Imaging device and imaging apparatus

Abstract

To detect a flare light in an imaging device.SOLUTION: An imaging device includes: a pixel allay part; and a detection pixel. The pixel allay part included by the imaging device comprises a photoelectric conversion part that performs a photoelectric conversion of an incident light, and a plurality of pixels for generating a pixel signal based on an electric charge generated by the photoelectric conversion is arranged therein. The detection image having the imaging device comprises the photoelectric conversion part so as to be arranged to their pixel allay part, and generates a detection pixel signal by detecting the incident light that is obliquely entered from a boundary region with the adjacent pixel.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an imaging element and an imaging device. [Background technology]

[0002] An imaging element that captures an image of a subject and generates an image is configured by arranging pixels in a two-dimensional matrix, each having a photoelectric conversion unit that performs photoelectric conversion of incident light to generate electric charges. In order to improve the image quality of this imaging element, an imaging element has been proposed that detects and corrects an image signal based on light different from direct light from the subject. For example, an imaging element has been proposed that includes a detection pixel that detects light leaked from an adjacent pixel (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-034086 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above-mentioned conventional technology has a problem that it is difficult to detect an image due to flare light that occurs when capturing an image of a high-luminance subject, such as when capturing an image outdoors. Here, flare light refers to light that is generated when a part of light from a high-luminance subject is reflected by the incident surface of an image sensor, etc., and the reflected light directly or indirectly enters surrounding pixels. When this flare light is photoelectrically converted by pixels, an optical image other than the original subject is generated, resulting in a problem of degraded image quality.

[0005] Therefore, the present disclosure proposes an image sensor and an image pickup apparatus that detect flare light. [Means for solving the problem]

[0006] The imaging element according to the present disclosure includes a pixel array section and a detection pixel. The pixel array section includes a plurality of pixels arranged therein, each of which includes a photoelectric conversion section that performs photoelectric conversion of incident light and generates a pixel signal based on an electric charge generated by the photoelectric conversion. The detection pixel is arranged in the pixel array section, includes a photoelectric conversion section, detects the incident light that is obliquely incident from a boundary region between the adjacent pixels, and generates a detection pixel signal. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram illustrating an example of the configuration of an imaging device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram illustrating an example of the configuration of an imaging element according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is a diagram illustrating an example of a pixel configuration according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a diagram illustrating an example of a pixel configuration according to an embodiment of the present disclosure. [Diagram 5] FIG. 2 is a diagram illustrating a configuration example of a pixel array unit according to an embodiment of the present disclosure. [Figure 6] FIG. 11 is a diagram illustrating an example of a processing procedure of a flare region detection process according to an embodiment of the present disclosure. [Figure 7] FIG. 4 is a diagram illustrating an example of the configuration of a pixel according to a first modified example of the embodiment of the present disclosure. [Figure 8] FIG. 4 is a diagram illustrating an example of the configuration of a pixel according to a first modified example of the embodiment of the present disclosure. [Figure 9] FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to a second modified example of the embodiment of the present disclosure. [Figure 10] FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to a second modified example of the embodiment of the present disclosure. [Figure 11] FIG. 13 is a diagram illustrating an example of a pixel configuration according to a third modified example of the embodiment of the present disclosure. [Figure 12] FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to a fourth modified example of the embodiment of the present disclosure. [Figure 13] FIG. 13 is a diagram illustrating an example of a pixel configuration according to a fifth modified example of the embodiment of the present disclosure. [Figure 14]FIG. 13 is a diagram illustrating an example of the configuration of a pixel according to a sixth modified example of the embodiment of the present disclosure. [Figure 15] 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; [Figure 16] 4 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order. In the following embodiments, the same components are designated by the same reference numerals, and duplicated description will be omitted. 1. Embodiment 2. Variations 3. Application Examples

[0009] (1. EMBODIMENT) [Configuration of imaging device] FIG. 1 is a diagram showing a configuration example of an imaging device according to an embodiment of the present disclosure. The figure is a block diagram showing a configuration example of an imaging device 1. The imaging device 1 captures an image based on incident light from a subject and generates image data. The imaging device 1 in the figure outputs pixel signals constituting the image data. The imaging device 1 also detects flare light and further outputs a flare region, which is a region of an image caused by the flare light. The imaging device 1 includes an imaging element 2, an imaging lens 3, and a flare region detection unit 4.

