Information processing device and information processing method

Abstract

To shorten time required for analyzing a factor of abnormality in a semiconductor production device.SOLUTION: An information processing device comprises: an acquisition unit for acquiring processing information including a first processing condition of substrate processing, first processing data related to the substrate processing to which the first processing condition is applied, a second processing condition different from the first processing condition, and second processing data related to the substrate processing to which the second processing condition is applied; and a display control unit for controlling display on a display device on the basis of the processing information acquired by the acquisition unit. The display control unit displays a first screen which displays the first processing data and the second processing data in different areas, respectively, on the display device.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an information processing device and an information processing method. [Background technology]

[0002] Semiconductor manufacturing factories are usually equipped with semiconductor manufacturing equipment such as substrate processing equipment, and it is necessary to efficiently process substrates by understanding the operating status of each equipment. Also, if an abnormality occurs in the semiconductor manufacturing equipment, it is necessary to take immediate action.

[0003] Patent Document 1 discloses a method for detecting anomalies in semiconductor manufacturing equipment by statistically processing the processing results of the semiconductor manufacturing equipment for each lot, which includes multiple substrates, and displaying the statistical processing results in a graph, allowing the user to immediately recognize which lot is experiencing an anomaly. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-170612 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, even if a graph is displayed for each lot that contains multiple substrates, it is difficult to immediately determine what trends exist due to differences in recipes, which are the processing conditions of the semiconductor manufacturing equipment. If an anomaly is caused by a recipe, in order to determine the cause, it is necessary to organize information about each recipe and compare the trends of each recipe. If the user does not collect and analyze the above-mentioned data, he or she will not be able to determine the trends of each recipe, and will end up spending a lot of time trying to resolve the anomaly.

[0006] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, an object of the present invention is to provide a technique that is advantageous in shortening the time required for analyzing the causes of an abnormality in semiconductor manufacturing equipment. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, an information processing apparatus as one aspect of the present invention has an acquisition unit that acquires processing information including first processing conditions for substrate processing, first processing data related to the substrate processing to which the first processing conditions have been applied, second processing conditions different from the first processing conditions, and second processing data related to the substrate processing to which the second processing conditions have been applied, and a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit, wherein the display control unit displays on the display device a first screen in which the first processing data and the second processing data are each displayed in separate areas. Effect of the Invention

[0008] An object of the present invention is to provide a technique that is advantageous for shortening the time required for analyzing the causes of an abnormality in, for example, semiconductor manufacturing equipment. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 illustrates a system for manufacturing an article. [Diagram 2] FIG. 1 is a diagram showing an exposure apparatus as an example of a pattern forming apparatus. [Diagram 3] FIG. 2 is a diagram illustrating a hardware configuration of an information processing device. [Figure 4] FIG. 2 illustrates a configuration of a CPU of a management apparatus. [Diagram 5] 11 is a flowchart of a display process in the display device. [Figure 6] FIG. 13 is a diagram showing lot data for different recipes superimposed on the same graph. [Figure 7] FIG. 13 is a diagram showing lot data for each recipe in a separate graph. [Figure 8] FIG. 13 is a diagram in which the time axis of the graph is changed. [Figure 9] FIG. 13 is a diagram showing change history information. [Figure 10] FIG. 13 is a diagram showing the processing conditions for a selected lot. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] First Embodiment In this embodiment, an article manufacturing system including a plurality of devices and a management device that manages the plurality of devices will be described. Fig. 1 is a diagram showing the article manufacturing system. The article manufacturing system 100 of this embodiment includes a pattern forming device 200 that forms a pattern on a wafer (substrate), a processing device 201, an inspection device 202, and a management device 300 that manages these devices. In the article manufacturing system 100, each of the pattern forming device 200, the processing device 201, and the inspection device 202 includes one or more devices.

