Electronic apparatus

Abstract

To provide an electronic apparatus that achieves high heat dissipation properties, while preventing an increase in load caused by displacement of heat dissipation members.SOLUTION: An electronic apparatus (10) has: a stationary unit (200b); a movable unit (200a) that holds an electronic component (230) and is movable relative to the stationary unit; a first heat dissipation member (801) and second heat dissipation members (802a, 802b) that transfer heat of the electronic component; a control board (100) that transmits signals; and a heat sink (700) that is provided between the stationary unit and the control board. The first heat dissipation member has flexibility. First connection parts (801a, 801b) of the first heat dissipation member are connected to the movable unit. Second connection parts (801c, 801d) of the first heat dissipation member are connected to the stationary unit. The second heat dissipation members are arranged between the second connection parts of the first heat dissipation member and the heat sink.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an electronic device. [Background technology]

[0002] Conventionally, electronic devices such as imaging devices have been known that have a wiring structure in which a movable unit displaceably supported by a fixed unit (support unit) and a control board are connected by a flexible board. For example, in an imaging device that has a function of optically correcting subject blur, subject blur correction is achieved by displacing a movable unit that supports an imaging element relative to the fixed unit in a direction perpendicular to the optical axis.

[0003] When an imaging element is provided in a movable unit, the imaging element needs to be cooled, and therefore a heat dissipation member such as a flexible graphite sheet is usually provided. Patent Document 1 discloses an imaging device in which a fixed unit and a movable unit are electrically connected and a flexible heat dissipation member is connected to cool the imaging element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-284414 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the imaging device disclosed in Patent Document 1, the reaction force generated by the deformation of the heat dissipation member becomes a load when driving the movable unit. Therefore, if the heat dissipation member has low flexibility, it may hinder the driving of the movable unit. Furthermore, since the reaction force of the heat dissipation member applies a load in the optical axis direction of the imaging element, it may reduce the installation accuracy of the imaging element.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electronic device with high heat dissipation properties while suppressing an increase in load caused by displacement of a heat dissipation member. [Means for solving the problem]

[0007] An electronic device according to one aspect of the present invention comprises a fixed unit, a movable unit that holds an electronic component and is movable relative to the fixed unit, a first heat dissipation member and a second heat dissipation member that transfer heat from the electronic component, a control board that transmits signals, and a heat dissipation plate provided between the fixed unit and the control board, wherein the first heat dissipation member is flexible, a first connection portion of the first heat dissipation member is connected to the movable unit, a second connection portion of the first heat dissipation member is connected to the fixed unit, and the second heat dissipation member is disposed between the second connection portion of the first heat dissipation member and the heat dissipation plate.

[0008] Other objects and features of the present invention will be described in the following embodiments. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an electronic device with high heat dissipation properties while suppressing an increase in load caused by displacement of the heat dissipation member. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view of an electronic device according to an embodiment of the present invention. [Figure 2] FIG. 1 is an exploded perspective view of an electronic device according to an embodiment of the present invention. [Figure 3] FIG. 2 is a perspective view of an image stabilization unit according to the present embodiment. [Figure 4] FIG. 2 is an exploded perspective view of the image stabilization unit according to the embodiment. [Figure 5] FIG. 2 is a cross-sectional view of an image stabilization unit according to the present embodiment. [Figure 6] FIG. 3 is a diagram illustrating the layout of heat dissipation members provided on a heat dissipation plate in this embodiment. [Figure 7]FIG. 2 is a schematic diagram of a control board according to the present embodiment. [Figure 8] FIG. 2 is an exploded perspective view of the EVF unit according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0012] Note that this embodiment describes an imaging device equipped with an imaging element (heat-generating portion) as an example of an electronic device, but is not limited to this and can also be applied to other electronic devices other than imaging devices (electronic devices equipped with electronic components (heat-generating portions) other than imaging elements).

