Lighting module and lighting assembly including the same

Abstract

To provide a lighting module improved in light extraction efficiency and light distribution characteristics, and a lighting assembly having the same.SOLUTION: A lighting assembly comprises: a lighting module 100 including a substrate 110, multiple light emitting devices 120 disposed on the substrate, a first resin layer 130 covering the multiple light emitting devices, and a second resin layer 140 disposed on the first resin layer; and a first cover 210 disposed on an outer edge of the substrate along an outer periphery of the substrate of the lighting module 100. The second resin layer is disposed on upper and side surfaces of the first resin layer, and the second resin layer includes at least one of phosphor and ink particles. The first cover includes an opening portion 215 from which the second resin layer protrudes, a substrate cover portion 211 disposed on an upper surface of the substrate around the opening portion, and a side cover portion 213 extending lower than a side surface of the substrate from the substrate cover portion.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] SUMMARY The present disclosure relates to lighting modules and lighting assemblies having light emitting elements. The present disclosure relates to lighting modules and lighting assemblies that provide area light sources. The disclosure relates to a light unit or vehicle lamp having a lighting module or lighting assembly. This is about the game. [Background technology]

[0002] Typical lighting applications include vehicle lighting as well as displays and signboards. Light-emitting elements, such as light-emitting diodes (LEDs), are used to replace existing fluorescent lamps, incandescent lamps, etc. Compared to conventional light sources, LEDs have low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Such LEDs are useful in various displays, indoor and outdoor lighting, etc. They are used in various lighting devices. Recently, light-emitting diodes have been adopted as vehicle light sources. Compared to incandescent lamps, light-emitting diodes consume less power. However, the angle of light emitted from the light-emitting diode is small. When using light-emitting diodes as vehicle lamps, The light-emitting area of ​​the lamp needs to be increased. This allows for greater design freedom, and its semi-permanent lifespan makes it economical. Summary of the Invention [Problem to be solved by the invention]

[0003] The present disclosure provides a lighting module that emits surface light by disposing a resin layer on a plurality of light-emitting elements. The present disclosure provides a light emitting device having a plurality of light emitting surfaces and a plurality of resin layers on the light emitting device. The present disclosure provides a lighting module in which a substrate and a light-emitting element are disposed. A lighting module is provided in which a wavelength conversion means is added to at least one of a number of resin layers. The present disclosure relates to a method for manufacturing a light-emitting device, comprising: The present disclosure provides a lighting module having at least one ink particle. A lighting module is provided having a wavelength conversion means in a resin layer separated from a substrate and a light emitting element. The present disclosure provides a light emitting device having ink particles in a resin layer separated from a substrate and a light emitting element. The present disclosure provides a light module comprising a plurality of resin layers disposed on a substrate. It is possible to provide a lighting module in which at least one of the components is doped with phosphor and ink particles. The present disclosure provides a method for manufacturing an insulating film as the uppermost layer among a number of resin layers arranged on a substrate and a light emitting element. The present disclosure provides a lighting module including a plurality of light-emitting elements. The present disclosure provides a flexible lighting module having a light-emitting region and multiple resin layers. The present invention provides a lighting assembly in which the cover can be connected through an outer edge other than the area. The figure shows a first cover having an opening from which a resin layer protrudes, and a substrate and a substrate disposed under the first cover. The present disclosure provides a lighting assembly including a second cover. The present disclosure provides a lighting assembly having a coupling structure for coupling. A lighting module with improved light characteristics and a lighting assembly having the same are provided. [Means for solving the problem]

[0004] The lighting assembly according to the present disclosure includes a substrate, a plurality of light-emitting elements disposed on the substrate, a front surface of ... a first resin layer covering the plurality of light-emitting elements; and at least one light-emitting element disposed on the first resin layer. a lighting module including a second resin layer and a substrate of the lighting module having a second resin layer disposed around the outer periphery thereof; a first cover disposed on an outer edge of the substrate, the second resin layer being the second resin layer is disposed on the top and side surfaces of the layer, and ... the first cover has an opening from which the second resin layer protrudes and a periphery of the opening. a substrate cover portion disposed on the top surface of the substrate, and a substrate cover portion extending from the side surface of the substrate to the substrate cover portion. and a side cover portion extending lower than the first resin layer. It may be positioned lower than the top surface.

[0005] According to the present disclosure, the lighting module includes a substrate support portion below the substrate; a second cover having a stepped joint around an outer edge of the second cover; The mating portion is connected to the side cover portion of the first cover. a power cable protruding from the area between the first cover and the second cover and connected to the board; The second cover may include a cable outlet portion through which a cable is led out. The lighting module includes a terminal groove through which a terminal on a lower surface is exposed, and the terminal groove is formed on one side of the lighting module. The distance between the side surface of the substrate and the side surface of the second resin layer may be inclined in the plane direction. The thickness of the second resin layer may be 0.1 times or more. The upper surface may include a protruding curved surface. The first cover may protrude toward the substrate. The first cover may include a locking projection. A light module may protrude into each of the plurality of openings.

[0006] The lighting assembly according to the present disclosure includes a substrate, a plurality of light-emitting elements disposed on the substrate, a front surface of ... a first resin layer covering the plurality of light-emitting elements; and at least one light-emitting element disposed on the first resin layer. a lighting module including a second resin layer and a second resin layer disposed around the outer periphery of the substrate of the lighting module; a first cover disposed on the outer edge of the substrate and a second cover supporting the lower portion of the lighting module; and a second cover including the second resin layer, the second resin layer being disposed on a surface of the first resin layer. and the first cover is disposed on the ink cartridge and includes at least one of a wavelength conversion means and ink particles therein. the first resin layer and the second resin layer are projected from an opening, and the substrate is disposed around the opening. a substrate cover portion disposed on the top surface of the substrate; and a substrate cover portion extending from the substrate cover portion to a side surface of the substrate. and a side cover portion, the cover being attached from both side surfaces adjacent to one end of the lighting module. The support may include a first connecting member and a second connecting member recessed from the support toward the substrate.

[0007] According to the present disclosure, the side surface of the second resin layer may include a protruding curved surface. The edge of the plate may extend further outward from the periphery of the lower end of the second resin layer. The thickness of the module may be 5.5 mm or less. The second resin layer may be disposed on the substrate in a flip-chip manner. The second resin layer contains a phosphor and ink particles, and the phosphor content in the second resin layer is 23 % or less by weight, and the content of the ink particles can be 3 wt % to 13 wt %. Cut. [Effects of the Invention]

