Electronic apparatus

Abstract

To provide a technique advantageous for miniaturization of an electronic apparatus and countermeasures against noise.SOLUTION: An electronic apparatus comprises: an electronic unit having a stationary part and a movable part movable relative to the stationary part; a first conductive portion having a first principal surface and a second principal surface on the opposite side of the first principal surface; and a second conductive portion having a third principal surface and a fourth principal surface on the opposite side of the third principal surface. The first principal surface is located between the stationary part and the second principal surface. The third principal surface is located between the movable part and the fourth principal surface. The third principal surface is located between the fourth principal surface and a virtual plane including the first principal surface and along the first principal surface. A part of the movable part is movable relative to the first conductive portion and the second conductive portion and can intersect the plane.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] An electronic device having an electronic unit is provided with a conductive plate for noise suppression, etc. Patent Document 1 discloses an imaging device, which is an example of an electronic device. The imaging device disclosed in Patent Document 1 is provided with a conductive shielding member.

[0003] Furthermore, the electronic unit has a fixed part and a movable part movable relative to the fixed part, and the movable part moves toward or away from the conductive plate. Patent Document 2 discloses an imaging device, which is an example of an electronic device. The imaging device disclosed in Patent Document 2 is configured to control image stabilization. The image stabilization is controlled by moving a movable part including an image sensor so as to reduce shaking of the optical image received by the image sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2011 / 129118 [Patent Document 2] International Publication No. 2020 / 121541 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, electronic devices have become increasingly miniaturized. To achieve this, electronic units must be housed in the narrow spaces inside the electronic device's exterior. Furthermore, the moving parts of the electronic units must have sufficient range of motion. Electronic units also need to be protected against noise, such as electrostatic discharge (ESD).

[0006] The present disclosure aims to provide a technique that is advantageous for miniaturizing electronic devices and suppressing noise. [Means for solving the problem]

[0007] A first aspect of the present disclosure is an electronic device comprising: an electronic unit having a fixed portion and a movable portion movable relative to the fixed portion; a first conductive portion having a first main surface and a second main surface opposite the first main surface; and a second conductive portion having a third main surface and a fourth main surface opposite the third main surface, wherein the first main surface is located between the fixed portion and the second main surface, the third main surface is located between the movable portion and the fourth main surface, the third main surface is located between an imaginary plane that includes the first main surface and extends along the first main surface and the fourth main surface, and a portion of the movable portion is movable relative to the first conductive portion and the second conductive portion and can intersect the plane.

[0008] A second aspect of the present disclosure is an electronic device comprising: an electronic unit having a fixed portion and a movable portion movable relative to the fixed portion; a first conductive portion having a first main surface and a second main surface opposite the first main surface; and a second conductive portion having a third main surface and a fourth main surface opposite the third main surface, wherein an imaginary plane including the first main surface and extending along the first main surface has a first region overlapping the first conductive portion in a direction perpendicular to the plane, a second region overlapping the second conductive portion in a direction perpendicular to the plane, and a third region between the first region and the second region, wherein a current is configured to flow from the first conductive portion to the second conductive portion, and a portion of the movable portion is movable relative to the first conductive portion and the second conductive portion and can intersect with the third region. [Effects of the Invention]

[0009] The present disclosure provides a technique that is advantageous for miniaturizing electronic devices and suppressing noise. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic perspective view of a camera, which is an imaging device as an example of an electronic device according to a first embodiment. [Figure 2] 1A is a schematic cross-sectional view of the camera according to the first embodiment, and FIG. 1B is an explanatory diagram of an imaging module, a processing module, and a flexible substrate according to the first embodiment. [Figure 3] FIG. 1 is a perspective view of a partial configuration of a camera according to a first embodiment. [Figure 4] FIG. 2 is a bottom view of the camera according to the first embodiment. [Figure 5] FIG. 2 is a perspective view of the electronic unit according to the first embodiment. [Figure 6] FIG. 2 is an exploded perspective view of the electronic unit according to the first embodiment. [Figure 7] 1A and 1B are cross-sectional views of a part of the camera according to the first embodiment. [Figure 8] 1A is an explanatory diagram of a camera of a comparative example, and FIG. 1B is an explanatory diagram of a camera according to the first embodiment. [Figure 9] FIG. 10 is an explanatory diagram of a camera according to a first modified example of the first embodiment. [Figure 10] Graphs (a) and (b) show the results of the simulation. [Figure 11] 10(a) and 10(b) are explanatory diagrams of a camera according to a second embodiment. [Figure 12] 10(a) and 10(b) are explanatory diagrams of a camera according to a second modification of the second embodiment. [Figure 13] 10(a) and 10(b) are explanatory diagrams of a camera according to a third embodiment. [Figure 14]10(a) is an explanatory diagram of a camera according to a third modification of the third embodiment, and FIG. 10(b) is an explanatory diagram of a camera according to a fourth modification of the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same components are assigned the same reference numerals, and redundant explanations will be omitted. In the following embodiments, directions are indicated by an XYZ coordinate system, which is a Cartesian coordinate system. The X-axis, Y-axis, and Z-axis are perpendicular to one another. The direction of the X-axis is also referred to as the X-direction, the direction of the Y-axis as the Y-direction, and the direction of the Z-axis as the Z-direction. The Y-direction is, for example, the direction along the optical axis (optical axis direction). The plane including the X-axis and Y-axis is referred to as the XY plane.

[0012] [First embodiment] Fig. 1 is a schematic perspective view of a camera 600, which is an imaging device as an example of an electronic device according to the first embodiment. Fig. 2(a) is a schematic cross-sectional view of the camera 600 according to the first embodiment.

[0013] The camera 600 is a digital camera with interchangeable lenses, and a lens unit (lens barrel) 650 including a lens can be attached to or detached from the camera (camera body) 600. The camera 600 includes an exterior casing 300, and an imaging module 6 and a processing module 10 arranged inside the exterior casing 300. The imaging module 6 and the processing module 10 are electrically connected by a flexible substrate 7. A battery (not shown) is provided inside the exterior casing 300. The flexible substrate 7 includes a flexible wiring member.

[0014] Fig. 2(b) is an explanatory diagram of the imaging module 6, the processing module 10, and the flexible substrate 7 according to the first embodiment. Fig. 2(b) schematically illustrates the imaging module 6, the processing module 10, and the flexible substrate 7 in a state where they have been removed from the exterior casing 300 and unfolded.

[0015] The imaging module 6 includes an image sensor 601 that performs photoelectric conversion, a communication circuit (not shown) required for mutual communication with the processing module 10, and a wiring board 602. The image sensor 601 and the communication circuit (not shown) are mounted on the wiring board 602. The wiring board 602 may be a rigid printed wiring board. The wiring board 602 is provided with circuits (not shown), wiring (not shown), and components (not shown) required for the operation of the image sensor 601. The image sensor 601 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The image sensor 601 has a light receiving surface 611. An optical path is secured on the side of the light receiving surface 611 of the image sensor 601 so that light is incident on the light receiving surface 611 of the image sensor 601 along the direction of the optical axis 4. The incident direction of light along the optical axis 4 is the positive direction of the Y axis. The Y axis is a direction perpendicular to the light receiving surface 611. The image sensor 601 converts the light image (subject light) formed on the light receiving surface 611 by the lens unit 650 into an electric signal (image signal). The electric signal is output to the processing module 10.

[0016] The image sensor 601 may be a packaged semiconductor package. The image sensor 601 includes a semiconductor integrated circuit including a plurality of photoelectric conversion elements and a ceramic substrate (interposer) on which the semiconductor integrated circuit is mounted. Note that the interposer may be omitted from the image sensor 601, and the semiconductor integrated circuit may be directly mounted on the wiring board 602, or the wiring board 602 may be omitted from the imaging module 6, and the flexible substrate 7 may be directly connected to the image sensor 601.

[0017] The processing module 10 includes an image processing engine 101, a power supply circuit 102, a communication circuit (not shown) required for mutual communication with the imaging module 6, and a wiring board 103. The image processing engine 101, the power supply circuit 102, and the communication circuit (not shown) are mounted on the wiring board 103. The wiring board 103 may be a rigid printed wiring board. The image processing engine 101 is, for example, a digital signal processor, and is an image processing device that acquires an electrical signal from the image sensor 601 via a flexible substrate 7, corrects the acquired electrical signal, and generates image data. The image processing engine 101 receives an input of an image signal from the image sensor 601 via a transmission path. In the first embodiment, the transmission path is the flexible substrate 7. The power supply circuit 102 is connected to a battery (not shown), and supplies power to the image processing engine 101, the imaging module 6, etc. by applying a predetermined voltage to the image processing engine 101, the imaging module 6, etc.

[0018] Image signals are transmitted from the imaging module 6 to the processing module 10 via a flexible substrate 7. One end of the flexible substrate 7 is connected to, for example, a mounting surface of the wiring board 602 opposite to the mounting surface on which the image sensor 601 is mounted. The other end of the flexible substrate 7 is connected to, for example, a mounting surface of the wiring board 103 opposite to the mounting surface on which the image processing engine 101 is mounted. The imaging module 6 and the flexible substrate 7 are connected via a connector, and the processing module 10 and the flexible substrate 7 are connected via a connector. In addition to image signals, power supply currents and control signals are also transmitted between the imaging module 6 and the processing module 10 via the flexible substrate 7. That is, the flexible substrate 7 includes differential signal lines used to transmit image signals, power supply lines used to transmit power, and ground lines serving as a reference potential. The image signals transmitted from the imaging module 6 to the processing module 10 via the flexible substrate 7 may be digital signals or may be analog signals.

