Wafer housing container washing device
Patent Information
- Application Number
- JP2023170840
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-29
- Publication Date
- 2025-08-04
- Estimated Expiration
- 2043-09-29
AI Technical Summary
The existing Wafer storage container cleaning device has shortcomings in terms of cleaning efficiency and production efficiency, which has affected the production efficiency of the semiconductor device.
A waffer storage container cleaning device is designed, which has a hexahedron profile, consists of a container body with an opening and a independently removable door section, equipped with a gripping mechanism to independently grasp and transport the container body and door section, and is cleaned and dried in the cleaning tank.
Through the design of this equipment, the Wafer storage container can be cleaned efficiently, which improves production efficiency and ensures the production quality of the semiconductor device.
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Abstract
Description
[Technical field]
[0001] SUMMARY OF THE DISCLOSURE An embodiment of the present invention relates to a wafer container cleaning apparatus. [Background technology]
[0002] FOUPs (Front Opening Unified Pods) are known as semiconductor wafer storage containers used in the semiconductor wafer manufacturing process. FOUPs are comprised of a shell (FOUP body, container body) with an opening, and a door (opening and closing lid) attached to the opening of the shell. The inside of the shell is a storage space with multiple shelves formed to hold multiple wafers.
[0003] Such FOUPs are used to transport semiconductor wafers, where semiconductor elements are formed through various processing steps (e.g., resist coating, exposure and development, etching (film formation), resist removal, cleaning, etc.), between processing steps. In other words, when the semiconductor wafers are transported between processing steps, they are held within the FOUP.
[0004] When a FOUP is used repeatedly, particles and chemical contaminants may adhere to the inner walls of the FOUP (the walls that define the space in which the wafers are stored). If these contaminants adhere to the semiconductor wafers stored in the FOUP, there is a risk that the yield of semiconductor devices will decrease. For this reason, after a FOUP has been used several times, it is cleaned to return it to a clean state.
[0005] As a technique for cleaning a FOUP, for example, a wafer container cleaning apparatus has been proposed in which the shell and the door are individually cleaned in a single cleaning tank.
[0006] In addition, the transport robot carries the shell and the door into the cleaning tank and carries the shell and the door out of the cleaning tank. [Prior art documents] [Patent documents]
[0007] [Patent Document 1] JP 2005-109523 A Summary of the Invention [Problem to be solved by the invention]
[0008] In such a wafer container cleaning apparatus, it is required to improve the throughput so as not to impede the production efficiency of semiconductor devices, and the same is true for wafer container cleaning apparatuses that clean wafer containers other than FOUPs (e.g., FOSBs (Front Opening Shipping Boxes)).
[0009] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer container cleaning apparatus capable of efficiently cleaning a wafer container. [Means for solving the problem]
[0010] In order to solve the above-mentioned problems and achieve the object, a wafer storage container cleaning device according to one aspect of the present invention includes a cleaning tank for cleaning a wafer storage container, the wafer storage container including a container body having a hexahedral outer shape, an opening on one face, and a gripped portion on another face intersecting the face having the opening, and a door portion that is detachable from the opening, and a gripping mechanism for individually gripping the container body and the door portion, and the container body and the door portion are individually carried into the cleaning tank, and the container body is removed from the cleaning tank. and a transport robot that individually transports the door section, wherein the gripping mechanism comprises a main body gripping section having a pair of first gripping claws that can move toward and away from each other along a first straight line and that grips the gripped section using the pair of first gripping claws, and a door gripping section having a pair of second gripping claws that can move toward and away from each other along a second straight line that intersects the first straight line in a top view and that grips the door section using the pair of second gripping claws, and the cleaning tank washes the container main body with the opening facing downward. Effect of the Invention
[0011] According to one aspect of the present invention, it is possible to provide a wafer container cleaning device capable of efficiently cleaning a wafer container. [Brief description of the drawings]
[0012] [Figure 1] FIG. 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line XX of the wafer container cleaning apparatus according to the first embodiment. [Diagram 3] FIG. 3 is a schematic diagram illustrating an example of the configuration of the transfer robot according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing an example of an internal configuration of the robot hand according to the first embodiment. [Diagram 5] FIG. 5 is a cross-sectional view taken along line YY in FIG. [Figure 6] FIG. 6 is a diagram showing an example of a base body according to the first embodiment. [Figure 7] FIG. 7 is a diagram illustrating an example of a state in which the robot hand according to the first embodiment grips a flange. [Figure 8] FIG. 8 is a cross-sectional view showing an example of an internal configuration of the robot hand according to the first embodiment. [Figure 9] FIG. 9 is a diagram for explaining the door and the gripping claws in the first and second embodiments. [Figure 10] FIG. 10 is a diagram for explaining the door and the gripping claws in the first and second embodiments. [Figure 11] FIG. 11 is a diagram for explaining the door and the gripping claws in the first and second embodiments. [Figure 12] FIG. 12 is a diagram for explaining the door and the gripping claws in the first and second embodiments. [Figure 13] FIG. 13 is a diagram for explaining the door and the gripping claws in the first and second embodiments. [Figure 14] FIG. 14 is a diagram showing an example of a state in which a pair of gripping claws grip a door when a protrusion is provided on the outer peripheral surface of the door. [Figure 15] FIG. 15 is a perspective view of a gripping claw according to a modified example. [Figure 16] FIG. 16 is a diagram showing an example in which a pair of gripping claws grip a door. [Figure 17] FIG. 17 is a diagram showing an example in which a pair of gripping claws grip a door. [Figure 18] FIG. 18 is a diagram showing an example in which a pair of gripping claws grip a door. [Figure 19] FIG. 19 is a diagram showing an example of a state in which a pair of gripping claws grip a door when a protrusion is provided on the outer peripheral surface of the door. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] Hereinafter, an embodiment of the wafer container cleaning apparatus disclosed in the present application will be described in detail with reference to the attached drawings. Note that the wafer container cleaning apparatus disclosed in the present application is not limited to the following embodiment. Also, each embodiment and each modified example can be appropriately combined within a range that does not cause a contradiction. Note that in this embodiment, a case will be described in which at least four processing tanks of the wafer container cleaning apparatus are cleaning tanks (cleaning processing tanks).