[0008] The present disclosure provides a method for manufacturing a photosensitive resin layer by incorporating at least one of a phosphor and ink particles into the resin layer. It can reduce hot spots and distribute light evenly. The lighting module can be installed without using complicated mechanisms. The cover can be attached to the lighting module to support and fix the parts other than the lighting module. This improves the assembly of the lighting module and user convenience. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a lighting module according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional side view of the lighting module of FIG. 1 taken along line A-A. [Figure 3] FIG. 3 is a diagram illustrating the curved surface portion of the second resin layer in FIG. [Figure 4] 4 is a perspective view showing a curved surface portion of a first resin layer in the lighting module of FIG. [Figure 5] FIG. 5 is a plan view for explaining the relationship depending on the distance between the light emitting element and the first resin layer in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line B-B of FIG. [Figure 7] FIG. 7 is a diagram showing another example of the lighting module of FIG. [Figure 8] FIG. 8 is a perspective view showing a lighting assembly having a lighting module according to a second embodiment. [Figure 9] FIG. 9 is a cross-sectional view of the lighting assembly of FIG. 8 taken along line CC. [Figure 10] FIG. 10 is a perspective view showing a lighting assembly having a lighting module according to a third embodiment. [Figure 11] FIG. 11 is a rear view of the lighting assembly of FIG. [Figure 12]FIG. 12 is an exemplary view of the lighting assembly and main frame of FIG. 10 before they are combined. [Figure 13] FIG. 13 is a perspective view showing an example of coupling the lighting assembly and main frame of FIG. [Figure 14] 14 is a side cross-sectional view showing the electrical contact structure of the lighting assembly in the combination structure of FIG. [Figure 15] FIG. 15 is a partial enlarged view of the coupling structure of FIG. [Figure 16] FIG. 16 is a plan view of a lighting assembly according to a fourth embodiment. [Figure 17] FIG. 17 is an example of a cross-sectional side view of the lighting assembly of FIG. [Figure 18] FIG. 18 is a perspective view of the lighting assembly and the main frame according to the fifth embodiment before they are coupled together. [Figure 19] 19 is a side view of the combined lighting assembly and main frame of FIG. 18. FIG. [Figure 20] FIG. 20 is a cross-sectional view taken along the line D-D of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The technical concept of the present invention is not limited to the embodiments described, but may be embodied in various forms. The components of the embodiments may be selectively embodied within the scope of the technical concept of the present invention. In addition, the terms (technical and Terms used herein (including scientific terms) are those commonly used in the art to which this invention pertains unless expressly specified otherwise. It is interpreted as meaning that is generally understandable to a person of ordinary skill in the art, and is not like a term defined in a dictionary. The meaning of commonly used terms can be interpreted taking into account the contextual meaning of the technology involved. Furthermore, the terms used in this disclosure are for the purpose of describing the embodiments, The invention is not intended to be limited. It can also include plurals unless otherwise specified, and it can be used to refer to "at least one of A, B, and C (or more than one)". When "Above") is written, it means that one or more of all possible combinations of A, B, and C can be used. In addition, in the description of the components of the present disclosure, first, second, A, B, Terms such as (a), (b), etc. can be used. Such terms are used to separate the components from other components. The term is used to distinguish it from the elements, and the essence or order of the components is not specified by the term. It is not limited to the fact that one component is "connected," "coupled," or "connected" to another component. When a component is described as being "connected," it means that the component is directly connected or connected to another component. and when other components are "connected," "coupled," or "connected" between the components. Also, it is described as being formed or arranged "above or below" each component. When mounted on a surface, "above or below" refers not only to when the two components are in direct contact, but also to when one This also includes cases where one or more other components are formed or disposed between the two components. Also, when it is expressed as "up or down," it is not limited to the upward direction, but is based on one component. It can also mean a downward direction.

[0011] The lighting device according to the invention can be used in a variety of lamp devices that require illumination, such as vehicle lamps, home lamps, etc. It can be applied to garden lighting devices or industrial lighting devices. For example, it can be applied to vehicle lamps. If so, headlights, width lights, side mirror lights, fog lights, tail lights, and control lights are Moving lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, back The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, etc. It can also be applied to various fields such as railways and other facilities. It will be applicable to all lighting-related fields and advertising-related fields that can be realized with technological development. .

[0012] FIG. 1 is a perspective view showing a lighting module according to a first embodiment, and FIG. 2 is a perspective view showing the lighting module of FIG. 3 is a cross-sectional view of the module taken along line A-A, and FIG. 3 is a cross-sectional view of the module taken along line A-A in FIG. 2 for explaining the curved surface of the second resin layer. This is a drawing of the

[0013] 1 to 3, the lighting module 100 has a polyhedral shape, for example, a hexahedral shape. The lighting module 100 is formed into a structure that allows for multi-faceted light emission. For example, light is emitted from the top surface and multiple side surfaces of the lighting module 100. Although 100 is illustrated as a device in which light is emitted from five sides, it is possible to use a device in which light is emitted from six sides through the bottom surface. The lighting module 100 may be a light emitting module. a plurality of light emitting elements 120 arranged on the light emitting element 10; a resin layer 130 and one or more second resin layers disposed on the first resin layer 130; The lighting module 100 can include a variety of lamps that require lighting. It can be applied to lighting devices, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it may be used for a head lamp, a side lamp, a indicator lights, fog lights, tail lights, turn signal lights, stop lights lamp, daytime running light, vehicle interior lighting, door scuff ), rear combination lamp, or backup lamp. It is possible.

[0014] The substrate 110 may include an insulating or conductive material. The substrate 110 may be made of a rigid or flexible material. The substrate 110 may be made of, for example, a resin-based printed circuit board. PCB, Metal Core PCB, Flexible PCB, Ceramic The substrate 110 may include at least one of a PCB or an FR-4 substrate. The thickness may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. The substrate 110 is thin, so that the thickness of the lighting module can be reduced. The thickness of the substrate 110 is provided to be 0.5 mm or less, so that the flexible module The thickness of the substrate 110 is approximately 1 / 4 of the thickness of the substrate 110 from the bottom surface to the top surface. 2) is set to 0.1 times or less, or in the range of 0.1 to 0.06 times, the distance to the upper surface of the resin layer 140. It can have.

[0015] A reflective layer (not shown) may be disposed on the substrate 110. The reflective layer may be disposed between the substrate 110 and the first resin layer 130. The reflective layer guides the light generated from the glass upward. The reflective layer may include a resin material. The reflective layer may include PMMA, silicone, etc. It can contain silicon or epoxy material, and the inside can contain, for example, TiO2, SiO2, Al2O 3, from the bottom surface of the substrate 110 to the top surface thereof. The distance to the upper surface of the second resin layer 140 may be the thickness of the module. The thickness of the roll 100 from the bottom surface of the substrate 110 is 5.5 mm or less, or 4.5 mm to 5. The illumination module may have a range of 5 mm or a range of 4.5 mm to 5 mm. The thickness of the resin layer 100 is the linear distance between the lower surface of the substrate 110 and the upper surface of the second resin layer 140. The thickness of the lighting module 100 may be 22 times the thickness of the first resin layer 130. The illumination module may have a range of 0% or less, for example, 180% to 220%. 100 is available in a thickness of less than 5.5mm, making it a flexible and slim surface light source module. The lighting module 100 having the thickness described above can be provided as a module. The light emitted from the surface light source can be provided with a uniform light distribution. This reduces the amount of light and improves light distribution.

[0016] The light emitting element 120 is disposed on the substrate 110. N pieces of the light-emitting elements may be arranged in a first direction, and M pieces of the light-emitting elements may be arranged in a second direction perpendicular to the first direction. The N and M may be 1 or more, or either one of N and M may be 1 or more, and the other may be 1 or more. The number of light emitting elements 120 may be two or more. The light emitting elements 120 are arranged at equal intervals in the first direction and the second direction. At least one of the light emitting elements 1 may be arranged at different intervals. The distance between the light sources 20 may be the same to effectively realize a surface light. The light element 120 is provided by an LED chip and can emit blue, green, red, white, infrared or ultraviolet light. The light emitting element 120 can emit linear light, for example, at 420 nm to 470 nm. The light emitting element 120 can emit blue light in the range. The light emitting element 120 may be made of, for example, a II-VI or III-V compound semiconductor. For example, the light emitting element 120 may be made of aluminum (Al), gallium (Ga), indium (In), or the like. It contains at least two elements selected from the group consisting of aluminum (In), phosphorus (P), arsenic (As), and nitrogen (N). may be provided.