[0019] The exterior 300 shown in Figure 1 has a top exterior 301 located at the top of the camera 600, a front exterior 302 located at the front (light incident side) of the camera 600, a back exterior 303 located at the rear opposite the front exterior 302, a right side exterior 304 located on the right side of the camera 600 when looking at the front exterior 302 from the front, a left side exterior 305 located on the left side of the camera 600 when looking at the front exterior 302 from the front, and a bottom exterior 306 located at the bottom of the camera 600.

[0020] The top exterior 301 is an exterior member made of, for example, conductive resin. The front exterior 302 is an exterior member made of, for example, a metal such as a magnesium alloy. The front exterior 302 has a ring-shaped mount portion 307 to which the lens unit 650 shown in FIG. 2(a) is attached. A through-hole 308 is defined inside the mount portion 307, which serves as a path for subject light that is irradiated onto the light receiving surface 611 of the image sensor 601 via the lens unit 650. The back exterior 303 is an exterior member located on the back side of the exterior 300. The back exterior 303 is made of, for example, the same conductive resin as the top exterior 301. The right side exterior 304 is made of, for example, insulating resin, and is an exterior member in which an external interface connection connector (not shown) is disposed. The left side exterior 305 is connected to bending portions (not shown) provided on the front exterior 302 and the back exterior 303, respectively. Bottom exterior 306 is made of a plastic exterior member, for example, insulating resin, and has an insertion port for a battery (not shown) required to drive camera 600. In other words, bottom exterior 306 is preferably non-conductive to ensure insulation from the battery. Exteriors 301 to 306 are connected to each other with metallic (conductive) screws (not shown).

[0021] 3 is a perspective view of a portion of the configuration of a camera 600 according to the first embodiment. The camera 600 includes an electronic unit 100, a plate 11 disposed between the electronic unit 100 and the processing module 10 in the Y direction, and a bottom plate 21 disposed on the negative side of the Z axis relative to the electronic unit 100. The electronic unit 100 includes the imaging module 6 described above.

[0022] The plate 11 and the bottom plate 21 are fixed to the exterior 300 of Fig. 1 with screws or the like (not shown). The electronic unit 100 is fixed to the exterior 300 of Fig. 1 or the plate 11 with screws or the like (not shown). Here, "A" being fixed to "B" is synonymous with "B" being fixed to "A". Also, viewing in the Z direction also means viewing from the perspective in the Z direction. The same applies to the X direction and the Y direction.

[0023] The plate 11 is a conductive plate having approximately the same area as the processing module 10 when viewed in the Y direction. The processing module 10 is fixed to the plate 11 at multiple locations with conductive screws or the like, and is electrically connected to the plate 11. In this way, the processing module 10 is electrically connected to the plate 11 at multiple locations, and the plate 11 serves as a heat dissipation member that releases heat from the processing module 10 to the outside, and as a ground that serves as a reference for electric potential. The plate 11 may also be configured to be electrically connected to the exterior 300.

[0024] The bottom plate 21 is a conductive plate and an example of a first conductive portion. The bottom plate 21 is located at the bottom of the camera 600. When viewed in the Z direction, the bottom plate 21 is a conductive member having a substantially rectangular shape and is fixed to the bottom exterior 306 of the exterior casing 300 shown in FIG. 1 with conductive screws or the like. The bottom plate 21 has a main surface 211 and a main surface 212 opposite the main surface 211. The main surface 211 faces the electronic unit 100, i.e., faces inward, and the main surface 212 faces the bottom exterior 306, i.e., faces outward. In other words, the bottom plate 21 is disposed between the bottom exterior 306 and the electronic unit 100. The main surface 211 is an example of a first main surface, and the main surface 212 is an example of a second main surface. The main surfaces 211 and 212 are, for example, planes parallel to the XY plane. The principal surfaces 211 and 212 are substantially parallel to each other. Therefore, the direction perpendicular to the principal surface 211 is substantially the same as the direction perpendicular to the principal surface 212.

[0025] FIG. 4 is a bottom view of the camera 600 according to the first embodiment. For ease of explanation, the bottom exterior 306 is shown in FIG. 4 with a dashed line. A screw receiving portion 22 for receiving a tripod screw is fixed to the bottom plate 21. For example, the cylindrical portion of the screw receiving portion 22 is inserted into a hole (not shown) formed in the approximate center of the bottom plate 21, and the screw receiving portion 22 is fixed to the bottom plate 21 with screws 22a, 22b, and 24. The screws 22a, 22b, and 24 may be made of metal, i.e., conductive screws. The screw receiving portion 22 has a plurality of positioning protrusions 26a and 26b. The screw receiving portion 22 is positioned on the bottom plate 21 by fitting the protrusions 26a and 26b into a plurality of holes formed in the bottom plate 21.

[0026] The screw receiving portion 22 is made of metal, i.e., a conductive member. The cylindrical portion of the screw receiving portion 22 has a screw hole that receives a screw of a camera tripod (not shown). By fastening the camera tripod to the screw receiving portion 22 by screwing it, the entire camera 600 including the bottom plate 21 and the electronic unit 100 can be fixed to the camera tripod.

[0027] Since a camera tripod is connected to the screw receiving portion 22, the screw holes of the screw receiving portion 22 are not covered by the bottom exterior 306, but the portions other than the screw holes may be covered by the bottom exterior 306. Therefore, the bottom plate 21 and a portion of the screw receiving portion 22 are covered by the bottom exterior 306.

[0028] The bottom exterior 306 and the bottom plate 21 are fixed to the front exterior 302 with screws 14a, 16a, 16b, and 16c. The screws 14a, 16a, 16b, and 16c may be made of metal, i.e., conductive screws. The bottom exterior 306 and the bottom plate 21 are fixed to the back exterior 303 with screws 14b, 16d, and 16e. The screws 14b, 16d, and 16e may be made of metal, i.e., conductive screws.

[0029] The bottom plate 21 has the effect of shielding noise from outside or inside the camera 600. When the bottom plate 21 is supported on a tripod via the screw receiving portion 22, force due to the weight of the camera 600 may be applied to the bottom plate 21, so the area and thickness of the bottom plate 21 are set to provide high strength.

[0030] The electronic unit 100 has a correction mechanism that reduces the influence of camera 600 shaking caused by the user's hand shake or the like on the captured image by moving the imaging module 6 in a translation direction approximately perpendicular to the optical axis 4 and in a rotation direction around the optical axis 4.

[0031] Fig. 5 is a perspective view of the electronic unit 100 according to the first embodiment. Fig. 6 is an exploded perspective view of the electronic unit 100 according to the first embodiment.

[0032] The electronic unit 100 has a movable part 50 including the imaging module 6 described above, a fixed part 80 fixed to the plate 11 or the exterior casing 300, and an actuator 5. The movable part 50 is configured to be movable within a predetermined range of motion relative to the fixed part 80. The fixed part 80 also functions as a support part that supports the movable part 50.

[0033] The movable direction of the movable part 50 includes a direction intersecting the main surface 211, and in the first embodiment, a direction within a plane parallel to the XZ plane that is perpendicular to the main surface 211. That is, the movable direction of the movable part 50 includes a translation direction parallel to the XZ plane and a rotation direction within the XZ plane. In this way, the movable part 50 is configured to be movable within a plane parallel to the XZ plane within a predetermined range of motion.

[0034] The actuator 5 is configured to move the movable part 50 relative to the fixed part 80. The fixed part 80 includes a fixed body 60 which is a first fixed body, and a fixed body 70 which is a second fixed body fixed to the fixed body 60. The movable part 50 is disposed between the fixed body 60 and the fixed body 70 in the Y direction.

[0035] Since the movable part 50 moves relative to the processing module 10, a flexible substrate 7 is used for the transmission path of image signals between the image sensor 601 and the image processing engine 101. The movable part 50 has an imaging module 6, a movable frame 51, and a flexible wiring substrate (not shown). An actuator 5 is disposed on the movable frame 51. The actuator 5 has coils 53a, 53b, and 53c. Power is supplied to each of the coils 53a, 53b, and 53c by a flexible wiring substrate (not shown).

[0036] The fixed body 60 has a first yoke 61. The fixed body 70 has a base plate 71, spacers 73a, 73b, and 73c, a second yoke 75, and magnets 76a, 76b, and 76c, which are permanent magnets. The base plate 71 is an example of a base member. Between the fixed body 70 and the movable part 50, rolling balls (not shown) are arranged to movably support the movable part 50. One or both of the fixed body 60 and the fixed body 70 are fixed to the exterior 300 with screws or the like. The first yoke 61 and the second yoke 75 are made of magnetic metal. The first yoke 61, the second yoke 75, and the magnets 76a, 76b, and 76c form a magnetic circuit, which is a closed magnetic path.

[0037] The magnets 76a, 76b, and 76c are fixed by adhesive while being attracted to the second yoke 75. Spacers 73a, 73b, and 73c are disposed between the first yoke 61 and the second yoke 75, and a predetermined distance is maintained between the first yoke 61 and the second yoke 75.

[0038] The movable part 50 is disposed between the first yoke 61 and the second yoke 75. Gaps are provided between the movable part 50 and the first yoke 61, and between the movable part 50 and the second yoke 75. Spacers 73a, 73b, and 73c are spacers that define the distance between the fixed bodies 60 and 70. Each of the spacers 73a, 73b, and 73c also serves as a stopper for the movable part 50, and has a cylindrical part and rubber provided on the side of the cylindrical part. In other words, the range of motion of the movable part 50 is defined by the spacers 73a, 73b, and 73c.

