Recyclable design of electronic devices

Abstract

The electronic device 100 is designed to maintain its usefulness during use and to be more easily recycled at the end of its life. The electronic device includes a first substrate 11, an encapsulation layer 19, and a set of electronic devices 15 disposed therebetween. One or more release layers 12, 18 cover at least one, preferably both sides, of the set of electronic devices 15 so as to separate the set of electronic devices 15 from at least one, preferably both, of the first substrate 11 and the encapsulation layer 19. The set of electronic devices 15 covered by the one or more release layers 12, 18 is encapsulated between the encapsulation layer 19 and the first substrate 11. At least one of the release layers 12, 18 includes a set of passages 12p, 18p filled with the material of the encapsulation layer 19, and the set of passages forms a set of interconnects 19p between the encapsulation layer 19 and the first substrate 11.

Description

[Technical field]

[0001] The present disclosure relates to electronic devices and methods for manufacturing and recycling electronic devices. [Background technology]

[0002] Recycling of electronic devices (e.g. in automobiles) is a challenge for the Printed Electronics (PE) community. Although PE technology is expected to be much more environmentally friendly than Printed Circuit Board (PCB) alternatives, the high level of integration makes it very difficult to dismantle electronic devices from the original product, disrupting the current recycling loop. For example, current recycling of electronic devices is done at the PCB level, as the packaging surrounding the PCB is easily removable. In the future, electronic devices will be part of a complete product (e.g. structural electronic devices or 3D printed electronic devices). Currently, PCB boards are crushed instead of being properly recycled and reused. Thus, a flake-based replacement in PE is already a big step forward. Summary of the Invention [Problem to be solved by the invention]

[0003] However, further improvements are needed to improve the recyclability of electronic devices while minimizing the impact on their manufacturability and usability. [Means for solving the problem]

[0004] Some aspects of the present disclosure relate to manufacturing methods for producing electronic devices that are more easily recyclable, for example, to be disassembled into parts at the end of their life. Typically, an electronic device may include a stack of layers, including a set of electronic devices disposed between and / or forming one of the layers. To facilitate separation, one or more release layers may be provided as part of the stack to cover at least one, preferably both sides, of the electronic devices. For example, an encapsulation layer may be disposed on at least one release layer to encapsulate both the electronic devices and the one or more release layers therebetween. In this arrangement, the one or more release layers may separate and hold the electronic components from the encapsulation layer and / or from other layers of the stack, for example, a (first) substrate on the opposite side of the electronic devices relative to the encapsulation layer.

[0005] Debonding is a process by which a material or object, in this case a stack, can be separated into layers. This may also be called debonding. As will be appreciated, by placing one or more release layers on one or both sides of an electronic device, the electronic components may be relatively easily separated from the substrate and / or encapsulation layer during a later recycling process (after the device is no longer in use). Thus, the components and / or circuit components can be more easily separated from the set of electronic devices without being covered (by being stuck) to the substrate or encapsulation layer. This may improve the recyclability of the device. By covering both sides of the electronic device with a release layer, the components may be easily separated from both the substrate and the encapsulation layer. Thus, the components can be completely separated during a later recycling process.

[0006] By providing selective passages through the release layer, a limited set of connections can be established to prevent unintentional delamination of the substrate during normal use. For example, the solidified material in the passages can form a set of posts interconnecting the substrate and the encapsulation layer, which can provide a relatively strong connection compared to the surrounding areas separated by the release layer. Nevertheless, these limited connections, e.g., the interconnect posts, can be weak enough to be separated during a subsequent recycling process. This can further improve the utility while maintaining the recyclability of the device.

[0007] Also, by further extending the area of ​​at least one release layer (beyond the periphery of the electronic device), the surrounding portion of the encapsulation layer and the substrate can be separated from each other. Thus, the substrate and encapsulation layer materials can also be separated from each other in a later recycling process. This may further improve the recyclability of the device. By providing a set of overlapping passages through each of the release surfaces, the substrate and encapsulation layer may be interconnected at each point to prevent unintentional delamination during use while still allowing delamination (by breaking small connections) during a later recycling process. This may further improve the utility of the device while maintaining its recyclability.

[0008] By covering a relatively large area with one release layer between the substrate and the release layer, while keeping the area of ​​another release layer relatively small to cover only the set of electronics (with as small a margin as possible), it may be possible to prevent unnecessary waste of a double release layer beyond the periphery of the set of electronics and allow complete separation of the set of electronics and the substrate and encapsulation layers. Placing the set of electronics on a relatively large release layer and covering it with a relatively small release layer may simplify manufacturing and / or prevent bending of protruding layers at least during initial stack fabrication. For example, the relatively small release layer may function as a globe top.

[0009] By making the substrate have a total surface area larger than the area of ​​the (largest area) release layer, the outer edge of the substrate may remain free of direct contact with the encapsulation layer. In this way, the release layer may be fully encapsulated at the edge between the substrate and the encapsulation layer. This may prevent unintentional release at the edge and improve the usability of the device. By not extending the edge of the substrate significantly beyond the edge of the largest release layer, it may also be possible to relatively easily separate the encapsulation layer from the substrate during a later recycling process. By extending the total surface area of ​​each release layer slightly beyond the edge of a set of electronic devices, the electronic devices may be sufficiently encapsulated and separable from the other layers without unnecessarily wasting material.

[0010] Other or further aspects relate to recyclable electronic devices, for example, manufactured using the manufacturing methods described herein. The device includes a set of electronic devices, including a substrate, an encapsulation layer, and an electronic component. A first release layer is disposed between the set of electronic devices and the substrate, and / or a second release layer is disposed between the set of electronic devices and the encapsulation layer. Thus, the set of electronic devices can be encapsulated between the first and second release layers. Similarly, the encapsulation package, including the release layer, can itself be encapsulated by the substrate and the encapsulation layer. Preferably, one or both release layers include a set of passages, such as small through holes, that are filled with the material of the encapsulation layer and form a set of interconnects between the encapsulation layer and the substrate.

[0011] Other or further aspects relate to methods for recycling electronic devices, for example as described herein. In some embodiments, a fluid, for example a (hot) liquid solvent, is injected through the encapsulation layer into a fluid inlet toward one or more exfoliation layers (between the substrate and the encapsulation layer). In other or further embodiments, edges of the substrate and / or the encapsulation layer are cut or perforated to expose the exfoliation layers, and a fluid is injected between the substrate and the encapsulation layer through the exposed edges. The injected fluid can separate the substrate and the encapsulation layer due to the pressure of the injected fluid, and / or the injected fluid dissolves or decomposes the first and / or second exfoliation layers. Thus, the interconnect between the encapsulation layer and the substrate can be severed. In this way, a set of electronic devices can be detached from at least one, preferably both, of the substrate and the encapsulation layer for recycling one or more of the electronic components. Furthermore, the substrate and the encapsulation layer can be separated from each other for recycling separately. [Brief description of the drawings]