[0010] The imaging lens 3 forms an optical image based on incident light from a subject on the light receiving surface of the imaging element 2 .

[0011] The image sensor 2 captures an image based on incident light and generates a pixel signal. The image sensor 2 also detects flare light and generates a detection pixel signal that is the detection result. The pixel signal is output to a device external to the image sensor 1. The detection pixel signal is also output to a flare area detection unit 4.

[0012] The flare region detection unit 4 detects a flare. The flare region detection unit 4 detects a flare region, which is a region where an optical image is formed by flare light, based on a detection pixel signal. The detected flare region is output to a device external to the imaging device 1. The flare region detection unit 4 is an example of a "processing unit" in the present disclosure.

[0013] [Image sensor configuration] 2 is a diagram showing a configuration example of an image sensor according to an embodiment of the present disclosure. The figure is a block diagram showing a configuration example of an image sensor 2. The image sensor 2 is a semiconductor element that generates image data of a subject. The image sensor 2 includes a pixel array section 10, a vertical drive section 20, a column signal processing section 30, and a control section 40.

[0014] The pixel array section 10 is configured by arranging a plurality of pixels 100. The pixel array section 10 in the figure shows an example in which a plurality of pixels 100 are arranged in a two-dimensional matrix. Here, the pixel 100 includes a photoelectric conversion section that performs photoelectric conversion of incident light, and generates a pixel signal of a subject based on the irradiated incident light. For example, a photodiode can be used for this photoelectric conversion section. In addition, a pixel circuit that generates a pixel signal based on the charge generated by the above-mentioned photoelectric conversion section is arranged in the pixel 100. Signal lines 11 and 12 are wired to each pixel 100. The pixel 100 generates a pixel signal under the control of a control signal transmitted by the signal line 11, and outputs the generated pixel signal via the signal line 12. The signal line 11 is arranged for each row in the shape of a two-dimensional matrix, and is wired in common to the plurality of pixels 100 arranged in one row. The signal line 12 is arranged for each column in the shape of a two-dimensional matrix, and is wired in common to the plurality of pixels 100 arranged in one column.

[0015] The vertical drive unit 20 generates control signals for the above-mentioned pixels 100. The vertical drive unit 20 in the figure generates a control signal for each row of the two-dimensional matrix of the pixel array unit 10 and outputs it sequentially via a signal line 11.

[0016] The column signal processing unit 30 processes pixel signals generated by the pixels 100. The column signal processing unit 30 in the figure simultaneously processes pixel signals from a plurality of pixels 100 arranged in one row of the pixel array unit 10, which are transmitted via a signal line 12. For example, this processing can include analog-to-digital conversion for converting analog pixel signals generated by the pixels 100 into digital pixel signals, and correlated double sampling (CDS) for removing offset errors in the pixel signals. The processed pixel signals are output to a circuit or the like external to the image sensor 2.

[0017] The control unit 40 controls the vertical driving unit 20 and the column signal processing unit 30. The control unit 40 in the figure controls the vertical driving unit 20 and the column signal processing unit 30 by outputting control signals via signal lines 41 and 42, respectively.

[0018] The pixel array unit 10 in the figure includes detection pixels 200 (not shown). The detection pixels 200 perform photoelectric conversion of the flare light to generate detection pixel signals.

[0019] [Image sensor configuration] 3 is a diagram showing an example of the configuration of a pixel according to an embodiment of the present disclosure. The figure is a plan view showing an example of the configuration of a pixel 100 and a detection pixel 200 arranged in a pixel array section 10 of the image sensor 2. The dotted line area in the figure represents the pixel 100. The pixel 100 is formed on a semiconductor substrate (semiconductor substrate 120). The white area in the figure represents the area of ​​the semiconductor substrate 120.

