Automatic teaching enclosure system

Abstract

To provide an enclosure system that makes automatic teaching possible.SOLUTION: An automatic teaching enclosure system 200 including a plurality of surfaces surrounding an internal space includes automatic teaching pins 230 at least partially disposed within the internal space. The automatic teaching pins are scannable features having fixed positions within the automatic teaching enclosure system. The automatic teaching enclosure system includes a front interface for connecting the automatic teaching enclosure system to a substantially vertical portion of a load port of a wafer processing system. The front interface is connected to one or more of the plurality of surfaces. The automatic teaching pins enable automatic teaching operation of a robot arm of the wafer processing system. The automatic teaching operation is an operation that automatically teaches the fixed position within the automatic teaching enclosure system to a robot arm of the wafer processing system.SELECTED DRAWING: Figure 2A

Description

Technical Field

[0001] Embodiments of the present disclosure relate to an enclosure system, such as for use in a wafer processing system, and more particularly to an enclosure system configured to enable an automatic teaching operation.

Background Art

[0002] In semiconductor processing and the processing of other electronic components, a platform that uses robotic arms to transfer objects such as wafers between processing chambers and storage areas (e.g., from a front opening unified pod (FOUP) to a processing chamber and from a processing chamber to a storage area) is often used. A processing system such as a wafer processing system has one or more processing chambers for processing wafers. Gas can be used to etch the wafers within the processing chamber (e.g., the wafers can be etched while electrostatically fixed in place within an etching chamber). The robotic arm lifts an object from a particular location and transfers the object to a particular location.

Summary of the Invention

[0003] The following is a simplified summary of the present disclosure to facilitate a basic understanding of some aspects of the present disclosure. This summary is not a detailed overview of the present disclosure. It is not intended to identify key or critical elements of the present disclosure nor to delineate the scope of particular embodiments of the present disclosure or the scope of the claims. Its sole purpose is to present some concepts of the present disclosure in a simplified form as a prelude to the more detailed description presented below.

[0004] In one aspect of the present disclosure, an automatic teaching enclosure system includes a plurality of surfaces that at least partially surround an internal space of the automatic teaching enclosure system. The automatic teaching enclosure system further includes an automatic teaching pin that is at least partially disposed within the internal space. The automatic teaching pin is a scannable feature having a fixed position within the automatic teaching enclosure system. The automatic teaching enclosure system includes a front interface coupled to one or more of the plurality of surfaces, the front interface including a front interface for connecting the automatic teaching enclosure system to a substantially vertical portion of a load port of a wafer processing system. The automatic teaching pin enables an automatic teaching operation of a robot arm of the wafer processing system. The automatic teaching operation is an operation of automatically teaching a fixed position within the automatic teaching enclosure system to the robot arm of the wafer processing system.

[0005] In another aspect of the present disclosure, the method includes connecting a front interface of an automatic teaching enclosure system to a substantially vertical portion of a load port of a factory interface to establish a sealed environment that includes an internal space of the automatic teaching enclosure system and an interior of a factory interface of a wafer processing system. The method further includes scanning an automatic teaching pin disposed within the internal space of the automatic teaching enclosure system by a robot arm of the factory interface while maintaining the sealed environment. The method further includes determining a fixed position associated with the automatic teaching enclosure system based on the results of the scan. An article is transferred by a robot arm based on the fixed position.

[0006] In other aspects of the present disclosure, an enclosure system includes a plurality of surfaces that at least partially surround an interior space of the enclosure system. The enclosure system further includes a plurality of support structures disposed within the interior space. The enclosure system further includes a calibration substrate placed on the plurality of support structures within the interior space. The calibration substrate includes calibration pins. The enclosure system further includes a front interface coupled to one or more of the plurality of surfaces. The front interface is configured to connect the enclosure system to a substantially vertical portion of a load port of a wafer processing system. The calibration substrate enables a calibration operation of a robot arm to automatically determine a robot arm error of the robot arm of the wafer processing system.

[0007] The present disclosure is shown by way of non-limiting example in the accompanying drawings, in which like reference numerals indicate like elements. Note that various references to "an" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references are meant to indicate at least one.

Brief Description of the Drawings

[0008]

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MODE FOR CARRYING OUT THE INVENTION

[0009] The embodiments described in this specification relate to an automatic teaching enclosure system. A robot arm (e.g., a robot for atmosphere, a robot of a factory interface, etc.) is disposed within a factory interface of a wafer processing system and moves wafers within the wafer processing system. An enclosure system (e.g., a FOUP (Front Opening Unified Pod), or other substrate enclosure system) is used to transfer objects such as wafers. The enclosure system provides a sealed environment during transfer. When the enclosure system is connected to the wafer processing system (e.g., docked to the wafer processing system, in close contact with the wafer processing system, etc.), as a result, a sealed environment including the internal space of the enclosure system and the internal space of the factory interface is obtained. The robot arm removes an object from and / or inserts an object into the enclosure system during operation, and the enclosure system is closed and removed from the wafer processing system (e.g., sealed with a door and separated) when the processing of the wafers in the enclosure system is completed. The robot arm lifts a wafer from a specific position in the enclosure system and places the wafer at a specific position in the enclosure system.

[0010] A robotic arm with errors causes damage to the wafer, the enclosure system, and / or the robotic arm. Robotic arm errors are related to teaching, calibration, and / or component diagnosis. Teaching refers to teaching the robotic arm the position of the enclosure system (e.g., a reference point). For example, the reference point can be the center of the enclosure system. Calibration refers to determining errors in the movement of the robotic arm (e.g., kinematic errors of joints, joint hysteresis, joint backlash) and adjusting the settings of the robotic arm to compensate for the determined errors. Diagnosis refers to determining whether the components of the robotic arm are malfunctioning. For example, the end effector of the robotic arm has a planar upper surface, a protrusion (e.g., a fang) extending upward from the planar upper surface, and a plunger disposed on the planar upper surface. The end effector is configured to grip a substrate disposed on the planar upper surface by actuating the plunger to fix the substrate between the actuated plunger and the distal protrusion. Diagnosis can be performed to determine that the plunger of the robotic arm is malfunctioning (e.g., the plunger does not extend far enough to fix the substrate, the plunger does not actuate fast enough, etc.).

[0011] If the position of the enclosure system (e.g., the central position of the enclosure system) has not been taught to the robotic arm, the robotic arm will attempt to lift the wafer from an incorrect position and / or place the wafer at an incorrect position. By lifting the wafer from an incorrect position and / or placing the wafer at an incorrect position, damage to the wafer, the enclosure system, and / or the robotic arm may be caused. Further, even if the robotic arm is instructed to lift and place the wafer at the correct position, if the robotic arm has not been calibrated, it often cannot actually lift and place it at the correct position. When the robotic arm has not been calibrated, due to the movement error of the robotic arm caused by the lack of calibration, the robotic arm will lift the wafer from an incorrect position and / or place the wafer at an incorrect position, thereby causing damage to the wafer, the enclosure system, and / or the robotic arm. Further, even if the center or zero position of the enclosure system has been taught to the robotic arm and the robotic arm has been calibrated, the robotic arm may malfunction, and damage to the wafer, the enclosure system, and / or the robotic arm may still occur. In response to this, in some embodiments, a diagnosis is performed to determine whether the robotic arm is malfunctioning and / or to determine how the robotic arm is malfunctioning. Due to the errors caused by the fact that the correct position of the enclosure system has not been taught to the robotic arm, the movement of the robotic arm has not been calibrated, and / or the malfunctioning parts of the robotic arm have not been correctly diagnosed, the wafer may be processed inappropriately.

[0012] Conventionally, teaching the position of a robotic arm, calibrating the movement of the robotic arm, and diagnosing malfunctioning components of the robotic arm (e.g., determining the error of the robotic arm, the speed of the robotic arm below the threshold speed) are manual processes. For the manual processes, a technician opens the wafer processing system (resulting in the exposure of the sealed environment within the factory interface of the wafer processing system to the atmosphere), manually operates the robotic arm (which may introduce contaminants to the robotic arm), and performs teaching, calibration, and diagnosis manually. After being opened, a long re-qualification evaluation process is performed in the wafer processing system, during which the wafer processing system is not used to process wafers. The re-qualification evaluation process affects line yield, scheduling, quality, user time, energy used, etc.

[0013] The apparatuses, systems, and methods disclosed herein provide an automated teaching enclosure system (e.g., FOUP) that enables one or more of an automated teaching operation, a calibration operation, or a diagnostic operation. In one embodiment, the automated teaching enclosure system includes a surface (e.g., top surface, side surface, bottom surface, back surface, etc.) that at least partially surrounds an interior space of the automated teaching enclosure system. An automated teaching pin is at least partially disposed within the interior space. The automated teaching pin is a scannable feature (e.g., a cylindrical feature that can be scanned by a robotic arm) having a fixed position within the automated teaching enclosure system. A front interface (e.g., a door frame) coupled to one or more of the surfaces (e.g., side surface, top surface, bottom surface, etc.) connects the automated teaching enclosure system to a substantially vertical portion of a load port of a wafer processing system (e.g., seals the automated teaching enclosure system). The automated teaching enclosure system includes a base plate fixed to a bottom surface (e.g., a bottom wall) of the surfaces of the automated teaching enclosure system. The automated teaching pin is fixed to the base plate and extends through the bottom surface into the interior space. The base plate connects the automated teaching enclosure system to a substantially horizontal portion of the load port. This substantially horizontal portion includes a kinematic device (e.g., kinematic pins, kinematic flanges, etc.) for positioning the automated teaching enclosure system in an accurate position (e.g., the same position each time the automated teaching enclosure system connects to the load port). A robotic arm scans the automated teaching pin to perform an automated teaching operation. The automated teaching operation is an operation that automatically determines (e.g., based on the position of the automated teaching pin) one or more fixed positions (e.g., centers) of the automated teaching enclosure system, a substantially horizontal portion of the load port, or a kinematic device, etc. The robotic arm uses the determined fixed position to retrieve an object from and / or insert an object into another enclosure system that connects to the load port.