[0039] The base plate 71 is made of a conductive metal, preferably non-magnetic stainless steel, for example. The thickness of the magnets 76a, 76b, and 76c is greater than the thickness of the base plate 71. The base plate 71 is provided with through holes through which the magnets 76a, 76b, and 76c are inserted. The second yoke 75 is fixed to the base plate 71 with screws (not shown), causing the magnets 76a, 76b, and 76c to protrude from the base plate 71. Furthermore, a substantially rectangular through hole 32 that penetrates the base plate 71 in the direction of the optical axis 4 is provided in the center of the base plate 71.

[0040] An imaging module 6 and a flexible wiring board (not shown) are mounted on the movable frame 51. Coils 53a, 53b, and 53c are mounted on the mounting surface of the flexible wiring board (not shown) on the fixed body 70 side.

[0041] A substantially rectangular through-hole 33 that penetrates in the direction of the optical axis 4 is provided in the center of the movable frame 51. Furthermore, through-holes 23a, 23b, and 23c that penetrate in the direction of the optical axis 4 are provided at the ends of the movable frame 51. Coil 53a is disposed in through-hole 23a, coil 53b is disposed in through-hole 23b, and coil 53c is disposed in through-hole 23c. An insulating positioning member for positioning and fixing coil 53a is disposed in through-hole 23a. An insulating positioning member for positioning and fixing coil 53b is disposed in through-hole 23b. An insulating positioning member for positioning and fixing coil 53c is disposed in through-hole 23c.

[0042] Furthermore, since the through-hole 33 is provided in the movable frame 51, it is possible to prevent mounted components such as connector components provided on the wiring board 602 of the imaging module 6 from interfering with the movable frame 51 or the base plate 71. Furthermore, the flexible substrate 7 shown in FIG. 2(b) is arranged so as to pass through the through-hole 33 of the movable frame 51 and the through-hole 32 of the base plate 71, and electrically connects the imaging module 6 and the processing module 10.

[0043] A drive circuit (not shown) is connected to a flexible wiring board (not shown) of the movable part 50. The drive circuit (not shown) passes a current through each of the coils 53a to 53c via the flexible wiring board (not shown), causing each of the coils 53a to 53c to generate a force according to Fleming's left-hand rule. This allows each of the coils 53a to 53c to move the movable part 50.

[0044] Furthermore, a magnetic sensor (not shown) is disposed on the movable part 50. A drive circuit (not shown) uses the magnetic sensor (not shown) to detect the movement position of the movable part 50 in a plane direction perpendicular to the optical axis 4, and performs feedback control based on the detection result to correct the above-mentioned camera shake. For example, a Hall element or the like can be used as the magnetic sensor, and the movement position of the movable part 50 is detected using a magnetic circuit including magnets 76a, 76b, and 76c.

[0045] The electronic unit 100 may have a magnet and a magnetic circuit for position detection instead of a magnetic sensor. The number of magnets is not limited to three. For example, each of the magnets 76a, 76b, and 76c may have two magnet pieces. The two magnet pieces may be fixed to the second yoke 75 with magnetism in opposite directions. This configuration improves the driving force that drives the movable part 50. Each of the magnets 76a, 76b, and 76c may have three or more magnet pieces. The three magnet pieces may be arranged so that the direction of the magnetic poles is optimized, for example, so that the magnetic field strength is maximized in a specific direction.

[0046] The imaging operation by the imaging module 6 and the shake correction operation by the actuator 5 are performed by known imaging means, image processing means, recording / playback means, control means, and the like.

[0047] As the camera 600 becomes smaller, the electronic unit 100 is housed in a narrow space inside the exterior casing 300. In order to prevent interference between the movable part 50 and the bottom plate 21 while ensuring a range of motion for the movable part 50 of the electronic unit 100, the bottom plate 21 has a notch 200 into which a portion of the movable part 50 can enter, as shown in FIGS. 3 and 4 . The notch 200 is a space defined by the bottom plate 21. The shape of the notch 200 is rectangular when viewed in the Z direction, but is not limited thereto. For example, the notch 200 may be V-shaped or U-shaped when viewed in the Z direction, and may have any shape as long as interference with the electronic unit 100 is prevented.

[0048] Figures 7(a) and 7(b) are cross-sectional views of a portion of the camera 600 according to the first embodiment. Figure 7(a) schematically illustrates a cross section of a portion of the camera 600 taken along a plane parallel to the YZ plane and including line AA' in Figure 3, as viewed in the negative direction of the X axis. Specifically, Figure 7(a) schematically illustrates cross sections of the bottom plate 21 and members in the vicinity of the bottom plate 21.

[0049] 7(b) is a schematic diagram showing a cross section of a portion of the camera 600 taken along a plane parallel to the XZ plane and including the center of the notch 200 in the Y direction, as viewed in the positive direction of the Y axis. Specifically, FIG. 7(b) is a schematic diagram showing a cross section of the bottom plate 21 and members in the vicinity of the bottom plate 21.

[0050] In the bottom plate 21, the notch 200 is formed at a position where a portion of the movable part 50 can enter. The portion of the movable part 50 is a conductive part. In the first embodiment, the portion of the movable part 50 that can enter the notch 200 is a protrusion 51a of the movable frame 51. Hereinafter, the protrusion 51a will also be referred to as the portion 51a. The notch 200 is a notch provided at the end of the bottom plate 21 in the X direction. The X direction is also the longitudinal direction of the bottom plate 21. That is, the notch 200 is formed so as to be recessed in the positive direction of the X axis with respect to an end face 213 of the bottom plate 21 on the tip side in the negative direction of the X axis. The protrusion 51a of the movable frame 51 enters or retracts from the notch 200 depending on the position and posture of the movable frame 51. That is, the movable part 50 is movable within a space defined by the notch 200 provided in the bottom plate 21.

[0051] The movable frame 51 has an end surface 51b that faces the main surface 211 of the bottom plate 21 in the Z direction. The Z direction is a direction perpendicular to the main surfaces 211 and 212. The protrusion 51a protrudes in the negative direction of the Z axis (i.e., toward the main surface 211) relative to the end surface 51b. Although no other member is disposed between the main surface 211 and the end surface 51b, another member may be disposed as long as it does not interfere with the movement of the movable part 50.

[0052] 7(a) and 7(b) show the movable frame 51 in a state where it has moved to the limit position in the negative direction of the Z axis and the limit position in the negative direction of the X axis in its movable range by using dashed lines. That is, the movable frame 51 in a state where the protrusion 51a of the movable frame 51 is inserted into the notch 200 is shown by using dashed lines. As shown in FIG. 7(b), when the movable frame 51 moves to the limit position in the negative direction of the Z axis and also to the limit position in the negative direction of the X axis, the movable frame 51 abuts against the spacer 73c, and movement in the negative direction of the X axis is restricted. Although not shown, the movable frame 51 has a protrusion 51a that protrudes in the negative direction of the Z axis so that movement of the movable frame 51 in the negative direction of the X axis is restricted even when the movable frame 51 has moved to the limit position in the positive direction of the Z axis, i.e., so that the movable frame 51 can abut against the spacer 73c.

[0053] Note that the protrusion 51a of the movable part 50 can be retracted from the notch 200 depending on the position and posture of the movable part 50 within the range of motion. In Figures 7(a) and 7(b), the movable frame 51 in a state in which the protrusion 51a is retracted from the notch 200 is shown by solid lines.

[0054] As described above, bottom plate 21 has notch 200 into which part of movable part 50 can enter, so the distance between bottom plate 21 and electronic unit 100 can be reduced, and camera 600 can be made smaller.

[0055] 7(a), a portion of the fixed portion 80 enters the notch 200. That is, a portion of the fixed portion 80 is located in the notch 200. The portion of the fixed portion 80 is a conductive portion. In the first embodiment, the portion of the fixed portion 80 is a portion 31 of the base plate 71 of the fixed body 70 of the fixed portion 80. The portion 31 of the fixed portion 80 enters the notch 200. That is, the portion 31 of the fixed portion 80 is located in the notch 200. Note that the portion 31 of the base plate 71 enters the notch 200 as part of the fixed portion 80, but this is not limited thereto. For example, the portion of the fixed portion entering the notch 200 may be a portion of the fixed body 60, or may be a portion of a member of the fixed body 70 other than the base plate 71. In this way, the fixing portion 80 is arranged inside the exterior casing 300 so that a portion of the fixing portion 80 is positioned in the notch 200, so that the distance between the bottom plate 21 and the electronic unit 100 can be reduced, and the camera 600 can be made smaller.

[0056] Incidentally, external noise such as ESD (Electro Static Discharge) may be applied to the bottom plate 21. Hereinafter, noise related to ESD will be referred to as ESD noise. In the first embodiment, the electronic unit 100 includes a shield member 41 disposed at a position facing the notch 200.

[0057] Here, a comparative camera without a shielding member will be described. Fig. 8(a) is an explanatory diagram of the comparative camera. Fig. 8(a) schematically illustrates a portion of the internal structure of the comparative camera, with the bottom exterior 306 omitted. Fig. 8(a) also schematically illustrates a perspective view of the internal structure of the comparative camera as viewed from below in the positive direction of the Z axis.

