Mixed fluid immersion cooling system and method

Abstract

Described herein are examples of devices that include a cooling housing. The cooling housing includes a storage area. The storage includes a heat source to be cooled. The housing includes a heat exchanger coupled to the housing. The heat exchanger transfers heat from the storage area to an environment surrounding the cooling housing. The housing includes a first fluid positioned within the storage area and partially surrounding a first portion of the heat source. The housing includes at least one second fluid positioned within the storage area and partially surrounding at least a second portion of the heat source. The first fluid is substantially separated from the at least one second fluid. The housing includes a third fluid in thermal contact with the at least one second fluid and a portion of the heat source.

Description

Technical Field

[0001] This application claims the priority of U.S. Provisional Patent Application No. 63 / 374,001, filed on August 30, 2022, entitled "MIXED FLUID IMMERSION COOLING SYSTEM AND METHOD". The entire content of the above application is incorporated herein by reference for all purposes.

Background Art

[0002] Modern electronic devices generate a significant amount of heat. Therefore, most modern electronic components require a robust cooling system.

Summary of the Invention

[0003] This specification will be more fully understood when considered in conjunction with the accompanying drawings of various examples of cooling systems. This specification is not intended to limit the cooling system to a particular example. Rather, the specific examples illustrated and described are provided for the purpose of explaining and understanding the cooling system. Throughout the specification, the drawings may be referred to as drawings, figures, and / or FIGS.

Brief Description of the Drawings

[0004] [Figure 1] A cross-sectional view of a cooling system according to one example is shown. [Figure 2] The operation of a cooling system according to one example is shown. [Figure 3] A cross-sectional view of another cooling system according to one example is shown. [Figure 4] A cross-sectional view of another cooling system according to one example is shown. [Figure 5] A block diagram of a method for cooling a heat source according to one example is shown.

Modes for Carrying Out the Invention

[0005] The cooling systems disclosed herein will be better understood by considering the following detailed description in conjunction with the drawings. The detailed description and drawings provide merely examples of various embodiments of the cooling systems. Many modifications are possible for various applications and design considerations. However, for the sake of brevity and clarity, not all possible modifications may be described individually in the following detailed description. Those skilled in the art will understand how the disclosed examples can be changed, modified, or altered without substantially departing from the scope of the examples described herein.

[0006] Conventional cooling systems can include a fluid to transfer heat from an object to the surrounding environment. One type of conventional cooling system is a two-phase immersion cooling system. Two-phase immersion required a large amount of expensive fluid to immerse the object being cooled, such as electronic equipment. In conventional cooling systems, the containment area needs to be airtight for proper functioning. However, this prevents inflow and outflow of the containment area without fluid loss (due to gasification). Another type of cooling system is a single-phase immersion cooling system. Single-phase immersion does not have the efficiency of two-phase immersion. Furthermore, single-phase fluids transfer less energy per watt used to cool the containment area and require a substantially higher flow rate per British Thermal Unit (BTU) removed.

[0007] Embodiments of the cooling system according to the present invention can address some or all of the above-mentioned problems. In the embodiment, the cooling system utilizes a dielectric single-phase fluid and a dielectric two-phase fluid in a single containment area. A container (heat source) containing one electronic device can be immersed in the single-phase fluid and the two-phase fluid. The container is positioned so that high-performance components, which typically have high heat generation, can take advantage of the superior cooling provided by the two-phase fluid, while the remaining components can be cooled by the single-phase fluid. Due to the greater density of the two-phase fluid, the two-phase fluid and the single-phase fluid remain separated and / or substantially separated, with the single-phase fluid positioned above the two-phase fluid when oriented against gravity. In the embodiment, the single-phase fluid has a greater density and therefore the fluid directionality is reversed.

