Lighting module, lighting apparatus, and lamp

Abstract

To provide a lighting module that emits, in a line form, light that has been emitted from a plurality of light-emitting elements.SOLUTION: A lighting device 200 includes: a substrate 210; a plurality of light-emitting elements 100 disposed on the substrate; a first reflective member 230 disposed on the substrate; a resin layer 220 disposed on the first reflective member; a second reflective member 240 disposed on the resin layer; and a wavelength conversion layer 250 disposed on one surface of the resin layer facing the light-emitting surface 111 of the light-emitting element, in which a distance from the light-emitting surface to the one surface S1 may be 5 to 10 times a height of the resin layer.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] An embodiment of the invention relates to a lighting module having a plurality of light emitting elements. The embodiment is a lighting module for emitting surface light on different planes, comprising said lighting module The present invention relates to a lighting device, a light unit, a display device, and a vehicle lamp. [Background technology]

[0002] Lighting applications include not only vehicle lighting but also display and sign backlighting. Light-emitting elements, such as light-emitting diodes (LEDs), are used to replace existing light sources such as fluorescent lamps and incandescent lamps. Compared to conventional light sources, it consumes less power, has a semi-permanent lifespan, is fast in response, is safe, and is environmentally friendly. Such a light emitting device is useful in various applications such as various display devices, indoor and outdoor lights, etc. Recently, the light emitting element has been used as a light source for vehicles. Compared to incandescent lamps, light-emitting elements have the advantage of consuming less power. However, since the emission angle of the light emitted from the light emitting element is small, When used as a lamp, there is a demand for an increase in the light-emitting area of ​​the lamp using the light-emitting element. The small size of the light-emitting element allows greater freedom in lamp design. It is also economical due to its semi-permanent lifespan. Summary of the Invention [Problem to be solved by the invention]

[0003] The embodiment of the present invention is a lighting module that outputs light emitted from a plurality of light emitting elements in a line shape. An embodiment of the invention provides a light emitting device having a first light emitting surface with a line width or line height. The present invention provides a lighting module or lighting device having a resin layer on at least one side thereof. and an exit surface on at least one of the first surface and the second surface of the resin layer. An embodiment of the invention provides a lighting module or lighting device, comprising a resin layer having a line height. A lighting module including a layer having a wavelength conversion means on at least one side surface and an upper surface and / or a lower surface. An embodiment of the invention provides a light source or lighting device having a wavelength conversion means on at least one side of the resin layer. A lighting module or lighting device is provided that includes a layer having steps and / or ink particles. In the embodiment, a reflective member is disposed on the upper surface and / or the lower surface of a resin layer on which a plurality of light emitting elements are disposed. a layer having impurities on one side, an upper surface, and / or a lower surface of the resin layer; The present invention provides a module or lighting device. The present invention provides a lighting module for illuminating a light source and a lighting device having the same. It is possible to provide a light unit, a liquid crystal display device, and a vehicle lamp having a light module. Cut. [Means for solving the problem]

[0004] The lighting device according to an embodiment of the invention includes a substrate and a plurality of light emitting elements disposed on the substrate. a first reflecting member disposed on the substrate; and a resin disposed on the first reflecting member. a second reflecting member disposed on the resin layer, and a front reflecting member facing the light emitting surface of the light emitting element; The resin layer includes a wavelength conversion layer disposed on one surface of the resin layer, and the resin layer has a height greater than the light emitting surface. The distance between the surfaces may be 5 to 10 times.

[0005] The lighting device according to an embodiment of the invention includes a substrate and a plurality of light emitting elements disposed on the substrate. a first reflecting member disposed on the substrate; and a resin disposed on the first reflecting member. a second reflecting member disposed on the first region of the resin layer; and a second reflecting member disposed on the second region of the resin layer. a first pattern layer disposed on one surface of the resin layer facing the light emitting surface of the light emitting element; and a wavelength conversion layer formed on the first pattern layer, the first pattern layer being in the shape of a polygon, a circle or a line. It may include at least one of the following:

[0006] According to an embodiment of the invention, the polygons or circles of the first pattern layer are made of lines. The first pattern layer may include a plurality of interconnected patterns. The plurality of patterns may include a honeycomb structure pattern. The layer has a first shape and a second shape that is different from the first shape and is disposed within the first shape. The first pattern layer and the plurality of light emitting elements may be arranged vertically over each other. The second reflecting member does not have to overlap the light emitting element in the vertical direction. According to an embodiment of the invention, the area of ​​the second region is a surface area of ​​the first region. The area of ​​the second region may be 0.6 to 1 times the area of ​​the first region. The second pattern layer may be disposed on a region of the second reflective member. The first pattern layer and the second pattern layer may have a pattern having a regular shape or an irregular shape. The pattern shape of the first pattern layer and the pattern shape of the second pattern layer may be The shapes of the patterns may be different. The pattern of the second layer may vertically overlap an area of ​​the pattern of the second layer.

[0007] The lighting device according to an embodiment of the invention includes a substrate and a plurality of light emitting elements disposed on the substrate. a first reflecting member disposed on the substrate; and a resin disposed on the first reflecting member. a second reflecting member disposed on the first region on the resin layer; and a light emitting surface of the light emitting element. a wavelength conversion layer disposed on one surface of the resin layer facing the first reflector; and a second pattern layer disposed on the first pattern layer, the second pattern layer being a polygon, a circle, or a line. The shape may include at least one of the following:

[0008] According to an embodiment of the invention, the second pattern layer is disposed in front of the light emitting surfaces of the plurality of light emitting elements. The second pattern layer may be molded by the resin layer. The first region may not overlap the second pattern layer in a vertical direction. .

[0009] The lighting device according to an embodiment of the invention includes a substrate and a plurality of light emitting elements disposed on the substrate. a first reflecting member disposed on the substrate; and a resin disposed on the first reflecting member. a second reflecting member disposed on the first region on the resin layer; and a light emitting surface of the light emitting element. a wavelength conversion layer disposed on one surface of the resin layer facing the first reflector; a pattern layer disposed on at least one of the regions on the resin layer; The shape of the light emitted from the light emitting element and passing through the pattern layer is a polygonal or circular shape. It may include at least one of the following:

[0010] According to an embodiment of the invention, the optical fiber may include a colored ink layer disposed over the wavelength converting layer. The colored ink layer may include a red ink. According to an embodiment of the invention, The surface of the resin layer and the wavelength conversion layer are formed between a plurality of convex portions. Each of the plurality of protrusions is a corresponding one of the plurality of light emitting elements. It can correspond to the position of.

[0011] According to an embodiment of the present invention, the plurality of light emitting devices are of a side view type. The first reflecting member is a side-view type LED. The light emitting device may include a plurality of holes in which EDs are disposed. The light emitting surface may be spaced apart from the one surface by a first distance. The first distance corresponds to 10 mm to 15 mm, and the resin layer According to an embodiment of the invention, the height of the resin layer may be 1.5 mm to 1.6 mm. The one surface may include a curvature. The shape of the light may be a line shape. Effect of the Invention