[0013] First, referring to FIG. 1, a schematic configuration of an imaging device (electronic device) 10 according to this embodiment will be described. FIGS. 1(a) and 1(b) are perspective views of the imaging device 10. With respect to the orientation of the imaging device 10, the subject side is defined as the front side (front side) based on the direction as seen from the user, and the up-down direction, the front-back direction, and the left-right direction are defined as seen from the user directly facing the back of the imaging device 10. Accordingly, FIG. 1(a) is a perspective view (front perspective view) of the imaging device 10 as seen from the front side (subject side), and FIG. 1(b) is a perspective view (rear perspective view) of the imaging device 10 as seen from the rear side (rear side). This embodiment describes an interchangeable lens camera in which a lens device (interchangeable lens) is detachably attached to a camera body as the imaging device 10, but is not limited thereto and can also be applied to an imaging device in which the camera body and lens device are integrally configured.

[0014] The imaging device 10 has an exterior part 10c. The exterior part 10c is composed of multiple members. The imaging device 10 has a mount 10a on the front side. An interchangeable lens (lens device) (not shown) can be attached to the mount 10a. The axis passing through the center of the mount 10a is approximately aligned with the optical axis P (dashed line in FIG. 1(a)) of the imaging optical system of the interchangeable lens, i.e., the imaging optical axis. The imaging device 10 also has an LCD monitor 71 and an EVF (electronic viewfinder) panel 81, which display image data captured by the imaging element 230, setting information related to imaging, and the like.

[0015] Next, the internal configuration of the imaging device 10 will be described with reference to Fig. 2. Fig. 2 is an exploded perspective view of the main parts of the imaging device 10 as seen from the rear side (back side). Note that Fig. 2 omits some components of the imaging device 10, such as the exterior part 10c. Furthermore, in Fig. 2 and subsequent figures, only parts necessary for understanding this embodiment are shown, and unnecessary parts are omitted.

[0016] The imaging device 10 has a control board 100, an image stabilization unit 200, a shutter unit 300, a base member 400, and a heat sink 700. The image stabilization unit 200 constitutes an image stabilization device that performs image stabilization for an image. A control unit of the image stabilization device is provided on the control board 100.

[0017] The image stabilization unit 200 includes a movable optical member. The image stabilization unit 200 is fixed to a base member 400 together with the shutter unit 300. The image stabilization unit 200 is held by the base member 400 to which the shutter unit 300 is attached. For example, the image stabilization unit 200 is supported by three screws 600a, 600b, and 600c and three coil springs 500a, 500b, and 500c so as to be displaceable (movable) in the direction along the optical axis P (see FIG. 1(a)) relative to the base member 400. An assembly worker adjusts the amount of tightening of the screws 600a, 600b, and 600c. This allows the tilt of the imaging surface of the image sensor (electronic component) 230 (see FIG. 4(b)) relative to the base member 400 and its position on the optical axis P to be adjusted. Once the adjustment of the tilt of the imaging surface is complete, the screws 600a, 600b, and 600c are adhesively fixed to the fixing unit of the image stabilization unit 200 to prevent them from loosening. The fixing unit 200b (see FIG. 3) is a support member, the details of which will be described later with reference to FIG.

[0018] The control board 100 and the base member 400 are fixed to the exterior part 10c. A signal (image pickup signal) output from the image pickup element 230 is transmitted to the control board 100. A control IC 101 used to control the image pickup signal, and connectors 102, 103, and 104 are mounted on the control board 100. In addition, various electronic components (not shown) such as chip resistors, ceramic capacitors, inductors, and transistors are mounted on the control board 100.

[0019] The imaging device 10 has, as flexible wiring members, a first connecting member 270a, a second connecting member 270b, and a third connecting member 240 extending from the image stabilization unit 200. The first connecting member 270a is connected to the connector 102. The second connecting member 270b is connected to the connector 103. The third connecting member 240 is connected to the connector 104. This electrically connects the control board 100 and the image stabilization unit 200.

