Method of producing resin molded product, mold, and resin molded product

Abstract

To prevent molding defects during insert molding, in which a distorted resin film is inserted into a mold.SOLUTION: A method of producing a resin molded product includes: a holding step in which at least a part of end sides 10a, 10b of a resin film 10 is sandwiched between a hold block 150 and a first mold 100 and brought into close contact with the first mold 100; a mold clamping step in which the first mold 100 and a second mold 200 are clamped together to fix the hold block 150 between the first mold 100 and the second mold 200, thereby forming a cavity C1 that accommodates a portion of the resin film 10; and a molding step in which resin is injected into the cavity C1 to form a resin molded product 1 with the resin film 10 inserted therein. A wall surface of the cavity C1 includes a cavity forming region 155 which is a part of the hold block 150, and the cavity forming region 155 is configured to contact a side surface 1a of the resin molded product 1 which rises from a vicinity of the end sides 10a, 10b of the resin film 10.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present invention relates to a method for producing a resin molded product, a mold used in the production method, and a resin molded product. [Background technology]

[0002] As a method for integrating a metal wire with a resin molded product, for example, there is a manufacturing method in which a film having wiring is inserted and injection molded, as described in Patent Document 1 (JP Patent Publication No. 2022-144960). In the manufacturing method described in Patent Document 1, a resin molded product injection molded in a cavity of a mold is held in a movable mold after injection molding, but the film to be inserted is held in a fixed mold. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-144960 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the case of a resin film on which metal wires such as copper wires are wired, the resin film may be distorted depending on the shape of the metal wires because the metal wires have a high rigidity. When insert molding is performed using such a distorted resin film, the deformation of the resin film in the cavity of the mold cannot be eliminated by correction using either or both of suction and positioning pins, and molding defects may occur. Furthermore, if a method is used in which an undercut is provided in the fixed mold so that the film can be hooked onto the fixed mold in order to hold the film to the fixed mold, the resin molded product may end up being held to the fixed mold when the mold is opened.

[0005] An object of the present invention is to suppress molding defects in insert molding in which a distorted resin film is inserted into a mold. [Means for solving the problem]

[0006] In the following, several aspects will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary. A method for manufacturing a resin molded product according to one aspect of the present invention includes a setting step, a holding step, a mold clamping step, a molding step, and a mold opening / removal step. In the setting step, a resin film is fitted into a first mold. In the holding step, at least a part of an edge of the resin film is sandwiched between a hold block and the first mold and adhered to the first mold. In the mold clamping step, the first mold and the second mold are clamped to fix the hold block with the first mold and the second mold, forming a cavity that accommodates a part of the resin film. In the molding step, resin is injected into the cavity to mold a resin molded product with the resin film inserted. In the mold opening / removal step, the first mold and the second mold are opened to remove the resin molded product with the resin film inserted. The wall surface of the cavity includes a cavity forming region that is a part of the hold block, and the cavity forming region is configured to contact a side surface of the resin molded product that rises from the vicinity of the edge of the resin film. In the manufacturing method of the resin molded product configured as described above, the cavity forming region contacts the side surface of the resin molded product rising from the vicinity of the edge of the resin film. And since the vicinity of the resin molded product is pressed against the first die by the hold block, even if the resin film is distorted, the hold block can sufficiently correct the distorted resin film before inserting it, and molding defects in the insert molding can be suppressed.

