Recyclable electronic devices, as well as methods and apparatus for manufacturing and recycling such devices.

Abstract

The present invention provides an electronic device comprising a laminate having a circuit layer (15) covered with at least one release layer (12). A graphic layer (13) having a pattern of one or more light-reflecting regions (13f) and one or more light-absorbing regions (13s) is provided on a first surface (S1). One or more light-reflecting regions (13f) are arranged to cover circuit components (15c) of the circuit layer (15). One or more light-absorbing regions (13s) are arranged in areas where there are no circuit components (15c) and at least one release layer (12), and are configured to be peeled off under the influence of light transmitted through the first substrate (11) and absorbed by one or more light-absorbing regions (13s), while one or more light-reflecting regions (13f) are configured to reflect light.

Description

Technical Field

[0001] The present disclosure relates to electronic devices and methods for manufacturing and recycling such devices.

[0002] Recycling of electronic devices (e.g., automobiles) is an issue for the printed electronics (PE) industry. Although PE technology is predicted to be much more environmentally friendly than alternatives for printed circuit boards (PCBs), due to high integration, it is very difficult to disassemble electronic devices from their original products, disrupting the current recycling cycle. For example, current recycling of electronic devices is carried out at the PCB level because the packages surrounding the PCB can be easily removed. In the future, electronic devices will become part of finished products (e.g., structural electronic devices and 3D printed electronics). Currently, PCB substrates are being ground up instead of being properly recycled and reused. Thus, thin-film-based alternatives in PE are already a major advancement.

[0003] WO2022 / 220688 describes a manufacturing method for producing more easily recyclable electronic devices by applying one or more release layers to one or both sides of an electronic device. By providing selected passages through the release layer, a limited group of connections can be established to prevent the substrate from unintentionally peeling during normal use, while simultaneously becoming weak enough to be disassembled during a later recycling process.

[0004] For electronic devices and their manufacturing and recycling methods, further improvements are still desired, such as further improving reliability and durability while maintaining the advantages of recyclability.

Summary of the Invention

[0005] Aspects of the present disclosure relate to an electronic device comprising a laminate (10) including a first substrate provided on a first surface of the laminate, a second substrate provided on a second surface of the laminate opposite to the first surface, and a circuit layer containing circuit components disposed between the first substrate and the second substrate, wherein the second substrate is formed to encapsulate the circuit layer between the second substrate and the first substrate. The laminate includes at least one release layer configured to cover the surface of the circuit layer facing the second substrate and to separate the circuit components from the second substrate, the at least one release layer forming an adhesive connection between the circuit layer and the second substrate with a first adhesive strength. The laminate includes a graphic layer disposed between the circuit layer and the first substrate, the graphic layer including a pattern of one or more light-reflecting regions and one or more light-absorbing regions. One or more light-reflecting regions are arranged to cover circuit components on the first surface, and one or more light-absorbing regions are arranged in regions without circuit components and without at least one release layer, forming an adhesive connection between the first substrate and the second substrate with a second adhesive strength higher than the first adhesive strength of at least one release layer. One or more light-absorbing regions are configured to delaminate under the influence of light transmitted through the first substrate and absorbed by one or more light-absorbing regions, while one or more light-reflecting regions are configured to reflect light.

[0006] The reliability and durability of the electronic device are improved by a graphic layer that forms an adhesive connection between the first substrate and the second substrate with a second adhesive strength higher than the first adhesive strength of at least one release layer.

[0007] Simultaneously, the recyclability of the device is maintained by providing a pattern of one or more light-absorbing and light-reflecting regions in the graphic layer. The connection between the first and second substrates can be broken by having one or more light-absorbing regions that are configured to peel off under the influence of light that has passed through the first substrate and been absorbed by one or more light-absorbing regions, and that function as a photoactivated peeling layer, while the circuit components of the circuit layer are protected from photon energy and / or generated heat by one or more light-reflecting regions of the graphic layer.

[0008] Furthermore, a graphic layer containing patterns of one or more light-reflecting and light-absorbing regions can be used to separate the process of separating the first substrate from the second substrate, and the process of separating the circuit layer from the first substrate. In this way, it is possible to prevent the circuit components from peeling off the first substrate by photon debonding, allowing the process of separating the circuit components from the first substrate to be performed later in the recycling process.

[0009] Therefore, light passes through the first substrate, is absorbed in one or more light-absorbing regions, and is reflected in one or more light-reflecting regions, which may be, for example, one or more of visible light, ultraviolet (UV), and infrared (IR). For example, in the visible light spectrum, the light may be in a wavelength range of 200 to 1100 nanometers, corresponding to a frequency of 750 to 420 terahertz, preferably in a wavelength range of 400 to 700 nanometers, corresponding to a frequency of 430 to 750 terahertz. For example, in the UV spectrum, the light may be in a wavelength range of 10 to 400 nanometers, corresponding to a frequency of 750 to 30 picohertz. For example, in the IR spectrum, the light may be in a wavelength range of 700 nanometers to 1 mm, corresponding to a frequency of 300 gigahertz to 430 terahertz.

[0010] In some embodiments, one or more light-absorbing regions absorb more light in the wavelength range than the light-reflecting regions, for example, 2, 3, 5, 10, or more. In other or further embodiments, one or more light-reflecting regions reflect more light in the wavelength range than one or more light-absorbing regions, for example, 2, 3, 5, 10, or more. Preferably, one or more light-absorbing regions are configured to absorb at least 50% of the light in the wavelength range incident on them without being reflected or refracted. More preferably, one or more light-absorbing regions are configured to absorb at least 90%, most preferably at least 99%, of the incident light in the wavelength range.

