Adsorption cooling device, cooling system and adsorption cooling method

Abstract

To provide a new adsorption cooling device capable of utilizing adsorption of gas and release of adsorbed gas using an adsorbent, a cooling system, and an adsorption cooling method.SOLUTION: An adsorption cooling device comprises: an adsorbent that adsorbs adsorption gas with heat generation, and releases the adsorbed adsorption gas with heat absorption; an adsorption gas supply unit that supplies the adsorption gas to the adsorbent; a liquefied gas supply unit that supplies liquefied gas; and a heat exchange unit that exchanges heat between the adsorbent and the liquefied gas. The adsorbent is adapted to adsorb the adsorption gas in a state of being cooled by the liquefied gas, and cool an object to be cooled by absorbing heat when releasing the adsorption gas.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an adsorption cooling device, a cooling system, and an adsorption cooling method.

Background Art

[0002] Techniques for adsorbing gas using an adsorbent such as activated carbon are known. For example, there is one described in Patent Document 1 below. In Patent Document 1, an adsorbent layer is disposed on the inner wall of a heat-insulated container that stores a liquefied gas, and it is disclosed that boil-off gas generated from the liquefied gas is adsorbed and recovered by the adsorbent layer. The adsorbent has an improved adsorption capacity as the temperature decreases, and when the temperature is raised in the state where the gas is adsorbed (that is, the adsorbent absorbs heat), the adsorbed gas is desorbed from the adsorbent. By disposing the adsorbent layer in the heat-insulated container of the low-temperature liquefied gas, the adsorbent layer is cooled without providing a separate cooling means, and the boil-off gas generated from the liquefied gas is adsorbed. By gas adsorption, an increase in the pressure of the heat-insulated container due to the boil-off gas is suppressed.

[0003] In Patent Document 1, after the liquefied gas in the heat-insulated container is carried out, the heat insulation of the heat-insulated container is released, and the adsorbent layer is heated by an external heat input or a heating means such as a heater to desorb the boil-off gas adsorbed on the adsorbent layer, and the desorbed boil-off gas is pressurized and carried out. As a result, the loss associated with gas transportation is reduced by the amount of the desorbed boil-off gas.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] As described above, Patent Document 1 proposes to suppress the pressure increase in a container and reduce losses due to boil-off gas during the transportation and storage of liquefied gas by utilizing gas adsorption and gas release by an adsorbent.

[0006] In contrast, as a result of intensive studies, the inventor of the present application has found that an adsorbent generates heat when adsorbing a gas, but has the property that its temperature decreases (absorbs heat) when releasing the gas, and has conceived of performing cooling by utilizing this heat-absorbing property.

[0007] An object of the present disclosure is to provide a new adsorption cooling device, a cooling system, and an adsorption cooling method that utilize gas adsorption by an adsorbent and release of the adsorbed gas.

Means for Solving the Problems

[0008] The adsorption cooling device of the present disclosure for achieving the above object includes an adsorbent that adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with heat absorption, an adsorption gas supply unit that supplies the adsorption gas to the adsorbent, a liquefied gas supply unit that supplies liquefied gas, and a heat exchange unit that heat-exchanges the adsorbent with the liquefied gas. The adsorbent is provided to adsorb the adsorption gas in a state cooled by the liquefied gas and cool a cooling object by heat absorption when releasing the adsorption gas.

[0009] Further, the cooling system of the present disclosure includes a first flow path through which a first fluid flows, a second flow path through which a second fluid that cools the first fluid flows, a heat exchanger connected to the first flow path and the second flow path, and an adsorption cooling device. The adsorption cooling device is thermally coupled to the first flow path, includes an adsorbent that adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with heat absorption, an adsorption gas supply unit that supplies the adsorption gas to the adsorbent, and a heat exchange unit connected to the second flow path that heat-exchanges the adsorbent with the second fluid. The adsorbent is provided to adsorb the adsorption gas in a state cooled by the second fluid and cool the first fluid by heat absorption when releasing the adsorption gas.

[0010] Further, the cooling method of the present disclosure is an adsorption cooling method for cooling an object to be cooled by endothermic heat when releasing an adsorption gas adsorbed on an adsorbent, and includes a step of adsorbing the adsorption gas on the adsorbent in a state where the adsorbent is cooled by a liquefied gas, and a step of releasing the adsorption gas by causing endothermic heat in the adsorbent in a state where the adsorption gas is adsorbed, and the object to be cooled is cooled by endothermic heat of the adsorbent when releasing the adsorption gas.

Effects of the Invention

[0011] According to the present disclosure, it is possible to provide a new adsorption cooling device, a cooling system, and an adsorption cooling method that utilize gas adsorption by an adsorbent and release of the adsorbed gas.

Brief Description of the Drawings

[0012]

Figure 1

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Figure 10

Best Mode for Carrying Out the Invention

[0013] Hereinafter, with reference to the drawings, preferred embodiments of the present disclosure will be described in detail. Note that the present disclosure is not limited by this embodiment, and when there are a plurality of embodiments, those configured by combining each embodiment are also included. In addition, the constituent elements in the embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those within a so-called equivalent range.

[0014] [First Embodiment] FIG. 1 is a schematic configuration diagram showing an adsorption cooling device according to the first embodiment.

[0015] The first embodiment shows an example in which the adsorption cooling device 10 is configured as a liquefied gas tank for storing a low-temperature liquefied gas 90. The adsorption cooling device 10 suppresses the generation of boil-off gas 91 from the liquefied gas 90 stored in the liquefied gas tank by cooling a partition wall (heat insulation layer) that stores the liquefied gas 90.

[0016] The adsorption cooling device 10 includes a liquefied gas supply unit 20 that supplies the liquefied gas 90, an adsorbent 30, an adsorption gas supply unit 40, and a heat exchange unit 50. The liquefied gas supply unit 20 is configured as a liquefied gas tank that stores the liquefied gas 90.

[0017] <Storage Structure of Liquefied Gas> First, the structure for storing the liquefied gas 90 will be described. The liquefied gas supply unit 20 has a multilayer structure surrounded by a first heat insulation layer 21 and a second heat insulation layer 22 outside the first heat insulation layer 21. The liquefied gas supply unit 20 also includes an inlet portion 23, an outlet portion 24, and flow paths 25 and 26.

[0018] The liquefied gas supply unit 20 stores the liquefied gas 90 in a space surrounded by the first heat insulation layer 21.

[0019] The liquefied gas 90 is a liquid of a low-boiling-point gas. The liquefied gas 90 is, for example, liquid hydrogen (boiling point at standard atmospheric pressure is about -253°C), liquid oxygen (boiling point about -183°C), liquid nitrogen (boiling point about -196°C), LNG (liquefied natural gas, boiling point about -160°C), etc., but is not particularly limited. Since the boiling point of the liquefied gas 90 of the low-boiling-point gas is sufficiently lower than the atmospheric temperature of the transportation and storage environment, it is easily vaporized by the heat invading from the outside of the liquefied gas supply unit 20, and boil-off gas 91 is generated. The boil-off gas 91 is the gas (vapor) obtained by vaporizing the liquefied gas 90. In the first embodiment, the liquefied gas 90 is liquid hydrogen, and the boil-off gas 91 is hydrogen gas.

