Substrate transfer robot, abnormal detection method and program

Abstract

To provide a semiconductor manufacturing device system capable of detecting abnormalities in semiconductor manufacturing devices that perform at least one of transferring, processing, and storing substrates.SOLUTION: A substrate processing system 100 (semiconductor manufacturing device system) comprises: a substrate holding hand 30 that holds a substrate 10; an imaging unit 60 that captures images of at least components of a processing device 103 in order to detect abnormalities in the processing device 103, which performs at least one of transferring, processing, and storing the substrate 10; and a control unit that detects abnormalities in the components of the processing device 103 based on images captured by the imaging unit 60.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This disclosure relates to a semiconductor manufacturing apparatus system, and more particularly, to a semiconductor manufacturing apparatus system including a substrate holding hand.

Background Art

[0002] Conventionally, a thin substrate transfer robot including a hand for holding a substrate has been known. For example, refer to Patent Document 1.

[0003] Patent Document 1 discloses a thin substrate transfer robot that unloads a thin substrate from a storage cassette. The thin substrate transfer robot includes a first arm and a second arm that rotate in a horizontal plane, and a fork attached to the second arm. The fork is a mechanical hand for placing the thin substrate. The thin substrate transfer robot described in Patent Document 1 includes a camera that detects the storage state of the thin substrate in the storage cassette for inspecting whether the thin substrate is stored in the correct posture in the cassette.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Here, in a semiconductor manufacturing apparatus that performs at least one of transporting, processing, and storing a substrate with respect to a substrate, if there is an abnormality in the storage unit that stores the substrate, it becomes difficult to transport the substrate to the storage unit. Further, not limited to the storage unit, if there is an abnormality in the semiconductor manufacturing apparatus, it is considered that the transportation, processing, and storage of the substrate become difficult. However, in the thin substrate transfer robot of Patent Document 1 described above, the camera that detects the substrate in the storage cassette is not configured to photograph the components of the semiconductor manufacturing apparatus, and thus cannot detect an abnormality in the semiconductor manufacturing apparatus. Therefore, it is desired to detect an abnormality in a semiconductor manufacturing apparatus that performs at least one of transporting, processing, and storing a substrate.

[0006] This disclosure has been made to solve the above-described problems, and one object of this disclosure is to provide a semiconductor manufacturing apparatus system capable of detecting an abnormality in a semiconductor manufacturing apparatus that performs at least one of transporting, processing, and storing a substrate.

Means for Solving the Problems

[0007] A semiconductor manufacturing apparatus system according to a first aspect of this disclosure includes a substrate holding hand that holds a substrate, an imaging unit that images at least components of a semiconductor manufacturing apparatus in order to detect an abnormality in the semiconductor manufacturing apparatus that performs at least one of transporting, processing, and storing the substrate, a substrate transfer robot that transfers the substrate held by the substrate holding hand to the semiconductor manufacturing apparatus by moving the substrate holding hand, and a control unit that detects an abnormality in the components of the semiconductor manufacturing apparatus to which the substrate is transferred by the substrate transfer robot based on the captured image captured by the imaging unit. The control unit detects an abnormality including a shape change in at least the components of the semiconductor manufacturing apparatus based on the captured image captured by the imaging unit. A semiconductor manufacturing apparatus system according to a second aspect of this disclosure includes a substrate holding hand that holds a substrate, an imaging unit that captures at least components of a semiconductor manufacturing apparatus to detect an abnormality of the semiconductor manufacturing apparatus that performs at least one of transfer, processing, and storage of the substrate, and a control unit that detects an abnormality of the components of the semiconductor manufacturing apparatus based on a captured image captured by the imaging unit. The control unit detects an abnormality including at least one of a shape change in the components of the semiconductor manufacturing apparatus and detection of a foreign object lacking a component of the semiconductor manufacturing apparatus based on the captured image captured by the imaging unit. The imaging unit captures components of the semiconductor manufacturing apparatus that are a storage unit for storing the substrate in the semiconductor manufacturing apparatus. The control unit detects an abnormality of the storage unit based on the captured image.

[0008] A semiconductor manufacturing apparatus system according to the first and second aspects of this disclosure includes, as described above, an imaging unit that captures at least components of a semiconductor manufacturing apparatus to detect an abnormality of the semiconductor manufacturing apparatus that performs at least one of transfer, processing, and storage of the substrate, and a control unit that detects an abnormality of the components of the semiconductor manufacturing apparatus based on a captured image captured by the imaging unit. Thereby, by capturing at least components of the semiconductor manufacturing apparatus to detect an abnormality of the semiconductor manufacturing apparatus, a captured image for detecting an abnormality of the semiconductor manufacturing apparatus can be obtained. As a result, based on the obtained captured image, an abnormality of the semiconductor manufacturing apparatus that performs at least one of transfer, processing, and storage of the substrate can be detected.

Effects of the Invention

[0009] According to the present disclosure, an abnormality of a semiconductor manufacturing apparatus that performs at least one of transfer, processing, and storage of a substrate can be detected.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present disclosure embodying the present disclosure will be described with reference to the drawings.

[0012] [First Embodiment] With reference to FIGS. 1 to 10, the configuration of a substrate processing system 100 according to the first embodiment will be described. Note that the substrate processing system 100 is an example of a semiconductor manufacturing apparatus system.

[0013] As shown in FIG. 1, the substrate processing system 100 includes a substrate transfer robot 101, a storage container 102, a plurality of processing apparatuses 103, a display device 104, and a control device 105. The substrate processing system 100 performs processing on a substrate 10 such as a semiconductor wafer or a printed circuit board. In the substrate processing system 100, processing is performed on a plurality of substrates 10 stored in the storage container 102. Also, the storage container 102 may store the substrates 10 on which the processing has been completed. The substrate 10 has, for example, a substantially disk shape and is stored vertically in the storage container 102. The processing apparatus 103 performs processing such as resist coating or etching on the substrate 10. Note that the storage container 102 is an example of a semiconductor manufacturing apparatus and a storage unit. Also, the processing apparatus 103 is an example of a semiconductor manufacturing apparatus.

[0014] The display device 104 displays information indicating the state of the substrate processing system 100. Specifically, the display device 104 displays information indicating the operating states of the plurality of processing apparatuses 103 and the operating state of the substrate transfer robot 101. The display device 104 has, for example, a liquid crystal display. The control device 105 is a higher-level control device that controls the entire substrate processing system 100. The control device 105 outputs signals for operating the plurality of processing apparatuses 103 and the substrate transfer robot 101. The control device 105 is, for example, a computer having a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory).

[0015] As shown in FIG. 2, the substrate transfer robot 101 transfers the substrate 10. The substrate transfer robot 101 performs at least one of carrying out the substrate 10 from the processing apparatus 103 that processes the substrate 10 and carrying in the substrate 10 to the processing apparatus 103. Also, the substrate transfer robot 101 performs at least one of carrying out the substrate 10 from the storage container 102 for storing the substrate 10 and carrying in the substrate 10 to the storage container 102. The processing apparatus 103 has a storage unit 20 that stores a plurality of substrates 10. For example, the substrate transfer robot 101 transfers the substrate 10 stored in the storage container 102 to the storage unit 20 in one of the plurality of processing apparatuses 103. Then, the substrate transfer robot 101 transfers the substrate 10 for which processing has been completed in one processing apparatus 103 from the storage unit 20 of the one processing apparatus 103 to the storage unit 20 of another processing apparatus 103 among the plurality of processing apparatuses 103. Note that the storage unit 20 is an example of a component of a semiconductor manufacturing apparatus.

[0016] As shown in FIG. 3, the substrate transfer robot 101 includes a substrate holding hand 30, an arm unit 40, and a lifting mechanism unit 50. The substrate holding hand 30 includes a blade 31 and a blade support portion 32. The arm unit 40 and the lifting mechanism unit 50 are moving mechanisms that move the substrate holding hand 30 in order to transfer the substrate 10.

[0017] The blade 31 has the substrate 10 placed thereon. Specifically, the blade 31 is a thin plate-shaped support plate that supports the substrate 10. The blade 31 has a shape in which the tip is bifurcated. Also, the blade 31 supports the back surface of the outer peripheral edge portion of the substantially disk-shaped substrate 10 from the lower side in the vertical direction. One substrate 10 is placed on each blade 31. The blade support portion 32 supports the blade 31. Specifically, the blade support portion 32 supports the base end of the blade 31.

[0018] The arm part 40 is a horizontal articulated robot arm. That is, the substrate transfer robot 101 is a horizontal articulated robot. At the tip of the arm part 40, a substrate holding hand 30 is attached. The blade support part 32 of the substrate holding hand 30 is connected to the arm part 40 so as to be rotatable along the horizontal direction. The arm part 40 includes a first part 41 and a second part 42 which are two links. The first part 41 and the second part 42 are connected to each other so as to be rotatable along the horizontal direction. One end of the first part 41 of the arm part 40 is connected to the substrate holding hand 30, and the other end is connected to the second part 42.

[0019] The arm part 40 is connected to the lifting mechanism part 50. Specifically, one end of the second part 42 of the arm part 40 is connected to the first part 41, and the other end is connected to the lifting shaft 51 of the lifting mechanism part 50 so as to be rotatable along the horizontal direction. The lifting mechanism part 50 moves the arm part 40 up and down by moving the lifting shaft 51 along the vertical direction. In the lifting mechanism part 50, the lifting shaft 51 is arranged so as to extend along the vertical direction. The lifting mechanism part 50 moves the substrate holding hand 30 up and down by moving the arm part 40 up and down.

[0020] The arm part 40 and the lifting mechanism part 50 have a servo motor as a drive source. Further, rotation position sensors such as encoders for detecting the rotation position of the output shaft of the servo motor are arranged in the arm part 40 and the lifting mechanism part 50. The arm part 40 and the lifting mechanism part 50 operate by control processing by a control part 70 described later.

[0021] The substrate transfer robot 101 is provided with a photographing unit 60. The photographing unit 60 is disposed on the blade support portion 32. Specifically, the photographing unit 60 is disposed on the upper side in the vertical direction in the blade support portion 32. That is, the photographing unit 60 is disposed on the upper side in the vertical direction than the blade 31. Further, the photographing unit 60 is disposed so as to be located above the mounting surface on which the substrate 10 is mounted on the blade 31. The photographing unit 60 moves integrally with the blade support portion 32. That is, the photographing unit 60 moves integrally with the blade support portion 32 by the operations of the arm portion 40 and the elevating mechanism portion 50.

[0022] As shown in FIG. 4, in the first embodiment, the photographing unit 60 photographs at least the components of the storage container 102 and the processing device 103 in order to detect abnormalities of the storage container 102 and the processing device 103. The components of the storage container 102 are, for example, protruding members on which the substrate 10 is placed in the storage container 102. The components of the processing device 103 are devices such as the storage unit 20 in the processing device 103, and consumables. The captured image P captured by the photographing unit 60 is output to the control unit 70. The photographing unit 60 is composed of, for example, a two-dimensional camera having a plurality of imaging elements such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). Note that the photographing unit 60 may be composed of a three-dimensional camera.

[0023] As shown in FIG. 1, the substrate transfer robot 101 is provided with a control unit 70 and a communication unit 80. The control unit 70 controls the operation of the substrate transfer robot 101. The control unit 70 is, for example, a computer having a CPU, a RAM, and a ROM. Further, the control unit 70 has a storage device including a flash memory such as an SSD (Solid State Drive). The control unit 70 controls the operations of the respective parts of the substrate transfer robot 101 based on programs and parameters stored in advance in the storage device.

[0024] The communication unit 80 communicates with each of the plurality of processing devices 103. Further, the communication unit 80 communicates with the upper control device 105. The communication unit 80 includes a communication module that performs communication via a LAN (Local Area Network) or the like. That is, the control unit 70 communicates with the outside of the substrate transfer robot 101 via the communication unit 80.

[0025] (Detection of Abnormality) Next, with reference to FIGS. 4 to 10, the detection of abnormalities in the components of the storage container 102 and the processing device 103 by the control unit 70 will be described.

[0026] In the first embodiment, the control unit 70 detects abnormalities in the components of the storage container 102 and the processing device 103 based on the captured image P captured by the imaging unit 60. That is, the control unit 70 performs an image analysis process on the captured image P captured by the imaging unit 60, thereby performing a process of detecting abnormalities in the components such as the members included in the storage container 102 and the components such as the devices constituting the processing device 103.

[0027] The control unit 70 causes the imaging unit 60 to perform imaging at predetermined intervals set in advance. The control unit 70 performs imaging of a plurality of preset imaging targets, for example, in a maintenance process that is periodically performed at preset predetermined periods such as once a day. Then, in the maintenance process, the control unit 70 operates the arm unit 40 and the lifting mechanism unit 50 to change the position of the imaging unit 60 and image a plurality of components in the storage container 102 and the processing device 103 as inspection targets. Further, even when the inspection target is not included in the transfer path of the substrate 10, the control unit 70 controls the operations of the arm unit 40 and the lifting mechanism unit 50 to move the blade support unit 32 so that the imaging unit 60 is disposed at a position where the inspection target is imaged.

[0028] As shown in FIG. 4, for example, the imaging unit 60 images the storage unit 20, which is a component of the processing device 103, under the control of the control unit 70. Then, the control unit 70 detects an abnormality in the storage unit 20. When an abnormality in the storage unit 20 is detected, the control unit 70 first images the entire storage unit 20. At this time, if the size of the storage unit 20 in the vertical direction is larger than the field of view of the imaging unit 60, the control unit 70 operates the elevating mechanism unit 50 to move the imaging unit 60 in the vertical direction and performs multiple imaging operations with the imaging unit 60.

[0029] As shown in FIG. 5, the control unit 70 detects an abnormality in the shape change of the storage container 102 and the components of the processing device 103 based on the captured image P. For example, the control unit 70 performs image analysis based on the captured image P of the storage unit 20 to detect an abnormality in the shape change in the storage unit 20.

[0030] The storage unit 20 of the processing device 103 has a plurality of substrate mounting portions 21 on which the substrates 10 are placed. The substrate mounting portions 21 protrude horizontally so that the substrates 10 can be placed thereon. In the storage unit 20, the plurality of substrates 10 are arranged vertically at a predetermined interval from each other.

[0031] Here, the substrate mounting portions 21 of the storage unit 20 deteriorate due to repeated use. Specifically, as shown in the portion P10 of FIG. 5, abnormalities such as defects or cracks may occur in the substrate mounting portions 21. In this case, abnormalities such as misalignment may occur in the substrates 10 stored in the storage unit 20.

[0032] Therefore, as shown in FIG. 6, the control unit 70 detects an abnormality in the components of the processing device 103 by comparing a preset reference image Pa with a captured image P captured by the imaging unit 60. When detecting an abnormality in the substrate placement unit 21, the imaging unit 60 captures the substrate placement unit 21 in a state where the substrate 10 is not placed. That is, the captured image P and the reference image Pa of the substrate placement unit 21 in a state where the substrate 10 is not placed are captured. The reference image Pa is captured by the imaging unit 60 and stored in the storage device by the control unit 70, for example, each time the storage unit 20 is replaced. The reference image Pa may also be a captured image P captured during a previous maintenance process. The control unit 70 detects an abnormal portion in the captured image P by performing, for example, pattern matching processing using the reference image Pa as a template. The control unit 70 detects an abnormality in the substrate placement unit 21 in a state where the substrate 10 is not placed based on the captured image P of the substrate placement unit 21 in a state where the substrate 10 is not placed. In the reference image Pa of FIG. 6, no abnormality of a defect occurs in the portion P10 of the captured image P of FIG. 5. The control unit 70 stores the control amounts of the arm unit 40 and the lifting mechanism unit 50 at the time when the reference image Pa is captured in association with the reference image Pa, thereby storing the position coordinates of the imaging unit 60 at the time when the reference image Pa is captured. Then, when detecting an abnormality, the control unit 70 captures the captured image P in a state where the imaging unit 60 is moved to the position coordinates equal to those of the reference image Pa, and compares the reference image Pa and the captured image P having equal position coordinates of the imaging unit 60, thereby detecting a portion whose shape has changed from the reference image Pa as an abnormality of a shape change in the components of the processing device 103.

[0033] Also, as shown in FIG. 7, misalignment abnormalities may occur in the components of the storage container 102 and the processing device 103. For example, in the storage unit 20, misalignment abnormalities may occur. When a misalignment abnormality occurs in the storage unit 20, the substrate 10 cannot be stored normally. As shown in the portion P20 of FIG. 7, the control unit 70 detects a misalignment abnormality in the storage unit 20 based on the captured image P. Specifically, similar to the detection of shape change abnormalities, the control unit 70 compares a preset reference image Pa with the captured image P to detect a misalignment abnormality in the storage unit 20. That is, the control unit 70 detects a misalignment abnormality in the storage unit 20 when the position of the storage unit 20 has changed since the reference image Pa was captured.

[0034] Also, as shown in FIG. 8, foreign object detection abnormalities may occur in the components of the storage container 102 and the processing device 103. For example, in the storage unit 20, fragments of the missing substrate placement portion 21 may become foreign objects. As shown in the portion P30 of FIG. 8, the control unit 70 detects foreign object detection as an abnormality based on the captured image P. Specifically, similar to the shape change and misalignment abnormalities, the control unit 70 compares a preset reference image Pa with the captured image P to detect foreign objects.

[0035] Note that when the control unit 70 captures an image of a component of the processing device 103 for abnormality detection, the imaging unit 60 is brought close to the inspection target. That is, the blade support portion 32 is brought close to the inspection target so that the imaging unit 60 is close to the component of the processing device 103 that is the inspection target.

[0036] When an abnormality is detected in the components of the storage container 102 and the processing device 103 that are the inspection targets, the control unit 70 outputs an abnormality detection signal indicating that an abnormality has been detected in the components of the storage container 102 and the processing device 103. Then, when an abnormality in the components of the storage container 102 and the processing device 103 is detected by the control unit 70, the communication unit 80 outputs the abnormality detection signal to the outside of the substrate transfer robot 101. For example, the control unit 70 outputs the abnormality detection signal to the upper control device 105 via the communication unit 80. Note that the control unit 70 may output the abnormality detection signal to the processing device 103.

[0037] As shown in FIG. 9, for example, based on the abnormality detection signal output from the control unit 70, the control device 105 causes the display device 104 of the substrate processing system 100 to display an abnormality detection display 104a indicating that an abnormality has been detected. FIG. 9 shows an example in which an abnormality in the storage unit 20 is detected in one of the plurality of processing devices 103. The abnormality detection display 104a includes a display indicating the type of the detected abnormality. Also, in the substrate processing system 100, when an abnormality detection signal is output, the operations of the substrate transfer robot 101 and the processing device 103 may be stopped. Further, the control unit 70 may store the captured image P in which the abnormality is detected in the storage device. In this case, a plurality of captured images P including the captured image P in which the abnormality is detected may be stored as a moving image.

[0038] Also, as shown in FIG. 10, the control unit 70 detects signs of abnormality in the components of the storage container 102 and the processing device 103 based on the captured image P. That is, the control unit 70 detects abnormalities that are expected to occur in the components of the storage container 102 and the processing device 103. Specifically, the control unit 70 detects signs of abnormality by comparing the reference image Pa and the captured image P. For example, the substrate mounting portion 21 of the storage unit 20 may gradually wear due to repeated use. Therefore, the shape change of the substrate mounting portion 21 may gradually progress. When the control unit 70 detects an abnormality in the shape change of the substrate mounting portion 21 by comparing the reference image Pa and the captured image P, the control unit 70 detects the degree of the shape change and detects signs of abnormality according to the degree of the shape change. For example, the control unit 70 detects a relatively small degree of shape change as a sign of abnormality. Then, the control unit 70 outputs an abnormality sign detection signal indicating that an abnormality sign has been detected to the upper control device 105 via the communication unit 80. Based on the abnormality sign detection signal output from the control unit 70, the control device 105 causes the display device 104 of the substrate processing system 100 to display an abnormality sign detection display 104b indicating that an abnormality sign has been detected. FIG. 10 shows an example in which a sign of an abnormality that is predicted to occur in the storage unit 20 is detected in one of the plurality of processing devices 103. The abnormality sign detection display 104b includes a display indicating the type of the detected abnormality sign. Also, based on the abnormality sign detection signal output from the control unit 70, the control device 105 causes the display device 104 of the substrate processing system 100 to display a life display 104c indicating the timing at which an abnormality is predicted to occur. When an abnormality sign is detected, the control unit 70 predicts the period until an abnormality occurs. In other words, when an abnormality sign is detected, the control unit 70 predicts the life of the component in which the abnormality sign has been detected. Note that the predicted timing in the life display 104c includes the date, elapsed time, number of uses, and the like. For example, the control unit 70 predicts the period until an abnormality occurs based on the comparison degree by comparing the reference image Pa and the captured image P.Then, based on the period until the predicted abnormality occurs, the control unit 70 outputs an abnormality sign detection signal including information indicating the lifespan, which is the predicted timing. The control unit 70 detects an abnormality and signs of an abnormality based on, for example, a threshold value stored in advance in the storage device.

[0039] (Abnormality Detection Method) Next, with reference to FIG. 11, an abnormality detection method for the processing device 103 will be described. The control process of this abnormality detection method is periodically executed in a maintenance process at predetermined intervals such as once a day as described above. The control process of the abnormality detection method is executed by the control unit 70. Note that the abnormality detection method for semiconductor manufacturing devices such as the storage container 102 other than the processing device 103 is the same.

[0040] First, in step S1, in order to detect an abnormality in the processing device 103, at least the components of the processing device 103 are photographed by the photographing unit 60. For example, the storage unit 20 in a state where the substrate 10 is not placed is photographed. Also, when the processing device 103 has a plurality of storage units 20, each of the plurality of storage units 20 is photographed. Further, photographing is performed for each storage unit 20 of each of the plurality of processing devices 103. Then, a photographed image P is acquired by the photographing by the photographing unit 60.

[0041] Next, in step S2, based on the photographed image P, an abnormality in the components of the processing device 103 is detected. Specifically, an abnormality in the components of the processing device 103 is detected by comparing a preset reference image Pa with the photographed image P acquired in step S1. Note that when there are a plurality of components of the processing device 103 as inspection targets, a plurality of types of reference images Pa are preset and stored so as to correspond to each of the plurality of inspection targets.

[0042] Next, in step S3, it is determined whether an abnormality has been detected in the components of the processing device 103. If an abnormality is detected in the components of the processing device 103, the process proceeds to step S4. If no abnormality is detected in the inspection target, the process proceeds to step S5.

[0043] In step S4, based on the detected abnormality, an abnormality detection signal indicating that an abnormality has been detected is output. The abnormality detection signal is transmitted, for example, to the upper control device 105 of the substrate processing system 100 via the communication unit 80. Then, the control device 105 displays an abnormality detection display 104a indicating that an abnormality has been detected on the display device 104.

[0044] In step S5, based on the captured image P, it is determined whether signs of an abnormality that are expected to occur in the components of the processing device 103 have been detected. If signs of an abnormality are detected, the process proceeds to step S6. If no signs of an abnormality are detected, the control process of the abnormality detection method ends.

[0045] In step S6, an abnormality sign detection signal indicating that signs of an abnormality have been detected is output. The abnormality sign detection signal is transmitted, for example, to the upper control device 105 of the substrate processing system 100 via the communication unit 80. Then, the control device 105 displays an abnormality sign detection display 104b and a life display 104c indicating that signs of a predicted abnormality have been detected on the display device 104.

[0046] [Effects of the First Embodiment] In the first embodiment, the following effects can be obtained.

[0047] The substrate processing system 100 includes an imaging unit 60 that captures at least the components of the storage container 102 and the processing device 103 to detect abnormalities in the storage container 102 and the processing device 103 that perform at least one of conveyance, processing, and storage of the substrate 10, and a control unit 70 that detects abnormalities in the components of the storage container 102 and the processing device 103 based on the captured image P captured by the imaging unit 60. Thereby, by capturing at least the components of the storage container 102 and the processing device 103 to detect abnormalities in the storage container 102 and the processing device 103, a captured image P for detecting abnormalities in the storage container 102 and the processing device 103 can be obtained. As a result, based on the obtained captured image P, abnormalities in the semiconductor manufacturing apparatus that performs at least one of conveyance, processing, and storage of the substrate 10 can be detected.

[0048] Based on the captured image P, the control unit 70 detects an abnormality including at least one of a shape change in the components of the storage container 102 and the processing device 103, a displacement of the components of the storage container 102 and the processing device 103, and detection of foreign matter. Thereby, at least one abnormality among a shape change, a displacement, and detection of foreign matter in the components of the storage container 102 and the processing device 103 can be detected. Therefore, it is possible to suppress an abnormality from occurring in the conveyance or processing of the substrate 10 due to at least one of a shape change, a displacement, and foreign matter in the components.

[0049] The substrate holding hand 30 includes a blade 31 on which the substrate 10 is placed and a blade support portion 32 that supports the blade 31. The imaging unit 60 is disposed on the blade support portion 32. Thus, since the imaging unit 60 is disposed on the blade support portion 32 of the substrate holding hand 30 that holds the substrate 10, the imaging unit 60 can be moved by a configuration in which the substrate holding hand 30 is moved for transporting the substrate 10. Therefore, when there are a plurality of components of the storage container 102 and the processing device 103 that are inspection targets, or when the components of the storage container 102 and the processing device 103 that are inspection targets are larger than the field of view of the imaging unit 60, the imaging unit 60 can be moved by a configuration in which the substrate holding hand 30 is moved. Thereby, unlike the case where a configuration for moving only the imaging unit 60 is separately provided, it is possible to suppress the complication of the apparatus configuration. Further, since the imaging unit 60 is disposed not on the blade 31 on which the substrate 10 is placed but on the blade support portion 32 that supports the blade 31, it is possible to prevent the imaging unit 60 from physically interfering with the substrate 10 when the substrate 10 is placed on the blade 31.

[0050] The imaging unit 60 images the components of the processing device 103, which is the storage unit 20 that stores the substrate 10 in the processing device 103, and the control unit 70 detects an abnormality in the storage unit 20 based on the captured image P. Thereby, an abnormality in the storage unit 20 can be detected. Therefore, it is possible to suppress an abnormality from occurring in the transportation of the substrate 10 to the processing device 103 due to an abnormality in the storage unit 20.

[0051] The storage unit 20 includes a substrate placement unit 21 on which the substrate 10 is placed. The imaging unit 60 images the substrate placement unit 21 with the substrate 10 not placed thereon. The control unit 70 detects an abnormality in the substrate placement unit 21 with the substrate 10 not placed thereon based on the captured image P. Here, when an abnormality occurs in the substrate placement unit 21 of the storage unit 20, it becomes difficult to accurately store the substrate 10 in the storage unit 20. In that case, it is considered that an abnormality may occur in the processing of the substrate 10 by the processing device 103. On the other hand, in the first embodiment, the imaging unit 60 images the substrate placement unit 21 with the substrate 10 not placed thereon, and the control unit 70 detects an abnormality in the substrate placement unit 21 with the substrate 10 not placed thereon based on the captured image P. Therefore, since an abnormality in the substrate placement unit 21 can be detected, it is possible to effectively suppress an abnormality from occurring in the transfer of the substrate 10 to the processing device 103 and in the processing of the substrate 10 by the processing device 103. Further, unlike the case of imaging the substrate placement unit 21 with the substrate 10 placed thereon, by imaging the substrate placement unit 21 with the substrate 10 not placed thereon, it is possible to suppress the substrate placement unit 21 from being hidden by the substrate 10 in the captured image P. Therefore, an abnormality in the substrate placement unit 21 can be detected more accurately.

[0052] The control unit 70 detects an abnormality in the components of the storage container 102 and the processing device 103 by comparing a preset reference image Pa with the captured image P captured by the imaging unit 60. Thereby, by comparing the reference image Pa with the captured image P, a portion different from the reference image Pa in the captured image P can be easily detected. Therefore, a portion different from the reference image Pa in the captured image P can be easily detected as an abnormality.

[0053] When an abnormality in a component of the storage container 102 and the processing apparatus 103 is detected by the control unit 70, the substrate processing system 100 includes a communication unit 80 that outputs an abnormality detection signal indicating that an abnormality in a component of the storage container 102 and the processing apparatus 103 has been detected. Thereby, in a notification unit such as a display device 104 different from the control unit 70, an operator can be notified that an abnormality has been detected. Therefore, when an abnormality occurs, the operator can easily recognize that an abnormality has occurred, so that it is possible to suppress using the storage container 102 and the processing apparatus 103 while an abnormality is occurring.

[0054] Based on the captured image P, the control unit 70 detects a sign of an abnormality in a component of the storage container 102 and the processing apparatus 103, and predicts a period until an abnormality occurs. Thereby, since a sign of an abnormality can be detected, before an abnormality that requires stopping the use of the storage container 102 and the processing apparatus 103 occurs, for the component in which a sign of an abnormality has been detected, during a time period other than when the storage container 102 and the processing apparatus 103 are in use, corresponding measures such as repair or replacement can be taken. Therefore, it is possible to suppress an abnormality from occurring during the use of the storage container 102 and the processing apparatus 103, so that it is possible to suppress at least one of conveyance, processing, and storage of the substrate 10 from being interrupted. As a result, it is possible to suppress an increase in the time required for at least one of conveyance, processing, and storage of the substrate 10.

[0055] The control unit 70 detects an abnormality in a component of the storage container 102 and the processing apparatus 103 based on the captured image P captured at predetermined intervals. Thereby, since an abnormality in a component of the storage container 102 and the processing apparatus 103 can be detected periodically at predetermined intervals, it is possible to effectively suppress using the storage container 102 and the processing apparatus 103 while an abnormality is occurring.

[0056] [Second Embodiment] Next, with reference to FIGS. 12 and 13, the configuration of the substrate processing system 200 according to the second embodiment of the present disclosure will be described. In this second embodiment, when an abnormality in the storage unit 20 is detected, the state of the substrate 10 is detected. Note that, for the same configuration as that in the first embodiment, the same reference numerals are given and the description thereof is omitted.

[0057] As shown in FIG. 12, the substrate processing system 200 of the second embodiment includes a substrate transfer robot 201. The substrate transfer robot 201 also includes a control unit 270. The hardware configuration of the control unit 270 is the same as that of the control unit 70 in the first embodiment. That is, the hardware configuration of the substrate transfer robot 201 is the same as that of the substrate transfer robot 101 in the first embodiment. Note that the substrate processing system 200 is an example of a semiconductor manufacturing apparatus system.

[0058] Similar to the control unit 70 in the first embodiment, the control unit 270 detects an abnormality in the components of the storage container 102 and the processing apparatus 103 based on the captured image P captured by the imaging unit 60. For example, similar to the first embodiment, the control unit 270 compares a preset reference image Pa with the captured image P of the storage unit 20 to detect an abnormality in the storage unit 20, which is a component of the processing apparatus 103.

[0059] As shown in FIG. 13, in the second embodiment, when an abnormality in the storage unit 20 is detected, the control unit 270 detects the state of the substrate 10 stored in the storage unit 20 based on the captured image P.

[0060] For example, when the control unit 270 conveys the substrates 10 one by one from the storage container 102 to the storage unit 20 of the processing apparatus 103, it detects an abnormality in the storage unit 20 at the conveyance destination. The control unit 270 detects an abnormality in the substrate placement unit 21 of the storage unit 20 at the conveyance destination each time one substrate 10 is conveyed, or each time a predetermined number of substrates are conveyed. At this time, as the reference image Pa, for each detection of an abnormality, the captured image P captured in the previous detection of an abnormality may be used as the reference image Pa. Then, when an abnormality is detected in the storage unit 20 while the substrate 10 is being conveyed, the control unit 270 outputs an abnormality detection signal in the same manner as in the first embodiment. The portion P210 indicated by the dashed-dotted line in FIG. 13 shows an abnormality in which one of the substrate placement units 21 of the storage unit 20 is missing.

[0061] When an abnormality in the storage unit 20 is detected, the control unit 270 detects the state of the substrates 10 already stored in the storage unit 20. The portion P220 indicated by the dotted line in FIG. 13 shows the detection of the substrate 10 in the storage unit 20. When an abnormality in the storage unit 20 is detected, the control unit 270 detects the storage state including the arrangement position and shape of the substrate 10 as the state of the substrates 10 stored in the storage unit 20.

[0062] Then, based on the detected state of the substrate 10, the control unit 270 operates the arm unit 40 and the lifting mechanism unit 50 to move the substrate holding hand 30, thereby carrying out the substrate 10 stored in the storage unit 20 from the storage unit 20. For example, when the substrate placement unit 21 is missing, the substrate 10 is stored in a tilted state as shown in FIG. 13. That is, due to an abnormality in the storage unit 20, the storage state of the substrate 10 may be different from normal. The control unit 270 moves the substrate holding hand 30 based on the detected state of the substrate 10, thereby carrying out the substrate 10 in an abnormal state from the storage unit 20. In other words, the control unit 270 detects the state of the substrate 10 to rescue the substrate 10 in which an abnormality in the storage state is detected from the storage unit 20. The control unit 270 carries out the substrate 10 by moving the substrate holding hand 30 so as not to interfere with the substrate 10 based on the detected state of the substrate 10. After carrying out the substrate 10 in an abnormal storage state, the control unit 270 may continue the conveyance operation of the substrate 10 while avoiding the portion of the storage unit 20 in which the abnormality is detected, or may stop the conveyance operation of the substrate 10. Further, even when an abnormality in the storage unit 20 is detected, the control unit 270 continues the conveyance of the substrate 10 when the state of the substrate 10 is normal. That is, even when an abnormality in the storage unit 20 is detected, when the state of the substrate 10 is normal, the processing of the substrate 10 by the processing device 103 may be executed.

[0063] Note that other configurations of the second embodiment are the same as those of the first embodiment described above.

[0064] [Effects of the Second Embodiment] In the second embodiment, the following effects can be obtained.

[0065] When an abnormality in the storage unit 20 is detected, the control unit 270 detects the state of the substrate 10 stored in the storage unit 20 based on the captured image P. Here, due to an abnormality in the storage unit 20, the state of the substrate 10 stored in the storage unit 20 may be different from the normal state. In contrast, in the second embodiment, when an abnormality in the storage unit 20 is detected, in order to detect the state of the substrate 10 stored in the storage unit 20 based on the captured image P, for example, the substrate 10 stored in an inclined state from the normal state, or the substrate 10 stored in a stacked manner of two sheets, etc. can be carried out from the storage unit 20. Further, when an abnormality is detected in the storage unit 20, it is possible to confirm whether there is an abnormality in the state of the substrate 10 stored in the storage unit 20. Therefore, even when an abnormality is detected in the storage unit 20, if the state of the substrate 10 is normal, the processing in the processing device 103 can be continued, so that the interruption of the processing of the substrate 10 can be suppressed. Note that other effects according to the second embodiment are the same as those of the first embodiment.

[0066] [Modification Example] It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present disclosure is shown by the scope of claims rather than the description of the above-described embodiments, and further includes all changes (modification examples) within the meaning and scope equivalent to the scope of claims.

[0067] For example, in the above-described first and second embodiments, an example of detecting an abnormality including at least one of a shape change in the components of the storage container 102 and the processing device 103, a displacement of the components of the storage container 102 and the processing device 103, and detection of foreign matter based on the captured image P has been shown, but the present disclosure is not limited to this. In the present disclosure, the consumption of consumables such as electrodes or solutions used in the processing in the processing device may be detected as an abnormality.

[0068] In addition, in the above-described first and second embodiments, an example in which the imaging unit 60 is disposed on the blade support portion 32 of the substrate holding hand 30 has been shown, but the present disclosure is not limited thereto. In the present disclosure, the imaging unit may be disposed on an arm unit that moves the substrate holding hand. Further, the imaging unit may be disposed on a base unit to which the arm unit is connected.

[0069] In addition, in the above-described first and second embodiments, an example in which the imaging unit 60 is disposed above the blade support portion 32 in the vertical direction in the substrate holding hand 30 has been shown, but the present disclosure is not limited thereto. In the present disclosure, the imaging unit may be disposed laterally of the blade support portion. Further, the imaging unit may be disposed below the blade support portion.

[0070] In addition, in the above-described first and second embodiments, an example in which an abnormality in the storage unit 20 is detected as an abnormality in the components of the processing device 103 has been shown, but the present disclosure is not limited thereto. In the present disclosure, an abnormality in components such as devices of the processing device other than the storage unit may be detected. Further, an abnormality in a component of a storage container that stores the substrate instead of the processing device may be detected. Further, an abnormality in a transfer device that transfers the substrate may be detected.

[0071] In addition, in the above-described first embodiment, an example in which an abnormality in the substrate placement portion 21 in a state where the substrate 10 is not placed is detected by imaging the substrate placement portion 21 in a state where the substrate 10 is not placed has been shown, but the present disclosure is not limited thereto. In the present disclosure, an abnormality in the substrate placement portion in a state where the substrate is placed may be detected by imaging the substrate placement portion in a state where the substrate is placed. That is, an abnormality in the storage unit in a state where the substrate is stored may be detected. For example, when the substrate is transferred from the storage container to the storage unit of the processing device, an abnormality in the storage container in which the substrate before transfer is stored may be detected.

[0072] In the second embodiment described above, an example was shown in which when an abnormality in the storage unit 20 is detected, the state of the substrate 10 stored in the storage unit 20 is detected based on the captured image P. However, the present disclosure is not limited to this. In the present disclosure, instead of detecting the state of the substrate, an abnormality in only the components of the semiconductor manufacturing apparatus may be detected.

[0073] In the first and second embodiments described above, an example was shown in which an abnormality in the components of the storage container 102 and the processing apparatus 103 is detected by comparing a preset reference image Pa and the captured image P. However, the present disclosure is not limited to this. In the present disclosure, an abnormality in the components of the semiconductor manufacturing apparatus may be detected based on the captured image without using a reference image, based on preset parameters.

[0074] In the first and second embodiments described above, an example was shown in which a communication unit 80 that outputs an abnormality detection signal is provided. However, the present disclosure is not limited to this. In the present disclosure, the communication unit may not be provided.

[0075] In the first and second embodiments described above, an example was shown in which an abnormality in the components of the processing apparatus 103 is detected based on the captured image P captured at preset predetermined intervals. However, the present disclosure is not limited to this. In the present disclosure, a captured image may be captured based on an input operation by an operator, and an abnormality may be detected. Also, the preset predetermined interval may not be once a day, but once a week, once a month, etc. Also, the capturing of the captured image at each predetermined interval may not be at each predetermined period, but at each number of times such as a predetermined number of processing times or a number of conveyance times. Also, a captured image may be captured at the startup of the substrate processing system to detect an abnormality.

[0076] In the first and second embodiments described above, an example was shown in which one blade 31 is supported by the blade support portion 32. However, the present disclosure is not limited to this. In the present disclosure, the blade support portion may support a plurality of blades.

[0077] In addition, in the above-described first and second embodiments, an example in which one substrate holding hand 30 is disposed on the arm portion 40 has been shown. However, the present disclosure is not limited thereto. In the present disclosure, a plurality of substrate holding hands may be provided. In that case, the imaging unit may be disposed on at least one of the plurality of substrate holding hands. Further, when a plurality of substrate holding hands are provided, the imaging unit may be disposed on some of the plurality of substrate holding hands. That is, a plurality of blade support portions may be provided.

[0078] In addition, in the above-described first embodiment, an example in which the control unit 70 that controls the operation of the substrate transfer robot 101 executes a process of detecting an abnormality based on the captured image P has been shown. However, the present disclosure is not limited thereto. In the present disclosure, the substrate transfer robot may output the captured image as it is without performing a process of detecting an abnormality. In that case, the communication unit of the substrate transfer robot outputs the captured image captured by the imaging unit instead of an abnormality detection signal indicating that an abnormality has been detected. That is, a process of detecting an abnormality in the components of the processing apparatus based on the captured image may be executed by a control unit separate from the control unit that controls the operation of the substrate holding hand. For example, the control process for detecting an abnormality may be executed in a control device at a higher level of the substrate processing system. Further, the process of detecting an abnormality in the components of the processing apparatus based on the captured image may be executed in a remote control system disposed separately from the substrate processing system. That is, the semiconductor manufacturing apparatus system in the present disclosure may include the substrate processing system and the remote control system.

[0079] In addition, in the above-described first and second embodiments, an example in which an abnormality detection signal indicating that an abnormality has been detected is output when an abnormality is detected has been shown. However, in the present disclosure, a process of resolving the detected abnormality may be performed. For example, the component in which an abnormality has been detected may be replaced or repaired by the substrate transfer robot. Further, replenishment of consumables may be performed. Further, removal of the detected foreign matter may be performed.

[0080] The functions of the elements disclosed in this specification can be executed using circuitry or a processing circuit that includes a general-purpose processor, a dedicated processor, an integrated circuit, an ASIC (Application Specific Integrated Circuits), a conventional circuit, and / or a combination thereof, configured or programmed to perform the disclosed functions. Since a processor includes transistors and other circuits, it is regarded as a processing circuit or a circuit. In the present disclosure, a circuit, a unit, or a means is either hardware that performs the recited functions or hardware programmed to perform the recited functions. The hardware may be the hardware disclosed herein or other known hardware programmed or configured to perform the recited functions. When the hardware is a processor considered to be a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used for configuring the hardware and / or the processor.

[0081] [Aspect] Those skilled in the art will understand that the above-exemplified embodiments are specific examples of the following aspects.

[0082] (Item 1) A substrate holding hand for holding a substrate, An imaging unit that images at least the components of a semiconductor manufacturing apparatus to detect an abnormality in the semiconductor manufacturing apparatus that performs at least one of transporting, processing, and storing the substrate, A control unit that detects an abnormality in the components of the semiconductor manufacturing apparatus based on a captured image captured by the imaging unit, a semiconductor manufacturing apparatus system comprising the same.

