Display device and method for manufacturing display device

Abstract

To provide a display device.SOLUTION: A display device comprises: a plurality of display modules; and a frame for supporting the plurality of display modules, in which the plurality of display modules are arranged in the frame in the form of an M*N matrix. The frame includes a frame panel having a first side and a second side opposite the first side. The frame panel includes: an insertion portion which penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, and in which the size of the first opening is greater than the size of the second opening; and a stud provided in the insertion portion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a display device that combines modules with light-emitting elements mounted on a substrate to display images, and a method for manufacturing the display device.

Background Art

[0002] A display device is a type of output device that visually displays data information such as characters and graphics, and images.

[0003] Generally, as display devices, a liquid crystal panel (Liquidcrystal panel) that requires a backlight, and an OLED (Organic Light-Emitting Diode) panel made of a film of an organic compound that emits light by itself in response to an electric current have been mainly used. However, the liquid crystal panel has problems such as a slow response time, high power consumption, inability to emit light by itself, and difficulty in miniaturization because it requires a backlight. In addition, since the OLED panel emits light by itself and does not require a backlight, it can be made thin, but if the same screen is displayed for a long time, it is vulnerable to the burn-in (deterioration) phenomenon in which a specific part of the previous screen remains as it is even when the sub-pixels reach the end of their life and the screen changes.

[0004] Therefore, as a new panel to replace these, a micro light-emitting diode (micro LED or μLED) display panel that mounts inorganic light-emitting elements on a substrate and uses the inorganic light-emitting elements themselves as pixels has been studied.

[0005] A micro light-emitting diode display panel (hereinafter, micro LED panel) is one of flat panel display panels, and is composed of a plurality of inorganic light-emitting diodes each having a size of 100 μm or less.

[0006] Although such an LED panel is also a self-luminous element, since it is an inorganic light-emitting element, the burn-in phenomenon of an OLED does not occur, and it is excellent in brightness, resolution, power consumption, and durability.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] Compared with a liquid crystal display (LCD) panel that requires a backlight, a micro LED display panel provides better contrast, response time, and energy efficiency. Both organic light-emitting diodes (OLEDs) and micro LEDs, which are inorganic light-emitting elements, are energy-efficient, but micro LEDs are brighter, have higher luminous efficiency, and longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, it is possible to manufacture a display module for each substrate unit, and it is easy to manufacture with various resolutions and screen sizes according to consumers' orders.

MEANS FOR SOLVING THE PROBLEMS

[0009] A display device according to the idea of the present invention includes a plurality of display modules and a frame that supports the plurality of display modules. The plurality of display modules are arranged in an M*N matrix form on the frame. The frame includes a frame panel having a first side and a second side opposite to the first side. The frame panel includes a first opening formed in the first side and a second opening formed in the second side that penetrate the frame panel, and an insertion portion in which the size of the first opening is larger than the size of the second opening, and a stud provided in the insertion portion.

[0010] The insertion portion may be provided such that the first opening and the second opening form a step.

[0011] The insertion portion may be provided in a tapered shape from the first side to the second side.

[0012] The stud may include a coupling part having an opening facing the second opening, and the coupling part may include a thread formed on an inner circumferential surface.

[0013] The display device may further include a bracket detachably coupled to the stud through the second opening, and the bracket may include at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0014] The frame may further include a reinforcing member attached to the first side of the frame panel and provided to cover the first opening.

[0015] The plurality of display modules may be attached to the reinforcing member.

[0016] The frame panel may further include a first metal layer forming the first side of the frame panel, a second metal layer forming the second side of the frame panel, and a resin layer disposed between the first metal layer and the second metal layer.

[0017] The size of a part of the insertion part formed in the resin layer may be provided to be the same as the size of another part of the insertion part formed in the first metal layer.

[0018] Each of the surface formed on the first side and the surface formed on the second side may be flat.

[0019] In another aspect, a method for manufacturing a display device according to the idea of the present invention provides a frame panel having a first side and a second side opposite to the first side, and as an insertion portion penetrating the frame panel, includes a first opening formed in the first side and a second opening formed in the second side, and forms an insertion portion in which the size of the first opening is larger than the size of the second opening, inserts a stud into the insertion portion through the first opening, and detachably couples a bracket to the stud through the second opening.

[0020] Forming the insertion portion may include forming the insertion portion such that the first opening and the second opening are stepped.

[0021] Forming the insertion portion may include forming the insertion portion in a tapered shape from the first side to the second side.

[0022] The stud includes a coupling portion having an opening facing the second opening, and the coupling portion may include a thread formed on an inner circumferential surface of the coupling portion.

[0023] After inserting the stud into the insertion portion, the method for manufacturing the display device may attach a reinforcing member to the first side of the frame panel.

[0024] After attaching the reinforcing member to the first side of the frame panel, the method for manufacturing the display device may form a module opening in the frame panel and the reinforcing member.

[0025] After forming the module opening, the method for manufacturing the display device may attach a plurality of display modules to the reinforcing member.

[0026] The bracket may include at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0027] Forming the insertion part may include forming the insertion part from the first side using at least one of a shaping device, a water jet, and a laser.

[0028] Each of the surface formed on the first side and the surface formed on the second side may be flat.

Advantages of the Invention

[0029] According to various embodiments, the display device can improve the pulling force or torque resistance of the frame for a plurality of display modules.

[0030] According to various embodiments, since the surface formed on the first side of the frame panel is flat without protruding portions, a flat surface for tiling a plurality of display modules attached to the front surface of the frame can be secured.

Brief Description of the Drawings

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Figure 16

Best Mode for Carrying Out the Invention

[0047] Additional aspects of the present disclosure are described in part in the following description, are in part apparent from the description, or may be learned by practice of the present disclosure.

[0048] The embodiments described herein are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention. Therefore, it should be understood that various equivalents or modifications that can replace these at the time of this application are also included within the scope of the present invention.

[0049] In the description, the singular forms used may include plural forms unless the context clearly dictates otherwise. The shapes and sizes of elements in the drawings may be exaggerated for clarity.

[0050] In this specification, terms such as "comprising" or "having" are intended to refer to the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0051] Also, in this specification, the meaning of "identical" includes those that are similar in attributes to each other or similar within a certain range. Also, identical means "substantially identical". The meaning of substantially identical is that numerical values within the range of differences that do not have a meaning with respect to the numerical values or reference numerical values within the error range in manufacturing are included within the range of "identical".

[0052] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0053] FIG. 1 shows a display device according to an embodiment of the present invention. FIG. 2 shows an exploded view of the main configuration of the display device shown in FIG. 1. FIG. 3 shows an enlarged cross-section of a partial configuration of one display module of the display device shown in FIG. 1. FIG. 4 shows the rear surface of one display module of the display device shown in FIG. 1.

