Plasma treatment apparatus for container

Abstract

To provide a plasma treatment apparatus for a container by which it is possible to decrease microorganism, virus, and mold in the container.SOLUTION: A plasma treatment apparatus for a container includes: a plasma generation part 10 that generates plasma and includes at least a dielectric layer and a pair of electrode layers disposed on both sides of the dielectric layer; a power supply part 30 that applies an AC voltage to the pair of electrode layers; and a gas flow part 20 that supplies gas to the plasma generation part 10 in order to treat gas with plasma, and supplies the gas treated with plasma into the container 200.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a plasma processing apparatus for a container. [Background technology]

[0002] In recent years, a technique called dielectric barrier discharge (DBD) has been developed in plasma processing technology, making it possible to generate low-temperature plasma at atmospheric pressure. As a result, the range of applications of plasma processing has expanded, and it is increasingly being used in a variety of applications. The purposes of plasma processing include sterilization, deodorization, surface modification, and decomposition of chemical substances. Furthermore, the substances that can be subjected to plasma processing can be solid, liquid, or gaseous.

[0003] Various plasma processing apparatuses have been developed to perform continuous plasma processing while flowing air. For example, Patent Document 1 discloses a plasma generating apparatus in which plasma generating units, each having a flat plate-shaped first electrode and a second electrode facing each other across a gap, are stacked in two or more layers. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-190472 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, inside containers used to store and transport cargo such as food, bacteria, viruses, and mold are likely to grow because they are closed spaces. There is also the risk that viruses and bacteria may spread to uncontaminated areas through the container. Furthermore, the spread of mold can damage the items inside the container and result in food waste. Therefore, it is desirable to reduce bacteria, viruses, and mold inside containers.

[0006] In view of the above background, an object of the present invention is to provide a plasma processing apparatus for a container that can reduce bacteria, viruses, and mold inside the container. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the present invention is characterized by comprising a plasma generation unit that generates plasma and that has at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer, a power supply unit that applies an AC voltage to the pair of electrode layers, and a gas flow unit that flows a gas through the plasma generation unit to treat the gas with plasma and supplies the gas treated by plasma into a container.

[0008] According to the present invention, a gas treated with plasma (also called plasma gas) can be generated and supplied into a container, thereby reducing germs (e.g., bacteria, mold, etc.) and viruses within the container.

[0009] It is also preferable to have a sensor that detects plasma inside the container, and a control unit that receives the detection result of the sensor and transmits a signal to apply an AC voltage to the power supply unit based on the detection result.

[0010] According to the present invention, the generation state of the gas treated by plasma in the container is detected by the sensor, so that the gas treated by plasma can be supplied efficiently.

[0011] It is also preferable that the power supply unit has a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer unit that measures time.

[0012] According to the present invention, by controlling the timing of generating plasma in accordance with the time and information from the sensor, it is possible to supply gas that has been efficiently treated with plasma.

[0013] It is also preferable that the plasma generating device has a wireless interface that provides information to a terminal device and a control unit that transmits a signal to apply an AC voltage to the power supply unit, and that the control unit transmits information regarding plasma generation to the outside via the wireless interface.

[0014] According to the present invention, for example, a user can obtain information regarding plasma generation.

[0015] It is also preferable that the plasma generating unit has a housing that covers the plasma generating unit and is divided into multiple spaces by the dielectric layer, and that the housing has an inlet section through which gas flows into each space and an outlet section through which gas flows out, and that the housing is configured so that gases of different pressures flow into each space.

[0016] According to the present invention, gas treated with a plurality of plasmas at different pressures can be supplied from a single plasma generating unit, i.e., gas treated with plasmas at different pressures can be supplied according to the load of the supply destination.

[0017] It is also preferable that the gas flow unit flows the gas in the container to the plasma generation unit and supplies the gas treated by the plasma into the container.

[0018] According to the present invention, by flowing the gas in the container into the plasma generating section, the gas in the container can be circulated, and gas that has been treated by plasma can be supplied efficiently.

[0019] The container preferably includes a humidifier, and the gas flowing through at least one of the spaces is preferably supplied to the humidifier. By controlling the humidity inside the container, food and other items can be transported in optimal condition. Humidity control is particularly important for fresh food.

