Photosensitive resin composition, photosensitive resin layer using the same, display device, and method of manufacturing photosensitive resin layer

Abstract

To provide a photosensitive resin composition that is sufficiently curable even at low temperatures, effectively forms high-resolution patterns, and can ensure high color reproducibility and a wide viewing angle.SOLUTION: The present invention provides: an antioxidant-free photosensitive resin composition including (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator and (E) a solvent, wherein the colorant is included in an amount of 80 wt.% to 95 wt.% based on the total weight of the photosensitive resin composition, the polymerization initiator is included in an amount of 0.65 wt.% to 1.3 wt.% based on the total weight of the photosensitive resin composition, the colorant comprises a green pigment and a yellow pigment, and the green pigment is included in an amount of greater than or equal to 50 wt.%, based on the total weight of the colorant; a photosensitive resin layer made using the same; a display device including the photosensitive resin layer; and a method of manufacturing a photosensitive resin layer.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film using the same, a display device, and a method for producing the photosensitive resin film. [Background technology]

[0002] In recent years, there has been growing interest in self-emitting (emissive) micro OLED display panels that emit light themselves as display panels applied to VR (Virtual Reality), AR (Augmented Reality) and MR (Mixed Reality) devices. OLED stands for Organic-Light Emitting Diode, and micro OLED refers to an OLED that is about 10 times smaller than a general OLED, as explained below.

[0003] In the case of micro OLED display panels, whose pixels are about 10 times smaller than those of general OLED display panels, it is difficult to precisely form the red (R) / green (G) / blue (B) light-emitting layers using conventional fine metal mask (FMM) technology. In other words, in order to apply conventional LCD displays to devices such as VR and AR, the size of the color filter pattern is large, making it difficult to increase the resolution.

[0004] In recent years, OLEDos (OLED on Silicon) technology has been introduced to achieve a high resolution of over 4000ppi. This technology uses OLEDs deposited on a silicon wafer as a backlight and patterns a color filter on it. Conventional color filters used in LCD displays have a pattern of about 100μm formed on glass, and are hardened through exposure and a high-temperature post-bake process of over 230℃. On the other hand, color filters formed on OLEDos cannot go through a high-temperature process because they are OLEDs, so they must be hardened at low temperatures, and it is also important that they are finely patterned to increase the resolution. VR, AR, and MR devices are small in size, so fine patterning is essential to achieve the desired resolution within them.

[0005] However, since hardening only occurs at low temperatures (below 100°C), it is difficult to form high-resolution patterns using color filters made from conventional materials, and it is also difficult to ensure sufficient color reproduction and viewing angle. Summary of the Invention [Problem to be solved by the invention]

[0006] An embodiment of the present invention provides a photosensitive resin composition that is sufficiently cured even at low temperatures, has excellent high-resolution pattern formability, and can ensure high color reproduction and viewing angle.

[0007] Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

[0008] Yet another embodiment provides a display device including the above photosensitive resin film.

[0009] Yet another embodiment provides a method for producing the above photosensitive resin film. [Means for solving the problem]

[0010] One embodiment of the present invention provides an antioxidant-free photosensitive resin composition comprising: (A) a binder resin; (B) a colorant; (C) a polymerizable monomer; (D) a polymerization initiator; and (E) a solvent, the colorant and the polymerization initiator being contained in an amount of 80% by weight to 95% by weight and 0.65% by weight to 1.3% by weight, respectively, based on the total amount of the photosensitive resin composition; the colorants include a green pigment and a yellow pigment; and the green pigment is contained in an amount of 50% by weight or more based on the total amount of the colorants.

[0011] The green pigment and the yellow pigment may each be contained independently in the form of a pigment dispersion.

[0012] The binder resin may be an acrylic binder resin.

[0013] The acrylic binder resin may have an acid value of 50 KOHmg / g or more and a weight average molecular weight of 7000 g / mol or less.

[0014] The acrylic binder resin may have a double bond equivalent of 360 g / mol or more.

[0015] The polymerizable monomer can include one or more compounds that contain three or more functional groups.

[0016] The polymerizable monomer is a mixture of two compounds, and each of the two compounds may independently be a compound containing three or more functional groups.

[0017] The two compounds may be mixed with each other in a 1:1 ratio by weight.

[0018] The polymerizable monomer may be contained in a content greater than that of the binder resin.

[0019] The photosensitive resin composition may have a half-width of less than 105 nm.

[0020] The photosensitive resin composition may have a transmittance at 630 nm of less than 8%.

[0021] The photosensitive resin composition can contain, relative to the total amount of the photosensitive resin composition, 1% by weight to 5% by weight of the (A) binder resin, 80% by weight to 95% by weight of the (B) colorant, 1% by weight to 10% by weight of the (C) polymerizable monomer, 0.65% by weight to 1.3% by weight of the (D) polymerization initiator, and a remaining amount of the (E) solvent.

[0022] The photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof.

[0023] The photosensitive resin composition may be a composition for a micro OLED display device.

[0024] Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

[0025] Yet another embodiment provides a display device including the above photosensitive resin film.

[0026] The display device may be a micro OLED display device including an OLED substrate deposited on a silicon wafer, and a color filter layer laminated on the OLED substrate to convert white light generated by the OLED substrate into a plurality of color lights, the color filter layer including a red color filter, a green color filter and a blue color filter.