[0014] In some embodiments, the calibration substrate is placed on a support structure within the internal space of the automatic teaching enclosure system. The calibration substrate is substantially horizontal and includes calibration pins fixed to the upper surface of the calibration substrate. A robotic arm performs a calibration operation using the calibration substrate. The robotic arm scans the calibration pins to determine a first position (e.g., of the calibration pins) of the calibration substrate, removes the calibration substrate from the support structure (e.g., removes the calibration substrate from the automatic teaching enclosure system), is instructed to place the calibration substrate at the first position on the support structure, scans the calibration pins to determine a second position of the calibration substrate, and determines a robotic arm error based on the difference between the first position and the second position.

[0015] In one embodiment, the robotic arm is used to perform a diagnostic operation by the calibration substrate. The calibration substrate has a first width in a first orientation and a second width in a second orientation. In some examples, the peripheral surface of the calibration substrate includes notches. The robotic arm is moved and placed under the calibration substrate in the first orientation, and the plunger of the robotic arm is actuated to fix the calibration substrate in the first orientation to determine whether a first error occurs when fixing the calibration substrate in the first orientation. The same process is repeated in the second orientation to determine whether a second error occurs when fixing the calibration substrate in the second orientation. In some embodiments, the first error or the second error includes one or more of the time exceeding a threshold amount required for the plunger to fix to the calibration substrate, the distance by which the plunger extends that is not equal to the distance between the robotic arm and the calibration substrate, and the like.

[0016] The apparatuses, systems, and methods disclosed herein have advantages over conventional solutions. An auto-teach enclosure system is connected to a load port of a wafer processing system to enable one or more of an auto-teach operation, an auto-calibration operation, and / or an auto-component diagnostic operation (e.g., enabling the execution of the above operations while maintaining a sealed environment), wherein the wafer processing system is not opened (e.g., the factory interface of the wafer processing system is not opened), and a subsequent re-qualification evaluation process of the wafer processing system is not provided. The load port is configured to receive various types of enclosure systems such as a front-opening unified pod (FOUP). The load port is in close contact with the front interface of the auto-teach enclosure system to prevent contamination within the wafer processing system (factory interface), prevent harmful gases from escaping from the wafer processing system (factory interface), and / or maintain an inert environment within the factory interface. The auto-teach enclosure system includes auto-teach pins for enabling an auto-teach operation. In some embodiments, the auto-teach enclosure system includes a calibration substrate for enabling one or more of a calibration operation or a diagnostic operation. The auto-teach enclosure system is used to learn the fixed position relative to the load port, the robot arm error, and / or problems with the robot arm, and enables the control of the robot arm to remove the wafer from an accurate position and place the wafer in an accurate position. By doing so, the auto-teach enclosure system reduces wafer errors and reduces damage to the robot arm, the enclosure system, and / or the wafer processing system. The use of the auto-teach enclosure system has less impact on line yield, scheduling, quality, user time, energy used, etc. than conventional solutions.

[0017] The automatic teaching enclosure system used for automatic teaching operations is for illustrative purposes rather than limitations. In some embodiments, the automatic teaching enclosure system is used for one or more of the calibration operation, the diagnostic operation, or the automatic teaching operation. In some embodiments, the automatic teaching enclosure system is not used for the automatic teaching operation (for example, the automatic teaching operation is not provided and is used for the calibration and / or diagnostic operations).

[0018] FIG. 1 shows a processing system 100 (e.g., a wafer processing system) according to a particular embodiment. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-128D). In some embodiments, the load ports 128A-128D are directly attached to the factory interface 101 (e.g., sealed to the factory interface 101). An enclosure system 130 (e.g., a cassette, FOUP, process kit enclosure system, or automatic teaching enclosure system, etc.) is configured to detachably couple (e.g., dock) to the load ports 128A-128D. Referring to FIG. 1, an enclosure system 130A is coupled to load port 128A, an enclosure system 130B is coupled to load port 128B, an enclosure system 130C is coupled to load port 128C, and an enclosure system 130D is coupled to load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load ports 128 for loading and unloading wafers and / or other substrates to and from the processing system 100. Each of the enclosure systems 130 may seal against the corresponding load port 128. In some embodiments, the first enclosure system 130A is docked to the load port 128A (e.g., to teach, calibrate, and / or diagnose the robot arm of the factory interface 101). Once such an operation is performed, the first enclosure system 130A is then detached from the load port 128A, and then a second enclosure system 130 (e.g., a FOUP containing wafers) is docked to the same load port 128A. In some embodiments, the enclosure system 130 (e.g., enclosure system 130A) is an automatic teaching enclosure system for performing one or more of an automatic teaching operation, a calibration operation, or a diagnostic operation.In some embodiments, the enclosure system 130 (e.g., enclosure system 130B) is a process kit enclosure system for loading and unloading an article 110, such as a process kit ring, to and from the processing system 100.

[0019] In some embodiments, load port 128 includes a front interface that forms an opening in a vertical direction (or substantially vertical direction). Load port 128 further includes a horizontal plane for supporting an enclosure system 130 (e.g., a cassette, an automated teaching enclosure system). Each enclosure system 130 (e.g., a FOUP for wafers, an automated teaching enclosure system, a process kit enclosure system) has a front interface that forms an opening in a vertical direction. The front interface of enclosure system 130 is dimensioned to connect to (e.g., abut against) the front interface of load port 128 (e.g., the vertical opening of enclosure system 130 is approximately the same size as the vertical opening of load port 128). Enclosure system 130 is placed on the horizontal plane of load port 128, and the vertical opening of enclosure system 130 is aligned with the vertical opening of load port 128. The front interface of enclosure system 130 interconnects with (e.g., is fastened to, fixed to, adhered to) the front interface of load port 128. The bottom plate (e.g., base plate) of enclosure system 130 has features (e.g., recesses or receptacles, load features that engage kinematic pin features of the load port, load port features for pin clearance, and / or enclosure system docking trailer latch clamp features) that engage the horizontal plane of load port 128. The same load port 128 is used for various types of enclosure systems 130 (e.g., an automated teaching enclosure system, a process kit enclosure system, a cassette containing wafers, etc.).

[0020] In some embodiments, an enclosure system 130 (e.g., an automatic teaching enclosure system) includes an automatic teaching pin for performing an automatic teaching operation. In some embodiments, the enclosure system 130 includes a calibration substrate (e.g., including a calibration pin) for performing one or more of a calibration operation or a diagnostic operation. Correspondingly, the enclosure system 130 may include both an automatic teaching pin and a calibration substrate.

[0021] In some embodiments, an enclosure system 130B (e.g., a process kit enclosure system) includes one or more articles 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring placed on a process kit ring carrier, an alignment verification wafer, etc.). In some examples, the enclosure system 130B is coupled to a factory interface 101 (e.g., via a load port 128) and is capable of automatically transferring a process kit ring on a process kit ring carrier into the processing system 100 for replacing a used process kit ring.

[0022] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b, which couple the factory interface 101 to corresponding degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to the corresponding degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate the transfer of wafers and articles 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 has a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around it and is coupled to the plurality of chambers. The processing chambers 107 are coupled to the transfer chamber 106 via respective ports 108 such as slit valves. In some embodiments, a higher pressure (e.g., atmospheric pressure) is applied to the factory interface 101 and a lower pressure (e.g., vacuum) is applied to the transfer chamber 106. Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., the first vacuum port 103) for sealing the degassing chamber 104 from the factory interface 101 and a second door (e.g., the second vacuum port 105) for sealing the degassing chamber 104 from the transfer chamber 106. While the first door is open and the second door is closed, an article is transferred from the factory interface 101 into the degassing chamber 104, the first door is closed, the pressure in the degassing chamber 104 is reduced to match that of the transfer chamber 106, the second door is opened, and the article is transferred from the degassing chamber 104. An LCF (local center finding) device is used to align articles within the transfer chamber 106 (e.g., before entering the processing chamber 107, after exiting the processing chamber 107).

[0023] In some embodiments, the processing chamber 107 includes one or more of an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), or an annealing chamber.