[0011] Conversely, it is preferable that one or more light reflection regions are configured to reflect at least 50% of the light in the wavelength range incident on them without being absorbed or refracted. More preferably, one or more light reflection regions are configured to reflect at least 90%, most preferably at least 99%, of the incident light in the wavelength range.

[0012] In some embodiments, the second substrate includes an injection-molded encapsulation layer. This can improve the bonding between the circuit layer and the second substrate. Suitable materials may include, for example, polycarbonate (PC), polyamide (PA), polyetheretherketone (PEEK), high-density polyethylene (HDPE), and / or polyethylene terephthalate (PET). Other or further materials such as acrylonitrile butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), and / or polystyrene (PS) may also be used. Vacuum forming, preferably epoxy resin, is used, for example. Recycled or bio-based materials may also be used.

[0013] Alternatively or additionally, the second substrate may include a printed encapsulation layer. For example, in some embodiments, the device comprises a flexible circuit layer, and the printed encapsulation layer is printed on a first and / or second surface of the flexible circuit layer. In other or further embodiments, the device further comprises a protective layer disposed between the second substrate and at least one release layer, the protective layer being disposed to protect the circuit layer during deformation or heating. Advantageously, the protective layer can function as a thermal and / or mechanical buffer layer between the second substrate and the circuit layer during the deformation process. This can be useful, for example, to protect circuit components such as OLEDs during deformation and / or heating.

[0014] In some embodiments, the second substrate includes a fluid inlet formed by an open passage extending from the outside of the second substrate to at least one delamination layer inside the device. The injected fluid can dissolve or decompose at least one delamination layer. Thus, the circuit layer may be removed from at least one, preferably both, of the first and second substrates for recycling one or more of its circuit components without, for example, applying mechanical delamination forces to separate the layer from the components. In this way, the risk of damaging the circuit components during the recycling process can be reduced. Furthermore, the substrates and / or encapsulation layers may be separated from each other for separate recycling without, for example, applying mechanical delamination forces.

[0015] In some embodiments, the electronic device further comprises a reversible adhesive in the light-absorbing region, preferably between the first substrate and the light-absorbing region. Beneficially, the reversible adhesive can be used to reattach a second substrate to the first substrate after any repairs. The reversible adhesive may be heat-sensitive, such as a Diels-Alder reversible adhesive whose adhesive properties are time-dependent. For example, debonding may occur within a time range of less than one second from the application of instantaneous heating via a high-power photon flash, while conventional rebonding by heating may be possible within a time range of more than one minute. Such a Diels-Alder reversible adhesive may have a substantially transparent composition and therefore may not be adversely affected by short flashes from the photon debonding process. Furthermore, such an adhesive may substantially retain its shape under photon flash, thus enabling rebonding by conventional heating. Other reversible adhesives that allow for the reattachment of a second substrate to the first substrate may also be conceivable instead of a Diels-Alder reversible adhesive. Reversible adhesives may be embedded within the design, for example, inside one or more recesses or grooves in a first or second substrate, to avoid the need to apply adhesive to the 3D-shaped structure. By embedding the reversible adhesive within the design, the optimal amount is added, and any excess is removed or extracted from adjacent areas, for example, and replenished, thus avoiding the application of excessive adhesive material.

[0016] In some embodiments, the circuit layer is separable from the second substrate and / or encapsulation layer by a release layer material that is soluble and / or decomposable by a solvent, preferably a non-toxic solvent. Preferably, the solubility is greater than 0.1 grams per 00 ml of solvent, more preferably 1 g / 100 mL or more, 10 g / 100 mL or more, 100 g / 100 mL or more, or not limited thereto. The higher the solubility, the easier the release layer material can dissolve. The process of dissolving the release layer may include, for example, a step of reducing the first adhesion strength of the release layer to the circuit layer by applying heat.

[0017] Furthermore, if the release layer contains a relatively weak adhesive, or if the release layer is absent from most of the surface, the relatively weak adhesive bond between the circuit layer and the first and / or second substrate will be lost more easily, even without performing a process to dissolve the release layer.

[0018] Preferably, at least one release layer is soluble in a low-impact solvent such as a biodegradable and / or non-toxic solvent, such as water or alcohol. Thus, the interconnection between the circuit layer and the second and / or first substrate can be broken by the solvent, while minimizing the ecological footprint during the recycling process. The circuit layer may be removed from at least one, preferably both, of the substrates for recycling one or more of its circuit components. Furthermore, the substrates and encapsulation layers may be separated from each other for separate recycling.

[0019] In some embodiments, the solubility of the release layer material in each solvent with little influence, such as alcohol or water, is higher than the solubility of the first or second substrate material and / or encapsulation material in each solvent, for example, by at least 10, 50, 100, or more. Most preferably, the first or second substrate material and / or encapsulation material is substantially poorly soluble in each solvent, for example, poorly soluble in alcohol or water. The higher the solubility of the first or second substrate material and / or encapsulation material, the better the structural integrity can be maintained during normal use.

[0020] In other or further embodiments, the circuit layer is separable from the second substrate and / or encapsulation layer by a release layer material having a relatively lower melting point, liquefaction / softening temperature, and / or glass transition temperature compared to the second substrate material and / or encapsulation material, for example, at least 10°C, 20°C, 50°C, or 100°C lower, and / or preferably less than 200°C in absolute terms, and more preferably less than 150°C. For example, the second substrate material may have a relatively higher melting point, liquefaction / softening temperature, and / or glass transition temperature so as not to soften during normal use, for example, remaining solid up to at least 100°C, preferably at least 200°C or 250°C.

