IC tag sheet

The IC tag sheet addresses the inefficiencies of cylindrical IC tags by using a sheet format with inlays sandwiched between face materials, allowing for compact storage and cost-effective manufacturing, thereby reducing transportation and storage costs.

JP2025074509APending Publication Date: 2025-05-14TOPPAN HOLDINGS INC
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Patent Information

Application Number
JP2023185356
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-10-30
Publication Date
2025-05-14

AI Technical Summary

Technical Problem

Existing cylindrical IC tags are inefficient in accommodating a large number of tags in a compact manner, leading to increased transportation and storage costs, and require special manufacturing equipment and materials, thereby increasing production costs.

Method used

An IC tag sheet comprising a pair of face materials with a plurality of inlays containing antenna circuits and IC chips sandwiched between them, arranged in a direction along the surface of the face materials, allowing for compact storage and conventional manufacturing processes.

Benefits of technology

The IC tag sheet enables compact storage of a large number of IC tags, reducing transportation and storage costs, and can be manufactured using standard equipment and materials, thus lowering production costs.

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Abstract

To provide an IC tag sheet which can compactly accommodate many IC tags, can be manufactured using conventional manufacturing equipment, and can suppress manufacturing costs by avoiding the use of special materials.SOLUTION: An IC tag sheet 1 of the present invention comprises a pair of planner materials 2, 2, and multiple inlays 3, each provided with an antenna circuit and IC chip connected to each other, arranged in a direction along surfaces of the planner materials 2 and sandwiched between the pair of planner materials 2, 2.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to an IC tag sheet. [Background technology]

[0002] Patent Document 1 discloses an IC tag that is attached to an object to be cleaned, in which an IC chip capable of contactless data communication is embedded in a cylindrical tag portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-269201 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, since the IC tag of Patent Document 1 is formed in a cylindrical shape, it is difficult to store many IC tags compactly. In this case, when many IC tags are transported or stored, the volume required to store many IC tags becomes large, which is undesirable because it increases the transportation and storage costs of the IC tags. Furthermore, the cylindrical IC tag of Patent Document 1 must be manufactured using special manufacturing equipment. Also, in the IC tag of Patent Document 1, a special material such as silicone rubber is used for the cylindrical tag portion. This undesirably increases the cost of manufacturing the IC tag.

[0005] In consideration of the above circumstances, the first object of the present invention is to provide an IC tag sheet capable of compactly storing a large number of IC tags.The second object of the present invention is to provide an IC tag sheet that can be manufactured using conventional manufacturing equipment and does not require special materials, thereby reducing the manufacturing costs. [Means for solving the problem]

[0006] One aspect of the present invention is an IC tag sheet comprising a pair of face materials and a number of inlays each having an antenna circuit and an IC chip connected to each other, arranged in a direction along the surface of the face materials and sandwiched between the pair of face materials. Effect of the Invention

[0007] According to the present invention, a large number of IC tags can be accommodated compactly. [Brief description of the drawings]

[0008] [Figure 1] 1 is a plan view of an IC tag sheet according to a first embodiment of the present invention, viewed from the thickness direction of a surface material. [Diagram 2] 2 is a cross-sectional view showing an example of a laminated structure of the IC tag sheet of FIG. 1 in an exploded state. FIG. [Diagram 3] FIG. 2 is a diagram showing an embodiment in which the IC tag sheet of FIG. 1 is wound into a roll. [Figure 4] 2 is a diagram showing a state in which the IC tag sheet of FIG. 1 is folded back into a Z shape. FIG. [Diagram 5] FIG. 4 is a plan view showing an IC tag sheet according to a second embodiment of the present invention. [Figure 6] FIG. 11 is a plan view showing an IC tag sheet according to a third embodiment of the present invention. [Figure 7] FIG. 7 is a diagram showing IC tags separated from the IC tag sheet of FIG. 6. [Figure 8] FIG. 13 is a plan view showing an IC tag sheet according to a fourth embodiment of the present invention. [Figure 9] 9 is a diagram showing IC tags separated from the IC tag sheet of FIG. 8. FIG. [Figure 10] FIG. 11 is a cross-sectional view showing a schematic exploded view of a modified example of the laminated structure of the IC tag sheet. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, an IC tag sheet 1 according to this embodiment includes a pair of face materials 2, 2, a plurality of inlays 3, and a pair of waterproof layers 4, 4.

