Resin composition, pellet, and molded product

Abstract

To provide a resin composition that can yield a molded product with high surface hardness, superior transparency, and superior heat resistance, as well as a pellet and a molded product.SOLUTION: A resin composition contains 5-60 pts.mass of a (meth)acryl copolymer (C) relative to the total of 100 pts.mass of bisphenol A type polycarbonate resin (A) and bisphenol AP type polycarbonate resin (B). The mass ratio of bisphenol A type polycarbonate resin (A) to bisphenol AP type polycarbonate resin (B), (A) / (B), is 0.8 or more.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition, a pellet, and a molded article, and in particular to a resin composition containing a polycarbonate resin as a main component. [Background technology]

[0002] Polycarbonate resin is widely used in electrical and electronic equipment, office automation equipment, optical media, automotive parts, building materials, etc. due to its excellent mechanical strength, heat resistance, electrical properties, dimensional stability, flame retardancy, transparency, etc.

[0003] The most widely used polycarbonate resin is bisphenol A polycarbonate resin made from bisphenol A. However, molded articles obtained from bisphenol A type polycarbonate resins have insufficient surface hardness depending on the application. For this reason, a hard coat layer or the like is sometimes provided on the surface of the polycarbonate resin to improve the surface hardness. However, providing a hard coat layer on the surface adds an additional step to the manufacturing process, reducing production efficiency. Furthermore, it is difficult to provide a hard coat layer on molded products with complex shapes. Therefore, research has been conducted into improving the surface hardness while maintaining transparency by blending specific resins with polycarbonate resin (Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 62-131056 [Patent Document 2] Japanese Patent Application Laid-Open No. 63-139935 [Patent Document 3] International Publication No. 2016 / 158332 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with the resin compositions described in Patent Documents 1 and 2, it is difficult to achieve both surface hardness and transparency in the resulting molded article. On the other hand, the resin composition described in Patent Document 3 is excellent in both surface hardness and transparency, but heat resistance may be required depending on the application. The present invention aims to solve such problems, and to provide a resin composition capable of providing a molded article having high surface hardness, excellent transparency, and excellent heat resistance, as well as pellets and a molded article. [Means for solving the problem]

[0006] In view of the above problems, the present inventors have conducted research and found that the above problems can be solved by blending a bisphenol A type polycarbonate resin with a bisphenol AP type polycarbonate resin and a (meth)acrylic copolymer. Specifically, the above problems were solved by the following means. <1> A resin composition comprising 5 to 60 parts by mass of a (meth)acrylic copolymer (C) per 100 parts by mass in total of a bisphenol A type polycarbonate resin (A) and a bisphenol AP type polycarbonate resin (B), and wherein the mass ratio (A) / (B) of the bisphenol A type polycarbonate resin (A) to the bisphenol AP type polycarbonate resin (B) is 0.8 or more. <2> The (meth)acrylic copolymer (C) contains aromatic (meth)acrylate units and methyl (meth)acrylate units. <1> The resin composition according to claim 1. <3> The (meth)acrylic copolymer (C) contains 5 to 35 parts by mass of aromatic (meth)acrylate units and 95 to 65 parts by mass of methyl (meth)acrylate units. <1> or <2> The resin composition according to claim 1. <4> The aromatic (meth)acrylate unit includes a unit represented by formula (1): <2> or <3> The resin composition according to claim 1. [ka] (In formula (1), R 1 is a hydrogen atom or a methyl group, m1 is an integer of 0 to 10, and Ar is a substituted or unsubstituted aryl group. <5> The aromatic (meth)acrylate unit includes a unit represented by formula (2): <2> or <3> The resin composition according to claim 1. [ka] (In formula (2), X is a single bond, -C(R 2 )(R 3 R is a divalent group selected from the group consisting of -C(=O)-, -O-, -OC(=O)-, -OC(=O)O-, -S-, -SO-, -SO2-, and combinations of two or more thereof; 1 is a hydrogen atom or a methyl group, and R 2 and R 3 are each independently a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a phenyl group, or a phenylphenyl group; R 2 and R 3 may be bonded to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are bonded, R 4 and R 5 are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a halogen atom, a phenyl group, or a phenylphenyl group, m2 is an integer of 1 to 10, p is an integer of 0 to 4, and q is an integer of 0 to 5. <6> The (meth)acrylic copolymer (C) is contained in an amount of 5 to 35 parts by mass per 100 parts by mass of the total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). <1> ~ <5> 10. The resin composition according to claim 9 . <7> the (meth)acrylic copolymer (C) contains 5 to 35 parts by mass of aromatic (meth)acrylate units and 95 to 65 parts by mass of methyl (meth)acrylate units, the aromatic (meth)acrylate units contain a unit represented by formula (2), and the (meth)acrylic copolymer (C) is contained in an amount of 5 to 35 parts by mass per 100 parts by mass in total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B); <1> ~ <6> 10. The resin composition according to claim 9 . [ka] (In formula (2), X is a single bond, -C(R 2 )(R 3 R is a divalent group selected from the group consisting of -C(=O)-, -O-, -OC(=O)-, -OC(=O)O-, -S-, -SO-, -SO2-, and combinations of two or more thereof; 1 is a hydrogen atom or a methyl group, and R 2 and R 3 are each independently a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a phenyl group, or a phenylphenyl group; R 2 and R 3 may be bonded to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are bonded, R 4 and R 5 are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a halogen atom, a phenyl group, or a phenylphenyl group, m2 is an integer of 1 to 10, p is an integer of 0 to 4, and q is an integer of 0 to 5. <8> The resin composition is molded into an ISO test piece having a thickness of 4 mm, and the deflection temperature under load when a load of 1.80 MPa is applied is 105°C or higher. <1> ~ <7> 10. The resin composition according to claim 9 . <9> When the resin composition is molded into a test piece having a thickness of 3 mm, the haze is 1.5% or less. <1> ~ <8> 10. The resin composition according to claim 9 . <10> <1> ~ <9> 2. A pellet of the resin composition according to claim 1. <11> <1> ~ <9> 2. A molded article formed from the resin composition according to claim 1. <12> <10> A molded article formed from the pellets according to claim 1. Effect of the Invention