[0012] The features and other features, aspects, and advantages of the apparatus, systems, and methods of the present disclosure will become better understood from the following description, appended claims, and accompanying drawings. [Figure 1A] 1 illustrates the manufacture of electronic devices. [Figure 1B] 1 illustrates the manufacture of electronic devices. [Figure 1C] 1 illustrates the manufacture of electronic devices. [Figure 2A] 1 illustrates the fabrication of non-planar devices. [Figure 2B] 1 illustrates the fabrication of non-planar devices. [Figure 2C] 1 illustrates the fabrication of non-planar devices. [Figure 3A] Shows recyclable devices. [Figure 3B] Indicates device recycling. [Figure 3C] Indicates device recycling. [Figure 4A] Further aspects of each electronic device are shown. [Figure 4B] Further aspects of each electronic device are shown. [Figure 5A] 1 illustrates the fabrication of an electronic device having one release layer. [Figure 5B] 1 illustrates the fabrication of an electronic device having one release layer. [Figure 5C] 1 illustrates the fabrication of an electronic device having one release layer. [Figure 6A] The deposition of the encapsulation layer in two steps is shown. [Figure 6B] The deposition of the encapsulation layer in two steps is shown. [Figure 6C] The deposition of the encapsulation layer in two steps is shown. [Figure 7A] 4 shows the arrangement of further layers. [Figure 7B] 4 shows the arrangement of further layers. [Figure 7C] 4 shows the arrangement of further layers. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The terms used to describe particular embodiments are not intended to limit the invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise. The term "and / or" includes any and all combinations of one or more of the associated listed items. It will be understood that the terms "comprises" and / or "comprising" specify the presence of the stated features but do not exclude the presence or addition of one or more other features. When a particular step of a method is referred to as following another step, it will be further understood that it may follow directly on the other step, unless otherwise specified, or that one or more intermediate steps may be performed prior to performing the particular step. Similarly, when a connection between structures or components is described, it will be understood that this connection may be established directly or through an intermediate structure or component, unless otherwise specified.

[0014] Typically, in conventional Injection Molded Structural Electronics (IMSE) parts, a plastic substrate is covered with graphic inks, conductive inks, and Surface Mounted Devices (SMD) components before being injection molded on the backside. Thus, the electronic components are embedded in the plastic with no opportunity to separate them again at end of life. Aspects of the present disclosure show the use of a sacrificial and recyclable layer (referred to herein as a release layer) onto which electronic circuitry and components can be placed. At end of life, they can be easily peeled away from the larger plastic volume of the product (the front substrate and / or the injection molded backside).

[0015] The present invention will be described in detail below with reference to the accompanying drawings, which illustrate embodiments of the invention. In the drawings, absolute and relative dimensions of systems, components, layers, and regions may be exaggerated for clarity. The embodiments may be described with reference to schematic and / or cross-sectional illustrations of idealized embodiments and intermediate structures of the invention to the greatest extent possible. In the description and drawings, like numbers refer to like components throughout. Relative terms and derivatives thereof should be construed to refer to the orientation shown in the drawings at which they are being described or referenced. These relative terms are for convenience of description and do not require that the system be constructed or operated in a particular orientation, unless specifically specified.

[0016] 1A-1C illustrate the fabrication of a recyclable device 100. In some embodiments, for example as shown in FIGS. 1A and 1B, a stack 10 of devices includes a first substrate 11 disposed on a first side S1 of the stack 10. In other or further embodiments, the stack 10 includes a set of electronic devices 15. Preferably, the stack includes at least one release layer 12, 18 or 18′. In other or further embodiments, for example as shown in FIG. 1C, an encapsulation layer 19 is disposed on a second side S2 of the stack 10 opposite the first side S1. Typically, the set of electronic devices 15 and at least one release layer 12 or 18 are embedded between the disposed encapsulation layer 19 and the first substrate 11. Preferably, at least one release layer 12 or 18 covers at least one side of the set of electronic devices 15 for separating the set of electronic devices 15 from the first substrate 11 and at least one of the set of electronic devices 15 in a later recycling process. Instead of a single release layer 12 or 18, preferably, stack 10 includes at least two release layers 12 and 18 covering both sides of set of electronic devices 15 in order to more easily separate set of electronic devices 15 from both first substrate 11 and set of electronic devices 15 in the recycling process.

[0017] In some embodiments, the first substrate 11 may form a front substrate, and thus the first side S1 may form the front side of the resulting device. For example, the encapsulation layer 19 may form a backing layer of the resulting device. Alternatively, the first substrate 11 may form a back substrate, and / or the backing encapsulation layer 19 may be the front side and the second side S2 of the resulting device. Of course, it will be appreciated that the designation of the front or back side of the device may depend on the use and / or orientation of a set of electronic devices that form part of a user interface, which may include, for example, lights, displays, buttons, user access points, etc. It is also conceivable that both sides of the device may include a user interface, thus forming two front sides. Alternatively, if neither side of the device is intended as a user interface (e.g., forming an internal component or device), the designation of the front side may be optional.

[0018] Typically, the set of electronic devices 15 is formed by an electrical circuit, including, for example, one, two, three or more electronic components 15c (e.g., SMDs) as well as circuit lines. In some embodiments, for example as shown, the set of electronic devices 15 is formed on at least one separate electronics substrate. In one embodiment, at least one separate electronics substrate is embedded between (or covered by) at least one release layer 12, 18. For example, a circuit with one or more electronic components 15c is formed on one or both sides of a (flexible) substrate embedded between release layers 12, 18. In one embodiment, the separate electronics substrate includes an OLED device. Also, other or further electronic components 15c may be arranged on the electronics substrate, for example, sensors such as touch-sensitive displays. This allows at least partially prefabricated substrates with components to be arranged in a stack, while allowing for separation in a later recycling process.

[0019] In one embodiment, the separate electronics substrate is made of the same material as the release layers 12, 18. Thus, effectively, a stack of at least three layers of release material may be formed with a separate electronics substrate in between. This may further facilitate easier peeling and / or disassembly of the intermediate layer and separation of the electronic components. In other or further embodiments, the separate electronics substrate is made of a different material than the release layers 12, 18, such as, for example, PET, PEN, or other (preferably flexible) material.

[0020] In some embodiments, the resulting device may be a flexible device or may include flexible regions. For example, the encapsulation layer may include a relatively thin layer, preferably a flexible hot melt layer and / or other material that remains flexible after solidification. In other or further embodiments, the resulting device may be a rigid device or may include rigid regions. For example, the encapsulation layer may include a relatively thick layer, or may include a thermosetting material, such as, for example, an injection molding material. Also, other or further layers of the stack may be flexible or rigid.

[0021] In some embodiments, some or all of the electronic components (e.g., circuit lines, SMDs, etc.) may be placed directly on the stack, e.g., on the first substrate 11 and / or the first release layer 12, which may cover the first substrate 11. In one embodiment, a set of circuit lines and / or electrical / electronic components 15c are printed on the stack, e.g., on the first substrate 11 and / or the first release layer 12. In another or further embodiment, a set of electronics 15 is electrically connected to the (printed) circuit lines. In another or further embodiment, one or more of the set of electronics 15 can be placed by other techniques, such as Light Induced Forward Transfer (LIFT) or pick-and-place.

[0022] In some embodiments, the first substrate 11 includes a graphics layer 11g. In one embodiment, the opaque graphics layer 11g covers the view of at least some of the electronic components on the first side. In another or further embodiment, a transparent or semi-transparent window 11w in the graphics layer 11g allows light to pass from one or more lighting devices, such as a display or other lighting, in the set of electronics. In one embodiment, the graphics layer 11g is on the second side of the first substrate 11. Thus, the first release layer 12 and / or the set of electronics 15 may be disposed on the graphics layer 11g of the first substrate 11. Alternatively or additionally, the graphics layer 11g may also be disposed on the first side, or the graphics layer 11g may be embedded in the first substrate 11.

