Display panel, manufacturing method of the display panel, and display device

Abstract

To provide a display panel capable of reducing damages of a signal wiring in a non-display region.SOLUTION: A display panel contains a display region AA and a non-display region NA, and at least one part of the non-display region NA is provided so as to surround the display region AA. The display panel contains: a substrate 10; a wiring layer 40; a light emitting layer; and an isolation structure 20. The wiring layer 40 is positioned on one side of the substrate 10, and the wiring layer 40 contains a metal layer positioned to the display region AA, and a signal wiring layer 41 that is positioned to the non-display region NA. The light emitting layer is positioned to the side facing to the substrate 10 of the wiring layer 40, and the light emitting layer contains a plurality of light emitting units 30. The isolation structure 20 is positioned to a position facing to the substrate of the wiring layer 40, and an isolation opening for housing each light emitting unit 30 to the isolation structure 20 is provided. The isolation structure 20 is electrically connected to the signal wiring layer 41, and provides a protection part 50 facing to the substrate 10 of at least one part of the signal wiring layer 41.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to the field of display technology, and more particularly to a display panel, a manufacturing method for a display panel, and a display device. [Background technology]

[0002] Flat display panels, such as organic light emitting diode (OLED) panels and display panels using light emitting diode (LED) devices, have advantages such as high image quality, power saving, thin body and wide range of applications, and are therefore widely applied to various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, desktop computers, etc., and have become the mainstream of display devices.

[0003] However, current organic light emitting diode display panels still have the problem of signal failure. Summary of the Invention [Problem to be solved by the invention]

[0004] Advantageous Effects of Invention The present invention provides a display panel, a manufacturing method for a display panel, and a display device that can reduce the possibility of damaging signal wiring in a non-display area. [Means for solving the problem]

[0005] In a first aspect, an embodiment of the present invention provides a display panel including a display area and a non-display area, at least a portion of the non-display area being disposed surrounding the display area, the display panel including a substrate, a wiring layer, a light-emitting layer, and an isolation structure. The wiring layer is disposed on one side of the substrate, the wiring layer including a metal layer disposed in the display area and a signal line layer disposed in the non-display area. The isolation structure is disposed on a side of the wiring layer facing away from the substrate, and an isolation opening is provided in the isolation structure for receiving a light-emitting unit. The isolation structure is electrically connected to the signal line layer, and a protective portion is provided on a side of at least a portion of the signal line layer facing away from the substrate.

[0006] In some embodiments, the signal line layer includes a first surface located on a side facing away from the substrate and a second surface connected to either side of the first surface and extending toward the substrate, and the protective portion covers the first and second surfaces.

[0007] In some embodiments, the signal line layer and the metal layer are provided in the same layer and are made of at least a portion of the same material.

[0008] In some embodiments, the wiring layer further includes a conductive connection portion located in the display area, the substrate includes a driving circuit, and the display panel further includes a first electrode, the first electrode being located on a side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit being connected via the conductive connection portion.

[0009] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer is provided on a substrate, the pixel definition layer includes a pixel limiting portion and a pixel opening defined by the pixel limiting portion, the pixel opening and the isolation opening are formed through the pixel opening to accommodate a light-emitting unit, a positive projection of an inner wall of each pixel opening on the substrate is located within a positive projection of an inner wall of each isolation opening on the substrate, and at least a portion of the protective portion and the pixel limiting portion are provided by the same material.

[0010] In some embodiments, the isolation structure is provided on a side of the pixel limiting portion that is remote from the substrate, or the pixel limiting portion is provided with an accommodation groove and the isolation structure is provided in the accommodation groove.

[0011] In some embodiments, the material of the protective portion comprises an inorganic material.

[0012] In some embodiments, a via hole is provided in the pixel limiting portion, and the signal line layer is electrically connected to the isolation structure through the via hole.

[0013] In some embodiments, the substrate further includes a planarization layer, the protective portion includes a first sub-layer and a second sub-layer stacked along the thickness direction of the substrate, the first sub-layer and the planarization layer being made of the same material, and the second sub-layer and the pixel limiting portion being made of the same material.

[0014] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and an orthogonal projection of the first isolation portion on the substrate is located within an orthogonal projection of the second isolation portion on the substrate. The display panel further includes a conductive portion located in the non-display region, the conductive portion located on a side of the protection portion facing away from the signal line layer and made of the same material as the first isolation portion.

[0015] In some embodiments, the material of the conductive portion includes molybdenum or aluminum.

[0016] In some embodiments, the isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion is made of the same material as the third isolation portion.

[0017] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, the method including the steps of: forming a wiring layer on one side of a substrate, the wiring layer including a metal layer located in a display area and a signal line layer located in a non-display area; forming a protective material layer on a side of the signal line layer facing away from the substrate, and performing a patterning process on the protective material layer to form a protective portion on a side of the signal line layer facing away from the substrate; and forming an isolation structure on a side of the wiring layer facing away from the substrate, so as to form an isolation opening surrounded by the isolation structure for accommodating a light-emitting unit.