[0054] A plurality of inorganic light-emitting elements 50 shown in the drawings and a partial configuration of the display device 1 are configurations in micro units having a size of several μm to several hundred μm. For convenience of explanation, the scale of a partial configuration (a plurality of inorganic light-emitting elements 50, black matrix 48, etc.) is exaggeratedly shown.

[0055] The display device 1 is a device for displaying information, materials, data, etc. in characters, graphics, graphs, videos, etc., and a TV, PC, mobile device, or digital signage, etc. can be implemented by the display device 1.

[0056] According to an embodiment of the present invention, as shown in FIGS. 1 and 2, the display device 1 may include a display panel 20 for displaying an image, a power supply device (not shown) for supplying power to the display panel 20, a main board 25 for controlling the overall operation of the display panel 20, a frame 100 for supporting the display panel 20, and a rear cover 10 for covering the rear surface of the frame 100.

[0057] The display panel 20 may include a plurality of display modules 30A-30w, a driving board (not shown) for driving each display module 30A-30w, and a TOCN board (Timing controller board) for generating a timing signal necessary for controlling each display module 30A-30w.

[0058] The rear cover 10 can support the display panel 20. The rear cover 10 can be installed on the floor through a stand (not shown) or on the wall through a hanger (not shown) or the like.

[0059] The plurality of display modules 30A - 30w can be arranged vertically, horizontally, and adjacent to each other. The plurality of display modules 30A - 30w can be arranged in an M*N matrix form. In this embodiment, 16 display modules 30A - 30w are provided and arranged in a 7*7 matrix form, but there is no limitation on the number and arrangement method of the plurality of display modules 30A - 30w.

[0060] The plurality of display modules 30A - 30w can be installed on the frame 100. The plurality of display modules 30A - 30w can be installed on the frame 100 through various known methods such as magnetic force using magnets, mechanical clamping structures, or adhesion. A rear cover 10 is coupled to the rear of the frame 100, and the rear cover 10 can form the rear appearance of the display device 1.

[0061] The rear cover 10 can include a metallic material. Thereby, the heat generated from the plurality of display modules 30A - 30w and the frame 100 can be easily conducted to the rear cover 10 to increase the heat dissipation efficiency of the display device 1.

[0062] Thus, the display device 1 according to the embodiment of the present invention can embody a large screen by tiling a plurality of display modules 30A - 30w.

[0063] Unlike the embodiments of the present invention, in a plurality of display modules 30A - 30w, each single display module can be applied to a display device. That is, the display modules 30A - 30w can be installed and applied in a wearable device, a portable device, a handheld device, and various electronic products and electrical equipment that require a display, in a single unit. Like the embodiments of the present invention, they can be applied to display devices such as a monitor for a personal computer, a high - resolution TV, signage, and an electronic display board through a plurality of assembled arrangements in a matrix type.

[0064] The plurality of display modules 30A - 30w can have the same configuration as each other. Therefore, any description of one of the display modules described below can be equally applied to all other display modules.

[0065] Taking the first display module 30A among the plurality of display modules 30A - 30w as an example, the first display module 30A can be formed in a quadrangle type. The first display module 30A can be provided in a rectangle type or a square type.

[0066] Therefore, the first display module 30A can include edges 31, 32, 33, 34 formed in the up, down, left, and right directions with respect to the first direction X which is the front.

[0067] As shown in FIG. 3, the plurality of display modules 30A - 30w can each include a substrate 40 and a plurality of inorganic light - emitting elements 50 mounted on the substrate 40. The plurality of inorganic light - emitting elements 50 can be mounted on the mounting surface 41 of the substrate 40 facing the first direction X. In FIG. 3, for the convenience of explanation, the thickness of the substrate 40 in the first direction X is exaggerated and shown thick.

[0068] The substrate 40 can be formed in a quadrangle shape. As described above, the plurality of display modules 30A - 30w can each be provided in a quadrangle shape, and the substrate 40 can be formed in a quadrangle shape to correspond thereto.

[0069] The substrate 40 can be provided in a rectangle shape or a square shape.

[0070] Therefore, taking the first display module 30A as an example, the substrate 40 can include four edges corresponding to the edges 31, 32, 33, 34 of the first display module 30A formed in the up, down, left, and right directions with respect to the first direction X which is the front.

[0071] The substrate 40 can include a base substrate 42, a mounting surface 41 formed on one surface of the base substrate 42, a rear surface 43 formed on the other surface of the base substrate 42 and arranged on the side opposite to the mounting surface 41, and a side surface 45 arranged between the mounting surface 41 and the rear surface 43.

[0072] The substrate 40 can include a TFT layer (Thin Film Transistor, 44) formed on the base substrate 42 so as to drive the inorganic light-emitting element 50. The base substrate 42 can include a glass substrate. That is, the substrate 40 can include a COG (Chip on Glass) type substrate. On the substrate 40, first and second pad electrodes 44a, 44b can be formed so that the inorganic light-emitting element 50 is electrically connected to the TFT layer 44.

[0073] The TFTs (Thin Film Transistors) that make up the TFT layer 44 are not limited to a specific structure or type and can be configured in various embodiments. That is, the TFTs of the TFT layer 44 according to an embodiment of the present invention can be implemented not only with LTPS (Low Temperature Poly Silicon) TFTs, oxide TFTs, Si (poly silicon or a-silicon) TFTs, but also with organic TFTs, graphene TFTs, etc.

[0074] Also, when the base substrate 42 of the substrate 40 is provided with a silicon wafer, the TFT layer 44 can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, an n-type MOSFET, or a p-type MOSFET transistor.

[0075] The plurality of inorganic light-emitting elements 50 are formed of an inorganic material and can include inorganic light-emitting elements having lateral, longitudinal, and height sizes of several μm to several tens of μm each. The micro inorganic light-emitting element may have a size in which the length of the short side among the lateral, longitudinal, and height directions is 100 μm or less. That is, the inorganic light-emitting elements 50 can be picked up from a wafer formed of a sapphire or silicon material and directly transferred onto the substrate 40. The plurality of inorganic light-emitting elements 50 can be picked up and transferred through an electrostatic method using an electrostatic head (Electrostatic Head) or a stamping method using an elastic polymer material such as PDMS or silicone as a head.

[0076] The plurality of inorganic light-emitting elements 50 may be a light-emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0077] Although not shown in the drawings, either one of the first contact electrode 57a and the second contact electrode 57b may be provided to be electrically connected to the n-type semiconductor 58a, and the other one may be provided to be electrically connected to the p-type semiconductor 58b.

[0078] The first contact electrode 57a and the second contact electrode 57b may be horizontally arranged and in a flip chip form arranged in the same direction (opposite to the light emission direction).

