Sensor shift assembly for camera module

Abstract

To provide a sensor shift camera module for actuating an image sensor.SOLUTION: A camera comprises an actuator assembly to move an image sensor relative to an optical assembly. In addition, the camera comprises a base that is a static component of the camera, and the base includes a seat parallel to an optical axis and facing in a direction away from the optical assembly. The camera also includes a flexure that is attached to the seat, suspends the image sensor from the base, and allows motion of the image sensor enabled by the actuator assembly. In some cases, the base does not extend between the flexure and an enclosure.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure generally relates to a sensor-shift camera module for actuating an image sensor. [Background technology]

[0002] The advent of small mobile multi-purpose devices such as smartphones and tablet or pad devices has created a need for high-resolution, small-sized cameras to integrate into the devices. Some cameras may incorporate optical image stabilization (OIS) mechanisms that can detect and react to external excitations / disturbances by adjusting the location of the optical lens and / or image sensor on the X and / or Y axis in an attempt to compensate for unwanted lens movements. Additionally, some cameras may incorporate autofocus (AF) mechanisms that can adjust the focal length of an object to focus on an object surface in front of the camera in the image plane to be captured by the image sensor. In some such AF mechanisms, the optical lens and / or image sensor are moved as a single rigid body along the optical axis of the camera to refocus the camera. [Brief description of the drawings]

[0003] [Figure 1] FIGURE 1 illustrates an exemplary camera component having an actuator module or assembly that can be used, for example, for autofocus and / or to provide optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments.

[0004] [Figure 2A]1 illustrates components of an exemplary camera having an actuator module or assembly that can be used, for example, to provide autofocus and / or optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. 2 illustrates a cross-sectional view of the camera across the AA plane. [Figure 2B] 1 illustrates components of an exemplary camera having an actuator module or assembly that can be used, for example, for autofocus and / or to provide optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments.

[0005] [Diagram 3] 1 illustrates another exemplary camera component having an actuator module or assembly that can be used, for example, to provide autofocus and / or optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. 2 illustrates a cross-sectional view of the camera across the AA plane. [Figure 4] 1 illustrates components of another example camera having an actuator module or assembly that can be used, for example, for autofocus and / or to provide optical image stabilization through movement of an image sensor in a compact camera, in accordance with at least some embodiments.

[0006] [Diagram 5] 1 illustrates another exemplary camera component having an actuator module or assembly that can be used, for example, to provide autofocus and / or optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. 2 illustrates a cross-sectional view of the camera across the AA plane. [Figure 6]1 illustrates components of another example camera having an actuator module or assembly that can be used, for example, for autofocus and / or to provide optical image stabilization through movement of an image sensor in a compact camera, in accordance with at least some embodiments.

[0007] [Figure 7] 2A and 2B and the camera shown in FIGS. 3 and 4. FIG.

[0008] [Figure 8] 5 and 6. FIG. 6 shows a cross-sectional comparison between the camera shown in FIGS. 2A and 2B and the camera shown in FIGS.

[0009] [Figure 9] 1 illustrates a schematic diagram of an example device that may include a camera, according to some embodiments.

[0010] [Figure 10] FIG. 1 shows a schematic block diagram of an exemplary computing device, referred to as a computer system, that may include or host an embodiment of a camera, according to some embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] This specification includes references to "one embodiment" or "an embodiment." The phrases "in one embodiment" or "in an embodiment" do not necessarily refer to the same embodiment. Particular features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.

[0012] "Comprising." This term is open-ended. As used in the following claims, this term does not exclude additional structures or steps. Consider a claim that reads "Apparatus comprising one or more processor units...." Such a claim does not exclude the apparatus from including additional components (e.g., a network interface unit, graphics circuitry, etc.).

[0013] "Configured to." Various units, circuits, or other components may be described or claimed as being "configured to" perform a task or tasks. In this context, "configured" is used when implying structure by indicating that the unit / circuit / component includes structure (e.g., circuitry) that performs those task or tasks during operation. As such, a unit / circuit / component can be said to be configured to perform a task even when the specified unit / circuit / component is not currently operational (e.g., not turned on). A unit / circuit / component used with the term "configured" includes hardware, e.g., circuits, memory that stores program instructions capable of performing an operation, etc. Describing a unit / circuit / component as being "configured" to perform one or more tasks is expressly intended not to invoke 35 U.S.C. 112, paragraph 6, for that unit / circuit / component. Additionally, "configured" can include general-purpose structure (e.g., general-purpose circuitry) that is operated by software and / or firmware (e.g., an FPGA or a general-purpose processor running software) to operate in a manner capable of performing the task or tasks in question. "Configuring" may also include adapting a manufacturing process (e.g., a semiconductor fabrication facility) to fabricate a device (e.g., an integrated circuit) adapted to perform or execute one or more tasks.

[0014] "first," "second," etc. As used herein, these terms are used as markers for the nouns that follow and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, a buffer circuit may be described herein as performing write operations on "first" and "second" values. The terms "first" and "second" do not necessarily imply that the first value must be written before the second value.

[0015] "Based on." As used herein, this term is used to describe one or more factors that influence the determination. This term does not preclude additional factors that may influence the determination. That is, the determination may be based solely on those factors, or at least in part on those factors. Consider the phrase "determining A based on B." In this case, B is a factor that influences the determination of A, but such a phrase does not preclude the determination of A being based on C as well. In other examples, A may be determined solely on B.

[0016] In this specification, terms such as first, second, etc. may be used to describe various elements, but it will be understood that these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first contact may be called a second contact, and similarly, a second contact may be called a first contact, without departing from the intended scope. Although a first contact and a second contact are both contacts, they are not the same contact.

[0017] The terms used in the description herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used in the description and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Also, as used herein, the term "and / or" is to be understood to refer to and include any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "includes," "including," "comprises," and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0018] As used herein, the term "if" can be interpreted to mean "when," "upon," "in response to determining," or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if (a stated condition or event) is detected" can be interpreted to mean "upon determining," "in response to determining," "upon detecting (the stated condition or event)," or "in response to detecting (the stated condition or event)," depending on the context.

[0019] Various embodiments described herein relate to actuator assemblies that may be used in cameras having movable image sensors. In some examples, the camera may include a camera assembly having controls, magnets, flexures, and voice coil motors to improve the effectiveness of miniature actuation mechanisms for compact camera modules. More specifically, in some embodiments, the compact camera module includes actuators for performing functions such as autofocus (AF) and optical image stabilization (OIS). One approach to achieving very compact actuators for OIS and AF is to use a voice coil motor (VCM) array.

[0020] In some embodiments, the actuator assembly may be used to provide AF and / or OIS for the camera. In some aspects, the axial actuator may drive an optical assembly having one or more lenses in one or more directions parallel to the optical axis (e.g., z-direction) to provide autofocus. A lateral actuator, separate from the axial actuator, may drive the optical assembly and / or the image sensor in one or more directions perpendicular to the optical axis (e.g., x-direction(s), y-direction(s)) to provide OIS. In some OIS sensor shift actuators, a flexure that holds the image sensor may be attached to the top surface of the camera base. The camera base may be an insert molded base that includes an intermediate frame therein that mechanically strengthens the structure of the base and provides an electrical connection for grounding. The flexure may need to be grounded by the enclosure by passing through the base. Thus, there may be a molded thickness of the base that results in a large gap between the image sensor and the camera's enclosure (e.g., outer wall). A large gap formed between the image sensor and the enclosure can limit the amount of heat dissipation generated by the image sensor, thus limiting the functionality of the sensor package and limiting the amount of video modes the camera can support. In addition, the base thickness and large gap can directly affect the module shoulder height and lens top height, affecting system fit.

