Manufacturing method of stretchable device

Abstract

To provide a manufacturing method of a stretchable device that can improve the ease of peeling off of a stretchable resin and prevent contamination of a chamber.SOLUTION: A manufacturing method of stretchable device includes a preparation step of preparing a glass plate provided with an inorganic film, a resin substrate formation step of forming a resin substrate on the inorganic film, an array layer formation step of forming an array layer on the resin substrate, and an elastic resin arrangement step of adhering the elastic resin to the array layer, and the elastic resin arrangement step arranges a portion of the elastic resin in a through hole penetrating the resin substrate and the array layer, and the portion of the elastic resin adheres to the inorganic film, and the inorganic film has a formation surface on which the resin substrate is formed, and the formation surface is provided with a recess that is recessed toward the glass plate.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a stretchable device. [Background technology]

[0002] The stretchable device is excellent in elasticity and flexibility. The stretchable device includes an array layer, a resin substrate that is the base material of the array layer, and two elastic resins that sandwich the array layer and the resin substrate. For example, as shown in Patent Document 1, the resin substrate is provided with a plurality of through holes that penetrate in the thickness direction. The plurality of through holes are arranged in a matrix. Thus, the resin substrate has a plurality of hinge portions that extend between the through holes, and a plurality of body portions whose ends are connected to each other. In addition, the shape of the hinge portion is a meandering shape. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-118273 Summary of the Invention [Problem to be solved by the invention]

[0004] The manufacturing process of the stretchable device includes forming a resin substrate on a glass plate. Next, forming an array layer on the resin substrate. Next, an elastic resin is arranged so as to cover the array layer, and the elastic resin is pressed onto the array layer. A part of the elastic resin is extruded into the through-holes of the resin substrate and adheres to the glass plate. However, the elastic resin has high adhesion, and when peeling the resin substrate from the glass plate, the elastic resin is difficult to peel off from the glass plate. For this reason, the resin substrate and the array layer may be damaged or deformed, which is undesirable. In addition, the glass plate may be eroded by etching when forming the resin substrate, and the chamber may be contaminated. Therefore, there is also a demand to prevent contamination of the chamber.

[0005] An object of the present invention is to provide a method for manufacturing a stretchable device that can improve the ease of peeling off of the stretchable resin and prevent contamination of the chamber. [Means for solving the problem]

[0006] A method for manufacturing a stretchable device according to one aspect of the present disclosure includes a preparation step of preparing a glass plate provided with an inorganic film, a resin substrate forming step of forming a resin substrate on the inorganic film, an array layer forming step of forming an array layer on the resin substrate, and an elastic resin arranging step of adhering an elastic resin to the array layer. The elastic resin arranging step arranges a part of the elastic resin in a through hole penetrating the resin substrate and the array layer, and a part of the elastic resin adheres to the inorganic film. The inorganic film has a forming surface on which the resin substrate is formed. The forming surface is provided with a recess recessed toward the glass plate. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of a stretchable device according to a first embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing a cross section of the stretchable device according to the first embodiment, specifically, a cross section taken along line II-II in FIG. [Diagram 3] FIG. 3 is a plan view of the resin substrate disposed on the first surface of the first elastic resin of the first embodiment, viewed from the first thickness direction. [Figure 4] FIG. 4 is an enlarged view of the body portion and the hinge portion of the first embodiment. [Diagram 5] FIG. 5 is an enlarged view of the body portion and the hinge portion when a tensile load acts on the resin base material of the first embodiment. [Figure 6] FIG. 6 is a flow diagram showing the first half of the method for manufacturing the stretchable device of the first embodiment. [Figure 7] FIG. 7 is a flow diagram showing the second half of the method for manufacturing the stretchable device of the first embodiment. [Figure 8] FIG. 8 is an enlarged view of a cross section cut in the thickness direction of the intermediate product in the second elastic resin placement step. [Figure 9] FIG. 9 is an enlarged view of the glass plate of Embodiment 1 as viewed from the first thickness direction. [Figure 10] FIG. 10 is an enlarged view of a cross section of the stretchable device manufactured by the manufacturing method of the first embodiment. [Figure 11] FIG. 11 is an enlarged view of a part of the surface on which the inorganic film is formed according to the first modification, viewed from the first thickness direction. [Figure 12] FIG. 12 is an enlarged view of a part of the surface on which the inorganic film of Modification 2 is formed, viewed from the first thickness direction. [Figure 13] FIG. 13 is an enlarged view of a part of the surface on which the inorganic film is formed according to Modification 3, viewed from the first thickness direction. [Figure 14] FIG. 14 is a cross-sectional view of the intermediate product after the second elastic resin disposing step in the manufacturing method of the second embodiment, cut in the thickness direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The form (embodiment) for carrying out the present disclosure will be described in detail with reference to the drawings. The invention of the present disclosure is not limited to the contents described in the following embodiment. In addition, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the components described below can be appropriately combined. Note that the disclosure is merely an example, and those that a person skilled in the art can easily imagine appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In order to make the explanation clearer, the drawings may be schematic in terms of the width, thickness, shape, etc. of each part compared to the actual embodiment, but are merely an example and do not limit the interpretation of the present invention. In addition, in this specification and each figure, the same reference numerals are given to components similar to those described above with respect to the previous figures, and detailed explanations may be omitted as appropriate.