[0027] Yet another embodiment provides a method for producing a photosensitive resin film, the method including the steps of: applying a photosensitive resin composition; pre-baking the composition at a temperature of 100° C. or less after the application; exposing the composition to an i-line after the pre-baking; and developing the composition.

[0028] Other specific details of the embodiment of the present invention are included in the following detailed description. Effect of the Invention

[0029] The photosensitive resin composition according to one embodiment of the present invention can be cured at a low temperature of 100°C or less, and can ensure high resolution by realizing fine patterns, and has excellent spectral characteristics and a wide color range. In particular, when pre-baking at 100°C or less, it has excellent color characteristics even with temperature and photo-curing only (i-line exposure) and is suitable for application to micro OLED display devices because it can realize fine patterns. [Brief description of the drawings]

[0030] [Figure 1] 1 is a graph showing the optical spectra of photosensitive resin compositions according to Example 1 and Comparative Example 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] Hereinafter, the implementation of the present invention will be described in detail, but this is presented as an example and is not intended to limit the present invention, and an embodiment of the present invention is not limited to what is defined by the claims below.

[0032] In this specification, unless otherwise specified, an "alkyl group" means a C1 to C20 alkyl group, an "alkenyl group" means a C2 to C20 alkenyl group, a "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, a "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, an "aryl group" means a C6 to C20 aryl group, an "arylalkyl group" means a C6 to C20 arylalkyl group, an "alkylene group" means a C1 to C20 alkylene group, an "arylene group" means a C6 to C20 arylene group, an "alkylarylene group" means a C6 to C20 alkylarylene group, a "heteroarylene group" means a C3 to C20 heteroarylene group, and an "alkoxyylene group" means a C1 to C20 alkoxyylene group.

[0033] In this specification, unless otherwise specified, "substituted" means that at least one hydrogen atom is substituted with a substituent selected from the group consisting of a halogen atom (F, Cl, Br, I), a hydroxy group, a C1-C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, phosphoric acid or a salt thereof, a C1-C20 alkyl group, a C2-C20 alkenyl group, a C2-C20 alkynyl group, a C6-C20 aryl group, a C3-C20 cycloalkyl group, a C3-C20 cycloalkenyl group, a C3-C20 cycloalkynyl group, a C2-C20 heterocycloalkyl group, a C2-C20 heterocycloalkenyl group, a C2-C20 heterocycloalkynyl group, a C3-C20 heteroaryl group, or a combination thereof.

[0034] In this specification, unless otherwise specified, "hetero" means that at least one heteroatom selected from the group consisting of N, O, S and P is contained in the chemical formula.

[0035] Furthermore, in this specification, unless otherwise specified, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0036] In this specification, unless otherwise defined, "combination" means a mixture or copolymerization, "copolymerization" means block copolymerization or random copolymerization, and "copolymer" means block copolymerization or random copolymerization.

[0037] In the chemical formulae shown in this specification, unless otherwise defined, when a chemical bond is not drawn at a position where a chemical bond should be shown, it means that a hydrogen atom is bonded at that position.

[0038] In this specification, unless otherwise defined, "*" means a moiety linked to the same or different atom or chemical formula.

[0039] A photosensitive resin composition according to one embodiment does not contain an antioxidant, i.e., is an antioxidant-free composition, and contains (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent, in which the colorant and the polymerization initiator are contained in amounts of 80% by weight to 95% by weight and 0.65% by weight to 1.3% by weight, respectively, relative to the total amount of the photosensitive resin composition, and the colorant includes a green pigment and a yellow pigment, and the green pigment is contained in an amount of 50% by weight or more relative to the total amount of the colorants.

[0040] Conventionally, color photoresists are negative photosensitive liquid materials that are realized in red, green, and blue color patterns, and technical development has been carried out in the direction of gradually changing the composition of the liquid material. For example, efforts have been made to improve color purity by changing the type and content of the pigment dispersion liquid, which is the color material that realizes the color pattern, to improve patterning by changing the composition of the binder resin and photopolymerization initiator, and to improve coating properties and color uniformity by using other additives such as leveling agents.

[0041] One embodiment of the present invention relates to a photosensitive resin composition that is applied to a color filter process used in a micro OLED display device, unlike a conventional color photoresist, and specifically, a green photosensitive resin composition that is applied to a green color filter process.

[0042] Micro OLED means a WOLED (White OLED) deposited on a silicon wafer. Inventors sometimes call it OLEDoS (Organic-Light Emitting Diode on Silicon). And micro OLED display device means a display device to which micro OLED is applied.

[0043] With the advent of the 4th Industrial Revolution, the metaverse market is growing rapidly, and there is a growing need to develop display devices that improve the realism and visibility of AR, VR, and MR devices and minimize the induction of vertigo. For this purpose, there are various candidate technologies such as LCoS (Liquid Crystal on Silicon), LEDoS (Light Emitting Diode on Silicon), and OLEDoS (Organic-Light Emitting Diode on Silicon). Among these, OLEDoS technology development is progressing rapidly in various places due to its advantages of high light-dark ratio, fast response speed, and being self-luminous, which allows the volume and weight of devices to be reduced with a relatively simple optical system.

