RFID tag and method for manufacturing substrate for RFID tag

The RFID tag design with a spiral coil within an annular loop and through-hole connection at a 90-degree corner addresses the challenge of maintaining coupling force and size, achieving miniaturization and efficient substrate production.

JP2024030445A5Pending Publication Date: 2025-07-25HOKURIKU ELECTRIC INDS
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Patent Information

Application Number
JP2022133360
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2022-08-24
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

Conventional RFID tags face challenges in maintaining strong electromagnetic coupling force while being miniaturized due to the use of spiral coils with rectangular contours and the need for through-hole connections, which increase substrate size.

Method used

The RFID tag design incorporates a first antenna with a spiral coil and a second antenna with an annular loop portion, where the spiral coil is positioned within the inner space of the annular loop and connected via a through-hole between a 90-degree corner of the polygonal substrate, allowing for miniaturization without increasing size and enhancing electromagnetic coupling.

Benefits of technology

This design strengthens electromagnetic coupling force and enables the RFID tag to be miniaturized effectively, while allowing efficient production of multiple substrates from a single large substrate.

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Abstract

To provide an RFID tag that can increase an electromagnetic field coupling power and can be reduced in size, and a method for manufacturing a substrate for an RFID tag by which multiple substrates for an RFID tag can be taken from one large-sized substrate without waste.SOLUTION: The positional relationship between a spiral coil 7 provided on a substrate 3 and a substrate in a pentagonal or more polygonal shape is determined, so that a corner part 3a at 90 degrees of the substrate 3 is located outside one side 7d of the spiral coil 7. A through-hole part 13 electrically connecting a circuit on a rear face of the substrate 3 and a coil pattern on a front face of the substrate 3 is provided between the spiral coil 7 and the corner part 3a at 90 degrees of the substrate 3.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present invention relates to an RFID (Radio Frequency Identification) tag capable of non-contact transmission and reception of information, and a method for manufacturing a substrate for an RFID tag.

Background Art

[0002] Japanese Patent No. 4697332 discloses a conventional wireless IC device (RFID tag) including a first antenna formed of a conductive material on a substrate, a wireless IC chip electrically connected to the first antenna to process transmission and reception signals, and a second antenna formed by bending a metal wire and coupled to the first antenna via an electromagnetic field. A typical first antenna in a conventional RFID tag is a spiral coil having a rectangular contour, and the second antenna includes a U-shaped portion located outside the first antenna and two linear portions extending from the U-shaped portion.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a conventional RFID tag, in order to facilitate the manufacture of the second antenna and increase the number of turns of the electromagnetic coupling portion, it is desirable to form the electromagnetic coupling portion of the second antenna into an annular loop portion having one or more turns. Further, when a second antenna having such a shape is used and a first antenna having a spiral coil with a rectangular contour as in the conventional case is used, there is a problem that the electromagnetic coupling force becomes weak. Further, when the first antenna is a spiral coil having a rectangular contour, in order to provide a through-hole portion for connecting the circuit on the back surface of the substrate to the first antenna, the size of the substrate has to be increased, which becomes an obstacle when miniaturizing.

[0005] An object of the present invention is to provide an RFID tag that can strengthen the electromagnetic coupling force of an RFID tag including a first antenna and a second antenna having an annular loop portion of at least one turn or more that is coupled to the first antenna via an electromagnetic field, and can be miniaturized.

[0006] Another object of the present invention is to provide a method for manufacturing a substrate for RFID that can efficiently take out a large number of substrates for RFID tags from a single large substrate.

Means for Solving the Problems

[0007] The present invention is directed to an RFID tag including a first antenna formed of a conductive material on the surface of a substrate, a wireless IC chip electrically connected to the first antenna for processing transmission and reception signals, and a second antenna formed by bending a metal wire and having an annular loop portion of at least one turn or more that is coupled to the first antenna via an electromagnetic field.

[0008] The first antenna is composed of a spiral coil that faces the inner space of the annular loop portion of the second antenna or is located within the inner space and extends along the annular loop portion. Further, the substrate is composed of a polygon substrate having five or more sides including one 90-degree corner.

[0009] And a through-hole portion for electrically connecting the circuit on the back surface of the substrate having five or more sides and the spiral coil is provided between the spiral coil and a 90-degree corner portion of the substrate having five or more sides.