[0014] (First embodiment) FIG. 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus 100 according to a first embodiment. FIG. 2 is a cross-sectional view taken along line XX in FIG. 1. The wafer container cleaning apparatus 100 is installed, for example, in a factory that manufactures semiconductor wafers, and cleans wafer containers. As shown in FIGS. 1 and 2, the wafer container cleaning apparatus 100 includes a transfer robot 1, a disassembly / connection stage (buffer) 2, a cleaning tank 3, a housing 6, a vacuum processing tank 7, a control unit 8, a first load / unload port 9a, a second load / unload port 9b, a third load / unload port 9c, and an input interface 10.
[0015] In this embodiment, the wafer storage container 200 is, for example, a FOUP or a FOSB, and includes a container body (shell) 201 and a lid (door) 202. The container body 201 has a hexahedral outer shape. The container body 201 has a square opening on one side. The container body 201 also has a storage space for storing semiconductor wafers. The storage space is located inside the opening and communicates with the opening. The door 202 can be disassembled / connected to the container body 201, and when connected to the container body 201, it is attached to the opening in a state in which it can be opened and closed. In this way, the door 202 forms a square with a size corresponding to the opening of the container body 201, and is detachable from the opening. The door 202 is, for example, an example of a door part. The container body 201 also has a flange 203. For example, the container body 201 has a flange 203 on another side that is perpendicular (intersecting) to the side having the opening. The flange 203 is a portion that is gripped (held) when the wafer container 200 is transported by an overhead hoist transport (OHT) or a transport robot 1, and is formed in a rectangular plate shape. The flange 203 is, for example, an example of a gripped portion.
[0016] The transfer robot 1, the disassembly / connection stage 2, the cleaning tank 3, the maintenance area 4, the cover unit 5, the vacuum processing tank 7, and the control unit 8 are provided inside the housing 6. On the other hand, the first load / unload port 9a, the second load / unload port 9b, and the third load / unload port 9c are provided across the inside and outside of the housing 6.
[0017] The first load / unload port 9a loads into the interior of the housing 6 the wafer storage container 200 to be cleaned, which is placed on the outside of the housing 6 of the first load / unload port 9a.
[0018] For example, the wafer storage container 200, which is transported with the flange 203 being gripped by the OHT, is placed on the first load / unload port 9a at a portion outside the housing 6. For example, as shown in FIG. 1, the wafer storage container 200 is placed on the first load / unload port 9a so that the door 202 of the wafer storage container 200 faces the housing 6. When the wafer storage container 200 is placed on the first load / unload port 9a in this manner, a shutter provided on the opening 6a of the housing 6 rises. This allows the wafer storage container 200 to be loaded into the housing 6 through the opening 6a. Then, the wafer storage container 200 is slid in a direction toward the inside by the sliding device of the first load / unload port 9a, and is loaded into the housing 6.
[0019] In addition, the first loading / unloading port 9a unloads the wafer storage container 200, which has been cleaned and vacuum dried and placed in the internal portion of the housing 6 of the first loading / unloading port 9a by the transport robot 1, to the outside of the housing 6.
[0020] For example, after vacuum drying, the wafer storage container 200, in which the container body 201 and the door 202 are connected at the disassembly / connection stage 2, is transported by the transport robot 1 and placed in the first load / unload port 9a inside the housing 6. When the wafer storage container 200 is placed in the first load / unload port 9a in this manner, a shutter provided at the opening 6a of the housing 6 rises. This makes it possible for the wafer storage container 200 to be carried out of the housing 6 through the opening 6a. Then, the wafer storage container 200 is slid in the direction toward the outside by the slide device of the first load / unload port 9a, and is carried out of the housing 6.
[0021] The second load / unload port 9b, like the first load / unload port 9a, can carry the wafer storage container 200 in and out through the opening 6b of the housing 6. The third load / unload port 9c can also be configured to carry the wafer storage container 200 in and out through the opening 6c of the housing 6 in the same manner as the first load / unload port 9a.
[0022] The transport robot 1 is a vertical articulated robot, and transports the wafer storage container 200 to each part while gripping the flange 203 of the wafer storage container 200. FIG. 3 is a schematic diagram showing an example of the configuration of the transport robot 1 according to the first embodiment. As shown in FIGS. 2 and 3, the transport robot 1 includes a robot arm 1a, a robot hand 1b, a base 1c, a moving device 1d, and a wrist 1e. The transport robot 1 transports the wafer storage container 200 to each part by extending and retracting the robot arm 1a and rotating the robot arm 1a while the robot hand 1b provided at the tip of the robot arm 1a grips the flange 203.
[0023] The moving device 1d includes a servo motor and a ball screw mechanism (not shown), and can move the base portion 1c in the front-rear direction (the up-down direction in the figure) within a moving region R3 shown in FIG.
[0024] As shown in the example of FIG. 3, the robot arm 1a of the transfer robot 1 includes a rotation support member 1a1, a first arm 1a2, and a second arm 1a3.
[0025] The lower end portion of the rotation support member 1a1 is supported by the upper portion of the base portion 1c in a state where it can rotate around an axis (vertical axis) 11 extending in the vertical direction. The first arm 1a2 is connected to the upper end portion of the rotation support member 1a1 in a state where it can rotate around an axis (horizontal axis) 12 extending in the horizontal direction. The second arm 1a3 is connected to the other end portion of the first arm 1a2 in a state where it can rotate around a horizontal axis 13. The wrist portion 1e is connected to the other end portion of the second arm 1a3 in a state where it can rotate around a horizontal axis 15. The robot hand 1b is connected to the tip of the wrist portion 1e in a state where it can rotate around an axis 14 perpendicular to the horizontal axis 15. With the above-mentioned configuration, the transport robot 1 can move the robot hand 1b to various positions.
[0026] In the disassembly / connection stage 2, a disassembly process for disassembling the wafer storage container 200 into the container body 201 and the door 202, and a connection process for connecting the container body 201 and the door 202 are performed. A latch key is provided on the disassembly / connection stage 2, and the latch key is inserted into a key hole formed in the door 202 of the wafer storage container 200 and rotated, thereby performing the disassembly process and the connection process of the wafer storage container 200. For example, the wafer storage container 200 carried into the housing 6 is carried by the transfer robot 1 to the disassembly / connection stage 2, and the disassembly process is performed in the disassembly / connection stage 2. Then, the transfer robot 1 carries the container body 201 and the door 202 into the cleaning tank 3 separately. In addition, when the provisional drying of the wafer storage container 200 is completed in the cleaning tank 3, the transfer robot 1 carries out the container body 201 and the door 202 individually from the cleaning tank 3, and carries the container body 201 and the door 202 individually to the vacuum processing tank 7. Furthermore, in the disassembly / connection stage 2, the vacuum-dried container body 201 and door 202 are transported by the transport robot 1, and a connection step is performed.