[0044] In the case of OLEDoS, there are many difficulties in development because a high-resolution microdisplay needs to be realized, so pixels of several μm units, which are very small compared to conventional displays, must be formed, and color filters must be formed through a low-temperature process to avoid damaging the lower OLED.

[0045] Under such circumstances, the present inventors have developed a composition that does not contain an antioxidant by controlling the content of the colorant and polymerization initiator, and further controlling the content of the green pigment in the colorant, in order to realize low-temperature curing and fine patterns, thereby completing a photosensitive resin composition that can be cured at a low temperature of 100° C. or less, realizes fine patterns, and has excellent color uniformity. Due to such characteristics, the photosensitive resin composition according to one embodiment can be applied to next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) displays, for example, micro OLED displays.

[0046] Each component will be specifically described below.

[0047] (A) Binder resin The binder resin may include an acrylic binder resin. For example, the binder resin may be an acrylic binder resin.

[0048] The acrylic binder resin is a resin containing one or more acrylic repeating units in a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith.

[0049] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxy groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof.

[0050] The first ethylenically unsaturated monomer may be contained in an amount of 5% by weight to 50% by weight, for example 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

[0051] Examples of the second ethylenically unsaturated monomer include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyl toluene, and vinyl benzyl methyl ether; unsaturated carboxylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylate amino alkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylate vinyl ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylate glycidyl ester compounds such as glycidyl (meth)acrylate; cyanide vinyl compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These can be used alone or in combination of two or more.

[0052] Specific examples of acrylic binder resins include (meth)acrylic acid / benzyl methacrylate copolymers, (meth)acrylic acid / benzyl methacrylate / styrene copolymers, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymers, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymers, and the like, but are not limited thereto. These may be used alone or in combination of two or more kinds.

[0053] The acrylic binder resin may have a weight average molecular weight of 7,000 g / mol or less, for example, a weight average molecular weight of 3,000 g / mol to 7,000 g / mol, an acid value of 50 KOHmg / g or more, for example, an acid value of 50 KOHmg / g to 90 KOHmg / g, for example, an acid value of 60 KOHmg / g to 80 KOHmg / g, and a double bond equivalent of 360 g / mol or more. When the weight average molecular weight, acid value and double bond equivalent of the acrylic binder resin are within the above ranges, the resulting thin film has excellent pattern formability and excellent mechanical and thermal properties.

[0054] The binder resin may further include an epoxy-based binder resin.

[0055] The binder resin can improve heat resistance by further containing an epoxy-based binder resin. Examples of the epoxy-based binder resin include, but are not limited to, phenol novolac epoxy resin, tetramethylbiphenyl epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, and combinations thereof.

[0056] Furthermore, the binder resin containing the epoxy-based binder resin can ensure the dispersion stability of a colorant such as a pigment, which will be described later, and at the same time, enable pixels of a desired resolution to be formed during the development process.

[0057] The epoxy-based binder resin may be contained in an amount of 1% by weight to 10% by weight, for example, 5% by weight to 10% by weight, based on the total amount of the binder resin. When the epoxy-based binder resin is contained in the above range, the residual film rate and chemical resistance are greatly improved.

[0058] The epoxy equivalent weight of the epoxy-based binder resin may be 150 g / eq to 200 g / eq. When an epoxy-based binder resin having an epoxy equivalent weight within the above range is contained in the binder resin, there is an advantageous effect on improving the degree of hardening of the formed pattern and on the fixation of the colorant in the structure in which the pattern is formed.

[0059] The binder resin may be contained in an amount of 1% by weight to 5% by weight, for example, 1% by weight to 4% by weight, for example, 2% by weight to 4% by weight, based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, developability, resolution, and linearity of the pattern can be obtained.

[0060] (B) Coloring agent The photosensitive resin composition according to an embodiment may be a green photosensitive resin composition, in which case the colorant in the composition may include a green pigment and a yellow pigment. The green pigment may be CI Green Pigment 7, CI Green Pigment 36, CI Green Pigment 58, CI Green Pigment 59, etc., in the Color Index, and may be used alone or in combination of two or more kinds, but is not necessarily limited thereto.

[0061] The yellow pigment may be, in the Color Index, an isoindoline pigment such as CI Yellow Pigment 185, CI Yellow Pigment 139, etc., a quinophthalone pigment such as CI Yellow Pigment 138, etc., or a nickel complex pigment such as CI Yellow Pigment 150, etc., which may be used alone or in combination of two or more kinds, but is not necessarily limited thereto.

[0062] At this time, the green pigment may be included in a weight amount greater than that of the yellow pigment. Specifically, the green pigment may be included in an amount of 50% by weight or more based on the total amount of the colorant. In addition, the colorant including the green pigment and the yellow pigment may be included in an amount of 80% by weight to 95% by weight, for example, 80% by weight to 90% by weight, for example, 80% by weight to 85% by weight, based on the total amount of the photosensitive resin composition according to an embodiment. When the content of the colorant is controlled as described above, and the content of the green pigment in the colorant is further controlled as described above, the half-width is narrowed, the color reproduction rate is increased, and the transmittance at 630 nm is reduced, thereby improving the viewing angle, and the effect can be very easily achieved.

