Mask assembly, method of manufacturing the mask assembly, apparatus for manufacturing display device, and method of manufacturing the display device

Abstract

To provide a mask assembly, a method of manufacturing the mask assembly, an apparatus for manufacturing a display device, and a method of manufacturing the display device.SOLUTION: A mask assembly of the present disclosure includes a mask sheet. The mask sheet includes: a first region including at least one or more first pattern holes; a second region including at least one or more second pattern holes; and a projection disposed on the inner surfaces of the first pattern holes or the second pattern holes and projecting into one of the inner surfaces of the first pattern holes and the second pattern holes. The inner surfaces of the first pattern holes are different from the inner surfaces of the second pattern holes.SELECTED DRAWING: Figure 11B

Description

Technical Field

[0001] The present invention relates to a mask assembly, a method for manufacturing the same, a manufacturing apparatus for a display device, and a method for manufacturing a display device.

Background Art

[0002] Electron devices based on mobility are widely used. As mobile electron devices, in addition to small electron devices such as mobile phones, in recent years, tablet PCs (personal computers) have been widely used. Such mobile electron devices include a display device in order to provide visual information such as an image or a video to a user in order to support various functions.

[0003] In recent years, due to the miniaturization of other components for driving a display device, the proportion of the display device in the electron device has been gradually increasing, and a structure that can be bent so as to have a predetermined angle in a flat state has also been developed. In such a display device, pixels can be arranged in various parts so as to have different resolutions from each other. At this time, the performance of the display device depends on the form of the mask assembly used for depositing an organic substance on such pixels. Generally, in order to manufacture a display device including display regions having different resolutions from each other, mask assemblies corresponding to each display region are separately manufactured and used.

[0004] However, when manufacturing the mask assembly separately in this way, not only a large manufacturing cost is incurred, but also the alignment between each mask assembly and the substrate is not precise, and it becomes difficult to manufacture a display device of a desired quality.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] The present invention has been made in view of the problems in the above-described conventional display device, and an object of the present invention is to provide a mask assembly capable of manufacturing a display device having a precise pattern through one mask assembly, a method for manufacturing the mask assembly, a manufacturing apparatus for the display device, and a manufacturing method for the display device.

MEANS FOR SOLVING THE PROBLEMS

[0007] A display device according to an embodiment includes a substrate including a first display region including a transmissive region and a second display region disposed so as to surround at least a part of the first display region, a first pixel disposed in the first display region and including a first pixel electrode, a first intermediate layer, and a first counter electrode, and a second pixel disposed in the second display region and including a second pixel electrode, a second intermediate layer, and a second counter electrode. Each of the first intermediate layer and the second intermediate layer includes a portion having a constant thickness and a section having a variable thickness, and a first length of the section having a variable thickness of the first intermediate layer is different from a second length of the section having a variable thickness of the second intermediate layer.

[0008] Preferably, the first length is shorter than the second length, or the second length is shorter than the first length. Preferably, a resolution of an image provided in the first display region is different from a resolution of an image provided in the second display region. Preferably, a component including an electronic element that emits or receives light is further disposed on one surface of the substrate so as to correspond to the first display region. Preferably, a light transmittance of the first display region and a light transmittance of the second display region are different from each other. Preferably, a size of a planar shape of the first intermediate layer is equal to or larger than a size of a planar shape of the second intermediate layer.

[0009] A mask assembly according to an aspect of the present invention made to achieve the above object is a mask assembly including a mask sheet, wherein the mask sheet includes a first region including at least one or more first pattern holes, a second region including at least one or more second pattern holes, and a protrusion disposed on an inner surface of the first pattern hole or the second pattern hole and protruding into one of the first pattern hole or the second pattern hole, and an inner surface of the first pattern hole and an inner surface of the second pattern hole are different from each other.

[0010] Preferably, the protrusion includes a first protrusion protruding from an inner surface of the first pattern hole into the first pattern hole. Preferably, a thickness of the first region and a thickness of the second region are the same as each other or different from each other. Preferably, a planar size of the second pattern hole formed on one surface of the second region is equal to or larger than a planar size of the first pattern hole formed on one surface of the first region extended from one surface of the second region. Preferably, a plurality of reference holes are disposed at an edge of the second region on the mask sheet. Preferably, a shape of the first pattern hole and a shape of the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

[0011] A method for manufacturing a mask assembly according to an aspect of the present invention made to achieve the above object includes disposing a first photoresist on a first surface of a base material so as to include a first opening, disposing a second photoresist on a second surface of the base material so as to include a second opening and a third opening, injecting an etching solution into the first opening to etch a part of the first surface of the base material, and injecting an etching solution into the first opening and the second opening to etch a part of the second surface of the base material and form a first pattern hole and a second pattern hole penetrating the base material.

[0012] It is preferable that the width of the second opening is larger than the width of the first opening. It is preferable that a protruding portion protruding from the inner surface of the second pattern hole into the second pattern hole is disposed inside the first pattern hole. It is preferable that the distance from the first surface to the protruding portion and the distance from the second surface to the protruding portion are different from each other. It is preferable to further include a step of removing the first photoresist. It is preferable to further include a step of removing the second photoresist.

[0013] A method for manufacturing a mask assembly according to another aspect of the present invention made to achieve the above object includes a step of disposing a first photoresist having a first opening located in a first region of a base material on the first surface of the base material, a step of disposing a second photoresist having a second opening corresponding to the first opening on the second surface of the base material, a step of injecting an etching solution into the first opening to etch a part of the first surface of the base material, a step of injecting an etching solution into the second opening to form a first pattern hole penetrating the base material, and a step of irradiating a laser beam on a second region adjacent to the first region on the second surface of the base material to form a second pattern hole penetrating the base material.

[0014] It is preferable that the shape of the first pattern hole and the shape of the second pattern hole on a plane parallel to the first surface or the second surface are different from each other. It is preferable that the area of the first pattern hole and the area of the second pattern hole on a plane parallel to the first surface or the second surface are different from each other. It is preferable that the number per unit area of the first pattern holes and the second pattern holes are different from each other. It is preferable to further include a step of removing the first photoresist. It is preferable to further include a step of removing the second photoresist. The step of forming the second pattern hole preferably includes a step of forming the width of the second pattern hole in a direction perpendicular to the thickness direction of the base material so as to increase from the first surface to the second surface. The second photoresist preferably further includes a third opening formed to correspond to the entire second region, and further includes a step of injecting an etching solution into the third opening to etch a part of the second surface of the base material. Preferably, it further includes a step of irradiating a laser beam onto an etching surface formed corresponding to the third opening on the second surface of the base material to form a second pattern hole penetrating the base material. The second photoresist preferably further includes a plurality of fourth openings arranged in the second region and spaced apart from each other, and further includes a step of injecting an etching solution into the fourth openings to etch a part of the second surface of the base material. The step of forming the second pattern hole preferably includes a step of irradiating a laser beam onto an etching surface formed corresponding to the fourth opening on the second surface of the base material to form a second pattern hole penetrating the base material. The second photoresist preferably further includes a plurality of fifth openings located at the edge of the second region, and by injecting an etching solution into the fifth openings to etch a part of the second surface of the base material, it preferably further includes a step of forming at least two or more reference holes. Preferably, before irradiating the laser beam, it further includes a step of aligning the base material using the reference holes.

[0015] A manufacturing apparatus for a display device according to an aspect of the present invention made to achieve the above object includes a chamber, a mask assembly disposed inside the chamber, and a vapor deposition source disposed to face the mask assembly and supply a vapor deposition material to a display substrate. The mask assembly includes a mask sheet through which the vapor deposition material supplied from the vapor deposition source passes. The mask sheet includes a first region including at least one or more first pattern holes, a second region including at least one or more second pattern holes, and a protruding portion disposed on an inner surface of one of the first pattern holes or the second pattern holes and protruding into one of the first pattern holes or the second pattern holes. The inner surface of the first pattern hole and the inner surface of the second pattern hole are different from each other.

[0016] Preferably, the protruding portion includes a first protruding portion protruding from the inner surface of the first pattern hole into the first pattern hole. Preferably, the thickness of the first region and the thickness of the second region are the same as or different from each other. Preferably, the planar size of the inlet portion of the first pattern hole formed on one surface of the first region is equal to or larger than the planar size of the inlet portion of the second pattern hole formed on one surface of the second region extended from one surface of the first region. Preferably, the mask sheet includes a plurality of reference holes disposed at an edge of the first region or an edge of the second region. Preferably, the thickness in the peripheral region of the second pattern hole among the thicknesses in the second region of the mask sheet is thinner than the thickness in the first region, and the thickness in the region between the second pattern holes adjacent to each other is the same as the thickness in the first region. Preferably, the width of the second pattern hole along the direction perpendicular to the thickness direction of the mask sheet is formed to become wider as it goes from one surface of the mask sheet to the other surface. On a plane parallel to one surface of the mask sheet, the shape of the first pattern hole and the shape of the second pattern hole are preferably different from each other. On a plane parallel to one surface of the mask sheet, the area of the first pattern hole and the area of the second pattern hole are preferably different from each other. The number of the first pattern holes and the second pattern holes per unit area is preferably different from each other. Preferably, a plurality of reference holes are arranged at the edge of the second region of the mask sheet.

[0017] A method for manufacturing a display device according to an aspect of the present invention made to achieve the above object includes arranging and aligning a display substrate and a mask assembly inside a chamber, and supplying a vapor deposition material by passing the mask assembly from a vapor deposition source to the display substrate. The mask assembly includes a mask sheet through which the vapor deposition material supplied from the vapor deposition source passes. The mask sheet includes a first region including at least one or more first pattern holes, a second region including at least one or more second pattern holes, and a protrusion disposed on an inner surface of one of the first pattern holes or the second pattern holes and protruding into one of the first pattern holes or the second pattern holes. The inner surface of the first pattern hole and the inner surface of the second pattern hole are different from each other.

[0018] Preferably, the protrusion includes a first protrusion protruding from the inner surface of the first pattern hole into the first pattern hole. The thickness of the first region and the thickness of the second region are preferably the same as or different from each other. The planar size of the second pattern hole formed on one surface of the second region is preferably equal to or larger than the planar size of the inlet of the first pattern hole formed on one surface of the first region extended from one surface of the second region. Preferably, a plurality of reference holes are arranged at the edge of the second region of the mask sheet.

[0019] A method for manufacturing a display device according to an embodiment includes forming a first intermediate layer on a first display area of a display substrate, and forming a second intermediate layer on a second display area of the display substrate. Each of the first intermediate layer and the second intermediate layer includes a portion with a constant thickness and a section with a variable thickness, and a first length of the section with a variable thickness of the first intermediate layer is different from a second length of the section with a variable thickness of the second intermediate layer.

[0020] Preferably, the first length is shorter than the second length, or the second length is shorter than the first length. Preferably, a resolution of an image provided in the first display area is different from a resolution of an image provided in the second display area. Preferably, the method further includes arranging a component including an electronic element that emits or receives light on one surface of the display substrate so as to correspond to the first display area. Preferably, a light transmittance of the first display area is different from a light transmittance of the second display area. Preferably, a size of a planar shape of the first intermediate layer is equal to or greater than a size of a planar shape of the second intermediate layer. Preferably, a thickness of a section with a constant thickness in the first intermediate layer is the same as a thickness of a section with a constant thickness in the second intermediate layer.

Advantages of the Invention

[0021] According to the display device of the present invention, it is possible to embody a precise image. According to the mask assembly and its manufacturing method, the manufacturing apparatus for a display device, and the manufacturing method for a display device of the present invention, it is possible to deposit a deposition material on a substrate in a precise pattern. Further, according to the mask assembly and its manufacturing method, the manufacturing apparatus for a display device, and the manufacturing method for a display device of the present invention, it is possible to manufacture a display device including display areas with different resolutions. In addition, according to the method for manufacturing a mask assembly of the present invention, it is possible to form pattern holes having different sizes, shapes, etc. on a single mask sheet. Further, even when forming pattern holes having different sizes, shapes, etc. on a single mask sheet, deformation of the mask sheet can be minimized, and the form of each pattern hole can be precisely manufactured.

Brief Description of the Drawings

[0022]

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Embodiments for Carrying Out the Invention

[0023] Next, specific examples of embodiments for implementing a display device, a mask assembly and a manufacturing method thereof, a manufacturing apparatus for a display device, and a manufacturing method for a display device according to the present invention will be described with reference to the drawings.

[0024] The present invention can be subjected to various conversions and can have various embodiments, but specific embodiments are illustrated in the drawings and will be described in detail by detailed description. The effects, features, and methods for achieving them of the present invention will become clear by referring to the embodiments described in detail hereinafter together with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in various forms.

[0025] Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail. When explaining with reference to the drawings, the same or corresponding components are denoted by the same reference numerals, and redundant explanations thereof will be omitted. In the following embodiments, terms such as first and second are not used in a limiting sense but for the purpose of distinguishing one component from another. In the following embodiments, singular expressions include plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as "including" or "having" mean that the features or components described in the specification exist, and do not preclude the possibility of adding one or more other features or components in advance. In the following embodiments, when a part such as a film, region, or component is said to be on or above another part, it includes not only the case where it is directly above the other part but also the case where other films, regions, components, etc. are interposed in between. In the drawings, for the convenience of explanation, the sizes of the components are exaggerated or reduced. For example, the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown. In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes in a rectangular coordinate system and are also interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may refer to different directions from each other without being orthogonal to each other although they may be orthogonal to each other. When a certain embodiment can be implemented differently, the specific process order may also be executed differently from the order described. For example, two processes described continuously may be executed substantially simultaneously and may also proceed in the order opposite to the described order.

[0026] FIG. 1 is a perspective view showing an outline of a display device according to an embodiment of the present invention. Referring to FIG. 1, the display device DD includes a display area DA for embodying an image and a peripheral area PA for not embodying an image.

[0027] The display area DA includes a first display area DA1 and a second display area DA2 which are arranged adjacent to each other and have different resolutions from each other. For example, the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. As another embodiment, the resolution of the first display area DA1 is higher than the resolution of the second display area DA2. At this time, the resolution of each display area is also determined by, for example, the distance between the centers of adjacent pixels arranged in each display area, the size of the pixels, the total area of the pixels per unit area of each display area, and / or the number of pixels per unit area of each display area. That is, in each display area, the display area with a lower resolution has a longer distance between the centers of adjacent pixels than the display area with a higher resolution, or there are also fewer pixels arranged in a unit area (or the same area).

[0028] Or, the total area of the pixels arranged in a unit area (or the same area) is narrower in the display area with a lower resolution than in other display areas. Hereinafter, for convenience of explanation, the case where the resolution of the first display area DA1 is lower than the resolution of the second display area DA2 will be mainly described in detail. The light transmittance of the first display area DA1 is also different from the light transmittance of the second display area DA2. For example, the light transmittance of one of the first display area DA1 or the second display area DA2 is higher than the light transmittance of the other one of the first display area DA1 or the second display area DA2. Hereinafter, for convenience of explanation, the case where the light transmittance of the first display area DA1 is higher than the light transmittance of the second display area DA2 will be mainly described in detail.