[0020] The heat sink 700 is disposed between the control board 100 and the image stabilization unit 200 (fixing unit 200b). The heat sink 700 is supported by ear loops 401 and 402, a bottom heat sink 403, and a top heat sink 404, which are plate members attached to the base member 400 together with the control board 100 with screws 700a, 700b, 700c, 700d, and 700e. The heat sink 700, the bottom heat sink 403, and the top heat sink 404 are each made of a metal material with high thermal conductivity, such as copper or aluminum. The ear loops 401 and 402 are made of a metal material with lower thermal conductivity, such as stainless steel or iron, to suppress heat transfer to a grip portion of the imaging device 10 that is held by a user.

[0021] The image stabilization unit 200 is provided with a first heat dissipation member 801. The first heat dissipation member 801 is connected to second elastic heat dissipation members (second heat dissipation members) 802a and 802b provided on the heat dissipation plate 700, and transfers heat from the image stabilization unit 200 to the heat dissipation plate 700. In addition, third elastic heat dissipation members (third heat dissipation members) 803a, 803b, and 803c are provided between the heat dissipation plate 700 and the control board 100. The third elastic heat dissipation members 803a, 803b, and 803c dissipate (transfer) heat from electronic components such as ICs provided on the control board 100 to the heat dissipation plate 700.

[0022] Next, the image stabilization unit 200 will be described with reference to Figures 3(a) and 3(b) and Figures 4(a) and 4(b). Figure 3(a) is a front perspective view of the image stabilization unit 200, and Figure 3(b) is a rear perspective view. Figure 4(a) is an exploded front perspective view of the image stabilization unit 200, and Figure 4(b) is an exploded rear perspective view.

[0023] The image stabilization unit 200 has a movable unit 200a and a fixed unit 200b. The movable unit 200a is a movable member including the image sensor 230. The fixed unit 200b is a support member fixed to the base member 400. The fixed unit 200b is configured to be able to adjust the position of the image sensor 230 in the optical axis direction. The movable unit 200a is supported by the fixed unit 200b in a state in which it can be displaced in any direction (a direction different from the optical axis direction) in a plane perpendicular to the optical axis P relative to the fixed unit 200b. The optical image stabilization operation is achieved by moving the movable unit 200a in the direction perpendicular to the optical axis P.

[0024] The fixed unit 200b is mainly composed of a front yoke 210, a fixed base plate 250, and a rear yoke 260. The movable unit 200a is mainly composed of a movable base holder 220, an imaging element board 231, a sensor holder 280, and a third connecting member 240. The first connecting member 270a and the second connecting member 270b each connect the imaging element board 231 and the control board 100. The third connecting member 240 connects the movable base holder 220 and the control board 100. The first connecting member 270a, the second connecting member 270b, and the third connecting member 240 are all flexible printed circuit boards.

[0025] The movable unit 200a includes an imaging element substrate 231. An imaging element 230 is mounted on the imaging element substrate 231. The imaging element 230 is a CMOS (complementary metal-oxide semiconductor) image sensor or a CCD (charge-coupled device) image sensor, and converts an optical image of a subject into an electrical signal. The imaging element 230 and the imaging element substrate 231 are adhesively fixed to the movable base holder 220. A sensor holder 280 provided with an optical low-pass filter 281 is disposed in front of the imaging element 230. The optical low-pass filter 281 is an optical element that blocks infrared light from entering and prevents color moiré and the like.

[0026] Three openings are formed in the movable base holder 220, and three coils 241a, 241b, and 241c are mounted in the three openings, respectively. The third connection member 240 is disposed so as to overlap the three coils 241a, 241b, and 241c. One end of the third connection member 240 is electrically connected to the coils 241a, 241b, and 241c. The other end of the third connection member 240 is electrically connected to the connector 104 of the control board 100.

[0027] Movable base holder 220 has three metal balls arranged in three ball receiving portions 220a, 220b, and 220c (see FIG. 4(b)), which are received on the flat portion of the opposing fixed base plate 250. The rolling of the three metal balls enables movable base holder 220 to be displaced in any direction within a plane perpendicular to optical axis P. Magnets 212a, 212b, and 212c are adhesively fixed to front yoke 210 (see FIGS. 4(a) and 4(b)) at predetermined positions on the surface facing movable base holder 220.