[0024] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robotic arm, such as a SCARA (selective compliance assembly robot arm) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, and the like. The factory interface robot 111 includes an end effector at the end of the robotic arm. The end effector is configured to lift and handle a specific object, such as a wafer. Alternatively or additionally, the end effector is configured to handle objects such as a calibration substrate and a process kit ring (edge ring). The end effector is also configured to scan objects (e.g., automatic teaching pins, calibration pins, etc.), which will be described in detail below (e.g., FIGS. 4A-4C). The robotic arm has one or more links or members (e.g., a wrist member, an upper arm member, a forearm member, etc.) configured to move the end effector to various positions in various orientations.

[0025] The robot 111 of the factory interface is configured to transfer objects between an enclosure system 130 (e.g., a cassette, a FOUP), and degassing chambers 104a, 104b (or load ports). In a conventional system, in order to teach, calibrate, and / or diagnose a malfunction of a robot arm (e.g., of a robot of the factory interface), an operator is associated with opening (e.g., disassembling, unsealing, contaminating) the processing system 100 (e.g., the factory interface 101), but the processing system 100 is configured to facilitate automatic teaching, calibration, and / or diagnosis without the operator opening the processing system 100 (e.g., without disassembling it, without unsealing it, without contaminating it). Correspondingly, in an embodiment, a sealed environment including the internal space of the enclosure system 130 and the internal space of the factory interface 101 can be maintained during an automatic teaching operation, a calibration operation, and / or a diagnostic operation.

[0026] In an embodiment, the robot 111 of the factory interface is taught a fixed position relative to the load port 128 using the enclosure system 130 (e.g., an automatic teaching pin of an automatic teaching enclosure system). The fixed position in one embodiment corresponds to the central position of an enclosure system 130A (e.g., an automatic teaching enclosure system) disposed at a particular load port 128, which central position also corresponds, in an embodiment, to the central position of an enclosure system 130B (e.g., a cassette for substrates) disposed at the particular load port 1,28. Alternatively, the fixed position may correspond to other fixed positions within the enclosure system 130, such as in front of or behind the enclosure system 130. The robot 111 of the factory interface is calibrated, in some embodiments, using the enclosure system 130 (e.g., an automatic teaching pin and / or a calibration substrate of an automatic teaching enclosure system). The robot 111 of the factory interface is diagnosed, in some embodiments, using the enclosure system 130 (e.g., a calibration substrate of an automatic teaching enclosure system).

[0027] Transfer chamber 106 includes a robot 112 of the transfer chamber. The robot 112 of the transfer chamber includes a robot arm, and the robot arm is provided with an end effector at the end of the robot arm. The end effector is configured to handle specific objects such as wafers. In some embodiments, the robot 112 of the transfer chamber is a SCARA robot, but in some embodiments, it may have fewer links and / or lower degrees of freedom than the robot 111 of the factory interface.

[0028] Controller 109 controls various aspects of the processing system 100. Controller 109 is a computing device and / or includes a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices such as a microprocessor or a central processing unit. More specifically, in some embodiments, the processor device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing another instruction set or a combination of instruction sets. In some embodiments, the processor device is one or more special-purpose processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), or a network processor. In some embodiments, Controller 109 includes a data storage device (e.g., one or more disk drives and / or solid state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, Controller 109 executes instructions for implementing any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium, which includes one or more of main memory, static memory, secondary storage, and / or a processing device (while the instructions are being executed).In some embodiments, the controller 109 receives signals from the factory interface robot 111 and the wafer transfer chamber robot 112 and sends signals to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0029] FIG. 1 schematically shows the transfer of an article 110 (e.g., a process kit ring coupled to a process kit ring carrier) into the processing chamber 107. According to one aspect of the present disclosure, the article 110 is removed from the process kit enclosure system 130B via the factory interface robot 111 disposed within the factory interface 101. The factory interface robot 111 transfers the article 110 into the respective degassing chambers 104a, 104b via one of the first vacuum ports 103a, 103b. The transfer chamber robot 112 located within the transfer chamber 106 removes the article 110 from one of the degassing chambers 104a, 104b via the second vacuum port 105a or 105b. The transfer chamber robot 112 moves the article 110 into the transfer chamber 106, where the article 110 is transferred to the processing chamber 107 via the corresponding port 108. Although not shown in FIG. 1 for clarity, the transfer of the article 110 includes the transfer of a process kit ring placed on a process kit ring carrier, the transfer of an empty process kit ring carrier, the transfer of an alignment verification wafer, and the like.

[0030] FIG. 1 shows an example of the transfer of article 110, although other examples are also conceivable. In some examples, process kit enclosure system 130B is contemplated to be coupled to transfer chamber 106 (e.g., via a load port attached to transfer chamber 106). From transfer chamber 106, article 110 is loaded into process chamber 107 by robot 112 of the transfer chamber. Further, in some embodiments, article 110 is loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is arranged to communicate with factory interface 101 on the side opposite the illustrated SSP. The processed article 110 (e.g., a used process kit ring) is removed from process system 100 in a direction opposite to any of the ways described herein. When using a plurality of enclosure systems 130B, or a combination of enclosure system 130B and SSP, in some embodiments, one SSP or enclosure system 130B is used for an unprocessed article 110 (e.g., a new process kit ring), and another SSP or enclosure system 130B is used to receive the processed article 110 (e.g., a used process kit ring). Enclosure system 130A is used to perform one or more of an automatic teaching operation, a calibration operation, or a diagnostic operation of a robot arm (e.g., robot 111 of the factory interface, robot 112 of the transfer chamber, etc.) before the transfer of article 110 via the robot arm. By one or more of the automatic teaching, calibration, or diagnostic operations, (e.g., when enclosure system 130B docks at the same load port 128 where enclosure system 130A docked,) the robot arm may be able to accurately pick up an object from a specific position within enclosure system 130B and accurately place the object at a specific position within enclosure system 130B.

[0031] The processing system 100 includes a chamber such as a factory interface 101 (e.g., an EFEM (equipment front end module)), and an adjacent chamber (e.g., a degassing chamber 104 such as a load port 128, an enclosure system 130, an SSP, or a load lock) adjacent to the factory interface 101. One or more chambers are sealed (e.g., each of the chambers is sealed). The adjacent chambers are in close contact with the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is supplied to one or more chambers (e.g., the factory interface 101 and / or the adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, such that a user need not enter the factory interface 101 (e.g., the processing system 100 is not configured for manual access within the factory interface 101).

[0032] In some embodiments, a gas stream (e.g., an inert gas, nitrogen) is supplied to one or more chambers (e.g., factory interface 101) of the processing system 100. In some embodiments, the gas stream is greater than the leakage through the one or more chambers and maintains a positive pressure within the one or more chambers. In some embodiments, the inert gas within the factory interface 101 is recycled. In some embodiments, a portion of the inert gas is discharged. In some embodiments, the gas stream of the non-recycled gas into the factory interface 101 is greater than the discharged gas stream and the gas leakage and maintains a positive pressure of the inert gas within the factory interface 101. In some embodiments, the factory interface 101 is coupled to one or more valves and / or pumps to provide a gas stream to and from the factory interface 101. A processing device (e.g., controller 109) controls the gas stream into and from the factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensor, humidity sensor, motion sensor, door actuation sensor, temperature sensor, pressure sensor, etc.) and determines the flow rate of the inert gas flowing into and / or out of the factory interface 101 based on the sensor data.

[0033] The enclosure system 130 enables teaching, calibrating, and / or diagnosing a robotic arm (e.g., of a robot in the factory interface) without opening the sealed environment within and adjacent to the factory interface 101. The teaching, calibration, and diagnosis of the robotic arm will be described in more detail below. The enclosure system 130 adheres to the load port 128 in response to being docked to the load port 128. The enclosure system 130 provides purge port access, thereby enabling purging of the interior of the enclosure system 130 before opening the enclosure system 130, minimizing disruption of the inert environment within the factory interface 101.

[0034] FIG. 2A shows a front view of an automatic teaching enclosure system 200 (e.g., the enclosure system 130 of FIG. 1) according to a particular embodiment. The automatic teaching enclosure system 200 is configured to enable one or more of an automatic teaching operation, a calibration operation, or a diagnostic operation.

[0035] The automatic teaching enclosure system 200 includes a surface (e.g., a wall, a sidewall, a substantially planar structure, etc.) that at least partially surrounds an internal space 202 (e.g., forms a cavity or a chamber). In some embodiments, the internal space 202 is a mini-environment (e.g., a sealed environment). In some embodiments, the internal space 202 is maintained in a substantially particle-free (e.g., substantially uncontaminated) state. In some embodiments, the automatic teaching enclosure system 200 includes a fan that removes particles within the internal space 202 (e.g., on the upper surface). In some embodiments, the internal space is substantially free (or completely free) of one or more of moisture, oxygen, or particles (e.g., dust).

[0036] The surface includes sidewall surfaces 210A-210B (e.g., sidewalls), a bottom surface 212 (e.g., a bottom wall), a top surface 214 (e.g., a top wall), and a back surface 216 (e.g., a rear wall). In some embodiments, the above surfaces form clampable tabs. One or more of the above surfaces (e.g., sidewall surfaces 210A-210B, bottom surface 212, top surface 214, etc.) form a front interface. The front interface is configured to connect (e.g., be in close contact with) a door for the transfer of the automatic teaching enclosure system 200. The front interface is configured to connect (e.g., be in close contact with) a substantially vertical portion of a load port of the wafer processing system. In response to the front interface being in close contact with the door or the load port, the automatic teaching enclosure system 200 forms a sealed environment (e.g., gas and / or particles do not exit the automatic teaching enclosure system 200 or enter the automatic teaching enclosure system 200 from the surrounding environment outside the wafer processing system).