[0063] For example, the photosensitive resin composition according to one embodiment can have a half-value width of less than 105 nm, which is advantageous in increasing color reproduction ratio.

[0064] For example, the photosensitive resin composition according to one embodiment may have a transmittance of less than 8% at 630 nm, and therefore has an excellent effect of improving the viewing angle.

[0065] The colorant may further include a purple pigment in addition to the green and yellow pigments.

[0066] As the purple pigment, in the Color Index, CI Violet Pigment 23 (V.23), CI Violet Pigment 29, Dioxazine Violet, Fast Violet B, Methyl Violet Lake, Indanthrene Brilliant Violet, etc. can be used, and these can be used alone or in combination of two or more kinds, but are not necessarily limited thereto.

[0067] The pigments may be used alone or in combination of two or more.

[0068] The pigment may be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is pretreated before use, the average particle size of the pigment can be made fine.

[0069] The pretreatment can be carried out through a step of kneading the pigment with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained from the kneading step.

[0070] The kneading is carried out at a temperature of 40° C. to 100° C., and the filtration and washing can be carried out by washing the inorganic salt with water or the like and then filtering.

[0071] Examples of water-soluble inorganic salts include, but are not limited to, sodium chloride, potassium chloride, etc. The wetting agent acts as a medium for homogeneously mixing the pigment and the water-soluble inorganic salt to easily grind the pigment, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc., alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, etc., and these can be used alone or in combination of two or more.

[0072] The pigment that has undergone the kneading step can have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle size of the pigment is within the above range, the pigment has excellent stability in the pigment mill base (pigment dispersion liquid), and there is no risk of a decrease in pixel resolution.

[0073] The pigments, such as the green pigment and the yellow pigment, can each be used independently in the form of a pigment dispersion, such as a millbase, together with a dispersant and a solvent.

[0074] The dispersant can disperse the pigment uniformly in the dispersion liquid, and nonionic, anionic or cationic dispersants can be used. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylate, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc. can be used, and these can be used alone or in combination of two or more kinds.

[0075] Examples of commercially available dispersants include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 from EFKA Chemical. Examples include Kal's EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc., Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc., and Ajinomoto's PB711, PB821, etc.

[0076] The dispersant may be contained in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the above range, the dispersibility of the composition is excellent, and therefore the stability, developability, and patternability during the production of the photosensitive resin film are excellent.

[0077] The pigment dispersion may further contain, in addition to the pigment, dispersant, and (dispersion) solvent, a dispersion assistant, a dispersion resin, etc. The solid pigment is contained in an amount of 5% by weight to 20% by weight, for example 8% by weight to 15% by weight, based on the total amount of the pigment dispersion.

[0078] As the (dispersion) solvent for the pigment dispersion, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc. can be used, and among these, propylene glycol methyl ether acetate can be preferably used.

[0079] The dispersing resin can be an acrylic resin containing a carboxy group, which can not only improve the stability of the pigment dispersion liquid, but also improve the patternability of the pixels.

[0080] The colorant may include a pigment and a dye, in which case the photosensitive resin composition of the embodiment may be a hybrid composition. In addition, the dye is not particularly limited, but may include a metal complex dye.

[0081] The metal complex dye may be a compound having a maximum absorbance in the wavelength region of 200 nm to 650 nm. In order to match the color coordinates with the combination of dyes, any metal complex dye of any color that dissolves in an organic solvent may be used as long as it is a compound having an absorbance in the above range.

[0082] Specifically, the metal complex dye may be a green dye having a maximum absorbance in the wavelength region of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength region of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength region of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength region of 500 nm to 650 nm, or a combination thereof.

[0083] The metal complex dye may be a direct dye, an acid dye, a basic dye, an acid mordant dye, a sulfur dye, a reduction dye, an azoic dye, a disperse dye, a reactive dye, an oxidation dye, a useful dye, an azo dye, an anthraquinone dye, an indigoid dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye, or a combination thereof.

[0084] The metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd and Fe.

[0085] Metal complex dyes include CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, and other CI Solvent dyes; CI Acid Green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109, and other CI Acid Greens. Dyes, CI Direct Dyes such as CI Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82, CI Basic Dyes such as CI Basic Green 1, CI Mordant Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41 , CI Mordant dyes such as CI Pigment Green 7, 36, 58, green pigments such as CI Pigment Green 7, 36, 58, solvent yellow 19, solvent yellow 21, solvent yellow 25, solvent yellow 79, solvent yellow 82, solvent yellow 88, solvent orange 45, solvent orange 54, solvent orange 62, solvent orange 99, solvent red 8, solvent red 32, solvent red 109, solvent red 112, solvent red 119, solvent red 124, solvent red 160, solvent red 132 and solvent red 218. A complex of at least one selected from the group consisting of these and a metal ion can be used.

[0086] The dye containing a metal complex has a solubility of 5 or more in the solvent used in the photosensitive resin composition according to an embodiment, i.e., the solvent described below, specifically, may be 5 to 10. The solubility can be obtained by the amount (g) of the dye dissolved in 100 g of the solvent. When the solubility of the dye containing a metal complex is within the above range, compatibility with other components forming the photosensitive resin composition according to an embodiment and coloring power can be ensured, and precipitation of the dye can be prevented.