[0028] Openings 251a, 251b, and 251c are formed in fixed base plate 250 at different positions when viewed from the direction of optical axis P (optical axis direction). Magnets 252a, 252b, and 252c are respectively incorporated in openings 251a, 251b, and 251c. Support pillars 251a, 251b, and 251c are provided on fixed base plate 250 facing front yoke 210 in order to fix front yoke 210, and front yoke 210 and fixed base plate 250 are joined together so as to sandwich movable base holder 220.

[0029] When viewed from the direction of the optical axis P, the magnets 212a, 212b, 212c and the magnets 252a, 252b, 252c are formed in substantially the same positions and shapes as the corresponding coils 241a, 241b, 241c, respectively, and sandwich the coils 241a, 241b, 241c. The magnets 212a, 212b, 212 and the magnets 252a, 252b, 252c are also positioned such that the centers of the magnets 212a, 212b, 212 and the magnets 252a, 252b, 252c are substantially aligned with the centers of the corresponding coils 241a, 241b, 241c. An electrical signal from the control board 100 is applied to the coils 241a, 241b, 241c via the third connecting member 240. At this time, electromagnetic forces are generated between the magnets 212a, 212b, 212 and the magnets 252a, 252b, 252c. This electromagnetic force enables the movable base holder 220 to perform optical image stabilization.

[0030] The assembler attaches rear yoke 260 to fixed base plate 250 from the rear side so that magnets 252a, 252b, and 252c are housed inside openings 251a, 251b, and 251c, respectively. Both rear yoke 260 and fixed base plate 250 are made of a ferromagnetic material. The assembler simply aligns rear yoke 260, to which magnets 252a, 252b, and 252c are attached, with fixed base plate 250 and brings them into contact, allowing the two components to be magnetically attracted to each other. In other words, the two components can be joined without using adhesive.

[0031] An opening 253 is also formed in the fixed base plate 250. When the movable base holder 220 is sandwiched between the front yoke 210 and the fixed base plate 250, the imaging element substrate 231 is exposed to the rear side from the opening 253. A first connecting member 270a and a second connecting member 270b are connected to the rear surface of the imaging element substrate 231. An assembly worker passes the first connecting member 270a and the second connecting member 270b through the opening 253 from the rear side and installs them into the imaging element substrate 231. These are electrically connected by soldering or a connector.

[0032] The first connecting member 270a and the second connecting member 270b each have a plate-like shape that is elongated in the vertical direction of the imaging device 10, are bent in a semicircular arc shape, and are flexible so as not to interfere with the image stabilization operation of the movable base holder 220. As described above, the first connecting member 270a is connected to the connector 102 of the control board 100, and the second connecting member 270b is connected to the connector 103. As shown in FIG. 3(b), the transmission direction of the first connecting member 270a and the second connecting member 270b is the longitudinal direction of the first connecting member 270a and the second connecting member 270b, which is the vertical direction of the imaging device 10. Electrical signals from the imaging element board 231 are transmitted to the control board 100 by the first connecting member 270a and the second connecting member 270b.

[0033] Next, with reference to Figures 5(a) and (b), a configuration for obtaining a high heat dissipation effect while suppressing an increase in load caused by displacement of heat dissipation members such as the first heat dissipation member 801 in this embodiment will be described. Figure 5(a) is a cross-sectional view of a main part of the image stabilization unit 200, and corresponds to a cross section of the image stabilization unit 200 taken along line AA shown in Figure 3(b). The movable base holder 220 is made of a magnesium alloy or aluminum alloy, which are metals with high heat dissipation properties, and transfers heat from the image sensor substrate 231 that is adhered to the movable base holder 220.

[0034] The first heat dissipation member 801 is a flexible sheet member such as a graphite sheet. The center of the first heat dissipation member 801 (fixed portions (first connection portions) 801a, 801b) is adhesively fixed to the movable base holder 220. Both ends of the first heat dissipation member 801 (fixed portions (second connection portions) 801c, 801d) are bent into semicircular arcs and adhesively fixed to the fixed holders 290 provided on the fixed base plate 250. This allows the first heat dissipation member 801 to reduce the load applied to the movable base holder 220 in the direction along the optical axis P (optical axis direction). Furthermore, because the first heat dissipation member 801 is flexible, when the movable base holder 220 moves in a plane perpendicular to the optical axis P due to the image stabilization operation, the first heat dissipation member 801 deforms, thereby reducing the load.