[0037] In some embodiments, the automatic teaching enclosure system 200 includes a base plate 220 (e.g., an adapter plate) coupled to the bottom surface 212. The base plate 220 is configured to connect to a horizontal portion of the load port. The base plate 220 has features (e.g., recesses, receptacles, kinematic interfaces) for receiving kinematic devices (e.g., kinematic pins, precisely positioned pins) of the horizontal portion of the load port. In some embodiments, the base plate 220 is fixed to the bottom surface 212 before the automatic teaching enclosure system 200 is connected to the load port. In some embodiments, the base plate 220 is fixed to the load port and then the bottom surface 212 is fixed to the base plate 220. In some embodiments, the automatic teaching enclosure system 200 has a seal (e.g., a crushable seal, a gasket) at an opening in the bottom surface 212 for sealing an opening through which the automatic teaching pin 230 passes.

[0038] In some embodiments, for the transfer of the automatic teaching enclosure system 200 (e.g., automated transfer, manual transfer, etc.), one or more of the overhead transport flange 222 or at least one handle 224 are coupled to one or more surfaces of the automatic teaching enclosure system 200. In some embodiments, the OHT flange 222 is coupled to the upper surface 214. In some embodiments, the first handle 224A is disposed on the first sidewall surface 210A, and the second handle 224B is disposed on the second sidewall surface 210B.

[0039] In some embodiments, the automatic teaching pin 230 is at least partially disposed within the internal space 202. In some embodiments, the automatic teaching pin 230 is coupled to the base plate 220, and at least a portion of the automatic teaching pin extends through the opening in the bottom surface 212 and into the internal space 202. The automatic teaching pin 230 enables an automatic teaching operation (see, for example, method 540 of FIG. 5C). In some embodiments, the automatic teaching pin 230 is disposed at the center of the base plate 220.

[0040] In some embodiments, the calibration substrate 240 is disposed within the internal space 202. The calibration substrate 240 is a planar object (e.g., a wafer) that can be gripped and moved by an end effector. The calibration substrate 240 is not fully fixed (e.g., a movable calibration substrate 240 that is not fully fixed) for performing sensor calibration (e.g., a calibration operation).

[0041] In some embodiments, the calibration pin 242 is placed (e.g., fixed) on the upper surface of the calibration substrate 240. In some embodiments, the calibration substrate 240 is placed on one or more support structures 244 (e.g., 3 to 4 support structures) within the internal space 202. In some embodiments, the calibration substrate 240 is placed on a first support structure 244A and a second support structure 244B disposed near the back surface 216. In some embodiments, the calibration substrate 240 is placed on support structures 244C to 244D near the front interface (e.g., in addition to support structures 244A to 244B). In some embodiments, the color 246 is placed on the automatic teaching pin 230, and the calibration substrate 240 is placed on the color 246 (e.g., in addition to support structures 244A to 244B). In some embodiments, the support structure 244 is placed on the bottom surface 212 (e.g., extends from the bottom surface 212 to the calibration substrate 240). In some embodiments, the support structure 244 is placed on one or more of the side wall surface 210A, the side wall surface 210B, or the back surface 216. The calibration substrate 240 enables one or more of a calibration operation (e.g., refer to method 520 in FIG. 5B) or a diagnostic operation (e.g., refer to method 560 in FIG. 5D).

[0042] In some embodiments, the automatic teaching enclosure system 200 includes a single automatic teaching pin 230 (e.g., the automatic teaching enclosure system 200 may or may not include the calibration pin 242). Alternatively, the automatic teaching system 200 includes a plurality of automatic teaching pins 230. In some embodiments, the automatic teaching enclosure system 200 includes a single calibration pin 242 (e.g., the automatic teaching enclosure system 200 may or may not include the automatic teaching pin 230). In some embodiments, the automatic teaching enclosure system 200 includes the automatic teaching pin 230 and the calibration pin 242. In some embodiments, the automatic teaching pin 230 and the calibration pin 242 are a single pin (e.g., a single pin can be used for both automatic teaching and calibration).

[0043] In some embodiments, the automated teaching enclosure system 200 includes pins (e.g., automated teaching pin 230 and / or calibration pin 242), where the shape of at least a portion of the pin (e.g., trapezoidal) is configured to provide calibration and angle detection. In some examples, the trapezoidal portion of the pin provides both calibration and angle detection and is easy to machine into a lathe part. In some embodiments, for increased accuracy, the corners of the trapezoidal portion are placed via press-fit pins (e.g., the four above-mentioned corners can be press-fit pins instead of a single machined feature).

[0044] In some embodiments, to provide calibration, at least a portion of the pin has a shape that is skewed or asymmetric (e.g., trapezoidal) around a central pin (e.g., the cylindrical portion of the pin). For calibration, the symmetry of a first portion of the pin (e.g., the cylindrical portion of the pin) is compared to the asymmetry of a second portion of the pin (e.g., the trapezoidal portion of the pin). The robotic arm moves in the z-direction (e.g., moves up and down) to scan the first portion (e.g., cylindrical) and the second portion (e.g., trapezoidal) of the pin for comparison. The robotic arm rotates about a single joint to measure the second portion (e.g., trapezoidal) from a first angle and from a second angle for comparison. By the movement of the robotic arm, comparison of joint angles for the same proximate region is possible, where the robot does not need to completely change the joint posture to scan other objects. In some embodiments, for angle detection, a set of offset features (e.g., sides or end faces of the trapezoidal portion) that increase or decrease separately due to the angle of the scan are used.

[0045] In some embodiments, the automated teaching enclosure system 200 has two or more automated teaching pins 230 and / or two or more calibration pins 242. In some embodiments, the automated teaching enclosure system 200 includes two or more pins, each of which can be used for one or more of automated teaching and / or calibration. In some embodiments, one or more pins extend from the bottom surface 212. In some embodiments, one or more pins extend from a surface of the automated teaching enclosure system 200 (e.g., sidewall surface 210A, sidewall surface 210B, top surface 214, or back surface 216, etc.) into the internal space of the automated teaching enclosure system 200. In some embodiments, one or more pins extend from a structure (e.g., calibration structure 240) within the internal space of the automated teaching enclosure system 200. In some embodiments, a first pin extends from a first structure (e.g., first calibration structure 240A, a structure movable by a robotic arm) within the automated teaching enclosure system 200, and a second pin extends from a second structure (e.g., second calibration structure 240B, a structure movable by a robotic arm) within the automated teaching enclosure system 200.

[0046] FIG. 2B shows an exploded perspective view of an automated teaching enclosure system 200 according to a particular embodiment.

[0047] The surface of the automated teaching enclosure system 200 (e.g., walls, sidewalls) includes sidewall surfaces 210A-210B, bottom surface 212, top surface 214, and back surface 216. In some embodiments, the automated teaching enclosure system 200 includes a base plate 220, and the automated teaching pins 230 are placed on the base plate 220. The bottom surface 212 forms one or more openings. The base plate 220 is fixed to the bottom surface 212, and the automated teaching pins 230 extend through the openings in the bottom surface 212 into the internal space 202 of the automated teaching enclosure system 200. The automated teaching pins 230 provide a seal (e.g., to provide a sealed environment) at the openings in the bottom surface 212.

[0048] In some embodiments, one or more purge adapters 250 are configured to be inserted into openings formed in the bottom surface 212. The purge adapter 250 is used for one or more of filling the automatic teaching enclosure system 200 with a gas (e.g., nitrogen (N2)), removing the gas from the automatic teaching enclosure system, or flowing the gas through the automatic teaching enclosure system 200. Each of the purge adapters 250 provides a seal (e.g., for providing a sealed environment) at a corresponding opening of the bottom surface 212. In some embodiments, the automatic teaching enclosure system 200 adheres to the load port in response to being docked to the load port. The internal space of the automatic teaching enclosure system 200 is configured to be purged via one or more purge adapters 250 before the automatic teaching enclosure system 200 is opened.

[0049] One or more of the above surfaces of the automatic teaching enclosure system 200 provide a front interface. The automatic teaching enclosure system 200 includes a door 252. The door 252 adheres to the front interface of the automatic teaching enclosure system 200 to provide a sealed environment. To prevent the calibration substrate from moving during transfer, the door 252 connects to (e.g., refer to FIG. 2B) (e.g., fixes the calibration substrate in a predetermined position, presses against the calibration substrate) the calibration substrate.

[0050] In some embodiments, the automatic teaching enclosure system 200 includes handles 224A - 224B and / or an OHT flange 222 for transferring the automatic teaching enclosure system 200.

[0051] FIG. 2C shows a perspective view of the automatic teaching enclosure system 200 according to a particular embodiment.

