Light-emitting device
Patent Information
- Application Number
- JP2024217185
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2014-10-28
- Filing Date
- 2024-12-12
- Publication Date
- 2025-02-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
【0032】 本発明の一態様では、可搬性に優れた発光装置、表示装置、入出力装置、電子機器、もし くは照明装置を提供できる。または、本発明の一態様では、一覧性に優れた発光装置、表 示装置、入出力装置、もしくは電子機器を提供できる。または、本発明の一態様では、可 搬性及び一覧性に優れた発光装置、表示装置、入出力装置、もしくは電子機器を提供でき る。
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Figure 2025026701000001_ABST
Abstract
Description
[Technical field]
[0001] One aspect of the present invention relates to a light-emitting device. In particular, one aspect of the present invention relates to an organic electroluminescent device. Electroluminescence (EL) phenomenon is used The present invention relates to a light emitting device.
[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the semiconductor device include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, Input devices (e.g., touch sensors, etc.), input / output devices (e.g., touch panels, etc.), These driving methods or manufacturing methods can be given as examples. [Background technology]
[0003] In recent years, light-emitting devices and display devices are expected to be used for a variety of purposes, and diversification is required. There are.
[0004] For example, in light-emitting devices and display devices for use in portable devices, etc., the devices are required to be thin and lightweight. It is also required that the material be resistant to damage.
[0005] Light-emitting elements that utilize the EL phenomenon (also referred to as EL elements) are easy to make thin and lightweight. It has features such as being able to respond quickly to signals and being able to be driven by a low-voltage DC power supply. Applications of these materials to light-emitting devices and display devices are currently being considered.
[0006] For example, Patent Document 1 discloses a film substrate on which transistors and organic EL display devices are mounted. A flexible active matrix type light emitting device having an EL element is disclosed. [Prior art documents] [Patent documents]
[0007] [Patent Document 1] JP 2003-174153 A Summary of the Invention [Problem to be solved by the invention]
[0008] For portable device applications, efforts are being made to miniaturize light-emitting devices and display devices in order to increase portability. On the other hand, there is also a demand for larger light-emitting and display areas to improve viewability.
[0009] One embodiment of the present invention is a light-emitting device, a display device, an input / output device, an electronic device, or a Another object of the present invention is to provide a lighting device having excellent visibility. It is an object of the present invention to provide a light-emitting device, a display device, an input / output device, or an electronic device having the same. Another embodiment of the present invention is a light-emitting device, a display device, or an input / output device that is highly portable and easy to view. One of the objectives of the present invention is to provide a device or electronic device.
[0010] Another embodiment of the present invention is a novel light-emitting device, a display device, an input / output device, an electronic device, or Another object of the present invention is to provide a lighting device that is not easily damaged. The present invention aims to provide a light-emitting device, a display device, an input / output device, an electronic device, or a lighting device. Another embodiment of the present invention is a light-emitting device, a display device, an input / output device, or the like that has high reliability. Another object of the present invention is to provide an electronic device or a lighting device. The present invention provides a light-emitting device, a display device, an input / output device, an electronic device, or a lighting device with low power consumption. One of the purposes of this organization is to provide
[0011] Another object of one embodiment of the present invention is to provide a lightweight light-emitting device or the like. An object of one embodiment of the present invention is to provide a thin light-emitting device or the like. An object of one embodiment of the present invention is to provide a flexible light-emitting device or the like. One aspect of the present invention is a light-emitting device or lighting device having a seamless, large light-emitting area. To provide a display device, an input / output device, or an electronic device having a seamless wide display area One of the objectives of the Society is to
[0012] The description of these problems does not preclude the existence of other problems. It is not necessary for the embodiment to solve all of these problems. It is possible to extract problems other than those mentioned above from the description of the claim. [Means for solving the problem]
[0013] One embodiment of the present invention is a light-emitting device having first to third regions. The first region is a light-emitting device having a second The first region is located between the second region and the third region, and among the first region to the third region, the first region is the most flexible. The first region has a light emitting panel and a plurality of spacers, and the second region has a light emitting panel. and a first support, and the third region has a light-emitting panel and a second support, and the light-emitting panel Among the first support, the light-emitting panel has the highest flexibility, and the second support has the highest flexibility. The region has a portion where each of the plurality of spacers and the light-emitting panel overlap each other, and the second region The first support and the light-emitting panel overlap each other in the third region. The body and the light-emitting panel have an overlapping portion, and when the first region is bent, two adjacent The angle between the normals of the opposing surfaces of the spacer changes in accordance with the light-emitting panel. It is a device.
[0014] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region has a light emitting panel and a plurality of spacers, and the second region has a light emitting the third region having a light emitting panel and a second support; Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility; The first region has a portion where each of the plurality of spacers and the light-emitting panel overlap each other, The second region has a portion where the first support and the light-emitting panel overlap each other, and the third region has a portion where the first support and the light-emitting panel overlap each other. The support member 2 and the light-emitting panel have overlapping portions, and the spacers are each a light-emitting The light emitting device has a panel and a fixed portion.
[0015] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region is highly flexible and includes a light-emitting panel, a protective layer, and a plurality of spacers. The region has a light-emitting panel, a protective layer, and a first support, and the third region has a light-emitting panel, a protective layer, and a second support. a protective layer, and a second support, and among the light-emitting panel, the first support, and the second support, The light-emitting panel is the most flexible, and among the protective layer, the first support, and the second support, the protective The layer is the most flexible, and the first region is a region where each of the plurality of spacers and the light-emitting panel are held. The second region has a portion where the first support and the light-emitting panel overlap each other via the protective layer, The second support and the light-emitting panel overlap each other through the protective layer. In the third region, the second support and the light-emitting panel The spacers have portions that overlap each other via a protective layer, and the spacers are fixed to the protective layer. The light emitting device has a portion that is
[0016] In one embodiment of the present invention, the number of spacers may be 2 or more. The present invention relates to a light emitting device having first to third regions, and the first region is divided into a second region and a third region. The first region is located between the first and third regions, and among the first to third regions, the first region is the most flexible. The region includes a light-emitting panel, a first spacer, and a second spacer, and the second region includes a light-emitting The third region has a light-emitting panel and a second support, and the third region has a light-emitting panel and a second support. Among the light panel, the first support, and the second support, the light-emitting panel is the most flexible, and the second support is the most flexible. The first region has a portion where the first spacer and the light-emitting panel overlap each other, and the first region includes: The second spacer and the light-emitting panel have an overlapping portion, and the second region is a first support. and the light-emitting panel have an overlapping portion, and the third region has a portion where the second support and the light-emitting panel overlap each other. have an overlapping portion, and when the first region is bent, the first spacer and the second spacer The angle between the normals of the opposing surfaces of the light emitting panel and the light emitting panel changes in accordance with the light emitting panel. be.
[0017] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region is highly flexible and includes a light-emitting panel, a first spacer, and a second spacer. The second region has a light-emitting panel and a first support, and the third region has a light-emitting panel and The light-emitting panel includes a first support and a second support. The first region is the most flexible, and the first region is the portion where the first spacer and the light-emitting panel overlap each other. The first region has a portion where the second spacer and the light-emitting panel overlap each other, and the second The region has a portion where the first support and the light-emitting panel overlap each other, and the third region has a portion where the second support and the light-emitting panel overlap each other. The support and the light-emitting panel have a mutually overlapping portion, and the first spacer is fixed to the light-emitting panel. the second spacer has a portion fixed to the light-emitting panel, It is a light-emitting device.
[0018] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region is highly flexible and includes a light-emitting panel, a protective layer, a first spacer, and a second spacer. the second region includes a light-emitting panel, a protective layer, and a first support; and the third region includes , a light-emitting panel, a protective layer, and a second support, Among the supports, the light-emitting panel has the highest flexibility, and the protective layer, the first support, and the second support are The protective layer is the most flexible of the support, and the first region is made up of the first spacer and the light-emitting panel. The first region includes a second spacer and a light-emitting panel, and the second region includes a second spacer and a light-emitting panel. The first region has a portion where the first support and the light-emitting panel overlap each other via the protective layer, and the second region has a portion where the first support and the light-emitting panel overlap each other via the protective layer. The second support and the light-emitting panel have a portion overlapping each other via the protective layer, and the third region is a region between the second support and the light-emitting panel. The panel and the first spacer have a portion overlapping each other via the protective layer, and the first spacer is fixed to the protective layer. a light-emitting element having a portion fixed to the protective layer, and a second spacer having a portion fixed to the protective layer; It is a device.
[0019] In the above-mentioned structure, it is preferable that the protective layer has a portion fixed to the light-emitting panel. In particular, in the first region, the protective layer may have a portion fixed to the light-emitting panel. preferable.
[0020] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region has a light-emitting panel and a connection portion, and the second region has a light-emitting panel. and a first support, and the third region has a light-emitting panel and a second support, and the light-emitting panel Among the first support, the light-emitting panel has the highest flexibility, and the second support has the highest flexibility. The first region has a portion where the connection portion and the light-emitting panel overlap each other, and the second region has a portion where the first support and The second support and the light-emitting panel have a portion where they overlap each other, and the third region is a region where the second support and the light-emitting panel overlap each other. The connecting portion has an elastic body and a plurality of spacers, and the elastic body has a first The spacers each have an opening. The plurality of spacers are connected to each other by an elastic body passing through the opening. do.
[0021] Another embodiment of the present invention is a light-emitting device having first to third regions, the first region being , located between the second region and the third region, and among the first to third regions, the first region is the largest. The first region has a light-emitting panel and a connection portion, and the second region has a light-emitting panel. and a first support, and the third region has a light-emitting panel and a second support, and the light-emitting panel Among the first support, the light-emitting panel has the highest flexibility, and the second support has the highest flexibility. The first region has a portion where the connection portion and the light-emitting panel overlap each other, and the second region has a portion where the first support and The second support and the light-emitting panel have a portion where they overlap each other, and the third region is a region where the second support and the light-emitting panel overlap each other. The first support and the second support have overlapping portions, and the connecting portion has a function of connecting the first support and the second support. The connecting portion has an elastic body, a first spacer, and a second spacer, and the first spacer is The second spacer has an opening, and the first spacer is connected to the second spacer by an elastic body passing through the opening. The first spacer and the second spacer are connected to each other, forming a light emitting device.
[0022] In the above-mentioned configuration, each of the spacers has a portion fixed to the light-emitting panel. It is preferable that
[0023] In each of the above configurations, the elastic body is preferably a spring or rubber.
[0024] In each of the above configurations, when the light emitting device is in an expanded state, the elastic body has a length equal to or longer than its natural length. It is preferable that the natural length is the length when no load is applied to the elastic body (spring, rubber, etc.). This refers to the length when the elastic body is not stretched or contracted.
[0025] In each of the above configurations, a protective layer is provided, and the first region is provided between the connection portion and the light-emitting panel through the protective layer. In the second region, the first support and the light-emitting panel are overlapped with each other through a protective layer. The third region has a portion where the second support and the light-emitting panel overlap each other via a protective It is preferable that the layers overlap each other.
[0026] In each of the above configurations, in the first region, the plurality of spacers are fixed to the protective layer. It is preferred that the moiety has a
[0027] In each of the above configurations, in the first region, the protective layer has a portion that is fixed to the light-emitting panel. It is preferable to do so.
[0028] In each of the above configurations, the spacer has a first surface on the light-emitting panel side and a second surface on the opposite side to the first surface. It is preferable that the width of the first surface is wider than that of the second surface.
[0029] Although the light-emitting device having the light-emitting panel has been described above as an example, the display device to which the above-described configurations are applied may be used. The display device according to one embodiment of the present invention may also be a display panel. An input / output device according to one embodiment of the present invention includes a touch panel.
[0030] Another embodiment of the present invention is a light-emitting device, a display device, or an input / output device to which any of the above structures is applied. It has an output device and can be used with FPC (Flexible printed circuit) or A connector such as TCP (Tape Carrier Package) is attached. Modules with ICs mounted by COG (Chip On Glass) method, etc. It is a module that has been
[0031] In addition, an electronic device or a lighting device using the above module is also one embodiment of the present invention. One aspect of the invention is a device that includes the above module, an antenna, a battery, a housing, a speaker, a microphone, and an operating system. and an operation switch or an operation button. Effect of the Invention
[0032] In one embodiment of the present invention, a light-emitting device, a display device, an input / output device, an electronic device, or the like that is highly portable can be used. Alternatively, in one embodiment of the present invention, a light-emitting device or a lighting device having excellent visibility can be provided. In one embodiment of the present invention, a display device, an input / output device, or an electronic device can be provided. It is possible to provide a light-emitting device, a display device, an input / output device, or an electronic device that is excellent in portability and visibility. do.