[0010] By providing the installation position of the through-hole portion between the spiral coil and the 90-degree corner portion of the substrate having five or more sides in this way, it is not necessary to increase the size of the substrate, so the substrate can be miniaturized. Moreover, since the installation position space of the through-hole portion can be secured, the spiral coil can be formed larger, and the electromagnetic field coupling force can be strengthened. Note that the through-hole portion has a structure in which a conductive portion for connection is formed inside the through-hole.

[0011] The shape of the spiral coil may be circular, but it may be formed from a spiral coil having five or more sides that faces the inner space of the annular loop portion of the second antenna or is located within the inner space and extends along the annular loop portion. In this case, the positional relationship between the corner portion of the spiral coil having five or more sides and the substrate having five or more sides is defined such that a 90-degree corner portion is located outside one side of the spiral coil having five or more sides. Further, a through-hole portion for electrically connecting the circuit on the back surface of the substrate having five or more sides and the spiral coil having five or more sides is provided between one side of the spiral coil having five or more sides and the 90-degree corner portion of the substrate having five or more sides. Note that the circuit on the back surface may be a spiral coil that cooperates with the spiral coil having five or more sides provided on the surface of the substrate to form the first antenna.

[0012] By providing the installation position of the through-hole portion between the spiral coil having five or more sides and the 90-degree corner portion of the substrate having five or more sides in this way, it is not necessary to increase the size of the substrate, so the substrate can be miniaturized. Moreover, since the installation position space of the through-hole portion can be secured, the spiral coil having multiple sides can be formed larger, and the electromagnetic field coupling force can be strengthened.

[0013] In addition, the polygonal substrate having five or more sides is preferably hexagonal or heptagonal for ease of design. Further, when the spiral coil having five or more sides is an octagonal spiral coil, the polygonal substrate having five or more sides can be a heptagonal polygonal substrate.

[0014] When manufacturing a hexagonal polygonal substrate including one 90-degree corner used in an RFID tag from a single substrate for mounting a large number of components, the following steps are taken. For ease of understanding, the reference numerals attached to the drawings are also noted in the following description.

[0015] For a plurality of pick-up substrates, a plurality of parallel vertical cut lines VC extending in the vertical direction, a plurality of parallel horizontal cut lines LC extending in the horizontal direction and orthogonal to the plurality of parallel vertical cut lines VC, and a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC are drawn, and a plurality of second oblique parallel cut lines TC2 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC, the plurality of parallel horizontal cut lines LC and the plurality of first oblique parallel cut lines TC1 are drawn, and the plurality of pick-up substrates are cut. In this case, the plurality of parallel vertical cut lines VC are arranged at equal intervals, and the plurality of parallel horizontal cut lines LC are arranged at equal intervals. And the position bisecting the portions of the plurality of parallel vertical cut lines VC located between the nth (n is an integer of 1 or more) parallel horizontal cut line LC and the (n + 1)th parallel horizontal cut line LC, and the position bisecting the portions of the plurality of parallel vertical cut lines VC located between the (n + 2)th parallel horizontal cut line LC and the (n + 3)th parallel horizontal cut line LC are respectively defined as virtual points P1. And the plurality of first oblique parallel cut lines TC1 respectively pass through every other one of the plurality of virtual points P1 arranged in the horizontal direction, and the plurality of second oblique parallel cut lines TC2 respectively pass through the virtual points P1 arranged in the horizontal direction. If the plurality of pick-up substrates are cut, for example, by dicing, in such a manner as to draw the cut lines, a hexagonal polygonal substrate with one corner being 90 degrees can be produced with good yield. Note that an adhesive sheet is attached to one surface of the plurality of pick-up substrates, a cut is made from the other surface of the plurality of pick-up substrates by dicing, and if the depth of this cut is set to a depth at which the adhesive sheet is not completely cut in the thickness direction, the cut pieces will not become separated.

[0016] Also, when manufacturing a heptagonal polygonal substrate including one 90-degree corner for use in an RFID tag from one pick-up substrate for multiple pieces, the following steps are taken. For ease of understanding, the reference numerals attached to the drawings are also noted in the following description.