[0010] The face material 2 is a flexible sheet-like material. The face material 2 of this embodiment is formed in a strip shape extending in a linear direction along the surface of the face material 2. The face material 2 may be made of, for example, a printable paper material, a PET (polyethylene terephthalate) material, or the like. The pair of face materials 2, 2 are arranged side by side in the thickness direction. In the following description, the direction in which the panel material 2 extends along the surface of the panel material 2 may be referred to as the first linear direction D1, and the direction perpendicular to the first linear direction D1 along the surface of the panel material 2 may be referred to as the second linear direction D2.

[0011] 2, the inlay 3 has an antenna circuit 31 and an IC chip 32 which are connected to each other. In the inlay 3, the antenna circuit 31 enables contactless data communication between the IC chip 32 and an external device. Specifically, the inlay 3 is configured by providing the antenna circuit 31 and the IC chip 32 on a sheet-like base material 30.

[0012] 1 and 2, multiple inlays 3 are sandwiched between a pair of face materials 2, 2 while being aligned in a first linear direction D1. Specifically, an adhesive layer 5 is provided on each of the surfaces of the pair of face materials 2, 2 facing the inlay 3. Therefore, when the inlay 3 is sandwiched between the pair of face materials 2, 2, the inlay 3 is adhered to the face material 2 by the adhesive layer 5, and the pair of face materials 2, 2 are adhered to each other in an overlapping state. The adhesive layer 5 may be, for example, a double-sided tape or an adhesive that enables thermocompression bonding.

[0013] As shown in Fig. 1, a pair of surface materials 2, 2 sandwiching a plurality of inlays 3 therebetween are configured by connecting a plurality of individual regions 22, each including one inlay 3, in a first linear direction D1. In Fig. 1, the individual region 22 of the surface material 2 is formed in a rectangular shape with a short side in the first linear direction D1 and a long side in the second linear direction D2, but is not limited thereto. An easy-to-break line BL1 that enables the pair of surface materials 2, 2 to be easily cut is formed at the boundary between adjacent individual regions 22 of the pair of surface materials 2, 2. The easy-to-break line BL1 in this embodiment is a perforation consisting of a plurality of cuts that penetrate the pair of surface materials 2, 2.

[0014] In the IC tag sheet 1 of this embodiment, in a plan view seen from the thickness direction of the surface material 2, the size of each inlay 3 is smaller than the individual area 22 of the surface material 2. In addition, as shown in Figures 1 and 2, the inlays 3 are positioned inside the edges of the individual areas 22 of the surface material 2 with intervals between them.

[0015] The pair of waterproof layers 4, 4 have a waterproof function and are provided overlapping the entire surfaces of the pair of facing materials 2, 2 facing the opposite side to the adhesive layer 5. The waterproof layer 4 has the same shape and size as the facing material 2 in a plan view. The waterproof layer 4 has an easy-to-break line formed therein similar to that of the facing material 2. The waterproof layer 4 may be made of a material such as a PET material or a waterproof ink or waterproof spray. When the waterproof layer 4 is made of the same material as the facing material 2 (for example, a PET material), the facing material 2 may also serve as the waterproof layer 4.

[0016] In the IC tag sheet 1 of this embodiment, one inlay 3 and the individual area 22 of the face material 2 (and the waterproof layer 4) that sandwiches it constitute one IC tag 100. That is, the IC tag sheet 1 is constituted by lining up a plurality of IC tags 100. Furthermore, the IC tag sheet 1 of this embodiment is flexible. Therefore, the IC tag sheet 1 can be wound into a roll as shown in Fig. 3. Moreover, as shown in Fig. 4, the IC tag sheet 1 can be folded back into a Z-shape by folding at the boundary (easy-break line BL1) of the individual region 22.

