Encapsulant for electronic devices, and electronic device

Abstract

To provide an encapsulant for electronic devices having a photoelectric conversion layer containing an organic-inorganic perovskite compound, where the encapsulant is excellent in water vapor barrier properties and oxygen barrier properties;, and an electronic device having the encapsulant.SOLUTION: An encapsulant for electronic devices has a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the general formula (1): R-M-X3, where, in the general formula (1), R represents an organic cation or a metal cation, M represents a metal atom, and X represents a halogen atom or a chalcogen atom. The encapsulant comprises a cured product of an encapsulant composition containing an epoxy resin and an epoxy resin curing agent, the epoxy resin curing agent containing xylylenediamine or a modified form thereof (X). Also provided is an electronic device having the encapsulant.

Description

[Technical field]

[0001] The present invention relates to a sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound, and to an electronic device having the sealant. [Background technology]

[0002] Perovskite solar cells are known to have high photoelectric conversion efficiency (see, for example, Patent Document 1). Although perovskite solar cells had problems with power generation efficiency when they were first reported, in recent years, power generation efficiency has improved rapidly, and they have become a leading player in solar cell development around the world. A perovskite solar cell generally comprises an electrode and a photoelectric conversion layer containing a perovskite compound. These electrodes and the photoelectric conversion layer need to be protected from moisture and oxygen in the air in order to extend the life of the solar cell.

[0003] 2. Description of the Related Art In order to protect electrodes and photoelectric conversion layers in electronic devices such as solar cells, sealants are used. For example, Patent Document 2 discloses a sealant composition for photoelectric conversion elements, which contains a predetermined amount of an epoxy resin that is liquid at room temperature selected from the group consisting of hydrogenated novolac epoxy resins, hydrogenated epoxy resins and / or aromatic epoxy resins that do not have a hydroxyl group in the molecule, and a cationic initiator, and describes that the composition is capable of forming a protective film that has excellent screen printability and excellent durability against corrosion by an electrolyte. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 056312 [Patent Document 2] JP 2013-089578 A Summary of the Invention [Problem to be solved by the invention]

[0005] The sealant composition disclosed in Patent Document 2 is a photoreactive cationic polymerizable composition, and since it uses a cationic initiator that generates a strong acid, there is a risk of corrosion. In addition, since perovskite solar cells require particularly high water vapor barrier properties and oxygen barrier properties, there is also room for improvement in the barrier properties of the sealant.

[0006] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound, the sealant having excellent water vapor barrier properties and oxygen barrier properties, and an electronic device having the sealant. [Means for solving the problem]

[0007] The present inventors have discovered that the above problems can be solved by using a sealant made of a cured product of a specified epoxy resin composition. That is, the present invention relates to the following. [1] The following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the formula: The sealant comprises a cured product of a sealant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X). [2] The sealant according to [1], wherein the modified xylylenediamine is a reaction product of the following component (A) and component (B): (A) at least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine (B) at least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (2) and derivatives thereof: [ka] (In formula (2), R 1 , R 2 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms. [3] The sealant according to [1] or [2], wherein a ratio of the number of active hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin in the sealant composition (number of active hydrogens / number of epoxy groups) is in the range of 0.8 to 3.0. [4] The sealant according to any one of [1] to [3], wherein the epoxy resin is mainly composed of an epoxy resin having a glycidylamino group derived from metaxylylenediamine. [5] The sealant according to any one of claims [2] to [4], wherein the component (A) is metaxylylenediamine, and the component (B) is at least one selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, and derivatives thereof. [6] The sealant has a water vapor permeability coefficient of 1.0 g mm / (m at a temperature of 40°C and a relative humidity of 90%. 2 ·day) or less, and the oxygen permeability coefficient at a temperature of 23°C and a relative humidity of 60% is 1.0cc·mm / (m 2 The sealant according to any one of [1] to [5], wherein the daily limit is 1.0 ms or less. [7] The encapsulant according to any one of [1] to [6], wherein the electronic device is a solar cell. [8] The following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the formula: An electronic device comprising a sealant comprising a cured product of a sealant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X). [9] The electronic device according to [8], wherein the electronic device has a structure in which a substrate, the photoelectric conversion layer, and an opposing substrate are arranged in that order, and the photoelectric conversion layer is sealed between the substrate and the opposing substrate.

[10] Use of a composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X) as a sealant composition for electronic devices, The electronic device is represented by the following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) The photoelectric conversion layer comprises an organic-inorganic perovskite compound represented by the formula: Effect of the Invention

[0008] According to the present invention, it is possible to provide a sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound, the sealant having excellent water vapor barrier properties and oxygen barrier properties, and an electronic device having the sealant. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a cross-sectional view showing an embodiment of a sealing aspect of a photoelectric conversion layer in the electronic device of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing an embodiment of a sealing aspect of a photoelectric conversion layer in the electronic device of the present invention. [Diagram 3] FIG. 2 is a cross-sectional view showing an embodiment of a sealing aspect of a photoelectric conversion layer in the electronic device of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [Sealants for electronic devices] The sealant for electronic devices of the present invention (hereinafter also simply referred to as "sealant of the present invention") is represented by the following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the formula: The sealant is made of a cured product of a sealant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X). The sealant of the present invention is a sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound, and has excellent water vapor barrier properties and oxygen barrier properties. The reason why the sealant of the present invention exhibits the above-mentioned effects is believed to be that the sealant composition contains xylylenediamine or its modified product (X) as an epoxy resin curing agent, and the obtained cured product exhibits excellent water vapor barrier property and oxygen barrier property.

[0011] [Electronic Devices] The electronic device of the present invention has the following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the formula: and a sealant comprising a cured product of a sealant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X).

[0012] (Photoelectric conversion layer) The photoelectric conversion layer of the electronic device contains the organic-inorganic perovskite compound represented by the general formula (1).