[0021] As described herein, the flexure holding the image sensor may be attached to the base of the camera with a relatively thin width such that the base does not extend below the flexure (e.g., between the flexure and the enclosure). The flexure is attached to the base via a downward-facing sheet on the base (e.g., a sheet parallel to the optical axis and facing away from the optical assembly) rather than an upward-facing sheet (e.g., a sheet parallel to the optical axis and facing toward the optical assembly). Due to the thinner base, the image sensor (or sensor stiffener) may be grounded directly to the enclosure rather than through an intermediate frame (e.g., a fender) of the base. A flexure attached to a downward-facing sheet of the base with a relatively thin dimension (e.g., width) such that the base does not extend below the flexure (e.g., static platform) (e.g., between the flexure and the enclosure) may reduce the gap between the image sensor and the enclosure of the camera. A relatively small gap between the image sensor and the enclosure of the camera may increase heat dissipation onto the enclosure, thus improving the functionality of the sensor package and increasing the amount of video modes the camera can support. Additionally, the relatively thin dimensions (e.g., width) of the base such that the base does not extend between the flexure and the enclosure may help to create at least a relatively small gap and may also provide camera module / camera shoulder height savings for different sensor mounting configurations. In some embodiments, the flexure mounting configuration may reduce the camera module height by approximately 250 microns (μm). In some embodiments, the flexure mounting configuration may reduce the module height by approximately 400 μm. Additionally, in some embodiments, wire bonds may electrically connect the image sensor to the flexure for improved electronic signal transmission. Additionally, the configurations described herein may reduce warpage requirements for the base molding and may enable a variety of different base manufacturing processes, including metal injection molding (MIM).

[0022] Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be apparent to those skilled in the art that some embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0023] FIG. 1 illustrates components of an exemplary camera 100 / 300 / 500 with an assembly that can be used, for example, to provide autofocus and / or optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. FIG. 1 illustrates an external overhead view of the camera. The camera 100 / 300 / 500 can include one or more features that are the same or similar to those described or illustrated with respect to FIGS. 2A, 2B, 3, 4, 5, 6, 7, 8, 9, and 10. The exemplary XYZ coordinate system illustrated in FIG. 1 may be used to describe aspects of the components and / or systems and may be applied to embodiments described throughout this disclosure.

[0024] In various embodiments, the camera 100 / 300 / 500 may include an optical assembly 103 having one or more lenses 102 (as shown in FIGS. 2A, 3, and 5) that defines an optical axis (z) 101, a shielding can 110, an enclosure 113, and electrical connection(s) 104. The shielding can 110 forms an outer wall of the top (and possibly sides) of the camera 100 / 300 / 500 and may form one or more camera shoulders. The enclosure 113 may form an outer wall of the bottom of the camera 100 / 300 / 500. The electrical connection(s) 104 may extend from the enclosure 113 (and shielding can 110) and may electrically connect the camera 100 / 300 / 500 to an external device. For example, the camera 100 / 300 / 500 may be the same or similar to the camera 904b shown in FIG. 9 or the camera 1008 shown in FIG. 10. Thus, the electrical connection(s) 104 may extend from the enclosure 113 and electrically connect the camera 100 / 300 / 500 to the device 900 shown in FIG. 9 or the computer system 1000 shown in FIG. 10, respectively. In some embodiments, the shielding can 110 may be mechanically attached to a base (e.g., the base 114 shown in FIGS. 2A and 2B, the base 314 shown in FIGS. 3 and 4, and / or the base 514 shown in FIGS. 5 and 6). The shielding can 110 may be mechanically coupled to the base via the enclosure 113 attached to both the shielding can 110 and the base.

[0025] 2A and 2B show components of an exemplary camera 100 having an assembly that can be used, for example, to provide autofocus and / or optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. FIG. 2A shows a cross-sectional view of the camera 100 across the AA plane. FIG. 2B shows an exploded view of the camera 100. The camera 100 can include one or more features that are the same or similar to those described or illustrated with respect to FIGS. 1, 3, 4, 5, 6, 7, 8, 9, and 10. The exemplary XYZ coordinate system shown in FIGS. 2A and 2B may be used to describe aspects of the components and / or systems and may be applied to embodiments described throughout this disclosure.

[0026] 2A and 2B show a camera 100 (e.g., a camera module) having a relatively large gap 190 between the image sensor 108 of the camera 100 and the enclosure 113 (e.g., compared to the gap 390 of the camera 300 of FIGS. 3 and 4 and compared to the gap 590 of the camera 500 of FIGS. 5 and 6). The relatively large gap 190 formed between the image sensor 108 of the camera 100 and the enclosure 113 may limit the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, and thus may limit the functionality of the sensor package and the amount of video modes that the camera 100 can support. For example, the camera 100 may only be able to slightly support a 4k / 120fps mode and may not be able to support an 8k / 30fps mode. For example, in the camera 100, when the image sensor 127 uses a 4K120FPS power mode, the peak temperature at the image sensor may be 70.2°C. Conversely, in camera 300 and / or camera 500, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 63.2°C. Thus, the configuration of cameras 300 and 500 is approximately 7°C lower than camera 100 when image sensor 127 uses an 8K 30 FPS power mode. As another example, in camera 100, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 95.2°C. Conversely, in camera 300 and / or camera 500, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 84.2°C. Thus, the configuration of cameras 300 and 500 is approximately 11°C lower than camera 100 when image sensor 127 uses an 8K 30 FPS power mode. Additionally, the thickness of the base 114 below the static platform 115 of the flexure 120, which provides structural support for the upward seat 161 attachment of the static platform 115 and creates a larger gap 190, can directly affect the camera shoulder height 199 and lens top height, affecting system fit.

[0027] As shown in FIGS. 2A and 2B, the camera 100 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens carrier 128 may hold the optical assembly 103. The lens carrier 128 may include one or more autofocus (AF) coil(s) 118 arranged circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 may be fixedly attached to the static shield can 110. The magnet holder 106 may include one or more magnets for magnetically interacting with the AF coil(s) 118 when a current flows through the AF coil(s) 118 to move the lens carrier 128 and the optical assembly 103 along the optical axis (z) 101 for autofocus. The magnet and AF coil(s) 118 together can be considered as a voice coil motor (VCM) actuator that utilizes Lorentz force to move the lens carrier 128 and optical assembly 103 along the optical axis (z) 101 for autofocus. When the Lorentz force causes movement of the lens carrier 128 and optical assembly 103 along the optical axis 101, respective AF springs 150 fixedly attached to the magnet holder 106 (and thus the static part of the camera 100) and fixedly attached to the lens carrier 128 can be used to dampen the movement of the lens carrier 128 and optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or shield can 110.

[0028] The camera 100 also includes an image sensor 108, one or more filter(s) 122a, a sensor stiffener 152, a substrate 134 (e.g., OIS FPC, printed circuit board, etc.) including an upper substrate 134a and a lower substrate 134b, a flexure 120, a fender 153, a base 114, a shield can 110, and an enclosure 130. The shield can 110 may be mechanically attached to the base 114. The shield can 110 may be mechanically coupled to the base 114 via an enclosure 113 attached to both the shield can 110 and the base 114. The flexure 120 may include a dynamic platform 121, a static platform 115, and a number of flexure arms 124. The image sensor 108 may be held by the dynamic platform 121 such that the image sensor 108 moves as the dynamic platform 121 moves relative to the static portion of the camera 100. The multiple flexure arms 124 can provide a flexible mechanical coupling between the static platform 115 and the dynamic platform 121. For example, the flexure arms 124 can enable the dynamic platform 121 (and thus the image sensor 108) to move in one or more directions orthogonal to the optical axis 101 relative to the static platform 115 (e.g., the remainder of the camera 100) using one or more lateral actuators. For example, the OIS coil 119 (e.g., shown in FIG. 2B ) disposed on the substrate 134 can interact with a magnet in the magnet holder 106 to generate a Lorentz force to move the dynamic platform 121 and the image sensor 108 in one or more directions orthogonal to the optical axis 101 relative to the static platform 115 (e.g., the remainder of the camera 100). In some aspects, the flexure arm 124 may enable the dynamic platform 121 (and thus the image sensor 108) to move relative to the static platform 115 (e.g., the remainder of the camera 100) in one or more directions parallel to or along the optical axis 101 using one or more axial actuators. The fender 153 may prevent the dynamic platform 121 and image sensor from moving axially away from the optical assembly and coming into direct contact with the enclosure 113.Additionally, the flexure arm 124 may enable the dynamic platform 121 (and thus the image sensor 108) to move in one or more angular orientations about one or more axes orthogonal to the optical axis 101 relative to the static platform 115 (e.g., the remainder of the camera 100) using one or more axial actuators. The sensor stiffeners 152 may be used to provide stiffness to the image sensor 108 during movement, as described herein.

