Display device

Abstract

To provide a display device which prevents heat of a drive element for driving a display panel from being conducted to the display panel.SOLUTION: A display device includes: a display panel having a display surface for displaying an image; a back chassis provided on the side of a rear surface of the display panel; an adhesive member which bonds the display panel and the back chassis and which forms a gap between the display panel and the back chassis; and a heating member provided on the side of separating farther from the center of the display surface than the adhesive member.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a display device.

Background Art

[0002] For example, according to the image display device disclosed in Patent Document 1, a driving IC that transmits various signals to a display panel using an organic electroluminescence element (hereinafter referred to as an organic EL element) as a light emitting element is provided on a flexible printed circuit board (hereinafter referred to as an FPC). The driving IC is disposed between the back surface of the display panel and a metal lower frame, and a heat insulating member is provided between the display panel and the driving IC. According to this configuration, the heat of the driving IC, which is a heat source, can be efficiently conducted to the lower frame for heat dissipation, and the possibility that the heat of the driving IC is applied to the display panel is reduced.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, as the performance of the image display device increases, the heat generated by the driving IC increases. Therefore, with the configuration of Patent Document 1, the heat of the driving IC cannot be completely dissipated by the lower frame, and the air in the space around the driving IC may be heated to a high temperature. In such a case, the heat of the driving IC is transmitted to the display panel through the air, causing the display panel to become partially high temperature and the heat distribution of the display panel to become non-uniform. As a result, for example, in the high temperature portion of the display panel, the luminous efficiency of the light emitting element is locally reduced, causing display unevenness, or the deterioration of the light emitting element is promoted, shortening the lifespan.

[0005] Therefore, in view of the above problems, an object of the present disclosure is to provide a display device that makes it difficult for heat of a heat-generating member such as a driving element that drives a display panel to be transmitted to the display panel.

Means for Solving the Problems

[0006] A display device according to an aspect of the present disclosure includes a display panel having a display surface for displaying an image, a back chassis provided on the back side of the display panel, an adhesive member that adheres the display panel and the back chassis and forms a gap between the display panel and the back chassis, and a heat-generating member provided on a side farther from the center of the display surface than the adhesive member.

Brief Description of the Drawings

[0007]

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Modes for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Regarding the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant descriptions are omitted. In addition, the embodiments described below do not unduly limit the content of the present disclosure described in the claims, and not all of the configurations described in the embodiments are essential as the solution means of the present disclosure.

[0009] <Embodiment 1> FIG. 1 is a schematic diagram of a display device 100 according to Embodiment 1 of the present disclosure. In the following description, the front side, the rear side, the left side, the right side, the upper side, and the lower side shown in FIG. 1 are respectively the front side, the rear side, the left side, the right side, the upper side, and the lower side of the display device 100. FIG. 2 is an exploded view of the display device 100 of FIG. 1 as viewed from the front, and FIG. 3 is an exploded view of the display device 100 of FIG. 1 as viewed from the rear. FIG. 4 is a plan view of the display device 100 of FIG. 1 as viewed from the rear through the back chassis 300. FIG. 5 is a cross-sectional view of the V-V cross-section of FIGS. 1 and 4.

[0010] The display device 100 includes a display panel 200, a back chassis 300, and a front cover 400, and has a structure in which they are stacked.

[0011] <Display Panel> As shown in FIGS. 1 to 3, the display panel 200 has a display surface 201 facing the front side for displaying an image and a back surface 202 on the opposite side of the display surface 201 facing the rear side. In the present disclosure, the case where the shape of the display panel 200 is a rectangular plate shape in a plan view as viewed from the front side is exemplified.

[0012] In the present disclosure, the display panel 200 includes a light-emitting element 210. In Embodiment 1, for example, the display panel 200 includes an organic EL element as the light-emitting element 210 between the display surface 201 and the back surface 202. In other words, the display panel 200 is an organic EL display panel, and the display device 100 is an organic EL display device. In that case, the display panel 200 includes, for example, an organic EL substrate, a CF substrate on which a color filter is formed, and a resin layer provided between the organic EL substrate and the CF substrate. However, detailed illustration and description of these elements are omitted. Note that in the present disclosure, the display device 100 is not limited to an organic EL display device, and may be, for example, a liquid crystal display device using liquid crystal. In that case, the display panel 200 includes a liquid crystal layer for displaying an image and a light-emitting diode as the light-emitting element 210.

[0013] <Back chassis> The back chassis 300 has a first inner surface 301 facing the front side, and is disposed on the rear side of the display panel 200 with the first inner surface 301 facing the back surface 202. As shown in FIGS. 1 to 5, in a plan view, the dimensions of the back chassis 300 are larger than those of the display panel 200. In the present disclosure, an example is illustrated in which the shape of the back chassis 300 is a rectangular plate shape having a larger dimension in the vertical direction than the display panel 200 in a plan view seen from the front side.

[0014] In Embodiment 1, since the display panel 200 and the back chassis 300 are overlapped with their upper ends aligned with each other, the back chassis 300 partially protrudes downward. Therefore, as shown in FIGS. 2 to 5, there are a portion where there is a space sandwiched between the back surface 202 and the first inner surface 301 and a portion where there is no space. Hereinafter, a partial region of the first inner surface 301 in the portion where there is a space between the back surface 202 is referred to as a first region 310, and a partial region of the first inner surface 301 in the portion where there is no space between the back surface 202 is referred to as a second region 320.

[0015] The back chassis 300 is made of a metal with high thermal conductivity, such as aluminum or iron, for example. As will be described in detail later, the heat generated by the heat generating member 500 or the like is conducted to the back chassis 300 and efficiently dissipated by being dissipated into the air outside the display device 100 from the back chassis 300. That is, the back chassis 300 has a function of dissipating heat.

[0016] <Adhesive member> As shown in FIGS. 2 and 3, an adhesive member 600 having heat insulating properties is provided between the back surface 202 and the first inner surface 301. As shown in FIG. 5, the back surface 202 and the first inner surface 301 are adhered by the adhesive member 600. A gap corresponding to the thickness of the adhesive member 600 is formed between the back surface 202 and the first inner surface 301. In Embodiment 1, the adhesive member 600 is exemplified as being arranged in a strip shape along the lower end of the back surface 202. The adhesive member 600 of the present disclosure is not limited to the above-described configuration. For example, a plurality of adhesive members 600 may be provided on the back surface 202, or the adhesive member 600 may be provided on the entire surface of the back surface 202. The adhesive member 600 can be formed of any material having heat insulating properties and adhesiveness.

[0017] As shown in FIG. 5, in the present disclosure, as the adhesive member 600, a double-sided tape having a base material 601 which is a sheet-shaped foamed resin and adhesive layers 602 provided on the front and back of the base material 601 is exemplified. The base material 601 is made of a material such as foamed silicone foam or porous polyurethane foam, for example, and realizes excellent heat insulation by containing a large amount of air with low thermal conductivity.

[0018] <Display substrate and connection substrate> As shown in FIGS. 2 to 4, a display substrate 801 and a connection substrate 802 are provided below the display panel 200. The display substrate 801 is a substrate having a circuit for inputting signals to the display panel 200. For example, the display substrate 801 is an electric circuit board for inputting signals for controlling the image display of the display panel 200, and is a printed circuit board on which electronic components such as capacitors, resistors, and diodes are mounted. The display substrate 801 becomes a heat source during the operation of the display device 100.

[0019] The connection substrate 802 is a connection substrate that electrically connects the display panel 200 and the display substrate 801. For example, the connection substrate 802 is an FPC in which wirings and electronic components are provided on a resin substrate having flexibility such as a film, and supplies the signals of the display substrate 801 to the display panel 200.

[0020] <Heat generating member> The heat generating member 500 is provided on the connection substrate 802. As shown in FIG. 4, the heat generating member 500 is provided on the side farther from the center of the display surface 201 than the adhesive member 600. In the present embodiment, for example, the heat generating member 500 is an electronic element for driving the display panel 200, and supplies a driving signal for driving the display panel 200 to the display panel 200. Hereinafter, the heat generating member 500 is also referred to as a driving element 500. For example, when the display substrate 801 is a source substrate which is an electric circuit board for driving a source driver, the driving element 500 is a source driver. The driving element 500 is a heat generating member that becomes a heat source during the operation of the display device 100.

[0021] As shown in FIGS. 4 and 5, in the vertical direction, the drive element 500 is provided on the connection substrate 802 between the display panel 200 and the display substrate 801. In other words, the drive element 500, which is a heat generating member, is provided below the display panel 200. Further, in the front-rear direction, the drive element 500 is disposed between the connection substrate 802 and the first inner surface 301, and the drive element 500 and the first inner surface 301 are thermally connected. As shown in FIG. 5, in Embodiment 1, the drive element 500 is in contact with the first inner surface 301, and heat is directly conducted from the drive element 500 to the first inner surface 301. Also, as shown in FIG. 5, in the vertical direction, the drive element 500 and the adhesive member 600 are separated from each other.

[0022] As shown in FIGS. 4 and 5, the connection substrate 802, the drive element 500, and the display substrate 801 are disposed at positions facing the second region 320. Therefore, in Embodiment 1, the drive element 500 is in direct contact with the first inner surface 301 of the second region 320.

[0023] In FIG. 5, the flow of heat generated from the drive element 500 is indicated by the dotted arrows. As shown in FIG. 5, in the display device 100 of Embodiment 1, the display substrate 801 and the drive element 500, which are the main heat sources, are arranged in the second region 320. In other words, the display substrate 801 and the drive element 500, which are the heat sources, are not located between the back surface 202 and the first inner surface 301, and are separated from the adhesive member 600 in contact with the display panel 200 and the display panel 200. The adhesive member 600 suppresses the heat generated by the display substrate 801 and the drive element 500, which are the heat sources, from being transmitted to the center side of the display surface 201 of the display panel 200. This is because the adhesive member 600 inhibits the direct transmission of heat from the heat source to the gap formed between the display panel 200 and the back chassis 300. Therefore, it is difficult for heat to be transmitted to the display panel 200. Further, since the drive element 500 is thermally connected to the first inner surface 301, the heat of the drive element 500 can be conducted to the back chassis 300 for efficient heat dissipation, and the transmission of heat to the display panel 200 through the air in the display device 100 is also suppressed. Moreover, since the adhesive member 600 having heat insulation properties is provided between the back chassis 300 and the display panel 200, even when the heat conducted from the drive element 500 to the first inner surface 301 is conducted from the second region 320 to the first region 310, it is difficult for the heat to be transmitted to the display panel 200. Therefore, the heat of the drive element 500 that drives the display panel 200 is less likely to be conducted to the display panel 200, and the occurrence of local display unevenness, the acceleration of deterioration of the local light-emitting elements 210, etc. can be suppressed.

[0024] <Front cover> As shown in FIGS. 1 to 5, the front cover 400 is disposed on the front side of the display device 100. The front cover 400 has a second inner surface 401 facing the rear side, and the second inner surface 401 faces a part of the display surface 201 and the first inner surface 301 of the second region 320. Therefore, the connection substrate 802, the driving element 500, and the display substrate 801 are disposed between the second inner surface 401 and the first inner surface 301. In Embodiment 1, the front cover 400 is a member for covering the connection substrate 802, the driving element 500, the display substrate 801, etc., and is made of a material such as plastic, for example.

[0025] <Embodiment 2> FIG. 6 is an exploded view of the display device 100 according to Embodiment 2 of the present disclosure as viewed from the rear. FIG. 7 is a plan view of the display device 100 in FIG. 6 as viewed from the rear through the back chassis 300. FIG. 8 is a cross-sectional view of the VIII-VIII cross-section of FIG. 7. In FIG. 8, the flow of heat generated from the driving element 500 is indicated by a dotted arrow. Embodiment 2 is different from Embodiment 1 mainly in that a heat dissipation member 700 is provided between the driving element 500 and the first inner surface 301.

[0026] As shown in FIG. 8, the display device 100 of Embodiment 2 includes a heat dissipation member 700 that contacts the first inner surface 301 and the driving element 500 and is sandwiched between the first inner surface 301 and the driving element 500 in the second region 320. In other words, in the second region 320, the driving element 500 and the first inner surface 301 are thermally connected via the heat dissipation member 700. In this way, by means of the heat dissipation member 700, heat is easily transferred from the driving element 500 to the first inner surface 301, so that the heat generated by the driving element 500 can be efficiently dissipated. The heat dissipation member 700 can be formed of any material with high thermal conductivity, and is composed of a metal with high thermal conductivity such as aluminum or iron, for example.

[0027] The heat radiating member 700 may be composed of a flexible heat conducting member. For example, a heat conducting sheet, a heat conducting pad, etc. obtained by mixing a material with high heat conductivity such as metal or ceramics into a resin material such as silicon or acrylic can be used. If the heat radiating member 700 is a flexible heat conducting member, the adhesion with the driving element 500 can be improved, and the heat of the driving element 500 can be radiated more efficiently.

[0028] As shown in FIG. 8, the driving element 500 may be thermally connected to the second inner surface 401 via the connection substrate 802. Thereby, the heat generated in the driving element 500 is conducted not only to the back chassis 300 but also to the front cover 400, and is dissipated from the front cover 400 into the air outside the display device 100. Therefore, it is possible to further suppress the heat from being transmitted to the display panel 200 through the air in the display device 100. In order to increase the heat dissipation of the front cover 400, for example, it may be made of a metal with high heat conductivity such as aluminum or iron. Further, in Embodiment 2, a configuration in which the connection substrate 802 of the portion where the driving element 500 is mounted is in direct contact with the second inner surface 401 is illustrated, but the present disclosure is not limited to the above-described configuration. For example, a heat conducting member such as a heat conducting sheet or a heat conducting pad may be sandwiched between the connection substrate 802 and the second inner surface 401.

[0029] <Opening> As shown in FIGS. 6 to 8, an opening 330 is provided in the back chassis 300 of the second embodiment. As shown in FIG. 7, the opening 330 is provided on the side farther from the center of the display surface 201 than the adhesive member 600. In the present embodiment, for example, the opening 330 is provided between the portion of the first inner surface 301 that is in thermal contact with the driving element 500 and the first region 310 in the vertical direction. In the second embodiment, the portion of the first inner surface 301 that is in thermal contact with the driving element 500 is the portion where the heat dissipation member 700 and the first inner surface 301 are in contact in the second region 320, and above that portion, a configuration is exemplified in which the opening 330 is provided between the first region 310 and the second region 320. Further, as shown in FIG. 7, in the left-right direction, the width of the opening 330 is equal to or greater than the width of the heat dissipation member 700. Thereby, the path through which heat is conducted from the portion of the driving element 500 where heat is directly conducted on the second inner surface 301 of the first inner surface 301 to the first region 310 closer to the display panel 200 becomes narrow. Therefore, it becomes difficult for the heat conducted from the driving element 500 to the first inner surface 301 to be conducted from the second region 320 to the first region 310, and it becomes difficult for heat to be transmitted to the display panel 200. As a result, it becomes difficult for the heat of the driving element 500 that drives the display panel 200 to be conducted to the display panel 200, and the occurrence of local display unevenness, the acceleration of deterioration of the local light-emitting element 210, etc. can be suppressed.

[0030] Note that the opening 330 can be applied to the display device 100 of the first embodiment. In that case, the portion of the first inner surface 301 that is in thermal contact with the driving element 500 is the portion where the driving element 500 is in direct contact with the first inner surface 301, and the opening 330 may be provided between the first region 310 and the second region 320 above that portion.

[0031] <Embodiment 3> FIG. 9 is a schematic view of the display device 100 according to Embodiment 3 of the present disclosure. FIG. 10 is a plan view of the display device 100 in FIG. 9 viewed from the rear through the back chassis 300. FIG. 11 is a cross-sectional view taken along the line XI-XI of FIGS. 9 and 10. In FIG. 11, the flow of heat generated from the drive element 500 is indicated by dotted arrows. Embodiment 3 is different from Embodiments 1 and 2 in that the operation substrate 803 is provided.

[0032] In the display device 100 of Embodiment 3, compared with Embodiments 1 and 2, the internal space between the front cover 400 and the back chassis 300 is larger, and the operation substrate 803 is provided between the second inner surface 401 and the first inner surface 301 of the second region 320. The operation substrate 803 is a substrate on which various electric circuits for operating the display panel 200 are formed. Examples of the various electric circuits include a power supply circuit that generates a DC voltage from an AC power supply, an inverter circuit that adjusts the magnitude of the DC voltage, and a signal processing circuit that processes signals including data of an image to be displayed.

[0033] The operation substrate 803 becomes a heat source during the operation of the display device 100. As shown in FIG. 11, the display device 100 of Embodiment 3 is arranged such that the operation substrate 803 faces the second region 320. Therefore, for example, in the first region 310, compared with the case where the operation substrate 803 is fixed to the surface on the opposite side of the first inner surface 301 of the back chassis 300, the distance between the display panel 200 and the operation substrate 803 is large, so that heat is less likely to be transmitted to the display panel 200.

[0034] In Embodiment 3, the case where there is one operation substrate 803 is exemplified. However, the display device 100 of the present disclosure may have, for example, a plurality of operation substrates 803 each having the above-described various electric circuits, and these plurality of operation substrates 803 may be provided in the space between the second inner surface 401 and the first inner surface 301 of the second region 320. The operation substrate 803 is attached to the second inner surface 401 or the first inner surface 301 via, for example, a spacer (not shown). Further, in Embodiment 3, the operation substrate 803 is disposed below the display substrate 801. However, the present disclosure is not limited to the above-described configuration. For example, the operation substrate 803 may be disposed between the connection substrate 802 and the second inner surface 401, or may be disposed between the display substrate 801 and the first inner surface 301.

[0035] In Embodiments 1 to 3, the configuration in which one second region 320 is disposed below the display device 100 is exemplified. However, the present disclosure is not limited to the above-described configuration. For example, the second region 320 may be disposed above, on the left side, or on the right side of the display device 100, or a plurality of second regions 320 may be disposed on the upper, lower, left, and right sides of the display device 100.

[0036] Note that the present disclosure is not limited to the configurations of the above-described embodiments and modification examples, and may be replaced with a configuration that is substantially the same as the configuration shown in the above-described embodiments and modification examples, a configuration that exhibits the same operational effects, or a configuration that can achieve the same object.

Description of Reference Numerals

[0037] 100: Display device 200: Display panel 201: Display surface 202: Back surface 210: Light-emitting element 300: Back chassis 301: First inner surface 310: First region 320: Second region 330: Opening 400: Front cover 401: Second inner surface 500: Driving element (heat-generating member) 600: Adjacent member 601: Base material 602: Adhesive layer 700: Heat dissipation member 801: Display substrate 802: Connection substrate 803: Operation substrate

Claims

1. A display panel having a display surface for displaying an image, a back chassis provided on the back side of the display panel, an adhesive member that adheres the display panel and the back chassis and forms a gap between the display panel and the back chassis, and a heating member provided on a side farther from the center of the display surface than the adhesive member. A display device comprising the same.

2. The display device according to claim 1, wherein the heating member is provided below the display panel.

3. a display substrate for inputting a signal to the display panel, and a connection substrate that electrically connects the display panel and the display substrate. The display device according to claim 1, wherein the heating member is provided on the connection substrate.

4. The display device according to claim 1, wherein the heating member is in contact with the back chassis.

5. The display device according to claim 1, further comprising a heat dissipation member provided between the heating member and the back chassis.

6. The display device according to claim 1, having an opening formed in the back chassis on a side farther from the center of the display surface than the adhesive member.

7. The display device according to claim 1, wherein the display panel includes an organic electroluminescence element.

Images