Organic light-emitting device and method for manufacturing the same

Abstract

To provide a method for manufacturing an organic light-emitting device that is excellent in water resistance and that can have a narrow frame.SOLUTION: A method for manufacturing an organic light-emitting device includes: an organic light-emitting element forming step of forming a plurality of organic light-emitting elements 6 on a substrate 1; a first sealing layer forming step of forming a first sealing layer 7 covering the organic light-emitting elements 6 and having a groove 10a in a non-display region; and a second sealing layer forming step of forming a second sealing layer 8 on the first sealing layer 7 using a shadow mask 20. The second sealing layer forming step is a step of forming the second sealing layer 8 in a state where an edge portion constituting a periphery of an opening of the shadow mask 20 is disposed so as to be located on the groove 10a.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an organic light-emitting device and a method for manufacturing the same. [Background technology]

[0002] Organic light-emitting devices such as organic EL displays are required to have a larger display area within the same outer box (bezel, cabinet) size, or to be able to downsize the device body while maintaining the display size, and this requires a narrower frame around the sealing area around the display area. As a technique for narrowing the frame of the sealing region around the display region, Patent Document 1 discloses a method of patterning a sealing layer with a shadow mask. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6642936 Summary of the Invention [Problem to be solved by the invention]

[0004] The sealing layer preferably includes a highly water-resistant layer that prevents moisture from penetrating from the outside. However, the highly water-resistant layer may crack due to foreign matter or unevenness, as shown in FIG. 6. The organic light-emitting device of FIG. 6 includes a substrate 1, a pixel separation film 2, an organic light-emitting element 6, and a sealing layer 7 that covers and protects the organic light-emitting element 6. Here, the organic light-emitting element 6 is an element having a lower electrode 3, an organic compound layer 4, and an upper electrode 5, in this order. The highly water-resistant sealing layer 7 is formed to cover the organic light-emitting element 6. Cracks 32 may occur in the sealing layer 7 due to unevenness in the pixel separation film 2 or foreign matter 31. Therefore, it is preferable for the sealing layer to include a highly coverage layer that smooths the cracks 32. Furthermore, because the highly coverage layer may have high moisture permeability, it is preferable to stack a highly water-resistant sealing layer on the high coverage layer to cover the top and edges of the high coverage layer. When an encapsulation layer is patterned using a shadow mask as in Patent Document 1 to form a layer with high coverage, foreign particles and scratches occur where the underlying layer and the shadow mask come into contact, as shown in Fig. 7. As shown in Fig. 7(a), when a high-coverage encapsulation layer 8 is patterned using a shadow mask 20 on a water-resistant encapsulation layer 7, foreign particles 31 are generated in the encapsulation layers 7 and 8 due to scratches at the edges of the shadow mask 20. Then, as shown in Fig. 7(b), when a water-resistant encapsulation layer 9 is laminated on the encapsulation layers 7 and 8, moisture can penetrate through cracks 32 around the foreign particles 31 caused by the scratches, and the invading water can reach the device by lateral penetration 33, causing corrosion. Furthermore, if the shadow mask is raised by ribs or the like to avoid contact between the shadow mask and the underlying layer, the sealing layer becomes blurred and spreads, making it impossible to achieve a narrow frame around the display area. In view of the above problems, an object of the present invention is to provide an organic light-emitting device that is excellent in water resistance and allows for a narrow frame, and a method for manufacturing the same. [Means for solving the problem]

[0005] The method for manufacturing an organic light-emitting device of the present invention includes the steps of: an organic light-emitting element forming step of forming a plurality of organic light-emitting elements on a substrate; a first sealing layer forming step of forming a first sealing layer that covers the organic light-emitting element and has a groove in a non-display area; a second sealing layer forming step of forming a second sealing layer on the first sealing layer using a shadow mask; A method for manufacturing an organic light-emitting device comprising: The second sealing layer forming process is characterized in that it is a process of forming the second sealing layer in a state in which the edge that forms the periphery of the opening of the shadow mask is positioned above the groove. The organic light-emitting device of the present invention comprises: An organic light-emitting device having a plurality of organic light-emitting elements on a substrate and a sealing layer covering the organic light-emitting elements, the sealing layer includes a first sealing layer and a second sealing layer covering the first sealing layer, the first sealing layer has a groove in the non-display area, The end of the second sealing layer is formed inside the groove. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide an organic light-emitting device that is excellent in water resistance and allows for a narrow frame, and a method for manufacturing the same. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic diagram illustrating an example of an organic light-emitting device of the present invention. [Figure 2] FIG. 1(b) is a partially enlarged view of part B in FIG. [Figure 3] 1A to 1C are schematic cross-sectional views showing examples of the shapes of grooves in a substrate. [Figure 4] 1A to 1C are schematic cross-sectional views illustrating an example of a method for manufacturing an organic light-emitting device according to the present invention. [Figure 5] FIG. 2 is a plan view illustrating an example of a shadow mask. [Figure 6] 10 is a schematic cross-sectional view showing a state in which a crack occurs in a sealing layer due to a foreign object or a step. [Figure 7] 10A and 10B are schematic cross-sectional views illustrating a situation in which foreign matter or scratches occur in a portion in contact with a shadow mask. [Figure 8] 1 is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention. [Figure 9] 1A is a schematic diagram illustrating an example of an imaging device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of an electronic device according to an embodiment of the present invention. [Figure 10] 1A is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of a foldable display device. [Figure 11] 1A is a schematic diagram showing an example of an illumination device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram showing an example of a moving body having a vehicle lamp according to an embodiment of the present invention. [Figure 12]1A is a schematic diagram showing an example of a wearable device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram showing another example of a wearable device according to an embodiment of the present invention. [Figure 13] 1A is a schematic diagram illustrating an example of an image forming apparatus according to an embodiment of the present invention, and FIGS. 1B and 1C are schematic diagrams illustrating an example of an exposure light source of the image forming apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the organic light-emitting device and the method for manufacturing the same of the present invention will be described, but the present invention is not limited to these embodiments.