[0083] (Item 2) The semiconductor manufacturing apparatus system according to Item 1, wherein the control unit detects an abnormality including at least one of a shape change in the components of the semiconductor manufacturing apparatus, a displacement in the position of the components of the semiconductor manufacturing apparatus, and detection of foreign matter, based on the captured image.

[0084] (Item 3) The substrate holding hand includes a blade on which the substrate is placed and a blade support portion that supports the blade. The photographing unit is arranged in the blade support portion, and is the semiconductor manufacturing apparatus system according to Item 1 or 2.

[0085] (Item 4) The photographing unit photographs a component of the semiconductor manufacturing apparatus which is a storage unit for storing the substrate in the semiconductor manufacturing apparatus. The control unit detects an abnormality of the storage unit based on the photographed image, and is the semiconductor manufacturing apparatus system according to any one of Items 1 to 3.

[0086] (Item 5) The storage unit includes a substrate placement portion on which the substrate is placed. The photographing unit photographs the substrate placement portion in a state where the substrate is not placed. The control unit detects an abnormality in the substrate placement portion in a state where the substrate is not placed based on the photographed image, and is the semiconductor manufacturing apparatus system according to Item 4.

[0087] (Item 6) When an abnormality of the storage unit is detected, the control unit detects the state of the substrate stored in the storage unit based on the photographed image, and is the semiconductor manufacturing apparatus system according to Item 4.

[0088] (Item 7) The control unit detects an abnormality of a component of the semiconductor manufacturing apparatus by comparing a preset reference image with the photographed image photographed by the photographing unit, and is the semiconductor manufacturing apparatus system according to any one of Items 1 to 6.

[0089] (Item 8) The semiconductor manufacturing apparatus system according to any one of items 1 to 7, further comprising a communication unit that outputs an abnormality detection signal indicating that an abnormality has been detected in a component of the semiconductor manufacturing apparatus when the control unit detects an abnormality in a component of the semiconductor manufacturing apparatus.

[0090] (Item 9) The semiconductor manufacturing apparatus system according to any one of items 1 to 8, wherein the control unit detects a sign of an abnormality in a component of the semiconductor manufacturing apparatus based on the captured image and predicts a period until an abnormality occurs.

[0091] (Item 10) The semiconductor manufacturing apparatus system according to any one of items 1 to 9, wherein the control unit detects an abnormality in a component of the semiconductor manufacturing apparatus based on the captured image captured at a preset predetermined interval.

Explanation of Signs

[0092] 10 Substrate 20 Storage unit (component of semiconductor manufacturing apparatus) 21 Substrate placement unit 30 Substrate holding hand 31 Blade 32 Blade support part 60 Imaging unit 70, 270 Control unit 80 Communication unit 100, 200 Substrate processing system (semiconductor manufacturing apparatus system) 102 Storage container (semiconductor manufacturing apparatus, storage unit) 103 Processing apparatus (semiconductor manufacturing apparatus)

Claims

1. A substrate holding hand for holding a substrate, An imaging unit that captures at least the components of a semiconductor manufacturing apparatus to detect an abnormality in the semiconductor manufacturing apparatus that performs at least one of conveyance, processing, and storage of the substrate, A substrate transfer robot that transfers the substrate held by the substrate holding hand to the semiconductor manufacturing apparatus by moving the substrate holding hand, A control unit that detects an abnormality in the components of the semiconductor manufacturing apparatus to which the substrate is transferred by the substrate transfer robot based on a captured image captured by the imaging unit, and The control unit detects an abnormality including at least a shape change in the components of the semiconductor manufacturing apparatus based on the captured image captured by the imaging unit, a semiconductor manufacturing apparatus system.

2. The substrate holding hand includes a blade on which the substrate is placed and a blade support portion that supports the blade, The imaging unit is disposed in the blade support portion, the semiconductor manufacturing apparatus system according to claim 1.

3. A substrate holding hand for holding a substrate, An imaging unit that captures at least the components of a semiconductor manufacturing apparatus to detect an abnormality in the semiconductor manufacturing apparatus that performs at least one of conveyance, processing, and storage of the substrate, A control unit that detects an abnormality in the components of the semiconductor manufacturing apparatus based on a captured image captured by the imaging unit, and The control unit detects an abnormality including at least one of a shape change in the components of the semiconductor manufacturing apparatus and detection of a foreign object lacking in the components of the semiconductor manufacturing apparatus based on the captured image captured by the imaging unit, The imaging unit captures the components of the semiconductor manufacturing apparatus that are a storage unit for storing the substrate in the semiconductor manufacturing apparatus, The control unit detects an abnormality in the storage unit based on the captured image, a semiconductor manufacturing apparatus system.

4. The storage unit includes a substrate placement portion on which the substrate is placed, The imaging unit captures the substrate placement portion in a state where the substrate is not placed, The control unit detects an abnormality in the substrate placement portion in a state where the substrate is not placed based on the captured image, the semiconductor manufacturing apparatus system according to claim 3.

5. When an abnormality in the storage unit is detected, the control unit detects the state of the substrate stored in the storage unit based on the captured image, the semiconductor manufacturing apparatus system according to claim 3.

6. The semiconductor manufacturing apparatus system according to claim 1, wherein the control unit detects an abnormality in a component of the semiconductor manufacturing apparatus by comparing a preset reference image with the captured image captured by the imaging unit.

7. The semiconductor manufacturing apparatus system according to claim 1, further comprising a communication unit that outputs an abnormality detection signal indicating that an abnormality in a component of the semiconductor manufacturing apparatus has been detected when the control unit detects an abnormality in a component of the semiconductor manufacturing apparatus.

8. The semiconductor manufacturing apparatus system according to claim 1, wherein the control unit detects a sign of an abnormality in a component of the semiconductor manufacturing apparatus based on the captured image and predicts a period until an abnormality occurs.

9. The semiconductor manufacturing apparatus system according to claim 1, wherein the control unit detects an abnormality in a component of the semiconductor manufacturing apparatus based on the captured images captured at preset predetermined intervals.

Images