[0017] As described above, the IC tag sheet 1 of the first embodiment is configured by connecting a plurality of IC tags 100. Therefore, by winding the IC tag sheet 1 into a roll or folding it in a Z-shape, a large number of IC tags 100 can be stored compactly. This makes it possible to keep the volume required to store a large number of IC tags 100 small, and effectively reduce the transportation and storage costs of the IC tags 100.

[0018] Moreover, in the IC tag sheet 1 of the first embodiment, the IC tag 100 is configured by sandwiching an inlay 3 consisting of an antenna circuit 31 and an IC chip 32 between a pair of face materials 2, 2. Therefore, the IC tag sheet 1 can be manufactured by a roll-to-roll method like a normal IC card, that is, it can be manufactured by a conventional manufacturing device without using special manufacturing equipment. Moreover, there is no need to use special materials as in the IC tag of Patent Document 1. Therefore, it is possible to reduce the cost required for manufacturing the IC tag 100.

[0019] Furthermore, the IC tag sheet 1 of the first embodiment can be in the same form as a normal label roll. Therefore, the IC tag sheet 1 can be handled as a normal label roll, such as printing with a label printer, manufacturing in rolls, and delivery. As a result, the cost required for manufacturing the IC tag 100 can be reduced.

[0020] Furthermore, in the IC tag sheet 1 of the first embodiment, an easy-to-break line BL1 is formed at the boundary between adjacent IC tags 100. This allows the IC tag sheet 1 to be easily broken at the boundary between the IC tags 100. In other words, a plurality of IC tags 100 can be easily separated into individual pieces. Furthermore, since the pair of face materials 2, 2 of the IC tag sheet 1 can be easily folded at the easy breaking line BL1, the IC tag sheet 1 can also be easily folded.

[0021] Moreover, the IC tag sheet 1 of the first embodiment has a waterproof layer 4 covering the outer surfaces of the pair of face materials 2, 2. This effectively suppresses or prevents moisture from passing through the face material 2 and reaching the inlay 3. This allows the individualized IC tags 100 to be effectively used as IC tags 100 to be attached to objects to be cleaned.

[0022] Second Embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 5. In the following description, configurations common to those already described will be given the same reference numerals and duplicated description will be omitted.

[0023] As shown in Fig. 5, the IC tag sheet 1A of the second embodiment is the same as the IC tag sheet 1 of the first embodiment, except that it has through holes 24. In the IC tag sheet 1A of the second embodiment, the through holes 24 are formed in each individual region 22 of the pair of face materials 2, 2, and penetrate in the thickness direction of the pair of face materials 2, 2. The through holes 24 also penetrate the waterproof layer 4 (see Fig. 2). The through holes 24 are formed in each IC tag 100A. In Fig. 5, the through hole 24 is located in a region adjacent to the inlay 3 in the second linear direction D2. In Fig. 5, the through hole 24 is formed in a rectangular shape in a plan view, but may be formed in any shape such as a circle or a slit.

[0024] According to the IC tag sheet 1A of the second embodiment, the same effects as those of the first embodiment are achieved. Moreover, in the IC tag sheet 1A of the second embodiment, a through hole 24 is formed in each individual region 22 (each IC tag 100A). This allows the individualized IC tag 100A to be easily attached to an object (e.g., a cleaning item). For example, the IC tag 100A can be easily attached to the clothing (object) by hooking the IC tag 100A onto a button provided on the clothing using the through hole 24. Also, for example, the IC tag 100A can be easily attached to the clothing (object) by passing a strip-shaped piece of paper or a string through the through hole 24 of the IC tag 100A and a buttonhole on the clothing.

[0025] <Third embodiment> Next, a third embodiment of the present invention will be described with reference to Figures 6 and 7. In the following description, components common to those already described will be given the same reference numerals and duplicated description will be omitted.

[0026] 6, the IC tag sheet 1B of the third embodiment is the same as the IC tag sheet 1A of the second embodiment, except that it has a plurality of extension bands 25 and a connecting portion 26. In the IC tag sheet 1B of the third embodiment, the plurality of extension bands 25 are formed on a pair of face materials 2, 2. The plurality of extension bands 25 extend from each individual region 22 in the second linear direction D2 and are arranged at intervals in the first linear direction D1.