[0017] For a plurality of substrates for picking, draw a plurality of parallel vertical cutting lines VC extending in the vertical direction, a plurality of parallel horizontal cutting lines LC extending in the horizontal direction and orthogonal to the plurality of parallel vertical cutting lines VC, a plurality of first oblique parallel cutting lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cutting lines VC and the plurality of parallel horizontal cutting lines LC, and a plurality of second oblique parallel cutting lines TC2 extending in an oblique direction and intersecting the plurality of parallel vertical cutting lines VC, the plurality of parallel horizontal cutting lines LC, and the plurality of first oblique parallel cutting lines TC1, and cut the plurality of substrates for picking accordingly. The plurality of parallel vertical cutting lines VC are arranged at equal intervals L, the plurality of parallel horizontal cutting lines LC are arranged at equal intervals L, and the intersection points of the plurality of parallel vertical cutting lines VC and the plurality of parallel horizontal cutting lines LC are defined as intersection points (P2, P2'). Then, the nth (n is an odd number of 1 or more) first oblique parallel cutting line TC1 and the (n + 1)th first oblique parallel cutting line TC1 sandwich every other intersection point P2 arranged in the horizontal direction and are parallel at positions separated by L / (2 + 2 1 / 2 ) in both vertical directions and intersect the parallel Vertical cut line VC. Also, the nth first oblique parallel cutting line TC1 and the (n + 1)th first oblique parallel cutting line TC1 sandwich every other intersection point P2 arranged in the horizontal direction and are parallel at positions separated by L / (2 + 2 1 / 2 ) in both horizontal directions and intersect the parallel horizontal cutting line LC. Further, the second oblique parallel cutting line TC2 is parallel to the (n + 1)th first oblique parallel cutting line TC1 from every other intersection point P2 and the remaining every other intersection point P2' adjacent thereto at positions separated by L / (2 + 2 Vertical cut ) in the direction where the point where the parallel 1 / 2 line VC intersects and the direction where the point where the parallel horizontal cutting line LC intersects the (n + 2)th first oblique parallel cutting line TC1 are located and intersect the parallel Vertical cut line VC and the parallel horizontal cutting line LC. By cutting the plurality of substrates for picking by dicing, for example, according to the cutting lines drawn in this way, one corner becomes 90 degrees, and a heptagonal polygonal substrate can be manufactured with good yield.

[0018] Also, when manufacturing a heptagonal substrate including one 90-degree corner used for an RFID tag from a single multi-piece substrate, the following method may be adopted. For easier understanding, reference numerals attached to the drawings are also noted in the following description. In this case, for the multi-piece substrate, a plurality of parallel vertical cut lines VC extending in the vertical direction, a plurality of parallel horizontal cut lines LC extending in the horizontal direction and perpendicular to the plurality of parallel vertical cut lines VC, a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC, and a plurality of second oblique parallel cut lines TC2 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC, the plurality of parallel horizontal cut lines LC, and the plurality of first oblique parallel cut lines TC1 are drawn to cut the multi-piece substrate.

[0019] When the interval dimension between the nth (n is an odd number of 1 or more) parallel vertical cut line and the (n + 1)th parallel vertical cut line VC1 is L for the plurality of parallel vertical cut lines VC, the interval dimension between the (n + 1)th parallel vertical cut line VC1 and the (n + 2)th parallel vertical cut line VC2 is 2 1 / 2 L / (2 + 2 1 / 2 ). And when the interval dimension between the mth (m is an odd number of 1 or more) parallel horizontal cut line LC1 and the (m + 1)th parallel horizontal cut line LC2 is L for the plurality of parallel horizontal cut lines LC, the interval dimension between the (m + 1)th parallel horizontal cut line LC2 and the (m + 2)th parallel horizontal cut line LC3 is 2 1 / 2 L / (2 + 2 1 / 2It is assumed to be so. Further, when virtual center points P3 are respectively defined at the centers of regions R located between the (n + 1)-th parallel vertical cut line VC1 and the (n + 2)-th parallel vertical cut line VC2 and between the m-th parallel horizontal cut line LC1 and the (m + 1)-th parallel horizontal cut line LC2, the plurality of first diagonal parallel cut lines TC1 shall each pass through every other center point P3 arranged in the horizontal direction. Also, the plurality of second diagonal parallel cut lines TC2 shall each pass through a plurality of center points P3 arranged in the horizontal direction. Even if the cut lines are drawn in this way, for example, if a substrate for multiple parts is cut by dicing, one corner will be 90 degrees, and a heptagonal polygonal substrate can be manufactured with good yield.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0021] Hereinafter, embodiments of the RFID tag of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of an RFID tag according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the RFID tag 1 of FIG. 1. The RFID tag 1 of this embodiment includes a substrate 3, an antenna coil 5, a spiral coil 7, a wireless IC chip 9, and a case 11 made of resin or ceramic.