[0012] The pattern forming apparatus 200 includes an exposure apparatus that irradiates a reticle (mask, original) on which a pattern is formed with light and projects the pattern onto a shot area on a wafer with the light from the reticle. The pattern forming apparatus 200 also includes an imprinting apparatus that, for example, brings an imprinting material supplied onto a wafer into contact with a mold (original, mold) and applies energy for hardening to the imprinting material to form a composition to which the shape of the mold is transferred. The pattern forming apparatus 200 also includes a drawing apparatus that draws on a substrate with a charged particle beam such as an electron beam or an ion beam via a charged particle optical system to form a pattern on the substrate. The pattern forming apparatus 200 performs substrate processing using these methods.

[0013] The processing apparatus 201 includes manufacturing apparatuses that perform processes other than those performed by an exposure apparatus or the like in the manufacture of an article such as a device, such as a coating apparatus that coats a photosensitive medium or the like on the surface of a substrate, a developing apparatus that develops a substrate onto which a pattern has been transferred, etc. In addition, the processing apparatus 201 includes an etching apparatus, a film forming apparatus, etc.

[0014] The inspection device 202 includes, for example, an overlay inspection device, a line width inspection device, a pattern inspection device, and an electrical property inspection device. Here, the overlay inspection device is a device that inspects the accuracy of the misalignment between an upper layer pattern and a lower layer pattern on a substrate on which patterns are formed in multiple layers. The line width inspection device is a device that inspects the accuracy of dimensions such as the line width of a pattern formed on a substrate. The pattern inspection device is a device that inspects the presence or absence of a pattern that does not meet the required accuracy due to foreign matter attached to the substrate on which a pattern is formed or insufficient filling of an imprint material. The electrical property inspection device is a device that inspects the accuracy of the electrical properties of a semiconductor device or the like manufactured from a substrate on which a pattern is formed.

[0015] Next, as an example of the pattern forming apparatus 200, an exposure apparatus that exposes a wafer with light from a reticle on which a pattern is formed will be described. FIG. 2 is a diagram showing an exposure apparatus as an example of the pattern forming apparatus. The exposure apparatus 204 according to this embodiment will be described as a step-and-scan type exposure apparatus that performs exposure while synchronously driving a reticle stage and a wafer stage. The exposure apparatus 204 is not limited to a scanner, and may be a step-and-repeat type exposure apparatus that performs exposure while the wafer stage is stationary. In the example of FIG. 2, the exposure apparatus 204 has a light source 7, an illumination optical system 8, a reticle stage 2, a projection optical system 3, a wafer stage 6, a wafer chuck 5, and a control unit 13. The exposure apparatus 204 also has a laser interferometer 9, a laser interferometer 10, a focus sensor, a wafer transport unit 12, a reticle transport unit 14, and an alignment scope 15. In FIG. 2, the direction parallel to the optical axis of the projection optical system 3 is the Z-axis direction, and two directions perpendicular to each other in a plane perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction.

[0016] Examples of light source 7 include a high-pressure mercury lamp, an ArF excimer laser, and a KrF excimer laser. Light source 7 is not necessarily located inside the chamber of the exposure device, and may be configured to be external. Light emitted from light source 7 illuminates reticle 1 via illumination optical system 8. Reticle 1 has a pattern drawn thereon to be transferred onto wafer 4 coated with a photosensitive material, and is mounted on reticle stage 2. Reticle stage 2 adsorbs and holds the reticle via a reticle chuck, and is configured to be movable by, for example, a linear motor.

[0017] The projection optical system 3 projects an image of the pattern drawn on the reticle 1 onto the wafer 4 placed on the wafer chuck 5. When the image of the pattern is projected onto the wafer 4, an image that has been inverted and reduced at a projection magnification (for example, 1 / 4) is projected onto the wafer 4 via the projection optical system 3. If the area onto which the image of the pattern is projected is referred to as a shot area, then a plurality of shot areas are set on the wafer 4, and projection onto the shot areas is repeated in sequence.

[0018] The wafer stage 6 is driven by a linear motor actuator or the like, and is thus movable in the X and Y directions. The wafer chuck 5 is mounted on the wafer stage 6 and holds the wafer 4. The wafer stage 6 positions the wafer chuck 5 in the Z, θ, ωX, and ωY directions. In this manner, the wafer 4 held by the wafer chuck 5 is moved by driving the wafer stage 6 and the wafer chuck 5.