[0029] The first display area DA1 and the second display area DA2 as described above are arranged in various forms. For example, a part of the frame of the first display area DA1 is arranged inside the second display area DA2, and another part of the frame of the first display area DA1 meets the peripheral area PA. As another embodiment, the first display area DA1 is arranged inside the second display area DA2, and the frame of the first display area DA1 is surrounded by the second display area DA2. In the following, for convenience of explanation, the case where the first display area DA1 is arranged inside the second display area DA2 will be described in detail as the center.

[0030] As will be described later with reference to FIG. 2, the first display area DA1 and / or the second display area DA2 is also an area where components such as sensors that utilize infrared rays, visible light, sound, etc. are arranged at the lower part thereof. In the following, for convenience of explanation, the case where the component is arranged in the first display area DA1 will be described in detail as the center. In the second display area DA2, a plurality of main pixels PXm are arranged, and the plurality of main pixels PXm emit light and provide a main image through such light. The first display area DA1 includes a transmission area TA through which light output from the component to the outside or light and / or sound traveling from the outside toward the component can pass through. In an embodiment of the present invention, when infrared rays pass through the first display area DA1, the light transmittance can be about 10% or more, more desirably 20% or more, 25% or more, 50% or more, 85% or more, 90% or more.

[0031] In this embodiment, a plurality of auxiliary pixels PXa are arranged in the first display area DA1, and light emitted from the plurality of auxiliary pixels PXa is used to provide a predetermined image. The image provided in the first display area DA1 is an auxiliary image, and may have a lower resolution than the image provided in the second display area DA2. That is, the first display area DA1 includes a transmissive area TA through which light or / and sound can pass, but the number of auxiliary pixels PXa that can be arranged per unit area may be smaller than the number of main pixels PXm arranged per unit area in the second display area DA2.

[0032] As another embodiment, the total area of the auxiliary pixels PXa arranged in the unit area of the first display area DA1 is smaller than the total area of the main pixels PXm arranged in the unit area of the second display area DA2. As yet another embodiment, the distance between the centers of adjacent auxiliary pixels PXa arranged in the first display area DA1 is wider than the distance between the centers of adjacent main pixels PXm arranged in the second display area DA2. In such a case, the auxiliary pixels PXa and the main pixels PXm whose resolutions are compared with each other emit the same color light.

[0033] Hereinafter, as a display device DD according to an embodiment of the present invention, an organic light-emitting display device will be described as an example, but the display device of the present invention is not limited thereto. As another embodiment, display devices of various types such as an inorganic electroluminescence display and a quantum dot light emitting display can be used.

[0034] In FIG. 1, the first display area DA1 is shown as being arranged on one side (upper right side) of the second display area DA2 having a rectangular shape, but the present invention is not limited thereto. It goes without saying that the shape of the second display area DA2 can also be circular, elliptical, or polygonal such as a triangle or a pentagon, and the position and number of the first display areas DA1 can also be variously changed.

[0035] FIG. 2 is a cross-sectional view showing a schematic configuration of a display device according to an embodiment of the present invention. FIG. 2 corresponds to a cross-section cut along the line A-A' in FIG. 1. Referring to FIG. 2, the display device DD includes a display panel 2 including display elements, and a component 3 located below the display panel 2 and corresponding to the first display area DA1. The display panel 2 includes a substrate 100, a display element layer 200 disposed on the substrate 100, and a thin film encapsulation layer 300 as a sealing member for sealing the display element layer 200. Further, the display panel 2 may further include a lower protection film 175 disposed below the substrate 100.

[0036] The substrate 100 may include glass or a polymer resin. The polymer resin may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyphenylene sulfide, polyarylate, polyimide (PI), polycarbonate, or cellulose acetate propionate. The substrate 100 including the polymer resin may have flexible, rollable, or bendable characteristics. The substrate 100 may be a multilayer structure including a layer containing the aforementioned polymer resin and an inorganic layer (not shown).

[0037] The display element layer 200 includes a circuit layer including thin film transistors TFTs, an organic light emitting diode OLED as a display element, and an insulating layer IL therebetween. In the second display area DA2, main pixels PXm including thin film transistors TFTs and organic light emitting diodes OLEDs connected thereto are arranged. In the first display area DA1, auxiliary pixels PXa including thin film transistors TFTs and organic light emitting diodes OLEDs connected thereto are arranged, and wirings (not shown) electrically connected to the main pixels PXm and the auxiliary pixels PXa are arranged. Also, in the first display area DA1, thin film transistors TFTs and a transmission area TA where no pixels are arranged are arranged. The transmission area TA can be understood as an area through which light / signals radiated from the component 3 or light / signals incident on the component 3 are transmitted.

[0038] Component 3 is located in the first display area DA1. Component 3 is an electronic element that utilizes light or sound. For example, Component 3 can be a sensor that receives and utilizes light, such as an infrared sensor, a sensor that outputs and senses light or sound to measure distance or recognize fingerprints, a small lamp that outputs light, a speaker that outputs sound, etc. In the case of an electronic element that utilizes light, it goes without saying that light in various wavelength bands, such as visible light, infrared light, and ultraviolet light, can be utilized. The number of Components 3 arranged in the first display area DA1 can be plural. For example, as Component 3, a light-emitting element and a light-receiving element may be provided together in one first display area DA1. Alternatively, one Component 3 may be provided with a light-emitting part and a light-receiving part at the same time.

[0039] The thin film encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. Related thereto, FIG. 2 shows the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330, and the organic encapsulation layer 320 therebetween. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic insulators among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer-based substance. Examples of polymer-based materials include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polyimide (PI), polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resins (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.

[0040] The lower protective film 175 is attached to the lower part of the substrate 100 and serves to support and protect the substrate 100. The lower protective film 175 is provided with an opening 175OP corresponding to the first display area DA1. By providing the opening 175OP in the lower protective film 175, the light transmittance of the first display area DA1 can be improved. The lower protective film 175 may be provided including polyethylene terephthalate (PET) or polyimide (PI).

[0041] The area of the first display area DA1 may be provided larger than the area where the component 3 is arranged. In FIG. 2, it is illustrated that the areas of the first display area DA1 and the opening 175OP are the same, but the area of the opening 175OP provided in the lower protective film 175 may be the same as the area of the first display area DA1. For example, the area of the opening 175OP may be provided narrower than the area of the first display area DA1.

[0042] Although not shown, on the display panel 2, an input sensing member for sensing touch input, a polarizer and a retarder, or an antireflection member including a color filter and a black matrix, and components such as a transparent window may be further arranged. Also, in the present embodiment, as illustrated, a thin film encapsulation layer 300 is used as an encapsulation member for sealing the display element layer 200, but the present invention is not limited thereto. For example, as a member for sealing the display element layer 200, a sealing substrate attached to the substrate 100 by a sealant or frit can also be used.

[0043] FIG. 3 is a plan view schematically showing the configuration of a display panel according to an embodiment of the present invention. Referring to FIG. 3, various components forming the display panel 2 are arranged on the substrate 100. The substrate 100 includes a display area DA (FIG. 1) and a peripheral area PA surrounding the display area.

[0044] The display area DA includes a second display area DA2 where the main image is displayed, and a first display area DA1 having a transmissive area TA therein and where an auxiliary image is displayed. A plurality of main pixels PXm are arranged in the second display area DA2. Each main pixel PXm includes a display element such as an organic light-emitting element OLED. Each main pixel PXm emits light of, for example, red, green, blue, or white through the organic light-emitting element OLED. As described above, the main pixel PXm in this specification can be understood as a pixel that emits light of any one of the hues of red, green, blue, and white. The second display area DA2 is covered with the sealing member described above with reference to FIG. 2 and is protected from the outside air, moisture, etc.

[0045] The first display area DA1 is arranged inside the second display area DA2, and a plurality of auxiliary pixels PXa are arranged in the first display area DA1. Each auxiliary pixel PXa includes a display element such as an organic light-emitting diode. Each auxiliary pixel PXa emits light of, for example, red, green, blue, or white through the organic light-emitting diode. As described above, the auxiliary pixel PXa in this specification can be understood as a pixel that emits light of any one of the hues of red, green, blue, and white. On the other hand, the first display area DA1 is provided with a transmissive area TA arranged between the auxiliary pixels PXa.

[0046] Although the first display area DA1 has the transmissive area TA, the resolution of the first display area DA1 is lower than that of the second display area DA2. For example, the resolution of the first display area DA1 is about 1 / 2 of that of the second display area DA2. In one embodiment, the resolution of the second display area DA2 is 400 ppi or more, and the resolution of the first display area DA1 can be about 200 ppi. Each pixel (main pixel PXm, auxiliary pixel PXa) can be electrically connected to an outer circuit disposed in the peripheral area PA. In the peripheral area PA, a first scan drive circuit 110, a second scan drive circuit 120, a terminal 140, a data drive circuit 150, a first power supply wiring 160, and a second power supply wiring 170 are disposed. The first scan drive circuit 110 provides a scan signal to each pixel (main pixel PXm, auxiliary pixel PXa) via a scan line SL. The first scan drive circuit 110 provides a light emission control signal to each pixel (main pixel PXm, auxiliary pixel PXa) via a light emission control line EL. The second scan drive circuit 120 is disposed in parallel with the first scan drive circuit 110 with the display area DA therebetween. Among the pixels (main pixel PXm, auxiliary pixel PXa) disposed in the display area DA, some are electrically connected to the first scan drive circuit 110, and the rest are connected to the second scan drive circuit 120. In another embodiment, the second scan drive circuit 120 may be omitted. The terminal 140 is disposed on one side of the substrate 100. The terminal 140 is exposed without being covered by an insulating layer and is electrically connected to a printed circuit board PCB. A terminal PCB-P of the printed circuit board PCB is electrically connected to the terminal 140 of the display panel 2. The printed circuit board PCB transmits a signal or power supply of a control unit (not shown) to the display panel 2. The control signal generated by the control unit is transmitted to the first scan drive circuit 110 and the second scan drive circuit 120 via the printed circuit board PCB, respectively. The control unit provides a first power supply voltage ELVDD and a second power supply voltage ELVSS (FIGS. 4 and 5) to the first power supply wiring 160 and the second power supply wiring 170 via a first connection wiring 161 and a second connection wiring 171, respectively. The first power supply voltage ELVDD is provided to each pixel (main pixel PXm, auxiliary pixel PXa) via a driving voltage line PL connected to the first power supply wiring 160, and the second power supply voltage ELVSS is provided to the counter electrode of each pixel (main pixel PXm, auxiliary pixel PXa) connected to the second power supply wiring 170. The data driving circuit 150 is electrically connected to the data line DL. The data signal of the data driving circuit 150 is provided to each pixel (main pixel PXm, auxiliary pixel PXa) via a connection wiring 151 connected to the terminal 140 and a data line DL connected to the connection wiring 151. FIG. 3 illustrates the data driving circuit 150 as being disposed on a printed circuit board PCB, but in other embodiments, the data driving circuit 150 may also be disposed on the substrate 100. For example, the data driving circuit 150 is disposed between the terminal 140 and the first power supply wiring 160. The first power supply wiring 160 is disposed between the second display area DA2 and the terminal 140 and includes a first sub-wiring 162 and a second sub-wiring 163 arranged side by side and extending along the x direction. The second power supply wiring 170 partially surrounds the display area DA in a loop shape with one side open.

[0047] FIGS. 4 and 5 are equivalent circuit diagrams of pixels of a display panel according to an embodiment of the present invention. Referring to FIGS. 4 and 5, each pixel (PXm, PXa) includes a pixel circuit PC connected to a scan line SL and a data line DL, and an organic light emitting element OLED connected to the pixel circuit PC. The pixel circuit PC includes a driving thin film transistor T1, a switching thin film transistor T2, and a storage capacitor Cst.

[0048] The switching thin film transistor T2 is connected to the scan line SL and the data line DL, and transmits the data signal Dm input via the data line DL to the driving thin film transistor T1 by a scan signal Sn input via the scan line SL. The storage capacitor Cst is connected to the switching thin film transistor T2 and the drive voltage line PL, and stores a voltage corresponding to the difference between the voltage transmitted from the switching thin film transistor T2 and the drive voltage (or power supply voltage) ELVDD supplied to the drive voltage line PL. The driving thin film transistor T1 is connected to the drive voltage line PL and the storage capacitor Cst, controls the drive current flowing from the drive voltage line PL to the organic light emitting element OLED, corresponding to the voltage value stored in the storage capacitor Cst. The organic light emitting element OLED emits light having a predetermined luminance by the drive current.

[0049] In FIG. 4, the case where the pixel circuit PC includes two thin film transistors and one storage capacitor is described, but the present invention is not limited thereto. As shown in FIG. 5, the pixel circuit PC may include seven thin film transistors and one storage capacitor. In FIG. 5, it is illustrated as including one storage capacitor, but the pixel circuit PC may include two or more storage capacitors.

[0050] Referring to FIG. 5, each pixel (PXm, PXa) includes a pixel circuit PC and an organic light emitting diode OLED connected to the pixel circuit PC. The pixel circuit PC includes a plurality of thin film transistors and a storage capacitor. The thin film transistors and the storage capacitor are connected to signal lines (SL, SL-1, EL, DL), an initialization voltage line VL, and a drive voltage line PL. In FIG. 5, the pixels (PXm, PXa) are illustrated as being connected to the signal lines (SL, SL-1, EL, DL), the initialization voltage line VL, and the drive voltage line PL, but the present invention is not limited thereto. As another embodiment, at least one of the signal lines (SL, SL-1, EL, DL), the initialization voltage line VL, the drive voltage line PL, etc. are also shared by adjacent pixels.

[0051] The signal lines include a scan line SL for transmitting a scan signal Sn, a previous scan line (SL-1) for transmitting a previous scan signal (Sn-1) to a first initialization thin film transistor T4 and a second initialization thin film transistor T7, a light emission control line EL for transmitting a light emission control signal En to an operation control thin film transistor T5 and a light emission control thin film transistor T6, and a data line DL that intersects the scan line SL and transmits a data signal Dm. The drive voltage line PL transmits a drive voltage ELVDD to the drive thin film transistor T1, and the initialization voltage line VL transmits an initialization voltage Vint for initializing the drive thin film transistor T1 and the pixel electrode.

[0052] The drive gate electrode G1 of the drive thin film transistor T1 is connected to the lower electrode CE1 of the storage capacitor Cst. The drive source electrode S1 of the drive thin film transistor T1 is connected to the drive voltage line PL via the operation control thin film transistor T5. The drive drain electrode D1 of the drive thin film transistor T1 is electrically connected to the pixel electrode of the organic light emitting element OLED via the light emission control thin film transistor T6. The drive thin film transistor T1 transmits the data signal Dm by the switching operation of the switching thin film transistor T2, and supplies a drive current I OLED to the organic light emitting element OLED.

[0053] The switching gate electrode G2 of the switching thin film transistor T2 is connected to the scan line SL. The switching source electrode S2 of the switching thin film transistor T2 is connected to the data line DL. The switching drain electrode D2 of the switching thin film transistor T2 is connected to the drive source electrode S1 of the drive thin film transistor T1 and is connected to the drive voltage line PL via the operation control thin film transistor T5. The switching thin film transistor T2 is turned on by a scan signal Sn transmitted through a scan line SL, and executes a switching operation of transmitting a data signal Dm transmitted to a data line DL to a driving source electrode S1 of a driving thin film transistor T1.