[0022] The substrate 3 is formed of an FR4 substrate, which is a material that combines flame retardancy and low conductivity, for example, by impregnating an epoxy resin into a glass woven fabric in which glass fibers are woven in a cloth shape. As shown in FIG. 1, the substrate 3 of the present embodiment has a heptagonal shape with one corner 3a having an angle of 90 degrees. Specifically, the substrate 3 of the present embodiment has a heptagonal shape having a pair of linear first side portions 3b forming the 90-degree corner 3a and five linear second side portions 3c connecting between the pair of first side portions 3b. In the present embodiment, the pair of first side portions 3b have the same length. Also, in the present embodiment, the five second side portions 3c have the same length. In particular, in the present embodiment, the six corners 3d other than the 90-degree corner 3a have the same angle of 135 degrees. In the present embodiment, the substrate 3 is fixed to the inner bottom surface of the case 11 with an insulating adhesive. Although not shown, the inside of the case 11 is filled with an epoxy-based filler. The case 11 has a recess 11A in which the substrate 3 is housed at the center and a peripheral wall portion 11B surrounding the recess 11A.

[0023] The antenna coil 5 is formed by bending a metal wire and has an annular loop portion 5a of one turn or more, and a pair of linear portions 5b and 5c connected to the annular loop portion 5a. In the present embodiment, the antenna coil 5 constitutes the second antenna of the present invention. In the present embodiment, the antenna coil 5 is formed by bending a stainless steel wire. The pair of linear portions 5b and 5c are fitted into groove portions 11C and 11D formed in the peripheral wall portion 11B of the case 11 and extend outside the case 11. The annular loop portion 5a is magnetically coupled to the spiral coil 7 via an electromagnetic field. The antenna coil 5 of the present embodiment is disposed in the case 11 such that the inner space of the annular loop portion 5a faces the spiral coil 7 above the substrate 3 or the spiral coil 7 is located within the inner space.

[0024] On the surface 3e of the substrate 3, a coil pattern of an octagonal spiral coil 7 is formed. In the present embodiment, a substantially octagonal spiral coil 7 is formed on the front and back surfaces of the substrate. Also, a coil pattern (not shown) is provided on the back surface of the substrate 3, and the spiral coil on the front surface 3e and the spiral coil on the back surface are connected via the through-hole portion 13. In the present embodiment, the spiral coil 7 constitutes the first antenna of the present invention. The spiral coil 7 is formed by printing a copper foil or a conductive paste on the substrate 3. A wireless IC chip 9 is electrically connected to the spiral coil 7. The wireless IC chip 9 has a clock circuit, a logic circuit, a memory circuit, etc., and processes transmission and reception signals of a predetermined frequency based on the information stored by these circuits.

[0025] The spiral coil 7 is located within the internal space of the annular loop portion 5a of the antenna coil 5 and extends along the annular loop portion 5a. The spiral coil 7 of the present embodiment includes six corner portions 7a and five first linear sides 7b that linearly extend between two corner portions 7a. Further, in the spiral coil 7 of the present embodiment, the positions of the six corner portions 7a are bent so as to correspond to the positions of the six corner portions 3d of the substrate 3. Therefore, in the spiral coil 7 of the present embodiment, the five first linear sides 7b extend along the five second side portions 3c of the substrate. The spiral coil 7 of the present embodiment also includes a pair of second linear sides 7c that extend from two corner portions 7a along a pair of first side portions 3b of the substrate 3, and one deformed side 7d that connects the second linear sides 7c. In the present embodiment, the positional relationship between the corners of the polygonal spiral coil and the polygonal substrate with five or more sides is defined such that a 90-degree corner 3a of the substrate 3 is located outside one side 7d of the spiral coil 7. A through-hole portion 13 that electrically connects the coil pattern on the back surface of the substrate 3 and the coil pattern on the front surface of the substrate is provided between one side 7d of the spiral coil 7 and the 90-degree corner 3a of the substrate 3. In the present embodiment, the circuit provided on the back surface of the substrate 3 is a spiral coil that cooperates with the spiral coil 7 on the front surface of the substrate 3 to form a first antenna. The through-hole portion 13 has a structure in which a conductive portion for connection is formed inside the through-hole that penetrates the substrate. This conductive portion may be formed by a conductive paste or may be formed by plating.

[0026] By providing the through-hole portion 13 between the spiral coil 7 and the 90-degree corner 3a of the substrate 3 in this way, the through-hole portion 13 does not interfere with the spiral coil 7, and it is not necessary to increase the size of the substrate, so the size of the substrate can be reduced. Moreover, since the installation position space of the through-hole portion 13 can be secured, a polygonal spiral coil can be formed larger, and the electromagnetic coupling force can be strengthened.

