Optical module and communication device

Abstract

To provide an optical module and a communication device that can be mounted at high density.SOLUTION: An optical module 1 according to the present disclosure comprises: a board 10; an integrated circuit 20 having a first surface 21 and a second surface 22 opposite to the first surface 21, and mounted on the board 10 so that the first surface 21 faces the board 10; an optical component 30 mounted on the board 10; an optical fiber 40 connected to the optical component 30; and a base portion 50 mounted on the integrated circuit 20 and holding at least a part of the optical fiber 40. The optical fiber 40 includes a first portion 40a and a second portion 40b passing through the second surface 22.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an optical module and a communication device. [Background technology]

[0002] Patent Document 1 discloses an optical module used in optical communications. For example, an optical transceiver used in optical communications is required to be equipped with various components, such as an integrated circuit such as an FPGA (Field Programmable Gate Array), an optical transmitter, and an optical receiver. In such an optical transceiver, these components are densely packed to increase the number of components mounted while achieving miniaturization. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-196112 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-059360 [Patent Document 3] International Publication No. 2019 / 181762 Summary of the Invention [Problem to be solved by the invention]

[0004] In such optical transceivers, in addition to electronic devices and optical components, optical fibers connecting the optical components are mounted on the board. However, when mounting the optical fibers in the optical transceiver, they must be spaced apart from other components to prevent interference. In such cases, however, an area for mounting the optical fiber is required in addition to the area for mounting each component, which hinders the high-density mounting of other components.

[0005] One of the objects of the present disclosure is to provide an optical module that can be mounted with high density to solve the above problems.

Means for Solving the Problems

[0006] The optical module according to the present disclosure includes a substrate, an integrated circuit having a first surface and a second surface opposite to the first surface, and the first surface is attached to the substrate so as to face the substrate, an optical component attached to the substrate, an optical fiber connected to the optical component, and a base material portion attached to the integrated circuit and holding at least a part of the optical fiber. The optical fiber includes a first portion passing through the second surface and a second portion passing through the second surface.

[0007] The communication device according to the present disclosure includes the above optical module.

Effects of the Invention

[0008] According to the present disclosure, an optical module and a communication device that can be mounted with high density can be provided.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the following description and drawings are appropriately omitted and simplified for clarity of explanation. In addition, in the following drawings, the same elements are denoted by the same reference numerals, and duplicate explanations are omitted as necessary.

[0011] <Embodiment 1> The optical module according to Embodiment 1 will be described. FIG. 1 is a perspective view illustrating the optical module according to the present disclosure. FIG. 2 is a perspective view illustrating the optical module according to the present disclosure and is an enlarged view of the II region in FIG. 1. FIG. 3 is a perspective view illustrating a housing in the optical module according to the present disclosure. In FIGS. 1 to 3, some reference numerals are omitted so that the drawings do not become complicated.

[0012] As shown in FIGS. 1 to 3, the optical module 1 includes a substrate 10, an integrated circuit 20, an optical component 30, an optical fiber 40, and a base material portion 50. In addition to these, the optical module 1 may further include a first optical fiber accommodating portion 91, a second optical fiber accommodating portion 92, a heat sink 93, a connector 94, an adapter 95, and a housing 96. Note that the optical module 1 may further include other members, or some of these members may be omitted. The optical module 1 has a function as an optical transceiver and is used in a communication device.

[0013] The substrate 10 is, for example, in the shape of a rectangular plate and has two opposing surfaces. The two surfaces are referred to as a first surface 11 and a second surface 12. Therefore, the substrate 10 has the first surface 11 and the second surface 12. The second surface 12 is the surface on the opposite side of the first surface 11.

[0014] Here, for the convenience of explaining the optical module 1, an XYZ orthogonal coordinate system is introduced. The direction orthogonal to the second surface 12 is defined as the Z-axis direction, and the plane parallel to the second surface 12 is defined as the XY plane. The direction in which the second surface 12 faces is defined as the +Z-axis direction, and the opposite direction is defined as the -Z-axis direction. The +Z-axis direction may be referred to as the upper direction, and the -Z-axis direction may be referred to as the lower direction. Note that the upper and lower directions are for the convenience of explaining the optical module 1 and do not indicate the direction in which the actual optical module 1 is arranged.

[0015] The integrated circuit 20 is, for example, in the shape of a rectangular plate and has two opposing surfaces. The two surfaces are referred to as the first surface 21 and the second surface 22. Accordingly, the integrated circuit 20 has the first surface 21 and the second surface 22. The second surface 22 is the surface on the opposite side of the first surface 21. In FIGS. 1 and 2, the integrated circuit 20 is hatched. The integrated circuit 20 controls the operation of each component in the optical module 1. The integrated circuit 20 includes, for example, an FPGA. Note that the integrated circuit 20 may have other circuits such as a CPU, as long as it controls the operation of each component in the optical module 1, and is not limited to an FPGA.

[0016] The integrated circuit 20 is attached to the second surface 12 side of the substrate 10. The integrated circuit 20 is attached to the substrate 10 such that the first surface 21 faces the substrate 10. The integrated circuit 20 may be disposed on the -X-axis direction side on the second surface 12 of the substrate 10. A base material portion 50 is disposed on the second surface 22 of the integrated circuit 20. The integrated circuit 20 may be held by the substrate 10 by the base material portion 50.

[0017] The optical component 30 includes a light source 31, an optical transmitter 32, an optical receiver 33, and an optical fiber type amplifier 34. The optical component 30 may further include other members in addition to these. The optical component 30 is attached to the substrate 10. For example, each optical component 30 is disposed on the second surface 12 of the substrate 10. Each optical component 30 is disposed, for example, on the -X-axis direction side of the heat sink 93 on the second surface 12 of the substrate 10. The heat sink 93 has a cooling function. The optical transmitter 32 and the optical receiver 33 are arranged side by side in the Y-axis direction at the central portion between the heat sink 93 and the integrated circuit 20. The light source 31 is disposed on the -Y-axis direction side on the second surface 12 of the substrate 10, and the optical fiber type amplifier 34 is disposed on the +Y-axis direction side on the second surface 12 of the substrate 10.

[0018] The integrated circuit 20, the optical transmitter 32 or the optical receiver 33, and the heat sink 93 are arranged in a straight line in a plane parallel to the second surface 12 of the substrate 10. By arranging them in this way, the cooling effect on the integrated circuit 20 and the optical components 30 such as the optical transmitter 32 and the optical receiver 33 can be improved.

[0019] The light source 31 generates the light used for the optical signal. The light source 31 includes, for example, an Integrable Tunable Laser Assembly (hereinafter referred to as ITLA). Note that the light source 31 is not limited to ITLA as long as it generates the light used for the optical signal. Two light sources 31 are shown in the figure, but only one of the light sources 31 may be used.

[0020] The optical transmitter 32 outputs an optical signal with information added. The optical transmitter 32 includes, for example, Code Division Multiplexing (hereinafter referred to as CDM). The optical transmitter 32 adds information by modulating the light generated by the light source 31 and then outputs it. The optical transmitter 32 is not limited to CDM as long as it can output an optical signal.

[0021] The optical receiver 33 receives the optical signal and extracts the information. The optical receiver 33 includes, for example, an Intradyne Coherent Receiver (hereinafter referred to as ICR). The optical receiver 33 extracts information from the interference wave obtained by interfering the input light with the light generated by the light source 31. The optical receiver 33 is not limited to ICR as long as it can receive the optical signal.

[0022] The optical fiber type amplifier 34 is housed inside the second optical fiber housing portion 92. The optical fiber type amplifier 34 amplifies an optical signal. For example, the optical fiber type amplifier 34 amplifies the optical signal output from the optical transmitter 32. The optical fiber type amplifier 34 may include, for example, an erbium-doped fiber amplifier (hereinafter referred to as EDFA). Note that the optical fiber type amplifier 34 is not limited to EDFA as long as it can amplify an optical signal.

[0023] The optical fiber 40 is connected to the optical component 30. For example, the optical fiber 40 connects predetermined members in the optical component 30. For example, the optical fiber 40 connects the light source 31 and the optical transmitter 32. Also, the optical fiber 40 connects the light source 31 and the optical receiver 33. Further, the optical fiber 40 connects the optical transmitter 32 and the optical fiber type amplifier 34. When connecting the light source 31 to the optical transmitter 32 and the optical receiver 33, a coupler may be sandwiched between the light source 31 and the optical transmitter 32 and the optical receiver 33.

[0024] Also, the optical fiber 40 may connect the optical component 30 and the connector 94. For example, the optical fiber 40 connects the optical fiber type amplifier 34 and the connector 94. Also, the optical fiber 40 connects the optical receiver 33 and the connector 94. The extra length portion of the optical fiber 40 may be housed in the first optical fiber housing portion 91.

[0025] The optical fiber 40 has portions passing through the second surface 22 of the integrated circuit 20. For example, the optical fiber 40 includes a first portion 40a and a second portion 40b passing through the second surface 22 of the integrated circuit 20. Thus, since a plurality of portions of the optical fiber 40 pass through the second surface 22 of the integrated circuit 20, the area occupied by the optical fiber 40 on the second surface 12 of the substrate 10 can be reduced. Therefore, each component of the optical module 1 can be mounted at high density. Also, a plurality of portions of the optical fiber 40 passing through the second surface 22 of the integrated circuit 20 press the integrated circuit 20 against the substrate 10 in a well-balanced manner. Therefore, the attachment of the integrated circuit 20 attached to the substrate 10 to the substrate 10 can be held.

[0026] In addition to the first portion 40a and the second portion 40b, the optical fiber 40 may further include a third portion 40c. The first portion 40a, the second portion 40b, and the third portion 40c of the optical fiber 40 each pass through the second surface 22 so as to cross over the second surface 22 of the integrated circuit 20. The second surface 22 of the integrated circuit 20 is, for example, rectangular and has a first side 23, a second side 24, a third side 25, and a fourth side 26. The first side 23 and the third side 25 are opposite to each other, and the second side 24 and the fourth side 26 are opposite to each other.

[0027] The first portion 40a of the optical fiber 40 intersects, for example, the first side 23 and the third side 25. Thus, at least one of the first portion 40a and the second portion 40b of the optical fiber 40 intersects one side of the second surface 22 of the integrated circuit 20 and the other side opposite to the one side. One end of the first portion 40a is connected to the optical fiber 40 connected to the light source 31. Specifically, the end portion on the side intersecting the first side 23 in the first portion 40a is connected to the optical fiber 40 connected to the light source 31. The other end of the first portion 40a, that is, the end portion on the side intersecting the third side 25 in the first portion 40a, is connected to, for example, the optical fiber 40 housed in the first optical fiber housing portion 91. Note that the connection destination of the end portion of the first portion 40a is merely an example, and it may be connected to other optical components 30 or connectors 94 or the like depending on the specifications and design of the optical module 1. The same applies to the connection destinations of the second portion 40b and the third portion 40c.

[0028] The second portion 40b of the optical fiber 40 intersects, for example, the second side 24 and the third side 25. One end of the second portion 40b, for example, the end portion on the side intersecting the second side 24 in the second portion 40b, may be connected to the optical fiber 40 connected to the optical transmitter 32 or may be connected to the optical fiber 40 connected to the optical receiver 33. The other end of the second portion 40b, that is, the end portion on the side intersecting the third side 25 in the second portion 40b, may be connected to the optical fiber 40 connected to the optical fiber type amplifier 34 or may be connected to the optical fiber 40 housed in the first optical fiber housing portion 91.

[0029] The third portion 40c of the optical fiber 40 intersects, for example, the first side 23 and the third side 25. One end of the third portion 40c, for example, the end on the side that intersects the first side 23 in the third portion 40c, is connected to the optical fiber 40 connected to the light source 31. The other end of the third portion 40c, that is, the end on the side that intersects the third side 25 in the third portion 40c, is connected to, for example, the optical fiber 40 housed in the first optical fiber housing portion 91.

[0030] The base material portion 50 is attached to the integrated circuit 20. For example, the base material portion 50 is attached so as to straddle the second surface 22 of the integrated circuit 20. The base material portion 50 holds at least a part of the optical fiber 40. The base material portion 50 includes a holding portion 60, a plurality of guides 70, and a plurality of support portions 80 when classified by the type of member constituting the base material portion 50. The base material portion 50 includes a first base material portion 50a, a second base material portion 50b, and a third base material portion 50c when classified by the portion attached to the integrated circuit 20.

[0031] The holding portion 60 is a portion disposed on the second surface 22 of the integrated circuit 20. The holding portion 60 may have a first surface 61 and a second surface 62 on the opposite side of the first surface 61. The holding portion 60 may be plate-shaped, but is not limited thereto. The first surface 61 of the holding portion 60 faces the second surface 22 of the integrated circuit 20. The first surface 61 of the holding portion 60 holds the integrated circuit 20. A plurality of guides 70 are provided on the second surface 62 of the holding portion 60.

[0032] The guide 70 holds the optical fiber 40. The guide 70 is, for example, annular and holds the optical fiber 40 inside. Note that the guide 70 may have a shape other than annular as long as it can hold the optical fiber 40. The optical fiber 40 passes through the guide 70 and passes through the second surface 22 of the integrated circuit 20.

[0033] The support portion 80 is a portion that supports the holding portion 60. The support portion 80 directly or indirectly fixes the holding portion 60 to the substrate 10. For example, one end of the support portion 80 is fixed to the substrate 10, and the other end of the support portion 80 is connected to the holding portion 60.

[0034] The holding part 60 includes a first holding portion 60a, a second holding portion 60b, and a third holding portion 60c. Each holding portion is arranged along the optical fiber 40 passing through the second surface 22 of the integrated circuit 20. One or more guides 70 are arranged on the second surface 62 of each holding portion. The end of each holding portion is connected to another holding portion or to the support portion 80. Thus, the support portion 80 supports each holding portion.

[0035] The first holding portion 60a has a portion arranged along the first portion 40a of the optical fiber 40. Specifically, the first holding portion 60a has a portion extending from the first side 23 to the third side 25 of the second surface 22 of the integrated circuit 20. Both ends of the first holding portion 60a are supported by the support portion 80. The first portion 40a of the optical fiber 40 passes through the second surface 22 of the integrated circuit 20 by being held by the first holding portion 60a. Thus, the first holding portion 60a holds the first portion 40a.

[0036] The second holding portion 60b has a portion arranged along the second portion 40b of the optical fiber 40. The second holding portion 60b overlaps at the portion intersecting the first holding portion 60a. That is, the second holding portion 60b is connected to the first holding portion 60a at the portion intersecting the first holding portion 60a. The end of the second holding portion 60b on the third side 25 side is supported by the support portion 80. The second portion 40b of the optical fiber 40 passes through the second surface 22 of the integrated circuit 20 by being held by the second holding portion 60b. Thus, the second holding portion 60b holds the second portion 40b.

[0037] The third holding portion 60c has a portion disposed along the third portion 40c of the optical fiber 40. The third holding portion 60c overlaps at the portion intersecting with the first holding portion 60a and the second holding portion 60b. That is, the third holding portion 60c is connected to the first holding portion 60a and the second holding portion 60b at the portion intersecting with the first holding portion 60a and the second holding portion 60b. The end portion of the third holding portion 60c on the first side 23 side is supported by the support portion 80. The third portion 40c of the optical fiber 40 passes through the second surface 22 of the integrated circuit 20 by being held by the third holding portion 60c. Thus, the third holding portion 60c holds the third portion 40c.

[0038] The first base material portion 50a includes the first holding portion 60a. Accordingly, the first base material portion 50a holds the first portion 40a. The second base material portion 50b includes the second holding portion 60b. Accordingly, the second base material portion 50b holds the second portion 40b. The third base material portion 50c includes the third holding portion 60c. Accordingly, the third base material portion 50c holds the third portion 40c.