[0020] The pixel 100 includes a first photoelectric conversion unit 101 and a second photoelectric conversion unit 102. The dashed lines in the figure represent the regions of the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102. The first photoelectric conversion unit 101 is an example configured to be an octagon in a plan view. The second photoelectric conversion unit 102 is an example configured to be a rectangle in a plan view. The first photoelectric conversion unit 101 is a photoelectric conversion unit having a large light receiving area. The second photoelectric conversion unit 102 is a photoelectric conversion unit having a smaller light receiving area than the first photoelectric conversion unit 101. By switching between the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102, the sensitivity during imaging can be switched. When the first photoelectric conversion unit 101 is used, imaging with high sensitivity can be performed. On the other hand, when the second photoelectric conversion unit 102 is used, imaging with low sensitivity can be performed. This makes it possible to capture high dynamic range (HDR) images.

[0021] Further, a color filter (color filter 170) described later is disposed in the pixel 100. This color filter 170 is an optical filter that transmits incident light of a predetermined wavelength. The color filter 170 may be a color filter that transmits red light, a color filter that transmits green light, or a color filter that transmits blue light. The alphabets in the figure indicate the type of color filter 170 disposed in the pixel 100. "R" indicates a color filter 170 corresponding to red light. "G" indicates a color filter 170 corresponding to green light. "B" indicates a color filter 170 corresponding to blue light.

[0022] Further, a separation section 135 (not shown) and a light shielding section 136 are disposed at the boundary between the pixels 100. As described later in FIG. 4, the separation section 135 is disposed on the semiconductor substrate 120 at the boundary between the pixels 100 to electrically separate the pixels 100 from each other. Further, the light shielding section 136 is disposed near the rear surface of the semiconductor substrate 120 at the boundary between the pixels 100 to shield light from the adjacent pixels 100. The dotted hatched area in the figure represents the light shielding section 136.

[0023] A detection pixel 200 is shown in the center of the pixel array unit 10 in the figure. The dashed line area represents the area of ​​the detection pixel 200. The semiconductor substrate 120 of the detection pixel 200 is distinguished by hatching. The detection pixel 200 in the figure represents an example including a second photoelectric conversion unit 102. A light-shielding film 251 is disposed in the detection pixel 200. This light-shielding film 251 blocks incident light other than flare light. The light-shielding unit 136 has an opening 137 formed in the area between the detection pixel 200 and the pixel 100.

[0024] The detection pixel 200 may also be configured to include the first photoelectric conversion unit 101. Specifically, a light-shielding film may be disposed on the pixel 100 adjacent to the lower left of the detection pixel 200 in the figure, and the pixel 100 may also be used as the detection pixel 200. The detection pixel 200 may also be configured to include both the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102.

[0025] 4 is a diagram showing a configuration example of a pixel according to an embodiment of the present disclosure. The figure is a cross-sectional view showing a configuration example of a pixel 100 and a detection pixel 200 arranged in a pixel array unit 10 of the image sensor 2. The left side of the figure shows a configuration example of the pixel 100, and the right side of the figure shows a configuration example of the detection pixel 200. The pixel 100 includes a semiconductor substrate 120, a wiring region 140, a color filter 170, and on-chip lenses 171 and 172.

[0026] The semiconductor substrate 120 is a semiconductor substrate on which elements such as the pixel 100 are formed. This semiconductor substrate 120 can be made of silicon (Si). For convenience, the semiconductor substrate 120 in the figure is assumed to form a p-type well region. An element can be formed by disposing an n-type or p-type semiconductor region in this well region. The open rectangles represent the semiconductor regions. In the figure, an n-type semiconductor region 121 constituting the first photoelectric conversion unit 101 and an n-type semiconductor region 122 constituting the second photoelectric conversion unit 102 are shown. The pn junctions at the interfaces between these semiconductor regions and the surrounding well regions form a photodiode.

[0027] A wiring region 140 is disposed on the front surface of the semiconductor substrate 120 via an insulating film 131. This wiring region 140 is a region where wiring for transmitting signals and the like to elements of the pixel 100 is disposed.

