Bonding system and bonding method

Abstract

To provide a highly efficient bonding system, and a bonding method.SOLUTION: A bonding system includes: multiple surface processing modules that perform surface preparation on multiple components held by a component carrier and surface preparation on a circuit board on which multiple components are to be bonded; a bonding unit that bonds each of the multiple components after surface preparation to the circuit board after surface preparation; and a transfer module that transfers the component carrier and the circuit board between the surface processing module and the bonding unit. The transfer module includes: a transfer robot that has a first hand for holding the circuit board and a second hand for holding the component carrier; and a robot moving table for moving the transfer robot along a first direction.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001] The present disclosure relates to a bonding system and a bonding method for individually bonding a plurality of components held on a component carrier to a substrate.

Background Art

[0002] Conventionally, with the high integration of semiconductor devices, techniques for three-dimensionally stacking semiconductor devices have been proposed. For example, a bonding system for bonding semiconductor wafers to each other has been proposed (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Not only in the case of bonding semiconductor wafers to each other as in Patent Document 1, but for example, it is conceivable to construct a bonding system for individually bonding a plurality of components held on a component carrier (e.g., a tape frame) to a substrate of a semiconductor wafer. In this case, in order to automatically transfer two different objects, namely, the component carrier and the substrate, it is necessary to design to avoid interference between the transfer devices, etc., and there is a risk that the processing efficiency may decrease.

[0005] An object of the present disclosure is to provide a bonding system and a bonding method with high processing efficiency.

Means for Solving the Problems

[0006] The bonding system of the present disclosure includes a plurality of surface treatment modules that perform surface treatment on a plurality of components held by a component carrier and surface treatment on a substrate for bonding the plurality of components, a bonding apparatus that individually bonds the plurality of surface-treated components to the surface-treated substrate, and a transfer module that transfers the component carrier and the substrate between the surface treatment module and the bonding apparatus. The transfer module includes a transfer robot having a first hand that holds the substrate and a second hand that holds the component carrier, and a robot transfer table that moves the transfer robot along a first direction.

[0007] The bonding method of the present disclosure includes steps of performing surface treatment on a plurality of components held by a component carrier, performing surface treatment on a substrate for bonding the plurality of components, transferring the surface-treated substrate to a bonding apparatus with a first hand, transferring the surface-treated component carrier to the bonding apparatus with a second hand, individually bonding the plurality of surface-treated components to the surface-treated substrate using the bonding apparatus, taking out the substrate to which the plurality of components are bonded from the bonding apparatus with the first hand, and taking out the component carrier from which the plurality of components are taken out from the bonding apparatus with the second hand.

Advantages of the Invention

[0008] According to the present disclosure, a bonding system and a bonding method with high processing efficiency can be provided.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] (Regarding the aspects of the present disclosure) According to a first aspect of the present disclosure, there are provided a plurality of surface treatment modules that perform surface treatment on a plurality of components held by a component carrier and surface treatment on a substrate for bonding the plurality of components, a bonding device that individually bonds the plurality of surface-treated components to the surface-treated substrate, and a transfer module that transfers the component carrier and the substrate between the surface treatment module and the bonding device. The transfer module includes a transfer robot having a first hand that holds the substrate and a second hand that holds the component carrier, and a robot transfer table that moves the transfer robot along a first direction, thereby providing a bonding system.

[0011] According to a second aspect of the present disclosure, there is provided the bonding system according to the first aspect, wherein at least one of the surface treatment modules and the bonding device are arranged on opposite sides of each other with the movement path of the transfer robot along the first direction therebetween.

[0012] According to a third aspect of the present disclosure, there is provided the bonding system according to the first or second aspect, wherein the surface treatment module performs surface treatment using any one of ultraviolet rays, plasma, and liquid.

[0013] According to a fourth aspect of the present disclosure, there is provided the bonding system according to any one of the first to third aspects, wherein the component carrier is a tape frame having an ultraviolet curable adhesive sheet, and at least one of the surface treatment modules has an ultraviolet irradiation device that irradiates ultraviolet rays.

[0014] According to a fifth aspect of the present disclosure, there is provided the bonding system according to any one of the first to fourth aspects, wherein the bonding device has a first bonding module into which the substrate is carried and a second bonding module to which the component carrier is transferred, and the first bonding module and the second bonding module are arranged in the first direction.

[0015] According to a sixth aspect of the present disclosure, there is further provided a partition wall separating the transfer module and the bonding apparatus from each other, and an opening for delivering the component carrier and the substrate held by the transfer module to the bonding apparatus is provided in the partition wall, and the bonding system according to any one of the first to fifth aspects is provided.

[0016] According to a seventh aspect of the present disclosure, there is provided the bonding system according to the sixth aspect, wherein the opening has a first opening for passing the substrate and a second opening for passing the component carrier.

[0017] According to an eighth aspect of the present disclosure, there is provided the bonding system according to any one of the first to seventh aspects, wherein the first hand and the second hand are arranged so as to be vertically displaced from each other and each is movable back and forth.

[0018] According to a ninth aspect of the present disclosure, there is provided the bonding system according to the eighth aspect, wherein the first hand is arranged above the second hand.

[0019] According to a tenth aspect of the present disclosure, there is provided the bonding system according to any one of the first to ninth aspects, wherein the substrate is a wafer and the component carrier is a tape frame.

[0020] According to the 11th aspect of the present disclosure, there is provided a bonding method including: a step of performing surface treatment on a plurality of components held by a component carrier; a step of performing surface treatment on a substrate for bonding the plurality of components; a step of transporting the surface-treated substrate to a bonding apparatus with a first hand; a step of transporting the surface-treated component carrier to the bonding apparatus with a second hand; a step of individually bonding the surface-treated plurality of components to the surface-treated substrate using the bonding apparatus; a step of taking out the substrate to which the plurality of components are bonded from the bonding apparatus with the first hand; and a step of taking out the component carrier from which the plurality of components are taken out from the bonding apparatus with the second hand.

[0021] (Embodiment) Exemplary embodiments of a bonding system and a bonding method according to the present disclosure will be described below with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on the same technical idea are included in the present disclosure.

[0022] First, a bonding system 2 and a bonding method according to an embodiment of the present disclosure will be described with reference to FIG. 1A. FIG. 1A is a schematic plan view schematically showing the bonding system 2.

[0023] The bonding system 2 shown in FIG. 1A is a system for individually bonding a plurality of components (not shown) held by a component carrier C to a substrate W. In the present embodiment, the components are chip components, the component carrier C is a tape frame having an adhesive sheet for adhesively holding the plurality of components, and the substrate W is a semiconductor wafer. The tape frame may be referred to as a dicing frame or a wafer ring, for example.

[0024] The bonding system 2 includes a load port 3, a loading module 4, a relay module 6, a transfer module 8, a plurality of surface treatment modules 10, 12, 14, 16, a bonding apparatus 18, and a control unit 19. In FIG. 1A, the horizontal directions orthogonal to each other are defined as the X-axis direction and the Y-axis direction, and the vertical direction orthogonal to both the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

[0025] The bonding system 2 shown in FIG. 1A is installed in a clean room, and a downflow flows inside the bonding system 2.

[0026] The load port 3 is a member for supplying the substrate W and the component carrier C to the loading module 4. The load port 3 mounts a sealed container 20 that houses a plurality of substrates W and a sealed container 22 that houses a plurality of component carriers C. In FIG. 1A, a state where the substrate W is housed in the sealed container 20 and the component carrier C is housed in the sealed container 22 is illustrated. In the example shown in FIG. 1A, the sealed container 20 and the sealed container 22 are arranged in the Y-axis direction and are connected to the loading module 4 in the X-axis direction.

[0027] The loading module 4 is a module for loading the substrate W and the component carrier C supplied from the load port 3 into the bonding system 2. The loading module 4 takes out the substrate W from the sealed container 20 mounted on the load port 3 and takes out the component carrier C from the sealed container 22. The loading module 4 may be referred to as an EFEM (Equipment Front End Module).

[0028] The loading module 4 has a transfer robot 24 and a robot moving table 26.

[0029] The transfer robot 24 is a robot for transferring the substrate W and the component carrier C supplied from the load port 3. The transfer robot 24 has arms for holding the substrate W and the component carrier C respectively, and is moved by the robot moving table 26.

[0030] The robot moving table 26 is a drive table for moving the transfer robot 24. The robot moving table 26 of the present embodiment has a function of linearly moving the transfer robot 24 in the Y direction (see arrow Y1), a function of horizontally rotating the transfer robot 24 (see arrow R1), and a function of raising and lowering the transfer robot 24 in the Z-axis direction. Note that, regarding the function of horizontally rotating the transfer robot 24 and the function of raising and lowering the transfer robot 24, they may be performed by a turning mechanism or a lifting mechanism provided on the transfer robot 24.