[0054] A compensation gate electrode G3 of a compensation thin film transistor T3 is connected to a scan line SL, a compensation source electrode S3 of the compensation thin film transistor T3 is connected to a driving drain electrode D1 of a driving thin film transistor T1, and is connected to a pixel electrode of an organic light emitting element OLED via a light emission control thin film transistor T6. A compensation drain electrode D3 of the compensation thin film transistor T3 is connected to a lower electrode CE1 of a storage capacitor Cst, a first initialization drain electrode D4 of a first initialization thin film transistor T4, and a driving gate electrode G1 of the driving thin film transistor T1. The compensation thin film transistor T3 is turned on by a scan signal Sn transmitted through a scan line SL, electrically connects a driving gate electrode G1 and a driving drain electrode D1 of the driving thin film transistor T1, and diode-connects the driving thin film transistor T1.

[0055] A first initialization gate electrode G4 of a first initialization thin film transistor T4 is connected to a previous scan line (SL-1), a first initialization source electrode S4 of the first initialization thin film transistor T4 is connected to a second initialization drain electrode D7 of a second initialization thin film transistor T7 and an initialization voltage line VL, and a first initialization drain electrode D4 of the first initialization thin film transistor T4 is connected to a lower electrode CE1 of a storage capacitor Cst, a compensation drain electrode D3 of a compensation thin film transistor T3, and a driving gate electrode G1 of a driving thin film transistor T1. The first initialization thin film transistor T4 is turned on by a previous scan signal (Sn-1) transmitted through a previous scan line (SL-1), transmits an initialization voltage Vint to a driving gate electrode G1 of the driving thin film transistor T1, and executes an initialization operation of initializing the voltage of the driving gate electrode G1 of the driving thin film transistor T1.

[0056] The operation control gate electrode G5 of the operation control thin film transistor T5 is connected to the emission control line EL. The operation control source electrode S5 of the operation control thin film transistor T5 is connected to the drive voltage line PL. The operation control drain electrode D5 of the operation control thin film transistor T5 is connected to the drive source electrode S1 of the drive thin film transistor T1 and the switching drain electrode D2 of the switching thin film transistor T2. The emission control gate electrode G6 of the emission control thin film transistor T6 is connected to the emission control line EL. The emission control source electrode S6 of the emission control thin film transistor T6 is connected to the drive drain electrode D1 of the drive thin film transistor T1 and the compensation source electrode S3 of the compensation thin film transistor T3. The emission control drain electrode D6 of the emission control thin film transistor T6 is electrically connected to the second initialization source electrode S7 of the second initialization thin film transistor T7 and the pixel electrode of the organic light emitting element OLED. The operation control thin film transistor T5 and the emission control thin film transistor T6 are simultaneously turned on by the emission control signal En transmitted through the emission control line EL, and the drive voltage ELVDD is transmitted to the organic light emitting element OLED, so that a drive current I OLED flows through.

[0057] The second initialization gate electrode G7 of the second initialization thin film transistor T7 is connected to the previous scan line (SL-1). The second initialization source electrode S7 of the second initialization thin film transistor T7 is connected to the emission control drain electrode D6 of the emission control thin film transistor T6 and the pixel electrode of the organic light emitting element OLED. The second initialization drain electrode D7 of the second initialization thin film transistor T7 is connected to the first initialization source electrode S4 of the first initialization thin film transistor T4 and the initialization voltage line VL. The second initialization thin film transistor T7 is turned on by the previous scan signal (Sn-1) transmitted through the previous scan line (SL-1) to initialize the pixel electrode of the organic light emitting element OLED.

[0058] FIG. 5 illustrates the case where the first initialization thin film transistor T4 and the second initialization thin film transistor T7 are connected to the previous scan line (SL-1), but the present invention is not limited thereto. As another embodiment, the first initialization thin film transistor T4 is connected to the previous scan line (SL-1) and driven by the previous scan signal (Sn-1), and the second initialization thin film transistor T7 is connected to a separate signal line (for example, the subsequent scan line) and driven by a signal transmitted to the signal line.

[0059] The upper electrode CE2 of the storage capacitor Cst is connected to the driving voltage line PL, and the counter electrode of the organic light emitting element OLED is connected to the common voltage ELVSS. Thereby, the organic light emitting element OLED can display an image by transmitting the driving current I OLED from the driving thin film transistor T1 and emitting light. In FIG. 5, the compensation thin film transistor T3 and the first initialization thin film transistor T4 are illustrated as having dual gate electrodes, but the compensation thin film transistor T3 and the first initialization thin film transistor T4 can have one gate electrode.

[0060] FIG. 6 is a layout diagram schematically showing a pixel circuit of a pixel according to an embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along the lines I-I' and II-II' of FIG. 6. Referring to FIGS. 6 and 7, the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the light emission control thin film transistor T6, and the second initialization thin film transistor T7 are arranged along the semiconductor layer 1130.

[0061] The semiconductor layer 1130 is disposed on a substrate on which a buffer layer made of an inorganic insulating material is formed. In the present embodiment, the semiconductor layer 1130 may include low temperature poly-silicon (LTPS). The polysilicon material has a high electron mobility (100 cm 3 / Vs or higher), low energy consumption power, and excellent reliability, so it is used as the semiconductor layer of thin film transistors in display devices. However, the present invention is not limited thereto. In other embodiments, the semiconductor layer 1130 may be formed of amorphous silicon (a-Si) and / or an oxide semiconductor. Some of the semiconductor layers of the plurality of thin film transistors may be formed of low temperature polysilicon (LTPS), and some other semiconductor layers may be formed of amorphous silicon (a-Si) and / or an oxide semiconductor.

[0062] A partial region of the semiconductor layer 1130 corresponds to the semiconductor layers of the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the light emission control thin film transistor T6, and the second initialization thin film transistor T7. In other words, it can be understood that the semiconductor layers of the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the light emission control thin film transistor T6, and the second initialization thin film transistor T7 are connected to each other and are bent in various shapes.

[0063] The semiconductor layer 1130 includes a channel region, and a source region and a drain region on both sides of the channel region. The source region and the drain region can also be understood as the source electrode and the drain electrode of the corresponding thin film transistor. Hereinafter, for convenience, the source region and the drain region are referred to as the source electrode and the drain electrode, respectively.

[0064] The driving thin film transistor T1 includes a driving gate electrode G1 that overlaps the driving channel region, and a driving source electrode S1 and a driving drain electrode D1 on both sides of the driving channel region. The driving channel region overlapping with the driving gate electrode G1 has a meandering shape like the shape of the Greek letter omega, so that a long channel length can be formed in a narrow space. When the length of the driving channel region is long, the driving range of the gate voltage becomes wide, and the gradation of the light emitted from the organic light emitting diode OLED can be more precisely controlled, and the display quality can be improved.

[0065] The switching thin film transistor T2 includes a switching gate electrode G2 overlapping the switching channel region, and a switching source electrode S2 and a switching drain electrode D2 on both sides of the switching channel region. The switching drain electrode D2 is connected to the driving source electrode S1. The compensation thin film transistor T3 is a dual thin film transistor, and includes a compensation gate electrode G3 overlapping two compensation channel regions, and a compensation source electrode S3 and a compensation drain electrode D3 arranged on both sides. The compensation thin film transistor T3 is connected to the driving gate electrode G1 of the driving thin film transistor T1 via a node connection line 1174 described later.

[0066] The first initialization thin film transistor T4 is a dual thin film transistor, and includes a first initialization gate electrode G4 overlapping two first initialization channel regions, and a first initialization source electrode S4 and a first initialization drain electrode D4 arranged on both sides. The operation control thin film transistor T5 includes an operation control gate electrode G5 overlapping the operation control channel region, and an operation control source electrode S4 and an operation control drain electrode D5 located on both sides. The operation control drain electrode D5 is connected to the driving source electrode S1.

[0067] The light emission control thin film transistor T6 includes a light emission control gate electrode G6 that overlaps the light emission control channel region, and a light emission control source electrode S6 and a light emission control drain electrode D6 located on both sides. The light emission control source electrode S6 is connected to the drive drain electrode D1. The second initialization thin film transistor T7 includes a second initialization gate electrode G7 that overlaps the second initialization channel region, and a second initialization source electrode S7 and a second initialization drain electrode D7 located on both sides. The aforementioned thin film transistors are connected to signal lines (SL, SL-1, EL, DL), an initialization voltage line VL, and a drive voltage line PL.

[0068] On the aforementioned semiconductor layer 1130, with an insulating layer in between, a scan line SL, a previous scan line (SL-1), a light emission control line EL, and a drive gate electrode G1 are arranged. The scan line SL extends along the first direction DR1. One region of the scan line SL corresponds to the switching gate electrode G2 and the compensation gate electrode G3. For example, in the scan line SL, the regions that overlap the channel regions of the switching thin film transistor T2 and the compensation thin film transistor T3 are the switching gate electrode G2 and the compensation gate electrode G3, respectively.

[0069] The previous scan line (SL-1) extends along the first direction DR1, and a partial region corresponds to the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively. For example, in the previous scan line (SL-1), the regions that overlap the channel regions of the first initialization drive thin film transistor T4 and the second initialization drive thin film transistor T7 may be the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively. The light emission control line EL extends along the first direction DR1. One region of the light emission control line EL corresponds to the operation control gate electrode G5 and the light emission control gate electrode G6, respectively. For example, in the light emission control line EL, the regions overlapping with the channel regions of the operation control driving thin film transistor T6 and the light emission control driving thin film transistor T7 are also the operation control gate electrode G5 and the light emission control gate electrode G6, respectively. The driving gate electrode G1 is a floating electrode and is connected to the compensation thin film transistor T3 via the aforementioned node connection line 1174.

[0070] An electrode voltage line HL is disposed above the aforementioned scan line SL, previous scan line (SL - 1), light emission control line EL, and driving gate electrode G1 with an insulating layer interposed therebetween. The electrode voltage line HL extends along the first direction DR1 so as to intersect the data line DL and the driving voltage line PL. A part of the electrode voltage line HL covers at least a part of the driving gate electrode G1 and forms a storage capacitor Cst together with the driving gate electrode G1. For example, the driving gate electrode G1 becomes the lower electrode CE1 of the storage capacitor Cst, and a part of the electrode voltage line HL becomes the upper electrode CE2 of the storage capacitor Cst.

[0071] The upper electrode CE2 of the storage capacitor Cst is electrically connected to the driving voltage line PL. In relation to that, the electrode voltage line HL is connected to the driving voltage line PL disposed on the electrode voltage line HL via a contact hole CNT. Therefore, the electrode voltage line HL has the same voltage level (constant voltage) as the driving voltage line PL. For example, the electrode voltage line HL can have a constant voltage of +5V. The electrode voltage line HL can be understood as a horizontal driving voltage line.

[0072] The drive voltage line PL extends along the second direction DR2, and the electrode voltage line HL electrically connected to the drive voltage line PL extends along the first direction DR1 that intersects the second direction DR2. Therefore, in the display area DA (Figure 1), the plurality of drive voltage lines PL and the electrode voltage lines HL form a mesh structure. On the electrode voltage line HL, a data line DL, a drive voltage line PL, an initialization connection line 1173, and a node connection line 1174 are arranged with an insulating layer interposed therebetween. The data line DL extends in the second direction DR2 and is connected to the switching source electrode S2 of the switching thin film transistor T2 via the contact hole 1154. A part of the data line DL is also understood as the switching source electrode.

[0073] The drive voltage line PL extends in the second direction DR2 and is connected to the electrode voltage line HL via the contact hole CNT as described above. Also, it is connected to the operation control thin film transistor T5 via the contact hole 1155. The drive voltage line PL is connected to the operation control drain electrode D5 via the contact hole 1155. One end of the initialization connection line 1173 is connected to the first initialization thin film transistor T4 and the second initialization thin film transistor T7 via the contact hole 1152, and the other end is connected to the initialization voltage line VL described later via the contact hole 1151. One end of the node connection line 1174 is connected to the compensation drain electrode D3 via the contact hole 1156, and the other end is connected to the drive gate electrode G1 via the contact hole 1157.

[0074] An initialization voltage line VL is arranged on the data line DL, the drive voltage line PL, the initialization connection line 1173, and the node connection line 1174 with an insulating layer interposed therebetween. The initialization voltage line VL extends in the first direction DR1. The initialization voltage line VL is connected to the first initialization driving thin film transistor T4 and the second initialization driving thin film transistor T7 via the initialization connection line 1173. The initialization voltage line VL may have a constant voltage (for example, -2V, etc.). The initialization voltage line VL is disposed on the same layer as the pixel electrode 210 of the organic light emitting diode OLED (FIG. 7) and may contain the same material.

[0075] The pixel electrode 210 is connected to the light emission control thin film transistor T6. The pixel electrode 210 is connected to the connection metal 1175 via the contact hole 1163, and the connection metal 1175 is connected to the light emission control drain electrode D6 via the contact hole 1153. In FIG. 6, the initialization voltage line VL is described as being disposed on the same layer as the pixel electrode 210. However, in other embodiments, the initialization voltage line VL may also be disposed on the same layer as the electrode voltage line HL.

[0076] Hereinafter, with reference to FIG. 7, a stacked structure of the configuration included in the display panel according to an embodiment of the present invention will be described. The substrate 100 may include glass or a polymer resin. The polymer resin may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate (PET), polyphenylene sulfide, polyarylate, polyimide (PI), polycarbonate, or cellulose acetate propionate. The substrate 100 including the polymer resin can have flexible, rollable, or bendable characteristics.

[0077] The substrate 100 may be a multilayer structure including a layer containing the aforementioned polymer resin and an inorganic layer (not shown). The buffer layer 111 is located on the substrate 100 and can reduce or block the penetration of foreign substances, moisture, or outside air from the lower part of the substrate 100, and provides a flat surface on the substrate 100. The buffer layer 111 may contain an inorganic substance such as an oxide or a nitride, an organic substance, or an organic / inorganic composite, and may have a single-layer structure or a multilayer structure of an inorganic substance and an organic substance. A barrier layer (not shown) for blocking the penetration of outside air may be further included between the substrate 100 and the buffer layer 111.

[0078] On the semiconductor layers (A1, A6), gate electrodes (G1, G6) are disposed with a first gate insulating layer 112 interposed therebetween. The gate electrodes (G1, G6) contain molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed of a single layer or multiple layers. As an example, the gate electrodes (G1, G6) are a single layer of Mo. The scan line SL (FIG. 6), the previous scan line (SL-1) (FIG. 6), and the emission control line EL (FIG. 6) are formed in the same layer as the gate electrodes (G1, G6). That is, the gate electrodes (G1, G6), the scan line SL (FIG. 6), the previous scan line (SL-1) (FIG. 6), and the emission control line EL (FIG. 6) are disposed on the first gate insulating layer 112.

[0079] The first gate insulating layer 112 is silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), or zinc oxide (ZnO 2 ), etc. A second gate insulating layer 113 is provided so as to cover the gate electrodes (G1, G6). The second gate insulating layer 113 is silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), or zinc oxide (ZnO 2 ) and the like may be included.