[0027] In the wafer storage container cleaning apparatus 100 of this embodiment, the disassembly / connection stage 2 is mounted on a plate-shaped support member located within the housing 6 at a position higher than the installation surfaces of the cleaning tank 3, vacuum processing tank 7, etc.
[0028] The cleaning tank 3 is a tank for cleaning the wafer storage container 200. For example, the container body 201 and the door 202 are separately transported to the cleaning tank 3 by the transport robot 1. Then, the cleaning tank 3 performs a cleaning process on the wafer storage container 200 while separately holding the container body 201 and the door 202. For example, as shown in FIG. 2, the cleaning tank 3 includes a cleaning tank body 30a having an opening on the top surface, an upper lid 30b capable of opening and closing the opening of the cleaning tank body 30a, and an upper lid opening and closing drive mechanism 30c for opening and closing the upper lid 30b. In the cleaning tank 3, the upper lid 30b holds the door 202, and the container body 201 is placed on a rotating table (not shown) provided in the cleaning tank body 30a. In the cleaning tank 3, the container body 201 and the door 202 are rotated by a rotation mechanism (not shown) while a cleaning liquid nozzle is used to eject a cleaning liquid (e.g., pure water) onto each of the container body 201 and the door 202, thereby cleaning the wafer storage container 200. In the cleaning tank 3, the container body 201 is arranged with its opening facing downward in consideration of the drainage of the cleaning liquid, but the orientation of the container body 201 is not limited to this.
[0029] When cleaning of the wafer storage container 200 is completed in the cleaning tank 3, the cleaning tank 3 then rotates the container body 201 and the door 202 in the cleaning tank 3, and blows dry air onto the container body 201 and the door 202 to dry them. The drying in the cleaning tank 3 here is a process (temporary drying) for mostly drying the cleaning solution adhering to the wafer storage container 200. When the temporary drying of the wafer storage container 200 is completed in the cleaning tank 3, the transfer robot 1 transfers the container body 201 and the door 202 in the cleaning tank 3 separately to the vacuum processing tank 7.
[0030] As shown in FIG. 1, the wafer container cleaning apparatus 100 has four cleaning tanks 3, two of which are arranged in each of the first area R1 and the second area R2.
[0031] The vacuum processing tank 7 is a tank for vacuum drying (main drying) the wafer storage container 200. For example, the vacuum processing tank 7 includes a vacuum tank body, an opening / closing lid, a heater, and a pressure reducing device that can evacuate the inside of the vacuum processing tank 7. The container body 201 and the door 202 are carried into the vacuum processing tank body by the transfer robot 1, and with the opening of the vacuum tank body closed by the opening / closing lid, the container body 201 and the door 202 are vacuum-dried by heating with the heater while evacuating with the pressure reducing device.
[0032] The control unit 8 controls the overall operation of the wafer storage container cleaning apparatus 100. For example, the control unit 8 controls the transfer robot 1, the disassembly / connection stage 2, the cleaning tank 3, the vacuum processing tank 7, the first load / unload port 9a, the second load / unload port 9b, and the third load / unload port 9c, thereby operating the transfer robot 1, the disassembly / connection stage 2, the cleaning tank 3, the vacuum processing tank 7, the first load / unload port 9a, the second load / unload port 9b, and the third load / unload port 9c as described above.
[0033] For example, the control unit 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a HDD (Hard Disk Drive), and a communication interface, all of which are connected via an internal bus.
[0034] The CPU executes various processes while using the RAM memory area as a temporary storage area for data used in the various processes. The ROM and HDD store programs for executing the various processes, as well as various databases and tables used when executing the various processes.
[0035] The communication interface is an interface for communicating with the above-mentioned components of the wafer container cleaning apparatus 100, and also for communicating with an external device connected via a network to the wafer container cleaning apparatus 100. For example, the communication interface is a network interface card.
[0036] The input interface 10 accepts input operations of various instructions and various information from the worker P. Specifically, the input interface 10 is connected to the control unit 8, and transmits the input operations accepted from the worker P to the control unit 8. For example, the input interface 10 is a mouse, a keyboard, a touch panel, or the like.
[0037] Next, an example of the robot hand 1b according to this embodiment will be described. Fig. 4 is a cross-sectional view showing an example of the internal configuration of the robot hand 1b according to the first embodiment. Fig. 5 is a cross-sectional view taken along line YY in Fig. 4.
[0038] 4 and 5, the robot hand 1b includes a base 90, a gripper drive mechanism 101, a container body gripper 104, and a door gripper 105. The gripper drive mechanism 101, the container body gripper 104, and the door gripper 105 are each disposed on the base 90. In this embodiment, the robot hand 1b grips the container body 201 and the door 202 individually. The robot hand 1b is, for example, an example of a gripping mechanism.
[0039] The container body gripping part 104 grips the rectangular flange 203 of the container body 201. The container body gripping part 104 includes a pair of gripping claws 104a1, 104b1 and a pair of arm blocks 104a, 104b. The gripping claw 104a1 is provided at one end of the arm block 104a, and the gripping claw 104b1 is provided at one end of the arm block 104b. The container body gripping part 104 grips the flange 203 using the pair of gripping claws 104a1, 104b1. Specifically, the pair of gripping claws 104a1, 104b1 grip the flange 203 by sandwiching the flange 203. The gripping claws 104a1, 104b1 are formed, for example, to have substantially the same length as the side of the flange 203 to be gripped. The container body gripping portion 104 is, for example, an example of a body gripping portion.
[0040] The door gripping portion 105 grips the rectangular door 202 that is larger than the flange 203. The door gripping portion 105 includes a pair of gripping claws 105a1 and 105b1 and a pair of arm blocks 105a and 105b. The gripping claw 105a1 is provided at one end of the arm block 105a, and the gripping claw 105b1 is provided at one end of the arm block 105b. The door gripping portion 105 grips the door 202 using the pair of gripping claws 105a1 and 105b1. Specifically, the pair of gripping claws 105a1 and 105b1 grip the door 202 by pinching the door 202. The gripping claws 105a1 and 105b1 hold only the central portion of the door 202, for example, and are formed to have a length shorter than the gripping claws 104a1 and 104b1. Since the pair of gripping claws 105a1, 105b1 can grip the rectangular door 202 which is larger than the flange 203, the distance between the pair of gripping claws 105a1, 105b1 is wider than the distance between the pair of gripping claws 104a1, 104b1.