[0018] In some embodiments, in the step of forming a protective material layer on a side of the signal line layer facing away from the substrate and performing a patterning process on the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate, the protective material layer is patterned to further form a pixel limiting portion and a pixel opening, the pixel opening and the isolation opening penetrate to accommodate a light-emitting unit, the orthogonal projection on the substrate of the inner wall of each pixel opening is located within the orthogonal projection on the substrate of the inner wall of each isolation opening, the pixel opening is for accommodating the light-emitting unit, and at least a part of the protective portion and the pixel limiting portion are made of the same material.

[0019] In a third aspect, an embodiment of the present invention provides a display device including the display panel described above. Effect of the Invention

[0020] The embodiments of the present invention provide a display panel, a manufacturing method for a display panel, and a display device, in which, in the manufacturing process of the display panel, a signal line layer is manufactured before an isolation structure is manufactured, and before the isolation structure is manufactured or a subsequent film layer of the signal line layer is manufactured, a protection part is further manufactured on the side of the signal line layer facing away from the substrate, thereby reducing the possibility that the isolation structure or other subsequent film layer will erode and damage the signal line layer during the manufacturing process, and the reliability of the display panel can be improved.

[0021] Other characteristics, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the drawings, in which: [Brief description of the drawings]

[0022] In the drawings, the same elements are given the same reference numerals, and the drawings are not drawn to scale, in which the same or similar reference numerals indicate the same or similar features. [Figure 1] FIG. 2 is a structural schematic diagram of a display panel according to an embodiment of the present invention. [Diagram 2] 2 is a diagram showing the relative positional relationship between the isolation structures at Q locations and the first signal line in FIG. 1; FIG. [Diagram 3]FIG. 3 is a schematic cross-sectional view of the AA portion in FIG. 2. [Figure 4] 13 is a schematic cross-sectional view of a section AA of still another display panel according to an embodiment of the present invention. FIG. [Diagram 5] 13 is a schematic cross-sectional view of a section AA of still another display panel according to an embodiment of the present invention. FIG. [Figure 6] FIG. 2 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention. [Figure 7] 13 is a schematic cross-sectional view of a section AA of still another display panel according to an embodiment of the present invention. FIG. [Figure 8] 13 is a schematic cross-sectional view of a section AA of still another display panel according to an embodiment of the present invention. FIG. [Figure 9] 13 is a schematic cross-sectional view of a section AA of still another display panel according to an embodiment of the present invention. FIG. [Figure 10] 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. [Figure 11A] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 11B] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 11C] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 12A] 11A to 11C are schematic diagrams illustrating a manufacturing process of still another display panel manufacturing method according to an embodiment of the present invention. [Figure 12B] 11A to 11C are schematic diagrams illustrating a manufacturing process of still another display panel manufacturing method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] The features and exemplary embodiments of each aspect of the present invention will be described in detail below. In the following detailed description, many specific details are proposed to fully understand the present invention. However, as will be apparent to one skilled in the art, the present invention may be practiced without the need for some of these specific details. The following description of the embodiments is merely for illustrating examples of the present invention to better understand the present invention. In the drawings and the following description, at least some known structures and techniques are not shown to avoid unnecessarily obscuring the present invention. In addition, the dimensions of some structures may be exaggerated for clarity. In addition, the features, structures, or characteristics described below may be combined in any suitable manner into one or more embodiments.

[0024] In the description of the present invention, unless otherwise specified, "plurality" means two or more. The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc., is merely for convenience and simplicity of description of the present invention, and does not indicate or imply that a specified device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be understood as limiting the present invention. Furthermore, terms such as "first", "second", etc. are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

[0025] All directional terms appearing in the following description are directions shown in the drawings, and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, unless otherwise clearly specified and limited, the terms "attached" and "connected" should be understood in a broad sense. For example, they may be fixedly connected, detachably connected, or integrally connected. They may be directly connected or indirectly connected. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific situation.

[0026] In the related art, various circuit structures are generally arranged at the frame position of the display panel to meet the normal operation requirements of the display panel, and after the manufacturing of these circuit structures is completed, other structures are generally manufactured in the display area, and the manufacturing process of the other structures will cause erosion of the circuit structures, which will cause damage to the circuit structures themselves, leading to problems such as a reduction in signal transmission effect and even failure.

[0027] Therefore, to solve the above problems, in a first aspect, embodiments of the present invention provide a display panel, a manufacturing method for a display panel, and a display device.

[0028] Fig. 1 is a structural schematic diagram of a display panel according to an embodiment of the present invention. Fig. 2 is a schematic diagram of the relative positional relationship between an isolation structure at a portion Q in Fig. 1 and a first signal line. Fig. 3 is a schematic cross-sectional structure diagram of a portion AA in Fig. 2.