[0007] According to the present invention, it is possible to provide a resin composition capable of providing a molded article having high surface hardness, excellent transparency, and excellent heat resistance, as well as pellets and a molded article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present invention (hereinafter, simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment. In this specification, the use of "to" means that the numerical values ​​before and after it are included as the lower limit and upper limit. In this specification, various physical properties and characteristic values ​​are those at 23° C. unless otherwise specified. In the description of groups (atomic groups) in this specification, when the description does not indicate whether the group is substituted or unsubstituted, the description also includes groups (atomic groups) that have a substituent as well as groups (atomic groups) that have no substituent. For example, the term "alkyl group" includes not only alkyl groups that have no substituent (unsubstituted alkyl groups), but also alkyl groups that have a substituent (substituted alkyl groups). In this specification, when the description does not indicate whether the group is substituted or unsubstituted, the description is preferably unsubstituted.

[0009] In this specification, "(meth)acrylic" refers to both or either of acrylic and methacrylic.

[0010] If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise stated.

[0011] The resin composition of the present embodiment is characterized in that it contains 5 to 60 parts by mass of (meth)acrylic copolymer (C) per 100 parts by mass of the total of bisphenol A type polycarbonate resin (A) and bisphenol AP type polycarbonate resin (B), and the mass ratio (A) / (B) of the bisphenol A type polycarbonate resin (A) to the bisphenol AP type polycarbonate resin (B) is 0.8 or more. With this configuration, it is possible to provide a molded product with high surface hardness, excellent transparency, and excellent heat resistance. By blending the AP type polycarbonate resin (B) with the bisphenol A type polycarbonate resin (A), the heat resistance of the resin composition can be improved. Also, by blending the (meth)acrylic copolymer (C), the hardness of the resulting molded product can be increased.

[0012] <Bisphenol A polycarbonate resin (A)> The resin composition of the present embodiment contains a bisphenol A type polycarbonate resin (A). The bisphenol A polycarbonate resin (A) refers to a polycarbonate resin in which the ratio of units represented by formula (A) is 50% by mass or more. The ratio of units represented by formula (A) in the bisphenol A polycarbonate resin (A) is preferably 60% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and even more preferably 90% by mass or more, and all units excluding terminal groups may be units represented by formula (A). [ka]

[0013] The bisphenol A polycarbonate resin (A) may have other monomer units other than the unit represented by formula (A). Examples of dihydroxy compounds constituting such other monomer units include aromatic dihydroxy compounds described in paragraph 0014 of JP 2018-154819 A, the contents of which are incorporated herein by reference.

[0014] The bisphenol A type polycarbonate resin (A) used in this embodiment may be a recycled product of bisphenol A type polycarbonate resin (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a scrap generated when molding a molded product from a resin composition.

[0015] The viscosity average molecular weight (Mv) of the bisphenol A polycarbonate resin (A) is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By making it equal to or more than the lower limit, the heat resistance of the obtained molded article tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the bisphenol A polycarbonate resin (A) is preferably 50,000 or less, more preferably 40,000 or less, and even more preferably 30,000 or less. By making it equal to or less than the upper limit, the molding processability of the molded article tends to be further improved. The viscosity average molecular weight (Mv) was calculated by using methylene chloride as a solvent and an Ubbelohde viscometer to determine the intrinsic viscosity [η] (unit: dL / g) at 25°C, and then using the Schnell viscosity formula, i.e., η = 1.23 × 10 -4 ×Mv 0.83 , means a value calculated from When two or more types of polycarbonate resins are used, the viscosity average molecular weight is the mixture.

[0016] The method for producing the bisphenol A polycarbonate resin (A) is not particularly limited, and any method can be used, such as interfacial polymerization, melt transesterification, pyridine method, ring-opening polymerization of a cyclic carbonate compound, and solid-phase transesterification of a prepolymer.

[0017] In addition, as the bisphenol A type polycarbonate resin, the bisphenol A type polycarbonate resin described in paragraphs 0026 to 0036 of JP 2018-87268 A, paragraphs 0055 to 0057 of WO 2016 / 158332, and paragraphs 0020 to 0027 of WO 2020 / 162419 can also be used, the contents of which are incorporated herein by reference.

[0018] The content of the bisphenol A polycarbonate resin (A) in the resin composition is preferably 30% by mass or more, more preferably 35% by mass or more, and the upper limit is preferably 60% by mass or less, more preferably 55% by mass or less.

[0019] <Bisphenol AP type polycarbonate resin (B)> The resin composition of the present embodiment contains a bisphenol AP type polycarbonate resin (B). By containing the bisphenol AP type polycarbonate resin (B), a molded article having excellent heat resistance can be obtained. [ka]

[0020] The bisphenol AP type polycarbonate resin (B) refers to a polycarbonate resin in which the ratio of units represented by formula (B) is 50% by mass or more. The ratio of units represented by formula (B) in the bisphenol AP type polycarbonate resin (B) is preferably 60% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and even more preferably 90% by mass or more, and all units except for terminal groups may be units represented by formula (B).

[0021] The bisphenol AP type polycarbonate resin (B) may have other monomer units other than the unit represented by formula (B). Examples of dihydroxy compounds constituting such other monomer units include aromatic dihydroxy compounds described in paragraph 0014 of JP 2018-154819 A, the contents of which are incorporated herein by reference.

[0022] The bisphenol AP type polycarbonate resin (B) used in this embodiment may be a recycled bisphenol AP type polycarbonate resin product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a scrap generated when a molded product is produced from a resin composition.