[0009] Furthermore, in this specification and the claims, when expressing an aspect of arranging another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both the case where another structure is arranged directly on top of a certain structure so as to be in contact with the certain structure, and the case where another structure is arranged above a certain structure via yet another structure.

[0010] (Embodiment 1) FIG. 1 is a perspective view of the stretchable device according to the first embodiment. FIG. 2 is a schematic cross-sectional view of the stretchable device according to the first embodiment, specifically a cross-sectional view taken along line II-II in FIG. 3. FIG. 3 is a plan view of the resin substrate arranged on the first surface of the first elastic resin according to the first embodiment, viewed from the first thickness direction. FIG. 4 is an enlarged view of the body and hinge of the first embodiment. FIG. 5 is an enlarged view of the body and hinge when a tensile load acts on the resin substrate of the first embodiment. In FIG. 3, the resin substrate 10 is hatched to make it easier to see.

[0011] First, a brief description will be given of the structure of the stretchable device 100. As shown in Figures 1 and 2, the stretchable device 100 is formed in a plate shape. The stretchable device 100 has a front surface 1 and a back surface 2 (not shown in Figure 1, see Figure 2) that face in opposite directions. Hereinafter, the directions parallel to each of the front surface 1 and the back surface 2 will be referred to as planar directions.

[0012] 1, the stretchable device 100 is formed into a rectangle when viewed from a direction opposite to the surface 1. That is, the surface 1 has a pair of long sides 3 and a pair of short sides 4. Hereinafter, the direction parallel to the long sides 3 is referred to as the longitudinal direction X, and the direction parallel to the short sides 4 is referred to as the cross direction Y.

[0013] As shown in FIG. 2, the stretchable device 100 includes a first elastic resin 50, a resin substrate 10, an array layer 30, and a second elastic resin (elastic resin) 60, which are laminated in this order. Hereinafter, the direction in which the first elastic resin 50, the resin substrate 10, the array layer 30, and the second elastic resin 60 are laminated is referred to as a thickness direction. With respect to the thickness direction, the direction in which the second elastic resin 60 is arranged as viewed from the first elastic resin 50 is referred to as a first thickness direction Z1, and the opposite direction to the first thickness direction Z1 is referred to as a second thickness direction Z2. Furthermore, viewing the stretchable device 100 from the first thickness direction Z1 is referred to as a plan view.