[0029] In some embodiments, the bending arm 124 may include electrical traces for communicating power and electrical signals between the dynamic platform 121 (e.g., one or more electronic components (e.g., electronic component 151) mounted (e.g., surface mounted) on a substrate (e.g., substrate top block 134a), the image sensor 108 mounted on a substrate (e.g., substrate bottom block 134b), one or more electronic components mounted on the dynamic platform 121, etc.) and the static platform 115. The static platform 115 may be fixedly attached to the base 114 via one or more sheets 161. For example, the base 114 may include one or more sheets 161 facing in a direction parallel to the optical axis 101 and facing towards the optical assembly 103. The static platform 115 may be on the sheets 161 and may be in electrical communication with one or more other components of the camera 100 (e.g., via the electrical connection(s) 104 shown in FIG. 1 ) to perform one or more camera operations via the base 114.

[0030] In some non-limiting examples, the image sensor 108 may be attached to or otherwise integrated with the substrate 134 such that the image sensor 108 is connected to the OIS frame or flexure 120 via the substrate. For example, the dynamic platform 121 may hold a substrate (e.g., substrate top block 134a, substrate bottom block 134b) for mounting one or more electronic components 151 and / or the image sensor 108. In some embodiments, the substrate 134 (e.g., substrate top block 134a and / or substrate bottom block 134b) may be formed from a ceramic. The substrate 134 may include an opening having a cross-section sized to allow light to pass through while receiving or holding the filter(s) 122 and the image sensor 108. The top surface of the substrate 134 (e.g., substrate bottom block 134b) may hold the filter(s) 122 around the periphery of the opening, and the bottom surface of the substrate (e.g., substrate bottom block 134b) may hold the image sensor 108 around the periphery of the opening. The substrate bottom block 134b can couple the image sensor 108 to the substrate top block 134a. With the bottom surface of the substrate 134 holding the image sensor 108 around the opening, the image sensor 108 can be connected (e.g., mechanically and / or electrically) to the flex 120 via the substrate 134. This configuration can allow the substrate to hold the image sensor 108 (and the filter(s) 122), while also allowing light to pass from the lens of the optical assembly 103 through the filter(s) 122 and be received by the image sensor 108 (e.g., the light receiving surface of the image sensor for image capture) for image capture. In other embodiments, the substrate 134 and the image sensor 108 can be separately attached to the OIS frame or flex 120. For example, a first set of one or more electrical traces can be routed between the substrate and the OIS frame or flex 120. A second, different set of one or more electrical traces may be routed between the image sensor 108 and the OIS frame or flexure 120.

[0031] As described herein, Figures 2A and 2B show a camera 100 (e.g., a camera module) having a relatively large gap 190 between the image sensor 108 of the camera 100 and the enclosure 113 (e.g., compared to the gap 390 of the camera 300 of Figures 3 and 4 and compared to the gap 590 of the camera 500 of Figures 5 and 6). The relatively large gap 190 formed between the image sensor 108 of the camera 100 and the enclosure 113 may limit the amount of heat dissipation generated by the image sensor 108 through the enclosure 113, thus limiting the functionality of the sensor package and limiting the amount of video modes that the camera 100 can support. For example, the camera 100 may only be able to support a few 4k / 120fps modes and may not be able to support an 8k / 30fps mode.

[0032] The flexure 120 is attached to the base 114 such that the static platform 115 of the flexure 120 may be attached to an upward facing seat 161 of the base 114 (e.g., a seat facing in a direction parallel to the optical axis and toward the optical assembly and / or lens 102). The portion of the base 114 supporting the seat 161 may form a relatively thick dimension (e.g., width) of the base 114, creating a relatively large gap 190 between the image sensor 108 (e.g., sensor stiffener 152) and the enclosure 113. As the flexure 120 and image sensor 108 move downward along the optical axis 101 and away from the optical assembly 103, the substrate 134 (e.g., substrate bottom block 134b) may be grounded against the fender 153, creating at least a portion of the gap 190 between the image sensor 108 and the enclosure 113. The flexure 120 attached to the upturned sheet 161 of the base 114 with a relatively thick width such that the base 114 extends at least partially under (e.g., between) the flexure 120 (e.g., static platform 115) (e.g., between the flexure and the enclosure) may result in a relatively large gap 190 between the image sensor 108 and the enclosure 113 of the camera 100. The relatively large gap 190 between the image sensor 108 and the enclosure 113 of the camera 100 may reduce heat dissipation onto the enclosure 113, thus limiting the functionality of the sensor package and the amount of video modes that the camera 100 can support. For example, the camera 100 may only be able to slightly support a 4k / 120fps mode and may not be able to support an 8k / 30fps mode. Furthermore, the relatively thicker base 114, which at least helps to create the relatively larger gap 190, may provide a relatively larger z-height 199 of the camera module / camera shoulder height.

[0033] 3 and 4 show components of an exemplary camera 300 having an assembly that can be used, for example, to autofocus and / or provide optical image stabilization through movement of an image sensor in a compact camera, according to at least some embodiments. FIG. 3 shows a cross-sectional view of the camera 300 across the AA plane. FIG. 4 shows an exploded view of the camera 300. The camera 300 may include one or more features that are the same or similar to those described or illustrated with respect to FIGS. 1, 2A, 2B, 5, 6, 7, 8, 9, and 10. The exemplary XYZ coordinate system shown in FIGS. 3 and 4 may be used to describe aspects of the components and / or systems and may be applied to embodiments described throughout this disclosure. The flexure 120 that holds the image sensor 108 may be attached to the camera's base 314 with a relatively thin portion that does not extend below (e.g., between the flexure 120 and the enclosure 113) the flexure 120 (e.g., the static platform 115).

[0034] 3 and 4 show a camera 300 (e.g., a camera module) having a relatively small gap 390 between the image sensor 108 and the enclosure 113 of the camera 300 (e.g., compared to the gap 190 of the camera 100 of FIGS. 2A and 2B), due at least in part to the absence of the fender 153 shown in FIGS. 2A and 2B. The relatively small gap 390 formed between the image sensor 108 and the enclosure 113 of the camera 300 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 300 can support. For example, the camera 300 may be capable of supporting a 4K 120 FPS mode and may support an 8K 30 FPS mode. For example, in the camera 100, when the image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 70.2°C. Conversely, in camera 300, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 63.2°C. Thus, the configuration of camera 300 is approximately 7°C lower than camera 100 when image sensor 127 uses a 4K 120 FPS power mode. As another example, in camera 100, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 95.2°C. Conversely, in camera 300, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 84.2°C. Thus, the configuration of camera 300 is approximately 11°C lower than camera 100 when image sensor 127 uses an 8K 30 FPS power mode. In addition, the flexure 120 (e.g., static platform 115) attached to the downward-facing sheet 361 of the base 314 and the thinness of the base 314 below the static platform 115 of the flexure 120 such that the base does not extend below the flexure 120 (e.g., static platform 115) (e.g., between the flexure 120 and the enclosure 113) may create a relatively small gap 390 between the image sensor 108 of the camera 300 and the enclosure 113 relative to gap 190.This smaller gap 390 directly reduces the camera shoulder height 399 and lens top height, improving system fit.

[0035] As shown in FIGS. 3 and 4, the camera 300 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens carrier 128 may hold the optical assembly 103. The lens carrier 128 may include one or more autofocus (AF) coil(s) 118 arranged circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 may be fixedly attached to the static shield can 110. The magnet holder 106 may include one or more magnets for magnetically interacting with the AF coil(s) 118 when a current flows through the AF coil(s) 118 to move the lens carrier 128 and the optical assembly 103 along the optical axis (z) 101 for autofocus. The magnets and the AF coil(s) 118 together may be considered as a voice coil motor (VCM) actuator that utilizes Lorentz force to move the lens carrier 128 and the optical assembly 103 along the optical axis (z) 101 for autofocus. When Lorentz forces cause movement of the lens carrier 128 and optical assembly 103 along the optical axis 101, respective AF springs 150 fixedly attached to the magnet holder 106 (and thus the static part of the camera 300) and fixedly attached to the lens carrier 128 can be used to dampen movement of the lens carrier 128 and optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or shield can 110.

