Inlay sheet, portable electronic device, and method of manufacturing inlay sheet

Abstract

To provide an inlay sheet configured to improve holdability of an IC module, a portable electronic device, and a method of manufacturing the inlay sheet.SOLUTION: In an IC card 1, an inlay sheet 11 includes a sheet substrate 15, a wireless module 20 (IC module), and a coil antenna 17. The sheet substrate includes an opening 15a. The wireless module is arranged in the opening and includes an IC chip 22 and a joint section 25 to which the antenna is connected. The coil antenna is formed on a surface of the sheet substrate. The wireless module includes three or more joint sections to be connected to the coil antenna or the sheet substrate.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE The present invention relates to an inlay sheet, a portable electronic device, and a method for manufacturing an inlay sheet. [Background technology]

[0002] Portable electronic devices such as wireless IC cards employ a laminated structure in which an inlay sheet on which a wireless IC module is mounted is laminated with other sheet materials. The wireless IC module includes a module substrate, an antenna connection terminal drawn on the module substrate, and chip components such as an LSI mounted on the module substrate.

[0003] A known method for manufacturing an inlay sheet involves, for example, fitting an IC module into an opening in a sheet-like substrate, drawing a coil antenna on the surface of the substrate, and electrically and mechanically connecting the antenna connection terminals of the wireless IC module at one and the other ends of the coil antenna.

[0004] For example, a coil antenna is joined to the surface of a sheet-like substrate, and its end is joined to an antenna connection terminal of a wireless IC module in an opening by soldering, etc. In such an inlay sheet, it is required to improve the retention of the IC module placed in the opening of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2000-235635 A Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide an inlay sheet, a portable electronic device, and a method for manufacturing an inlay sheet, which can improve the retention of an IC module. [Means for solving the problem]

[0007] The inlay sheet according to the embodiment includes a sheet-like substrate, a wireless module, and a coil antenna. The substrate has an opening. The wireless module has a chip and a joint where the antenna is joined. The wireless module is disposed in the opening. The coil antenna is provided on a surface of the substrate. The wireless module has three or more joints where it is joined to the coil antenna or the substrate. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing a configuration of an IC card according to an embodiment. [Diagram 2] FIG. [Diagram 3] FIG. 2 is an explanatory diagram showing the configuration of an IC card. [Figure 4] FIG. 2 is a plan view showing a partial configuration of the IC card. [Diagram 5] FIG. 2 is a cross-sectional view showing a partial configuration of the IC card. [Figure 6] FIG. 2 is a plan view showing the configuration of the IC module. [Figure 7] FIG. 2 is a cross-sectional view showing the configuration of the IC module. [Figure 8] 3A to 3C are explanatory diagrams showing the manufacturing process of the IC card. [Figure 9] FIG. 2 is a plan view showing an example of an inlay sheet according to an embodiment. [Figure 10] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 11] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 12] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 13] FIG. 2 is a cross-sectional view showing a configuration of a portion of the IC card according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The configuration of an IC card 1 according to a first embodiment will be described below with reference to Figs. 1 to 7. Fig. 1 is a plan view showing the configuration of an IC card 1 according to a first embodiment. Fig. 2 is a cross-sectional view of the IC card 1. Fig. 3 is an explanatory diagram showing the configuration of an IC card. Figs. 4 and 5 are a plan view and a cross-sectional view showing a partial configuration of an IC card. Figs. 4 and 5 are a plan view and a cross-sectional view showing the configuration of an IC module. In the drawings, arrows X, Y, and Z respectively indicate a first direction, a second direction, and a third direction which are perpendicular to each other.

[0010] 1 to 3, an IC card 1 as a portable electronic device includes a first core sheet 11 which is an inlay sheet, a second core sheet 12 (second sheet) laminated on one side of the first core sheet 11, a first cover sheet 13 laminated on the back surface of the first core sheet 11, and a second cover sheet 14 laminated on the front surface of the second core sheet 12. For example, the IC card 1 is configured to be capable of contactless communication with a processing device such as a reader / writer, and information is exchanged by bringing the IC card 1 close to the processing device. For example, the IC card 1 is used as a passport, a transportation card, a credit card, etc.