[0023] In some embodiments, one or both of the release layers 12, 18 are printed onto the stack, for example using screen printing. Alternatively, one or more of the release layers can be laid down by superposing preformed layers. Other methods can also be used, for example (spray) coating. Preferably, one or both of the release layers 12, 18 comprise passages 12p, 18p, respectively, which allow the material M19 of the encapsulation layer 19 to be connected to the first substrate 11. Preferably, the passages are generated directly by deposition of the release layer, for example by printing or laminating a corresponding pattern. It is also conceivable to selectively remove parts of the release layer, for example when applied by (spray) coating.

[0024] In some embodiments, at least one release layer 12 or 18 has an extended release surface E12, E18 that extends beyond the perimeter P15 of the set of electronics 15. Preferably, the extended release surface E12, E18 also separates the first substrate 11 and the surrounding portion E11, E19 of the encapsulation layer 19, which extends beyond the perimeter P15 without the set of electronics 15 in between. In a preferred embodiment, the extended release surface E12, E18 of at least one release layer 12 or 18 includes a set of passages 12p therethrough. Alternatively, or in addition, the passages can be provided (not shown here) to extend through the set of electronics 15. For example, if a separate electronics substrate is used, the substrate can also include a set of passages that overlap the passages in the front and back release layers 12, 18.

[0025] In some embodiments, at least a portion of the encapsulation layer 19 is disposed in at least a partially liquefied form. In one embodiment, the at least partially liquefied portion 19p of the encapsulation layer 19 penetrates the set of passages 12p to directly connect to the first substrate 11. In another or further embodiment, the encapsulation layer 19 (including the portion 19p in the set of passages 12p) solidifies. Thus, the solidified portion 19p of the encapsulation layer 19 in the set of passages 12p can form a set of connections between the encapsulation layer 19 and the first substrate 11 through at least one of the release layers 12 or 18.

[0026] In a preferred embodiment, the stack 10 includes at least two release layers 12 and 18 covering both sides of the set of electronics 15. In some embodiments, each of the release layers 12, 18 includes a set of overlapping passages 12p, 18p, respectively. In another or further embodiment, the at least partially liquefied portion 19p of the encapsulation layer 19 connects to the first substrate 11 through the set of overlapping passages 12p, 18p. Thus, the solidified portion 19p of the encapsulation layer 19 in the first and second sets of passages 12p, 18p can form a set of connections between the encapsulation layer 19 and the first substrate 11 through each of the extended release surfaces E12, E18. In one embodiment, each of the at least two release layers 12 and 18 has an extended release surface E12, E18 that extends beyond the perimeter P15 of the set of electronics 15. Thus, at least some overlapping passages can be formed through the extended release surfaces E12, E18.

[0027] Instead of the front and second side release layers 12 and 18 having substantially the same area (A12≈A18), these layers can have substantially different areas. For example, this is shown in FIG. 1B, where a relatively small area release layer 18' can be used instead of the relatively large area release layer 18 depicted therein. In some embodiments, the first release layer 12 has a first extended release surface E12 that extends a first distance D12 beyond the perimeter P15 of the set of electronics 15, such as the substrate perimeter of a separate electronic board or the end of the electronic component 15c. In other or further embodiments, the second release layer 18' has a second extended release surface E18' that extends a second distance D18' beyond the perimeter P15. Preferably, the second distance D18' is smaller than the first distance D12. For example, the first distance D12 (margin) of the first release layer 12 around the set of electronics 15 is at least 2, 3, 5, 10, or more times larger than the second distance D18' (margin) of the second release layer 18'. In other words, the first extended release surface E12 can have a larger area than the extended release surfaces E12, E18, e.g., at least 2, 3, 5, 10, or more times larger. This is also shown, for example, in FIG. 4A.

[0028] In some embodiments, for example as shown in Figures 1A and 4A, the first release layer 12 has a first total surface area A12. Also as shown, the second release layer 18' has a second total surface area A18'. Preferably, the first total surface area A12 is larger than the second total surface area A18', for example at least 1.1 times, 1.2 times, 1.5 times, 2 times, 3 times, or more. Most preferably, said (large) first release layer 12 separates the set of electronics 15 from the first substrate 11 at a front side S1 of the set of electronics 15, and the second release layer 18' separates the set of electronics 15 from the encapsulation layer 19 at a second side S2.

[0029] In some embodiments, the first substrate 11 has a third total surface area A11, for example as shown in FIG. 1A or 4A. Preferably, the third total surface area A11 is greater than the first total surface area A12 of the first release layer 12, for example at least 1 percent, at least 2 percent, at least 5 percent, at least 10 percent, or more. For example, the total surface area of ​​the first release layer 12 can include the total surface area enclosed by the perimeter of the release layer, minus the total surface area of ​​each passage. Preferably, the total surface area of ​​the passages through each release layer 12 or 18 is relatively small, for example less than 10 percent, preferably less than 5 percent, or less than 1 percent of the total surface area enclosed by the perimeter of the release layer. For example, as shown in FIG. 4A and 4B, the passages include relatively small posts and / or thin wall segments. In another or further embodiment, the third total surface area A11 is less than 1.2 times (20 percent), preferably less than 1.1 times (10 percent), and more preferably less than 1.05 times (5 percent) greater than the first total surface area A12 of the first release layer 12. In another or further embodiment, the margin or distance D11 by which the edge of the first substrate 11 extends beyond the largest release layer 12 or 18 may be set to allow sufficient encapsulation during use on the one hand and separation during the recycling process on the other hand. For example, the margin D11 is set to a range of 0.5 cm to 10 cm, preferably 1 cm to 5 cm.

[0030] In some embodiments, the set of electronic devices 15 has a fourth total surface area A15, for example as shown in FIG. 1A or 4A. Preferably, each of the first total surface area A12 and the second total surface area A18′ is greater than the fourth total surface area A15, for example at least 1 percent, at least 2 percent, at least 5 percent, at least 10 percent, or more. In one embodiment, the peripheral edge of each of the release layers 12 and 18 or 18′ extends beyond the peripheral edge of the set of electronic devices 15. In another or further embodiment, the margin or distance D18′ by which the edge of the minimum release layer 18 extends beyond the edge of the set of electronic devices 15 can be set within a range that allows sufficient encapsulation of the set of electronic devices on the one hand and prevents unnecessary material waste on the other hand. For example, margin D18' may be set in the range of 0.5 cm to 10 cm, preferably in the range of 1 cm to 5 cm, or up to or including a set of passages 12p in the larger peel layer.

[0031] 1B, the roles of the first and back release substrates 12 and 18' can also be reversed, e.g., a smaller back release substrate 18' can separate the set of electronics 15 on the first side S1 from the first substrate 11, and a larger front release substrate 12 can separate the set of electronics 15 on the second side S2 from the encapsulation layer 19. Thus, the surface areas A12 and A18' and relative sizes, as well as the distances (relative or absolute) D12 and D18' described herein, can also be reversed.