[0036] The camera 300 also includes an image sensor 108, one or more filters 122a, a sensor stiffener 152, a substrate 334 (e.g., OIS FPC, printed circuit board, etc.) including an upper substrate 334a and a lower substrate 334b, a flexure 120, a base 314, a shield can 110, and an enclosure 130. The shield can 110 may be mechanically attached to the base 314. The shield can 110 may be mechanically coupled to the base 314 via an enclosure 113 attached to both the shield can 110 and the base 314. The flexure 120 may include a dynamic platform 121, a static platform 115, and multiple flexure arms 124. The image sensor 108 may be held by the dynamic platform 121 such that the image sensor 108 moves as the dynamic platform 121 moves relative to a static portion of the camera 300. The multiple flexure arms 124 may provide a flexible mechanical coupling between the static platform 115 and the dynamic platform 121. For example, the flex arm 124 may enable the dynamic platform 121 (and thus the image sensor 108) to move relative to the static platform 115 (e.g., the remainder of the camera 300) in one or more directions orthogonal to the optical axis 101 using one or more lateral actuators. For example, the OIS coil 119 (e.g., shown in FIG. 4 ) disposed on the substrate 334 may interact with magnets in the magnet holder 106 to generate Lorentz forces to cause the dynamic platform 121 and image sensor 108 to move relative to the static platform 115 (e.g., the remainder of the camera 300) in one or more directions orthogonal to the optical axis 101. In some aspects, the flex arm 124 may enable the dynamic platform 121 (and thus the image sensor 108) to move relative to the static platform 115 (e.g., the remainder of the camera 300) in one or more directions parallel to or along the optical axis 101 using one or more axial actuators.The image sensor stiffeners 352 may provide stiffness to the image sensor 108 and may be grounded within the enclosure 113 as the dynamic platform 121 and image sensor 108 move axially along the optical axis 101 and away from the optical assembly 103. Additionally, the flexure arms 124 may enable the dynamic platform 121 (and thus the image sensor 108) to move in one or more angular orientations about one or more axes orthogonal to the optical axis 101 relative to the static platform 115 (e.g., the remainder of the camera 300) using one or more axial actuators.

[0037] In some embodiments, the bending arm 124 may include electrical traces for communicating power and electrical signals between the dynamic platform 121 (e.g., one or more electronic components (e.g., electronic component 151) mounted (e.g., surface mounted) on a substrate (e.g., substrate top block 334a), the image sensor 108 mounted on a substrate (e.g., substrate bottom block 334b), one or more electronic components mounted on the dynamic platform 121, etc.) and the static platform 115. The static platform 115 may be fixedly attached to the base 314 via one or more sheets 361. For example, the base 314 may include one or more sheets 361 facing in a direction parallel to the optical axis 101 and facing away from the optical assembly 103. The static platform 115 may reside on the sheets 361 and may be in electrical communication with one or more other components of the camera 300 (e.g., via the electrical connections 104 shown in FIG. 1 ) to perform one or more camera operations via the base 314.

[0038] In some non-limiting examples, the image sensor 108 may be attached to or otherwise integrated with the substrate 334 such that the image sensor 108 is connected to the OIS frame or flexure 120 via the substrate. For example, the dynamic platform 121 may hold a substrate (e.g., substrate top block 334a, substrate bottom block 334b) for mounting one or more electronic components 151 and / or the image sensor 108. In some embodiments, the substrate 334 (e.g., substrate top block 334a and / or substrate bottom block 334b) may be formed from ceramic and organic materials. For example, the substrate top block 334a may be formed from an organic material and the substrate bottom block 334b ​​may be formed from a ceramic material. The substrate 334 may include an opening with a cross-section sized to allow light to pass through while receiving or holding the filter 122 and the image sensor 108. An upper surface of the substrate 334 (e.g., substrate lower block 334b) may hold a filter 122 around the opening, and a lower surface of the substrate (e.g., substrate lower block 334b) may hold an image sensor 108 around the opening. The substrate lower block 334b ​​may couple the image sensor 108 to the substrate upper block 334a. With the lower surface of the substrate 334 holding the image sensor 108 around the opening, the image sensor 108 may be connected (e.g., mechanically and / or electrically) to the flexure 120 via the substrate 334. This configuration may allow the substrate to hold the image sensor 108 (and the filter(s) 122), while also allowing light to pass from the lens of the optical assembly 103 through the filter(s) 122 and be received by the image sensor 108 for image capture (e.g., the light receiving surface of the image sensor for image capture). In other embodiments, the substrate 334 and the image sensor 108 may be separately attached to the OIS frame or flex 120. For example, a first set of one or more electrical traces may be routed between the substrate and the OIS frame or flex 120. A second, different set of one or more electrical traces may be routed between the image sensor 108 and the OIS frame or flex 120.

[0039] The camera 300 (e.g., camera module) may have a relatively small gap 390 (e.g., at least as compared to the gap 190 of the camera 100 of FIGS. 2A and 2B) between the image sensor 108 and the enclosure 113 of the camera 300. The relatively small gap 390 formed between the image sensor 108 (e.g., the image sensor stiffener 352) and the enclosure 113 of the camera 300 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 300 can support (e.g., relative to the camera 100 of FIGS. 2A and 2B). For example, the camera 300 may improve support for a 4k / 120fps mode and may support an 8k / 30fps mode.

[0040] The flexure 120 may be mounted to the base 314 such that the static platform 115 of the flexure 120 may be mounted to a downward-facing sheet 361 of the base 314 (e.g., a sheet facing in a direction parallel to the optical axis and away from the optical assembly and / or lens 102) rather than an upward-facing sheet (e.g., a sheet facing in a direction parallel to the optical axis and toward the optical assembly and / or lens 102, sheet 161 in Figures 2A and 2B), and may allow the image sensor 108 (e.g., image sensor stiffener 352) to move into the enclosure 113 (e.g., away from the optical assembly 103 and / or lens 102) so that the image sensor 108 (e.g., image sensor stiffener 352) is in direct contact with the enclosure 113 rather than through an intermediate frame of the base 314 (e.g., base 114 in Figures 2A and 2B, fender 153 in Figures 2A and 2B). Because the flexure 120 (e.g., static platform 115) is attached to a downward facing sheet 361 of the base 314 that has a relatively thin portion that does not extend below the flexure 120 (e.g., static platform 115) (e.g., between the flexure 120 and the enclosure 113), a gap 390 that is smaller than gap 190 can be created between the image sensor 108 of the camera 300 and the enclosure 113. The gap 390 can be positioned between the image sensor 108 (e.g., image sensor brace 352) and the enclosure 113 such that no object is present in the gap 309 between the image sensor 108 (e.g., image sensor brace 352) and the enclosure 113. In other words, the image sensor 108 (e.g., image sensor brace 352) can be the moving component of the camera 300 that is closest to the enclosure 113 (e.g., at or near the optical axis 101). A relatively small gap 390 between the image sensor 108 and the enclosure 113 of the camera 300 may increase heat dissipation onto the enclosure 113 and remove heat from the camera 300 (e.g., the image sensor 108 of the camera 300) more quickly, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 300 can support (e.g., relative to the camera 100 of Figures 2A and 2B).Additionally, the relatively thin base, such that the base does not extend between the flexure 120 and the enclosure 113, helps to create a relatively small gap 390 that provides at least a reduced camera module / camera shoulder height, z-height 399 (e.g., as compared to the camera module / camera shoulder height, z-height 199) for different sensor mounting configurations. In some embodiments, the flexure mounting configuration may reduce the camera module height / camera shoulder height, z-height by approximately 250 μm, such that the z-height 399 in FIGS. 3 and 4 is 250 μm less than the z-height 199 in FIGS. 2A and 2B. Additionally, the configurations described herein may reduce warpage requirements for the base molding and may enable a variety of different base manufacturing processes, including metal injection molding (MIM).

[0041] 5 and 6 show components of an exemplary camera 500 having an assembly that can be used, for example, to autofocus and / or provide optical image stabilization through movement of an image sensor in a miniature camera, according to at least some embodiments. FIG. 5 shows a cross-sectional view of the camera 500 across the AA plane. FIG. 6 shows an exploded view of the camera 500. The camera 500 may include one or more features that are the same or similar to those described or illustrated with respect to FIGS. 1, 2A, 2B, 3, 4, 7, 8, 9, and 10. The exemplary XYZ coordinate system shown in FIGS. 5 and 6 may be used to describe aspects of the components and / or systems and may be applied to embodiments described throughout this disclosure. The flexure 520 that holds the image sensor 108 may be attached to the camera base 314 with a relatively thin portion that does not extend below the flexure 520 (e.g., between the flexure 520 and the enclosure 113) (e.g., the static platform 515).