[0029] As shown in Figs. 1 to 3, the display panel according to the present invention includes a display area AA and a non-display area NA, and at least a part of the non-display area NA is provided surrounding the display area AA. The display panel includes a substrate 10, a wiring layer 40, a light-emitting layer, and an isolation structure 20. The wiring layer 40 is located on one side of the substrate 10. The wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA. The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10, and the isolation structure 20 is provided with an isolation opening 21 for accommodating the light-emitting unit 30. The isolation structure 20 is electrically connected to the signal line layer 41, and a protective portion 50 is provided on at least a part of the signal line layer 41 facing away from the substrate 10.

[0030] The display panel has at least two regions, a display area AA and a non-display area NA, the display area AA is the main region for realizing the display effect in the display panel, and the non-display area NA is provided on the outer periphery of the display area AA and is mainly used for arranging signal lines in the display panel. The size and shape of the display area AA and the non-display area NA are not limited in the embodiment of the present invention. For example, the display area AA may have a rectangular structure, the non-display area NA is provided on at least one side of the circumferential direction of the display area AA, and the non-display area NA may have a ring-shaped, semi-ring-shaped or strip-shaped structure.

[0031] The substrate 10 mainly performs a supporting / mounting function, and other film layers are sequentially stacked on the substrate 10. The term "stacked" as used herein refers to the fact that other film layers are sequentially stacked along the thickness direction Y of the substrate 10. Here, the substrate 10 may include a plurality of film layer structures, and the specific configuration of the film layer structure of the substrate 10 is not limited in the embodiment of the present invention. In addition, the thickness direction Y of other film layers located on the substrate 10 side usually coincides with the thickness direction Y of the substrate 10 itself, so for convenience of explanation, the thickness direction Y of the substrate 10 or the thickness direction Y of other film layers described later in the embodiment of the present invention are all shown in the same direction.

[0032] The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10, and the isolation structure 20 surrounds and forms an isolation opening 21 for accommodating the light-emitting unit 30, which is one of the main devices for realizing light-emitting display. The light-emitting unit 30 includes, but is not limited to, a red light-emitting unit that emits red light, a blue light-emitting unit that emits blue light, and a green light-emitting unit that emits green light. Each light-emitting unit 30 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL) that are stacked.

[0033] The isolation opening 21 surrounded by the isolation structure 20 can accommodate the light-emitting unit 30. In other words, the orthogonal projection of the light-emitting unit 30 on the substrate 10 and the orthogonal projection of the isolation opening 21 on the substrate 10 are at least partially overlapped, and at least a part of the orthogonal projection of the light-emitting unit 30 on the substrate 10 is located within the orthogonal projection of the isolation opening 21 on the substrate 10. Furthermore, during the manufacturing process of the light-emitting unit 30, due to the presence of the isolation structure 20, the light-emitting material is separated into light-emitting units 30 independent of each other by the isolation structure 20, and a precision metal mask deposition process can be omitted.

[0034] For example, taking the manufacture of a red light-emitting unit before the manufacture of a green light-emitting unit as an example, in order to omit the need for a precision metal mask, a red light-emitting material corresponding to the red light-emitting unit is first dropped into each isolation opening 21, and then a part of the red light-emitting material in the isolation opening 21 is selectively etched away to leave a part of the red light-emitting material in the isolation opening 21 to form a red light-emitting unit. After that, a green light-emitting material corresponding to the green light-emitting unit 30 is dropped into each isolation opening 21, and then a part of the green light-emitting material in the isolation opening 21 is selectively etched away to leave a part of the green light-emitting material in the isolation opening 21 to form a green light-emitting unit.

[0035] Furthermore, the display panel may include a second electrode 70, and the second electrode 70 and the first electrode 60 are provided on both sides of the light-emitting unit, respectively, and the second electrode 70 may be provided electrically connected to the isolation structure 20. That is, a conductive material may be included in the isolation structure 20, and the second electrode 70 and the conductive material in the isolation structure 20 communicate with each other, so that the second electrodes in different isolation openings are interconnected through the isolation structure to form a planar electrode. Preferably, the second electrode 70 may be a cathode.

[0036] The conductive material for electrically connecting to the second electrodes 70 in the isolation structure 20 may have a lattice shape in the display area, so that the second electrodes 70 in the display area are interconnected as planar electrodes by the isolation structure 20. Alternatively, the conductive material for electrically connecting to the second electrodes 70 in the isolation structure 20 may be separated into a plurality of mutually independent conductive parts. That is, at least some different second electrodes 70 may receive or transmit power signals of different voltage magnitudes through the isolation structure 20 to realize independent or compartmentalized control of the light-emitting units 30, but the embodiment of the present invention is not limited thereto.

[0037] The wiring layer 40 is provided on one side of the substrate 10, and includes a signal line layer 41 located in the non-display area NA, i.e., the wiring layer 40 is provided insulated between the signal line layer 41 and other conductive film layers in the substrate 10 via an insulating layer. Preferably, a driving chip IC is further provided in the non-display area NA of the display panel, and the signal line layer 41 is located between the driving chip IC and the display area AA. Preferably, the material of the signal line layer 41 includes a conductive material, and exemplarily, the material of the signal line layer 41 includes a metal material.