[0019] Laser interferometer 9 measures the position of reticle stage 2 in the Y direction, and measures the attitude of reticle stage 2. Laser interferometer 9 similarly includes a laser interferometer for measuring the position of reticle stage 2 in the X direction. Laser interferometer 10 also measures the position of wafer stage 6 on which wafer 4 is mounted in the Y direction, and measures the attitude of wafer stage 6. Laser interferometer 10 also includes a laser interferometer for measuring the position of wafer stage 6 in the X direction. The positions of reticle stage 2 and wafer stage 6 are controlled by controller 13, which will be described later, based on the positions measured by laser interferometer 9 and laser interferometer 10.

[0020] The focus sensor includes a light projection system 11a that projects light onto the wafer 4, a light receiving system 11b that receives light reflected from the wafer, and a detection section that detects the light from the light receiving system and outputs a detection signal to a control section 13. The light projection system 11a and the light receiving system 11b are installed on either side of the exit section of the projection optical system 3, with the light projection system 11a irradiating the wafer with obliquely incident light and the light receiving system 11b capturing the light reflected on the opposite side. The control section 13, which will be described later, measures the position of the wafer 4 in the Z direction from the detection signal detected by the focus sensor and controls the movement of the wafer 4 by the wafer stage 6.

[0021] The wafer transfer unit 12 transfers the wafer 4. The wafer transfer unit 12 transfers the wafer 4 from a wafer storage container or the like that stores the wafer 4 to the wafer stage 6. The wafer transfer unit 12 also transfers the wafer 4 from the wafer stage 6 to the wafer storage container or the like.

[0022] The reticle transport unit 14 transports the reticle 1. The reticle transport unit 14 transports the reticle 1 from a reticle storage container or the like that stores the reticle 1 to the reticle stage 2. In addition, the reticle transport unit 14 transports the reticle 1 from the reticle stage 2 to the reticle storage container or the like.

[0023] The alignment scope 15 acquires a digital image signal obtained by capturing an image of a mark formed on the wafer 4 in order to perform positioning (alignment) of the wafer 4 held by the wafer chuck 5. The alignment scope 15 includes an image sensor that outputs a grayscale image signal corresponding to the brightness, i.e., grayscale, of the light reflected from the wafer 4, and an A / D converter that converts the grayscale image signal obtained from the image sensor into a digital image signal. The control unit 13, which will be described later, detects the position of the mark formed on the wafer 4 using the acquired digital image signal, and controls the wafer stage 6 based on the detected position of the mark to perform positioning of the wafer 4.

[0024] The control unit 13 controls the exposure process on the wafer 4 by controlling the operation and adjustment of each part of the exposure apparatus 204. The control unit 13 is configured, for example, by a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a computer with a program installed, or a combination of all or part of these. The control unit 13 may be configured integrally with other parts of the exposure apparatus 204 (in a common housing), or may be configured separately from other parts of the exposure apparatus 204 (in a different housing). The control unit 13 also applies information acquired from a storage device or the like, which will be described later, to control the exposure process (pattern formation process) on the wafer 4 to be executed.

[0025] Next, the management device 300 will be described. FIG. 3 is a diagram showing the hardware configuration of the information processing device. The information processing device includes a CPU 301, a ROM 302, a RAM 303, a storage device 304, an input device 305, a display device 306, and a communication device 307. Each hardware configuration of the information processing device functions according to a program. In the example of FIG. 3, the CPU 301 is a processing device that performs calculations for control according to a program and controls each component connected to a bus 308. The ROM 302 is a memory dedicated to reading data, and stores programs and data. The RAM 303 is a memory for reading and writing data, and is used for storing programs and data. The RAM 303 is used for temporarily storing data such as the results of calculations by the CPU 301. The storage device 304 is also used for storing programs and data. The storage device 304 is also used as a temporary storage area for programs and data of the operating system (OS) of the information processing device.