[0031] The transfer robot 24 moves in the Y-axis direction so as to be able to access each of the sealed containers 20 and 22 arranged in the Y-axis direction, takes out the substrate W from the sealed container 20, and takes out the component carrier C from the sealed container 22.

[0032] Next, the detailed configuration of the loading module 4 will be described with reference to FIGS. 2 to 4.

[0033] FIGS. 2 to 4 are schematic plan views showing different states of the transfer robot 24 in the loading module 4, respectively.

[0034] In FIG. 2, a state is shown in which the hand 28 of the transfer robot 24 holds neither the substrate W nor the component carrier C. In FIG. 3, a state is shown in which the hand 28 holding the substrate W has advanced. In FIG. 4, a state is shown in which the hand 32 holding the component carrier C has advanced.

[0035] As shown in FIGS. 2 to 4, the transfer robot 24 has a hand 28 and an arm 30 for holding and transferring the substrate W, and a hand 32 and an arm 34 for holding and transferring the component carrier C.

[0036] As shown in FIG. 2, the hand 28 is a hand that can support the substrate W from below and has a bifurcated shape. A plurality of anti-slip portions (not shown) for preventing displacement of the substrate W are provided on the upper surface of the hand 28. Note that the hand 28 may be one that chucks (including non-contact methods) the substrate W from above. The hand 28 is attached to the tip portions of a plurality of arms 30. The plurality of arms 30 are pivotally supported so as to be rotatable relative to each other, and their base end portions are pivotally supported by a base portion 36. As shown in FIG. 3, by driving the connecting angles between the plurality of arms 30 to change, the hand 28 moves linearly in the front-rear direction (see arrow A1).

[0037] As shown in FIG. 2, the hand 32 is a hand that can support the component carrier C from below and has a bifurcated shape. A plurality of anti-slip portions (not shown) for preventing displacement of the component carrier C are provided on the upper surface of the hand 32. The hand 32 is attached to the tip portions of a plurality of arms 34. The plurality of arms 34 are pivotally supported so as to be rotatable relative to each other, and their base end portions are pivotally supported by a base portion 36. As shown in FIG. 4, by driving the connecting angles between the plurality of arms 34 to change, the hand 32 moves linearly in the front-rear direction (see arrow A2).

[0038] The hand 28 and the arms 30 for transporting the substrate W and the hand 32 and the arms 34 for transporting the component carrier C are arranged vertically offset so as not to interfere with each other. In the present embodiment, the hand 28 for the substrate is arranged above the hand 32 for the component carrier. Since the component carrier C has a higher particle adhesion rate than the substrate W, by arranging the hand 32 for the component carrier below, the mixing of particles can be suppressed.

[0039] The hand 32 arranged below the hand 28 is arranged at a height position that passes through the vertical gap in the arm 30 connected to the hand 28. Thus, the hand 28 and the arms 30 for the substrate and the hand 32 and the arms 34 for the component carrier can move independently without interfering with each other.

[0040] Returning to FIG. 2, the robot moving table 26 moves the base portion 36 along the Y-axis direction, thereby integrally moving the transfer robot 24 in the Y-axis direction (arrow Y1). The robot moving table 26 rotationally drives the base portion 36 about a rotation axis extending in the Z-axis direction, thereby integrally horizontally rotating the transfer robot 24 (arrow R1). The robot moving table 26 moves the base portion 36 up and down along the Z-axis direction, thereby integrally moving the transfer robot 24 up and down.

[0041] The transfer robot 24 of the present embodiment does not have a function of moving in a horizontal direction different from the Y-axis direction (for example, the X-axis direction). That is, the linear movement of the transfer robot 24 in the horizontal direction is only in the Y-axis direction. Thereby, the dimension of the transfer module 4 in the X-axis direction can be reduced.

[0042] Returning to FIG. 1A, a relay module 6 is connected to the downstream side of the transfer module 4, and a transfer module 8 is connected to the downstream side of the relay module 6.

[0043] Similar to the transfer module 4, the transfer module 8 includes a transfer robot 60 and a robot moving table 62. The transfer robot 60 has the same configuration as the transfer robot 24, and the robot moving table 62 has the same configuration as the robot moving table 26.

[0044] The detailed configuration of the transfer robot 60 and the robot moving table 62 will be described with reference to FIG. 5.

[0045] FIG. 5 is a schematic plan view of the transfer module 8.

[0046] As shown in FIG. 5, the transfer robot 60 of the transfer module 8 includes a hand 64 and an arm 66 for holding and transferring the substrate W, and a hand 68 and an arm 70 for holding and transferring the component carrier C.

[0047] As shown in FIG. 5, the hand 64 is a hand that can support the substrate W from below and is attached to the tip portions of a plurality of arms 66. Note that the hand 68 may be one that chucks (including non-contact methods) the substrate W from above. The base end portions of the plurality of arms 66 are pivotally supported by the base portion 72. By driving the connection angles between the plurality of arms 66 to change, the hand 64 moves linearly in the front-rear direction (see arrow A3).

[0048] The hand 68 is a hand that can support the component carrier C from below and is attached to the tip portions of a plurality of arms 70. The base end portions of the plurality of arms 70 are pivotally supported by the base portion 72. By driving the connection angles between the plurality of arms 70 to change, the hand 68 moves linearly in the front-rear direction (see arrow A4).

[0049] The hand 64 and the arms 66 for transporting the substrate W and the hand 68 and the arms 70 for transporting the component carrier C are arranged vertically offset so as not to interfere with each other. In the present embodiment, the hand 64 for the substrate is arranged above the hand 68 for the component carrier.

[0050] By moving the robot moving table 62 along the X-axis direction with the base portion 72, the transfer robot 60 is integrally moved in the X-axis direction (arrow X1). By rotationally driving the robot moving table 62 about a rotation axis extending in the Z-axis direction with the base portion 72, the transfer robot 60 is integrally horizontally rotated (arrow R2). By moving the robot moving table 62 up and down along the Z-axis direction with the base portion 72, the transfer robot 60 is integrally moved up and down. Note that the function of horizontally rotating the transfer robot 60 and the function of moving it up and down may be performed by a turning mechanism or a lifting mechanism provided in the transfer robot 60.

[0051] The transfer robot 60 of the present embodiment does not have a function of moving in a horizontal direction different from the X-axis direction (for example, the Y-axis direction), and the linear movement in the horizontal direction is only in the X-axis direction. Thereby, the dimension in the Y-axis direction of the transfer module 8 can be reduced.

[0052] Returning to FIG. 1A, the relay module 6 is a module that temporarily places the substrate W and the component carrier C carried into the carry-in module 4 and delivers them to the transfer module 8.

[0053] FIG. 6 is a perspective view schematically showing the relay module 6.

[0054] As shown in FIG. 6, the relay module 6 has a first temporary placement stage 38 and a second temporary placement stage 40.

[0055] The first temporary placement stage 38 is a stage for placing the substrate W before use carried in from the carry-in module 4. By placing the substrate W held by the transfer robot 24 of the carry-in module 4 described above on the first temporary placement stage 38 with the hand 28, the substrate W before use is temporarily placed on the first temporary placement stage 38. The temporarily placed substrate W is received and transferred by a transfer robot 60 (not shown) of the transfer module 8.

[0056] The second temporary placement stage 40 is a stage for placing the component carrier C before use carried in from the carry-in module 4. By placing the component carrier C held by the transfer robot 24 of the carry-in module 4 described above on the second temporary placement stage 40 with the hand 32, the component carrier C before use is temporarily placed on the second temporary placement stage 40. The temporarily placed component carrier C is received and transferred by a transfer robot 60 (not shown) of the transfer module 8.

[0057] FIG. 7 is a schematic front view of the first temporary placement stage 38, and FIG. 8 is a schematic front view of the second temporary placement stage 40.

[0058] The first temporary placement stage 38 shown in FIG. 7 has two-stage shelves 46 and 48 as shelves for placing the substrate W.

[0059] The lower first shelf 46 is a shelf for temporarily placing the substrate W1 before use carried in from the loading module 4. The upper second shelf 48 is a shelf for temporarily placing the substrate W2 after use with components joined by a bonding device 18 described later.

[0060] By providing the second shelf 48 in addition to the first shelf 46, the substrate W2 after use with components joined can be returned to the loading module 4 via the relay module 6 and discharged to the outside of the bonding system 2.

[0061] By arranging the first shelf 46 and the second shelf 48 vertically, the horizontal dimension of the relay module 6 can be reduced. By arranging the substrate W1 before use, which has a relatively high particle retention rate compared to the substrate W2 after use, on the lower first shelf 46, the mixing of particles can be suppressed.

[0062] The second temporary placement stage 40 shown in FIG. 8 has two-stage shelves 50 and 52 as shelves for arranging the component carrier C.