[0021] In other or further embodiments, the circuit layer is separable from the first and / or second substrates due to the relatively weak adhesive strength per unit area of ​​the release layer and / or their materials toward each other and / or toward the first substrate and / or the second substrate and / or the substrate material of any electronic substrate, where the relatively weak adhesive strength is, for example, at least 2, 3, 5, 10, or more lower than the relatively strong adhesive strength between the first and second substrates. Other types of separation may also be conceivable. The first adhesive strength of the release layer may be weaker than the adhesive strength required for the entire area adhesive, since the majority of the structural strength of the device is determined by the second adhesive strength between the first and second substrates.

[0022] In some embodiments, one or more light-absorbing regions are black and one or more light-reflecting regions are white, thereby providing alignment markers for aligning a first substrate with respect to a circuit layer and / or a second substrate. For example, the alignment markers of one or more black and white regions thus provided may form a barcode, which is a machine-readable optical label in which one or more black and white regions are arranged in a two-dimensional matrix pattern, or a quick-response (QR) code, or information about other parts of the first substrate or device. Such information may include identifiers, locators, or trackers, such as part numbers, serial numbers, or lot numbers, mounting aids or references, or references to processes, recycling, or assembly procedures. Alternatively, the alignment markers of one or more black and white regions may form another type of optical label, such as a line pattern or one or more reference markers, to present the information in a computer-readable format. In some embodiments, the electronic device further comprises a graphic layer on a second surface. The further graphic layer may form windows or other patterns, depending on the functionality of the device. For example, a window may allow light to pass through from the circuit layer. In this case, the second surface may form the front of the device. Of course, the orientation may be reversed, and an additional graphics layer may be provided on the first substrate. Additional graphics layers may also be provided on both the first and second substrates. For example, an additional graphics layer on the back may cover the entire device.

[0023] In some embodiments, the electronic device further comprises a circuit layer containing further circuit components on a second surface and at least one release layer covering the surface of the further circuit layer facing the first substrate, and a further graphic layer disposed on the second surface between the further circuit layer and the second substrate. The further graphic layer may include a pattern of one or more light-reflecting regions and one or more light-absorbing regions. One or more light-reflecting regions may be disposed to cover further circuit components on the second surface, and one or more light-absorbing regions may be disposed in areas without further circuit components and at least one release layer, forming an adhesive connection between the first substrate and the second substrate with a second adhesive strength higher than the first adhesive strength of the at least one release layer. One or more light-absorbing regions may be configured to peel off under the influence of light transmitted through the second substrate and absorbed by one or more light-absorbing regions, while one or more light-reflecting regions may be configured to reflect light. Thus, by applying a further graphic layer including a pattern of one or more light-absorbing and light-reflecting regions, a recyclable electronic device having multiple layers of circuit components is provided.

[0024] In yet another or further embodiment, the second substrate includes a hot-melt encapsulant or other printable encapsulant. Thus, the resulting device may be a flexible device and / or may include flexible regions. For example, the encapsulation layer may include a relatively thin layer, preferably a flexible hot-melt layer and / or a printed layer and / or other material that remains flexible after solidification.

[0025] Other aspects of the present disclosure relate to a method for manufacturing an electronic device. The method includes providing a laminate including a first substrate disposed on a first surface of the laminate, a circuit layer including circuit components, and a second substrate applied to a second surface of the laminate opposite the first surface, the second substrate being formed to enclose the circuit layer between the applied second substrate and the first substrate. The method further includes applying a release layer between the circuit layer and the second substrate, the release layer being configured to separate the circuit components from the second substrate and including a material having a first adhesion strength, and applying a graphic layer between the circuit layer and the first substrate, the graphic layer including a pattern of one or more light reflection regions and one or more light absorption regions. The one or more light absorption regions are disposed in a region without circuit components and without at least one release layer that forms an adhesive connection between the first substrate and the second substrate with a second adhesion strength higher than the first adhesion strength of at least one release layer. The one or more light absorption regions are configured to peel under the influence of light transmitted through the first substrate and absorbed by the one or more light absorption regions, while the one or more light reflection regions are configured to reflect light.

[0026] Thus, a recyclable electronic device with improved reliability and durability while maintaining recyclability, such as the electronic device described herein, can be manufactured.

[0027] Other aspects of the present disclosure relate to a method for recycling an electronic device. The method includes providing the electronic device described herein and irradiating light on a first surface of the laminate, thereby peeling one or more light absorption regions under the influence of light transmitted through the first substrate and absorbed by the one or more light absorption regions, while the one or more light reflection regions are configured to reflect light.

[0028] In some embodiments, after the step of irradiating light, the method includes a step of mechanically separating the first substrate and the second substrate using the remaining release layer, for example, preferably exposing the circuit layer. For example, a peeling force can be applied substantially in the normal direction to the first surface and / or the second surface of the device. Alternatively or additionally, a shearing force can be applied to provide a relative displacement between the first substrate and the second substrate in the plane of the circuit layer. In this way, the first substrate, the second substrate, and the circuit layer can be mechanically separated from each other.

[0029] In other or further embodiments, after the step of irradiating light, the method includes a step of injecting a fluid through the second substrate into a fluid inlet up to the release layer between the second substrate and the circuit layer, and the injected fluid pushes the second substrate and the circuit layer apart by its pressure and / or dissolves or decomposes the release layer. Preferably, the fluid is heated to further facilitate the dissolution, melting, and / or other decomposition of the release layer. For example, the temperature of the injected fluid exceeds 50 °C, or even exceeds 100 °C. For example, hot water and / or steam can be injected. Also, other liquids and / or gases can be injected.