[0009] <Organic light-emitting device> First, an embodiment of an organic light-emitting device of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an example of an organic light-emitting device of the present invention. FIG. 1(a) is a plan view, and FIG. 1(b) is a cross-sectional view taken along the line A-A' in FIG. 1(a). In FIG. 1, 1 denotes a substrate, 2 denotes a pixel separation film, 3 denotes a lower electrode, 4 denotes an organic compound layer, 5 denotes an upper electrode, 6 denotes an organic light-emitting element, 7 denotes a first sealing layer, 8 denotes a second sealing layer, 9 denotes a third sealing layer, 10 and 10a denote grooves, 11 denotes a display region, 12 denotes a non-display region, and 13 denotes a pad electrode. For ease of illustration, FIG. 1(a) omits all elements other than the groove 10, the display region 11, the non-display region 12, and the pad electrode 13.

[0010] 1(a), the organic light-emitting device shown in Fig. 1 has a display area 11 and a non-display area 12 outside the display area 11, and has a plurality of pad electrodes 13 in the non-display area 12. The organic light-emitting device shown in Fig. 1 also has a groove 10 in the non-display area 12 of the substrate 1 along the periphery of the display area 11.

[0011] The organic light-emitting device shown in Fig. 1 has a plurality of organic light-emitting elements 6 in a display region 11 on a substrate 1, as shown in Fig. 1(b). In Fig. 1, the organic light-emitting elements 6 are elements having a lower electrode 3, an organic compound layer 4, and an upper electrode 5 in this order, and a pixel separation film 2 is provided between adjacent organic light-emitting elements 6. Either the lower electrode 3 or the upper electrode 5 may be an anode, and the other may be a cathode. The emitted light color of the organic light-emitting elements 6 may be red, green, blue, or white.

[0012] Substrate 1 may be transparent or opaque. For example, an insulating substrate made of silicon, glass, synthetic resin, or the like, or a conductive substrate or semiconductor substrate having an insulating layer of silicon oxide, silicon nitride, or the like formed on the surface thereof can be used as substrate 1.

[0013] The pixel separation film 2 is an insulating layer and is also called a bank. The pixel separation film 2 covers the edge of the lower electrode 3 and is disposed so as to surround the lower electrode 3. The portion of the lower electrode 3 where the pixel separation film 2 is not disposed contacts the organic compound layer 4 and becomes a light-emitting region.

[0014] Examples of materials that can be used to form the lower electrode 3 include a compound of aluminum and silicon, aluminum, silver, ITO (indium tin oxide), IZO (indium zinc oxide), and titanium.

[0015] A specific example of the structure of the organic compound layer 4 is a three-layer structure consisting of a hole transport layer, a light-emitting layer, and an electron transport layer. However, the organic compound layer 4 is not limited to this three-layer structure, and may have a single layer structure consisting of only a light-emitting layer, or may have a multiple layer structure other than a three-layer structure (such as a two-layer structure or a four-layer structure).

[0016] Examples of materials that can be used to form the upper electrode 5 include transparent conductive oxide films such as IZO (indium zinc oxide) and ITO (indium tin oxide), and semi-transparent metal films such as silver, aluminum, gold, and MgAg (magnesium silver).

[0017] The organic light-emitting device shown in FIG. 1 includes a sealing layer that covers and protects the organic light-emitting element 6, as shown in FIG. 1(b). In FIG. 1, the sealing layer has a three-layer structure consisting of a first sealing layer 7, a second sealing layer 8, and a third sealing layer 9, but it may also have a two-layer structure consisting of a first sealing layer 7 and a second sealing layer 8. A color filter, a microlens, etc. may be provided on the sealing layer. When a color filter is provided, a planarizing layer may be provided between the sealing layer and the color filter. The planarizing layer may be made of an acrylic resin, etc. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0018] 1, the first sealing layer 7 covers the organic light-emitting element 6 and is formed on the entire surface of the substrate 1 except for the area where the pad electrode 13 is formed. As shown in FIG. 1(b), the first sealing layer 7 has grooves 10a as recesses that imitate the grooves 10 in the areas corresponding to the grooves 10 of the substrate 1. The first sealing layer 7 is preferably a highly water-resistant layer, and the moisture permeation amount of the first sealing layer 7 is 10 -5 g / m 2 / day or less. -5 g / m 2 / day less than 10 -8 g / m 2 / day or more is more preferable, and 10 -5 g / m 2 / day less than 10 -6 g / m 2 / day or more is even more preferable. Examples of materials constituting first sealing layer 7 include silicon nitride, silicon oxide, and silicon nitride oxide. First sealing layer 7 preferably contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon nitride oxide. First sealing layer 7 can be formed using, for example, a sputtering method, a CVD method, an ALD method, or the like. The thickness of first sealing layer 7 is preferably 50 nm or more, and more preferably 100 nm to 2,000 nm. If the thickness of first sealing layer 7 is 2,000 nm or less, film peeling is less likely to occur.