[0020] According to the present invention, by supplying gas treated with plasma to a humidifier, mold growth in the humidifier can be suppressed. Many products, particularly perishable foods, can be kept fresh by transporting them at high humidity. However, high humidity makes mold more likely to grow, and if mold grows in the humidifier, it will continue to be released into the container. This invention solves this problem. [Effects of the Invention]

[0021] According to the plasma processing apparatus for a container of the present invention, it is possible to reduce bacteria, viruses, and mold inside the container. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 2] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 3] FIG. 2 is a cross-sectional view illustrating a plasma generating unit. [Figure 4] FIG. 10 is a perspective view for explaining a plasma generating unit according to a first modified example. [Figure 5] FIG. 10 is a perspective view for explaining a plasma generating unit according to a second modified example. [Figure 6] FIG. 10 is a perspective view for explaining a plasma generating unit according to a third modified example. [Figure 7] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fourth modified example. [Figure 8] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fifth modified example. [Figure 9] FIG. 13 is a cross-sectional view illustrating a plasma generating unit according to a sixth modified example. [Figure 10] 1 is a side view showing a container equipped with a plasma treatment apparatus for a container according to a first embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12]1 is a block diagram showing a container plasma processing apparatus according to a first embodiment. [Figure 13] 1 is an enlarged side view showing a container plasma processing apparatus according to a first embodiment. [Figure 14] FIG. 10 is a side view showing a container equipped with a plasma treatment apparatus for a container according to a second embodiment of the present invention. [Figure 15] 15 is a cross-sectional view taken along line XV-XV in FIG. 14. [Figure 16] FIG. 4 is a side view showing a plasma processing apparatus for a container according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present invention will be described in detail, but the embodiments of the present invention are not limited to the embodiments described below. Each embodiment and modified example can be applied in appropriate combination. Furthermore, directions such as "upper" and "lower" in the description are used for convenience of explanation and do not limit the directions of the present invention.

[0024] The container plasma processing apparatus of this embodiment has a multilayered plasma generating unit having a dielectric layer, an electrode layer, and a mask layer (optional) for continuous plasma processing of gases, a power supply unit capable of applying an AC voltage between the pair of electrode layers, and a gas flow unit capable of flowing gas through the plasma generating unit. In dielectric barrier discharge, a dielectric layer is provided between two electrode layers, and an AC voltage is applied between the two electrode layers to generate plasma within the dielectric layer sandwiched between the two electrode layers. First, the plasma generating unit will be described.

[0025] <Basic structure of the plasma generation unit> As shown in Figures 1 and 2, the plasma generating unit 10 includes a dielectric layer 11, an upper electrode 12, a lower electrode 13, an upper mask layer 14, and a lower mask layer 15. The plasma generating unit 10 is a flexible thin-film member. For convenience, the dielectric layer 11 is expressed as a single dielectric, but it may also be a laminate of one or more dielectrics containing air. The mask layer is provided to protect the electrodes and improve the assembly and performance of the electrodes, and may be omitted. Furthermore, by appropriately selecting the thickness and position of the mask layer, excessive electric field concentration on the electrodes can be prevented, thereby extending the life of the electrodes.

[0026] As shown in Figures 1 to 3, the dielectric layer 11 is a layered member disposed between the upper electrode 12 and the lower electrode 13. The material of the dielectric layer 11 is an insulating material with a large breakdown voltage so as to prevent discharge between the upper electrode 12 and the lower electrode 13. Furthermore, since the material of the dielectric layer 11 is exposed to the generated plasma, it is preferable that the material be durable against the active substances generated in the plasma. The material of the dielectric layer 11 is preferably a material selected from the group consisting of glass, ceramics, and synthetic resins. "Mainly" means that the component composition is 50% by mass or more (the same applies hereinafter). For convenience, the dielectric layer 11 is shown as a single dielectric, but it may also be a layered structure of multiple dielectrics including air.

[0027] Examples of glass include soda-lime glass (soda glass), borosilicate glass, quartz glass, lead glass, and oxide glass. Synthetic resins include thermoplastic resins and thermosetting resins. Examples of thermoplastic resins include general-purpose resins such as polyolefin, polystyrene, polyvinyl acetate, polyurethane, polylactic acid, ABS resin, AS resin, acrylic resin, polyvinyl chloride, and polyvinylidene chloride; engineering plastics such as polyamide, polyacetal, polycarbonate, modified polyphenylene ether, polyester, and cyclic polyolefin; polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, liquid crystal polymer, polyetheretherketone, polyimide, polyamideimide, polyetherimide, fluorine-based resin, unsaturated polyester resin, and polyurethane resin. Among these synthetic resins, silicone-based resins, polyimide-based resins, and Teflon®-based resins, which have excellent durability, are particularly preferred. The thickness of the dielectric layer 11 is not particularly limited, but is preferably 0.1 mm to 5.0 mm, more preferably 0.1 mm to 3.0 mm, and even more preferably 0.1 mm to 1.0 mm, in order to achieve lightweight and compactness.