[0012] According to an embodiment of the invention, through at least one side of the lighting module having a small thickness The luminosity of the emitted light can be improved. providing wavelength-converted light through at least one side of the resin layer, or The wavelength-converted light can be provided through one side and / or the other side. According to the embodiment, the wavelength-converted light is emitted through the emission surface of the resin layer and the upper surface adjacent to the emission surface. and / or extracting light emitted from the light emitting element. Thin lighting modules are provided in line light form, allowing greater freedom in design. The light uniformity of the emitted surface light can be improved. The optical reliability of the light source and the lighting device having the light source can be improved. The lighting module is used in vehicle lighting devices, light units, various display devices, and electric billboards. It can be applied to bulletin boards. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view showing an illumination device according to a first embodiment of the invention. [Diagram 2] FIG. 2 is a plan view of the lighting device of FIG. [Diagram 3] 3 is a cross-sectional side view of the lighting device of FIG. 2 taken along line A-A. [Figure 4] 3 is a cross-sectional view of the illumination device of FIG. 2 taken along line B-B. [Diagram 5] 4 is a first modified example of the emission section of the illumination device of FIG. [Figure 6] 4 is a second modified example of the emission section of the illumination device of FIG. [Figure 7] 3 is another example of the lighting device of FIG. 2. [Figure 8] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 9] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 10] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 11] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 12] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 13] 8 is a side cross-sectional view of a modification of the lighting device of FIG. 7. [Figure 14] FIG. 11 is a plan view showing an illumination device according to a second embodiment. [Figure 15] 15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 16] 15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 17]15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 18] 15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 19] 15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 20] 15 is a side cross-sectional view of a modification of the lighting device of FIG. 14. [Figure 21] 15 is another example of a side cross-sectional view of the lighting device of FIG. 1, FIG. 7, or FIG. [Figure 22] 15 is another example of a side cross-sectional view of the lighting device of FIG. 1, FIG. 7, or FIG. [Diagram 23] 15 is another example of a side cross-sectional view of the lighting device of FIG. 1, FIG. 7, or FIG. [Figure 24] 15 is another example of a side cross-sectional view of the lighting device of FIG. 1, FIG. 7, or FIG. [Diagram 25] 15 is another example of a side cross-sectional view of the lighting device of FIG. 1, FIG. 7, or FIG. [Figure 26] 4 is another example of a light-emitting element of a lighting device according to an embodiment of the invention. [Figure 27] This is an example in which a layer in which a phosphor is formed on one surface and / or the other surface of the lighting device of FIG. 1, FIG. 7, and FIG. 14 is extended to the third and fourth surfaces. [Figure 28] 15 is a plan view of a patterned layer on one and / or other side of the lighting device of FIG. 1, FIG. 7, and FIG. 14. [Figure 29] 13 is an example of a plan view of a lighting device according to a third embodiment of the invention. [Diagram 30] 13 is an example of a plan view of a lighting device according to a third embodiment of the invention. [Diagram 31] 1 is an example of a plan view of a lighting device for a vehicle lamp according to an embodiment of the invention; [Diagram 32] 1 is a front view of a light-emitting element applied to a lighting device according to an embodiment of the present invention; [Diagram 33] 33 is an example of a lighting device in which the light-emitting element of FIG. 32 is disposed on a circuit board. [Diagram 34] 1 is a plan view of a vehicle to which a lighting device or a lamp having a lighting device according to an embodiment of the invention is applied; [Diagram 35] 35 is a diagram showing a lamp having the lighting device or lighting module of FIG. 34. [Diagram 36] 29 is a diagram showing light distribution in the lighting module or lighting device of FIG. 28. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] BRIEF DESCRIPTION OF THE DRAWINGS The following description is made in conjunction with the accompanying drawings, in which: FIG. The preferred embodiment in which the invention can be readily put into practice will now be described in detail. The embodiment and the configuration shown in the drawings are merely preferred embodiments of the present invention and are not intended to be limiting of the present invention. It is to be understood that there are numerous equivalents and alternatives that may be used in place of these. In the detailed explanation of the operation principle of the preferred embodiment of the present invention, If it is determined that the detailed description of the present invention is difficult to understand, the details may be omitted. Each term described below is defined in consideration of the function in the present invention. As such, the meaning of each term should be interpreted based on the overall content of this specification. Throughout the drawings, parts having similar functions and actions are designated by the same reference numerals. The lighting device according to the present invention can be used in a variety of lamp devices that require illumination, such as vehicle lamps, It can be applied to home lighting devices and industrial lighting devices. For example, it can be applied to vehicle lamps. If you are driving, headlamps, width lights, side mirror lights, fog lights, tail lights, etc. mp), brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lights The lighting device of the present invention can be applied to indoor and outdoor advertising displays, back-up lamps, etc. It can also be applied to various electric vehicles, and is currently being developed for commercial use. It is being applied to all lighting-related fields and advertisements that can be realized through future technological developments. The present invention can be applied to various fields. The following examples are described with reference to the accompanying drawings and examples. In the description of the embodiments, each layer (film), region, pattern, etc. Or the structure is "above" or "below" the substrate, each layer (film), area, pad or pattern. When it is described that a layer is formed, the "top" and "bottom" are "directly" or "through another layer." In addition, the reference to the top or bottom of each layer is described with reference to the drawings. do.

[0015] <Lighting module or lighting device> FIG. 1 is a perspective view showing a lighting device according to a first embodiment of the invention, and FIG. 2 is a perspective view showing the lighting device of FIG. FIG. 3 is a cross-sectional view of the illumination device of FIG. 2 taken along the line A-A of FIG. FIG. 5 is a cross-sectional view of the illumination device taken along the line B-B, showing a first modified example of the first light exit surface of the illumination device shown in FIG. FIG. 6 shows a second modified example of the first light exit surface of the lighting device of FIG. 3, and FIG. 7 shows a second modified example of the first light exit surface of the lighting device of FIG. 8 to 13 are modified examples of the side cross-sectional views of the illumination device in FIG.

[0016] 1 to 6, a lighting module or device 200 according to an embodiment of the invention includes a base The plate 210, the resin layer 220, the wavelength conversion layer 250 and the plurality of light emitting devices 100 may be included. The lighting device 200 includes at least one of the resin layer 220 and the wavelength conversion layer 250. A second reflecting member 240 may be disposed on one or both of the illumination modules. The filter 200 includes at least one of the resin layer 220 and the wavelength conversion layer 250. The first reflecting member 230 may be disposed under the substrate. The first and second layers may be disposed above the plate 210 and below the resin layer 220. The reflecting members 230, 240 are capable of reflecting incident light.

[0017] The light emitted from the light emitting device 100 is guided to at least one of the sides of the resin layer 220. The illumination module can emit light in a planar form through the wavelength conversion layer 250 or through the wavelength conversion layer 250. The module 200 has a line-shaped side, an emission surface or a transparent The lighting module 200 has a surface facing the light emitting surfaces of the plurality of light emitting elements 100. The resin layer 220 has at least one surface having a certain height or thickness. At least one side and one surface (or top surface) of the wavelength conversion layer 250 may be exposed. At least one side and one surface (or top surface) and / or the other surface (or bottom surface) can be exposed. The lighting module or device 200 has a first surface S1 and a second surface S2 arranged opposite each other. The front surface S2, and a third surface S3 and a fourth surface S4 disposed opposite each other. The first and second surfaces S1, S2 extend in a long length in a first direction, and the third and The four faces S3, S4 may extend in a long length in a second direction. The three directions can be mutually perpendicular or can intersect at acute or obtuse angles. The third direction is the perpendicular direction. Alternatively, the illumination direction may be a thickness direction, which is a direction perpendicular to the first and second directions. In the module 200, at least a portion of the first surface S1 and the second surface S2 are opposed to each other. At least a portion of the third surface S3 and the fourth surface S4 may be disposed so as to face each other. The third surface S3 and the fourth surface S4 may be arranged to face each other or to be offset from each other. The surface S1 and the second surface S2 may be different side surfaces. The small distance may be smaller than the minimum distance between the third surface S3 and the fourth surface S4.

[0018] In the lighting module 200, the first surface S1 and the second surface S2 are arranged in one direction or in a first direction. It may have a long length in the direction X and may be extended in a bar or line shape. The first surface S1 is a surface facing the light emitting surface 111 of the light emitting element 100, or a surface facing the resin layer 2. 20 or the side surface of the wavelength conversion layer 250 from which light with the highest luminous intensity is emitted. The first surface S1 may be a first emission surface facing the light emitting surface 111. Although the light emitting device 100 has been described as having a light emitting surface 111 on a single side, Depending on the type of light source, the lighting module can emit light from two or more sides or four or more sides. In the device 200, the light emitting elements 100 are arranged in a first direction or in a second direction. The light emitting elements 100 may be arranged along an area adjacent to the second surface S2. The light emitting devices 100 arranged in at least one row may be connected to each other. The imaginary line may include a straight line or a curved line. The light emitting elements may be arranged in two rows, and the light emitting elements in the first and second rows may have a first surface S1 and The second surfaces S2 may be arranged so as not to overlap each other in the column direction (for example, the Y direction). The plurality of light emitting elements 100 arranged in the first direction X are arranged on the first surface S1 or the first light emitting surface S2. The light emitting surfaces 111 of the light emitting elements 100 may face the The light emitted from the light emitting device 100 may face the first exit surface or the first surface S1. The light is emitted through the first surface S1, and a part of the light is reflected by the second surface S2, the third surface S3 and / or the second surface S4. Or it is emitted through the fourth surface S4.

[0019] As shown in FIG. 2 to FIG. 5, the lighting module 200 has a first length X1 in a first direction X. The first length X1 may be longer than the second length Y1 in the second direction Y. The distance between the second direction and the second electrode can be changed by changing the number of the second electrode. For example, the distance between the second direction and the second electrode can be 30 mm or more. The length Y1 can have a length of 13 mm or more, or a length of 16 mm or more, or a length of 20 mm or less. The second length Y1 of the lighting module 200 is an area in which the emitted light of the light emitting element 100 is diffused. In addition, the light emitting device 100 can be protected from the rear of the light emitting device 100. When the minimum distance between the two light emitting elements 100 is G1, the first length X1 is twice the distance G1. The second length Y1 may be greater than twice the distance G1, and the second length Y1 may be less than or equal to twice the distance G1. G1 may be 10 mm or more, for example, in the range of 10 mm to 15 mm.

[0020] As shown in FIG. 2 and FIG. 3, the light emitting surface (or one surface) of the light emitting element 100 and the first surface S1 The distance D1 between the other surface of the light emitting element 100 and the distance D5 between the second surface S2 may be different. For example, the relationship between the light emitting element 100 and the second surface S The distance D5 between the two can be 3 mm or more, for example in the range of 3 mm to 20 mm. The distance D5 between the light emitting element 100 and the second surface S2 can be set to be within the above range. If the surface is smaller, the area through which moisture can penetrate and form circuit patterns is smaller, If the range is larger, the size of the lighting module 200 will be large. In FIG. 00, the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 are perpendicular to the third direction Z. They may be provided with straight planar surfaces or may include at least one curved or angled surface. The first surface S1, the second surface S2, the third surface S3 and the fourth surface S4 have the same thickness in the third direction Z. For example, the first surface S1, which is the first exit surface, may have a vertical The resin layer 220 may be a flat surface or a convex curved surface having a curvature. The wavelength conversion layer 250 may include the second surface S2, the third surface S3, and the fourth surface S4. , the first surface S1, the third surface S3 and the fourth surface S4.