[0011] The IC card 1 is constructed, for example, by stacking a first cover sheet 13 and a second cover sheet 14 on the front and back sides, respectively, of a laminate formed by stacking a first core sheet 11 and a second core sheet 12, and bonding them together, for example by heat pressing.

[0012] The first core sheet 11 comprises a sheet base material 15 (base material) having an opening 15a, a non-contact coil antenna 17 drawn on the surface of the sheet base material 15, and an IC module 20 as a wireless module arranged in the opening 15a.

[0013] The sheet base material 15 is formed, for example, in a rectangular sheet shape from a resin material such as PVC (polyvinyl chloride), PET-G (glycol-modified polyethylene terephthalate), or PC (polycarbonate). A rectangular opening 15a constituting a part of a housing section in which the IC module 20 is housed is formed at a predetermined position of the sheet base material 15. The opening 15a is a through hole extending from the front surface on one side of the stacking direction (Z direction) of the sheet base material 15 to the back surface on the other side of the stacking direction, and the IC module 20 is disposed inside. In addition to the IC module 20, the sheet base material 15 may be formed with wiring parts and various terminals. In addition to the IC module 20, electronic components may be mounted on the sheet base material 15 as mounting components.

[0014] 1 to 5, coil antenna 17 is made of, for example, a copper wire, and is drawn in a predetermined pattern on the surface of sheet substrate 15 and fixed to sheet substrate 15. For example, coil antenna 17 is formed by heating a copper wire and pressing it against sheet substrate 15, and is drawn in a predetermined pattern shape on sheet substrate 15. Note that coil antenna 17 may be formed by being fixed to sheet substrate 15 with an adhesive or the like instead of by thermocompression bonding. A part of coil antenna 17 may be embedded in sheet substrate 15.

[0015] Coil antenna 17 is a loop antenna and has one end 17a, the other end 17b, a loop portion 17c formed by winding a sheet multiple times along the outer periphery of sheet base material 15, and passing portions 17d and 17e disposed across opening 15a between loop portion 17c and both ends 17a and 17b. For example, coil antenna 17 is disposed with ends 17a and 17b and loop portion 17c on the surface of sheet base material 15 and joined to sheet base material 15.

[0016] In the coil antenna 17, the passing parts 17d and 17e arranged passing over the opening 15a extend linearly in a second direction perpendicular to the first direction, for example, at portions adjacent to both sides in the first direction of the IC chip 22 and the molded part 28 on the module substrate 21. That is, the passing parts 17d and 17e are arranged passing over the module substrate 21 of the IC module 20 from one side to the other in the second direction of the opening 15a. For example, the passing parts 17d and 17e of the coil antenna 17 are joined to the IC module 20 at a total of three or more points. The coil antenna 17 may have a bent part or a folded part where the extending direction changes. For example, a folded part where the extending direction changes is formed at the end parts 17a and 17b that are continuous with the passing parts 17d and 17e and are joined to the surface of the sheet base material 15.

[0017] Specifically, passing portions 17d, 17e near ends 17a, 17b of coil antenna 17 are joined to IC module 20 by soldering, welding, or the like, thereby providing electrical and mechanical connection. As an example, coil antenna 17 has passing portion 17d on one end 17a side joined to one antenna connection terminal 23 at two points, and passing portion 17e on the other end 17b side joined to the other antenna connection terminal 23 at two points. That is, two joints 25 are formed on each antenna connection terminal 23, totaling four joints 25.

[0018] That is, coil antenna 17 has loop portion 17c joined to the surface of sheet base material 15, and other parts thereof, passing portions 17d and 17e, joined to module board 21 or antenna connection terminal 23. Passing portions 17d and 17e of coil antenna 17 have portions that are not joined to base material 15 or module board 21 in gap G1 between the edge of opening 15a of base material 15 and module board 21.