[0028] An insulating film 132 is disposed on the rear surface of the semiconductor substrate 120. Furthermore, a separation section 135 is disposed in a region of the semiconductor substrate 120 at the boundary between the pixels 100. This separation section 135 insulates the pixels 100 from each other. The separation section 135 can be made of, for example, silicon oxide (SiO2). The separation section 135 is also disposed between the first photoelectric conversion section 101 and the second photoelectric conversion section 102. The separation section 135 can be formed by disposing SiO2 in a groove-shaped recess formed in the semiconductor substrate 120.

[0029] In addition, a light shielding portion 136 is disposed at the boundary between pixels 100 near the rear surface of the semiconductor substrate 120. This light shielding portion 136 blocks light incident obliquely from an adjacent pixel 100. By disposing this light shielding portion 136, color mixing and crosstalk can be reduced. The light shielding portion 136 can be made of tungsten or the like.

[0030] The above-mentioned color filter 170 and on-chip lenses 171 and 172 are disposed on the back surface side of the semiconductor substrate 120. The on-chip lens 171 corresponds to the first photoelectric conversion unit 101, and the on-chip lens 172 corresponds to the second photoelectric conversion unit .

[0031] The detection pixel 200 includes a second photoelectric conversion unit 102 and an on-chip lens 172. The detection pixel 200 also includes a light-shielding film 251. This light-shielding film 251 is disposed on the light-receiving surface side of the second photoelectric conversion unit 102, and blocks direct light from among incident light. The dotted arrows in the figure represent direct light. This direct light is blocked by the light-shielding film 251 after passing through the on-chip lens 172 and the color filter 170. This inhibits photoelectric conversion based on the direct light in the second photoelectric conversion unit 102. The light-shielding film 251 can be made of tungsten, similar to the light-shielding unit 136.

[0032] Moreover, an opening 137 is disposed in the light shielding portion 136 between the detection pixel 200 and the pixel 100. That is, the light shielding portion 136 is not disposed in the boundary region between the detection pixel 200 and the pixel 100. Therefore, oblique incident light is incident on the detection pixel 200 through the region between the detection pixel 200 and the pixel 100. The arrow in the figure indicates this oblique incident light. Such light with a high incident angle (for example, 60 to 80 degrees) corresponds to flare light. The detection pixel 200 performs photoelectric conversion of the flare light to generate a pixel signal. This pixel signal corresponds to the detection pixel signal.

[0033] 5 is a diagram showing a configuration example of a pixel array section according to an embodiment of the present disclosure. The diagram shows a configuration example of a pixel array section 10. The pixels 100 and the like of the pixel array section 10 in the diagram are divided into a plurality of regions 300. A detection pixel 200 is arranged in each of the regions 300. The region 300 can be configured to include the pixels 100 arranged in 100 rows and 100 columns, for example. The flare region detection section 4 in FIG. 1 detects the range of a flare optical image in units of the regions 300.

[0034] [Flare area detection process] FIG. 6 is a diagram showing an example of a processing procedure of the flare region detection processing according to the embodiment of the present disclosure. The figure is a flow chart showing an example of a processing procedure of the flare region detection processing in the flare region detection unit 4. First, the flare region detection unit 4 selects one of the regions 300 (step S101). Next, the flare region detection unit 4 acquires a detection pixel signal of the detection pixel 200 included in the selected region 300 (step S102). Next, the flare region detection unit 4 judges whether the acquired detection pixel signal is greater than a threshold value (step S103). As a result, if the detection pixel signal is not greater than the threshold value (step S103, No), the flare region detection unit 4 proceeds to step S105. On the other hand, if the detection pixel signal is greater than the threshold value (step S103, Yes), the flare region detection unit 4 outputs the region 300 as a flare region (step S104) and proceeds to step S105.

[0035] In step S105, the flare region detection unit 4 determines whether all the regions 300 have been selected (step S105). As a result, if all the regions 300 have been selected (step S105, Yes), the flare region detection unit 4 ends the process. On the other hand, if all the regions 300 have not been selected (step S105, No), the flare region detection unit 4 returns to the process of step S101 and selects another region 300.