[0007] The above-mentioned method for producing a resin molded product can be configured to further include a preforming step in which the resin film on which the metal wires are wired is three-dimensionally formed before the setting step, in which the resin film on which the metal wires are wired is wired. The method for producing a resin molded product configured in this manner can sufficiently correct the resin film, which becomes distorted due to the metal wires, with the hold block, and can suppress molding defects in insert molding. The above-mentioned manufacturing method for resin molded products can be configured such that the hold block is attached to the first mold so as to be rotatable around the rotation axis, and in the holding step, the hold block rotates around the rotation axis by being pushed by a cylinder, so that the hold block pinches at least a part of the edge of the resin film between the hold block and the first mold and adheres it to the first mold, and in the mold opening and removal step, when the first mold and the second mold are opened, the hold block is not pressed by the cylinder and is in a state in which the hold block can rotate around the rotation axis. In the manufacturing method for resin molded products configured in this way, the rotation of the hold block makes it easier for the hold block to pinch the edge of the resin film between the hold block and the first mold and adhere it to the first mold or release it, making it easier to improve the manufacturing speed. The above-mentioned manufacturing method for resin molded products can be configured so that, in the mold opening / removal process, when the first and second molds are opened, the convex part of the hold block gets caught on the resin molded product, and the resin molded product pushes the hold block. In the manufacturing method for resin molded products configured in this way, since the resin molded product pushes the hold block in the mold opening / removal process, it becomes easier to open the hold block, which makes it easier to improve the manufacturing speed.

[0008] A mold according to one aspect of the present invention includes a first mold, a second mold, and a hold block. The first mold and the second mold are for forming a cavity for molding a resin molded product by clamping the mold. The hold block is attached to the first mold and is movable when the mold is open so as to switch between an open state in which at least a part of an edge of a resin film to be inserted into the resin molded product is not pressed against the first mold, and a closed state in which at least a part of the edge is pressed against the first mold. When the first mold and the second mold are clamped, the hold block constitutes a part of the wall surface of the cavity and includes a cavity forming region rising from the vicinity of the edge. A mold constructed in this manner is suitable for a method of manufacturing a resin molded product in which a distorted resin film is inserted into the mold after being corrected by a hold block, thereby suppressing molding defects in insert molding.

[0009] The above-mentioned mold can be configured so that the hold block is attached to the first mold so that it can rotate around a rotation axis, the first mold has a cylinder that pushes the hold block to rotate it around the rotation axis, and so that in the closed state, a gap of a size corresponding to the thickness of the resin film is formed between the hold block and the first mold. In the above-mentioned mold, the hold block can be configured so that when the first and second dies are opened, the convex portion of the hold block catches on the resin molded product, causing the resin molded product to push the hold block. A mold configured in this way makes it easier to open the hold block, and is suitable for a method of manufacturing a resin molded product that can easily improve the manufacturing speed. The above-mentioned mold can be configured such that the first die has a spring or plunger that constantly applies pressure to the hold block to release the closed state of the hold block when the mold is open. A mold configured in this way makes it easier to open the hold block, and is suitable for a method of manufacturing a resin molded product that can easily improve the manufacturing speed.

[0010] A resin molded product according to one aspect of the present invention includes a resin molded body, a resin film integrated with the resin molded body by insert molding, and a metal wire wired in a meandering manner on the resin film. The resin film has a protruding portion whose end edge protrudes from the resin molded body. The resin molded product thus configured can eliminate the step of cutting off the protruding portion, and can suppress an increase in the cost of the resin molded product. Effect of the Invention

[0011] The manufacturing method of the resin molded product according to the present invention can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold. The mold according to the present invention is suitable for a manufacturing method of the resin molded product that can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold. The resin molded product according to the present invention is manufactured by a manufacturing method that can suppress molding defects in insert molding in which a distorted resin film is inserted into a mold, and can suppress manufacturing costs. [Brief description of the drawings]