[0017] The light emitting device 120 includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The first conductive type semiconductor layer and the second conductive type semiconductor layer can be made of a group III-V or group II material. The first conductive type semiconductor may be implemented using at least one of group VI compound semiconductors. The conductor layer and the second conductive type semiconductor layer are, for example, In x Al y Ga 1‐x‐y N(0≦x≦1, 0≦y≦1, For example, the first semiconductor material may be a semiconductor material having a composition formula of 0≦x+y≦1. The conductive type semiconductor layer and the second conductive type semiconductor layer are made of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, Al At least one selected from the group including InN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, etc. The first conductive type semiconductor layer may include an n-type dopant such as Si, Ge, Sn, Se, or Te. The second conductive type semiconductor layer may be an n-type semiconductor layer doped with Mg, It may also be a p-type semiconductor layer doped with a p-type dopant such as Zn, Ca, Sr, or Ba. The active layer may be realized by a compound semiconductor, for example, a III-V group semiconductor. Alternatively, the active layer may be realized by at least one of group II-group VI compound semiconductors. When the active layer is embodied in a multi-well structure, the active layer is composed of a plurality of alternating well layers. Multiple barrier layers may be included, and In x Al y Ga 1‐x‐y N(0≦x≦1, 0≦y≦1, 0≦x+ For example, the active layer may be made of InGaN. / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaA At least one selected from the group including AlInGaP / GaAs, InGaP / GaP, AlInGaP / InGaP, and InP / GaAs The light emitting device 120 may include one or more light emitting elements. It can emit light, for example, through the top and four sides. The light emitting device 120 includes a substrate made of a light-transmitting material, and the substrate made of a light-transmitting material is The light emitting device 120 is mounted on the substrate 110 in a flip-chip manner. may be placed on top of

[0018] The first resin layer 130 is disposed on the substrate 110 and the light emitting element 120. The resin layer 130 may be disposed on the top and side surfaces of the plurality of light emitting elements 120. The resin layer 130 may include an upper surface and a plurality of side surfaces. The side surface faces the upper surfaces of the plurality of light emitting elements 120, and a part of the side surface faces the upper surfaces of the plurality of light emitting elements 120. The side surface of the first resin layer 130 may face the upper surface of the substrate 110. The side surface of the first resin layer 130 may be perpendicular or curved. When the first resin layer 130 faces the first resin layer 120, the light emitted through the side of the first resin layer 130 is distributed in a direction perpendicular to the light distribution plane. In order to reduce such light loss, the first resin layer 130 The side surface of the first resin layer 130 may include a curved surface, for example, a protruding curved surface. When the first resin is formed on a curved surface, it can refract incident light in the upward direction. The boundary portion between the upper surface and the side surface of the fat layer 130 may be a curved surface portion. The curved surface is continuously connected to the top and side surfaces of the first resin layer 130. It may be an edge portion of the top surface or a side surface of 30.

[0019] The resin layer 130 is made of a transparent resin material, for example, UV (Ultra Violet) resin, silicone, etc. The UV resin may be a resin material such as epoxy or acrylic. The resin (oligomer type) is made primarily from urethane acrylate oligomer. For example, a synthetic oligomer, urethane acrylate oligomer, can be used. The main material is IBOA (isobornyl acrylamide), a low-boiling point dilutable reactive monomer. Acrylate), HBA (Hydroxybutyl Acrylate), HEMA (Hydroxymethyl Acrylate), etc. are mixed. The polymer may further contain a monomer, and a photoinitiator (e.g., 1-hydroxycyclohexane) may be used as an additive. xyl phenyl-ketone, Diphenyl), Diphwnyl(2,4,6-trimethylbenzoyl phosphine oxide) The UV resin may contain an oligomer 10 to 21. %, monomer 30-63%, additive 1.5-6% In this case, the monomers are IBOA (isobornyl acrylate) 10 to 21%, HBA (Hydroxypropyl acrylate) 10 to 21%. droxybutyl acrylate)10~21%, HEMA(Hydroxy Metaethyl Acrylate)10~21% The additive may be a mixture of 1 to 5% of a photoinitiator to initiate photoreactivity. By adding 0.5 to 1% of antioxidant, yellowing phenomenon can be improved. The resin layer 130 may be made of a mixture of the above-mentioned compositions. The structure is such that a layer is formed using a resin such as UV resin instead of a light guide plate, making it possible to adjust the refractive index and thickness. At the same time, the adhesive properties, reliability, and mass production speed can all be satisfied by using the above-mentioned composition. The resin layer 130 may have beads or dispersing agents therein. The diffusing agent may have a spherical shape and its size may be The shape and size of the diffusing agent may be in the range of 4 μm to 6 μm. The content of the diffusing agent in the first resin layer 130 is not limited to 5 wt %. , for example, 2wt%~5w If the content of the diffusing agent is less than the above range, There is a limit to how much hot spots can be reduced, and if the limit is exceeded, the light transmittance decreases. Therefore, the diffusing agent is disposed in the first resin layer 130 at the above content. This diffuses the light and reduces hot spots without reducing light transmission. When the second resin layer 140 contains a diffusing material or a light-blocking material, the first resin layer 13 In the lighting module, the first resin layer 130 is formed as a single layer. However, the present invention is not limited to this and may include two or more resin layers. The first resin layer 130 includes a transparent layer that does not contain impurities and a diffusing agent on the transparent layer. Alternatively, the diffusion layer may be formed below the light-transmitting layer. can.

[0020] The second resin layer 140 is formed on the first resin layer 130. The second resin layer 140 is The second resin layer 140 may include a transparent material or a transparent insulating material. The second resin layer 140 may be molded on the surface of the first resin layer 130. For example, the second resin layer 140 may be made of a resin material such as silicon. It may be a silicon material or a silicon material with different chemical bonds. Con is a polymer made up of inorganic silicon and organic carbon, and is a thermal Stability, chemical stability, abrasion resistance, gloss, etc., and the reactivity, solubility, and elasticity that are the characteristics of organic materials Silicon has properties such as flexibility and workability. Silicon is available in two types: ordinary silicon and fluorine-rich silicon. It can contain silicon dioxide. Increasing the fluorine ratio of fluorine silicon improves moisture resistance. The second resin layer 140 has an effect of making it possible to The wavelength conversion means may include a wavelength conversion means for receiving the incident light and providing wavelength-converted light. The second resin layer 140 is made of at least one material selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot may emit blue, green, or red light. It can light up.

[0021] The phosphor is uniformly distributed inside the second resin layer 140. The phosphor is a fluoride. The phosphor may include a phosphor of a fluoride compound, for example, an MGF-based phosphor, a KSF-based phosphor, or The phosphor may include at least one of a KTF-based phosphor and a different peak. The light emitted from the light emitting element 120 can be divided into different yellow and red wavelengths. The phosphor can emit light in a different color or a different red peak wavelength. In this case, the red phosphor may have a wavelength range of 610 nm to 650 nm, The wavelength may have a width of less than 10 nm. The fluoride-based red phosphor can be used in a variety of applications, including high temperature and high humidity environments. To improve the performance, they are coated with Mn-free fluoride or Applying an organic coating to the surface of the optical body or a Mn-free fluoride coating In the case of the above-mentioned fluoride-based red phosphor, unlike other phosphors, It can be used in high resolution devices because it can realize a width of 10 nm or less. The phosphor composition must basically conform to stoichiometry, and each element can be substituted by other elements within each group on the periodic table. For example, Sr is an alkaline earth element (I I) Ba, Ca, Mg, etc., and Y can be substituted with lanthanide elements such as Tb, Lu, Sc, Gd, etc. In addition, the activator Eu etc. can be replaced with Ce, Tb, Pr, Er, Yb etc. depending on the desired energy level. It is possible to use an active agent alone or to further apply an inactive agent for property modification. The quantum dots may comprise II-VI or III-V compound semiconductors, and may be red The quantum dots can emit colored light. CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si , CuInS2, CuInSe2, etc., and combinations thereof.