[0020] The first heat-insulating layer 21 is a hollow partition wall (heat-insulating layer) that partitions the liquefied gas supply unit 20. The first heat-insulating layer 21 is a layer formed between the inner wall 21a and the outer wall 21b. The inner wall 21a constitutes the storage space for the liquefied gas 90. The outer wall 21b constitutes the outer surface of the first heat-insulating layer 21. The first heat-insulating layer 21 has a radiation shield on at least the outer wall 21b for shielding (reflecting) the radiant heat from the outside. The radiation shield is made of, for example, an aluminum material. The first heat-insulating layer 21 has a sealed structure. The first heat-insulating layer 21 has become a low-pressure space by depressurization. Due to the low heat transfer rate of the low-pressure space, the first heat-insulating layer 21 blocks the heat input from the outside. The first heat-insulating layer 21 can be depressurized, for example, to substantially vacuum, but it may be depressurized until the desired heat-insulating performance is obtained and does not have to be vacuum.

[0021] The flow path 25 penetrates the first heat-insulating layer 21 and is connected to the storage space, and the other end is connected to the inlet portion 23. One end of the flow path 26 is connected to the inside (storage space) of the liquefied gas supply unit 20, and the other end is connected to the outlet portion 24. The flow path 26 connects the liquefied gas supply unit 20 and the outlet portion 24 via the heat exchange unit 50.

[0022] The second heat insulation layer 22 is a hollow partition wall (heat insulation layer) surrounding the outer periphery of the first heat insulation layer 21. The second heat insulation layer 22 is a layer formed between the inner wall 22a and the outer wall 22b. The inner wall 22a surrounds the first heat insulation layer 21. The outer wall 22b constitutes the outer shell of the second heat insulation layer 22, and the outer wall 22b constitutes the outer surface of the liquefied gas supply unit 20. The second heat insulation layer 22 has a sealed structure. The interior of the second heat insulation layer 22 is a low-pressure space due to decompression. Due to the low heat transfer rate of the low-pressure space, the second heat insulation layer 22 blocks the heat input from the outside. The second heat insulation layer 22 can be decompressed, for example, to approximately vacuum, but it may be decompressed until the desired heat insulation performance is obtained and does not have to be a vacuum.

[0023] The liquefied gas supply unit 20 can supply the stored liquefied gas 90 from the outlet 24 to the supply destination. The supply destination can be, for example, a hydrogen supply facility (such as a hydrogen station) for vaporizing liquid hydrogen and supplying it to hydrogen utilization equipment (such as a hydrogen vehicle). The adsorption cooling device 10 (liquefied gas tank) may be mounted on a moving body, and in that case, the supply destination can be, for example, a gas engine, a fuel cell, etc. The supply destination can also be, for example, a fuel supply facility for a liquid fuel rocket.

[0024] <Cooling Structure of Adsorption Cooling Device> The adsorbent 30 adsorbs the adsorption gas 41 with heat generation and releases the adsorbed adsorption gas 41 with heat absorption. The adsorbent 30 reversibly adsorbs gas, for example, by physical adsorption. The adsorbent 30 is made of, for example, a porous material. The material constituting the adsorbent 30 can be, for example, activated carbon, carbon fiber, charcoal, zeolite, metal complex, metal-organic framework (MOF), etc.

[0025] The adsorbent 30 is disposed between the first heat insulating layer 21 and the second heat insulating layer 22 while being thermally coupled to the first heat insulating layer 21. In the example of FIG. 1, the adsorbent 30 is provided so as to be in close contact with the outer surface (outer wall 21b) of the first heat insulating layer 21. Thermally coupled means a coupled state in which heat conduction is possible, and the adsorbent 30 and the first heat insulating layer 21 may be coupled via a heat conducting member without direct contact. In FIG. 1, for the sake of convenience, the adsorbent 30 is disposed only on one side (the right side in FIG. 1) of the first heat insulating layer 21, but the adsorbent 30 may be provided so as to surround the entire circumference of the first heat insulating layer 21. Also, in FIG. 1, the adsorbent 30 is provided so as to be in close contact with the inner surface of the second heat insulating layer 22. The adsorbent 30 may be separated from the inner surface of the second heat insulating layer 22. The adsorbent 30 is, for example, filled in the space between the first heat insulating layer 21 (outer wall 21b) and the second heat insulating layer 22 (inner wall 22a).

[0026] The adsorbing gas supply unit 40 is configured to supply the adsorbing gas 41 to the adsorbent 30. The adsorbing gas supply unit 40 is a gas storage body that accommodates the adsorbing gas 41 in a manner that allows the adsorbing gas 41 to be taken in and out, and stores the adsorbing gas 41. In the example of FIG. 1, the adsorbing gas supply unit 40 is provided outside the second heat insulating layer 22 and is connected to the adsorbent 30 via a gas pipe 42. One end of the gas pipe 42 is connected to the adsorbing gas supply unit 40, and the other end is connected to the adsorbent 30.

[0027] The adsorbing gas 41 is a gas to be adsorbed by the adsorbent 30. The type of the adsorbing gas 41 is not particularly limited, but a gas having physical properties (particularly thermal properties) similar to those of the gas obtained by vaporizing the liquefied gas 90 is preferable. The adsorbing gas 41 is, for example, a gas having the same element (composition) as the liquefied gas 90. For example, when the liquefied gas 90 is liquid hydrogen, the adsorbing gas 41 may be hydrogen gas.

[0028] The gas supply unit 40 for adsorption is a pressure-resistant container having a predetermined volume. When the adsorbent 30 adsorbs the adsorption gas 41, the internal pressure of the gas supply unit 40 for adsorption decreases, and when the adsorbent 30 releases the adsorption gas 41, the internal pressure of the gas supply unit 40 for adsorption increases. The gas supply unit 40 for adsorption is decompressed to about 0.1 MPa by gas adsorption, for example, and pressurized to about 1 MPa by gas release.

[0029] The heat exchange unit 50 causes the adsorbent 30 to exchange heat with the liquefied gas 90. The heat exchange unit 50 is thermally coupled to the adsorbent 30. In the example of FIG. 1, the heat exchange unit 50 is a heat exchanger provided in the arrangement region of the adsorbent 30. The heat exchange unit 50 is provided with a flow path for circulating the liquefied gas 90 inside, and transfers heat between the liquefied gas 90 inside and the adsorbent 30 outside.

[0030] The heat exchange unit 50 is provided in the middle of the flow path 26 between the liquefied gas supply unit 20 (storage space) and the outlet unit 24. Thereby, the adsorbent 30 on the outer surface side of the heat exchange unit 50 is cooled by the cold of the liquefied gas 90 flowing through the inside of the heat exchange unit 50.

[0031] In the example of FIG. 1, the adsorption cooling device 10 includes a second heat exchange unit 11 that exchanges heat between the liquefied gas 90 and the adsorption gas 41. The second heat exchange unit 11 is provided in front of the outlet unit 24 inside the second heat insulation layer 22 (outside the first heat insulation layer 21). The second heat exchange unit 11 is connected to the flow path 25, the flow path 26, and the gas pipe 42, respectively. The second heat exchange unit 11 pre-cools the adsorption gas 41 before it is supplied to the adsorbent 30 by the low-temperature liquefied gas 90 passing through the flow path 25 and the flow path 26.

[0032] Note that even if the adsorption gas 41 is not pre-cooled, the adsorbent 30 can adsorb the adsorption gas 41 by being cooled by the liquefied gas 90. When the adsorption gas 41 is pre-cooled, since an increase in the temperature of the adsorbent 30 due to contact with the adsorption gas 41 is suppressed, it is possible to make it easier for the adsorption gas 41 to be adsorbed by the adsorbent 30.