[0019] As shown in FIGS. 6 and 7, the IC module 20 includes a module substrate 21, an IC chip 22, an antenna connection terminal 23, wires 27, and a molded portion .

[0020] The module substrate 21 is configured in a rectangular plate shape, and is placed in the opening 15a of the sheet base material 15. The module substrate 21 is made of, for example, a glass epoxy material. The module substrate 21 is configured to be slightly smaller than the opening 15a, and a gap is formed between the outer periphery of the module substrate 21 and the inner wall of the opening 15a. . It gets stuck.

[0021] The IC chip 22 is, for example, an LSI (Large Scale Integration) element. The IC chip 22 is mounted on the module substrate 21. The IC chip 22 is connected to the conductor portion 23a by wire bonding via the wire 27, and is sealed by the molded portion 28. For example, the IC chip 22 includes memories such as RAM and ROM, a CPU, an interface, etc. The IC chip 22 is provided on the front side of the module substrate 21, and is disposed in a housing portion formed by the opening 15a and an opening 12a of the second core sheet 12 described later.

[0022] The antenna connection terminals 23 are provided on one and the other side of the IC chip 22 in the first direction on the module substrate 21. The antenna connection terminals 23 are, for example, metal layers and are configured in a rectangular shape. The antenna connection terminals 23 are connection terminals connected to terminals on the IC chip 22 side. The antenna connection terminals 23 have linear conductor portions 23a extending along the first direction toward the IC chip 22 disposed in the center. Each antenna connection terminal 23 has an antenna joint portion 25 to which the coil antenna 17 is joined.

[0023] For example, in this embodiment, the coil antennas 17 are joined at two locations to each of the two antenna connection terminals 23 provided on both sides of the IC chip 22. That is, two antenna joints 25 are provided on each side, totaling four.

[0024] Wire 27 is, for example, a gold wire, and connects conductor portion 23a and IC chip 22. Wire 27 is, for example, electrically connected to a terminal of IC chip 22 at one end and electrically connected to conductor portion 23a of antenna connection terminal 23 at the other end.

[0025] The molded portion 28 is made of a resin material and integrally covers the IC chip 22, the wires 27, and a part of the conductor portion 23a. For example, the molded portion 28 is formed in a rectangular block shape.

[0026] The second core sheet 12 is made of a resin material and is formed in a rectangular shape that is long in one direction. The second core sheet 12 is made of the same material as the sheet base material 15 of the first core sheet 11. For example, the second core sheet 12 is formed of PVC, PETG, PC, etc. The second core sheet 12 is laminated on the front side of the first core sheet 11. The outer shape of the second core sheet 12 is formed to be the same shape as the outer shape of the first core sheet 11. The second core sheet 12 has an opening 12a that penetrates in the thickness direction. The opening 12a is, for example, a through hole that is the same shape as the opening 15a or a size larger, and is arranged overlapping the opening 15a in the lamination direction to form a storage section that stores the IC module 20. For example, the opening 12a is formed in a rectangular shape along the shape of the outer periphery of the molded section 28 of the IC module 20, and stores at least a part of the IC module 20 protruding from the first core sheet 11.

[0027] The first cover sheet 13 and the second cover sheet 14 are formed, for example, in the shape of a rectangular plate. The outer periphery of the cover sheet 13 is formed in the same shape as the outer shapes of the first core sheet 11 and the second core sheet 12. The cover sheets 13 and 14 have a base layer formed of a resin material such as PVC, PETG, PC, etc., and a printed layer on the surface of the base layer on which patterns and characters are drawn. For example, the cover sheets 13 and 14 are made of the same material as the sheet substrate 15 of the first core sheet 11 and the second core sheet 12.

[0028] The IC card 1 configured in this manner has three or more joints where the IC module 20 is joined to the coil antenna 17 or the base material 15. For example, in this embodiment, the coil antenna 17 is joined to the antenna connection terminal 23 of the IC module 20 at four points, forming four joints 25.