[0033] In another embodiment of the present invention, a novel light-emitting device, a display device, an input / output device, an electronic device, or In one embodiment of the present invention, a light-emitting device that is not easily damaged can be provided. It is possible to provide a display device, an input / output device, an electronic device, or a lighting device. In one embodiment of the present invention, a light-emitting device, a display device, an input / output device, an electronic device, or the like having high reliability can be provided. Alternatively, a lighting device with low power consumption can be provided. It is possible to provide a light-emitting device, a display device, an input / output device, an electronic device, or a lighting device. do.
[0034] Alternatively, in one embodiment of the present invention, a lightweight light-emitting device or the like can be provided. In one embodiment of the present invention, a thin light-emitting device or the like can be provided. In this embodiment, a flexible light-emitting device or the like can be provided. The present invention relates to a light-emitting device or lighting device having a seamless, large light-emitting area, or a seamless, large light-emitting area. It is possible to provide a display device, an input / output device, or an electronic device having a large display area.
[0035] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have all of these effects. It is possible to extract other effects from the description in the section. [Brief description of the drawings]
[0036] [Figure 1] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Diagram 2] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Diagram 3] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 4] FIG. 13 is a diagram showing an example of a connecting portion and a spacer. [Diagram 5] FIG. [Figure 6] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 7] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 8] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 9] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 10] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 11] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 12] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 13] 1A and 1B are diagrams illustrating an example of a light-emitting device. [Figure 14] FIG. 1 is a diagram showing an example of a light-emitting panel. [Figure 15] FIG. 1 is a diagram showing an example of a light-emitting panel. [Figure 16] FIG. 1 is a diagram showing an example of a light-emitting panel. [Figure 17] FIG. 1 is a diagram showing an example of a light-emitting panel. [Figure 18] FIG. 2 is a diagram showing an example of a touch panel. [Figure 19] FIG. 2 is a diagram showing an example of a touch panel. [Figure 20] FIG. 2 is a diagram showing an example of a touch panel. [Figure 21] FIG. 2 is a diagram showing an example of a touch panel. [Figure 22] 1 is a photograph showing a light emitting device according to an embodiment of the present invention. [Diagram 23] 1 is a photograph showing a light emitting device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0037] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the above-mentioned invention can be obtained by the following embodiments. It should not be construed as being limited to the contents described.
[0038] In the configuration of the invention described below, the same parts or parts having similar functions are referred to as the same parts. The same reference numerals are used in common among different drawings, and the repeated explanations are omitted. When referring to a function, the same hatch pattern may be used and no particular reference number may be given.
[0039] In addition, the position, size, range, etc. of each component shown in the drawings are not necessarily the same as in the actual embodiment, in order to facilitate understanding. Therefore, the disclosed invention may not necessarily represent the position, size, range, etc. Furthermore, the present invention is not limited to the position, size, range, etc. disclosed in the drawings.
[0040] The words "film" and "layer" may be interchangeable depending on the circumstances. For example, the term "conductive layer" can be replaced with "conductive film" Alternatively, for example, the term "insulating film" can be changed to " The term "insulating layer" may be changed to "insulating layer."
[0041] (Embodiment 1) In this embodiment, a light-emitting device according to one embodiment of the present invention will be described with reference to FIGS.
[0042] In this embodiment, a light-emitting device using an organic EL element is mainly illustrated. The present invention is not limited to this. A light-emitting device using other light-emitting elements or display elements as exemplified in the second embodiment Another embodiment of the present invention is a light-emitting device or a display device. The present invention can be applied not only to a single device but also to various devices such as an input / output device.
[0043] A light-emitting device according to one embodiment of the present invention has a strip-shaped highly flexible region, a strip-shaped less flexible region, and The light emitting device can be folded by bending it at the highly flexible region. The light-emitting device according to one embodiment of the present invention is highly portable when folded and can be folded and unfolded. The seamless, wide light-emitting area provides excellent visibility.
[0044] In the light-emitting device according to one embodiment of the present invention, the highly flexible region is folded inward or outward. In the light emitting device of the present embodiment, one light emitting panel can be folded one or more times. In this case, the radius of curvature is, for example, 0.01 mm or more and 150 mm or less. It is possible.
[0045] In this specification, the term "inward bending" refers to bending the light-emitting surface of the light-emitting panel inward. In addition, when the light-emitting panel is bent so that the light-emitting surface faces outward, this is referred to as "outward bending." The light-emitting surface of a panel or a light-emitting device refers to the surface through which light from a light-emitting element is extracted.
[0046] When the light-emitting device according to one embodiment of the present invention is not in use, the light-emitting panel is bent so that the light-emitting surface faces inward. By doing so, it is possible to prevent scratches and dirt on the light-emitting surface.
[0047] When using the light-emitting device according to one embodiment of the present invention, it can be unfolded to provide a seamless, wide light-emitting area. The entire light emitting area can be used, or the light emitting surface of the light emitting panel can be bent outward to reduce the light emitting area. A part of the light-emitting area may be used. The light-emitting area is folded and cannot be seen by the user. By doing so, the power consumption of the light emitting device can be reduced.
[0048] One embodiment of the present invention is a light-emitting device having first to third regions. The first region is located between the second region and the third region, and among the first region to the third region, the first region is the most flexible. The second region has a light-emitting panel and a first support overlapping each other. The third region has a light-emitting The light-emitting panel includes a first support and a second support, which are stacked on top of each other. Of the supports, the light-emitting panel is the most flexible.
[0049] The first region includes a light-emitting panel and a plurality of spacers. The light-emitting panel overlaps with the light-emitting panel.
[0050] The first region having high flexibility has a light-emitting panel and a member (here, a spacer) overlapped therewith. This provides higher mechanical strength and resistance to bending compared to a case consisting of only light-emitting panels. .
[0051] On the other hand, by stacking the light-emitting panel and the material, compressive stress and tensile stress that occur due to deformation such as bending are reduced. The neutral surface (surface that does not expand or contract) is the surface on which no stress distortion due to tensile stress occurs. The farther the neutral plane is from the light-emitting panel, the more bending can cause the light-emitting panel to Compressive or tensile stress is applied to the light-emitting panel, making it more susceptible to damage.
[0052] In the light-emitting device according to one embodiment of the present invention, when the first region is bent, the two adjacent spaces are bent. The angle between the normals of the opposing surfaces of the laser changes in accordance with the light-emitting panel. By adopting such a configuration, it is possible to prevent the neutral surface from moving away from the light-emitting panel. By moving the neutral plane closer to the light-emitting panel or forming the neutral plane inside the light-emitting panel, The light-emitting panel is less likely to expand and contract when the light device is bent. Damage to the optical panel can be reduced.
[0053] In the following, a bi-fold with one highly flexible region between two less flexible regions is described. In this embodiment, a light emitting device having a high flexibility and An example is shown in which the less flexible regions or the less flexible regions are parallel to each other. The regions do not have to be arranged in parallel.
[0054] <Configuration example A> FIG. 1(A) shows the light-emitting device in an unfolded state. FIG. 1(B) shows the light-emitting device in an unfolded or folded state. Figure 1(C) shows the light-emitting device in the process of changing from one folded state to the other. 1 shows the light emitting device in a blank state.
[0055] The light emitting device has a first region 151, a second region 152, and a third region 153. The first region 151 is located between the second region 152 and the third region 153. 51 is the most flexible of the three regions.
[0056] The light emitting device includes a light emitting panel 101, a support 103(1), a support 103(2), and a plurality of The spacer 108 is made of a material other than aluminum.
[0057] The light-emitting panel 101 includes a light-emitting area 111 (which may also be called a light-emitting section, a pixel section, or a display section). The non-light emitting region 112 is provided so as to surround the light emitting region 111. is.
[0058] The light-emitting panel 101 is flexible. A light-emitting panel using an organic EL element has high flexibility and This is preferable because it is possible to achieve a thin and lightweight structure in addition to excellent shock resistance.
[0059] The support 103(1) and the support 103(2) are spaced apart from each other. Each of them has a lower flexibility than the light-emitting panel 101 .
[0060] The first region 151 includes the light-emitting panel 101 and a plurality of spacers 108. Each of the spacers 108 and the light-emitting panel 101 overlap each other. Each spacer 108 is fixed to the light-emitting panel 101. Adjacent spacers 108 are fixed to each other. With this configuration, when the first region 151 is bent, two adjacent strips The angle between the normals of the opposing surfaces of the spacer 108 changes in accordance with the light-emitting panel 101. This forms a neutral surface within the light-emitting panel 101 or in the vicinity of the light-emitting panel 101. It is possible.
[0061] The spacer 108 may have a portion that does not overlap with the light-emitting panel 101. The light-emitting panel 101 may overlap the entire surface of the spacer 108 .
[0062] In this embodiment, the spacer 108 is located on the side opposite to the light emitting surface of the light emitting panel 101. However, the present invention is not limited to this embodiment. The spacer 108 may be located on the light emitting surface side of the light emitting panel 101. When positioned, the spacers 108 preferably overlap only the non-emitting regions 112. When the spacer 108 overlaps with the light emitting region 111, the spacer 108 is made of a material that transmits visible light. It is preferable to use
[0063] The second region 152 includes the light-emitting panel 101 and the support 103(1) stacked together. 103(1) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. 1 and support 103(1) may be fixed to each other.
[0064] The third region 153 has the light-emitting panel 101 and the support 103(2) stacked together. 103(2) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. 1 and support 103(2) may be fixed to each other.
[0065] If the support is provided only on the side opposite to the light-emitting surface of the light-emitting panel 101, the light-emitting device can be made thin or This is preferable because it can be made lightweight.
[0066] <Configuration example B> FIG. 2(A) shows the light-emitting device in an unfolded state. FIG. 2(B) shows the light-emitting device in an unfolded or folded state. Figure 2(C) shows the light-emitting device in the process of changing from one folded state to the other. In the following configuration examples (including modified examples), the above-described configuration is used. Description of configurations similar to those in the examples may be omitted.
[0067] The light emitting device includes a light emitting panel 101, a support 103a(1), a support 103a(2), and a support 103b(1), a support 103b(2), and a connection portion 105.
[0068] The support 103a(1) and the support 103a(2) are spaced apart from each other. The four supports are each a light-emitting panel. It has lower flexibility than 101.
[0069] The second region 152 is a region between the support 103a(1) and the support 103b(1) and includes the light-emitting panel 1. The support 103a(1) is located on the light emitting surface side of the light emitting panel 101. The body 103b(1) is located on the side opposite to the light emitting surface of the light emitting panel 101. 101 is fixed to at least one of the support 103a(1) and the support 103b(1). It may be possible.
[0070] The third region 153 is a region between the support 103a(2) and the support 103b(2) where the light-emitting panel 1 is disposed. The support 103a(2) is located on the light emitting surface side of the light emitting panel 101. The body 103b(2) is located on the side opposite to the light emitting surface of the light emitting panel 101. 101 is fixed to at least one of the support 103a(2) and the support 103b(2). It may be possible.
[0071] When the light-emitting panel 101 has supports on both the light-emitting surface side and the surface opposite the light-emitting surface, a pair of Since the light-emitting panel 101 can be sandwiched between the supports, the mechanical strength of the less flexible area can be increased. This is preferable because it makes the light emitting device less susceptible to damage.
[0072] The first region 151 includes the light-emitting panel 101 and the connection portion 105. The connecting portion 105 overlaps with each other.
[0073] Side views of the connection portion 105 in each state of FIG. 2(A) to (C) are shown in FIG. 3(A) to (C). 4(A) and 5 show examples of top views of the connection portion 105, respectively. ) shows a perspective view of the spacer 108.
[0074] The connection portion 105 includes an elastic body 106 and a plurality of spacers 108 .
[0075] In addition, in Figs. 3(A) to (C), 4(A), and 5, the elastic body 106 is shown by a thin solid line. The elastic body 106 is not actually exposed to the outside of the spacer 108, but is provided on the spacer 108. It is located in a recessed opening.