[0019] In FIG. 1, second sealing layer 8 is formed on first sealing layer 7, inside groove 10a, and within groove 10a. As shown in FIG. 1(b), the end of second sealing layer 8 is formed within groove 10a of first sealing layer 7. Second sealing layer 8 is preferably a layer with high coverage and is preferably conformal (the property of forming a uniform film along the surface) to structures with high aspect ratios. Second sealing layer 8 is preferably a layer that can be conformally deposited in structures with aspect ratios higher than 1 / 10. More preferably, second sealing layer 8 is a layer that can be conformally deposited in structures with aspect ratios in the range of more than 1 / 10 and less than or equal to 1 / 4,000. Furthermore, second sealing layer 8 is even more preferably a layer that can be conformally deposited in structures with aspect ratios in the range of more than 1 / 10 and less than or equal to 1 / 1,000. Examples of materials constituting the second sealing layer 8 include hexamethyldisiloxane (HMDSO), dimethylsiloxane (DMSO), aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide, and the second sealing layer 8 may also be a laminated film of a combination of these materials. The second sealing layer 8 preferably contains at least one material selected from the group consisting of hexamethyldisiloxane, dimethylsiloxane, aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide. The second sealing layer 8 can be formed by, for example, a CVD method or an ALD method. The thickness of the second sealing layer 8 is preferably 5 nm or more, and more preferably 10 nm or more and 200 nm or less. If the thickness of the second sealing layer 8 is 200 nm or less, peeling is less likely to occur.

[0020] In FIG. 1, third sealing layer 9 covers first sealing layer 7 and second sealing layer 8, and is formed on the entire surface of substrate 1 except for the area where pad electrode 13 is formed. As shown in FIG. 1(b), third sealing layer 9 may have recesses at locations corresponding to grooves 10 of substrate 1. Third sealing layer 9 is preferably a highly water-resistant layer, and the moisture permeation amount of third sealing layer 9 is preferably 10 -5 g / m 2 The moisture permeation rate of the third sealing layer 9 is preferably 10 / day or less. -5 g / m 2 / day less than 10-8 g / m 2 / day or more is more preferable, and 10 -5 g / m 2 / day less than 10 -6 g / m 2 / day or more is even more preferable. Examples of materials constituting third sealing layer 9 include silicon nitride, silicon oxide, and silicon nitride oxide. Third sealing layer 9 preferably contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon nitride oxide. Third sealing layer 9 can be formed using, for example, a sputtering method, a CVD method, an ALD method, or the like. The thickness of third sealing layer 9 is preferably 50 nm or more, and more preferably 100 nm to 2,000 nm. When the thickness of third sealing layer 9 is 2,000 nm or less, film peeling is less likely to occur.

[0021] FIG. 2 shows a partial enlarged view of portion B in FIG. 1(a). For ease of illustration, FIG. 2 omits illustration of only the second sealing layer 8, groove 10a, display region 11, and non-display region 12. As shown in FIG. 2(a), the end of the second sealing layer 8 is preferably formed inside the groove 10a, even at the corner. Furthermore, as shown in FIG. 2(b), if the corner is rounded, the end of the second sealing layer 8 may have a shape that follows the roundness of the corner inside the groove 10a.

[0022] FIG. 3 is a schematic cross-sectional view showing an example of the shape of a groove in a substrate, illustrating a portion of the substrate corresponding to portion C in FIG. 1(a). The cross-sectional shape of groove 10 is not particularly limited and may be V-shaped as shown in FIG. 3(a), U-shaped as shown in FIG. 3(b), or trapezoidal as shown in FIG. 3(c). Furthermore, as shown in FIGS. 3(d) and 3(e), the cross-sectional shape of groove 10 may be such that the deepest point of groove 10 is shifted from the center of groove 10 in the width w direction toward the edge of substrate 1 (to the right as viewed in the drawing) or toward the display area 11 of substrate 1 (to the left as viewed in the drawing). Furthermore, as shown in FIGS. 3(f) and 3(g), the cross-sectional shape of groove 10 may be such that the height from the deepest point differs between the edge of substrate 1 and the display area 11 of substrate 1.

[0023] <Method of manufacturing an organic light-emitting device> Fig. 4 is a schematic cross-sectional view showing an example of a method for manufacturing an organic light-emitting device of the present invention, and Fig. 5 is a plan view showing an example of a shadow mask used in the present invention. The method for manufacturing an organic light-emitting device of the present invention may include a pad electrode removing step of removing the sealing layer in the area where the pad electrode 13 is formed.

[0024] [Substrate groove formation process] As shown in Figure 4(a), first, a groove 10 is formed in the non-display area 12 of the substrate 1, preferably along the periphery of the display area 11. The method for forming the groove 10 is not particularly limited, but it can be formed, for example, by photolithography using a grayscale mask. Note that the substrate groove formation step is not essential.

[0025] [Organic light-emitting element formation process] Next, as shown in FIG. 4( a ), a lower electrode 3 , a pixel separation film 2 , an organic compound layer 4 , and an upper electrode 5 are formed in this order on the substrate 1 , and a plurality of organic light-emitting elements 6 are formed in the display region 11 .

[0026] [First sealing layer formation process] Next, as shown in FIG. 4(b), a first sealing layer 7 covering the organic light-emitting element 6 is formed on the entire surface of the substrate 1. As shown in FIG. 4(b), grooves 10a are formed in the first sealing layer 7 as recesses that resemble the grooves 10 in the substrate 1 at locations that correspond to the grooves 10. The first sealing layer 7 can be formed using, for example, a sputtering method, a CVD method, an ALD method, or the like. Note that if the substrate groove formation step is not included, the grooves 10a may be formed in the non-display region of the first sealing layer 7, preferably along the periphery of the display region 11, by a known method such as etching.