[0042] 5 and 6 show a camera 500 (e.g., a camera module) having a relatively small gap 590 between the image sensor 108 and the enclosure 113 of the camera 500 (e.g., compared to the gap 190 of the camera 100 of FIGS. 2A and 2B and compared to the gap 390 of the camera 300 of FIGS. 3 and 4) due at least in part to the absence of the fender 153 shown in FIGS. 2A and 2B and / or at least in part to the absence of the image sensor stiffener 152 shown in FIGS. 2A, 2B, 3, and 4. The relatively small gap 590 formed between the image sensor 108 and the enclosure 113 of the camera 500 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 500 can support. For example, the camera 500 may be capable of supporting a 4K 120 FPS mode and may support an 8K 30 FPS mode. For example, in camera 100, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 70.2°C. Conversely, in camera 500, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 63.2°C. Thus, the configuration of camera 500 is approximately 7°C lower than camera 100 when image sensor 127 uses a 4K 120 FPS power mode. As another example, in camera 100, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 95.2°C. Conversely, in camera 500, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 84.2°C. Thus, the configuration of camera 500 is approximately 11°C lower than camera 100 when image sensor 127 uses an 8K 30 FPS power mode.Additionally, the flexure 520 (e.g., static platform 115) attached to the downward facing sheet 361 of the base 314 and the thinness of the base 314 below the static platform 515 of the flexure 120 such that the base does not extend below the flexure 120 (e.g., static platform 515) (e.g., between the flexure 520 and the enclosure 113) can create a relatively smaller gap 590 between the image sensor 108 of the camera 500 and the enclosure 113 relative to the gap 390 shown in Figures 2A and 2B and the gap 190 shown in Figures 3 and 4. This smaller gap 590 directly reduces the camera shoulder height 599 and the lens top height, improving system fit. Additionally, the camera 500 does not include fenders or sensor stiffeners. Instead, the dynamic platform 521 of the flexure 520 extends completely below the image sensor 108, such that there is no aperture penetrating the dynamic platform along the optical axis 101, eliminating the need for a fender and / or sensor reinforcement and further reducing the size of the gap 590 relative to the gap 190 of Figures 2A and 2B and relative to the gap 390 of Figures 3 and 4.

[0043] As shown in FIGS. 5 and 6, the camera 500 includes an optical axis 101 and an optical assembly 103 including one or more lenses 102. A lens carrier 128 may hold the optical assembly 103. The lens carrier 128 may include one or more autofocus (AF) coil(s) 118 arranged circumferentially around the optical assembly 103 and the optical axis 101. A magnet holder 106 may be fixedly attached to the static shield can 110. The magnet holder 106 may include one or more magnets for magnetically interacting with the AF coil(s) 118 when a current flows through the AF coil(s) 118 to move the lens carrier 128 and the optical assembly 103 along the optical axis (z) 101 for autofocus. The magnets and the AF coil(s) 118 together may be considered as a voice coil motor (VCM) actuator that utilizes Lorentz force to move the lens carrier 128 and the optical assembly 103 along the optical axis (z) 101 for autofocus. When Lorentz forces cause movement of the lens carrier 128 and optical assembly 103 along the optical axis 101, respective AF springs 150 fixedly attached to the magnet holder 106 (and thus the static part of the camera 500) and fixedly attached to the lens carrier 128 can be used to dampen movement of the lens carrier 128 and optical assembly 103 along the optical axis 101 relative to the magnet holder 106 and / or shield can 110.

[0044] The camera 500 also includes an image sensor 108, one or more filters 122a, a substrate 534 (e.g., OIS FPC, printed circuit board, etc.) including an upper substrate 534a and a lower substrate 534b, a flexure 520, a base 314, a shield can 110, and an enclosure 130. The shield can 110 may be mechanically attached to the base 314. The shield can 110 may be mechanically coupled to the base 314 via an enclosure 113 attached to both the shield can 110 and the base 314. The flexure 520 may include a dynamic platform 521, a static platform 515, and multiple flexure arms 524. The image sensor 108 may be held by the dynamic platform 521 such that the image sensor 108 moves as the dynamic platform 521 moves relative to the static portion of the camera 500. The multiple flexure arms 524 may provide a flexible mechanical coupling between the static platform 515 and the dynamic platform 521. For example, the bending arm 524 may enable the dynamic platform 521 (and thus the image sensor 108) to move in one or more directions orthogonal to the optical axis 101 relative to the static platform 515 (e.g., the remainder of the camera 300) using one or more lateral actuators. For example, the OIS coil 119 (e.g., shown in FIG. 6 ) disposed on the substrate 534 may interact with magnets in the magnet holder 106 to generate Lorentz forces to cause the dynamic platform 521 and image sensor 108 to move in one or more directions orthogonal to the optical axis 101 relative to the static platform 515 (e.g., the remainder of the camera 500). In some aspects, the bending arm 524 may enable the dynamic platform 521 (and thus the image sensor 108) to move in one or more directions parallel to or along the optical axis 101 relative to the static platform 515 (e.g., the remainder of the camera 500) using one or more axial actuators.In addition, the bending arm 524 may enable the dynamic platform 521 (and thus the image sensor 108) to move in one or more angular directions about one or more axes perpendicular to the optical axis 101 relative to the static platform 515 (e.g., the remainder of the camera 500) using one or more axial actuators.

[0045] 2A, 2B, 3, and 4, the flexure 520 can include a dynamic platform 521 that extends completely under the image sensor 108, such that there is no aperture through the dynamic platform 521 that intersects the optical axis 101. Extending the dynamic platform 521 completely across the image sensor 108 can eliminate the need for a fender or sensor stiffener to protect the image sensor 108 when the dynamic platform is fully extended and grounded against the enclosure 113, and can further reduce the size of the gap 590 compared to the gap 390 and the gap 190. In some aspects, one or more end stops 553 (e.g., formed from polyimide (PI)) can be attached to the underside of the dynamic platform 521 to weaken the contact between the dynamic platform 521 and the enclosure 113.

[0046] In some embodiments, the bending arm 524 may include electrical traces for communicating power and electrical signals between the dynamic platform 521 (e.g., one or more electronic components (e.g., electronic components 151) mounted (e.g., surface mounted) on a substrate (e.g., substrate top block 534a), the image sensor 108 mounted on a substrate (e.g., substrate bottom block 534b), one or more electronic components mounted on the dynamic platform 521, etc.) and the static platform 515. The static platform 515 may be fixedly attached to the base 314 via one or more sheets 361. For example, the base 314 may include one or more sheets 361 facing in a direction parallel to the optical axis 101 and facing away from the optical assembly 103. The static platform 515 may reside on the sheets 361 and may be in electrical communication with one or more other components of the camera 500 (e.g., via electrical connections 104 shown in FIG. 1 ) to perform one or more camera operations via the base 314.

[0047] In some non-limiting examples, the image sensor 108 may be directly connected to the OIS frame or flexure 520. For example, the dynamic platform 521 may hold both the image sensor 108 and a substrate 534 (e.g., substrate top block 534a, substrate bottom block 534b) for mounting one or more electronic components 151. One or more wire bonds 552 may electrically connect the image sensor 108 present on the dynamic platform 521 to the dynamic platform 521. In some embodiments, the substrate 534 (e.g., substrate top block 534a and / or substrate bottom block 534b) may be formed from an organic material. For example, the substrate top block 534a may be formed of an organic material and the substrate bottom block 534b may also be formed of an organic material. Forming the substrate 534 of an organic material may facilitate easier electrical transmission compared to a ceramic material. The substrate 534 may include an opening with a cross-section sized to allow light to pass to the image sensor 108 while receiving or holding the filter 122. A top surface of the substrate 534 (e.g., substrate bottom block 534b) can hold the filter 122 around the aperture, while a dynamic platform 521 attached to the substrate bottom block 534b can hold the image sensor 108. This configuration can allow light to pass from the lens(es) of the optical assembly 103 through the filter(s) 122 and be received by the filter(s) 122 and the image sensor 108 for image capture (e.g., a light receiving surface of the image sensor for image capture).