[0058] The screw 14a is used to fix the bottom exterior 306 and the bottom plate 21 to the front exterior 302, and the screw 14b is used to fix the bottom exterior 306 and the bottom plate 21 to the back exterior 303. The screws 14a and 14b are made of metal because they are required to have high rigidity. When ESD noise is applied to the screw 14b, a current related to ESD flows along the edge of the bottom plate 21. Hereinafter, the current related to ESD will be referred to as an ESD current.

[0059] Reference symbols 92a, 92b, 92c, and 92d denote the main ESD currents propagating through the bottom plate 21. In FIG. 8(a), arrows indicate the flow directions of the ESD currents 92a, 92b, 92c, and 92d. Reference symbols 91a, 91b, 91c, and 91d denote the main electromagnetic field noises propagating spatially. In FIG. 8(a), arrows indicate the flow directions of the electromagnetic field noises 91a, 91b, 91c, and 91d. A high charge is stored in the ESD source 90, and when the ESD source 90 comes into contact with the screw 14b, the charge is instantly discharged to the screw 14b. Therefore, a large electromagnetic field noise 91a is generated from the ESD source 90. The ESD source 90 may be, for example, a user. The electromagnetic field noise 91a propagates from the ESD source 90 to the electronic unit 100 through the notch 200.

[0060] ESD applied from ESD source 90 propagates through screw 14b and into bottom plate 21. ESD current has high frequency characteristics, and therefore tends to flow in large amounts at the ends of the metal body to which it is applied. Therefore, ESD applied to screw 14b flows along the ends of bottom plate 21 as ESD currents 92a, 92b, 92c, and 92d.

[0061] The bottom plate 21 has a notch 200. Therefore, the ESD current 92c flows along the edge of the bottom plate 21 that defines the notch 200. Then, the ESD current 92d that reaches the screw 14a flows into the exterior casing 300.

[0062] When an ESD current flows through the bottom plate 21, electromagnetic field noise is generated from the current path of the ESD current. Therefore, when an ESD current 92c flows through the edge that defines the notch 200, electromagnetic field noise 91b, 91c, and 91d is generated from the edge that defines the notch 200. The electromagnetic field noise 91b, 91c, and 91d propagate to the electronic unit 100 via the notch 200.

[0063] As shown in FIG. 8(a), when a portion of the electronic unit 100 enters the notch 200, much of the electromagnetic field noise 91a to 91d reaches the portion of the electronic unit 100. When the electromagnetic field noise 91a to 91d reaches the electronic unit 100, ESD noise enters the electronic unit 100. The ESD noise that enters the electronic unit 100 reaches the imaging module 6 or reaches the processing module 10 via the flexible substrate 7 or the plate 11. The ESD noise that enters the electronic unit 100 in this way may cause distortion of the captured image (image data) or cause an error stop. In particular, when the portion 51a of the movable part 50 is located in the notch 200, the electronic unit 100 is susceptible to the influence of the electromagnetic field noise 91a to 91d.

[0064] In contrast, as shown in FIGS. 7( a) and 7(b), the electronic unit 100 of the first embodiment includes a conductive shield member 41. The shield member 41 is an example of a second conductive portion. At least a portion of the shield member 41 is located on the main surface 212 side of the bottom plate 21 in the Z direction. That is, at least a portion of the shield member 41 is located between the bottom plate 21 and the bottom exterior 306 in the Z direction. Note that when a portion of the shield member 41 is located between the bottom plate 21 and the bottom exterior 306 in the Z direction, the portion of the shield member 41 is the second conductive portion, and the entire shield member 41 is the second conductive member having the second conductive portion. In the first embodiment, the entire shield member 41 is located on the main surface 212 side of the bottom plate 21 in the Z direction. That is, the entire shield member 41 is located between the bottom plate 21 and the bottom exterior 306 in the Z direction. Therefore, in the first embodiment, the shield member 41 is both the second conductive portion and the second conductive member. In addition, in the first embodiment, the entire bottom plate 21 is the first conductive part and the first conductive member, but a part of the bottom plate 21 may be the first conductive part, and the entire bottom plate 21 may be the first conductive member having the first conductive part.

[0065] Shielding member 41 is a plate-shaped conductive member. Shielding member 41 has a main surface 411 and a main surface 412 opposite to main surface 411. Main surface 411 is an example of a third main surface, and main surface 412 is an example of a fourth main surface. Shielding member 41 may be a metal member such as aluminum or stainless steel, or a conductive resin made conductive by mixing a conductive material into a resin material.

[0066] As shown in Figures 7(a) and 7(b), an imaginary plane V1 is defined that includes the main surface 211 and extends along the main surface 211. The main surface 411 is located between the plane V1 and the main surface 412. The main surface 211 is also located between the fixed portion 80 and the main surface 212. The main surface 411 is also located between the movable portion 50 and the main surface 412. A portion of the movable portion 50 is movable relative to the bottom plate 21 and the shield member 41 and can intersect with the plane V1. With this configuration, according to the first embodiment, a technique that is advantageous for miniaturizing the camera 600 and for reducing noise is provided.

[0067] Here, "a portion of the movable part 50 can intersect with the plane V1" can also be said to mean that a portion of the movable part 50 can exist on the plane V1. For example, the movement of the movable part 50 does not require the portion of the movable part 50 to retract from the notch 200. That is, "a portion of the movable part 50 can intersect with the plane V1" means either Case 1 or Case 2 below. Case 1 is a case where a portion of the movable part 50 always intersects with the plane V1. Case 2 is a case where a portion of the movable part 50 can change between intersecting and not intersecting with the plane V1 depending on the movement of the movable part 50. In the example of the first embodiment, this is Case 2. Note that in a default state, such as when the power of the camera 600 is turned off, the portion of the movable part 50 may either intersect or not intersect with the plane V1.

[0068] In the first embodiment, part 31 of base plate 71, which is part of fixed portion 80, is present in notch 200 and therefore intersects with plane V1. This reduces the size of camera 600, and noise is reduced by shield member 41.

[0069] In addition, in the Z direction perpendicular to the plane V1, the shield member 41 preferably overlaps the entire movable range of the movable part 50 within the plane V1.

[0070] In the first embodiment, the shielding member 41 is disposed so as to overlap at least a portion of the cutout 200 in the Z direction. As viewed in the Z direction, the shielding member 41 preferably covers a larger area of ​​the cutout 200. Therefore, the shielding member 41 is preferably disposed so as to overlap the entire cutout 200 in the Z direction.

[0071] In other words, in the Z direction (as viewed in the Z direction), the entire notch 200 overlaps with the shielding member 41. In the first embodiment, the entire notch 200 overlaps with a portion of the shielding member 41 in the Z direction. Here, in the first embodiment, nothing is disposed between the notch 200 and the shielding member 41 in the Z direction, but this is not limited to this. For example, an insulating member or a conductive member other than the shielding member 41 may be disposed between the notch 200 and the shielding member 41 in the Z direction.

[0072] In the first embodiment, the shielding member 41 may not be electrically connected to the bottom plate 21 and may be at a floating potential, for example. In this case, the shielding member 41 may be fixed to the bottom plate 21 or the bottom exterior 306 with a fixing member such as an adhesive or a screw.

[0073] By configuring the bottom plate 21 to have the notch 200 in this manner, it is possible to bring the electronic unit 100 and the bottom plate 21 closer to each other while preventing interference between the movable part 50 of the electronic unit 100 and the bottom plate 21. Therefore, it is possible to reduce the size of the camera 600.

[0074] Fig. 8(b) is an explanatory diagram of the camera 600 according to the first embodiment. Fig. 8(b) schematically illustrates a part of the internal structure of the camera 600, with the bottom exterior 306 of the camera 600 not shown. Fig. 8(b) also schematically illustrates a perspective view of the internal structure of the camera 600 as viewed from below the camera 600 in the positive direction of the Z axis.

[0075] 8(b), in the first embodiment, a conductive shielding member 41 is disposed opposite the notch 200. As a result, the notch 200 is covered by the shielding member 41. Therefore, the electromagnetic field noise 91a from the ESD application source 90 is shielded by the shielding member 41, and propagation of the electromagnetic field noise 91a to the notch 200 can be reduced.

[0076] 8(a) generated from ESD current 92c flowing through the end face defining notch 200 is also shielded by shielding member 41, and propagation of the electromagnetic noise 91b to 91d to notch 200 can be reduced.

[0077] In this way, by disposing the shielding member 41 near the notch 200, it is possible to reduce the intrusion of ESD noise through the notch 200 into the imaging module 6, the processing module 10, and the flexible substrate 7 connecting the imaging module 6 and the processing module 10. This reduces noise induced in the image signal, reduces disturbances occurring in the captured image, and maintains high quality of the captured image. It is also possible to reduce the occurrence of error shutdowns of the camera 600.

[0078] Although the above description has been given taking the example of ESD noise being applied to the screw 14b, ESD noise may also be applied to other components. For example, ESD noise may also be applied to the screws 14a, 16a, 16b, 16c, 16d, 16e, 22a, 22b, 24, the screw receiving portion 22, or other components. Even in such a case, when an ESD current flows through the bottom plate 21, it is possible to reduce the propagation of electromagnetic field noise to parts of the electronic unit 100, i.e., parts of the movable portion 50 and the fixed portion 80. This reduces noise propagating to the imaging module 6 and the processing module 10, thereby reducing distortion of captured images and reducing the occurrence of error shutdowns.