[0013] [Organic-inorganic perovskite compound represented by general formula (1)] R in the general formula (1) is an organic cation or a metal cation. The organic cation in R in the general formula (1) is preferably a cationized product of an organic compound containing a nitrogen atom. Examples of organic compounds containing a nitrogen atom include amine compounds such as methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, dipentylamine, dihexylamine, trimethylamine, triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, ethylmethylamine, methylpropylamine, butylmethylamine, methylpentylamine, hexylmethylamine, ethylpropylamine, ethylbutylamine, and phenethylamine; amidine compounds such as formamidine and acetamidine; guanidine; and heterocyclic compounds such as imidazole, azole, pyrrole, aziridine, azirine, azetidine, azeto, azole, imidazoline, and carbazole. Here, the "cationized product of an organic compound containing a nitrogen atom" refers to, for example, when the organic compound containing a nitrogen atom is an amine compound, a product in which an amino group in the amine compound is converted to a quaternary ammonium cation. One example of such a product is the methylammonium cation, which is an example of a "cationized product of methylamine."

[0014] Among the above, the organic compound containing a nitrogen atom is preferably at least one selected from the group consisting of amine compounds and amidine compounds, more preferably at least one selected from the group consisting of methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, phenethylamine, formamidine, and acetamidine, and even more preferably at least one selected from the group consisting of methylamine, ethylamine, propylamine, and formamidine.

[0015] The metal cation in R in the general formula (1) is preferably a monovalent metal cation, more preferably an alkali metal cation. Examples of the metal cation in R in the general formula (1) include silver cation (Ag + ), cesium cation (Cs+), potassium cation (K+), rubidium cation (Rb+), etc.

[0016] M in the general formula (1) is a metal atom, more specifically, a metal atom that can be a multivalent ion. Examples of the metal atom include lead, tin, zinc, titanium, antimony, bismuth, nickel, iron, cobalt, silver, copper, gallium, germanium, magnesium, calcium, indium, aluminum, manganese, chromium, molybdenum, and europium. These metal atoms may be used alone or in combination of two or more.

[0017] X in the general formula (1) is a halogen atom or a chalcogen atom, such as chlorine, bromine, iodine, sulfur, and selenium. These halogen atoms or chalcogen atoms may be used alone or in combination of two or more. Specifically, one of the halogen atoms may be used alone or in combination of two or more of the halogen atoms. Alternatively, one of the chalcogen atoms may be used alone or in combination of two or more of the chalcogen atoms. From the viewpoint of improving the solubility of the organic inorganic perovskite compound in an organic solvent, X is preferably a halogen atom. Furthermore, from the viewpoint of narrowing the energy band gap of the organic inorganic perovskite compound, the halogen atom is preferably an iodine atom.

[0018] The organic-inorganic perovskite compound represented by general formula (1) preferably has a cubic crystal structure in which a metal atom M is located at the body center, an organic cation or metal cation R is located at each vertex, and a halogen atom or chalcogen atom X is located at the face center. Although the reason for this is unclear, it is presumed that when the organic-inorganic perovskite compound has the above structure, the orientation of the octahedron in the crystal lattice can be easily changed, thereby increasing the mobility of electrons in the organic-inorganic perovskite compound and improving the photoelectric conversion efficiency.

[0019] The organic-inorganic perovskite compound is preferably a crystalline semiconductor. In this specification, a crystalline semiconductor means a semiconductor in which a scattering peak can be detected by measuring an X-ray scattering intensity distribution. It is considered that the organic-inorganic perovskite compound is a crystalline semiconductor, and thus the mobility of electrons in the organic-inorganic perovskite compound is increased, thereby improving the photoelectric conversion efficiency.

[0020] The photoelectric conversion layer may further contain an organic semiconductor or an inorganic semiconductor in addition to the organic-inorganic perovskite compound represented by the general formula (1) as long as the effect of the present invention is not impaired. Examples of organic semiconductors include compounds having a thiophene skeleton such as poly(3-alkylthiophene); conductive polymers having a polyparaphenylenevinylene skeleton, a polyvinylcarbazole skeleton, a polyaniline skeleton, a polyacetylene skeleton, or the like; compounds having a porphyrin skeleton such as a phthalocyanine skeleton, a naphthalocyanine skeleton, a pentacene skeleton, a benzoporphyrin skeleton, or the like, a spirobifluorene skeleton, or the like; and carbon-containing materials such as carbon nanotubes, graphene, and fullerene, which may be surface-modified. Examples of inorganic semiconductors include titanium oxide, zinc oxide, indium oxide, tin oxide, gallium oxide, tin sulfide, indium sulfide, zinc sulfide, CuSCN, Cu2O, CuI, MoO3, V2O5, WO3, MoS2, MoSe2, and Cu2S.

[0021] When the photoelectric conversion layer contains an organic / inorganic perovskite compound and an organic semiconductor or an inorganic semiconductor, it may be a laminate in which a thin-film organic semiconductor portion and / or an inorganic semiconductor portion and a thin-film organic / inorganic perovskite compound portion are laminated together, or it may be a composite film in which an organic semiconductor portion and / or an inorganic semiconductor portion is composited with an organic / inorganic perovskite compound portion.

[0022] The thickness of the thin-film organic-inorganic perovskite compound portion in the photoelectric conversion layer is not particularly limited, but from the viewpoint of improving photoelectric conversion efficiency, it is preferably 5 nm or more, more preferably 10 nm or more, and even more preferably 20 nm or more, and is preferably 5000 nm or less, more preferably 1000 nm or less, and even more preferably 500 nm or less.

[0023] When the photoelectric conversion layer is a composite film in which an organic semiconductor portion and / or an inorganic semiconductor portion is combined with an organic-inorganic perovskite compound portion, the thickness of the composite film is, from the viewpoint of improving the photoelectric conversion efficiency, preferably 30 nm or more, more preferably 40 nm or more, even more preferably 50 nm or more, and is preferably 3000 nm or less, more preferably 2000 nm or less, even more preferably 1000 nm or less.