[0036] The image of the area determined to be a flare area can be excluded from the image data. For example, it can be determined that another sensor (such as a Lidar or millimeter wave sensor) is to be used for recognition in that area. This makes it possible to suppress the occurrence of erroneous recognition due to flare. Note that image data will be missing from the portion of the detection pixel 200. By performing defect correction processing, the image data of this detection pixel 200 can be complemented.

[0037] In this manner, the image sensor 2 according to the embodiment of the present disclosure can detect flare light by the detection pixels 200 arranged in the pixel array section 10.

[0038] (2. Modifications) A modification of the above embodiment will now be described.

[0039] 7 and 8 are diagrams showing an example of the configuration of a pixel according to a first modified example of the embodiment of the present disclosure. Fig. 7 is a plan view showing an example of the configuration of a pixel 100 and a detection pixel 200. Fig. 8 is a cross-sectional view showing an example of the configuration of a pixel 100 and a detection pixel 200. The pixel 100 adjacent to the detection pixel 200 in the figure includes a second light-shielding film 151. This makes it possible to reduce the influence of stray light from the pixel 100.

[0040] 9 and 10 are diagrams illustrating an example of a pixel configuration according to a second modified example of the embodiment of the present disclosure. Fig. 9 is a plan view illustrating an example of a pixel configuration of a pixel 100 and a detection pixel 200. Fig. 10 is a cross-sectional view illustrating an example of a pixel configuration of a pixel 100 and a detection pixel 200. The pixel 100 adjacent to the detection pixel 200 in the figure does not include the color filter 170. This can reduce the wavelength dependency of flare light.

[0041] 11 is a diagram showing a configuration example of a pixel according to a third modified example of the embodiment of the present disclosure. The figure is a cross-sectional view showing a configuration example of a detection pixel 200. The detection pixel 200 in the figure shows an example in which the separation unit 135 is omitted. As a result, the detection pixel 200 in the figure can also detect crosstalk and color mixing from the adjacent pixel 100.

[0042] 12 is a diagram showing a configuration example of a pixel according to a fourth modified example of the embodiment of the present disclosure. The figure is a cross-sectional view showing a configuration example of a detection pixel 200. The detection pixel 200 in the figure shows an example in which the on-chip lens 172 is omitted.

[0043] FIG. 13 is a diagram showing a configuration example of a pixel according to a fifth modified example of the embodiment of the present disclosure. The figure is a cross-sectional view showing a configuration example of a pixel 100 and a detection pixel 200. The pixel 100 in the figure shows an example in which pupil correction is performed. Here, pupil correction is a process of shifting and arranging the on-chip lenses 171 and 172 and the color filter 170 according to the distance from the center of the pixel array unit 10. This can improve the detection efficiency of the obliquely incident light in the pixel 100 in the peripheral part of the pixel array unit 10. Pupil correction can also be performed in the detection pixel 200 in the figure. Specifically, the on-chip lens 172, the color filter 170, and the light-shielding film 251 of the detection pixel 200 are shifted and arranged. This can improve the detection efficiency of the detection pixel 200 in the peripheral part of the pixel array unit 10.

[0044] 14 is a diagram showing a configuration example of a pixel according to a sixth modified example of the embodiment of the present disclosure. The figure is a plan view showing a configuration example of a pixel 100 and a detection pixel 200. The pixel 100 in the figure includes a first photoelectric conversion unit 103 configured in an L-shape and a second photoelectric conversion unit 104 configured in a rectangular shape. Also, a circle in the figure represents an on-chip lens 173. As shown in the figure, three on-chip lenses 173 are arranged in the first photoelectric conversion unit 103. The detection pixel 200 in the figure includes the second photoelectric conversion unit 104.

[0045] Other than this, the configuration of the image sensor 2 is the same as the configuration of the image sensor 2 in the embodiment of the present disclosure, and therefore a description thereof will be omitted.

[0046] (3. Application to moving objects) The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, etc.

[0047] FIG. 15 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a moving object control system to which the technology according to the present disclosure can be applied.

[0048] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 15, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also, as functional configurations of the integrated control unit 12050, a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053 are illustrated.

[0049] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0050] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as head lamps, back lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves or signals of various switches transmitted from a portable device that replaces a key may be input to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, and the like of the vehicle.