[0038] The signal line layer 41 is used to transmit a corresponding power supply signal to the second electrode 70, and in the related art, the second electrode 70 is provided over the entire surface within the display area, and the signal line layer 41 for electrically connecting to the second electrode 70 is usually located within the non-display area NA and is provided so as to form a ring structure and go around the outer periphery of the second electrode 70. Such an arrangement causes the first electrode 60 to occupy a larger than necessary size at the frame position of the display panel, which is detrimental to realizing a narrow frame effect.

[0039] In the embodiment of the present invention, the signal line layer 41 is not directly connected to the second electrodes 70, but transmits a power signal to each second electrode 70 through the isolation structure 20. Specifically, the isolation structure 20 itself is provided corresponding to each second electrode 70, and signal transmission can be realized between them. Therefore, it is not necessary to extend the signal line layer 41 to the position of each second electrode 70, that is, it is not necessary to install the signal line layer 41 so as to go around each second electrode 70, but it is sufficient to install the signal line layer 41 on one side of the isolation structure 20 along the first direction X and electrically connect to the isolation structure 20. In this way, the power signal located in the signal line layer 41 is transmitted to each second electrode 70 through the isolation structure 20, thereby satisfying the requirement of signal transmission. In addition, since the signal line layer 41 is not annular but is only located on one side of the isolation structure 20 along the first direction X, it is helpful to reduce the frame size of the display panel and improve the display effect. Preferably, the first direction X may be provided crossing the thickness direction Y.

[0040] It should be noted that the embodiment of the present invention is not limited to the specific wiring form of the signal line layer 41. In addition, according to the actual situation, the signal line layer 41 may be completely located on one side of the isolation structure 20 along the first direction X, or a small amount of the signal line layer 41 may be located on the other side of the isolation structure 20 along a different direction, as long as most of the signal line layer 41 are located on the same side of the isolation structure 20.

[0041] In the manufacturing process of the display panel according to the embodiment of the present invention, the signal line layer 41 is manufactured before the isolation structure 20 is manufactured, and before manufacturing the isolation structure 20 or the subsequent film layers of the signal line layer 41, a protective portion 50 is further manufactured on the side of the signal line layer 41 facing away from the substrate 10, thereby reducing the possibility that the isolation structure 20 or other subsequent film layers will erode and damage the signal line layer 41 during the manufacturing process, and improving the reliability of the display panel.

[0042] In some embodiments, as shown in FIG. 3, the signal line layer 41 includes a first surface 411 located on the side facing away from the substrate 10 and a second surface 412 connected to both sides of the first surface 411 and extending toward the substrate 10, and the protective portion 50 covers the first surface 411 and the second surface 412.

[0043] The embodiment of the present invention is not limited to the specific dimensions and shape of the signal line layer 41. Exemplarily, the cross section of the signal line layer 41 may be rectangular or trapezoidal in order to reduce the electrical resistance of the signal line layer 41. Taking the cross section of the signal line layer 41 as an example, which has a trapezoidal shape, the first surface 411 and the second surface 412 of the signal line layer 41 may be the upper base and the leg of the trapezoid.

[0044] In an embodiment of the present invention, by providing a protective portion 50 to cover the first surface 411 and the second surface 412, the possibility that the isolation structure 20 or other film layers will erode the signal line layer 41 during the manufacturing process can be further reduced, and the possibility that the signal line layer 41 will be damaged can be reduced.

[0045] In some embodiments, the signal line layer 41 and the metal layer are provided in the same layer and are made of at least some of the same material, so that the signal line layer 41 and the metal layer can be manufactured and shaped in the same process step.

[0046] FIG. 4 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0047] In some embodiments, as shown in FIG. 4 , the wiring layer 40 further includes a conductive connection 42 located in the display area AA, the substrate 10 includes a driving circuit 11, and the display panel further includes a first electrode 60 located between the light-emitting layer and the substrate, the first electrode 60 being located on the side of the conductive connection 42 facing away from the driving circuit 11, and the first electrode 60 and the driving circuit 11 being connected via the conductive connection 42.

[0048] Preferably, the first electrode 60 and the second electrode 70 are provided on both opposing sides of the light-emitting unit 30 in the thickness direction Y, the number of the first electrodes 60 is plural, each first electrode 60 is provided corresponding to each light-emitting unit 30, and the first electrode 60 and the second electrode 70 drive and control whether or not the light-emitting unit 30 emits light. Exemplarily, the first electrode 60 is an anode, and the second electrode 70 is a cathode. Furthermore, a plurality of insulating layers may be provided between the first electrode 60 and the driving circuit 11, through holes may be provided in the insulating layers, and the conductive connection portion 42 may connect the first electrode 60 and the driving circuit 11 via the through holes.

[0049] Preferably, the material of the conductive connection portion 42 is the same as the material of the signal line layer 41. Illustratively, the conductive connection portion 42 and the signal line layer 41 are manufactured and molded in the same process step.