[0027] [Second sealing layer formation process] Next, as shown in FIG. 4( c), a shadow mask 20 is used to pattern and form a second sealing layer 8 on the first sealing layer 7. For example, the shadow mask shown in FIG. 5 can be used as the shadow mask 20. The shadow mask 20 shown in FIG. 5 has a rectangular opening 21. In FIG. 5, 22 denotes an edge that forms the periphery of the opening 21. As shown in FIG. 4( c), the shadow mask 20 is positioned so that the edge 22 that forms the periphery of the opening 21 is positioned above the groove 10 a in the first sealing layer 7. Thereafter, the second sealing layer 8 is formed in the opening 21 of the shadow mask 20. As a result, the edge of the second sealing layer 8 is formed inside the groove 10 a in the first sealing layer 7. The second sealing layer 8 can be formed by, for example, a CVD method, an ALD method, or the like.

[0028] [Third sealing layer formation process] Next, as shown in FIG. 4(d), after removing the shadow mask 20, a third sealing layer 9 is formed on the entire surface of the substrate 1 so as to cover the first sealing layer 7 and the second sealing layer 8. As shown in FIG. 4(d), the third sealing layer 9 may have recesses formed in locations corresponding to the grooves 10 of the substrate 1. The third sealing layer 9 can be formed using, for example, a sputtering method, a CVD method, an ALD method, or the like. Note that the formation of the third sealing layer 9 is not essential.

[0029] As described above, by providing grooves 10 in substrate 1, even when shadow mask 20 is attached, edges 22 surrounding opening 21 of shadow mask 20 do not come into contact with the substrate. This prevents scratches and foreign matter from forming at the edges of first sealing layer 7 and second sealing layer 8. This allows for the formation of a crack-free third sealing layer 9. Furthermore, unlike when contact between the shadow mask and the substrate is avoided by, for example, floating the shadow mask with ribs, second sealing layer 8 does not blur and spread. Therefore, the edges of second sealing layer 8 are sealed within third sealing layer 9 with a minimal area, forming a highly water-resistant laminated sealing layer that prevents moisture from penetrating from the outside. Furthermore, by attaching shadow mask 20 to the substrate, the frame of the sealing area around the display area can be narrowed compared to when contact between the shadow mask and the substrate is avoided by, for example, floating the shadow mask with ribs. This allows for the provision of high-value-added organic light-emitting devices, such as organic electroluminescent (EL) displays.

[0030] <Applications of organic light-emitting devices> The organic light-emitting device according to this embodiment can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, or a light-emitting device having a white light source and a color filter.

[0031] The display device may be an image information processing device having an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., an information processing unit that processes the input information, and displays the input image on a display unit. The display device may have the organic light-emitting device of this embodiment, which has a plurality of pixels, at least one of which may have an organic light-emitting element and an active element such as a transistor connected to the organic light-emitting element. In this case, the substrate may be a semiconductor substrate such as silicon, and the transistor may be a MOSFET formed on the substrate. The image display device has an input unit for inputting image information and a display unit for outputting an image, and the display unit includes the display device of this embodiment.

[0032] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0033] 8 is a schematic diagram illustrating an example of a display device according to this embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected by flexible printed circuits FPCs 1002 and 1004. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0034] The display device according to this embodiment may have color filters having red, green, and blue colors, which may be arranged in a delta arrangement.

[0035] The display device according to the present embodiment may be used as a display unit of a mobile terminal. In this case, the display device may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0036] The display device according to this embodiment may be used as a display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit disposed within a viewfinder. The imaging device may be a digital camera or a digital video camera.

[0037] 9A is a schematic diagram showing an example of an imaging device according to this embodiment. The imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may include a display device according to this embodiment. In this case, the display device may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the speed at which the subject is moving, the possibility that the subject will be blocked by an obstruction, and the like.

[0038] Since the optimum timing for capturing an image is very short, it is better to display information as quickly as possible. Therefore, it is preferable to use a display device using the organic light-emitting device of this embodiment. This is because the organic light-emitting device has a fast response speed. A display device using an organic light-emitting device can be used more preferably than a liquid crystal display device, which requires a high display speed.

[0039] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be called a photoelectric conversion device. Instead of sequentially capturing images, the photoelectric conversion device can include an imaging method that detects the difference from the previous image, or a method of cutting out an image from a constantly recorded image, etc.

[0040] FIG. 9(b) is a schematic diagram illustrating an example of an electronic device according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may include a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The display unit 1201 may include an organic light-emitting device according to this embodiment. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit may also be called a communication device. The electronic device 1200 may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit 1201. Examples of the electronic device 1200 include a smartphone, a laptop computer, etc.

[0041] FIG. 10 is a schematic diagram illustrating an example of a display device according to this embodiment. FIG. 10(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The display unit 1302 may use a light-emitting device according to this embodiment. The display device 1300 has the frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 10(a). The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0042] FIG. 10(b) is a schematic diagram illustrating another example of a display device according to this embodiment. The display device 1310 in FIG. 10(b) is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may include a light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single, seamless display unit. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may display a single image.

[0043] FIG. 11(a) is a schematic diagram illustrating an example of a lighting device according to this embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical filter 1404 that transmits light emitted by the light source 1402, and a light diffusion unit 1405. The light source 1402 may include an organic light-emitting device according to this embodiment. The optical filter 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source, such as for illumination, and deliver the light over a wide area. The optical filter 1404 and the light diffusion unit 1405 may be provided on the light emission side of the lighting device. If necessary, a cover may be provided on the outermost surface.