[0076] One end of the elastic body 106 is fixed to the support 103b(1). The other end of the elastic body 106 is fixed to the support 103b(2). It connects the body 103b(1) and the support 103b(2).
[0077] The spacer 108 has an opening. The spacer 108 is connected via the elastic body 106. Specifically, the elastic body 106 passes through the opening and connects a plurality of spacers 108. The number of openings that the pacer 108 has is not particularly limited.
[0078] The number of spacers 108 is not particularly limited.
[0079] The light emitting device may have one spacer 108. In the case where there is one spacer 108, the angle between the normal lines of the opposing surfaces of the spacer 108 and the support is It is sufficient that the neutral surface is changed in accordance with the light-emitting panel. It is possible to prevent the light emitting element from being separated from the light emitting panel.
[0080] The light emitting device preferably has a plurality of spacers 108 .
[0081] FIG. 4A shows an example in which ten spacers 108 are arranged in one direction. There are two rows of 0 spacers 108 arranged in one direction, and the connection portion 105 has a total of 20 spaces. 108.
[0082] The more spacers 108 arranged in a row, the smoother the bending of the light emitting device can be, which is preferable. In addition, the narrower the width (length in the short direction) of the spacer 108, the easier it is to mount the light emitting device. By arranging many narrow spacers 108, it is possible to bend the wire more easily. It is possible to realize a light emitting device with extremely high light emission power.
[0083] In the configuration of FIG. 5, the spacers 108 are arranged in two separate rows, with a gap between the rows. On the other hand, in the configuration of FIG. 4(A), the spacers 108 are aligned in a row, so there is no gap. Therefore, when the light-emitting device is folded, the folded part of the light-emitting panel is not easily exposed. This prevents the light-emitting panel from being damaged or the elements contained in the panel from being destroyed. do.
[0084] Each of the spacers 108 and the light-emitting panel 101 overlaps with each other. 108 are connected to each other by elastic bodies 106 that pass through the openings. The first region 151 is not fixed. With this configuration, when the first region 151 is bent, The angle between the normal lines of the opposing surfaces of two adjacent spacers 108 is 1. This causes the light-emitting panel 101 or the vicinity of the light-emitting panel 101 to change. A neutral surface can be formed.
[0085] The upper right portion of FIG. 3C shows an enlarged view of two adjacent spacers 108. ), the angle θ between the normals of the opposing faces of the two spacers 108 is an acute angle. As the light-emitting device is deployed from the state shown in FIG. 3(C), the angle θ becomes smaller. In the state of 3(A), the angle θ is 0°, that is, the angle between the adjacent two spacers 108 is 0°. When the opposing surfaces come into contact, the light emitting device cannot be bent any further. In this case, the first region 151 can be said to be a portion that cannot be bent outward.
[0086] In this case, the spacer 108 is located on the side opposite to the light-emitting surface of the light-emitting panel 101. An example is shown in which the first region 151 is an area where inward bending is possible but outward bending is not possible. One embodiment is not limited to this. In this case, the first region 151 is a region where outward bending is possible but inward bending is not possible.
[0087] The light emitting device shown in FIG. 3(C) can also be bent with a smaller radius of curvature than in the state of FIG. 3(C). However, if the light-emitting panel 101 is bent with an extremely small radius of curvature, 01 may be damaged. Therefore, By adjusting the thickness or by arranging fixtures to fix the two supports, It is preferable that the support 103b(1) and the support 103b(2) are spaced apart from each other by a certain distance. This can prevent light-emitting panel 101 from being bent with an extremely small radius of curvature.
[0088] The range in which the light emitting device can be bent in the first region 151 is determined by the shape and number of the spacers 108. Can be controlled.
[0089] For example, the cross-sectional shape of the spacer 108 perpendicular to the longitudinal direction is not limited, and may be a triangle, a square, a pentagon, or the like. It may be square, polygonal such as a hexagon (including polygons with rounded corners), or circular.
[0090] For example, as shown in the present configuration example B, the cross-sectional shape of the spacer 108 perpendicular to the longitudinal direction is a square. The two opposing sides of the spacer 108 (each adjacent side) may be a square, rectangular, parallelogram, etc. The spacer 108 and the two opposing surfaces are parallel. The high areas are areas that can only be bent inwards or outwards.
[0091] Alternatively, for example, as described later in configuration example D, the cross-sectional shape perpendicular to the longitudinal direction of the spacer 108 is Assume that the shape of the spacer 108 is a trapezoid or the like, in which two opposing side surfaces of the spacer 108 are not parallel. At this time, the highly flexible region is a portion that can be bent both inwardly and outwardly.
[0092] Each of the plurality of spacers 108 is preferably fixed to the light-emitting panel 101 . This makes it possible to suppress the movement of the spacer 108 in the longitudinal direction of the spacer 108. .
[0093] The elastic body 106 may be, for example, a spring or rubber. In this case, it is preferable that the elastic body 106 has a length equal to or longer than the natural length. It is easier to keep the light device deployed. On the other hand, it is easier to keep the light device bent. In order to make it easier to hold, the elastic body 106 is required to be longer than its natural length when the light emitting device is in the deployed state. It is sufficient as long as it is full length.
[0094] <Variation 1> 6(A) and (B) show top views of the light emitting device in an unfolded state.
[0095] The light emitting device shown in FIG. 6A is a light emitting device that can display a light emitting area 111 and a non-light emitting area 112 to a user who is viewing the light emitting surface of the light emitting device. This is an example in which both light emitting areas 112 are visible.
[0096] The light emitting device shown in FIG. 6B has a non-light emitting area 112 that is visible to a user looking at the light emitting surface of the light emitting device. In this example, the light emitting region 111 is not visible, and only the light emitting region 111 is visible.
[0097] The light emitting device shown in FIG. 6(A) is a modified example of configuration example B, but may be applied to configuration example A. Similarly, the light emitting device shown in FIG. 6B is a modified example of the configuration example A, but can be applied to the configuration example B. Good too.
[0098] The light-emitting device shown in Figures 6(A) and (B) has a light-shielding layer 109. The light-shielding layer 109 is The light-shielding layer 109 overlaps the connecting portion 105 or the spacer 108. By stacking them, the connecting portion 105 or the spacer 106 is visible to a user who is looking at the light emitting surface of the light emitting device. 08 can be made invisible.
[0099] The light-shielding layer 109 may overlap with the non-light-emitting area 112 of the light-emitting panel. By placing the non-light emitting area 112 over the non-light emitting area 112, external light is irradiated onto the non-light emitting area 112. This can suppress the transistors of the driving circuits included in the non-light emitting area 112 from This can suppress photodegradation of the laser and the like.
[0100] The light-shielding layer 109 is made of a material that can block light and has flexibility. For example, resin, Plastics, metals, alloys, rubber, paper, etc. can be used. A film or tape may be used. Also, an adhesive layer may be provided between the light-shielding layer 109 and the connection portion 105. It is okay to do so.
[0101] <Variation 2> FIG. 7(A) shows a top view of the light-emitting device in an unfolded state. FIG. 7(B) shows a top view of the light-emitting device in a folded state. 1 shows a side view of a light emitting device in the above embodiment.
[0102] The light emitting device shown in FIGS. 7A and 7B has only one spacer 108. 8 has a plurality of cuts. The plurality of protrusions separated by the cuts are similar to the previous configuration example. In other words, when the first region 151 is bent, The angle between the normals of the opposing faces of two adjacent protrusions follows the light-emitting panel 101. As a result, a neutral plane is generated in the light-emitting panel 101 or in the vicinity of the light-emitting panel 101. The deeper the cut, the more the thickness of the light-emitting panel 101 or the light-emitting panel 1 It is easy to form a neutral surface in the vicinity of the spacer 108 having a notch. It is okay to do so.
[0103] The light emitting device shown in FIGS. 7A and 7B has a fixture 107. By doing so, when the light emitting device is folded, the light emitting panel 101 is bent with an extremely small radius of curvature. The fixing device 107 is provided with a magnet. A fixing tool of a jit type or a mechanical type can be used. The light device can remain folded.
[0104] <Variation 3> FIG. 7(C) shows a side view of the light emitting device in an unfolded state. The light emitting device shown in FIG. 3(A) to 3(C).
[0105] The light-emitting panel 101 may have a protective layer 113a on the light-emitting surface. The protective layer 113a is If the protective layer 113 transmits visible light, it can be disposed so as to overlap the light-emitting region 111. When the visible light is not transmitted through the a, the a has an opening in the portion overlapping with the light emitting region 111. The protective layer 113a may also function as the light blocking layer 109 described above.
[0106] A protective layer 113b may be provided between the light-emitting panel 101 and the connection portion 105. 13b is fixed to the connection portion 105. For example, the plurality of spacers 108 are As a result, the spacer 108 is This can prevent the sensor 108 from moving.
[0107] Moreover, it is preferable that protective layer 113b is fixed to light-emitting panel 101. In the area where the optical panel 101, the protective layer 113b, and the connection portion 105 overlap each other, It is preferable that the layer 113b and the light-emitting panel 101 are fixed to each other. This can further increase the mechanical strength of the first region 151 having a high mechanical strength.
[0108] The thinner the protective layer 113b, the less likely the neutral surface is to separate from the light-emitting panel 101. Protective layer 113b is preferably formed on the light-emitting surface of light-emitting panel 101 so as to prevent damage to light-emitting panel 1. Since the protective layer 113b is located on the opposite side, the transparency of visible light is not an issue. The mechanical strength of the light emitting device is increased, and the light emitting panel 101 can be effectively protected. The thickness of b is, for example, 0.01 times or more and 10 times or less than the thickness of the light-emitting panel 101, and preferably The range may be from 0.05 to 5 times, and more preferably from 0.05 to 3 times. .
[0109] In addition, the protective layer 113b is disposed so as to overlap both the light emitting region 111 and the non-light emitting region 112. The larger the area where protective layer 113b and light-emitting panel 101 overlap, the greater the light-emitting area. The panel 101 can be better protected, and the reliability of the light emitting device can be improved. For example, support 103a(1), support 103a(2), support 103b(1), or support At least one (preferably all) of 103b(2) is overlapped with protective layer 113b. Good.
[0110] The protective layer is preferably more flexible than the support. Thin is preferable.
[0111] By providing at least one of the protective layer 113a and the protective layer 113b, a highly flexible region However, since the region has flexibility and high mechanical strength, the light emitting device is less likely to be damaged. Therefore, the elasticity can be increased not only in the region with low flexibility but also in the region with high flexibility. Even if the light emitting device is exposed to the outside, the light emitting device is unlikely to be damaged due to deformation caused by an external force or the like.
[0112] By providing only one of the protective layers 113a and 113b, the light emitting device can be made thinner. Or, it can be made lighter, which is preferable.
[0113] When both the protective layer 113a and the protective layer 113b are provided, the light-emitting panel is protected by the pair of protective layers. Since the light emitting device can be sandwiched between the light emitting elements, the mechanical strength of the light emitting device can be increased, and the light emitting device can be made less susceptible to damage, which is preferable. It is.
[0114] <Examples of materials for light-emitting devices> The materials used for the spacer, protective layer, and support are not particularly limited. For example, It can be made of plastic, metal, alloy, rubber, etc. This is preferable because it is possible to obtain a spacer, a protective layer, or a support that is lightweight and not easily damaged. For example, silicone rubber is used as the protective layer, and stainless steel or aluminum is used as the spacer and support. Minium can be used.
[0115] In addition, it is preferable that the spacer, the protective layer, and the support are each made of a material having high toughness. This makes it possible to realize a light-emitting device that is highly impact resistant and less likely to break. By using resin and thin metal and alloy materials, the light-emitting element is lightweight and resistant to breakage. For the same reason, the substrate that constitutes the light-emitting panel must also have high toughness. It is preferable to use materials.
[0116] The spacer, protective layer and support located on the light-emitting surface side must not overlap with the light-emitting area of the light-emitting panel. In this case, the light-transmitting property is not important. If the light emitting area overlaps with the light emitting area, a material that transmits the light emitted from the light emitting panel can be used. It is preferable that the spacer, protective layer, and support positioned on the side opposite to the light-emitting surface have no light-transmitting properties. stomach.