[0080] The lower electrode CE1 of the storage capacitor Cst is formed integrally with the driving gate electrode G1 of the driving thin film transistor T1. For example, the driving gate electrode G1 of the driving thin film transistor T1 functions as the lower electrode CE1 of the storage capacitor Cst. The upper electrode CE2 of the storage capacitor Cst sandwiches the second gate insulating layer 113 and overlaps the lower electrode CE1. In this case, the second gate insulating layer 113 functions as the dielectric layer of the storage capacitor Cst. The upper electrode CE2 may include a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed into a multilayer or a single layer containing the above-mentioned materials. As an example, the upper electrode CE2 is a single layer of Mo or a multilayer of Mo / Al / Mo.

[0081] In FIG. 7, the storage capacitor Cst is shown so as to overlap the driving thin film transistor T1, but the present invention is not limited thereto. The storage capacitor Cst can be variously deformed, such as being arranged so as not to overlap the driving thin film transistor T1. The upper electrode CE2 functions as the electrode voltage line HL. For example, a part of the electrode voltage line HL can be the upper electrode CE2 of the storage capacitor Cst.

[0082] An interlayer insulating layer 115 is provided so as to cover the upper electrode CE2. The interlayer insulating layer 115 is silicon oxide (SiO 2 ), silicon nitride (SiN x) Silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), or zinc oxide (ZnO 2 ), etc. may be included. In FIG. 7, the interlayer insulating layer 115 is shown as a single layer, but in one embodiment, the interlayer insulating layer 115 may also be formed in a multilayer structure.

[0083] On the interlayer insulating layer 115, a data line DL, a driving voltage line PL, and a connection metal 1175 are arranged. The data line DL, the driving voltage line PL, and the connection metal 1175 may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed in a multilayer or single layer including the above materials. As an example, the data line DL, the driving voltage line PL, and the connection metal 1175 are formed by a multilayer structure of Ti / Al / Ti. The upper electrode CE2 of the storage capacitor Cst is also connected to the driving voltage line PL through a contact hole CNT defined in the interlayer insulating layer 115. This means that the electrode voltage line HL is connected to the driving voltage line PL through the contact hole CNT. Therefore, the electrode voltage line HL has the same voltage level (constant voltage) as the driving voltage line PL.

[0084] The connection metal 1175 is connected to the semiconductor layer A6 of the light emission control thin film transistor T6 through a contact hole 1153 penetrating the interlayer insulating layer 115, the second gate insulating layer 113, and the first gate insulating layer 112. Through the connection metal 1175, the light emission control thin film transistor T6 is electrically connected to the pixel electrode 210 of the organic light emitting diode OLED. On the data line DL, the driving voltage line PL, and the connection metal 1175, a planarization layer 117 is located, and an organic light-emitting diode OLED is located on the planarization layer 117.

[0085] The planarization layer 117 has a flat upper surface so that the pixel electrode 210 is formed flat. The planarization layer 117 is formed of a single layer or multiple layers of a film made of an organic substance. Such a planarization layer 117 may include benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), general-purpose polymers such as polymethyl methacrylate (PXMMA) and polystyrene (PS), polymer derivatives having a phenolic group, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0086] The planarization layer 117 may contain an inorganic substance. Such a planarization layer 117 is silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), or zinc oxide (ZnO 2 ), etc. When the planarization layer 117 is provided by an inorganic substance, a chemical mechanical polishing process is performed in some cases. On the other hand, the planarization layer 117 may contain both an organic substance and an inorganic substance.

[0087] The pixel electrode 210 is a (semi) transparent electrode or a reflective electrode. In one embodiment, the pixel electrode 210 includes a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and compounds thereof, and a transparent electrode layer or a semi-transparent electrode layer formed on the reflective film. The transparent electrode layer or the semi-transparent electrode layer comprises at least one selected from the group including indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In one embodiment, the pixel electrode 210 has a structure laminated by ITO / Ag / ITO.

[0088] On the planarization layer 117, a pixel definition film 119 is disposed. The pixel definition film 119 has an opening 119OP that exposes the central portion of the pixel electrode 210 (FIG. 2), thereby defining the light-emitting region of the pixel. In addition, the pixel definition film 119 serves to prevent the occurrence of arcs or the like at the edge of the pixel electrode 210 by increasing the distance between the edge of the pixel electrode 210 and the counter electrode 230 above the pixel electrode 210. The pixel definition film 119 is an organic insulating material such as polyimide (PI), polyamide, acrylic resin, benzocyclobutene, hexamethyldisiloxane (HMDSO), and phenolic resin, and is formed by a method such as spin coating.

[0089] The intermediate layer 220 of the organic light-emitting diode OLED includes an organic light-emitting layer. The organic light-emitting layer may include an organic material containing a fluorescent substance or a phosphorescent substance that emits red, green, blue, or white light. The organic light-emitting layer is a low-molecular organic material or a high-molecular organic material. Functional layers such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL) are selectively further disposed above and below the organic light-emitting layer. The intermediate layer 220 is disposed corresponding to each of the plurality of pixel electrodes 210. However, it is not limited thereto. The intermediate layer 220 can have various modifications such as including a layer that is integral across the plurality of pixel electrodes 210.

[0090] The size of the intermediate layer 220 that emits light of the same hue to each other is different between the first display region DA1 and the second display region DA2. For example, the area on the plane of at least one layer among the intermediate layers 220 of the main pixel PXm is different from the area on the plane of at least one layer among the intermediate layers 220 of the auxiliary pixel PXa. In particular, the area on the plane of at least one layer among the intermediate layers 220 of the main pixel PXm is narrower than the area on the plane of at least one layer among the intermediate layers 220 of the auxiliary pixel PXa. For example, in the intermediate layer 220 of the main pixel PXm, the area on the plane of the hole injection layer is narrower than the area on the plane of the hole injection layer in the intermediate layer 220 of the auxiliary pixel PXa. As another embodiment, in the intermediate layer 220 of the main pixel PXm, the area on the plane of the organic light-emitting layer is narrower than the area on the plane of the organic light-emitting layer in the intermediate layer 220 of the auxiliary pixel PXa. As still another embodiment, in the intermediate layer 220 of the main pixel PXm, the area on the plane of the hole injection layer and the organic light-emitting layer is narrower than the area on the plane of the hole injection layer and the organic light-emitting layer in the intermediate layer 220 of the auxiliary pixel PXa. At this time, the relationship as described above is not limited to what has been described above, and can also be applied to the pixel electrode, hole transport layer, electron transport layer, electron injection layer, etc.

[0091] Also, the thickness of the intermediate layer 220 of the main pixel PXm and the thickness of the intermediate layer 220 of the auxiliary pixel PXa each have a uniform portion and a variable section. For example, the thickness of the intermediate layer 220 disposed on the pixel electrode 210 of each pixel is constant, and the thickness of the intermediate layer 220 disposed on the inner surface of the opening 119OP of the pixel defining film 119 is not constant. In such a case, the thickness of the intermediate layer 220 disposed on the inner surface of the opening 119OP of the pixel definition film 119 becomes thinner as it is farther from the pixel electrode 210. As another embodiment, the thickness of the intermediate layer 220 disposed on a part of the pixel electrode 210 of each pixel is constant, and the thickness of the intermediate layer 220 becomes thinner from the end (or, frame) of the portion where the thickness of the intermediate layer 220 is constant to the end of the intermediate layer 220. At this time, the thickness of the intermediate layer 220 is measured in the vertical direction from the surface of the pixel electrode 210 with which the intermediate layer 220 is in direct contact or the surface of the pixel definition film 119 to the surface of the intermediate layer 220 that contacts the counter electrode 230. In the following, for the sake of convenience of explanation, the case where the variable-thickness section of the intermediate layer 220 is disposed only on the inner surface of the opening of the pixel definition film 119 will be described in detail.

[0092] In the case as described above, in the intermediate layer 220 of the main pixel PXm, the thickness of the intermediate layer 220 in the portion where the thickness is constant and the thickness of the intermediate layer 220 in the intermediate layer 220 of the auxiliary pixel PXa in the portion where the thickness is constant are the same as each other. Also, the first length LX of the variable-thickness section of the intermediate layer 220 of the main pixel PXm m is different from the second length LX of the variable-thickness section of the intermediate layer 220 of the auxiliary pixel PXa. a For example, one of the first length LX m or the second length LX a is longer than the first length LX m or the second length LX. a Specifically, the first length LX m is longer than the second length LX a or the second length LX a is longer than the first length LX. m At this time, when the resolution of the second display area DA2 is higher than the resolution of the first display area DA1, the first length LX m is longer than the second length LX. a ​​​​As another embodiment, when the resolution of the second display area DA2 is lower than that of the first display area DA1, the first length LX m is shorter than the second length LX a .

[0093] In such a case, since the section where the thickness of the intermediate layer 220 of each pixel varies becomes shorter, at least one of the first display area DA1 and the second display area DA2 can embody a clear image. In particular, when the second length LX a is shorter than the first length LX m , it is possible to secure the maximum transmission area TA, so that malfunctions and deterioration of operating performance can be prevented during the operation of a component (not shown) disposed in the first display area DA1. In the following, for convenience of explanation, the case where the second length LX a is shorter than the first length LX m will be described in detail.

[0094] The counter electrode 230 is a translucent electrode or a reflective electrode. In some embodiments, the counter electrode 230 is a transparent electrode or a semi-transparent electrode, and is formed of a thin metal film having a small work function, including Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and their compounds. Also, a TCO (transparent conductive oxide) film such as ITO, IZO, ZnO, or In 2 O 3 can be further disposed on the metal thin film.

[0095] When the pixel electrode 210 is provided as a reflective electrode and the counter electrode 230 is provided as a translucent electrode, the light emitted from the intermediate layer 220 is emitted toward the counter electrode 230 side, and the display device becomes a front light emission type. When the pixel electrode 210 is composed of a transparent electrode or a semi-transparent electrode and the counter electrode 230 is composed of a reflective electrode, the light emitted from the intermediate layer 220 is emitted toward the substrate 100 side, and the display device becomes a back light emission type. However, the present embodiment is not limited thereto. The display device of the present embodiment may be a double-sided light-emitting type that emits light in both the front and back directions.

[0096] In the present embodiment, the counter electrode 230 is disposed over the entire second display region DA2, and a part of the edge is located in the peripheral region PA. The counter electrode 230 is integrally formed in the main pixels PXm located on the second display region DA2, that is, in a plurality of organic light-emitting diodes OLEDs, and corresponds to the plurality of pixel electrodes 210. On the other hand, the counter electrode 230 is provided in the auxiliary pixels PXa located on the first display region DA1. However, the first display region DA1 includes a transmission region TA located between the auxiliary pixels PXa, but a part of the counter electrode 230 is not provided in a partial region corresponding to the transmission region TA. Here, in the case of the front light-emitting type display device, it goes without saying that light is emitted to the counter electrode 230 side, but the transmittance is partially reduced by the counter electrode 230. Therefore, by not providing the counter electrode 230 in the region corresponding to the transmission region TA, the transmittance of the transmission region TA can be improved.

[0097] At this time, the counter electrodes 230 arranged separately from each other in the first display region DA1 are connected by a separate bridge, or at least a part of the counter electrodes 230 adjacent to each other overlap each other. The main pixels PXm and the auxiliary pixels PXa as described above each include the pixel electrode 210, the intermediate layer 220, and the counter electrode 230 described above. At this time, although not shown in the figure, the auxiliary pixel PXa may include a first pixel electrode (not shown), a first intermediate layer (not shown), and a first counter electrode (not shown), and the main pixel PXm may include a second pixel electrode (not shown), a second intermediate layer (not shown), and a second counter electrode (not shown).

[0098] FIG. 8 is a cross-sectional view showing a schematic configuration of a manufacturing apparatus for a display device according to an embodiment of the present invention, and FIG. 9 is a perspective view showing the mask assembly shown in FIG. 8. Referring to FIGS. 8 and 9, the display device DD is manufactured by a manufacturing apparatus 1 for a display device. The manufacturing apparatus 1 for a display device includes a chamber 10, a mask assembly 20, a first support portion 30, a second support portion 40, a vapor deposition source 50, a magnetic force generation portion 60, a vision portion 70, and a pressure adjustment portion 80.

[0099] The chamber 10 has a space formed therein, and a part of the chamber 10 is formed to be opened. At this time, a gate valve 11 is disposed at the opened portion of the chamber 10 so as to be openable and closable. The mask assembly 20 is selectively disposed inside the chamber 10. At this time, the mask assembly 20 may include a mask frame 21 and a mask sheet 22. The mask sheet 22 is fixed in a state of being pulled by the mask frame 21. The mask sheet 22 includes at least one or more first pattern holes PH1 and at least one second pattern hole PH2. The first pattern hole PH1 and the second pattern hole PH2 are through holes formed so that a vapor deposition material passes through the mask sheet 22.

[0100] The mask assembly 20 includes a mask frame 21 and a mask sheet 22. The mask frame 21 is formed by connecting a plurality of frames to each other and includes an opening therein. At this time, the mask frame 21 may include one opening or a plurality of openings divided from each other. In such a case, the mask frame 21 is formed in a lattice shape like a window frame.

[0101] The mask sheet 22 is fixed in a state of being pulled by the mask frame 21. One or more mask sheets 22 may be provided. When one mask sheet 22 is provided, the mask sheet 22 is disposed on the mask frame 21 and shields the opening of the mask frame 21. In another embodiment, when a plurality of mask sheets 22 are provided, the plurality of mask sheets 22 are arranged adjacent to each other along one side of the mask frame 21 (for example, in the X direction or the Y direction) and can shield the opening of the mask frame 21. In the following, for the sake of convenience of explanation, the case where a plurality of mask sheets 22 are provided will be described in detail.

[0102] The mask assembly 20 further includes a support frame 23 that supports the mask sheet 22. The mask sheet 22 is disposed on the support frame 23. The support frame 23 is disposed in the opening of the mask frame 21 and is provided in a plurality. The support frames 23 are arranged so as to be spaced apart from each other in a direction parallel or perpendicular to the longitudinal direction of the mask sheet 22 (for example, in the Y direction). The substrate 100 is placed on the first support portion 30. At this time, the first support portion 30 can adjust the position of the substrate 100. For example, the first support portion 30 may include a UVW stage.

[0103] The mask assembly 20 is placed on the second support portion 40. At this time, similar to the first support portion 30, the second support portion 40 can adjust the position of the mask assembly 20. At least one of the first support portion 30 and the second support portion 40 is lifted inside the chamber 10. In such a case, at least one of the first support portion 30 and the second support portion 40 can adjust the distance between the substrate 100 and the mask frame 21.

[0104] After the deposition material is stored, the evaporation source 50 vaporizes or sublimes the deposition material and supplies it to the chamber 10. At this time, the evaporation source 50 may include a heater inside, and by operating the heater, the deposition material inside the evaporation source 50 can be heated to melt or sublime the deposition material. In the case as described above, the evaporation source 50 is disposed at the center or corner of the chamber 10. The magnetic force generation unit 60 is disposed in the chamber 10 and brings the substrate 100 and the mask assembly 20 into close contact with each other. At this time, the magnetic force generation unit 60 may include an electromagnet or a permanent magnet that generates a magnetic force.