[0021] The wavelength conversion layer 250 is disposed on the outer side of the resin layer 220. 2, S3, and S4 may be the outermost surface of the resin layer 220 or the wavelength conversion layer 250. The wavelength conversion layer 250 may be disposed on the side of the first surface S1, or on the third surface S3 or / and The wavelength conversion layer 250 may be disposed on a part of the fourth surface S4 or on the entire side surface S4. When the wavelength conversion layer 250 contacts the outer surface of the resin layer 220, the interface S a may be disposed along the region where the wavelength conversion layer 250 is formed. For example, The boundary surface Sa is formed by arranging the first surface S1 or one of the first surface S1, the third surface S3, and the fourth surface S4. That is, the wavelength conversion layer 250 may be disposed along the first portion of the resin layer 220. The resin layer 220 may be disposed on the surfaces corresponding to the surfaces S1, S3, and S4. The substrate 210 may include a substrate 212 that surrounds one or more light emitting devices 100. The resin layer 220 may be arranged so as to seal the light emitting device 100. The resin layer 220 may be in contact with the light emitting device 100. At least three or more optical elements 100 are arranged in the first direction, and the resin layer 22 The plurality of light emitting elements 100 are disposed within the substrate 210 and the second reflecting member 240. The resin layer 220 is made of a light-transmitting material such as silicone or epoxy. The resin layer 220 may include a glass material as another material. The resin layer 220 may be a layer without impurities or may contain impurities such as a diffusing agent. The first reflecting member 230 is disposed between the resin layer 220 and the substrate 210. The first reflecting member 230 may not be formed, and a reflecting material may be formed on the upper surface of the substrate 210. can be formed.

[0022] The substrate 210 is a printed circuit board (PCB). oard), such as resin-based printed circuit boards (PCBs), metal cores (Met Al Core PCB, Flexible PCB, Ceramic PCB The substrate 210 may be a flexible or rigid substrate. The substrate 210 may be made of a metal material, and may have a circuit pattern disposed thereon. The circuit pattern of the substrate 210 has a plurality of pads in an area corresponding to the light emitting device 100. The light emitting devices 100 are electrically connected to the substrate 210. The light emitting elements 100 have bonding parts at their bottoms. The light emitting devices 100 are electrically connected to the pads of the substrate 210. The plurality of electrodes may be connected in series by a circuit pattern on the substrate 210. The light emitting devices 100 are connected in parallel or in a group of two or more by the circuit pattern of the substrate 210. The groups of serially connected light emitting diodes may be connected in parallel. The rear region of the optical element 100 is the region opposite the region from which light is emitted. A circuit pattern for connecting the light emitting element 100 is disposed in the rear region. The width of the rear region varies depending on the number of the light emitting elements 100 or the manner in which the light emitting elements 100 are connected. The width of the region is the distance D5 between the light emitting element 100 and the second surface S2, and is 3 mm or more. This can prevent moisture from penetrating from the rear of the light emitting element 100. A circuit pattern for connecting the light emitting devices 100 may be formed.

[0023] The light emitting device 100 may be a device having a light emitting chip or a LED chip packaged in a package. The light emitting chip can include a package that emits blue, red, green, ultraviolet ( The light emitting device 100 can emit at least one of white, blue, and UV. The light emitting element 100 can emit at least one of white, red, and green light. The light emitting element 1 emits light in the lateral direction and has a bottom portion disposed on the substrate 210. 00 is a side view type package or one side is exposed The light emitting device 100 may be a package having a light surface 111. The LED chip may be an LED chip, and one side of the LED chip is open and the other side is provided with a reflective member. Alternatively, an LED chip is disposed on the substrate 210, and the upper surface and The light emitting surface 111 of the light emitting device 100 can emit light from the front and side. The substrate 210 may be disposed adjacent to the surface thereof, for example, on a side surface adjacent to the top surface of the substrate 210. The light emitting surface 111 is disposed on a side surface between the bottom and top surfaces of the light emitting element 100, and The light emitting surface 111 of the light emitting element 100 emits light in the second direction Y. The upper surface of the substrate 210 and the upper surface of the first reflecting member 230 are adjacent to each other. The height of the light emitting element 100 may be in the range of 1 mm to 2 mm. For example, the range may be 1.2 mm to 1.8 mm. As shown in FIG. 4, the distance G1 between the light emitting elements 100 is 10 mm or more, for example, 10 mm. The thickness of the outermost light emitting element 100 and the resin layer 2 can be in the range of 100 to 15 mm. The distance G2 between the third or fourth side S3, S4 of 20 may be smaller than the gap G1. The distance D1 is preferably 90 mm or less than the gap G1. %, for example, in the range of 90% to 120%, and the interval G1 is the distance It can be varied by D1.

[0024] The length of the light emitting device 100 in the first direction X may be greater than the height of the light emitting device 100. For example, the height of the light emitting element 100 may be 1.5 times or more. The element 100 has a small height and a long length in the first direction X. It is possible to provide a wide light emission angle in a first direction X, which is the left-right direction with respect to the center. Here, the light emission angle of the light emitting element 100 in the first direction X is The light output angle of the light emitting device 100 in the second direction Y may be larger than 110 degrees. 3, the thickness of the substrate 210 may be in the range of 1 to 160 degrees. Za may be smaller than the height of the light emitting element 100. The height of the light emitting element 100 is The thickness Za of the substrate 210 may be more than twice as large as the thickness Za of the substrate 210, for example, in the range of 2 to 4 times. Since the thickness Za of the substrate 210 is small, the lighting module 200 is provided as a flexible plate.

[0025] The resin layer 220 may cover the light emitting device 100 on the substrate 210 . The second reflecting member 240 may cover an upper surface of the resin layer 220. The resin layer 220 may contact the upper surface and the side surface of the light emitting device 100. , may contact the upper surface of the first reflecting member 230. The first reflecting member 230 may come into contact with the substrate 210 through a hole 232. The resin layer 220 may be in contact with the light emitting surface 111 of the light emitting device 100. The first surface S1, the second surface S2, the third surface S3 and the fourth surface S4 of the resin layer 220 are The upper surface of the resin layer 220 may be a side surface between the first and second reflecting members 230 and 240. The area is the area of ​​the top surface of the substrate 210, the area of ​​the top surface of the first reflecting member 230, or the area of ​​the top surface of the second reflecting member 230. The length of the resin layer 220 in the first direction may be equal to the area of ​​the bottom surface of the reflecting member 240. The length of the substrate 210, the length of the first reflecting member 230 and / or the length of the second reflecting member 24 The maximum width Y1 of the resin layer 220 in the second direction may be equal to the length of the substrate 210. the maximum width of the first reflecting member 230 and / or the maximum width of the second reflecting member 240 In another example, the upper surface area of ​​the resin layer 220 may be equal to the maximum width of the substrate. In this structure, the area of ​​the upper surface of the substrate 210 may be smaller than that of the upper surface of the substrate 210. The edge may protrude outward beyond the edge of the lower surface of the resin layer 220. The resin layer 220 is disposed between the first and second reflecting members 230 and 240. A portion of the first reflecting member 20 is disposed between the substrate 210 and the second reflecting member 240. The upper surface of the second reflecting member 240 and the lower surface of the resin layer 220 face each other at the upper surface. The upper surface of the first reflecting member 230 and the lower surface of the second reflecting member 240 may be the same. In this way, the resin layer 220 can prevent light from being emitted from the light emitting device 100. The emitted light and the light reflected by the first and second reflecting members 230 and 240 are diffused in the lateral direction. can be guided to.