[0023] The viscosity average molecular weight (Mv) of the bisphenol AP type polycarbonate resin (B) is preferably 8,000 or more, more preferably 10,000 or more, and may be 15,000 or more. By making it equal to or more than the lower limit, the heat resistance of the obtained molded article tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the bisphenol AP type polycarbonate resin (B) is preferably 40,000 or less, more preferably 30,000 or less, and even more preferably 25,000 or less. By making it equal to or less than the upper limit, the molding processability of the molded article tends to be further improved. Furthermore, from the viewpoint of further improving the transparency of the resin composition, it is preferably 18,000 or less, and more preferably 15,000 or less.

[0024] The glass transition temperature (Tg) of the bisphenol AP type polycarbonate resin (B) is preferably 165° C. or higher, more preferably 170° C. or higher, even more preferably 172° C. or higher, even more preferably 175° C. or higher, even more preferably 178° C. or higher, and even more preferably 180° C. or higher. The upper limit is preferably 210° C. or lower, more preferably 200° C. or lower, and even more preferably 195° C. or lower. The glass transition temperature (Tg) is measured by the following method. Using a differential scanning calorimeter (EXSTAR DSC7020, manufactured by SII NanoTechnology), approximately 5-10 mg of sample is heated from 40°C to 280°C at a heating rate of 20°C / min. After holding the temperature for 5 minutes, it is cooled to 40°C at a rate of 40°C / min. It is held at 40°C for 10 minutes and then heated again to 280°C at a rate of 10°C / min. From the DSC data obtained in the second heating, the midpoint glass transition temperature is taken as the glass transition temperature (Tg). When the resin composition contains two or more types of bisphenol AP type polycarbonate resins (B), the measured Tg of the mixture is regarded as the Tg of the bisphenol AP type polycarbonate resin (B).

[0025] In addition, as the bisphenol AP type polycarbonate resin, those described in paragraphs 0010 to 0018 of WO 2020 / 162419 can also be used, the contents of which are incorporated herein by reference.

[0026] In the resin composition of the present embodiment, the mass ratio (A) / (B) of the bisphenol A type polycarbonate resin (A) to the bisphenol AP type polycarbonate resin (B) is 0.8 or more. By making it equal to or more than the lower limit, the transparency of the molded article tends to be further improved. The mass ratio (A) / (B) is preferably 0.9 or more, and is preferably 6.0 or less, more preferably 5.0 or less, even more preferably 4.5 or less, even more preferably 4.0 or less, even more preferably 3.0 or less, and even more preferably 2.0 or less. By making it equal to or less than the upper limit, heat resistance tends to be further improved.

[0027] The total amount of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B) in the resin composition of this embodiment is preferably 65 mass% or more, more preferably 70 mass% or more, even more preferably 75 mass% or more, and even more preferably 78 mass% or more in the resin composition. By making it equal to or more than the lower limit, the heat resistance tends to be further improved. In addition, the total amount of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B) in the resin composition of this embodiment is preferably 95 mass% or less, more preferably 90 mass% or less, and may be 85 mass% or less in the resin composition. By making it equal to or less than the upper limit, the surface hardness of the molded article tends to be further improved. The resin composition of the present embodiment may use only one type of bisphenol A type polycarbonate resin (A) and / or two or more types of bisphenol AP type polycarbonate resin (B).

[0028] The resin composition of the present embodiment may or may not contain a polycarbonate resin other than the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). Examples of the other polycarbonate resins include bisphenol B type polycarbonate resin, bisphenol BP type polycarbonate resin, bisphenol C type polycarbonate resin, bisphenol E type polycarbonate resin, bisphenol M type polycarbonate resin, bisphenol P type polycarbonate resin, bisphenol PH type polycarbonate resin, bisphenol TMC type polycarbonate resin, and bisphenol Z type polycarbonate resin. The resin composition of the present embodiment preferably does not substantially contain any other polycarbonate resin than the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). "Substantially free" means that the content of the other polycarbonate resin is less than 10% by mass of the content of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B), preferably less than 5% by mass, more preferably less than 3% by mass, and even more preferably less than 1% by mass.

[0029] <(Meth)acrylic copolymer (C)> The resin composition of the present embodiment contains a (meth)acrylic copolymer (C). By containing the (meth)acrylic copolymer (C), the surface hardness of the obtained molded article can be increased. The (meth)acrylic copolymer (C) used in this embodiment preferably contains aromatic (meth)acrylate units and / or methyl (meth)acrylate units.

[0030] The (meth)acrylic copolymer (C) used in the present embodiment preferably contains an aromatic (meth)acrylate unit, which improves compatibility with the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B), and can further increase the transparency of the resulting molded article.

[0031] The aromatic (meth)acrylate unit preferably contains a unit represented by formula (1). [ka] (In formula (1), R 1 is a hydrogen atom or a methyl group, m1 is an integer of 0 to 10, and Ar is a substituted or unsubstituted aryl group.

[0032] R 1 is preferably a methyl group. m1 is preferably an integer of 5 or less, more preferably an integer of 3 or less, and further preferably 0 or 1. Ar is preferably a substituted or unsubstituted phenyl group. When Ar has a substituent, the substituent is preferably a halogen atom, a cyano group, a nitro group, a hydroxy group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkenyl group, an alkylsulfanyl group, an arylsulfanyl group, an acyl group or an amino group, more preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkenyl group or an acyl group, even more preferably an alkyl group, an aryl group, an aryloxy group or an alkenyl group, and even more preferably an aryl group. The formula weight of these substituents is preferably 15 or more, and is preferably 200 or less. For example, the formula weight is 15 for a methyl group (-CH3). These substituents may further have a substituent.