[0041] The base 90 is provided with a gripper drive mechanism 101. FIG. 6 is a diagram showing an example of the base 90 according to the first embodiment. As shown in FIG. 6, the base 90 is formed in a shape (convex shape) having notches 90a obtained by cutting out two adjacent corners of a rectangle in a square shape when viewed from above. For example, if the container body 201 is transported to the disassembly / connection stage 2 in an orientation in which the notches 90a are located on the lower side, it is possible to prevent the robot hand 1b from interfering with the disassembly / connection stage 2. It is to be noted that the robot hand 1b can similarly prevent interference with the cleaning tank 3 not only when transporting the container body 201 to the disassembly / connection stage 2, but also when placing (carrying) the container body 201 in the cleaning tank 3 or removing (carrying) it out of the cleaning tank 3.
[0042] The gripper drive mechanism 101 drives the container body gripper 104 to cause the container body gripper 104 to grip the flange 203 of the container body 201, and drives the door gripper 105 to cause the door gripper 105 to grip the door 202. The gripper drive mechanism 101 includes linear guides 102a, 102b, 103a, and 103b, a support shaft 115, a rotating member 116, four connecting members 106a, 106b, 107a, and 107b, an air cylinder 110, a rod portion 111, and a connecting portion 112.
[0043] Each of the linear guides 102a and 102b supports each of the arm blocks 104a and 104b so that each of the arm blocks 104a and 104b can move toward and away from each other along a first straight line L1, which is a virtual line. This allows a pair of gripping claws 104a1 and 104b1 provided on the two arm blocks 104a and 104b to move toward and away from each other as indicated by the double arrow L11. In this manner, the linear guides 102a and 102b support the pair of gripping claws 104a1 and 104b1 so as to be movable in a direction along the first straight line L1. The linear guides 102a and 102b are, for example, an example of a first guide member. Also, the gripping claws 104a1 and 104b1 are, for example, an example of a first gripping claw.
[0044] Each of the linear guides 103a and 103b supports each of the arm blocks 105a and 105b so that each of the arm blocks 105a and 105b can move toward and away from each other along a second straight line L2, which is a virtual line perpendicular to the first straight line L1 in a top view. This allows a pair of gripping claws 105a1 and 105b1 provided on the two arm blocks 105a and 105b to move toward and away from each other as indicated by the double arrow L21. In this way, the linear guides 103a and 103b support the pair of gripping claws 105a1 and 105b1 so as to be movable in a direction along the second straight line L2. The linear guides 103a and 103b are, for example, an example of a second guide member. Also, the gripping claws 105a1 and 105b1 are, for example, an example of a second gripping claw.
[0045] Although an example has been given of the second straight line L2 being perpendicular to the first straight line L1 when viewed from above, this is not limited to the case where the second straight line L2 is perpendicular to the first straight line L1 when viewed from above, and the second straight line L2 may intersect the first straight line L1 when viewed from above.
[0046] 5, in this embodiment, in top view, the first straight line L1 and the second straight line L2 intersect at the support shaft 115. Therefore, the container body gripping portion 104 and the door gripping portion 105 are disposed in an intersecting relationship with the support shaft 115 as the center.
[0047] The air cylinder 110 drives the rod portion 111 to advance and retreat (reciprocate) along the second straight line L2 under the control of the control unit 8. This causes the rod portion 111 to move in two directions indicated by the double-headed arrow 111a along the second straight line L2. Note that the direction along the second straight line L2, the two directions indicated by the double-headed arrow L21, and the two directions indicated by the double-headed arrow 111a are parallel to each other.
[0048] The connecting portion 112 is a member that connects the rod portion 111 and the arm block 105a. Since the rod portion 111 is connected to the arm block 105a via the connecting portion 112, when the rod portion 111 moves as described above, the arm block 105a moves in a direction along the second straight line L2 in conjunction with the movement of the rod portion 111.
[0049] The support shaft 115 is an axis provided in the approximate center of the base body 90, and extends in a direction perpendicular to both the first straight line L1 and the second straight line L2 at a position P where the first straight line L1 and the second straight line L2 intersect in a top view. The rotating member 116 is supported by the support shaft 115 so as to be rotatable about the support shaft 115. That is, in a top view, the position P coincides with the rotation center C. In this way, the rotating member 116 is provided at a position P where the first straight line L1 and the second straight line L2 intersect in a top view so as to be rotatable about the support shaft 115 perpendicular to both the first straight line L1 and the second straight line L2. The support shaft 115 is, for example, an example of a shaft. In this embodiment, the rotating member 116 is a disc-shaped member, but may be a member of another shape.
[0050] The four (plural) connecting members 106a, 106b, 107a, 107b connect each of the pair of gripping claws 104a1, 104b1 and each of the pair of gripping claws 105a1, 105b1 to the rotating member 116 in a rotatable state. Specifically, a portion 106a1 on one end side of the connecting member 106a is connected to the rotating member 116 in a rotatable state, and a portion 106a2 on the other end side of the connecting member 106a is connected to the arm block 104a in a rotatable state. A portion 106b1 on one end side of the connecting member 106b is connected to the rotating member 116 in a rotatable state, and a portion 106b2 on the other end side of the connecting member 106b is connected to the arm block 104b in a rotatable state.
[0051] A portion 107a1 on one end side of the connecting member 107a is rotatably connected to the rotating member 116, and a portion 107a2 on the other end side of the connecting member 107a is rotatably connected to the arm block 105a. A portion 107b1 on one end side of the connecting member 107b is rotatably connected to the rotating member 116, and a portion 107b2 on the other end side of the connecting member 107b is rotatably connected to the arm block 105b.
[0052] The positions of a pair of ends 106a1, 106b1 on the rotating member 116 side of the pair of connecting members 106a, 106b connected to the pair of gripping claws 104a1, 104b1 are symmetrical with respect to the rotation center C of the rotating member 116. In addition, the positions of a pair of ends 107a1, 107b1 on the rotating member 116 side of the pair of connecting members 107a, 107b connected to the pair of gripping claws 105a1, 105b1 are symmetrical with respect to the rotation center C of the rotating member 116.