[0039] The base material portion 50 has a notch portion 55 that penetrates to the second surface 22 of the integrated circuit 20 at least in a part other than the region where the path of the optical fiber 40 is located among the surfaces holding the first portion 40a, the second portion 40b, and the third portion 40c of the optical fiber 40. Specifically, between the first base material portion 50a and the second base material portion 50b is the notch portion 55. Accordingly, the second surface 22 of the integrated circuit 20 is exposed between the first base material portion 50a and the second base material portion 50b. Between the second base material portion 50b and the third base material portion 50c is the notch portion 55. Accordingly, the second surface 22 of the integrated circuit 20 is exposed between the second base material portion 50b and the third base material portion 50c. Between the third base material portion 50c and the first base material portion 50a is the notch portion 55. Accordingly, the second surface 22 of the integrated circuit 20 is exposed between the third base material portion 50c and the first base material portion 50a.

[0040] Thus, since the notch portion 55 is provided in a portion of the base material portion 50 other than the region where the path of the optical fiber 40 is located, the integrated circuit 20 can be air-cooled.

[0041] The first optical fiber accommodating portion 91 accommodates a part of the optical fiber 40 that is not held by the base material portion 50. That is, the first optical fiber accommodating portion 91 accommodates the surplus length portion of the optical fiber 40. The first optical fiber accommodating portion 91 is disposed on the +Z-axis direction side of the second optical fiber accommodating portion 92. That is, the first optical fiber accommodating portion 91 is provided so as to be laminated on the second optical fiber accommodating portion 92. The second optical fiber accommodating portion 92 accommodates the optical fiber type amplifier 34.

[0042] The heat sink 93, the connector 94, and the adapter 95 are also disposed on the second surface 12 side of the substrate 10. The connector 94 and the adapter 95 are disposed on the +X-axis direction side of the heat sink 93. The housing 96 accommodates the substrate 10, the integrated circuit 20, the optical component 30, the optical fiber 40, the base material portion 50, the first optical fiber accommodating portion 91, the second optical fiber accommodating portion 92, the heat sink 93, the connector 94, and the adapter 95. The thickness of the heat sink 93 from the second surface 12 of the substrate 10 is larger than the thickness of the integrated circuit 20 from the second surface 12 of the substrate 10. Therefore, a space is formed on the second surface 22 side of the integrated circuit 20. Thereby, the cooled gas 97 from the heat sink 93 can cool the integrated circuit 20.

[0043] Next, the effects of the present embodiment will be described. The optical module 1 of the present embodiment includes the base material portion 50, so that the optical fiber 40 can be fixed on the integrated circuit 20. Therefore, a part of the region on the substrate 10 used for fixing the optical fiber 40 becomes unnecessary. Thereby, the region used for fixing the optical fiber 40 can be made smaller than the case where the path of the optical fiber 40 is provided only on the substrate 10, and the mounting region of the members constituting the optical module 1 can be secured. With such a configuration, high-density mounting can be achieved.

[0044] Further, the optical module 1 passes the first portion 40a and the second portion 40b of the optical fiber 40 through the second surface 22 of the integrated circuit 20. Thereby, the holding force for stably fixing the integrated circuit 20 to the substrate 10 can be improved. Further, since the optical module 1 has a notch 55 between the first base material portion 50a that holds the first portion 40a and the second base material portion 50b that holds the second portion 40b, the air cooling function of the integrated circuit 20 can be improved.

[0045] Furthermore, the optical module 1 can reduce the area used for fixing each optical fiber 40 by laminating and providing the first optical fiber accommodating portion 91 and the second optical fiber accommodating portion 92. Therefore, the mounting area for the components constituting the optical module 1 can be secured.

[0046] As described above, the present disclosure has been described with reference to the embodiments, but the present disclosure is not limited to the above-described embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure. And each configuration in the embodiment can be combined as appropriate.

[0047] Each drawing is merely an illustration for explaining one or more embodiments. Each drawing is not associated with only one specific embodiment, but may be associated with one or more other embodiments. As can be understood by those skilled in the art, various features described with reference to any one drawing can be combined with features shown in one or more other drawings to create, for example, embodiments not explicitly illustrated or described. Not all of the features shown in any one drawing for explaining exemplary embodiments are necessarily essential, and some features may be omitted.