[0022] The second resin layer 140 may contain ink particles therein. The ink may include at least one of a metallic ink, a UV ink, or a curable ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color may be any one of green, red, yellow, and blue. Types include PVC (Polyvinyl chloride) ink, PC (Polycarbonate) ink, and ABS (acrylic) ink. (hydroxynitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, Silicone ink, PP (polypropylene) ink, water-based ink, plastic ink, PM Selective application of MA (poly methyl methacrylate) ink or PS (Polystyrene) ink Here, the width or diameter of the ink particles can be 5 μm or less, for example, 0.0 At least one of the ink particles may have a diameter in the range of 5 μm to 1 μm. The ink particles may have a size smaller than the wavelength of light. The colors of the ink particles may be red, green, or For example, the phosphor may be red, yellow, or blue. For example, the ink particles may emit red light. The color may be darker than the color of the phosphor or the wavelength of light. The light may be of a different color than the color of the light emitted from the light emitting element. The particles can provide the effect of blocking or blocking incident light.

[0023] The second resin layer 140 contains at least two of a diffusing agent, ink particles, and a fluorescent material. The second resin layer 140 may contain ink particles and phosphors without a diffusing agent. The content of the phosphor can be the same as that of the resin material forming the second resin layer 140. The phosphor may be added at a ratio of 40% to the resin material of the second resin layer 140. For example, the phosphor and the second resin layer may be added at a ratio of 40% to 60%. The resin material 140 may be added in the same proportion, for example, 50%:50%. The content of the phosphor is such that the ratio of the phosphor content to the resin material of the second resin layer 140 is 20% or less or 1. In an embodiment, the difference between the content of the phosphor in the second resin layer 140 can be 0% or less. By adding an amount of 40 wt% or more or in the range of 40 wt% to 60 wt%, The color on the surface of the resin layer 140 is provided by the color of the phosphor, and the diffusion and wave of light are prevented. In addition, the second resin layer 140 can improve the long-term conversion efficiency of the light emitting device 120. It can reduce the transmission of wavelengths of light emitted from the The light extracted through the resin layer 140 is provided as a surface light source according to the wavelength of the phosphor. The second resin layer 140 may be provided to have a thickness thinner than that of the first resin layer 130 . If the second resin layer 140 is too thick, the light transmittance decreases, and if it is too thin, the wavelength conversion efficiency decreases. This sometimes happens.

[0024] The thickness of the second resin layer 140 may be in the range of, for example, 0.3 mm to 0.5 mm. The thickness of the second resin layer 140 is 25% or less of the thickness of the first resin layer 130, for example. For example, the thickness of the second resin layer 140 may be in the range of 16% to 25%. If the thickness is greater than this range, the light extraction efficiency may decrease or the module thickness may increase. If it is smaller than this range, it may be difficult to suppress hot spots or the wavelength conversion efficiency may decrease. In addition, the second resin layer 140 is a layer for wavelength conversion and external protection, and has a thickness within the above range. If it is too thick, the flexibility and design freedom of the module may be reduced. The phosphor or quantum dots added to the second resin layer 140 emit amber light, yellow light, and (low) light, green light, red light or blue light. can.

[0025] The second resin layer 140 includes a phosphor, so that the external color is the color of the phosphor. The surface of the second resin layer 140 or the surface of the lighting module may be When the element 120 is off, a red image is provided, and when the element 120 is on, a red image is provided. In this case, red light having a predetermined luminous intensity is diffused and provided as a red image of the surface light source. When the light element 120 is turned on or off, the color coordinates of the surface color are The second resin layer 140 may have different values ​​within the color hue. The fluorescent material and the ink particles can have the same wavelength. or the same color may be one of the colors of the phosphor. The content of the phosphor in the second resin layer 140 may be 23 wt % or less. For example, the range is 12 wt% to 23 wt%, and the content of the ink particles is 3 wt% or more. For example, the weight of the ink particles may be in the range of 3 wt % to 13 wt %. Since the ink particles are smaller in weight than the phosphor, they are more likely to adhere to the surface of the second resin layer 140 than to the phosphor. The color of the surface of the second resin layer 140 can be distributed in the area adjacent to the surface. The effect is provided by the color of the ink particles. These ink particles can suppress the transmission of light. If the ink particles are red, the hot spots can be reduced. When the light elements 120 are not lit, the exterior surface of the lighting module 100 appears red. The light module 100 appears red whether the light is on or off, so color difference The second resin layer 140 can prevent the appearance of a foreign texture due to the addition of a phosphor. The ink may include a first layer and a second layer to which the ink particles are added, and the first layer may include the first The second layer having the ink particles is separately deposited between the resin layer 130 and the second layer. By layering, the phosphor content of the first layer can be reduced.

[0026] As shown in FIG. 2, the second resin layer 140 is formed on the first resin layer 130. 141 and a second region 143 disposed on the side of the first resin layer 130. The first region 141 of the second resin layer 140 is arranged such that N light emitting elements 12 are arranged in a direction perpendicular to the substrate 110. The first region 141 of the second resin layer 140 can overlap with a part of the first region 141 of the second resin layer 140. The light emitting element 120 is disposed on the outermost edge of the substrate 110. The first region 141 of the second resin layer 140 may be formed so as not to burlap. The first region 141 of the second resin layer 140 may be disposed parallel to the upper surface of the first region 141 of the second resin layer 140. The width of the second resin layer 14 may be smaller than the width of the substrate 110 in the first and second directions. The edge of the first region 141 of the substrate 110 may be located inside the side surface of the substrate 110. The first region 141 of the second resin layer 140 may include a flat surface.

[0027] The second region 143 of the second resin layer 140 is formed from the edge of the first region 141 of the second resin layer 140. The second region 143 of the second resin layer 140 extends from the first region 143 toward the substrate 110. The second region 143 of the second resin layer 140 may include a curved surface that bulges outward. The second region 143 of the second resin layer 140 is disposed on the outermost edge of the upper portion of the substrate 110. The light emitting element 120 may be formed to overlap the substrate 110 in the vertical direction. The first region 141 can be defined as a flat portion or an upper surface portion. 43 can be defined as a side surface portion or a curved surface portion. The thickness of the first region 141 and the thickness of the second region 143 of the second resin layer 140 are formed to correspond to each other. However, the thickness of the first region 141 is not limited to this. The thickness of the second region 143 may be the thickness in the direction or the perpendicular distance. It may be the horizontal distance from the outer surface of 140 to the outer surface of the second region 43.

[0028] As described above, the second resin layer 140 is formed so that the side surface has a curved surface. The distance between the corner region of the resin layer 140 and the light emitting element 120 arranged on the outermost edge of the substrate 100 is As a result, the second resin layer 140 can be divided into the first region 141 and the second region In the above, it is possible to prevent the occurrence of dark lines at the boundary surface between the light emitting element 143. The explanation focused on the arrangement structure of the resin layer, the layer containing phosphor and ink particles, but the removal of dark lines and In order to improve the uniformity of light, the distance between the light emitting element and the phosphor layer, the second region of the phosphor layer, The relationship between the radius of curvature of the resin layer and the thickness of the phosphor layer plays an important role.

[0029] Therefore, the detailed specifications of each component of the lighting module will be explained in more detail below. As shown in FIG. 3, the second region 143 of the second resin layer 140 has a curved surface. The second region 143 of the second resin layer 140 may include a first point P1, a second point P2, The first point P1, the second point P2 and the third point P3 may be included. 3 may be a point on the outer surface of the second region 143 of the second resin layer 140. The light emitting elements 120 include a first light emitting element 121, and the first light emitting element 121 includes a plurality of The light emitting elements are arranged around the outer edge of the first resin layer 120 or on the side of the first resin layer 120. The first point P1 may be a light emitting element adjacent to the first resin layer 130. The second resin layer 140 is positioned horizontally from the center C1 of the first light emitting element 121 that is closest to the surface. The third point P3 may be a region in contact with the outer surface of the region 143. A vertical line from the center C1 of the second resin layer 140 and an area in contact with the outer surface of the second area 143 of the second resin layer 140 are The horizontal direction may be a direction parallel to or horizontal to the upper surface of the substrate 110, The vertical direction may be a direction perpendicular to the top surface of the substrate 110. P2 is any point between the first point P1 and the third point P3 of the second region 143 of the second resin layer 140. It may be one area.

