Head Cooling Pad

JP1814149SActive Publication Date: 2025-12-05東莞市中邦健康科技有限公司
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Patent Information

Application Number
JP2025001165D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2025-01-22
Publication Date
2025-12-05
Estimated Expiration
2050-01-22

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Abstract

The material of this product is synthetic resin and liquid latent heat material. The product is filled with liquid latent heat material (phase change material) and after cooling in a refrigerator, it is placed inside a hat or helmet and worn on the head to reduce body heat.
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