[0030] In still other or further embodiments, the method further includes a step of irradiating and / or heating the electronic device with radiation. For example, one or more release layers are melted or decomposed by radiation and / or heat, facilitating the separation of the circuit layer from the first and second substrates and / or the encapsulation layer. For example, one or more release layers may include materials that decompose under the influence of microwaves, ultraviolet light, visible light, or (infrared) IR radiation. It is also possible to envision embedding other types of release triggers, such as photoacids and / or gas-generating materials, in one or more release layers. For example, gases generated within the release layer by light and / or chemical triggers.

[0031] Another aspect of the present disclosure relates to an apparatus for recycling an electronic device described herein. The apparatus comprises a photon debonding tool having a light source positioned to irradiate a first surface of an electronic device with light, thereby debonding one or more light-absorbing regions under the influence of light that has passed through the first substrate and been absorbed by one or more light-absorbing regions, while one or more light-reflecting regions are configured to reflect light.

[0032] In some embodiments, the apparatus further comprises a stripping tool positioned to penetrate a second substrate and inject fluid into a fluid inlet to a stripping layer between the second substrate and the circuit layer, wherein the injected fluid, by its pressure, pushes the second substrate and the circuit layer apart and / or dissolves or decomposes at least one stripping layer. [Brief explanation of the drawing]

[0033] These features, aspects, and advantages of the apparatus, systems, and methods of the present disclosure, as well as other features, aspects, and advantages, will be better understood from the following description, the appended claims, and the appended drawings.

[0034] [Figure 1A-1B] An embodiment of an electronic device is shown. [Figure 2A-2B] This specification shows another or further embodiment of the electronic device described herein. [Figure 3A-3B] This specification shows yet another or further embodiment of the electronic device described herein. [Figure 4] Embodiments of an apparatus for recycling electronic devices described herein are shown. [Modes for carrying out the invention]

[0035] The terms used to describe specific embodiments are not intended to limit the invention. The singular forms “a,” “an,” and “the” as used herein also include the plural forms unless explicitly stated otherwise in the context. The terms “and / or” include any and all combinations of one or more items listed together. The terms “comprises” and / or “comprising” identify the presence of a described feature, but are not intended to exclude the presence or addition of one or more other features. Furthermore, where a particular step of a method is mentioned as following another step, unless otherwise specified, the step may follow another step directly, or one or more intermediate steps may be performed before the step is executed. Similarly, where connections between structures or components are described, unless otherwise specified, the connections may be established directly or through intermediate structures or components.

[0036] The present invention will be described in more detail below with reference to the accompanying drawings illustrating embodiments of the invention. In the drawings, absolute and relative sizes of systems, components, layers, and areas may be exaggerated for clarity. Embodiments may be described with reference to schematic and / or cross-sectional views of idealized embodiments and intermediate structures of the invention as far as possible. In the specification and drawings, the same number indicates the same element. Relative terms and their derivatives should be interpreted as referring to the direction being described or shown in the drawings at that point. These relative terms are for illustrative purposes only and do not require the system to be constructed or operated in a particular direction unless otherwise specified.

[0037] Figures 1A and 1B show embodiments of the electronic device 100 in a laminated and delaminated state, respectively. The electronic device 100 comprises a laminate 10 of a first substrate 11 provided on a first surface S1 of the laminate 10. In some embodiments, the first substrate 11 is transparent, allowing light transmission through the first substrate 11, for example. For example, the first substrate 11 is configured to transmit at least 50%, preferably at least 80%, more preferably at least 90%, for example, up to 99%, or more of light. This light may be one or more of visible light, ultraviolet (UV), and infrared (IR). For example, in the visible light spectrum, the light may have a wavelength range of 200 to 1100 nanometers, preferably 300 to 1000 nanometers, and more preferably 350 to 900 nanometers. In some embodiments, the first substrate 11 may form a front substrate, and the first surface S1 may form the front of the later-obtained device.

[0038] The second substrate 21 is provided on the second surface S2 of the laminate 10 opposite to the first surface S1. In other or further embodiments, the second substrate 21 is transparent, for example, allowing light to pass through the second substrate 21. In some embodiments, the second substrate 21 may form a backing layer of the resulting device. Alternatively, the first substrate 11 may form a back substrate, and / or the second substrate 21 may be the front surface on the second surface S2 of the resulting device. Of course, it will be understood that the designation of the front or back of the device may depend on the intended use and / or orientation of the circuit layer 15, for example, if it forms part of a user interface that may include lighting, displays, buttons, user access points, etc. It can also be considered that the designation of the front may be arbitrary, since both sides of the device may form two front surfaces by having a user interface, or neither side of the device may be intended as a user interface, for example, by forming internal components or devices.

[0039] The circuit layer 15 is located between the first substrate 11 and the second substrate 21 and includes circuit components 15c such as surface mount devices (SMDs) and / or circuit lines connecting the devices. As shown in Figure 1A, the second substrate 21 is formed to enclose the circuit layer 15 between the second substrate 21 and the first substrate 11. Typically, the circuit layer 15 is formed by electrical circuits including circuit lines having one, two, three, or more circuit components 15c, such as SMDs. Preferably, one or more circuit components 15c, such as SMDs, are covered with a glob top (not shown). In some embodiments, the laminate 10 includes at least one release layer 12 covering the surface of the circuit layer 15 facing the second substrate 21. In one embodiment, the glob top is applied after the release layer 12 is applied, for example, between the circuit components 15c and the release layer 12. This prevents damage to the circuit components when peeling off the layer. In some embodiments, the circuit layer 15 is formed, for example, on a lower layer, such as a graphic layer 13 (which may be on a first substrate 11) as shown in Figure 1, and / or on another release layer 18 in between, as shown in Figures 2 and 3, by deposition, printing, etc. In other or further embodiments (not shown), the circuit layer 15 may be formed on a separate electronic substrate, which may be embedded between the first and second substrates 11, 21, each with an additional layer interposed between them. For example, separate electronic devices may be manufactured separately and applied on top of the layers below them.