[0105] The vision unit 70 is disposed in the chamber 10 and photographs the positions of the mask assembly 20 and the substrate 100. At this time, the vision unit 70 photographs at least one alignment mark of the mask assembly 20 and the substrate 100. The pressure adjustment unit 80 is connected to the chamber 10 and adjusts the pressure inside the chamber 10. At this time, the pressure adjustment unit 80 includes a connection pipe 81 connected to the chamber 10 and a pump 82 disposed in the connection pipe 81.

[0106] Regarding the operation of the manufacturing apparatus 1 of the display device as described above, the gate valve 11 is opened while the pressure adjustment unit 80 maintains the atmospheric pressure inside the chamber 10 to be the same as or similar to the atmospheric pressure, and the substrate 100 and the mask assembly 20 are inserted into the chamber 10. At this time, at least one of the substrate 100 and the mask assembly 20 is moved via a separate robot arm disposed outside the chamber 10 or a shuttle that inserts and withdraws into the chamber 10. At this time, the substrate 100 is in a state in which each layer disposed below the pixel definition film 119 as shown in FIG. 7, the pixel definition film 119, and the pixel electrode 210 are formed. After arranging the mask frame 21 and the substrate 100 on the second support portion 40 and the first support portion 30 respectively, the positions of the mask frame 21 and the substrate 100 are sensed by the vision unit 70 and aligned.

[0107] After that, after bringing the substrate 100 and the mask frame 21 close to each other, the magnetic force generating unit 60 makes the mask frame 21 and the substrate 100 adhere to each other. When the vapor deposition material is released from the vapor deposition source 50, the vapor deposition material is vapor deposited on the substrate 100 through the first pattern holes PH1 and the second pattern holes PH2 of the mask sheet 22 to form a pattern. At this time, the vapor deposition material is vapor deposited on the substrate 100 to form, for example, the intermediate layer 220 (FIG. 7), or at least one layer (for example, at least one layer of the organic light emitting layer and the functional layer) in the intermediate layer 220 (FIG. 7). When the above-described process is completed, the substrate 100 is carried out of the chamber 10 or moved to another place in the chamber 10 to form other layers on the substrate 100.

[0108] The operations as described above are individually executed in various layers. For example, a pixel electrode is formed through the mask assembly 20 as described above, the substrate 100 is transferred to a manufacturing apparatus of another display device, and at least one layer of the hole transport layer and the hole injection layer among the functional layers is formed on the pixel electrode. In a manufacturing apparatus of another display device, the substrate 100 is transferred, an organic light emitting layer is formed on the functional layer, the substrate 100 is transferred to a manufacturing apparatus of another display device, and a hole transport layer and an electron injection layer among the functional layers are formed on the organic light emitting layer. At this time, the organic light emitting layers having different colors are formed on the substrate 100 using different mask assemblies in a manufacturing apparatus of a separate display device for each organic light emitting layer. When the above-described process is completed, the counter electrode and the thin film encapsulation layer are sequentially formed on the functional layer in a manufacturing apparatus of still another display device. In such a case, at least one of the pixel electrode, the functional layer, and the organic light-emitting layer is formed on the substrate 100 in the manufacturing apparatus 1 of the display device shown in FIG. 8 or a manufacturing apparatus of a similar display device.

[0109] FIGS. 10A and 10B are plan views schematically showing a partial configuration of a mask sheet and a support frame according to an embodiment of the present invention. First, referring to FIG. 10A, a part of the mask sheet 22 overlaps with the support frame 23. In the pattern holes of the mask sheet 22, the pattern holes located in the region overlapping with the support frame 23 are shielded by the support frame 23.

[0110] That is, the deposition material cannot pass through the pattern holes located in the region where the support frame 23 and the mask sheet 22 overlap. Therefore, the region between the support frames 23 separated from each other is defined as the deposition region A. The deposition region A can have shapes such as polygons like triangles, ellipses, circles, etc., not to mention rectangles and squares, depending on the shape and arrangement of the support frame 23. The deposition region A includes a first region A1 and a second region A2 at least one side of which is surrounded by the first region A1 on a plane. FIG. 10A shows the case where there is one second region A2, but it is not limited thereto, and two or more second regions A2 may be included.

[0111] The mask sheet 22 is provided with a first pattern hole PH1 and a second pattern hole PH2 so that the deposition material can pass through. The first pattern hole PH1 and the second pattern hole PH2 are holes penetrating in the thickness direction of the mask sheet 22. The first pattern hole PH1 is arranged in the first region A1 in the deposition region A, and the second pattern hole PH2 is arranged in the second region A2 in the deposition region A. The shape of each of the first pattern hole PH1 and the second pattern hole PH2 may be rectangular or square, and may be various shapes such as polygons such as triangles, circles, and ellipses.

[0112] Here, the shapes of the first pattern hole PH1 and the second pattern hole PH2 are, for example, also the shapes on a plane parallel to one surface of the mask sheet 22 facing the vapor deposition source 50. In FIG. 10A, both the first pattern hole PH1 and the second pattern hole PH2 have a rectangular shape, but are not limited thereto. The shapes of the first pattern hole PH1 and the second pattern hole PH2 may be different from each other. Also, the areas of the first pattern hole PH1 and the second pattern hole PH2 may be different from each other. Here, the areas of the first pattern hole PH1 and the second pattern hole PH2 are the shape sizes of the first pattern hole PH1 and the second pattern hole PH2 on the plane. As an example, the shape size of the first pattern hole PH1 is smaller than the planar shape size of the second pattern hole PH2. FIG. 10A shows that the shape sizes of the first pattern hole PH1 and the second pattern hole PH2 are the same as each other, but are not limited thereto.

[0113] The number (i.e., density) per unit area of the first pattern hole PH1 and the second pattern hole PH2 may be different from each other. In one embodiment, the number of the first pattern holes PH1 per unit area is larger than the number of the second pattern holes PH2 per unit area. Through this, the display device DD can be manufactured so that the first display area DA1 and the second display area DA2 of the display device DD, which respectively correspond to the first area A1 and the second area A2 of the mask sheet 22, have different resolutions from each other. FIG. 10A shows that four second pattern holes PH2 are arranged in the second region A2, but this is exemplary and not limiting.

[0114] On the other hand, the thicknesses of the mask sheet 22 in the first region A1 and the second region A2 may be different from each other. As an example, the thickness in the second region A2 may be thinner than the thickness in the first region A1, and the thickness in the second region A2 may be 50% or less, 40% or less, 30% or less, or 20% or less of the thickness in the first region A1. This will be described in detail later with reference to FIG. 16F.

[0115] Referring to FIG. 10B, a reference hole RH is additionally arranged in the second region A2 of the mask sheet 22. The reference hole RH is a through hole. At least two reference holes RH are arranged at the edge of the second region A2. For example, when the second region A2 has a rectangular shape, two reference holes RH adjacent to two corners located on the opposite sides of the diagonal line among the four corners of the second region A2 are arranged, or as shown in FIG. 10B, four reference holes RH adjacent to the four corners of the second region A2 are arranged. In addition, when the second region A2 has a circular shape, at least two reference holes RH can be arranged along the circumference at its edge. The reference hole RH is also utilized to align the material (base material) of the mask sheet 22 in the processing stage using a laser beam, as will be described in detail with reference to FIG. 19. Through this, a laser beam can be irradiated at an accurate position on the material of the mask sheet 22 to form a delicate pattern hole.

[0116] FIG. 11A is a plan view showing a pixel arrangement of a display device according to an embodiment of the present invention. Referring to FIG. 11A, the auxiliary pixels PXa arranged in the first display area DA1 include a first auxiliary pixel PXa1, a second auxiliary pixel PXa2, and a third auxiliary pixel PXa3. At this time, each of the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 emits light of different colors from each other. In addition, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are formed such that their forms and areas on the plane are the same as each other or different from each other.

[0117] The main pixels PXm arranged in the second display area DA2 include a first main pixel PXm1, a second main pixel PXm2, and a third main pixel PXm3. At this time, each of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 emits light of different colors from each other, and their respective forms and areas on the plane can be the same as each other or different from each other. The first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 emit light of the same color as the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3, respectively.

[0118] The auxiliary pixel PXa and the main pixel PXm as described above can be in various forms. For example, the main pixel PXm is arranged in an S-stripe type. At this time, in the S-stripe type, one of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 is rectangular, and the remaining two of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 are also square. In such a case, the remaining two of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 shown in FIG. 11A are arranged so as to correspond to one of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3.

[0119] The auxiliary pixel PXa is arranged in a pentile type of diamond structure. In such a case, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are arranged radially with one of the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 as a reference and the remaining two of the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3. In the case as described above, the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. For example, as an embodiment, the area on the plane of the auxiliary pixels PXa that emit the same color as each other and the area on the plane of the main pixels PXm are different from each other. For example, the area on the plane of the auxiliary pixels PXa that emit the same color as each other is less than the area on the plane of the main pixels PXm.

[0120] As another embodiment, while emitting the same color, the distance between the centers of the adjacent main pixels PXm is shorter than the distance between the centers of the adjacent auxiliary pixels PXa while emitting the same color. As still another embodiment, the number of auxiliary pixels PXa arranged in the unit area of the first display area DA1 (for example, 1 cm of the first display area DA1 2 ) is less than the number of main pixels PXm arranged in the unit area of the second display area DA2 (for example, 1 cm of the second display area DA2 2 ). Or, in the same area, the number of auxiliary pixels PXa arranged in each of the first display area DA1 and the second display area DA2 is less than the number of main pixels PXm. In such a case, the number of each pixel is the number of pixels that emit the same color.

[0121] FIG. 11B is a plan view showing a part of the first mask sheet used in manufacturing the first main pixel and the first auxiliary pixel shown in FIG. 11A. Referring to FIGS. 11A and 11B, the pixels of the display device DD manufactured using the first pattern hole PH1 of the mask sheet 22 are arranged in an S-stripe type, and the pixels of the display device DD manufactured using the second pattern hole PH2 are arranged in a pentile type of diamond structure.

[0122] One pattern hole corresponds to one pixel of the display device DD. For example, the deposition material that passes through one pattern hole and is deposited on the substrate forms the intermediate layer 220 (FIG. 7) of one pixel of the display device DD. Each pixel means a light-emitting region that emits a different color from each other, and each pixel is, for example, one of a red (R) pixel, a green (G) pixel, and a blue (B) pixel. When forming the first auxiliary pixel PXa1 and the first main pixel PXm1 through the manufacturing apparatus 1 of the display device shown in FIG. 8, the first mask sheet (22-1) is used. At this time, the first mask sheet (22-1) is formed with a first (1-1) pattern hole (PH1-1) and a second (2-1) pattern hole (PH2-1). The deposition material that has passed through such a first (1-1) pattern hole (PH1-1) and a second (2-1) pattern hole (PH2-1) is deposited on the substrate 100, and forms a layer having a certain pattern, such as a part of a source electrode, an organic light-emitting layer, and a functional layer, on the first main pixel PXm1 and the first auxiliary pixel PXa1, respectively.

[0123] The aforementioned first (1-1) pattern hole (PH1-1) and second (2-1) pattern hole (PH2-1) are formed to correspond to the sizes and shapes of the first auxiliary pixel PXa1 and the first main pixel PXm1, respectively. In such a case, the first (1-1) pattern hole (PH1-1) and the second (2-1) pattern hole (PH2-1) are arranged on the first mask sheet (22-1) so as to correspond to the positions of the first auxiliary pixel PXa1 and the first main pixel PXm1, respectively. In such a case, the relationship between the (1-1) pattern hole (PH1-1) and the (2-1) pattern hole (PH2-1) is the same as or similar to the relationship between the first auxiliary pixel PXa1 and the first main pixel PXm1.

[0124] For example, the number of (1-1) pattern holes (PH1-1) per unit area in the first region A1 of the first mask sheet (22-1) is larger than the number of (2-1) pattern holes (PH2-1) per unit area in the second region A2 of the first mask sheet (22-1). For example, as shown in FIG. 11B, the areas of the first region A1 and the second region A2 are the same. In the first region A1 of the same area, 24 (1-1) pattern holes (PH1-1) are arranged, and in the second region A2 of the same area, 4 (2-1) pattern holes (PH2-1) are arranged. Thereby, a display device DD having display regions with different resolutions can be manufactured.

[0125] Depending on the designed resolution, the number of (1-1) pattern holes (PH1-1) and (2-1) pattern holes (PH2-1) per unit area can be different. On the other hand, in the second region A2, the region where the (2-1) pattern holes (PH2-1) are not arranged corresponds to the transmissive region TA of the display device DD. In the case as described above, the first interval W1 between adjacent (1-1) pattern holes (PH1-1) is different from the second interval W2 between adjacent (2-1) pattern holes (PH2-1). At this time, the interval between pattern holes is also defined as the distance between the centers of adjacent pattern holes, the distance between the frames at the same position in the frames of the pattern holes arranged adjacent to each other, and the like.

[0126] However, hereinafter, the interval between pattern holes will be described in detail by meaning the distance between the centers of adjacent pattern holes. In the case as described above, the first interval W1 is narrower than the second interval W2. Through it, the interval between adjacent first main pixels PXm1 formed in the display device DD is narrower than the interval between adjacent first auxiliary pixels PXa1. In the case as described above, the first auxiliary pixel PXa1 and the first main pixel PXm1 emit light of one color among red, green, or blue. Hereinafter, for convenience of explanation, the case where the first auxiliary pixel PXa1 and the first main pixel PXm1 emit red light will be described in detail as the center.

[0127] FIG. 11C is a plan view showing a part of a second mask sheet used in manufacturing the second main pixel and the second auxiliary pixel shown in FIG. 11A. Referring to FIGS. 11A and 11C, when forming the second auxiliary pixel PXa2 and the second main pixel PXm2 through the manufacturing apparatus 1 of the display device shown in FIG. 8, a second mask sheet (22-2) is used.

[0128] At this time, a first (1-2) pattern hole (PH1-2) and a second (2-2) pattern hole (PH2-2) are formed in the second mask sheet (22-2). The deposited substances passing through such first (1-2) pattern hole (PH1-2) and second (2-2) pattern hole (PH2-2) are deposited on the substrate 100 to form a layer having a certain pattern, such as a part of a source electrode, an organic light-emitting layer, and a functional layer, on the second main pixel PXm2 and the second auxiliary pixel PXa2, respectively. The first (1-2) pattern hole (PH1-2) and the second (2-2) pattern hole (PH2-2) as described above are formed to correspond to the sizes and shapes of the second auxiliary pixel PXa2 and the second main pixel PXm2, respectively.

[0129] In such a case, the first (1-2) pattern hole (PH1-2) and the second (2-2) pattern hole (PH2-2) are arranged in the second mask sheet (22-2) to correspond to the positions of the second main pixel PXm2 and the second auxiliary pixel PXa2, respectively. In such a case, the relationship between the (1-2) pattern hole (PH1-2) and the (2-2) pattern hole (PH2-2) is the same as or similar to the relationship between the (1-1) pattern hole (PH1-1) and the (2-1) pattern hole (PH2-1) shown in FIG. 11B. Also, the relationship between the second auxiliary pixel PXa2 and the second main pixel PXm2 is the same as or similar to the relationship between the first auxiliary pixel PXa1 and the first main pixel PXm1 described above. In the case as described above, the second auxiliary pixel PXa2 and the second main pixel PXm2 emit light of one color among red, green, or blue. In the following, for the sake of convenience of explanation, the case where the second auxiliary pixel PXa2 and the second main pixel PXm2 emit green light will be described in detail.