[0027] The width dimension of the extension band 25 in the first linear direction D1 is smaller than the dimension of the individual region 22 in the first linear direction D1. Moreover, the extension band 25 is located in the middle portion of the individual region 22 in the first linear direction D1. Moreover, the width dimension of the extension band 25 is equivalent to the width dimension of the through hole 24 in the first linear direction D1. That is, the width dimension of the extension band 25 is the same as the width dimension of the through hole 24, or is slightly smaller or larger than the width dimension of the through hole 24. 6, the length dimension of the extension bands 25 in the second linear direction D2 is the same among the multiple extension bands 25. In FIG. 6, the length dimension of the extension bands 25 is smaller than the dimension of the individual region 22 in the second linear direction D2, but is not limited to this.

[0028] The connecting portion 26 extends in the first linear direction D1 and connects adjacent extension bands 25. The connecting portion 26 of the third embodiment is composed of a pair of face materials 2, 2, similar to the extension bands 25. The connecting portion 26 is formed in a band shape extending in the first linear direction D1, and is connected to the ends of the multiple extension bands 25. An easy-to-break line BL2 (perforation) is formed at the boundary between the connecting portion 26 and the end of each extension band 25.

[0029] In the third embodiment of the IC tag sheet 1B, a single IC tag 100B as shown in Figure 7 can be obtained by simply breaking the IC tag sheet 1B at the easy-to-break line BL1 located at the boundary between adjacent individual regions 22, and at the easy-to-break line BL2 located at the boundary between the extension band 25 and the connecting portion 26.

[0030] According to the IC tag sheet 1B of the third embodiment, the same effects as those of the first embodiment are achieved. In the IC tag sheet 1B of the third embodiment, a plurality of extension bands 25 are formed on a pair of face materials 2, 2, extending from each individual region 22 and arranged at intervals in the first linear direction D1. Therefore, in the singulated IC tag 100B, the extension bands 25 can be formed into a ring shape by fixing the tip end of the extension band 25 to the base end or the individual region 22. The tip end of the extension band 25 can be fixed to the base end or the individual region 22 by a stapler, adhesive, pressure sensitive adhesive, or the like. Since the extension band 25 can be formed into a ring shape, the individualized IC tag 100B can be easily attached to an object (e.g., a cleaning object). For example, the extension band 25 is passed through the through hole 24 of the IC tag 100B and a buttonhole of a garment, and the tip of the extension band 25 is fixed to the base end of the extension band 25 or the individualized region 22, so that the IC tag 100B can be easily attached to the garment (object).

[0031] In the IC tag sheet 1B of the third embodiment, similarly to the second embodiment, a through hole 24 is formed in each individual region 22. Therefore, in the individualized IC tag 100B, the tip end of the extension band 25 can be fixed to the individual region 22 in a state where it is passed through the through hole 24 of the individual region 22.

[0032] In the IC tag sheet 1B of the third embodiment, the extension bands 25 adjacent to each other in the first linear direction D1 are connected by a connecting portion 26 extending in the first linear direction D1. This makes it possible to prevent the adjacent extension bands 25 from moving independently in the state of the IC tag sheet 1B. This makes it possible to suppress or prevent problems such as the extension bands 25 being unexpectedly bent when the IC tag sheet 1B is rolled up or folded in a Z-shape.

[0033] In the third embodiment of the IC tag sheet 1B, the connecting portion connecting adjacent extension bands 25 may be, for example, a release backing formed in a band extending in the first linear direction D1 and removably attached to multiple extension bands 25 via an adhesive layer.

[0034] In the IC tag sheet 1B of the third embodiment, for example, the through-holes 24 do not have to be formed in each individual region 22.

[0035] <Fourth embodiment> Next, a fourth embodiment of the present invention will be described with reference to Figures 8 and 9. In the following description, components common to those already described will be given the same reference numerals and duplicated description will be omitted.

[0036] 8, the IC tag sheet 1C of the fourth embodiment is configured by lining up a plurality of IC tags 100C in a first linear direction D1, similar to the first to third embodiments. Also, the IC tag sheet 1C of the fourth embodiment has a plurality of extension bands 25 extending from each individual region 22 in the second linear direction D2 and arranged at intervals in the first linear direction D1, similar to the third embodiment.