[0117] When bonding two of the spacer, protective layer, support, or light-emitting panel together, various adhesives are used. For example, a resin that hardens at room temperature, such as a two-liquid mixed resin, a photo-curable resin, Resins, thermosetting resins, etc. can be used. Also, a sheet-like adhesive can be used. In addition, the spacer, the protective layer, the support, and the light-emitting panel may be penetrated by two or more of them. Each component of the light emitting device may be fixed using screws, pins, clips, or the like.
[0118] The light-emitting device according to one embodiment of the present invention has one light-emitting panel (one light-emitting region) folded. It can be used by dividing it into two or more parts. For example, it can be folded to make the hidden area non-luminous. Only the exposed area may emit light. This reduces the consumption of the area not used by the user. This can reduce the amount of electricity consumed.
[0119] In the light-emitting device according to one embodiment of the present invention, it is possible to determine whether each highly flexible region is folded. For example, a switch such as a magnetic switch or a MEMs may be provided. It can be configured using a pressure sensor such as an S pressure sensor.
[0120] Next, a three-layered sintered body having two highly flexible regions and three less flexible regions will be described. A foldable light emitting device will be described as an example. In this embodiment, the light emitting device is made up of two highly flexible regions. In the example shown, one of the regions is bent inward and the other is bent outward, but the present invention is not limited to this. In other words, when a light emitting device having a plurality of highly flexible regions is folded, the light emitting device does not necessarily bend inward. It is not necessary to alternate between bending and outward. All of the multiple highly flexible regions can be bent inward or outward. Only outward bending may be performed. In addition, inward bending may be repeated multiple times, or outward bending may be repeated multiple times. You may repeat the process.
[0121] <Configuration example C> FIG. 8(A) shows the light emitting device in an unfolded state. FIG. 8(B) shows the light emitting device in an unfolded or folded state. Figure 8(C) shows the light-emitting device in the process of changing from one of the folded states to the other. 1 shows the light emitting device in a blank state.
[0122] The light emitting device includes a first region 161, a second region 162, a third region 163, a fourth region 164, and a The first region 161 includes a second region 162 and a third region 163. The first region 161 is located between the first and second regions 163 and 164. The first region 161 is the most flexible of the first to third regions. The fourth region 164 is located between the third region 163 and the fifth region 165. The region 164 is the most flexible of the third to fifth regions.
[0123] The light emitting device includes a light emitting panel 101, a support 103(1), a support 103(2), and a support 10 3(3), connecting portion 105a, and connecting portion 105b.
[0124] The light-emitting panel 101 has a light-emitting area 111 and a non-light-emitting area 112. The non-light-emitting area 112 is , are provided so as to surround the light emitting area 111 .
[0125] The support 103(1) and the support 103(2) are spaced apart from each other. The supports 103(3) are spaced apart from each other. The three supports each support a light-emitting panel 101. It has lower flexibility than
[0126] The first region 161 includes the light-emitting panel 101 and the connection portion 105a. and connecting portion 105a overlap each other.
[0127] The fourth region 164 includes the light-emitting panel 101 and the connection portion 105b. and connecting portion 105b overlap each other.
[0128] The first region 161 is a portion where the light-emitting panel 101 can be bent outward. Details will be described later in configuration example D.
[0129] The fourth region 164 is a portion where the light-emitting panel 101 can be bent inward. For details, see connection unit 105 in configuration example B.
[0130] The second region 162 includes the light-emitting panel 101 and the support 103(1) stacked together. 103(1) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. 1 and support 103(1) may be fixed to each other.
[0131] The third region 163 has the light-emitting panel 101 and the support 103(2) stacked together. 103(2) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. 1 and support 103(2) may be fixed to each other.
[0132] The fifth region 165 has the light-emitting panel 101 and the support 103(3) stacked together. 103(3) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. 1 and support 103(3) may be fixed to each other.
[0133] If the support is provided only on the side opposite to the light-emitting surface of the light-emitting panel 101, the light-emitting device can be made thin or This is preferable because it can be made lightweight.
[0134] <Configuration example D> FIG. 9(A) shows the light emitting device in an unfolded state. FIG. 9(B) shows the light emitting device in an unfolded or folded state. Figure 9(C) shows the light-emitting device in the process of changing from one of the folded states to the other. 1 shows the light emitting device in a blank state.
[0135] The light emitting device includes a light emitting panel 101, a support 103a(1), a support 103a(2), and a support 103a(3), support 103b(1), support 103b(2), support 103b(3) , connection portion 105a, and connection portion 105b.
[0136] The support 103a(1) and the support 103a(2) are spaced apart from each other. 2) and the support 103a(3) are spaced apart from each other. The supports 103b(2) and 103b(3) are spaced apart from each other. Each of the six supports has a lower flexibility than the light-emitting panel 101.
[0137] The first region 161 includes the light-emitting panel 101 and the connection portion 105a. and connecting portion 105a overlap each other.
[0138] The fourth region 164 includes the light-emitting panel 101 and the connection portion 105b. and connecting portion 105b overlap each other.
[0139] The second region 162 is a region between the support 103a(1) and the support 103b(1) and includes the light-emitting panel 1. The support 103a(1) is located on the light emitting surface side of the light emitting panel 101. The body 103b(1) is located on the side opposite to the light emitting surface of the light emitting panel 101. 101 is fixed to at least one of the support 103a(1) and the support 103b(1). It may be possible.
[0140] The third region 163 is a region between the support 103a(2) and the support 103b(2) where the light-emitting panel 1 The support 103a(2) is located on the light emitting surface side of the light emitting panel 101. The body 103b(2) is located on the side opposite to the light emitting surface of the light emitting panel 101. 101 is fixed to at least one of the support 103a(2) and the support 103b(2). It may be possible.
[0141] The fifth region 165 is a region in which the light-emitting panel 1 is disposed between the support 103a(3) and the support 103b(3). The support 103a(3) is located on the light emitting surface side of the light emitting panel 101. The body 103b(3) is located on the side opposite to the light emitting surface of the light emitting panel 101. 101 is fixed to at least one of the support 103a(3) and the support 103b(3). It may be possible.
[0142] When the light-emitting panel 101 has supports on both the light-emitting surface side and the surface opposite the light-emitting surface, a pair of Since the light-emitting panel 101 can be sandwiched between the supports, the mechanical strength of the less flexible area can be increased. This is preferable because it makes the light emitting device less susceptible to damage.
[0143] 10(A) to 10(C) are side views of the connection portion 105a in each state of FIG. 9(A) to (C). are shown in the figures.
[0144] The connecting portion 105a has an elastic body 106 and a plurality of spacers 108. In this example, the cross section of the spacer 108 perpendicular to the longitudinal direction is a trapezoid. In region 161, the highly flexible region provides both inward and outward bending.
[0145] In addition, in FIGS. 10(A) to (C), the elastic body 106 is shown by a thin solid line, but the elastic body 106 is In reality, the spacer 108 is not exposed to the outside, but is located within an opening in the spacer 108. Place it.
[0146] One end of the elastic body 106 is fixed to the support 103b(1). The other end of the elastic body 106 is fixed to the support 103b(2). It connects the body 103b(1) and the support 103b(2).
[0147] The spacer 108 has an opening. The elastic body 106 passes through the opening and the spacers 10 Concatenate 8.
[0148] Each of the spacers 108 and the light-emitting panel 101 overlaps with each other. 108 are connected to each other by elastic bodies 106 that pass through the openings. The first region 161 is not fixed. With this configuration, when the first region 161 is bent, The angle between the normal lines of the opposing surfaces of two adjacent spacers 108 is 1. This causes the light-emitting panel 101 or the vicinity of the light-emitting panel 101 to change. A neutral surface can be formed.
[0149] The lower left portion of FIG. 10(A) shows an enlarged view of two adjacent spacers 108. In (A), the angle θ between the normals of the opposing surfaces of the two spacers 108 is an acute angle. As the light emitting device is bent from the state shown in FIG. 10(A), the angle θ becomes smaller. When the angle θ becomes 0° in the state of FIG. 10(C), the light emitting device cannot be bent any further. In other words, the shape and number of the spacers 108 determines whether the light emitting device is located in the first region 161 or not. When folding, the light-emitting panel 101 is prevented from being bent with an extremely small radius of curvature. It is possible.
[0150] In addition, since the angle θ can be made larger than that in the state of FIG. 10(A), the light emitting device An inward bend is also possible in region 161.
[0151] The width or area of the surface of the spacer 108 on the light-emitting panel 101 side and the surface on the opposite side is It is preferable that the surface on the light-emitting panel 101 side is wider than the surface on the light-emitting panel 101 side. The light-emitting panel 101 can be bent outward. The spacer 108 is, for example, as shown in FIG. As shown in FIG. 1, the shape of the side surface is required to be trapezoidal. Note that the end of the spacer 108 has a curvature. It's fine.
[0152] Each of the plurality of spacers 108 is preferably fixed to the light-emitting panel 101 . This makes it possible to suppress the movement of the spacer 108 in the longitudinal direction of the spacer 108. .
[0153] <Configuration example E> FIG. 11(A) shows the light-emitting device in an unfolded state. FIG. 11(B) shows the light-emitting device in an unfolded or folded state. The light-emitting device is shown in the middle of changing from one folded state to the other. FIG. 12(A) shows a side view of the light emitting device in the folded state. Fig. 12(B) shows a top view of the state of Fig. 11(A).
[0154] As shown in FIG. 11(A), FIG. 12(B), etc., the support 103a(1) has a connecting portion 105a Or it may overlap with the spacer 108. In this case, the support 103a(1) transmits visible light. In this way, it is possible to prevent a user from seeing the light emitting surface of the light emitting device. In addition, the connecting portion 105a or the spacer 108 can be made invisible. As shown in the first modification, a light-shielding layer may be provided.
[0155] As shown in FIG. 11(A), FIG. 12(B), etc., in a state where the light emitting device is unfolded, the support 103 When the support 103a(1) is in contact with the support 103a(2), the first region 161 is bent inward. In this way, in the light emitting device, the highly flexible region is configured to bend in a direction that is not possible. When it is desired to limit the amount of the radiation, it is possible to control the amount by adjusting the structure of the support.
[0156] In addition, as shown in FIG. 12(A), in the area with low flexibility overlapped by folding, The pair of outer regions are preferably parallel to a plane supporting the light emitting device, and the inner It is preferable that the other area located on the side of the light emitting device is not parallel to the plane. It is possible to achieve a thinner design.
[0157] <Variation 4> FIG. 12(C) shows a side view of the light-emitting device in a folded state. The device is a modification of the light emitting device shown in FIG.
[0158] As shown in FIG. 12(C), the thickness of the support 103a(2) and the support 103a(3) Therefore, the support 103b(2) and the support 103b(3) are configured to be spaced apart from each other by a certain distance. This is preferable because it is possible to prevent light-emitting panel 101 from being bent with an extremely small radius of curvature.
[0159] In the configuration examples A and B, the light-emitting device that can be folded in two by bending inward is illustrated. As shown in the following configuration example F, a light-emitting device that can be folded in two by bending outward is is also an aspect of the present invention.
[0160] <Configuration example F> FIG. 13(A) shows a top view of the light-emitting device in an unfolded state. FIG. 13(B) shows a top view of the light-emitting device in a folded state. 1 shows a side view of a light emitting device in the above state.
[0161] The light emitting device has a first region 171, a second region 172, and a third region 173. The first region 171 is located between the second region 172 and the third region 173. The 71 is the most flexible of the three regions.
[0162] The light emitting device includes a light emitting panel 101, a support 103a(1), a support 103a(2), and a support 103b(1), a support 103b(2), and a connection portion 105.
[0163] The support 103a(1) and the support 103a(2) are spaced apart from each other. The four supports are each a light-emitting panel. It has lower flexibility than 101.
[0164] The first region 171 includes the light-emitting panel 101 and the connection portion 105. The connecting portion 105 overlaps with each other.
[0165] The first region 171 is a portion where the light-emitting panel 101 can be bent outward. In the first region 171, the light-emitting panel 101 is bent inward. Good too.
[0166] The second region 172 is a region between the support 103a(1) and the support 103b(1) and includes the light-emitting panel 1. 01. The third region 173 is between the support 103a(2) and the support 103b(2). The display device has a light-emitting panel 101.
[0167] <Variation 5> FIG. 13(C) shows a side view of the light-emitting device in a folded state. The device is a modification of the light emitting device shown in FIG.