[0035] Furthermore, fixed portions (first connection portions) 801a and 801b at the center of first heat dissipation member 801 and semicircular arc-shaped fixed portions (second connection portions) 801c and 801d at both ends are arranged to approximately coincide in the optical axis direction. That is, when viewed from a direction perpendicular to the movement direction of movable unit 200a (the in-plane direction in which movable unit 200a moves), at least a portion of fixed portions 801c and 801d of first heat dissipation member 801 overlaps with fixed portions 801a and 801b. This provides uniform flexibility with respect to optical axis P in a plane perpendicular to optical axis P.

[0036] The second elastic heat dissipation members 802a and 802b provided on the heat dissipation plate 700 contact (are pressed against) both ends (fixed portions 801c and 801d) of the first heat dissipation member 801 adhesively fixed to the fixed holder 290 and the heat dissipation plate 700, thereby dissipating heat from the imaging element substrate 231 to the heat dissipation plate 700. The second elastic heat dissipation members 802a and 802b are elastic members such as heat-dissipating rubber or a cylindrically rolled graphite sheet that has elasticity (flexibility) at least in the optical axis direction (a direction perpendicular to the movement direction of the movable unit 200a). This makes it possible to suppress the reaction force on the image stabilization unit 200 in the optical axis direction. This also makes it possible to suppress a decrease in the mounting accuracy of the image stabilization unit 200 in the optical axis direction. Furthermore, the load on the second elastic heat dissipation members 802a and 802b in the optical axis direction is applied only to the fixed holder 290 and the fixed base plate 250. That is, this load is not applied to the movable base holder 220, and therefore does not impede the image blur correction operation.

[0037] Second connecting member 270b is arranged on the opposite side of the connection surface between fixed holder 290 constituting fixed unit 200b and both ends (fixed portions 801c, 801d) of first heat dissipation member 801. Therefore, when movable base holder 220 moves, first heat dissipation member 801 and second connecting member 270b do not come into contact with each other, preventing the flexibility of each from being impaired.

[0038] 5(b) is a cross-sectional view of essential parts in a case where second elastic heat dissipation members 802a and 802b are not provided, as compared to FIG. 5(a). The fixed holder 290 has elastic portions 290a and 290b, to which both ends of the first heat dissipation member 801 are connected. The elastic portions 290a and 290b press (bring into contact) both ends (fixed portions 801c and 801d) of the first heat dissipation member 801 against the heat dissipation plate 700. At this time, the elastic portions 290a and 290b have elasticity (flexibility) in the optical axis direction (a direction perpendicular to the movement direction of the movable unit 200a), and suppress the reaction force in the optical axis direction on the image stabilization unit 200. The elastic portions 290a and 290b may be leaf springs formed integrally with the fixed holder 290, or elastic members such as rubber or urethane formed separately from the fixed holder 290 may be attached.

[0039] Next, with reference to Figures 6(a) and (b), the arrangement of the second elastic heat dissipation members 802a and 802b and the third elastic heat dissipation members 803a, 803b, and 803c provided on the heat dissipation plate 700 will be described. Figure 6(a) is a diagram illustrating the arrangement of the second elastic heat dissipation members 802a and 802b provided on the heat dissipation plate 700 when viewed from the front side (subject side) of the imaging device 10. Figure 6(b) is a diagram illustrating the arrangement of the third elastic heat dissipation members 803a, 803b, and 803c provided on the heat dissipation plate 700 when viewed from the rear side (back side) of the imaging device 10.