[0008] In the embodiment, the single-phase fluid and the two-phase fluid may be liquids. The components release their heat into the two-phase fluid, which boils and carries the two-phase fluid in the form of a gas through the two-phase fluid and the lighter single-phase fluid, and the gas (originally a two-phase liquid) is released into a pocket of air (or inert gas) above the fluid layer in the containment area. When the gas reaches the air pocket, the gas (from the two-phase fluid) condenses again through a heat exchanger that is in thermal communication with the air pocket in the containment area. In one embodiment, the heat exchanger may be a device that facilitates the process of heat exchange between two or more fluids. In one embodiment, the fluids may be at different temperatures. In another embodiment, the fluids may be at the same temperature. In another embodiment, the fluids may be different types of fluids. In another embodiment, the heat exchanger may be a condenser coil that can be placed in the air pocket of the containment area. When heat is transferred to the heat exchanger, the gas of the two-phase liquid condenses and returns to the two-phase fluid layer through the single-phase fluid layer. By repeating this cycle, the heat source in the containment area is cooled. In some embodiments, the heat exchanger may be located in a separate compartment or container.

[0009] Furthermore, the heat released to the top of the tank is stored in the single-phase fluid, which can be pumped separately or left as is, boiling the two-phase fluid at the boundary, releasing the heat and recirculating the fluid. The single-phase fluid has the additional advantage of allowing inflow and outflow into the tank (e.g., a cable) without losing the two-phase fluid, as the inlet and outlet are located within the single-phase fluid portion, for example, the inlet and outlet are immersed in the single-phase fluid. In addition, the single-phase fluid also acts as a natural seal, as gas cannot escape from the top of the storage area (much like how air can be trapped inside an inverted canoe).

[0010] For example, a containment area for two or more fluids (which may be dielectric fluids), a condenser coil (for fluids such as water (a non-dielectric liquid) or a water-glycol mixture, but not limited to these), and electronic equipment for cooling. Optionally, the containment area may include a secondary pump for cooling a single-phase fluid independently of the condenser coil. Furthermore, the condenser coil may include an inner or outer plate of the containment area (if outer, the cooler temperature surrounding the containment area (which may be caused by another fluid, a cold plate, and / or cold air) will condense the gas).

[0011] Figure 1 shows a cooling system 100 for cooling a heat source 102 according to one embodiment. The cooling system 100 utilizes multiple layers of cooling fluid to cool the heat source 102. The heat source 102 is positioned so that high-performance components that typically have high heat generation can utilize one type of fluid, while the remaining components can be cooled by another type of fluid.

[0012] As shown in Figure 1, the cooling system 100 includes a cooling housing 101 that forms a storage area 104. A heat source 102 is located within the storage area 104. The heat source 102 may be any type of object, device, item, etc., that is desired to be cooled. In one embodiment, the heat source 102 may be one or more electronic devices that need to be cooled. Figure 1 shows a cooling housing 101 formed as a square or rectangular cube, but those skilled in the art will understand that the cooling housing 101 shown in Figure 1 is a general example and that the cooling housing 101 can be formed in any shape and dimensions. Similarly, Figure 1 shows a storage area 104 formed as a hollow cavity, but those skilled in the art will understand that the storage area 104 shown in Figure 1 is a general example and that the storage area 104 can be formed in any shape and dimensions.

[0013] The containment area 104 of the cooling housing 101 includes a first fluid layer 106. The first fluid layer 106 is positioned within the containment area 104 such that the first fluid layer 106 surrounds a first portion of the heat source 102 (or the heat source 102 is positioned within the containment area 104). In some embodiments, the heat source 102 can be positioned such that the first fluid layer 106 surrounds the first portion of the heat source 102 that generates the most heat. For example, the first fluid layer 106 may be adjacent to an electronic component that generates heat. In some embodiments, the first fluid layer 106 may contain a two-phase liquid, such as two-phase Novec by 3M, or Flulinert by 3M.