[0014] The first elastic resin 50 and the second elastic resin 60 have insulating properties, elasticity, and flexibility. An acrylic elastomer can be used as the first elastic resin 50 and the second elastic resin 60. The first elastic resin 50 and the second elastic resin 60 of the present disclosure are not limited to acrylic elastomers, and may be acrylic resins, epoxy resins, urethane resins, or the like, and are not particularly limited.

[0015] The first elastic resin 50 and the second elastic resin 60 are formed in a plate shape and extend in a planar direction. The surface of the first elastic resin 50 in the second thickness direction Z2 constitutes the back surface 2 of the stretchable device 100. The first elastic resin 50 has a first surface 51 facing the first thickness direction Z1. The resin base material 10 is laminated on the first surface 51.

[0016] A surface of the second elastic resin 60 in the first thickness direction Z1 constitutes a surface 1 of the stretchable device 100. A surface 61 of the second elastic resin 60 in the second thickness direction Z2 is adhered to the array layer 30. At an end of the second elastic resin 60 in the longitudinal direction X and an end of the second elastic resin 60 in the cross direction Y, a frame portion 62 protruding in the second thickness direction Z2 beyond the surface 61 is provided.

[0017] The frame 62 is formed in a ring shape in a plan view, and surrounds the outer periphery of the resin substrate 10 and the array layer 30. A surface 62a of the frame 62 in the second thickness direction Z2 is bonded to the first surface 51 of the first elastic resin 50. Thus, the first elastic resin 50 and the second elastic resin 60 cooperate with each other to form a housing that accommodates the resin substrate 10 and the array layer 30.

[0018] The resin base material 10 is adhered to a first surface 51 of the first elastic resin 50. The resin base material 10 has elasticity, flexibility, and insulating properties. The resin base material 10 is made of a resin material such as polyimide.

[0019] As shown in Fig. 3, the resin base material 10 includes a plurality of body portions 11 and a plurality of hinge portions 12 that extend in a planar direction while meandering. The body portions 11 are quadrangular (square) in plan view. The body portions 11 are arranged such that their four corners point in the longitudinal direction X and the intersecting direction Y. The body portions 11 are arranged in the longitudinal direction X and the intersecting direction Y and are spaced apart from one another. Note that the shape of the body portions 11 in the present disclosure in plan view is not limited to a quadrangular shape, and may be a circular shape or another polygonal shape.

[0020] 3, the hinge portion 12 has a vertical hinge portion 12A extending in the longitudinal direction X and a horizontal hinge portion 12B extending in the transverse direction Y. When the vertical hinge portion 12A is rotated by 90° in a plan view, it has the same shape as the horizontal hinge portion 12B. In the following description of the hinge portion 12, the vertical hinge portion 12A will be described as a representative example, and a description of the horizontal hinge portion 12B will be omitted.

[0021] As shown in Fig. 4, the vertical hinge portion 12A has four bent portions 13 and extends in a serpentine manner in the longitudinal direction X. Each bent portion 13 in this embodiment is formed in an arc shape. Note that the bent portions of the present disclosure may be formed in an angular shape instead of an arc shape. The number of bent portions is not limited to four.

[0022] The four bent portions 13 are a first arc portion 14, a second arc portion 15, a third arc portion 16, and a fourth arc portion 17, which are arranged in this order in the longitudinal direction X. The first arc portion 14 and the fourth arc portion 17 are quadrant-shaped and bent at 90 degrees. The second arc portion 15 and the third arc portion 16 are semicircular-shaped and bent at 180 degrees.

[0023] As shown in FIG. 5, when a tensile load in the longitudinal direction X (see arrow C in FIG. 5) acts on the vertical hinge portion 12A, the first arc portion 14, the second arc portion 15, the third arc portion 16, and the fourth arc portion 17 are deformed so that their curvatures become smaller. As a result, the distance from one end to the other end of the vertical hinge portion 12A becomes larger, and the body portions 11 become separated from each other. In addition, although not shown in particular, when a compressive load in the longitudinal direction X acts on the vertical hinge portion 12A, the first arc portion 14, the second arc portion 15, the third arc portion 16, and the fourth arc portion 17 are deformed so that their curvatures become larger. As a result, the distance from one end to the other end of the vertical hinge portion 12A becomes smaller, and the body portions 11 become closer to each other.