[0051] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for a person, a car, an obstacle, a sign, or characters on a road surface, based on the received image.

[0052] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0053] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing.

[0054] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the information inside and outside the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc.

[0055] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on the driver's operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle acquired by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0056] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12030 based on the information outside the vehicle acquired by the outside-vehicle information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0057] The audio / video output unit 12052 transmits at least one output signal of audio and video to an output device capable of visually or audibly notifying information to passengers in the vehicle or the outside of the vehicle. In the example of Fig. 15, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as the output device. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

[0058] FIG. 16 is a diagram showing an example of the installation position of the imaging unit 12031.

[0059] In FIG. 16, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0060] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided at positions such as the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield in the vehicle interior of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the windshield in the vehicle interior mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the upper part of the windshield in the vehicle interior is mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

[0061] 16 shows an example of the imaging ranges of the imaging units 12101 to 12104. An imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and an imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, an overhead image of the vehicle 12100 viewed from above is obtained by superimposing the image data captured by the imaging units 12101 to 12104.

[0062] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of a plurality of imaging elements, or may be an imaging element having pixels for detecting a phase difference.

[0063] For example, the microcomputer 12051 can extract, as a preceding vehicle, a three-dimensional object that is the closest three-dimensional object on the travel path of the vehicle 12100 and travels at a predetermined speed (for example, 0 km / h or more) in approximately the same direction as the vehicle 12100, by calculating the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the change over time of this distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104. Furthermore, the microcomputer 12051 can set a vehicle distance to be secured in advance in front of the preceding vehicle, and perform automatic brake control (including follow-up stop control) and automatic acceleration control (including follow-up start control). In this way, cooperative control can be performed for the purpose of automatic driving that travels autonomously without relying on the driver's operation.

[0064] For example, the microcomputer 12051 classifies and extracts three-dimensional object data on three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0065] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the captured images of the imaging units 12101 to 12104. The recognition of such a pedestrian is performed, for example, by a procedure of extracting feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras, and a procedure of performing pattern matching processing on a series of feature points that indicate the contour of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating a pedestrian at a desired position.

[0066] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 in the configuration described above. Specifically, the imaging device 1 in FIG. 1 can be applied to the imaging unit 12031.

[0067] It should be noted that the effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0068] The present technology can also be configured as follows. (1) a pixel array section in which a plurality of pixels are arranged, the pixel array section including a photoelectric conversion section that performs photoelectric conversion of incident light and generates pixel signals based on charges generated by the photoelectric conversion; a detection pixel arranged in the pixel array portion, the detection pixel including a photoelectric conversion portion, the detection pixel detecting the incident light obliquely incident from a boundary region between the adjacent pixel and the detection pixel to generate a detection pixel signal; An imaging element having (2) The imaging element according to (1), wherein the detection pixel includes a light-shielding film disposed on a light-receiving surface side of the photoelectric conversion portion. (3) The imaging element according to (2), further comprising a second light-shielding film arranged on the light receiving surface side of the photoelectric conversion unit of the pixel adjacent to the detection pixel. (4) The imaging element according to (2), wherein the light-shielding film is disposed at a position according to a distance from a center of the pixel array portion. (5) The imaging element described in any one of (1) to (4), wherein the pixel has a first photoelectric conversion unit that is the photoelectric conversion unit having a large light receiving area and a second photoelectric conversion unit that is the photoelectric conversion unit having a small light receiving area. (6) The imaging element according to (5), wherein the detection pixel includes at least one of the first photoelectric conversion unit and the second photoelectric conversion unit. (7) a light shielding portion disposed at a boundary between the pixels and configured to shield the incident light, The light blocking portion includes an opening disposed between the detection pixel and the pixel. The imaging element according to any one of (1) to (6). (8) The pixel includes an on-chip lens that focuses incident light onto the photoelectric conversion unit, The detection pixel is a pixel where the on-chip lens is not disposed. The imaging element according to any one of (1) to (7). (9) The imaging element according to any one of (1) to (8), further comprising a color filter disposed in the pixels other than the pixel adjacent to the detection pixel and transmitting the incident light of a predetermined wavelength. (10) Further comprising a separator disposed between the pixels, The separation portion is not disposed between the detection pixel and the pixel. The imaging element according to any one of (1) to (9) above. (11) The plurality of pixels in the pixel array unit are divided into a plurality of regions, The detection pixels are arranged for each of the regions. The imaging element according to any one of (1) to (10) above. (12) a pixel array section in which a plurality of pixels are arranged, the pixel array section including a photoelectric conversion section that performs photoelectric conversion of incident light and generates pixel signals based on charges generated by the photoelectric conversion; a detection pixel arranged in the pixel array portion, the detection pixel including a photoelectric conversion portion, the detection pixel detecting the incident light obliquely incident from a boundary region between the adjacent pixel and the detection pixel to generate a detection pixel signal; An imaging element comprising: a processing unit that processes the detected pixel signal; An imaging device having the above configuration. (13) The imaging device according to (12), wherein the processing unit performs processing to detect flare based on the detection pixel signal. [Explanation of symbols]