[0052] In some embodiments, the base plate 220 is fixed to the bottom surface 212, and the automatic teaching pin 230 extends through the bottom surface 212 into the internal space 202 of the automatic teaching enclosure system. The purge adapter 250 is disposed on the bottom surface 212 and is fluidly connected to one or more of a gas line or a vacuum line (e.g., for purging the automatic teaching enclosure system 200, forming a vacuum within the automatic teaching enclosure system 200, filling the automatic teaching enclosure system 200 with a gas, etc.) through the base plate 220. In some embodiments, the handle 224 and the OHT flange 222 are fixed to the corresponding surfaces of the automatic teaching enclosure system 200. In some embodiments, the calibration substrate 240 is placed on one or more support structures 244 within the internal space 202 of the automatic teaching enclosure system 200. The calibration substrate 240 includes calibration pins 242 fixed to the upper surface of the calibration substrate 240. The calibration substrate 240 includes a first width in a first orientation and a second width in a second orientation. In some embodiments, the calibration substrate 240 has a notch or a recess. The first width of the calibration substrate 240 is from a first position on the peripheral surface of the calibration substrate 240 to a second position on the peripheral surface (e.g., neither the first position nor the second position includes a notch or a recess), and the second width of the calibration substrate 240 is from a third position on the peripheral surface with a notch or a recess to a fourth position on the peripheral surface. Depending on the third position being a recess or an inward notch, the second width is shorter than the first width. The first width and the second width are used to perform diagnostic operations on the robotic arm (e.g., to determine whether the end effector can grip the calibration substrate 240 within a threshold time amount range of the first width and the second width). The calibration substrate 240 and the support structure 244 are dimensioned to allow the calibration substrate 240 to be lifted from a first position by the robotic arm (e.g., gripped by the fangs and plungers of the end effector of the robotic arm) and placed at a second position on a support structure 244 different from the first position (e.g., to determine robotic arm error).The calibration pin 242 is sized and positioned to enable a robot arm (e.g., an end effector) to scan the calibration pin 242 to determine its position (e.g., to determine robot arm error). The automatic teaching pin 230 is sized and positioned to enable a robot arm (e.g., an end effector) to scan the automatic teaching pin 230 to determine its position (e.g., to teach the center position of the automatic teaching enclosure system 200 and / or the load port).

[0053] Figures 3A-3B show the automatic teaching pin 300 (e.g., the automatic teaching pin 230 of FIGS. 2A-2AC) of an automatic teaching enclosure system (e.g., the automatic teaching enclosure system 130 of FIG. 1 and / or 200 of FIGS. 2A-2C) according to a particular embodiment. FIG. 3A shows a front view of the automatic teaching pin 300, and FIG. 3B shows a top view of the automatic teaching pin 300. In some embodiments, one or more portions of the calibration pin (e.g., the calibration pin 242 of FIGS. 2A-2B) are similar to the corresponding portions of the automatic teaching pin 300. In some examples, the calibration pin has a cylindrical portion and a trapezoidal portion.

[0054] The automatic teaching pin 300 includes a cylindrical portion 302 (e.g., a first portion having a cylindrical sidewall). The robot arm uses the cylindrical portion 302 to perform an automatic teaching operation to identify a fixed position (e.g., an x-y position) of the automatic teaching enclosure system and / or the load port.

[0055] The automatic teaching pin 300 includes a trapezoidal portion 304 (e.g., a second portion including planar sidewalls). The robot arm uses the trapezoidal portion 304 to enable calibration of the robot arm error. In some embodiments, the trapezoidal portion 304 has a peripheral surface that is elliptical or polygonal (e.g., trapezoidal, square, rectangular, triangular, etc.), enabling the robot arm to scan the trapezoidal portion from various angles to measure various lengths (e.g., depths) and calibrate the robot arm.

[0056] In some embodiments, the automatic teaching pin 300 includes a base 306 fixed to a protruding portion 324 of a base plate 320 (e.g., the base plate 220 of FIGS. 2A-2C). One or more base fasteners (e.g., bolts, screws, etc.) couple the base 306 to the protruding portion 324 of the base plate 320.

[0057] The bottom surface of the automatic teaching enclosure system includes an opening for the automatic teaching pin (e.g., the cylindrical portion 302, the trapezoidal portion 304, and the base 306) and an opening for the clamp fastener 330. The base plate 320 includes a base flange 322 and a protruding portion 324. A seal portion 326 is placed on the base flange 322 and the base 306 is fixed to the protruding portion 324. The base plate 320 is fixed to the bottom surface of the automatic teaching enclosure system, whereby at least a portion of the automatic teaching pin 300 extends through the opening in the bottom surface and into the internal space of the automatic teaching enclosure system. In some examples, at least a portion of the cylindrical portion 302, the trapezoidal portion 304, and the base 306 extends into the internal space. In some embodiments, the base flange 322 is adapted to the inclination (e.g., a non-horizontal inclination) of the bottom surface of the automatic teaching enclosure system. The bottom surface is placed on the seal portion 326 placed on the base flange 322. A clamp 308 surrounds the base 306 and is placed on the bottom surface. A clamp fastener 330 engages the base flange 322 by passing through the clamp 308, the bottom surface, and the seal portion 326 to fix the clamp 308 to the base flange. The base flange 322, the seal portion 326, the bottom surface, and the clamp 308 are substantially parallel to each other, and the clamp fastener 330 is substantially perpendicular to the base flange 322, the seal portion 326, the bottom surface, and the clamp 308.

[0058] The upper surface of the cylindrical portion 302 defines a first wafer transfer plane. The upper surface of the trapezoidal portion 304 defines an alternative wafer transfer plane. The distal end of the cylindrical portion 302, near the upper surface of the cylindrical portion 302, is configured to support a collar for supporting a calibration substrate.

[0059] The cylindrical portion 302 has a round circumferential surface and has a precisely controlled surface for the robot arm to scan. The diameter of the cylindrical portion 302 varies as a programmable parameter. The cylindrical portion 302 indicates the x-y center (e.g., the center of the load port) with respect to the kinematic device (e.g., kinematic pins) of the load port (e.g., the substantially horizontal portion of the load port). The cylindrical portion 302 is used for automatic teaching operations.

[0060] The trapezoidal portion 304 enables calibration for backlash and two additional robot linear positions (e.g., 10 degrees and -10 degrees), resulting in a total of six scannable positions. The trapezoidal portion 304 is used for calibrating the backlash of a specific joint on the robot arm. When approached from various angles, the trapezoidal portion 304 provides various scan depths. The trapezoidal portion enables the separation of backlash (e.g., general errors in the joint) at individual joints.

[0061] FIG. 4A shows a top view of a robot arm 400 according to a particular embodiment. The robot arm 400 is configured to perform one or more of an automatic teaching operation, a calibration operation, or a diagnostic operation using an automatic teaching enclosure system. The robot arm 400 includes an end effector 408, a list member 436, a beam sensor 450, a light source 452, and a light receiver 454. An optical transmission fiber 456A is wired through the list member 436 and the end effector 408 and terminates at a first end 458A of the end effector 408. A light receiving fiber 456B is wired through the list member 436 and the end effector 408 and terminates at a second end 458B of the end effector 408. The first end 458A and the second end 458B of the end effector 408 are spaced apart across a gap 460, and the gap 460 forms an open area for a particular type of processing including detecting the end face of a substrate, an automatic teaching pin, or a calibration pin, etc.

[0062] The optical transmission fiber 456A terminates at a first optical path opening 462A near the first end 458A. Similarly, the light receiving fiber 456B terminates at a second optical path opening 462B near the second end 458B. The first optical path opening 462A and the second optical path opening 462B face each other and form an optical transmission path 464 (e.g., a light beam) for detecting the presence or absence of an end face of an object (e.g., a teaching pin, a calibration pin, a substrate, etc.). The optical transmission path 464 extends between the first end 458A and the second end 458B (e.g., between two points), thereby enabling detection of an object within the gap 460.

[0063] The beam sensor 450 further includes an optical transmission / reception module 466 that detects the degree of optical transmission between the optical transmission fiber 456A and the light receiving fiber 456B. The optical transmission / reception module 466 senses the end face of an object located between the first optical path opening 462A and the second optical path opening 462B in response to the object blocking the optical transmission path 464. The output signal generated by the optical transmission / reception module 466 is supplied to the controller via a conductor passing through the robot arm 400.

[0064] During operation of the robot arm 400, a controller (e.g., the controller 109 of FIG. 1) transmits a signal to the robot arm 400 to move the end effector 408 to a specific position. In some examples, the controller generates a signal to move one or more portions of the robot arm (e.g., the upper arm, forearm, wrist member 436) to a specific position such as a position within the factory interface of the wafer processing system or within the transfer chamber. The controller generates a signal for moving the end effector 408 based on a fixed position relative to the robot arm 400. For example, the robot arm 400 performs an automatic teaching operation (e.g., the robot arm 400 determines the coordinates of a fixed position), a calibration operation (e.g., the robot arm 400 determines the robotic arm error of the robot arm 400), and / or a diagnostic operation (e.g., the robot arm 400 determines an error or malfunction in the robot arm 400). Thereafter, the controller generates a signal to move one or more portions of the robot arm 400 (e.g., the upper arm, forearm, wrist member 436) to move the end effector 408 to a specific position relative to the fixed position (e.g., taking into account errors in the robotic arm, etc.).