[0048] The camera 500 (e.g., a camera module) may have a relatively small gap 590 between the image sensor 108 and the enclosure 113 of the camera 500 (e.g., compared to at least the gap 190 of the camera 100 of FIGS. 2A and 2B and compared to at least the gap 390 of the camera 300 of FIGS. 3 and 4). The relatively small gap 590 formed between the image sensor 108 and the enclosure 113 of the camera 500 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 500 can support (e.g., relative to the camera 100 of FIGS. 2A and 2B and relative to the camera 300 of FIGS. 3 and 4). For example, the camera 500 may improve support for a 4k / 120fps mode and may support an 8k / 30fps mode.

[0049] The flexure 520 may be mounted to the base 314 such that the static platform 515 of the flexure 520 may be mounted to a downward-facing sheet 361 of the base 314 (e.g., a sheet facing in a direction parallel to the optical axis and away from the optical assembly and / or lens 102) rather than an upward-facing sheet (e.g., a sheet facing in a direction parallel to the optical axis and toward the optical assembly and / or lens 102, sheet 161 in Figures 2A and 2B), and may allow the image sensor 108 (e.g., dynamic platform 521, end stop 553) to move into the enclosure 113 (e.g., away from the optical assembly 103 and / or lens 102) so that the image sensor 108 and dynamic platform 521 are in direct contact with the enclosure 113 rather than through an intermediate frame of the base 314 (e.g., base 114 in Figures 2A and 2B, fender 153 in Figures 2A and 2B). Flexure 520 (e.g., static platform 515) is attached to downward facing sheet 361 of base 314 with a relatively thin portion that does not extend below flexure 120 (e.g., static platform 515) (e.g., between flexure 520 and enclosure 113), thus creating a smaller gap 590 between image sensor 108 of camera 500 and enclosure 113 relative to gap 190 and gap 390. In some embodiments, one or more end stops 553 (e.g., formed from polyimide (PI)) may be attached to the underside of dynamic platform 521 to weaken contact between dynamic platform 521 and enclosure 113. Additionally, unlike flexure 120 of FIGS. 2A, 2B, 3, and 4, flexure 520 including dynamic platform 521 extends completely below image sensor 108, and thus there is no aperture through dynamic platform 521 that intersects optical axis 101. By extending the dynamic platform 521 completely across and below the image sensor 108, the need for a fender or sensor reinforcement to protect the image sensor 108 when the dynamic platform is fully extended and grounded to the enclosure 113 may be eliminated, further reducing gap 590 compared to gap 390 and gap 190.

[0050] A relatively small gap 590 between the image sensor 108 and the enclosure 113 of the camera 500 can increase heat dissipation onto the enclosure 113 and remove heat from the camera 500 (e.g., the image sensor 108 of the camera 500) more quickly, thus improving the functionality of the sensor package (e.g., the image sensor 108) and increasing the amount of video modes that the camera 500 can support (e.g., relative to the camera 100 of FIGS. 2A and 2B). Additionally, a relatively thin base such that the base does not extend between the flexure 520 and the enclosure 113 helps to create a relatively small gap 590 that provides at least a reduced camera module / camera shoulder height, z-height 599 (e.g., compared to camera module / camera shoulder height z-height 199 and camera module / camera shoulder height z-height 399) (and / or lens top height) for different sensor mounting configurations. A relatively small gap 590 may be disposed between the flexure 520 (e.g., dynamic platform 521, end stop 553) and the enclosure 113 such that no object is present within the relatively small gap 509 between the flexure 520 (e.g., dynamic platform 521, end stop 553) and the enclosure 113. In other words, the flexure 520 (e.g., dynamic platform 521, end stop 553) may be the moving part of the camera 500 closest to the enclosure 113 (e.g., at or near the optical axis 101). In some embodiments, the flexure mounting configuration may reduce the camera module height / camera shoulder height, z-height by approximately 400 μm such that the z-height 599 in FIGS. 5 and 6 is 400 μm less than the z-height 199 in FIGS. 2A and 2B. In some embodiments, the flexure mounting configuration may reduce the module height by approximately 400 μm. Additionally, in some embodiments, wire bonds 552 may electrically connect the image sensor to the flexure for improved electronic signal transmission. Furthermore, the configurations described herein can reduce warpage requirements for the base molding and can enable a variety of different base manufacturing processes, including metal injection molding (MIM).

[0051] FIG. 7 shows a cross-sectional comparison of the camera 100 shown in FIGS. 2A and 2B and the camera 300 shown in FIGS. 3 and 4. As described herein, the camera 300 (e.g., a camera module) has a relatively small gap 390 between the image sensor 108 and the enclosure 113 of the camera 300 compared to the gap 190 of the camera 100. This is at least in part due to the absence of the fender 153 included in the camera 100. The relatively small gap 390 formed between the image sensor 108 and the enclosure 113 of the camera 300 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 300 can support. For example, the camera 300 may be capable of supporting a 4K 120 FPS mode and may support an 8K 30 FPS mode. For example, in camera 100, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 70.2°C. Conversely, in camera 300, when image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 63.2°C. Thus, the configuration of camera 300 is approximately 7°C lower than camera 100 when image sensor 127 uses a 4K 120 FPS power mode. As another example, in camera 100, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 95.2°C. Conversely, in camera 300, when image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 84.2°C. Thus, the configuration of camera 300 is approximately 11°C lower than camera 100 when image sensor 127 uses an 8K 30 FPS power mode.Additionally, the flexure 120 (e.g., static platform 115) attached to the downward facing sheet 361 of the base 314, and the thinness of the base 314 below the static platform 115 of the flexure 120 such that the base does not extend below the flexure 120 (e.g., static platform 115) (e.g., between the flexure 120 and the enclosure 113), may create a relatively smaller gap 390 between the image sensor 108 of the camera 300 and the enclosure 113 relative to the gap 190. This smaller gap 390 directly reduces the camera shoulder height 399 and the lens top height, improving system fit. For example, as shown in FIG. 7, the smaller gap 390 of the camera 300 may provide the camera 300 with a z-height savings 799 of approximately 250 μm compared to the camera 100.

[0052] FIG. 8 shows a cross-sectional comparison between the camera 100 shown in FIGS. 2A and 2B and the camera 500 shown in FIGS. 5 and 6. As described herein, the camera 500 (e.g., camera module) has a relatively small gap 590 compared to the gap 190 of the camera 100 and the gap 390 of the camera 300 between the image sensor 108 and the enclosure 113 of the camera 500. This is due, at least in part, to the absence of the fender 153 included in the camera 100 and / or the absence of the image sensor stiffener 152 shown in FIGS. 2A, 2B, 3, and 4. The relatively small gap 590 formed between the image sensor 108 and the enclosure 113 of the camera 500 may increase the amount of heat dissipation through the enclosure 113 generated by the image sensor 108, thus improving the functionality of the sensor package and increasing the amount of video modes that the camera 500 can support. For example, the camera 500 may be capable of supporting a 4K 120 FPS mode and may support an 8K 30 FPS mode. For example, in the camera 100, when the image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 70.2°C. Conversely, in the camera 500, when the image sensor 127 uses a 4K 120 FPS power mode, the peak temperature at the image sensor may be 63.2°C. Thus, the configuration of the camera 500 is approximately 7°C lower than the camera 100 when the image sensor 127 uses the 4K 120 FPS power mode. As another example, in the camera 100, when the image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 95.2°C. Conversely, in the camera 500, when the image sensor 127 uses an 8K 30 FPS power mode, the peak temperature at the image sensor may be 84.2°C. Therefore, the camera 500 configuration is approximately 11° C. cooler than the camera 100 when the image sensor 127 uses the 8K30FPS power mode.Additionally, the flexure 520 (e.g., static platform 115) attached to the downward facing sheet 361 of the base 314 and the thinness of the base 314 below the static platform 515 of the flexure 120 such that the base does not extend below the flexure 120 (e.g., static platform 515) (e.g., between the flexure 520 and the enclosure 113) can create a relatively smaller gap 590 between the image sensor 108 of the camera 500 and the enclosure 113 relative to the gap 390 shown in Figures 2A and 2B and the gap 190 shown in Figures 3 and 4. This smaller gap 590 directly reduces the camera shoulder height 599 and the lens top height, improving system fit. Additionally, the camera 500 does not include fenders or sensor stiffeners. Instead, dynamic platform 521 of flexure 520 extends completely below image sensor 108 such that there is no aperture through the dynamic platform along optical axis 101, eliminating the need for a fender and / or sensor stiffener and further reducing the size of gap 590 relative to gap 190 of Figures 2A and 2B and relative to gap 390 of Figures 3 and 4. As shown in Figure 8, the smaller gap 590 of camera 500 may provide camera 500 with a z-height savings 899 of approximately 400 μm compared to camera 100.