[0037] In the IC tag sheet 1C of the fourth embodiment, a locking portion 28 having a width dimension in the first linear direction D1 larger than that of the extension band 25 is formed at the tip of each extension band 25 away from the individual region 22. In the fourth embodiment, the locking portion 28 extends from the tip of the extension band 25 to both sides in the first linear direction D1. Note that the locking portion 28 may extend from the tip of the extension band 25 to only one side in the first linear direction D1, for example. Further, a locking hole 29 is formed in each individual region 22, penetrating the pair of face materials 2, 2 in the thickness direction. The extension band 25 can be inserted into the locking hole 29. The locking portion 28 described above is locked in the locking hole 29. The locking portion 28 and the locking hole 29 will be described in detail below.

[0038] The locking hole 29 in the fourth embodiment is formed in a slit shape extending in the first linear direction D1. The width of the locking hole 29 in the first linear direction D1 is equal to the width of the extension band 25 excluding the tip portion, i.e., the same as the width of the extension band 25, or slightly smaller or larger than the width of the extension band 25. The width dimension of the locking hole 29 is smaller than the width dimension of the locking portion 28 in the first linear direction D1. Therefore, when passing the tip end of the extension band 25 including the locking portion 28 through the locking hole 29, the locking portion 28 may be folded to have a width dimension equal to or smaller than the width dimension of the locking hole 29 and then passed through the locking hole 29. When the folded locking portion 28 is then unfolded, the tip end of the extension band 25 including the locking portion 28 cannot be passed through the locking hole 29. As a result, the locking portion 28 is locked in the locking hole 29. When the tip end of the extension band 25 is passed through the locking hole 29, the extension band 25 is formed into a ring shape.

[0039] In the fourth embodiment, adjacent locking portions 28 in the first linear direction D1 are connected. In addition, when other locking portions 28 are located on both sides of a given locking portion 28 in the first linear direction D1, the given locking portion 28 is connected to the locking portions 28 on both sides. An easy-to-break line BL3 (perforation) is formed at the boundary between adjacent locking portions 28 in the first linear direction D1.

[0040] In the fourth embodiment of the IC tag sheet 1C, a single IC tag 100C as shown in Figure 9 can be obtained by simply breaking the IC tag sheet 1C at the easy-to-break line BL1 located at the boundary between adjacent individual regions 22 and at the easy-to-break line BL3 located at the boundary between adjacent locking portions 28.

[0041] According to the IC tag sheet 1C of the fourth embodiment, the same effects as those of the first embodiment are achieved. In the IC tag sheet 1C of the fourth embodiment, a locking portion 28 having a width dimension larger than that of the extension band 25 is formed at the tip of each extension band 25. In addition, a locking hole 29 is formed in each individual region 22, penetrating the pair of face materials 2, 2 in the thickness direction, through which the extension band 25 is inserted and into which the locking portion 28 is locked. Therefore, in the individualized IC tag 100C, the extension band 25 can be held in a ring shape by simply locking the locking portion 28 at the tip of the extension band 25 into the locking hole 29 formed in the individual region 22 without using a stapler, adhesive, or pressure-sensitive adhesive. This makes it possible to more easily attach the individualized IC tag 100C to an object (e.g., a cleaning object). For example, the IC tag 100C can be easily attached to clothing (an object) by simply passing the extension band 25 through the through hole 24 of the IC tag 100C and a buttonhole of the clothing, and then locking the locking portion 28 of the extension band 25 into the locking hole 29.

[0042] In the IC tag sheet 1C of the fourth embodiment, adjacent locking portions 28 are connected in the first linear direction D1. This makes it possible to prevent adjacent extension bands 25 from moving independently in the state of the IC tag sheet 1C. This makes it possible to suppress or prevent problems such as the extension bands 25 being unexpectedly bent when the IC tag sheet 1C is wound into a roll or folded in a Z shape. Furthermore, since the locking portions 28 adjacent to each other in the first linear direction D1 are connected to each other, the locking portions 28 can be connected to each other without using the connecting portions 26 as in the third embodiment.