[0048] Some or all of the above embodiments may be described as follows in the appended claims, but are not limited thereto.

[0049] (Appended Claim 1) A substrate, An integrated circuit having a first surface and a second surface opposite to the first surface, and attached to the substrate such that the first surface faces the substrate, An optical component attached to the substrate, An optical fiber connected to the optical component, A base material portion attached to the integrated circuit and holding at least a part of the optical fiber, Comprising: The optical fiber is A first portion passing through the second surface, A second portion passing through the second surface, Including: The optical component is An optical transmitter that outputs an optical signal, An optical receiver that receives the optical signal, An optical fiber amplifier that amplifies the optical signal, Including: A first optical fiber housing portion that houses a part of the optical fiber not held by the base material portion, A second optical fiber housing portion that houses the optical fiber amplifier, Further comprising: The first optical fiber housing portion is provided laminated on the second optical fiber housing portion, One end of the second portion is connected to the optical fiber connected to the optical receiver, Optical module. (Appendix 2) A communication device including the optical module described in Appendix 1.

Explanation of Signs

[0050] 1 Optical module 10 Substrate 11 First surface 12 Second surface 20 Integrated circuit 21 First surface 22 Second surface 23 First side 24 Second side 25 Third side 26 Fourth side 30 Optical component 31 Light source 32 Optical transmitter 33 Optical receiver 34 Optical fiber type amplifier 40 Optical fiber 40a First part 40b Second part 40c Third part 50 Base material part 50a First base material part 50b Second base material part 50c Third base material part 55 Notch part 60 Holding part 60a First holding part 60b Second holding part 60c Third holding part 61 First surface 62 Second surface 70 Guide 80 Support part 91 First optical fiber housing part 92 Second optical fiber housing part 93 Heat sink 94 Connector 95 Adapter 96 Housing 97 Gas

Claims

1. A substrate, An integrated circuit having a first surface and a second surface opposite to the first surface, and attached to the substrate such that the first surface faces the substrate, An optical component attached to the substrate, An optical fiber connected to the optical component, A base material part attached to the integrated circuit and holding at least a part of the optical fiber, Comprising, The optical fiber, A first portion passing through the second surface, A second portion passing through the second surface, Including, An optical module.

2. At least one of the first portion and the second portion intersects one side of the second surface and the other side opposite to the one side, The optical module according to Claim 1.

3. The base material part, A first base material portion holding the first portion, A second base material portion holding the second portion, Including, The optical module according to Claim 1.

4. The second surface is exposed between the first base material portion and the second base material portion, The optical module according to Claim 3.

5. The base material part has a notch that penetrates to the second surface at least in a part other than the region where the path of the optical fiber is located among the surfaces holding the optical fiber, The optical module according to Claim 1.

6. The optical component, An optical transmitter that outputs an optical signal and An optical fiber type amplifier that amplifies the optical signal, Including, A first optical fiber housing portion that houses a part of the optical fiber not held by the base material part, A second optical fiber housing portion that houses the optical fiber type amplifier, Further comprising, The first optical fiber housing portion is provided laminated on the second optical fiber housing portion, The optical module according to Claim 1.

7. Further comprising a heat sink having a cooling function, The integrated circuit, the optical transmitter, and the heat sink are arranged so as to be aligned in a straight line in a plane parallel to one surface of the substrate, The optical module according to Claim 6.

8. Further comprising a housing that houses the substrate, the integrated circuit, the optical component, the optical fiber, the base material part, the first optical fiber housing portion, the second optical fiber housing portion, and the heat sink, The thickness of the heat sink from the one surface is larger than the thickness of the integrated circuit from the one surface, A space is formed on the second surface side of the integrated circuit, The optical module according to Claim 7.

9. The optical component further includes a light source that generates light used for the optical signal, One end of the first part is connected to the optical fiber connected to the light source. The optical module according to claim 6.

10. A communication device comprising the optical module according to any one of claims 1 to 9.

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