[0029] Such an IC card 1 is made by stacking a first core sheet 11 and a second core sheet 12 which is laminated on the surface of the first core sheet 11, laminating a first cover sheet 13 on the back side of the first core sheet 11, and stacking a second cover sheet 14 on the front side of the second core sheet 12, and then bonding the stacked sheets 11-14 together by heating and pressing.

[0030] FIG. 8 is an explanatory diagram showing the manufacturing process of an IC card, and FIG. 9 is a plan view showing an example of an inlay sheet. As shown in FIG. 8, the manufacturing method of the first core sheet 11 includes arranging an IC module 20 in an opening 15a formed in a sheet base material 15, and joining an antenna 17 to the IC module 20 at at least three points. That is, an opening 15a is formed in the sheet base material 15 (ST1), and an IC module 20 is arranged in the opening 15a (ST2). Then, a coil antenna 17 is formed in a predetermined pattern passing through the IC module 20 in the opening 15a from the surface of the sheet base material 15 (ST3). At this time, a part of the antenna 17 is placed on the antenna connection terminal 23 of the IC module 20, and joined to the connection terminal 23 by welding or soldering (ST4).

[0031] For example, the first core sheet 11 is formed as a sheet unit 110 in which a plurality of inlets are arranged, and then cut into a predetermined shape and separated into individual pieces. That is, a plurality of openings 15a are formed in a large-sized base sheet material 150 in which a plurality of sheet substrates 15 are continuous (ST1), and an IC module 20 is arranged in each opening 15a (ST2). Then, a coil antenna 17 corresponding to each IC module is drawn (ST3), and the antenna 17 is joined onto the antenna connection terminal 23 of each IC module 20, and three or more joints 25 are formed (ST4). Through the above steps, the sheet unit 110, which is an inlay sheet in which a plurality of IC modules 20 are mounted on the base sheet material 150, is completed. Thereafter, the sheet unit 110 on which the multiple IC modules 20 are mounted is stacked on a second sheet material that will become multiple second core sheets 12 when singulated, a third sheet material that will become the first cover sheet 13 when singulated is stacked on the back side of the sheet unit 110, a fourth sheet material that will become the second cover sheet 14 when singulated is stacked on the front side of the second sheet material, and the stacked multiple sheet materials are joined together by heat and pressure bonding (ST5), forming a card unit on which multiple IC modules 20 are mounted. Then, the card unit is cut and singulated (ST6), forming multiple IC cards 1. Note that the first core sheet 11 that is part of the laminated structure of one IC card 1 and has the IC modules 20 is referred to as an inlay sheet, and the sheet unit 110 on which multiple IC modules 20 are mounted on a large-sized sheet material before being singulated in the manufacturing process is referred to as an inlay sheet.

[0032] As described above, in the first core sheet 11 and IC card 1 according to the first embodiment, the IC module 20 is joined to the coil antenna 17 or the base material 15 at three or more points, for example, four points. Therefore, compared with a configuration in which the IC module 20 is joined at two points, one point on each side of the IC chip 22, the IC module 20 can be held more firmly, and the handling of the first core sheet 11 during transportation can be improved. That is, in an inlay configuration in which the IC module is disposed in the opening of the sheet base material through a gap, and the coil antenna extending from the sheet base material is joined to the connection terminal of the IC module at only two points, the support state is unstable, and if the inlay is transported to the next process in this state, the wireless module is greatly shaken by the vibration at that time, and the antenna wire may break near the joint. In contrast, according to the above embodiment, the IC module 20 and the coil antenna 17 are joined at three or more points, thereby improving the support and suppressing the antenna from breaking. Moreover, stability and strength can be improved by joining each of the passing parts 17d, 17e to the antenna connection terminal 23 at two points and ensuring the distance between the multiple joining parts 25, 25. Furthermore, it is possible to prevent the IC module 20 from shifting in position or falling off during the manufacturing process, and improve the positional accuracy when the IC module is manufactured.