[0033] With such a configuration, the adsorbent 30 adsorbs the adsorption gas 41 while being cooled by the liquefied gas 90, and is provided to cool the object to be cooled by the endotherm when releasing the adsorption gas 41. In the first embodiment, the object to be cooled is the first heat insulation layer 21.

[0034] <Adsorption cooling method> The adsorption cooling method according to the first embodiment will be described. The adsorption cooling method is a cooling method that cools the object to be cooled by the endotherm when releasing the adsorption gas 41 adsorbed on the adsorbent 30. The adsorption cooling method according to the first embodiment is implemented by the adsorption cooling device 10.

[0035] FIG. 2 is a schematic diagram for explaining the adsorption cooling method according to the first embodiment. As shown in FIG. 2, the adsorption cooling method according to the first embodiment includes a step S1 of adsorbing the adsorption gas 41 on the adsorbent 30 in a state where the adsorbent 30 is cooled by the liquefied gas 90, and a step S2 of releasing the adsorption gas 41 by causing the adsorbent 30 in the state of adsorbing the adsorption gas 41 to absorb heat.

[0036] In step S1, the adsorption cooling device 10 cools the adsorbent 30 with the liquefied gas 90. The adsorption cooling device 10 implements step S1 when supplying the liquefied gas 90 to the outside. When the liquefied gas 90 is sent to the outlet portion 24 through the flow path 26, the adsorbent 30 is cooled as the liquefied gas 90 passes through the heat exchange portion 50. The adsorbent 30 adsorbs the adsorption gas 41 by being cooled to an extremely low temperature by the liquefied gas 90. At this time, the second heat exchange portion 11 (see FIG. 1) precools the adsorption gas 41 before supplying it to the adsorbent 30 by heat-exchanging the liquefied gas 90 that has passed through the heat exchange portion 50 and the adsorption gas 41. The adsorbent 30 adsorbs the low-temperature adsorption gas 41 precooled by the second heat exchange portion 11. Since the adsorption gas 41 is stored at a high pressure in the adsorption gas supply portion 40, it is naturally sent out from the adsorption gas supply portion 40 as the gas is adsorbed in the adsorbent 30. Therefore, a drive source such as a pump for supplying the adsorption gas 41 is not particularly necessary.

[0037] Note that the liquefied gas 90 supplied to the outside is heated by the heat exchange section 50 and the second heat exchange section 11. The second heat exchange section 11 supplies the gas 90A (see FIG. 1) obtained by vaporizing the liquefied gas 90 or supplies it to the outlet section 24 in a gas-liquid mixed phase state. Since the liquefied gas 90 can be pre-heated at a stage prior to supplying it to an external vaporizer or the like, the energy required for the vaporization process in the vaporizer can be reduced accordingly. Depending on the usage form of the supply destination of the liquefied gas 90, the liquefied gas 90 may be sent out from the outlet section 24 as a liquid phase (liquefied gas 90) without being vaporized.

[0038] After supplying a desired amount of the liquefied gas 90 to the outside, the adsorption cooling device 10 stops the supply of the liquefied gas 90 in step S2. In step S2 of FIG. 2, the flow path 26 indicated by the broken line represents a state in which the liquefied gas 90 does not flow. As a result, the flow of the liquefied gas 90 in the flow path 26 stops, so the cooling of the adsorbent 30 by the liquefied gas 90 stops.

[0039] Here, even if the liquefied gas supply section 20 employs a multi-layer heat insulation structure, heat enters from the outside. In step S2, the adsorbent 30 absorbs (endotherms) the heat entering from the outside and thus increases in temperature, releasing the adsorption gas 41 adsorbed in step S1. The adsorption gas 41 released from the adsorbent 30 is re-stored in the adsorption gas supply section 40 through the gas pipe 42.

[0040] Since the adsorbent 30 is thermally coupled to the first heat insulation layer 21 (radiation shield), it absorbs the heat HE applied to the first heat insulation layer 21 and cools the first heat insulation layer 21. In this way, the adsorbent 30 cools the object to be cooled (the first heat insulation layer 21) by endotherming when releasing the adsorption gas 41. By cooling the first heat insulation layer 21, the intrusion of the heat HE into the liquefied gas 90 in the liquefied gas supply section 20 is suppressed, so the generation of the boil-off gas 91 in the liquefied gas supply section 20 is suppressed.

[0041] As the adsorbent 30 releases the adsorption gas 41 it has adsorbed, its cooling capacity decreases. Thereafter, when step S1 is executed again at the timing of supplying the liquefied gas 90 to the outside, the adsorbent 30 adsorbs the adsorption gas 41 again by cooling and recovers its cooling capacity. The adsorption cooling device 10 can continuously (repeatedly) cool the object to be cooled (the first heat insulating layer 21) by alternately repeating step S1 and step S2.

[0042] [Second Embodiment] FIG. 3 is a schematic configuration diagram showing the adsorption cooling device of the second embodiment. Note that members having the same functions as those in the above-described first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0043] In the above-described first embodiment, an example in which the first heat insulating layer 21 of the liquefied gas tank is cooled by the adsorption cooling device 10 was shown. In this second embodiment, an example in which the reliquefaction device 122 of the liquefied gas tank 121 is cooled by the adsorption cooling device 10A is shown.

[0044] The liquefied gas supply unit 20 of the adsorption cooling device 10A according to the second embodiment includes a liquefied gas tank 121, a reliquefaction device 122, and a flow path 123.

[0045] The liquefied gas tank 121 stores the liquefied gas 90. The liquefied gas 90 generates boil-off gas 91 due to the heat of intrusion from the outside of the liquefied gas tank 121.

[0046] The reliquefaction device 122 cools and reliquefies the boil-off gas 91 in the liquefied gas tank 121. The reliquefaction device 122 is a refrigerator that cools the boil-off gas 91 by a heat absorption part 122a provided in the gas phase space in the liquefied gas tank 121 and discharges heat from a waste heat part 122b provided outside the liquefied gas tank 121. The reliquefaction device 122 may be configured such that the heat absorption part 122a is provided outside the liquefied gas tank 121 and is connected to the liquefied gas tank 121 by piping.

[0047] The flow path 123 connects the liquefied gas tank 121 and the heat exchange section 50. The heat exchange section 50 causes heat exchange between the liquefied gas 90 and the adsorbent 30 to cool the adsorbent 30 as the liquefied gas 90 passes therethrough. The heat exchange section 50 may be configured to vaporize the liquefied gas 90 by heat exchange and discharge it as gas 90A.

[0048] The adsorbent 30 is thermally coupled to the exhaust heat section 122b of the reliquefaction device 122. The adsorbent 30 cools the exhaust heat section 122b of the reliquefaction device 122 as an object to be cooled.

[0049] The adsorption cooling device 10A cools the adsorbent 30 with the liquefied gas 90 (step S1 in FIG. 2). That is, when the liquefied gas 90 is supplied, the adsorption cooling device 10A supplies the liquefied gas 90 from the liquefied gas tank 121 through the flow path 123. The heat exchange section 50 causes heat exchange between the liquefied gas 90 passing through the flow path 123 and the adsorbent 30 to cool the adsorbent 30. The cooled adsorbent 30 adsorbs the adsorption gas 41 from the adsorption gas supply section 40.