[0012] [Figure 1] 4 is a flowchart showing an example of a manufacturing process of a resin molded product according to the embodiment. [Diagram 2] FIG. 2 is a front view showing an example of a resin film with heating wires to be inserted into a resin molded product. [Diagram 3] 3 is a top view showing a state in which a portion corresponding to a protruding portion is removed from the resin film in FIG. 2. [Figure 4] 4 is a right side view showing the resin film in the state shown in FIG. 3. [Diagram 5] FIG. 2 is a perspective view showing an example of a first mold according to the embodiment. [Figure 6] FIG. 6 is a perspective view showing a portion of the first mold shown in FIG. 5. [Figure 7] FIG. 7 is a plan view of the portion of FIG. 6 of the first mold. [Figure 8] FIG. 7 is a side view of the portion of FIG. 6 of the first mold. [Figure 9] FIG. 7 is a front view of the portion of FIG. 6 of the first mold. [Figure 10] FIG. 7 is a perspective view showing a part of a first mold as viewed from the opposite side to FIG. 6. [Figure 11] FIG. 11 is a plan view showing a part of a first mold for explaining a suction hole. [Figure 12] 4 is a cross-sectional view showing a part of a first mold around a holding block in a state before a resin film is held. FIG. [Figure 13] FIG. 2 is a plan view showing a first mold in a state in which a resin film is held. [Figure 14] FIG. 4 is a perspective view showing an example of a second mold according to the embodiment. [Figure 15] 4 is a cross-sectional view showing a part of the first and second molds around the hold block when the molds are clamped. FIG. [Figure 16] 4 is a cross-sectional view showing a part of the first mold and the second mold around the hold block during injection. FIG. [Figure 17] FIG. 4 is a cross-sectional view showing a part of the first mold and the second mold during injection. [Figure 18] FIG. 11 is a cross-sectional view showing a part of the first and second molds around the hold block during mold opening and removal. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] (1) Manufacturing method for resin molded products FIG. 1 shows an outline of the flow of a method for producing a resin molded product according to one embodiment of the present invention. In step S1 shown in FIG. 1, a resin film 10 with electric heating wires (see FIG. 2) is prepared. Here, a case where the resin film 10 with electric heating wires is used as the resin film to be inserted will be described. The resin film 10 with electric heating wires is an example of a resin film on which metal wires are wired. The material of the resin film 10 is, for example, a thermoplastic resin. Examples of the thermoplastic resin include polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin. The thickness of the resin film 10 is, for example, 10 μm to 500 μm. For example, metal or metal alloy is used for the heating wire 20 (see FIG. 2), which is an example of a metal wire. For example, copper, iron, nickel, aluminum, or alloys thereof are used for the heating wire. The thickness of the heating wire 20 is set within a range of, for example, 0.01 mm to 1.0 mm, and the width of the heating wire 20 is set within a range of, for example, 0.1 mm to 5.0 mm. Since the heating wire 20 causes unevenness on the surface of the resin molded product 1 (see FIG. 18), it is preferable to set the thickness and width of the heating wire 20 within a range in which the unevenness caused by the heating wire 20 on the surface of the resin molded product 1 is difficult to visually recognize. However, the resin film to be inserted is not limited to the resin film 10 with heating wire. The resin film may be, for example, a resin film to which members other than the heating wire 20 are attached, or a film made of only resin. The resin molded article 1 with the heating wire 20 inserted therein is used, for example, to generate heat for anti-fogging, for melting snow, for protection from the cold, or for temperature regulation in agriculture. The heating wire 20 is fixed to the resin film 10 by, for example, fusion, adhesion, or adhesion. Therefore, even if the resin film 10 is moved, the position of the heating wire 20 on the resin film 10 does not change. The heating wire 20 is arranged in a serpentine manner as shown in Fig. 2. The area of ​​the region in which the heating wire 20 is wired is 60% or more of the area of ​​the largest main surface 11 of the resin film 10. In the resin molded product 1, the heating wire 20 is arranged between the resin film 10 and the resin molded body 50 (see Fig. 18).