[0040] Typically, the release layers 12 and / or 18 may include a material having a first adhesive strength configured to separate the circuit components 15c from the second substrate 21. In one embodiment, the circuit layer 15 is covered with at least one release layer 12 or embedded between release layers (e.g., layers 12, 18). For example, a circuit layer 15 having one or more electronic components 15c is formed on one or both sides of a flexible substrate embedded between the release layers 12. In one embodiment, the circuit layer 15 includes an OLED device. Other or further circuit components 15c may be placed on an electronic substrate such as a sensor, e.g., a touch-sensitive display. This allows at least partially pre-fabricated substrates with components to be applied to the laminate while enabling separation in subsequent recycling processes.

[0041] Debonding is the process of separating a material or object, which in this case is a laminate 10, into layers. This is also called debonding. As can be understood, applying at least one debonding layer 12 to the surface of the second circuit layer 15 facing the substrate 21 may allow for relatively easy separation of the circuit components 15c from the second substrate 21 and / or the first substrate 11 during the subsequent recycling process after the device has been used. Thus, the electronic components and / or circuit components 15c may be more easily separated from the second substrate 21 without being adhered to it. This may improve the recyclability of the device.

[0042] In one embodiment, a separate electronic substrate is formed of the same material as at least one release layer 12. Thus, a laminate of at least two layers of release material including a separate electronic substrate can be effectively formed. This can further facilitate the peeling and / or disassembly of the intermediate layer and the disconnection of the electronic device. In another or further embodiment, the separate electronic substrate is formed of a different material from at least one release layer 12, for example, PET, PEN, or any other preferred flexible material.

[0043] In some embodiments, the resulting device may be a flexible device and / or may include flexible regions. For example, the second substrate may include an encapsulation layer 19 having a relatively thin layer, preferably a flexible hot-melt layer and / or other material that remains flexible after solidification. In other or further embodiments, the resulting device may be a rigid device and / or may include rigid regions. For example, the encapsulation layer 19 may include a relatively thick layer and / or a thermosetting material, such as an injection-molded material. Other or further layers in the laminate may be flexible or rigid.

[0044] In some embodiments, for example, some or all of the electronic components, such as circuit lines and SMDs, are applied directly onto a laminate, such as on a first substrate 11 and / or on at least one release layer 12 that can cover the first substrate 11. In one embodiment, a set of circuit lines and / or electronic components 15c are printed onto a laminate 10, such as the first substrate 11 and / or release layer 12. In another or further embodiment, a circuit layer 15 is electrically connected to the printed circuit lines. In another or further embodiment, the circuit layer 15 may be applied by other techniques such as photo-induced forward transfer (LIFT) or pick-and-place.

[0045] In some embodiments, at least one release layer 12 is printed onto the laminate, for example, using screen printing. Alternatively, at least one release layer 12 can be applied by laminating pre-formed layers. Other methods such as spray coating, dispensing, plasma printing, plasma treatment, or chemical vapor deposition can also be used.

[0046] In some embodiments, to facilitate separation, one or more additional release layers 18 may be provided as part of the laminate 10, covering the surface of the circuit layer 15 facing the first substrate 11. In this arrangement, one or more release layers 12, 18 can keep the electronic components separated from other layers of the laminate 10, such as the first and second substrates 11, 21 on the side opposite to the circuit layer 15.

[0047] In one embodiment, the first adhesive strength of one or more release layers 12, 18 is less than 10 Newtons per square centimeter, preferably less than 1 Newton per square centimeter, more preferably 0.5 N / cm². 2 Less than 0.1 N / cm², most preferably 0.1 N / cm² 2 It is less than 20 N / cm. Alternatively, for example, in a peel test, the first adhesive strength of one or more peel layers 12, 18 is less than 20 N / cm, for example, between 10 and 20 N / cm or between 5 and 15 N / cm, more preferably between 3 and 10 N / cm.

[0048] As shown in the figure, a graphic layer 13 is disposed between the circuit layer 15 and the first substrate 11. The graphic layer 13 includes a pattern of one or more light-reflecting regions 13f and one or more light-absorbing regions 13s. One or more light-reflecting regions 13f are arranged to cover the circuit components 15c on the first surface S1. One or more light-absorbing regions 13s are located between the first substrate 11 and the second substrate 21 in an area (from below or above in a plan view) where there are no circuit components 15c and at least one release layer 12, forming an adhesive connection with a second adhesive strength higher than the first adhesive strength of at least one release layer 12. One or more light-absorbing regions 13s are configured to peel off under the influence of light that has passed through the first substrate 11 and been absorbed by the one or more light-absorbing regions 13s (functioning as a photoactivated release layer), while one or more light-reflecting regions 13f are configured to reflect light. Generally, the graphic layer includes a material that does not have electrical function. Thus, since the functionality of the graphics layer is independent of the circuit layer, patterns of one or more light-reflecting regions and one or more light-absorbing regions can be applied without affecting the electrical connections between circuit components in the circuit layer. However, in some further or alternative embodiments, additional light-reflecting and / or light-absorbing materials or elements may be incorporated into the graphics layer.