[0033] The aromatic (meth)acrylate unit more preferably contains a unit represented by formula (2). By containing the unit represented by formula (2), the transparency of the obtained molded article tends to be further improved. [ka] (In formula (2), X is a single bond, -C(R 2 )(R 3 R is a divalent group selected from the group consisting of -C(=O)-, -O-, -OC(=O)-, -OC(=O)O-, -S-, -SO-, -SO2-, and combinations of two or more thereof;1 is a hydrogen atom or a methyl group, and R 2 and R 3 are each independently a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a phenyl group, or a phenylphenyl group; R 2 and R 3 may be bonded to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are bonded, R 4 and R 5 are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a halogen atom, a phenyl group, or a phenylphenyl group, m2 is an integer of 1 to 10, p is an integer of 0 to 4, and q is an integer of 0 to 5.

[0034] X is a single bond, -C(R 2 )(R 3 )-, -C(=O)-, -O-, -SO-, or -SO2- is preferred, -CH2- or a single bond is more preferred, and a single bond is even more preferred. R 2 and R 3 are each preferably independently selected from a hydrogen atom, a methyl group, a methoxy group, a phenyl group, and a phenylphenyl group, and more preferably a hydrogen atom. 2 and R 3 may be linked to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are bonded, or may further form a cyclic alkyl group having 3 to 10 carbon atoms together with the carbon atom to which they are bonded. R 2 and R 3 are linked to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are attached, R 2 and R 3are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, or a cyclic alkoxy group having 3 to 10 carbon atoms. R 2 and R 3 are preferably not linked to each other to form a ring.

[0035] R 4 and R 5 are each independently preferably a methyl group, a methoxy group, a chloro group, a bromo group or a phenyl group, and more preferably a phenyl group. m2 is preferably an integer of 1 to 3, and more preferably 1. p is preferably an integer of 0 to 1, and more preferably 0. q is preferably an integer of 0 to 2, and more preferably 0.

[0036] Examples of the aromatic (meth)acrylate include phenyl (meth)acrylate, 4-phenylbenzyl (meth)acrylate, 3-phenylbenzyl (meth)acrylate, 2-phenylbenzyl (meth)acrylate, 4-biphenylbenzyl (meth)acrylate, 3-biphenylbenzyl (meth)acrylate, 2-biphenylbenzyl (meth)acrylate, 4-benzylbenzyl (meth)acrylate, 3-benzylbenzyl (meth)acrylate, 2-benzylbenzyl (meth)acrylate, 4-phenethylbenzyl (meth)acrylate, acrylate, 3-phenethylbenzyl (meth)acrylate, 2-phenethylbenzyl (meth)acrylate, 4-phenethylphenethyl (meth)acrylate, 3-phenethylphenethyl (meth)acrylate, 2-phenethylphenethyl (meth)acrylate, 4-(4-methylphenyl)benzyl (meth)acrylate, 3-(4-methylphenyl)benzyl (meth)acrylate, 2-(4-methylphenyl)benzyl (meth)acrylate, 4-(4-methoxyphenyl)benzyl (meth)acrylate, 3-(4-methoxyphenyl)benzyl (Meth)acrylate, 2-(4-methoxyphenyl)benzyl (meth)acrylate, 4-(4-bromophenyl)benzyl (meth)acrylate, 3-(4-bromophenyl)benzyl (meth)acrylate, 2-(4-bromophenyl)benzyl (meth)acrylate, 4-benzoylbenzyl (meth)acrylate, 3-benzoylbenzyl (meth)acrylate, 2-benzoylbenzyl (meth)acrylate, 4-(phenylsulfinyl)benzyl (meth)acrylate, 3-(phenylsulfinyl)benzyl (meth)acrylate, 2-(phenylsulfinyl)benzyl (meth)acrylate, 4-(phenylsulfonyl)benzyl (meth)acrylate, 3-(phenylsulfonyl)benzyl (meth)acrylate, 2-(phenylsulfonyl)benzyl (meth)acrylate, 4-((phenoxycarbonyl)oxy)benzyl (meth)acrylate, 3-((phenoxycarbonyl)oxy)benzyl (meth)acrylate, 2-((phenoxycarbonyl)oxy)benzyl (meth)acrylate, 4-(((meth)acryloxy)methyl)phenylbenzoate,3-(((meth)acryloxy)methyl)phenyl benzoate, 2-(((meth)acryloxy)methyl)phenyl benzoate, phenyl 4-(((meth)acryloxy)methyl)benzoate, phenyl 3-(((meth)acryloxy)methyl)benzoate, phenyl 2-(((meth)acryloxy)methyl)benzoate, 4-(1-phenylcyclohexyl)benzyl (meth)acrylate, 3-(1-phenylcyclohexyl)benzyl (meth)acrylate, 2 -(1-phenylcyclohexyl)benzyl (meth)acrylate, 4-phenoxybenzyl (meth)acrylate, 3-phenoxybenzyl (meth)acrylate, 2-phenoxybenzyl (meth)acrylate, 4-(phenylthio)benzyl (meth)acrylate, 3-(phenylthio)benzyl (meth)acrylate, 2-(phenylthio)benzyl (meth)acrylate and 3-methyl-4-(2-methylphenyl)benzyl methacrylate can be mentioned. In this embodiment, phenyl(meth)acrylate and 4-phenylbenzyl(meth)acrylate are preferred, with 4-phenylbenzyl(meth)acrylate being more preferred.