[0053] Furthermore, in this embodiment, the four distances, namely, the distance between end 106a1 of connecting member 106a and the center of rotation C, the distance between end 106b1 of connecting member 106b and the center of rotation C, the distance between end 107a1 of connecting member 107a and the center of rotation C, and the distance between end 107b1 of connecting member 107b and the center of rotation C, are identical.
[0054] For these reasons, in the first embodiment, the stroke (opening / closing amount, movement amount) of the pair of gripping claws 104a1, 104b1 and the stroke of the pair of gripping claws 105a1, 105b1 are the same.
[0055] Next, an example of the operation of the gripper drive mechanism 101 when the container body gripper 104 grips the flange 203 of the container body 201 or when the door gripper 105 grips the door 202 will be described. For example, the control unit 8 controls the transport robot 1 so that the robot hand 1b approaches the flange 203 or the door 202 to a position where the flange 203 or the door 202 can be gripped by the robot hand 1b. As a result, the robot hand 1b approaches the flange 203 or the door 202 to a position where the flange 203 or the door 202 can be gripped by the robot hand 1b.
[0056] Then, in the state shown in Fig. 5, the control unit 8 controls the air cylinder 110 so as to retract the rod portion 111 toward the air cylinder 110. As a result, the rod portion 111 moves along the second straight line L2, which is the rightward direction in Fig. 5, of the two directions indicated by the double-headed arrow 111a. As the rod portion 111 moves in this manner, the arm block 105a moves in conjunction with the movement of the rod portion 111, along the second straight line L2, in the rightward direction in Fig. 5 (in the direction approaching the support shaft 115).
[0057] When the arm block 105a moves to the right in FIG. 5, the rotating member 116 connected to the arm block 105a by the connecting member 107a rotates clockwise in FIG. 5. When the rotating member 116 rotates clockwise, the arm blocks 104a, 104b, and 105b connected to each other by the connecting members 106a, 106b, and 107b also move in a direction approaching the support shaft 115. In this case, the pair of arm blocks 104a and 104b move closer to each other. The pair of arm blocks 105a and 105b also move closer to each other. When the pair of arm blocks 104a and 104b move closer to each other, the pair of gripping claws 104a1 and 104b1 move closer to each other in accordance with the movement of the pair of arm blocks 104a and 104b. Similarly, the pair of gripping claws 105a1 and 105b1 also move closer to each other. The pair of gripping claws 104a1, 104b1 pinch the flange 203 to grip the flange 203, or the pair of gripping claws 105a1, 105b1 pinch the door 202 to grip the door 202.
[0058] When the container body gripper 104 gripping the flange 203 of the container body 201 releases the flange 203, or when the door gripper 105 gripping the door 202 releases the door 202, the gripper drive mechanism 101 may perform the reverse operation to that described above. For example, the control unit 8 controls the air cylinder 110 so that the rod portion 111 protrudes from the air cylinder 110 (so that the rod portion 111 is restored to the state shown in FIG. 5). As a result, the rod portion 111 moves along the second straight line L2 in the left direction in FIG. 5 (a direction moving away from the support shaft 115) of the two directions indicated by the double-headed arrow 111a. As a result of the rod portion 111 moving in this manner, the arm block 105a moves in the left direction in FIG. 5.
[0059] When the arm block 105a moves leftward in FIG. 5, the rotating member 116 rotates counterclockwise in FIG. 5 in association with the movement of the arm block 105a. When the rotating member 116 rotates counterclockwise, the arm blocks 104a, 104b, and 105b also move in a direction away from the support shaft 115. In this case, the pair of arm blocks 104a and 104b move apart. The pair of arm blocks 105a and 105b also move apart. When the pair of arm blocks 104a and 104b move apart, the pair of gripping claws 104a1 and 104b1 move apart in association with the movement of the pair of arm blocks 104a and 104b. Similarly, the pair of gripping claws 105a1 and 105b1 also move apart. As a result, the pair of gripping claws 104a1 and 104b1 release the flange 203, and the pair of gripping claws 105a1 and 105b1 release the door 202.
[0060] As described above, the air cylinder 110 moves one of the pair of gripping claws 104a1, 104b1 and the pair of gripping claws 105a1, 105b1, thereby moving all of the pair of gripping claws 104a1, 104b1 and the pair of gripping claws 105a1, 105b1. Note that the gripping claw moved by the air cylinder 110 is not limited to the gripping claw 105a1, and may be the other gripping claws 104a1, 104b1, 105b1. The air cylinder 110 is, for example, an example of a moving member.
[0061] Fig. 7 is a diagram showing an example of a state in which the robot hand 1b according to the first embodiment grips the flange 203. The example of Fig. 7 shows a case in which the pair of gripping claws 104a1, 104b1 grip the flange 203 by sandwiching the flange 203 in the up-down direction (vertical direction).
[0062] Here, when the pair of gripping claws 104a1, 104b1 grip the flange 203 by pinching it in the horizontal direction, there is a risk that the flange 203 may slip off the pair of gripping claws 104a1, 104b1. For this reason, the pair of gripping claws 104a1, 104b1 are required to pinch the flange 203 with a relatively strong force. On the other hand, when the pair of gripping claws 104a1, 104b1 grip the flange 203 by pinching it in the vertical direction, the lower gripping claw of the pair of gripping claws 104a1, 104b1 (grip claw 104b1 in the example of FIG. 7) supports the flange 203. Therefore, the magnitude of the force required when the pair of gripping claws 104a1, 104b1 pinch the flange 203 in the vertical direction is smaller than the magnitude of the force required when pinching the flange 203 in the horizontal direction. Therefore, when the pair of gripping claws 104a1, 104b1 pinch the flange 203 in the vertical direction, the force applied to the flange 203 can be reduced, so damage to the flange 203 and the gripping claws 104a1, 104b1 can be suppressed. In addition, the air cylinder 110 can be made smaller by the amount that the force pinching the flange 203 can be reduced, and the weight of the robot hand 1b can be reduced.
[0063] Therefore, when the transport robot 1 transports the container body 201 into the cleaning tank 3, the control unit 8 may control the transport robot 1 so that the container body 201 is transported into the cleaning tank 3 with the opening facing downward while the pair of first gripping claws 104a1, 104b1 grip the flange 203 from above and below.