[0079] When the inorganic light-emitting element 50 is mounted on the mounting surface 41, it has a light-emitting surface 54 arranged in the first direction X, a side surface 55, and a bottom surface 56 arranged on the opposite side of the light-emitting surface 54, and the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

[0080] That is, the first and second contact electrodes 57a, 57b of the inorganic light-emitting element 50 are arranged on the opposite side of the light-emitting surface 54, and thus may be arranged on the opposite side of the direction in which light is irradiated.

[0081] The first and second contact electrodes 57a, 57b are arranged to face the mounting surface 41 and provided to be electrically connected to the TFT layer 44, and a light-emitting surface 54 that irradiates light in the direction opposite to the direction in which the first and second contact electrodes 57a, 57b are arranged may be arranged.

[0082] Therefore, when the light generated from the active layer 58c is irradiated in the first direction X through the light-emitting surface 54, the light may be irradiated in the first direction X without interference from the first contact electrode 57a or the second contact electrode 57b.

[0083] That is, the first direction X may be defined as the direction in which the light-emitting surface 54 is arranged to irradiate light.

[0084] The first contact electrode 57a and the second contact electrode 57b may be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 of the substrate 40, respectively.

[0085] The inorganic light-emitting element 50 can be directly connected to the pad electrodes 44a and 44b through a bonding structure such as an anisotropic conductive layer 47 or solder.

[0086] An anisotropic conductive layer 47 can be formed on the substrate 40 to mediate the electrical bonding between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 47 can be one in which an anisotropic conductive adhesive is attached to a protective film and has a structure in which conductive balls 47a are dispersed in an adhesive resin. The conductive balls 47a are conductive spheres surrounded by a thin insulating film, and the insulating film can be broken by pressure while electrically connecting conductors to each other.

[0087] The anisotropic conductive layer 47 can include an anisotropic conductive film (ACF) in film form and an anisotropic conductive paste (ACP) in paste form.

[0088] Therefore, when a plurality of inorganic light-emitting elements 50 are mounted on the substrate 40, when pressure is applied to the anisotropic conductive layer 47, the insulating film of the conductive balls 47a is broken, and the contact electrodes 57a and 57b of the inorganic light-emitting element 50 and the pad electrodes 44a and 44b of the substrate 40 can be electrically connected.

[0089] However, although not shown in the drawings, a plurality of inorganic light-emitting elements 50 may be mounted on the substrate 40 through solder (not shown) instead of the anisotropic conductive layer 47. After the inorganic light-emitting elements 50 are aligned on the substrate 40, the inorganic light-emitting elements 50 can be bonded to the substrate 40 through a reflow process.

[0090] The plurality of inorganic light-emitting elements 50 can include a red (Red) light-emitting element 51, a green (Green) light-emitting element 52, and a blue (Blue) light-emitting element 53. The inorganic light-emitting elements 50 can be mounted on the mounting surface 41 of the substrate 40 with a series of red (Red) light-emitting elements 51, green (Green) light-emitting elements 52, and blue (Blue) light-emitting elements 53 as one unit. A series of red (Red) light-emitting elements 51, green (Green) light-emitting elements 52, and blue (Blue) light-emitting elements 53 can form one pixel. At this time, the red (Red) light-emitting element 51, the green (Green) light-emitting element 52, and the blue (Blue) light-emitting element 53 can each form a sub-pixel.

[0091] The red (Red) light-emitting element 51, the green (Green) light-emitting element 52, and the blue (Blue) light-emitting element 53 may be arranged in a row at a predetermined interval as in the embodiment of the present invention, or may be arranged in a different form such as a triangular form.

[0092] The substrate 40 can include a light-absorbing layer 44c so as to absorb external light and improve contrast. The light-absorbing layer 44c can be formed on the entire mounting surface 41 side of the substrate 40. The light-absorbing layer 44c can be formed between the TFT layer 44 and the anisotropic conductive layer 47.

[0093] The plurality of display modules 30A-30w can further include a black matrix 48 formed between the plurality of inorganic light-emitting elements 50.

[0094] The black matrix 48 can perform a function of complementing the light-absorbing layer 44c formed entirely on the mounting surface 41 of the substrate 40. That is, the black matrix 48 can improve the contrast of the screen by absorbing external light so that the substrate 40 looks black.

[0095] The black matrix 48 can have a black color.

[0096] In this embodiment, the black matrix 48 is formed to be disposed between pixels formed by a series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53. However, different from this embodiment, it may be formed more densely so as to partition each of the light-emitting elements 51, 52, and 53 which are sub-pixels.

[0097] The black matrix 48 can be formed in a lattice pattern having a horizontal pattern and a vertical pattern so as to be disposed between pixels.

[0098] The black matrix 48 can be formed by applying a light-absorbing ink onto the anisotropic conductive layer 47 through an ink-jet process and then curing it, or by coating a light-absorbing film on the anisotropic conductive layer 47.

[0099] That is, in the anisotropic conductive layer 47 formed entirely on the mounting surface 41, the black matrix 48 can be formed between a plurality of inorganic light-emitting elements 50 where the plurality of inorganic light-emitting elements 50 are not mounted.

[0100] The plurality of display modules 30A - 30w can each include a front cover 49 disposed on the mounting surface 41 in the first direction X so as to cover the mounting surface 41 of the plurality of display modules 30A - 30w.

[0101] A plurality of front covers 49 can be provided so as to be respectively formed on the plurality of display modules 30A - 30w in the first direction X.

[0102] The front cover 49 can include a film (not shown).

[0103] The film (not shown) of the front cover 49 can be provided with a functional film having optical performance.

[0104] The front cover 49 is provided to cover the substrate 40 and can protect the substrate 40 from external forces.

[0105] Normally, the adhesive layer (not shown) of the front cover 49 can be provided to have a height equal to or greater than a predetermined height in the first direction X towards the mounting surface 41 or the light emitting surface 54. This is to sufficiently fill the gap that can be formed between the front cover 49 and the plurality of inorganic light emitting elements 50 when the front cover 49 is disposed on the substrate 40.

[0106] The plurality of display modules 30A - 30w can each include a heat dissipation member 60 provided on the rear surface 43 of the substrate 40 to dissipate heat generated from the substrate 40.

[0107] The heat generated from the substrate 40 may include heat generated from various components. Among the various heats generated from the substrate 40 and transmitted to the rear surface 43, the heat that accounts for the largest proportion is the heat generated when the plurality of inorganic light emitting elements 50 emit light. However, not only that, heat is also generated from a plurality of components disposed on the mounting surface 41 of the substrate 40, such as the TFT layer 44, and the heat generated from the plurality of components can flow into the substrate 40.

[0108] Also, heat can be transmitted to the substrate 40 from the outside of the substrate 40, and heat can be transmitted to the substrate 40 through the external structure of the substrate 40, causing heat to be generated from the substrate 40.

[0109] The heat generated from the substrate 40 described below substantially refers to the heat that has flowed into the substrate 40 from the heat generated from a plurality of components disposed on the substrate 40 including the plurality of inorganic light emitting elements 50.

[0110] In particular, as described above, where the heat generated from the plurality of inorganic light-emitting elements 50 flows into the substrate 40 the most, the heat that occupies the largest proportion among the heat generated from the substrate 40 is the heat generated from the plurality of inorganic light-emitting elements 50. However, as described above, it can be expressed that heat is generated from the substrate 40 due to various components other than the plurality of inorganic light-emitting elements 50 and heat generated from outside the substrate 40. Further, the plurality of display modules 30A - 30w can each include an adhesive tape 70 disposed between the rear surface 43 of the substrate 40 and the heat dissipation member 60 so as to bond the rear surface 43 and the heat dissipation member 60.

[0111] The plurality of inorganic light-emitting elements 50 can be electrically connected to a pixel driving wiring (not shown) formed on the mounting surface 41 and an upper surface wiring layer (not shown) formed by the pixel driving wiring (not shown) extending through the side surface 45 of the substrate 40.

[0112] The upper surface wiring layer (not shown) can be electrically connected to a side surface wiring (not shown) formed on the side surface 45 of the substrate 40. The side surface wiring (not shown) can be provided in a thin film form.

[0113] The upper surface wiring layer (not shown) can be connected to the side surface wiring (not shown) by an upper surface connection pad (not shown) formed on the edge side of the substrate 40.

[0114] The side surface wiring (not shown) can extend along the side surface 45 of the substrate 40 and be connected to a rear surface wiring layer 43b formed on the rear surface 43.

[0115] An insulating layer 43c covering the rear surface wiring layer 43b can be formed on the rear surface wiring layer 43b in the direction toward the rear surface of the substrate 40.

[0116] That is, the plurality of inorganic light-emitting elements 50 can be electrically connected to the upper surface wiring layer (not shown), the side surface wiring (not shown), and the rear surface wiring layer 43b in sequence.

[0117] Also, as shown in FIG. 4, the display module 30A can include a drive circuit board 80 provided for electrically controlling a plurality of inorganic light-emitting elements 50 mounted on the mounting surface 41. The drive circuit board 80 can be formed of a printed circuit board. The drive circuit board 80 can be disposed on the rear surface 43 of the substrate 40 in the first direction X. It can be disposed on a heat dissipation member 60 adhered to the rear surface 43 of the substrate 40.

[0118] The display module 30A can include a flexible film 81 that connects the drive circuit board 80 and the rear wiring layer 43b so that the drive circuit board 80 is electrically connected to the plurality of inorganic light-emitting elements 50.

[0119] One end of the flexible film 81 can be disposed on the rear surface 43 of the substrate 40 and connected to a rear connection pad 43d that is electrically connected to the plurality of inorganic light-emitting elements 50.

[0120] The rear connection pad 43d can be electrically connected to the rear wiring layer 43b. Thereby, the rear connection pad 43d can electrically connect the rear wiring layer 43b and the flexible film 81.

[0121] The flexible film 81 can transmit power and electrical signals from the drive circuit board 80 to the plurality of inorganic light-emitting elements 50 by being electrically connected to the rear connection pad 43d.

[0122] The flexible film 81 can be formed of an FFC (Flexible Flat Cable) or a COF (Chip On Film), etc.

[0123] The flexible film 81 can include a first flexible film 81a and a second flexible film 81b that are respectively disposed in the vertical direction with respect to the first direction X which is the front.

[0124] The first and second flexible films 81a and 81b may be arranged in the left - right direction with respect to the first direction X, and are not limited thereto. They may be arranged in at least two of the up, down, left, and right directions respectively.

[0125] A plurality of second flexible films 81b may be provided. However, it is not limited thereto. The second flexible film 81b may be provided as a single one, and a plurality of first flexible films 81a may also be provided.

[0126] The first flexible film 81a can transmit data signals from the drive circuit board 80 to the substrate 40. The first flexible film 81a may be provided by COF.

[0127] The second flexible film 81b can transmit power from the drive circuit board 80 to the substrate 40. The second flexible film 81b may be provided by FFC.

[0128] However, it is not limited thereto. The first and second flexible films 81a and 81b may be formed oppositely to each other.

[0129] Although not shown in the drawings, the drive circuit board 80 may be electrically connected to the main board 25 (see FIG. 2). The main board 25 may be arranged on the rear side of the frame 100, and the main board 25 may be connected to the drive circuit board 80 through a cable (not shown) from the rear of the frame 100.

[0130] As described above, the heat dissipation member 60 may be provided to contact the substrate 40. The heat dissipation member 60 and the substrate 40 may be adhered by an adhesive tape 70 disposed between the rear surface 43 of the substrate 40 and the heat dissipation member 60.

[0131] The heat dissipation member 60 may be formed of a material with high thermal conductivity or may be embodied in a configuration with high thermal conductivity. For example, the heat dissipation member 60 may be provided with an aluminum material.

[0132] Heat generated from the plurality of inorganic light-emitting elements 50 and the TFT layer 44 mounted on the substrate 40 can be transmitted to the heat dissipation member 60 through the adhesive tape 70 along the rear surface 43 of the substrate 40.

[0133] Thereby, the heat generated from the substrate 40 can be easily transmitted to the heat dissipation member 60, and it can be prevented that the substrate 40 rises above a certain temperature.

[0134] The plurality of display modules 30A - 30w can be arranged at various positions in an M*N matrix form. Each display module 30A - 30w is provided to be individually movable. At this time, each display module 30A - 30w can maintain a certain level of heat dissipation performance regardless of the position where each display module 30A - 30w is arranged by individually including the heat dissipation member 60.

[0135] The plurality of display modules 30A - 30w can form screens of various sizes of the display device 1 in various M*N matrix forms. Thereby, compared with heat dissipation through a single heat dissipation member provided for heat dissipation, as in an embodiment of the present invention, each display module 30A - 30w includes an independent heat dissipation member 60, so that each display module 30A - 30w can dissipate heat individually, which can improve the heat dissipation performance of the entire display device 1.

[0136] When a single heat dissipation member is arranged inside the display device 1, a part of the heat dissipation member may not be arranged at a position corresponding to the position where some display modules are arranged with reference to the front - rear direction, or the heat dissipation member may be arranged at a position where no display module is arranged. Therefore, the heat dissipation efficiency of the display device 1 may decrease.

[0137] That is, regardless of the position of each display module 30A-30w through the heat dissipation member 60 disposed in each display module 30A-30w, all the display modules 30A-30w can self-dissipate heat by their respective heat dissipation members 60, so that the heat dissipation performance of the entire display device 1 can be improved.

[0138] The heat dissipation member 60 can be provided in a rectangular shape that generally corresponds to the shape of the substrate 40.

[0139] The area of the substrate 40 can be provided to be at least the same as or larger than the area of the heat dissipation member 60. When the substrate 40 and the heat dissipation member 60 are arranged side by side in the first direction X, the four edges of the rectangular substrate 40 with reference to the centers of the substrate 40 and the heat dissipation member 60 may be formed to correspond to the four edges of the heat dissipation member 60, or may be provided to be arranged more outside than the four edges of the heat dissipation member 60 with reference to the centers of the substrate 40 and the heat dissipation member 60.

[0140] The four edges of the substrate 40 can be provided to be arranged outside the four edges of the heat dissipation member 60. That is, the area of the substrate 40 can be provided to be larger than the area of the heat dissipation member 60.

[0141] This is because when heat is transferred to each display module 30A-30w, the substrate 40 and the heat dissipation member 60 can be thermally expanded, but since the heat dissipation member 60 has a higher coefficient of thermal expansion than the substrate 40, the numerical value of the expansion of the heat dissipation member 60 is higher than the numerical value of the expansion of the substrate 40.

[0142] At this time, when the four edges of the substrate 40 correspond to or are arranged more inside than the four edges of the heat dissipation member 60, the edges of the heat dissipation member 60 can protrude outside the substrate 40.

[0143] As a result, the separation length of the gaps formed between the respective display modules 30A - 30w can be irregularly formed due to the thermal expansion of the heat dissipation members 60 of the respective display modules 30A - 30w. Accordingly, the perceptibility of some seams can increase and the unity of the screen of the display panel 20 can decrease.

[0144] However, when the four edges of the substrate 40 are provided to be disposed outside the four edges of the heat dissipation member 60, even if the substrate 40 and the heat dissipation member 60 thermally expand, the heat dissipation member 60 does not protrude outside the four edges of the substrate 40. Accordingly, the separation length of the gaps formed between the respective display modules 30A - 30w can be maintained constant.

[0145] According to an embodiment of the present invention, the area of the substrate 40 and the area of the heat dissipation member 60 can be provided to roughly correspond. Accordingly, the heat generated from the substrate 40 can be uniformly dissipated over the entire area of the substrate 40 without being isolated in a partial area of the substrate 40.

[0146] The heat dissipation member 60 can be provided to be adhered to the rear surface 43 of the substrate 40 by an adhesive tape 70.

[0147] The adhesive tape 70 can be provided in a size corresponding to the heat dissipation member 60. That is, the area of the adhesive tape 70 can be provided to correspond to the area of the heat dissipation member 60. The heat dissipation member 60 is provided in a substantially rectangular shape, and the adhesive tape 70 can be provided in a rectangular shape corresponding thereto.

[0148] Based on the centers of the heat dissipation member 60 and the adhesive tape 70, the edges of the rectangular heat dissipation member 60 and the edges of the adhesive tape 70 can be formed to correspond.

[0149] Accordingly, the heat dissipation member 60 and the adhesive tape 70 can be easily manufactured in a single coupling configuration, so that the manufacturing efficiency of the entire display device 1 can be increased.

[0150] That is, when the heat dissipation member 60 is cut in unit quantities from a single plate, the adhesive tape 70 is first adhered to the single plate before the heat dissipation member 60 is cut, and the adhesive tape 70 and the heat dissipation member 60 are cut simultaneously in unit quantities, which can produce the effect of reducing the process steps.

[0151] The heat generated from the substrate 40 can be transmitted to the heat dissipation member 60 through the adhesive tape 70. Accordingly, the adhesive tape 70 can be provided to adhere the heat dissipation member 60 to the substrate 40 and at the same time transmit the heat generated from the substrate 40 to the heat dissipation member 60.

[0152] Accordingly, the adhesive tape 70 can include a material having high heat dissipation performance.

[0153] The adhesive tape 70 can include a material having adhesiveness for adhering the substrate 40 and the heat dissipation member 60.

[0154] The adhesive tape 70 can include a material having higher heat dissipation performance than a material having general adhesiveness. Accordingly, heat can be efficiently transmitted between the substrate 40 and the heat dissipation member 60 to each configuration.

[0155] In addition, the material having adhesiveness of the adhesive tape 70 can be formed of a material having higher heat dissipation performance than an adhesive material constituting a general adhesive.

[0156] The material having high heat dissipation performance means a material having high thermal conductivity, high heat transfer property, and low specific heat, and thus can effectively transmit heat.

[0157] As an example, the adhesive tape 70 can include a graphite material. However, it is not limited thereto, and the adhesive tape 70 can be provided with a material generally having high heat dissipation performance.

[0158] The flexibility of the adhesive tape 70 can be set to be greater than the flexibility of the substrate 40 and the heat dissipation member 60. Therefore, the adhesive tape 70 can be made of a material that has adhesiveness and heat dissipation properties and is highly flexible. The adhesive tape 70 can be formed as an inorganic material double-sided tape. When the adhesive tape 70 is formed as an inorganic material double-sided tape, it can be formed as a single layer without a base material that supports one surface and the other surface between one surface adhered to the substrate 40 and the other surface adhered to the heat dissipation member 60.

[0159] Since the adhesive tape 70 does not contain a base material, it does not contain a material that obstructs heat conduction, and thus the heat dissipation performance can be improved. However, the adhesive tape 70 is not limited to an inorganic material double-sided tape and can be provided with a heat dissipation tape having better heat dissipation performance than a general double-sided tape.

[0160] The substrate 40 is configured to include a glass material, and the heat dissipation member 60 is configured to include a metal material. Since the material physical property values of the glass material and the metal material are different, the degree to which the materials are deformed by the same heat can be different. That is, when heat is generated from the substrate 40, the substrate 40 and the heat dissipation member 60 can be thermally expanded to different sizes from each other by heat. As a result, a problem may occur in that the display module 30A is damaged.

[0161] When the substrate 40 and the heat dissipation member 60 are fixed to each other, the values at which the substrate 40 and the heat dissipation member 60 expand at the same temperature are different from each other. Therefore, stress can be generated in each configuration while the substrate 40 and the heat dissipation member 60 expand to different sizes from each other.

[0162] Among the material physical property values, in particular, the thermal expansion coefficients of the materials of the substrate 40 and the heat dissipation member 60 are different from each other, and the degree to which the materials are physically deformed by heat is different. In particular, generally, the thermal expansion coefficient of the metal material is larger than the thermal expansion coefficient of glass. Therefore, when the same heat is transmitted to the substrate 40 and the heat dissipation member 60, the heat dissipation member 60 can be expanded and deformed more than the substrate 40.

[0163] Conversely, when heat generation in the substrate 40 ends and both the substrate 40 and the heat dissipation member 60 are cooled, the heat dissipation member 60 can contract and deform even more than the substrate 40.

[0164] Since the substrate 40 and the heat dissipation member 60 are adhered to each other by the adhesive tape 70, when the heat dissipation member 60 deforms more than the substrate 40, an external force can be transmitted to the substrate 40.

[0165] Conversely, an external force can also be transmitted to the heat dissipation member 60 by the substrate 40. However, since the rigidity of the glass - material substrate 40 is smaller than that of the metal - material heat dissipation member 60, the substrate 40 can be damaged.

[0166] The adhesive tape 70 can be provided to absorb the external forces transmitted from different structures while the substrate 40 and the heat dissipation member 60 expand with different sizes between the substrate 40 and the heat dissipation member 60.

[0167] Thereby, an external force can be transmitted to the substrate 40 and the heat dissipation member 60, and in particular, it is possible to prevent the substrate 40 from being damaged.

[0168] The adhesive tape 70 can be provided with a highly flexible material so as to absorb the external forces transmitted to the substrate 40 and the heat dissipation member 60. Specifically, the flexibility of the adhesive tape 70 can be provided to be much larger than the flexibility of the substrate 40 and the heat dissipation member 60.

[0169] Thereby, when the external force generated from the size change of the substrate 40 and the heat dissipation member 60 is transmitted to the adhesive tape 70, it is possible to prevent the external force from being transmitted to different structures by the deformation of the adhesive tape 70 itself.

[0170] The adhesive tape 70 can have a predetermined thickness in the first direction X. When heat is transmitted to the heat dissipation member 60 and it thermally expands or is cooled and contracts, the heat dissipation member 60 can expand or contract not only in the first direction X but also in a direction orthogonal to the first direction X, whereby an external force can be transmitted to the substrate 40.

[0171] As described above, the display panel 20 can have an image displayed thereon by a plurality of display modules 30A - 30w. At this time, the seam formed by the gaps formed between the plurality of display modules 30A - 30w may reduce the integrity of the image.

[0172] Accordingly, in order to minimize the perception of the seam of the display panel 20, the plurality of display modules 30A - 30w can be arranged on the frame 100 so as to form a constant gap. This is because when the gaps formed by the plurality of display modules 30A - 30w are not constant, the perception of the seam due to some of the gaps can be amplified.

[0173] In the case of a conventional display device, a frame for supporting the display panel is provided with a metal material. A plurality of display modules can be tiled on the metal - framed material.

[0174] While the display device is being driven, the heat generated from the display panel can cause the substrates forming the plurality of display modules 30A - 30w to thermally expand. However, as described above, the plurality of display modules 30A - 30w are supported by a metal - framed material, and due to the thermal expansion of the substrates of the plurality of display modules 30A - 30w and the thermal expansion of the frame, a problem may occur in that the gaps between the plurality of display modules 30A - 30w are irregularly formed, amplifying the perception of the seam.

[0175] That is, the substrates of the plurality of display modules 30A - 30w are all made of a glass material and each substrate can thermally expand by a certain value. However, due to the thermal expansion of the metal - framed material supporting each substrate, the width between some of the gaps in the gaps between the plurality of display modules 30A - 30w can be irregularly formed. This is because the physical property values of the metal material and the glass material are different.

[0176] The material physical property values of the material may vary depending on the coefficient of thermal expansion, specific heat, thermal conductivity, etc. In particular, the degree of thermal expansion of the substrate and the frame may differ depending on the difference between the coefficient of thermal expansion of the metal material and the coefficient of thermal expansion of the glass.

[0177] In addition to the thermal expansion of the substrates of the plurality of display modules 30A-30w, the frame itself to which the plurality of display modules 30A-30w are adhered expands thermally, whereby the separation distance of the gaps between the plurality of display modules 30A-30w can change irregularly.

[0178] Thus, in order to prevent the gaps between the plurality of display modules 30A-30w from being irregularly provided due to thermal expansion when the plurality of display modules 30A-30w are arrayed on the frame made of a metal material, the frame 100 of the display device 1 according to an embodiment of the present invention may be provided with a material formed with a material physical property value similar to the material physical property value of the substrate 40 of the plurality of display modules 30A-30w to which the plurality of display modules 30A-30w are adhered.

[0179] That is, the frame 100 may be provided so as to have a material physical property value (material property) similar to that of the substrate 40 in order to maintain a constant separation length of the gaps formed between the respective display modules 30A-30w.

[0180] The meaning of being formed with a material physical property value similar to the material physical property value of the substrate 40 described above can include the meaning that the coefficient of thermal expansion, specific heat, and thermal conductivity of the substrate 40 are similar. In particular, according to an embodiment of the present invention, it can be interpreted as meaning that the coefficient of thermal expansion of the substrate 40 and the coefficient of thermal expansion of the frame 100 correspond.

[0181] The frame 100 may be entirely formed of a material similar to the material physical property value of the substrate 40, or may be provided with a material having a similar coefficient of thermal expansion value. The frame 100 may be formed of a material having the same value as the coefficient of thermal expansion of the substrate 40.

[0182] Not limited thereto, the frame 100 may include a front layer (not shown) formed of a material having a material physical property value corresponding to the material physical property value of the substrate 40.

[0183] When the substrate 40 is adhered to a front layer (not shown) in the first direction X, and the same heat is transferred to the substrate 40 and the front layer (not shown) in the second direction Y or the third direction Z orthogonal to the first direction X, they may be provided to expand with corresponding lengths to each other.

[0184] That is, when the frame 100 is entirely formed of a material having a material physical property value corresponding to the substrate 40, or only the front layer (not shown) constituting the front surface of the frame 100 is formed of a material having a material physical property value corresponding to the substrate 40, in any embodiment, the front surface of the frame 100 to which the substrate 40 of the display module 30A - 30w is adhered can thermally expand with the same numerical value as the substrate 40 when the substrate 40 of the plurality of display modules 30A - 30w is thermally expanded by the heat generated during the driving of the display device 1.

[0185] When the front surface of the frame 100, which is the base surface to which the plurality of display modules 30A - 30w are adhered, thermally expands with the same numerical value as the substrates 40 of the plurality of display modules 30A - 30w, the interval of the gaps formed between the plurality of display modules 30A - 30w can be maintained the same.

[0186] Thereby, the gaps formed between the plurality of display modules 30A - 30w can maintain the separation distance of the gaps in the same state as when the substrate 40 does not thermally expand, so that a certain level of seam is maintained and the integrity of the screen of the display panel 20 can be maintained.

[0187] Therefore, even if the heat generated by driving the display device 1 is supplied to the substrates 40 of the plurality of display modules 30A - 30w, by maintaining a constant distance of the gaps between the plurality of display modules 30A - 30w, it is possible to prevent a phenomenon in which some seams are amplified and the screen integrity deteriorates.

[0188] The frame 100 is configured to support the display panel 20 and may be provided to have rigidity equal to or greater than a predetermined size. Accordingly, the frame 100 may be formed of a metal material having rigidity equal to or greater than a certain level, and the front surface of the frame 100 may be formed of a glass material corresponding to the substrate 40. However, it is not limited thereto, and the frame 100 may be formed of a material having a value different from the coefficient of thermal expansion of the substrate 40.

[0189] Hereinafter, the frame 100 according to an embodiment of the present invention will be described in detail.

[0190] FIG. 5 shows the frame shown in FIG. 2 and a bracket coupled to the rear side of the frame. FIG. 6 shows a cross-section taken along line A - A' shown in FIG. 5. FIG. 7 shows an enlarged view of part E shown in FIG. 6. FIG. 8 shows a cross-section taken along line B - B' shown in FIG. 5. FIG. 9 shows a cross-section taken along line C - C' shown in FIG. 5. FIG. 10 shows a cross-section taken along line D - D' shown in FIG. 5.

[0191] Referring to FIGS. 5 to 10, the frame 100 according to an embodiment of the present invention may include a frame panel 110. The frame panel 110 may have a first side 110a facing the plurality of display modules 30A - 30w and a second side 110b opposite to the first side 110a. The first side 110a may face forward, and the second side 110b may face backward.

[0192] Referring to FIGS. 6 and 7, the frame panel 110 can include an insertion portion 111 formed to penetrate in the front-rear direction. The insertion portion 111 can be provided such that the stud 120 is inserted into the insertion portion 111. The insertion portion 111 can be provided at positions and in numbers corresponding to the brackets 160, 172, 180, 190 coupled to the frame 100.

[0193] A first opening 111a can be formed in the first side 110a of the frame panel 110. A second opening 111b can be formed in the second side 110b of the frame panel 110. The first opening 111a can be formed in a size different from that of the second opening 111b. The first opening 111a can have a size larger than that of the second opening 111b. The insertion portion 111 can be provided such that the first opening 111a and the second opening 111b form a step.

[0194] When the brackets 160, 172, 180, 190 are coupled to the stud 120 with the stud 120 inserted into the insertion portion 111 by forming the second opening 111b smaller than the first opening 111a, a part of the frame panel 110 forming the second opening 111b can support the stud 120, so that the pulling force or torque resistance applied to the frame 100 can be improved.

[0195] Also, by forming the second opening 111b smaller than the first opening 111a and pushing the stud 120 into the insertion portion 111, the surfaces formed on the first side 110a and the second side 110b of the frame panel 110 can be formed flat without protruding portions.

[0196] In particular, by forming the surface formed on the first side 110a of the frame panel 110 flat without protruding portions, the display device 1 according to an embodiment of the present invention can secure a flat surface for tiling a plurality of display modules 30A-30w attached to the front surface of the frame 100.

[0197] In addition, by forming the surface formed on the second side 110b of the frame panel 110 to be flat without protruding portions, it is possible to prevent the thickness of the display device 1 from increasing unnecessarily.

[0198] Referring to FIG. 7, the frame panel 110 can include a first metal layer 116 forming the first side 110a, a second metal layer 117 forming the second side 110b, and a resin layer 118 disposed between the first metal layer 116 and the second metal layer 117. With such a configuration, the frame panel 110 can have excellent flatness and improved weight-to-rigidity ratio.

[0199] The size of a part of the insertion portion 111 formed in the resin layer 118 can be provided to be approximately the same as the size of another part of the insertion portion 111 formed in the first metal layer 116. That is, the size of a part of the insertion portion 111 formed in the resin layer 118 can be provided to be larger than the size of another part of the insertion portion 111 formed in the second metal layer 117.

[0200] The first opening 111a can be formed in the first metal layer 116, and the second opening 111b can be formed in the second metal layer 117.

[0201] Referring to FIG. 7, the stud 120 can be inserted into the insertion portion 111 through the first opening 111a. The stud 120 can include a coupling portion 120a that is open toward the second opening 111b. A thread 121 can be formed on the inner circumferential surface of the coupling portion 120a. The coupling portion 120a can also be open toward the first opening 111a. The stud 120 can be supported by a part of the frame panel 110 that forms the second opening 111b.

[0202] The frame 100 can include a plurality of module openings 101 formed to correspond to a plurality of display modules 30A - 30w.

[0203] On the back surface of the frame panel 110, brackets 160, 172, 180, and 190 can be detachably attached. The brackets 160, 172, 180, and 190 can be detachably coupled to the studs 120. The brackets 160, 172, 180, and 190 can include at least one of a board bracket 160, a chassis bracket 172, a mounting bracket 180, and a reinforcing bracket 190.

[0204] Referring to FIGS. 5 and 6, a circuit board (not shown) for driving the display device 1 can be mounted on the board bracket 160. The board brackets 160 can be provided in plurality. The board bracket 160 can include board bracket holes 161. The board bracket holes 161 can be formed to correspond to the second openings 111b of the frame panel 110. By a fastening member (not shown) passing through the board bracket holes 161 and being coupled to the thread 121 of the stud 120, the board bracket 160 can be fixed to the frame 100.

[0205] Referring to FIGS. 5 and 8, the chassis bracket 172 can be provided to fix a front chassis 171 provided to cover an edge of the frame 100 to the frame 100. The chassis brackets 172 can be provided in plurality. The chassis bracket 172 can include chassis bracket holes 173. The chassis bracket holes 173 can be formed to correspond to the second openings 111b of the frame panel 110. By a fastening member (not shown) passing through the chassis bracket holes 173 and being coupled to the thread 121 of the stud 120, the chassis bracket 172 can be fixed to the frame 100. The front chassis 171 can be fixed to the chassis bracket 172 fixed to the frame 100.

[0206] Referring to FIGS. 5 and 9, the mounting bracket 180 can be provided to be coupled to a wall mount (not shown) when fixing the display device 1 to a wall. The mounting bracket 180 can include a mounting bracket hole 181. The mounting bracket hole 181 can be formed to correspond to the second opening 111b of the frame panel 110. By a fastening member (not shown) passing through the mounting bracket hole 181 and being coupled to the thread 121 of the stud 120, the mounting bracket 180 can be fixed to the frame 100.

[0207] Referring to FIGS. 5 and 10, the reinforcing bracket 190 can be provided to reinforce the strength of the frame 100. The reinforcing bracket 190 can extend substantially horizontally. The reinforcing bracket 190 can include a reinforcing bracket hole 191. The reinforcing bracket hole 191 can be formed to correspond to the second opening 111b of the frame panel 110. By a fastening member (not shown) passing through the reinforcing bracket hole 191 and being coupled to the thread 121 of the stud 120, the reinforcing bracket 190 can be fixed to the frame 100.