[0032] Other or further layers may be provided instead of or in addition to the layers shown. In some embodiments, one or more (colored) ink layers are provided between the first substrate 11 and the encapsulation layer 19. Aesthetic and / or functional coatings may be provided, such as, for example, reflective (e.g. white) coatings, absorbing (e.g. black) coatings, light guides between the first substrate 11 and the set of electronics 15, etc. In other or further embodiments, the stack includes a logo or other pattern. For example, the stack includes a human and / or machine readable pattern, such as a barcode, a QR code, or other indicia informing or instructing on how the device can be recycled. In one embodiment, such a pattern is created in the first release layer 12, for example, as shown in FIG. 4A.

[0033] In some embodiments, the first substrate 11 comprises or essentially consists of a first substrate material M11. For example, the first substrate material M11 comprises or essentially consists of a polymer and / or plastic material, preferably a thermoplastic material. Suitable materials may include, for example, polymethyl methacrylate (PMMA), thermoplastic polyurethane (TPU), (PVB), polyvinyl butyral (PVB), polycarbonate (PC), (thermoformable) polyethylene terephthalate (PET), polyimide (PI) and / or polyethylene naphthalate (PEN). Recyclable and / or bio-based materials may also be used in the substrates and / or other layers and components described herein, such as polylactic acid (PLA), polyethylene furanoate (PEF), cellulose mono / di / triacetate (CA, CDA, CTA), poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) (PHBH), polyhydroxyalkanoates (PHAs).

[0034] In some embodiments, the set of electronics 15 is formed on a separate electronic board, which includes or essentially consists of a substrate or film of material M15 on which a circuit with one or more electronic components 15c is disposed. Preferably, the electronic board is a flexible board, e.g. capable of being bent with a radius of about one meter without breaking or losing essential functionality. For example, the flexibility may depend on the choice of flexible material and / or the relative thickness of the board. Alternatively or additionally, the electronic board may be (predominantly) formed of the same material as the first board 11 (which is typically rigid, but may be flexible). Also, similar or different materials may be used. The set of electronics 15 typically includes electronic components 15c on one or both sides of the board. For example, the electronic components 15c may include (printed) circuit components such as silver ink, and / or may include surface mounted devices (SMD) and / or thin film components such as OLEDs, displays, lighting, sensors, etc. Some components, e.g. SMDs, may be relatively rigid. Optionally, additional, eg, localized, graphic, buffer and / or adhesive layers may be disposed to cover and / or better adhere the SMDs or other components.

[0035] In some embodiments, the encapsulation layer 19 comprises or consists essentially of the encapsulation layer material M19. In one embodiment, the encapsulation layer 19 is placed by injection molding, for example using the stack as the front part of the mold. In another or further embodiment, the encapsulation layer material M19 comprises or consists essentially of a resin, preferably an injection moldable resin, for example a thermosetting polymer. Other types of polymers and / or plastics can also be used. Other molding techniques can also be used to place the encapsulation layer 19, for example vacuum forming. In some embodiments, the same material is used as the first substrate 11. This can improve the bond between the encapsulation layer 19 and the first substrate 11. Suitable materials may include, for example, polycarbonate (PC) and / or polyethylene naphthalate (PEN). Other or additional materials can also be used, for example acrylonitrile butadiene styrene (ABS), polyethylene (PE), polypropylene (PE), and / or polystyrene (PC). For example, vacuum forming, preferably epoxy resin is used. Bio-based materials can also be used. The encapsulation layer 19 can also be arranged as a hot melt material, such as, for example, a hot melt adhesive or layer and / or substrate. Similar to a molding material, the hot melt material can be (temporarily) liquefied (e.g., by high temperature and / or pressure) and enter the set of passages 12, 18 through one or both of the encapsulation layers. For example, this can strengthen the connection between the encapsulation layer 19 and the first substrate 11 while allowing peeling during a recycling process.

[0036] In some embodiments, at least one (or each) of the release layers 12 and / or 18 comprises or consists essentially of the release layer material M12, M18. The release layer materials M12, M18 may be the same or different materials. Preferably, the release layer material is formed from an ink that is applied, for example, by (screen) printing, coating, and / or (thermal / UV) curing. The set of passages 12p may be formed during deposition of the first substrate material M11, for example during printing, or may be formed later by selectively removing material, or beforehand (for example, when the release layer is deposited as a preformed substrate or film).

[0037] In some embodiments, the set of electronic devices 15 is separable from the first substrate 11 and / or the encapsulation layer 19 by the release layer material M12, M18 being dissolvable and / or decomposable by a solvent, particularly a non-toxic solvent. Preferably, the solubility is 0.1 grams per 100 milliliters of solvent or more, more preferably ≧1 g / 100 mL, ≧10 g / 100 mL, ≧100 g / 100 mL, or unlimited (fully miscible). The higher the solubility, the easier it is to dissolve the release layer material. In one embodiment, the release layer material M12, M18 is soluble in water. For example, the release layer material is based on a water-based polymer. For example, the release layer is configured to form a lacquer between each layer.

[0038] In some embodiments, the solubility of the release layer materials M12, M18 in each solvent, e.g., water, is higher than the solubility of the first substrate material M11 and / or the encapsulation layer material M19 in each solvent, e.g., at least 10 times, 50 times, 100 times, or more. Most preferably, the first substrate material M11 and / or the encapsulation layer material M19 are essentially insoluble in the corresponding solvent, e.g., insoluble in water. The more insoluble the first substrate material M11 and / or the encapsulation layer material M19, the better it maintains its structural integrity during normal use.

[0039] In other or further embodiments, the release layer material M12, M18 has a melting point, liquefaction / softening temperature and / or glass transition temperature that is relatively lower than the first substrate material M11 and / or the encapsulation layer material M19, e.g., they are at least 10, 20, 50 or 100 degrees Celsius relatively lower, and / or in an absolute sense preferably less than 200°C, or even less than 150°C, so that the set of electronics 15 is separable from the first substrate 11 and / or the encapsulation layer 19. For example, the first substrate material M11 can have a relatively high melting point, liquefaction / softening temperature and / or glass transition temperature so that it does not soften during normal use, e.g., it remains solid up to at least 100°C, preferably at least 200°C or 250°C.

[0040] In other or further embodiments, the release layers 12, 18 and / or their materials M12, M18 have relatively weak adhesion per surface to each other and / or to the first substrate 11 and / or the encapsulation layer 19 and / or to the substrate material M15 of the optional electronic substrate, e.g., at least 2, 3, 5, 10 or even more times relatively lower (Newtons per square meter) compared to the relatively strong adhesion between at least the first substrate 11 and the encapsulation layer 19 (without a release layer in between), so that the set of electronics 15 is separable from the first substrate 11 and / or the encapsulation layer 19. Other types of separation are also contemplated.

[0041] In one embodiment, the relatively weak adhesion of any of the aforementioned layers to the release layer is less than 10 Newtons per square centimeter, preferably less than 1 Newton per square centimeter, more preferably less than 0.5 N / cm 2 Less than 0.1N / cm 2 In another or further embodiment, the relatively strong adhesive strength between the layers without the release layer between them is greater than 1 Newton per square centimeter, preferably less than 10 N / cm 2 or more than 100N / cm 2In particular, the relatively strong adhesive forces may exceed the structural integrity of the materials / layers, e.g., the layers may tear when attempting to separate them. As will be appreciated, the size and / or number and / or arrangement of the passages through the at least one release layer may be adapted to adjust the effective adhesive force between the relatively weak adhesive force of the release layer and the relatively strong force where no release layer is present.