[0037] When the (meth)acrylic copolymer (C) contains an aromatic (meth)acrylate unit, the content thereof in the (meth)acrylic copolymer (C) is preferably 5% by mass or more, more preferably 8% by mass or more, even more preferably 10% by mass or more, even more preferably 12% by mass or more, and may be 16% by mass or more depending on the application. By making it equal to or more than the lower limit, the compatibility with the polycarbonate resin tends to be further improved. In addition, the upper limit of the content of the aromatic (meth)acrylate unit in the (meth)acrylic copolymer (C) is preferably 35% by mass or less, more preferably 30% by mass or less, even more preferably 25% by mass or less, even more preferably 22% by mass or less, and may be 18% by mass or less depending on the application. By making it equal to or less than the upper limit, the surface hardness of the molded article tends to be further improved. The resin composition of the present embodiment may contain only one type of aromatic (meth)acrylate unit, or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0038] On the other hand, the (meth)acrylic copolymer (C) used in the present embodiment preferably contains methyl (meth)acrylate units, which can further increase the surface hardness of the resulting molded article. When the (meth)acrylic copolymer (C) contains methyl (meth)acrylate units, the content thereof in the (meth)acrylic copolymer (C) is preferably 65% ​​by mass or more, more preferably 70% by mass or more, even more preferably 75% by mass or more, and even more preferably 78% by mass or more. By making it equal to or more than the lower limit, the surface hardness of the molded product tends to be further improved. In addition, the upper limit of the content of the methyl (meth)acrylate units in the (meth)acrylic copolymer (C) is preferably 95% by mass or less, more preferably 92% by mass or less, even more preferably 90% by mass or less, even more preferably 85% by mass or less, and even more preferably 82% by mass or less. By making it equal to or less than the upper limit, the compatibility with the polycarbonate resin tends to be further improved. The (meth)acrylic copolymer (C) used in the present embodiment may contain either a methyl methacrylate unit or a methyl acrylate unit (for example, a methyl methacrylate unit), or may contain both. The mass ratios of methyl methacrylate units and methyl acrylate units in the (meth)acrylic copolymer (C) are preferably 1 to 100 mass% of methyl methacrylate units and 99 to 0 mass% of methyl acrylate units, more preferably 50 to 100 mass% of methyl methacrylate units and 50 to 0 mass% of methyl acrylate units, and even more preferably 80 to 99 mass% of methyl methacrylate units and 20 to 1 mass% of methyl acrylate units, in a total of 100 mass% of methyl methacrylate units and methyl acrylate units.

[0039] The (meth)acrylic copolymer (C) used in the present embodiment preferably contains 5 to 35 mass% of aromatic (meth)acrylate units and 95 to 65 mass% of methyl (meth)acrylate units, more preferably in the same range as the above-mentioned aromatic (meth)acrylate unit content and methyl (meth)acrylate unit content in the above-mentioned (meth)acrylic copolymer (C).

[0040] The (meth)acrylic copolymer (C) used in this embodiment may or may not contain other monomer units than aromatic (meth)acrylate units and methyl (meth)acrylate. Examples of other monomer units include aliphatic methacrylates other than methyl methacrylate, such as ethyl methacrylate, butyl methacrylate, propyl methacrylate, and 2-ethylhexyl methacrylate; aliphatic acrylates other than methyl acrylate, such as ethyl acrylate, butyl acrylate, propyl acrylate, 2-ethylhexyl acrylate, and glycidyl acrylate; vinyl cyanide monomers such as acrylonitrile and methacrylonitrile; diene monomers such as butadiene, isoprene, and dimethylbutadiene; vinyl methyl ether, vinyl ethyl ether, and the like. vinyl ether-based monomers; vinyl carboxylic acid-based vinyl monomers such as vinyl acetate and vinyl butyrate; olefin-based monomers such as ethylene, propylene, and isobutylene; ethylenically unsaturated carboxylic acid monomers such as acrylic acid, methacrylic acid, maleic acid, and itaconic acid; halogenated vinyl monomers such as vinyl chloride and vinylidene chloride; maleimide-based monomers such as maleimide, N-phenylmaleimide, N-cyclohexylmaleimide, and N-methylmaleimide; allyl (meth)acrylate, divinylbenzene, and 1,3-butylene dimethacrylate.

[0041] In the (meth)acrylic copolymer (C) used in this embodiment, the total of aromatic (meth)acrylate units and methyl (meth)acrylate units preferably accounts for 90 mass% or more, more preferably 95 mass% or more, and even more preferably 98 mass% or more, of 100 mass% of all monomer units.

[0042] The (meth)acrylic copolymer (C) used in this embodiment may be a recycled product (including recovered products, material recycled products, chemical recycled products, etc.) of the (meth)acrylic copolymer (C), a rejected product, or a scrap generated when a molded product is produced from the resin composition.

[0043] The mass average molecular weight of the (meth)acrylic copolymer (C) used in this embodiment is preferably 5,000 or more, more preferably 8,000 or more, and even more preferably 10,000 or more, and is preferably 500,000 or less, more preferably 100,000 or less, even more preferably 50,000 or less, even more preferably 30,000 or less, and even more preferably 20,000 or less. By making it equal to or more than the lower limit, the gas generated during molding tends to be further reduced. By making it equal to or less than the upper limit, the compatibility with polycarbonate resin tends to be further improved. When the resin composition of the present embodiment contains two or more types of (meth)acrylic copolymers (C), the weight average molecular weight is the mass average molecular weight of the mixture. The mass average molecular weight is a polystyrene-equivalent value measured by GPC (gel permeation chromatography) using a Tosoh HLC-8320GPC EcoSEC with tetrahydrofuran as a solvent and Shodex KF-G, KF-805L x 3, KF-800D columns at a column temperature of 40°C and a flow rate of 1.2 mL / min at a detection wavelength of 254 nm.