[0064] Next, a case will be described in which the transport robot 1 transports the container body 201 out of the cleaning tank 3. In this case, the container body 201 is placed in the cleaning tank 3 with the opening facing downward. Therefore, the control unit 8 may control the transport robot 1 to transport the container body 201 out of the cleaning tank 3 with the opening facing downward, while the pair of first gripping claws 104a1, 104b1 hold the flange 203 from above and below.
[0065] As described above, in the wafer container cleaning apparatus 100 according to the first embodiment, the robot hand 1b as a gripping mechanism is configured so that the container body gripping part 104 and the door gripping part 105 are arranged such that the direction in which the pair of gripping claws 104a, 104b of the container body gripping part 104 move toward and away from each other (the direction along the first straight line L1) and the direction in which the pair of gripping claws 105a, 105b of the door gripping part 105 move toward and away from each other (the direction along the second straight line L2) are perpendicular to each other in a top view. With this configuration, the wafer container cleaning apparatus 100 according to the first embodiment has the effect of efficiently cleaning the wafer container for the following reasons.
[0066] As described above, inside the cleaning tank 3, the container body 201 is disposed with its opening facing downward as shown in FIG. 7. That is, the container body 201 is disposed with the flange 203 facing sideways. However, the container body 201 (wafer storage container 200) is carried into the wafer storage container cleaning apparatus 100 with its opening facing sideways, that is, with the flange 203 facing upward. Therefore, in order to take the container body 201 into or out of the cleaning tank 3, it is necessary to rotate the wrist 1e of the robot arm 1a by 90° to change the orientation of the container body 201.
[0067] Here, consider the case of a robot hand having a container body gripping part and a door gripping part in which the gripping claws 104a1, 104b1 and the gripping claws 105a1, 105b1 of the door gripping part 105 are arranged on a straight line and are configured to approach and move away from each other in the same direction. In the case of such a robot hand, as in FIG. 7, when the flange 203 is gripped from the top-bottom direction, which is a direction perpendicular to the horizontal axis 15, one of the gripping claws (located on the lower side) of the door gripping part 105 protrudes below the opening of the container body 201. In this case, when the container body 201 is placed with the opening facing downward or when the container body 201 placed with the opening facing downward is gripped, the gripping claw of the door gripping part 105 may interfere with a placement table or the like inside the cleaning tank 3. Therefore, in a robot hand configured in this way, the flange 203 cannot be gripped from the top-bottom direction, and must be gripped from a direction parallel to the horizontal axis 15, that is, from the side.
[0068] Consider the case where the flange 203 is gripped from the side by the robot hand having the above-mentioned configuration, and the wrist 1e is rotated 90° to change the orientation of the container body 201 by 90°. During this rotation, a force in the torsional direction (swinging direction) of a magnitude according to the inertial force of the container body 201 acts on the body gripping part (its constituent members, the arm block and the linear guide). A small gap exists in the movable part such as the linear guide to enable movement, and the gap gradually expands with use, causing problems such as rattling, that is, deterioration. If such a movable part is repeatedly subjected to the above-mentioned force, deterioration will appear earlier than in the case where it is not. In other words, the lifespan will be shortened. Therefore, in the robot hand having such a configuration, in order to prevent the lifespan of the body gripping part from being shortened, it is necessary to suppress the rotation speed of the wrist 1e that changes the orientation of the container body 201. This would result in a longer time required to change the orientation of the container body 201, which would then require a longer time to clean the wafer container 200, lowering the cleaning efficiency. If the linear guides 102a and 102b were replaced with ones that were sufficiently wide, or if multiple linear guides were provided in parallel, it might be possible to suppress the shortening of the life span even if the rotation speed was increased. However, this would increase the weight of the body gripping part 104, i.e., the weight of the part that is rotated 90 degrees, which would prevent an increase in the rotation speed, and thus would not improve efficiency.
[0069] In contrast, the robot hand 1b according to the first embodiment can grip the flange 203 from the top and bottom directions, which are perpendicular to the horizontal axis, as shown in Fig. 7. This makes it possible to prevent a force in the torsional direction (swing direction) from acting on the main body gripping part 104 (its constituent members, the arm blocks 104a, 104b, and the linear guides 102a, 102b). This eliminates the above-mentioned problems with the movable parts such as the linear guides 102a, 102b. This makes it possible to quickly change the orientation of the container main body 201, and efficiently clean the wafer storage container 200.
[0070] Furthermore, according to the wafer storage container cleaning apparatus 100 of the first embodiment, the container body gripping portion 104 that grips the container body 201 and the door gripping portion 105 that grips the door 202 can be driven by a common gripping portion driving mechanism 101, thereby simplifying the structure and reducing manufacturing costs.
[0071] Second Embodiment As described above, in the first embodiment, the four distances, namely, the distance between the end 106a1 of the connecting member 106a and the rotation center C, the distance between the end 106b1 of the connecting member 106b and the rotation center C, the distance between the end 107a1 of the connecting member 107a and the rotation center C, and the distance between the end 107b1 of the connecting member 107b and the rotation center C, are the same. However, the two distances, namely, the distance between the end 106a1 and the rotation center C and the distance between the end 106b1 and the rotation center C, and the two distances, namely, the distance between the end 107a1 and the rotation center C and the distance between the end 107b1 and the rotation center C, may be different. That is, the stroke of the pair of gripping claws 104a1, 104b1 may be different from the stroke of the pair of gripping claws 105a1, 105b1. Therefore, such an embodiment will be described as a wafer container cleaning device according to a second embodiment. In the following description of the second embodiment, differences from the first embodiment will be mainly described, and a description of configurations similar to those of the first embodiment may be omitted.
[0072] 8 is a cross-sectional view showing an example of the internal configuration of a robot hand according to the second embodiment. In the second embodiment, the robot hand is designed so that two distances, the distance between the end 106a1 and the rotation center C and the distance between the end 106b1 and the rotation center C, and two distances, the distance between the end 107a1 and the rotation center C and the distance between the end 107b1 and the rotation center C, are different from each other.
[0073] 8, the distance between end 106a1 and the center of rotation C and the distance between end 106b1 and the center of rotation C are "D1." On the other hand, the distance between end 107a1 and the center of rotation C and the distance between end 107b1 and the center of rotation C are "D2." Furthermore, distance "D2" is longer than distance "D1."