[0050] Note that the signal line layer 41 may be located completely within the non-display area NA, or may partially extend into the display area AA. Similarly, the isolation structure 20 may be located completely within the display area AA, or may partially extend into the non-display area NA. Similarly, the conductive connection 42 may be located completely within the display area AA, or may partially extend into the non-display area NA.

[0051] In some embodiments, as shown in Figures 3 and 4, the display panel further includes a pixel definition layer 80, the pixel definition layer 80 is disposed on the substrate 10, the pixel definition layer 80 includes a pixel limiting portion 81 and a pixel opening 82 defined by the pixel limiting portion 81, the pixel opening 82 penetrates the isolation openings 21 to accommodate the light-emitting unit 30, the orthogonal projection of each pixel opening 82 on the substrate 10 is located within the orthogonal projection of each isolation opening 21 on the substrate 10, and at least a portion of the protective portion 50 and the pixel limiting portion 81 are made of the same material.

[0052] The pixel definition layer 80 includes a pixel limiting portion 81 and a pixel opening 82, and the pixel opening 82 is provided corresponding to the isolation opening 21. For example, the orthogonal projection of the pixel opening 82 on the substrate 10 may be located within the orthogonal projection of the isolation opening 21 on the substrate 10, and some structures in the light-emitting unit 30 and the second electrode 70 may be located within the pixel opening 82.

[0053] In some examples, at least a portion of the protective portion 50 and the pixel limiting portion 81 may be provided from the same material, ie, the protective portion 50 and the pixel limiting portion 81 may be manufactured and molded in the same process step.

[0054] As can be seen from the above, the signal line layer 41 and the conductive connection portion 42 are manufactured and formed in the same process step, so by making the distance between the signal line layer 41 and the substrate in the substrate 10 the same as the distance between the conductive connection portion 42 and the substrate in the substrate 10, the distance between the protective portion 50 and the substrate can be made equal to or less than the distance between the pixel limiting portion 81 and the substrate, thereby improving the effect of the protective portion 50 on the thickness of the film layer in the non-display area NA and reducing the overall thickness of the film layer in the non-display area NA.

[0055] FIG. 5 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0056] In some embodiments, as shown in Figures 4 and 5, the isolation structure 20 is provided on the side of the pixel limiting portion 81 away from the substrate 10, or an accommodating groove 811 is provided in the pixel limiting portion 81, and the isolation structure 20 is provided in the accommodating groove 811.

[0057] The isolation structure 20 is provided on the side of the pixel limiting portion 81 away from the substrate 10, i.e., the orthogonal projection of the isolation structure 20 on the substrate 10 is within the orthogonal projection of the pixel limiting portion 81 on the substrate 10, thereby improving the blocking effect of the isolation opening 21 formed by being surrounded by the isolation structure 20.

[0058] The pixel limiting portion 81 may be provided with an accommodation groove 811, and the accommodation groove 811 may be formed by being recessed from the side of the pixel limiting portion 81 facing away from the substrate 10. Preferably, the recess depth of the accommodation groove 811 may be the same as or different from the recess depth of the pixel opening 82. Preferably, the accommodation groove 811 may be provided so as to penetrate the pixel limiting portion 81.

[0059] Preferably, one or more receiving grooves 811 may be provided between two adjacent pixel openings 82. The isolation structure 20 is provided in the receiving groove 811, thereby reducing the space occupied by the isolation structure 20 in the thickness direction Y of the display panel, and thus the overall thickness of the display panel can be reduced.

[0060] In some embodiments, the material of the protective part 50 includes an inorganic material, which allows the protective part 50 to have good density and reduces the possibility of the protective part 50 being eroded when it comes into contact with the isolation structure 20 or other film layer etching solution or etching gas, and the protective part 50 exposes at least a portion of the signal line layer 41, thereby reducing the possibility of the signal line layer 41 being eroded and causing failure of the signal line layer 41.

[0061] FIG. 6 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.

[0062] In some embodiments, as shown in FIG. 6, a via hole 43 is provided in the pixel limiting portion 81 , and the signal line layer 41 is electrically connected to the isolation structure 20 through the via hole 43 .

[0063] Optionally, a portion of the signal line layer 41 may extend to the display area AA, and a via hole is provided penetrating the pixel limiting portion 81 along the thickness direction of the display panel.

[0064] In another example, a portion of the isolation structure 20 may be located in the non-display area NA, and a via hole may be provided in the protective part 50. Specifically, after the manufacture of the isolation structure 20 is completed, a via hole 43 may be formed in the protective part 50, and the partial structure of the isolation structure 20 located in the non-display area NA may be electrically connected to the signal line layer 41 through the via hole 43.

[0065] FIG. 7 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0066] In some embodiments, as shown in FIG. 7 , the substrate 10 further includes a planarization layer 12, and the protective portion 50 includes a first sublayer 51 and a second sublayer 52 stacked along the thickness direction Y of the substrate 10, where the first sublayer 51 is made of the same material as the planarization layer 12, and the second sublayer 52 is made of the same material as the pixel limiting portion 81.