[0063] The lower third shelf 50 is a shelf for temporarily placing the component carrier C1 before use carried into the loading module 4. The upper fourth shelf 52 is a shelf for temporarily placing the component carrier C2 after use with components taken out in the bonding device 18 described later.

[0064] By providing the fourth shelf 52 in addition to the third shelf 50, the component carrier C2 after use with components joined can be returned to the loading module 4 via the relay module 6 and discharged to the outside of the bonding system 2.

[0065] By arranging the third shelf 50 and the fourth shelf 52 vertically, the horizontal dimension of the relay module 6 can be reduced. By arranging the component carrier C1 before use, which has a relatively high particle retention rate compared to the component carrier C2 after use, on the lower third shelf 50, the mixing of particles can be suppressed.

[0066] Returning to FIG. 6, the temporary placement stages 38 and 40 of the present embodiment are arranged obliquely so as to intersect both the X-axis direction and the Y-axis direction in a plan view. Here, the arrangement of the temporary placement stages 38 and 40 will be described with reference to FIGS. 9 and 10.

[0067] FIGS. 9 and 10 are schematic plan views showing the periphery of the relay module 6 including the first temporary placement stage 38 and the second temporary placement stage 40, respectively.

[0068] FIG. 9 shows a state in which the substrate W arranged on the first temporary placement stage 38 is being transported, and FIG. 10 shows the states before and after the component carrier C arranged on the second temporary placement stage 40 is transported.

[0069] As shown in FIGS. 9 and 10, the first temporary placement stage 38 and the second temporary placement stage 40 are arranged in the Y-axis direction and are located on opposite sides with respect to the central axis 63 of the movement path along the X-axis direction of the downstream transfer robot 60.

[0070] As shown in FIG. 9, the first temporary placement stage 38 is configured to transfer the substrate W along the obliquely delivery direction A3 in a plan view with respect to the upstream transfer robot 24, and is configured to transfer the substrate W along the obliquely delivery direction A4 in a plan view with respect to the downstream transfer robot 60. The delivery directions A3 and A4 of the present embodiment are directions that intersect both the X-axis direction and the Y-axis direction in a plan view and are parallel to each other. In particular, the delivery direction A4 with respect to the downstream transfer robot 60 is inclined in a direction approaching the central axis 63 of the movement path of the transfer robot 60.

[0071] As shown in FIG. 10, the second temporary placement stage 40 is configured to transfer the component carrier C along the diagonal delivery direction A5 in plan view with respect to the upstream transfer robot 24, and is also configured to transfer the component carrier C along the diagonal delivery direction A6 in plan view with respect to the downstream transfer robot 60. The delivery directions A5 and A6 in the present embodiment are directions that intersect both the X-axis direction and the Y-axis direction in plan view and are parallel to each other. In particular, the delivery direction A6 with respect to the downstream transfer robot 60 is inclined in a direction approaching the central axis 63 of the movement path of the transfer robot 60.

[0072] According to such settings of the delivery directions A4 and A6, even when the downstream transfer robot 60 can only move horizontally in the X-axis direction and does not have the function of moving in the Y-axis direction, the transfer robot 60 can horizontally rotate to receive the substrate W from the first temporary placement stage 38 and receive the component carrier C from the second temporary placement stage 40. This simplifies the configuration of the transfer module 8 and can improve the processing efficiency. Furthermore, with such a configuration, since a 3-axis type, which is less expensive than a 4-axis type with a high degree of freedom of movement of the hand 64, can be adopted for the transfer robot 60, it is advantageous for cost reduction.

[0073] The inclination angles of the delivery directions A3, A4, A5, and A6 with respect to the central axis 63 may be appropriately set according to the specifications of the bonding system 2.

[0074] The upstream transfer robot 24 can move to positions where it can transfer the substrate W with the first temporary placement stage 38 and transfer the component carrier C with the second temporary placement stage 40 by moving in the Y-axis direction.

[0075] Returning to FIG. 6, the relay module 6 further includes a first positioning stage 42 and a second positioning stage 44.

[0076] The first positioning stage 42 is a stage for aligning the substrate W conveyed by the transfer robot 60 of the transfer module 8 in a predetermined orientation. By placing the substrate W held by the hand 64 on the first positioning stage 42, the substrate W before the bonding process is temporarily placed on the first positioning stage 42. The substrate W placed on the first positioning stage 42 is positioned in a predetermined orientation, and after being transferred to the transfer robot 60, it is carried into the bonding apparatus 18.

[0077] The second positioning stage 44 is a stage for aligning the component carrier C conveyed by the transfer robot 60 of the transfer module 8 in a predetermined orientation. By placing the component carrier C held by the hand 68 on the second positioning stage 44, the component carrier C before the bonding process is temporarily placed on the second positioning stage 44. The component carrier C placed on the second positioning stage 44 is positioned in a predetermined orientation, and after being transferred to the transfer robot 60, it is carried into the bonding apparatus 18.

[0078] By providing the temporary placement stages 42 and 44, the substrate W and the component carrier C can be aligned in predetermined orientations immediately before being carried into the bonding apparatus 18, leading to an improvement in the bonding process accuracy in the bonding apparatus 18.

[0079] FIG. 11 and FIG. 12 are perspective views for explaining the usage method of the first positioning stage 42, respectively.

[0080] As shown in FIGS. 11 and 12, the first positioning stage 42 includes a rotating plate 73 (FIG. 11), a rotational position detection unit 74, and a drive box 76.

[0081] The rotating plate 73 is a member for rotating the substrate W. The rotating plate 73 is rotatable about a rotation axis Ax1 extending in the Z-axis direction (arrow R3), and as shown in FIG. 12, it rotates the substrate W by rotating in a state where the substrate W is placed thereon (arrow R4).

[0082] The rotational position detection unit 74 is a member for detecting the rotational position of the substrate W. The rotational position detection unit 74 of the present embodiment irradiates light toward the outer peripheral portion of the substrate W and detects the light passing through the position corresponding to the notch N provided in the substrate W, thereby detecting the rotational position of the substrate W. Not limited to such a detection method, any detection method may be adopted as long as the rotational position of the substrate W can be detected.

[0083] The drive box 76 is a box-shaped member incorporating drive members for the rotary plate 73 and the rotational position detection unit 74. The drive box 76 is connected to the control unit 19 shown in FIG. 1A. The control unit 19 identifies the rotational position of the substrate W based on the detection result of the rotational position detection unit 74 and adjusts the amount of rotation of the rotary plate 73 so as to reach a predetermined rotational position. Thereby, the substrate W is positioned in a predetermined orientation.

[0084] FIGS. 13 and 14 are perspective views for explaining the usage method of the second positioning stage 44.

[0085] As shown in FIGS. 13 and 14, the second positioning stage 44 includes a pair of aligners 78 and a drive box 80.

[0086] The pair of aligners 78 are members for positioning the component carrier C. The pair of aligners 78 are each movable in a direction approaching each other and a direction moving away from each other (arrow A7), and when moving in the direction approaching each other, position the component carrier C in a predetermined orientation while sandwiching it.

[0087] The drive box 80 is a box-shaped member incorporating a drive member for the aligner 78. The drive box 80 is connected to the control unit 19 shown in FIG. 1A.

[0088] As shown in FIG. 14, with a pair of aligners 78 open, the component carrier C held by the transfer robot 60 with the hand 68 is placed between the pair of aligners 78. Thereafter, the pair of aligners 78 move in the closing direction (arrow A8), engage with the straight portion S of the component carrier C, and sandwich the component carrier C, thereby positioning the component carrier C in a predetermined orientation.

[0089] FIGS. 15 and 16 are schematic plan views showing the periphery of the relay module 6 including the first positioning stage 42 and the second positioning stage 44, respectively.

[0090] FIG. 15 shows a state where the substrate W is transferred at the first positioning stage 42, and FIG. 16 shows a state where the component carrier C is transferred at the second positioning stage 44.

[0091] The first positioning stage 42 and the second positioning stage 44 are arranged obliquely in plan view, similar to the temporary placement stages 38 and 40 shown in FIGS. 9 and 10. As shown in FIGS. 15 and 16, the positioning stages 42 and 44 are arranged at positions on opposite sides with respect to the central axis 63 of the movement path along the X-axis direction of the downstream transfer robot 60.

[0092] As shown in FIG. 15, the first positioning stage 42 is configured to transfer the substrate W along the delivery direction A9 that is obliquely oriented in plan view with respect to the transfer robot 60. The delivery direction A9 of the first positioning stage 42 is parallel to the delivery direction A4 (FIG. 9) of the first temporary placement stage 38.