[0044] The lighting device is, for example, a device that illuminates a room. The lighting device may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit for dimming these colors or a color tuning circuit for tuning the emitted color. The lighting device may have the organic light-emitting device of this embodiment and a power supply circuit connected to it. The power supply circuit is a circuit that converts AC voltage to DC voltage. The lighting device may have an inverter circuit. Furthermore, white has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device may have a color filter.

[0045] The lighting device according to this embodiment may also include a heat dissipation unit, which dissipates heat from within the device to the outside, and may be made of a material such as a metal with a high specific heat capacity or liquid silicon.

[0046] 11(b) is a schematic diagram of an automobile, which is an example of a moving body according to this embodiment. The automobile has tail lamps, which are an example of lighting fixtures. The automobile 1500 has tail lamps 1501, and may be configured to turn on the tail lamps when braking or the like is performed.

[0047] A tail lamp 1501 may include an organic light-emitting device according to this embodiment. The tail lamp 1501 may include a protective member for protecting the organic light-emitting device. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but is preferably made of polycarbonate or the like. Polycarbonate may be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0048] An automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window 1502 may be a transparent display, provided that it is not a window for checking the front and rear of the automobile. The transparent display may have an organic light-emitting device according to this embodiment. In this case, constituent materials of the electrodes and the like of the organic light-emitting device are made of transparent materials.

[0049] The moving body according to the present embodiment may be a ship, an aircraft, a drone, or the like. The moving body may have a body and a lighting device provided on the body. The lighting device may emit light to indicate the position of the body. The lighting device has the organic light-emitting device according to the present embodiment.

[0050] An application example of the display device of each of the above-described embodiments will be described with reference to Fig. 12. The display device can be applied to a system that can be attached as a wearable device, such as smart glasses, an HMD, or a smart contact lens. The image capturing and display device used in such an application example includes an image capturing device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0051] Fig. 12(a) is a schematic diagram showing an example of a wearable device according to an embodiment of the present invention. Using Fig. 12(a), glasses 1600 (smart glasses) according to one application example will be described. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a display device according to each of the above-mentioned embodiments is provided on the back side of the lens 1601.

[0052] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0053] FIG. 12(b) is a schematic diagram showing another example of a wearable device according to an embodiment of the present invention. Using FIG. 12(b), glasses 1610 (smart glasses) according to one application example will be described. The glasses 1610 have a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 in FIG. 12(a) and a display device. A lens 1611 is formed with an optical system for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source that supplies power to the imaging device and the display device, and also controls the operation of the imaging device and the display device.

[0054] The control device 1612 may include a gaze detection unit that detects the wearer's gaze. The gaze detection may use infrared light. The infrared light emitter emits infrared light toward the eyeball of the user gazing at the display image. An imaging unit with a light-receiving element detects the reflected infrared light from the eyeball, thereby obtaining a captured image of the eyeball. A reduction unit that reduces light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality. The user's gaze toward the displayed image is detected from the captured image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using the captured image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used. More specifically, gaze detection processing based on the pupil-corneal reflex method is performed. Using the pupil-corneal reflex method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0055] A display device according to one embodiment of the present invention may include an imaging device having a light receiving element, and may control the display image of the display device based on user line-of-sight information from the imaging device. Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0056] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0057] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI ​​program may be included in the display device, the imaging device, or an external device. If included in an external device, it is transmitted to the display device via communication.

[0058] When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0059] FIG. 13(a) is a schematic diagram showing an example of an image forming apparatus according to an embodiment of the present invention. The image forming apparatus 140 is an electrophotographic image forming apparatus and includes a photoconductor 127, an exposure light source 128, a charging unit 130, a developing unit 131, a transfer unit 132, a transport roller 133, and a fixing unit 135. Light 129 is irradiated from the exposure light source 128, and an electrostatic latent image is formed on the surface of the photoconductor 127. The exposure light source 128 includes an organic light-emitting device according to this embodiment. The developing unit 131 includes toner and the like. The charging unit 130 charges the photoconductor 127. The transfer unit 132 transfers the developed image to a recording medium 134. The transport roller 133 transports the recording medium 134. The recording medium 134 is, for example, paper. The fixing unit 135 fixes the image formed on the recording medium 134.

[0060] 13(b) and 13(c) are diagrams showing an exposure light source 128 and are schematic diagrams illustrating a state in which multiple light-emitting units 136 are arranged on a long substrate. Arrow 137 indicates the direction parallel to the axis of the photoconductor, the column direction in which the organic light-emitting elements are arranged. This column direction is the same as the axis direction about which the photoconductor 127 rotates. This direction can also be referred to as the long axis direction of the photoconductor 127. FIG. 13(b) shows a configuration in which the light-emitting units 136 are arranged along the long axis direction of the photoconductor 127. FIG. 13(c) shows a configuration different from FIG. 13(b), in which the light-emitting units 136 are arranged alternately in the column direction in the first and second columns. The first and second columns are arranged at different positions in the row direction. The first column has multiple light-emitting units 136 arranged at intervals. The second column has light-emitting units 136 at positions corresponding to the intervals between the light-emitting units 136 in the first column. That is, the light-emitting units 136 are also spaced apart in the row direction. The arrangement in Fig. 13(c) can also be described as a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0061] As described above, the organic light-emitting device according to this embodiment can provide a stable display with good image quality even over a long period of time. Furthermore, the organic light-emitting device according to this embodiment can provide both good visibility outdoors and power-saving display due to its highly efficient and bright light output. [Example]

[0062] Example 1 The organic light-emitting device shown in Fig. 1 was manufactured by the method shown in Fig. 4. First, a groove 10 (opening width w 10 µm, depth d 5 µm) having the cross-sectional shape shown in Fig. 3(a) was formed in the substrate 1 along the periphery of the display area 11 by photolithography using a grayscale mask. A lower electrode 3, a pixel separation film 2, an organic compound layer 4, and an upper electrode 5 were formed in this order on the substrate 1, and a plurality of organic light-emitting elements 6 were formed in the display area 11.