[0014] The resin film 10 is preformed (step S2) to give the shape (see Figs. 2, 3, and 4) of the resin molded product 1 (see Fig. 18). Step S2 is a preforming process. The resin film 10 before preforming has a flat sheet-like shape. As shown in Figs. 2, 3, and 4, after preforming, a first rising portion 12 with an L-shaped cross section rising in a direction substantially perpendicular to the main surface 11 on which the heating wire 20 is mainly arranged, and a second rising portion 13 facing the first rising portion 12 are formed. After preforming, the main surface 11 is formed into a curved surface. Note that Fig. 2 shows a protruding portion 19 held by a holding block 150 (see Fig. 11) described later, but Figs. 3 and 4 omit the protruding portion 19. The opening 16 shown in FIG. 2 is for exposing the heating wire 20 to the outside of the resin film 10 when the resin molded product 1 (see FIG. 18) is formed, and for electrically connecting the heating wire 20. In the preforming (step S2), the resin film 10 is softened by heating and fixed in shape by cooling. Therefore, the resin film 10 takes a shape that conforms to the preforming mold. However, the heating wire 20 is deformed into a shape that conforms to the preforming mold during the preforming, but the preforming causes deformation due to plastic deformation and deformation due to elastic deformation. Therefore, when the resin film 10 with the heating wire 20 is removed from the preforming mold, the elastic deformation of the heating wire 20 tries to return to its original shape, so that the shape of the resin film 10 is distorted relative to the shape of the preforming mold and the shape of the first mold 100 due to the rigidity of the heating wire 20. In this way, when a metal wire such as the heating wire 20 is fixed to the resin film 10, the distortion of the resin film 10 after preforming tends to be large.

[0015] Next, the resin film 10 with the heating wire 20 after preforming is fitted into the first die 100 (see FIG. 5) (step S3). This step S3 is a setting process for fitting the resin film 10 into the first die 100. As shown in FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG. 10, the first die 100 is provided with a plurality of positioning pins 110 for regulating the position of the resin film 10. The resin film 10 is provided with a plurality of holes 15 into which the positioning pins 110 are inserted. When the resin film 10 is fitted into the first die 100, the movement of the resin film 10 is regulated by the positioning pins 110. The fitted resin film 10 is sucked through a plurality of suction holes 120 (see FIG. 11) provided in the first die 100. Note that an intake system for the suction holes 120 and an intake and exhaust system for the cylinder 170 (see FIG. 12) are provided separately. The plurality of suction holes 120 are arranged around one circumference at the end of the bushing 130. Even if the resin film 10 is set in this manner using the multiple positioning pins 110 and multiple suction holes 120, a part of the resin film 10 fitted into the first mold 100 may rise up due to distortion of the resin film 10 with the heating wire 20 attached. Note that the attachment portion 140 shown in Fig. 11 is a recess for attaching the hold block 150. In step S3 in which the resin film 10 is fitted into the first mold 100, the hold block 150 is in an open state, as shown in Fig. 12. Since the hold block 150 is in an open state, the resin film 10 can be easily set so as to contact the first mold 100.

[0016] At least a part of the end edges 10a, 10b (see FIG. 2) of the resin film 10 with the heating wire 20 fitted in the positioning pin 110 is sandwiched between the hold block 150 (see FIG. 5) and the first mold 100 and brought into close contact with the first mold 100 (step S4). Step S4 is a holding step for holding the resin film 10 in the first mold 100. When the hold block 150 moves from the open state to the closed state, the hold block 150 is pushed by the cylinder 170 and rotates around the rotation shaft 158 ​​as shown by the arrow in FIG. 12. In FIGS. 12, 15, 16, and 18, the arrows indicate the movement of each part of the mold. This cylinder 170 is a device that operates by air pressure. When the hold block 150 is in the closed state, the plunger 160 is pressed into the first mold 100. A spring may be used instead of the plunger 160, and in that case, the spring is also pressed into the first mold 100. The plunger 160 or spring opens the hold block 150. In this embodiment, the protruding portion 19 indicated by the two-dot chain line is the portion where the end sides 10a, 10b of the resin film 10 protrude from the resin molded body 50. The protruding portion 19 is cut out from this resin molded product 1 to form the resin molded product as the final product (goods). However, the resin molded product 1 having the protruding portion 19 may also be used as the product. The hold block 150 includes two first hold blocks 151 for holding one end edge 10a and one second hold block 152 for holding the other end edge 10b. As shown in Fig. 13, a part of the end edge 10a of the resin film 10 is sandwiched between the first hold block 151 and the first mold 100. Also, a part of the end edge 10b of the resin film 10 is sandwiched between the second hold block 152 and the first mold 100 (see Fig. 17). In Fig. 13, the part shown between the two-dot chain line and the end edges 10a, 10b is the protrusion 19.