[0024] The method for forming the photoelectric conversion layer is not particularly limited, and examples thereof include dissolving the materials to be contained in the photoelectric conversion layer in an organic solvent such as N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), or N,N-dimethylacetamide (DMAc) at a total concentration of about 0.5 to 3.0 mol / L, and then depositing the materials by vacuum deposition, sputtering, chemical vapor deposition (CVD), electrochemical deposition, spin coating, casting, or roll-to-roll deposition.

[0025] Specific examples of the electronic device of the present invention include solar cells, light-emitting sensors, quantum dots, etc. Among these, from the viewpoint of effectively utilizing the excellent photoelectric conversion efficiency of the organic-inorganic perovskite compound, the electronic device is preferably a solar cell.

[0026] The configuration of the electronic device of the present invention is not particularly limited as long as it has the photoelectric conversion layer and the sealant, but from the viewpoint of protecting the photoelectric conversion layer from water vapor, oxygen, etc., it is preferable that the electronic device has a structure in which a substrate, the photoelectric conversion layer, and an opposing substrate are arranged in this order, and the photoelectric conversion layer is sealed between the substrate and the opposing substrate. The "structure in which the photoelectric conversion layer is sealed between the substrate and the opposing substrate" refers to a structure in which a photoelectric conversion layer is disposed between the substrate and the opposing substrate, and the photoelectric conversion layer is sealed with a sealant so as not to come into contact with the outside air.

[0027] 1 to 3 are schematic cross-sectional views showing one embodiment of a sealing aspect of a photoelectric conversion layer in an electronic device of the present invention. In FIG. 1, 1 is a substrate, 2 is a photoelectric conversion layer, 3 is a sealant, and 4 is an opposing substrate. In FIG. 1, the sealant 3 is laminated so as to cover the upper surface of the photoelectric conversion layer 2, and is provided so as to cover an end face 21 of the peripheral portion of the photoelectric conversion layer 2. As a result, the photoelectric conversion layer 2 is sealed by the sealant 3 between the substrate 1 and the opposing substrate 4. Note that the photoelectric conversion layer 2 and the sealant 3 are in contact with each other in FIG. 1, but this is not limited to this embodiment. 1, functional layers may be laminated on the lower surface of the substrate 1, between the substrate 1 and the photoelectric conversion layer 2, between the photoelectric conversion layer 2 and the sealant 3, between the sealant 3 and the opposing substrate 4, and on the upper surface of the opposing substrate 4. Examples of the functional layers include a primer layer, a transparent electrode (cathode) layer, an electron transport layer, a hole transport layer, a metal electrode (anode) layer, other vapor deposition layers, and the like.

[0028] In Fig. 2, 1 is a substrate, 2 is a photoelectric conversion layer, 31 is a sealant, and 4 is an opposing substrate. In Fig. 2, the peripheral portion between the substrate 1 and the opposing substrate 4 is sealed with the sealant 31. As a result, the photoelectric conversion layer 2 has a structure sealed with the sealant 31 between the substrate 1 and the opposing substrate 4. 2, the photoelectric conversion layer 2 and the sealant 31 are not in contact with each other, but this is not limited to the embodiment. In addition, any of the functional layers described above may be laminated on the lower surface of the substrate 1, between the substrate 1 and the photoelectric conversion layer 2, on the upper surface of the photoelectric conversion layer 2, and on the upper surface or lower surface of the opposing substrate 4.

[0029] In Fig. 3, 1 is a substrate, 2 is a photoelectric conversion layer, 31 and 32 are sealants, and 4 is an opposing substrate. In Fig. 3, the peripheral portion between the substrate 1 and the opposing substrate 4 is sealed with the sealant 31. As a result, the photoelectric conversion layer 2 has a structure sealed with the sealant 31 between the substrate 1 and the opposing substrate 4. In addition, the sealant 32 is laminated so as to cover the upper surface of the photoelectric conversion layer 2. In FIG. 3, at least one of the sealant 31 and the sealant 32 may be the sealant of the present invention. 3, the photoelectric conversion layer 2 and the sealant 31 are not in contact with each other, but this is not limited to the embodiment. Any of the functional layers described above may be laminated on the lower surface of the base material 1, between the base material 1 and the photoelectric conversion layer 2, between the photoelectric conversion layer 2 and the sealant 32, on the upper surface of the sealant 32, and on the upper or lower surface of the opposing base material 4.

[0030] 1 to 3, any of inorganic substrates made of glass, metal, etc., and organic substrates made of resin films, etc. can be used. The substrate 1 and the opposing substrate 4 preferably have water vapor barrier properties and oxygen barrier properties.

[0031] The thickness of the sealant is appropriately selected depending on the type, shape, and use site of the electronic device, but from the viewpoint of improving the water vapor barrier property and the oxygen barrier property, it is preferably 20 μm or more, more preferably 50 μm or more, even more preferably 100 μm or more, and even more preferably 200 μm or more. Also, from the viewpoint of improving the adhesion to the substrate, the photoelectric conversion layer, and the opposing substrate, it is preferably 2000 μm or less, more preferably 1000 μm or less, and even more preferably 600 μm or less. The thickness of the sealant refers to the distances indicated by d1 to d3 in Figures 1 to 3. Specifically, in the sealant 3 in Figure 1, it refers to the shortest distance d1 between the upper and lower surfaces of the layer made of the sealant. In the sealant 31 in Figures 2 and 3, it refers to the shortest distance d2 between the inner and outer surfaces, and in the sealant 32 in Figure 3, it refers to the shortest distance d3 between the upper and lower surfaces of the layer made of the sealant.

[0032] When the electronic device of the present invention is a solar cell, the basic structure of the solar cell has, for example, a laminate structure in which a transparent electrode (cathode) layer, an electron transport layer, a photoelectric conversion layer, a hole transport layer, and a metal electrode (anode) layer are laminated in this order. In this case, it is preferable that the substrate is laminated on the outer surface of either the transparent electrode layer or the metal electrode layer, and the opposing substrate is laminated on the outer surface of the other.