[0049] In another or further embodiment, the second adhesive strength is 1 Newton per square centimeter or more, preferably 10 N / cm². 2 Above or above, or 100 N / cm 2That is all. Alternatively, in peel tests, such as 90-degree or 180-degree peel tests, the second adhesive strength is preferably 20 N / cm or more, 30 N / cm or more, or even 40 N / cm or more. In particular, the second adhesive strength may exceed the structural integrity of the material / layer, for example, the layer may break when attempting to separate it. As understood, the adhesive area and thickness of one or more release layers 12, 18 and graphic layer 13 may be adapted to adjust the effective ratio between the relatively weaker adhesive strength values ​​of one or more release layers 12, 18 and the relatively stronger strength in the second connection where no release layer is present.

[0050] In some embodiments, the pattern of one or more light-absorbing regions 13s is complementary to the pattern of one or more light-reflecting regions 13f. For example, the graphic layer 13 may have an entire area, and the pattern of one or more light-absorbing regions 13s may be arranged relative to the pattern of one or more light-reflecting regions 13f so as to cover the entire area of ​​the graphic layer 13. For example, the one or more light-absorbing regions 13s and the one or more light-reflecting regions 13f may be arranged in an alternating pattern, a checkerboard pattern, or an island-and-channel pattern. However, a portion of the entire area of ​​the graphic layer may not include a light-absorbing region 13s or a light-reflecting region 13f, for example, if there are no connections established between that portion and the first and second substrates 11, 21 and no circuit components 15c to be covered.

[0051] For example, the graphic layer 13 may be irradiated with broadband light emitted from a photon debonding tool, which includes a light source positioned to irradiate the graphic layer 13 through the first substrate 11 and / or the second substrate 21 in order to debond the first substrate 11 from the second substrate 21. The photon debonding tool may, for example, irradiate the graphic layer 13 with broadband light in the range of 200 nm to 1100 nm at a rate of, for example, 45 kW / cm². 2 They may be arranged to emit with a peak radiation intensity reaching a certain value, for example, in one or more pulses of less than 1 millisecond.

[0052] In one embodiment, the first substrate 11 is formed of a transparent material that allows light transmission. In another or further embodiment, the second substrate 21 is formed of a transparent material that allows light transmission. For example, the transparent material is configured to transmit at least 50%, preferably at least 80%, more preferably at least 90%, for example, up to 99%, or more light. When irradiated through the first or second substrates 11, 21, one or more light-absorbing regions absorb most of the light, converting it into energy and / or heat necessary, for example, to separate the first substrate 11 from the second substrate 21.

[0053] Preferably, the graphic layer 13 comprises a material composition having both light absorption properties and adhesive properties, wherein the adhesive strength decreases when absorbed light from this material composition is converted into energy, such as heat.

[0054] In another or further embodiment, the graphic layer 13 includes, for example, dissimilar material compositions scattered within adjacently laminated intermediate layers, where at least one of the material compositions has light-absorbing properties and the other material compositions have adhesive properties. In this way, when the light-absorbing material composition converts the absorbed light into heat, the adhesive properties of the adhesive material composition decrease.

[0055] Figures 2A and 2B show another or further embodiment of the electronic device 100 in a laminated and delaminated state, respectively, in which the second substrate 21 includes an injection-molded encapsulation layer 19. The encapsulation layer 19 may be applied by injection molding, for example, using the laminate 10 as the front of the mold. In another or further embodiment, the encapsulation material includes or consists essentially of a resin, preferably an injection-molded resin, such as a thermoplastic polymer. Other types of polymers and / or plastics may also be used. Other molding techniques, such as vacuum forming, may also be used to apply the encapsulation material 19. In some embodiments, the same material as the second substrate 21 is used. This may improve the bonding between the encapsulation layer 19 and the second substrate 21. Suitable materials may include, for example, polycarbonate (PC), polyamide (PA), polyetheretherketone (PEEK), high-density polyethylene (HDPE), and / or polyethylene terephthalate (PET). Other or further materials such as acrylonitrile butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), and / or polystyrene (PS) can also be used. For example, vacuum forming, preferably epoxy or polyurethane (PU) resin, is used. Bio-based materials can also be used.

[0056] Alternatively or additionally, the encapsulation layer 19 may be applied as a hot-melt material or printing material, such as a hot-melt adhesive or layer and / or substrate. Similar to molding materials, the hot-melt material may be temporarily liquefied, for example, by heating and / or pressurizing, in order to encapsulate the circuit layer 15 between the first and second substrates 11, 21. For example, this may strengthen the connection between the encapsulation layer 19 and the second substrate 21 while allowing peeling during the recycling process.

[0057] As shown in Figures 2A and 2B, the second substrate 21 includes a fluid inlet 19r formed by an open passage extending from the outside of the second substrate 21 to, for example, one or more delamination layers 12, 18 inside the device between the inner surface of the second substrate 21 and the encapsulation layer 19. In one embodiment, the fluid inlet 19r is sealed to prevent exposure of the delamination layers 12, 18 to the external environment during use of the device. For example, the fluid inlet 19r is sealed with a sealant or object, and the seal is removable to carry out a recycling process.

[0058] In some embodiments, the fluid inlet 19r is connected to a channel along the surface of the device between the second substrate 21 and the encapsulation layer 19 in order to guide the injected fluid Sr toward different portions of one or more delamination layers 12, 18. In one embodiment, the channel branches into different paths. In another or further embodiment not shown, multiple fluid inlets are provided to access different portions of one or more delamination layers 12, 18.

[0059] In some embodiments, a fluid, such as a thermal solvent, is injected through a fluid inlet 19r into one or more release layers 12, 18 between, for example, the substrate and the encapsulation layer. The injected fluid can dissolve or decompose one or more release layers 12, 18. Thus, the circuit layer 15 may be removed from at least one, preferably both, of the first and second substrates 11, 21 for recycling one or more of its circuit components 15c. Furthermore, the substrates 11, 21 and the encapsulation layer 19 may be separated from each other for separate recycling.