[0042] 2A-2C illustrate the fabrication of a non-planar device 100. In some embodiments, at least a portion of the stack 10 is initially planar and is deformed into a non-planar shape 10′. For example, one or more (preferably all) of the first substrate 11, the first release layer 12 (on the first side or bottom), the set of electronics 15, and the second release layer 18′ (on the second side or top) are initially stacked in a planar (flat) configuration. Alternatively, the stack may be directly constructed in a non-planar shape. For example, a pre-formed non-planar first substrate 11 is provided, and subsequent (flexible and / or printed) layers 12, 15, 18 are placed on the non-planar first substrate 11. A combination is also possible, e.g., by (screen) printing or other methods, while a portion of the stack, e.g., including the first substrate 11, the first release layer 12, and the set of electronics 15, is deformed, while the second release layer 18′ (or 18) is placed on the deformed stack.

[0043] In a preferred embodiment, the stack 10 is deformed before depositing the encapsulation layer 19. This may, for example, allow easier access to the second side for connecting electronic components. For similar reasons, the second release layer 18' may also be deposited after the deformation (but before applying the encapsulation layer). For example, the encapsulation layer may be deposited as a resin on a back mold connected to the non-planar stack 10' as shown in FIG. 2C. Alternatively or additionally, other types of encapsulation layers may be envisaged that are deposited before or after deforming the stack 10.

[0044] In some embodiments, the stack 10 is deformed by a thermoforming process. For example, this may include heating the stack to an elevated temperature and / or pressing the stack into a mold as shown in FIG. 2B. Other or additional deformation processes may also be used, for example vacuum forming. Advantageously, the release layer 12 may additionally act as a thermal and / or mechanical buffer layer between the first substrate 11 and the set of electronics 15 during the deformation process. This may help protect electronic components, such as OLEDs, during deformation and / or heating.

[0045] In one embodiment, the thermoforming process involves applying heat to the stack 10 to raise the temperature of at least the first substrate 11 and the buffer layer (exfoliation layer 12) to their respective processing temperatures at which their respective materials become pliable. For example, the first substrate 11 and / or the exfoliation layer 12 comprise a thermoplastic material. In another or further embodiment, the stack 10 is thermoformed while the thermoplastic material is pliable to form a non-planar (curved) device 100.

[0046] Preferably, the (thermoplastic) buffer layer material (e.g., release material) has a lower stiffness than the first substrate material at the respective processing temperature. In other words, the buffer layer material is more flexible or pliable, i.e. more easily deformed, than the first substrate material, at least during the thermoforming process. Such properties can, for example, help to reduce thermal and / or mechanical stresses transmitted to the set of electronics 15, and thus advantageously allow at least some, preferably all, of the electronic components 15c to be included in the stack already during the deformation process. Alternatively or additionally, some or all of the electronic components (especially the more delicate ones) may be placed and / or connected after the deformation process.

[0047] In some embodiments, the buffer layer material has a lower elastic and / or plastic modulus than the first substrate material at the same or similar processing temperature. Alternatively or additionally, the temperature of the buffer layer can be kept lower than the temperature of the first substrate 11 during thermoforming. For example, the buffer layer material has a lower glass transition temperature and / or melting point than the first substrate material, e.g., at least 5 or 10 degrees lower, more preferably more. Thus, when applying heat, energy is first used to cause a substantial phase change of the buffer layer 12 at a relatively low temperature, while the first substrate 11 can reach a higher temperature before a substantial phase change occurs. In some embodiments, the buffer layer material can soften or (partially) melt, while the first substrate material does not soften significantly, or at least does not melt. Thus, during the deformation of the stack, the flow of the buffer layer material can substantially relieve mechanical stress between the first substrate 11 and the electronic component, e.g., an OLED display, while melting or other phase transitions can also account for a substantial portion of the thermal energy.

[0048] FIG. 3A shows a recyclable device 100. In some embodiments, the device 100 includes a first substrate 11 on a first side S1 of the device 100, an encapsulation layer 19 on a second side S2 of the device 100, and a set of electronic devices 15 with a set of electronic devices 15c. In some embodiments, a first release layer 12 is disposed between the set of electronic devices 15 and the first substrate 11. In other or further embodiments, a second release layer is disposed between the set of electronic devices 15 and the encapsulation layer 19. Preferably, the set of electronic devices 15 is encapsulated by the first and second release layers 12, 18. More preferably, the first and second release layers 12, 18 are themselves encapsulated by the first substrate 11 and the encapsulation layer 19. In some embodiments, one or more of the release layers 12, 18 include a set of passages 19p filled with the material of the encapsulation layer 19 to form a set of interconnects between the encapsulation layer 19 and the first substrate 11. In preferred embodiments, the one or more release layers are dissolvable, e.g., dissolvable by water or other (preferably non-toxic) solvents. Most preferably, the first substrate 11 and the encapsulation layer 19 are resistant to dissolution or corrosion during normal use. For example, the first substrate 11 and the encapsulation layer 19 protect the embedded release layer from potential solvents, e.g., water, during normal use.

[0049] In some embodiments, the encapsulation layer 19 includes a fluid inlet 19r formed by an open passageway extending from the exterior of the encapsulation layer 19 to the one or more release layers 12, 18 inside the device between the first substrate 11 and the inner surface of the encapsulation layer 19. In one embodiment, the fluid inlet 19r is sealed during use of the device to prevent exposure of the one or more release layers 12, 18 to the outside environment. For example, the fluid inlet 19r is sealed by a sealing material or object such that the seal can be removed to perform a recycling process.

[0050] 3B and 3C illustrate a recycling method for recycling device 100, for example, manufactured according to the manufacturing methods described herein or other methods.

[0051] In some embodiments, a fluid Sr, e.g., a liquid solvent, is injected through the encapsulation layer 19 into the fluid inlet 19r toward the one or more release layers 12, 18 between the first substrate 11 and the encapsulation layer 19. In other or further embodiments (not shown), the method may include cutting edges of the first substrate 11 and the encapsulation layer 19 and / or drilling holes in the first substrate 11 and / or the encapsulation layer 19 to expose the one or more release layers 12, 18. For example, the fluid Sr can be injected between the first substrate 11 and the encapsulation layer 19 through the exposed edges or holes. In one embodiment, the injected fluid Sr separates the first substrate 11 and the encapsulation layer 19, e.g., due to the pressure of the injected fluid. In another or further embodiment, the injected fluid Sr dissolves or decomposes the one or more release layers 12, 18. Thus, the set of interconnects between the encapsulation layer 19 and the first substrate 11 is cut and the set of electronic devices 15 can be removed from at least one, preferably both, of the first substrate 11 and the encapsulation layer 19 for recycling one or more of the electronic components 15c. Preferably, the fluid is heated to further promote dissolution, melting and / or other decomposition of the release layer. For example, the injected fluid has a temperature of 50° C. or more, or even 100° C. or more. For example, hot water and / or steam can be injected. Other liquids and / or gases can also be injected.