[0168] The light-emitting device shown in FIG. 13C has only one spacer 108. The spacer 108 is The plurality of protruding portions separated by the cuts are the same as those in the previous configuration example. In other words, when the first region 171 is bent, the adjacent The angle between the normals of the two opposing surfaces of the two protrusions changes in accordance with the light-emitting panel 101. This forms a neutral surface within the light-emitting panel 101 or in the vicinity of the light-emitting panel 101. The deeper the cut, the greater the amount of damage to the light-emitting panel 101 or the surface of the light-emitting panel 101. It is easy to form a neutral surface in the vicinity. This is also fine.
[0169] As described above, in the present embodiment, the highly flexible region of the light emitting device is configured to overlap the light emitting panel and the member. By forming the above-mentioned member, the mechanical strength of the region can be increased. The elevation can be formed in or near the light emitting panel. Even if the device is bent, the light-emitting panel is less likely to expand and contract, which reduces damage to the light-emitting panel.
[0170] This embodiment mode can be combined with other embodiment modes as appropriate.
[0171] (Embodiment 2) In this embodiment mode, a light-emitting panel will be described with reference to the drawings.
[0172] In this embodiment, a light-emitting panel using an organic EL element is mainly illustrated. is not limited to this.
[0173] When the light-emitting panel exemplified in this embodiment is bent, the minimum value of the radius of curvature of the light-emitting panel is , 1 mm or more and 150 mm or less, 1 mm or more and 100 mm or less, 1 mm or more and 50 mm or less, 1 The thickness of the gap may be set to 10 mm or more, or 2 mm or more and 5 mm or less. The light-emitting panel element will not be damaged even if it is bent with a small radius of curvature (for example, between 2 mm and 5 mm). The light-emitting panel is bent with a small radius of curvature, The light-emitting device according to one embodiment of the present invention can be thinned. The direction does not matter. The number of bends may be one or more.
[0174] <Example 1> FIG. 14A shows a plan view of the light-emitting panel. An example of a cross-sectional view of the light-emitting panel shown in Example 1 is a color filter type. In this embodiment, the light-emitting panel is a top-emission type light-emitting panel using the formula. For example, a pixel is composed of three sub-pixels, R (red), G (green), and B (blue), which represent one color. A configuration in which one color is expressed using four sub-pixels of R, G, B, and W (white), and a configuration in which one color is expressed using four sub-pixels of R, G, B, and Y ( A configuration in which one color is expressed by four sub-pixels of four colors (yellow, red, green, and blue) can be applied. Instead, colors other than RGBWY may be used, for example, cyan, magenta, etc. stomach.
[0175] The light-emitting panel shown in FIG. 14(A) has a light-emitting section 804, a driving circuit section 806, and an FPC 808. do.
[0176] The light-emitting panel shown in FIG. 14B includes a first flexible substrate 701, a first adhesive layer 703, a first The insulating layer 705, the first functional layer (multiple transistors, conductive layer 857, insulating layer 815, insulating An edge layer 817, a plurality of light emitting elements, an insulating layer 821, a third adhesive layer 822, a second functional layer (coloring layer 845 and light-shielding layer 847), a second insulating layer 715, a second adhesive layer 713, and The second flexible substrate 711 includes a third adhesive layer 822, a second insulating layer 715, and a second adhesive layer 826. The adhesive layer 713 and the second flexible substrate 711 transmit visible light. The light emitting element and the transistor included in the path portion 806 are supported by the first flexible substrate 701 and the second flexible substrate 702. It is sealed by the substrate 711 and the third adhesive layer 822 .
[0177] The light emitting portion 804 is attached to the first flexible substrate 702 via the first adhesive layer 703 and the first insulating layer 705. A transistor 820 and a light-emitting element 830 are disposed on the plate 701. The light-emitting element 830 is an insulating A lower electrode 831 on the layer 817, an EL layer 833 on the lower electrode 831, and The lower electrode 831 is a source electrode of the transistor 820 or The end of the lower electrode 831 is covered with an insulating layer 821. The lower electrode 831 is preferably reflective to visible light. The upper electrode 835 is preferably transparent to visible light. do.
[0178] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. A third adhesive layer 822 is provided between the light emitting element 830 and the colored layer 845. It is filled.
[0179] The insulating layer 815 has an effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having a
[0180] The driving circuit section 806 is attached to the first flexible substrate 802 via the first adhesive layer 703 and the first insulating layer 705. A plurality of transistors are provided over the substrate 701. In FIG. The figure shows one of the transistors.
[0181] The first insulating layer 705 and the first flexible substrate 701 are bonded together by a first adhesive layer 703. The second insulating layer 715 and the second flexible substrate 711 are bonded to a second adhesive layer 713. The first insulating layer 705 and the second insulating layer 715 are laminated together. By using the above, it is possible to prevent impurities such as water from entering the light emitting element 830 and the transistor 820. This is preferable because it increases the reliability of the light-emitting panel.
[0182] The conductive layer 857 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 806. Here, an example is shown in which an FPC808 is provided as the external input terminal. In order to prevent an increase in the number of processes, the conductive layer 857 is formed of the same material as the electrodes and wiring used in the light-emitting section and the driving circuit section. It is preferable to form the conductive layer 857 by the same material and process. This shows an example in which the electrodes constituting the electrode 820 are fabricated using the same material and process.
[0183] In the light-emitting panel shown in FIG. 14B, the FPC 808 is located on the second flexible substrate 711. The connection body 825 is made up of the second flexible substrate 711, the second adhesive layer 713, the second insulating layer 71, and the 5, the third adhesive layer 822, the insulating layer 817, and the insulating layer 815 through an opening. The connector 825 is connected to the conductive layer 857. The connector 825 is also connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via 825. When the flexible substrate 711 overlaps the second flexible substrate 711, the second flexible substrate 711 is opened (or an opening By using a substrate having the above-mentioned structure, the conductive layer 857, the connector 825, and the FPC 808 are electrically It can be effectively connected.
[0184] A modified example of the light-emitting panel shown in Fig. 14(A) and (B) is shown. FIG. 15B is a cross-sectional view taken along dashed line D3-D4 in FIG. 15A. FIG. 16(A) shows an example of a cross-sectional view taken along the dashed line D5-D6 in FIG. 15(A). ) as shown in
[0185] The light-emitting panel shown in FIGS. 15A and 15B includes a first flexible substrate 701 and a second flexible substrate This is an example in which the sizes of 711 are different. The FPC 808 is placed on the second insulating layer 715. , and does not overlap with the second flexible substrate 711. The connecting body 825 is formed by the second insulating layer 715, the third A conductive layer 857 is formed through an opening provided in the adhesive layer 822, the insulating layer 817, and the insulating layer 815. Since there is no need to provide an opening in the second flexible substrate 711, The material of the substrate 711 is not limited.
[0186] In addition, the insulating layer formed using an organic resin having low gas barrier properties and moisture resistance is By adopting such a structure, it is preferable that the light emitting device is not exposed to the outside. For example, as shown in FIG. 15(B) and FIG. 16(A), The insulating layer 817 may not be provided at the end of the optical device.
[0187] Moreover, a modified example of the light emitting section 804 is shown in FIG.
[0188] The light-emitting panel shown in FIG. 16B includes an insulating layer 817a and an insulating layer 817b. A conductive layer 856 is provided over the transistor 820. , and the lower electrode of the light-emitting element 830 are electrically connected via a conductive layer 856 .
[0189] The light-emitting panel shown in FIG. 16B has a spacer 823 over an insulating layer 821. By providing 823, the distance between the first flexible substrate 701 and the second flexible substrate 711 can be adjusted. It is possible.
[0190] The light-emitting panel shown in FIG. 16B has an overcoat that covers the colored layer 845 and the light-shielding layer 847. The space between the light emitting element 830 and the overcoat 849 is filled with an adhesive layer 822. is.
[0191] Moreover, a modified example of the light emitting element 830 is shown in FIG.
[0192] As shown in FIG. 16C, the light emitting element 830 is made up of a lower electrode 831 and an EL layer 833. The optical adjustment layer 832 may be disposed between the first and second electrodes. It is preferable to use conductive materials. Color filter (colored layer) and microcavity structure By combining with the (optical adjustment layer), the light-emitting panel of one embodiment of the present invention can exhibit high color purity. The thickness of the optical adjustment layer can be changed according to the color of each sub-pixel. good.
[0193] <Example 2> The light-emitting panel shown in FIG. 16(D) includes a first flexible substrate 701, a first adhesive layer 703, a first The insulating layer 705, the first functional layer (conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting The element 830, the insulating layer 821, the second adhesive layer 713, and the second flexible substrate 711 are Yes.
[0194] The conductive layer 857a and the conductive layer 857b are external connection electrodes of the light-emitting panel, and are electrically connected to an FPC or the like. It can be electrically connected.
[0195] The light emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitter. The type is a top emission type, a dual emission type, or a top emission type. The electrode, the substrate, the insulating layer, etc. are each transparent to visible light. Make an electrical connection.
[0196] The substrate from which the light is extracted is equipped with a hemispherical lens, a microlens array, The substrate may have a film having a concave-convex structure, a light diffusing film, etc. For example, a resin substrate. The lens or film is placed on the substrate, and the refractive index is set to the same level as that of the substrate, lens, or film. By bonding the substrate with an adhesive having a light extraction structure, a substrate having a light extraction structure can be formed. can.
[0197] The conductive layer 814 is not necessarily required, but the voltage drop caused by the resistance of the lower electrode 831 may be reduced. For the same purpose, the upper electrode 835 and the electric A conductive layer for electrically connecting the insulating layer 821, the EL layer 833, the upper electrode 835, or the like is provided on the insulating layer 821, the EL layer 833, the upper electrode 835, or the like. It is okay.
[0198] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of , scandium, nickel, and aluminum, or alloys containing these as their main components. The conductive layer 814 can be formed of a single layer or a multilayer structure using a gold material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0. It is less than 5 μm.
[0199] <Example 3> FIG. 15(A) shows a plan view of the light-emitting panel. An example of a cross-sectional view of the light-emitting panel shown in Example 3 is a color filter type. This is a bottom emission type light emitting panel that uses the formula.
[0200] The light-emitting panel shown in FIG. 17(A) includes a first flexible substrate 701, a first adhesive layer 703, a first The insulating layer 705, the first functional layer (multiple transistors, conductive layer 857, insulating layer 815, A color layer 845, an insulating layer 817a, an insulating layer 817b, a conductive layer 856, a plurality of light-emitting elements, and an insulating layer The first flexible substrate 711 has a first edge layer 821, a second adhesive layer 713, and a second flexible substrate 711. A conductive substrate 701, a first adhesive layer 703, a first insulating layer 705, an insulating layer 815, and an insulating layer 817. a and the insulating layer 817b transmit visible light.
[0201] The light emitting portion 804 is attached to the first flexible substrate 702 via the first adhesive layer 703 and the first insulating layer 705. A transistor 820 , a transistor 824 , and a light-emitting element 830 are provided on a plate 701 . The light-emitting element 830 includes a lower electrode 831 on the insulating layer 817b and an EL layer 831 on the lower electrode 831. 33 and an upper electrode 835 on the EL layer 833. The end of the lower electrode 831 is electrically connected to the source electrode or drain electrode of the lower electrode 820. It is covered with an insulating layer 821. The top electrode 835 is preferably reflective to visible light. The electrode 831 transmits visible light. The colored layer 845 overlapping the light emitting element 830 is provided at a position There is no particular limitation, and for example, between the insulating layer 817a and the insulating layer 817b, between the insulating layer 815 and the insulating layer It may be provided between the layers 817a, etc.
[0202] The driving circuit section 806 is attached to the first flexible substrate 802 via the first adhesive layer 703 and the first insulating layer 705. A plurality of transistors are provided over a substrate 701. In FIG. Two of the transistors shown are shown.
[0203] The first insulating layer 705 and the first flexible substrate 701 are bonded together by a first adhesive layer 703. When a film having high moisture resistance is used for the first insulating layer 705, the light emitting element 830 and the transistor The intrusion of impurities such as water into the stator 820 and the transistor 824 can be suppressed, and the light-emitting panel This is preferable because it increases the reliability of the system.
[0204] The conductive layer 857 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 806. Here, an example is shown in which an FPC808 is provided as the external input terminal. In this example, the conductive layer 857 is formed from the same material and in the same process as the conductive layer 856. Shows.