[0067] Alternatively, the first sub-layer 51 and the second sub-layer 52 of the protective part 50 may cover the same area of ​​the signal line layer 41, for example, the first sub-layer 51 covers the first surface 411 and the second surface 412 of the signal line layer 41, and the second sub-layer 52 covers the area of ​​the first sub-layer 51 corresponding to the first surface 411 and the second surface 412 of the signal line layer 41. Of course, the areas of the signal line layer 41 covered by the first sub-layer 51 and the second sub-layer 52 may be different, for example, the first sub-layer 51 covers the first surface 411 of the signal line layer 41, and the second sub-layer 52 covers the area of ​​the first sub-layer 51 corresponding to the first surface 411 of the signal line layer 41 and the second surface 412 of the signal line layer 41.

[0068] The first sub-layer 51 and the planarization layer 12 are made of the same material, i.e., the first sub-layer 51 and the planarization layer 12 are manufactured and shaped in the same process step. The second sub-layer 52 is made of the same material as the pixel limiting portion 81, i.e., the second sub-layer 52 is manufactured and shaped in the same process step as the pixel limiting portion 81, thereby reducing the possibility that the first sub-layer 51 will react with other substances after the second sub-layer 52 reacts with other substances, and improving the reliability of the protection portion 50.

[0069] FIG. 8 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0070] 8 , the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 located on a side of the first isolation portion 22 away from the substrate 10, and the orthogonal projection of the first isolation portion 22 on the substrate 10 is located within the orthogonal projection of the second isolation portion 23 on the substrate 10. The display panel further includes a conductive portion 90 located in the non-display area NA, the conductive portion 90 is located on a side of the protection portion 50 facing away from the signal line layer 41, and the conductive portion 90 is made of the same material as the first isolation portion 22.

[0071] The embodiment of the present invention is not limited to the specific dimensions and shapes of the first isolation portion 22 and the second isolation portion 23. For example, the vertical section of the isolation structure 20 may be T-shaped. This design contributes to preventing the luminescent material and the electrode material from easily extending along the sidewall of the first isolation portion 22 to the sidewall of the second isolation portion 23 during the manufacturing process of the light emitting unit 30 and the second electrode 70, thereby realizing the manufacture and mutual separation of the light emitting unit 30 and the second electrode 70 in the different isolation openings 21 without the need for a fine metal mask.

[0072] Regarding the material composition of the first isolation portion 22 and the second isolation portion 23, the embodiment of the present invention is not limited, and the first isolation portion 22 and the second isolation portion 23 may both include a conductive material, or the first isolation portion 22 may include a conductive material and the second isolation portion 23 may include an insulating material, as long as the two electrodes can realize signal transmission through the isolation structure 20.

[0073] The conductive part 90 is used to connect the functional film layer in the display area AA of the driving chip IC to the driving chip IC, so that the signal in the driving chip IC is transmitted to the functional film layer. The conductive part 90 is made of the same material as the first isolation part 22, that is, the conductive part 90 is manufactured and formed in the same process step as the first isolation part 22, so that the first isolation part 22 can manufacture the conductive part 90 at the same time during the manufacturing process, and the manufacturing cost can be reduced.

[0074] In some embodiments, the material of conductive portion 90 may include molybdenum or aluminum to improve the conductive performance of conductive portion 90 .

[0075] FIG. 9 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0076] In some embodiments, as shown in FIG. 9 , the isolation structure 20 further includes a third isolation portion 24, the first isolation portion 22 is located between the third isolation portion 24 and the second isolation portion 23, and the conductive portion 90 is made of the same material as the third isolation portion 24.

[0077] The isolation structure 20 includes at least a first isolation portion 22, a second isolation portion 23, and a third isolation portion 24, and the embodiment of the present invention is not limited with respect to the dimensions and shapes of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24. Exemplarily, the orthogonal projection of the first isolation portion 22 on the substrate 10 is located within the orthogonal projection of the third isolation portion 24 on the substrate 10, that is, the vertical cross-sectional shapes of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24 are U-shaped.

[0078] Similar to the first isolation portion 22, the third isolation portion 24 also includes a conductive material, and the second electrode 70 may be in direct contact with the third isolation portion 24 to realize an electrical connection with the first isolation portion 22 through the third isolation portion 24. Optionally, the second electrode 70 is disposed to overlap the third isolation portion 24. Furthermore, the second electrode 70 may be partially located on a side of the third isolation portion 24 that is away from the substrate 10, and the provision of the third isolation portion 24 contributes to improving the reliability of the electrical connection between the second electrode 70 and the isolation structure 20.