[0130] FIG. 11D is a plan view showing a part of the third mask sheet used in manufacturing the third main pixel and the third auxiliary pixel shown in FIG. 11A. Referring to FIGS. 11A and 11D, when forming the third auxiliary pixel PXa3 and the third main pixel PXm3 through the manufacturing apparatus 1 of the display device shown in FIG. 8, the third mask sheet (22-3) is used. At this time, the (1-3) pattern hole (PH1-3) and the (2-3) pattern hole (PH2-3) are formed in the third mask sheet (22-3). The deposited material passing through such (1-3) pattern hole (PH1-3) and (2-3) pattern hole (PH2-3) is deposited on the substrate 100, and a layer having a certain pattern, such as a part of the source electrode, the organic light-emitting layer, and the functional layer, is formed at the corresponding positions of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively.

[0131] The (1-3) pattern hole (PH1-3) and the (2-3) pattern hole (PH2-3) as described above are formed so as to correspond to the sizes and shapes of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively. At this time, the (1-3) pattern holes (PH1-3) and the (2-3) pattern holes (PH2-3) are arranged on the third mask sheet (22-3) so as to correspond to the positions of the third main pixel PXm3 and the third auxiliary pixel PXa3, respectively. In such a case, the (1-3) pattern holes (PH1-3) and the (2-3) pattern holes (PH2-3) have different shapes from each other. In such a case, the size of the (1-3) pattern holes (PH1-3) is smaller than the size of the (2-3) pattern holes (PH2-3).

[0132] However, the number of the (2-3) pattern holes (PH2-3) per unit area and the distance between adjacent (2-3) pattern holes (PH2-3) are larger than the number of the (1-3) pattern holes (PH1-3) per unit area and the distance between adjacent (1-3) pattern holes (PH1-3). At this time, the relationship between the third auxiliary pixel PXa3 and the third main pixel PXm3 is the same as or similar to the relationship between the aforementioned (2-3) pattern holes (PH2-3) and the (1-3) pattern holes (PH1-3). In the case as described above, the third auxiliary pixel PXa3 and the third main pixel PXm3 emit light of one color among red, green, or blue. In the following, for the sake of convenience of explanation, the case where the third auxiliary pixel PXa3 and the third main pixel PXm3 emit blue light will be described in detail.

[0133] On the other hand, in the case as described above, in addition to the above, when forming a pixel electrode or forming a layer in a pattern form while entering all pixels in common in the functional layer, the mask sheets shown in FIGS. 11B to 11D are used, or although not shown in the figure, a single mask sheet can also be used. When forming a layer that enters all pixels in common using a single mask sheet, as shown in FIG. 11A, a mask sheet having the first pattern holes and the second pattern holes formed therein is used so as to correspond to all pixels. In such a case, they are arranged on a single mask sheet so that the pattern holes in FIGS. 11B to 11D do not overlap with each other.

[0134] FIG. 12 is a plan view showing a pixel arrangement of a display device according to another embodiment of the present invention. Referring to FIG. 12, the main pixel PXm has a hexagon structure, and the auxiliary pixel PXa has an S-stripe structure. At this time, in the hexagon structure, the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 are arranged at regular intervals from each other while having a hexagonal planar shape.

[0135] Also, the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are arranged in the same form as the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 shown in FIG. 11A. However, in such a case, the distance between adjacent first auxiliary pixels PXa1, the distance between adjacent second auxiliary pixels PXa2, and the distance between adjacent third auxiliary pixels PXa3 are different from the distances between adjacent first main pixels PXm1, the distances between adjacent second main pixels PXm2, and the distances between adjacent third main pixels PXm3 shown in FIG. 11A, respectively.

[0136] The auxiliary pixel PXa and the main pixel PXm as described above are manufactured through mask sheets having similar forms to those shown in FIGS. 11B to 11D, respectively. That is, each pattern hole shown in FIGS. 11B to 11D is formed so as to correspond to the auxiliary pixel PXa and the main pixel PXm shown in FIG. 12, respectively. In such a case, the first auxiliary pixel PXa1 and the first main pixel PXm1 are formed on the substrate simultaneously, and the second auxiliary pixel PXa2 and the second main pixel PXm2 are also formed on the substrate simultaneously. Also, the third auxiliary pixel PXa3 and the third main pixel PXm3 are also formed on the substrate simultaneously.

[0137] FIG. 13 is a plan view showing a pixel arrangement of a display device according to still another embodiment of the present invention. Referring to FIG. 13, the auxiliary pixels PXa are arranged in a stripe form, and the main pixels PXm are arranged in a pentile structure with a circular planar shape. At this time, the planar shapes of the first auxiliary pixel PXa1, the second auxiliary pixel PXa2, and the third auxiliary pixel PXa3 are formed in a line form. Also, the planar shapes of the first main pixel PXm1, the second main pixel PXm2, and the third main pixel PXm3 are circular.

[0138] In the case as described above, in the same area or unit area, the area of the first auxiliary pixel PXa1 arranged in the first display region DA1 is smaller than the area of the first main pixel PXm1 arranged in the second display region DA2. In the same area or unit area, the area of the second auxiliary pixel PXa2 arranged in the first display region DA1 is smaller than the area of the second main pixel PXm2 arranged in the second display region DA2. In the same area or unit area, the area of the third auxiliary pixel PXa3 arranged in the first display region DA1 is smaller than the area of the third main pixel PXm3 arranged in the second display region DA2.

[0139] The auxiliary pixel PXa and the main pixel PXm as described above are each manufactured through a mask sheet having a form similar to that shown in FIGS. 11B to 11D. That is, each pattern hole shown in FIGS. 11B to 11D is formed so as to correspond to the auxiliary pixel PXa and the main pixel PXm shown in FIG. 12, respectively. In such a case, the first auxiliary pixel PXa1 and the first main pixel PXm1 are formed on the substrate at the same time, and the second auxiliary pixel PXa2 and the second main pixel PXm2 are also formed on the substrate at the same time. Also, the third auxiliary pixel PXa3 and the third main pixel PXm3 are also formed on the substrate at the same time.

[0140] FIG. 14 is a plan view showing a pixel arrangement of a display device according to still another embodiment of the present invention. Referring to FIG. 14, the auxiliary pixel PXa and the main pixel PXm are each formed in a rhombus shape and arranged in a pentile structure. In such a case, the area on the plane of the auxiliary pixels PXa that emit the same color as each other and the area on the plane of the main pixels PXm are different from each other. For example, the area on the plane of the main pixels PXm that emit the same color as each other is narrower than the area on the plane of the auxiliary pixels PXa.

[0141] Specifically, the area on the plane of the first main pixel PXm1 is narrower than the area on the plane of the first auxiliary pixel PXa1, the area on the plane of the second main pixel PXm2 is narrower than the area on the plane of the second auxiliary pixel PXa2, and the area on the plane of the third main pixel PXm3 is narrower than the area on the plane of the third auxiliary pixel PXa3. In the case as described above, the number of main pixels PXm per unit area that emit the same color is larger than the number of auxiliary pixels PXa per unit area. As another embodiment, the total area of the main pixels PXm included in a unit area that emit the same color is wider than the total area of the auxiliary pixels PXa included in the unit area. Or, while emitting the same color, the distance between adjacent auxiliary pixels PXa is longer than the distance between adjacent main pixels PXm while emitting the same color. In such a case, the resolution of the first display area DA1 is lower than the resolution of the second display area DA2. The relationship between the main pixel PXm and the auxiliary pixel PXa as described above is opposite when the resolution of the first display area DA1 is higher than the resolution of the second display area DA2.

[0142] The auxiliary pixel PXa and the main pixel PXm as described above are each manufactured through a mask sheet in a form similar to that shown in FIGS. 11B to 11D. That is, each pattern hole shown in FIGS. 11B to 11D is formed so as to correspond to the auxiliary pixel PXa and the main pixel PXm shown in FIG. 12, respectively. In such a case, the first auxiliary pixel PXa1 and the first main pixel PXm1 are formed on the substrate simultaneously, and the second auxiliary pixel PXa2 and the second main pixel PXm2 are also formed on the substrate simultaneously. Also, the third auxiliary pixel PXa3 and the third main pixel PXm3 are formed on the substrate simultaneously.

[0143] The forms and arrangements of the main pixel PXm and the auxiliary pixel PXa as described above are not limited to those described above. For example, each pixel may have a form in which pixels having a rectangle are arranged in the X direction while being in an S-stripe form. As another embodiment, each pixel may be formed in a stripe form. In the case as described above, the forms and arrangements of the main pixel PXm and the auxiliary pixel PXa are not limited to those described above, and may include all forms and arrangements that make the resolution of the first display area DA1 different from the resolution of the second display area DA2.

[0144] FIGS. 15A to 15F are schematic cross-sectional views for explaining the manufacturing sequence of a mask sheet according to an embodiment of the present invention. Referring to FIG. 15A, a base material M is prepared to manufacture the mask sheet 22. Such a base material M is in a state where foreign matters adsorbed on each surface are removed through a polishing process, a cleaning process, and the like. The base material M is a thin plate and may include stainless steel, invar, nickel (Ni), cobalt (Co), nickel alloy, nickel-cobalt alloy, and the like.

[0145] When the base material M is prepared, a first photoresist PR1 and a second photoresist PR2 are disposed on the first surface M1 and the second surface M2 of the base material M, respectively. At this time, the first photoresist PR1 and the second photoresist PR2 can be disposed on the base material M sequentially or simultaneously. Thereafter, the first photoresist PR1 in the first region A1 is exposed and developed with a developer to form a first opening OP1, and the second photoresist PR2 in the first region A1 is exposed and developed to form a second opening OP2. The position of the second opening OP2 corresponds to the position of the first opening OP1. At this time, the method of exposing the photoresist to form a photoresist opening also varies depending on whether the property of the photoresist is a negative type or a positive type.

[0146] That is, when the photoresist is exposed and then developed, if the photoresist is of the negative type, the unexposed photoresist portion is removed, but if the photoresist is of the positive type, the exposed photoresist portion is removed. Through the above-described steps, a first photoresist PR1 having a first opening OP1 located in the first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 is formed on the second surface M2 of the base material M. On the other hand, as shown in FIG. 9, when the mask assembly 20 including the mask sheet 22 is disposed in the chamber 10, the first surface M1 corresponds to one surface of the mask sheet 22 facing the substrate 100, and the second surface M2 corresponds to the other surface of the mask sheet 22 facing the evaporation source 50.

[0147] Referring to FIG. 15B, after the above-described steps are completed, an etching solution is injected into the first opening OP1. At this time, the first surface M1 of the base material M on which the first photoresist PR1 is disposed is disposed so as to face downward, and the etching solution is injected from below the first photoresist PR1 toward the first surface M1. When the etching solution is injected into the first opening OP1, a part of the first surface M1 of the base material M is etched at a position corresponding to the first opening OP1. Thereby, a groove corresponding to the first opening OP1 is formed in the first surface M1. Since the first opening OP1 is arranged only in the first region A1, no groove is formed in the second region A2 by the etching solution.

[0148] Referring to FIG. 15C, the first photoresist PR1 is removed from the first surface M1 of the base material M. As another example, the first photoresist PR1 is removed together when removing the second photoresist PR2, as will be described later.

[0149] Referring to FIG. 15D, an etching solution is injected into the second opening OP2. At this time, the etching solution is injected from above the second photoresist PR2 toward the second surface M2 of the base material M. When the etching solution is injected into the second opening OP2, the second surface M2 of the base material M is etched at the position corresponding to the second opening OP2. Therefore, a first pattern hole PH1 penetrating the base material M is formed in the base material M. Since the second opening OP2 is arranged only in the first region A1, no hole is formed in the second region A2.

[0150] Referring to FIG. 15E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to FIG. 15F, after the above-described process is completed, in the second region A2 of the base material M, at a preset position, a laser beam is irradiated onto the second surface M2 of the base material M by a laser processing apparatus to form a second pattern hole PH2. At this time, the second pattern hole PH2 is formed such that the width of the inner surface of the second pattern hole PH2 gradually widens from the first surface M1 to the second surface M2. At this time, the width is the distance between the inner surfaces of the second pattern hole PH2 along a direction perpendicular to the thickness direction of the base material M. As another example, the second photoresist PR2 is removed after irradiating the base material M with a laser beam to form the second pattern hole PH2.

[0151] In one embodiment, the step of forming the second pattern hole PH2 via a laser beam is performed by repeating the processing a plurality of times while varying laser processing conditions such as the depth of focus of the laser beam and the processing area. By irradiating the second surface M2 of the base material M with a laser beam, the base material M is removed along the thickness direction of the base material M from the second surface M2. At this time, while changing the depth of focus of the laser beam in the thickness direction of the base material M, the profile of the inner surface of the second pattern hole PH2 is formed. In order to improve the processing accuracy via the laser beam, a scanner or an AOD (acousto optic deflector) or the like can be used to control the number of laser beams, the depth of focus, the incident angle, the form, the position, and the like. Hereinafter, with reference to FIG. 19, the laser processing apparatus will be described in detail later.

[0152] The display device DD has a plurality of display regions, and differences are required in characteristics such as the shape, arrangement, size, and resolution of the pixels arranged in the display regions between the display regions. In order to manufacture such a display device DD, the mask sheet 22 also requires differences in characteristics such as the shape, arrangement, size, and density of the pattern holes between the regions corresponding to the plurality of display regions. According to an embodiment of the present invention, when forming two or more pattern holes having different characteristics in one mask sheet 22 as described above, a mask sheet 22 with improved quality can be manufactured.

[0153] As a comparative example, even though the first pattern hole PH1 in the first region A1 and the second pattern hole PH2 in the second region A2 of the mask sheet 22 have different characteristics from each other, if etching is performed by applying one processing condition, the processing deviation between the pattern holes becomes large and the processing quality of the mask sheet 22 deteriorates. For example, although the thickness of the available base material M varies depending on the size (area) of the generally formed pattern holes, in the case of the comparative example, since this cannot be taken into account, the processing quality of the pattern holes deteriorates. However, according to an embodiment of the present invention, in the case of the first pattern hole PH1 disposed in the first region A1 of the mask sheet 22, etching is performed under processing conditions determined in consideration of characteristics such as the shape, arrangement, size, and density of the first pattern hole PH1 to obtain consistent quality. In the case of the second pattern hole PH2 in the second region A2 where relatively precise processing is required, the processing accuracy can be improved by separately forming it via a laser beam. Thereby, a mask sheet 22 with overall improved quality can be obtained.

[0154] Also, in the case of the second pattern hole PH2, the second pattern hole PH2 is formed using a laser beam such that the width of the inner surface of the second pattern hole PH2 gradually widens from the first surface M1 to the second surface M2. In such a case, a protrusion is not formed in the middle of the inner surface of the second pattern hole PH2. During vapor deposition using such a second pattern hole PH2, the shadow phenomenon can be minimized, and the manufacturing quality of the display device DD can be improved. Also, in the case of the second pattern hole PH2, since it is processed using a laser beam, precise processing is possible without restrictions on various shapes of the second pattern hole PH2.