[0026] The storage device 304 is slower in data input / output than the RAM 303, but is capable of storing large amounts of data. It is desirable for the storage device 304 to be a non-volatile storage device that can store data as permanent data so that the data can be referenced for a long period of time. The storage device 304 is mainly composed of a magnetic storage device (HDD), but may also be a device that reads and writes data by loading external media such as CDs, DVDs, and memory cards.

[0027] The input device 305 is a device for inputting characters and data to the information processing device, and corresponds to various keyboards and mice. The display device 306 plays a role as a user interface of the management device 300 and displays information required for operating the information processing device, processing results, and the like, and corresponds to a CRT or liquid crystal monitor. When the display device 306 can be operated by touching the screen, for example, like a touch panel, it also plays a role of the input device 305. In addition, the input device 305 and the display device 306 have been described as parts of the management device 300, but are not limited to this, and may be parts of the pattern forming device 200, for example.

[0028] The communication device 307 is used when connecting to a network and performing data communication using a communication protocol such as TCP / IP to communicate with other devices. The information processing device may also be configured with a GPU (abbreviation of Graphics Processor Unit) to enable high-speed arithmetic processing. The management device 300 is an information processing device, and is connected to a plurality of exposure devices 204 via the communication device 307 to communicate data.

[0029] Fig. 4 is a diagram showing the configuration of CPU 301 in management apparatus 300. CPU 301 includes an acquisition unit 401, a storage unit 402, a calculation unit 403, and a display control unit 404. Fig. 5 is a flowchart showing the display processing of a user interface for analyzing an abnormality occurring in the exposure apparatus.

[0030] 4 and 5, the display processing of the display device 306 in the management device 300 of this embodiment will be described below. In this embodiment, the display on the display device 306 makes it possible to shorten the time required for analyzing the cause of an abnormality in the exposure apparatus 204. An abnormality in this embodiment includes a serious abnormality that causes the exposure apparatus 204 to stop, and an abnormality that affects productivity such as reducing the accuracy of the exposure apparatus 204.

[0031] The flowchart of FIG. 5 will be described. In step S501, the acquisition unit 401 acquires the processing information of the exposure apparatus 204. The processing information of the exposure apparatus 204 includes the processing data of the exposure apparatus 204 and the processing conditions applied during the exposure process. The processing data of the exposure apparatus 204 is information including the operation result of the exposure apparatus 204 and the state of the wafer exposed by the exposure apparatus 204, and specifically includes synchronization accuracy data, alignment accuracy data, and the like. The synchronization accuracy data is data indicating the error in the relative positions of the reticle stage 2 and the wafer stage 6 during the period in which the reticle stage 2 and the wafer stage 6 are driven synchronously in, for example, the Y-axis direction in order to expose the target shot area. The alignment accuracy data is data indicating the waveform data of the digital image signal obtained by capturing an image of a mark formed on the target wafer 4 and the evaluation of the digital image signal (symmetry of the waveform data, contrast of the digital image signal).

[0032] The processing conditions applied during exposure processing are recipes determined for each recipe of the wafers to be produced, and equipment parameters determined for each exposure tool 204. A recipe is a processing condition that is shared among a plurality of exposure tools, and equipment parameters are processing conditions that are not shared among a plurality of exposure tools. Examples of recipes include the exposure dose when exposing a wafer, and selection of individual correction values ​​and correction algorithms for tracking an exposed pattern. Examples of equipment parameters include correction values ​​for the projection optical system, and a control method and control parameters for the wafer stage. Furthermore, the processing conditions are not limited to these, and parameters that define other processing conditions may also be displayed.

[0033] Next, in step S502, the processing data and processing conditions of the exposure tool 204 acquired in step S501 are stored in the storage unit 402. The processing data stored in the storage unit 402 is, for example, processing data on a wafer basis (substrate basis).

[0034] In step S503, calculation unit 403 calculates lot data, which is processing data per lot, based on the processing data per wafer accumulated by accumulation unit 402. The lot data is calculated from statistical values ​​(e.g., maximum value, minimum value, average value, median value, standard deviation) of the processing data per wafer. Also, the lot data may be calculated in exposure tool 304 instead of being calculated by calculation unit 403. For example, acquisition unit 401 may acquire the lot data calculated in exposure tool 304 from exposure tool 204 and proceed to step S504.