[0093] As shown in FIG. 16, the second positioning stage 44 is configured to transfer the component carrier C along the delivery direction A10 that is obliquely oriented in plan view with respect to the transfer robot 60. The delivery direction A10 of the second positioning stage 44 is parallel to the delivery direction A6 (FIG. 10) of the second temporary placement stage 40.

[0094] Returning to FIG. 6, the temporary placement stages 38 and 40 are arranged in the upper stage, and the positioning stages 42 and 44 are arranged in the lower stage. The relay module 6 is provided with a support plate 41 that supports the temporary placement stages 38 and 40, and the support plate 41 vertically partitions the temporary placement stages 38 and 40 from the positioning stages 42 and 44. According to such an upper and lower arrangement, the floor area of the relay module 6 can be reduced, and the entry of particles can be suppressed. Further, since the positioning stages 42 and 44 have movable parts inside, there is concern about particles generated due to the friction of the movable parts. However, by arranging the positioning stages 42 and 44 below the support plate 41 that vertically partitions the space, the possibility of particles adhering to the substrate W and the component carrier C of the temporary placement stages 38 and 40 can be reduced.

[0095] Returning to FIG. 1A, the control unit 19 is a member that controls each component of the bonding system 2. The control unit 19 is composed of, for example, a microcomputer including a processor and a memory that stores a computer program executed by the processor.

[0096] The surface treatment modules 10, 12, 14, and 16 are modules for performing surface treatment of the substrate W and the component carrier C. After performing surface treatment of the substrate W and the component carrier C in the surface treatment modules 10, 12, 14, and 16, bonding treatment is performed in the bonding apparatus 18.

[0097] In the present embodiment, three surface treatment modules 10, 12, and 14 are arranged on one side (+Y-axis direction) and one surface treatment module 16 is arranged on the other side (-Y-axis direction) with respect to the movement path of the transfer robot 60.

[0098] In the present embodiment, the surface treatment modules 10 and 12 have a cleaning device for cleaning, the surface treatment module 14 has a plasma treatment device for surface modification, and the surface treatment module 16 has a UV irradiation device for curing the adhesive sheet of the component carrier C.

[0099] The cleaning device of the surface treatment module 10 cleans the surfaces of the substrate W and the component carrier C using a predetermined liquid (e.g., pure water, alkaline chemical solution, neutral surfactant).

[0100] The cleaning device of the surface treatment module 12 cleans (rinses) the surfaces of the substrate W and the component carrier C using a predetermined liquid (e.g., pure water).

[0101] The plasma treatment device of the surface treatment module 14 irradiates plasma to activate the surfaces of the substrate W and the component carrier C.

[0102] The UV irradiation device of the surface treatment module 16 irradiates ultraviolet rays onto the component carrier C to cure the surface of the adhesive sheet holding the components of the component carrier C and weaken the adhesive force.

[0103] By providing the surface treatment modules 10, 12, 14, and 16 at positions adjacent to the transfer path of the transfer robot 60, the transfer robot 60 can move in the X-axis direction to access each module and carry in and out the substrate W and the component carrier C.

[0104] Each of the surface treatment modules 10, 12, 14, and 16 is provided with a partition wall for separating the modules, an opening provided at a position facing the transfer path of the transfer robot 60 in the partition wall, and a shutter for opening and closing the opening. The openings of each module are closed except when loading and unloading the substrate W and the component carrier C, and the shutter operates to open the opening only when loading and unloading the substrate W and the component carrier C.

[0105] Further, a bonding device 18 is provided at a position adjacent to the transfer path of the transfer robot 60.

[0106] The bonding device 18 is a device for individually bonding a plurality of components held by the component carrier C to the substrate W. The bonding device 18 of the present embodiment includes a first bonding module 82 and a second bonding module 84.

[0107] The first bonding module 82 is a module that receives the substrate W from the transfer robot 60. The second bonding module 84 is a module that receives the component carrier C from the transfer robot 60.

[0108] As shown in the enlarged view of FIG. 1B, a partition wall 81 is provided between the transfer module 8 and the bonding apparatus 18. Each of the bonding modules 82 and 84 is provided with openings 82g and 84g provided at positions facing the transfer path of the transfer robot 60 in the partition wall 81, and a shutter (not shown) for opening and closing the openings 82g and 84g. The first bonding module 82 is provided with a first opening 82g for loading and unloading the substrate W, and the second bonding module 84 is provided with a second opening 84g for loading and unloading the component carrier C.

[0109] The bonding modules 82 and 84 are arranged adjacent to each other in the X-axis direction, which is the moving direction of the transfer robot 60, and their internal spaces communicate with each other.

[0110] The first bonding module 82 includes a substrate temporary placement part 86, a substrate transfer device 87, a substrate holding table 88, a stage moving device 89, and a bonding head 94.

[0111] The substrate temporary placement part 86 is a member for placing and temporarily placing the substrate W received from the transfer robot 60. The substrate transfer device 87 is a device for transferring the substrate W placed on the substrate temporary placement part 86 and delivering the substrate W to the substrate holding table 88. The substrate transfer device 87 shown in FIG. 1B includes a first substrate transfer device 87a and a second substrate transfer device 87b. The first substrate transfer device 87a transfers the substrate S placed on the substrate temporary placement part 26 and delivers the substrate S to the second substrate transfer device 87b. The second substrate transfer device 87b delivers the substrate S received from the first substrate transfer device 87a to the substrate holding table 88.

[0112] The substrate holding table 88 holds the substrate W received from the substrate transfer device 87 and holds the substrate W while the bonding head 94 performs component bonding. The stage moving device 89 is a device that moves the substrate holding table 88. The bonding head 94 is a member that receives components from the pickup head 96 described later and bonds the received components to the substrate W. The bonding head 94 of the present embodiment is movable along the X-axis direction, which is the arrangement direction of the bonding modules 82 and 84.

[0113] The second bonding module 84 includes a carrier temporary placement unit 90, a carrier transfer device 91, a carrier holding table 92, a stage moving device 93, and a pickup head 96.

[0114] The carrier temporary placement unit 90 is a member for arranging and temporarily placing the component carrier C received from the transfer robot 60. The carrier transfer device 91 is a device for transferring the component carrier C arranged in the carrier temporary placement unit 90 and delivering the component carrier C to the carrier holding table 92. The carrier holding table 92 holds the component carrier C received from the carrier transfer device 91 and holds the component carrier C while the pickup head 96 picks up components. The stage moving device 93 is a device that moves the carrier holding table 92. The pickup head 96 is a member that receives components from the component carrier C held on the carrier holding table 92 and delivers the received components to the bonding head 94 described above.

[0115] Here, the detailed configuration and operation of the carrier holding table 92 will be described with reference to FIGS. 17 to 21.

[0116] FIG. 17 is a perspective view schematically showing the carrier holding table 92.

[0117] As shown in FIG. 17, the carrier holding table 92 includes a carrier frame guide 100, a carrier frame retainer 102, a plurality of columns 104, a drive box 106, a sheet extension ring 108, and an ejector 110.

[0118] The carrier frame guide 100 is a member that supports the carrier frame 112 of the component carrier C. The component carrier C has an outer carrier frame 112 and an inner adhesive sheet 114, and a plurality of components P are held on the adhesive sheet 114. A conveying device (the carrier conveying device 91 shown in FIG. 1B) (not shown) conveys the component carrier C to the carrier frame guide 100 (arrow A11), and the carrier frame guide 100 supports the carrier frame 112 of the component carrier C.

[0119] The carrier frame retainer 102 is a member for pressing the carrier frame 112 of the component carrier C from above. The carrier frame retainer 102 has a ring shape with an opening in the central part, and the dimensions of the opening are larger than the dimensions of the adhesive sheet 114.

[0120] The columns 104 are members that support the carrier frame retainer 102 from below, and a plurality of columns 104 are provided. The columns 104 are configured to be movable up and down by the drive box 106. By the drive box 106 moving the columns 104 up and down, the carrier frame guide 100, the carrier frame retainer 102, and the columns 104 move up and down integrally (arrow Z1). The carrier frame guide 100, the carrier frame retainer 102, and the columns 104 constitute a lifting part 101.

[0121] The drive box 106 is a box incorporating a drive unit for moving the lifting part 101 up and down.

[0122] The sheet expansion ring 108 is a member for supporting the adhesive sheet 114 inside the component carrier C from below and expanding it outward. When the component carrier C supported by the carrier frame guide 100 descends, the adhesive sheet 114 of the component carrier C comes into contact with and is supported by the sheet expansion ring 108. The sheet expansion ring 108 has a cylindrical shape extending in the Z-axis direction, and the ring portion at the upper end supports the adhesive sheet 114.

[0123] The ejector 110 is a member for assisting in picking up a component by the pickup head 96 by abutting against the adhesive sheet 114 supported by the sheet expansion ring 108 from below and pushing up the component at a predetermined position. The ejector 110 is moved up and down by a drive box 106 independently of the lifting part 101.