[0074] With this configuration, even with a single drive source (air cylinder 110), the gripper drive mechanism 101 can open and close two sets of gripping jaws (one set of gripping jaws 104a1, 104b1 and one set of gripping jaws 105a1, 105b1) in different directions (orthogonal directions) and with different strokes. For example, the dimensions of the flange 203 of the container body 201 are standardized and are almost the same regardless of the type (type of manufacturer) of the wafer storage container 200. In contrast, there is no standard for the outer dimensions of the door 202, and the outer dimensions and shape tend to vary depending on the type of wafer storage container 200.
[0075] In such a case, in a facility where different types of wafer storage containers 200 are mixed, it is necessary to either provide separate drive mechanisms for the container body gripper 104 and the door gripper 105, or to use a single drive mechanism and increase the stroke of the pair of gripping claws 104a1, 104b1 to match the stroke of the pair of gripping claws 105a1, 105b1. However, when separate drive mechanisms are provided, the structure becomes complicated and the manufacturing cost increases. Also, when a single drive mechanism is used and the stroke of the pair of gripping claws 104a1, 104b1 is increased to match the stroke of the pair of gripping claws 105a1, 105b1, it takes extra time to open and close the pair of gripping claws 104a1, 104b1, which reduces efficiency.
[0076] However, in the second embodiment, there is no need for such a configuration, and only the stroke of the pair of gripping claws 105a1, 105b1 of the door gripper 105 can be made large. Therefore, no extra time is required to open and close the pair of gripping claws 104a1, 104b1. Therefore, the wafer container cleaning apparatus according to the second embodiment can perform the cleaning process more efficiently.
[0077] (Other variations) Here, the door 202 and the gripping claws 105a1, 105b1 in each of the above-mentioned embodiments will be described. Figures 9 to 13 are diagrams for explaining the door 202 and the gripping claws 105a1, 105b1 in the first and second embodiments. As shown in Figure 9, the pair of gripping claws 105a1, 105b1 grip the door 202 by sandwiching the door 202.
[0078] FIG. 10 is a perspective view of the gripping claws 105a1 and 105b1. As shown in FIG. 10, the gripping claws 105a1 and 105b1 have a generally U-shaped shape. The surfaces of the gripping claws 105a1 and 105b, which are the central parts of the gripping claws and correspond to the bottom of the U-shape, are flat. Then, in a state where the surfaces of the central parts of the gripping claws 105a1 and the central parts of the gripping claws 105b1 are in contact with the outer peripheral surface of the door 202, the pair of gripping claws 105a1 and 105b1 pinch the door 202 to grip the door 202. FIGS. 11 to 13 are enlarged views of the area enclosed by the dashed line 300 in FIG. 9. As shown in FIG. 11, there may be no protrusions on the outer peripheral surface of the door 202, or there may be protrusions 202a and 202b on the outer peripheral surface of the door 202 as shown in FIGS. 12 and 13 depending on the type of the wafer container 200. FIG. 14 is a diagram showing an example of a state in which the pair of gripping claws 105a1 and 105b1 grip the door 202 when there is a protrusion on the outer peripheral surface of the door 202. In FIG. 14, black circles indicate a case in which the gripping claws 105a1 and 105b1 are in contact with the door 202 at one point. In the example of FIG. 14, the pair of gripping claws 105a1 and 105b1 are in contact with the door 202 at two points. This can occur when the central parts of the gripping claws 105a1 and 105b1 are flat surfaces, whereas the outer peripheral surface of the door 202 may have undulations due to variations in processing accuracy, and a protruding portion (protrusion) is positioned opposite both gripping claws 105a1 and 105b1. In this case, the gripping of the door 202 is not stable, and the door 202 is shifted relative to the gripping claws 105a1 and 105b1.
[0079] Therefore, instead of the gripping claws 105a1 and 105b1, gripping claws 205a1 and 205b1 shown in Fig. 15 may be used so as to stably grip the door 202 even when there is a protrusion on the outer peripheral surface of the door 202. Fig. 15 is a perspective view of the gripping claws 205a1 and 205b1 according to a modified example.
[0080] As shown in FIG. 15, the gripping claws 205a1 and 205b1 include a first member 211, a second member 212, an elastic body 213, and a third member 214.
[0081] The first member 211 is a flat plate-like member, and is a rectangular plate-like member having four sides when viewed from above.
[0082] A pair of second members 212 and third members 214, each of which is a rectangular plate, is provided on the surface of the first member 211 so as to rise from each of the three sides. The pair of second members 212 are disposed opposite each other, and the third member 214 is disposed so as to be sandwiched between the pair of second members 212. Such a pair of second members 212 and third members 214 have a U-shape when viewed from above (when viewed from the direction facing the surface of the first member 211). The second member 212 has a recess 212b formed in an upper end portion (end portion opposite to the first member 211 side) 212a. In addition, protrusions 212c are formed on both ends of the upper end portion 212. The side surface of the protrusion 212c on the central side of the upper end portion 212a is formed as an inclined surface 212c1 that inclines toward the central side. The inclined surface 212c1 functions as a guide when the gripping claws 205a1, 205b1 grip the door 202. The recess 212b is provided with an elastic body 213 having a width equal to that of the second member 212 and a generally cubic outer shape. The upper end surface 213b of the elastic body 213 is formed so as to be flush with a plane (a plane connected to the base end of the protrusion 212c) 212d connected to the base end of the recess 212b. A groove 213a is formed at the end of the elastic body 213 opposite to the third member 214. When a flange-shaped protrusion is formed on the outer periphery of the door 202, the groove 213a is provided to accommodate the protrusion and to hold the tip of the protrusion at the bottom of the groove 213a.
[0083] The third member 214 has a convex ridge 214a continuing to the protrusion 212c of the second member 212, and a flat surface 214b continuing to the flat surface 212d of the second member 212. Since the guide function can be fulfilled if either the convex ridge 214a or the protrusion 212c of the second member 212 on the third member 214 side is provided, the other may be omitted. Such first to third members 211, 212, 214 may be either formed separately or integrally.
[0084] Further, the gripping claws 205a1 and 205b1 are formed with grooves 213a for contacting the projections on the outer peripheral surface of the door 202.