[0063] Next, as shown in FIG. 4(b), a first sealing layer 7 covering the organic light-emitting element 6 was formed on the entire surface of the substrate 1 by a CVD method. The first sealing layer 7 had a moisture permeability of 10 -5 g / m 2 First sealing layer 7 was formed with a thickness of 100 nm using silicon nitride having a thermal conductivity of 100 s / day or less. Grooves 10a were formed in first sealing layer 7 at locations corresponding to grooves 10 in substrate 1.

[0064] Next, as shown in FIG. 4(c), a second sealing layer 8 was patterned and formed on the first sealing layer 7 using a shadow mask 20 shown in FIG. 5. The second sealing layer 8 was formed by patterning aluminum oxide to a thickness of 10 nm using the ALD method, which enables conformal deposition in structures with an aspect ratio of 1 / 10 or higher. Specifically, as shown in FIG. 4(c), the shadow mask 20 was positioned so that the edge 22 forming the periphery of the opening 21 was positioned above the groove 10a in the first sealing layer 7. Then, the second sealing layer 8 was formed within the opening 21 of the shadow mask 20. The edge of the second sealing layer 8 was formed inside the groove 10a in the first sealing layer 7.

[0065] Next, as shown in FIG. 4(d), after removing the shadow mask 20, a third sealing layer 9 was formed on the entire surface of the substrate 1 by a CVD method so as to cover the first sealing layer 7 and the second sealing layer 8. The third sealing layer 9 had a moisture permeability of 10 -5 g / m 2 4(d), third sealing layer 9 had recesses formed in the locations corresponding to grooves 10 in substrate 1.

[0066] The organic light-emitting devices were stored in a high-temperature, high-humidity (60°C / 90%) testing device, and evaluated for non-light-emitting defects after 100, 200, 1,000, and 2,000 hours of storage according to the following criteria. Evaluation was discontinued when a non-light-emitting defect occurred. The results are shown in Table 1. A: No non-luminescent defects occurred in the luminescent region. B: Non-light-emitting defects occurred in the light-emitting region, but the specifications of the organic light-emitting device were met. C: Non-light-emitting defects occur in the light-emitting region, and the organic light-emitting device does not meet the specifications.

[0067] <Examples 2 to 7> An organic light-emitting device was produced and evaluated in the same manner as in Example 1, except that the cross-sectional shape of the groove 10 was changed as shown in Table 1. The results are shown in Table 1.

[0068] In the groove of Example 4 (FIG. 3(d)), the position of the deepest part is shifted 2 μm outward from the center in the width direction of the groove 10, and in the groove of Example 5 (FIG. 3(e)), the position of the deepest part is shifted 2 μm inward from the center in the width direction of the groove 10. In addition, in the groove of Example 6 (FIG. 3(f)), the outer side is 3 μm lower than the inner side, and in the groove of Example 7 (FIG. 3(g)), the outer side is 2 μm higher than the inner side.

[0069] <Comparative Example 1> An organic light-emitting device was produced and evaluated in the same manner as in Example 1, except that no groove 10 was provided on the substrate 1. The results are shown in Table 1.

[0070] <Examples 8 and 9> An organic light-emitting device was produced and evaluated in the same manner as in Example 1, except that the moisture permeation amount of first sealing layer 7 or third sealing layer 9 was changed as shown in Table 1. The results are shown in Table 1.

[0071] Example 10 An organic light-emitting device was manufactured and evaluated in the same manner as in Example 1, except that second sealing layer 8 was formed using a material that can be conformally deposited in a structure with an aspect ratio of 1 / 10. The results are shown in Table 1.

[0072] [Table 1]