[0065] In some embodiments, due to one or more errors in the mechanical structure of the robotic arm 400, errors occur when positioning the end effector 408. For example, there are errors or play in one or more joints (e.g., between the upper arm, forearm, wrist member 436), which contribute to positional errors. This positional error reduces the accuracy of the automatic teaching operation performed by the robotic arm 400. The errors in one or more joints include kinematic errors of the joints, joint hysteresis, and joint backlash. The kinematic error of a joint (joint error) is the result of the joint not rotating as instructed. For example, a particular joint is instructed to rotate to a specific angle, but the joint rotates to a different angle. Joint backlash occurs when the joint is rotated clockwise or counterclockwise, resulting in a reproducible difference in position. Joint hysteresis is related to the hysteresis observed in the clockwise and counterclockwise rotations of the joint. Other errors to be analyzed include the lengths of one or more parts of the robotic arm (e.g., upper arm, forearm, wrist member 436) stored in the controller relative to their actual lengths.

[0066] The accuracy of automatic teaching is improved by repeatedly orienting the end effector 408 with respect to a fixed position using various robot postures. The robot posture refers to the position of one or more parts of the robotic arm (e.g., upper arm, forearm, wrist member 436). The robotic arm 400 determines various coordinates of a fixed position that vary due to robotic arm errors (e.g., joint errors and other errors).

[0067] Figure 4B shows a top view of a robotic arm 400 according to a particular embodiment. The robotic arm 400 is configured to perform one or more of an automatic teaching operation, a calibration operation, or a diagnostic operation using an automatic teaching enclosure system. The robotic arm 400 includes an end effector 408, a list member 436, a first optical path opening 462A (e.g., a fiber emitter) coupled to a light source 452, and a second optical path opening 462B (e.g., a fiber receiver) coupled to a light receiver 454. An optical transmission path 464 (e.g., a path for triggering a light ray or beam) is disposed between the first optical path opening 462A and the second optical path opening 462B.

[0068] The robotic arm 400 has a robotic list center 410, and this robotic list center 410 corresponds to an actual wafer center 412. The characteristic error 414 (e.g., robotic arm error) of the robotic arm 400 is the distance or angle between a center line and an error line. The center line is between the robotic list center 410 and the actual wafer center 412. The error line is orthogonal to the optical transmission path 464 (e.g., by an angle 416 of 90 degrees). In some embodiments, the robotic arm 400 determines the characteristic error 414 via a calibration operation.

[0069] Figure 4C shows a method 470 for performing a calibration operation using an automatic teaching enclosure system according to a particular embodiment. Although shown in a particular flow or order, the order of the process can be changed unless otherwise specified. Thus, the illustrated embodiment should be understood merely as an example, and the illustrated process can be performed in a different order, and several processes can be performed in parallel. Further, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0070] Referring to method 470 of FIG. 4C, at block 472, (e.g., in response to the automatic teaching enclosure system being docked and in close contact with the load port,) the robot arm 400 places a calibration substrate (e.g., a pinned wafer) including calibration pins at a first position (e.g., Tx0, Ty0) on a support structure within the automatic teaching enclosure system. In some embodiments, the calibration substrate is placed at the first position before the automatic teaching enclosure system is docked.

[0071] At block 474, the robot arm 400 performs a first scan (e.g., an automatic teaching scan) of the calibration pins within the automatic teaching enclosure system. The robot arm 400 determines that the calibration pins are at the first position. To perform the scan, the robot arm 400 rotates left and right around the list center 410.

[0072] At block 476, the robot arm 400 is instructed to lift the calibration substrate and move the calibration substrate to a second position (e.g., Tx1, Ty1) on a support structure within the automatic teaching enclosure system. In some embodiments, the second position is the same as the first position. In some embodiments, the second position is different from the first position.

[0073] At block 478, the robot arm 400 performs a second scan (e.g., an automatic teaching scan), and at block 480, determines that the calibration pins are at a third position (e.g., Tx2, Ty2) within the automatic teaching enclosure system. To perform the scan, the robot arm 400 rotates left and right around the list center 410.

[0074] The robot arm 400 determines a robot arm error based on two or more of the first position, the second position, or the third position. In one example, the robot arm error is the difference between the third position (e.g., the actual position) and the second position (e.g., the instructed position). Correspondingly, the robot arm uses the robot arm error to determine the actual position of an object.

[0075] In some embodiments, the robotic arm executes method 470 for each member of the robotic arm (e.g., the wrist member, the upper arm, the forearm) to determine the robotic arm error for each member of the robotic arm. In some examples, the robotic arm executes method 470 by rotating the forearm center of the forearm while maintaining other members in a stationary state to determine the robotic arm error specific to the forearm.

[0076] Figures 5A - 5D illustrate a method of performing one or more of an auto - teaching operation, a calibration operation, or a diagnostic operation (e.g., while maintaining a sealed environment) using an auto - teaching enclosure system according to a particular embodiment. One or more of the auto - teaching operation, the calibration operation, or the diagnostic operation are automatically executed in response to a user input (e.g., by pressing a button on a factory interface). Although shown in a particular flow or order, the order of the process can be changed unless otherwise specifically defined. Thus, the illustrated embodiments should be understood merely as examples, and the illustrated process can be implemented in a different order, and some processes can be performed in parallel. Further, in various embodiments, it is possible to omit one or more processes. Thus, not all processes are required in all embodiments.

[0077] Referring to method 500 of Figure 5A, at block 502, the front interface of the auto - teaching enclosure system connects to a substantially vertical portion of the load port of the wafer processing system. The front interface is in close contact with the substantially vertical portion of the load port. In some examples, the front interface is fixed to the substantially vertical portion of the load port, and a seal member (e.g., a gasket) is disposed between the front interface and the substantially vertical portion of the load port.

[0078] In block 504, the base plate of the automatic teaching enclosure connects to the substantially horizontal portion of the load port. The base plate includes features (such as recesses or receptacles) that connect to the kinematic devices (such as kinematic pins) of the substantially horizontal portion of the load port. Features of the base plate (such as cones) connect to the kinematic features (such as kinematic pins) of the load port to position the automatic teaching enclosure system at a specific position relative to the load port. The kinematic features of the load port connect to features of other enclosure systems (such as the process kit ring enclosure system) to position other enclosure systems at the same specific position relative to the load port as the automatic teaching enclosure system.

[0079] In block 506, a robot arm is used to perform one or more of an automatic teaching operation (see, for example, method 540 of FIG. 5C), a calibration operation (see, for example, method 520 of FIG. 5B), or a diagnostic operation (see, for example, method 560 of FIG. 5D).

[0080] In some embodiments, an automatic teaching operation is used to teach a fixed position (such as the center of the enclosure system or the load port in the x - y plane) to the robot arm, whereby the robot arm can be positioned under the center of each wafer during the lifting operation and transfer each wafer to the correct position in the placement (such as hand - off) operation.

[0081] In some embodiments, a calibration operation is used to determine an error in the movement of the robot arm and compensate for that error. For example, in response to determining that the list of the robot arm has rotated by a first angular amount that is less than the indicated angular amount, the controller instructs the list to rotate by the difference between the first angular amount and the indicated angular amount, i.e., by the amount of error in one degree of the list's rotation in the rotation of the robot arm (for example, to compensate for the rotational error).

[0082] In some embodiments, diagnostic operations are used to determine whether the components of the robotic arm are functioning properly (e.g., appropriate speed, appropriate measurements, proper fixation of the wafer, etc.).

[0083] Each of the automatic teaching operation, the calibration operation, and the diagnostic operation is performed using the automatic teaching enclosure system without opening the factory interface.

[0084] FIG. 5B shows a method 520 for performing a calibration operation (e.g., while maintaining a sealed environment) using an automatic teaching enclosure system according to a particular embodiment. In some embodiments, the calibration operation is performed in a factory after replacement of one or more parts of the robotic arm (e.g., a controller, a member, a joint, etc.), after operation of one or more parts of the robotic arm, after damage to the robotic arm, or after loss of previous robotic arm error data (e.g., obtained from the factory). The calibration operation can provide robotic joint errors of the robotic arm that are not specific to any particular station (e.g., can be applied to the robotic arm at any load port of a wafer manufacturing system).

[0085] Referring to the method 520 of FIG. 5B, in block 522, a calibration substrate is placed on the automatic teaching pins on a support structure within the internal space of the automatic teaching enclosure system.

[0086] In block 524, the robotic arm scans the calibration pins of the calibration substrate to determine a first position of the calibration substrate. The robotic arm scans the calibration pins by moving left and right about the center of a member of the robotic arm (e.g., the wrist center). The robotic arm scans the calibration pins by moving only one member of the robotic arm (e.g., the wrist member) and keeping the other members of the robotic arm stationary. The robotic arm stores the first position.

[0087] In block 526, the robotic arm removes the calibration substrate from the support structure. The robotic arm positions the end effector of the robotic arm under the calibration substrate. The robotic arm actuates a plunger (e.g., a pneumatic plunger) of the end effector to grip the calibration substrate between the plunger of the end effector and a distal pad (e.g., a fang). In some embodiments, the robotic arm uses only one member of the robotic arm to lift and move the calibration substrate while keeping other members of the robotic arm stationary. In some embodiments, the robotic arm removes the calibration substrate from the automatic teaching enclosure system.