[0085] 16 to 18 are diagrams showing examples of a pair of gripping claws 205a1 and 205b1 gripping the door 202. As shown in FIG. 16, when the outer peripheral surface of the door 202 is flat and has no protrusions, in one gripping claw (gripping claw 205a1 or gripping claw 205b1), the upper end surfaces 213b (see FIG. 15) of the two elastic bodies 213 are in close contact with the door 202 so as not to shift the door 202. As shown in FIGS. 17 and 18, when the outer peripheral surface of the door 202 has protrusions 202a and 202b, in one gripping claw (gripping claw 205a1 or gripping claw 205b1), the two grooves 213a are in contact with the protrusions 202a and 202b at two points so as not to shift the door 202. Note that FIG. 17 shows an example of the protrusion 202a having a square cross-sectional shape, and FIG. 18 shows an example of the protrusion 202b having a triangular cross-sectional shape. Fig. 19 is a diagram showing an example of a case where the pair of gripping claws 205a1, 205b1 grip the door 202 when there is a protrusion on the outer peripheral surface of the door 202. In the example of Fig. 19, two black circles indicate positions where the gripping claw 205a1 is in contact with the protrusion of the door 202 at two points. Also, in the example of Fig. 19, one black circle indicates a position where the gripping claw 205b1 is in contact with the protrusion of the door 202 at one point. In this case, since the pair of gripping claws 205a1, 205b1 are in contact with the door 202 at three points, the gripping of the door 202 is stable, and it is possible to prevent the door 202 from shifting relative to the gripping claws 205a1, 205b1.
[0086] As described above, the outer periphery of the door 202 may have undulations due to variations in processing accuracy, but since the gripping claws 205a1 and 205b1 of this modification are provided with the elastic bodies 213 at the contact portions with the door 202, undulations of a certain degree can be absorbed by the deformation of the elastic bodies 213, and the gripping claws 205a1 and 205b1 can stably grip the door 202 at a total of four points, two points each. The gripping state shown in FIG. 19 can occur when there is an undulation (protrusion) in the gripped area of the outer periphery of the door 202 that cannot be absorbed by the deformation of the elastic bodies 213. However, in the gripping claws 205a1 and 205b1 of this modification, the elastic bodies 213 that contact the door 202 are arranged at two separate points. Therefore, even if there is an undulation as described above, one of the elastic bodies 213 can be reliably contacted with the door 202. Therefore, unless a similar undulation exists in the other gripping area, the pair of gripping claws 205a1, 205b1 can securely grip the door 202 at a total of three points.
[0087] In the above-described first embodiment, the wafer container cleaning apparatus 100 has four cleaning tanks 3. However, the embodiment is not limited to this, and the apparatus may have five or more cleaning tanks.
[0088] In the first embodiment described above, the wafer container cleaning apparatus 100 has been described as having four cleaning tanks 3 and two vacuum processing tanks 7. However, the embodiment is not limited to this, and at least four processing tanks may be vacuum processing tanks 7. That is, the wafer container cleaning apparatus 100 may have at least four vacuum processing tanks 7, and the vacuum processing tanks 7 may be provided at the positions where the cleaning tanks 3 were provided in the first embodiment. In this case, the wafer container cleaning apparatus 100 may have two cleaning tanks 3, and the cleaning tanks 3 may be provided at the positions where the vacuum processing tanks 7 were provided in the first embodiment. [Explanation of symbols]
[0089] 1. Transport robot 1b Robot hand 2 Disassembly / connection stage 3. Cleaning tank 8. Control Unit 100 Wafer storage container cleaning device 104 Container body gripping part 105 Door grip
Claims
1. a cleaning tank for cleaning a wafer storage container, the container body having a hexahedral outer shape, an opening on one face, and a grippable portion on another face intersecting the face having the opening, and a door portion detachable from the opening; a transport robot including a gripping mechanism for gripping the container body and the door part individually, the transport robot carrying the container body and the door part individually into the cleaning tank and carrying the container body and the door part individually out of the cleaning tank; Equipped with The gripping mechanism includes: a main body gripping portion having a pair of first gripping claws that can move toward and away from each other along a first straight line, and gripping the gripped portion using the pair of first gripping claws; a door gripping portion having a pair of second gripping claws that can move toward and away from each other along a second straight line that intersects with the first straight line in a top view, and gripping the door portion using the pair of second gripping claws; Equipped with The cleaning tank cleans the container body with the opening facing downward. Wafer container cleaning equipment.
2. a rotating member provided at a position where the first straight line and the second straight line intersect in a top view so as to be rotatable about an axis perpendicular to both the first straight line and the second straight line; a first guide member that supports the pair of first gripping jaws so as to be movable in a direction along the first straight line; a second guide member that supports the pair of second gripping jaws so as to be movable in a direction along the second straight line; a plurality of connecting members that connect each of the pair of first gripping claws and each of the pair of second gripping claws to the rotating member; a moving member that moves one of the pair of first gripping claws and the pair of second gripping claws, thereby moving all of the pair of first gripping claws and the pair of second gripping claws; The wafer container cleaning apparatus of claim 1 , comprising:
3. a pair of end portions of the pair of connecting members connected to the pair of first gripping jaws on the rotating member side are rotatably connected to the rotating member at positions symmetrical with respect to a rotation center of the rotating member, A pair of end portions of the pair of connecting members connected to the pair of second gripping jaws on the rotating member side are rotatably connected to the rotating member at positions symmetrical with respect to a rotation center of the rotating member.
3. The wafer container cleaning apparatus according to claim 2.
4. 4. The wafer storage container cleaning apparatus according to claim 3, wherein a first distance between a position where a pair of ends of a pair of connecting members connected to the pair of first gripping jaws on the side of the rotating member are connected to the rotating member and the center of rotation is different from a second distance between a position where a pair of ends of a pair of connecting members connected to the pair of second gripping jaws on the side of the rotating member are connected to the rotating member and the center of rotation.
5. 5. The wafer container cleaning apparatus of claim 4, wherein the second distance is greater than the first distance.
6. 2. The wafer storage container cleaning apparatus of claim 1, further comprising a control unit that controls the transport robot so that, when the container body is placed in the cleaning tank with the opening facing downward, the pair of first gripping claws grip the gripped portion from above and below, and the container body is transported out of the cleaning tank with the opening facing downward.
7. 2. The wafer storage container cleaning apparatus of claim 1, further comprising a control unit that controls the transport robot so that the container body is transported into the cleaning tank with the opening facing downward while the pair of first gripping claws grip the gripped portion from above and below.
8. The second gripping jaw includes: A rectangular first member; a second member extending from one side of the first member and a side opposite to the one side of the first member, the second member having a recess formed at an end portion opposite to the first member; an elastic body provided in the recess formed in the second member and having a groove formed therein; The wafer container cleaning apparatus of claim 1 , comprising: