Parts transfer device, parts transfer method and parts feeding device

Abstract

To provide a parts transfer device, a parts transfer method, and a parts feeding device capable of properly handling minute parts in bulk.SOLUTION: A parts transfer device 1 has a parts supply unit 30 that supplies parts D to a parts supply area 30a, a transfer head 10 that picks up parts D supplied to the parts supply area 30a, a transfer head moving mechanism that moves the transfer head 10 in a horizontal plane, and a controlling unit that controls the transfer head moving mechanism and the transfer head 10. The parts supply unit 30 is equipped with a transparent plate 33 located in the parts supply area 30a, spreading means 42 that spreads multiple parts D onto the transparent plate 33, and a parts supply camera 45 that captures images of the upper side of the transparent plate 33 from below. The controlling unit controls the transfer head moving mechanism and the transfer head 10 based on the tip position of the nozzle 11 and the state of the part D on the transparent plate 33, as imaged by the parts supply camera 45.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a component transfer device and a component transfer method for transferring components supplied to a component supply area with a nozzle, and a component supply device for supplying components to the component supply area.

Background Art

[0002] As a method for supplying components of a component supply device, in addition to a method of sequentially supplying components held at equal intervals on a carrier tape, a tray having recesses, etc., there is also known a method of supplying a plurality of components in a scattered state, holding them with a nozzle, and taking them out (see, for example, Patent Documents 1 and 2). Patent Document 1 discloses a component supply method in which a plurality of components supplied in a dispersed manner on a conveyor are imaged from above by a camera, the number, position, and posture of the components are recognized, and the components that can be taken out are taken out by a robot.

[0003] Patent Document 2 has pins for promoting separation of components at the central part, a translucent plate on the downstream side, a supply linear feeder arranged horizontally, a return linear feeder arranged obliquely beside the supply linear feeder, with the downstream side lower than the supply linear feeder and the upstream side higher than the supply linear feeder, an image detection unit arranged below the translucent plate, a leaf spring for supporting the supply linear feeder, a leaf spring for supporting the return linear feeder, a solenoid for applying vibration to the supply linear feeder, and a solenoid for applying vibration to the return linear feeder. By applying vibration with the solenoid, components are circulated and supplied between the supply linear feeder and the return linear feeder, a plurality of components dispersed by the pins are supplied onto the translucent plate, the components on the translucent plate are recognized by the image detection unit, and the components are taken out by giving a command to a robot for taking out components.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005] However, in the prior art including Patent Documents 1 and 2, although large parts with a large allowable range of nozzle misalignment with respect to parts can be supplied and taken out in a scattered state, there is still room for further improvement in appropriately supplying and taking out small parts with a small allowable range of nozzle misalignment in a scattered state and accurately transferring them with a nozzle.

[0006] Therefore, an object of the present invention is to provide a component transfer device, a component transfer method, and a component supply device that can appropriately process small components in a scattered state. [Means for Solving the Problems]

[0007] The component transfer device of the present invention includes a component supply device that supplies components to a component supply area, a transfer head that moves a nozzle up and down and rotates around the axis of the nozzle to pick up the components supplied to the component supply area, a transfer head movement mechanism that moves the transfer head in a horizontal plane, a transfer target holding unit that holds a transfer target to which the components picked up by the nozzle are transferred, and a control device that controls at least the transfer head movement mechanism and the transfer head. The component supply device includes a transparent plate disposed in the component supply area, a scattering means for scattering a plurality of components on the transparent plate, and a component supply camera that images from below to above the transparent plate. The control device controls the head movement mechanism and the transfer head based on the tip position of the nozzle imaged by the component supply camera through the transparent plate and the state of the components on the transparent plate imaged by the component supply camera.

[0008] The component transfer method of the present invention includes a nozzle position recognition step of imaging a nozzle of a transfer head through a transparent plate arranged in a component supply area by a component supply camera and recognizing the tip position of the nozzle, a component scattering step of scattering a plurality of components on the transparent plate, a component state recognition step of imaging the components on the transparent plate by the component supply camera and recognizing the state of the components, a component pickup step of holding and picking up the components by the nozzle based on the tip position of the nozzle recognized in the nozzle position recognition step and the state of the components recognized in the component state recognition step, and a component placement step of placing the components held by the nozzle on a transfer target.

[0009] The component supply device of the present invention is a component supply device that supplies components picked up by a nozzle of a transfer head to a component supply area, and includes a feed rail having a transparent plate in the component supply area, a pair of first leaf springs connected to the upstream and downstream of the feed rail in a state inclined upstream with respect to the feed rail, a return rail arranged adjacent to the feed rail, a pair of second leaf springs connected to the upstream and downstream of the return rail in a state inclined downstream with respect to the return rail, and vibration means for reciprocally vibrating the pair of first leaf springs and the pair of second leaf springs synchronously in the upstream and downstream directions. The feed rail has a feed guide portion downstream of the transparent plate for guiding components moving in the downstream direction to the return rail, and the return rail has a return guide portion for guiding components moving in the upstream direction upstream of the transparent plate of the feed rail.

Advantages of the Invention

[0010] According to the present invention, minute components can be appropriately processed in a scattered state.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0012] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component transfer device and the component supply device. Hereinafter, corresponding elements in all the drawings are denoted by the same reference numerals, and redundant explanations are omitted.

[0013] First, with reference to FIG. 1, the configuration of the main part of the component transfer device 1 will be described. On the upper surface of the base 2 of the component transfer device 1, a component supply transfer mechanism 3, an intermediate camera 4, and a transfer target transfer mechanism 5 are arranged side by side in one direction (hereinafter referred to as the "X-axis direction"). That is, the intermediate camera 4 is arranged between the component supply transfer mechanism 3 and the transfer target transfer mechanism 5.

[0014] The component supply moving mechanism 3 moves a moving table 3a with a component supply device 30 disposed thereon in a direction orthogonal to the X-axis direction (hereinafter referred to as the "Y-axis direction"). By moving the moving table 3a along the Y-axis direction by the component supply moving mechanism 3, the component supply device 30 moves back and forth in the Y-axis direction. The component supply device 30 supplies a plurality of components D to a component supply area 30a (see FIG. 2). The transfer target moving mechanism 5 moves a transfer target holding portion 6 disposed thereon along the Y-axis direction. The transfer target holding portion 6 holds a transfer target T such as a tray, a printed circuit board, or a sheet onto which the component D supplied from the component supply device 30 is transferred. FIG. 1 shows an example in which the transfer target holding portion 6 holds a flat tray as the transfer target T.

[0015] In FIG. 1, on the upper surface of the base 2, a pair of support columns 7 are provided so as to extend upward outside the component supply moving mechanism 3 and the transfer target moving mechanism 5 in the X-axis direction. Between the pair of support columns 7, a beam 8 extending in the X-axis direction is disposed. A transfer head moving mechanism 9, which is a linear drive mechanism, is disposed on the beam 8. A transfer head 10 is attached to the beam 8. The transfer head moving mechanism 9 moves the transfer head 10 along the X-axis direction in a horizontal plane. A plurality of nozzles 11 are disposed below the transfer head 10 (see also FIG. 5). The transfer head 10 raises and lowers each nozzle 11 in the Z-axis direction and rotates it about the Z-axis (axis of the nozzle) as a rotation axis (center). The transfer head 10 raises and lowers and rotates the nozzle 11 to hold and pick up the component D supplied to the component supply area 30a and transfer it to the transfer target T.

[0016] FIG. 1 and FIG. 5 show, as the transfer head 10, a rotary head having a plurality of nozzles 11 that rotate on concentric circles as an example. Note that the transfer head 10 may be a transfer head in which a plurality of nozzles 11 are arranged in one direction. Further, FIG. 1 shows an example of a configuration in which the transfer head 10 moves in the X-axis direction (one axial direction in the horizontal plane) by the transfer head moving mechanism 9, and the component supply device 30 and the transfer target T move in the Y-axis direction by the component supply moving mechanism 3 and the transfer target moving mechanism 5, but the component transfer device 1 is not limited to this configuration. For example, the component transfer device 1 may be an XY robot in which the positions of the component supply device 30 and the transfer target T are fixed with respect to the base 2, and the transfer head moving mechanism 9 moves the transfer head 10 in two axial directions (X-axis direction and Y-axis direction) in the horizontal plane.

[0017] In FIG. 7, the component supply device 30, the component supply moving mechanism 3, the intermediate camera 4, the transfer target moving mechanism 5, the transfer head moving mechanism 9, and the transfer head 10 are controlled by the transfer control unit 22 based on the transfer data 21a stored in the storage unit 21 of the control device 20 included in the component transfer device 1.

[0018] Next, with reference to FIG. 1, the outline of the control by the transfer control unit 22 will be described along the component transfer process of the component D by the transfer head 10. The transfer control unit 22 controls the component supply device 30 to supply a plurality of components D to the component supply area 30a. The transfer control unit 22 controls the transfer head moving mechanism 9 to move the transfer head 10 above the component supply device 30. The transfer control unit 22 controls the transfer head 10 to lower the nozzles 11 in order, vacuum-adsorb the components D supplied to the component supply area 30a, and raise the nozzles 11, thereby picking up the components D on each nozzle 11.

[0019] The transfer control unit 22 controls the transfer head moving mechanism 9 to move the transfer head 10 above the transfer target T. When the transfer head 10 moves from the component supply device 30 above the transfer target T, the transfer control unit 22 controls the intermediate camera 4 to image the component D held by the nozzle 11 that has moved upward from below. The transfer control unit 22 recognizes the position, rotation direction, posture, etc. of the component D held by each nozzle 11 with respect to the nozzle 11 from the captured image.

[0020] In FIG. 1, the transfer control unit 22 controls the transfer head 10 to lower the nozzles 11 in order to transfer the component D to the transfer target T. At this time, the transfer control unit 22 (control device 20) controls the transfer target moving mechanism 5, the transfer head moving mechanism 9, and the transfer head 10 based on the transfer data 21a to transfer the component D to the transfer target T. For example, when the transfer target T is a tray or a sheet, the transfer control unit 22 transfers the component D so that the component D is aligned at equal intervals based on the transfer interval of the component D included in the transfer data 21a. When the transfer target T is a printed circuit board, the transfer control unit 22 transfers the component D to the transfer position based on the transfer position set on the printed circuit board included in the transfer data 21a.

[0021] When the transfer control unit 22 transfers the component D to the transfer target T, it corrects the position and rotation direction of the nozzle 11 with respect to the transfer target T based on the position and rotation direction of the component D with respect to the nozzle 11 recognized from the captured image of the intermediate camera 4. In this way, the component transfer device 1 is provided with the intermediate camera 4 that images the component D held by the nozzle 11 from below. Then, the control device 20 (transfer control unit 22) transfers the component D held by the nozzle 11 to the transfer target T held by the transfer target holding unit 6 based on the state (position, rotation direction) of the component D held by the nozzle 11 imaged by the intermediate camera 4.

[0022] Next, with reference to FIGS. 2 to 5, the configuration of the main part of the component supply device 30 will be described. FIG. 4(b) is a partial cross-sectional view taken along A-A including the component reservoir 31f in FIG. 4(a). FIG. 5 is a partial cross-sectional view taken along B-B in FIG. 4(a). The component supply device 30 includes an adjacent feed rail 31 and a return rail 32 that extend in the Y-axis direction in a state of being installed on the component transfer device 1. A transparent plate 33 is disposed on a part of the floor surface 31a of the feed rail 31. The upper surface of the transparent plate 33 is substantially at the same height as the floor surface 31a. An imaging opening 31b (see FIG. 5) that penetrates vertically is formed in the feed rail 31 at a position where the transparent plate 33 is disposed. The region of the transparent plate 33 that overlaps the imaging opening 31b when viewed from above is the component supply region 30a (see also FIG. 6(a)). Thus, the transparent plate 33 is disposed on the floor surface 31a of the feed rail 31 in the component supply region 30a.

[0023] In FIGS. 3 and 4, an outer wall 31c that extends upward from the floor surface 31a is formed on the left side in the X-axis direction of the feed rail 31. Further, on the right side in the X-axis direction of the feed rail 31, an inner wall 31d that extends upward from the floor surface 31a and has notches near the component reservoir 31f on the front side in the Y-axis direction (upstream of the component supply device 30) and near the component discharge portion 31g on the rear side (downstream of the component supply device 30) is formed. The transparent plate 33 is disposed at a position sandwiched between the outer wall 31c and the inner wall 31d on the floor surface 31a. In this embodiment, a part of the transparent plate 33 constitutes a part of the outer wall 31c and the inner wall 31d. A feed downstream wall 31e that extends upward from the floor surface 31a and obliquely extends in the downstream direction from the outer wall 31c to reach the notch downstream of the inner wall 31d is formed downstream of the feed rail 31.

[0024] On the right side of the return rail 32, an outer wall 32b extending upward from the floor surface 32a is formed. Further downstream of the return rail 32, a return downstream wall 32c extending upward from the floor surface 32a and reaching from the outer wall 32b to the stepped portion 32e of the return rail 32 is formed. Further upstream of the return rail 32, an upstream wall 32d extending upward from the floor surface 32a and obliquely running upstream from the outer wall 32b to reach the stepped portion 32e is formed. The stepped portion 32e is formed by notching the return rail 32 so as to be lower than the floor surface 32a.

[0025] In Fig. 4(b), the feed rail 31 is attached to the component supply device 30 in a state where the lower surface on the right side of the feed rail 31 is placed on the stepped portion 32e formed on the left side of the return rail 32. In this state, the floor surface 31a of the feed rail 31 and the floor surface 32a of the return rail 32 are substantially at the same height, and the gap between the right side surface of the feed rail 31 and the left side surface of the return rail 32 is extremely small. Therefore, even minute components can smoothly move from the return rail 32 to the component reservoir 31f of the feed rail 31 through the notch. Similarly, even minute components can smoothly move from the component discharge portion 31g of the feed rail 31 to the return rail 32 through the notch. The return rail 32 reciprocates relatively along the right side surface of the feed rail 31.

[0026] In this way, since the heights (floor surfaces 31a, 32a) on which the components D of the feed rail 31 and the return rail 32 are placed are substantially the same and the gap between the feed rail 31 and the return rail 32 is also extremely small, as will be described later, minute components with a chip size smaller than 1 mm can be appropriately circulated and supplied (processed) in a loose state.

[0027] In FIGS. 2 to 5, a pair of first leaf springs 34 are connected upstream and downstream of the feed rail 31 in a state inclined upstream with respect to the feed rail 31. A pair of second leaf springs 35 are connected upstream and downstream of the return rail 32 in a state inclined downstream with respect to the return rail 32. On the upper part of the pedestal 36 of the component supply device 30 fixed on the moving table 3a of the component supply moving mechanism 3, a first piezoelectric element 37 extends upward and is connected upstream, and a second piezoelectric element 38 extends upward and is connected downstream.

[0028] To the upper part of the first piezoelectric element 37, the lower part of the upstream (one) first leaf spring 34 of the pair of first leaf springs 34 and the lower part of the upstream (one) second leaf spring 35 of the pair of second leaf springs 35 are connected. To the upper part of the second piezoelectric element 38, the lower part of the downstream (the other) first leaf spring 34 of the pair of first leaf springs 34 and the lower part of the downstream (the other) second leaf spring 35 of the pair of second leaf springs 35 are connected.

[0029] In FIG. 2, the pedestal 36, the first piezoelectric element 37 and the second piezoelectric element 38, the first piezoelectric element 37 and the second piezoelectric element 38 and the first leaf springs 34 and the second leaf springs 35, the first leaf springs 34 and the second leaf springs 35 and the feed rail 31 and the return rail 32 are fixed by screws S.

[0030] In FIG. 7, a drive voltage is supplied from a drive driver 39 to the first piezoelectric element 37 and the second piezoelectric element 38. When a drive voltage is supplied from the drive driver 39, the first piezoelectric element 37 and the second piezoelectric element 38 reciprocally vibrate in the upstream and downstream directions (arrow a in FIG. 5). When the first piezoelectric element 37 and the second piezoelectric element 38 vibrate, the pair of first leaf springs 34 and the pair of second leaf springs 35 reciprocally vibrate in the upstream and downstream directions.

[0031] The first piezoelectric element 37 and the drive driver 39 constitute a first vibration means 40 that reciprocally vibrates one first leaf spring 34 and one second leaf spring 35 in the upstream and downstream directions. Further, the second piezoelectric element 38 and the drive driver 39 constitute a second vibration means 41 that reciprocally vibrates the other first leaf spring 34 and the other second leaf spring 35 in the upstream and downstream directions. In the present embodiment, the drive voltage is supplied from the drive driver 39 so that the first vibration means 40 and the second vibration means 41 vibrate the pair of first leaf springs 34 and the pair of second leaf springs 35 in synchronization in the same direction.

[0032] Next, with reference to FIG. 6, the effects of the vibrations generated by the first vibration means 40 (first piezoelectric element 37) and the second vibration means 41 (second piezoelectric element 38) will be described. Here, the feed rail 31 connected to the first piezoelectric element 37 and the second piezoelectric element 38 via a pair of first leaf springs 34 will be described as an example.

[0033] In FIG. 6(a), on the floor surface 31a of the feed rail 31, a plurality of components D are placed upstream of the transparent plate 33 provided in the component supply region 30a. Also, the first piezoelectric element 37 and the second piezoelectric element 38 are vibrating upstream (arrow b) due to the drive voltage supplied from the drive driver 39. In this state, the feed rail 31 connected via the first leaf spring 34 inclined upstream is inclined such that the downstream side is higher than the upstream side.

[0034] In FIG. 6(b), next, when the first piezoelectric element 37 and the second piezoelectric element 38 vibrate downstream (arrow c), the feed rail 31 is inclined such that the upstream side is higher than the downstream side. In the process in which the first piezoelectric element 37 and the second piezoelectric element 38 vibrate from the upstream side to the downstream side (the process of shifting from arrow b to arrow c), the upstream side of the feed rail 31 jumps up due to the elastic force of the first leaf spring 34, and the plurality of components D on the floor surface 31a jump up from the floor surface 31a and move downstream (arrow d).

[0035] FIG. 6(c) shows a state in which the first piezoelectric element 37 and the second piezoelectric element 38 vibrate upstream (arrow e), the first piezoelectric element 37 and the second piezoelectric element 38 become vertical, and the feed rail 31 becomes horizontal. A plurality of components D bounced up from the floor surface 31a have moved downstream from their original positions and are stationary on the floor surface 31a or the transparent plate 33. Thereafter, in the process in which the first piezoelectric element 37 and the second piezoelectric element 38 vibrate upstream and the downstream side of the feed rail 31 inclines so as to be higher than the upstream side (the state of FIG. 6(a)), the plurality of components D on the floor surface 31a or the transparent plate 33 do not bounce up and remain stationary without moving.

[0036] As described above, the component supply device 30 causes the first vibration means 40 and the second vibration means 41 to vibrate the pair of first leaf springs 34, thereby causing the component D on the floor surface 31a of the feed rail 31 to bounce up from the floor surface 31a and move downstream. Thereby, a plurality of minute components D upstream of the transparent plate 33 are scattered so as to spread on the transparent plate 33. That is, the first piezoelectric element 37, the second piezoelectric element 38, the pair of first leaf springs 34, and the feed rail 31 constitute a scattering means 42 (FIG. 5) for causing a plurality of components D on the floor surface 31a to bounce up from the floor surface 31a and scatter onto the transparent plate 33 from upstream.

[0037] In FIG. 4(a) as well, the first vibration means 40 and the second vibration means 41 vibrate the pair of second leaf springs 35, whereby the component D on the floor surface 32a of the return rail 32 is bounced up from the floor surface 32a and moves upstream (arrow f). On the floor surface 32a of the return rail 32, the component D that has moved upstream and reached the upstream wall 32d rides onto the upstream of the feed rail 31 along the upstream wall 32d (arrow g). That is, the upstream wall 32d of the return rail 32 has a function as a return guide portion that guides the component D moving in the upstream direction to the component reservoir 31f upstream of the transparent plate 33 of the feed rail 31.

[0038] On the floor surface 31a of the feed rail 31, the component D that has moved downstream and reached the feed downstream wall 31e rides onto the downstream side of the return rail 32 along the feed downstream wall 31e (arrow h). That is, the feed downstream wall 31e of the feed rail 31 has a function as a feed guide portion that guides the component D moving in the downstream direction at the component discharge portion 31g downstream of the transparent plate 33 to the return rail 32. By the return guide portion and the feed guide portion, the component D moves in a circulation along the feed rail 31 and the return rail 32.

[0039] In this way, the return rail 32 that can reciprocate along the side surface of the feed rail 31, the pair of second leaf springs 35 connected to the upstream and downstream of the return rail 32 in a state inclined downstream with respect to the return rail 32, and the first piezoelectric element 37 and the second piezoelectric element 38 that reciprocally vibrate the pair of second leaf springs 35 in the upstream and downstream directions constitute a recovery means 43 (FIG. 3) for returning the component D on the floor surface 32a of the return rail 32 from downstream to upstream.

[0040] In FIGS. 4 and 5, a component supply region 31h is provided upstream of the component accumulation 31f of the feed rail 31, where the component D is supplied from a component supply device 44 arranged upstream of the feed rail 31. The component supply device 44 is controlled by the control device 20 (see FIG. 7). When the component D is taken out from the component supply device 30 and the number of components D in the component supply device 30 becomes less than a predetermined number, the control device 20 operates the component supply device 44 to supply the component D to the component supply region 31h (arrow i in FIG. 5).

[0041] Note that in the above description, the component supply device 30 is described as having two vibration means (the first vibration means 40 and the second vibration means 41) as vibration means for reciprocally vibrating a pair of first leaf springs 34 connected to the feed rail 31 and a pair of second leaf springs 35 connected to the return rail 32 in synchronization in the upstream and downstream directions. However, the component supply device 30 is not limited to this configuration. For example, when sufficient vibration force can be applied by one vibration means, it may be configured to include only the first vibration means 40 as an active vibration means and use a member that passively vibrates the pair of first leaf springs 34 and the pair of second leaf springs 35 in synchronization with the vibration applied by the first vibration means 40 instead of the second vibration means 41.

[0042] Further, instead of the first vibration means 40 and the second vibration means 41 that simultaneously vibrate the pair of first leaf springs 34 and the pair of second leaf springs 35, it may be configured to separately include a feed vibration means that reciprocally vibrates the pair of first leaf springs 34 and a return vibration means that reciprocally vibrates the pair of second leaf springs 35.

[0043] Moreover, in the component supply device 30 of the present embodiment, since the feed rail 31 and the return rail 32 are connected and supported only by the pair of first leaf springs 34 and the pair of second leaf springs 35, the vibration applied from the vibration means (the first vibration means 40 and the second vibration means 41) can be efficiently transmitted to the feed rail 31 and the return rail 32.

[0044] In FIGS. 2 to 5, above the pedestal 36 of the component supply device 30, a component supply camera 45 is disposed which faces upward the imaging axis 45a (FIG. 5) and images above the transparent plate 33 through an imaging opening 31b formed in the feed rail 31. Between the component supply camera 45 and the imaging opening 31b, an illumination unit 46 having a plurality of LED chips for illuminating the transparent plate 33 obliquely downward is disposed. Further, between the illumination unit 46 and the imaging opening 31b, a diffusion plate 47 is disposed which scatters the highly directional light irradiated from the illumination unit 46 into spread light and uniformly irradiates light onto components D above the transparent plate 33, nozzles 11 of the transfer head 10, and the like. The component supply camera 45 and the illumination unit 46 are controlled by the control device 20 (see FIG. 7).

[0045] Next, with reference to FIG. 7, the configuration of the control system of the component transfer device 1 will be described. Connected to the control device 20 included in the component transfer device 1 are a component supply device 30, a component supply moving mechanism 3, an intermediate camera 4, a transfer target moving mechanism 5, a transfer head moving mechanism 9, a transfer head 10, a component replenishing device 44, and in addition, a touch panel 12. The touch panel 12 displays various control screens and input screens for various information and parameters on its display unit, and an operator uses operation buttons and the like displayed on the display unit to control the component transfer device 1 and input data.

[0046] The control device 20 includes a storage unit 21, a transfer control unit 22, and a nozzle correction processing unit 23. The storage unit 21 is a storage device and stores transfer data 21a, vibration condition data 21b, nozzle correction data 21c, and the like. The transfer data 21a stores the size (length, width, height), weight, comparison image data for determining the front and back surfaces of the component D supplied from the component supply device 30, the size of the transfer target T, transfer conditions (transfer interval, mounting position), and the like.

[0047] In the vibration condition data 21b, conditions (such as drive voltage and frequency) for the drive driver 39 of the component supply device 30 to drive the first piezoelectric element 37 and the second piezoelectric element 38 are stored according to the type of the supplied component D. The drive voltage and frequency are set in advance to appropriate values according to the weights of the feed rail 31 and the return rail 32, the spring coefficients and inclinations of the first leaf spring 34 and the second leaf spring 35, the size and weight of the supplied component D, and the like.

[0048] In FIG. 7, the nozzle correction processing unit 23 executes a nozzle correction process for acquiring nozzle correction data 21c for correcting the tip position of each nozzle 11 of the transfer head 10 when the nozzle 11 holds the component D in the component supply area 30a. Specifically, the nozzle correction processing unit 23 controls the transfer head movement mechanism 9 and the transfer head 10 to move the tip position of the nozzle 11 to the center of the imaging axis 45a of the component supply camera 45, and causes the component supply camera 45 to image the lower surface of the nozzle 11 while illuminating with the illumination unit 46. Next, the nozzle correction processing unit 23 performs image recognition processing on the captured image, calculates the deviation amount of the tip position of the nozzle 11 from the imaging axis 45a of the nozzle 11, and stores it in the storage unit 21 as the nozzle correction data 21c.

[0049] Here, with reference to FIG. 8, an example of a captured image 50 in which the nozzle correction processing unit 23 images the lower surface of the nozzle 11 with the component supply camera 45 will be described. In the captured image 50, a crosshair 51 indicating the center of the captured image 50 is displayed. The position where the crosshair 51 intersects is the center 50c of the captured image 50, which coincides with the imaging axis 45a of the component supply camera 45. In the captured image 50, the lower surface of the nozzle 11 is darkly imaged. The nozzle correction processing unit 23 performs image recognition processing on the captured image 50, extracts the center 11a of the lower surface of the nozzle 11, and calculates the deviation amount ΔX in the X-axis direction and the deviation amount ΔY in the Y-axis direction from the center 50c of the captured image 50. Then, the nozzle correction processing unit 23 associates the information for identifying the nozzle 11 and stores the deviation amount (ΔX, ΔY) of the tip position of the nozzle 11 as the nozzle correction data 21c.

[0050] Thus, the deviation amounts (ΔX, ΔY) of the tip position of the nozzle 11 represent the position of the nozzle 11 imaged by the component supply camera 45 that images from below the transparent plate 33 to above through the transparent plate 33.

[0051] In FIG. 7, the transfer control unit 22 causes the component transfer head 10 to hold and pick up the component D supplied by the component supply device 30 to the component supply area 30a with the nozzle 11 based on the transfer data 21a, the vibration condition data 21b, and the nozzle correction data 21c, and executes a component transfer process for transferring it to the transfer target T. Specifically, the transfer control unit 22 controls the drive driver 39 of the component supply device 30 based on the vibration condition data 21b to vibrate the first piezoelectric element 37 and the second piezoelectric element 38, and scatter a plurality of components D on the transparent plate 33 disposed in the component supply area 30a (see FIG. 9(a)).

[0052] Also, the transfer control unit 22 causes the component supply camera 45 to image the component D on the transparent plate 33 from below while illuminating with the illumination unit 46. The transfer control unit 22 performs image recognition processing on the captured image of the component D on the transparent plate 33, and extracts the component D whose surface held by the nozzle 11 faces upward and does not overlap with other components D as the component D to be taken out. Further, the transfer control unit 22 extracts the position and rotation direction of the component D to be taken out on the transparent plate 33.

[0053] In FIG. 7, next, the transfer control unit 22 controls the transfer head movement mechanism 9 and the transfer head 10 based on the position and rotation direction of the extracted component D to be taken out, and the deviation amounts (ΔX, ΔY) of the tip position of the nozzle 11 to be picked up, and corrects the position and rotation direction of the nozzle 11 so that the position and rotation direction of the component D after being held by the nozzle 11 become a predetermined position and direction, and holds the component D.

[0054] The transfer control unit 22 moves the transfer head 10 holding the component D to above the intermediate camera 4, and causes the intermediate camera 4 to image the component D held by each nozzle 11 of the transfer head 10. Next, the transfer control unit 22 performs image recognition processing on the captured image to recognize the position and rotation direction of the component D held by each nozzle 11 with respect to the nozzle 11. Based on the transfer data 21a and the recognized position and rotation direction with respect to the nozzle 11, the transfer control unit 22 controls the transfer head movement mechanism 9 and the transfer head 10 to transfer the component D held by the nozzle 11 to the transfer target T (such as a tray, a printed circuit board, a sheet, etc.).

[0055] In this way, the transfer control unit 22 of the control device 20 controls the transfer head movement mechanism 9 and the transfer head 10 based on the tip position of the nozzle 11 (the deviation amount (ΔX, ΔY) of the tip position) imaged by the component supply camera 45 through the transparent plate 33 and the state (position, rotation direction, etc.) of the component D on the transparent plate 33 imaged by the component supply camera 45. Then, the transfer control unit 22 moves the transfer head 10 based on the state of the component D imaged by the component supply camera 45, rotates the nozzle 11 on the transfer head 10 to pick up the component D. In this way, based on the tip position of the nozzle 11 and the state of the component D imaged by the same camera (component supply camera 45) through the transparent plate 33, the position and rotation direction of the nozzle 11 are corrected to hold the component D on the transparent plate 33, so that the minute component D can be appropriately picked up (processed) in a scattered state.

[0056] Here, referring to FIG. 9(b), an example of a captured image 52 in which the transfer control unit 22 causes the component supply camera 45 to image a plurality of components D supplied on the transparent plate 33 will be described. The transfer control unit 22 performs image recognition processing on the captured image based on the comparison image data included in the transfer data 21a to extract the component D to be taken out. In this example, four components D indicated by circles C, whose surfaces held by the nozzles 11 face upward and do not overlap with other components D, are extracted as the components D to be taken out. Further, the transfer control unit 22 extracts the positions and rotation directions of these four components D.

[0057] Next, along the flow of FIG. 10, the component transfer method in the component transfer device 1 will be described with reference to the drawings. First, the nozzle correction processing unit 23 causes the nozzle 11 of the transfer head 10 to be imaged through the transparent plate 33 arranged in the component supply area 30a of the component supply device 30 by the component supply camera 45 (ST1: nozzle imaging step), and recognizes the tip position of the nozzle 11 (the deviation amount of the tip position (ΔX, ΔY)) by image recognition processing (ST2: nozzle position recognition step) (FIG. 8). Next, the nozzle correction processing unit 23 stores the recognized tip position of the nozzle 11 (the deviation amount of the tip position (ΔX, ΔY)) in the storage unit 21 as nozzle correction data 21c (ST3: nozzle correction value storage step).

[0058] Next, the transfer control unit 22 controls the drive driver 39 based on the vibration condition data 21b to scatter a plurality of components D from the component reservoir 31f onto the transparent plate 33 (ST4: component scattering step) (FIG. 9(a)). Next, the transfer control unit 22 causes the component supply camera 45 to image the component D on the transparent plate 33, and recognizes the state of the component D from the captured image (ST5: component state recognition step) (see FIG. 9(b)).

[0059] In FIG. 10, when there is no component D to be taken out in the component supply area 30a (No in ST6), the component scattering step (ST4) is executed again. When there is a component D to be taken out in the component supply area 30a (Yes in ST6), the transfer control unit 22 holds and picks up the component D with the nozzle 11 based on the tip position of the nozzle 11 (the deviation amount of the tip position (ΔX, ΔY)) recognized in the nozzle position recognition step (ST2) and the state of the component D (position, rotation direction) recognized in the component state recognition step (ST5) (ST7: component pickup step).

[0060] Next, until all the nozzles 11 of the transfer head 10 hold the component D (No in ST8), the process returns to (ST6), and the component pickup process (ST7) is repeatedly executed. When all the nozzles 11 of the transfer head 10 hold the component D (Yes in ST8), the transfer control unit 22 causes the intermediate camera 4 to image the component D held by the nozzle 11, and recognizes the position and rotation angle of the component D with respect to the nozzle 11 from the captured image (ST9: component position recognition process). Next, the transfer control unit 22 places the component D held by the nozzle 11 on the transfer target T based on the transfer data 21a (ST10: component placement process).

[0061] In FIG. 10, when not all the components D have been transferred to the transfer target T (No in ST11), the component spraying process (ST4) to the component placement process (ST10) are repeatedly executed. When all the components D have been transferred to the transfer target T (Yes in ST11), the transfer of the component D to the transfer target T is completed.

[0062] As described above, the component transfer device 1 of the present embodiment includes a component supply device 30 that supplies the component D to the component supply area 30a, a transfer head 10 that moves the nozzle 11 up and down and rotates about the axis of the nozzle 11 to pick up the component D supplied to the component supply area 30a, a transfer head movement mechanism 9 that moves the transfer head 10 in the horizontal plane, a transfer target holding unit 6 that holds the transfer target T to which the component D picked up by the nozzle 11 is transferred, and a control device 20 that controls at least the transfer head movement mechanism 9 and the transfer head 10.

[0063] And the component supply device 30 includes a transparent plate 33 disposed in a component supply area 30a, a scattering means 42 (a first vibration means 40, a second vibration means 41, a pair of first leaf springs 34, a feed rail 31) for scattering a plurality of components D onto the transparent plate 33, and a component supply camera 45 for imaging from below to above the transparent plate 33. Further, the control device 20 controls the transfer head movement mechanism 9 and the transfer head 10 based on the tip position of the nozzle 11 (the deviation amount (ΔX, ΔY) of the tip position) imaged by the component supply camera 45 through the transparent plate 33 and the state of the component D on the transparent plate 33 imaged by the component supply camera 45. Thereby, minute components D can be appropriately processed (supplied, picked up, transferred) in a scattered state.

Industrial Applicability

[0064] The component transfer device, the component transfer method, and the component supply device of the present invention have the effect of being able to appropriately process minute components in a scattered state, and are useful in the field of mounting components on a substrate.

Explanation of Reference Numerals

[0065] 1 Component transfer device 4 Intermediate camera 6 Transfer target holding part 9 Transfer head movement mechanism 10 Transfer head 11 Nozzle 30 Component supply device 30a Component supply area 31 Feed rail 31e Feed downstream wall (feed guide part) 32 Return rail 32d Upstream wall (return guide part) 33 Transparent plate 34 First leaf spring 35 Second leaf spring 40 First vibration means (vibration means) 41 Second vibration means (vibration means) 42 Scattering means 45 Component supply camera D Component T Transfer target

Claims

1. A component supply device that supplies components to a component supply area, A transfer head that moves up and down a nozzle and rotates about the axis of the nozzle to pick up a component supplied to the component supply area, A transfer head moving mechanism that moves the transfer head in a horizontal plane, A transfer target holding unit that holds a transfer target onto which the component picked up by the nozzle is transferred, Comprising at least the transfer head moving mechanism and a control device that controls the transfer head, The component supply device, A transparent plate disposed in the component supply area, Spraying means for spraying a plurality of components onto the transparent plate, A component supply camera that images from below to above the transparent plate, The control device, A component transfer device that controls the head moving mechanism and the transfer head based on the tip position of the nozzle imaged by the component supply camera through the transparent plate and the state of the component on the transparent plate imaged by the component supply camera.

2. Further comprising an intermediate camera disposed between the component supply device and the transfer target holding unit, and imaging the component held by the nozzle from below, The control device, A component transfer device according to claim 1, wherein the component held by the nozzle is transferred to the transfer target held by the transfer target holding unit based on the state of the component held by the nozzle imaged by the intermediate camera.

3. A nozzle position recognition step of imaging a nozzle of a transfer head through a transparent plate disposed in a component supply area by a component supply camera and recognizing the tip position of the nozzle, A component spraying step of spraying a plurality of components onto the transparent plate, A component state recognition step of imaging the components on the transparent plate by the component supply camera and recognizing the state of the components, A component picking-up step of causing the nozzle to hold and pick up the component based on the tip position of the nozzle recognized in the nozzle position recognition step and the state of the component recognized in the component state recognition step, A component placing step of placing the component held by the nozzle on a transfer target, and a component transfer method including the same.

4. A component supply device that supplies components picked up by a nozzle of a transfer head to a component supply area, A feed rail having a transparent plate in the component supply area, A pair of first leaf springs connected to the upstream and downstream of the feed rail in a state inclined upstream with respect to the feed rail, A return rail disposed adjacent to the feed rail, A pair of second leaf springs connected to the upstream and downstream of the return rail in a state inclined downstream with respect to the return rail, Vibration means for reciprocally vibrating the pair of first leaf springs and the pair of second leaf springs synchronously in the upstream and downstream directions, The feed rail has a feed guide portion downstream of the transparent plate for guiding components moving in the downstream direction to the return rail, The return rail has a return guide portion for guiding components moving in the upstream direction upstream of the transparent plate of the feed rail, and a component supply device.

5. The component supply device according to claim 4, further comprising a component supply camera that images from below to above the transparent plate.

Images