[0040] The second elastic heat dissipation members 802a and 802b are disposed on the left and right sides of the imaging device 10. As described above, the first connection member 270a is wired between the two second elastic heat dissipation members 802a and 802b so as to transmit an electrical signal from the imaging element substrate 231 in the vertical direction (transmission direction) of the imaging device 10. In FIG. 6(b), the transmission direction of the electrical signal is indicated by an arrow.

[0041] 6(b), third elastic heat dissipation members 803a and 803b are respectively arranged above and below the second elastic heat dissipation member 802a, and a third elastic heat dissipation member 803c is arranged above the second elastic heat dissipation member 802b. In this manner, the second elastic heat dissipation member 802a and the third elastic heat dissipation members 803a and 803b are arranged in a direction parallel to the transmission direction of the first connecting member 270a. Furthermore, the second elastic heat dissipation member 802b and the third elastic heat dissipation member 803c are arranged in a direction parallel to the transmission direction of the first connecting member 270a.

[0042] Next, the control board 100 will be described in detail with reference to Fig. 7. Fig. 7 is a schematic diagram of the control board 100 as viewed from the rear of the imaging device 10. As described above, the control IC 101 and connectors 102, 103, and 104 are mounted on the rear side of the control board 100. As indicated by dotted lines, control ICs 105a, 105b, 105c, 105d, and 105e, which are different from the control IC 101, are arranged on the front side of the control board 100.

[0043] The control ICs 105a, 105b, 105c, 105d, and 105e and the third elastic heat dissipation members 803a, 803b, and 803c provided on the heat dissipation plate 700 are substantially aligned on the optical axis P. That is, the control ICs 105a and 105b and the third elastic heat dissipation member 803a at least partially overlap each other when viewed from the optical axis direction. Similarly, the control ICs 105c and 105d and the third elastic heat dissipation member 803b at least partially overlap each other when viewed from the optical axis direction. Furthermore, the control IC 105e and the third elastic heat dissipation member 803c at least partially overlap each other when viewed from the optical axis direction. This allows heat from the control ICs 105a, 105b, 105c, 105d, and 105e to be transferred (dissipated) to the heat dissipation plate 700.

[0044] In this embodiment, openings 701a, 701b, 701c, and 701d are formed on the upper and lower sides of the second elastic heat dissipation members 802a and 802b of the heat dissipation plate 700. This prevents heat from the control ICs 105a, 105b, 105c, 105d, and 105e from flowing back to the image pickup element substrate 231 via the second elastic heat dissipation members 802a and 802b.

[0045] The openings 701a, 701b, 701c, and 701d of the heat sink 700 have a long (rectangular) shape in the direction perpendicular to the transmission direction of the first connecting member 270a (the horizontal direction in FIG. 6(b)), and are therefore configured not to impair the electromagnetic shielding properties of electrical signals. That is, the length of the openings 701a-701d in the direction perpendicular to the signal transmission direction of the first connecting member 270a (first length) is longer than the length of the openings 701a-701d in the transmission direction (second length).

[0046] Furthermore, with respect to the second elastic heat dissipation members 802a and 802b, the third elastic heat dissipation members 803a, 803b, and 803c are each arranged parallel to the transmission direction of the first connecting member 270a, and therefore, the long openings in the direction perpendicular to the transmission direction can effectively prevent reverse heat flow.

[0047] According to this embodiment, it is possible to provide an electronic device with high heat dissipation properties while suppressing an increase in load caused by displacement of the heat dissipation member.

[0048] In this embodiment, an imaging device has been described as an example of an electronic device, but this is not limited to this, and the present invention can be applied to various electronic devices in which a movable member supported in a displaceable state on a support member and a control board are connected by a connecting member.

[0049] 8 is an exploded perspective view of an EVF unit (electronic device) 80 in this embodiment. The EVF unit 80 is configured to include an EVF panel unit 82 and a lens unit 84. The EVF panel unit 82 has a diopter adjustment mechanism (not shown) and is displaceable (movable) in the Z-axis direction (optical axis direction) relative to the lens unit 84. The EVF panel unit 82 is configured to include an EVF panel (electronic component) 81 and a panel holder 83 that holds the EVF panel 81. The EVF panel 81 is adhesively fixed to the panel holder 83. In this way, this embodiment can also be applied to an electronic device that includes the EVF panel 81 as an electronic component.

