Polishing material slurry and polishing method for the same
JP2025063882A5Pending Publication Date: 2026-06-09MITSUI MINING & SMELTING CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUI MINING & SMELTING CO LTD
- Filing Date
- 2024-12-25
- Publication Date
- 2026-06-09
Abstract
To provide a polishing material slurry that has excellent dispersibility and a high polishing rate.SOLUTION: A polishing material slurry includes manganese oxide polishing particles containing manganese oxide particles, permanganate ions, and phosphates. The content of manganese oxide polishing particles is 0.5 mass% or more and 20 mass% or less. The permanganate ion content is 0.5 mass% or more and 3.2 mass% or less. The phosphate content is 0.01 mass% or more and 0.1 mass% or less.SELECTED DRAWING: None
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