[0033] <Sealant composition> The electronic device sealant of the present invention is made of a cured product of a sealant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or its modified product (X). Each component contained in the sealant composition will be described below.

[0034] (Epoxy resin) The epoxy resin used in the sealant composition may be any of a saturated or unsaturated aliphatic compound, an alicyclic compound, an aromatic compound, and a heterocyclic compound. From the viewpoint of improving the water vapor barrier property and the oxygen barrier property, an epoxy resin containing an aromatic ring or an alicyclic structure in the molecule is preferable. Specific examples of the epoxy resin include at least one selected from the group consisting of epoxy resins having a glycidylamino group derived from metaxylylenediamine, epoxy resins having a glycidylamino group derived from paraxylylenediamine, epoxy resins having a glycidylamino group derived from 1,3-bis(aminomethyl)cyclohexane, epoxy resins having a glycidylamino group derived from 1,4-bis(aminomethyl)cyclohexane, epoxy resins having a glycidylamino group derived from diaminodiphenylmethane, epoxy resins having a glycidylamino group and / or a glycidyloxy group derived from paraaminophenol, epoxy resins having a glycidyloxy group derived from bisphenol A, epoxy resins having a glycidyloxy group derived from bisphenol F, epoxy resins having a glycidyloxy group derived from phenol novolac, and epoxy resins having a glycidyloxy group derived from resorcinol. The above epoxy resins may be used alone or in combination of two or more. Among the above, from the viewpoint of improving the water vapor barrier property and oxygen barrier property, the epoxy resin is preferably one having as a main component at least one selected from the group consisting of epoxy resins having a glycidylamino group derived from meta-xylylenediamine, epoxy resins having a glycidylamino group derived from para-xylylenediamine, epoxy resins having a glycidyloxy group derived from bisphenol A, and epoxy resins having a glycidyloxy group derived from bisphenol F, and more preferably one having as a main component an epoxy resin having a glycidylamino group derived from meta-xylylenediamine. The term "main component" used here means that other components may be contained within a range that does not deviate from the spirit of the present invention, and preferably means 50 to 100% by mass of the total, more preferably 70 to 100% by mass, even more preferably 80 to 100% by mass, and even more preferably 90 to 100% by mass.

[0035] (Epoxy resin hardener) The epoxy resin curing agent used in the sealant composition contains xylylenediamine or a modified product thereof (X). [Xylylenediamine or its modified form (X)] Xylylenediamine or its modified product (X) (hereinafter also simply referred to as "component (X)") is ortho-xylylenediamine, meta-xylylenediamine, para-xylylenediamine, or modified products thereof. The modified xylylenediamine may be any modified product having active hydrogen that can function as an epoxy resin curing agent, and examples thereof include Mannich reaction products of xylylenediamine, a phenol compound, and an aldehyde compound; reaction products of xylylenediamine and an unsaturated hydrocarbon compound; reaction products of xylylenediamine and an epoxy compound having at least one epoxy group; reaction products of xylylenediamine and a carboxylic acid or a derivative thereof; and the like. In this specification, the term "reaction product of X and Y" includes not only the reaction product (adduct) of X and Y, but also by-products other than the reaction product, and unreacted raw materials such as X and Y. The same applies to the "Mannich reaction product of X, Y, and Z."

[0036] Among the above, from the viewpoint of improving the water vapor barrier property and the oxygen barrier property, the modified xylylenediamine is preferably a reaction product of xylylenediamine with a carboxylic acid or a derivative thereof, and more preferably a reaction product of the following component (A) and component (B): (A) at least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine (B) at least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (2) and derivatives thereof: [ka] (In formula (2), R 1 , R 2 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms.

[0037] From the viewpoint of improving the water vapor barrier property and the oxygen barrier property, the component (A) is preferably meta-xylylenediamine. The component (B) is at least one selected from the group consisting of unsaturated carboxylic acids and derivatives thereof represented by the general formula (2). 1 is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, even more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom. From the viewpoint of improving the water vapor barrier property and the oxygen barrier property, R 2 is preferably a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, even more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.

[0038] Examples of the derivative of the unsaturated carboxylic acid represented by the general formula (2) include esters, amides, acid anhydrides, and acid chlorides of the unsaturated carboxylic acid. As the ester of the unsaturated carboxylic acid, alkyl esters are preferred, and from the viewpoint of obtaining good reactivity, the number of carbon atoms of the alkyl is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2.

[0039] Examples of the unsaturated carboxylic acid represented by the general formula (2) and its derivatives include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, α-ethylacrylic acid, α-propylacrylic acid, α-isopropylacrylic acid, α-n-butylacrylic acid, α-t-butylacrylic acid, α-pentylacrylic acid, α-phenylacrylic acid, α-benzylacrylic acid, crotonic acid, 2-pentenoic acid, 2-hexenoic acid, 4-methyl-2-pentenoic acid, 2-heptenoic acid, 4-methyl-2-hexenoic acid, 5-methyl-2-hexenoic acid, 4,4-dimethyl-2-pentenoic acid, 4-phenyl-2-butenoic acid, cinnamic acid, o-methylcinnamic acid, m-methylcinnamic acid, p-methylcinnamic acid, and 2-octenoic acid, as well as their esters, amides, acid anhydrides, and acid chlorides.

[0040] Among the above, from the viewpoint of improving the water vapor barrier property and the oxygen barrier property, it is preferable that the component (A) is metaxylylenediamine, and the component (B) is at least one selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, and derivatives thereof. Component (B) is more preferably at least one selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, and their alkyl esters, even more preferably at least one selected from the group consisting of acrylic acid, methacrylic acid, and their alkyl esters, even more preferably an alkyl ester of acrylic acid, and even more preferably methyl acrylate.