[0014] The storage area 104 also includes a second fluid layer 108. The second fluid layer 108 is positioned within the storage area 104 such that it surrounds a second portion of the heat source 102 (or the heat source 102 is positioned within the storage area 104). The second fluid layer 108 is positioned within the storage area 104 such that the first fluid layer 106 and the second fluid layer 108 are substantially separated. In some embodiments, the second fluid layer 108 may contain a single-phase liquid. In some embodiments, the first fluid layer 106 may have a higher density than the second fluid layer 108. Thus, when the housing is oriented relative to gravity, the first fluid layer 106 settles at the bottom of the storage area 104, and the second fluid layer 108 is positioned above the first fluid layer 106. In some embodiments, the first fluid layer 106 may contain a single-phase liquid, and the second fluid layer 108 may contain a two-phase liquid. However, as described herein, separated and / or substantially separated means that a person skilled in the art will understand that the fluid layers may mix at the interface such that the fluid layers are governed by the physical properties of the fluids being used. In one embodiment, the storage region 104 may contain different single-phase fluids in the same vessel, such as single-phase fluids having different energy or watt properties.

[0015] The storage area 104 also includes an nth fluid layer 110. The nth fluid layer 110 is positioned within the storage area 104 such that it surrounds a third portion of the heat source 102 (or the heat source 102 is positioned within the storage area 104). The nth fluid layer 110 is positioned within the storage area 104 such that it and the second fluid layer 108 are substantially separated. In embodiments, the nth fluid layer 110 may contain a gas such as air. In embodiments, the nth fluid layer 110 may have a lower density than the second fluid layer 108. Therefore, with respect to gravity, the nth fluid layer 110 may be located at the top of the storage area 104, above the second fluid layer 108.

[0016] Although not shown, the storage region 104 may contain two or more of the second fluid layers 108. That is, multiple second fluid layers 108 (such as the third, fourth, fifth, sixth, and seventh fluid layers) may be sandwiched between the nth fluid layer 110 and the first fluid layer 106. In some embodiments, the multiple second fluid layers 108 may contain the same type of fluid. In some embodiments, the multiple second fluid layers 108 may contain different types of fluid. In some embodiments, each of the multiple second fluid layers 108 may have a different density, thereby forming a continuum of the second fluid layers 108.

[0017] The cooling housing 101 also includes a heat exchanger 112. The heat exchanger 112 is positioned to have thermal communication with an nth fluid layer 110 and the environment 114 surrounding the housing 101. The heat exchanger 112 transfers heat from the storage area 104 to the environment 114 surrounding the housing 101 via a first fluid layer 106, a second fluid layer 108, and the nth fluid layer 110, as described later in Figure 2. In some embodiments, the heat exchanger 112 may include a heat pump, a refrigeration system, a heat sink, a fan, and the like. In another embodiment, the heat exchanger 112 may be located outside the housing, such as at different locations. In yet another embodiment, the heat exchanger 112 may be located in different compartments of the cooling housing 101.

[0018] In some embodiments, the heat exchanger 112 may be located in one or more separate compartments or containers. The separate compartment or container containing the heat exchanger may be removable or detachable from the housing 101. In this example, the gas from the nth fluid layer may be separated or isolated in one or more separate compartments or containers in order to interact with the heat exchanger.

[0019] Figure 2 shows an operational cooling system 100 for cooling a heat source 102 according to one embodiment. The cooling system 100 utilizes multiple layers of cooling fluid to cool the heat source 102. The hottest portion of the heat source 102 is positioned with a first fluid layer 106, thereby taking advantage of the excellent thermal properties of the first fluid layer 106.

[0020] As shown in the figure, a container containing a heat source 102, for example, an electronic device 200, can be immersed in a first fluid layer 106 and a second fluid layer 108. The heat source 102 is positioned so that the electronic device 200, which typically has high heat generation, can take advantage of superior cooling by the first fluid layer 106, while the remaining components can be cooled by the second fluid layer 108. Because the density of the first fluid layer 106 is greater, the first fluid layer 106 and the second fluid layer 108 remain substantially separate, and the second fluid layer 108 is located on top of the two-phase fluid when oriented with respect to gravity g.