[0155] Figures 16A to 16F are schematic cross-sectional views for explaining the manufacturing sequence of a mask sheet according to another embodiment of the present invention. First, the same content as the manufacturing sequence described with reference to Figures 15A to 15F is omitted, and hereinafter, the description will focus on the differences.

[0156] Referring to Figure 16A, a first photoresist PR1 and a second photoresist PR2 are respectively disposed on the first surface M1 and the second surface M2 of the base material M. Thereafter, the first photoresist PR1 is exposed and developed with a developer to form a first opening OP1 disposed in the first region A1. The second photoresist PR2 is exposed and developed to form a second opening OP2 disposed in the first region A1 and a third opening OP3 disposed in the second region A2. The second opening OP2 is formed corresponding to the first opening OP1, and the third opening OP3 is formed corresponding to the entire second region A2. Through the above-described steps, a first photoresist PR1 having a first opening OP1 located in the first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 and a third opening OP3 formed corresponding to the entire second region A2 of the base material M is formed on the second surface M2 of the base material M.

[0157] Referring to FIG. 16B, after the above-described steps are completed, an etching solution is injected into the first opening OP1, and a part of the first surface M1 of the base material M is etched at a position corresponding to the first opening OP1. Thereby, a groove corresponding to the first opening OP1 is formed in the first surface M1. Referring to FIG. 16C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0158] Referring to FIG. 16D, an etching solution is injected into the second opening OP2 and the third opening OP3. When the etching solution is injected into the second opening OP2, the second surface M2 of the base material M is etched at a position corresponding to the second opening OP2. Therefore, a first pattern hole PH1 penetrating the base material M is formed in the base material M. When the etching solution is injected into the third opening OP3, the second surface M2 of the base material M is partially etched at a position corresponding to the third opening OP3. Therefore, a wide etching surface is formed in the second region A2 of the base material M. At this time, the depth of etching can be 50% or more, 60% or more, 70% or more, or 80% or more of the original thickness of the base material M.

[0159] Referring to FIG. 16E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to FIG. 16F, after the above-described process is completed, in the second region A2 of the base material M, at a preset position, a laser beam is irradiated onto the etching surface formed corresponding to the third opening OP3 on the second surface M2 of the base material M by a laser processing apparatus to form the second pattern hole PH2. Thereby, the mask sheet 22 is manufactured.

[0160] At this time, the thicknesses of the first region A1 and the second region A2 of the mask sheet 22 may be different from each other. For example, among the thicknesses of the mask sheet 22, the thickness T1 in the first region A1 is thinner than the thickness T2 in the second region A2. The thickness in the second region A2 may be 50% or less, 40% or less, 30% or less, or 20% or less of the thickness in the first region A1. According to the above-described embodiment of the present invention, since the second surface M2 of the second region A2 is partially etched in advance before forming the second pattern hole PH2, the processing amount of the laser beam can be reduced. Thereby, the workability of the laser beam can be improved, and the amount of dust that may be generated during laser processing can be minimized.

[0161] FIGS. 17A to 17G are schematic cross-sectional views for explaining the manufacturing order of a mask sheet according to still another embodiment of the present invention. First, the same content as the manufacturing order described with reference to FIGS. 15A to 15F is omitted, and hereinafter, the description will be centered on the different parts.

[0162] Referring to FIG. 17A, the first photoresist PR1 and the second photoresist PR2 are respectively disposed on the first surface M1 and the second surface M2 of the base material M. Thereafter, the first photoresist PR1 is exposed and treated with a developer to form the first opening OP1 disposed in the first region A1. Expose and develop the second photoresist PR2 to form a second opening OP2 disposed in the first region A1 and a plurality of fourth openings OP4 disposed in the second region A2 and spaced apart from each other. The second opening OP2 corresponds to the first opening OP1, and the fourth openings OP4 correspond to predetermined positions where the second pattern holes PH2 are to be formed. Therefore, the number of the fourth openings OP4 is the same as the number of the second pattern holes PH2 to be formed. Through the above-described steps, a first photoresist PR1 having a first opening OP1 located in the first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second opening OP2 corresponding to the first opening OP1 and a second photoresist PR2 having a plurality of fourth openings OP4 disposed in the second region A2 of the base material M and spaced apart from each other are formed on the second surface M2 of the base material M.

[0163] Referring to FIG. 17B, after the above-described steps are completed, an etching solution is injected into the first opening OP1 to etch a part of the first surface M1 of the base material M at a position corresponding to the first opening OP1. Thereby, a groove corresponding to the first opening OP1 is formed in the first surface M1. Referring to FIG. 17C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0164] Referring to FIG. 17D, an etching solution is injected into the second opening OP2 and the fourth openings OP4. When the etching solution is injected into the second opening OP2, the second surface M2 of the base material M is etched at a position corresponding to the second opening OP2. Therefore, a first pattern hole PH1 penetrating the base material M is formed in the base material M. When the etching solution is injected into the fourth openings OP4, a part of the second surface M2 of the base material M is etched at a position corresponding to the fourth openings OP4. At this time, the depth of etching can be 50% or more, 60% or more, 70% or more, or 80% or more of the original thickness of the base material M. The size (area) of the hole formed at the position corresponding to the fourth opening OP4 is smaller than the size of the second pattern hole PH2.

[0165] Referring to FIG. 17E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to FIG. 17F, after the above-described steps are completed, in the second region A2 of the base material M, a laser beam is irradiated onto the etching surface formed corresponding to the fourth opening OP4 on the second surface M2 of the base material M by a laser processing apparatus to form the second pattern hole PH2. Thereby, the mask sheet 22 is manufactured.

[0166] According to the above-described embodiment of the present invention, before forming the second pattern hole PH2, a part of the second surface M2 of the base material M is etched in advance at the position where the second pattern hole PH2 is to be formed. Needless to say, the laser processing amount can be reduced, and it is easy to identify the position where the second pattern hole PH2 is to be formed. Therefore, when necessary, the laser processing can be advanced manually.

[0167] Referring to FIG. 17G, in some embodiments, around the second pattern hole PH2, a part of the base material M etched by the etching solution remains. Such a structure is formed when the width of the fourth opening OP4 is wider than the width of the second pattern hole PH2. In that case, in the thickness t2 of the second region A2 of the mask sheet 22, the thickness (t2 - 1) in the peripheral region adjacent to the second pattern hole PH2 is thinner than the thickness t1 in the first region A1, and the thickness (t2 - 2) in the region between the second pattern holes PH2 adjacent to each other is substantially the same as the thickness t1 in the first region A1. Before forming the second pattern hole PH2, a part of the second surface M2 of the base material M is sufficiently etched in advance at the position where the second pattern hole PH2 is to be formed, the laser processing amount can be reduced, and it is easy to identify the position where the second pattern hole PH2 is to be formed.

[0168] Figures 18A to 18F are schematic cross-sectional views for explaining the manufacturing sequence of a mask sheet according to still other embodiments of the present invention. Referring to FIG. 18A, a first photoresist PR1 and a second photoresist PR2 are disposed on the first surface M1 and the second surface M2 of the base material M, respectively. Thereafter, the first photoresist PR1 is exposed and developed with a developer to form a first opening OP1 disposed in the first region A1. The second photoresist PR2 is exposed and developed to form a second opening OP2 disposed in the first region A1 and a plurality of fifth openings OP5 located at the edges of the second region A2. The second opening OP2 corresponds to the first opening OP1.

[0169] At least two or more fifth openings OP5 are disposed at the edges of the second region A2. For example, when the second region A2 has a rectangular shape, the fifth opening OP5 may be disposed adjacent to the corners located on the opposite diagonal sides of the four corners. Alternatively, four fifth openings OP5 may be disposed adjacent to the four corners. In addition, when the second region A2 has a circular shape, at least two or more fifth openings OP5 may be disposed along the circumference at its edges. Through the above-described steps, a first photoresist PR1 having a first opening OP1 located in the first region A1 of the base material M is formed on the first surface M1 of the base material M, and a second photoresist PR2 having a second opening OP2 corresponding to the first opening OP1 and a plurality of fifth openings OP5 located at the edges of the second region A2 of the base material M is formed on the second surface M2 of the base material M.

[0170] Referring to FIG. 18B, after the above-described steps are completed, an etching solution is sprayed into the first opening OP1, and a part of the first surface M1 of the base material M is etched at a position corresponding to the first opening OP1. Thereby, a groove corresponding to the first opening OP1 is formed in the first surface M1. Referring to FIG. 18C, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0171] Referring to FIG. 18D, an etching solution is injected into the second opening OP2 and the fifth opening OP5. When the etching solution is injected into the second opening OP2, the second surface M2 of the base material M is etched at a position corresponding to the second opening OP2. Therefore, a first pattern hole PH1 penetrating the base material M is formed in the base material M. When the etching solution is injected into the fifth opening OP5, the second surface M2 of the base material M is partially etched at a position corresponding to the fifth opening OP5. At this time, the depth of etching can be 10% or more, 20% or more, 30% or more, 40% or more, or 50% or more of the original thickness of the base material M. Thereby, at least two or more reference holes RH are formed at positions corresponding to the fifth opening OP5. As will be described in detail with reference to FIG. 19, the reference holes RH are also used to align the base material M in the processing stage using a laser beam.

[0172] Referring to FIG. 18E, the second photoresist PR2 is removed from the second surface M2 of the base material M. Referring to FIG. 18F, after the above-described steps are completed, in the second region A2 of the base material M, the second surface M2 of the base material M is irradiated with a laser beam by a laser processing apparatus to form a second pattern hole PH2. Thereby, the mask sheet 22 is manufactured.

[0173] FIG. 19 is a diagram showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. Referring to FIG. 19, the laser processing apparatus 90 includes a laser oscillation unit 91, an optical system 92, a scan unit 93, a stage 94, and an inspection unit 95.

[0174] The laser oscillation unit 91 emits a pulsed laser beam for forming a pattern hole in the base material M. As the laser oscillation unit 91, a UV (ultraviolet) laser, a CO 2 laser, etc. may be included. The optical system 92 receives the laser beam emitted from the laser oscillation unit 91 and adjusts it to the optimal conditions for pattern hole formation. For example, the intensity, spot size, irradiation angle, and number of irradiations of the laser beam are finely adjusted. As an example, the spot size of the laser beam is 20 μm or less, but it is not limited thereto, and the spot size of the laser beam can also be changed by changing the design of the mask sheet 22 according to the resolution of the display device DD. Also, as an example, by using an ultrashort pulse laser from several tens of femtoseconds to several hundreds of picoseconds for the laser, generation of burrs on the surface of the mask sheet 22 can be suppressed.

[0175] The scanning unit 93 determines the position of the laser beam emitted from the laser oscillation unit 91, for example, on the second surface M2 of the base material M which is the object to be processed. The scanning unit 93 may include a scanner that changes the path of the laser beam and irradiates the second surface M2 of the base material M with the laser beam. The stage 94 supports the base material M which is the object to be processed. The base material M is placed on the stage 94 and fixed by an electrostatic chuck or the like. Also, the stage 94 can move precisely on a plane by a driving unit (not shown) in order to process the base material M at a desired position.

[0176] The inspection unit 95 may include a three-dimensional (3D) imaging module that can confirm the processed area of the base material M and inspect whether the processing is successful. Also, the inspection unit 95 may include an alignment camera that photographs a predetermined point of the base material M. The video data acquired from the alignment camera is compared with the pre-set data, the alignment degree of the base material M is judged, and then, reflecting it, the stage 94 is moved via a driving unit (not shown). Accordingly, the base material M as the workpiece is aligned so that the processing position of the base material M coincides with the position of the scan unit 93 irradiated with the laser beam.

[0177] According to an embodiment of the present invention, the reference hole RH can also be utilized to align the base material M. The alignment camera photographs the second region A2 of the base material M that becomes the processing region by the laser beam, and acquires the position information of the reference hole RH disposed in the second region A2. With reference to this, the alignment degree of the base material M is judged, and based on the position information of the second pattern hole PH2 set in advance, the stage 94 is moved to align the base material M. Accordingly, the laser beam can be irradiated at an accurate position on the second surface M2 of the base material M to form the second pattern hole PH2.

[0178] Figs. 20A to 20F are schematic cross-sectional views for explaining the manufacturing sequence of a mask sheet according to still another embodiment of the present invention. Referring to Fig. 20A, to manufacture the mask sheet 22, the base material M is prepared. Such a base material M is in a state where foreign matter adsorbed on each surface has been removed through a polishing process, a cleaning process, etc.

[0179] Referring to Fig. 20B, when the base material M is prepared, the first photoresist PR1 and the second photoresist PR2 are respectively disposed on the first surface M1 and the second surface M2 of the base material M. At this time, the first photoresist PR1 and the second photoresist PR2 are disposed on the base material M sequentially or simultaneously. Thereafter, the first photoresist PR1 is exposed and treated with a developer to form the first opening OP1, and the second photoresist PR2 is exposed and developed to form the second opening OP2 and the third opening OP3. At this time, the method of exposing the photoresist and forming the photoresist opening also differs depending on whether the property of the photoresist is a negative type or a positive type. That is, after exposing the photoresist and then treating it with a developer, if the photoresist is in a negative mode, the unexposed photoresist portions are removed, but if the photoresist is in a positive mode, the exposed photoresist portions are removed.

[0180] Referring to FIG. 20C, as described above, when the first photoresist PR1 and the second photoresist PR2 are disposed on the base material M, the sizes of the second opening OP2 and the third opening OP3 on the plane may be different from each other. For example, when the shape of the second opening OP2 and the shape of the third opening OP3 are the same, the width of the second opening OP2 on the plane is narrower than the width of the third opening OP3. At this time, the number of the second openings OP2 disposed in a unit area or the same area is larger than the number of the third openings OP3. In the case as described above, the second opening OP2 corresponds to the first pattern hole PH1, and the third opening OP3 also corresponds to the second pattern hole PH2.

[0181] After the steps to be described later are completed, if the first pattern hole PH1 and the second pattern hole PH2 are formed, the relationship between the first pattern hole PH1 and the second pattern hole PH2 is similar to the relationship between the second opening OP2 and the third opening OP3. That is, the planar size of the second pattern hole PH2 disposed on one surface of the mask sheet 22 is equal to or larger than the planar size of the first pattern hole PH1 disposed on the same surface of the mask sheet 22. However, the number of the first pattern holes PH1 disposed in the same area is larger than the number of the second pattern holes PH2. The relationships as described above are all applicable to the embodiments of the present invention. Also, the relationships as described above can be equally applied to the relationship between the second intermediate layer formed by the first pattern hole PH1 and disposed in the first display region and the first intermediate layer formed by the second pattern hole PH2 and disposed in the second display region.

[0182] Referring to FIG. 20D, after the above-described process is completed, an etching solution is injected into the first opening OP1. At this time, the first surface M1 of the base material M on which the first photoresist PR1 is disposed is disposed so as to face the lower surface, and the etching solution is injected from the lower part to the upper surface of the first photoresist PR1. As described above, when injecting the etching solution into the first opening OP1, a first groove (M1-1) is formed in the base material M so as to correspond to the first opening OP1. Thereafter, the first photoresist PR1 is removed from the first surface M1 of the base material M.