[0035] In step S504, the display control unit 404 outputs the lot data calculated in step S503 to the display device 306, and controls the display device 306 to display it as shown in Fig. 6. A graph 601 is a graph in which lot data to which different recipes have been applied are superimposed on one graph and displayed in the same area. The graph 601 is displayed in chronological order, with the horizontal axis of the graph 601 indicating the time when the exposure process was performed and the vertical axis indicating the lot data value, which is the value of the processing data for each lot.

[0036] Switching buttons 602 and 603 can change the display method of graph 601. Fig. 6 shows a state in which switching button 602 is selected. A user can change the display method of graph 601 by selecting switching button 603. Switching buttons 601 and 602 may be integrated into one button.

[0037] In step S505, the display control unit 404 determines whether the graph display method has been changed. That is, it determines whether the user has selected the switching button 603. If the switching button 603 has been selected, the process proceeds to step S506. The method of selecting the switching button 603 is realized by a computer input device such as a mouse, keyboard, or touch panel, and a program that controls the device.

[0038] In step S506, the display control unit 404 outputs the lot data calculated in step S503 to the display device 306, and controls the display device 306 to display the lot data as shown in FIG. 7. The graph 701 is a graph in which the display area is divided for each recipe, and the lot data is displayed in a separate graph. The graph 701 is displayed in chronological order, and the horizontal axis of the graph 701 is the time when the exposure process was performed, and is divided by recipe. The vertical axis indicates the lot data value, which is the value of the processing data in units of lots. The scroll bar 705 is for changing the display position of the graph 701, and can display lot data in a range not displayed in FIG. 7 on the display device 306. In addition, the user can return to the state of FIG. 6 in which lot data to which different recipes have been applied are superimposed on one graph by selecting the switch button 602 in the state of FIG. 7 in which the lot data for each recipe is displayed in a separate graph.

[0039] The setting button 704 is for setting whether to align the time range of the graphs to be displayed for each recipe. As shown in FIG. 7, when the setting button 704 is ON, a graph of the same time range is displayed for each recipe, as in graph 701. On the other hand, FIG. 8 is a diagram showing the state in which the setting button 704 is OFF. FIG. 8 is a diagram showing lot data displayed in a separate graph for each recipe, as in FIG. 7, but in graph 711, the displayed time range differs depending on the recipe. Therefore, when there is a change over time in a certain recipe, the overall trend for one recipe can be seen, making it easy to judge the trend. Also, the recipe to be displayed and its time range can be changed using the scroll bar 705.

[0040] If the user selects to end the screen in step S507, the display on the display device 306 is terminated.

[0041] In order to analyze the cause of the abnormality, the user can selectively switch the graph display to the most suitable one for identifying the cause, as described above. For example, in the graph shown in FIG. 6, if the lot data display is not overlapped, the recipe tendency can be judged, but if the lot data display is overlapped, it is difficult to judge the tendency of each recipe. On the other hand, in the graph shown in FIG. 7, since there are multiple graphs and the time display range is narrow, it is not possible to judge the overall tendency of the recipe at a glance, but it is possible to judge the tendency of each recipe by moving the scroll bar 705. In FIG. 7, the user can immediately judge that the lot data value of recipe D is larger than those of recipe A and recipe B, so that the user can quickly take measures to eliminate the abnormality. It can be seen that the recipe C does not process the wafer during the time displayed in the graph 701. Also, the graph 601 in FIG. 6, the graph 701 in FIG. 7, and the graph 711 in FIG. 8 may be displayed together in the display device 306 without being switched between each other.

[0042] In the above description, the lot data is described as a statistical value of the processing data of one lot, but this is not limited thereto, and the lot data may be a statistical value of the processing data of multiple lots to which the same recipe is applied. In the present embodiment, the lot data is described as being displayed on a separate graph for each recipe in Fig. 7 and Fig. 8, but this is not limited thereto, and the lot data may be displayed on a separate graph for each exposure tool 304.