[0205] <Example 4> FIG. 15(A) shows a plan view of the light-emitting panel. An example of a cross-sectional view of the light-emitting panel shown in Example 4 is shown in FIG. It is a top-emission type light-emitting panel.
[0206] The light-emitting panel shown in FIG. 17(B) includes a first flexible substrate 701, a first adhesive layer 703, a first The insulating layer 705, the first functional layer (multiple transistors, conductive layer 857, insulating layer 815, insulating The edge layer 817, the plurality of light emitting elements, the insulating layer 821, and the spacer 823, the second adhesive layer 71 3, and a second flexible substrate 711. A second adhesive layer 713 and a second flexible substrate 7 11 transmits visible light.
[0207] In the light-emitting panel shown in FIG. 17B, the connector 825 is located on the insulating layer 815. The insulating layer 825 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. The connection member 825 is connected to the FPC 808. Layer 857 provides the electrical connection.
[0208] <Examples of materials> Next, materials that can be used for the light-emitting panel will be described. The description of the configuration may be omitted.
[0209] The substrate can be made of a material such as glass, quartz, organic resin, metal, or alloy. The substrate on the side from which light from the element is extracted is made of a material that transmits the light.
[0210] In particular, it is preferable to use a flexible substrate. For example, a substrate made of organic resin or a substrate having a thickness sufficient to provide flexibility is used. For example, the thickness of the flexible substrate is 1 μm or less. Preferably, the thickness is 200 μm or less, more preferably, 1 μm or more and 100 μm or less, and more preferably, 1 μm or more and 5 It is more preferable that the thickness is 0 μm or less, and particularly preferable that the thickness is 1 μm or more and 25 μm or less.
[0211] Since organic resin has a smaller specific gravity than glass, using organic resin as a flexible substrate This is preferable because it allows the light-emitting panel to be lighter than when glass is used.
[0212] It is preferable to use a highly tough material for the substrate. This makes it possible to improve impact resistance and prevent breakage. For example, organic resin substrates, thin metal substrates, or By using an alloy substrate, it is lighter and less likely to break than a glass substrate. This makes it possible to realize a light-emitting panel with high brightness.
[0213] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it ideal for the light-emitting panel. It is preferable to use a substrate made of a metal material or an alloy material because it is possible to suppress a local temperature rise in the substrate. The thickness of the plate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable that
[0214] The material constituting the metal substrate or alloy substrate is not particularly limited. For example, aluminum , copper, nickel, or an alloy of a metal such as an aluminum alloy or stainless steel is preferred. can be used.
[0215] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel can be prevented from becoming too high. For example, the substrate can be made of a metal substrate and a heat dissipating substrate, which can suppress damage to the light-emitting panel and deterioration of its reliability. A laminated structure of high refractive index layers (which can be, for example, metal oxides or ceramic materials) It is also possible to use the following.
[0216] As a material having flexibility and light transmission, for example, polyethylene terephthalate (PET) ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin , polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), Chloroolefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, Polytetrafluoroethylene (PTFE) resin, etc. In particular, those with a low linear expansion coefficient It is preferable to use a material such as polyamide-imide resin, polyimide resin, polya Mido resin, PET, etc. can be suitably used. In addition, a substrate ( Prepreg (also called prepreg) or a substrate with a lower linear expansion coefficient by mixing inorganic filler with organic resin is used. It can also be used.
[0217] As for the flexible substrate, the layer using the above material is used as a hard cover to protect the surface of the device from scratches. A layer of a material capable of dispersing pressure (e.g., a layer of silicon nitride) or a layer of a material capable of dispersing pressure (e.g., a layer of aramid) The insulating layer may be laminated with a layer of a polymeric resin or the like.
[0218] The flexible substrate may be used by laminating a plurality of layers. This improves the barrier properties against water and oxygen, making it possible to create a highly reliable light-emitting panel. Cut.
[0219] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness of the glass layer is preferably 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The organic resin layer can be made thicker than 10 mm thick. The thickness of such an organic material is preferably from 20 to 50 μm. By providing the resin layer on the outer side of the glass layer, breakage or cracks in the glass layer are suppressed, The mechanical strength can be improved. By applying this technology to a plate, it is possible to create a highly reliable and flexible light-emitting panel. Cut.
[0220] The adhesive layer may be a photo-curable adhesive such as an ultraviolet curable adhesive, a reactive curable adhesive, a heat curable adhesive, or an antibacterial adhesive. Various curing adhesives such as epoxy adhesives can be used. Resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin , PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA ( Ethylene vinyl acetate resins, etc. In particular, epoxy resins, etc., have low moisture permeability. The material is preferably a two-part mixed resin. Also, an adhesive sheet or the like may be used. Good too.
[0221] The resin may contain a desiccant. For example, an oxide of an alkaline earth metal (oxide Use substances that adsorb moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb moisture by physical adsorption. If a desiccant is included, impurities such as moisture may penetrate into the functional elements. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.
[0222] In addition, by mixing a filler having a high refractive index or a light scattering material into the resin, it is possible to improve the light transmission efficiency. For example, titanium oxide, barium oxide, and zeolite can be used. For example, olyte, zirconium, etc. can be used.
[0223] The first insulating layer 705 and the second insulating layer 715 may be made of an insulating film having high moisture resistance. Alternatively, the first insulating layer 705 and the second insulating layer 715 may be formed to prevent impurities from entering the light emitting element. It is preferable that the material has a function of preventing diffusion.
[0224] Highly moisture-proof insulating films include those containing nitrogen and silicon, such as silicon nitride film and silicon oxide nitride film. Examples of the film include a film containing nitrogen and aluminum, such as an aluminum nitride film. Alternatively, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.
[0225] For example, the water vapor permeability of a highly moisture-resistant insulating film is 1×10 -5 [g / (m 2 ·day)] Less than or equal to 1×10 -6 [g / (m 2 ·day)] or less, preferably 1×10 -7 [g / (m 2 ·day)] or less, and more preferably 1×10 -8 [g / (m 2 ·da y)] or less.
[0226] In the light-emitting panel, at least one of the first insulating layer 705 and the second insulating layer 715 is The first insulating layer 705 or the second insulating layer 715 must be transparent to the light emitted from the light emitting element. The insulating layer on the side that transmits the light emitted from the light-emitting element has a wavelength of 400 nm or more smaller than the other insulating layer. It is preferable that the average transmittance at 800 nm or less is high.
[0227] The structure of the transistors in the light-emitting panel is not particularly limited. For example, The transistor may be a top gate type or an inverted staggered type. The transistor may have either a bottom gate type or a bottom gate type structure. The conductive material is not particularly limited, and examples thereof include silicon, germanium, and organic semiconductors. Or, indium, gallium, and zinc, such as In-Ga-Zn metal oxides. An oxide semiconductor including at least one of these may be used.
[0228] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region If a semiconductor having crystallinity is used, the transistor This is preferable because it can suppress deterioration of the star characteristics.
[0229] In order to stabilize the characteristics of the transistor, it is preferable to provide an undercoat film. Inorganic films such as silicon oxide film, silicon nitride film, silicon oxynitride film, and silicon nitride oxide film The insulating film can be formed in a single layer or a multilayer structure. CVD (Chemical Vapor Deposition) method (Plasma CVD method , thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD ( Formed using Atomic Layer Deposition (ALD), coating, printing, etc. In addition, the undercoat film may not be provided if it is not necessary. The insulating layer 705 can also serve as a base film of the transistor.
[0230] The light emitting element may be a self-emitting element, and the luminance may be controlled by a current or a voltage. The category includes devices that are controlled by light emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be used.
[0231] The light-emitting elements are top emission type, bottom emission type, and dual emission type. For the electrode from which light is extracted, a conductive film that transmits visible light is used. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. .
[0232] The conductive film that transmits visible light is, for example, indium oxide, indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide (ZnO), Gallium It can be formed by using zinc oxide doped with sulphur. It can also be formed by using gold, silver, platinum, magnesium Nesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium Metallic materials such as aluminum or titanium, alloys containing these metallic materials, or nitrogen compounds of these metallic materials Titanium nitride, for example, can also be used by forming it thin enough to have light transmission. A laminated film of the above materials can be used as the conductive layer. For example, silver and magenta A laminated film of magnesium alloy and ITO is preferred because it can increase the electrical conductivity. In addition, graphene or the like may be used.
[0233] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, etc. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium; An alloy containing these metal materials can be used. In addition, aluminum and titanium may be added. alloys of aluminum and nickel, alloys of aluminum and neodymium, Aluminum-containing alloys such as aluminum, nickel, and lanthanum alloys (Al-Ni-La) Aluminum alloy), silver-copper alloy, silver-palladium-copper alloy (Ag-Pd-Cu, APC (also called APC) can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy containing silver and copper is preferable because of its high heat resistance. By laminating a metal film or a metal oxide film adjacent to the aluminum alloy film, oxidation of the aluminum alloy film is suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. Moreover, the conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a laminated film of silver and ITO, or a laminated film of an alloy of silver and magnesium and ITO can be used. This can be done.
[0234] The electrodes may be formed by vapor deposition or sputtering. Formed using a discharge method such as the jet method, a printing method such as the screen printing method, or a plating method. It is possible.
[0235] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. When the light is injected from the anode side to the EL layer 833, holes are injected from the cathode side and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. do.
[0236] The EL layer 833 has at least a light-emitting layer. The EL layer 833 has a positive electrode as a layer other than the light-emitting layer. Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties , a substance with high electron injection properties, or a bipolar substance (a substance with high electron transport properties and hole transport properties) The film may further include a layer containing a polymer (such as a polymeric material).
[0237] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may each be formed by deposition (vacuum deposition) The method may include a transfer method, a printing method, an ink-jet method, a coating method, etc. do.
[0238] The light emitting element 830 may contain two or more types of luminescent materials. For example, it is possible to realize a light-emitting element that emits light of complementary colors. White light can be obtained by selecting a light-emitting material so that the following relationship is satisfied. For example, luminescent materials that emit light of R (red), G (green), B (blue), Y (yellow), or O (orange) are used. The light-emitting material must emit light containing two or more of the following spectral components: red, green, and blue. For example, a light-emitting material that emits blue light and a light-emitting material that emits yellow light may be used. In this case, the emission spectrum of the luminescent material that emits yellow light contains green and red spectral components. In addition, the emission spectrum of the light emitting element 830 is preferably in the visible region (for example, 35 0 nm to 750 nm, or 400 nm to 800 nm, etc.) It is preferable that the peak is
[0239] The EL layer 833 may have a plurality of light-emitting layers. The layers may be stacked in contact with each other or with a separating layer interposed therebetween. For example, a separation layer may be provided between the fluorescent light-emitting layer and the phosphorescent light-emitting layer.
[0240] The separation layer is, for example, a layer for converting the excited state of the phosphorescent material generated in the phosphorescent-emitting layer into the fluorescent material in the fluorescent-emitting layer. To prevent energy transfer (especially triplet energy transfer) to materials via the Dexter mechanism The separation layer may be provided with a thickness of about several nm. m or more and less than 20 nm, or 1 nm or more and less than 10 nm, or 1 nm or more and less than 5 nm The separating layer may be made of a single material (preferably a bipolar material) or a plurality of materials (preferably a Preferably, the material includes a hole transporting material and an electron transporting material.
[0241] The separation layer may be formed using a material contained in the light-emitting layer that is in contact with the separation layer. This facilitates the fabrication of the light-emitting device and reduces the driving voltage. When the separation layer is made of a host material, an assist material, and a phosphorescent material (guest material), In other words, the separation layer may be formed of a phosphorescent material and an assist material. The phosphorescent layer has a region that does not contain a phosphorescent material, and the phosphorescent layer has a region that contains a phosphorescent material. It is possible to deposit the separation layer and the phosphorescent light-emitting layer with or without the phosphorescent material. By forming the separation layer and the phosphorescent layer in the same chamber, it becomes possible to form the separation layer and the phosphorescent layer in the same chamber. This makes it possible to reduce manufacturing costs.
[0242] The light-emitting element 830 may be a single element having one EL layer, or a charge generating It may also be a tandem element having a plurality of EL layers stacked with an intervening layer.