[0041] When an unsaturated carboxylic acid, ester, or amide is used as component (B), the reaction between component (A) and component (B) is carried out by mixing component (A) and component (B) under conditions of 0 to 100°C, more preferably 0 to 70°C, and carrying out a Michael addition reaction and an amide group formation reaction by dehydration and dealcoholization under conditions of 100 to 300°C, preferably 130 to 250°C. In this case, in order to complete the amide group formation reaction, the inside of the reaction apparatus can be decompressed as necessary in the final stage of the reaction. In addition, a non-reactive solvent can be used for dilution as necessary. Furthermore, a catalyst such as a phosphite can be added as a dehydrating agent or a dealcoholizing agent.

[0042] On the other hand, when an acid anhydride or an acid chloride of an unsaturated carboxylic acid is used as the component (B), the mixture is mixed under conditions of 0 to 150°C, preferably 0 to 100°C, and then the Michael addition reaction and the amide group formation reaction are carried out. In this case, in order to complete the amide group formation reaction, the inside of the reaction apparatus can be decompressed as necessary at the final stage of the reaction. In addition, dilution can be performed using a non-reactive solvent as necessary. Furthermore, a tertiary amine such as pyridine, picoline, lutidine, or trialkylamine can be added.

[0043] The amide group moiety formed by the reaction of component (A) with component (B) has high cohesive strength, and therefore a sealant formed using the epoxy resin curing agent that is the reaction product of component (A) with component (B) has water vapor barrier properties, oxygen barrier properties, and good adhesion.

[0044] The reaction molar ratio of the component (B) to the component (A) [(B) / (A)] is preferably in the range of 0.3 to 1.0. If the reaction molar ratio is 0.3 or more, a sufficient amount of amide groups are generated in the epoxy resin curing agent, and high levels of water vapor barrier property, oxygen barrier property and adhesiveness are exhibited. On the other hand, if the reaction molar ratio is in the range of 1.0 or less, the amount of amino groups required for reaction with the epoxy groups in the epoxy resin is sufficient, and the heat resistance is excellent, and the solubility in organic solvents and water is also excellent. From the viewpoint of the water vapor barrier property and oxygen barrier property of the resulting sealant, the reaction molar ratio of the component (B) to the component (A) [(B) / (A)] is more preferably in the range of 0.6 to 1.0.

[0045] The above reaction product may be a reaction product of the components (A) and (B) and at least one compound selected from the group consisting of the following components (C), (D) and (E). (C)R 3 At least one member (R ) selected from the group consisting of monovalent carboxylic acids represented by —COOH and their derivatives 3 represents a hydrogen atom, an alkyl group having 1 to 7 carbon atoms which may have a hydroxyl group, or an aryl group having 6 to 12 carbon atoms. (D) Cyclic carbonate (E) Monoepoxy compounds having 2 to 20 carbon atoms

[0046] The component (C), R 3 The monovalent carboxylic acid represented by --COOH and its derivatives are used as necessary from the viewpoint of lowering the reactivity between the epoxy resin curing agent and the epoxy resin and improving the workability. R 3 represents a hydrogen atom, an alkyl group having 1 to 7 carbon atoms which may have a hydroxyl group, or an aryl group having 6 to 12 carbon atoms; R 3 is preferably an alkyl group having 1 to 3 carbon atoms or a phenyl group. Also R 3 Examples of the derivative of the monovalent carboxylic acid represented by -COOH include esters, amides, acid anhydrides, and acid chlorides of the carboxylic acid. The esters of the carboxylic acid are preferably alkyl esters, and the number of alkyl carbon atoms is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 to 2. Examples of the component (C) include monovalent carboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, lactic acid, glycolic acid, and benzoic acid, and derivatives thereof. The component (C) may be used alone or in combination of two or more kinds.

[0047] The cyclic carbonate, which is the component (D), is used as necessary from the viewpoint of reducing the reactivity between the epoxy resin curing agent and the epoxy resin and improving workability, and is preferably a cyclic carbonate having a six-membered ring or less from the viewpoint of reactivity with the component (A). For example, ethylene carbonate, propylene carbonate, glycerin carbonate, 1,2-butylene carbonate, vinylene carbonate, 4-vinyl-1,3-dioxolan-2-one, 4-methoxymethyl-1,3-dioxolan-2-one, 1,3-dioxane-2-one, etc. are listed. Among these, at least one selected from the group consisting of ethylene carbonate, propylene carbonate, and glycerin carbonate is preferred from the viewpoint of gas barrier properties.

[0048] The monoepoxy compound of the component (E) is a monoepoxy compound having 2 to 20 carbon atoms, and is used as necessary from the viewpoint of improving workability by reducing the reactivity between the epoxy resin curing agent and the epoxy resin. From the viewpoint of gas barrier properties, it is preferably a monoepoxy compound having 2 to 10 carbon atoms, and more preferably a compound represented by the following formula (3).

[0049] [ka] (In formula (3), R 4 is a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group, or R 5 -O-CH2-, R 5 represents a phenyl group or a benzyl group. Examples of the monoepoxy compound represented by the formula (3) include ethylene oxide, propylene oxide, 1,2-butylene oxide, styrene oxide, phenyl glycidyl ether, benzyl glycidyl ether, etc. The component (E) may be used alone or in combination of two or more.

[0050] When the component (C), component (D) or component (E) is used in the above reaction product, any one compound selected from the group consisting of the components (C), (D) and (E) may be used alone, or two or more of them may be used in combination.

[0051] The reaction product may be a reaction product obtained by reacting the components (A) to (E) with other components, as long as the effect of the present invention is not impaired. Examples of the other components include aromatic dicarboxylic acids and derivatives thereof. However, the amount of the "other components" used is preferably 30 mass % or less, more preferably 10 mass % or less, and even more preferably 5 mass % or less of the total amount of the reaction components constituting the reaction product.