[0017] Next, the first mold 100 and the second mold 200 (see FIG. 14) are clamped together to fix the hold block 150 between the first mold 100 and the second mold 200, forming a cavity C1 (see FIG. 15) that accommodates a part of the resin film 10 (step S5). Step S5 is a mold clamping process. When clamping the mold, the second mold 200, which is a movable mold, moves toward the first mold 100 so that the parting surfaces of the first mold 100 and the second mold 200 come into contact with each other. When the mold is clamped, the hold block 150 is fixed by the first mold 100 and the second mold 200. Therefore, after clamping, the hold block 150 is kept closed even if the cylinder 170 does not press the hold block 150. The hold block 150 fits into the recess 210 of the second mold 200 shown in FIG. 14 and comes into contact with the second mold 200. The portion of the resin film 10 that becomes the protrusion 19 is not contained in the cavity C1, and therefore not all of the resin film 10 is contained in the cavity C1. In other words, the first gap IS1 for sandwiching the resin film 10 between the first mold 100 and the hold block 150 and the second gap IS2 (see FIG. 17) for sandwiching the resin film 10 between the first mold 100 and the second mold 200 are not included in the cavity C1. The wall surface of the cavity C1 includes a cavity forming region 159 which is a part of the hold block 150. In this embodiment, the space surrounded by the first region 101 of the first mold 100, the second region 202 of the second mold 200, and the cavity forming region 159 of the hold block 150 is the cavity C1. A part of the first region 101 of the first mold 100 is a curved surface. A preforming process is performed for the purpose of making the main surface 11 of the resin film 10 conform to the first region 101 of the first mold 100. The cavity forming region 159 of the hold block 150 contacts the side surface 1a (see FIG. 18) of the resin molded product 1. In a mold-closed state, the side surface 1a of the resin molded product 1 is a portion that rises from the vicinity of the end edges 10a, 10b of the resin film 10.

[0018] After the mold is clamped, as shown in FIG. 16, molten resin is injected into the cavity C1 (step S6). FIG. 17 shows a cross section of the cavity C1 where the hold block 150 is not included. A second gap IS2 is also formed between the first mold 100 and the second mold 200, sandwiching the end sides 10a, 10b of the resin film 10. The size of the second gap IS2 is the same as the thickness of the resin film 10, and is, for example, 10 μm to 500 μm. In order to form the second gap IS2, a step (a step-like portion) is provided in the second mold 200. Therefore, not only is the resin film 10 sandwiched between the hold block 150 and the first mold 100 to form the protrusion 19, but also the resin film 10 is sandwiched between the first mold 100 and the second mold 200 on both sides of the first mold 100 to form the protrusion 19. The molten resin injected into the cavity C1 is subjected to pressure dwelling, in which a predetermined pressure is continuously applied to maintain a positive density (step S7). Then, cooling is performed by the cooling function of the metal molds (first mold 100 and second mold 200) for a preset cooling time to solidify all of the molten resin in the cavity C1 (step S8). After the molds are closed, the resin molded product 1 with the resin film 10 inserted is molded through steps S6 to S8. That is, steps S6 to S8 are the molding process in which resin is injected into the cavity C1 to mold the resin molded product 1 with the resin film 10 inserted.