[0243] It is preferable that the light emitting element is provided between a pair of highly moisture-proof insulating films. This makes it possible to prevent impurities such as water from entering the light emitting element, and thus prevents a decrease in the reliability of the light emitting panel. Specifically, as described above, the first insulating layer 705 and the second insulating layer 715 are When a highly moisture-resistant insulating film is used, the light-emitting element is located between a pair of highly moisture-resistant insulating films. This can suppress a decrease in the reliability of the light-emitting panel.
[0244] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. In addition, the insulating layer 817, the insulating layer 817a, and The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, polyimide acryl, etc. Organic materials such as amide and benzocyclobutene resins can be used. A dielectric constant material (low-k material) can be used. In addition, multiple insulating films can be stacked. In this way, each insulating layer may be formed.
[0245] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy Resin, phenolic resin, etc. can be used. In particular, photosensitive resin material is used, and the lower part An opening is formed on the electrode 831, and the sidewall of the opening has a continuous curvature. It is preferable to form the surface so as to have an inclined surface.
[0246] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, Vapor deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing etc.) can be used.
[0247] The spacer 823 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Various materials can be used. Metal materials include titanium and aluminum. The spacer 823 containing a conductive material and the upper electrode 835 are electrically connected to each other. This makes it possible to suppress a potential drop caused by the resistance of the upper electrode 835. The shape of the 3 may be either a forward taper shape or a reverse taper shape.
[0248] Used in light-emitting panels that function as electrodes or wiring of transistors or auxiliary electrodes of light-emitting elements The conductive layer may be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. The material is made of metals such as tungsten, copper, neodymium, and scandium, or alloys containing these elements. The conductive layer may be formed as a single layer or a laminate. The conductive metal oxide may be indium oxide (In 2 O 3 etc.) , tin oxide (SnO 2 etc.), ZnO, ITO, Indium Zinc Oxide (In 2 O 3 -Zn O, etc.) or these metal oxide materials containing silicon oxide can be used. .
[0249] The colored layer is a colored layer that transmits light of a specific wavelength band. For example, red, green, blue, or A color filter that transmits light in the yellow wavelength range can be used. Using various materials, printing, inkjet, and photolithography The white sub-pixel is formed at a desired position by a bonding method or the like. Alternatively, a transparent resin may be placed on the plate.
[0250] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is provided with a light shielding layer to prevent color mixing between adjacent light emitting elements. By providing the light-shielding layer so that it overlaps the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the optical element can be used, including, for example, metallic materials, pigments, and dyes. The black matrix may be formed using a resin material. By placing it in an area other than the light-emitting part, unintended light leakage due to guided light etc. can be suppressed. preferable.
[0251] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. This makes it possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The bar coat is made of a material that transmits light emitted from the light emitting element, such as a silicon nitride film. Inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films are used. Alternatively, the insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.
[0252] In addition, when the material for the adhesive layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the adhesive layer. As the substrate, an oxide conductive film such as an ITO film, or a metal film such as an Ag film that is thin enough to have light transmission properties is used. It is preferable to use:
[0253] By using a material with high wettability for the overcoat material, adhesion is improved. This allows the layer material to be applied uniformly, eliminating the need for air bubbles when bonding a pair of substrates together. The inclusion of bubbles can be suppressed, and display defects can be suppressed.
[0254] As connectors, various anisotropic conductive films (ACFs) are used. Conductive Film) and Anisotropic Conductive Paste (ACP) Conductive Paste) can be used.
[0255] As described above, one embodiment of the present invention can be applied to a light-emitting panel, a display panel, a touch panel, and the like. This can be done.
[0256] Display elements include organic EL elements, inorganic EL elements, LEDs and other light-emitting elements, liquid crystal elements, and Display elements using electrophoretic elements and MEMS (microelectromechanical systems) etc.
[0257] Note that the light-emitting panel of one embodiment of the present invention may be used as a display device or a lighting device. For example, a light source such as a backlight or a frontlight, i.e., a display panel It may also be used as a lighting device for
[0258] This embodiment mode can be combined with other embodiment modes as appropriate.
[0259] (Embodiment 3) In this embodiment, a touch panel will be described with reference to the drawings. Among the components, the same components as those of the light-emitting panel described in the second embodiment are as follows: In addition, in this embodiment, a touch panel using a light-emitting element is A panel is shown as an example, but the present invention is not limited to this. For example, the other elements (displays) shown in the second embodiment may be used. A touch panel using a liquid crystal display element or the like is also one embodiment of the present invention.
[0260] <Configuration example 1> FIG. 18(A) is a top view of a touch panel. FIG. 18(B) is a top view of a dashed line A in FIG. 18(C) is a cross-sectional view taken along the dashed line E in FIG. -F cross-sectional view.
[0261] The touch panel 390 shown in FIG. 18(A) includes a display unit 301 (which also serves as an input unit), a scanning line driver, driving circuit 303g(1), imaging pixel driving circuit 303g(2), image signal line driving circuit 303s The image pickup device 303 includes an image pickup signal line driver circuit 303s(1) and an image pickup signal line driver circuit 303s(2).
[0262] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308 .
[0263] The pixel 302 includes a number of sub-pixels, each of which includes a light-emitting element and a pixel circuit.
[0264] The pixel circuit can supply power to drive the light emitting element. The pixel circuit outputs a selection signal The pixel circuit is electrically connected to a wiring that can supply an image signal. The semiconductor device is electrically connected to a wiring that can be connected to the semiconductor device.
[0265] The scanning line driver circuit 303g(1) can supply a selection signal to the pixel 302.
[0266] The image signal line driver circuit 303 s ( 1 ) can supply an image signal to the pixel 302 .
[0267] A touch sensor can be configured using the imaging pixels 308. 08 can detect a finger or the like touching the display unit 301.
[0268] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit.
[0269] The imaging pixel circuit can drive the photoelectric conversion element. The imaging pixel circuit provides a control signal. The imaging pixel circuit is electrically connected to a wiring that can supply a power supply potential. The semiconductor device is electrically connected to a wiring that can be connected to the semiconductor device.
[0270] The control signal may be, for example, a signal to select an imaging pixel circuit that reads out a recorded imaging signal. a signal that can initialize the imaging pixel circuit; and a signal that can detect light by the imaging pixel circuit. Examples of such signals include a signal that can determine the time at which the signal is detected.
[0271] The imaging pixel drive circuit 303g(2) can supply a control signal to the imaging pixel 308. .
[0272] The imaging signal line driving circuit 303s(2) can read out imaging signals.
[0273] As shown in FIGS. 18B and 18C, the touch panel 390 includes a first flexible substrate 701, A first adhesive layer 703, a first insulating layer 705, a second flexible substrate 711, a second adhesive layer 71 3, and a second insulating layer 715. Also, the first flexible substrate 701 and the second flexible The substrate 711 is attached with a third adhesive layer 360 .
[0274] The first flexible substrate 701 and the first insulating layer 705 are bonded together with a first adhesive layer 703. The second flexible substrate 711 and the second insulating layer 715 are bonded to each other with a second adhesive layer 713. The materials that can be used for the substrate, adhesive layer, and insulating layer are described in detail in the embodiment. Please refer to State 2.
[0275] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 18 (C)).
[0276] For example, the sub-pixel 302R includes a light-emitting element 350R and a pixel circuit. The subpixel 3 also includes a transistor 302t that can supply power to the subpixel 350R. 02R is a light emitting element 350R and an optical element (for example, a colored layer 367R that transmits red light). has.
[0277] The light emitting element 350R includes a lower electrode 351R, an EL layer 353, and an upper electrode 352 in this order. It is laminated (Figure 18(C)).
[0278] The EL layer 353 includes a first EL layer 353a, an intermediate layer 354, and a second EL layer 353b. The layers are laminated in this order.
[0279] In order to efficiently extract light of a specific wavelength, the light-emitting element 350R is equipped with a micro-cavity. Specifically, it is possible to arrange the T-structure so that a specific light can be efficiently extracted. The EL layer may be disposed between a film that reflects visible light and a semi-reflective / semi-transmissive film that are disposed in the substrate.
[0280] The subpixel 302R includes a light emitting element 350R and a third adhesive layer 360 in contact with the color layer 367R. The colored layer 367R is located so as to overlap the light emitting element 350R. A part of the light emitted by 50R is transmitted through the third adhesive layer 360 and the colored layer 367R, and is As indicated by the arrow, the light is emitted to the outside of the subpixel 302R.
[0281] The touch panel 390 includes a light-shielding layer 367BM. The light-shielding layer 367BM is a colored layer (e.g., For example, the colored layer 367R is provided so as to surround the colored layer 367.
[0282] The touch panel 390 has an anti-reflection layer 367p at a position overlapping the display unit 301. The blocking layer 367p may be, for example, a circular polarizing plate.
[0283] The touch panel 390 includes an insulating layer 321. The insulating layer 321 includes a transistor 302t, etc. The insulating layer 321 is formed to flatten the unevenness caused by the pixel circuits and the imaging pixel circuits. It can be used as a layer for diffusing impurities into the transistor 302t, etc. An insulating layer capable of suppressing the above can be applied to the insulating layer 321.
[0284] The touch panel 390 has a partition wall 328 that overlaps an end of the lower electrode 351R. A spacer 329 for controlling the distance between the first flexible substrate 701 and the second flexible substrate 711 is provided at the It is provided on the wall 328 .
[0285] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in FIG. 3B, the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. They may be provided with different potentials. The gate 304 may be provided to the transistor 308t, the transistor 302t, and the like.
[0286] The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit. The photoelectric conversion element 308p can detect light irradiated thereto. For example, a pin-type photodiode is used as the photoelectric conversion element 308p. There can be.
[0287] The touch panel 390 has wiring 311 through which a signal can be supplied, and a terminal 319 is disposed. The FP 311 can supply signals such as image signals and synchronization signals. C309 is electrically connected to terminal 319. FPC309 is a printed wiring board ( A PWB may be attached.
[0288] In addition, transistors such as transistor 302t, transistor 303t, and transistor 308t The resistors can be formed in the same process, or they can be formed in different processes. Good too.
[0289] <Configuration example 2> 19(A) and (B) are perspective views of the touch panel 505. For clarity, FIG. 20 is a cross-sectional view taken along dashed line X1-X2 in FIG. 19(A). do.
[0290] As shown in FIGS. 19A and 19B, the touch panel 505 includes a display unit 501, a scanning line drive The touch panel 505 includes a circuit 303g(1) and a touch sensor 595. , a first flexible substrate 701 , a second flexible substrate 711 , and a flexible substrate 590 .
[0291] The touch panel 505 includes a plurality of pixels and a plurality of wirings 311. The plurality of wirings 311 are connected to the first flexible substrate 701. The wire is routed to the outer periphery, and a part of it constitutes the terminal 319. 09(1) and electrically connected.
[0292] The touch panel 505 includes a touch sensor 595 and a plurality of wirings 598. 598 is electrically connected to the touch sensor 595. The multiple wirings 598 are 90, and a part of it constitutes a terminal. 9(2). For clarity, in FIG. 19(B), the flexible substrate 59 0 (the surface facing the first flexible substrate 701) Electrodes, wiring, etc. are indicated by solid lines.
[0293] For example, a capacitive touch sensor can be used as the touch sensor 595. There are various types of capacitive touch panels, such as surface capacitive touch panels and projected capacitive touch panels. This shows a case where a capacitive touch sensor is applied.
[0294] The projected capacitive touch sensor is classified into two types: self-capacitance and mutual capacitance. The use of such a method is preferable since it enables simultaneous multipoint detection.
[0295] The touch sensor 595 can detect the proximity or contact of a detection target such as a finger. A variety of sensors can be applied.
[0296] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 91 is electrically connected to one of the multiple wirings 598, and the electrode 592 is In electrical connection with any of the others.
[0297] As shown in FIGS. 19(A) and 19(B), the electrodes 592 are a plurality of electrodes repeatedly arranged in one direction. It has a shape of quadrilaterals connected at the corners.
[0298] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrodes 592 extend. In addition, the plurality of electrodes 591 are not necessarily arranged in a direction perpendicular to one electrode 592. The electrodes do not necessarily have to be spaced apart from each other and may be disposed at an angle less than 90 degrees.