[0087] The solvent may be, for example, propylene glycol mono methyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

[0088] The dye containing a metal complex is contained in an amount of 0.01% by weight to 1% by weight, for example, 0.01% by weight to 0.5% by weight, based on the total amount of the photosensitive resin composition. When the dye containing a metal complex is used in the above range, high brightness and light-dark ratio can be achieved with desired color coordinates.

[0089] When dyes and pigments are mixed and used, they can be mixed at a weight ratio of 0.1:99.9 to 99.9:0.1, specifically 1:9 to 9:1. When mixed within this weight ratio range, it is possible to control the chemical resistance and maximum absorption wavelength within an appropriate range, and to achieve high brightness and light-dark ratio at the desired color coordinates.

[0090] As described above, the colorant is contained in an amount of 80% by weight to 95% by weight, for example, 80% by weight to 90% by weight, for example, 80% by weight to 85% by weight, based on the total amount of the photosensitive resin composition. When the colorant is contained in a very high content as described above, the coloring effect and developability are excellent in the micro OLED display device, and it is easy to ensure high color reproduction rate and viewing angle characteristics.

[0091] (C) Polymerizable monomer The polymerizable monomer in the photosensitive resin composition according to an embodiment may include one or more compounds having three or more functional groups, such as, but not limited to, a (meth)acrylate group, an epoxy group, etc.

[0092] The photosensitive resin composition according to an embodiment has been developed for use in a micro OLED display device, and requires a low-temperature curing process. In the case of a low-temperature curing patterning process, the contribution of thermal curing is reduced and the influence of photocuring is greater. Therefore, maximizing the photocuring efficiency is advantageous for ensuring excellent patterning under low-temperature curing. According to an embodiment, the photocuring efficiency can be maximized by using a compound having at least three functional groups in the monomer as a polymerizable monomer. Specifically, the photocuring efficiency is greatly affected by the weight-average molecular weight and the number of functional groups of the polymerizable monomer, and the smaller the weight-average molecular weight of the polymerizable monomer and the larger the number of functional groups in the polymerizable monomer, the higher the photocuring efficiency. For example, a compound having at least three functional groups in the monomer is advantageous for maximizing the photocuring efficiency because it has a small weight-average molecular weight and a large number of functional groups.

[0093] For example, the polymerizable monomer may be a mixture of two kinds of compounds, and the two kinds of compounds may each independently contain three or more functional groups. For example, the polymerizable monomer may be a mixture of a polymerizable compound each independently containing three functional groups and a polymerizable compound each independently containing four to six functional groups. When the polymerizable monomer has the above-mentioned mixed composition, it is possible to maximize the photocuring efficiency while maintaining the above-mentioned color characteristics, and to facilitate the formation of a low-temperature cured pattern.

[0094] For example, the above two compounds are mixed in a weight ratio of 1:1. When the two compounds are mixed in the same weight ratio, the low temperature curing patternability is the best.

[0095] For example, the polymerizable compound containing three functional groups is represented by the following Chemical Formula 1, but is not necessarily limited thereto.

[0096] [ka]

[0097] In chemical formula 1, L 1 ~L 4 each independently represents a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C1 to C20 oxyalkylene group, or a combination thereof; R 1 ~R 4 are each independently a hydrogen atom, a hydroxy group, an epoxy group, or a substituted or unsubstituted (meth)acrylate group, with the proviso that R 1 ~R 4 Three of the groups are necessarily epoxy groups or substituted or unsubstituted (meth)acrylate groups.

[0098] For example, a compound containing 4 to 6 functional groups is pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, or a combination thereof, but is not necessarily limited thereto.

[0099] For example, the polymerizable monomer is contained in a content greater than that of the binder resin. In the case of conventional photosensitive resin compositions for color filters, the binder resin is generally contained in a content greater than that of the polymerizable monomer, but the photosensitive resin composition according to one embodiment is applied to a micro OLED display device including a WOLED deposited on a glass substrate or a silicon wafer other than polyimide as a light source, and therefore low-temperature curing is essential. Therefore, when the content of the polymerizable monomer is greater than that of the binder resin contained therein, it is more advantageous in improving patternability. Specifically, when the content of the polymerizable monomer is greater than that of the binder resin, sufficient polymerization is caused with a photopolymerization initiator described below during exposure in a low-temperature pattern formation process, and a pattern having excellent heat resistance, light resistance, and chemical resistance can be formed even under a low-temperature process of 100°C or less. Conventional color filters for liquid crystal displays (LCDs) use resists to form patterns of about 100 μm, but the patterns are too large for use in micro OLED display devices. The present inventors have controlled the contents of the polymerizable monomer and binder resin as described above, and also controlled the content of the photopolymerization initiator described below, thereby realizing fine patterns and enabling low-temperature curing.

[0100] The polymerizable monomer can also be used after being treated with an acid anhydride in order to impart better developability.

[0101] The polymerizable monomer is contained in an amount of 1% by weight to 10% by weight, for example, 1% by weight to 5% by weight, based on the total amount of the photosensitive resin composition. When the polymerizable monomer is contained within the above range, curing upon exposure occurs sufficiently in a low-temperature pattern formation process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, as well as excellent resolution and adhesion.