[0033] Although one embodiment of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and various modifications and improvements are possible as appropriate.

[0034] For example, in the above-described first embodiment, the antenna connection terminals 23 are provided on both sides in one direction of the IC chip 22, and the passing parts 17d, 17e passing over the opening 15a near both ends 17a, 17b of the coil antenna 17 are joined and fixed to the connection terminals 23, but this is not limiting. For example, the antenna connection terminals 23 may be formed in four separate locations, and the coil antenna 17 may be joined to each of the antenna connection terminals 23.

[0035] 10 as another embodiment, a first core sheet 11A has a pair of antenna connection terminals 23 at both ends in the first direction on a module substrate 21, as well as a pair of antenna connection terminals 29 at both ends in the second direction, and one joint 25 is provided at each of four locations on both sides to join the antenna 17 to the antenna connection terminals 23, 29. Specifically, the coil antenna 17 has a passing portion 17d joined to one of the connection terminals 23, a portion on the end side of the passing portion 17d extending onto the sheet base material 15 and joined to the sheet base material 15, and a portion on the further end side of the joint extending to a second antenna connection terminal 29 and joined to the second antenna connection terminal 29.

[0036] That is, coil antenna 17 includes relay portions 17f, 17g joined to the surface of sheet base material 15 between passing portions 17d, 17e and ends 17a, 17b, and extending portions 17h, 17i extending to antenna connection terminal 29 and joined to antenna connection terminal 29. For example, relay portions 17f, 17g form a rectangular pattern. Ends 17a, 17b are disposed on module substrate 21.

[0037] The connection terminal 23 and the connection terminal 29 are electrically connected by a conductor portion 23b.

[0038] In this embodiment as well, by providing three or more joints 25, it is possible to improve the retention of the IC module 20. Furthermore, in the coil antenna 17, the passing portions 17d, 17e are joined to the antenna connection terminals 23, 29 by the joints 25 via the relay portions 17f, 17g, so that the stability can be further improved.

[0039] In the above example, the antenna connection terminals 23, 29 are electrically connected by the conductor portions 23a, 23b, but not all of the multiple antenna connection terminals 23, 29 may be connected to the IC chip. For example, as in the first core sheet 11B shown in Fig. 11 as another embodiment, the second connection terminal 29 is not connected to the connection terminal 23 by the conductor portion 23b, and may be an auxiliary terminal for joining the antenna 17.

[0040] In the above embodiment, the coil antenna 17 is joined to the antenna connection terminal 23 at four points, but the present invention is not limited to this. For example, the joints may be connection parts connected to the base material 15 instead of the coil antenna 17.

[0041] 12 and 13, the first core sheet 11C, which is an inlay sheet, has two connection members 18 attached to the edge of the opening 15a and the module substrate 21, and the connection members 18 form joints 19 at which the antenna 17 is joined to the IC module 20. That is, in this embodiment, the total number of joints 25 at which the antenna 17 is joined to the IC module 20 and the number of joints 19 at which the base material 15 and the IC module 20 are connected by the connection members 18 is 3 or more. For example, the connection members 18 are made of the same material as at least one of the sheet base material 15 of the first core sheet 11, the second core sheet 12, and the cover sheets 13 and 14. For example, the connection members 18 are made of a resin material such as PVC, PETG, or PC.

[0042] A method for manufacturing such a first core sheet 11C includes, for example, forming an opening 15a in a sheet base material 15 (ST1), arranging an IC module 20 in the formed opening 15a (ST2), forming a coil antenna 17 in a predetermined pattern from the surface of the sheet base material 15 to the IC module 20 (ST3), joining the antenna 17 to the IC module 20 to form a joint 25, and configuring a joint 19 by attaching a connection member 18 in two places that spans between the edge of the opening 15a of the sheet base material 15 and the IC module 20 (ST3). For example, when the first core sheet 11C, the second core sheet 12, and the cover sheets 13 and 14 are laminated and hot-pressed, the connection member 18, which is made of the same material as the first core sheet 11C and the second core sheet 12, is melted and integrated.