[0024] 3, a portion surrounded by the four hinge portions 12 arranged in a ring shape (square shape) forms a first through hole 19 that penetrates the resin base material 10 in the thickness direction. That is, the resin base material 10 has a plurality of first through holes 19.

[0025] As shown in FIG. 2, the array layer 30 is provided on the surface of the resin substrate 10 in the first thickness direction Z1. Although not particularly shown, the array layer 30 has substantially the same shape as the resin substrate 10 in a plan view. Thus, the array layer 30 is provided with a plurality of second through holes 31 corresponding to the first through holes 19. Hereinafter, the first through holes 19 and the second through holes 31 will be collectively referred to as through holes 40. As shown in FIG. 2, the through holes 40 have protruding portions 63 protruding from a surface 61 of the second elastic resin 60 in the second thickness direction Z2 arranged therein.

[0026] The array layer 30 includes a plurality of insulating layers (not shown) stacked in the thickness direction, and an electric circuit whose insulation from the outside is ensured by the plurality of insulating layers. The electric circuit may be a load detection circuit that detects the expansion and contraction of the stretchable device 100 in the planar direction or the bending of the stretchable device 100. In addition, the present disclosure is not limited to a pressure detection circuit that detects a load applied to the surface 1, a detection circuit that detects light incident on the surface 1, or the like. Next, a manufacturing method of the stretchable device 100 of the first embodiment will be described.

[0027] Fig. 6 is a flow diagram showing the first half of the method for manufacturing the stretchable device of embodiment 1. Fig. 7 is a flow diagram showing the second half of the method for manufacturing the stretchable device of embodiment 1. As shown in Figs. 6 and 7, the method S100 for manufacturing the stretchable device 100 includes a preparation step S1, a resin substrate forming step S3, an array layer forming step S5, a second stretchable resin arranging step (stretchable resin arranging step) S7, a lift-off step S9, and a first stretchable resin arranging step S11.

[0028] As shown in FIG. 6, the preparation step S1 is a step of preparing a glass plate 120. The glass plate 120 has a first surface 121 facing the first thickness direction Z1 and a second surface 122 facing the second thickness direction Z2. The first surface 121 of the glass plate 120 is provided with an inorganic film 130 formed of SiO. The inorganic film 130 has a formation surface 131 facing the first thickness direction Z1. The material of the inorganic film 130 of the present disclosure is not limited to SiO. The inorganic film 130 only needs to prevent the glass plate 120 from being eroded by etching. Therefore, the inorganic film 130 may be, for example, an oxide film or an amorphous silicon film. The formation surface 131 of the inorganic film 130 will be described in detail later.

[0029] In the resin base material forming step S3, first, a resin layer is formed as a solid film on the formation surface 131 of the inorganic film 130 (glass plate 120). Next, a mask is placed in the first thickness direction Z1 of the resin layer, and etching is performed. As a result, first through holes 19 are formed in the resin layer, and the resin base material 10 is formed. Here, the glass plate 120 is covered with the inorganic film 130. Therefore, it is possible to prevent the glass plate 120 from being eroded by etching.

[0030] The array layer forming step S5 is a step of forming an array layer 30 in the first thickness direction Z1 of the resin substrate 10. In the array layer 30, second through holes 31 continuous with the first through holes 19 are formed. Note that the method of forming the array layer in the array layer forming step S5 is not particularly limited in the present disclosure, but even if etching is performed in the array layer forming step S5, the glass plate 120 is covered with the inorganic film 130. Therefore, it is possible to prevent the glass plate 120 from being eroded by etching.