[0102] (D) Polymerization initiator The photosensitive resin composition according to an embodiment includes a polymerization initiator. At this time, the polymerization initiator is controlled to 0.65% by weight to 1.3% by weight, for example, 0.65% by weight to 1.0% by weight, based on the total amount of the photosensitive resin composition. When the content of the polymerization initiator is controlled as described above, an optimal pattern can be formed in a low-temperature curing process together with the composition of the polymerizable monomer, binder resin, and colorant described above. When a polymerization initiator outside the above content range is used together with the composition of the polymerizable monomer, binder resin, and colorant described above, the patternability is significantly reduced during the low-temperature curing process, which is not preferred.

[0103] The polymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxine-based compound, or a combination thereof.

[0104] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0105] Examples of benzophenone-based compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0106] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0107] Examples of the benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0108] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0109] Examples of oxine compounds that can be used include O-acyloxine compounds, 2-(O-benzoyloxine)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxine)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyl oxine compounds include, but are not limited to, 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxine-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1,2-dione-2-oxine-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-oneoxine-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxine-O-acetate.

[0110] The polymerization initiator can be used together with, in addition to the compound, for example, a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, and the like.

[0111] (E) Solvent The solvent may be a substance that is compatible with, but does not react with, the pigment dispersion liquid containing the colorant, the binder resin, the polymerizable monomer, and the polymerization initiator.

[0112] Examples of the solvent include alcohols such as methanol and ethanol, ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran, glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether, cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate, carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether, propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl ketones such as methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxypropionic acid methyl ethyl, 3-oxypropionic acid alkyl esters such as ethyl 3-oxypropionate, 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate, 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, and ethyl 2-ethoxypropionate,2-alkoxypropionic acid alkyl esters such as methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; Ketone acid esters such as ethyl pyruvate, and high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0113] Of these, taking into consideration compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc.; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate, etc.; esters such as ethyl 2-hydroxypropionate, etc.; carbitols such as diethylene glycol monomethyl ether, etc.; and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, etc. are preferably used.

[0114] The solvent may be contained in an amount of, for example, 0.1% by weight to 10% by weight, for example, 0.1% by weight to 5% by weight, for example, 0.1% by weight to 3% by weight, based on the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, and thus has excellent processability during production of the photosensitive resin film.

[0115] (F) Other additives Meanwhile, the photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof, but does not contain an antioxidant.

[0116] The photosensitive resin composition according to an embodiment includes the binder resin, colorant, polymerizable compound, polymerization initiator, and solvent as described above, and if an antioxidant is further included, the photocuring reaction does not proceed properly, and the pattern formation during the low-temperature curing process may not be complete, making it impossible to form a high-resolution pattern. Therefore, the photosensitive resin composition according to an embodiment does not include an antioxidant, i.e., has an antioxidant-free composition.

[0117] The silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion to a substrate.

[0118] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like. These can be used alone or in combination of two or more kinds.

[0119] The silane coupling agent is contained in an amount of 0.01 to 10 parts by weight relative to 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the composition has excellent adhesion, storage stability, and the like.

[0120] The photosensitive resin composition may further contain a surfactant, such as a fluorine-based surfactant and / or a silicon-based surfactant, if necessary, to improve coating properties and prevent the formation of defects.

[0121] As the fluorine-based surfactant, commercially available surfactants such as BM-1000 (registered trademark) and BM-1100 (registered trademark) from BM Chemie, Megapack F 142D (registered trademark), F 172 (registered trademark), F 173 (registered trademark), F 183 (registered trademark), F 554 (registered trademark), and F 556 (registered trademark) from Dainippon Ink and Chemicals, Inc., Fluodad FC-135, FC-170C, FC-430, and FC-431 from Sumitomo Sriem Co., Ltd., Surflon S-112, S-113, S-131, S-141, and S-145 from Asahi Glass Co., Ltd., and SH-28PA, -190, -193, SZ-6032, and SF-8428 from Toray Silicon Co., Ltd. can be used.

[0122] Silicone surfactants that can be used include those commercially available from BYK Chem under the names BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc.

[0123] The surfactant is used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is within the above range, coating uniformity is ensured, stains do not occur, and wetting to IZO substrates or glass substrates is excellent.

[0124] The photosensitive resin composition may contain a certain amount of other additives such as stabilizers within the range that does not impair the physical properties.

[0125] The photosensitive resin composition according to an embodiment may be a positive type or a negative type, but is preferably a negative type in order to more completely remove residues in areas where a pattern is exposed after exposure and development of the composition having light-blocking properties.

[0126] Another embodiment provides a photosensitive resin film prepared by low-temperature curing, exposing, and developing the above-mentioned photosensitive resin composition. Compared with conventional LCD processes, the difference is that a post-curing (post-baking) process is not required.

[0127] The method for producing the photosensitive resin film is as follows.

[0128] (1) Coating and coating film formation step (low temperature curing) The photosensitive resin composition is applied to a desired thickness on a substrate such as a glass substrate or an ITO substrate that has been pretreated using a method such as spin or slit coating, roll coating, screen printing, or applicator, and then heated to 100°C or less, for example 85°C, for 1 to 10 minutes to remove the solvent, forming a photosensitive resin film. This step makes it possible to improve image quality and stains.