[0053] FIG. 9 illustrates a schematic diagram of an example device 900 that may include a camera (e.g., as described herein with respect to FIGS. 1, 2A, 2B, 3, 4, 5, 6, 7, 8, and 10) according to some embodiments. In some embodiments, device 900 may be a mobile device and / or a multifunction device. In various embodiments, device 900 may be any of a variety of types of devices, including, but not limited to, a personal computer system, a desktop computer, a laptop, a notebook, a tablet, a slate, a pad, or a netbook computer, a mainframe computer system, a handheld computer, a workstation, a network computer, a camera, a set-top box, a mobile device, an augmented reality (AR) and / or virtual reality (VR) headset, a consumer device, a video game console, a handheld video game device, an application server, a storage device, a television, a video recording device, a peripheral device such as a switch, a modem, a router, or generally any type of computing or electronic device.

[0054] In some embodiments, device 900 may include a display system 902 (e.g., including a display and / or a touch-sensitive surface) and / or one or more cameras 904. In some non-limiting embodiments, display system 902 and / or one or more front-facing cameras 904a may be provided on the front side of device 900, for example, as shown in FIG. 9. Additionally or alternatively, one or more rear-facing cameras 904b may be provided on the rear side of device 900. In some embodiments with multiple cameras 904, some or all of the cameras may be the same or similar to one another. Additionally or alternatively, some or all of the cameras may be different from one another. In various embodiments, the location(s) and / or arrangement(s) of camera(s) 904 may differ from that shown in FIG. 9.

[0055] Among other things, device 900 may include memory 906 (e.g., comprising an operating system 908 and / or application(s) / program instructions 910), one or more processors and / or controllers 912 (e.g., comprising a CPU(s), memory controller(s), display controller(s), and / or camera controller(s), etc.), and / or one or more sensors 916 (e.g., orientation sensor(s), proximity sensor(s), and / or position sensor(s), etc.). In some embodiments, device 900 may communicate with one or more other devices and / or services, such as computing device(s) 918, cloud services 920, etc., via one or more network(s) 922. For example, device 900 may include a network interface (e.g., network interface 910) that enables device 900 to transmit data to and receive data from network(s) 922. Additionally or alternatively, device 900 may be capable of communicating with other devices via wireless communications using any of a variety of communication standards, protocols, and / or technologies.

[0056] 10 illustrates a schematic block diagram of an exemplary computing device, referred to as computer system 1000, that may include or host an embodiment of a camera (e.g., as described herein with respect to FIGS. 1, 2A, 2B, 3, 4, 5, 6, 7, 8, and 9). Additionally, computer system 1000 may implement methods for controlling the operation of the camera and / or for performing image processing images captured by cameras, including cameras 100, 300, and 500, described herein. In some embodiments, device 1000 (described herein with reference to FIG. 10) may additionally or alternatively include some or all of the functional components of computer system 700 described herein.

[0057] Computer system 1000 may be configured to perform any or all of the above-described embodiments. In different embodiments, computer system 1000 may be any of a variety of types of devices, including, but not limited to, a personal computer system, a desktop computer, a laptop, notebook, tablet, slate, pad, or netbook computer, a mainframe computer system, a handheld computer, a workstation, a network computer, a camera, a set-top box, a mobile device, an augmented reality (AR) and / or virtual reality (VR) headset, a consumer device, a video game console, a handheld video game device, an application server, a storage device, a television, a video recording device, a peripheral device such as a switch, modem, router, or generally any type of computing or electronic device.

[0058] In the illustrated embodiment, computer system 1000 includes one or more processors 1002 coupled to a system memory 1004 via an input / output (I / O) interface 1006. Computer system 1000 further includes one or more cameras 1008 coupled to I / O interface 1006. Computer system 1000 further includes a network interface 1010 coupled to I / O interface 1006, and one or more input / output devices 1012, such as a cursor control device 1014, a keyboard 1016, and a display(s) 1018. While in some cases, an embodiment may be implemented using a single instance of computer system 1000, it is contemplated that in other embodiments, multiple such systems, or multiple nodes comprising computer system 1000, may be configured to host different portions or instances of the embodiments. For example, in one embodiment, some elements may be implemented via one or more nodes of computer system 1000 that are different from the nodes implementing other elements.

[0059] In various embodiments, computer system 1000 may be a uniprocessor system including one processor 1002, or a multiprocessor system including multiple processors 1002 (e.g., two, four, eight, or another suitable number). Processor 1002 may be any suitable processor capable of executing instructions. For example, in various embodiments, processor 1002 may be a general-purpose or embedded processor implementing any of a variety of instruction set architectures (ISAs), such as the x86, PowerPC, SPARC, or MIPS ISA, or any other suitable ISA. In a multiprocessor system, each of processors 1002 may commonly execute the same ISA, but this is not necessarily the case.

[0060] The system memory 1004 may be configured to store program instructions 1020 accessible by the processor 1002. In various embodiments, the system memory 1004 may be implemented using any suitable memory technology, such as static random access memory (SRAM), synchronous dynamic RAM (SDRAM), non-volatile / flash type memory, or any other type of memory. Additionally, the existing camera control data 1022 in the memory 1004 may include any of the information or data structures described above. In some embodiments, the program instructions 1020 and / or data 1022 may be received, transmitted, or stored on different types of computer-accessible media, or on similar media separate from the system memory 1004 or computer system 1000. In various embodiments, some or all of the functionality described herein may be implemented via such a computer system 1000.

[0061] In one embodiment, the I / O interface 1006 may be configured to coordinate I / O traffic between the processor 1002, the system memory 1004, and any peripheral devices within the device, including other peripheral interfaces such as the network interface 1010 or input / output devices 1012. In some embodiments, the I / O interface 1006 may perform any necessary protocol, timing, or other data conversion to convert data signals from one component (e.g., the system memory 1004) into a format suitable for use by another component (e.g., the processor 1002). In some embodiments, the I / O interface 1006 may include support for devices attached via various types of peripheral buses, such as, for example, variations on the Peripheral Component Interconnect (PCI) bus standard or the Universal Serial Bus (USB) standard. In some embodiments, the functionality of the I / O interface 1006 may be split into two or more separate components, such as, for example, a northbridge and a southbridge. Additionally, in some embodiments, some or all of the functionality of the I / O interface 1006, such as an interface to the system memory 1004, may be incorporated directly into the processor 1002.

[0062] The network interface 1010 may be configured to allow data to be exchanged between the computer system 1000 and other devices (e.g., carrier or agent devices) attached to the network 1024, or between nodes of the computer system 1000. The network 1024, in various embodiments, may include one or more networks, including, but not limited to, a local area network (LAN) (e.g., an Ethernet or enterprise network), a wide area network (WAN) (e.g., the Internet), a wireless data network, some other electronic data network, or some combination thereof. In various embodiments, the network interface 1010 may support communication over a wired or wireless general-purpose data network, such as, for example, any suitable type of Ethernet network. It may support communication over a telecommunications / telephone network, such as an analog voice network or a digital fiber communications network, communication over a storage area network, such as a Fibre Channel SAN, or communication over any other suitable type of network and / or protocol.

[0063] The input / output devices 1012, in some embodiments, may include one or more display terminals, keyboards, keypads, touchpads, scanning devices, voice or optical recognition devices, or any other devices suitable for inputting or accessing data by one or more computer systems 1000. Multiple input / output devices 1012 may be present within computer system 1000 or distributed on various nodes of computer system 1000. In some embodiments, similar input / output devices may be separate from computer system 1000 and may interact with one or more nodes of computer system 1000 through wired or wireless connections, such as via network interface 1010.