[0052] In another or further embodiment (not shown), the recycling method for recycling the device 100 includes irradiating and / or heating the device. For example, the irradiation and / or heating may cause melting or decomposition of the one or more release layers 12, 18 to facilitate separation of the set of electronics 15 from the first substrate 11 and / or the encapsulation layer 19. For example, the one or more release layers 12, 18 may include at least one of a reversible adhesive, a hot melt material, and / or a low Tg material. For example, the one or more release layers 12, 18 may include a material that decomposes under the influence of microwave, UV, visible light, or IR radiation. Other types of delamination triggers are also contemplated, such as embedding a photoacid generating material and / or a gas generating material in the one or more release layers 12, 18. For example, gas generated in the release layers, e.g., by (UV) light and / or chemical triggers (e.g., reacting with injected liquid Sr), may cause expansion between the first substrate 11 and the encapsulation layer 19, facilitating delamination during the recycling process.

[0053] Although the current illustration shows the set of electronics 15 completely separated from the first substrate 11 and the encapsulation layer 19, it is contemplated that the set of electronics 15 may be separated from only one of the first substrate 11 and the encapsulation layer 19. For example, the release layer 12 or 18 may be provided on only one side of the electronics. However, at least some of the advantages described herein may be achieved by exposing the set of electronics 15 from at least one side. Furthermore, although the current illustration shows the first substrate 11 completely separated from the encapsulation layer 19, this may not be necessary to remove the set of electronics therebetween. For example, some or all of the electronics or other circuitry may flow out of the device, for example, via a fluid inlet 19r and / or a fluid outlet (not shown).

[0054] 4A and 4B show further aspects of each device 100. In some embodiments, a fluid inlet 19r is connected to a channel 19c along the face of the device between the first substrate 11 and the encapsulation layer 19 to direct injected fluid Sr to different portions of one or more of the release layers 12, 18. In one embodiment, the channel branches into different paths. In another or further embodiment (not shown), multiple fluid inlets are provided to access different portions of one or more of the release layers 12, 18.

[0055] In some embodiments, one or more of the release layers 12, 18 are provided with circuit structures 12c. For example, the circuit structures on the release layers can be connected to a set of electronics 15 on a separate substrate, or electronic components 15c can be directly disposed on one or more of the release layers 12, 18. Circuit components can also be provided on other or additional layers as described herein. In one embodiment, circuit lines are printed on one or more layers, such as, optionally, a separate electronics substrate, one or more of the release layers 12, 18, the first substrate 11, and / or the encapsulation layer 19. In addition to or instead of electronic components on the electronic substrate, electronic components can be disposed on other or additional layers. For example, circuit lines are printed or otherwise disposed on each layer, and / or components are disposed after each layer and / or circuit lines are deposited. Electrical vias or through holes can also be provided to interconnect circuit structures on different layers.

[0056] In some embodiments, the logo L and / or computer readable instructions, e.g., a QR code, are embedded in the device 100. Advantageously, the patterns can be generated during printing of one or more of the release layers 12, 18. The patterns can simultaneously function as one or a set of passages, i.e., form respective connections through the release layers.

[0057] In some embodiments, each connection 19p is made not only through one or more release layers 12, 18, but also between a set of electronics 15. For example, the set of electronics 15 and / or a separate electronics substrate are provided with a set of passages that are aligned with the passages in the one or more release layers 12, 18. The connections may pass through the entire stack from the encapsulation layer 19 to the first substrate 11, or may be partial, e.g., interconnecting the encapsulation layer 19 with a portion of an electronic component or substrate and / or interconnecting a portion of an electronic component or substrate with the first substrate 11.

[0058] In some embodiments, the set of connections 19p formed in each passage includes one or more posts, e.g., round structures with a relatively small diameter D19, e.g., 0.01 mm to 5 mm, preferably 0.05 mm to 1 mm. Keeping the posts relatively small can prevent them from being very noticeable through the device. In other or further embodiments, the set of connections 19p formed in each passage includes one or more wall segments, e.g., as shown in FIG. 4B. For example, the wall segments are arranged around the fluid inlet 19r to conduct the fluid. In one embodiment, the thickness of the wall segments is relatively large to allow sufficient pressure buildup and / or expansion of the peeling layer before rupture of each wall segment. For example, the wall segments have a diameter D19′ in the range of 0.1 mm to 10 mm, preferably 0.5 mm to 5 mm. The distance between adjacent connections 19p (posts, walls, or other structures) can vary. This distance can be small to prevent unintentional peeling, or large to facilitate separation during recycling. For example, the (maximum distance) between the connections can be selected in the range of 0.5 cm to 50 cm, preferably in the range of 1 cm to 10 cm.

[0059] 5A-5C show a method of manufacturing a recyclable electronic device 100 having a release layer 18 covering a set of electronic components 15 arranged on a substrate 11. In one embodiment, the set of electronic components 15 is directly provided on the first substrate 11 without a release layer, as shown in FIG. 5A for example. For example, a set of circuit lines is printed or otherwise arranged on the first substrate 11, and the set of electronic components 15 is electrically connected to the circuit lines. Alternatively or additionally, another electronics substrate can be provided. In another or further embodiment, the release layer 18 is provided to cover the set of electronic components 15 on the first substrate 11, as shown in FIG. 5B for example. For example, compared to the previous embodiment, the first release layer 12 may be omitted. Advantageously, the remaining release layer 18 can enable the electronic components 15 on the first substrate 11 to be relatively easily separated from the encapsulation layer 19 during a later recycling process (after the device is no longer in use). Thus, the electronic components 15 can be easily exposed for removal from the first substrate 11. Although the figures show the set of electronics 15 fabricated on a separate substrate that is disposed directly on the first substrate 11, the set of electronics 15 can also be fabricated directly on the first substrate 11 without the need for a separate substrate. For example, the set of electronics 15 can be integrally formed as part of the first substrate 11.

[0060] Instead of omitting the first release layer 12, it is envisaged that the second release layer 18 is omitted and the first release layer 12 is provided between the set of electronics 15 and the first substrate 11, as shown in the present FIGS. 5A-5C. In this case, the release layer 12 may relatively easily separate the electronic components 15 (manufactured on a separate electronics substrate or on the release layer 12) from the first substrate 11. Thus, the electronic components 15 may be exposed, for example, to facilitate removal from the encapsulation layer 19. In either case, it will be appreciated that the features described with reference to the preceding figures (e.g. thermoforming, etc.) may be applied mutatis mutandis with the omission of either one of the release layers 12, 18 to achieve at least some of the advantages of easy separation and / or at least partial exposure of the set of electronics 15, thereby enabling a more efficient recycling process.

[0061] In one embodiment, the release layer 18 covering the set of electronics 15 is provided with a set of passages 18p therethrough, as shown, for example, in FIG. 5B. In another or further embodiment, the encapsulation layer 19 is disposed in at least a partially liquefied form, with a first portion 19p of the at least partially liquefied encapsulation layer 19 penetrating the set of passages 18p for direct connection to the first substrate 11, as shown, for example, in FIG. 5C. In another or further embodiment, the encapsulation layer 19 including the first portion 19p in the set of passages 18p is solidified, and the set of passages 12p, the solidified first portion 19p of the encapsulation layer 19 in 18p, forms a set of connections between the second portion 19q of the encapsulation layer 19 and the first substrate 11 through the release layer 18. Of course, it will be understood that if the first release layer 12 (not shown here) is maintained while the second release layer 18 is omitted, the set of passages will be provided through the first release layer 12 and filled with at least a partially liquefied encapsulation layer. In the current illustration, the encapsulation layer 19 is shown applied using injection molding.