[0031] As shown in FIG. 7, in the second elastic resin arrangement step S7, first, the flat second elastic resin 60 is laminated on the array layer 30 from the first thickness direction Z1. Next, the second elastic resin 60 is pressed from the first thickness direction Z1. Note that the pressing from the first thickness direction Z1 may be performed using a jig such as a roller. As a result, the surface 61 of the second elastic resin 60 adheres to the array layer 30. Also, a part of the second elastic resin 60 enters the through hole 40 by pressing from the first thickness direction Z1 and becomes a convex portion 63. Then, the convex portion 63 adheres to the inorganic film 130. Also, a part of the second elastic resin 60 arranged on the outer side of the array layer 30 in the planar direction moves in the second thickness direction Z2 by pressing from the first thickness direction Z1 and becomes a frame portion 62. Then, the frame portion 62 also adheres to the inorganic film 130.

[0032] In the lift-off process S9, a laser is irradiated from the second thickness direction Z2 of the glass plate 120 toward the surface 10a of the resin base material 10 in the second thickness direction Z2. Next, the resin base material 10 is peeled off from the glass plate 120. Here, a gap is formed at the interface between the resin base material 10 and the inorganic film 130 by the laser irradiation. Therefore, the resin base material 10 can be easily peeled off from the glass plate 120. Note that even if the laser irradiated to the resin base material 10 is irradiated to the second elastic resin 60, no gap is formed between the second elastic resin 60 and the inorganic film 130. That is, the second elastic resin 60 and the inorganic film 130 are adhered to each other. Therefore, when the resin base material 10 is peeled off from the glass plate 120 (inorganic film 130), the second elastic resin 60 exerts an adhesive force to the glass plate 120 (inorganic film 130).

[0033] In the first elastic resin arrangement step S13, the plate-shaped first elastic resin 50 is layered on the resin base material 10 from the second thickness direction Z2. Next, the first elastic resin 50 is pressed from the second thickness direction Z2. This causes the first elastic resin 50 to adhere to the resin base material 10. In addition, the second elastic resin 60 (frame portion 62 and protruding portion 63) and the first elastic resin 50 are bonded with an adhesive. This completes the stretchable device 100. Next, the formation surface 131 of the inorganic film 130 will be described in detail.

[0034] Fig. 8 is an enlarged view of a cross section of an intermediate product in a second stretchable resin arranging step cut in a thickness direction. Fig. 9 is an enlarged view of a glass plate of embodiment 1 viewed from a first thickness direction. Fig. 10 is an enlarged view of a cross section of a stretchable device manufactured by a manufacturing method of embodiment 1.

[0035] 8, a recess 132 recessed in the second thickness direction Z2 (toward the glass plate 120) is provided on the formation surface 131 of the inorganic film 130. The depth of the recess 132 is in the range of several tens of nm to several hundreds of nm.

[0036] As shown in FIG. 9, the recesses 132 are formed in a rectangular (square) shape in plan view. A plurality of recesses 132 are provided and are arranged on the entire formation surface 131 of the inorganic film 130. The recesses 132 are provided at equal intervals in the longitudinal direction X and the planar direction. Thus, a flat surface 133 that is a part of the formation surface 131A and has a rectangular (square) shape in plan view is provided between the recesses 132. Thus, the formation surface 131 has an array of the recesses 132 and the flat surfaces 133 alternately arranged in the longitudinal direction X and the planar direction. The interval at which the recesses 132 are arranged is, for example, 100 nm, but the present disclosure is not limited thereto.

[0037] As described above, according to the manufacturing method S100 of the first embodiment, the glass plate 120 is covered with the inorganic film 130. Even if etching is performed in the resin substrate forming step S3 and the array layer forming step S5, the glass plate 120 is not eroded. Therefore, contamination of the chamber is avoided. In addition, the inorganic film 130 is provided with a recess 132, and the adhesion area between the second elastic resin 60 (frame portion 62 and protrusion portion 63) and the formation surface 131 is reduced. In other words, the second elastic resin 60 has a small adhesive force to the inorganic film 130. Therefore, when the resin substrate 10 is peeled off from the glass plate in the lift-off step S9, the second elastic resin 60 is easily peeled off from the inorganic film 130, and damage to the resin substrate 10 and the array layer 30 is avoided.