[0043] In the IC tag sheet 1C of the fourth embodiment, similarly to the third embodiment, for example, the extension bands 25 adjacent to each other in the first linear direction D1 may be connected by a connecting portion extending in the first linear direction D1.

[0044] In the third and fourth embodiments, the extension bands 25 extending from each individual region 22 are not limited to extending in the second linear direction D2 perpendicular to the first linear direction D1, but may extend at least in a direction intersecting the first linear direction D1. That is, the extension bands 25 may extend from the individual region 22 in a direction inclined with respect to the second linear direction D2, for example. The extension bands 25 do not have to be parallel to each other.

[0045] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and can be modified as appropriate without departing from the spirit of the present invention.

[0046] The IC tag sheet of the present invention may not include the waterproof layer 4, for example.

[0047] In the IC tag sheet of the present invention, for example, each inlay 3 may be positioned so as to contact the edge of the individual region 22 of the face material 2 .

[0048] In the IC tag sheet of the present invention, for example as shown in Fig. 10, the size of each inlay 3 may be the same as the size of the individual region 22 of the surface material 2. In this case, the multiple inlays 3 may be lined up along the surface of the surface material 2 without any gaps between them. Furthermore, the inlay 3 (particularly the base material 30) may be formed by connecting a plurality of inlays, similar to the individual regions 22 of the surface material 2. In this case, it is preferable that an easy-to-break line similar to that of the surface material 2 is formed at the boundary of the inlay 3. Furthermore, the inlay 3 may be formed not only in the individual region 22 of the face material 2, but also in a position overlapping the extension band 25 and the locking portion 28 of the third and fourth embodiments formed by the face material 2, for example.

[0049] In the IC tag sheet of the present invention, the pair of face materials 2, 2 is not limited to being formed in a band shape extending in the first linear direction D1, but may be formed in a sheet shape extending in the first linear direction D1 and the second linear direction D2. In this case, the multiple inlays 3 sandwiched between the pair of face materials 2, 2 may be arranged in a matrix shape along the surface of the face material 2, for example, that is, lined up in both the first linear direction D1 and the second linear direction D2. [Explanation of symbols]

[0050] 1,1A,1B,1C IC tag sheet 2. Surface material 3 Inlay 22 piece area 24 Through hole 25 Extension belt 26 Connecting part 28 Locking part 29 Locking hole 31 Antenna circuit 32 IC chip BL1 Easy-to-break wire D1 First straight direction

Claims

1. A pair of face materials; An IC tag sheet comprising: a plurality of inlays, each having an antenna circuit and an IC chip connected to each other, arranged in a direction along the surface of the face material and sandwiched between the pair of face materials.

2. The pair of face materials are configured by arranging a plurality of individual regions including one of the inlays in a direction along a surface of the face material, The IC tag sheet according to claim 1 , wherein an easy-to-break line is formed at the boundary between adjacent individual regions of the pair of surface materials, allowing the pair of surface materials to be easily cut.

3. The pair of face materials are configured by arranging a plurality of individual regions including one of the inlays in a direction along a surface of the face material, The IC tag sheet according to claim 1 or 2, wherein each individual region has a through hole formed therein, the through hole penetrating in a thickness direction of the pair of face materials.

4. The pair of face materials are configured by arranging a plurality of individual regions including one of the inlays in a first linear direction along the surface of the face material, An IC tag sheet as described in claim 1 or claim 2, wherein the pair of surface materials have a plurality of extension bands formed thereon, the extension bands extending from each individual region along the surface of the surface material in a direction intersecting the first linear direction and arranged at intervals in the first linear direction.

5. The IC tag sheet according to claim 4 , further comprising a connecting portion extending in the first linear direction and connecting adjacent extension bands.

6. A locking portion having a dimension in the first linear direction larger than that of the extension band is formed at a tip end of the extension band away from the individual region, The IC tag sheet according to claim 4 , wherein each individual region has a locking hole formed therein, the locking hole penetrating the pair of face plates in the thickness direction thereof, through which the extension band passes and into which the locking portion is engaged.

7. The IC tag sheet according to claim 6 , wherein the locking portions adjacent to each other in the first linear direction are connected to each other.

Citation Information

Patent Citations

  • IC tag

    JP2008269201A