[0060] Figures 3A and 3B show yet another or further embodiment of the electronic device 100 in the laminated and delaminated states, respectively. The protective layer 22 is positioned between the second substrate 21 and at least one delaminated layer 12. Thus, the circuit layer 15 is protected by the protective layer 22 during deformation or heating. Advantageously, the protective layer 22 can function as a thermal and / or mechanical buffer layer between the second substrate 21 and the circuit layer 15 during the deformation process. This can, for example, help protect circuit components 15c such as OLEDs during deformation and / or heating.

[0061] As shown in the figure, a reversible adhesive 23, such as a Diels-Alder type adhesive, is provided in the light-absorbing region 13s, preferably between the first substrate 11 and the light-absorbing region 13s. Alternatively or additionally, the reversible adhesive 23 may be provided between the light-absorbing region 13s and the second substrate 21 or the encapsulation layer 19.

[0062] Figures 3A and 3B also show further graphic layers 14 of the second substrate 21. In one embodiment, the opaque further graphic layer 14 covers at least the second surface S2 of some electronic equipment. In another or further embodiment, transparent or translucent windows 14w in the further graphic layer 14 may allow light to pass through one or more lighting devices, e.g., displays or other lighting, in the circuit layer 15. In one embodiment, the further graphic layer 14 is on the first surface S1 of the second substrate 21. Thus, the release layer 12 and / or circuit layer 15 may be applied on the further graphic layer 14 of the second substrate 21. Alternatively or additionally, the further graphic layer 14 may also be applied to the second surface S2 or embedded in the second substrate 21.

[0063] Figure 4 shows an embodiment of the apparatus 500 for recycling the electronic device 100 described herein. The apparatus 500 includes a photon debonding tool 510 having a light source positioned to irradiate a first surface S1 of the electronic device 100 with light Pf, thereby debonding one or more light-absorbing regions 13s under the influence of light that has passed through the first substrate 11 and been absorbed by one or more light-absorbing regions 13s, while one or more light-reflecting regions 13f are configured to reflect light.

[0064] The apparatus 500 may further include a peeling tool 520 positioned to penetrate the second substrate 21 and inject fluid Sr into a fluid inlet 19r to a peeling layer 12 between the second substrate 21 and the circuit layer 15, the injected fluid Sr, by its pressure, pushes the second substrate 21 and the circuit layer 15 apart and / or dissolves or decomposes at least one peeling layer 12.

[0065] Advantageously, as described in this disclosure, after the delamination of the first and second substrates 11 and 21, the graphic layer 13 allows for relatively easy separation of the electronic components 15c from the first substrate 11 and the second substrate 21 and / or the encapsulation layer 19 during subsequent recycling processes after the device has been used. Thus, the circuit components 15c can be easily exposed for removal from the first substrate 11. Although the drawings show the circuit layer 15 being manufactured on a separate substrate provided on the first substrate 11, the circuit layer 15 can also be manufactured directly on the graphic layer 13 without requiring a separate substrate.

[0066] Therefore, the circuit components 15c may be exposed, for example, to facilitate removal from the second substrate 21 or the encapsulation layer 19. In either case, the features described above with reference to the drawings, such as light-absorbing regions and light-reflecting regions, may be applied with appropriate modifications while omitting one or more of the release layers 12, 18, and it will be understood that a more efficient recycling process will be possible by achieving at least several advantages, such as easy separation and / or at least partial exposure of the circuit layer 15.

[0067] Although this drawing shows the first substrate 11 completely separated from the second substrate 21, it is not necessarily required to remove the circuit layer 15 from between them. For example, some or all of the circuit components 15c and other electronic components may be discharged from the device, for example, from a fluid inlet 19r and / or a fluid outlet (not shown).

[0068] For clarity and conciseness, features are described herein as identical or separate embodiments; however, it will be understood that the scope of the invention may include embodiments combining all or some of the described features. For example, embodiments have shown electronic devices and apparatus for recycling electronic devices; however, those skilled in the art who benefit from this disclosure may also envision alternative means to achieve similar functions and results. For example, Figures 1 to 3 can be combined or divided into one or more alternative components. The various elements of the embodiments described above and illustrated offer certain advantages, such as improved reliability and durability while maintaining recyclability. Of course, it will be understood that any one embodiment or process described above may be combined with one or more other embodiments or processes, which may result in further improvements in design and the discovery and matching of advantages. While this disclosure offers particular advantages for the recycling of electronic devices, it will be understood that it can be applied in general to any application where the durability and reliability of the device are important.

[0069] In interpreting the attached claims, the term “comprising” does not exclude the existence of other elements or actions other than those enumerated in the claims; the term “a” or “an” preceding an element does not exclude the possibility of multiple elements; reference numerals in the claims do not limit their scope; multiple “means” may be represented by the same or different items, or by implemented structures or functions; and unless otherwise specified, any or part of the disclosed apparatus may be combined with each other or further divided into parts. Where one claim references another, this may suggest that a synergistic advantage is achieved by combining the respective constituent elements. However, the mere fact that particular means are described in different claims does not mean that combinations of these means cannot be used advantageously. Thus, these embodiments may include any practical combination of claims in which, unless explicitly excluded by context, each claim may, in principle, reference a preceding claim.