[0021] In this embodiment, the electronic device 200 releases heat into a first fluid layer 106, which boils to form gas particles 202. The gas particles 202 travel through a second fluid layer 108, where they are released into an nth fluid layer 110, for example, a gas layer, located above the second fluid layer 108 in the storage area 104. When the gas reaches the nth fluid layer 110 (or gas layer), the gas particles 202 come into contact with components of the heat exchanger 112, thereby transferring heat to the environment 114. Due to heat loss, the gas particles 202 condense into liquid particles 204. The liquid particles 204 fall back onto the surface of the second fluid layer 108 and return to the first fluid layer through the second fluid layer 108. This cycle is repeated to cool the heat source 102 in the storage area 104.

[0022] Furthermore, the heat released to the upper part of the storage area 104 accumulates in the single-phase fluid, can be separately pumped, or can be left as it is, boiling the first fluid layer 106 at the boundary, releasing heat, and recirculating the fluid. The second fluid layer 108 has inlets and outlets within the second fluid layer 108. For example, since the inlets and outlets are immersed within the second fluid layer 108, it adds the additional advantage of allowing access to the tank (e.g., cable 210) without losing the two-phase fluid. Furthermore, since the gas at the upper part of the storage area 104 cannot escape from the second fluid layer 108 (similar to how air can be trapped in an inverted canoe), the second fluid layer 108 also serves as a natural seal.

[0023] FIG. 3 shows a cooling system 300 for cooling a heat source 302 according to an embodiment. The cooling system 300 utilizes multiple layers of a cooling fluid to cool the heat source 302. The cooling system 300 includes a heat pump 312 as a heat exchanger.

[0024] As shown in FIG. 3, the cooling system 300 includes a cooling housing 301 that forms a storage area 304. The heat source 302 is disposed within the storage area 304. The heat source 302 may be any type of object, device, item, etc. that is desired to be cooled. In one embodiment, the heat source 302 may be one or more electronic devices that need to be cooled. FIG. 3 shows the cooling housing 301 formed as a square or rectangular cube, but those skilled in the art will understand that the cooling housing 301 shown in FIG. 3 is a general example and that the cooling housing 301 can be formed in any shape and any dimensions. Similarly, FIG. 3 shows the storage area 304 formed as a hollow cavity, but those skilled in the art will understand that the storage area 304 shown in FIG. 3 is a general example and that the storage area 304 can be formed in any shape and any dimensions.

[0025] The storage region 304 of the cooling housing 301 includes a two-phase liquid layer 306. The two-phase liquid layer 306 is positioned within the storage region 304 (or the heat source 302 is positioned within the storage region 304) such that the two-phase liquid layer 306 surrounds a first portion of the heat source 302. In some embodiments, the heat source 302 can be positioned such that the two-phase liquid layer 306 surrounds the first portion of the heat source 302 that generates the most heat. In some embodiments, the two-phase liquid layer 306 can be Novec by 3M. The storage region 304 also includes a single-phase liquid layer 308. The single-phase liquid layer 308 is positioned within the storage region 304 (or the heat source 302 is positioned within the storage region 304) such that the single-phase liquid layer 308 surrounds a second portion of the heat source 302. The single-phase liquid layer 308 is positioned within the storage region 304 such that the two-phase liquid layer 306 and the single-phase liquid layer 308 are substantially separated.

[0026] In embodiments, the two-phase liquid layer 306 can have a higher density than the single-phase liquid layer 308. Thus, when the housing is oriented with respect to gravity, the two-phase liquid layer 306 sinks to the lower portion of the storage region 304 and the single-phase liquid layer 308 is positioned above the two-phase liquid layer 306. However, as described herein, being substantially separated means that one of ordinary skill in the art will understand that the fluid layers can be interfacially mixed such that the fluid layers are governed by the physical properties of the fluids being used.