[0069] 1. Imaging device 2. Image sensor 4. Flare area detection section 10 Pixel array section 100 pixels 101, 103 First photoelectric conversion unit 102, 104 Second photoelectric conversion unit 135 Separation section 136 Shading section 137 Opening 151 Second light-shielding film 170 Color Filter 171~173 On-chip lens 200 detection pixels 251 Light-shielding film 300 areas 12031, 12101~12104 Imaging section

Claims

1. a pixel array section in which a plurality of pixels are arranged, the pixel array section including a photoelectric conversion section that performs photoelectric conversion of incident light and generates pixel signals based on charges generated by the photoelectric conversion; a detection pixel arranged in the pixel array portion, the detection pixel including a photoelectric conversion portion, the detection pixel detecting the incident light obliquely incident from a boundary region between the adjacent pixel and the detection pixel to generate a detection pixel signal; An imaging element having

2. The image sensor according to claim 1 , wherein the detection pixel includes a light-shielding film disposed on a light-receiving surface side of the photoelectric conversion portion.

3. The imaging element according to claim 2 , further comprising a second light-shielding film disposed on a light-receiving surface side of the photoelectric conversion unit of the pixel adjacent to the detection pixel.

4. The image sensor according to claim 2 , wherein the light blocking film is disposed at a position according to a distance from a center of the pixel array portion.

5. The image sensor according to claim 1 , wherein the pixel includes a first photoelectric conversion unit having a large light receiving area and a second photoelectric conversion unit having a small light receiving area.

6. The imaging element according to claim 5 , wherein the detection pixel includes at least one of the first photoelectric conversion unit and the second photoelectric conversion unit.

7. a light shielding portion disposed at a boundary between the pixels and configured to shield the incident light, The light blocking portion includes an opening disposed between the detection pixel and the pixel. The imaging device according to claim 1 .

8. The pixel includes an on-chip lens that focuses the incident light onto the photoelectric conversion unit, The detection pixel is a pixel where the on-chip lens is not disposed. The imaging device according to claim 1 .

9. The imaging device according to claim 1 , further comprising a color filter disposed at each of the pixels other than the pixel adjacent to the detection pixel, the color filter transmitting the incident light of a predetermined wavelength.

10. Further comprising a separator disposed between the pixels, The separation portion is not disposed between the detection pixel and the pixel. The imaging device according to claim 1 .

11. The plurality of pixels in the pixel array unit are divided into a plurality of regions, The detection pixels are arranged for each of the regions. The imaging device according to claim 1 .

12. a pixel array section in which a plurality of pixels are arranged, the pixel array section including a photoelectric conversion section that performs photoelectric conversion of incident light and generates pixel signals based on charges generated by the photoelectric conversion; a detection pixel arranged in the pixel array portion, the detection pixel including a photoelectric conversion portion, the detection pixel detecting the incident light obliquely incident from a boundary region between the adjacent pixel and the detection pixel to generate a detection pixel signal; An imaging element comprising: a processing unit that processes the detected pixel signal; An imaging device having the above configuration.

13. The imaging apparatus according to claim 12 , wherein the processing unit performs processing to detect a flare based on the detection pixel signal.

Images