[0050] After the adsorption cooling device 10A adsorbs the adsorption gas 41 to the adsorbent 30 by supplying a desired amount of the liquefied gas 90 to the outside, the supply of the liquefied gas 90 is stopped. Next, the adsorption cooling device 10A discharges the heat HE generated by the reliquefaction process of the boil-off gas 91 from the exhaust heat section 122b of the reliquefaction device 122. The adsorbent 30 releases the adsorption gas 41 adsorbed in step S1 by absorbing (endothermic) the heat HE from the exhaust heat section 122b (step S2 in FIG. 2). Thereby, the adsorbent 30 cools the exhaust heat section 122b of the reliquefaction device 122.

[0051] Thereafter, when step S1 is executed again at the timing of supplying the liquefied gas 90 to the outside, the adsorbent 30 adsorbs the adsorption gas 41 again by cooling and restores the cooling capacity. The adsorption cooling device 10A can continuously (repeatedly) cool the object to be cooled (exhaust heat section 122b) by alternately repeating step S1 and step S2.

[0052] [Third Embodiment] FIG. 4 is a schematic configuration diagram showing the adsorption cooling device of the third embodiment. Members having the same functions as those of the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0053] In the third embodiment, the liquefied gas tank 121 includes a first tank 121-1 that stores the first liquefied gas 90-1 and a second tank 121-2 that stores the second liquefied gas 90-2. The first tank 121-1 is provided with a reliquefaction device 122. Note that illustration and description of the reliquefaction device on the second tank 121-2 side are omitted.

[0054] The second liquefied gas 90-2 is a liquefied gas at a lower temperature than the first liquefied gas 90-1. In the third embodiment, for example, the first liquefied gas 90-1 is liquid oxygen (boiling point of about -183°C), and the second liquefied gas 90-2 is liquid hydrogen (boiling point of about -253°C).

[0055] The adsorption cooling device 10B includes a cooling unit 12-1 including an adsorbent 30-1, an adsorption gas supply unit 40-1, and a heat exchange unit 50-1, and a cooling unit 12-2 including an adsorbent 30-2, an adsorption gas supply unit 40-2, and a heat exchange unit 50-2. The cooling unit 12-1 corresponds to the first tank 121-1. The heat exchange unit 50-1 is connected to the first tank 121-1 via a flow path 123-1. The cooling unit 12-2 corresponds to the second tank 121-2. The heat exchange unit 50-2 is connected to the second tank 121-2 via a flow path 123-2.

[0056] The adsorbent 30-2 is provided to cool the exhaust heat portion 122b of the reliquefaction device 122 of the first tank 121-1 as a cooling object. That is, the adsorbent 30-2 of the cooling unit 12-2 is thermally coupled to the exhaust heat portion 122b of the reliquefaction device 122 of the first tank 121-1.

[0057] The adsorption cooling device 10B cools the adsorbent 30-2 in the cooling section 12-2 by supplying the second liquefied gas 90-2 from the second tank 121-2 to the flow path 123-2. The heat exchange section 50-2 uses the second liquefied gas 90-2, which is at a lower temperature than the first liquefied gas 90-1, as a cooling medium to cool the adsorbent 30-2 in the cooling section 12-2. The adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply section 40-2 by cooling (step S1).

[0058] After stopping the supply of the second liquefied gas 90-2 to the outside, the adsorption cooling device 10B discharges the heat HE generated by the re-liquefaction process of the boil-off gas 91 in the first tank 121-1 from the exhaust heat section 122b of the re-liquefaction device 122-1. The adsorbent 30-2 releases the adsorption gas 41 adsorbed in step S1 by absorbing the heat HE from the exhaust heat section 122b (step S2). As a result, the adsorbent 30-2 cools the exhaust heat section 122b of the re-liquefaction device 122-1.

[0059] Since the adsorbent 30-2 is cooled by the second liquefied gas 90-2, which has a lower temperature among the first liquefied gas 90-1 and the second liquefied gas 90-2, the adsorption performance increases compared to the case of cooling with the first liquefied gas 90-1. Therefore, the gas release amount increases, and the amount of heat that can be cooled increases.

[0060] Note that the adsorbent 30-1 in the cooling section 12-1 may be thermally coupled to the exhaust heat section 122b of the re-liquefaction device 122. In this case, both the adsorbent 30-1 and the adsorbent 30-2 are configured to cool the exhaust heat section 122b of the re-liquefaction device 122. The adsorbent 30-1 may be thermally coupled to other objects to be cooled other than the exhaust heat section 122b.

[0061] [Fourth Embodiment] FIG. 5 is a schematic configuration diagram showing the adsorption cooling device of the fourth embodiment. Note that members having the same functions as those in the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0062] The device configuration of the adsorption cooling device 10C according to the fourth embodiment is the same as that of the third embodiment. The fourth embodiment is different from the third embodiment in that the object to be cooled by the adsorption cooling device 10C is the radiation shield 124 of the liquefied gas tank 121.

[0063] The liquefied gas tank 121 (first tank 121-1) has a radiation shield 124 that shields radiant heat. The radiation shield 124 can be the outer wall of the heat insulation layer. Note that the illustration of the radiation shield of the second tank 121-2 is omitted. The adsorbent 30-2 of the cooling unit 12-2 is thermally coupled to the radiation shield 124 of the first tank 121-1. The adsorbent 30-2 is provided to cool the radiation shield 124 of the first tank 121-1 as the object to be cooled.

[0064] Other configurations of the fourth embodiment are the same as those of the third embodiment.

[0065] Since the adsorbent 30-2 is cooled by the second liquefied gas 90-2 having a lower temperature among the first liquefied gas 90-1 and the second liquefied gas 90-2, the adsorption performance of the adsorption gas 41 is increased compared to cooling with the first liquefied gas 90-1. Since the adsorbent 30-2 cools the radiation shield 124 of the first tank 121-1, which has a higher temperature among the first tank 121-1 and the second tank 121-2, more heat HE can be absorbed. Therefore, the amount of heat that the adsorption cooling device 10C can cool can be increased.

[0066] Note that the adsorbent 30-1 of the cooling unit 12-1 may be thermally coupled to the radiation shield 124. In this case, the radiation shield 124 is cooled by both the adsorbent 30-1 and the adsorbent 30-2. The adsorbent 30-1 may be thermally coupled to an object to be cooled other than the radiation shield 124.

[0067] [Fifth Embodiment] FIG. 6 is a schematic configuration diagram showing the adsorption cooling device of the fifth embodiment. Members having the same functions as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

[0068] In the above-described fourth embodiment, an example was shown in which the radiation shield 124 of the first tank 121-1 is cooled by the adsorbent 30-2 of the cooling unit 12-2 provided corresponding to the second tank 121-2. In the fifth embodiment, an example is shown in which the radiation shield 124 of the liquefied gas tank 121 is cooled by the adsorbent 30 corresponding to the liquefied gas tank 121.

[0069] The adsorption cooling device 10D includes a liquefied gas tank 121 and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange unit 50.

[0070] The flow path 123 connects the liquefied gas tank 121 and the heat exchange unit 50. The heat exchange unit 50 causes heat exchange between the liquefied gas 90 and the adsorbent 30 in the process of the liquefied gas 90 passing therethrough, thereby cooling the adsorbent 30. The adsorbent 30 is thermally coupled to the radiation shield 124 and is provided so as to cool the object to be cooled.