[0030] A first distance L1 between the center C1 of the first light emitting element 121 and a first point P1; a second distance L2 from the center C1 of the first light-emitting element 121 to the second point P2; The third distance L3 from the center C1 to the third point P3 may be formed differently. The third distance L3 from the center C1 of the first light emitting element 121 to the third point P3 is A first distance L1 between the center C1 of the light emitting element 121 and the first point P1, and The distance L2 from the center C1 of the first portion to the second point P2 may be greater than the second distance L2. The second distance L2 between the center C1 of the first light emitting element 121 and the second point P2 is The distance L1 from the center C1 of the first portion C1 to the first point P1 may be greater than the first distance L1. In the following, the second distance L2 between the center C1 of the first light emitting element 121 and the second point P2 is The third distance L3 between the center C1 of the element 121 and the third point P3 and the center C1 of the first light-emitting element 121 The distance L2 between C1 and the first point P1 is significantly greater than the first distance L2. A problem occurred in which a dark line appeared at point P2. The second region 143 of the second resin layer 140 is curved so as to reduce the second distance L2 between the second points P2. By forming the second resin layer 140 so as to have a surface, it is possible to prevent the occurrence of dark lines on the second resin layer 140. In addition, in the embodiment, the difference between the first distance L1, the second distance L2, and the third distance L3 is By forming a curved surface so that there is almost no unevenness, the light uniformity on the side surface of the second resin layer 140 can be improved. In addition, the light uniformity between the top surface and the side surface of the second resin layer 140 can be improved. In reality, there are differences in the distance values ​​of the first distance L1, the second distance L2, and the third distance L3, but the second tree The difference in distance between the upper and side surfaces of the fat layer 140 is very small, so it is bright when viewed from the outside. It's hard to recognize the difference in degree.

[0031] The first distance L1 between the center C1 of the first light emitting element 121 and the first point P1 is 0. The first light emitting element 121 and the adjacent light emitting element The light emitting element 120 is arranged so that the distance L4 between the light emitting element 120 and the light emitting element 120 is 5.5 mm to 6.5 mm. The distance L4 between the first light emitting element 121 and the adjacent light emitting element is 6.5 m. If the thickness exceeds m, a hot spot will occur in the area where the light emitting element 120 is located when viewed from the outside. The first distance L1 between the center C1 of the first light emitting element 121 and the first point P1 is , the first light emitting element 121 is spaced apart from the light emitting element 120 so as to be 44% to 55% of the fourth distance L4 between the light emitting elements 120. For example, the distance between the center C1 of the first light emitting element 121 and the first point P1 can be The first distance L1 is determined to be approximately 3 mm. The first distance L1 between the light-emitting elements 120 is less than 44% or 55% of the fourth distance L4 between the light-emitting elements 120. %, the light emitted through the second region 143 of the second resin layer 140 becomes too bright. Alternatively, the image may appear dark, resulting in a problem of reduced light uniformity.

[0032] The radius of curvature R of the second region 143 of the second resin layer 140 is The radius of curvature R of the second region 143 of the second resin layer 140 is determined by the thickness of the second region 143. The thickness t1 of the first resin layer 130 in the direction perpendicular to the substrate 110 and the thickness t2 of the first region 1 of the second resin layer 140 are For example, the thickness t2 of the second resin layer 14 may be larger than or equal to the sum of the thicknesses t1 and t2 of the second resin layer 14. The radius of curvature R of the second region 143 is the thickness of the first resin layer 130 in the direction perpendicular to the substrate 110. The thickness t1 of the first region 141 of the second resin layer 140 is set to 100% to 110% of the sum of the thickness t2 of the first region 141 of the second resin layer 140 and the thickness t2 of the first region 141 of the second resin layer 140. Here, the thickness t1 of the first resin layer 130 is 3.5 mm to 5 mm. The thickness t2 of the first region 141 of the second resin layer 140 may be 0.5 mm or less, for example For example, the thickness of the second resin layer 14 may be in the range of 0.3 mm to 0.5 mm. The radius of curvature R of the second region 143 may be 5.5 mm to 6.0 mm. Therefore, when the thickness t2 of the first region 141 of the second resin layer 140 is less than 0.5 mm, the optical efficiency is low. The second resin layer 140 has a first region 141 and a second region 142. The fourth point P4 may be formed on the outer surface of the second resin layer 140. Furthermore, a fifth point P The fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 may be included. The distance L5 between the first point P1 of the second region 143 of the second resin layer 140 and the first light-emitting element 1 21. Also, the distance between the fourth point P4 of the second resin layer 140 and the The distance L5 between the fifth points P5 of the substrate 110 is determined by the curvature of the second region 143 of the second resin layer 140. It may be formed to be smaller than or equal to the radius R.

[0033] The second resin layer 140 has a seventh region where the second region 143 of the second resin layer 140 and the substrate 110 are in contact. The seventh point P7 may include a point P7. The seventh point P7 may include a point P7. It may be the inner surface of the second resin layer 140 that is in contact with the first resin layer 130. The distance L7 between the seventh point P7 of the second region 143 and the side surface of the light emitting element 120 is The distance L4 between the electrodes 120 may be smaller than the distance L5 between the electrodes 120. The distance from the point P5 to the seventh point P7 is greater than the distance from the first light emitting element 121 to the curved line. The illumination modules may be arranged in an area smaller than or equal to the radius R. The radius of curvature R of the second region 143 of the second resin layer 140 is determined by various conditions of the mold 100. will be done.

[0034] FIG. 4 is a perspective view showing the first resin layer in the lighting module of FIG. 2, and FIG. 6 is a plan view for explaining the relationship depending on the distance between the optical element and the first resin layer, and FIG. As shown in FIG. 4, the first resin layer 130 has a flat upper surface 1 131 and a first side surface 131 formed by bending the first side surface 131 toward the substrate 110. 33, a second side surface 135 disposed adjacent to the first side surface 133, and the first side surface The first side surface 133 may include a corner region 137 disposed between the first side surface 133 and the second side surface 135. The side surface 133, the second side surface 135 and the corner region 137 may include curved surfaces.

[0035] The upper surface 131 of the first resin layer 130 may be in contact with the lower portion of the first region of the second resin layer. The side surfaces 133, 135 and corner areas 137 of the first resin layer 130 are formed by the second resin layer 130. That is, the upper surface 131, the side surfaces 133, and the The corner regions 137 may be formed in a shape corresponding to the inner surface of the second resin layer. The first resin layer 130 has a first side surface 133 of the first resin layer 130 in a region that contacts the upper surface of the substrate 110. The first resin layer 130 may include an eighth point P8 where the corner region 137 contacts the substrate 1. 10 includes a ninth point P9 where the second side surface 135 and the corner region 137 meet. The first resin layer 130 is formed on the outer side of the corner region 137 in the region in contact with the upper surface of the substrate 110. The first resin layer 130 and the substrate 110 may include a tenth point P10, which is a plane. The area where the upper surface of the contacting portion 133a is in contact with the upper surface of the contacting portion 133a may include a straight line 133a.

[0036] As shown in FIG. 5, the center of the first light emitting element 121 adjacent to the corner region 137 of the first resin layer 130 The distance L10 from C1 to the tenth point P10 of the corner region 137 is The distance L8 from the center C1 of the first resin layer 130 to the eighth point P8 of the first resin layer 130 may be the same as the distance L8. The first resin layer 130 has a corner region 137 adjacent to the center C1 of the first light emitting element 121. The distance L10 to the tenth point P10 of the corner region 137 is 1 to the ninth point P9 of the first resin layer 130. As a result, the light emitted from the corner region 137 of the first resin layer 130 passes through the first The light emitted from the first side surface 133 and the second side surface 135 has the same brightness. .

[0037] As shown in FIG. 6, the outer surface of the corner region 137 of the first resin layer 130 is It can include an eleventh point P11, which is the shortest distance from the center C1 perpendicular to the substrate 110. Therefore, the linear distance L11 from the center C1 of the first light emitting element 121 to the eleventh point P11 is The distance L10 from the center C1 of the first light emitting element 121 to the tenth point P10 is greater than the distance L10. That is, the corner regions 137 of the first resin layer 130 may be formed in the same manner as the side surfaces of the first resin layer 130. The distance from the first light emitting element 121 increases toward the upper surface of the first resin layer 130. The lighting module of the first embodiment can be realized by forming the boundary area between the surfaces into a curved surface. It can be seen that the occurrence of dark lines can be prevented. By forming the light source so as to have a uniform light intensity, it can be seen that the light intensity of the lighting module is uniform overall. do.

[0038] As shown in FIG. 7, the third region 145 of the second resin layer 140 is The third region 143 of the second resin layer 140 may be disposed vertically between the second region 143 and the substrate 110. One end of the second resin layer 140 contacts the second region 143 of the second resin layer 140, and the other end of the second resin layer 140 contacts the third region 143 of the second resin layer 140. The other end of the second resin layer 140 may contact the upper surface of the substrate 110. The height h1 of the region 145 may be smaller than the height h2 of the light emitting element 120. In this example, the thickness of the first region 141 of the second resin layer 140 and the thickness of the second region 143 of the second resin layer 143 are The thickness of the second resin layer 140 and the thickness of the third region 145 of the second resin layer 140 can be formed to correspond to each other. The second region 143 of the second resin layer 140 has a first point P1, a second point P2, and a third point P3. The first point P1, the second point P2, and the third point P3 may include a second tree. The first point P1 may be the outer surface of the second region 143 of the resin layer 140. The distance from the center C1 of the light emitting element 120 disposed so as to be closest to the side of the substrate 110 is It may also be a region that contacts the outer surface of the second region 143 of the second resin layer 140 in the horizontal direction. The first point P1 is a region where the second region 143 and the third region 145 of the second resin layer 140 contact each other. The second point P2 may be at a point on the outer surface of the second region 143 of the second resin layer 140. The third point P3 may be any one of the areas. A line perpendicular to the substrate 110 and a region in contact with the outer surface of the second region 143 of the second resin layer 140 may be.

[0039] A first distance L1 between the center C1 of the first light emitting element 121 and a first point P1, and a first light emitting A second distance L2 from the center C1 of the element 121 to the second point P2, and the first light emitting element 121 The third distance L3 from the center C1 to the third point P3 may be formed differently. The third distance L3 from the center C1 of the first light emitting element 121 to the third point P3 is A first distance L1 between the center C1 of the element 121 and the first point P1, and The distance L2 from the center C1 to the second point P2 may be greater than the second distance L2. The second distance L2 between the center C1 of the element 121 and the second point P2 is The second resin may be formed to be greater than the first distance L1 from the center C1 to the first point P1. The layer 140 can include a fourth point P4 between the first region 141 and the second region 143. The fourth point P4 may be disposed on the outer surface of the second resin layer 140. The fifth point P5 can be included on the substrate 110 at the shortest distance. The distance L5 between the fourth point P4 and the fifth point P5 of the substrate 110 is 143 from the first point P1 to the first light emitting element 121. The distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is The radius of curvature R of the second region 143 of the layer 140 may be smaller than or equal to the radius of curvature R of the second region 143 of the layer 140. The third region 145 of the resin layer 140 may include a sixth point P6. The sixth point P6 is The outer surface of the third region 145 of the second resin layer 140 and the upper surface of the substrate 110 are in contact with each other. The distance L6 from the center C1 of the first light emitting element 121 to the sixth point P6 is It may be greater than the distance L1 from the center C1 of the element 121 to the first point P1.

[0040] In the lighting module according to the embodiment, the side surface of the first resin layer 130 is perpendicular to the upper surface of the substrate 110. By providing the second resin layer 140 having a certain straight line, the brightness of the light emitted from the side surface can be increased. This has the effect of enabling uniform formation.

[0041] FIG. 8 is a perspective view of a lighting assembly having a lighting module according to a second embodiment; 9 is a cross-sectional view of the lighting assembly of FIG. 8 taken along the line CC. The assembly includes the lighting module 100 disclosed above, the first A first cover 210 having an opening 215 through which the resin layer and the second resin layers 130 and 140 protrude. 2, the first cover 210 and the second cover 220 supporting the lighting module 100. The first cover 210 may be a sub-bezel or an upper or top cover. The second cover 220 may be a lower bezel, a lower or bottom cover. It could also be a bar.

[0042] The lighting module 100 includes a substrate 110, a first resin layer 130, and a second resin layer 140. The first cover 210 and the second cover 220 are connected to each other with a predetermined curvature. The cover and the second cover 210, 220 are provided to cover the area other than the light-emitting area of ​​the lighting module 100. The light emitting region can be supported and fixed by a first resin layer on the light emitting element 120. The light source 100 may be formed in the region of the resin layer and the second resin layer 130, 140. The area of ​​the upper surface of the substrate 110 may be larger than the area of ​​the lower surface of the first resin layer 130. The outer edge of the plate 110 may extend further outward from each edge of the first resin layer 130. The length D2 of the outer edge of the upper surface of the substrate 110 is the distance from the side surface of the second resin layer 130 to the substrate edge. The distance to the front may be 0.1 times or more the thickness of the lighting module. The length D2 of the outer edge portion may be 1 mm or less, for example, in the range of 0.3 mm to 1 mm. If the thickness is smaller than the range, there is no supporting effect, and if the thickness is larger than the range, material loss and molybdenum may occur. The outer edge of the substrate 110 is a non-light-emitting area without a resin layer. Then, a first cover 210 and a second cover 220 are attached to the outer edge of the lighting module. This can provide ease of assembly and convenience for the module 100.

[0043] The first cover 210 includes a board cover portion 211 having an opening 215 and a board cover The opening 215 may include a side cover 213 on the outside of the opening 211. The dimensions are set larger than the dimensions of the lower surface of the first resin layer 130, and the opening 215 The upper surface S1 of the second resin layer 140 and the upper surface S2 of the second resin layer 140 may be protruded. The side surface S2 may be a curved surface or a flat surface, and a corner portion S3 between the top surface S1 and the side surface S2 The second resin layer 140 may be formed on the upper and side surfaces of the first resin layer 130. The substrate cover part 211 may be spaced apart from the second resin layer 140. This prevents the first resin layer 130 from being exposed. The second resin layer 140 disposed on the side surface S2 of the resin layer 140 is Therefore, the first resin layer 130 can be prevented from being exposed.

[0044] The substrate cover 211 can protect the upper surface of the substrate 110. The cover portion 211 covers the outer edge upper surface of the substrate 110 and the side surface S2 of the second resin layer 140. The upper surface of the substrate cover portion 211 faces the upper surface of the second resin layer 140. For example, the second resin layer 140 may be located at a position lower than S1. The upper surface of the substrate cover part 211 may be disposed below the upper surface of the first resin layer 130. This allows the side light emitted from the lighting module 100 to be With respect to surface light, the light blocking by the substrate cover part 211 can be minimized.