[0183] Referring to FIG. 20E, after the above-described process is completed, an etching solution is injected into the second opening OP2 and the third opening OP3. At this time, the etching solution is injected from the upper surface of the base material M toward the second surface M2 side of the base material M. If the above-described process is completed, the etching solution passes through the second opening OP2 and the third opening OP3 and removes a part of the base material M. At this time, the etching solution that has passed through the second opening OP2 removes the base material M from the second surface M2 of the base material M in the thickness direction of the base material M to the first surface M1, and is formed so as to correspond to the first opening OP1. It connects to the first groove (M1-1) on the first surface M1 and forms a first pattern hole PH1.

[0184] In addition, the etching solution that has passed through the third opening OP3 forms a second pattern hole PH2 by removing the base material M from the second surface M2 to the first surface M1. In the above-described case, the etching degree of the base material M by the etching solution is adjusted by the difference between the width (or the area on the plane) of the second opening OP2 and the width (or the area on the plane) of the first opening OP1. Specifically, by forming the width (or the area on the plane) of the second opening OP2 wider than the width (or the area on the plane) of the first opening OP1, when injecting the same etching solution at the same time, the thickness of the base material M can be adjusted. The distance etched in the direction can be adjusted (see FIG. 20C). That is, in such a case, the thickness by which the base material M is etched by the etching liquid that has passed through the second opening OP2 is greater than the thickness by which the base material M is etched by the etching liquid that has passed through the first opening OP1.

[0185] In the case as described above, while the second protrusion (PH2-a) is not disposed inside the second pattern hole PH2, the first protrusion (PH1-a) is disposed inside the first pattern hole PH1. That is, the second protrusion (PH2-a) is disposed at the end of the second pattern hole PH2, and the first protrusion PH1 protrudes inside the first pattern hole PH1. In the case as described above, the first distance L1 from the first surface M1 to the first protrusion (PH1-a) is different from the second distance L2 from the second surface M2 to the first protrusion (PH1-a). Specifically, the first distance L1 from the first surface M1 to the first protrusion (PH1-a) is shorter than the second distance L2 from the second surface M2 to the first protrusion (PH1-a). At this time, the first surface M1 is the surface facing the substrate 100 when the mask sheet 22 is disposed on the manufacturing apparatus 1 of the display device shown in FIG. 11.

[0186] Therefore, in the method for manufacturing a display device according to the present invention, it is possible not to form the second protrusion in the portion of the second pattern hole PH2 used when forming the intermediate layer (not shown) in the first display region (not shown). Further, the method for manufacturing a display device according to the present invention thereby enables formation of an intermediate layer having a precise pattern during manufacture of the display panel, and by shortening the section in which the thickness of the intermediate layer varies, it is possible to deposit the intermediate layer so as to have an area of the intermediate layer substantially the same as the design value.

[0187] FIG. 21 is a perspective view showing an outline of a display device according to another embodiment of the present invention. Referring to FIG. 21, the display device DD is similar to that shown in FIG. 1. At this time, the display device DD includes a first display region DA1, a second display region DA2, and a peripheral region PA. The first display area DA1 is a fixed area of the display device DD, different from that in FIG. 1. At this time, the first display area DA1 is similar in shape to the second display area DA2. For example, the first display area DA1 is formed long in the X-axis direction. Such a first display area DA1 has a higher light transmittance than the second display area DA2, and the resolution of the first display area DA1 is lower than that of the second display area DA2. As described above, auxiliary pixels PXa are arranged in the first display area DA1, and main pixels PXm are arranged in the second display area DA2. In addition, the first display area DA1 may include a transmission area TA where no auxiliary pixel PXa is arranged.

[0188] Components are arranged at various positions in the first display area DA1 as described above. At this time, at least one or more components may be arranged in the first display area DA1. An auxiliary pixel PXa and a transmission area TA may be arranged in the first display area DA1 as described above. At this time, at least one or more auxiliary pixels PXa are provided to form one pixel area, and such pixel areas are arranged to be separated from each other in the first display area DA1. In such a case, the transmission area TA is arranged between the pixel areas that are separated from each other. For example, the pixel areas may be arranged in a grid pattern, and the transmission area TA may be arranged between such pixel areas. In the second display area DA2, unlike the first display area DA1, there is no separate transmission area. At this time, a plurality of main pixels PXm are arranged in the second display area DA2.

[0189] Specific aspects of the present invention as described above can be implemented using a system, method, computer program, or any combination of systems, methods, and computer programs.

[0190] Furthermore, the present invention is not limited to the above-described embodiments. Various modifications can be made without departing from the technical scope of the present invention.

Explanation of Reference Numerals

[0191] 1 Manufacturing apparatus 2 Display panel 3 Component 10 Chamber 11 Gate valve 20 Mask assembly 21 Mask frame 22 Mask sheet 22-1 to 22-3 First to third mask sheets 23 Support frame 30, 40 First and second support portions 50 Evaporation source 60 Magnetic force generation unit 70 Vision unit 80 Pressure adjustment unit 81 Connection pipe 82 Pump 90 Laser processing apparatus 91 Laser oscillation unit 92 Optical system 93 Scan unit 94 Stage 95 Inspection unit 100 Substrate 110, 120 First and second scan drive circuits 111 Buffer layer 112, 113 First and second gate insulating layers 115 Interlayer insulating layer 117 Planarization layer 119 Pixel definition film 119OP Opening 140 Terminal 150 Data drive circuit 151 Connection wiring 160, 170 First and second power supply wirings 161, 171 First and second connection wirings 162, 163 First and second sub-wirings 175 Lower protection film 175OP Opening 200 Display element layer 210 Pixel electrode 220 Intermediate layer 230 Counter electrode 300 Thin film encapsulation layer 320 Organic encapsulation layer 310, 330 First, second inorganic encapsulation layers 1130 Semiconductor layer 1151~1157, 1163 Contact hole 1173 Initialization connection line 1174 Node connection line 1175 Connection metal A Deposition area A1, A2 First, second areas A1, A6 Semiconductor layer CE1, CE2 Lower, upper electrodes CNT Contact hole Cst Storage capacitor D1 Drive drain electrode D2 Switching drain electrode D3 Compensation drain electrode D4, D7 First, second initialization drain electrodes D5 Operation control drain electrode D6 Emission control drain electrode DA Display area DA1, DA2 First, second display areas DD Display device DL Data line Dm Data signal EL Emission control line ELVDD First power supply voltage (drive voltage) ELVSS Second power supply voltage En Emission control signal G1 Drive gate electrode G2 Switching gate electrode G3 Compensation gate electrode G4, G7 First, second initialization gate electrodes G5 Operation control gate electrode G6 Emission control gate electrode HL electrode voltage line IL insulating layer I OLED Drive current LX a Second length LX m First length M base material M1, M2 First and second surfaces M1-1 First groove OLED Organic light-emitting diode OP1~OP5 First to fifth openings PA Peripheral area PC Pixel circuit PCB Printed circuit board PCB-P terminal PH1, PH2 First and second pattern holes PL Drive voltage line (Drive voltage line) PR1, PR2 First and second photoresists PXa Auxiliary pixel (Second pixel) PXa1~PXa2 First to third auxiliary pixels PXm Main pixel (First pixel) PXm1~PXm3 First to third main pixels RH Reference hole S1 Drive source electrode S2 Switching source electrode S3 Compensation source electrode S4, S7 First and second initialization source electrodes S5 Operation control source electrode S6 Emission control source electrode SL, SL-1 Scan line Sn, Sn-1 Scan signal T1 Drive thin-film transistor T2 Switching thin-film transistor T3 Compensation thin-film transistor T4, T7 First and second initialization thin-film transistors T5 Operation control thin-film transistor T6 Emission control thin-film transistor TFT Thin-film transistor Vint Initialization Voltage VL Initialization Voltage Line

Claims

1. A mask assembly comprising a mask sheet, The mask sheet comprises: a first region including at least one first pattern hole; a second region including at least one second pattern hole; a protrusion disposed on an inner surface of the first pattern hole or the second pattern hole and protruding into one of the first pattern hole or the second pattern hole; 4. A mask assembly, comprising: an inner surface of the first pattern hole and an inner surface of the second pattern hole that are different from each other.

2. The mask assembly of claim 1 , wherein the protrusion comprises a first protrusion protruding from an inner surface of the first pattern hole into the first pattern hole.

3. 2. The mask assembly of claim 1, wherein the thickness of the first region and the thickness of the second region are the same or different from each other.

4. 2. The mask assembly of claim 1, wherein a planar size of the second pattern hole formed on one side of the second region is equal to or larger than a planar size of the first pattern hole formed on one side of the first region extended from one side of the second region.

5. The mask assembly according to claim 1 , wherein the mask sheet has a plurality of reference holes disposed on an edge of the second region.

6. The mask assembly of claim 1 , wherein the first pattern holes and the second pattern holes are different in shape from each other on a plane parallel to one surface of the mask sheet.

7. disposing a first photoresist on a first surface of a workpiece to define a first opening; disposing a second photoresist on a second surface of the workpiece to have a second opening and a third opening; injecting an etchant into the first opening to etch a portion of the first surface of the base material; and spraying an etchant into the first opening and the second opening to etch a portion of the second surface of the base material, thereby forming a first pattern hole and a second pattern hole penetrating the base material.

8. The method of claim 7, wherein the second opening has a width greater than a width of the first opening.

9. The method of claim 7, wherein the first pattern hole has a protrusion disposed inside the second pattern hole, the protrusion protruding from an inner surface of the second pattern hole into the second pattern hole.

10. The method of claim 9, wherein a distance from the first surface to the protrusion is different from a distance from the second surface to the protrusion.

11. 8. The method of claim 7, further comprising the step of removing the first photoresist.

12. 8. The method of claim 7, further comprising the step of removing the second photoresist.

13. disposing a first photoresist on a first surface of a workpiece, the first photoresist having a first opening located in a first region of the workpiece; placing a second photoresist on a second surface of the workpiece, the second photoresist having a second opening corresponding to the first opening; injecting an etchant into the first opening to etch a portion of the first surface of the base material; forming a first pattern hole penetrating the base material by injecting an etchant into the second opening; and irradiating a laser beam onto a second region adjacent to the first region on the second surface of the base material to form a second pattern hole penetrating the base material.

14. The method of claim 13, wherein a shape of the first pattern hole and a shape of the second pattern hole on a plane parallel to the first surface or the second surface are different from each other.

15. The method of claim 13, wherein an area of ​​the first pattern hole and an area of ​​the second pattern hole on a plane parallel to the first surface or the second surface are different from each other.

16. The method of claim 13, wherein the number of the first pattern holes and the second pattern holes per same area are different from each other.

17. The method of claim 13, further comprising the step of removing the first photoresist.

18. 14. The method of claim 13, further comprising the step of removing the second photoresist.

19. 14. The method of claim 13, wherein forming the second pattern hole includes forming the second pattern hole such that a width of the second pattern hole in a direction perpendicular to a thickness direction of the base material becomes wider from the first surface to the second surface.

20. the second photoresist further includes a third opening formed to correspond to the entire second region; The method of claim 13, further comprising the step of injecting an etchant into the third opening to etch a portion of the second surface of the base material.

21. 21. The method of claim 20, further comprising the step of irradiating a laser beam onto an etched surface formed on the second surface of the base material corresponding to the third opening to form a second pattern hole penetrating the base material.

22. the second photoresist further includes a plurality of fourth openings disposed in the second region and spaced apart from one another; The method of claim 13, further comprising the step of injecting an etchant into the fourth opening to etch a portion of the second surface of the base material.

23. 23. The method of claim 22, wherein forming the second pattern hole comprises irradiating a laser beam to an etching surface formed on the second surface of the base material corresponding to the fourth opening to form a second pattern hole penetrating the base material.

24. the second photoresist further includes a plurality of fifth openings located at edges of the second region; 14. The method of claim 13, further comprising the step of forming at least two reference holes by injecting an etchant into the fifth opening to etch a portion of the second surface of the base material.

25. The method of claim 24, further comprising aligning the base material using the reference hole before irradiating the laser beam.

26. A chamber; a mask assembly disposed within the chamber; a deposition source disposed opposite the mask assembly to supply a deposition material to the display substrate, the mask assembly includes a mask sheet through which a deposition material supplied from the deposition source passes, The mask sheet comprises: a first region including at least one first pattern hole; a second region including at least one second pattern hole; a protrusion disposed on an inner surface of one of the first pattern hole or the second pattern hole and protruding into the inside of the one of the first pattern hole or the second pattern hole; 13. An apparatus for manufacturing a display device, wherein an inner surface of the first pattern hole and an inner surface of the second pattern hole are different from each other.

27. 27. The apparatus of claim 26, wherein the protrusion comprises a first protrusion protruding from an inner surface of the first pattern hole into the first pattern hole.

28. 27. The apparatus for manufacturing a display device according to claim 26, wherein a thickness of the first region and a thickness of the second region are the same as or different from each other.

29. 27. The apparatus of claim 26, wherein a planar size of an entrance portion of the first pattern hole formed on one side of the first region is equal to or larger than a planar size of an entrance portion of the second pattern hole formed on one side of the second region extended from one side of the first region.

30. The apparatus of claim 26, wherein the mask sheet includes a plurality of reference holes disposed at an edge of the first region or an edge of the second region.

31. a thickness of the mask sheet in the second region around the second pattern hole is smaller than a thickness of the mask sheet in the first region; 27. The apparatus of claim 26, wherein a thickness in an area between adjacent second pattern holes is the same as a thickness in the first area.

32. 27. The apparatus of claim 26, wherein a width of the second pattern hole along a direction perpendicular to a thickness direction of the mask sheet is formed to become wider from one surface of the mask sheet to the other surface of the mask sheet.

33. 27. The apparatus of claim 26, wherein a shape of the first pattern hole and a shape of the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

34. 27. The apparatus of claim 26, wherein an area of ​​the first pattern hole and an area of ​​the second pattern hole on a plane parallel to one surface of the mask sheet are different from each other.

35. 27. The apparatus of claim 26, wherein the number of the first pattern holes and the number of the second pattern holes per same area are different from each other.

36. The apparatus of claim 26, wherein the mask sheet has a plurality of reference holes disposed on an edge of the second region.

37. placing and aligning a display substrate and a mask assembly within a chamber; delivering deposition material from a deposition source to the display substrate through the mask assembly; the mask assembly includes a mask sheet through which a deposition material supplied from the deposition source passes, The mask sheet comprises: a first region including at least one first pattern hole; a second region including at least one second pattern hole; a protrusion disposed on an inner surface of one of the first pattern hole or the second pattern hole and protruding into the inside of the one of the first pattern hole or the second pattern hole; 13. A method for manufacturing a display device, comprising: forming a first pattern hole and a second pattern hole on a substrate;

38. 38. The method of claim 37, wherein the protrusion comprises a first protrusion protruding from an inner surface of the first pattern hole into the first pattern hole.

39. 38. The method of claim 37, wherein the thickness of the first region and the thickness of the second region are the same or different from each other.

40. 38. The method of claim 37, wherein a planar size of the second pattern hole formed on one side of the second region is equal to or larger than a planar size of an entrance of the first pattern hole formed on one side of the first region extended from one side of the second region.

41. The method of claim 37, wherein the mask sheet has a plurality of reference holes disposed on an edge of the second region.

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