Claims

1. An electronic device (100) comprising a laminate (10), A first substrate (11) is provided on the first surface (S1) of the laminate (10), A second substrate (21) is provided on the second surface (S2) of the laminate (10) opposite to the first surface (S1), A circuit layer (15) including circuit components (15c) disposed between the first substrate (11) and the second substrate (21), wherein the second substrate (21) is formed to enclose the circuit layer (15) between the second substrate (21) and the first substrate (11), At least one release layer (12) configured to cover the surface of the circuit layer (15) facing the second substrate (21) and to separate the circuit component (15c) from the second substrate (21), wherein at least one release layer (12) forms an adhesive connection between the circuit layer (15) and the second substrate (21) with a first adhesive strength, A graphic layer (13) disposed between the circuit layer (15) and the first substrate (11), the graphic layer (13) includes a pattern of one or more light-reflecting regions (13f) and one or more light-absorbing regions (13s), The one or more light-reflecting regions (13f) are arranged to cover the circuit component (15c) on the first surface (S1), The one or more light-absorbing regions (13s) are located in a region between the first substrate (11) and the second substrate (21) where there are no circuit components (15c) and no at least one release layer (12), forming an adhesive connection with a second adhesive strength higher than the first adhesive strength of the at least one release layer (12). The electronic device (100) is configured such that the one or more light-absorbing regions (13s) are peeled off under the influence of light that has passed through the first substrate (11) and been absorbed by the one or more light-absorbing regions (13s), while the one or more light-reflecting regions (13f) are configured to reflect the light.

2. The electronic device (100) according to claim 1, wherein the second substrate (21) includes an injection-molded encapsulation layer (19).

3. The present invention further comprises a protective layer (22) disposed between the second substrate (21) and the at least one release layer (12), The electronic device (100) according to any one of claims 1 to 2, wherein the protective layer (22) is arranged to protect the circuit layer (15) during deformation or heating.

4. The electronic device (100) according to any one of claims 1 to 3, wherein the second substrate (21) comprises a fluid inlet (19r) formed by an open passage extending from the outside of the second substrate (21) to the at least one delamination layer (12) inside the device.

5. The electronic device (100) according to any one of claims 1 to 4, wherein the light-absorbing region (13s) is further preferably provided with a reversible adhesive (23) between the first substrate (11) and the light-absorbing region (13s).

6. The electronic device (100) according to any one of claims 1 to 5, wherein one or more light-absorbing regions (13s) are black, and one or more light-reflecting regions (13f) are white, thereby providing an alignment marker for aligning the first substrate (11) with respect to the circuit layer (15) and / or the second substrate (21).

7. The electronic device (100) according to any one of claims 1 to 6, further comprising a graphics layer (14) on the second surface (S2).

8. The electronic device (100) according to any one of claims 1 to 7, wherein the second substrate (21) includes a hot melt encapsulant (19) and / or a printed encapsulant.

9. A method for manufacturing electronic devices, The present invention provides a laminate (10) comprising: a first substrate (11) disposed on a first surface (S1) of the laminate (10); a circuit layer (15) including circuit components (15c); and a second substrate (21) applied to a second surface (S2) of the laminate (10) opposite to the first surface (S1), wherein the second substrate (21) is formed to enclose the circuit layer (15) between the applied second substrate (21) and the first substrate (11). The method involves applying a release layer (12) between the circuit layer (15) and the second substrate (21), wherein the release layer (12) is configured to separate the circuit component (15c) from the second substrate (21) and includes a material having a first adhesive strength. The method involves applying a graphic layer (13) between the circuit layer (15) and the first substrate (11), wherein the graphic layer (13) includes a pattern of one or more light-reflecting regions (13f) and one or more light-absorbing regions (13s), The one or more light-absorbing regions (13s) are located in a region where there are no circuit components (15c) and no at least one release layer (12), forming an adhesive connection between the first substrate (11) and the second substrate (21) with a second adhesive strength higher than the first adhesive strength of the at least one release layer (12). A method wherein the one or more light-absorbing regions (13s) are configured to be peeled off under the influence of light that has passed through the first substrate (11) and been absorbed by the one or more light-absorbing regions (13s), while the one or more light-reflecting regions (13f) are configured to reflect the light.

10. A method for recycling electronic devices, To provide an electronic device (100) according to any one of claims 1 to 9, The method includes irradiating the first surface (S1) of the laminate (10) with light, thereby peeling off the one or more light-absorbing regions (13s) under the influence of light that has passed through the first substrate (11) and been absorbed by the one or more light-absorbing regions (13s), On the other hand, the method is configured such that one or more light-reflecting regions (13f) reflect the light.

11. The process includes, after the step of irradiating with light, injecting fluid (Sr) through the second substrate (21) to the fluid inlet (19r) between the second substrate (21) and the circuit layer (15) up to the peeling layer (12), The method according to claim 10, wherein the injected fluid (Sr) pushes the second substrate (21) and the circuit layer (15) apart by its pressure, and / or dissolves or decomposes the release layer (12).

12. The method according to claim 10 or 11, further comprising the step of irradiating and / or heating the electronic device (100).

13. An apparatus (500) for recycling an electronic device (100) according to any one of claims 1 to 9, The photon debonding tool (510) includes a light source positioned to irradiate the first surface (S1) of the electronic device (100) with light (Pf), As a result, the one or more light-absorbing regions (13s) are peeled off under the influence of the light that has passed through the first substrate (11) and been absorbed by the one or more light-absorbing regions (13s), while the one or more light-reflecting regions (13f) are configured to reflect the light, in the apparatus (500).

14. The present invention further comprises a peeling tool (520) positioned to penetrate the second substrate (21) and inject fluid (Sr) into a fluid inlet (19r) between the second substrate (21) and the peeling layer (12) between the second substrate (21) and the circuit layer (15), The apparatus (500) according to claim 13, wherein the injected fluid (Sr) pushes apart the second substrate (21) and the circuit layer (15) by its pressure, and / or dissolves or decomposes the at least one release layer (12).

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