[0043] In this embodiment as well, by providing three or more joints or connections, the holding performance of the IC module 20 can be improved.

[0044] In addition, the number of joints is not limited to four. For example, the number of joints may be three or five or more. The shape of the wiring of the antenna is also not limited to the above embodiment and can be changed as appropriate. For example, in the first embodiment, the ends 17a and 17b are folded back on the end side that passes through the opening 15a, but they may extend in a straight line.

[0045] In addition to the above configuration, IC card 1 may include other configurations as necessary, or certain configurations may be excluded from IC card 1. Also, IC card 1 has a laminated structure of four layers of sheets 11 to 14, but is not limited to this, and any of the sheets may be omitted to make it three layers or less, or it may have five layers or more.

[0046] Also, the openings 15a and 12a constituting the housing portion are through holes in the above example, but the present invention is not limited to this. For example, either or both of them may be recesses.

[0047] Further, although an IC card 1 has been exemplified as a portable electronic device, the present invention is not limited to this and can be used in various electronic devices.

[0048] According to at least one of the embodiments described above, the holding performance of the wireless module can be improved.

[0049] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0050] 1...IC card, 11, 11A, 11B, 11C...first core sheet (inlay sheet), 12...second core sheet, 12a...opening, 13...first cover sheet, 14...second cover sheet, 15...sheet base material, 15a...opening, 17...coil antenna, 17a...end, 17b...end, 17c...loop portion, 17d...passing portion, 17e...passing portion, 17f...relay portion, 17g...relay portion, 17h...extension portion, 17i...extension portion, 18...connection member (joint portion), 20...IC module (wireless module), 21...module substrate, 22...IC chip, 23...antenna connection terminal, 23a...conductor portion, 23b...conductor portion, 25...joint portion, 27...wire, 28...molded portion, 29...connection terminal, 110...sheet unit (inlay sheet), 150...base sheet material, G1...gap.

Claims

1. A sheet-like substrate having an opening; a wireless module having a chip and a joint to which an antenna is joined, the wireless module being disposed in the opening; A coil antenna provided on a surface of the substrate; Equipped with The wireless module has three or more joints at which the wireless module is joined to the coil antenna or the base material. Inlay sheet.

2. the wireless module has a module substrate disposed in the opening and an antenna connection terminal joined to the coil antenna, the chip is mounted on the module substrate, The inlay sheet according to claim 1 , wherein the coil antenna is connected to the antenna connection terminal of the wireless module at three or more joints.

3. The inlay sheet of claim 2 , wherein portions of the coil antenna between the plurality of joints extend above a surface of the base material and are joined to the module substrate.

4. a connection member attached to an edge of the opening and the wireless module, the connection member connecting the base material and the wireless module; The inlay sheet according to claim 1 , wherein the sum of the number of joints at which the antenna is joined to the wireless module and the number of connection parts at which the connecting member connects the substrate and the wireless module is three or more.

5. The inlay sheet according to claim 1 ; a second sheet that is laminated on one side of the inlay sheet in a lamination direction and has an opening in which the wireless module is disposed; A portable electronic device comprising: a cover sheet arranged on at least one of one side and the other side in a stacking direction of the stack of the inlay sheet and the second sheet.

6. disposing a module substrate, a chip disposed on the module substrate, and a wireless module having an antenna connection terminal in an opening formed in a sheet base material; A method for manufacturing an inlay sheet, comprising: forming an antenna extending from a surface of the sheet base material to the wireless module; and joining the antenna to the wireless module at at least three points.

7. disposing a wireless module having a module substrate, a chip disposed on the module substrate, and an antenna connection terminal in an opening formed in a sheet base material; forming an antenna extending from a surface of the sheet base material to the wireless module, and joining the antenna to the wireless module; A method for manufacturing an inlay sheet, comprising: attaching a connecting member that spans the edge of the opening of the sheet base material and the wireless module.

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