[0027] In the above embodiment, the pair of first side portions 3b of the substrate 3 have the same length. However, the pair of first side portions may have different lengths. Similarly, in the present embodiment, the five second side portions 3c of the substrate 3 have the same length, but the second side portions may have different lengths. Further, in the present embodiment, the six corner portions 3d other than the 90-degree corner portion 3a have the same size, but the six corner portions 3d may have different sizes and angles.

[0028] In the present embodiment, as described above, a spiral coil similar to the surface 3e is formed on the back surface of the substrate 3. However, it goes without saying that the coil pattern formed on the back surface may have a pattern different from that of the surface 3e.

[0029] In the present embodiment, the spiral coil 7 includes a pair of sides 7c extending along the pair of first side portions 3b of the substrate 3 on the surface 3e of the substrate 3, and one deformed side 7d connecting the pair of sides 7c. The deformed side 7d is deformed along the through-hole portion 13, but it does not have to be along the through-hole portion.

[0030] In the above embodiment, the spiral coil 7 is formed from a spiral coil having a polygon of pentagon or more. However, it goes without saying that the spiral coil 7 may be circular.

[0031] Next, a method for manufacturing the RFID tag of the present embodiment will be described. First, a plurality of pick-up substrates on which circuit patterns including coil patterns and through-hole portions are formed on the front and back surfaces are cut to produce the substrate 3. Next, the substrate 3 on which the IC Chip 9 is mounted is fixed to the inner bottom surface of the resin case 11 with an insulating adhesive. It goes without saying that the IC Chip 9 may be mounted after the cut substrate 3 is fixed to the inner bottom surface of the case 11 with an adhesive.

[0032] Next, the antenna coil 5 processed to have an annular loop portion is installed in the case 11, and resin is injected into the recess 11A in the case 11 so that the annular loop portion is fixed to the inner surface of the case 11.

[0033] FIG. 3 is a schematic diagram showing a cutting line for cutting a multi-piece substrate SB for manufacturing the polygonal substrate 3 of the present embodiment. In this manufacturing method, first, for the multi-piece substrate SB, a plurality of parallel vertical cutting lines VC extending in the vertical direction and arranged at equal intervals L, and a plurality of parallel horizontal cutting lines LC extending in the horizontal direction and arranged at equal intervals L and orthogonal to the plurality of parallel vertical cutting lines VC are defined. Here, the vertical direction and the horizontal direction are the vertical direction and the horizontal direction in the plane of FIG. 3, and in actual manufacturing, the vertical direction and the horizontal direction will be adjusted according to the vertical direction and the horizontal direction of dicing.

[0034] In this example, the plurality of parallel vertical cutting lines VC are arranged at equal intervals L, and the plurality of parallel horizontal cutting lines LC are arranged at equal intervals L. Next, a plurality of first oblique parallel cutting lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cutting lines VC and the plurality of parallel horizontal cutting lines LC are defined. Further, a plurality of second oblique parallel cutting lines TC2 extending in an oblique direction and intersecting the plurality of parallel vertical cutting lines VC, the plurality of parallel horizontal cutting lines LC, and the plurality of first oblique parallel cutting lines TC1 are defined. At this time, the intersections of the plurality of parallel vertical cutting lines VC and the plurality of parallel horizontal cutting lines LC are defined as intersections P2, P2', and the nth (n is an odd number of 1 or more) first oblique parallel cutting line TC1 and the (n + 1)th first oblique parallel cutting line TC1 are separated by X = L / (2 + 2 1 / 2 ) in both vertical directions with every other intersection P2 arranged in the horizontal direction in between and intersect the parallel Vertical cut line VC. Also, the nth first oblique parallel cutting line TC1 and the (n + 1)th first oblique parallel cutting line TC1 are separated by X = L / (2 + 2 1 / 2 ) in both horizontal directions with every other intersection P2 arranged in the horizontal direction in between and intersect the parallel horizontal cutting line LC so as to define the first oblique parallel cutting line TC1.

[0035] Further, the second obliquely parallel cut line TC2 is parallel to the (n + 1)-th first obliquely parallel cut line TC1 from every other intersection point P2 adjacent to the remaining every other intersection point P2'. Vertical cut The directions in which the points where the line VC intersects and the points where the horizontal cut line LC parallel to the (n + 2)-th first obliquely parallel cut line TC1 intersect are respectively at a position separated by X = L / (2 + 2 1 / 2 ) and are parallel. Vertical cut The second obliquely parallel cut line TC2 is defined so as to intersect the line VC and the horizontal cut line LC.