[0045] The side cover part 213 is extended toward the second cover 220 through the board cover part 211. The side cover part 213 may be bent or extended. The side cover portion 213 can cover the side of the substrate 110 to protect the side of the substrate 110. may protrude lower than the bottom surface of the substrate 110. At least one or both of the side cover portions 213 are provided with the substrate 110 and the The second cover 220 may include a connecting member (not shown) that is connected to the second cover 220. The material may include a hook or a locking rib structure. The thickness of the second cover 220 is The thickness of the first cover 210 is greater than the thickness of the first cover 210, and the thickness of the second cover 210 is greater than the thickness of the first cover 210. This will happen.

[0046] The second cover 220 has a substrate support portion 221 and a substrate support portion 222 below the substrate 110. The substrate support 221 may include a coupling portion 223 below the substrate 11. The substrate support portion 221 may be disposed under the substrate 110 and bonded to the substrate 110. The substrate 110 has a top width or top area that is larger than the bottom width D1 or bottom area of ​​the substrate 110, The connecting portion 223 is formed from the substrate support portion 221 with a stepped structure. The connecting portion 223 is provided with a hook or a The first cover 210 has a locking groove structure and is connected to the side cover part 213. The support portion may have a support protrusion 235 disposed thereon, but is not limited to this. The first cover 210 and the second cover 211 may have one or more support protrusions. The material of 20 can include plastic material or resin material with good moisture resistance. For example, at least one of the first cover and the second cover 210, 220 is made of a metal material. The first cover and the second cover 210, 220 may have a thickness of 5.5 mm or more. Covers 210, 220 supporting the outer edge and bottom of the lighting module 100 having a thickness below Therefore, the lighting module 100 can be used as a lighting assembly. It is easy to set up and install, and when using a lighting assembly, it is durable even when used for a long time. This can improve the performance and reliability.

[0047] The first cover 210 and the second cover 220 are formed to have an outer edge shape of the lighting module 100. The first cover and the second cover 21 may have a curved or straight shape depending on the shape. 0, 220 is a case in which a power cable drawn from the lighting module 100 is placed. The cable lead-out portion 226 may include a cable lead-out portion 226. The cable lead-out portion 226 may be connected to the first cover and The power cable can protrude from the area between the first cover 210 and the second cover 220. , and is connected to the substrate 110 of the lighting module 100 .

[0048] FIG. 10 is a perspective view showing a lighting assembly having a lighting module according to a third embodiment. 11 is a rear view of the lighting assembly of FIG. 11, and FIG. 12 is a rear view of the lighting assembly of FIG. 13 is an example of the lighting assembly of FIG. 12 before being coupled to the main frame. 14 is a perspective view showing an example of a main frame connection, and FIG. 14 is a perspective view showing an example of a connection structure of FIG. 15 is a cross-sectional side view of the electrical contact structure of the light assembly; FIG. 16 is a cross-sectional side view of the electrical contact structure of FIG. FIG.

[0049] Referring to Figures 10-12, the lighting assembly 200 includes the lighting modules disclosed above. The lighting module 100 has an opening 215 through which the second resin layer 140 of the lighting module 100 protrudes. a first cover 210 for supporting the first cover 210 and the lighting module 100; The first cover 210 may include a second cover 220. The first cover 210 may be a sub-bezel or The second cover 220 may be a lower bezel, The first cover and the second cover 210, 220 may be a lower or bottom cover. may be connected via, but is not limited to, a bonding member or an adhesive member. The first cover and the second cover 210, 220 can be defined as a cover 201. .

[0050] The cover 201 (210, 220) has a first coupling member and a second coupling member spaced apart from a coupling front end 245. and second connecting members 241, 243, 41 and 243 are respectively disposed at positions corresponding to both side surfaces of the lighting module 100. The first and second connecting members 241 and 243 are connected to the front connecting end 245 at the same time. The first and second connecting members 241 and 243 may be spaced apart by the same distance D3. 2A and 2B are cut from the side of the first cover 210 and the second cover 220 toward the lighting module 100. In another example, the first and second coupling members may include a locking groove recessed therein. The front coupling end 245 may be provided as a locking protrusion. The first and second connecting members 241 may be arranged on one side surface of the connecting member 241. The locking groove 243 is disposed at a depth D4 where the substrate 110 of the lighting module 100 is not exposed. The depth D4 of the locking groove is set to be equal to or less than half the width of the first cover 210, If the depth is outside the range, the substrate 110 may be exposed, and the rigidity of the first cover 210 may be reduced. The locking groove has a narrow entrance and a wide interior, or is inclined toward the front end 245 of the locking groove. The rear surface of the second cover 220 or the substrate support portion 221 may have a plurality of A number of terminal grooves 225 are arranged on the substrate 110, and the terminal grooves 225 expose the rear surface of the substrate 110. The terminals 251 of the substrate 110 are exposed in the terminal grooves 225. The groove 225 may be disposed adjacent to the coupling front end 245. The side of the 5 can be inclined in one direction, for example, before the contact terminal is inserted. The terminal groove 225 may include a surface inclined toward the front coupling end. 245 is arranged closer to the first and second connecting members 241 and 243. may be positioned adjacent one end of the lighting module.

[0051] As shown in FIG. 12, the lighting assembly 200 is coupled to a main case 300. The main case 300 has an insertion opening 310 and a coupling protrusion 341 on the outside of the insertion opening 310. The insertion opening 310 has a contact terminal 301 disposed on the bottom surface thereof. The illumination module may be provided with guide portions 342 and 343 for guiding the illumination module around the entrance. The coupling portion 223 disposed at the front end of the module 100 is inserted into the insertion opening 301 and coupled. The insertion slot 301 provides an open area at the top to allow the lighting module 100 to be inserted. The upper part of the second resin layer 140 may protrude. The coupling front end 245 corresponds to the insertion opening 310 of the main case 300, and they are coupled as shown in FIG. At this time, the outer edge of the lighting assembly 200 is inserted into the insertion opening 210 and guided. The lighting module 100 is inserted along the guide portions 342 and 343 and engaged with the locking protrusion 341. The terminal grooves 225 of the first and second connecting members 241 and 243 are engaged and connected. The protrusions 341 may protrude in opposite directions from both side walls of the insertion opening 210. For example, a locking protrusion may be formed on the lighting module, and a locking groove may be arranged on the assembly. stomach.

[0052] As shown in FIGS. 14 and 15, the terminal groove 225 of the second cover 220 is The contact terminal 301 arranged on the bottom surface of the insertion port 310 of the case 300 is inserted. 301 can contact the terminal 251 of the substrate 110 of the lighting module 100. At this time, the contact terminal 301 has a plate spring shape and can provide a predetermined elasticity. Therefore, it can be in close contact with the terminal 251 of the substrate 110. The assembly 200 is supported by the main case 300 through the front end 245 of the assembly 200. 225, the main case 300 and the lighting are electrically connected to the contact terminal 301. The assembly 200 is now completed. The lighting assembly may have a spring shape that protrudes in the direction of the arrow and has an elastic reaction force. The lighting assembly 200 can be connected to or separated from the main case 300. In the bridge 200, the terminals 251 of the substrate 110 are exposed to the lower part of the second cover 220. As described above, the terminals are located on the upper or lower surface of the substrate 110 at the front coupling end 245. The lighting assembly 200 described above may be mechanically mounted on a surface. By providing a convenient mounting structure, the lighting module 10 can be mounted without using a separate mechanism. The assembly 200 having the casing 300 can be coupled to the main case 300. The lighting assembly can be easily attached to or detached from the main case.

[0053] FIG. 16 is a plan view of a lighting assembly according to a fourth embodiment, and FIG. 17 is a plan view of the lighting assembly of FIG. 19 is an example of a cross-sectional side view of the lighting assembly and main frame of FIG. 20 is a cross-sectional side view taken along line D-D of FIG. 19. FIG.