[0073] ≪Included components≫ The disclosure of this embodiment includes the following configuration. (Configuration 1) an organic light-emitting element forming step of forming a plurality of organic light-emitting elements on a substrate; a first sealing layer forming step of forming a first sealing layer that covers the organic light-emitting element and has a groove in a non-display area; a second sealing layer forming step of forming a second sealing layer on the first sealing layer using a shadow mask; A method for manufacturing an organic light-emitting device comprising: The method for manufacturing an organic light-emitting device, characterized in that the second sealing layer formation process is a process of forming the second sealing layer in a state where the edge that constitutes the periphery of the opening of the shadow mask is positioned above the groove. (Configuration 2) The method for manufacturing an organic light-emitting device according to configuration 1, further comprising the step of forming a third sealing layer that covers the second sealing layer after removing the shadow mask. (Configuration 3) The moisture permeation amount of the first sealing layer is 10 -5 g / m 2 3. The method for producing an organic light-emitting device according to configuration 1 or 2, wherein the time required for producing the organic light-emitting device is 1 / day or less. (Configuration 4) 4. The method for manufacturing an organic light-emitting device according to any one of configurations 1 to 3, wherein the second sealing layer is a layer that can be conformally deposited in a structure having an aspect ratio of more than 1 / 10. (Configuration 5) a substrate groove forming step of forming a groove in a non-display area of ​​the substrate; 5. The method for manufacturing an organic light-emitting device according to any one of configurations 1 to 4, wherein the grooves in the first sealing layer are formed along the grooves in the substrate. (Configuration 6) 6. The method for manufacturing an organic light-emitting device according to claim 5, wherein the substrate groove forming step is a step of forming a groove along the periphery of a display area of ​​the substrate. (Configuration 7) 7. The method for manufacturing an organic light-emitting device according to any one of configurations 1 to 6, wherein the first sealing layer forming step is a step of forming the first sealing layer over the entire surface of the substrate. (Configuration 8) 8. The method for manufacturing an organic light-emitting device according to any one of configurations 1 to 7, wherein the first sealing layer contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride. (Configuration 9) 9. The method for manufacturing an organic light-emitting device according to any one of structures 1 to 8, wherein the second sealing layer contains at least one selected from the group consisting of hexamethyldisiloxane, dimethylsiloxane, aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide. (Configuration 10) The moisture permeation amount of the third sealing layer is 10 -5 g / m 2 3. The method for producing an organic light-emitting device according to claim 2, wherein the time required for producing the organic light-emitting device is 1 / day or less. (Configuration 11) 11. The method for manufacturing an organic light-emitting device according to configuration 2 or 10, wherein the third sealing layer forming step is a step of forming the third sealing layer over the entire surface of the substrate. (Configuration 12) 12. The method for manufacturing an organic light-emitting device according to claim 2, 10, or 11, wherein the third sealing layer contains at least one selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride. (Configuration 13) An organic light-emitting device having a plurality of organic light-emitting elements on a substrate and a sealing layer covering the organic light-emitting elements, the sealing layer includes a first sealing layer and a second sealing layer covering the first sealing layer, the first sealing layer has a groove in the non-display area, An organic light-emitting device, wherein an end portion of the second sealing layer is formed inside the groove. (Configuration 14) 14. The organic light-emitting device of claim 13, wherein the encapsulation layer further comprises a third encapsulation layer covering the second encapsulation layer. (Configuration 15) The moisture permeation amount of the first sealing layer is 10 -5 g / m 2 15. The organic light-emitting device according to claim 13, wherein the light-emitting efficiency is 1 / day or less. (Configuration 16) 16. The organic light emitting device of any one of configurations 13 to 15, wherein the second encapsulation layer is a layer capable of conformal deposition in structures with aspect ratios greater than 1 / 10. (Configuration 17) 17. The organic light-emitting device according to any one of structures 13 to 16, wherein the non-display region of the substrate has a groove, and the groove of the first sealing layer is formed along the groove in the substrate. (Configuration 18) 18. The organic light-emitting device according to claim 17, wherein the groove in the substrate is formed along the periphery of the display area of ​​the substrate. (Configuration 19) 19. The organic light-emitting device according to any one of Structures 13 to 18, wherein the first sealing layer is formed on the entire surface of the substrate. (Configuration 20) 20. The organic light-emitting device according to any one of Structures 13 to 19, wherein the first sealing layer contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride. (Configuration 21) 22. The organic light-emitting device according to any one of structures 13 to 21, wherein the second sealing layer contains at least one selected from the group consisting of hexamethyldisiloxane, dimethylsiloxane, aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide. (Configuration 22) The moisture permeation amount of the third sealing layer is 10 -5 g / m 2 15. The organic light-emitting device according to claim 14, wherein the light-emitting device has a wavelength of 100 nm or less. (Configuration 23) 23. The organic light-emitting device according to claim 14, wherein the third sealing layer is formed on the entire surface of the substrate. (Configuration 24) 24. The organic light-emitting device according to any one of the preceding aspects 14, 22, and 23, wherein the third sealing layer contains at least one selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride.

[0074] (Configuration 25) A display device comprising the organic light-emitting device according to any one of Structures 13 to 24, wherein the organic light-emitting device comprises a plurality of pixels, and at least one of the plurality of pixels comprises an organic light-emitting element and a transistor connected to the organic light-emitting element. (Configuration 26) an input unit for inputting image information and a display unit for outputting an image; 26. An image display device, wherein the display unit comprises the display device according to configuration 25. (Configuration 27) an optical unit having a plurality of lenses, an image pickup element that receives light that has passed through the optical unit, and a display unit that displays an image picked up by the image pickup element; 25. A photoelectric conversion device, wherein the display section comprises the organic light-emitting device according to any one of configurations 13 to 24. (Configuration 28) 25. An electronic device comprising: a display unit having the organic light-emitting device according to any one of configurations 13 to 24; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with the outside. (Configuration 29) 25. A lighting device comprising: a light source having the organic light-emitting device according to any one of configurations 13 to 24; and a light diffusion section or an optical filter that transmits light emitted by the light source. (Configuration 30) A moving body comprising: a lighting fixture having the organic light-emitting device according to any one of configurations 13 to 24; and a vehicle on which the lighting fixture is provided. (Configuration 31) An exposure light source for an electrophotographic image forming apparatus, comprising the organic light emitting device according to any one of Structures 13 to 24. [Explanation of symbols]

[0075] 1: substrate, 2: pixel separation film, 3: lower electrode, 4: organic compound layer, 5: upper electrode, 6: organic light-emitting element, 7: first sealing layer, 8: second sealing layer, 9: third sealing layer, 10, 10a: groove, 11: display area, 12: non-display area, 13: pad electrode, 20: shadow mask

Claims

1. an organic light-emitting element forming step of forming a plurality of organic light-emitting elements on a substrate; a first sealing layer forming step of forming a first sealing layer that covers the organic light-emitting element and has a groove in a non-display area; a second sealing layer forming step of forming a second sealing layer on the first sealing layer using a shadow mask; A method for manufacturing an organic light-emitting device comprising: The method for manufacturing an organic light-emitting device, characterized in that the second sealing layer formation process is a process of forming the second sealing layer in a state where the edge that constitutes the periphery of the opening of the shadow mask is positioned above the groove.

2. 2 . The method for manufacturing an organic light-emitting device according to claim 1 , further comprising the step of forming a third sealing layer that covers the second sealing layer after removing the shadow mask.

3. The moisture permeation amount of the first sealing layer is 10 -5 g / m 2 3. The method for manufacturing an organic light-emitting device according to claim 1, wherein the number of times of light emission is equal to or less than 1 / day.

4. 3. The method for manufacturing an organic light-emitting device according to claim 1, wherein the second encapsulation layer is a layer that can be conformally deposited in a structure having an aspect ratio of more than 1 / 10.

5. a substrate groove forming step of forming a groove in a non-display area of ​​the substrate; The method for manufacturing an organic light-emitting device according to claim 1 , wherein the grooves in the first sealing layer are formed along the grooves in the substrate.

6. 6. The method for manufacturing an organic light-emitting device according to claim 5, wherein the substrate groove forming step is a step of forming a groove along the periphery of a display area of ​​the substrate.

7. 3. The method for manufacturing an organic light-emitting device according to claim 1, wherein the first sealing layer forming step is a step of forming the first sealing layer over the entire surface of the substrate.

8. 3. The method for manufacturing an organic light-emitting device according to claim 1, wherein the first sealing layer contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride.

9. 3. The method for manufacturing an organic light-emitting device according to claim 1, wherein the second sealing layer contains at least one selected from the group consisting of hexamethyldisiloxane, dimethylsiloxane, aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide.

10. The moisture permeation amount of the third sealing layer is 10 -5 g / m 2 3. The method for manufacturing an organic light-emitting device according to claim 2, wherein the number of times of the light-emitting element is 1000 or less.

11. 3. The method for manufacturing an organic light-emitting device according to claim 2, wherein the third sealing layer forming step is a step of forming the third sealing layer over the entire surface of the substrate.

12. 3. The method for manufacturing an organic light-emitting device according to claim 2, wherein the third sealing layer contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride.

13. An organic light-emitting device having a plurality of organic light-emitting elements on a substrate and a sealing layer covering the organic light-emitting elements, the sealing layer includes a first sealing layer and a second sealing layer covering the first sealing layer, the first sealing layer has a groove in the non-display area, An organic light-emitting device, wherein an end portion of the second sealing layer is formed inside the groove.

14. 14. The organic light-emitting device of claim 13, wherein the encapsulation layer further comprises a third encapsulation layer covering the second encapsulation layer.

15. The moisture permeation amount of the first sealing layer is 10 -5 g / m 2 15. The organic light-emitting device according to claim 13, wherein the light-emitting diode (LED) is 1000 times or less.

16. 15. The organic light-emitting device of claim 13 or 14, wherein the second encapsulation layer is a layer capable of conformal deposition in structures with aspect ratios higher than 1 / 10.

17. 15. The organic light-emitting device according to claim 13, wherein the non-display region of the substrate has a groove, and the groove of the first sealing layer is formed along the groove in the substrate.

18. 18. The organic light-emitting device according to claim 17, wherein the groove in the substrate is formed along the periphery of the display area of ​​the substrate.

19. The organic light-emitting device according to claim 13 or 14, wherein the first sealing layer is formed on the entire surface of the substrate.

20. 15. The organic light-emitting device according to claim 13, wherein the first sealing layer contains at least one material selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride.

21. 15. The organic light-emitting device according to claim 13, wherein the second sealing layer contains at least one selected from the group consisting of hexamethyldisiloxane, dimethylsiloxane, aluminum oxide, hafnium oxide, zirconia oxide, and titanium oxide.

22. The moisture permeation amount of the third sealing layer is 10 -5 g / m 2 15. The organic light-emitting device of claim 14, wherein the light-emitting diode (LED) is 1000 times or less.

23. The organic light-emitting device according to claim 14 , wherein the third sealing layer is formed on the entire surface of the substrate.

24. 15. The organic light-emitting device of claim 14, wherein the third sealing layer comprises at least one selected from the group consisting of silicon nitride, silicon oxide, and silicon oxynitride.

25. 15. A display device comprising the organic light-emitting device according to claim 13 or 14, wherein the organic light-emitting device comprises a plurality of pixels, and at least one of the plurality of pixels comprises an organic light-emitting element and a transistor connected to the organic light-emitting element.

26. an input unit for inputting image information and a display unit for outputting an image; 26. An image display device, wherein the display unit comprises the display device according to claim 25.

27. an optical unit having a plurality of lenses, an image pickup element that receives light that has passed through the optical unit, and a display unit that displays an image picked up by the image pickup element; The photoelectric conversion device, wherein the display unit comprises the organic light-emitting device according to claim 13 or 14.

28. 15. An electronic device comprising: a display unit having the organic light-emitting device according to claim 13; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with an external device.

29. 15. A lighting device comprising: a light source having the organic light-emitting device according to claim 13; and a light diffusion section or an optical filter that transmits light emitted by the light source.

30. A moving body comprising: a lamp having the organic light-emitting device according to claim 13 or 14; and a body on which the lamp is provided.

31. An exposure light source for an electrophotographic image forming apparatus, comprising the organic light emitting device according to claim 13 or 14.

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