[0027] The storage region 304 also includes a gas layer 310 (or a third fluid). The gas layer 310 is positioned within the storage region �04 (or the heat source 302 is positioned within the storage region 304) such that the gas layer 310 surrounds a third portion of the heat source 302. The gas layer 310 is positioned within the storage region 304 such that the gas layer 310 and the single-phase liquid layer 308 are substantially separated. In embodiments, the gas layer 310 can include a gas such as air. In embodiments, the gas layer 310 can have a lower density than the single-phase liquid layer 308. Thus, the gas layer 310 can be above the single-phase liquid layer 308 and at the upper portion of the storage region 304 with respect to gravity.

[0028] Although not shown, the storage region 304 may contain two or more single-phase liquid layers 308 (which may be called third, fourth, or fifth liquid layers, and the gas layers may be subsequently numbered or simply called gas layers). That is, multiple single-phase liquid layers 308 may be sandwiched between the gas layer 310 and the two-phase liquid layer 306. In some embodiments, the multiple single-phase liquid layers 308 may contain the same type of fluid. In some embodiments, the multiple second single-phase liquid layers 308 may contain different types of fluid. In embodiments, each of the multiple single-phase liquid layers 308 may have a different density, thereby forming a continuum of single-phase liquid layers 308.

[0029] The cooling housing 301 also includes a heat pump 312 as a heat exchanger. The heat pump 312 may include a condenser coil 316 coupled to a cooling device 320 by a supply line 318. The cooling device may include a fan, radiator, heat sink, etc. The condenser coil 316 is positioned to have thermal communication with the gas layer 310. The condenser coil 316 transfers heat from the containment area 304 to the environment 314 surrounding the housing 301 via the two-phase fluid layer 306, the single-phase liquid layer 308, and the gas layer 310, as described above in Figure 2. That is, heat is transferred to the fluid in the condenser coil 316 toward the cooling device 320 and then transferred to the environment 314.

[0030] For example, a condenser fluid, such as water / glycol / other mixtures, circulates through a radiator. The single-phase liquid layer 308 above the two-phase liquid layer 306 provides direct cooling to components that generally produce less thermal energy, causing the fluid to rise to a two-phase threshold temperature, which boils the two-phase liquid layer 306 and allows heat transfer from the less dense components (where the components are in contact). Boiling may be at a constant boiling point, a slow boil, a low boiling point, or at intermediate levels. Once condensed, the two-phase liquid layer 306 will either pour down like rain or be directed in some way (directed rain or collected and sent back for further processing).

[0031] Figure 4 shows a cooling system 400 for cooling a heat source 402 according to one embodiment. The cooling system 400 utilizes multiple layers of cooling fluid to cool the heat source 402.

[0032] As shown in Figure 4, the cooling system 400 includes a cooling housing 401 that forms a containment region 404. The heat source 402 is located within the containment region 404, as described above in Figures 1 to 3. The containment region 404 of the cooling housing 401 includes a two-phase liquid layer 406. The containment region 404 also includes a single-phase liquid layer 408. The two-phase liquid layer 406 and the single-phase liquid layer 408 may be the same as those described above.

[0033] The storage region 404 also includes a non-dielectric fluid layer 409. In this embodiment, the non-dielectric fluid layer 409 may have a lower density than the single-phase liquid layer 408. Therefore, when the housing is oriented relative to gravity, the non-dielectric fluid layer 409 is positioned above the single-phase liquid layer 408. For example, water may be positioned above the single-phase liquid layer above the dielectric fluid. In this example, the water may be visible to provide a decorative and pleasing appearance.

[0034] The containment region 404 also includes a gas layer 410. The gas layer 410 is positioned within the containment region 404 such that it surrounds a portion of the heat source 402 (or the heat source 402 is positioned within the containment region 404). The gas layer 410 is positioned within the containment region 404 such that the gas layer 410 and the non-dielectric fluid layer 409 are substantially separated. In embodiments, the gas layer 410 may include a gas such as air. In embodiments, the gas layer 410 may have a lower density than the non-dielectric fluid layer 409. Thus, the gas layer 410 may be located at the top of the containment region 404, above the single-phase liquid layer 408, with respect to gravity. Although not shown, the containment region 404 may include two or more single-phase liquid layers 408 as described. The housing 401 may also include a heat exchanger 412 as described above.