[0062] 6A-6C illustrate how the encapsulation layer 19 can be disposed in multiple steps. In one embodiment, as shown for example in FIG. 6A, a first portion 19p of the encapsulation layer 19 is provided in at least a partially liquefied form and directly connects to the first substrate 11 and / or the set of electronics 15 disposed on the first substrate 11 through a set of passages 18p of at least one release layer 18. In the current illustration, a single release layer 18 is shown, but as mentioned above, a further release layer (12, not shown here) may be provided between the set of electronics 15 and the first substrate 11.

[0063] In some embodiments, the at least partially liquefied first portion 19p is solidified within the set of passages 18p of at least one release layer 18, as shown, for example, in Figure 6B. In other or further embodiments, a second portion 19q of the encapsulation layer 19 is provided in direct contact with the first portion 19p of the encapsulation layer 19 within the set of passages 19p, as shown, for example, in Figure 6C. In one embodiment, the second portion 19q of the encapsulation layer 19 is provided after the first portion 19p has partially or completely solidified within the set of passages 18p.

[0064] In some embodiments, the second portion 19q is provided in at least partially liquefied form and then solidified in contact with the first portion 19p in the passages. In one embodiment, the at least partially liquefied second portion of the encapsulation layer is solidified in contact with the solidified first portion 19p of the encapsulation layer 19 in the set of passages 18p, such that the solidified first portion 19p of the encapsulation layer 19 in the set of passages 18p passes through at least one release layer 18 and forms a set of connections between the second portion of the encapsulation layer 19 and the first substrate 11. Preferably, the first portion 19p of the encapsulation layer 19 comprises or (substantially) consists of the same or similar material M19 as the second portion 19p, so that an integral connection can be formed. Alternatively, different materials can be used.

[0065] By applying the encapsulation layer in separate steps, the deposition methods may be different and the most suitable process may be selected. In one embodiment, the second portion of the encapsulation layer 19 is deposited by an injection molding process. In another or further embodiment, the first portion 19p of the encapsulation layer 19 is applied by another process, such as spray coating, dip coating, and / or spin coating. In some embodiments, one or more of the set of passages 18p and / or 18p' are formed around the respective electronic components 15c. In other or further embodiments, the electronic components 15c are globe topped. In another or further embodiment, the globe topping may form part of the encapsulation layer. It is therefore understood that the globe topping may play the role of or correspond to at least a part of the solidified first portion 19p of the encapsulation layer 19 within the set of passages 12p, 18p. For example, the globe topping may include or consist (substantially) of the same or similar material used to place the second portion 19q of the encapsulation layer 19. Alternatively or additionally, part or all of the globe topping may include or consist (substantially) of the same or similar material as the material (M12, M18) of the release layer 12 and / or 18. For example, this may facilitate subsequent release of the electronic components. Other or additional materials that facilitate release may also be used as described herein, such as water-soluble materials and / or materials that have thermal flowability and / or phase changes (at temperatures prior to decomposition of other materials in the stack). Alternatively, or in addition, one or more electronic components may be provided with a release material and / or layer specific to the electronic component that may facilitate release of a subsequently applied groove topping material, such as the same or a similar material used to position second portion 19q of encapsulation layer 19.Combinations are also possible, for example, a release material can be placed as a glove topping (e.g., at passage 18p') for one or more electronic components 15c, with a backing layer material placed in at least a portion of the passage (e.g., 18p) to ensure a connection through the release layer. In either case, the glove topping can serve to protect electronic components 15c, for example, from a subsequent injection molding and / or thermoforming process. As an alternative to the injection molding process, the second portion of encapsulation layer 19 can also be placed as a hot melt adhesive that encapsulates at least one release layer, for example forming a connection through at least one release layer to the glove topping and / or other material in the set of passages.

[0066] 7A-7C show further possible layer arrangements. In one embodiment, a stack 10 is provided, for example as shown in FIG. 7A. For example, the stack 10 can be the same as or similar to the device 100 obtained by the method described with reference to FIGS. 1A-1C. In some embodiments, a second substrate 11f is disposed on the second side S2 of the stack 10, for example as shown in FIG. 7B. In other or further embodiments, an encapsulation layer 19 is provided between the second substrate 11f and the release layer 18. In one embodiment, for example as shown, the second substrate 11f is disposed after the encapsulation layer 19 is formed, for example as shown in FIG. 1C. In another embodiment (not shown), the encapsulation layer 19 is formed between the second substrate 11f and the rest of the stack. For example, the second substrate 11f may be present or form a boundary between which the encapsulation layer 19 is disposed using an injection molding process.

[0067] In some embodiments, the second substrate 11f includes a graphics layer 11g. The graphics layer 11g may form a window 11w or other pattern depending on the function of the device. For example, the window 11w may allow light from a set of electronics 15 to pass through. In this case, the second side S2 may form the front side of the device. Of course, the orientation may be reversed and the graphics layer may be provided on the first substrate 11 as shown in Figures 1A-1C. The graphics layer may also be provided on both the first and second substrates. For example, the graphics layer on the back side may cover the entire device.

[0068] In some embodiments, a reinforcing layer 19b is placed in the stack. For example, it may serve as a (further) reinforcement of the device. Preferably, the reinforcing layer 19b comprises or (substantially) consists of the same or similar material M19b as the material M19 forming the encapsulation layer 19. Other materials may also be used. Depending on the orientation of the device, the reinforcement 19b may form the backing layer of the device or the front side of the device. In one embodiment, the reinforcing layer 19b is placed by injection molding. In another or further embodiment, the reinforcing layer 19b is placed after and / or during the thermoforming process. For example, the reinforcing layer 19b may be placed in a similar manner to the encapsulation layer 19 shown in Figures 2A-2C. Although the figures show the reinforcing layer 19b being placed after the second substrate 11f, this order may be reversed and the second substrate 11f may be omitted.

[0069] In interpreting the appended claims, it should be understood that the term "comprising" does not exclude the presence of elements or acts other than those recited in a particular claim, the words "a" or "an" preceding an element do not exclude the presence of a plurality of such elements, and any reference signs in a claim do not limit its scope, several "means" may be represented by the same or different items or implemented structures or functions, and any devices or portions thereof disclosed may be combined or further divided into parts, unless specifically stated otherwise.

Claims

1. A method for manufacturing a recyclable electronic device (100), comprising: A stack (10) is provided, the stack (10) comprising: a first substrate (11) disposed on a first side (S1) of the stack (10); a set of electronic devices (15) including a circuit having electronic components (15c); one or more release layers (12, 18) covering at least one side of the set of electronic devices (15); providing the stack (10), disposing an encapsulation layer (19) on a second side (S2) of the stack (10) opposite the first side (S1) to encapsulate the one or more release layers (12, 18) between the disposed encapsulation layer (19) and the first substrate (11); Including, the one or more release layers (12, 18) are configured to separate the electronic component (15c) from the first substrate (11) and / or the encapsulation layer (19); at least one of the one or more release layers (12, 18) includes a set of passages (12p, 18p) passing through the one or more release layers (12, 18); the encapsulation layer (19) is disposed in an at least partially liquefied form, and a first portion (19p) of the at least partially liquefied encapsulation layer (19) passes through a set of vias (12p, 18p) for direct connection to the first substrate (11); the encapsulation layer (19) including the first portions (19p) in the set of vias (12p, 18p) is solidified, and the solidified first portions (19p) of the encapsulation layer (19) in the set of vias (12p, 18p) form a set of connections between the second portions (19q) of the encapsulation layer (19) and the first substrate (11) through at least one release layer (12, 18).