[0079] Next, a first modification of the first embodiment will be described. In the first embodiment described above, the case where the shield member 41 is not electrically connected to the bottom plate 21 has been described as an example, but the present invention is not limited to this. Fig. 9 is an explanatory diagram of a camera 600 according to the first modification of the first embodiment.

[0080] 9, the shielding member 41 may be fixed to the bottom plate 21 with screws 14a, 14b or the like, and electrically connected to the bottom plate 21. That is, the shielding member 41 is fixed to the bottom plate 21 with screws 14a, 14b arranged so as to sandwich the notch 200, and is electrically connected to the bottom plate 21.

[0081] The shield member 41 of the first modification has a plate-shaped main body and two fastening portions protruding from the main body and fixed to the bottom plate 21 by screws 14a and 14b. To increase the reliability of the electrical connection between the bottom plate 21 and the shield member 41, a metal member such as a metal washer is preferably disposed between the bottom plate 21 and the shield member 41 at the fastening portion of the shield member 41. Instead of disposing a washer between the bottom plate 21 and the shield member 41, the fastening portion of the shield member 41 or a portion of the bottom plate 21 that comes into contact with the fastening portion may be formed in a protruding or bent shape. In this manner, the bottom plate 21 and the shield member 41 are fixed to each other by fastening members such as screws 14a and 14b. The bottom plate 21 may be a first conductive member having a first conductive portion. The main body of the shield member 41 may be a second conductive portion. The entire shield member 41 may be a second conductive member having a second conductive portion.

[0082] With the camera of Modification 1 configured as described above, ESD noise applied to screw 14b becomes ESD current 93 and flows through shield member 41. ESD current 93 flows along the arrow from the location of screw 14b to the location of screw 14a in shield member 41. Then, ESD current 93 that reaches screw 14a flows into exterior casing 300.

[0083] According to the first modification, the shielding member 41 forms a detour for the ESD current 93 to flow, thereby suppressing the ESD current 92c that would flow along the notch 200. This reduces the electromagnetic field noise that enters the electronic unit 100 through the notch 200. Furthermore, because the shielding member 41 is disposed so as to cover the notch 200, it also has a shielding effect against the electromagnetic field noise 91a shown in FIG. 8(b).

[0084] The screws 14a and 14b that secure the shielding member 41 to the bottom plate 21 also secure the bottom plate 21 and the bottom exterior 306 to the front exterior 302 and the back exterior 303. Therefore, the shielding member 41, the bottom plate 21, and the exterior 300 are fastened together and fixed to one another by the screws 14a and 14b. This configuration allows the ESD current to flow from the shielding member 41 to the exterior 300, which has a more stable ground potential, without passing through any other members, thereby reducing the intrusion of ESD noise into the imaging module 6 and the processing module 10 in the camera 600.

[0085] 8(b) of the first embodiment and FIG. 9 of the first modification, the ESD current and electromagnetic noise have been described using arrows. This is for the sake of convenience in explaining the phenomenon, and the direction of the ESD current and electromagnetic noise changes depending on the difference in the application point of the ESD noise and potential fluctuations due to resonance, etc. Even in such cases, in the first embodiment and modification, the shielding member 41 is disposed near the notch 200, so that it is possible to shield the electromagnetic noise that reaches the notch 200 and the electromagnetic noise caused by the flow of the ESD current.

[0086] Next, a model and simulation results obtained when an electromagnetic field simulation was performed by computer will be described for the comparative example, the first embodiment, and the first modified example of the first embodiment.

[0087] First, we will explain the outline of the model used when conducting the electromagnetic field simulation. The bottom plate 21 was configured by providing a notch 200 in a rectangular parallelepiped conductor measuring 26.3 mm in height, 81.1 mm in width, and 1.2 mm in thickness. Here, the vertical direction is the Y direction, the horizontal direction is the X direction, and the thickness direction is the Z direction. The vertical direction is the short side direction of the bottom plate 21, and the horizontal direction is also the longitudinal direction of the bottom plate 21.

[0088] The notch 200 has a rectangular shape, measuring 8.4 mm in height and 15.9 mm in width, where part of the bottom plate 21 is cut out. The notch 200 is provided at an end of the bottom plate 21 that extends in the vertical direction. The vertical center of the notch 200 is located 1.2 mm closer to the front exterior 302 than the vertical center of the bottom plate 21.

[0089] A portion 31 of the base plate 71 is located in the notch 200. The width of the portion 31 of the base plate 71 in the vertical direction of the bottom plate 21 is 5.9 mm. The height of the portion 31 of the base plate 71 in the thickness direction of the bottom plate 21 is 0.35 mm, and the length of the portion 31 of the base plate 71 in the horizontal direction of the bottom plate 21 is 14 mm. The portion 31 of the base plate 71 is located 1 mm away from the end of the notch 200 closer to the screw 14b.

[0090] In this simulation model, noise simulating ESD was applied to the screw 14b. The positions of the screws 14a and 14b in the comparative example, the first embodiment, and modification example 1 will be described below. The screw 14a is a screw involved in the propagation path of the ESD current, and the screw 14b is a screw that serves as the ESD application point.

[0091] Screw 14b is located 12.2 mm laterally away from the end of bottom plate 21 where notch 200 is provided, and is disposed near the end of bottom plate 21 that is closer to back exterior 303. Screw 14a is located near the end of bottom plate 21 where notch 200 is provided, and is disposed in a position that sandwiches notch 200 between screw 14b and screw 14a.

[0092] The shielding member 41 of the first embodiment was a rectangular plate material measuring 10 mm in length, 19.2 mm in width, and 0.35 mm in thickness. The material of the shielding member 41 of the first embodiment was aluminum. The shielding member 41 was disposed in a position that covered the entire cutout 200 when viewed in the Z direction, and was disposed 0.2 mm away from the bottom plate 21 in the negative direction of the Z axis.

[0093] The shielding member 41 of the first modification was a plate material having two fastening portions protruding from a rectangular body measuring 10 mm in length, 19.2 mm in width, and 0.35 mm in thickness, and fixed to the bottom plate 21 by screws 14a and 14b. The material of the shielding member 41 of the first modification was aluminum.

[0094] A metal washer having a thickness of 0.2 mm is disposed between the bottom plate 21 and the shielding member 41 at the fastening portion of the shielding member 41 so that the bottom plate 21 and the shielding member 41 are electrically connected.

[0095] Next, we will explain the signal lines observed in the simulation. In this simulation, we used a signal line used to transmit an image signal connected from the imaging module 6 to the processing module 10 via the flexible substrate 7. The signal line is connected to a ground pattern, which is the reference voltage pattern of the processing module 10, via a termination resistor assumed to be a receiver IC for the image signal. In this simulation, we observed the noise voltage induced in the signal at the termination resistor provided in the processing module 10.

[0096] 10(a) and 10(b) are graphs showing the results of the simulation. Fig. 10(a) shows the voltage waveform from 0 to 10 nsec induced in the signal line in a comparative example without the shielding member 41. From the voltage waveform shown in Fig. 10(a), it can be seen that a potential fluctuation with a large pulse width is induced in the signal line within 4 nsec.

[0097] 10(b) shows the values ​​of noise voltage induced in the signal line for the comparative example, the first embodiment, and modified example 1 of the first embodiment. In Fig. 10(b), "A" is the simulation result for the comparative example without the shielding member 41, "B" is the simulation result for the first embodiment with the shielding member 41, and "C" is the simulation result for modified example 1 with the shielding member 41.

[0098] The noise voltage referred to here is the 0 to peak value of the first waveform with a large pulse width observed within 4 nsec after the application of a waveform simulating ESD.

[0099] 10(b), it can be seen that the noise voltage induced in the signal line is reduced by the shielding member 41. It can also be seen that in Modification 1, the noise voltage is further reduced compared to the first embodiment.

[0100] As described above, the configuration of the first embodiment or the configuration of the first modification reduces ESD noise that penetrates into the camera 600, and reduces potential fluctuations induced in the signal lines. Furthermore, according to the first modification, the shielding member 41 is electrically connected to the bottom plate 21, further reducing potential fluctuations induced in the signal lines. Therefore, a technology that is advantageous for miniaturizing the camera 600 and for noise countermeasures is provided.

[0101] In the first embodiment and the first modified example, the shielding member 41 is a flat plate, but the present invention is not limited to this. For example, the shielding member 41 may have a bent portion that matches the shape of the exterior casing 300 or the like.

[0102] In addition, in the first embodiment and the first modified example, the case where the shielding member 41 is disposed inside the exterior casing 300 has been described as an example, but the present invention is not limited to this. For example, the shielding member 41 may be configured to serve as a part of the exterior casing.

[0103] Furthermore, the shielding member 41 need only be a conductor and is not limited to a plate-like shape. For example, the shielding member 41 may be a rectangular parallelepiped metal member, a sheet-like conductor, a conductive cloth gasket, or the like.

[0104] [Second embodiment] A second embodiment of the present disclosure will be described. Below, elements with the same reference numerals as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described.

[0105] 11(a) and 11(b) are explanatory diagrams of a camera 600A according to the second embodiment. Fig. 11(a) is a schematic perspective view of a portion of the internal structure of the camera 600A, omitting the illustration of the bottom exterior 306. Fig. 11(b) is an explanatory diagram of the positional relationship between the bottom plate 21A and the movable part 50.