[0079] The conductive portion 90 may be made of the same material as the third isolation portion 24, i.e., the conductive portion 90 may be made of the same material as the third isolation portion 24. As can be seen from the above, the conductive portion 90 may be made of the same material as the third isolation portion 24, and the conductive portion 90 may include a first sub portion and a second sub portion that are laminated along the thickness direction Y of the substrate 10. By making the first sub portion and the third isolation portion 24 of the same material and making the second sub portion and the first isolation portion 22 of the same material, the electrical resistance of the conductive portion 90 can be further reduced and the reliability of the conductive portion 90 can be improved.

[0080] In some examples, the conductive portion 90 may be made of the same material as only the first isolation portion 22. In other examples, the conductive portion 90 may be made of the same material as only the third isolation portion 24.

[0081] Fig. 10 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figs. 11A to 11C are schematic diagrams of the manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. Figs. 12A to 12B are schematic diagrams of the manufacturing process of yet another display panel manufacturing method according to an embodiment of the present invention.

[0082] In a second embodiment, as shown in FIG. 10, a method for manufacturing a display panel according to the present invention includes the following steps, and the display panel may be the display panel shown in FIGS.

[0083] In S100, a wiring layer 40 is formed on one side of a substrate 10, and the wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA.

[0084] 11A, in step S100, a wiring layer 40 is formed on one side of the substrate 10, i.e., a conductive material layer is provided on one side of the substrate 10, and a patterning process is performed on the conductive material layer to form a signal line layer 41 and a metal layer. Optionally, the material of the signal line layer 41 includes a titanium-aluminum-titanium three-layer metal structure.

[0085] In S200, a protective material layer D1 is formed on the side of the signal line layer 41 facing away from the substrate 10, and a patterning process is performed on the protective material layer D1 to form a protective portion 50 located on the side of the signal line layer 41 away from the substrate 10.

[0086] In some embodiments, as shown in Fig. 11B, after patterning the protective material layer D1 in step S200, only the protective portion 50 may be formed, or other film layers in the display area AA may be formed while forming the protective portion 50. Optionally, the protective material layer D1 may be manufactured by a process such as photolithography.

[0087] In S300, an isolation structure 20 is formed on the wiring layer 40 on the side facing away from the substrate 10, and an isolation opening 21 is formed surrounded by the isolation structure 20 to accommodate the light emitting unit 30 therein.

[0088] In some embodiments, as shown in FIG. 11C , in step S300, in the manufacturing process of the isolation structure 20, in order to facilitate the manufacturing of the first isolation portion 22 and the second isolation portion 23, the first isolation portion 22 may be manufactured by wet etching, and a protective portion 50 may be provided covering the surface of the signal line layer 41 to reduce the possibility that the etching solution used in the manufacturing process of the first isolation portion 22 will corrode the metal material and corrode the signal line layer 41.

[0089] In S400, a light-emitting unit is formed within the isolation opening.

[0090] In some embodiments, as shown in Fig. 11C, in step S400, light-emitting units 30 of different colors are formed in the isolation openings 21. Exemplarily, a red light-emitting unit, a green light-emitting unit and a blue light-emitting unit are formed in each of the isolation openings 21. In forming the light-emitting units 30, an isolation structure may be used instead of a precision metal mask.

[0091] In some embodiments, as shown in FIGS. 11C, 12A and 12B, step S200 includes the following steps.

[0092] In S210, a patterning process is performed on the protective material layer D1 to further form pixel limiting portions 81 and pixel openings 82, the pixel openings 82 and the isolation openings 21 penetrate each other to accommodate the light-emitting units 30, the orthogonal projection of the inner wall of each pixel opening 82 on the substrate 10 is located within the orthogonal projection of the inner wall of each isolation opening 21 on the substrate 10, and at least a portion of the protective portions 50 and the pixel limiting portions 81 are made of the same material.

[0093] In some embodiments, in step S210, the pixel limiting portion 81 and the pixel opening 82 may be manufactured before the isolation structure 20 is manufactured, or the pixel limiting portion 81 and the pixel opening 82 may be manufactured after the isolation structure 20 is manufactured. In the embodiments of the present invention, the pixel limiting portion 81 and the pixel opening 82 are manufactured after the isolation structure 20 is manufactured. As shown in FIG. 12A, the protective material layer D1 can cover the display area AA and the non-display area NA. As shown in FIG. 12B, the protective material layer D1 is patterned to form a pixel defining material layer D2 and a protective portion, and the isolation structure 20 is formed in the corresponding area of ​​the pixel defining material layer D2 to form the pixel limiting portion 81 and the pixel opening 82, thereby reducing the possibility of damaging the signal line layer 41 and the first electrode 60 during the process of manufacturing the isolation structure 20.

[0094] In a third aspect, the present invention further provides a display device including any one of the display panels described above. Since the display device according to the embodiment of the present invention includes any one of the display panels described above, the display device according to the embodiment of the present invention has the beneficial effects of any one of the display panels described above, and the description thereof will be omitted here.

[0095] The display device in the embodiment of the present invention includes, but is not limited to, devices with display functions such as mobile phones, personal digital assistants (abbreviated as PDA), tablet computers, e-books, televisions, door controls, smart landlines, and consoles.