[0124] A method for holding the component carrier C by the carrier holding table 92 having the above configuration will be described with reference to FIGS. 18 to 21. FIGS. 18 to 21 are longitudinal sectional views schematically showing the method for holding the component carrier C by the carrier holding table 92.

[0125] As shown in FIG. 18, a transport device (carrier transport device 91 shown in FIG. 1B) (not shown) transports the component carrier C and supports the carrier frame 112 of the component carrier C on the carrier frame guide 100.

[0126] As shown in FIG. 19, the lifting part 101 is lowered (arrow Z2). As a result, the component carrier C supported by the carrier frame guide 100 and the lifting part 101 are integrally lowered, and the adhesive sheet 114 of the component carrier C comes into contact with the upper end of the sheet expansion ring 108. When the lifting part 101 is further lowered from this state, the carrier frame 112 of the component carrier C separates from the carrier frame guide 100, and the lowered carrier frame presser 102 comes into contact with the carrier frame 112.

[0127] As shown in FIG. 20, the carrier frame retainer 102 pushes down the carrier frame 112 (arrow Z3). As a result, the adhesive sheet 114 is expanded radially outward, and the intervals between the plurality of components P held by the adhesive sheet 114 are widened.

[0128] As shown in FIG. 21, thereafter, the ejector 110 rises (arrow Z4), pushes up the lower surface of the adhesive sheet 114, and pushes up the component P1 at a predetermined position. By pushing up the component P1, the pickup operation of the component P1 by the pickup head 96 can be accurately performed.

[0129] Regarding the bonding operation of individually bonding the plurality of components P held by the component carrier C to the substrate W using the above-described carrier holding table 92 and substrate holding table 90, FIGS. 22 to 24 will be used for explanation.

[0130] FIG. 22 is a longitudinal sectional view schematically showing a state in which the substrate W is held by the substrate holding table 88. FIGS. 23 and 24 are longitudinal sectional views schematically showing a method of bonding the component P held by the component carrier C to the substrate W.

[0131] As shown in FIG. 22, the substrate transfer device 87 shown in FIG. 1A transfers the substrate W and places the substrate W on the holding surface 89 of the substrate holding table 88. The XY coordinate position of the substrate holding table 88 is adjusted so that the substrate W is positioned at a predetermined bonding work position XY1. The bonding head 94 is disposed at a component transfer position XY2 for transferring the component P between the pickup head 96.

[0132] As shown in FIG. 23, in the component carrier C held by the carrier holding table 92, with the ejector 110 pushing up the component P1 at a predetermined position, the pickup head 96 descends (arrow A12) to pick up the component P1. At this time, the XY coordinate position of the carrier holding table 92 is adjusted so that the component P1 is positioned at a predetermined pickup work position XY3.

[0133] The pickup head 96 that has picked up the component P1 moves horizontally from the pickup operation position XY3 toward the component delivery position XY2 (arrow A13) and flips over during the process (arrow R5). As a result, the component P1 is oriented upward.

[0134] After that, the bonding head 94 positioned above the pickup head 96 at the component delivery position XY2 descends (arrow A14) and adsorbs and holds the component P1 held by the pickup head 96. As a result, the component P1 is transferred from the pickup head 96 to the bonding head 94. The bonding head 94 that has received the component P1 moves from the component delivery position XY2 to the bonding operation position XY1 (arrow A15).

[0135] The bonding head 94 that has moved to the bonding operation position XY1 descends toward the substrate W held by the substrate holding table 88 as shown in FIG. 24 (arrow A16) and joins the component P1 to the substrate W at a position corresponding to the bonding operation position XY1. As a result, the joining process of the component P1 is completed.

[0136] While the bonding head 94 is mounting the component P1 on the substrate W, the pickup head 96 executes an operation to pick up the next component P2. In order to align the next component P2 with the pickup operation position XY3, the elevating unit 101 that supports the component carrier C is moved in the XY direction. The ejector 110 does not have a function of moving in the XY direction and moves up and down independently of the elevating unit 101 in a state of being arranged in advance at the pickup operation position XY3.

[0137] By repeatedly executing the operations shown in FIGS. 23 and 24, a plurality of components P held by the component carrier C can be individually joined to one substrate W.

[0138] In the bonding system 2 of the present embodiment, when bonding the component P to the substrate W, hybrid bonding is performed in which the electrodes are directly bonded without using a bonding auxiliary member such as solder. In order to perform the hybrid bonding with high precision, surface treatment is performed on each of the substrate W and the component P before loading them into the bonding apparatus 18.

[0139] In the present embodiment, a plurality of types of surface treatment modules 10, 12, 14, 16 as shown in FIG. 1A are provided, and a transfer robot 60 of the transfer module 8 corresponding to both the substrate W and the component carrier C is provided. After the transfer robot 60 transfers the substrate W and the component carrier C to each module and performs surface treatment, they are loaded into the bonding apparatus 18.

[0140] (Processing flow of the substrate) An example of the processing flow of the substrate W by the bonding system 2 of the present embodiment will be described with reference to FIGS. 25 to 27. FIGS. 25 to 27 are respectively plan views of the bonding system 2 schematically showing an example of the processing flow of the substrate W.

[0141] In FIGS. 25 to 27, the moving order of the substrate W is indicated by dotted arrows.

[0142] FIG. 25 shows the moving order of the substrate W from when it is supplied by the load port 3 until it is loaded into the first bonding module 82 of the bonding apparatus 18.

[0143] <Step of loading into the bonding system, temporary placement step> As shown in FIG. 25, the transfer robot 24 of the transfer module 4 accesses the sealed container 20 mounted on the load port 3, and using the hand 28 (FIGS. 2 to 4), takes out one substrate W from the sealed container 20. After the transfer robot 24 that has taken out the substrate W rotates horizontally, it delivers the substrate W obliquely in plan view to the first shelf 46 (FIG. 7) at the lower stage of the first temporary placement stage 38 of the relay module 6.

[0144] <First cleaning step (first surface treatment step)> After that, the transfer robot 60 of the transfer module 8 accesses the first temporary placement stage 38 and receives the substrate W in an obliquely oriented manner in plan view. After horizontally rotating, the transfer robot 60 that has received the substrate W horizontally moves in the +X-axis direction so as to access the surface treatment module 10, and transfers the substrate W to the surface treatment module 10. In the surface treatment module 10, a cleaning process of the substrate W using a liquid such as pure water or a chemical solution is performed.

[0145] <Surface modification step (second surface treatment step)> The substrate W that has undergone the cleaning process is carried out from the surface treatment module 10 and received by the transfer robot 60. The transfer robot 60 that has received the substrate W horizontally moves in the +X-axis direction so as to access the surface treatment module 14, and transfers the substrate W to the surface treatment module 14. In the surface treatment module 14, a surface modification process of the substrate W using plasma is performed.

[0146] <Second cleaning step (third surface treatment step)> The substrate W that has undergone the surface modification process is carried out from the surface treatment module 14 and received by the transfer robot 60. The transfer robot 60 that has received the substrate W horizontally moves in the -X-axis direction so as to access the surface treatment module 12, and transfers the substrate W to the surface treatment module 12. In the surface treatment module 12, a cleaning process of the substrate W using pure water is performed.

[0147] <Positioning step> The substrate W that has undergone the cleaning process is carried out from the surface treatment module 12 and received by the transfer robot 60. The transfer robot 60 that has received the substrate W horizontally moves in the -X-axis direction so as to access the third temporary placement stage 42 of the relay module 6, and transfers the substrate W to the third temporary placement stage 42 in an obliquely oriented manner in plan view. At the third temporary placement stage 42, positioning is performed so that the substrates W are aligned in a predetermined orientation.

[0148] <Loading step into the bonding apparatus> The transfer robot 60 receives the substrate W positioned in a predetermined orientation on the third temporary placement stage 42 in an obliquely oriented manner in a plan view. The transfer robot 60 that has received the substrate W horizontally moves in the +X-axis direction so as to access the first bonding module 82 of the bonding apparatus 18, and carries the substrate W into the first bonding module 82.

[0149] According to the above flow, after performing a cleaning process and a surface modification process on the substrate W, the substrates W are aligned in a predetermined orientation on the third temporary placement stage 42, and then the substrate W is carried into the first bonding module 82.

[0150] <Bonding step> The substrate W carried into the first bonding module 82 is subjected to a bonding process using a plurality of components P of the component carrier C carried into the second bonding module 84. In the present embodiment, when bonding a plurality of components P to the substrate W, the components P can also be stacked in multiple stages. At this time, after the bonding process of the components P in the nth stage is completed, before executing the bonding process of the components P in the n + 1th stage, a cleaning process of the substrate W is performed.