[0026] The resin layer 220 is formed to have a thickness Zb or height greater than the height of the light emitting device 100. In this way, the resin layer 220 can protect the upper part of the light emitting device 100 and prevent moisture. The light emitting device 100 has a substrate 210 disposed on the bottom thereof. Since a resin layer 220 is disposed on the upper portion, the light emitting device 100 can be protected. Therefore, the distance between the upper surface of the resin layer 220 and the light emitting element 100 is 0.5 mm or less, e.g. For example, the thickness Zb of the resin layer 220 may be in the range of 0.2 mm to 0.5 mm. is the distance between the first and second reflecting members 230, 240, The distance (for example, Zb) between the reflecting members 230 and 240 is the distance between the first surface S1 and the second surface S2. For example, the distance between the first surface S1 and the second surface S2 may be smaller than the distance between the first surface S1 and the second surface S2. , maximum distance or minimum distance. The distance between 0 and 240 is set to be smaller than the width Y1 or the minimum width of the lighting module 200 in the second direction. By arranging the lights closely together, it provides a linear surface light, improving the luminosity and preventing hot spots. It is also possible to provide a lighting module that is flexible in the third direction. The thickness Zb of the resin layer 220 may be less than twice the thickness of the light emitting element 100. The thickness Zb of the resin layer 220 may be, for example, more than 1 time and less than 2 times. For example, the range is 1.5 mm to 1.9 mm or 1.5 mm to 1.6 mm. The thickness Zb of the resin layer 220 is 0.5 times the thickness Z1 of the lighting module 200. 8 times or less, for example, 0.4 to 0.8 times the thickness Z1 of the lighting module 200. The resin layer 220 may have a thickness of 0.8 times that of the lighting module 200. Since the difference between the height Z1 and the height Z2 is 1.2 mm or less, the light efficiency of the lighting module 200 is improved. The resin layer 220 can prevent deterioration and enhance flexibility. Silicone molding compound (SMC), epoxy, or epoxy moulding compound (EPMC) The resin may include at least one of the following: The oil layer 220 is made of a UV (ultra violet) curable resin or a thermosetting resin material. For example, PC, OPS, PMMA, PVC, etc. may be selectively included. For example, the main material of the resin layer 220 is a urethane acrylate oligomer. In the resin layer 220, beads (not shown) may be formed. The beads may include a diffusing and reflecting element that diffuses and reflects incident light to reduce the amount of light. The resin layer 220 may include a phosphor. The phosphor content may be lower than that of the other resin layers, and may be yellow, green, blue, or may include at least one of the red phosphors.

[0027] The first reflecting member 230 can reflect the light emitted from the light emitting device 100. The first reflecting member 230 is formed on the upper surface of the substrate 210. The member 230 may be formed as a top layer on the substrate 210 or may be formed as a separate layer. The first reflecting member 230 may be attached to the upper surface of the substrate 210 with an adhesive. The resin layer 220 may be attached to an upper surface of the first reflecting member 230. The light-emitting member 230 has a plurality of holes 232 in an area corresponding to the lower surface of the light-emitting device 100. The light emitting device 100 is connected to the substrate 210 through the hole 232. A portion of the oil layer 220 may contact the substrate 210 through the hole 232. The hole 232 is a region where the light emitting device 100 is bonded to the substrate 210. The first reflecting member 230 may be formed in a single layer or multi-layer structure. The first reflecting member 230 includes a material that reflects light, such as a metal or a non-metal material. When the first reflecting member 230 is made of metal, it can be made of stainless steel, aluminum (Al ), it can contain a metal layer such as silver (Ag), and if it is a non-metallic material, it is a white resin material. It is a material that is filled with metal oxide and / or air in the resin, or it is a plastic The first reflective member 230 may be made of a white resin material or a polyester material. The first reflective member 230 may include a low reflection film, a high reflection film, a PET film, etc. It may include at least one of the following: a film, a diffuse film, or a specular film. The first reflecting member 230 may be, for example, a positive reflector for reflecting incident light to a first surface S1. It may be provided as a reflective film.

[0028] One end of the first reflecting member 230 may be disposed on the same plane as the first surface S1. The other end of the first reflecting member 230 may be disposed on the same plane as the second surface S2. The first reflecting member 230 has one end and the other end spaced apart from the first surface S1 and the second surface S2. The first reflecting member 230 may be in contact with the resin layer 220. The first reflective member may be covered with a layer 220 to prevent moisture from penetrating. The thickness Zc of the first reflector 230 may be smaller than the thickness Za of the substrate 210. The thickness Zc of the substrate 230 is set to be 0.3 times or more the thickness Za of the substrate 210. The thickness Zc of the first reflecting member 230 can be set to 0.1 mm to 0.5 mm. If the thickness is smaller than this range, light transmission loss occurs and the If the thickness is greater than this range, the thickness Z1 of the lighting module 200 increases. The thickness Zd of the second reflecting member 240 may be smaller than the thickness Za of the substrate 210. The thickness Zd of the substrate 40 is set to be 0.3 times or more the thickness Za of the substrate 210. The transmission loss can be reduced. The thickness Zd of the second reflecting member 240 is 0.1 mm to 0. If the thickness is smaller than the range, a loss in light transmission occurs, and If the thickness is greater than the range, the thickness Z1 of the lighting module 200 is increased. The reflective layer 220 is disposed over the entire upper surface of the resin layer 220 to reduce light loss. The second reflecting member 240 may be made of the same material as the first reflecting member 230. The reflecting member 240 is a member that is disposed on the first reflecting member 230 in order to reflect light and reduce the transmission loss of light. The second reflective member 2 may have a higher light reflectance or a larger thickness than the first reflective member 2. The first reflecting member 40 may have a thickness equal to or greater than that of the first reflecting member 230. For example, the first and second reflecting members 230 and 240 may be provided with the same material and the same thickness. The second reflecting member 240 may be formed in a single layer or a multi-layer structure. The member 240 may include a material that reflects light, such as a metal or a non-metallic material. When the second reflecting member 240 is made of a metal, it is preferably made of stainless steel, aluminum (Al), silver (Ag If it is a non-metallic material, it may be made of white resin or resin. Materials that contain metal oxide and / or air in the oil, or plastic materials The second reflecting member 240 may be made of a white resin material or a polyester (PET) material. The second reflecting member 240 may include a low reflection film, a high reflection film, a diffusing ... The optical element may include at least one of a reflecting film, a specular reflecting film, or a reflecting film. The second reflecting member 240 is, for example, a regular reflection film so that the incident light travels in the direction of the first surface S1. Here, the first surface S1 may have a light extraction structure, such as a concave-convex structure, disposed thereon. This can improve the extraction efficiency of the light emitted through the resin layer 220. A first overlapping region that overlaps the light emitting element 100 in the horizontal direction on the first surface S1, A second overlap region that overlaps horizontally with the region between the elements may be disposed in the same plane. For example, the second overlapping region is recessed in a second surface direction from the first overlapping region, or the first overlapping region is recessed in a second surface direction from the first overlapping region. The overlapping area may protrude from the second overlapping area in a convex shape. The haze surface is treated to diffuse light. The other side of the layer 220 is treated to have a rougher surface, which can diffuse the light emitted therefrom. The module 200 provides a thickness Z1 in the third direction in the form of a line, so that it is flexible. The lighting module 200 may provide a line-shaped surface light. That is, the lighting module 200 has at least one side As another example, the lighting module can emit a line-shaped surface light of 3 mm or less. The lighting module 200 is arranged to be greater than 2 mm and less than 6 mm in length. In this case, the lighting module 2 00 thickness is increased, but the thickness of the resin layer 220 is provided to be thicker to increase the line width, The light distribution area can be increased.

[0029] Referring to FIG. 3, the thickness of each component of the lighting module 200 is as follows: The thickness of the resin layer 220 is Zb, and the thickness of the first reflecting member 230 is When Zc and the thickness of the second reflecting member 240 is Zd, the relationship Zb>Za>Zd≧Zc is satisfied. The space between the bottom surface of the substrate 210 and the top surface of the second reflecting member 240 may include a space between the bottom surface of the substrate 210 and the top surface of the second reflecting member 240. The distance is the thickness Z1 of the lighting module 200. The thickness Zb is 0.4 to 0.8 of Z1. The thickness Za is a ratio of Z1 to Z2 of 0.14 to 0.18, and the thickness Zd is also The ratio of Zc to Z1 may be 0.08 to 0.12. The ratio of Zb to Za may be 3. The ratio of Zb to Zc or Zd can be 5.8 to 6.4. The thickness Zb of the resin layer 220 can be set to be smaller than the thickness Za of the substrate 210. By disposing it thickly, it is possible to protect the light emitting element 100 and to diffuse and guide the light. The sible properties can be enhanced. In addition, the thickness Zb or height of the resin layer 220 can be Since the first light exit surface is provided in a line shape, a line light exit surface can be provided. The distance D1 between the light emitting surface 111 of the light emitting element 100 and the first surface S1 is The thickness Zb or height of the insulating layer 10 can be 5 times or more, for example, in the range of 5 to 10 times. The distance D1 may be 10 mm or more, for example, in the range of 10 mm to 15 mm. The distance D1 from the light emitting surface 111 of the light emitting element 100 to the first exit surface or the first surface is If the thickness of the oil layer 220 is less than 5 times the thickness Zb, the surface light source distribution becomes non-uniform. In this case, the improvement in the distribution of the surface light source becomes insignificant compared with the increase in the module size.