[0019] Next, in mold opening, as shown in Fig. 18, the second mold 200 is separated from the first mold 100 (step S9). Step S9 is the mold opening process. When the first mold 100 and the second mold 200 are opened, the cooled and solidified resin molded article 1 is ejected by, for example, an ejection cylinder (not shown). The resin molded article 1 ejected from the first mold 100 and the second mold 200 is released and taken out (step S10). In the removal process (step S10), when the first mold 100 and the second mold 200 are opened, the convex portion 155 of the hold block 150 gets caught on the resin molded product 1, and the resin molded product 1 pushes the hold block 150. The mold opening process and removal process are sometimes collectively referred to as the mold opening / removal process. In the mold opening / removal process, the convex portion 155 of the hold block 150 is pushed by the resin molded product 1, making it easier for the hold block 150 to be in an open state, improving the reliability of removing the resin molded product 1 in the mold opening / removal process.

[0020] (2) Molds used in the manufacturing process of resin molded products The mold used in the manufacturing method of the resin molded product includes a first mold 100 shown in Fig. 5 and a second mold 200 shown in Fig. 14. The first mold 100 and the second mold 200 are molds for forming a cavity C1 for molding the resin molded product 1 by clamping. However, in this embodiment, the cavity C1 is formed by three members including not only the first mold 100 and the second mold 200 but also a hold block 150. The hold block 150 is movably attached to the first die 100. When the die is open, the hold block 150 can be switched between an open state in which at least a part of the end edges 10a, 10b of the resin film 10 to be inserted into the resin molded product 1 is not pressed against the first die 100, and a closed state in which at least a part of the end edges 10a, 10b are pressed against the first die 100. As an example of a mode of movably mounting the hold block 150 to the first mold 100, the hold block 150 is mounted to the first mold 100 so as to be rotatable about a rotation axis 158. In this case, the first mold 100 has a cylinder 170 that pushes the hold block 150 to rotate about the rotation axis 158. When the first mold 100 is in a closed state, a first gap IS1 is formed between the hold block 150 and the first mold 100, the size of which corresponds to the thickness of the resin film 10. The hold block 150 switches between an open state and a closed state by rotating, making it easy to set the resin film 10. The size of the first gap IS1 is the same as the thickness of the resin film 10, and is, for example, 10 μm to 500 μm. In order to form the first gap IS1, a step (a step-like portion) is formed in the hold block 150.

[0021] 18, it is preferable that the hold block 150 is configured to have a protrusion 155. When the hold block 150 has the protrusion 155, it is caught by the resin molded article 1 when the first mold 100 and the second mold 200 are opened, and the resin molded article 1 presses the protrusion 155 of the hold block 150. In this way, the protrusion 155 is pressed by the resin molded article 1, which assists in removing the resin molded article 1 and improves the reliability of removing the resin molded article 1. The first mold 100 has a spring or plunger 160 for constantly releasing the closed state of the hold block 150 when the mold is open. The hold block 150 receives a force in the releasing direction from the plunger 160 or spring, so that it can be easily switched from the closed state to the open state.

[0022] (3) Resin molded products 18, the resin molded product 1 includes a resin molded body 50, a resin film 10 integrated with the resin molded body by insert molding, and a heating wire 20 which is a metal wire wired in a serpentine manner in the resin film 10. The resin film 10 has a protruding portion 19 with end sides 10a, 10b protruding from the resin molded body 50. Even when the protruding portion 19 is cut off to form a resin molded product as the final product, the resin molded product 1 can be transported with the protruding portion 19 attached in order to protect it.

[0023] (4) Variations (4-1) Variation A In the above embodiment, the case where the metal wire (heating wire 20) is wired in the resin film 10 has been described. However, the manufacturing method of the resin molded product according to the present invention can also be applied to a resin film that does not have a metal wire wired therein. For example, the manufacturing method of the resin molded product according to the present invention is suitable for a resin film having multiple layers, where the multiple layers are made of different materials, and therefore warping occurs in the resin film during the preforming process. In addition, the manufacturing method of the resin molded product according to the present invention is also preferably applied to a case where a different material other than the metal wire is integrated with the resin film and distortion occurs during the preforming process. An example of a different material other than the metal wire is a wire material other than the metal wire. An example of a wire material other than the metal wire is an optical fiber. (4-2) Variation B In the above embodiment, the case has been described where the protruding portion 19 is cut off after injection molding to produce a resin molded product as a final product. However, the resin molded product 1 may be a product with the protruding portion 19 remaining. For example, the protruding portion 19 may be left as a fixing or adhesive portion when the resin molded product 1 is incorporated into another device.

[0024] (4-3) Variation C In the above embodiment, a case has been described in which parts of the end sides 10a, 10b of the resin film 10 are brought into close contact with the first mold 100 by the hold block 150. However, the parts that are brought into close contact with the first mold 100 by the hold block 150 may be the entire end sides 10a, 10b of the resin film 10. In the above embodiment, a case has been described in which two opposing end edges 10a, 10b of the resin film 10 are brought into close contact with the first mold 100 by the hold block 150. However, the end edges brought into close contact with the first mold 100 by the hold block 150 may be one or three or more. (4-4) Variation D In the above embodiment, the setting step (step S3) has been described with reference to the case where the positioning pins 110 and the suction holes 120 are used. However, in the setting step, one of the positioning pins 110 and the suction holes 120 may be used to set the resin film 10, or the resin film 10 may be set by a method other than the method using the positioning pins 110 and the suction holes 120. (4-5) Variation E In the above embodiment, a description has been given of a case in which the mold cavity C1 is formed by the first mold 100, the second mold 200, and the hold block 150. However, the members for forming the mold cavity C1 may include members other than the first mold 100, the second mold 200, and the hold block 150.

[0025] (5) Features (5-1) In the mold of the above embodiment, the wall surface of the cavity C1 includes a cavity forming region 159 that is a part of the hold block 150. In the manufacturing method of the resin molded product 1, the cavity forming region 159 contacts the side surface 1a of the resin molded product 1 that rises from the vicinity of the end edges 10a, 10b of the resin film 10. Since the vicinity of the resin molded product 1 is pressed against the first mold 100 by the hold block 150, the resin film 10 that is distorted relative to the mold can be corrected by the hold block 150 and inserted, and molding defects in insert molding can be suppressed. (5-2) When the resin film 10 is wired with the heating wire 20, and a preforming process is performed before the setting process to three-dimensionally mold the resin film 10 with the heating wire 20 wired therein, distortion will be large due to the heating wire 20. Even if the heating wire 20 is present, it can be sufficiently corrected by the hold block 150, and molding defects in the insert molding can be suppressed.

[0026] (5-3) In the above embodiment, in the holding step, the hold block 150 is pushed by the cylinder 170 to rotate around the rotation axis 158, whereby the hold block 150 pinches at least a part of the end edges 10a, 10b of the resin film 10 between the first mold 100 and the hold block 150 and brings the resin film 10 into close contact with the first mold 100. In the mold opening and removal step, when the first mold 100 and the second mold 200 are opened, the hold block 150 is not pushed by the cylinder 170 and is in a state in which the hold block 150 can rotate around the rotation axis. The rotation of the hold block 150 makes it easier for the hold block 150 to pinch the end edges 10a, 10b of the resin film 10 between the first mold 100 and the hold block 150 to bring the resin film 10 into close contact with the first mold 100 or release the end edges 10a, 10b, which makes it easier to improve the production speed. (5-4) In the mold opening and removal process of the above embodiment, when the first mold 100 and the second mold 200 are opened, the convex portion 155 of the hold block 150 is caught by the resin molded product 1, and the resin molded product 1 presses the hold block 150. In this way, since the resin molded product 1 presses the hold block 150 in the mold opening and removal process, it becomes easier to open the hold block 150, and it becomes easier to improve the manufacturing speed.

[0027] (5-5) The resin molded product 1 manufactured by the manufacturing method of the above embodiment includes a resin molded body 50, a resin film 10 integrated with the resin molded body 50 by insert molding, and a heating wire 20 which is a metal wire wired in a meandering manner in the resin film 10. The resin film 10 of the resin molded product 1 has a protruding portion 19 with end sides 10a, 10b protruding from the resin molded body 50. By making the protruding portion 19 a component of the resin molded product 1, the process of cutting the protruding portion 19 can be omitted, and an increase in the cost of the resin molded product 1 can be suppressed. Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as necessary. [Explanation of symbols]

[0028] 1 Resin molded products 10 Resin film 10a,10b Edge 20 Heating wire (an example of metal wire) 50 Resin molding 100 Type 1 150 Hold Block 151 First Hold Block 152 Second Hold Block 155 Convex 158 Rotational Axis 159 Cavity formation area 160 Plunger 170 cylinders 200 Type 2 C1 Cavity

Claims

1. a setting step of fitting the resin film into a first mold; a holding step of sandwiching at least a part of an edge of the resin film between a holding block and the first mold and closely contacting the resin film with the first mold; a mold clamping step of clamping the first mold and the second mold to fix the hold block between the first mold and the second mold and form a cavity that accommodates a portion of the resin film; a molding step of injecting a resin into the cavity to form a resin molded product into which the resin film is inserted; a mold opening and removal step of opening the first mold and the second mold and removing the resin molded product into which the resin film has been inserted; Equipped with A method for manufacturing a resin molded product, characterized in that a wall surface of the cavity includes a cavity forming area which is part of the hold block, and the cavity forming area contacts a side surface of the resin molded product which rises from near the end edge of the resin film.

2. A metal wire is wired on the resin film, The method further includes a preforming step of three-dimensionally forming the resin film on which the metal wire is wired, prior to the setting step. A method for producing the resin molded product according to claim 1.

3. the hold block is attached to the first mold so as to be rotatable about a rotation axis; In the holding step, the holding block is pushed by a cylinder to rotate around the rotation axis, whereby the holding block sandwiches at least a part of the end side of the resin film between the holding block and the first mold and brings the resin film into close contact with the first mold; In the mold opening and removal step, when the first mold and the second mold are opened, the hold block is not pressed by the cylinder and is in a state in which the hold block can rotate around the rotation axis. A method for producing the resin molded product according to claim 1.

4. In the mold opening and removal step, when the first mold and the second mold are opened, a convex portion of the hold block is caught by the resin molded product, and the resin molded product presses the hold block. A method for producing the resin molded product according to claim 3.

5. a first mold and a second mold for forming a cavity for molding a resin molded product by clamping; a hold block that is attached to the first mold and is movable so as to switch between an open state in which at least a part of an edge of a resin film to be inserted into the resin molded product is not pressed against the first mold and a closed state in which at least a part of the edge is pressed against the first mold when the mold is open; Equipped with A mold characterized in that the hold block constitutes part of the wall of the cavity when the first mold and the second mold are clamped, and includes a cavity forming area rising from near the end edge.

6. the holding block is attached to the first mold so as to be rotatable about a rotation axis; the first mold has a cylinder that pushes the hold block and rotates it around the rotation axis, and is configured to form a gap between the hold block and the first mold in the closed state, the gap having a size corresponding to the thickness of the resin film. The mold according to claim 5.

7. the hold block is configured such that, when the first mold and the second mold are opened, a convex portion of the hold block is caught by the resin molded product, and the resin molded product presses the hold block. The mold according to claim 6.

8. the first mold has a spring or a plunger that constantly applies pressure to the hold block to release the closed state of the hold block in a mold open state; A mold according to any one of claims 5 to 7.

9. A resin molded body, A resin film integrated with the resin molded body by insert molding; A metal wire is wired in a meandering manner on the resin film; Equipped with The resin film has a protruding portion whose end edge protrudes from the resin molded article.

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