[0036] By the cut lines defined in this way, for example, if the multi-piece substrate SB is cut by dicing, one corner becomes 90 degrees, and a heptagonal substrate can be produced with good yield. Note that an adhesive sheet is attached to one surface of the multi-piece substrate, and a cut is made from the other surface of the multi-piece substrate by dicing. If the depth of this cut is set to a depth at which the adhesive sheet is not completely cut in the thickness direction, the cut pieces will not fall apart.

[0037] FIG. 4 is a schematic diagram showing another example of a cut line for cutting a multi-piece substrate for manufacturing heptagonal substrates of different shapes. In this manufacturing method, first, for the multi-piece substrate SB, a plurality of parallel vertical cut lines VC extending in the vertical direction and a plurality of parallel horizontal cut lines LC orthogonal to the plurality of parallel vertical cut lines VC extending in the horizontal direction are defined.

[0038] At this time, when the interval dimension between the n-th (n is an odd number of 1 or more) parallel vertical cut line and the (n + 1)-th parallel vertical cut line VC1 is L, the interval dimension X between the (n + 1)-th parallel vertical cut line VC1 and the (n + 2)-th parallel vertical cut line VC2 is 2 1 / 2 L / (2 + 2 1 / 2Determine a plurality of parallel vertical cut lines VC so as to satisfy the following. Also, for the plurality of parallel horizontal cut lines LC, when the distance dimension between the m-th (m is an odd number of 1 or more) parallel horizontal cut line LC1 and the (m + 1)-th parallel horizontal cut line LC2 is L, the distance dimension X between the (m + 1)-th parallel horizontal cut line LC2 and the (m + 2)-th parallel horizontal cut line LC3 is 2 1 / 2 L / (2 + 2 1 / 2 ) to determine a plurality of parallel horizontal cut lines LC so as to satisfy the following.

[0039] Then, determine a plurality of first obliquely parallel cut lines TC1 that extend in an oblique direction and intersect the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC, and a plurality of second obliquely parallel cut lines TC2 that extend in an oblique direction and intersect the plurality of parallel vertical cut lines VC, the plurality of parallel horizontal cut lines LC, and the plurality of first obliquely parallel cut lines TC1.

[0040] At this time, virtual center points P3 are respectively determined at the centers of the regions R located between the (n + 1)-th parallel vertical cut line VC1 and the (n + 2)-th parallel vertical cut line VC2 and between the m-th parallel horizontal cut line LC1 and the (m + 1)-th parallel horizontal cut line LC2. Then, determine the plurality of first obliquely parallel cut lines TC1 so that each of the plurality of first obliquely parallel cut lines TC1 passes through every other center point P3 arranged in the horizontal direction. Also, determine the plurality of second obliquely parallel cut lines TC2 so that each of the plurality of second obliquely parallel cut lines TC2 passes through the plurality of center points P3 arranged in the horizontal direction.

[0041] By cutting the multi-piece substrate with the cut lines determined in this way, it is also possible to increase the number of heptagonal substrates that can be manufactured from one multi-piece substrate SB.

[0042] The substrate does not have to be a heptagonal shape as long as it is a polygonal shape with five or more sides. For example, the substrate can be hexagonal. FIG. 5 is a schematic diagram showing an example of a cut line for cutting a multi-piece substrate for manufacturing a hexagonal substrate. In this manufacturing method, first, for the multi-piece substrate SB, a plurality of parallel vertical cut lines VC extending in the vertical direction and arranged at equal intervals, and a plurality of parallel horizontal cut lines LC intersecting the plurality of parallel vertical cut lines VC and extending in the horizontal direction and arranged at equal intervals are defined.

[0043] Next, a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC are defined.

[0044] Furthermore, a plurality of second oblique parallel cut lines TC2 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC, the plurality of parallel horizontal cut lines LC, and the plurality of first oblique parallel cut lines TC1 are defined.

[0045] In this case, the plurality of parallel vertical cut lines VC are arranged at equal intervals, and the plurality of parallel horizontal cut lines LC are arranged at equal intervals. At this time, a virtual point P1 is defined at a position that bisects the portions of the plurality of parallel vertical cut lines VC located between the nth (n is an integer of 1 or more) parallel horizontal cut line LC and the (n + 1)th parallel horizontal cut line LC. Similarly, a virtual point P1 is defined at a position that bisects the portions of the plurality of parallel vertical cut lines VC located between the (n + 2)th parallel horizontal cut line LC and the (n + 3)th parallel horizontal cut line LC.