[0030] The wavelength conversion layer 250 is disposed on the outer surface of the light-emitting side of the resin layer 220. The first surface S1 is disposed on the emission surface of the wavelength conversion layer 250. The wavelength conversion layer 250 may be arranged to face the light emitting surface 111 of the semiconductor device 100. The thickness of the wavelength conversion layer 2 may be equal to or greater than the thickness Zb of the resin layer 220. The thickness of the resin layer 220 is Zb, and the thickness of the first and second reflecting members 230 and 24 is 0, Z a , Z b , or Z c . That is, the wavelength conversion layer The vertical thickness of 250 is equal to or less than the distance between the upper surface of the substrate 210 and the second reflecting member 240. or may be equal to or greater than the distance between the upper and lower surfaces of the resin layer 220. The inner surface of the first insulating film 50 contacts the resin layer 220, and the lower surface of the first insulating film 50 contacts the substrate 210 and the first insulating film 220. The wavelength conversion element 230 may contact at least one or both of the wavelength conversion elements 230. The upper surface of the transfer layer 250 may contact the second reflecting member 240. The length conversion layer 250 covers the outer surface (i.e., Sa) of the resin layer 220 and prevents penetration from the outside. Here, the outer surface or the first surface S1 of the wavelength conversion layer 250 can be blocked. The side of the substrate 210 and / or the second reflecting member 240 may be flush with each other. The wavelength conversion layer 250 has a width D3 in the horizontal second direction Y of 0.7 mm or less, for example, 0.3 mm. The width D may be in the range of 0.01 to 0.7 mm or in the range of 0.3 mm to 0.5 mm. The length Y3 may be smaller than the length Y1 of the resin layer 220 in the second direction, for example, 1 / 30 or less of D2. The wavelength converting layer 250 may include a wavelength converting means therein. The wavelength conversion means may include a phosphor and / or a quantum dot. Quantum dots are available in a variety of colors, such as amber, yellow, green, red, and red. The wavelength conversion layer 2 can emit at least one or more of blue light. The content of the wavelength converting means added to the wavelength converting layer 50 is 13 wt % or more of the weight of the wavelength converting layer 250. The fluorescent material may be added in a range of 13 wt % to 60 wt %. The content of the light body can be changed by the emitted light intensity and wavelength conversion efficiency. The light emitted through the wavelength conversion layer 250 is the first light emitted from the light emitting device 100. The first light and the second light that have been wavelength-converted in the wavelength conversion layer 250 may be mixed. The mixed light of the second light may be red or white. The ink particles may include a powder and / or ink particles. The ink particles may include at least one of a hardened ink, a hardened ink, or a cured ink. The size of the ink particles may be smaller than the size of the phosphor. The ink particles may be any one of red, yellow, and blue. PVC (Polyvinyl chloride) ink, PC (Polycarbonate) nate) ink, ABS (acrylonitrile butadiene sty rene copolymer) ink, UV resin ink, epoxy ink, silicone ink Ink, PP (polypropylene) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS (Pol 0.01% to 0.01% by weight of the ink, wherein the ink particles are The width or diameter of the may be 5 μm or less, for example, in the range of 0.05 μm to 1 μm. At least one of the ink particles may be smaller than a wavelength of light. The child material can contain at least one of the following colors: red, green, yellow, and blue. For example, the phosphor may emit red wavelengths and the ink particles may include a red color. Here, when ink particles and a wavelength conversion means are added together in the wavelength conversion layer 250, In this case, the ink particles can reduce the transmittance of incident light, and in the power off mode, The wavelength converting layer 25 can be used to provide an external color that is the same as the ink color. In the case of 0, the content of the wavelength conversion means is reduced to 20 wt % or less by the ink particles. This can be done.

[0031] In the manufacturing process of the lighting module, for example, the light emitting element 100 is mounted on the substrate 210. Then, a resin layer 220 is placed on the substrate 210, and a first reflecting member 230 is attached. After forming the resin layer 220, the wavelength conversion layer 250 can be formed. After the wavelength conversion layer 250 is formed, the second reflecting member 240 may be attached. After forming the resin layer 220, the second reflecting member 240 is attached. A wavelength converting layer 250 may be formed on the side.

[0032] Referring to FIG. 5, the lighting module or device includes a resin layer 220 on the substrate 210. 2, the wavelength-converting layer 250 and the colored ink layer 252 can be included. The color ink layer 252 may include ink particles. The ink particles can reduce the transmittance of light without converting the wavelength of the light. In addition, the colored ink layer 252 is generated on the light emitting surface 111 of the light emitting element 100. Hot spots are visible from the outside, so you can prevent them by reducing light transmittance. The colored ink layer 252 can be removed when the power is off. When the power is turned on, the wavelength-converted light by the wavelength conversion means and the emitted light are provided. The colored ink layer 252 can transmit light emitted from the element 100. The color ink layer 25 can face the light emitting surfaces 111 of the plurality of light emitting elements 100. 2 has a first surface S1 disposed on the outside, and the outer surface of the wavelength conversion layer 250 can be in contact with the inner surface. The color ink layer 252 is disposed on the first surface S1 or on the first surface S1 and the third and fourth surfaces S2 and S3. As shown in Figs. 2 and 5, The wavelength conversion layer 250 or colored ink layer 252 arranged on the outermost side further expands the light emitting area. The height or thickness of the colored ink layer 252 in the vertical third direction Z is The height or thickness of the colored ink in the vertical direction Z may be the same as that of the wavelength conversion layer 250. The height or thickness of the resin layer 252 is equal to or greater than the height or thickness of the resin layer 220. The width of the colored ink layer 252 in the horizontal second direction Y may be The inner surface of the colored ink layer 252 may be in contact with the wavelength conversion layer 250. The lower surface of the first reflecting member 230 is in contact with the substrate 210. The upper surface of the colored ink layer 252 may be in contact with the second reflective portion 251 or may be in contact with both of the colored ink layer 252 and the second reflective portion 251. The colored ink layer 252 can be brought into contact with the wavelength conversion material 240. Covers the outer surface of the conversion layer 250 to control the color of emitted light and non-emitted light in power on or off mode. The difference in light surface color can be reduced. The first surface S1 is flush with the side surface of the substrate 210 and / or the second reflecting member 240. As shown in FIG. 3 and FIG. 6, a wavelength conversion layer 250 is disposed on the emission side of the light emitting element 100. When the wavelength conversion layer 250 is disposed on the substrate 210, the outer surface, i.e., the first surface S1 of the wavelength conversion layer 250 is The wavelength conversion layer 2 may be flush with the side surface of the second reflecting member 240. 50 is disposed between the first and second reflecting members 230, 240 or between the first and second reflecting members 230, 240. The second reflecting member 240 may be made of a resin. The second reflecting member 240 may expose a part of the resin layer 220. As shown in FIG. 7 and FIG. 8, the upper surface of the wavelength conversion layer 250 can be partially exposed. The surface is disposed outside the second reflecting member 240 or is exposed from the second reflecting member 240. The inner surface of the wavelength conversion layer 250 may be in contact with the outer surface of the resin layer 220. The upper portion of the wavelength conversion layer 250 may contact the side of the second reflecting member 240. The upper surface of the second reflecting member 240 may be flush with the upper surface of the second reflecting member 240. That is, the wavelength-converting layer 250 can further increase the light-emitting area.

[0033] As shown in FIG. 9, the resin layer 220 can contact the periphery of the top surface of the substrate 210. The resin layer 220 may be in contact with a side surface of the first reflecting member 230. 50 is a side surface of the substrate 210, a side surface of the resin layer 220, and a side surface of the second reflecting member 240 on the emission side. The wavelength conversion layer 250 may contact at least one of the surfaces of the substrate 2. 10 and / or the second reflecting member 240, The vertical height or thickness of the wavelength-converting layer 250 can be The thickness of the wavelength conversion layer 250 may be the same as that of the illumination module 200. The second reflecting member 24 contacts one of the sides of the module 200 to suppress the penetration of moisture. As shown in FIG. 8 and FIG. 9, the wavelength conversion layer 250 includes the wavelength conversion means disclosed above, or includes the wavelength conversion means and ink particles. It is possible to do so.

[0034] As shown in FIG. 10, the resin layer 220 can be in contact with the periphery of the top surface of the substrate 210. The resin layer 220 may be in contact with a side surface of the first reflecting member 230. The reflecting layer 250 is disposed on the side of the substrate 210, the side of the resin layer 220, and the second reflecting member 24 on the light emitting side. The wavelength conversion layer 250 may contact at least one of the sides of the The side of the substrate 210 and / or the second reflecting member 240 may be covered. The ink layer 252 is disposed on the outer side of the wavelength conversion layer 250 and is used to The wavelength conversion layer 250 and the colored ink layer 252 can cover the side areas. The vertical height or thickness may be the same as the thickness of the lighting module 200. As such, the colored ink layer 252 is disposed on the outer surface of the wavelength-converting layer 250 and on the underside and The first color ink layer 252 may include extensions Ia and Ib extending to the upper surface. The extension Ia extends to the lower surface of the wavelength conversion layer 250 and can contact the substrate 210. The second extension Ib of the colored ink layer 252 extends onto the upper surface of the wavelength conversion layer 250. 1 can contact the reflective member 240. As shown in FIG. The wavelength conversion layer 250 is disposed on the outer surface of the substrate 210 and / or the second reflecting member 240. Here, the wavelength conversion layer 250 may extend to and contact the side of the substrate 210. The second reflecting member 240 may be disposed between the first reflecting members 240 and may be smaller than the vertical height of the colored ink layer 252. As shown in Figs. 10 to 12, the wavelength conversion layer 250 is made of the wavelength conversion means disclosed above. The colored ink layer 252 may include the ink particles disclosed above. As shown in FIG. 13, the inside of the wavelength conversion layer 250 is made up of the substrate 210 and the second reflecting member 24. 0 or protrudes toward the light emitting element 100, and the upper portion Pb is The lower portion Pa is disposed on the outer side of the substrate 210. 0 indicates the outer surface of the resin layer 220, the edge and side of the lower surface of the second reflecting member 240, and the substrate 210 The underside edges and sides of the can be contacted.