[0044] The content of the (meth)acrylic copolymer (C) in the resin composition of this embodiment is 5 parts by mass or more, preferably 8 parts by mass or more, more preferably 10 parts by mass or more, relative to 100 parts by mass of the total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). When surface hardness is more important, it may be 15 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, or 30 parts by mass or more. The upper limit of the content of the (meth)acrylic copolymer (C) is 60 parts by mass or less, preferably 55 parts by mass or less, relative to 100 parts by mass of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). When transparency and a low YI value are more important, it is more preferably 50 parts by mass or less, more preferably 45 parts by mass or less, even more preferably 40 parts by mass or less, even more preferably 35 parts by mass or less, and may be 30 parts by mass or less depending on the application. The resin composition of the present embodiment may contain only one type of (meth)acrylic copolymer (C), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0045] <Other ingredients> The resin composition of the present embodiment may contain other components as necessary, as long as the desired physical properties are not significantly impaired. Examples of the other components include thermoplastic resins other than the bisphenol A polycarbonate resin (A), the bisphenol AP polycarbonate resin (B), and the (meth)acrylic copolymer (C), various resin additives, etc. Examples of resin additives include release agents, stabilizers (thermal stabilizers, antioxidants, etc.), antistatic agents, flame retardants, UV absorbers, flame retardant assistants, dyes, pigments, antifogging agents, antiblocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc. The resin additives may be contained alone or in any combination and ratio of two or more. For information on the antistatic agent, refer to paragraphs 0063 to 0067 of JP2016-216534A, the contents of which are incorporated herein by reference. For flame retardants, the descriptions in paragraphs 0068 to 0075 of JP2016-216534A can be referred to, the contents of which are incorporated herein by reference. In addition to the above, details of these components can be found in paragraphs 0107 to 0115 of JP 2014-136710 A, paragraphs 0106 to 0128 of JP 2015-117298 A, paragraphs 0055 to 0061 of JP 2018-095706 A, and paragraphs 0047 to 0103 of WO 2021 / 241471 A. The contents of these are incorporated herein by reference. When contained, the content of the other components in the resin composition is, for example, 0.001 mass % or more and, for example, 5.0 mass % or less, preferably 3.0 mass % or less, and more preferably 1.0 mass % or less.

[0046] <<Release agent>> The resin composition of the present embodiment may contain a release agent. Examples of the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbons having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred.

[0047] Examples of the aliphatic carboxylic acid include saturated or unsaturated aliphatic mono-, di- or tri-carboxylic acids. Here, the aliphatic carboxylic acid also includes alicyclic carboxylic acids. Among these, preferred aliphatic carboxylic acids are mono- or di-carboxylic acids having 6 to 36 carbon atoms, and more preferred are saturated aliphatic mono-carboxylic acids having 6 to 36 carbon atoms. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachic acid, behenic acid, lignoceric acid, cerotic acid, melissic acid, tetratriacontanoic acid, montanic acid, adipic acid, and azelaic acid. Examples of the salts of aliphatic carboxylic acids include sodium salts, potassium salts, calcium salts, and magnesium salts.

[0048] The aliphatic carboxylic acid in the ester of aliphatic carboxylic acid and alcohol can be, for example, the same as the aliphatic carboxylic acid. On the other hand, the alcohol can be, for example, saturated or unsaturated monohydric or polyhydric alcohol. These alcohols may have a substituent such as a fluorine atom or an aryl group. Among these, monohydric or polyhydric saturated alcohols having 30 or less carbon atoms are preferred, and aliphatic or alicyclic saturated monohydric alcohols or aliphatic saturated polyhydric alcohols having 30 or less carbon atoms are more preferred. Specific examples of such alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, and dipentaerythritol. Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture containing myricyl palmitate as a main component), stearyl stearate, behenyl behenate, behenyl stearate, glycerin monopalmitate, glycerin monostearate, glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate.

[0049] Examples of aliphatic hydrocarbons having a number average molecular weight of 200 to 15,000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomers having 3 to 12 carbon atoms. The aliphatic hydrocarbons also include alicyclic hydrocarbons. The number average molecular weight of the aliphatic hydrocarbons is preferably 5,000 or less. Among these, paraffin wax, polyethylene wax, or partial oxides of polyethylene wax are preferred, and paraffin wax and polyethylene wax are more preferred. For details about the release agent, please refer to paragraphs 0055 to 0061 of JP2018-095706A, the contents of which are incorporated herein by reference.

[0050] When the resin composition of the present embodiment contains a release agent, the content thereof in the resin composition is preferably 0.05 to 3 mass %, more preferably 0.1 to 0.8 mass %, and even more preferably 0.1 to 0.6 mass %. The resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0051] <<Stabilizer>> The resin composition of the present embodiment may contain a stabilizer. The stabilizers include heat stabilizers and antioxidants. Examples of the stabilizer include a phenol-based stabilizer, an amine-based stabilizer, a phosphorus-based stabilizer, a thioether-based stabilizer, etc. Among them, in the present embodiment, a phosphorus-based stabilizer and a phenol-based stabilizer are preferred, and a phosphorus-based stabilizer is more preferred. Any known phosphorus stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2 metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds being particularly preferred.

[0052] Examples of organic phosphite compounds include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl / dinonyl phenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyl diphenyl phosphite, dioctyl monophenyl phosphite, monodecyl diphenyl phosphite, didecyl monophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite. Specific examples of such organic phosphite compounds include "ADK STAB (registered trademark; the same applies below) 1178," "ADK STAB 2112," and "ADK STAB HP-10" manufactured by ADEKA Corporation, "JP-351," "JP-360," and "JP-3CP" manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies below) 168" manufactured by BASF.

[0053] As the phenol-based stabilizer, a hindered phenol-based stabilizer is preferably used. Specific examples of hindered phenol stabilizers include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(mesityle) 4,6-bis(octylthiomethyl)-o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl -4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like.

[0054] Among them, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol stabilizers include "Irganox (registered trademark, the same applies below) 1010" and "Irganox 1076" manufactured by BASF, and "Adeka STAB AO-50" and "Adeka STAB AO-60" manufactured by ADEKA.