[0046] And the plurality of first oblique parallel cut lines TC1 are defined so as to pass through every other one of the plurality of virtual points P1 arranged in the horizontal direction. Also, the plurality of second oblique parallel cut lines TC2 are defined so as to pass through the virtual points P1 arranged in the horizontal direction.

[0047] If the multi-piece substrate is cut, for example, by dicing in such a way as to draw the cut lines, one corner becomes 90 degrees, and a hexagonal polygonal substrate can be manufactured with good yield.

[0048] In each of the above examples, since a plurality of parallel vertical cut lines VC extending in the vertical direction and arranged at equal intervals L and a plurality of parallel vertical cut lines VC extending in the horizontal direction and arranged at equal intervals L are assumed, a polygonal substrate is formed in a square substrate formation region. However, it is of course possible to form a polygonal substrate using a substrate formation region other than a square.

Industrial Applicability

[0049] According to the present invention, it is possible to provide an RFID tag that strengthens the electromagnetic field coupling force of an RFID tag including a first antenna and a second antenna having at least one turn or more of an annular loop portion coupled through an electromagnetic field, and that can be miniaturized.

[0050] Further, according to the present invention, it is possible to provide a method for manufacturing a substrate for RFID that can efficiently take out a large number of substrates for RFID tags from a single large substrate.

Explanation of Signs

[0051] 1 RFID tag 3 Substrate 3a 90-degree corner 3b First side portion 3c Second side portion 3d Corner 3e Surface 5 Antenna coil 5a Annular loop portion 7 Spiral coil 9 Wireless IC chip 11 Case 13 Through-hole portion

Claims

1. a first antenna formed of a conductive material on a surface of a substrate; a wireless IC chip electrically connected to the first antenna for processing a transmission / reception signal; An RFID tag including a second antenna having at least one turn of an annular loop portion formed by bending a metal wire and coupled to the first antenna via an electromagnetic field, the first antenna is a spiral coil that faces an inner space of the annular loop portion of the second antenna or is located within the inner space and extends along the annular loop portion, The substrate is a polygonal substrate having five or more sides including one 90-degree corner, An RFID tag characterized in that a through-hole portion that electrically connects the circuit on the back surface of the polygonal substrate having 5 or more sides and the spiral coil is provided between the spiral coil and the 90-degree corner of the polygonal substrate having 5 or more sides.

2. The RFID tag according to claim 1 , wherein the substrate having a polygonal shape of five or more sides is a hexagon or a heptagon.

3. The spiral coil is a spiral coil having a polygonal shape having 5 or more sides, a positional relationship between a corner of the spiral coil having a polygonal shape of five or more sides and a substrate having a polygonal shape of five or more sides is determined so that the 90 degree corner is located outside one side of the spiral coil having a polygonal shape of five or more sides, 2. The RFID tag as described in claim 1, wherein a through-hole portion electrically connecting a circuit on a back surface of the polygonal substrate having 5 or more sides and the spiral coil having 5 or more sides is provided between one side of the spiral coil having 5 or more sides and the 90-degree corner of the polygonal substrate having 5 or more sides.

4. For multi-piece substrates, A plurality of parallel vertical cut lines VC extending in a vertical direction; a plurality of parallel horizontal cut lines LC extending in a horizontal direction and perpendicular to the plurality of parallel vertical cut lines VC; a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC; 2. A method for manufacturing a polygonal substrate for use in an RFID tag according to claim 1, comprising cutting the multi-piece substrate to draw a plurality of parallel vertical cut lines VC, a plurality of parallel horizontal cut lines LC, and a plurality of second diagonal parallel cut lines TC2 that extend in a diagonal direction and intersect with the plurality of first diagonal parallel cut lines TC1, the method comprising the steps of: The parallel vertical cut lines VC are arranged at equal intervals L, The parallel horizontal cut lines LC are arranged at equal intervals L, A virtual point P1 is determined at a position that divides a portion of the parallel vertical cut lines VC located between the nth (n is an integer of 1 or more) parallel horizontal cut line LC and the n+1th parallel horizontal cut line LC in half, and at a position that divides a portion of the parallel vertical cut lines VC located between the n+2th parallel horizontal cut line LC and the n+3th parallel horizontal cut line LC in half, The first diagonal parallel cut lines TC1 pass through every other one of the imaginary points P1 arranged in the horizontal direction, A method for manufacturing an RFID tag substrate, wherein the plurality of second oblique parallel cut lines TC2 each pass through the imaginary points P1 aligned in the horizontal direction.