[0052] The reaction product of the components (A) and (B) with at least one compound selected from the group consisting of the components (C), (D) and (E) is obtained by reacting the component (A), which is a polyamine compound, with at least one compound selected from the group consisting of the components (C), (D) and (E) in combination with the component (B). The reaction may be carried out by adding the components (B) to (E) in any order and reacting them with the component (A), or by mixing the components (B) to (E) and reacting them with the component (A). The reaction between the component (A) and the component (C) can be carried out under the same conditions as those for the reaction between the component (A) and the component (B). When the component (C) is used, the components (B) and (C) may be mixed and reacted with the component (A), or the components (A) and (B) may be reacted first, and then the component (C) may be reacted. On the other hand, when the component (D) and / or the component (E) is used, it is preferable to first react the component (A) with the component (B) and then react the component (A) with the component (B) and the component (D) and / or the component (E). The reaction of the component (A) with the component (D) and / or the component (E) is carried out by mixing the component (A) with the component (D) and / or the component (E) under conditions of 25 to 200° C., and carrying out an addition reaction under conditions of 30 to 180° C., preferably 40 to 170° C. Furthermore, a catalyst such as sodium methoxide, sodium ethoxide, potassium t-butoxide, etc. can be used as necessary. During the above reaction, in order to promote the reaction, component (D) and / or component (E) may be used in a melt state or diluted with a non-reactive solvent, if necessary.

[0053] Even when the reaction product is a reaction product of the components (A) and (B) and at least one compound selected from the group consisting of the components (C), (D) and (E), the reaction molar ratio of the component (B) to the component (A) [(B) / (A)] is preferably in the range of 0.3 to 1.0, more preferably in the range of 0.6 to 1.0, for the same reasons as above. On the other hand, the reaction molar ratio of the components (C), (D) and (E) to the component (A) [{(C)+(D)+(E)} / (A)] is preferably in the range of 0.05 to 3.1, more preferably in the range of 0.07 to 2.5, and more preferably in the range of 0.1 to 2.0. However, from the viewpoints of water vapor barrier properties, oxygen barrier properties, and coatability, the reaction molar ratio of the components (B) to (E) to the component (A), [{(B)+(C)+(D)+(E)} / (A)], is preferably in the range of 0.35 to 2.5, and more preferably in the range of 0.35 to 2.0.

[0054] From the viewpoints of improving the water vapor barrier property, the oxygen barrier property, and the adhesion, the reaction product of the component (A) and the component (B) is preferably a reaction product obtained by reacting only the component (A) and the component (B), and more preferably a reaction product obtained by reacting only meta-xylylenediamine and an alkyl acrylate.

[0055] From the viewpoint of improving the water vapor barrier property and the oxygen barrier property, component (X) is preferably meta-xylylenediamine, para-xylylenediamine or a modified product thereof, more preferably contains meta-xylylenediamine or a reaction product of components (A) and (B), even more preferably contains a reaction product of components (A) and (B), still more preferably contains a reaction product obtained by reacting only components (A) and (B), and even more preferably contains a reaction product obtained by reacting only meta-xylylenediamine and an alkyl acrylate.

[0056] When component (X) contains a reaction product of component (A) and component (B), preferably a reaction product obtained by reacting only component (A) and component (B), and more preferably a reaction product obtained by reacting only meta-xylylenediamine and an alkyl acrylate ester, the content of the reaction product in component (X) is, from the viewpoint of improving the water vapor barrier property and the oxygen barrier property, preferably 50 mass % or more, more preferably 60 mass % or more, even more preferably 70 mass % or more, still more preferably 80 mass % or more, and still more preferably 90 mass % or more, and 100 mass % or less.

[0057] The epoxy resin curing agent may contain a curing agent component other than the component (X) within a range that does not impair the effects of the present invention. Examples of the curing agent component include amine-based curing agents other than the component (X), phenol-based curing agents, acid anhydride-based curing agents, and hydrazide-based curing agents, and from the viewpoint of improving the water vapor barrier property and oxygen barrier property, amine-based curing agents are preferred. However, from the viewpoint of improving the water vapor barrier property and the oxygen barrier property, the content of xylylenediamine or its modified product (X) in the epoxy resin curing agent is preferably 50 mass% or more, more preferably 60 mass% or more, even more preferably 70 mass% or more, still more preferably 80 mass% or more, still more preferably 90 mass% or more, and still more preferably 95 mass% or more, and 100 mass% or less.

[0058] The blending ratio of the epoxy resin and the epoxy resin curing agent in the sealant composition may be in the standard blending range generally used when preparing an epoxy resin reactant by reaction of the epoxy resin with the epoxy resin curing agent. Specifically, the ratio of the number of active hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin (number of active hydrogens / number of epoxy groups) is preferably in the range of 0.2 to 12.0. From the viewpoint of improving the water vapor barrier property and the oxygen barrier property, and from the viewpoint of improving the adhesiveness, (number of active hydrogens / number of epoxy groups) is more preferably in the range of 0.2 to 10.0, even more preferably 0.2 to 8.0, even more preferably 0.5 to 6.0, even more preferably 0.8 to 5.0, even more preferably 0.8 to 3.0, even more preferably 1.1 to 3.0, and even more preferably 1.2 to 3.0.

[0059] The sealant composition may further contain a coupling agent from the viewpoint of improving the adhesion of the resulting sealant to a substrate, etc. Examples of the coupling agent include a silane coupling agent, a titanate-based coupling agent, an aluminate-based coupling agent, etc., and the silane coupling agent is preferred. Examples of the silane coupling agent include a silane coupling agent having a vinyl group, a silane coupling agent having an amino group, a silane coupling agent having an epoxy group, a silane coupling agent having a (meth)acrylic group, a silane coupling agent having a mercapto group, etc. Among these, from the viewpoint of improving the adhesion of the resulting sealant to a substrate or the like, at least one selected from the group consisting of a silane coupling agent having an amino group and a silane coupling agent having an epoxy group is preferred. When a coupling agent is used, the content of the coupling agent in the sealant composition is preferably 0.1 to 10 parts by mass, more preferably 1 to 8 parts by mass, based on 100 parts by mass of the epoxy resin curing agent.

[0060] The sealant composition may contain additives such as a thermosetting resin, a wetting agent, a tackifier, an antifoaming agent, a curing accelerator, a rust-preventive additive, a pigment, and an oxygen scavenger, as necessary, within the scope of not impairing the effects of the present invention. When additives are used, the total content of the additives in the sealant composition is preferably 20.0 parts by mass or less, and more preferably 0.001 to 15.0 parts by mass, per 100 parts by mass of the total amount of the epoxy resin and the epoxy resin curing agent.

[0061] However, from the viewpoint of obtaining the effects of the present invention, the total content of the epoxy resin and the epoxy resin curing agent in the solid content of the sealant composition is preferably 60 mass% or more, more preferably 70 mass% or more, even more preferably 80 mass% or more, and still more preferably 85 mass% or more and 100 mass% or less. The "solid content of the epoxy resin composition" means the components in the epoxy resin composition excluding water and organic solvents.

[0062] The sealant composition may contain an organic solvent, and the organic solvent is preferably a non-reactive solvent.Specific examples of the organic solvent include protic polar solvents such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methoxyethanol, 2-ethoxyethanol, 2-propoxyethanol, 2-butoxyethanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, and 1-propoxy-2-propanol, as well as ethyl acetate, butyl acetate, methyl isobutyl ketone, and toluene, which may be used alone or in combination. Among the above, from the viewpoint of improving the drying speed, at least one selected from the group consisting of methanol, ethanol, and ethyl acetate is preferred.

[0063] The sealant composition can be prepared, for example, by blending predetermined amounts of an epoxy resin, an epoxy resin curing agent, and, if necessary, additives and a solvent, and then stirring and mixing the mixture using a known method and device.

[0064] [Method of forming sealant] The sealant of the present invention is made of the cured product of the sealant composition. The method of curing the sealant composition to form the sealant is not particularly limited, and a known method can be used. For example, when producing an electronic device having a laminated structure in which a substrate, the photoelectric conversion layer, and a sealant layer made of the sealant are laminated, a method of forming a sealant composition layer on the surface of the substrate on which the photoelectric conversion layer is formed, and then curing the composition layer to form the sealant layer can be mentioned.

[0065] Examples of the method for applying the composition when forming the sealant composition layer include bar coating, Mayer bar coating, air knife coating, gravure coating, reverse gravure coating, microgravure coating, microreverse gravure coating, die coating, slot die coating, vacuum die coating, dip coating, spin coating, roll coating, spray coating, brush coating, etc. Among these, bar coating, roll coating, or spray coating is preferred, and industrially, gravure coating, reverse gravure coating, microgravure coating, or microreverse gravure coating is preferred. After the sealant composition layer is formed, a step of volatilizing the solvent (drying step) is carried out as necessary. The conditions in the drying step can be appropriately selected, but for example, the drying step can be carried out under conditions of a drying temperature of 60 to 180° C. and a drying time of 5 to 180 seconds. After the drying step, the sealant composition is cured to form a sealant layer. The curing temperature can be selected, for example, from 10 to 140° C. The curing time can be selected, for example, from 0.1 to 200 hours, and is preferably in the range of 0.5 to 100 hours.

[0066] <Characteristics of sealant> The sealant of the present invention has high water vapor barrier properties and oxygen barrier properties. For example, the sealant of the present invention has a water vapor permeability coefficient of 1.0 g mm / (m 2 ·day) or less, and the oxygen permeability coefficient at a temperature of 23°C and a relative humidity of 60% is 1.0cc·mm / (m 2 It is preferable that the time is 100-240 s or less. The water vapor permeability coefficient is more preferably 0.8 g mm / (m 2 ·day) or less, preferably 0.6g·mm / (m 2 ·day) or less, and more preferably 0.5g·mm / (m 2 ·day) or less, and even more preferably 0.3g·mm / (m 2 ·day) or less. The oxygen permeability coefficient is more preferably 0.8cc·mm / (m 2 ·day) or less, preferably 0.5cc·mm / (m 2 ·day) or less, and more preferably 0.3cc·mm / (m 2 ·day) or less, and even more preferably 0.1cc·mm / (m 2 ·day) or less, and even more preferably 0.05cc·mm / (m 2 ·day) or less. The water vapor permeability coefficient and oxygen permeability coefficient of the sealant can be specifically measured by the method described in the Examples.

[0067] [use] The present invention further relates to use of a composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified product thereof (X) as a sealant composition for electronic devices, comprising: The electronic device is represented by the following general formula (1): RM-X3(1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) The present invention provides a method for manufacturing a photoelectric conversion layer comprising: forming a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by the formula (1) or (2): wherein the organic-inorganic perovskite compound is an organic compound represented by the formula (1): The details of the encapsulant composition and the electronic device and the preferred embodiments thereof are the same as those described above. EXAMPLES

[0068] The present invention will now be described in detail with reference to examples, although the present invention is not limited to these examples in any way. In the present examples, measurements and evaluations were carried out by the following methods.

[0069] <Thickness of cured product> The thickness of the cured product of the sealant composition obtained in each example was measured using a multilayer film thickness measuring device ("DC-8200" manufactured by Gunze Ltd.).

[0070] <Water vapor permeability coefficient (g mm / (m 2 ·day))> For the cured product of the sealant composition obtained in each example, the water vapor permeability coefficient was measured under conditions of 40° C. and a relative humidity of 90% using a water vapor permeability measuring device ("PERMATRAN-W 1 / 50" manufactured by MOCON).

[0071] <Oxygen permeability coefficient (cc mm / (m 2 ·day))> For the cured product of the sealant composition obtained in each example, the oxygen permeability coefficient was measured under conditions of 23° C. and a relative humidity of 60% using an oxygen permeability measuring device ("OX-TRAN2 / 21" manufactured by Modern Controls).