[0038] In the first embodiment, the recesses 132 are provided on all of the forming surface 131. Therefore, when the resin layer is formed in the resin base material forming step S3, the resin enters the recesses 132. The resin that has entered the recesses 132 becomes the protrusions 20 (see FIG. 8) that protrude from the surface 10a of the resin base material 10 in the second thickness direction Z2. The protrusions 20 have a shape corresponding to the recesses 132 and are rectangular columns. As shown in FIG. 10, when the first elastic resin 50 is pressed from the second thickness direction Z2 in the first elastic resin arranging step S13, the first elastic resin 50 enters between the protrusions 20. Therefore, the protrusions 20 are embedded in the first surface 51 of the first elastic resin 50. The protrusions 20 are omitted in FIG. 2 and the like.

[0039] Although the first embodiment has been described above, the shape and arrangement of the recesses 132 formed in the inorganic film 130 are not limited to those shown in the first embodiment. Below, modified examples 1 to 3 in which the shape and arrangement of the recesses 132 are changed will be described.

[0040] (Variation 1) FIG. 11 is an enlarged view of a part of the formation surface of the inorganic film of the first modification seen from the first thickness direction. As shown in FIG. 11, the recesses 132A of the inorganic film 130A of the first modification extend in the intersecting direction Y and are formed in a groove shape. In addition, a plurality of the recesses 132A are provided at intervals in the longitudinal direction X. Therefore, between the recesses 132A, a flat surface 133A that is a part of the formation surface 131A and extends in the intersecting direction Y is provided. From the above, the formation surface 131A of the first modification has the recesses 132A and the flat surface 133A alternately arranged in the longitudinal direction X, so that the adhesion area with the second elastic resin 60 is reduced. Even in such a first modification, the second elastic resin 60 has a small adhesive force to the inorganic film 130, and the second elastic resin 60 is easily peeled off from the inorganic film 130 when the resin substrate 10 is peeled off from the glass plate.

[0041] (Variation 2) FIG. 12 is an enlarged view of a part of the formation surface of the inorganic film of the second modification viewed from the first thickness direction. As shown in FIG. 12, a recess 132B is formed on the formation surface 131B of the inorganic film 130B of the second modification. The recess 132B is formed in a circular shape when viewed from the first thickness direction Z1. In addition, a plurality of recesses 132B are provided. The plurality of recesses 132B are arranged in a triangular lattice (regular triangular lattice) shape. Even in the formation surface 131B of the third modification, the adhesion area with the second elastic resin 60 is reduced. Therefore, when the resin substrate 10 is peeled off from the glass plate, the second elastic resin 60 is easily peeled off from the inorganic film 130. Note that the portion (plane 133B) where the recess 132B is not provided is continuous in the plane direction.

[0042] (Variation 3) FIG. 13 is an enlarged view of a part of the formation surface of the inorganic film of the third modification viewed from the first thickness direction. As shown in FIG. 13, a recess 132C is formed on the formation surface 131C of the inorganic film 130C of the third modification. There is one recess 132C. The recess 132C extends in the planar direction and is provided on the entire formation surface 131A. The part where the recess 132C is not provided is a flat surface 133C that is a part of the formation surface 131A. The flat surface 133C is formed in a circular shape when viewed from the first thickness direction Z1. A plurality of flat surfaces 133C are provided. The plurality of flat surfaces 133C are arranged in a triangular lattice (regular triangular lattice) shape. Even in the formation surface 131C of the third modification, the adhesive area with the second elastic resin 60 is reduced. Therefore, when the resin substrate 10 is peeled off from the glass plate, the second elastic resin 60 is easily peeled off from the inorganic film 130.