[0064] Those skilled in the art will appreciate that computer system 1000 is merely exemplary and is not intended to limit the scope of the embodiments. In particular, computer systems and devices may include any combination of hardware or software capable of performing the illustrated functions, including computers, network devices, Internet appliances, PDAs, wireless telephones, pagers, and the like. Computer system 1000 may also be connected to other devices not shown, or may alternatively operate as a stand-alone system. In addition, functionality provided by the illustrated components may be combined in fewer components or distributed in additional components in some embodiments. Similarly, in some embodiments, the functionality of some of the illustrated components may not be provided and / or other additional functionality may be available.

[0065] Those skilled in the art will also appreciate that while various items are shown as being stored in memory or on a storage device during use, these items or portions thereof may be transferred between memory and other storage devices for purposes of memory management and data integrity. Alternatively, in other embodiments, some or all of the software components may execute in memory on another device and communicate with the illustrated computer system via computer-to-computer communications. Some or all of the system components or data structures may also be stored (e.g., instructions or structured data) on a computer-accessible medium or portable article to be read by an appropriate drive, various examples of which are described above. In some embodiments, instructions stored on a computer-accessible medium separate from computer system 1000 may be transmitted to computer system 1000 via signals, such as electrical, electromagnetic, or digital signals, conveyed over a transmission medium or a communications medium, such as a network and / or wireless link. Various embodiments may further include receiving, sending, or storing instructions and / or data executed on a computer-accessible medium in accordance with the preceding description. Generally speaking, a computer-accessible medium may include non-transitory computer-readable storage media or memory media, such as magnetic or optical media, e.g., volatile or non-volatile media, such as disks or DVDs / CD-ROMs, RAM (e.g., SDRAM, DDR, RDRAM, SRAM, etc.), ROM, etc. In some embodiments, the computer-accessible medium may include a transmission medium or signal, such as an electrical, electromagnetic, or digital signal, conveyed over a communication medium, such as a network and / or a wireless link.

[0066] The methods described herein may be implemented in different embodiments in the form of software, hardware, or a combination thereof. In addition, the order of blocks of the methods may be changed, and various elements may be added, reordered, combined, omitted, modified, etc. Various modifications and changes may be made as would be apparent to a person skilled in the art having the benefit of this disclosure. The various embodiments described herein are illustrative and not limiting. Many variations, modifications, additions, and improvements are possible. Thus, multiple instances may be provided for components described herein as a single instance. Boundaries between various components, operations, and data stores are somewhat arbitrary, and certain operations are illustrated in the context of specific example configurations. Other allocations of functionality are contemplated and may be included within the scope of the following claims. Finally, structures and functions presented as separate components in example configurations may be implemented as combined structures or components. These and other variations, modifications, additions, and improvements may be included within the scope of the embodiments, as defined in the following claims.

Claims

1. A camera, an optical assembly having one or more lenses defining an optical axis; An image sensor; an enclosure forming an outer wall of the camera; an actuator assembly for moving the image sensor relative to the optical assembly; a base that is a static component of the camera, the base comprising a sheet that is parallel to the optical axis and faces away from the optical assembly; a flexure attached to the seat and suspending the image sensor from the base and permitting movement of the image sensor enabled by the actuator assembly; Equipped with a camera.

2. 2. The camera of claim 1, further comprising a substrate providing electronic communication between one or more surface mounted electrical components present on the substrate and the image sensor, the image sensor being fixedly attached to a surface of the substrate that faces parallel to the optical axis and away from the optical assembly, the substrate comprising an upper block formed of an organic material and a lower block formed of a ceramic material.

3. The camera of claim 2 , further comprising an image sensor stiffener extending across at least a portion of the bend, the image sensor stiffener being the moving component of the camera closest to the enclosure.

4. 2. The camera of claim 1, further comprising a substrate providing electronic communication between one or more surface mounted electrical components present on the substrate and the image sensor via the flexure, the flexure being fixedly attached to a surface of the substrate facing the direction parallel to the optical axis and away from the optical assembly, the substrate comprising an upper block and a lower block formed of an organic material.

5. 5. The camera of claim 4, wherein the flexure extends completely across a surface of the image sensor that faces in the direction parallel to the optical axis and away from the optical assembly, the flexure being the moving component of the camera closest to the enclosure.

6. 5. The camera of claim 4, further comprising an end stop fixedly attached to a surface of the flexure that faces in the direction parallel to the optical axis and away from the optical assembly, the end stop being the moving component of the camera closest to the enclosure.

7. The camera of claim 4 , further comprising wire bonds providing electronic communication between the image sensor and the flexure.

8. A device, comprising: one or more processors; a memory storing program instructions executable by said one or more processors to control operation of the camera; The camera includes: an optical assembly having one or more lenses defining an optical axis; An image sensor; an enclosure forming an outer wall of the camera; an actuator assembly for moving the image sensor relative to the optical assembly; a base that is a static component of the camera, the base comprising a sheet that is parallel to the optical axis and faces away from the optical assembly; a flexure attached to the seat and suspending the image sensor from the base and allowing movement of the image sensor enabled by the actuator assembly.

9. 10. The device of claim 8, wherein the camera further comprises a substrate providing electronic communication between one or more surface mounted electrical components present on the substrate and the image sensor, the image sensor being fixedly attached to a surface of the substrate facing the direction parallel to the optical axis and away from the optical assembly, the substrate comprising an upper block formed of an organic material and a lower block formed of a ceramic material.

10. 10. The device of claim 9, wherein the camera further comprises an image sensor stiffener extending across at least a portion of the bend, the image sensor stiffener being the moving component of the camera closest to the enclosure.

11. 9. The device of claim 8, wherein the camera further comprises a substrate providing electronic communication between one or more surface mounted electrical components present on the substrate and the image sensor via the flexure, the flexure being fixedly attached to a surface of the substrate facing the direction parallel to the optical axis and away from the optical assembly, the substrate comprising upper and lower blocks formed of a ceramic material.

12. 12. The device of claim 11, wherein the flexure extends completely across a surface of the image sensor that faces in the direction parallel to the optical axis and away from the optical assembly, the flexure being the moving component of the camera closest to the enclosure.

13. 12. The device of claim 11, further comprising an end stop fixedly attached to a surface of the flexure that faces in the direction parallel to the optical axis and away from the optical assembly, the end stop being a moving component of the camera closest to the enclosure.

14. The device of claim 11 , further comprising wire bonds providing electronic communication between the image sensor and the flexure.

15. 1. An image sensor actuator assembly comprising: An image sensor; an actuator assembly for moving the image sensor in one or more directions relative to an axis perpendicular to a light receiving surface of the image sensor; an enclosure forming an outer wall of the camera; a base fixedly attached to the enclosure, the base including a sheet facing in a direction parallel to the axis and facing in a direction opposite the light receiving surface of the image sensor; an image sensor actuator assembly attached to the seat and comprising: a flexure that suspends the image sensor from the base and enables movement of the image sensor enabled by the actuator assembly;

16. 16. The image sensor actuator assembly of claim 15, further comprising a substrate providing electronic communication between one or more surface mounted electrical components present on the substrate and the image sensor, the image sensor facing the direction parallel to the axis and fixedly attached to a surface of the substrate facing the direction opposite the light receiving surface of the image sensor, the substrate comprising an upper block formed of an organic material and a lower block formed of a ceramic material.

17. 17. The image sensor actuator assembly of claim 16, further comprising an image sensor stiffener extending across at least a portion of the bend, the image sensor stiffener being the moving component of the camera closest to the enclosure.

18. 16. The image sensor actuator assembly of claim 15, further comprising a substrate that provides electronic communication between the image sensor and the flexure, and through the flexure, one or more surface mounted electrical components present on the substrate and the image sensor, the flexure facing the direction parallel to the axis and fixedly attached to a surface of the substrate facing the opposite direction to the light receiving surface of the image sensor, the substrate comprising an upper block and a lower block formed of an organic material.

19. 16. The image sensor actuator assembly of claim 15, wherein the flexure faces in the direction parallel to the axis and extends completely across a surface of the image sensor that faces in the opposite direction to the light receiving surface of the image sensor, the flexure being the moving component of the camera closest to the enclosure.

20. 16. The image sensor actuator assembly of claim 15, further comprising an end stop fixedly attached to a surface of the flexure facing the direction parallel to the axis and facing the opposite direction of the light receiving surface of the image sensor, the end stop being the moving component of the camera closest to the enclosure.

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