[0035] The material of the wavelength conversion layer 250 and / or the colored ink layer 252 includes a transparent material, The wavelength conversion layer 250 may be formed selectively from the materials of the resin layer 220 disclosed in. Or / and the material of the colored ink layer 252 is the same as that of the resin layer 220 or at least In the lighting module disclosed above, the second reflecting member 24 may be different from the first reflecting member 24. 0 may be removed when other mechanisms are installed or when a housing is installed. The second reflecting member 240 may be formed of a light-shielding layer or a light-shielding plate.

[0036] Here, the embodiment of the invention is a resin layer 220 that converts the wavelength of light in the direction of emission or in the horizontal direction. 2. An example in which a wavelength conversion layer 250 is disposed or a wavelength conversion layer 250 and a colored ink layer 252 are disposed. As another example, the resin layer 220 may have at least one layer of resin material in a vertical direction. The layer or layers may be a single layer or a shaped layer. The single layer or the patterned layer may be a resin layer having a pattern. The single layer or the patterned layer may be disposed on one or the other side of the layer 220. The structure may be disposed on a part of the upper surface and / or a part of the lower surface of the fat layer 220. This will be explained in detail in the embodiment.

[0037] FIG. 14 is a plan view showing a lighting module according to a second embodiment, and FIGS. 21 to 25 are side sectional views of the lighting module of FIG. 14, and FIG. 15 is another example of a side cross-sectional view of the lighting module of FIG. 14.

[0038] 14 and 15, the lighting module includes a substrate 210, a resin layer 220, a wave A long conversion layer 250, a light emitting device 100 and at least one reflecting member 230, 240 and The first pattern layer 255 may include a transparent resin material. The resin material may be selected from the materials of the resin layer 220. The first pattern layer 255 may include a wavelength conversion means therein. The ink layer 255 may contain ink particles and wavelength conversion means therein.

[0039] The first pattern layer 255 has a length in the first direction X that is equal to or longer than the length of the resin layer 220. The first pattern layer 255 may be disposed longer than the resin layer 220 in the second direction Y. For example, the light emitting device 100 and the first surface 110 may have a length D6 smaller than the length The distance D1 between the first pattern layer 2 in the second direction may be equal to or smaller than the distance D1 between the first pattern layer 2 in the second direction. The length D6 of 55 can be 2 mm or more, for example, in the range of 2 mm to 10 mm. When the wavelength converting means is added to the first pattern layer 255, the wavelength converting layer 250 is doped The content of the wavelength converting means may be smaller than the content of the wavelength converting means formed in the first pattern layer 255. When a wavelength conversion means is added to the conversion layer 250, for example, a fluorescent light emitting the same color wavelength is generated. The light emitting diodes may be semiconductors and / or quantum dots, or may be materials that emit different color wavelengths. The first pattern layer 255 is configured to receive a part of the light traveling in the direction of the first surface S1 through the resin layer 220. The first pattern layer 255 can transmit light and emit it as wavelength-converted light. , disposed on the first region of the resin layer 220, so that the second reflecting member 240 is disposed on the first region of the resin layer 220. The first pattern layer 255 is disposed on the second region of the resin layer 220. The first reflecting member 230 and the substrate 210 can be overlapped in the vertical direction. The first pattern layer 255 does not have to overlap the light emitting element 100 in the vertical direction. The pattern layer 255 may contact the top surface of the resin layer 220. The first pattern layer 255 may contact a side surface of the second reflecting member 240. 255 contacts the upper surface of the wavelength conversion layer 250 or overlaps the wavelength conversion layer 250 in the vertical direction. The thickness of the first pattern layer 255 may be the thickness of the second reflective member 240. The light emitted through the first surface S1 is the main light. In this case, the light emitted through the first pattern layer 255 may be sub-light.

[0040] Here, the second reflecting member 240 is extended to a length that covers the upper surface of the light emitting device 100. The distance D8 from one end of the second reflecting member 240 to a line perpendicular to the light emitting surface 111 is The second reflection may be provided in a range of 3 mm or more, for example, 3 mm to 6 mm. The front end of the member 240 covers the upper portion of the light emitting device 100. The area where hot spots occur on the surrounding area adjacent to 100 can be reduced. 14 and 15, the length D6 of the first pattern layer 255 in the second direction Y is 8, for example, 5 mm or more, or 5 mm to 10 mm. Such a first pattern layer 255 may have a range of m. By being spaced apart from the perpendicular line by the distance D8, the incident surface light is guided and emitted. Here, the second reflecting member 220 is formed on the upper surface of the resin layer 220, and the hot spot is suppressed. The area of ​​the first region in which the first pattern layer 240 is disposed is larger than the area of ​​the second region in which the first pattern layer 255 is disposed. For example, the area of ​​the second region is 0.01 to the area of ​​the first region. It can range from .6x to 1.3x.

[0041] FIG. 16 shows the structure of FIG. 15 in which a colored ink layer 252 is further disposed on the outer surface of the wavelength conversion layer 250. The first pattern layer 255 is disposed on the upper surface of the resin layer 220 or contacting or further disposed on top of wavelength-converting layer 250 and / or colored ink layer 252 This may be done.

[0042] As shown in FIG. 17, the first pattern layer 255 may have a regular or irregular shape. For example, the first pattern layer 255 may be formed in a polygonal, circular or The pattern includes at least one line shape or a shape in which multiple patterns are interconnected. Or the shape is a cross of lines, or a polygonal or circular pattern is connected to the lines. The first pattern may be formed of a line pattern, which may be continuous or discontinuous. The layer 255 may have a honeycomb structure, a mesh shape, a lattice shape, a plurality of lines, a plurality of polygons, etc. The first putter may selectively include a plurality of oval shapes, a plurality of circular shapes, etc. The pattern layer 255 has a pattern having a first shape and a pattern having a second shape within the first shape. The first and second shapes may be different shapes or may be the same shape as each other. They may be of the same shape, but are connected in a continuous closed loop shape. or may be an open loop shape with connections that are discontinuous. The first pattern layer 255 may include a plurality of holes OP1 therein. An upper surface of the resin layer 220 may be exposed through the hole OP1. The insulating layer 255 may be provided with a thickness less than that of the second reflecting member 240. The first pattern layer 255 is formed in a pattern shape, and the light is emitted through the first pattern layer 255. The shape of the sub-beams has various shapes to match the pattern shape, and the first surface S1 The shape of the main light emitted through the wavelength conversion layer 250 is The type of the .

[0043] The first pattern layer 255 does not need to overlap the second reflecting member 240 in the vertical direction. The second region where the first pattern layer 255 is formed on the upper surface of the resin layer 220 is The first pattern may not overlap the first region in the vertical direction where the reflective member 240 is formed. The insulating layer 255 may overlap the first reflecting member 230 in a vertical direction.

[0044] As shown in FIGS. 17 and 18, the first patterned layer 255 may be a wavelength-converting layer 250 or a colored It may or may not be disposed on the ink layer 252. Such a first pattern layer The 255 pattern is formed selectively on multiple resin layers by printing. In FIG. 17, the length D10 of the second reflecting member 240 in the second direction Y is The length D6 of the first pattern layer 255 may be greater or smaller than the length D6 of the first pattern layer 255. The length D6 of the first pattern layer 255 on the upper surface of the second reflecting member 240 is The second reflecting portion may have a length D10 in the direction of the reflecting surface 11. The light guided in the resin layer 220 disposed under the material 240 passes through the first pattern layer 255 and the and emitted through wavelength-converting layer 250.

[0045] As shown in FIGS. 19 and 20, the wavelength conversion layer 250 is the outermost layer of the first pattern layer 255. This is because the first pattern layer 255 is patterned. The outer side of the first pattern layer 255 is in contact with the inner side of the wavelength conversion layer 250. You can touch it.