[0208] Although not shown, the display device 1 can include a stand. An insertion portion 111 into which a stud 120 for a bracket to which the stand is to be coupled can be inserted may be formed in the frame 100.

[0209] The frame 100 can include a reinforcing member 130 attached to the first side 110a of the frame panel 110. The reinforcing member 130 can be provided to cover the first opening 111a. A plurality of display modules 30A - 30w can be installed on the reinforcing member 130. The reinforcing member 130 can be configured to include CFRP (carbon fiber reinforced plastics).

[0210] FIG. 11 shows the state in which the frame panel shown in FIG. 5 is provided. FIG. 12 shows the state in which a stud is inserted into the insertion portion of the frame panel shown in FIG. 11. FIG. 13 shows another embodiment of the insertion portion of the frame panel shown in FIG. 12. FIG. 14 shows the state in which a reinforcing member is adhered to the frame panel shown in FIG. 12. FIG. 15 shows the state in which a module opening is formed in the frame shown in FIG. 14. FIG. 16 shows the state in which a bracket is attached to the frame shown in FIG. 15.

[0211] Referring to FIGS. 11 to 16, the process of manufacturing the display device 1 according to an embodiment of the present invention will be described.

[0212] Referring to FIG. 11, a frame panel 110 having a first metal layer 116, a second metal layer 117, and a resin layer 118 may be provided. An insertion portion 111 may be formed in the frame panel 110. The insertion portion 111 can be formed on the first side 110a of the frame panel 110. The insertion portion 111 can be formed to penetrate from the first side 110a to the second side 110b of the frame panel 110. The insertion portion 111 can be formed at various positions in consideration of the types of brackets 160, 172, 180, 190 to be mounted on the frame 100.

[0213] The insertion portion 111 can be formed in various ways. The insertion portion 111 can be formed on the first side 110a of the frame panel 110 using at least one of a shaping device, a water jet, and a laser.

[0214] The insertion portion 111 can be formed through a shaping device (not shown). The shaping device can include a router. When the insertion portion 111 is formed by the shaping device, the insertion portion 111 can be formed such that the first opening 111a and the second opening 111b have a stepped shape as shown in FIG. 12.

[0215] The insertion part 211 may be formed through a water jet and / or a laser. When forming the insertion part 211 through a water jet and / or a laser, the insertion part 211 may be provided in a tapered shape from the first opening 211a to the second opening 211b as shown in FIG. 13. The insertion part 211 may be formed such that its size decreases from the first metal layer 116 to the second metal layer 117.

[0216] Referring to FIG. 12, a stud 120 may be inserted into the frame panel 110 in which the insertion part 111 is formed. The stud 120 may be pushed in at the first side 110a. The stud 120 may be inserted into the insertion part 111 in a direction facing the second opening 111b through the first opening 111a. Thus, when the stud 120 is inserted into the insertion part 111, it may be supported by a part of the frame panel 110 that forms the second opening 111b.

[0217] Referring to FIG. 14, after inserting the stud 120 into the insertion part 111 of the frame panel 110, a reinforcing member 130 may be attached to the first side 110a of the frame panel 110. Thereby, the first opening 111a of the insertion part 111 may be covered by the reinforcing member 130.

[0218] Referring to FIG. 15, after attaching the reinforcing member 130 to the frame panel 110, a module opening 101 may be formed in the frame panel 110 and the reinforcing member 130. By forming the module opening 101 after attaching the reinforcing member 130 to the frame panel 110, the manufacturing process can be simplified.

[0219] Referring to FIG. 16, brackets 160, 172, 180, 190 can be mounted on the frame 100 that forms the module opening 101. Specifically, the board bracket 160 can be mounted on the frame 100 by being coupled to the first stud on the second side 110b of the frame panel 110. The chassis bracket 172 can be mounted on the frame 100 by being coupled to the second stud on the second side 110b of the frame panel 110. The mounting bracket 180 can be mounted on the frame 100 by being coupled to the third stud on the second side 110b of the frame panel 110. The reinforcing bracket 190 can be mounted on the frame 100 by being coupled to the fourth stud on the second side 110b of the frame panel 110. The brackets 160, 172, 180, 190 can be detachably coupled to the first to fourth studs through the second opening 111b of the frame panel 110. Each of the first to fourth studs can have a shape corresponding to the shape of the stud 120.

[0220] After mounting the brackets 160, 172, 180, 190 on the frame 100, a plurality of display modules 30A - 30w can be installed on the front surface of the frame 100.

[0221] According to the idea of the present invention, in the display device and the method of manufacturing the display device, since the sizes of the first opening formed on the first side and the second opening formed on the second side of the frame for inserting the studs to which the brackets are detachably coupled are formed to be different from each other, the pulling force or torque resistance of the frame supporting the plurality of display modules can be improved.

[0222] In the above, the embodiments disclosed with reference to the attached drawings have been described. Those having ordinary knowledge in the technical field to which the disclosed embodiments belong will be able to understand that the disclosed embodiments can be implemented in forms different from the disclosed embodiments without changing the technical idea or essential features of the disclosed embodiments. The disclosed embodiments are exemplary and should not be construed in a limiting manner.

Claims

1. A plurality of display modules; A frame that supports the plurality of display modules, wherein the plurality of display modules are arranged in an M*N matrix form on the frame; and A bracket detachably coupled to the frame; including The frame includes a frame panel having a first side and a second side opposite to the first side, The frame panel An insertion portion that penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, and the size of the first opening is larger than the size of the second opening; and A stud provided on the insertion portion; including The plurality of display modules are attached to the first side of the frame panel, and the bracket is coupled to the stud through the second opening formed on the second side of the frame panel. A display device.

2. The display device according to claim 1, wherein the insertion portion is provided such that the first opening and the second opening form a step.

3. The display device according to claim 1, wherein the insertion portion is provided in a tapered shape from the first side to the second side.

4. The stud includes a coupling portion having an opening facing the second opening, The display device according to claim 1, wherein the coupling portion includes a thread formed on an inner peripheral surface.

5. The display device according to claim 1, wherein the bracket includes at least one of a mounting bracket, a chassis bracket, a reinforcement bracket, and a board bracket.

6. The display device according to claim 1, wherein the frame further includes a reinforcing member attached to the first side of the frame panel and provided to cover the first opening.

7. The display device according to claim 6, wherein the plurality of display modules are attached to the reinforcing member.

8. The frame panel A first metal layer forming the first side of the frame panel; A second metal layer forming the second side of the frame panel; and A resin layer disposed between the first metal layer and the second metal layer; further included in the display device according to claim 1.

9. The size of a part of the insertion portion formed in the resin layer is provided to be the same as the size of the other part of the insertion portion formed in the first metal layer. The display device according to claim 8.

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