[0071] The adsorption cooling device 10D cools the adsorbent 30 with the liquefied gas 90 stored in the liquefied gas tank 121 and causes the adsorbent 30 to adsorb the adsorption gas 41. After the supply of the liquefied gas 90 is stopped, the heat HE applied to the radiation shield 124 from the outside of the liquefied gas tank 121 is transmitted to the adsorbent 30. The adsorbent 30 absorbs the heat HE and releases the adsorbed adsorption gas 41, thereby cooling the radiation shield 124 of the liquefied gas tank 121.

[0072] In the fifth embodiment, when the first tank 121-1 and the second tank 121-2 are provided as in the above-described fourth embodiment (see FIG. 4), the cooling unit 12-1 and the cooling unit 12-2 cool the radiation shield 124 of the corresponding first tank 121-1 and the radiation shield 124 of the second tank 121-2, respectively.

[0073] [Sixth Embodiment] FIG. 7 is a schematic configuration diagram showing the cooling system of the sixth embodiment. FIG. 8 is a schematic configuration diagram showing the adsorption cooling device 10E included in the cooling system. Note that members having the same functions as those of the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0074] The cooling system 200 of the sixth embodiment is configured as a liquefaction system that cools and liquefies a raw material gas.

[0075] <Configuration of the cooling system> The cooling system 200 includes a first flow path 210 through which a first fluid 201 flows, a second flow path 220 through which a second fluid 202 that cools the first flow path 210 flows, heat exchangers 231 and 232 connected to the first flow path 210 and the second flow path 220, and an adsorption cooling device 10E. Further, the cooling system 200 further includes a refrigerator 240 that uses a third fluid 203 as a refrigerant, a heat exchanger 233, and an expansion valve 250.

[0076] The first fluid 201 is a fluid to be cooled by the adsorption cooling device 10E. In the example of FIG. 7, the first fluid 201 is a raw material gas before liquefaction. The first fluid 201 is, for example, hydrogen. The second fluid 202 and the third fluid 203 are cold heat media for cooling the first fluid 201, respectively. The second fluid 202 is, for example, nitrogen (liquid nitrogen, nitrogen gas), and the third fluid 203 is, for example, hydrogen (liquid hydrogen, hydrogen gas).

[0077] The first flow path 210 extends to the outlet through the adsorption cooling device 10E, the heat exchanger 231, the heat exchanger 232, the heat exchanger 233, and the expansion valve 250 in order from the inlet side. The inlet of the first flow path 210 is connected to a supply source of the raw material gas, and the outlet of the first flow path 210 is connected to a supply destination of the liquefied gas. The first flow path 210 receives the first fluid 201 in a gas phase (hydrogen gas) state and sends out the first fluid 201 in a liquid phase (liquid hydrogen) state.

[0078] The second flow path 220 extends from the inlet side to the outlet through a storage tank 260, a heat exchanger 231, and an adsorption cooling device 10E in sequence. The inlet of the second flow path 220 is connected to a supply source of the second fluid 202. The outlet of the second flow path 220 is connected to a recovery device of the second fluid 202 or is configured to be open to the atmosphere. The second flow path 220 receives the second fluid 202 in a liquid phase (liquid nitrogen) state and sends out the second fluid 202 in a gas phase (nitrogen gas) state.

[0079] The refrigerator 240 is constituted by a gas refrigeration cycle using a third fluid 203 (hydrogen) as a refrigerant. The refrigerator 240 includes a compressor 241, a condenser 242, an expansion valve 243, an expansion turbine 244, and a circulation flow path 245 connecting these components. The circulation flow path 245 passes through a heat exchanger 231, a heat exchanger 232, and a heat exchanger 233. The refrigerator 240 liquefies the third fluid 203 by expanding the third fluid 203 in a low-temperature and high-pressure gas phase (refrigerant hydrogen gas) by the expansion turbine 244 and the expansion valve 243 respectively. The refrigerator 240 cools the first fluid 201 (raw material hydrogen gas) by heat-exchanging the liquid-phase third fluid 203 (refrigerant liquid hydrogen) with the first fluid 201 in the heat exchangers 231 to 233.

[0080] The heat exchanger 231 cools the first fluid 201 by heat exchange among the first fluid 201 (raw material hydrogen gas), the second fluid 202 (refrigerant nitrogen), and the third fluid 203 (refrigerant hydrogen).

[0081] The heat exchanger 232 is provided in the storage tank 260 of the liquid-phase second fluid 202 (refrigerant liquid nitrogen) and is immersed in the liquid-phase second fluid 202. A catalyst portion 234 for promoting the ortho-para conversion of raw material hydrogen is provided in the passage portion through which the first fluid 201 of the heat exchanger 232 flows.

[0082] The heat exchanger 233 cools the first fluid 201 by heat exchange between the first fluid 201 (raw material hydrogen gas) and the third fluid 203 (refrigerant hydrogen). A catalyst portion 234 for promoting the ortho-para conversion of raw material hydrogen is provided in the passage portion through which the first fluid 201 of the heat exchanger 233 flows.

[0083] The expansion valve 250 expands the first fluid 201 (raw material hydrogen gas). The expansion valve 250 is, for example, a Joule-Thomson valve. The expansion valve 250 cools by expanding the first fluid 201 and liquefies the gaseous first fluid 201.

[0084] <Adsorption cooling device> The adsorption cooling device 10E is disposed upstream of the heat exchanger 231 in the first flow path 210. The adsorption cooling device 10E cools the first fluid 201 (raw material hydrogen gas) before it is supplied to the heat exchanger 231. The adsorption cooling device 10E is disposed downstream of the heat exchanger 231 in the second flow path 220. The adsorption cooling device 10E cools the adsorbent 30 using the second fluid 202 (refrigerant nitrogen) after it has been used for cooling in the heat exchanger 231. That is, the adsorption cooling device 10E has a function of recovering cold heat from the second fluid 202 after heat exchange in the cooling system 200 and precooling the first fluid 201 (raw material hydrogen gas) before sending it to the heat exchangers 231 to 233.

[0085] As shown in FIG. 8, the adsorption cooling device 10E includes a plurality of cooling units 12 (12-1, 12-2) including an adsorbent 30, an adsorption gas supply unit 40, and a heat exchange unit 50. FIG. 8 shows an example in which two cooling units 12-1 and 12-2 are provided, but three or more cooling units 12 may be provided.

[0086] The cooling unit 12-1 includes an adsorbent 30-1, an adsorption gas supply unit 40-1, and a heat exchange unit 50-1. The cooling unit 12-2 includes an adsorbent 30-2, an adsorption gas supply unit 40-2, and a heat exchange unit 50-2. Each heat exchange unit 50-1, 50-2 is connected to the second flow path 220 and exchanges heat between the adsorbents 30-1, 30-2 and the second fluid 202. Each adsorbent 30-1, 30-2 adsorbs the adsorption gas 41 in a state cooled by the second fluid 202 and cools the first fluid 201 by endothermic heat when releasing the adsorption gas 41.

[0087] The adsorption cooling device 10E also includes a flow path switching unit 13. The flow path switching unit 13 includes a switching valve 13a and a switching valve 13b.

[0088] The switching valve 13a is a three-way valve, which is connected to the first flow path 210 and is connected in parallel to the cooling units 12-1 and 12-2. Thus, the switching valve 13a performs flow path switching so as to selectively connect one of the cooling units 12-1 and 12-2 to the first flow path 210. The first fluid outlet of the adsorption cooling device 10E is connected to the heat exchanger 231 via the first flow path 210.