[0050] The disclosure of each embodiment includes the following configuration. (Configuration 1) A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member and a second heat dissipation member for transferring heat from the electronic component; a control board for transmitting signals; a heat sink provided between the fixed unit and the control board, the first heat dissipation member is flexible, a first connection portion of the first heat dissipation member connected to the movable unit; a second connection portion of the first heat dissipation member connected to the fixing unit; The electronic device is characterized in that the second heat dissipation member is disposed between the second connection portion of the first heat dissipation member and the heat dissipation plate. (Configuration 2) 2. The electronic device according to configuration 1, wherein the second heat dissipation member is in contact with both the second connection portion of the first heat dissipation member and the heat dissipation plate. (Configuration 3) 3. The electronic device according to configuration 1 or 2, wherein the second heat dissipation member has flexibility in a direction perpendicular to the direction of movement of the movable unit. (Configuration 4) A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member that transfers heat from the electronic component; a control board for transmitting signals; a first connection member that electrically connects the movable unit and the control board; a heat sink provided between the fixed unit and the control board, the first heat dissipation member is flexible, a first connection portion of the first heat dissipation member connected to the movable unit; a second connection portion of the first heat dissipation member connected to the fixing unit; the fixing unit has an elastic portion connected to the second connection portion of the first heat dissipation member, The electronic device, characterized in that the second connection portion of the first heat dissipation member is disposed between the elastic portion and the heat dissipation plate. (Configuration 5) 5. The electronic device according to configuration 4, wherein the second connection portion of the first heat dissipation member is in contact with the heat dissipation plate. (Configuration 6) The electronic device described in any one of configurations 1 to 5, characterized in that when viewed from a direction perpendicular to the movement direction of the movable unit, at least a portion of the second connection portion overlaps with the first connection portion. (Configuration 7) 7. The electronic device according to any one of configurations 1 to 6, wherein the first heat dissipation member has flexibility in the direction of movement of the movable unit. (Configuration 8) 6. The electronic device according to configuration 4 or 5, wherein the elastic portion has flexibility in a direction perpendicular to the direction of movement of the movable unit. (Configuration 9) a second connection member that electrically connects the movable unit and the control board; the second connection member is disposed on the opposite side of the fixing unit to a connection surface with the second connection portion, 9. The electronic device according to any one of configurations 1 to 8, wherein the first heat dissipation member and the second connection member do not come into contact with each other when the movable unit moves. (Configuration 10) A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member and a second heat dissipation member for transferring heat from the electronic component; a control board for transmitting signals; a heat sink provided between the fixed unit and the control board; a third heat dissipation member that transfers heat from the control board; a first connection member that electrically connects the movable unit and the control board, the first heat dissipation member or the second heat dissipation member and the third heat dissipation member are connected to the heat dissipation plate; The heat sink has an opening formed therein, The electronic device, wherein a first length of the opening in the first connection member in a direction perpendicular to the signal transmission direction is longer than a second length of the opening in the transmission direction. (Configuration 11) The electronic device described in configuration 10, characterized in that the second heat dissipation member and the third heat dissipation member are arranged along a direction parallel to the transmission direction of the first connection member and connected to the heat dissipation plate. (Configuration 12) the electronic component is an imaging element that converts an optical image of a subject into an electrical signal; 12. The electronic device according to any one of configurations 1 to 11, wherein the movable unit is movable relative to the fixed unit in a direction different from the optical axis direction of the imaging optical system in order to correct image blur. (Configuration 13) 13. The electronic device according to configuration 12, wherein the direction different from the optical axis direction is a direction perpendicular to the optical axis direction. (Configuration 14) 14. The electronic device according to configuration 12 or 13, wherein the fixing unit is capable of adjusting the position of the imaging element in the optical axis direction. (Configuration 15) 15. The electronic device according to any one of configurations 12 to 14, wherein the signal output from the imaging element is transmitted to the control board.