[0055] The content of the stabilizer in the resin composition of the present embodiment is usually 0.001% by mass or more, preferably 0.005% by mass or more, more preferably 0.01% by mass or more, and usually 1% by mass or less, preferably 0.5% by mass or less, more preferably 0.3% by mass or less. By setting the content of the stabilizer in the above range, the effect of adding the stabilizer is more effectively exhibited. The resin composition of the present embodiment may contain only one type of stabilizer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0056] <Physical properties of resin composition> The resin composition of the present embodiment preferably has excellent heat resistance. Specifically, when the resin composition of this embodiment is molded into an ISO test piece having a thickness of 4 mm and a load of 1.80 MPa is applied, the deflection temperature under load is preferably 105° C. or higher, more preferably 106° C. or higher, even more preferably 111° C. or higher, and even more preferably 112° C. or higher. There is no particular upper limit for the deflection temperature under load, but a temperature of 150° C. or lower is practical, and even a temperature of 140° C. or lower will sufficiently satisfy the required performance. The heat resistance is achieved mainly by using the bisphenol AP type polycarbonate resin (B).

[0057] The resin composition of the present embodiment preferably has excellent transparency. Specifically, when the resin composition of the present embodiment is molded to a thickness of 3 mm, the total light transmittance is preferably 80% or more, and more preferably 85% or more. There is no particular upper limit to the total light transmittance, but even if it is 99% or less, the required performance is sufficiently satisfied. In addition, the resin composition of the present embodiment preferably has a haze of 5% or less, more preferably 4% or less, even more preferably 3% or less, still more preferably 2% or less, even more preferably 1.5% or less, and even more preferably 1% or less, when the resin composition is molded into a test piece having a thickness of 3 mm. The lower limit of the haze is not particularly set, but even if it is more than 0%, the required performance is sufficiently satisfied. The excellent transparency is achieved by adjusting the monomer composition of the acrylic copolymer (C) or the like.

[0058] The resin composition of the present embodiment preferably has a low yellowness index. Specifically, when the resin composition of the present embodiment is molded to a thickness of 3 mm, the YI value is preferably 5.0 or less, more preferably 4.5 or less, even more preferably 3.5 or less, still more preferably 3.0 or less, and even more preferably 2.5 or less. There is no particular lower limit for the YI value, but a value of 0.1 or more is practical, and even a value of 0.2 or more satisfies the required performance. The YI value can be achieved by adjusting the content of the bisphenol AP type polycarbonate resin (B), as well as by adjusting the extrusion conditions and adding an antioxidant or a bluing agent.

[0059] The resin composition of the present embodiment preferably has high surface hardness. Specifically, the resin composition of the present embodiment preferably has a pencil hardness of HB or more, more preferably F or more, measured according to ISO 15184. There is no particular upper limit, but a practical upper limit is 3H or less. Such a high pencil hardness can be achieved by using the (meth)acrylic copolymer (C), for example.

[0060] <Method of producing resin composition> The method for producing the resin composition of the present embodiment includes melt-kneading a bisphenol A type polycarbonate resin (A), a bisphenol AP type polycarbonate resin (B), and a (meth)acrylic copolymer (C). More specifically, the method for producing the resin composition of this embodiment includes a method in which the bisphenol A polycarbonate resin (A), the bisphenol AP polycarbonate resin (B), the (meth)acrylic copolymer (C), and other components that are added as necessary are premixed using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, a kneader, etc. The temperature for melt-kneading is not particularly limited, but is usually in the range of 240 to 320°C.

[0061] <Molded products> The above-mentioned resin composition (e.g., pellets) is molded into a molded article by various molding methods. That is, the molded article of the present embodiment is formed from the resin composition of the present embodiment. The shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article, and examples thereof include film-like, rod-like, cylindrical, annular, circular, elliptical, polygonal, irregular, hollow, frame-like, box-like, panel-like, and button-like shapes.

[0062] The method for forming the molded article is not particularly limited, and a conventionally known molding method can be adopted, for example, injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding) molding, rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, pressure molding, etc. In particular, the resin composition of this embodiment is suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding. However, it goes without saying that the resin composition of this embodiment is not limited to molded articles obtained by these methods.

[0063] The molded article of the present embodiment can be suitably used for parts of electric and electronic devices, office automation equipment, portable information terminals, machine parts, home appliances, vehicle parts, various containers, lighting equipment, displays, and the like. In particular, it is preferably used in applications such as display panels that require high heat resistance, high hardness, and high transparency. EXAMPLES

[0064] The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0065] 1.Raw materials The following raw materials were used: [Table 1]

[0066] 2. Examples 1 to 9 and Comparative Examples 1 to 7 The components shown in Table 1 above were blended in the ratios shown in Tables 2 to 4 below (each component in Tables 2 to 4 is in parts by mass), mixed in a tumbler for 20 minutes, and then melt-kneaded using a twin-screw extruder ("TEM-26SX" manufactured by Shibaura Machine Co., Ltd.) at a cylinder temperature of 260°C and a discharge rate of 25 kg / h, and a resin composition (pellets) was obtained by strand cutting.

[0067] <Deflection temperature under load> The pellets obtained above were dried in a hot air circulation dryer at 120°C for 5 hours. Then, an ISO multipurpose test piece (Type A1, 4 mm thick) conforming to JIS-K7139 was molded in an injection molding machine under the conditions of a cylinder temperature of 290°C, a mold temperature of 80°C, and a molding cycle of 45 seconds. The injection molding machine used was "NEX80" (product name) manufactured by Nissei Plastic Industrial Co., Ltd. Using the above ISO multi-purpose test piece (Type A1, 4 mm thick), in accordance with ISO 75-1, the heat deflection temperature (unit: °C) was measured under the condition of a load of 1.80 MPa (Method A) using an HDT test apparatus. As the HDT (heat deflection temperature) test apparatus, "AUTO HDT Tester 6A-2V" (trade name) manufactured by Toyo Seiki Seisakusho Co., Ltd. was used.