[0089] The switching valve 13b is a three-way valve, which is connected to the heat exchanger 231 by the second flow path 220 and is connected in parallel to the cooling units 12-1 and 12-2. Thus, the switching valve 13b performs flow path switching so as to selectively connect the other of the cooling units 12-1 and 12-2 to the second flow path 220 (heat exchanger 231). The second fluid outlet of the adsorption cooling device 10E is connected to the downstream side of the second flow path 220.

[0090] The flow path switching unit 13 switches the connection between the plurality of cooling units (12-1, 12-2) and the first flow path 210 and the second flow path 220 so that at least one of the plurality of cooling units (12-1, 12-2) is connected to the second flow path 220 and at least one other cooling unit (12-1, 12-2) is connected to the first flow path 210.

[0091] In this example, since there are two cooling units (12-1, 12-2), the flow path switching unit 13 switches between two states: a state (1) in which the cooling unit 12-1 is connected to the first flow path 210 and the cooling unit 12-2 is connected to the second flow path 220; and a state (2) in which the cooling unit 12-2 is connected to the first flow path 210 and the cooling unit 12-1 is connected to the second flow path 220. When there are three or more cooling units 12, the flow path switching unit 13 may connect only any one of the cooling units 12 to the first flow path 210 or the second flow path 220, or may connect two or more cooling units 12 to the first flow path 210 or the second flow path 220 simultaneously.

[0092] With this configuration, while the adsorption cooling device 10E adsorbs the adsorption gas 41 in one of the cooling units 12-1 and 12-2, it cools (pre-cools) the first fluid 201 by discharging the adsorption gas 41 in the other of the cooling units 12-1 and 12-2. Then, the adsorption cooling device 10E alternately adsorbs and discharges the adsorption gas 41 in each cooling unit (12-1, 12-2) by switching the connection state of the flow path switching unit 13.

[0093] That is, in state (1), the cooling unit 12-1 is connected to the first flow path 210 and not connected to the second flow path 220. Therefore, the second fluid 202 is not supplied to the adsorbent 30-1, and the adsorbent 30-1 absorbs heat from the first fluid 201 flowing through the first flow path 210 and discharges the already adsorbed adsorption gas 41 to the adsorption gas supply unit 40-1. As a result, the first fluid 201 is cooled.

[0094] At this time, the cooling unit 12-2 is connected to the second flow path 220 and not connected to the first flow path 210. Therefore, the heat exchange unit 50-2 cools the adsorbent 30-2 by heat exchange with the second fluid 202. The cooled adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-2. As a result, the adsorbent 30-2 becomes a state where it can discharge the adsorption gas 41.

[0095] In state (2), the cooling unit 12-1 is connected to the second flow path 220 and not connected to the first flow path 210. Therefore, the heat exchange unit 50-1 cools the adsorbent 30-1 by heat exchange with the second fluid 202. The cooled adsorbent 30-1 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-1. As a result, the adsorbent 30-1 becomes a state where it can discharge the adsorption gas 41.

[0096] At this time, the cooling unit 12-2 is connected to the first flow path 210 and not connected to the second flow path 220. Therefore, the second fluid 202 is not supplied to the adsorbent 30-2, and the adsorbent 30-2 absorbs heat from the first fluid 201 flowing through the first flow path 210 and discharges the already adsorbed adsorption gas 41 to the adsorption gas supply unit 40-2. As a result, the first fluid 201 is cooled.

[0097] Therefore, by alternately switching between state (1) and state (2), the cooling unit 12-1 and the cooling unit 12-2 alternately discharge the adsorption gas 41. As a result, the cooling (pre-cooling) of the first fluid 201 is continuously performed.

[0098] In the sixth embodiment, the adsorption cooling device 10E recovers the cold heat from the second fluid 202 that has absorbed heat in the heat exchangers 231 and 232 to perform the adsorption of the adsorption gas 41, and cools the first fluid 201 by discharging the adsorption gas 41, so the efficiency of the cooling system 200 is improved.

[0099] [Seventh Embodiment] FIG. 9 is a schematic configuration diagram showing the cooling system of the seventh embodiment. FIG. 10 is a schematic configuration diagram showing the adsorption cooling device 10E included in the cooling system. Note that members having the same functions as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0100] The seventh embodiment shows an example in which the arrangement position of the adsorption cooling device 10E is different from that in the sixth embodiment. In the seventh embodiment, since the configuration other than the arrangement position of the adsorption cooling device 10E is the same as that in the sixth embodiment, the description thereof is omitted.

[0101] The adsorption cooling device 10E of the cooling system 200A in the seventh embodiment is disposed between the heat exchanger 231 and the heat exchanger 232 (storage tank 260). The adsorption cooling device 10E cools the first fluid 201 (raw material hydrogen gas) that is cooled by the heat exchanger 231 and before being supplied to the heat exchanger 232. The adsorption cooling device 10E cools the adsorbent 30 using the second fluid 202 (refrigerant nitrogen) that is used for cooling by the heat exchanger 232 and before being used by the heat exchanger 231. Therefore, the adsorption cooling device 10E in the seventh embodiment is configured to recover the cold heat from the second fluid 202 at a lower temperature than in the sixth embodiment and cool the first fluid 201 (raw material hydrogen gas) that has been primarily cooled by the heat exchanger 231.

[0102] The adsorption cooling device 10E is connected to the heat exchanger 231 and the heat exchanger 232 by the first flow path 210. The adsorption cooling device 10E receives the first fluid 201 that has passed through the heat exchanger 231 and supplies it to the heat exchanger 232. The adsorption cooling device 10E is connected to the storage tank 260 and the heat exchanger 231 by the second flow path 220. The adsorption cooling device 10E receives the second fluid 202 that has passed through the storage tank 260 and supplies it to the heat exchanger 231.

[0103] As shown in FIG. 10, the switching valve 13a is connected to the outlet of the heat exchanger 231 and is connected in parallel to the cooling units 12-1 and 12-2. The switching valve 13b is connected to the outlet of the storage tank 260 and is connected in parallel to the cooling units 12-1 and 12-2.

[0104] The flow path switching unit 13 switches each of the switching valves 13a and 13b to bring the cooling unit 12-1 into a state (1) where it is connected to the first flow path 210 and the cooling unit 12-2 into a state where it is connected to the second flow path 220. In state (1), the cooling unit 12-1 absorbs heat from the first fluid 201 that has passed through the heat exchanger 231 and sends it to the heat exchanger 232. At this time, the adsorbent 30-1 releases the already adsorbed adsorption gas 41 to the adsorption gas supply unit 40-1. Thereby, the first fluid 201 is cooled.

[0105] At this time, the cooling unit 12-2 cools the adsorbent 30-2 by heat exchange with the gaseous second fluid 202 flowing in from the storage tank 260 and sends the second fluid 202 to the heat exchanger 231. The cooled adsorbent 30-2 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-2. Thereby, the adsorbent 30-2 becomes a state in which it can release the adsorption gas 41.

[0106] The flow path switching unit 13 switches each of the switching valves 13a and 13b to bring the cooling unit 12-2 into a state (2) where it is connected to the first flow path 210 and the cooling unit 12-1 is connected to the second flow path 220. In state (2), the cooling unit 12-1 cools the adsorbent 30-1 by heat exchange with the gaseous second fluid 202 flowing in from the heat exchanger 232, and sends the second fluid 202 to the heat exchanger 231. The cooled adsorbent 30-1 adsorbs the adsorption gas 41 from the adsorption gas supply unit 40-1.