[0051] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the present invention. Parts of the above-described embodiments may be combined as appropriate. [Explanation of symbols]

[0052] 10 Imaging devices (electronic devices) 100 control board 200a Mobile Unit 200b Fixed Unit 230 Image sensor (electronic component) 700 Heat sink 801 First heat dissipation member 801a, 801b Fixed part (first connection part) 801c, 801d Fixed part (second connection part) 802a, 802b Second elastic heat dissipation member (second heat dissipation member)

Claims

1. A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member and a second heat dissipation member for transferring heat from the electronic component; a control board for transmitting signals; a heat sink provided between the fixed unit and the control board, the first heat dissipation member is flexible, a first connection portion of the first heat dissipation member connected to the movable unit; a second connection portion of the first heat dissipation member connected to the fixing unit; The electronic device, characterized in that the second heat dissipation member is disposed between the second connection portion of the first heat dissipation member and the heat dissipation plate.

2. The electronic device according to claim 1 , wherein the second heat dissipation member is in contact with both the second connection portion of the first heat dissipation member and the heat dissipation plate.

3. The electronic device according to claim 1 , wherein the second heat dissipation member is flexible in a direction perpendicular to the direction of movement of the movable unit.

4. A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member that transfers heat from the electronic component; a control board for transmitting signals; a first connection member that electrically connects the movable unit and the control board; a heat sink provided between the fixed unit and the control board, the first heat dissipation member is flexible, a first connection portion of the first heat dissipation member connected to the movable unit; a second connection portion of the first heat dissipation member connected to the fixing unit; the fixing unit has an elastic portion connected to the second connection portion of the first heat dissipation member, The electronic device, characterized in that the second connection portion of the first heat dissipation member is disposed between the elastic portion and the heat dissipation plate.

5. The electronic device according to claim 4 , wherein the second connection portion of the first heat dissipation member is in contact with the heat dissipation plate.

6. 2. The electronic device according to claim 1, wherein when viewed from a direction perpendicular to the movement direction of the movable unit, at least a portion of the second connection portion overlaps with the first connection portion.

7. The electronic device according to claim 1 , wherein the first heat dissipation member has flexibility in the direction of movement of the movable unit.

8. 5. The electronic device according to claim 4, wherein the elastic portion has flexibility in a direction perpendicular to the direction of movement of the movable unit.

9. a second connection member that electrically connects the movable unit and the control board; the second connection member is disposed on the opposite side of the fixing unit from a connection surface with the second connection portion, 2. The electronic device according to claim 1, wherein the first heat dissipation member and the second connection member do not come into contact with each other when the movable unit moves.

10. A fixed unit and a movable unit that holds an electronic component and is movable relative to the fixed unit; a first heat dissipation member and a second heat dissipation member for transferring heat from the electronic component; a control board for transmitting signals; a heat sink provided between the fixed unit and the control board; a third heat dissipation member that transfers heat from the control board; a first connection member that electrically connects the movable unit and the control board, the first heat dissipation member or the second heat dissipation member and the third heat dissipation member are connected to the heat dissipation plate; The heat sink has an opening formed therein, The electronic device, wherein a first length of the opening in the first connection member in a direction perpendicular to the signal transmission direction is longer than a second length of the opening in the transmission direction.

11. 11. The electronic device according to claim 10, wherein the second heat dissipation member and the third heat dissipation member are arranged in a direction parallel to the transmission direction of the first connection member and connected to the heat dissipation plate.

12. the electronic component is an imaging element that converts an optical image of a subject into an electrical signal; 12. The electronic device according to claim 1, wherein the movable unit is movable relative to the fixed unit in a direction different from an optical axis direction of an imaging optical system in order to correct image blur.

13. 13. The electronic device according to claim 12, wherein the direction different from the optical axis direction is a direction perpendicular to the optical axis direction.

14. 13. The electronic device according to claim 12, wherein the fixing unit is capable of adjusting the position of the image pickup element in the optical axis direction.

15. 13. The electronic device according to claim 12, wherein the signal output from the imaging element is transmitted to the control board.

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