[0035] Figure 5 shows a block diagram of a method 500 using a cooling system to remove heat from a heat source according to one embodiment. In one embodiment, step 501 includes locating the heat source in a containment area within a cooling housing. The containment area is configured to receive the heat source. Step 502 includes coupling a heat exchanger to the housing. In one embodiment, the housing can be coupled to the heat exchanger by mounting the heat exchanger directly to the housing. In another embodiment, the housing can be coupled to the heat exchanger indirectly via connections such as tubes, pipes, and piping. The heat exchanger is configured to transfer heat from the containment area to the environment surrounding the cooling housing. Step 503 includes locating a first fluid within the containment area. The first fluid surrounds a first portion of the heat source, and the first fluid includes a two-phase liquid. Step 504 includes locating a second fluid within the containment area. The second fluid surrounds a second portion of the heat source, and the second fluid includes a single-phase liquid. Step 505 includes positioning a gas within a containment area. The gas is in thermal communication with a second fluid and a portion of a heat exchanger. The first fluid is configured to receive heat, boil to form gas particles, move upward through the second fluid and gas, come into contact with the heat exchanger, lose heat to the heat exchanger, condense into a liquid, move downward through the gas and the second fluid, and return to the first portion of the heat source within the containment area.

[0036] The embodiment includes a method by which a second fluid allows a second fluid to enter and exit a storage area, thereby enabling a user to access a heat source without losing gas or the first fluid.

[0037] The embodiment includes a method for maintaining the second fluid at a temperature that provides the first fluid with a constant boiling point at the boundary between the first and second fluids.

[0038] The embodiment includes a method in which a second fluid is cooled by a second heat exchanger in order to lower the temperature of the second fluid and delay the boiling of the first fluid.

[0039] A feature shown in one of the drawings may be the same as or similar to a feature shown in another of the drawings. Similarly, a feature described in relation to one of the drawings may be the same as or similar to a feature described in relation to another of the drawings. The same or similar features may be indicated by the same or similar reference letters unless otherwise specified. Furthermore, a description of a particular drawing may refer to a feature not shown in that particular drawing. This feature may be shown in another drawing and / or described further in relation to another drawing.

[0040] The above description includes many specific details, such as examples of particular systems, components, and methods, in order to provide a good understanding of several embodiments. However, it will be apparent to those skilled in the art that at least some embodiments can be implemented without these specific details. In other cases, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the embodiments. Thus, the above specific details are merely illustrative. Certain embodiments may differ from these exemplary details and are still considered to fall within the scope of these embodiments.

[0041] The relevant elements in the examples and / or embodiments described herein may be identical, similar, or different in different examples. For the sake of brevity and clarity, relevant elements may not be described redundantly. Instead, the use of identical, similar, and / or relevant element names and / or reference letters may inform the reader that an element having a given name and / or relevant reference letter may be similar to another relevant element having the same, similar, and / or relevant element name and / or reference letter in examples described elsewhere in this specification. Elements specific to a given example may be described in reference to that particular example. Those skilled in the art will understand that a given element does not need to be identical and / or similar to a specific depiction of a relevant element in any given figure or example in order to share the characteristics of a relevant element.

[0042] It should be understood that the above description is illustrative and not limiting. Those skilled in the art will see many other embodiments upon reading and understanding the above description. Therefore, the scope of this embodiment should be determined by reference to the appended claims, along with the entire scope of equivalents to which such claims are granted.