[0088] In block 528, the robotic arm is instructed to place the calibration substrate in a first position. The robotic arm retrieves the first position from memory and attempts to place the calibration substrate in the first position. The robotic arm uses the same member of the robotic arm (e.g., a lift member) that was used to remove the calibration substrate from the support structure (e.g., limiting the determined robotic arm error to one member).

[0089] In block 530, the robotic arm scans the calibration pins of the calibration substrate again to determine a second position of the calibration substrate.

[0090] In block 532, the robotic arm error is determined based on the difference between the first position and the second position. The robotic arm error is used for any operation of the enclosure system (e.g., an automatic teaching operation, a calibration operation of other members of the robotic arm, a diagnostic operation, etc.) and / or for the operation of another enclosure system that will later dock to the same load port as the automatic teaching enclosure system (e.g., the transfer of wafers, carriers, process kit rings, placement verification wafers, etc.).

[0091] Figure 5C shows a method 540 of performing an auto-teaching operation using an auto-teaching enclosure system (e.g., while maintaining a sealed environment). In some embodiments, the auto-teaching operation is performed at one or more of startup of a tool (e.g., in a wafer manufacturing system), periodically (e.g., once a year), in response to drift of values received from a robot arm, as the robot arm ages, and after replacement of parts of the robot arm. The auto-teaching operation provides a specific position of the auto-teaching enclosure system and / or the load port. The specific position is used by the robot arm to determine the position of an object within any enclosure system attached to the same load port.

[0092] Referring to method 540 of FIG. 5C, at block 542, the robot arm scans an auto-teaching pin disposed within the internal space of the auto-teaching enclosure system. In some embodiments, the robot arm scans the auto-teaching pin by moving only a member (e.g., a wrist member) of the robot arm and keeping other members of the robot arm stationary. In some embodiments, the robot arm uses the same member that was used in a calibration operation.

[0093] At block 544, based on the results of the scan of block 542, a fixed position (e.g., a center position) associated with the auto-teaching enclosure system and / or the load port is determined. In some embodiments, the fixed position is further determined based on robot arm error.

[0094] In block 546, the robotic arm is caused to transfer an article based on a fixed position. In some embodiments, the robotic arm transfers an article based on a robotic error. The robotic arm uses the fixed position for any operation of the enclosure system (e.g., a calibration operation, a diagnostic operation, etc. of other members of the robotic arm), and / or for an operation of another enclosure system that will later dock to the same load port as the automatic teaching enclosure system (e.g., the transfer of wafers, carriers, process kit rings, placement verification wafers, etc.).

[0095] FIG. 5D shows a method 560 of performing a diagnostic operation using an automatic teaching enclosure system (e.g., while maintaining a sealed environment) according to a particular embodiment. In some embodiments, the diagnostic operation is performed periodically (e.g., daily, weekly, monthly), as the robotic arm ages, and / or when a problem is detected with respect to the robotic arm and / or a wafer handled by the robotic arm, in one or more of these cases, to perform statistical process control (SPC) tracking on the robotic arm to anticipate whether the robotic arm is degrading and plan for down time. The diagnostic operation may be performed to determine whether any component of the robotic arm is malfunctioning.

[0096] Referring to method 560 of FIG. 5D, at block 562, the robotic arm is positioned under the calibration substrate in a first orientation corresponding to the first width of the calibration substrate. In some embodiments, the end effector of the robotic arm is positioned under the calibration substrate. The end effector has a planar upper surface and one or more distal ends on the side opposite the list of the robotic arm. Each of the one or more distal ends has a corresponding protrusion (e.g., a fang) extending upward from the planar surface. The end effector has a plunger disposed on the planar upper surface. The planar upper surface is configured to support the substrate. The plunger is configured to push on one side of the substrate when actuated, while the protrusion (e.g., a fang) presses on the other side of the substrate, whereby the substrate is gripped (e.g., fixed) between the plunger and the protrusion. The robotic arm is capable of transferring the substrate while fixing the substrate via the end effector.

[0097] At block 564, the plunger of the robotic arm is instructed to actuate to fix the calibration substrate in the first orientation. To fix the calibration substrate, the calibration substrate is fixed between the pad (e.g., a fang) at the distal end of the end effector and the plunger.

[0098] At block 566, it is determined whether a first error occurs when fixing the substrate in the first orientation. The robotic arm can actuate the plunger until it reaches the earlier of reaching a threshold time amount or being determined that the substrate is fixed between the plunger and the pad in response to the distance between the distal end of the plunger and the pad being determined (e.g., a sensor determines a threshold resistance amount for the actuation of the plunger). For example, the distance between the plunger and the pad can correspond to each actuation position of the plunger.

[0099] In some embodiments, determining the first error is responsive to determining that the substrate is not fixed between the plunger and the pad within a threshold amount of actuation time of the plunger (e.g., a threshold amount of resistance is not detected within the threshold amount of time). This may indicate that the plunger is malfunctioning by not being actuated or being actuated at a speed below a threshold speed.

[0100] In some embodiments, determining the first error is responsive to determining that the plunger has actuated more than a threshold distance to fix the calibration substrate (resulting in, e.g., a measured width being less than the actual width, etc.). This may indicate that the plunger is malfunctioning by actuating less than the distance it was instructed to actuate.

[0101] In some embodiments, determining the first error is responsive to determining that the measured width of the calibration substrate in a first orientation is different from the actual width of the calibration substrate in the first orientation. This may indicate that the plunger is malfunctioning by not actuating to the extent it was instructed to actuate or not properly fixing the calibration substrate.

[0102] In some embodiments, the first error is responsive to the calibration substrate not being properly seated on the robotic arm (e.g., one or more portions protruding over the fangs of the end effector), or wear of the end effector, etc.

[0103] In block 568, the robotic arm is positioned under the calibration substrate in a second orientation corresponding to a second width of the calibration substrate that is different from the first width. One of the first orientation or the second orientation corresponds to a feature (e.g., a notch, a recess) on the circumferential surface of the calibration substrate.

[0104] In block 570, the plunger of the robotic arm is actuated to fix the calibration substrate in the second orientation. In some embodiments, block 570 is similar to block 564.

[0105] In block 572, it is determined about the occurrence of a second error when fixing the calibration substrate in the second orientation. In some embodiments, block 572 is similar to block 566. In some embodiments, the occurrence of the error is determined for one of the first orientation or the second orientation (for example, there is no error in the other of the first orientation or the second orientation).

[0106] FIG. 6 is a block diagram showing a computer system 600 according to a particular embodiment. In some embodiments, computer system 600 is controller 109 (see, for example, FIG. 1). Computer system 600 (for example, processing device 602) is used to cause a robotic arm to perform an automatic teaching operation, a calibration operation, and / or a diagnostic operation.

[0107] In some embodiments, computer system 600 is connected to other computer systems (e.g., via a network such as a local area network (LAN), intranet, extranet, or the Internet). Computer system 600 operates as a server or client computer in a client-server environment, or as a peer computer in a peer-to-peer (or distributed) network environment. Computer system 600 is provided by a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), mobile phone, web appliance, server, network router, switch or bridge, or any machine capable of (sequentially or otherwise) executing a set of instructions that define actions to be taken by that machine. Further, the term "computer" shall include any collection of computers that individually or jointly execute a set of (or multiple sets of) instructions to perform any one or more of the methods described herein.

[0108] In a further aspect, computer system 600 includes a processing device 602, volatile memory 604 (e.g., random access memory (RAM)), non-volatile memory 606 (e.g., read-only memory (ROM) or electrically-erasable programmable ROM (EEPROM)), and a data storage device 618, which communicate with each other via a bus 608.

[0109] The processing device 602 is provided by one or more processors, such as a general-purpose processor (e.g., a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a microprocessor implementing other types of instruction sets, a microprocessor implementing a combination of other types of instruction sets, or a specialized processor (e.g., an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), or a network processor).

[0110] The computer system 600 further includes a network interface device 622 (e.g., communicating via the network 674). The computer system 600 also includes a video display unit 610 (e.g., a liquid crystal display (LCD)), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generation device 620.

[0111] In some implementations, the data storage device 618 includes a non-transitory computer-readable storage medium 624, and the non-transitory computer-readable storage medium 624 stores instructions 626 encoding any one or more of the methods or functions described herein. The instructions 626 include instructions for implementing the methods described herein (e.g., for causing a robotic arm to perform an automatic teaching operation, for causing a robotic arm to perform a calibration operation, for causing a robotic arm to perform a diagnostic operation, and / or for executing the method 470 of FIG. 4C).

[0112] Command 626 also resides, fully or at least partially, within non-volatile memory 604 and / or within processing device 602 while being executed by computer system 600, and thus, the non-volatile memory 604 and the processing device 602 also constitute a machine-readable storage medium in some embodiments.

[0113] In the example shown, computer-readable storage medium 624 is shown as a single medium, but the term "non-transitory computer-readable storage medium" shall include a single medium or multiple media (e.g., a centralized database or a distributed database, and / or associated caches and servers) that store one or more sets of executable instructions. The term "non-transitory computer-readable storage medium" shall also include any medium that can store or encode a set of instructions for execution by a computer, the set of instructions being capable of causing a computer to perform any one or more of the methods described herein. The term "non-transitory computer-readable storage medium" includes, but is not limited to, solid-state memory, optical media, and magnetic media.