[0043] In the above-mentioned embodiment 1 and the modified example, the recesses are formed on the entire forming surface, but the present disclosure is not limited thereto. Next, embodiment 2 in which recesses are formed on a part of the forming surface will be described.

[0044] (Embodiment 2) 14 is a cross-sectional view cut in the thickness direction of the intermediate product after the second resin base material forming step in the manufacturing method of embodiment 2. The formation surface 131D of the inorganic film 130D used in the manufacturing method of embodiment 2 has a covered portion 135 that comes into contact with the resin base material 10 and an exposed portion 136 that does not come into contact with the resin base material 10.

[0045] The covering portion 135 is covered by the resin base material 10 from the first thickness direction. Moreover, the exposed portion 136 is not covered by the resin base material 10 from the first thickness direction Z1. Specifically, the exposed portion 136 is a portion overlapping the first through hole 19 (through hole 40) in the thickness direction and a portion disposed on the outer side of the resin base material 10 in the planar direction. The portion of the exposed portion 136 overlapping the first through hole 19 in the thickness direction adheres to the convex portion 63 of the second elastic resin 60. Moreover, the portion of the exposed portion 136 disposed on the outer side of the resin base material 10 in the planar direction adheres to the frame portion 62 (see FIG. 2) of the second elastic resin 60. In this embodiment, the recess 132D is formed only in the exposed portion 136. Therefore, the covering portion 135 is flat.

[0046] As described above, according to the manufacturing method of the second embodiment, the formation surface 131D of the inorganic film 130D has the recesses 132D formed only in the portions that are in contact with the second elastic resin 60. Therefore, similar to the first embodiment, when the resin substrate 10 is peeled off from the glass plate, the second elastic resin 60 is easily peeled off from the inorganic film 130.

[0047] In the first embodiment, recesses are formed on the entire forming surface 131, and the boundary (interface) where the resin base material 10 and the forming surface 131 come into contact is not flat. When irradiating with a laser in the lift-off step S9, it is difficult to irradiate the interface between the resin base material 10 and the forming surface 131 with the laser uniformly. On the other hand, according to the second embodiment, the interface between the resin base material 10 and the covering portion 135 is flat. Therefore, the interface between the resin base material 10 and the covering portion 135 can be irradiated with the laser uniformly. As a result, the peelability of the resin base material 10 is improved compared to the manufacturing method of the first embodiment. [Explanation of symbols]

[0048] 10 Resin substrate 11 Body 12 Hinge part 19 First through hole 30 Array Layer 31 Second through hole 40 Through hole 50 1st elastic resin 60 Second elastic resin (elastic resin) 62 Frame 63 Convex 100 Stretchable Devices 120 Glass Plate 130, 130A, 130B, 130C, 130D Inorganic membrane 131, 131A, 131B, 131C, 131D forming surface 132, 132A, 132B, 132C, 132D recess 133, 133A, 133B, 133C plane 135 Covering part 136 Exposed part

Claims

1. A preparation step of preparing a glass plate provided with an inorganic film; a resin substrate forming step of forming a resin substrate on the inorganic film; an array layer forming step of forming an array layer on the resin substrate; a step of attaching a stretchable resin to the array layer; Including, The elastic resin disposing step disposes a part of the elastic resin in a through-hole penetrating the resin substrate and the array layer, and the part of the elastic resin adheres to the inorganic film; the inorganic film has a formation surface on which the resin substrate is formed, The forming surface is provided with a recess that is recessed toward the glass plate. A method for manufacturing a stretchable device.

2. The recesses are provided on the entire forming surface. A method for manufacturing the stretchable device according to claim 1.

3. The forming surface is A covering portion covered by the resin base material; an exposed portion that is not covered by the resin base material and to which a part of the elastic resin is adhered; having The recess is provided only in the exposed portion. A method for manufacturing the stretchable device according to claim 1.

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