[0043] The aforementioned disclosures encompass several different examples, each possessing independent utility. While these examples have been disclosed in certain forms, the specific examples disclosed and illustrated above should not be considered in a restrictive sense, as many variations are possible. The subject matter disclosed herein includes novel and non-obvious combinations and partial combinations of the various elements, features, functions, and / or characteristics disclosed above, both explicitly and essentially. Where this disclosure or any subsequently filed claims enumerate "one" element, "first" element, or any such equivalent term, it should be understood that this disclosure or claims incorporate one or more such elements and do not require or exclude two or more of such elements.

[0044] As used herein, “same” means sharing all features, and “similar” means sharing a substantial number of features, or sharing substantially important features even if a substantial number of features are not shared. As used herein, “may” should be interpreted in an allowable sense, not in an indefinite sense. Furthermore, the use of “is” with respect to examples, elements and / or features should be interpreted explicitly with respect to specific examples, not explicitly with respect to all examples. Furthermore, references to “this disclosure” and / or “this disclosure” refer to the entire description and accompanying drawings of this specification, and extend to all descriptions of each subsection of this specification, including the title of the invention, background art, brief description of the drawings, modes for carrying out the invention, claims, abstract, and any other documents and / or resources incorporated herein by reference.

[0045] As used herein with respect to lists, "and" forms a group that includes all of the elements listed. For example, an example described as including A, B, C, and D is an example that includes A, B, C, and D. As used herein with respect to lists, "or" forms a list of elements that may include any of them. For example, an example described as including A, B, C, or D is an example that includes any of elements A, B, C, and D. Unless otherwise specified, an example that includes a list of alternatively-inclusive elements does not preclude other examples that include various combinations of some or all of the alternatively-inclusive elements. An example described using a list of alternatively-inclusive elements includes at least one of the elements listed. However, an example described using a list of alternatively-inclusive elements does not preclude other examples that include all of the elements listed. Nor does an example described using a list of alternatively-inclusive elements preclude other examples that include some combinations of the elements listed. As used herein with respect to lists, "and / or" forms a list of elements that include one or any combination thereof. For example, the example described as containing A, B, C, and / or D may also contain only A, A and B, A and B and C, A and B and C and D, etc. The boundaries of an "and / or" list are defined by the complete set of combinations and permutations of the list.

[0046] If multiple specific elements are shown in a figure and it is clear that those elements overlap throughout the figure, then only one label may be provided for that element, even though multiple instances of that element exist in the figure. Therefore, other instances in the figure of an element having the same or similar structure and / or function may not be redundantly labeled. Those skilled in the art will recognize extra and / or redundant elements in the same figure based on the disclosure herein. Nevertheless, extra labels may be included if they help to clarify the structure of the illustrated examples.

[0047] The applicant reserves the right to file claims covering novel and non-obvious combinations and partial combinations of disclosed examples. Examples embodied in other combinations and partial combinations of features, functions, elements, and / or characteristics may be claimed through amendments to those claims or through the presentation of new claims in this application or related applications. Such amended or new claims should be considered within the scope of the subject matter of the examples described herein, regardless of whether they cover the same or different examples, and whether they differ in scope from, broader, narrower, or equal to, the original claims.

Claims

1. A cooling housing, A storage area configured to receive a heat source, A heat exchanger coupled to the cooling housing, A heat exchanger configured to transfer heat from the storage area to the environment surrounding the cooling housing, The first fluid is, Located within the aforementioned storage area, Surrounding the first part of the heat source, A two-phase liquid, the first fluid, The second fluid is Located within the aforementioned storage area, Surrounding the second part of the heat source, It is a single-phase liquid, The first fluid is separated from the second fluid, and the second fluid is The third fluid, Located within the aforementioned storage area, Surrounding the third part of the heat source, It is a liquid, The first fluid, the second fluid, and the third fluid are separated, and the third fluid is... It is a gas, Positioned in thermal contact with a portion of the third fluid, Located in the fourth part of the heat source, gas and A device equipped with a cooling housing.

2. The first fluid has a higher density than the second fluid, The second fluid has a higher density than the third fluid, The device according to claim 1, wherein the third fluid has a higher density than the gas.