[0114] In some embodiments, the methods, components, and features described herein are implemented by separate hardware components or incorporated into the functionality of other hardware components such as ASICs, FPGAs, DSPs, or similar devices. In some embodiments, the methods, components, and features are implemented by firmware modules or functional circuits within a hardware device. Further, in some embodiments, the methods, components, and features are implemented in any combination of a hardware device and computer program components or in a computer program.

[0115] Unless otherwise specified, terms such as "scanning", "moving", "causing", "performing", "removing", "placing", "directing", "determining", "disposing", "actuating", or "locating" refer to actions and processes that are executed or realized by a computer system that manipulates data represented as physical (electronic) quantities within the registers and memories of the computer system and transforms it into other data similarly represented as physical quantities within the memory or registers of the computer system, or other such information storage devices, transmission devices, or display devices. Further, in this specification, terms such as "first", "second", "third", "fourth", etc. are shown as labels for distinguishing between various elements and need not have an ordinal meaning according to their numerical representation.

[0116] The examples described in this specification also relate to an apparatus for performing the methods described herein. In some embodiments, the apparatus includes a general-purpose computer system that is specially constructed to perform the methods described herein or selectively programmed by a computer program stored in the computer system. In some embodiments, such a computer program is stored in a tangible computer-readable storage medium.

[0117] The methods and examples described in this specification are not inherently related to any particular computer or other device. A variety of general-purpose systems can be used in accordance with the teachings described herein, or more specialized devices can be constructed to perform each of the methods and / or their individual functions, routines, subroutines, or operations described herein. Examples of the structures of various such systems are described in the previous specification.

[0118] In the previous description, for the purpose of better understanding some embodiments of the present disclosure, many specific details such as examples of specific systems, components, methods, etc. have been described. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure can be implemented without the above specific details. In other instances, well-known components or methods are not described in detail or are presented in the form of simple block diagrams in order to avoid unnecessarily obscuring the present disclosure. Therefore, the specific details described are merely illustrative. Specific embodiments can be changed from the above illustrative details and still be considered within the scope of the present disclosure.

[0119] Throughout this specification, the phrase "one embodiment" or "an embodiment" means that the specific features, structures, or characteristics described in connection with that embodiment are included in at least one embodiment. Thus, the phrases "in one embodiment" or "in an embodiment" that appear in various places in this specification do not necessarily all refer to the same embodiment. Further, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the terms "about" or "approximately" are used in this specification, it is intended to mean that the recited nominal value is accurate within a range of ±10%.

[0120] The operations of the methods described in this specification are shown and described in a particular order, but it is possible to change the order of the operations of each method, whereby one operation is executed in the reverse order and one operation is executed at least partially simultaneously with other operations. In other embodiments, sub-steps of instructions or separate operations are executed intermittently and / or alternately.

[0121] The description in the previous specification is to be understood as illustrative and not restrictive. Reading and understanding the description in the previous specification will make many other embodiments apparent to those skilled in the art. Accordingly, the scope of the present disclosure is defined with reference to the appended claims, together with the full scope of equivalents to which such claims are entitled.

Claims

1. An automatic teaching enclosure system, comprising: a plurality of surfaces that at least partially surround an internal space of the automatic teaching enclosure system; an automatic teaching pin at least partially disposed within the internal space, the automatic teaching pin being a scannable feature having a fixed position within the automatic teaching enclosure system; a front interface coupled to one or more of the plurality of surfaces, the front interface for connecting the automatic teaching enclosure system to a substantially vertical portion of a load port of a wafer processing system; and the automatic teaching pin enables an automatic teaching operation of a robot arm of the wafer processing system, the automatic teaching operation being an operation of automatically teaching the fixed position within the automatic teaching enclosure system to the robot arm of the wafer processing system. An automatic teaching enclosure system.

2. A base plate coupled to a bottom surface of the plurality of surfaces, further comprising a base plate for connecting to a substantially horizontal portion of the load port, wherein the automatic teaching pin is fixed to the base plate and extends through the bottom surface into the internal space. The automatic teaching enclosure system according to claim 1.

3. The base plate includes a plurality of receptacles for engaging kinematic pins of the substantially horizontal portion of the load port, and the fixed position of the automatic teaching pin is relative to the plurality of receptacles. The automatic teaching enclosure system according to claim 2.

4. The automatic teaching pin includes a clamp for fixing the automatic teaching pin to the base plate; a seal portion fixed between the clamp and the base plate; and. The automatic teaching enclosure system according to claim 2.

5. The automatic teaching pin includes a first portion including a cylindrical side wall, wherein the robot arm uses the first portion to identify the fixed position within the automatic teaching enclosure system. A first portion and further includes. The automatic teaching enclosure system according to claim 2.

6. The automatic teaching pin includes a second portion including a planar side wall and disposed between the first portion and the base plate, the second portion being configured to enable calibration of robot arm errors. A second portion The automatic teaching enclosure system according to claim 5, further comprising

7. The automatic teaching enclosure system, At least one of a handle or an overhead transport (OHT) flange coupled to at least one of the plurality of surfaces and configured to enable transfer of the automatic teaching enclosure system, and One or more purge adapters coupled to at least one of the plurality of surfaces, One or more purge adapters configured such that, in response to docking at the load port, the front interface is in close contact with the load port and the internal space of the automatic teaching enclosure system is purged through the one or more purge adapters before the automatic teaching enclosure system is opened. The automatic teaching enclosure system according to claim 1, comprising

8. The automatic teaching enclosure system according to claim 1, wherein an end effector of the robot arm enters the internal space and scans the automatic teaching pins to perform the automatic teaching operation of the robot arm.

9. A method comprising: Connecting a front interface of the automatic teaching enclosure system to a substantially vertical portion of a load port of the factory interface to establish a sealed environment including an internal space of the automatic teaching enclosure system and an interior of a factory interface of a wafer processing system; Scanning an automatic teaching pin disposed within the internal space of the automatic teaching enclosure system by a robot arm of the factory interface while maintaining the sealed environment; Determining a fixed position associated with the automatic teaching enclosure system based on the result of the scanning, wherein an article is transferred by a robot arm based on the fixed position. A method comprising

10. Purging the automatic teaching enclosure system through one or more purge adapters coupled to at least one of a plurality of surfaces at least partially surrounding the internal space of the automatic teaching enclosure system; Subsequently opening the automatic teaching enclosure system to establish the sealed environment The method according to claim 9, further comprising

11. scanning, by the robot arm, calibration pins of a calibration substrate placed on a plurality of support structures above an automatic teaching pin within the internal space of the automatic teaching enclosure system to determine a first position of the calibration substrate; removing, by the robot arm, the calibration substrate from the plurality of support structures; instructing the robot arm to place the calibration substrate in the first position; scanning, by the robot arm, the calibration pins of the calibration substrate again to determine a second position of the calibration substrate; determining a robot arm error based on a difference between the first position and the second position; The method according to claim 9, further comprising

12. The method according to claim 11, wherein determining the fixed position is further based on the robot arm error.

13. The method according to claim 11, wherein transferring an article by the robot arm is further based on the robot arm error.

14. positioning the robot arm under the calibration substrate in a first orientation corresponding to a first width of the calibration substrate; actuating a plunger of the robot arm to fix the calibration substrate in the first orientation; determining whether a first error occurs when fixing the calibration substrate in the first orientation; The method according to claim 11, further comprising

15. positioning the robot arm under the calibration substrate in a second orientation corresponding to a second width different from the first width of the calibration substrate; actuating the plunger to fix the calibration substrate in the second orientation; determining whether a second error occurs when fixing the calibration substrate in the second orientation; The method according to claim 14, further comprising

16. An enclosure system, comprising a plurality of surfaces at least partially surrounding an internal space of the enclosure system; a plurality of support structures disposed within the internal space; a calibration substrate placed on the plurality of support structures within the internal space, the calibration substrate including calibration pins A front interface coupled to one or more of the plurality of surfaces, the front interface configured to connect the enclosure system to a substantially vertical portion of a load port of a wafer processing system comprising An enclosure system, wherein the calibration substrate enables a calibration operation of the robot arm to automatically determine a robot arm error of the robot arm of the wafer processing system

17. The enclosure system according to claim 16, further comprising a door connected to the one or more of the plurality of surfaces and configured to prevent movement of the calibration substrate during transfer of the enclosure system

18. An automatic teaching pin at least partially disposed within the internal space below the calibration pin, the automatic teaching pin being a scannable feature having a fixed position within the automatic teaching enclosure system, the automatic teaching pin enabling an automatic teaching operation of the robot arm, the automatic teaching operation being an operation of automatically teaching the robot arm the fixed position within the automatic teaching enclosure system The enclosure system according to claim 16, further comprising

19. The enclosure system according to claim 18, further comprising a collar placed on the automatic teaching pin for supporting the calibration substrate

20. The enclosure system according to claim 16, wherein the calibration substrate enables a diagnostic operation of the robot arm to determine whether a first error occurs when fixing the calibration substrate

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