[0106] As shown in Fig. 11(a), the camera 600A of the second embodiment includes a bottom plate 21A and an electronic unit 100. Fig. 11(a) shows a part of the electronic unit 100 and a part of the bottom plate 21A. The camera 600A of the second embodiment is configured by replacing the bottom plate 21 with a bottom plate 21A in the camera 600 of the first embodiment and omitting the shield member 41. In other words, the bottom plate 21A functions as a shield member.

[0107] The bottom plate 21A is a conductive plate. The bottom plate 21A has a plate body 25 and a conductive portion 43 that is integral with the plate body 25. In other words, the bottom plate 21A integrally has the plate body 25 and the conductive portion 43. That is, the plate body 25 and the conductive portion 43 are each part of the bottom plate 21A. The bottom plate 21A is an example of a conductive member. The plate body 25 is an example of a first conductive portion, and the conductive portion 43 is an example of a second conductive portion.

[0108] The plate body 25 is configured so that a current flows from the plate body 25 to the conductive portion 43. In other words, the plate body 25 and the conductive portion 43 are electrically connected.

[0109] The bottom plate 21A is disposed on the negative side of the Z axis with respect to the electronic unit 100. When viewed in the Z direction, the bottom plate 21A is a conductive member having a substantially rectangular shape, and is fixed to the bottom exterior 306 of the exterior 300 shown in FIG. 1 with conductive screws or the like. The bottom plate 21A is disposed between the bottom exterior 306 and the electronic unit 100.

[0110] The plate body 25 has a main surface 251 and a main surface 252 opposite to the main surface 251. The main surface 251 faces the electronic unit 100, i.e., faces inward, and the main surface 252 faces the bottom exterior 306, i.e., faces outward. The main surface 251 is an example of a first main surface, and the main surface 252 is an example of a second main surface. The main surfaces 251 and 252 are, for example, planes parallel to the XY plane. The main surfaces 251 and 252 are substantially parallel to each other. Therefore, the direction perpendicular to the main surface 251 is substantially the same as the direction perpendicular to the main surface 252.

[0111] 3 is fixed to the bottom plate 21A, similar to the first embodiment. Also, similar to the first embodiment, the bottom plate 21A and the bottom exterior 306 in FIG. 1 are fixed to the front exterior 302 and the back exterior 303 in FIG. 1 with a plurality of metal screws. Two of the plurality of screws, screws 14a and 14b, are shown in FIG. 11(a).

[0112] As the camera 600A is made smaller, the electronic unit 100 is housed in a narrow space inside the exterior casing 300 shown in FIG. 1 . To prevent interference between the movable part 50 and the bottom plate 21A while ensuring a range of motion for the movable part 50 of the electronic unit 100, the bottom plate 21A of the second embodiment has a hole 42 into which a portion of the movable part 50 can enter. That is, the bottom plate 21A of the second embodiment has the hole 42 instead of the notch 200 described in the first embodiment. The hole 42 is a space defined by the bottom plate 21A. The position of the hole 42 in the bottom plate 21A is substantially the same as the position of the notch 200 in the bottom plate 21A. As in the first embodiment, a portion of the movable part 50 is a protrusion 51a of the movable frame 51. The movable part 50 is movable within the space defined by the hole 42 provided in the bottom plate 21A.

[0113] The hole 42 is a recessed hole recessed in the negative direction of the Z axis away from the electronic unit 100 with respect to the main surface 251. In other words, the hole 42 is a concave portion. The depth of the hole 42 in the Z direction is equal to or greater than the thickness of the plate body 25 in the Z direction. Therefore, the conductive portion 43 is provided at a position corresponding to the hole 42 and includes a protruding portion that protrudes in the negative direction of the Z axis away from the electronic unit 100 with respect to the main surface 252. In other words, the protruding portion is disposed on the side of the bottom plate 21A opposite to the side of the hole 42.

[0114] In the second embodiment, the conductive portion 43 has a main surface 431 and a main surface 432 opposite to the main surface 431. The main surface 431 is an example of a third main surface, and the main surface 432 is an example of a fourth main surface. The main surface 431 is the surface on the side of the hole 42. The main surface 432 is the surface on the side of the protruding portion.

[0115] Furthermore, in order to avoid interference between the movable frame 51 and the base plate 71 and the bottom plate 21A, the hole 42 may be opened on the side of the end face 253 of the bottom plate 21A. The end face 253 is, for example, the end face of the bottom plate 21A on the tip side in the negative direction of the X axis.

[0116] As shown in FIG. 11(b), an imaginary plane V2 is defined that includes the main surface 251 and extends along the main surface 251. The main surface 431 is located between the plane V2 and the main surface 432. The main surface 251 is also located between the fixed portion 80 and the main surface 252. The main surface 431 is also located between the movable portion 50 and the main surface 432. A portion of the movable portion 50 is movable relative to the plate body 25 and the conductive portion 43 and can intersect with the plane V2. With this configuration, the second embodiment provides a technology that is advantageous for miniaturizing the camera 600A and for suppressing noise.

[0117] Here, "a portion of the movable part 50 can intersect with the plane V2" can also be said to mean that a portion of the movable part 50 can exist on the plane V2. For example, the movement of the movable part 50 does not require the portion of the movable part 50 to retreat from the hole 42. That is, "a portion of the movable part 50 can intersect with the plane V2" means either Case 1 or Case 2 below. Case 1 is a case where a portion of the movable part 50 always intersects with the plane V2. Case 2 is a case where a portion of the movable part 50 can change between intersecting and not intersecting with the plane V2 by the movement of the movable part 50. In the example of the second embodiment, this is Case 2. Note that in a default state, such as when the power of the camera 600A is OFF, the portion of the movable part 50 may either intersect or not intersect with the plane V2.

[0118] In the second embodiment, the distance D2 between the main surface 431 and the main surface 432 is smaller than the distance D1 between the main surface 251 and the main surface 252. That is, the conductive portion 43 is thinner than the plate main body 25. Furthermore, the distance D3 between the main surface 432 and the plane V2 is larger than the distance D1 between the main surface 251 and the main surface 252. That is, the conductive portion 43 protrudes in the negative direction of the Z axis with respect to the plate main body 25.

[0119] With the above configuration, ESD noise applied to the screw 14a flows as ESD current 94 from the screw 14a to the screw 14b via the end of the bottom plate 21A, i.e., the end of the plate body 25 and the end of the conductive portion 43. The ESD current 94 that reaches the screw 14a flows to the exterior 300 (FIG. 1), which has a more stable ground potential. This reduces the penetration of ESD noise into the imaging module 6, the processing module 10, and the flexible substrate 7 connecting the imaging module 6 and the processing module 10. This reduces noise induced in the image signal, reduces distortion in the captured image, and maintains high-quality captured images. It also reduces the likelihood of the camera 600A shutting down due to an error.

[0120] In the second embodiment, a part of the fixing portion 80 is present in the hole 42 and therefore intersects with the plane V2. This allows the camera 600A to be made smaller, and the conductive portion 43 reduces noise.

[0121] Next, a second modification of the second embodiment will be described. In the second embodiment described above, the Z-direction depth of the hole 42 is described as being equal to or greater than the Z-direction thickness of the plate main body 25, but this is not limiting. FIGS. 12(a) and 12(b) are explanatory diagrams of a camera 600A according to a second modification of the second embodiment. FIG. 12(a) is a schematic perspective view of a portion of the internal structure of the camera 600A, with the bottom exterior 306 omitted. FIG. 12(b) is an explanatory diagram of the positional relationship between the bottom plate 21A and the movable part 50.

[0122] The depth of the hole 42 in the Z direction may be smaller than the thickness of the plate main body 25 in the Z direction. In the configuration of Modification 2, the distance D2 between the main surface 431 and the main surface 432 is smaller than the distance D1 between the main surface 251 and the main surface 252. That is, the thickness of the conductive portion 43 in the Z direction is smaller than the thickness of the plate main body 25 in the Z direction. Furthermore, in Modification 2, there is no need to provide a protruding portion, as in the second embodiment, in the portion corresponding to the hole 42. That is, in the bottom plate 21A, there is no protruding portion on the side opposite to the hole 42, and the main surface 252 and the main surface 432 are flush with each other. With this configuration, the noise reduction effect can be obtained similarly to the second embodiment, and protrusion in the thickness direction of the bottom plate 21A can be suppressed.

[0123] [Third embodiment] Next, a third embodiment will be described. Below, elements with the same reference symbols as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described.

[0124] In the second embodiment described above, the hole 42 is a recessed hole, but the present invention is not limited to this. Fig. 13(a) is an explanatory diagram of a camera 600B according to a third embodiment. Fig. 13(a) is a schematic perspective view of a part of the internal structure of the camera 600B, with the bottom exterior 306 omitted.

[0125] As shown in Fig. 13(a), a camera 600B of the third embodiment includes a bottom plate 21B and an electronic unit 100. Fig. 13(a) shows a part of the electronic unit 100 and a part of the bottom plate 21B. The camera 600B of the third embodiment is configured such that the bottom plate 21 in the camera 600 of the first embodiment is replaced with a bottom plate 21B and the shield member 41 is omitted. In other words, the bottom plate 21B functions as a shield member.

[0126] The bottom plate 21B is a conductive plate. The bottom plate 21B has a plate body 25 and a conductive portion 44 that is integral with the plate body 25. In other words, the bottom plate 21B integrally has the plate body 25 and the conductive portion 44. That is, the plate body 25 and the conductive portion 44 are each part of the bottom plate 21B. The bottom plate 21B is an example of a conductive member. The plate body 25 is an example of a first conductive portion, and the conductive portion 44 is an example of a second conductive portion.