3. The first fluid is a dielectric fluid, The second fluid is a dielectric fluid, The third fluid is a non-dielectric fluid, The device according to claim 1, wherein the gas is an inert gas.

4. The first fluid surrounds the hottest part of the heat source, The device according to claim 1, wherein the second fluid surrounds the second hottest portion of the heat source.

5. The device according to claim 1, wherein the second portion of the heat source surrounded by the second fluid is configured to be cooled by a second heat exchanger.

6. The aforementioned heat exchanger, Condenser and, A plate configured to condense gas and The device according to claim 1, further comprising:

7. The aforementioned heat exchanger, It is configured to be removable from the cooling housing, The device according to claim 6, wherein the third fluid is configured to be removed together with the heat exchanger.

8. The aforementioned heat exchanger, It is a heat pump, The device according to claim 1, positioned within the aforementioned storage area.

9. The step of placing a heat source in a storage area within a cooling housing, The steps include configuring the storage area to receive the heat source, A step of connecting the heat exchanger to the cooling housing, The heat exchanger is configured to transfer heat from the storage area to the environment surrounding the cooling housing, A step of positioning the first fluid within the storage area, The first fluid surrounds the first portion of the heat source, The first fluid includes a step of a two-phase liquid, A step of positioning a second fluid within the storage area, The second fluid surrounds the second portion of the heat source, The second fluid includes a single-phase liquid, A step of positioning the gas within the storage area, The gas is in thermal contact with the second fluid and a part of the heat exchanger. A method including, The first fluid is, Receiving heat, It boils and forms gas particles, Moving upward through the second fluid and the gas, Contacting the aforementioned heat exchanger, Heat is removed by the aforementioned heat exchanger. It condenses into a liquid, Moving downward through the gas and the second fluid, Return to the first portion of the heat source within the storage area. A method that is structured in such a way.

10. A third fluid positioned between the second fluid and the gas, A third fluid, which is a non-dielectric liquid The method according to claim 9, further comprising:

11. The heat exchanger is located outside the cooling housing, The method according to claim 9, wherein heat is transferred to the heat exchanger via a condenser coil coupled to a cooling device.

12. The method according to claim 9, wherein the second fluid allows the user to enter and exit the storage area, thereby enabling the user to access the heat source without losing gas or the first fluid.

13. The method according to claim 9, wherein the second fluid can be maintained at a temperature that provides a constant boiling point for the first fluid at the boundary between the first fluid and the second fluid.

14. The method according to claim 9, wherein the second fluid is cooled by a second heat exchanger to lower the temperature of the second fluid and delay the boiling of the first fluid.

15. A third fluid positioned between the second fluid and the gas, It is a single-phase fluid, The method according to claim 14, further comprising a third fluid having a lower density than the second fluid and a higher density than the gas.

16. A cooling housing, A storage area configured to receive a heat source, A heat exchanger coupled to the cooling housing, A heat exchanger configured to transfer heat from the storage area to the environment surrounding the cooling housing, The first fluid is, Located within the aforementioned storage area, A first fluid surrounds the first part of the heat source, The second fluid is Located within the aforementioned storage area, Surrounding the second part of the heat source, The first fluid and the second fluid are separated, the second fluid and It is a gas, A portion of the second fluid, It is positioned in thermal contact with a part of the aforementioned heat exchanger, Located in the fourth part of the heat source, gas and A system equipped with a cooling housing.

17. The first fluid is a two-phase liquid, The second fluid is a single-phase liquid, The system according to claim 16, wherein the gas is air.

18. A second heat exchanger positioned within the second fluid, supply line, Condenser coil and Heat pump and The system according to claim 16, further comprising a second heat exchanger having the following:

19. The heat exchanger is located outside the cooling housing, The system according to claim 16, wherein the heat exchanger is located within a removable compartment.

20. The first fluid has a higher density than the second fluid, The system according to claim 16, wherein the first portion of the heat source generates more heat than the second portion of the heat source.

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