[0068] <Total light transmittance and haze> The pellets obtained above were dried at 120 °C for 5 hours using a hot air circulation dryer. Then, using an injection molding machine, a two-stage plate test piece (120 mm × 35 mm) with a thickness of 2 mm / 3 mm was molded under the conditions of a cylinder temperature of 300 °C, a mold temperature of 80 °C, and a molding cycle of 45 seconds. As the injection molding machine, "J55AD" (trade name) manufactured by Japan Steel Works, Ltd. was used. Using a haze meter, for the 3 mm thick part of the two-stage plate test piece, in accordance with JIS-K-7361 and JIS-K-7136, under the conditions of a D65 light source and a 10° field of view, the total light transmittance (%) and haze (%) of the plate-like test piece obtained by injection molding were measured.

[0069] <YI value> For the 3 mm part of the 2 mm thick / 3 mm thick two-stage plate test piece obtained above, the YI value was measured in accordance with ASTM E313-05 (D65).

[0070] <Measurement of pencil hardness> For the 2 mm thick part of the 2 mm thick / 3 mm thick two-stage plate test piece obtained above, in accordance with ISO 15184, using a pencil hardness tester, the pencil hardness measured at a load of 750 g was determined. The pencil hardness tester used was manufactured by Toyo Seiki Seisakusho Co., Ltd.

[0071] The results are shown in Tables 2 to 4 below.

Table 2

[0072] [Table 3]

[0073] [Table 4]

[0074] As is clear from the above results, the resin compositions of the present invention were excellent in heat resistance, high in transmittance, and excellent in surface hardness (Examples 1 to 9). In contrast, when the mass ratio (A) / (B) of the bisphenol A type polycarbonate resin (A) to the bisphenol AP type polycarbonate resin (B) was less than 0.8 (Comparative Examples 1 to 3), the total light transmittance was low, the haze was high, and the YI value was high. When the bisphenol A type polycarbonate resin (A) was not included (Comparative Example 4), the total light transmittance was low, the haze was high, and the YI value was high. When the (meth)acrylic copolymer (C) was not included (Comparative Examples 5 and 6), the pencil hardness was low. When the bisphenol AP type polycarbonate resin (B) was not included (Comparative Example 7), the deflection temperature under load was low.

Claims

1. The polycarbonate composition according to claim 1, wherein the (meth)acrylic copolymer (C) is contained in an amount of 5 to 60 parts by mass per 100 parts by mass of the total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B), and A resin composition, in which the mass ratio (A) / (B) of a bisphenol A type polycarbonate resin (A) to a bisphenol AP type polycarbonate resin (B) is 0.8 or more.

2. The resin composition according to claim 1 , wherein the (meth)acrylic copolymer (C) contains aromatic (meth)acrylate units and methyl (meth)acrylate units.

3. The resin composition according to claim 1, wherein the (meth)acrylic copolymer (C) contains 5 to 35 parts by mass of aromatic (meth)acrylate units and 95 to 65 parts by mass of methyl (meth)acrylate units.

4. The resin composition according to claim 2 or 3, wherein the aromatic (meth)acrylate unit comprises a unit represented by formula (1). 【Chemistry 1】 (In formula (1), R 1 is a hydrogen atom or a methyl group, m1 is an integer of 0 to 10, and Ar is a substituted or unsubstituted aryl group.

5. The resin composition according to claim 2 or 3, wherein the aromatic (meth)acrylate unit comprises a unit represented by formula (2). 【Chemistry 2】 (In formula (2), X is a single bond, -C(R 2 ) (R 3 )-, -C(=O)-, -O-, -OC(=O)-, -OC(=O)O-, -S-, -SO-, -SO 2 -, and a combination of two or more thereof; R 1 is a hydrogen atom or a methyl group, R 2 and R 3 are each independently a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a phenyl group, or a phenylphenyl group; R 2 and R 3 may be bonded to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are attached, R 4 and R 5 are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a halogen atom, a phenyl group, or a phenylphenyl group, m2 is an integer of 1 to 10, p is an integer of 0 to 4, and q is an integer of 0 to 5.

6. The (meth)acrylic copolymer (C) is contained in an amount of 5 to 35 parts by mass per 100 parts by mass of the total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). The resin composition according to any one of claims 1 to 3.

7. The (meth)acrylic copolymer (C) contains 5 to 35 parts by mass of aromatic (meth)acrylate units and 95 to 65 parts by mass of methyl (meth)acrylate units; The aromatic (meth)acrylate unit contains a unit represented by formula (2): The (meth)acrylic copolymer (C) is contained in an amount of 5 to 35 parts by mass per 100 parts by mass of the total of the bisphenol A type polycarbonate resin (A) and the bisphenol AP type polycarbonate resin (B). The resin composition according to claim 1. 【Chemistry 3】 (In formula (2), X is a single bond, -C(R 2 ) (R 3 )-, -C(=O)-, -O-, -OC(=O)-, -OC(=O)O-, -S-, -SO-, -SO 2 -, and a combination of two or more thereof; R 1 is a hydrogen atom or a methyl group, R 2 and R 3 are each independently a hydrogen atom, a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a phenyl group, or a phenylphenyl group; R 2 and R 3 may be bonded to each other to form a ring having 3 to 10 carbon atoms together with the carbon atom to which they are attached, R 4 and R 5 are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkoxy group having 1 to 10 carbon atoms, a branched alkoxy group having 3 to 10 carbon atoms, a cyclic alkoxy group having 3 to 10 carbon atoms, a halogen atom, a phenyl group, or a phenylphenyl group, m2 is an integer of 1 to 10, p is an integer of 0 to 4, and q is an integer of 0 to 5.

8. The resin composition is molded into an ISO test piece having a thickness of 4 mm, and the deflection temperature under load when a load of 1.80 MPa is applied is 105° C. or higher. The resin composition according to any one of claims 1 to 3 and 7.

9. The resin composition according to any one of claims 1 to 3 and 7, wherein the haze of the resin composition when molded into a test piece having a thickness of 3 mm is 1.5% or less.

10. A pellet of the resin composition according to any one of claims 1 to 3 and 7.

11. A molded article formed from the resin composition according to any one of claims 1 to 3 and 7.

12. A molded article formed from the pellets of claim 10.

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