[0096] Although the present invention has been described above with reference to the preferred embodiments, various modifications can be made and the components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features described in each embodiment can be arbitrarily combined as long as there is no structural contradiction. The present invention is not limited to the specific embodiments disclosed in this specification, but includes all technical solutions included in the claims. [Explanation of symbols]

[0097] 10 Substrate 11 Drive circuit 12 Planarization layer 20 Isolation structure 21 Isolation opening 22 1st isolation section 23 2nd isolation section 24 3rd Isolation Department 30 Light Emitting Unit 40 wiring layer 41 Signal Line Layer 411 1st surface 412 2nd surface 42 Conductive connection 43 Signal line connection part 50 Protection Department 51 First Sublayer 52 Second Sub-layer 60 1st electrode 70 2nd electrode 80 Pixel Definition Layer 81 Pixel Limited Section 811 Storage Groove 82 pixel aperture 90 Conductive part D1 Protective material layer D2 Pixel Defining Material Layer IC driver chip AA display area NA hidden area X 1st direction Y thickness direction

Claims

1. A display panel including a display area and a non-display area, the non-display area being disposed so as to surround at least a portion of the display area, A substrate; a wiring layer located on one side of the substrate, the wiring layer including a metal layer located in the display area and a signal line layer located in the non-display area; a light-emitting layer located on a side of the wiring layer facing away from the substrate and including a plurality of light-emitting units; an isolation structure located on a side of the wiring layer facing away from the substrate and having an isolation opening for accommodating a light emitting unit; A display panel comprising: a protection portion provided on at least a portion of said signal line layer on a side facing away from said substrate.

2. the signal line layer includes a first surface located on a side facing away from the substrate, and a second surface connected to both sides of the first surface and extending toward the substrate, the protective portion covers the first surface and the second surface, 2. The display panel according to claim 1, wherein the signal line layer and the metal layer are preferably provided in the same layer and are made of at least a part of the same material.

3. the isolation structure is electrically connected to the signal line layer; The display panel of claim 1, characterized in that the metal layer includes a conductive connection portion, the substrate includes a driving circuit, the display panel further includes a first electrode located between the light-emitting layer and the substrate, the first electrode being located on a side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit being connected via the conductive connection portion.

4. the display panel further includes a pixel definition layer, the pixel definition layer being disposed on the substrate, the pixel definition layer including a pixel limiting portion and a pixel opening defined by the pixel limiting portion, the pixel opening and the isolation opening are formed to accommodate the light emitting unit therethrough, an orthogonal projection of an inner wall of each of the pixel openings on the substrate is located within an orthogonal projection of an inner wall of each of the isolation openings on the substrate, and at least a portion of the protection portion and the pixel limiting portion are formed of the same material; Preferably, the isolation structure is provided on a side of the pixel limiting portion that is remote from the substrate, or a receiving groove is provided in the pixel limiting portion, and the isolation structure is provided in the receiving groove; Preferably, the material of the protective part includes an inorganic material, 2. The display panel according to claim 1, wherein a via hole is provided in the pixel limiting portion, and the signal line layer is electrically connected to the isolation structure through the via hole.

5. 5. The display panel of claim 4, wherein the substrate further includes a planarization layer, the protective portion includes a first sub-layer and a second sub-layer stacked along the thickness direction of the substrate, the first sub-layer and the planarization layer being made of the same material, and the second sub-layer and the pixel limiting portion being made of the same material.

6. the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, the orthogonal projection of the first isolation portion on the substrate being located within the orthogonal projection of the second isolation portion on the substrate; the display panel further includes a conductive portion located in the non-display area, the conductive portion being located on a side of the protection portion facing away from the signal line layer and being made of the same material as the first isolation portion; 2. The display panel according to claim 1, wherein the material of the conductive portion preferably contains molybdenum or aluminum.

7. 7. The display panel of claim 6, wherein the isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion is made of the same material as the third isolation portion.

8. forming a wiring layer including a metal layer located in a display area and a signal line layer located in a non-display area on one side of a substrate; forming a protective material layer on a side of the signal line layer facing away from the substrate, and performing a patterning process on the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate; forming an isolation structure on a side of the wiring layer facing away from the substrate, the isolation structure being provided with an isolation opening for receiving a light emitting unit; forming the light emitting units in the isolation openings.

9. 9. The method for manufacturing a display panel according to claim 8, wherein in the step of forming a protective material layer on a side of the signal line layer facing away from the substrate and patterning the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate, the protective material layer is patterned to further form a pixel limiting portion and a pixel opening, the pixel opening and the isolation opening penetrate each other to accommodate the light-emitting unit, an orthogonal projection of an inner wall of each of the pixel openings on the substrate is located within an orthogonal projection of an inner wall of each of the isolation openings on the substrate, the pixel openings are for accommodating a light-emitting unit, and at least a part of the protective portion and the pixel limiting portion are made of the same material.

10. A display device comprising the display panel according to any one of claims 1 to 7.

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