[0107] At this time, the cooling unit 12-2 absorbs heat from the first fluid 201 that has passed through the heat exchanger 231 and sends it to the heat exchanger 232. The adsorbent 30-2 releases the already adsorbed adsorption gas 41 to the adsorption gas supply unit 40-2. As a result, the first fluid 201 is cooled.

[0108] The adsorption cooling device 10E alternately switches between state (1) and state (2) by the flow path switching unit 13, and the cooling unit 12-1 and the cooling unit 12-2 alternately release the adsorption gas 41 to continuously cool the first fluid 201.

[0109] In the seventh embodiment, compared with the sixth embodiment, the adsorption gas 41 can be adsorbed in a state where the adsorbents 30-1 and 30-2 are cooled to a lower temperature, so the adsorption efficiency of the adsorption gas 41 is improved. As a result, the cooling effect of the first fluid 201 due to the release of the adsorption gas 41 is improved.

[0110] [Operation and Effect of this Embodiment] The adsorption cooling device according to the first aspect adsorbs the adsorption gas 41 with heat generation, and has an adsorbent 30 that releases the adsorbed adsorption gas 41 with heat absorption, an adsorption gas supply unit 40 that supplies the adsorption gas 41 to the adsorbent 30, a liquefied gas supply unit 20 that supplies the liquefied gas 90, and a heat exchange unit 50 that heat-exchanges the adsorbent 30 with the liquefied gas 90. The adsorbent 30 adsorbs the adsorption gas 41 in a state cooled by the liquefied gas 90, and is provided to cool the object to be cooled by the heat absorption when releasing the adsorption gas 41.

[0111] According to the adsorption cooling device according to the first aspect, by utilizing the property of the adsorbent 30 that releases the adsorption gas 41 while adsorbing with endothermic heat, the object to be cooled can be cooled by the endothermic heat when the adsorption gas 41 is released. Thereby, a new adsorption cooling device 10 that utilizes the adsorption of gas by the adsorbent 30 and the release of the adsorbed gas can be provided. Further, since the cooling of the adsorbent 30 for adsorbing the adsorption gas 41 is performed by the liquefied gas 90 from the liquefied gas supply unit 20, external energy is not consumed for cooling the adsorbent 30. Therefore, it is possible to improve the energy efficiency of the entire system that stores and supplies the liquefied gas 90.

[0112] The adsorption cooling device according to the second aspect is the adsorption cooling device according to the first aspect, wherein the liquefied gas supply unit 20 has a multilayer structure surrounded by the first heat insulation layer 21 and the second heat insulation layer 22 outside the first heat insulation layer 21, and is a liquefied gas tank that stores the liquefied gas 90 in the space surrounded by the first heat insulation layer 21. The adsorbent 30 is disposed between the first heat insulation layer 21 and the second heat insulation layer 22 in a state of being thermally coupled to the first heat insulation layer 21, and cools the first heat insulation layer 21 as an object to be cooled. Thereby, the first heat insulation layer 21 can be cooled by the endothermic heat when the adsorbent 30 releases the adsorption gas 41. As a result, the heat input to the liquefied gas 90 in the first heat insulation layer 21 can be suppressed, so that the generation amount of the boil-off gas 91 in the liquefied gas 90 can be reduced.

[0113] The adsorption cooling device according to the third aspect is the adsorption cooling device according to the first aspect or the second aspect, wherein the liquefied gas supply unit 20 includes a liquefied gas tank 121 that stores the liquefied gas 90, a reliquefaction device 122 that cools and reliquefies the boil-off gas 91 in the liquefied gas tank 121, and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange unit 50. The adsorbent 30 is thermally coupled to the exhaust heat part 122b of the reliquefaction device 122 and cools it as an object to be cooled. Thereby, the exhaust heat of the reliquefaction device 122 associated with the reliquefaction (cooling) of the boil-off gas 91 can be effectively performed by the endothermic heat when the adsorbent 30 releases the adsorption gas 41.

[0114] The adsorption cooling device according to the fourth aspect is the adsorption cooling device according to the third aspect, and further, the liquefied gas tank 121 includes a first tank 121-1 that stores the first liquefied gas 90-1 and a second tank 121-2 that stores the second liquefied gas 90-2 at a temperature lower than that of the first liquefied gas 90-1. The heat exchange section 50-2 is connected to the second tank 121-2 via the flow path 123-2, and the adsorbent 30-2 is thermally coupled to the exhaust heat section 122b of the re-liquefaction device 122-1 of the first tank 121-1 and cools the object to be cooled. As a result, the adsorbent 30-2 can be effectively cooled by the second liquefied gas 90-2 at a temperature lower than that of the first liquefied gas 90-1, so that the adsorption performance of the adsorbent 30-2 can be improved. As a result, the amount of heat absorbed when discharging the adsorption gas 41 can be increased, so that the exhaust heat of the re-liquefaction device 122 can be performed more effectively.

[0115] The adsorption cooling device according to the fifth aspect is the adsorption cooling device according to any one of the first to fourth aspects, and the liquefied gas supply section 20 has a radiation shield 124 that shields radiant heat, and includes a liquefied gas tank 121 that stores the liquefied gas 90 and a flow path 123 that connects the liquefied gas tank 121 and the heat exchange section 50. The adsorbent 30 is thermally coupled to the radiation shield 124 and cools the object to be cooled. As a result, the radiation shield 124 of the liquefied gas tank 121 can be cooled by the heat absorption when discharging the adsorption gas 41, so that the generation amount of the boil-off gas 91 in the liquefied gas 90 can be effectively reduced.

[0116] The adsorption cooling device according to the sixth aspect is the adsorption cooling device according to the fifth aspect, and further, the liquefied gas tank 121 includes a first tank 121-1 that stores the first liquefied gas 90-1 and a second tank 121-2 that stores the second liquefied gas 90-2 at a temperature lower than that of the first liquefied gas 90-1. The heat exchange part 50-2 is connected to the second tank 121-2 via the flow path 123-2. The adsorbent 30-2 is thermally coupled to the radiation shield 124 of the first tank 121-1 and cools the object to be cooled. Thereby, since the adsorbent 30-2 can be effectively cooled by the second liquefied gas 90-2 having a lower temperature than the first liquefied gas 90-1, the adsorption performance of the adsorbent 30-2 can be improved. And, since the radiation shield 124 of the first tank 121-1 having a higher temperature than the second tank 121-2 is cooled by the endotherm when discharging the adsorption gas 41, the generation amount of the boil-off gas 91 in the first tank 121-1 can be more effectively reduced.

[0117] The cooling system according to the seventh aspect includes a first flow path 210 through which the first fluid 201 flows, a second flow path 220 through which the second fluid 202 that cools the first fluid 201 flows, heat exchangers 231 and 232 connected to the first flow path 210 and the second flow path 220, and an adsorption cooling device 10E. The adsorption cooling device 10E is thermally coupled to the first flow path 210, adsorbs the adsorption gas 41 with heat generation, and releases the adsorbed adsorption gas 41 with endotherm. The adsorption cooling device 10E includes an adsorbent 30, an adsorption gas supply part 40 that supplies the adsorption gas 41 to the adsorbent 30, and a heat exchange part 50 connected to the second flow path 220 that causes the adsorbent 30 to exchange heat with the second fluid 202. The adsorbent 30 adsorbs the adsorption gas 41 in a state cooled by the second fluid 202 and cools the first fluid 201 by the endotherm when releasing the adsorption gas 41.