[0046] As shown in FIG. 21, a second pattern layer 257 is disposed on the first reflecting member 230. The second pattern layer 257 is selectively provided from the material of the resin layer 220, and may include a phosphor and / or In the second direction, the wavelength conversion means may include at least one of the quantum dots. The length of the second pattern layer 257 is longer than the length of the first pattern layer 255. The second pattern layer 257 may be formed on the first reflecting member 230 and the light emitting surface 11. The second pattern layer 257 is disposed in the region between the light emitting element 210 and the wavelength conversion layer 250. The second pattern layer 257 may be further disposed in the area between the elements 100. The area of ​​the second pattern layer 255 may be larger than the area of ​​the first pattern layer 255. The turning layer 257 may be formed in a pattern having a regular or irregular shape. For example, the second pattern layer 257 may have at least one of a polygonal shape, a circular shape, and a line shape. The pattern may include one or more interconnected shapes, or the polygonal or circular shapes may include one or more interconnected shapes. The pattern is connected to lines or is formed of a line pattern that is continuous or discontinuous. The second pattern layer 257 may have a honeycomb structure, a mesh shape, a lattice shape, a complex shape, or the like. The shapes may selectively include a number of line shapes, a number of polygonal shapes, a number of elliptical shapes, a number of circular shapes, etc. The second pattern layer 257 may include a pattern having a first shape and a The pattern may include a second shape within a shape. The first and second shapes may be The loops may be of different shapes or the same shape and are connected in series. d loop shape or an open loop with discontinuous connections. The second pattern layer 257 may have a shape of a plurality of holes OP2 therein. The bottom surface of the resin layer 220 may be exposed through the hole OP2. The second pattern layer 257 is provided to have a thickness smaller than that of the first reflecting member 230. The second pattern layer 257 may be vertically overlapped with the first pattern layer 255. The second pattern layer 257 may be formed on the first and second reflecting members 230 and 240. and a vertically overlapping area.

[0047] As shown in FIGS. 17 to 21, the pattern effect of the first pattern layer 255 is as shown in FIG. By providing a difference in luminosity between the light emitted through the hole and the light emitted through the pattern, The resin layer 220 is provided on the light-emitting side thereof with a transparent resin layer 220a. A wavelength conversion layer 250 is disposed, or a wavelength conversion layer 250 / colored ink layer 252 laminate structure is formed. The first pattern layer 255 may be disposed on the light-emitting peripheral region. , the first and second pattern layers 255 and 257 are arranged to provide the light exit surface with various surface light shapes. It is possible.

[0048] As shown in FIG. 22 and FIG. 23, a second pattern layer 257 is disposed on the first reflecting member 230. The second pattern layer 257 is selectively formed from the material of the resin layer 220. The wavelength conversion means may include at least one of a fluorine atom or a fluorine atom. The second pattern layer 257 may be provided in a pattern. The pattern 7 has a plurality of holes OP2, and has a regular or irregular shape. The pattern of the second pattern layer 257 may be arranged in a reverse manner. The pattern of the first pattern layer 255 may be the same as or different from that of the first pattern layer 255. The area of ​​the second pattern layer 257 may at least partially overlap in the vertical direction. As a result, the pattern of the second pattern layer 257 and the pattern of the first pattern layer 255 are The turns are provided at different depths when viewed from above, so that a replacement effect can be achieved. The first and second pattern layers 255 and 257 are formed on the upper surface of the resin layer 220. The wavelength conversion layer 250 is formed by the first and second patterned layers 255, 257, and can emit the main light. As shown, a colored ink layer 252 is disposed on the outer side of the wavelength conversion layer 250. When the second pattern layer 257 is disposed on the first reflecting member 230, the second pattern layer 257 It may be embedded within the underside of 20.

[0049] As shown in FIG. 24, the upper surface of the resin layer 220 can be exposed without the second reflecting member 240. The first pattern layer 255 may be formed in a pattern over the entire top surface of the resin layer 220. A second pattern layer 257 is disposed under the resin layer 220, but is not limited thereto. 25, the upper and lower surfaces of the resin layer 220 on the emission side can be exposed. The pattern of the first pattern layer 255 is disposed on the upper surface of the emission side of the resin layer 220, and the pattern of the first pattern layer 255 is disposed on the lower surface of the emission side of the resin layer 220. The pattern of the second pattern layer 257 is disposed on the outer surface of the resin layer 220. Either a wavelength converting layer 250 is disposed, or a wavelength converting layer 250 and a colored ink layer 252 are disposed. The second pattern layer 257 does not need to overlap the light emitting element 100 in the vertical direction. Like element 26, light emitting element 100A may include multiple light emitting surfaces. The surface may include a top surface and multiple side surfaces. A vertical type LED chip or a vertical type LED chip may be mounted on the substrate 210. Such a light emitting device 100A can be selectively applied to the embodiments disclosed above.

[0050] 27 shows the structure of FIG. 3 and FIG. 5, in which the upper surface area of ​​the substrate 210 is the area under the resin layer 220. The wavelength conversion element is provided with an area larger than the surface area, and its edges can protrude outward. The layer 250 or the colored ink layer 252 is disposed on the first surface S1, the third surface S2, and the fourth surface S3 of the resin layer 220. S3 and S4 may be disposed over each of the wavelength conversion layers 250 disclosed above. At least one of the colored ink layers 252 is disposed on the third and fourth surfaces S3 and S4. The wavelength conversion layer 250 may include extended portions 250A and 250B. The width D3 may be the same as or greater than the width D7 of the extensions 250A, 250B. The wavelength conversion layer 250 and / or the colored ink layer 252 are disposed under the second reflecting member 240. This is an example.

[0051] FIG. 28 shows the structure of FIG. 14 to FIG. 20 in which the wavelength conversion layer 250 and / or the colored ink layer 252 is A first pattern layer 255 having a pattern on the upper side is disposed on the emission side of the resin layer 220. As shown in FIG. 36, the inner line La of the first pattern layer 255 is a horizontal straight line. The first pattern layer 255 may be a square wave, a sine wave, or a concave-convex shape. The inner line La can be in contact with the second reflecting member 240.

[0052] 29 and 30 show a third embodiment of the lighting module having a hemispherical convex portion P1 on the light output side. The lighting module includes a plurality of hemispherical convex portions P1, and a plurality of hemispherical convex portions P2 and P3. The maximum width of the hemispherical protrusion P1 is equal to or less than the diameter of the protrusion P1. In such a structure, the wavelength conversion layer 250 or and / or a colored ink layer 252 may be selectively formed. Even if the color ink layer 252 is omitted, the wavelength conversion layer 250 alone can eliminate hot spots and produce a uniform The first pattern disclosed above may be formed on the protrusion P1. The layer 255 may be formed in a pattern of a predetermined shape. The protrusion P1 may be formed in an adjacent region or an upper region. Therefore, the incident light can be refracted to a certain area.

[0053] FIG. 31 shows the above disclosed lighting module or lighting device applied to a vehicle lamp. As shown in FIG. 31, the lighting module or device 201 is horizontally The light may be provided in a curved shape based on a straight line X0. This is applicable to vehicle lamps. In this case, the rear (or front) and sides of the vehicle can be connected with a curved lamp shape that extends. The lighting module 201 can be formed by connecting both ends of the first surface S1 from the straight line X0. The angle between the straight lines X2 may be an angle C2 in the range of 10 degrees to 60 degrees, An imaginary straight line X3 extending tangentially from the first surface S1 located at one end of the module 201. The angle C3 may be in the range of 5 degrees to 30 degrees. The imaginary line connecting adjacent light emitting elements 100 in one may include a straight line, a diagonal line, or a curved line. The wavelength conversion layer 250 is disposed on the first surface S1, which is the emission surface. The ink layer / colored ink layer 250, 252 may be arranged in a laminated structure. A first pattern layer 255 and / or a second pattern layer 257 may be disposed.

[0054] In addition, the first surface S1 of the module or device has a protrusion and a The surface area of ​​the substrate 210 may be the same as that of the resin layer 220. The area of ​​the bottom surface of the light emitting device 100 may be equal to or larger than the area of ​​the bottom surface of the light emitting device 100. A part of the first surface S1 of the lighting module 201 is aligned along a virtual straight line connecting one end of the first surface S1 to the other end of the first surface S1. Alternatively, the first and second electrodes may be disposed adjacent to each other in the first surface direction.

[0055] FIG. 32 shows a lighting module according to an embodiment of the invention, in which a light emitting element is disposed on a circuit board. FIG. 33 is a diagram of the module as viewed from the other side of FIG. 32.

[0056] 32 and 33, the light emitting device 100 includes a body 1 having a cavity 20. 0, a plurality of lead frames 30, 40 in the cavity 20, and the plurality of leads One or more light emitting chips disposed on at least one of the frames 30, 40 Such a light emitting element 100 is an example of the position of the light emitting element disclosed in the above embodiment. The light emitting device 100 may be implemented as a side emission type package. The length of X (or the length of the long side) is at least three times, for example, four times, the width in the second direction Y. The length in the second direction Y may be 2.5 mm or more, for example, in the range of 2.7 mm to 6 mm. The light emitting device 100 may have a thickness in the range of 2.5 mm to 3.2 mm. By providing a long length in the X direction, the number of the light emitting devices 100 in the first direction X can be reduced. The light emitting device 100 can be provided with a relatively thin thickness. The thickness of the light emitting device 100 can be reduced. For example, the thickness may be 1.5 mm or less or may be in the range of 0.6 mm to 1 mm. The body 10 has a cavity 20, and the length in the first direction X is 3 times shorter than the thickness of the body 10. 4 or more times, and the directivity angle of the light in the first direction X can be widened.