[0054] 16 and 17, the lighting assembly 400 includes multiple lighting modules 10 100A, 100B, 100C, and the plurality of lighting modules 100A, 100B, 100C The cover 410 may include a substrate cover portion 411. are disposed on the substrate 110 of each of the lighting modules 100A, 100B, and 100C, and The cover part 413 extends from the outer side of the substrate 110 toward the bottom of the substrate 110 . The locking protrusions 430 of the cover 410 are adapted to lock the lighting modules 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H ... One or more locking ribs are formed at the bottom end of the bottom plate 110 of the C. The protrusion 430 is engaged and coupled through the side of the substrate 110 or through a hole in the substrate 110. At this time, the cover 410 can be protruded by the locking protrusion 430. The substrate 110 of the lighting modules 100A, 100B, and 100C is fixed and supported, and the lower The plurality of lighting modules are connected to another main case by projecting a locking protrusion 430. The light-emitting areas of the modules 100A, 100B, and 100C may be of the same shape or different sizes. The lighting modules 100A and 100B have different shapes and are coupled to the cover 410. The second resin layer 140 of the 100B and 100C protrudes through the opening 415 of the cover 410. At this time, the substrate 110 of the lighting module 100 is covered with the cover 410. The adhesive may be bonded to the substrate by heat sealing or fixed with an adhesive.

[0055] As shown in FIGS. 18 and 19, the lighting assemblies 400 and 400A are mounted in a main case 4. 50 and coupled to the main case 450. The light emitting regions of the lighting assemblies 400 and 400A are inserted into the projections 451. As shown in Figures 19 and 20, the main case 450 has a rear opening. The first lighting assembly 400 and the second lighting assembly 400A are inserted through the opening 470. The first and second lighting assemblies 400 and 400A are connected to each other. - 451, 452, 461, 462, 463 are supported and fixed, and the light-emitting area is exposed The first and second lighting assemblies 400 and 400A can be The second resin layers 140A and 140B are made of different resin materials. 0B. The first and second lighting assemblies 140, 140B may include second resin layers 140A, 140B having ink particles of different colors. At least one or both of the second resin layers 140A and 140B may contain a phosphor. 18 and 19, the lighting module 1 Since each of the substrates 110 of 100A, 100B, and 100C is exposed below the cover, The above-described lighting assemblies 400 and 400A can be used to easily supply power to a plurality of lighting modules. By combining modules 100A, 100B, and 100C, no separate mechanism is required. Assembly including the lighting modules 100A, 100B, 100C without Such a lighting assembly can be attached to the main case. The ease of assembly and removal is improved. Each of the lighting modules may include the lighting modules disclosed in the first embodiment. The lighting assembly according to the embodiment can be coupled to a vehicle lamp, for example, a tail light of a vehicle. It can be applied to brake lights and turn signal lamps.

[0056] The features, structures, effects, etc. described in the above embodiments may be applied to at least one embodiment of the present invention. The present invention is not limited to any one embodiment. The structure, effect, etc. of the embodiment may be easily understood by a person having ordinary skill in the art to which the embodiment belongs. Therefore, the contents relating to such combinations and modifications are should be construed as being within the scope of the present invention.

Claims

1. a substrate; a plurality of light-emitting elements disposed on the substrate; and a first insulating film covering the plurality of light-emitting elements. A lighting device comprising: a resin layer; and at least one second resin layer disposed on the first resin layer. Modules, and A second light source disposed on the outer edge of the substrate along the outer periphery of the substrate of the lighting module. 1 cover, including the second resin layer is disposed on an upper surface and a side surface of the first resin layer, the second resin layer includes at least one of a wavelength conversion means and ink particles; The first cover has an opening through which the second resin layer protrudes, and the substrate is disposed around the opening. a substrate cover portion disposed on the top surface of the substrate; and a substrate cover portion extending from the substrate cover portion to a position lower than the side surface of the substrate. and a side cover portion, an upper surface of the substrate cover portion being disposed lower than an upper surface of the first resin layer; Li.

2. The lighting module has a board support portion below the board and a step around the outer edge of the board support portion. a second cover having a coupling portion; The stepped joint portion of the second cover is joined to the side cover portion of the first cover.

10. The lighting assembly of claim 1,

3. The first cover and the second cover are provided outside the area between the first cover and the second cover. a cable outlet portion protruding from the side of the board and from which a power cable connected to the board is drawn out, 3. The lighting assembly of claim 2.

4. the second cover includes a stepped groove through which terminals on the underside of the board are exposed; 3. The method according to claim 2, wherein the stepped groove is inclined toward one side surface of the lighting module. The lighting assembly.

5. The distance between the side surface of the substrate and the side surface of the second resin layer is 0.05 mm / s of the thickness of the lighting module.

5. The lighting assembly of claim 1, wherein the luminance is greater than or equal to 1.

6. 5. The method according to claim 1, wherein the upper surface of the substrate and the upper surface of the second resin layer include protruding curved surfaces.

10. The lighting assembly according to any one of claims 1 to 9.

7. 5. The method according to claim 1, wherein the first cover includes a locking projection projecting toward the substrate.

10. The lighting assembly according to claim 9 .

8. the first cover includes a plurality of openings; 5. The lighting module according to claim 1, wherein the lighting module projects into each of the plurality of openings.

10. The lighting assembly according to any one of claims 1 to 9.

9. an upper surface area of ​​the substrate is larger than a lower surface area of ​​the first resin layer; the edge of the substrate extends further outward than the lower end periphery of the second resin layer; 5. The lighting module according to claim 1, wherein the thickness of the lighting module is 5.5 mm or less.

10. The lighting assembly according to claim 1 .

10. each of the plurality of light-emitting elements is disposed on the substrate in a flip-chip type; the second resin layer contains phosphor and ink particles in a resin material; The content of the fluorescent material in the second resin layer is 23 wt % or less, and the ink particles The light emitting device according to any one of claims 1 to 4, wherein the content of the element is 3 wt% to 13 wt%. Ming assembly.

11. a substrate; a plurality of light-emitting elements disposed on the substrate; and a first insulating film covering the plurality of light-emitting elements. A lighting device comprising: a resin layer; and at least one second resin layer disposed on the first resin layer. Modules, and A second light source disposed on the outer edge of the substrate along the outer periphery of the substrate of the lighting module. a cover including a first cover and a second cover supporting a lower portion of the lighting module; 、 The second resin layer is disposed on the surface of the first resin layer, and contains a wavelength conversion means and ink therein. particles, The first cover has an opening through which the first resin layer and the second resin layer protrude, and a substrate cover portion disposed on the upper surface of the substrate around the substrate; a side cover portion extending to the surface, The cover is recessed from both sides adjacent to one end of the lighting module toward the substrate. a first coupling member and a second coupling member;

12. the second cover includes a plurality of terminal grooves at a lower portion thereof; The terminals arranged on the lower surface of the substrate are exposed through the terminal grooves according to claim 10 . Lighting assembly.

13. The plurality of terminal grooves are spaced apart from an imaginary line connecting the first and second connecting members.

12. The lighting assembly of claim 11, wherein the lighting assembly is disposed adjacent one end of the lighting module. Yellowtail.

14. The lighting apparatus according to claim 12 or 13, wherein the side surface of the second resin layer includes a protruding curved surface. Gentian.

15. the edge of the substrate extends further outward than the lower end periphery of the second resin layer; The thickness of the lighting module is 5.5 mm or less; each of the plurality of light-emitting elements is disposed on the substrate in a flip-chip type; the second resin layer contains phosphor and ink particles in a resin material; The content of the fluorescent material in the second resin layer is 23 wt % or less, and the ink particles The lighting assembly according to claim 12 or 13, wherein the content of the element is 3 wt % to 13 wt %. Yellowtail.

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