[0072] Production Example 1 (Preparation of Epoxy Resin Hardener Solution A) A reaction vessel was charged with 1 mol of metaxylylenediamine (MXDA). The temperature was raised to 60°C under a nitrogen stream, and 0.93 mol of methyl acrylate was added dropwise over 1 hour. The temperature was raised to 165°C while distilling off the generated methanol, and the temperature was maintained at 165°C for 2.5 hours to obtain an amine-based curing agent A. Methanol was added dropwise thereto over 1.5 hours to obtain an epoxy resin curing agent solution A containing 65% by mass of amine-based curing agent A and 35% by mass of methanol.

[0073] Production Example 2 (Preparation of Sealant Composition A) 1.98 g of methanol and 3.25 g of ethyl acetate were added as dilution solvents and stirred thoroughly. Next, 3.64 g of the epoxy resin curing agent solution A obtained in Production Example 1 was added and stirred. 1.13 g of an epoxy resin having a glycidylamino group derived from metaxylylenediamine ("TETRAD-X" manufactured by Mitsubishi Gas Chemical Co., Ltd.) (number of active hydrogens in the epoxy resin curing agent / number of epoxy groups in the epoxy resin=1.2) was added as an epoxy resin and stirred to prepare a sealant composition A.

[0074] Production Example 3 (Preparation of Sealant Composition B) A polyfunctional epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 186 g / equivalent) was used as the epoxy resin, and metaxylylenediamine (MXDA manufactured by Mitsubishi Gas Chemical Company, Inc.) was used as the epoxy resin curing agent. 18.6 g of jER828 and 3.4 g of MXDA were mixed and stirred to prepare a sealant composition B (number of active hydrogens in the epoxy resin curing agent / number of epoxy groups in the epoxy resin=1.0).

[0075] Comparative Production Example 1 (Preparation of Sealant Composition (Comparative) C) The epoxy resin used was a multifunctional epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 186 g / equivalent), and the epoxy resin curing agent used was diethylenetriamine (DETA). 18.6 g of jER828 and 2.1 g of DETA were mixed and stirred to prepare a sealant composition (comparison) C (number of active hydrogens in the epoxy resin curing agent / number of epoxy groups in the epoxy resin=1.0).

[0076] Comparative Production Example 2 (Preparation of Sealant Composition (Comparative) D) A polyfunctional epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 186 g / equivalent) was used as the epoxy resin, and isophoronediamine (IPDA) was used as the epoxy resin curing agent. 18.6 g of jER828 and 4.3 g of IPDA were mixed and stirred to prepare a sealant composition (comparative) D (number of active hydrogens in the epoxy resin curing agent / number of epoxy groups in the epoxy resin=1.0).

[0077] Examples 1-2 and Comparative Examples 1-2 (Preparation and Evaluation of Cured Products (Sealants) of Sealant Compositions) The sealant compositions shown in Table 1 were cured at 120° C. for 1 hour to prepare cured products (thickness: about 500 μm) of each sealant composition. The obtained cured product was evaluated by the above-mentioned methods, and the results are shown in Table 1.

[0078] [Table 1]

[0079] From Table 1, the sealant in this example has a water vapor permeability coefficient of 1.0(g mm / (m 2 ·day)) or less and the oxygen permeability coefficient is 1.0 (cc·mm / (m 2 ·day) or less, which shows that both the water vapor barrier property and the oxygen barrier property are excellent. [Industrial Applicability]

[0080] According to the present invention, it is possible to provide a sealant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound, the sealant having excellent water vapor barrier properties and oxygen barrier properties, and an electronic device having the sealant. [Explanation of symbols]

[0081] 1 Base material 2 Photoelectric conversion layer 21 End face of peripheral portion of photoelectric conversion layer 3, 31, 32 Sealant 4 Opposing substrate

Claims

1. The following general formula (1): R-M-X ３ (1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A encapsulant for an electronic device having a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by, The encapsulant comprises a cured product of an encapsulant composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified form thereof (X).

2. The encapsulant according to claim 1, wherein the modified xylylenediamine is a reaction product of the following component (A) and component (B). (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine (B) At least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (2) and their derivatives. 【Chemistry 1】 (In formula (2), R １ , R ２ Each of these independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms.

3. The encapsulant according to claim 1 or 2, wherein the ratio of the number of active hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin in the encapsulant composition (number of active hydrogens / number of epoxy groups) is in the range of 0.8 to 3.

0.

4. The encapsulant according to claim 1 or 2, wherein the epoxy resin mainly comprises an epoxy resin having a glycidylamino group derived from metaxylylenediamine.

5. The encapsulant according to claim 2, wherein component (A) is metaxylylenediamine and component (B) is at least one selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, and derivatives thereof.

6. The water vapor transmission coefficient of the aforementioned sealant at a temperature of 40°C and a relative humidity of 90% is 1.0 g / mm / (m). ２ The oxygen permeability coefficient is less than or equal to 1.0 cc·mm / (m³) at a temperature of 23°C and a relative humidity of 60%. ２ The sealing agent according to claim 1 or 2, wherein the day is less than or equal to [number] days.

7. The encapsulant according to claim 1 or 2, wherein the electronic device is a solar cell.

8. The following general formula (1): R-M-X ３ (1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) A photoelectric conversion layer containing an organic-inorganic perovskite compound represented by, An electronic device having a encapsulant comprising an epoxy resin and a encapsulant comprising a cured product of an encapsulant composition containing xylylenediamine or a modified form thereof (X).

9. The electronic device according to claim 8, wherein the electronic device comprises, in order, a substrate, the photoelectric conversion layer, and a counter substrate, and the photoelectric conversion layer is sealed between the substrate and the counter substrate.

10. The use of a composition containing an epoxy resin and an epoxy resin curing agent containing xylylenediamine or a modified thereof (X) as a encapsulant composition for electronic devices, The aforementioned electronic device is given by the following general formula (1): R-M-X ３ (1) (In formula (1), R is an organic cation or a metal cation, M is a metal atom, and X is a halogen atom or a chalcogen atom.) The device has a photoelectric conversion layer containing an organic-inorganic perovskite compound represented by [formula].

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