[0151] FIG. 26 shows the movement sequence of the substrate W from when the substrate W is carried into the first bonding module 82 and a predetermined number of components P (for example, the components P in the nth stage) are bonded until after various surface treatments are performed after carrying the substrate W out of the first bonding module 82 and before returning it to the first bonding module 82.

[0152] As shown in FIG. 26, the transfer robot 60 receives the substrate W unloaded from the first bonding module 82, and the transfer robot 60 rotates horizontally to access the surface treatment module 10. Similar to the processing flow of FIG. 25, the transfer robot 60 transfers the substrate W so as to execute in order a cleaning process (first cleaning step) in the surface treatment module 10, a surface modification process (surface modification step) in the surface treatment module 14, a cleaning process (second cleaning step) in the surface treatment module 12, a positioning process (positioning step) in the third temporary placement stage 42, and a supply process to the first bonding module 82 (loading step into the bonding apparatus).

[0153] By executing the processing flow shown in FIG. 26 every time the components P at each stage are joined, it is possible to accurately execute the process of joining the components P in multiple stages to the substrate W.

[0154] FIG. 27 shows the movement order of the substrate W from when the substrate W is unloaded from the first bonding module 82 until it returns to the load port 3 after all the components P to be joined to the substrate W are joined.

[0155] <Unloading step from the bonding apparatus, temporary placement step> As shown in FIG. 27, the transfer robot 60 receives the substrate W unloaded from the first bonding module 82, and the transfer robot 60 moves horizontally in the -X axis direction to access the first temporary placement stage 38. The transfer robot 60 delivers the substrate W obliquely in plan view to the second shelf 48 (FIG. 7) in the upper stage of the first temporary placement stage 38.

[0156] <Unloading step from the bonding system> The transfer robot 24 of the transfer module 4 accesses the first temporary placement stage 38 and receives the substrate W obliquely in plan view. The transfer robot 24 that has received the substrate W rotates horizontally and delivers the substrate W to the load port 3.

[0157] According to the processing flow shown in FIG. 27, the used substrate W after the joining process of the component P is completed can be returned to the load port 3 and discharged outside the bonding system 2.

[0158] (Processing flow of component carrier) An example of the processing flow of the component carrier C by the bonding system 2 of the present embodiment will be described with reference to FIGS. 28 and 29. FIGS. 28 and 29 are respectively plan views of the bonding system 2 schematically showing an example of the processing flow of the component carrier C.

[0159] In FIGS. 28 and 29, the moving order of the component carrier C is indicated by dotted arrows.

[0160] FIG. 28 shows the moving order of the component carrier C from when it is supplied by the load port 3 until it is carried into the second bonding module 84 of the bonding apparatus 18.

[0161] <Carrying-in step to bonding system, temporary placement step> As shown in FIG. 28, the transfer robot 24 of the carrying-in module 4 accesses the sealed container 22 mounted on the load port 3, and using the hand 32 (FIGS. 2 to 4), takes out one component carrier C from the sealed container 22. After the transfer robot 24 that has taken out the component carrier C rotates horizontally, it transfers the component carrier C diagonally in plan view to the third shelf 50 (FIG. 8) at the lower stage of the second temporary placement stage 40 of the relay module 6.

[0162] <First cleaning step (first surface treatment step)> The transfer robot 60 of the transfer module 8 accesses the second temporary placement stage 40 and receives the component carrier C diagonally in plan view. After the transfer robot 60 that has received the component carrier C rotates horizontally, it moves horizontally in the +X axis direction to access the surface treatment module 10, and transfers the component carrier C to the surface treatment module 10. In the surface treatment module 10, a cleaning process of the component carrier C using a liquid such as pure water or chemical solution is performed.

[0163] <Surface modification step (second surface treatment step)> The component carrier C that has undergone the cleaning process is carried out from the surface treatment module 10 and received by the transfer robot 60. The transfer robot 60 that has received the component carrier C horizontally moves in the +X-axis direction to access the surface treatment module 14 and delivers the component carrier C to the surface treatment module 14. In the surface treatment module 14, a surface modification process of the component carrier C using plasma is performed.

[0164] <Second cleaning step (third surface treatment step)> The component carrier C that has undergone the surface modification process is carried out from the surface treatment module 14 and received by the transfer robot 60. The transfer robot 60 that has received the component carrier C horizontally moves in the -X-axis direction to access the surface treatment module 12 and delivers the component carrier C to the surface treatment module 12. In the surface treatment module 12, a cleaning process of the component carrier C using pure water is performed.

[0165] <Ultraviolet irradiation step (fourth surface treatment step)> The component carrier C that has undergone the cleaning process is carried out from the surface treatment module 12 and received by the transfer robot 60. The transfer robot 60 that has received the component carrier C horizontally moves in the +X-axis direction to access the surface treatment module 16 and delivers the component carrier C to the surface treatment module 16. In the surface treatment module 16, an ultraviolet irradiation process on the component carrier C is performed. Thereby, the adhesive sheet 114 of the component carrier C is cured to weaken the adhesive force of the component P.

[0166] <Positioning step> The component carrier C that has undergone ultraviolet irradiation treatment is carried out from the surface treatment module 16 and received by the transfer robot 60. The transfer robot 60 that has received the component carrier C horizontally moves in the -X axis direction so as to access the fourth temporary placement stage 44 of the relay module 6, and transfers the component carrier C to the fourth temporary placement stage 44 obliquely in a plan view. At the fourth temporary placement stage 44, the component carrier C is positioned so that the components are aligned in a predetermined orientation.

[0167] <Step of Loading into Bonding Apparatus> The transfer robot 60 receives the component carrier C positioned in a predetermined orientation at the fourth temporary placement stage 44 obliquely in a plan view. The transfer robot 60 that has received the component carrier C horizontally moves in the +X axis direction so as to access the second bonding module 84 of the bonding apparatus 18, and loads the component carrier C into the second bonding module 84.

[0168] According to the above flow, after performing cleaning treatment, surface modification treatment, and ultraviolet irradiation treatment on the component carrier C, the component carrier C is aligned in a predetermined orientation at the fourth temporary placement stage 44, and then the component carrier C is supplied to the second bonding module 84.

[0169] <Step of Removing Components, Bonding Step> In the second bonding module 84, a plurality of components P held by the component carrier C are sequentially taken out by the pickup head 96, transferred to the bonding head 94, and then bonded to the substrate W. After all the components P have been taken out, the used component carrier C is carried out from the second bonding module 84 and then discharged to the outside from the bonding system 2.

[0170] FIG. 29 shows the movement sequence of the component carrier C after all the components P to be taken out in the second bonding module 84 have been taken out, after the component carrier C is carried out from the second bonding module 84, and until it returns to the load port 3.

[0171] <Unloading Step from Bonding Device, Temporary Placement Step> As shown in FIG. 29, the transfer robot 60 receives the component carrier C unloaded from the second bonding module 84, and the transfer robot 60 horizontally moves in the -X axis direction so as to access the second temporary placement stage 40. The transfer robot 60 transfers the component carrier C diagonally in a plan view with respect to the fourth shelf 52 (FIG. 8) on the upper stage of the second temporary placement stage 40.

[0172] <Unloading Step from Bonding System> The transfer robot 24 of the loading module 4 accesses the second temporary placement stage 40 and receives the component carrier C diagonally in a plan view. The transfer robot 24 that has received the component carrier C rotates horizontally and transfers the component carrier C to the load port 3.

[0173] According to the processing flow shown in FIG. 29, the used component carrier C from which the component P has been taken out can be returned to the load port 3 and discharged outside the bonding system 2.

[0174] According to the above configuration and method, as a hybrid bonding system capable of directly bonding the electrodes of the component P and the substrate W, in particular, a highly efficient bonding system 2 capable of automatically transferring both the component carrier C and the substrate W can be constructed.

[0175] By using the transfer robots 24 and 60 corresponding to both the component P and the substrate W, which are two types of transfer targets, the transferred component P and the substrate W can be efficiently transferred respectively, and a highly efficient bonding system 2 can be realized.

[0176] Also, by providing the temporary placement module 6, the substrate W and the component carrier C can be efficiently transferred between the loading module 4 and the transfer module 8. Furthermore, by adding the positioning function of the component carrier C and the substrate W to the relay module 6, the accuracy of the component bonding process in the bonding device 18 can be improved.

[0177] The number of component carriers C required for one substrate W varies. For example, five component carriers C may be required for one substrate W. The processing flow of the substrate W shown in FIGS. 25 to 27 and the processing flow of the component carrier C shown in FIGS. 28 and 29 may be executed at appropriate timings according to one substrate W and the number of component carriers C required therefor, and may be executed in parallel.