[0043] As described above, in this embodiment, since the display device 306 can display different graphs of lot data for each recipe, it is possible to reduce the time required to resolve an abnormality caused by a recipe.

[0044] <Second embodiment> In this embodiment, an example will be described in which change history information, which is information on changes to exposure processing conditions, is displayed together with lot data. Note that matters not mentioned in this embodiment follow the first embodiment.

[0045] Fig. 9 is a diagram showing the graph display shown in Fig. 8 together with change history information. Change history information is information related to processing conditions and the time when the processing conditions were applied. Lines 712a and 712b indicate the time when the recipe parameters were changed on graph 711, and show that the recipe parameters were changed before and after lines 712a and 712b. Lines 713a and 713b indicate the time when the equipment parameters were changed on graph 711, and show that the equipment parameters were changed before and after lines 713a and 713b.

[0046] Process conditions 714 represent changes to the recipe parameters corresponding to lines 712a and 712b. Setpoint 1 and setpoint 3 are changed at the time shown by line 712a and are returned to the original recipe parameters at the time shown by line 712b. Setpoint 2 remains unchanged. Process conditions 715 represent changes to the equipment parameters corresponding to lines 713a and 713b. Setpoint 5 and setpoint 6 are changed at the time shown by line 713a and are returned to the original equipment parameters at the time shown by line 713b. Setpoint 4 remains unchanged.

[0047] Lines 712a, 712b, 713a, and 713b help the user visually determine whether there is a difference in the lot data trend before and after the time when the processing conditions are changed. The user can check whether there is a difference in the lot data trend before and after the time when the lines 712a, 712b, 713a, and 713b, and take immediate action if there is a difference.

[0048] In the example shown in Fig. 9, the user first checks lines 712a, 712b, 713a, and 713b. At this time, it is found that the change in lot data occurs due to a change in settings at line 713a. Therefore, the user changes the settings at line 713b to return setting values ​​5 and 6 to the original equipment parameters. As a result, the lot data at the time after line 713b is corrected to match the trend of the lot data at the time before line 713a.

[0049] In the above description, information regarding the time when the processing conditions are applied is shown by lines 712a, 712b, 713a, and 713b, but this is not limiting and may be an arrow or a mark that can specify the time on graph 711. In addition to the recipe parameters and equipment parameters of processing conditions 714 and 715, parameters that define the processing conditions may be displayed as processing conditions.

[0050] As described above, in this embodiment, by displaying change history information, which is information regarding changes to the exposure processing conditions, it is possible to make it easier to analyze abnormalities in the exposure tool 304 and shorten the time it takes to resolve the abnormality.

[0051] <Third embodiment> In this embodiment, an example will be described in which processing conditions related to a lot designated by a user are displayed. Note that matters not mentioned in this embodiment follow the first embodiment.

[0052] Fig. 10 is a diagram showing processing conditions for a lot specified by a user in the graph display shown in Fig. 8. A lot is specified by the user selecting the lot data plotted in graph 711 or inputting the lot name. A method for specifying a lot is realized by a computer input device such as a mouse, keyboard, or touch panel and a program for controlling the same.

[0053] Processing conditions 724 indicate recipe parameters applied to the lot data 722a to 722c. Processing conditions 725 indicate equipment parameters applied to the lot data 722a to 722c. The parameters displayed in the processing conditions 724 and 725 may be highlighted to highlight parameters with differences so that the user can easily compare the lot data 722a to 722c, or may display only parameters with differences. In addition, the parameters may be displayed based on a preset priority order, or parameters that are deemed unnecessary based on preset information may not be displayed.

[0054] In the example shown in Fig. 10, the user first searches for a characteristic point of the change in the lot data from the graph 711. The user then specifies the characteristic point and the surrounding lot data 722a to 722c. The display device 306 displays the processing conditions 724, 725 applied to the lot data 722a to 722c. From the displayed processing conditions 724, 725, the user can determine that the changes in the setting values ​​1, 3, 5, and 6 are related to the change in the tendency of the lot data. Therefore, the user can correct the settings of the setting values ​​1, 3, 5, and 6 so as to eliminate the abnormality.