[0118] According to the cooling system according to the seventh aspect, by utilizing the property of the adsorbent 30 that releases the adsorption gas 41 while adsorbing with heat absorption, the first fluid 201 can be cooled by the heat absorption when the adsorption gas 41 is released. Thereby, a new cooling system 200 that utilizes the gas adsorption by the adsorbent 30 and the release of the adsorbed gas can be provided. Further, since the cooling of the adsorbent 30 for adsorbing the adsorption gas 41 is performed by the second fluid 202 that cools the first fluid 201, it is not necessary to separately provide a cooling medium or a cooling device for cooling the adsorbent 30. Therefore, for example, in a system for liquefying a raw material gas, the energy efficiency of the entire system for cooling the first fluid 201 can be improved.

[0119] The cooling system according to the eighth aspect is the cooling system according to the seventh aspect, wherein the adsorption cooling device 10E includes a plurality of cooling units 12 (12-1, 12-2) including an adsorbent 30 (30-1, 30-2), an adsorption gas supply unit 40 (40-1, 40-2), and a heat exchange unit 50 (50-1, 50-2). A flow path switching unit 13 is further provided to switch the connection between the plurality of cooling units 12 and the first flow path 210 and the second flow path 220 such that at least one of the plurality of cooling units 12 is connected to the second flow path 220 and at least one of the other cooling units 12 is connected to the first flow path 210. Thereby, while the adsorption of the adsorption gas 41 (that is, the regeneration of the cooling capacity) is being performed in one of the plurality of cooling units 12 each provided with the adsorbent 30, the release of the adsorption gas 41 (that is, the cooling of the first fluid 201) can be performed in the other of the plurality of cooling units 12. Therefore, if the connection switching is performed by the flow path switching unit 13 so that the adsorption and release of the adsorption gas 41 are alternately performed in each of the plurality of cooling units 12, continuous cooling of the first fluid 201 by the plurality of cooling units 12 can be performed.

[0120] The adsorption cooling method according to the ninth aspect is an adsorption cooling method for cooling an object to be cooled by the endothermic reaction when releasing the adsorption gas 41 adsorbed on the adsorbent 30. The method includes a step of adsorbing the adsorption gas 41 on the adsorbent 30 in a state where the adsorbent 30 is cooled by the liquefied gas 90, and a step of releasing the adsorption gas 41 by causing endothermic reaction in the adsorbent 30 in a state where the adsorption gas 41 is adsorbed. The object to be cooled is cooled by the endothermic reaction of the adsorbent 30 when releasing the adsorption gas 41. Thereby, a new cooling method using the gas adsorption by the adsorbent 30 and the release of the adsorbed gas can be provided. In addition, the energy efficiency of the entire system for storing and supplying the liquefied gas 90 can be improved.

Explanation of Signs

[0121] 10, 10A, 10B, 10C, 10D, 10E Adsorption cooling device 12, 12-1, 12-2 Cooling section 13 Flow path switching section 20 Liquefied gas supply section 21 First heat insulation layer 22 Second heat insulation layer 26, 123, 123-1, 123-2 Flow path 30, 30-1, 30-2 Adsorbent 40, 40-1, 40-2 Adsorption gas supply section 41 Adsorption gas 50, 50-1, 50-2 Heat exchange section 90 Liquefied gas 90-1 First liquefied gas 90-2 Second liquefied gas 91 Boil-off gas 121 Liquefied gas tank 121-1 First tank 121-2 Second tank 122, 122-1 Re-liquefaction device 122b Waste heat section 124 Radiation shield 200, 200A Cooling system 201 First fluid 202 Second fluid 210 First flow path Second flow path 220 Heat exchangers 231, 232, 233

Claims

1. An adsorbent that adsorbs an adsorption gas with heat generation and releases the adsorbed adsorption gas with endothermic heat, An adsorption gas supply unit that supplies the adsorption gas to the adsorbent, A liquefied gas supply unit that supplies liquefied gas, A heat exchange unit that exchanges heat between the adsorbent and the liquefied gas, and is provided with The adsorbent is Adsorbing the adsorption gas in a state cooled by the liquefied gas, It is provided so as to cool the object to be cooled by the endothermic heat when releasing the adsorption gas. Adsorption cooling device.

2. The liquefied gas supply unit has a multilayer structure surrounded by a first heat insulation layer and a second heat insulation layer outside the first heat insulation layer, and is a liquefied gas tank that stores the liquefied gas in a space surrounded by the first heat insulation layer. The adsorbent is disposed between the first heat insulation layer and the second heat insulation layer in a state of being thermally coupled to the first heat insulation layer, and cools the first heat insulation layer as the object to be cooled. The adsorption cooling device according to claim 1.

3. The liquefied gas supply unit A liquefied gas tank that stores the liquefied gas, A reliquefaction device that cools and reliquefies the boil-off gas in the liquefied gas tank, Including a flow path connecting the liquefied gas tank and the heat exchange unit, The adsorbent is thermally coupled to the exhaust heat part of the reliquefaction device and cools it as the object to be cooled. The adsorption cooling device according to claim 1.

4. The liquefied gas tank includes a first tank that stores a first liquefied gas and a second tank that stores a second liquefied gas that is lower in temperature than the first liquefied gas. The heat exchange unit is connected to the second tank via the flow path. The adsorbent is thermally coupled to the exhaust heat part of the reliquefaction device of the first tank and cools it as the object to be cooled. The adsorption cooling device according to claim 3.

5. The liquefied gas supply unit Has a radiation shield that shields radiant heat, a liquefied gas tank that stores the liquefied gas, Including a flow path connecting the liquefied gas tank and the heat exchange unit, The adsorbent is thermally coupled to the radiation shield and cools it as the object to be cooled. The adsorption cooling device according to claim 1.

6. The liquefied gas tank includes a first tank that stores a first liquefied gas and a second tank that stores a second liquefied gas that is lower in temperature than the first liquefied gas. The heat exchange unit is connected to the second tank via the flow path. The adsorbent is thermally coupled to the radiation shield of the first tank and cools the object to be cooled. The adsorption cooling device according to claim 5.

7. A first flow path through which a first fluid flows; A second flow path through which a second fluid that cools the first fluid flows; A heat exchanger connected to the first flow path and the second flow path; An adsorption cooling device, and The adsorption cooling device An adsorbent that is thermally coupled to the first flow path, adsorbs an adsorption gas with heat generation, and releases the adsorbed adsorption gas with endotherm; An adsorption gas supply unit that supplies the adsorption gas to the adsorbent; A heat exchange unit that is connected to the second flow path and exchanges heat between the adsorbent and the second fluid, and The adsorbent Adsorbs the adsorption gas in a state cooled by the second fluid, Cools the first fluid by endotherm when releasing the adsorption gas, Cooling system.

8. The adsorption cooling device Comprises a plurality of cooling units including the adsorbent, the adsorption gas supply unit, and the heat exchange unit, A flow path switching unit that switches the connection between the plurality of cooling units and the first flow path and the second flow path so that at least one of the plurality of cooling units is connected to the second flow path and at least one of the other cooling units is connected to the first flow path, The cooling system according to claim 7.

9. An adsorption cooling method for cooling an object to be cooled by endotherm when releasing an adsorption gas adsorbed by an adsorbent, A step of adsorbing the adsorption gas to the adsorbent in a state where the adsorbent is cooled by a liquefied gas; A step of releasing the adsorption gas by causing endotherm to the adsorbent in a state where the adsorption gas is adsorbed, and Cooling the object to be cooled by endotherm of the adsorbent when releasing the adsorption gas, Adsorption cooling method.

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