[0129] (2) Exposure step To form the required pattern on the obtained photosensitive resin film, a mask is placed and then the film is irradiated with i-line actinic radiation. The light source used for irradiation can be a low pressure mercury lamp, a high pressure mercury lamp, an ultra-high pressure mercury lamp, a metal halide lamp, an argon gas laser, or in some cases, X-rays or electron beams.

[0130] The exposure dose varies depending on the type and amount of each component of the composition and the thickness of the dried film. When using a high-pressure mercury lamp, the exposure dose is 500 mJ / cm. 2(365 nm sensor) or less. However, in some cases the exposure dose is 500 mJ / cm 2 (with a 365 nm sensor). This step allows fine tuning of the pixel size, allowing for higher resolution.

[0131] (3) Development step As for the development method, following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts to form a pattern. This step allows a profile to be formed, realizing high resolution, and ensuring color uniformity and improving clarity.

[0132] Yet another embodiment provides a display device including a photosensitive resin film.

[0133] The display may be a micro-organic light emitting device (OLED) display.

[0134] The micro organic light emitting device (OLED) display device includes an OLED substrate deposited on a silicon wafer and a color filter layer laminated on the OLED substrate to convert white light generated by the OLED substrate into a plurality of color lights, and the color filter layer can include a red color filter, a green color filter, and a blue color filter.

[0135] For example, a micro organic light emitting device (OLED) display device may include an OLED substrate deposited on a silicon wafer, an inorganic layer laminated on the OLED substrate, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer to convert white light generated in the OLED substrate into a plurality of color lights, and the color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0136] For example, the photosensitive resin composition according to an embodiment may be a green photosensitive resin composition, and the green color filter in the micro OLED display device may be a low-temperature cured film of the green photosensitive resin composition.

[0137] Conventionally, an OLED substrate in which an OLED is deposited on a glass substrate or a polyimide substrate has been used, but in the micro OLED display device according to an embodiment, an OLED is deposited on a silicon wafer, which is more advantageous for realizing a micro display. Such micro displays are attracting attention as next-generation displays, and are expected to be applied to devices such as MR. In fact, Apple, Meta, LG Display, etc. have already entered the next-generation MR device market or have announced their intention to enter it.

[0138] For example, the micro OLED display device can further include a microlens array, which can be located on the protective adhesive layer and can surround the color filter layer.

[0139] In the micro OLED display device with the above structure, WOLED is deposited on a highly integrated silicon wafer, driven in pixel units, and the transmission wavelength can be easily controlled through the color filter layer patterned with a resolution of 3μm or less, which is advantageous for ensuring high color reproduction and high resolution.

[0140] For example, the thickness of the protective adhesive layer may be 1 μm or less, in which case the above-mentioned effects can be further maximized.

[0141] For example, the thickness of the color filter layer may be 1.1 μm to 1.6 μm.

[0142] When the thickness of the color filter layer is controlled as above, it is more advantageous to realize a micro OLED display device.

[0143] For example, the thickness of the inorganic layer may be 2 μm or less. Even in WOLED, light does not always diffuse only in the direction perpendicular to the OLED substrate, so red, green and blue color mixture inevitably occurs. Therefore, in the past, an inorganic layer was deposited on the OLED substrate to prevent such color mixture. However, since color mixture cannot be completely prevented even by depositing an inorganic layer, in one embodiment, the inorganic layer is made thin, for example, the thickness of the inorganic layer is controlled to 2 μm or less, thereby preventing minute light leakage phenomena.

[0144] As described above, the photosensitive resin composition according to one embodiment can produce a cured film by only low-temperature (100°C) curing during pre-baking and i-line photocuring, resulting in a significant difference in achievable resolution compared to conventional display devices.

[0145] Preferred embodiments of the present invention will be described below. However, the following embodiment is a preferred embodiment of the present invention, and the present invention is not limited to the following embodiment. EXAMPLES

[0146] (Production of Photosensitive Resin Composition) Examples 1 to 23 and Comparative Examples 1 to 14

[0147] A polymerization initiator was dissolved in a solvent according to the composition shown in Tables 1 to 5 below, and then stirred at room temperature for 2 hours. A binder resin and a polymerizable monomer were added to the solution, and then stirred at room temperature for 1 hour. Other additives and colorants were added to the solution, and then stirred at room temperature for 1 hour, and then the entire solution was stirred for 2 hours. The solution was filtered three times to remove impurities, and a photosensitive resin composition was produced.

[0148] [Table 1] [Table 2] [Table 3] [Table 4] [Table 5]

[0149] (A) Binder resin (A-1) Acrylic binder resin (SP-RY38, Showadenko) (69KOHmg / g, 6000g / mol, 370g / mol) (A-2) Acrylic binder resin (SP-RY92, Showadenko) (35KOHmg / g, 6000g / mol, 350g / mol) (A-3) Acrylic binder resin (SP-RY92-M10, Showadenko) (34KOHmg / g, 9000g / mol, 340g / mol)

[0150] (B) Coloring agent (B-1) Green pigment dispersion (Sanyo, G58) (B-2) Yellow pigment dispersion (Sanyo, Y139)

[0151] (C) Polymerizable monomer (C-1) pentaerythritol triacrylate (PE-3A, Kyoeisha) (C-2) Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Kayaku Co., Ltd.) (C-3) Compound represented by the following chemical formula A (M200, Miwon Chemical Co., Ltd.)