[0127] The positional relationship and fixing relationship between the bottom plate 21B, the electronic unit 100 and the bottom exterior 306 are the same as those between the bottom plate 21B, the electronic unit 100 and the bottom exterior 306 described in the first embodiment, so the explanation will be omitted.

[0128] In the third embodiment, the plate main body 25 has a main surface 251 and a main surface 252 opposite to the main surface 251, similar to the first embodiment. The main surface 251 is an example of a first main surface, and the main surface 252 is an example of a second main surface. The conductive portion 44 has a main surface 441 and a main surface 442 opposite to the main surface 441. The main surface 441 is an example of a third main surface, and the main surface 442 is an example of a fourth main surface. A hole 42 is defined by the plate main body 25 and the conductive portion 44. In the third embodiment, the main surface 251 and the main surface 441 are flush with each other, and the main surface 252 and the main surface 442 are flush with each other.

[0129] 13(b) is an explanatory diagram of the positional relationship between the bottom plate 21B and the plane V2. FIG. 13(b) illustrates the bottom plate 21B on the plane V2 as viewed in the Z direction perpendicular to the plane V2. As in the second embodiment, a virtual plane V2 is defined that includes the main surface 251 and extends along the main surface 251. The plane V2 has a first region A1 that overlaps with the plate main body 25 in the Z direction perpendicular to the plane V2, a second region A2 that overlaps with the conductive portion 44 in the Z direction perpendicular to the plane V2, and a third region A3 between the first region A1 and the second region A2.

[0130] The plate body 25 is configured so that a current flows from the plate body 25 to the conductive portion 44. That is, the plate body 25 and the conductive portion 44 are electrically connected. In the third embodiment, the plate body 25 and the conductive portion 44 are configured integrally. In other words, the bottom plate 21B integrally includes the plate body 25 and the conductive portion 44. That is, the plate body 25 and the conductive portion 44 are each part of the bottom plate 21B.

[0131] A part of the movable part 50 is movable relative to the plate body 25 and the conductive part 44 and can cross the third area A3. With the above-described configuration, the third embodiment provides a technique that is advantageous for miniaturizing the camera 600B and for reducing noise.

[0132] 13(a), the hole 42 may be a through-hole that penetrates the bottom plate 21B in the Z direction. In this case, most of the ESD current 94 flows through the edge between the main surface 252, 442 and the end surface 253. Therefore, the ESD current 94 does not follow a path that bypasses the notch 200 as shown in FIG. 8(a), and so moves away from the hole 42. Even if electromagnetic field noise is generated by the ESD current 94, the electromagnetic field noise that passes through the hole 42 is reduced.

[0133] In the comparative example shown in FIG. 8(a), the ESD current 92c bypasses the notch 200, and the electromagnetic field noise 91b, 91c, and 91d pass through the notch 200, resulting in high intensity of the electromagnetic field noise.

[0134] 13(a), in the third embodiment, ESD current 94 hardly passes through the edge of hole 42, does not detour around hole 42, and instead flows intensively through the edge of conductive portion 44, which is the edge between main surface 442 and end face 253. In this way, it is possible to prevent the occurrence of electromagnetic field noises such as electromagnetic field noises 91b, 91c, and 91d in FIG. 8(a) that reinforce each other, and to reduce the electromagnetic field noise that passes through hole 42. Because the electromagnetic field noise that passes through hole 42 is reduced, it is possible to effectively reduce distortion in captured images.

[0135] Furthermore, because the thickness of the conductive portion 44 through which the ESD current 94 passes is the same as the thickness of the plate body 25, the change in the cross-sectional area through which the ESD current 94 flows is also small. The smaller change in cross-sectional area also reduces the change in electrical resistance. Therefore, the ESD current 94 can more easily flow through the edge of the conductive portion 44 included in the edge of the bottom plate 21B, and the electromagnetic field noise passing through the hole 42 can be more effectively reduced.

[0136] In the third embodiment, a part of the fixing portion 80 is present in the hole 42 and therefore intersects with the plane V2. This allows the camera 600B to be made smaller, and the conductive portion 44 reduces noise.

[0137] Next, a third modification of the third embodiment will be described. In the second embodiment described above, the hole 42 is a recessed hole, and in the third embodiment described above, the hole 42 is a through-hole, but this is not limiting. Fig. 14(a) is an explanatory diagram of a camera 600B according to a third modification of the third embodiment. Fig. 14(a) is a schematic perspective view of a portion of the internal structure of the camera 600B, with the bottom exterior 306 omitted.

[0138] 14(a), the bottom plate 21B has a plate main body 25 and a conductive portion 44 that is integral with the plate main body 25. The hole 42 defined by the plate main body 25 and the conductive portion 44 may include a through hole 421 and a recessed hole 422 that is continuous with the through hole 421 in the X direction. The through hole 421 is a through hole that penetrates the bottom plate 21B in the Z direction. The recessed hole 422 is a recessed hole that is recessed in the negative direction of the Z axis, away from the electronic unit 100, with respect to the main surface 251. In other words, the recessed hole 422 is a concave portion.

[0139] The recessed hole 422 is defined by the conductive portion 44. The depth of the recessed hole 422 in the Z direction is equal to or greater than the thickness of the plate main body 25 in the Z direction. Therefore, the bottom plate 21B has a protruding portion that is provided at a position corresponding to the recessed hole 422 and protrudes relative to the main surface 252 in the negative direction of the Z axis, away from the electronic unit 100. In other words, the protruding portion is located on the side of the bottom plate 21B opposite to the recessed hole 422. The conductive portion 44 includes a protruding portion. The thickness of the conductive portion 44 in the Z direction is smaller than the thickness of the plate main body 25 in the Z direction. In other words, the bottom plate 21B includes a thick portion for ensuring strength and a thin portion that is the conductive portion 44 corresponding to the recessed hole 422.

[0140] The distance between the main surface 441 and the main surface 442 is smaller than the distance between the main surface 251 and the main surface 252. In other words, the conductive portion 44 is thinner than the plate main body 25. In addition, the distance between the main surface 442 and the plane V2 is larger than the distance between the main surface 251 and the main surface 252. In other words, the conductive portion 44 protrudes in the negative direction of the Z axis with respect to the plate main body 25.

[0141] Furthermore, in order to avoid interference between the movable frame 51 and the base plate 71 and the bottom plate 21B, the recessed hole 422 may be open on the side of the end face 253 of the bottom plate 21B. The end face 253 is, for example, the end face of the bottom plate 21B on the tip side in the negative direction of the X axis.

[0142] Even with the above configuration, according to the third modification, the electromagnetic field noise passing through the through-hole 421 is reduced, so that it is possible to effectively reduce the occurrence of disturbances in the captured image.

[0143] Next, a fourth modification of the third embodiment will be described. In the third modification, the hole 42 has a through-hole 421 and a recessed hole 422, and the opposite side of the recessed hole 422 is a protruding portion, but the present invention is not limited to this. Fig. 14(b) is an explanatory diagram of a camera 600B according to the fourth modification of the third embodiment. Fig. 14(b) is a schematic perspective view of a portion of the internal structure of the camera 600B, with the bottom exterior 306 omitted.

[0144] The depth of the hole 422 in the Z direction may be smaller than the thickness of the plate main body 25 in the Z direction. In the configuration of Modification 4, the distance between the main surface 441 and the main surface 442 is smaller than the distance between the main surface 251 and the main surface 252. In other words, the thickness of the conductive portion 44 in the Z direction is smaller than the thickness of the plate main body 25 in the Z direction. In addition, in Modification 4, as shown in FIG. 14(b), the side of the bottom plate 21B opposite to the recessed hole 422 does not need to protrude as in Modification 2. In other words, the side of the bottom plate 21B opposite to the recessed hole 422 does not have a protruding portion, and the main surface 252 and the main surface 442 are flush with each other.

[0145] Even with the above configuration, according to Modification 4, it is possible to effectively reduce the occurrence of distortion in a captured image because electromagnetic field noise passing through the through-hole 421 is reduced. Also, it is possible to suppress protrusion of the bottom plate 21B in the thickness direction.

[0146] In either the third embodiment or modified examples 3 and 4 of the third embodiment, a shielding member may be disposed in a position facing the through hole, as in the first embodiment or comparative example 1 of the first embodiment. As described above, the third embodiment and modified examples 3 and 4 of the third embodiment provide techniques that are advantageous for miniaturizing the camera 600B and for dealing with noise.

[0147] [Other variations] The present disclosure is not limited to the above-described embodiments, and many modifications of the embodiments are possible within the technical concept of the present disclosure. For example, at least two of the above-described embodiments and modifications may be combined. Furthermore, the effects described in the present embodiments are merely a list of the most preferable effects resulting from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the present embodiments.

[0148] In the above-described embodiment, the conductive plate having the notch or hole is described as the bottom plate, but this is not limiting. For example, another conductive plate in the camera may have the above-described notch or hole. If the conductive plate has the notch, the above-described shielding member may be disposed near the notch.

[0149] In the above embodiment, the first main surface of the plate body of the bottom plate is parallel to the XY plane, but the present invention is not limited to this and the first main surface of the plate body may be inclined with respect to the XY plane. In this case, the movable part only needs to be movable within a plane parallel to the XZ plane that intersects with the first main surface of the plate body.