2. The release layer (12, 18) a first release layer (12) disposed between the first substrate (11) and the set of electronic devices (15); a second release layer (18); 2. The method of claim 1, wherein when the encapsulation layer (19) is disposed on the second side (S2) of the stack (10), the release layer (12, 18) is encapsulated between the disposed encapsulation layer (19) and the first substrate (11), and the set of electronic devices (15) is embedded between the release layer (12, 18) to separate the electronic component (15c) from both the first substrate (11) and the encapsulation layer (19).

3. 3. The method of claim 1 or 2, wherein the one or more release layers (12, 18) have relatively weak adhesion per surface area to each other and / or to the first substrate (11) and / or the encapsulation layer (19) compared to the adhesion between the first substrate (11) and the encapsulation layer (19) in the absence of the release layer(s).

4. each of the release layers (12, 18) includes a corresponding set of overlapping passages (12p, 18p); the portion (19p) of the at least partially liquefied encapsulation layer (19) passes through the overlapping set of vias (12p, 18p) to connect to the first substrate (11); 3. The method of claim 1, wherein the solidified portions (19p) of the encapsulation layer (19) in the first and second sets of passages (12p, 18p) form a set of connections between the encapsulation layer (19) and the first substrate (11) through each of the extended release surfaces (E12, E18).

5. 3. The method of claim 1 or 2, wherein at least a first release layer (12) of the one or more release layers (12, 18) is printed on the stack (10), a set of circuit lines is printed on the first release layer (12), and the set of electronic devices (15) are electrically connected to the circuit lines.

6. 3. The method of claim 1 or 2, wherein the set of electronics (15) is formed on a separate electronic substrate embedded between the release layers (12, 18).

7. 3. The method of claim 1 or 2, wherein the first substrate (11) forms the front surface of the electronic device (100) and includes a graphics layer (11g) covering the front view of at least some of the electronic components, leaving a window (11w) for one or more lighting devices in the set of electronic devices.

8. 3. The method of claim 1, wherein the one or more release layers include a first release layer (12) disposed between the set of electronic devices (15) and the first substrate (11) and a second release layer (18) disposed between the set of electronic devices (15) and the encapsulation layer (19), wherein a surface (A12) of the first release layer (12) is larger than a surface (A18') of the second release layer (18'), the larger periphery of the first release layer (12) surrounds the smaller periphery of the second release layer (18'), and the periphery of each release layer (12, 18, 18') surrounds the periphery of the set of electronic devices (15).

9. 3. The method according to claim 1 or 2, wherein the surface (A11) of the first substrate (11) is larger than the surface (A12, A12, A18') of each of the one or more release layers (12, 18, 18'), and the peripheries of both the first substrate (11) and the encapsulation layer (19) surround the corresponding periphery of each of the one or more release layers (12, 18, 18').

10. 3. The method of claim 1 or 2, wherein at least a portion of the stack (10) is initially planar and is transformed into a non-planar shape (10') by a thermoforming process.

11. 3. The method of claim 1 or 2, wherein the stack (10) is deformed after placing at least a portion of the set of electronic devices (15) on the stack (10) and before placing the encapsulation layer (19).

12. The one or more release layers (12, 18) comprise a release layer material, and compared to either or both of a first substrate material (M11) of the first substrate (11) and an encapsulation layer material (M19) of the encapsulation layer (19), the release layer material (M12, M18) is: Relatively high solubility in non-toxic solvents, a relatively low melting point, a relatively low liquidus or softening temperature, or a relatively low glass transition temperature; and 3. The method of claim 1, wherein the adhesive layer has at least one of: a relatively weak adhesive strength per surface area to adjacent layers;

13. A recyclable electronic device (100) manufactured by the method of claim 1, comprising: a first substrate (11); an encapsulation layer (19); a set of electronic devices (15) including a circuit having electronic components (15c) disposed between the first substrate (11) and the encapsulation layer (19); one or more release layers (12, 18) covering at least one, preferably both sides, of the set of electronic devices (15) for separating the set of electronic devices (15) from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19); Including, The set of electronic devices (15) covered with the one or more release layers (12, 18) is encapsulated between the encapsulation layer (19) and the first substrate (11); a recyclable electronic device (100), wherein at least one of the one or more release layers (12, 18) includes a set of passages (12p, 18p) filled with material of the encapsulation layer (19), the set of passages (12p, 18p) passing through the one or more release layers (12, 18) forming a set of interconnects (19p) between the encapsulation layer (19) and the first substrate (11).

14. 14. The recyclable electronic device (100) of claim 13, wherein the one or more release layers are water soluble.

15. 15. The recyclable electronic device (100) of claim 13 or 14, wherein the encapsulation layer (19) includes a fluid inlet (19r) formed by an open passage extending from the exterior of the encapsulation layer (19) to the one or more release layers (12, 18) inside the device between the first substrate (11) and the inner surface of the encapsulation layer (19).

16. The one or more release layers (12, 18) comprise a release layer material, and compared to either or both of a first substrate material (M11) of the first substrate (11) and an encapsulation layer material (M19) of the encapsulation layer (19), the release layer material (M12, M18) is: Relatively high solubility in non-toxic solvents, a relatively low melting point, a relatively low liquidus or softening temperature, or a relatively low glass transition temperature; and 15. The recyclable electronic device (100) of claim 13 or 14, having at least one of: a relatively weak adhesion per surface area to adjacent layers;

17. A method for recycling an electronic device (100), comprising: Providing a recyclable electronic device (100) according to claim 15; injecting a fluid (Sr) into the fluid inlet (19r) through the encapsulation layer (19) toward the one or more release layers (12, 18) between the first substrate (11) and the encapsulation layer (19); Including, the injected fluid (Sr) separates the first substrate (11) and the encapsulation layer (19) due to the pressure of the injected fluid, and / or the injected fluid (Sr) dissolves or decomposes the one or more release layers (12, 18); the set of interconnections between the encapsulation layer (19) and the first substrate (11) are cut, the set of electronic devices (15) is exposed to the injected fluid (Sr), and the set of electronic devices (15) is detached from at least one, preferably both, of the first substrate (11) and the encapsulation layer (19) for recycling one or more of the electronic components (15c).

18. The one or more release layers (12, 18) comprise a release layer material, and compared to either or both of a first substrate material (M11) of the first substrate (11) and an encapsulation layer material (M19) of the encapsulation layer (19), the release layer material (M12, M18) is: Relatively high solubility in non-toxic solvents, a relatively low melting point, a relatively low liquidus or softening temperature, or a relatively low glass transition temperature; and 18. The method of claim 17, wherein the adhesive layer has at least one of: a relatively weak adhesion per surface area to adjacent layers;

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