[0152] [ka]

[0153] (D) Polymerization initiator Oxine-based initiator (SPI-03, Sanyosha)

[0154] (E) Solvent Propylene glycol monomethyl ether acetate (PGMEA, Daicel)

[0155] (F) Other additives (F-1) Leveling agent (F-556, DIC) (F-2) Silane coupling agent (KBM503, ShinEtsu) (F-3) Antioxidant (2-Methylhydroquinone, JHChem)

[0156] Rating 1 Using K-spin8(Track) equipment, the photosensitive compositions according to Examples 1 to 23 and Comparative Examples 1 to 14 were coated onto an 8-inch silicon wafer at a rpm that could reach a constant thickness (1.5um) for each sample. Then, the wafer was baked at 100°C for 3 minutes or 85°C for 6 minutes in the Hot Plate of the Track equipment, and pattern exposure was performed by adjusting the exposure amount using Nikon's i-line stepper. Then, development was performed to form a pattern. The pattern was measured for a 1.6um pattern CD using Hitachi's CD-SEM.

[0157] For color characteristic evaluation, the pattern (substrate) manufacturing process was performed in the same way as above, except that a glass wafer was used and two substrates were manufactured for each sample because the thickness could not be accurately adjusted to the target (1.5um).Color was measured using a fine pattern color meter (LCF).

[0158] The experimental results are shown in Tables 6 and 7 below.

[0159] [Table 6] [Table 7]

[0160] From Tables 6 and 7, it can be seen that the photosensitive resin composition according to one embodiment is capable of realizing fine patterns, has excellent color characteristics, and can ensure a wide color range, even though it is cured at a low temperature.

[0161] The present invention is not limited to the above-mentioned embodiments, and can be manufactured in various different forms, and a person having ordinary skill in the art to which the present invention belongs can understand that the present invention can be embodied in other specific forms without changing the technical concept or essential features of the present invention. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and are not limiting.

Claims

1. Binder resin, Coloring agents, A polymerizable monomer, A polymerization initiator, and Contains a solvent, the colorant and the polymerization initiator are contained in an amount of 80% by weight to 95% by weight and 0.65% by weight to 1.3% by weight, respectively, based on the total amount of the photosensitive resin composition; The colorant includes a green pigment and a yellow pigment, and the green pigment is contained in an amount of 50% by weight or more based on the total amount of the colorant. Antioxidant-free photosensitive resin composition.

2. The photosensitive resin composition according to claim 1 , wherein the green pigment and the yellow pigment are each independently contained in the form of a pigment dispersion.

3. The photosensitive resin composition according to claim 1 , wherein the binder resin is an acrylic binder resin.

4. The photosensitive resin composition according to claim 3 , wherein the acrylic binder resin has an acid value of 50 KOHmg / g or more and a weight average molecular weight of 7000 g / mol or less.

5. The photosensitive resin composition according to claim 4 , wherein the acrylic binder resin has a double bond equivalent of 360 g / mol or more.

6. The photosensitive resin composition according to claim 1 , wherein the polymerizable monomer comprises one or more compounds having three or more functional groups.

7. The polymerizable monomer is a mixture of two compounds, The photosensitive resin composition according to claim 6, wherein each of the two compounds independently contains three or more functional groups.

8. The photosensitive resin composition according to claim 7, wherein the two compounds are mixed with each other in a 1:1 weight ratio.

9. The photosensitive resin composition according to claim 1 , wherein the polymerizable monomer is contained in a content greater than that of the binder resin.

10. The photosensitive resin composition according to claim 1 , wherein the photosensitive resin composition has a half-value width of less than 105 nm.

11. The photosensitive resin composition according to claim 1 , wherein the photosensitive resin composition has a transmittance at 630 nm of less than 8%.

12. The photosensitive resin composition contains, relative to the total amount of the photosensitive resin composition, 1% by weight to 5% by weight of the binder resin, 80% to 95% by weight of said colorant, 1% by weight to 10% by weight of the polymerizable monomer, 0.65% to 1.3% by weight of the polymerization initiator, and The amount of the solvent remaining The photosensitive resin composition according to claim 1 ,

13. The photosensitive resin composition according to claim 1, further comprising an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, and a combination thereof.

14. A photosensitive resin film produced by utilizing the photosensitive resin composition according to any one of claims 1 to 13.

15. A display device comprising the photosensitive resin film according to claim 14.

16. The display device includes an OLED substrate deposited on a silicon wafer, and a color filter layer laminated on the OLED substrate to convert white light generated by the OLED substrate into a plurality of color lights; 16. The display device of claim 15, wherein the color filter layer includes a red color filter, a green color filter, and a blue color filter, and the display device is a micro OLED display device.

17. A step of applying the photosensitive resin composition according to any one of claims 1 to 13; After the coating, pre-baking at a temperature of 100° C. or less; After the pre-baking, exposing to light in an i-line; and Developing step A method for producing a photosensitive resin film comprising the steps of:

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