[0150] The electronic devices to which the above-described embodiments can be applied may be information devices such as smartphones and personal computers, or communication devices such as modems and routers. Alternatively, the electronic devices may be office equipment such as printers and copiers, medical equipment such as X-ray machines and endoscopes, industrial equipment such as robots and semiconductor manufacturing equipment, or transportation equipment such as vehicles, airplanes, and ships. The electronic devices of the present embodiments allow the electronic unit and conductive plate to be arranged in a limited space within the exterior, which is useful for miniaturizing the electronic devices and improving their performance.

[0151] The disclosure of this specification includes not only what is explicitly described in this specification, but also all matters that can be understood from this specification and the drawings attached hereto. The disclosure of this specification also includes the complement of the individual concepts described in this specification. In other words, if this specification states, for example, that "A is B," it can be said that this specification discloses that "A is not B," even if it omits the statement that "A is not B." This is because when "A is B," it is assumed that the case where "A is not B" is taken into consideration.

[0152] The disclosure of the above embodiments includes the following sections.

[0153] (Section 1) an electronic unit having a fixed part and a movable part movable relative to the fixed part; a first conductive portion having a first major surface and a second major surface opposite the first major surface; a second conductive portion having a third major surface and a fourth major surface opposite the third major surface; the first main surface is located between the fixing portion and the second main surface, the third main surface is located between the movable portion and the fourth main surface, the third main surface is located between the fourth main surface and an imaginary plane that includes the first main surface and extends along the first main surface, a part of the movable portion is movable relative to the first conductive portion and the second conductive portion and is capable of intersecting the plane; An electronic device characterized by:

[0154] (Section 2) an electronic unit having a fixed part and a movable part movable relative to the fixed part; a first conductive portion having a first major surface and a second major surface opposite the first major surface; a second conductive portion having a third major surface and a fourth major surface opposite the third major surface; an imaginary plane including the first main surface and extending along the first main surface has a first region overlapping the first conductive portion in a direction perpendicular to the plane, a second region overlapping the second conductive portion in a direction perpendicular to the plane, and a third region between the first region and the second region; configured to allow current to flow from the first conductive portion to the second conductive portion; a part of the movable portion is movable relative to the first conductive portion and the second conductive portion and is capable of crossing the third region; An electronic device characterized by:

[0155] (Section 3) the part of the movable part is a conductive part; 3. The electronic device according to item 1 or 2, characterized in that:

[0156] (Section 4) A part of the fixing portion intersects with the plane. 4. The electronic device according to any one of items 1 to 3, characterized in that:

[0157] (Section 5) the part of the fixed part is a conductive part; 5. The electronic device according to any one of items 1 to 4.

[0158] (Section 6) the first conductive portion is a part of a conductive member; the movable portion is movable within a space defined by a notch or a hole provided in the conductive member; 6. The electronic device according to any one of items 1 to 5, characterized in that:

[0159] (Section 7) The hole is It is a through hole, a recessed hole recessed relative to the first major surface, or a through hole; and a recessed hole that is continuous with the through hole and recessed relative to the first main surface, Item 7. The electronic device according to item 6, characterized in that:

[0160] (Section 8) the recessed hole is open on the side of the end face of the conductive member, Item 8. The electronic device according to item 7.

[0161] (Section 9) The distance between the third main surface and the fourth main surface is smaller than the distance between the first main surface and the second main surface. 9. The electronic device according to any one of items 1 to 8, characterized in that:

[0162] (Section 10) The distance between the fourth main surface and the plane is greater than the distance between the first main surface and the second main surface. 10. The electronic device according to any one of items 1 to 9, characterized in that:

[0163] (Section 11) The distance between the third main surface and the plane is smaller than the distance between the second main surface and the plane. 11. The electronic device according to any one of items 1 to 10.

[0164] (Section 12) In a direction perpendicular to the plane, the second conductive portion overlaps the entire movable range of the movable part within the plane. 12. The electronic device according to any one of items 1 to 11, characterized in that:

[0165] (Section 13) the second conductive portion is electrically connected to the first conductive portion. 13. The electronic device according to any one of items 1 to 12.

[0166] (Section 14) a first conductive member having the first conductive portion and a second conductive member having the second conductive portion are fixed to each other by a fixing member; 14. The electronic device according to any one of items 1 to 13, characterized in that:

[0167] (Section 15) the conductive member integrally includes the first conductive portion and the second conductive portion; 15. The electronic device according to any one of items 1 to 14.

[0168] (Section 16) The electronic unit has an actuator that moves the movable part. 16. The electronic device according to any one of items 1 to 15, characterized in that:

[0169] (Section 17) an exterior member disposed on the second main surface side of the first conductive portion; the exterior member is fixed to the conductive member having the first conductive portion with a metal screw; 17. The electronic device according to any one of items 1 to 16,

[0170] (Section 18) The exterior member is made of plastic. Item 18. The electronic device according to item 17.

[0171] (Section 19) the movable part includes an image sensor; Item 19. The electronic device according to any one of items 1 to 18.

[0172] (Section 20) a screw receiving portion for receiving a tripod screw is fixed to the conductive member having the first conductive portion; 20. The electronic device according to any one of items 1 to 19, characterized in that:

[0173] (Section 21) further comprising an image processing device that receives an input of an image signal from the image sensor via a transmission path; 20. The electronic device according to item 19, characterized in that:

[0174] (Section 22) The transmission path includes a flexible wiring member. 22. The electronic device according to item 21. [Explanation of symbols]

[0175] V1...imaginary plane, 21...bottom plate (first conductive portion), 41...shield member (second conductive portion), 100...electronic unit, 50...movable portion, 80...fixed portion, 211...main surface (first main surface), 212...main surface (second main surface), 411...main surface (third main surface), 412...main surface (fourth main surface), 600...camera (electronic device)

Claims

1. an electronic unit having a fixed part and a movable part movable relative to the fixed part; a first conductive portion having a first major surface and a second major surface opposite the first major surface; a second conductive portion having a third major surface and a fourth major surface opposite the third major surface; the first main surface is located between the fixing portion and the second main surface, the third main surface is located between the movable portion and the fourth main surface, the third main surface is located between the fourth main surface and an imaginary plane that includes the first main surface and extends along the first main surface, a part of the movable portion is movable relative to the first conductive portion and the second conductive portion and is capable of intersecting the plane; An electronic device characterized by:

2. an electronic unit having a fixed part and a movable part movable relative to the fixed part; a first conductive portion having a first major surface and a second major surface opposite the first major surface; a second conductive portion having a third major surface and a fourth major surface opposite the third major surface; an imaginary plane including the first main surface and extending along the first main surface has a first region overlapping the first conductive portion in a direction perpendicular to the plane, a second region overlapping the second conductive portion in a direction perpendicular to the plane, and a third region between the first region and the second region; configured to allow current to flow from the first conductive portion to the second conductive portion; a part of the movable portion is movable relative to the first conductive portion and the second conductive portion and is capable of crossing the third region; An electronic device characterized by:

3. the part of the movable part is a conductive part; 3. The electronic device according to claim 1 or 2.

4. A part of the fixing portion intersects with the plane.

3. The electronic device according to claim 1 or 2.

5. the part of the fixed part is a conductive part; 3. The electronic device according to claim 1 or 2.

6. the first conductive portion is a part of a conductive member; the movable portion is movable within a space defined by a notch or a hole provided in the conductive member; 3. The electronic device according to claim 1 or 2.

7. The hole is It is a through hole, a recess recessed relative to the first major surface; or a through hole; and a recessed hole that is continuous with the through hole and recessed relative to the first main surface, 7. The electronic device according to claim 6, wherein the electronic device is a semiconductor device.

8. the recessed hole is open on the side of the end face of the conductive member, 8. The electronic device according to claim 7,

9. a distance between the third main surface and the fourth main surface is smaller than a distance between the first main surface and the second main surface; 3. The electronic device according to claim 1 or 2.

10. a distance between the fourth main surface and the plane is greater than a distance between the first main surface and the second main surface; 3. The electronic device according to claim 1 or 2.

11. a distance between the third main surface and the plane is smaller than a distance between the second main surface and the plane; 3. The electronic device according to claim 1 or 2.

12. In a direction perpendicular to the plane, the second conductive portion overlaps the entire movable range of the movable part within the plane.

3. The electronic device according to claim 1 or 2.

13. the second conductive portion is electrically connected to the first conductive portion.

2. The electronic device according to claim 1, wherein the electronic device is a semiconductor device.

14. a first conductive member having the first conductive portion and a second conductive member having the second conductive portion are fixed to each other by a fixing member; 3. The electronic device according to claim 1 or 2.

15. the conductive member integrally includes the first conductive portion and the second conductive portion; 3. The electronic device according to claim 1 or 2.

16. The electronic unit has an actuator that moves the movable part.

3. The electronic device according to claim 1 or 2.

17. an exterior member disposed on the second main surface side of the first conductive portion; the exterior member is fixed to the conductive member having the first conductive portion with a metal screw; 3. The electronic device according to claim 1 or 2.

18. The exterior member is made of plastic.

18. The electronic device according to claim 17.

19. the movable part includes an image sensor; 3. The electronic device according to claim 1 or 2.

20. a screw receiving portion for receiving a screw of a tripod is fixed to the conductive member having the first conductive portion; 3. The electronic device according to claim 1 or 2.

21. further comprising an image processing device that receives an input of an image signal from the image sensor via a transmission path; 20. The electronic device according to claim 19.

22. The transmission path includes a flexible wiring member.

22. The electronic device according to claim 21.

Images