5. For multi-piece substrates, A plurality of parallel vertical cut lines VC extending in a vertical direction; a plurality of parallel horizontal cut lines LC extending in a horizontal direction and perpendicular to the plurality of parallel vertical cut lines VC; a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC; 2. A method for manufacturing a polygonal substrate for use in an RFID tag according to claim 1, comprising cutting the multi-piece substrate to draw a plurality of parallel vertical cut lines VC, a plurality of parallel horizontal cut lines LC, and a plurality of second diagonal parallel cut lines TC2 that extend in a diagonal direction and intersect with the plurality of first diagonal parallel cut lines TC1, the method comprising the steps of: The parallel vertical cut lines VC are arranged at equal intervals L, The parallel horizontal cut lines LC are arranged at equal intervals L, The intersections of the parallel vertical cut lines VC and the parallel horizontal cut lines LC are defined as intersections (P2, P2'), The n-th (n is an odd number equal to or greater than 1) first diagonal parallel cut line TC1 and the n+1-th first diagonal parallel cut line TC1 are arranged in both directions of the vertical direction with every other intersection point P2 arranged in the horizontal direction therebetween. 1 / 2 ) intersects the parallel vertical cut line VC at a position spaced apart from the The n-th first diagonal parallel cut line TC1 and the n+1-th first diagonal parallel cut line TC1 are arranged in both directions of the horizontal direction with every other intersection point P2 arranged in the horizontal direction therebetween, the intersection points P2 being spaced apart by L / (2+2 1 / 2 ) intersects with the parallel horizontal cut line LC at a position spaced apart from the The second diagonal parallel cut line TC2 extends from the remaining alternate intersection point P2' adjacent to the alternate intersection point P2 in a direction to a point where the (n+1)th first diagonal parallel cut line TC1 intersects with the parallel vertical cut line VC and in a direction to a point where the (n+2)th first diagonal parallel cut line TC1 intersects with the parallel horizontal cut line LC, with a length of L / (2+2 1 / 2 ) the parallel vertical cut lines VC and the parallel horizontal cut lines LC intersect at positions spaced apart from each other.

6. For multi-piece substrates, A plurality of parallel vertical cut lines VC extending in a vertical direction; a plurality of parallel horizontal cut lines LC extending in a horizontal direction and perpendicular to the plurality of parallel vertical cut lines VC; a plurality of first oblique parallel cut lines TC1 extending in an oblique direction and intersecting the plurality of parallel vertical cut lines VC and the plurality of parallel horizontal cut lines LC; 2. A method for manufacturing a polygonal substrate for use in an RFID tag according to claim 1, comprising cutting the multi-piece substrate to draw a plurality of parallel vertical cut lines VC, a plurality of parallel horizontal cut lines LC, and a plurality of second diagonal parallel cut lines TC2 that extend in a diagonal direction and intersect with the plurality of first diagonal parallel cut lines TC1, the method comprising the steps of: When the distance between the n-th (n is an odd number equal to or greater than 1) parallel vertical cut line and the n+1-th parallel vertical cut line VC1 is L, the distance between the n+1-th parallel vertical cut line VC1 and the n+2-th parallel vertical cut line VC2 is 2 1 / 2 L / (2+2 1 / 2 ) When the distance between the m-th (m is an odd number equal to or greater than 1) parallel horizontal cut line LC1 and the (m+1)-th parallel horizontal cut line LC2 is L, the distance between the m+1-th parallel horizontal cut line LC2 and the (m+2)-th parallel horizontal cut line LC3 is 2 1 / 2 L / (2+2 1 / 2 ) When a virtual center point P3 is set at the center of a region R located between the n+1-th parallel vertical cut line VC1 and the n+2-th parallel vertical cut line VC2 and between the m-th parallel horizontal cut line LC1 and the m+1-th parallel horizontal cut line LC2, The plurality of first oblique parallel cut lines TC1 each pass through every other center point P3 arranged in the horizontal direction, The method for manufacturing an RFID tag substrate, wherein the plurality of second oblique parallel cut lines TC2 each pass through a plurality of center points P3 aligned in the horizontal direction.

Citation Information

Patent Citations

  • Wireless IC devices

    JP4697332B2