[0055] As a modified example combining the second embodiment with this embodiment, the graph 711 may show processing conditions 724 and 725 relating to lot data designated by the user while still displaying the lines 712a, 712b, 713a, and 713b of FIG.

[0056] As described above, in this embodiment, by displaying the processing conditions for a lot specified by the user, it becomes easier to understand under which processing conditions an abnormality is occurring, and it is possible to shorten the time required to resolve the abnormality.

[0057] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment may include a forming step of forming a pattern of an original on a substrate using the above-mentioned manufacturing system for the article, and a processing step of processing the substrate on which the pattern has been formed in the forming step. Furthermore, such an article manufacturing method may include other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0058] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0059] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0060] 200 Pattern forming device 300 Management device 306 Display device 401 Acquisition Department 404 Display control section

Claims

1. An acquisition unit that acquires processing information including a first recipe which is a processing condition for substrate processing by a substrate processing apparatus, first processing data relating to the substrate processing to which the first recipe is applied, a second recipe which is a processing condition different from that of the first recipe, and second processing data relating to the substrate processing to which the second recipe is applied; a display control unit that controls display on a display device based on the processing information acquired by the acquisition unit; The information processing device is characterized in that the display control unit displays a first screen on the display device in which the first processing data and the second processing data are displayed in separate areas, and displays change history information in which processing conditions have been changed on the first screen.

2. 2. The information processing device according to claim 1, wherein the display control unit selectively displays, on the display device, the first screen and a second screen that displays the first processing data and the second processing data in the same area.

3. 2 . The information processing apparatus according to claim 1 , wherein the display control unit displays, on the display device, a second screen that displays the first processing data and the second processing data in the same area together with the first screen.

4. 4. An information processing apparatus according to claim 1, wherein the first processing data and the second processing data are information including the operation results of a processing apparatus performing substrate processing, and the state of the substrate obtained by measuring the substrate that has undergone substrate processing.

5. The information processing apparatus according to claim 1 , wherein the display control unit displays the first processing data and the second processing data in a graph in chronological order.

6. 6. The information processing apparatus according to claim 1, further comprising a calculation unit that calculates processing data for each lot based on the processing data for each substrate acquired by the acquisition unit.

7. 7. The information processing apparatus according to claim 6, wherein the calculation unit calculates the processing data per lot based on one of statistical processing of a maximum value, a minimum value, an average value, a median value, and a standard deviation of the processing data per substrate acquired by the acquisition unit.

8. 8. The information processing apparatus according to claim 1, wherein the display control unit displays processing conditions for a lot designated by a user on the display device.

9. An acquisition process for acquiring processing information including a first recipe which is a processing condition for substrate processing by a substrate processing apparatus, first processing data relating to the substrate processing to which the first recipe is applied, a second recipe which is a processing condition different from the first recipe, and second processing data relating to the substrate processing to which the second recipe is applied; a display control step of controlling a display on a display device based on the processing information acquired in the acquisition step; The information processing method is characterized in that the display control step includes displaying a first screen on the display device, in which the first processing data and the second processing data are displayed in separate areas, and displaying change history information in which processing conditions have been changed on the first screen.

10. 10. The information processing method according to claim 9, wherein the display control step selectively displays, on the display device, the first screen and a second screen that displays the first processing data and the second processing data in the same area.

11. 10. The information processing method according to claim 9, wherein the display control step displays, on the display device, a second screen that displays the first processing data and the second processing data in the same area together with the first screen.

12. A program for causing a computer to execute each step of the information processing method according to any one of claims 9 to 11.

13. An information processing device according to any one of claims 1 to 8; a pattern forming device for forming a pattern on a substrate; The manufacturing system of the article, wherein the information processing device manages a plurality of devices including the pattern forming device.

14. A forming step of forming a pattern on a substrate using the manufacturing system according to claim 13; a processing step of processing the substrate on which the pattern is formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

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