[0299] The wiring 594 is provided so as to intersect with the electrodes 592. The wiring 594 is connected to one of the electrodes 592. The two sandwiching electrodes 591 are electrically connected. At this time, the intersection of the electrode 592 and the wiring 594 It is preferable that the area of the electrode be as small as possible. As a result, the area of the touch sensor 595 can be reduced, and the unevenness of the light transmittance can be reduced. It is possible to reduce unevenness in the brightness of the transmitted light.
[0300] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes.
[0301] As shown in FIG. 20A, the touch panel 505 includes a first flexible substrate 701, a first contact a first insulating layer 705; a second flexible substrate 711; a second adhesive layer 713; and The first flexible substrate 701 and the second flexible substrate 71 1 is attached with a third adhesive layer 360.
[0302] The adhesive layer 597 is attached to the flexible substrate 590 so that the touch sensor 595 overlaps the display unit 501. The adhesive layer 597 is attached to a second flexible substrate 711. The adhesive layer 597 transmits light.
[0303] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Examples of conductive materials that can be used include indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. Alternatively, a film containing graphene may be used. The film containing graphene may be formed in a film shape, for example. The graphene oxide film can be formed by reducing the graphene oxide film. and a method of applying heat.
[0304] In addition, the conductive films such as the electrodes 591, the electrodes 592, and the wiring 594 constitute a touch panel. The materials used for wiring and electrodes are transparent materials containing indium oxide, tin oxide, zinc oxide, etc. Conductive films (e.g., ITO, etc.) are also used. Wiring and electrodes that make up touch panels are also used. The material that can be used for the electrode preferably has a low resistance. Examples of the material include silver, copper, and aluminum. Minium, carbon nanotubes, graphene, metal halides (silver halides, etc.) Furthermore, a plurality of very thin (e.g., a diameter of a few nanometers) Metal nanowires made of a conductor may be used. Metal meshes made of Ag nanowires, Cu nanowires, Al nanowires, etc. may also be used. Nanowires, Ag mesh, Cu mesh, Al mesh, etc. may also be used. For example, When Ag nanowires are used for the wiring and electrodes that make up a touch panel, they are transparent in visible light. The rate can be 89% or more, and the sheet resistance can be 40 Ω / □ or more and 100 Ω / □ or less. It is also an example of a material that can be used for the wiring and electrodes that make up the above-mentioned touch panel. Metal nanowires, metal meshes, carbon nanotubes, graphene, etc., which are used for visible light Since the transmittance is high in the It may also be used as a
[0305] After a light-transmitting conductive material is formed on a flexible substrate 590 by a sputtering method, Using various patterning techniques such as photolithography, unnecessary parts are removed to form electrodes. 591 and electrode 592 can be formed.
[0306] The electrodes 591 and 592 are covered with an insulating layer 593. A hole is provided in the insulating layer 593, and a wiring 594 electrically connects the adjacent electrodes 591. A photoconductive material is preferred for the wiring 594 because it can increase the aperture ratio of the touch panel. In addition, a material having a higher conductivity than the electrodes 591 and 592 can be used. Since the air resistance can be reduced, it can be suitably used for the wiring 594.
[0307] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.
[0308] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).
[0309] The display unit 501 has a plurality of pixels arranged in a matrix. Since the above is the case, the explanation will be omitted.
[0310] As shown in FIG. 20B, the flexible substrate 590 is not used, and a first flexible substrate 701 is used. The touch panel may be configured by two substrates, the first substrate 711 and the second flexible substrate 712. The conductive substrate 711 and the second insulating layer 715 are bonded together with a second adhesive layer 713. The touch sensor 595 is provided in contact with the insulating layer 715. A colored layer 367R and a light-shielding layer 367BM are provided in contact with the insulating layer 589. Alternatively, the colored layer 367R and the light-shielding layer 367BM may be provided in contact with the wiring 594 without providing the wiring 589. .
[0311] <Configuration example 3> 21 is a cross-sectional view of touch panel 505B. 505B is a point and tag for displaying the supplied image information on the side where the transistor is provided. The touch sensor is provided on the first flexible substrate 701 side of the display unit, which is the same as the touch sensor in the configuration example 2. The difference is explained in detail here, and the same configuration is used for The above description is incorporated herein for the parts that may be used.
[0312] The colored layer 367R is located so as to overlap the light-emitting element 350R. The element 350R emits light toward the side where the transistor 302t is provided. A part of the light emitted by the light emitting element 350R passes through the colored layer 367R and travels in the direction of the arrow shown in the figure. The light is emitted to the outside of touch panel 505B in the opposite direction.
[0313] The touch panel 505B has a light-shielding layer 367BM in the light-emitting direction. The BM is provided so as to surround a colored layer (for example, the colored layer 367R).
[0314] The touch sensor 595 is located on the first flexible substrate 701 side, not on the second flexible substrate 711 side. (Figure 21(A)).
[0315] The adhesive layer 597 is formed by first attaching the flexible substrate 590 to the touch sensor 595 so that the touch sensor 595 overlaps the display unit. The adhesive layer 597 is attached to a flexible substrate 701. The adhesive layer 597 transmits light.
[0316] A configuration in which a bottom gate type transistor is applied to the display unit 501 is shown in FIG. As shown in (A) and (B).
[0317] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is This can be applied to the transistor 302t and the transistor 303t.
[0318] For example, a semiconductor layer containing polycrystalline silicon or the like is used as the transistor 302t shown in FIG. and transistor 303t.
[0319] FIG. 21C shows a structure in which a top-gate transistor is used.
[0320] For example, polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate may be used. The semiconductor layer including the semiconductor layer is applied to a transistor 302t and a transistor 303t shown in FIG. It can be used.
[0321] This embodiment mode can be combined with other embodiment modes as appropriate. EXAMPLES
[0322] In this example, a light-emitting device according to one embodiment of the present invention was manufactured.
[0323] In this embodiment, the configuration example B (see FIG. 2A, etc.) and the configuration example D (see FIG. 9A, etc.) are used. We fabricated a light-emitting device that
[0324] The light-emitting panel manufactured in this embodiment has a pair of manufacturing substrates (glass substrates) on which a peel-off A layer (tungsten film) is formed on each peeling layer, and a peeled layer (one side is a transistor, a light-emitting element) is formed on the peeling layer. After forming the substrates (one including a substrate, such as a photoresist, the other including a color filter, etc.), each substrate is peeled off. A layer was peeled off, and a flexible substrate was attached to the layer to be peeled off using an adhesive.
[0325] The transistor is CAAC-OS (C Axis Aligned Crystall A transistor using a ZnO oxide semiconductor was applied. Unlike amorphous materials, CAAC-OS has fewer defect levels, improving the reliability of transistors. In addition, because CAAC-OS has the characteristic that no grain boundaries are observed, It is possible to form a stable and uniform film over a large area, and it is also possible to bend a flexible light-emitting device. Therefore, the CAAC-OS film is less likely to crack due to the stress caused by the application of heat.
[0326] CAAC-OS is a crystalline oxide semiconductor whose c-axis is aligned approximately perpendicular to the film surface. Another crystal structure of oxide semiconductors is the nanoscale microcrystal aggregate, n It is clear that there are various structures that are different from single crystals, such as ano-crystal (nc). CAAC-OS has lower crystallinity than single crystals and higher crystallinity than nc. stomach.
[0327] In this embodiment, a channel-etched transistor using an In-Ga-Zn oxide is used. The transistor was fabricated on a glass substrate at a temperature of less than 500°C.
[0328] In the method of directly fabricating elements such as transistors on organic resin such as plastic substrates, The temperature in the manufacturing process must be lower than the heat resistance temperature of the organic resin. The substrate used for the preparation is a glass substrate, and the peeling layer, which is an inorganic film, has high heat resistance. The transistors can be fabricated at the same temperature as when fabricating transistors on a substrate. The performance and reliability of the transistor can be easily ensured.
[0329] The light-emitting element used was a tandem (stacked) type organic EL element that emits white light. The LED has a top emission structure, and the light from the light-emitting element is emitted to the light-emitting panel through a color filter. The device is taken out of the system.
[0330] A total of two types of light-emitting panels were produced.
[0331] A light emitting device corresponding to the configuration example B is shown in Fig. 22(A) to (C). FIG. 22(B) shows a light-emitting device in an unfolded or folded state. Figure 22(C) shows the light-emitting device in the folded state. show.
[0332] The light emitting device shown in FIGS. 22(A) to 22(C) uses a magnetic fixture as the fixture 107. The connecting portion 105 has an elastic body and a plurality of spacers. A light-shielding layer 109 is provided so that the connection portion 105 is not visible to a user who looks at the light-emitting surface of the light-emitting device. It is structured in such a way that
[0333] The light-emitting panel of the light-emitting device shown in FIG. 22(A) to (C) has a light-emitting section (light-emitting region, pixel section The size of the 5.9-inch diagonal screen, the number of pixels, and the pixel size are 720 x 1280. 2μm×102μm, resolution 249ppi, aperture ratio 45.2%. The driver is built-in, and the source driver is externally connected using COF (Chip On Film). The frame frequency was set to 60Hz. The light-emitting panel weighs about 3g and is about 1.5mm thick. It was less than 100 μm.
[0334] A light emitting device corresponding to the configuration example D is shown in Figs. 23(A) to (C). FIG. 23(B) shows a light-emitting device in an unfolded or folded state. Figure 23(C) shows the light-emitting device in the folded state. show.
[0335] The light-emitting panel of the light-emitting device shown in Figures 23(A) to (C) has a light-emitting part with a diagonal size of 8. 7 inches, number of pixels 1080 x 1920, pixel size 100 μm x 100 μm, resolution The display has a resolution of 254ppi and an aperture ratio of 46.0%. The scan driver is built-in and the source driver is The driver was attached externally using COF. The frame frequency was 60Hz. The light-emitting panel The light-emitting panel weighs about 6g and is 1.2m thick. The thickness was less than 100 μm.
[0336] As described above, by applying one embodiment of the present invention, the portable terminal has excellent portability in the folded state, When deployed, the seamless, wide light-emitting area allows the creation of a light-emitting device with excellent visibility. They also succeeded in creating a light-emitting device in which damage to the light-emitting panel caused by folding is suppressed. [Explanation of symbols]
[0337] 101 Light-emitting panel 103 Support 103a Support 103b Support 105 Connection 105a Connection 105b Connection 106 Elastic Body 107 Fixtures 108 Spacer 109 Light blocking layer 111 Light-emitting area 112 Non-luminous area 113a Protective layer 113b Protective layer 151 First Area 152 Second Area 153 The Third Region 161 First Area 162 Second Area 163 The Third Region 164 The Fourth Region 165 The Fifth Region 171 First Area 172 Second Area 173 The Third Region 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t Transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel driving circuit 303s(1) Image signal line driver circuit 303s(2) Imaging signal line driver circuit 303t Transistor Gate 304 308 imaging pixels 308p Photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 Terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R Light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 adhesive layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 390 Touch Panel 501 Display section 505 Touch Panel 505B Touch Panel 509 FPC 589 Insulating Layer 590 Flexible substrate 591 Electrode 592 Electrode 593 Insulation Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 701 Flexible substrate 703 Adhesive layer 705 Insulation Layer 711 Flexible substrate 713 Adhesive layer 715 Insulating layer 804 Light emitting part 806 Drive circuit section 808 FPC 814 Conductive layer 815 Insulating layer 817 Insulating layer 817a Insulating layer 817b Insulating layer 820 Transistor 821 Insulating layer 822 Adhesive layer 823 Spacer 824 Transistor 825 Connector 830 Light emitting element 831 Lower electrode 832 Optical adjustment layer 833 EL layer 835 Upper electrode 845 Colored layer 847 Light blocking layer 849 Overcoat 856 Conductive layer 857 Conductive layer 857a Conductive layer 857b Conductive layer
Claims
[Claim 1] A light emitting device having first to third regions, the first region is located between the second region and the third region, Among the first to third regions, the first region has the highest flexibility, the first region includes a light emitting panel and a plurality of spacers; the second region includes the light-emitting panel and a first support; the third region includes the light-emitting panel and a second support; Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility; the first region has a portion where each of the plurality of spacers and the light-emitting panel overlap each other, the second region has a portion where the first support and the light-emitting panel overlap each other, the third region has a portion where the second support and the light-emitting panel overlap each other, When the first region is bent, an angle between normals of opposing surfaces of two adjacent spacers changes in accordance with the light-emitting panel.
Citation Information
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