[0178] (Function and Effect 1) The bonding system 2 of the present embodiment includes a plurality of surface treatment modules 10, 12, 14, 16 that perform surface treatment on a plurality of components P held by a component carrier C and surface treatment on a substrate W for bonding the plurality of components P, a bonding device 18 that individually bonds the plurality of surface-treated components P to the surface-treated substrate W, and a transfer module 8 that transfers the component carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18. The transfer module 8 includes a transfer robot 60 having a hand 64 (first hand) that holds the substrate W and a hand 68 (second hand) that holds the component carrier C, and a robot moving table 62 that moves the transfer robot 60 along the X-axis direction (first direction).

[0179] According to such a configuration, both the substrate W and the component carrier C can be transferred by the transfer robot 60 and moved between the surface treatment modules 10, 12, 14, 16 and the bonding device 18, and a bonding system 2 with high processing efficiency can be realized. Note that, not limited to the surface treatment modules 10, 12, 14, 16, as long as at least one surface treatment module can process the substrate W and at least one surface treatment module can process the component carrier C, a plurality of surface treatment modules that perform surface treatment on a plurality of components P held by the component carrier C and surface treatment on the substrate W for bonding the plurality of components P may be provided.

[0180] In addition, in the bonding system 2 of the present embodiment, the surface treatment modules 10, 12, 14 and the bonding device 18 are arranged on opposite sides across the movement path along the X-axis direction (first direction) of the transfer robot 60. According to such a configuration, while the transfer robot 60 is movable in the X-axis direction and horizontally rotates, the component carriers C and the components P can be easily transferred to the surface treatment modules 10, 12, 14 and the bonding device 18 arranged on the opposite sides across the movement path of the transfer robot 60. Note that it is not limited to the three surface treatment modules 10, 12, 14, and at least one surface treatment module and the bonding device 18 may be arranged on opposite sides across the movement path along the X-axis direction of the transfer robot 60.

[0181] In addition, in the bonding system 2 of the present embodiment, the surface treatment modules 10, 12, 14, 16 perform surface treatment using any one of ultraviolet rays, plasma, and liquid. According to such a configuration, a plurality of types of surface treatment can be performed on the substrate W and the component carrier C.

[0182] In addition, in the bonding system 2 of the present embodiment, the component carrier C is a tape frame having an ultraviolet-curable adhesive sheet 114, and the surface treatment module 16 has an ultraviolet irradiation device that irradiates ultraviolet rays. According to such a configuration, when the surface treatment module 16 irradiates the adhesive sheet 114 of the tape frame with ultraviolet rays, the adhesive force of the component P by the adhesive sheet 114 is weakened, and it becomes easier to pick up the component P from the tape frame. Note that it is not limited to only the surface treatment module 16, and at least one surface treatment module may have an ultraviolet irradiation device that irradiates ultraviolet rays.

[0183] In addition, in the bonding system 2 of the present embodiment, the bonding apparatus 18 includes a first bonding module 82 into which the substrate W is carried, and a second bonding module 84 through which the component carrier C is conveyed. The first bonding module 82 and the second bonding module 84 are arranged in the X-axis direction (first direction). According to such a configuration, by arranging the two types of bonding modules in the X-axis direction, when the transfer robot 60 moves in the X-axis direction (first direction), it can easily access the respective bonding modules 82 and 84.

[0184] Further, the bonding system 2 of the present embodiment further includes a partition wall 81 that separates the transfer module 8 and the bonding apparatus 18. The partition wall 81 is provided with openings 82g and 84g for delivering the component carrier C and the substrate W held by the transfer module 8 to the bonding apparatus 18. According to such a configuration, by partitioning the partition wall 81 at locations other than the openings 82g and 84g, it is possible to suppress the entry of particles.

[0185] In addition, in the bonding system 2 of the present embodiment, the openings 82g and 84g provided in the partition wall 81 include a first opening 82g for passing the substrate W and a second opening 84g for passing the component carrier C. According to such a configuration, by separating the first opening 82g for passing the substrate W and the second opening 84g for passing the component carrier C, it is possible to further suppress the entry of particles.

[0186] In addition, in the bonding system 2 of the present embodiment, the hand 64 (first hand) and the hand 68 (second hand) are arranged so as to be vertically offset from each other, and each can move back and forth. According to such a configuration, it is possible to hold the component carrier C and the substrate W respectively while preventing interference between the hand 64 and the hand 68.

[0187] In the bonding system 2 of the present embodiment, the hand 64 (first hand) is disposed above the hand 68 (second hand). According to such a configuration, by disposing the component carrier C having a higher particle adhesion rate than the substrate W below, it is possible to suppress the mixing of particles caused by the component carrier C.

[0188] In the bonding system 2 of the present embodiment, the substrate W is a wafer, and the component carrier C is a tape frame. According to such a configuration, it is possible to execute a bonding process of bonding the component P held by the tape frame to the wafer.

[0189] The bonding method of the present embodiment also includes steps of performing surface treatment on a plurality of components P held by the component carrier C, performing surface treatment on the substrate W for bonding the plurality of components P, transporting the surface-treated substrate W to the bonding apparatus 18 by the hand 64 (first hand), transporting the surface-treated component carrier C to the bonding apparatus 18 by the hand 68 (second hand), individually bonding the plurality of surface-treated components P to the surface-treated substrate W using the bonding apparatus 18, taking out the substrate W to which the plurality of components P are bonded from the bonding apparatus 18 by the hand 64, and taking out the component carrier C from which the plurality of components P are taken out from the bonding apparatus 18 by the hand 68.

[0190] According to such a method, both the substrate W and the component carrier C can be transported by the transfer robot 60 and carried into and out of the bonding apparatus 18, and a bonding system 2 with high processing efficiency can be realized.

[0191] (Function and Effect 2) The bonding system 2 of this embodiment includes a loading module 4 for loading a component carrier C that holds a plurality of components P and a substrate W for bonding the plurality of components P, a relay module 6 for placing the component carrier C and the substrate W received from the loading module 4, a transport module 8 for transporting the component carrier C and the substrate W placed on the relay module 6 along the X-axis direction (first direction), surface treatment modules 10, 12, 14, 16 for performing surface treatment on the plurality of components P held by the component carrier C and surface treatment on the substrate W, and a bonding device 18 for individually bonding the plurality of surface-treated components P to the surface-treated substrate W. The transport module 8 transports the component carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18.

[0192] According to such a configuration, both the substrate W and the component carrier C can be transported by the transport module 8 and moved between the surface treatment modules 10, 12, 14, 16 and the bonding device 18, and a bonding system 2 with high processing efficiency can be realized. Note that not limited to the surface treatment modules 10, 12, 14, 16, as long as at least one surface treatment module can process the substrate W and at least one surface treatment module can process the component carrier C, a surface treatment module for performing surface treatment on the plurality of components P held by the component carrier C and surface treatment on the substrate W for bonding the plurality of components P may be provided.

[0193] In addition, in the bonding system 2 of this embodiment, the relay module 6 has a first temporary placement stage 38 for placing the substrate W and a second temporary placement stage 40 for placing the component carrier C. According to such a configuration, the substrate W and the component carrier C can be placed in separate locations.

[0194] Also, in the bonding system 2 of the present embodiment, the first temporary placement stage 38 has a first shelf 46 on which the pre-use substrate W received from the loading module 4 is placed, and a second shelf 48 on which the post-use substrate W to which a plurality of components P are bonded is placed. The second temporary placement stage 40 has a third shelf 50 on which the pre-use component carrier C received from the loading module 4 is placed, and a fourth shelf 52 on which the post-use component carrier C from which a plurality of components P have been taken out is placed. According to such a configuration, the pre-use substrate W and the post-use substrate W can be respectively arranged on the first temporary placement stage 38, and the pre-use component carrier C and the post-use component carrier C can be respectively arranged on the second temporary placement stage 40.

[0195] Also, in the bonding system 2 of the present embodiment, the first shelf 46 is located below the second shelf 48, and the third shelf 50 is located below the fourth shelf 52. According to such a configuration, since the substrate W and the component carrier C are more likely to contain more particles before use than after use, by arranging the pre-use substrate W and the component carrier C below, it is possible to suppress the mixing of particles into the post-use substrate W and the component carrier C.

[0196] Also, in the bonding system 2 of the present embodiment, the first temporary placement stage 38 is configured to transfer the substrate W to the transfer module 8 in a first delivery direction A4 in a plan view, and the second temporary placement stage 40 is configured to transfer the component carrier C to the transfer module 8 in a second delivery direction A6 in a plan view. According to such a configuration, the temporary placement stages 38 and 40 can transfer the substrate W and the component carrier C to the transfer module 8 in desired directions respectively.