[0057] A plurality of lead frames 30, 40 are disposed in the body 10. A plurality of lead frames 30, 40 are disposed on the bottom of the body 10 and are coupled to the body 10. The body 10 may be made of an insulating material. The body 10 may be made of a reflective material. The body 10 can be made of, for example, polyphthalamide (PPA). The main body 10 may be made of a resin material such as silicone. or epoxy-based or plastic materials, thermosetting resins, or highly heat-resistant and light-resistant materials The body 10 may be made of a resin material to which metal oxide is added. The metal oxide may include at least one of TiO2, SiO2, and Al2O3. The first side surface portion 15 of the main body 10 is a surface on which the cavity 20 is disposed. The second side surface of the main body 10 may be a surface from which light is emitted. The first lead frame 30 may be the opposite side or the second side of the first side portion 15. The second lead portion includes a first lead portion, a first bonding portion, and a first heat dissipation portion. The lead frame 40 includes a second lead portion 41, a second bonding portion 42, and a second heat dissipation portion 43. The gap 17 between the first and second lead portions 31 and 41 is made of the material of the main body 10. As another example, the body 10 may include two or more lead frames. In this case, the light emitting chip may be coupled to a frame, one of which may be a heat dissipation frame. The lead 71 is disposed, for example, on the first lead portion 31 of the first lead frame 30. and the second lead portion 31, 41 are connected to the wires 72, 73, or are bonded to the first lead portion 31. The light emitting chip 71 is connected to the second lead portion 41 by a wire. The light emitting chip 71 may be a chip, a vertical chip, or a chip having a via structure. The light emitting chip 71 may be mounted by a flip chip method. The light-emitting chip 71 can selectively emit light within a wavelength range of, for example, ultraviolet light. The light emitting chip 71 can emit light of II-VI group The light emitting chip may include at least one of a group III-V compound and a group III-V compound. The light emitting chip 71 may be connected in series or in parallel. 71 is, for example, a red LED chip, a blue LED chip, a green LED chip, a yellow-green LED chip, The LED chips may be selected from the group consisting of low and green LED chips. A molding member 81 is disposed on the tee 20, and the molding member 81 is a serial The light-transmitting resin may be a single layer or multiple layers, such as a transparent resin such as epoxy. The molding member 81 or the light emitting chip 71 is provided with a light emitting device for changing the wavelength of the emitted light. As another example, a phosphor may be provided on the cavity 20 to illuminate the cavity. A light-transmitting film having a light body and / or an optical lens may be further formed. Semiconductor elements such as a light receiving element and a protection element may be mounted inside.

[0058] Referring to FIG. 33, at least one or more light emitting devices 100 are disposed on a substrate 210. A protective layer and / or a first reflecting member 230 is disposed around the lower portion of the light emitting element 100. The light emitting element 100 emits light in the direction of a central axis Y0 and is applied to the lighting device. The first and second lead portions 31 and 41 of the light emitting element 100 are connected to the substrate The electrode patterns 213 and 215 of the electrode 210 are provided with conductive adhesive members 217 and 219, which are solder or is bonded with conductive tape.

[0059] FIG. 34 is a plan view of a vehicle to which a vehicle lamp to which a lighting module according to an embodiment is applied is applied. FIG. 35 is a side view of a vehicle having a lighting module or lighting device according to the disclosed embodiment. 34 and 35, in a vehicle 900, a tail lamp is The lamp 800 includes a first lamp unit 812, a second lamp unit 814, and a third lamp unit. The first lamp unit 81 may include a light source 816 and a housing 810. 2 may be a light source to serve as a direction indicator, and the second lamp unit 814 may be The third lamp unit 816 may be a light source for serving as a parking light, and the third lamp unit 817 may be a light source for serving as a brake light. However, the present invention is not limited to this. At least one or all of the third lamp units 812, 814, and 816 may be The housing 810 may include a lighting device or module as disclosed in The lamp housing includes first to third lamp units 812, 814, and 816 and is made of a light-transmitting material. At this time, the housing 810 may have a bend depending on the design of the vehicle body. The first to third lamp units 812, 814, and 816 can be arranged in a shape that matches the shape of the housing 810. Accordingly, a surface light source having a curved surface can be realized. When the lamp unit is applied to the tail lamp, brake lamp, or turn signal lamp of a vehicle, This can be applied to turn signal lamps.

[0060] The lighting device of the invention has a small thickness and increases the luminous intensity of the light emitted through at least one side. and providing wavelength-converted light through at least one side of the resin layer. The lighting device of the invention can be formed by bonding the resin layer through at least one side, one surface and / or the other surface. The present invention provides a light source having a wavelength converted by the above-mentioned method. The wavelength-converted light and / or the light emitted from the light-emitting element are extracted through the upper surface of the light-emitting element. The invention provides a thin lighting module or device that provides surface light in the form of a line light. This increases the freedom of design and improves the uniformity of the surface light. The optical reliability of the light module and the lighting device having the light module can be improved. The reliability of a vehicle lighting device having a lighting module can be improved, The present invention can be applied to light units, various display devices, and vehicle lamps.

[0061] The features, structures, effects, etc. described in the above embodiments may be used in at least one embodiment of the present invention. The present invention is not limited to any one embodiment. The features, structures, effects, etc. of the present invention may be easily understood by those skilled in the art to which the present invention pertains. The present invention can be implemented in combination or modification with the above examples. should be construed as being within the scope of the present invention.

Claims

1. A substrate; A plurality of light emitting elements disposed on the substrate; A first reflecting member disposed on the substrate; a resin layer disposed on the first reflecting member; A second reflecting member disposed on the resin layer; a wavelength conversion layer disposed on one surface of the resin layer facing the light emitting surface of the light emitting element; Including, The distance from the light emitting surface to the one surface is 5 to 10 times the height of the resin layer. Lighting device.

2. A substrate; A plurality of light emitting elements disposed on the substrate; A first reflecting member disposed on the substrate; a resin layer disposed on the first reflecting member; a second reflecting member disposed on the first region of the resin layer; a first pattern layer disposed on the second region of the resin layer; a wavelength conversion layer disposed on one surface of the resin layer facing the light emitting surface of the light emitting element; Including, The first pattern layer includes at least one of a polygon, a circle, or a line shape; Lighting equipment.

3. The first pattern layer is formed of at least one of a polygon, a circle, and a line shape; 3. The lighting device according to claim 2.

4. The first pattern layer is a plurality of interconnected polygonal or honeycomb-shaped patterns. The lighting device of claim 2 comprising a turn.

5. The first pattern layer includes a first shape and a second pattern layer disposed within the first shape. The illumination device of claim 2 having a second shape.

6. the first pattern layer and the plurality of light emitting devices do not overlap in a vertical direction; The second reflector according to claim 2 , wherein the second reflector overlaps the light emitting element in a vertical direction. Lighting equipment.

7. The area of ​​the second region is larger than the area of ​​the first region, The area of ​​the second region is 0.6 to 1.3 times the area of ​​the first region.

3. The lighting device according to claim 2.

8. a second pattern layer disposed on a region of the second reflector; The first pattern layer and the second pattern layer may have a pattern having a regular shape or an irregular shape. Including, The shape of the pattern of the first pattern layer is different from the shape of the pattern of the second pattern layer. 、 A region of the pattern of the first pattern layer is aligned with a region of the pattern of the second pattern layer. The lighting device of claim 2 , wherein the lighting device overlaps vertically.

9. A substrate; A plurality of light emitting elements disposed on the substrate; A first reflecting member disposed on the substrate; a resin layer disposed on the first reflecting member; a second reflecting member disposed on the first region on the resin layer; a wavelength conversion layer disposed on one surface of the resin layer facing the light emitting surface of the light emitting element; a second pattern layer disposed on a region of the first reflector; Including, The second pattern layer includes at least one of a polygon, a circle, or a line shape; Lighting equipment.

10. the second pattern layer is disposed in front of the light emitting surfaces of the plurality of light emitting elements; 10. The method according to claim 8, wherein the second pattern layer is molded by the resin layer.

2. The lighting device according to claim 1 .

11. 9. The method of claim 8, wherein the first region does not overlap the second pattern layer in a vertical direction.

10. The lighting device according to claim 9.

12. The wavelength conversion layer is disposed on one surface of the resin layer facing the light emitting surface of the light emitting element.

10. The lighting device according to claim 1, 2 or 9.

13. a colored ink layer disposed over the wavelength converting layer; The illumination device of claim 12 , wherein the colored ink layer includes a red ink.

14. The one surface of the resin layer and the wavelength conversion layer have a plurality of convex portions and a plurality of convex portions between the plurality of convex portions. a recess formed in the Each of the plurality of protrusions faces a light emitting surface of each of the plurality of light emitting elements.

13. The lighting device according to claim 12.

15. The plurality of light emitting devices are side view type LEDs. Including ED, The first reflecting member has a plurality of holes in which the side-view type LEDs are arranged. Including, The plurality of light emitting devices are arranged in a row and spaced apart by a first distance, The distance from the light emitting surface of each of the plurality of light emitting elements to one surface of the resin layer is corresponds to one distance, the first distance is between 10 mm and 15 mm; The height of the resin layer is 1.5 mm to 1.6 mm, The lighting device according to claim 1 , wherein one surface of the resin layer includes a curvature. Device.

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