Polishing material slurry and polishing method for the same

JP2025063882A5Pending Publication Date: 2026-06-09MITSUI MINING & SMELTING CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
MITSUI MINING & SMELTING CO LTD
Filing Date
2024-12-25
Publication Date
2026-06-09
Patent Text Reader

Abstract

To provide a polishing material slurry that has excellent dispersibility and a high polishing rate.SOLUTION: A polishing material slurry includes manganese oxide polishing particles containing manganese oxide particles, permanganate ions, and phosphates. The content of manganese oxide polishing particles is 0.5 mass% or more and 20 mass% or less. The permanganate ion content is 0.5 mass% or more and 3.2 mass% or less. The phosphate content is 0.01 mass% or more and 0.1 mass% or less.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art