[0197] In the bonding system 2 of the present embodiment, the first temporary placement stage 38 and the second temporary placement stage 40 are arranged in the Y-axis direction (second direction) intersecting the X-axis direction (first direction) in a plan view, and the first delivery direction A4 and the second delivery direction A6 respectively intersect the X-axis direction. According to such a configuration, the temporary placement stages 38 and 40 can be arranged toward the transfer module 8 respectively, and the component carrier C and the substrate W can be smoothly delivered.

[0198] In the bonding system 2 of the present embodiment, the relay module 6 further has positioning stages 42 and 44 for receiving the component carrier C and the substrate W from the transfer module 8 and positioning them in predetermined delivery directions A9 and A10. According to such a configuration, by positioning the component carrier C and the substrate W in the predetermined delivery directions A9 and A10 before loading them into the bonding device 18, it becomes easier to keep the postures of the component carrier C and the substrate W constant in the bonding device 18, leading to an improvement in bonding accuracy.

[0199] In the bonding system 2 of the present embodiment, the positioning stages 42 and 44 include a first positioning stage 42 for positioning the substrate W and a second positioning stage 44 for positioning the component carrier C. According to such a configuration, the substrate W and the component carrier C can be positioned on separate stages 42 and 44 respectively.

[0200] In the bonding system 2 of the present embodiment, the positioning stages 42 and 44 are located below the first temporary placement stage 38 and the second temporary placement stage 40. According to such a configuration, the entry of particles can be suppressed.

[0201] In addition, in the bonding system 2 of the present embodiment, the loading module 4 includes a transfer robot 24 (first transfer robot) having a hand 28 (first hand) for holding the substrate W and a hand 32 (second hand) for holding the component carrier C, and a robot transfer table 26 (first robot transfer table) for moving the transfer robot 24 in the Y-axis direction (second direction) intersecting the X-axis direction (first direction) in a plan view. According to such a configuration, both the substrate W and the component carrier C can be transferred by the transfer robot 24.

[0202] In addition, in the bonding system 2 of the present embodiment, the transfer module 8 includes a transfer robot 60 (second transfer robot) having a hand 64 (third hand) for holding the substrate W and a hand 68 (fourth hand) for holding the component carrier C, and a robot transfer table 62 (second robot transfer table) for moving the transfer robot 60 in the X-axis direction (first direction). According to such a configuration, both the substrate W and the component carrier C can be transferred by the transfer robot 60.

[0203] In addition, in the bonding system 2 of the present embodiment, the surface treatment modules 10, 12, 14 and the bonding device 18 are arranged on opposite sides with respect to the movement path along the X-axis direction (first direction) of the transfer module 8. According to such a configuration, while the transfer robot 60 can move in the X-axis direction and rotate horizontally, it is possible to easily transfer the component carrier C and the component P to the surface treatment modules 10, 12, 14 and the bonding device 18 arranged on the opposite sides across the movement path of the transfer module 8. Note that it is not limited to the three surface treatment modules 10, 12, 14, and at least one surface treatment module and the bonding device 18 may be arranged on opposite sides with respect to the movement path along the X-axis direction of the transfer module 8.

[0204] In the bonding system 2 of the present embodiment, the substrate W is a wafer, and the component carrier C is a tape frame. According to such a configuration, a bonding process for bonding the components P held on the tape frame to the wafer can be executed.

[0205] Also, the bonding method of the present embodiment includes a step of loading, using the loading module 4, a component carrier C that holds a plurality of components P and a substrate W for bonding the plurality of components P; a step of placing, using the relay module 6, the component carrier C and the substrate W received from the loading module 4; a step of transporting, using the transport module 8, the component carrier C and the substrate W placed on the relay module 6 along the X-axis direction (first direction); a step of performing surface treatment on the plurality of components P held by the component carrier C and surface treatment on the substrate W, using the surface treatment modules 10, 12, 14, 16; and a step of individually bonding, using the bonding apparatus 18, the plurality of surface-treated components P to the surface-treated substrate W. As the transport module 8, one that transports the component carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding apparatus 18 is used.

[0206] According to such a method, both the substrate W and the component carrier C can be transported by the transport module 8 and moved between the surface treatment modules 10, 12, 14, 16 and the bonding apparatus 18, and a highly efficient bonding system 2 can be realized.

[0207] (Modifications, etc.) In the above-described embodiment, the case where the substrate W is a wafer and the component carrier C is a tape frame has been described. However, it is not limited to such a case, and the substrate W may be a substrate of a type different from a wafer, and the component carrier C may be a component carrier of a type different from a tape frame.

[0208] In the above-described embodiment, the case where three surface treatment modules 10, 12, and 14 are provided as the first surface treatment module has been described. However, the number of the first surface treatment modules is not limited to three, and any number may be used. Similarly, in the case where one surface treatment module 16 is provided as the second surface treatment module, the number of the second surface treatment modules is not limited to one, and any number may be used.

[0209] In addition, the specific surface treatment methods (cleaning treatment, surface modification treatment, ultraviolet irradiation treatment) in the surface treatment modules 10, 12, 14, and 16 may be appropriately changed according to the specifications of the substrate W and the components P, etc. The surface treatment modules 10, 12, 14, and 16 are not limited to the type capable of treating both the substrate W and the component carrier C, and may be a surface treatment module dedicated to the substrate or a surface treatment module dedicated to the component carrier.

[0210] In the above-described embodiment, the case where the layout of each module as shown in FIG. 1A is applied has been described. However, not limited to such a case, the layout may be appropriately changed, such as changing the arrangement of the surface treatment modules 10, 12, 14, and 16.

[0211] This disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings. However, various modifications and corrections are obvious to those skilled in the art of this technology. Such modifications and corrections should be understood to be included therein as long as they do not deviate from the scope of this disclosure according to the appended claims. In addition, changes in the combination and order of elements in each embodiment can be realized without departing from the scope and idea of this disclosure.

[0212] Note that by appropriately combining the above various modification examples, the respective effects can be achieved.

Industrial Applicability

[0213] The present disclosure is applicable to a bonding system and a bonding method for individually bonding a plurality of components held by a component carrier to a substrate.

Explanation of Signs

[0214] 2 Bonding system 4 Loading module 6 Relay module 8 Conveying module 10, 12, 14, 16 Surface treatment module 18 Bonding device 19 Control unit 24 Conveying robot 26 Robot moving table 28 Hand 32 Hand 60 Conveying robot 62 Robot moving table 64 Hand 68 Hand C Component carrier P Component W Substrate

Claims

1. A plurality of surface treatment modules for performing surface treatment on a plurality of components held by a component carrier and surface treatment on a substrate for bonding the plurality of components; A bonding device for individually bonding the plurality of surface-treated components to the surface-treated substrate; A transfer module for transferring the component carrier and the substrate between the surface treatment module and the bonding device, comprising: The transfer module: A transfer robot having a first hand for holding the substrate and a second hand for holding the component carrier; A robot moving table for moving the transfer robot along a first direction, a bonding system.

2. The bonding system according to claim 1, wherein at least one of the surface treatment module and the bonding device is disposed on opposite sides of the transfer robot across a moving path along the first direction.

3. The bonding system according to claim 1, wherein the surface treatment module performs surface treatment using any one of ultraviolet rays, plasma, and liquid.

4. The component carrier is a tape frame having an ultraviolet curable adhesive sheet, The bonding system according to claim 1, wherein at least one of the surface treatment modules has an ultraviolet irradiation device for irradiating ultraviolet rays.

5. The bonding device has a first bonding module into which the substrate is loaded and a second bonding module to which the component carrier is transferred, The bonding system according to claim 1, wherein the first bonding module and the second bonding module are arranged in the first direction.

6. Further comprising a partition wall separating the transfer module and the bonding device from each other, The bonding system according to claim 1, wherein the partition wall is provided with an opening for delivering the component carrier and the substrate held by the transfer module to the bonding device.

7. The bonding system according to claim 6, wherein the opening has a first opening for passing the substrate therethrough and a second opening for passing the component carrier therethrough.

8. The bonding system according to claim 1, wherein the first hand and the second hand are vertically offset from each other and each is movable back and forth.

9. The bonding system according to claim 8, wherein the first hand is disposed above the second hand.

10. The bonding system according to claim 1, wherein the substrate is a wafer and the component carrier is a tape frame.

11. Performing a surface treatment on a plurality of components held by a component carrier; Performing a surface treatment on a substrate for bonding the plurality of components; Conveying the surface-treated substrate to a bonding apparatus with a first hand; Conveying the surface-treated component carrier to the bonding apparatus with a second hand; Individually bonding the plurality of surface-treated components to the surface-treated substrate using the bonding apparatus; Removing the substrate to which the plurality of components are bonded from the bonding apparatus with the first hand; Removing the component carrier from which the plurality of components have been removed from the bonding apparatus with the second hand, including: Bonding method.

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