[0028] As shown in FIGS. 2 and 3, the upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are layer members disposed on the front and back of the dielectric layer 11. The upper electrode 12 and the lower electrode 13 are each provided with a through-hole 16 penetrating in the thickness direction. In this embodiment, the through-holes 16 are oval in shape, and five through-holes 16 are formed, but the shape and number are not limited. The through-holes 16 may be omitted, but the presence of the through-holes 16 in this embodiment makes it easier to generate plasma and facilitates the creation of a power supply circuit. Furthermore, contact with gas at the through-holes 16 enables plasma processing of the gas.

[0029] The upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are formed of a conductive material, and may be a metal plate (including metal foil), a conductive paint, a conductive polymer, a conductive film, etc. The thickness of the upper electrode 12 and the lower electrode 13 is not particularly limited, but is preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm, respectively, in order to provide a flexible, lightweight, and compact processing device.

[0030] The dielectric layer 11, the upper electrode 12, and the lower electrode 13 may be laminated without using an adhesive, or may be bonded with an adhesive. The adhesive is preferably a material that is durable against active substances generated in plasma. Examples of adhesives include epoxy, acrylic, urethane, phenol, urea, silicone, cyanoacrylate, rubber, and vinyl acetate adhesives. Among these, silicone adhesives and UV-curable epoxy adhesives are preferred from the viewpoint of durability, with polyamide adhesives, polyimide adhesives, and silicone adhesives being more preferred. The thickness of the adhesive is preferably 0.01 to 0.2 mm, and more preferably 0.01 to 0.1 mm.

[0031] As shown in FIG. 3 , the upper mask layer (mask layer) 14 and the lower mask layer (mask layer) 15 are members respectively disposed on the outer sides of the upper electrode 12 and the lower electrode 13. More specifically, the upper mask layer 14 is disposed on the upper surface of the upper electrode 12. The lower mask layer 15 is disposed on the lower surface of the lower electrode 13. The upper mask layer 14 and the lower mask layer 15 are each provided with through holes 17. In this embodiment, the through holes 17 are oval and five of them are formed, but the shape and number are not limited thereto. The through holes 17 may be omitted, but for ease of manufacture, it is preferable that the through holes 17 are the same as the through holes 16, although this is not limited thereto.

[0032] 2 and 3, through-hole 17 has the same shape as through-hole 16 and is connected to each other. Through-holes 16 and 17, dielectric layer 11 is exposed to the outside. In other words, the surface of dielectric layer 11 is exposed to the outside at multiple locations where through-holes 16 and 17 are formed. Hole walls (cross-sectional portions) 16a and 17a of through-holes 16 and 17 are also exposed to the outside.

[0033] The upper mask layer 14 and the lower mask layer 15 are formed of an insulating material. The hardness of the upper mask layer 14 and the lower mask layer 15 is preferably equal to or less than that of the upper electrode 12 and the lower electrode 13. Although the plasma generation unit 10 can be difficult to handle if it is manufactured using a thin material, providing the upper mask layer 14 and the lower mask layer 15 improves ease of handling. Furthermore, the upper mask layer 14 and the lower mask layer 15 protect the thin conductor from mechanical and physical shocks during manufacturing and use, as well as deterioration caused by the surrounding environment. They also provide mechanical protection from scratches that may occur during manufacturing. Considering that the plasma generation unit 10 will be installed on an object to be attached, the upper mask layer 14 and the lower mask layer 15 preferably have a hardness that allows for easy installation along the object and also improves ease of handling. Furthermore, dividing the dielectric layer 11 into two allows the upper and lower structures of the plasma generation unit 10 to be symmetrical. It can be easily manufactured by assembling the upper and lower layers and bonding them together in the center. In this case, the dielectric layer 11 is divided into three layers: the upper layer, the lower layer, and the adhesive layer, but even in this case, it can be considered as a single dielectric from an electrical standpoint. The thicknesses of the upper mask layer 14 and the lower mask layer 15 are not particularly limited, but in order to provide a flexible, lightweight, and compact processing device, they are preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm. The thicknesses of the upper mask layer 14 and the lower mask layer 15 may be set as appropriate, but in this embodiment they are formed to be larger than the thicknesses of the upper-layer electrode 12 and the lower-layer electrode 13.

[0034] The plasma generating unit 10 is very thin and flexible, which can make it difficult to handle during assembly. Furthermore, the upper electrode 12 and the lower electrode 13 are formed of conductive materials, such as conductive metals or conductive dielectrics. Metals, for example, can be corroded by liquids or gases. For example, the upper electrode 12 and the lower electrode 13 are oxidized by highly oxidizing gases and corroded by sulfuric acid or hydrochloric acid. Furthermore, if the upper electrode 12 and the lower electrode 13 are made of a resin-based conductive material, they may be deteriorated by humidity or acid. Furthermore, the plasma generating unit 10 is designed to be installed according to the shape of the object to which it is to be attached. However, if only the upper electrode 12 and the lower electrode 13 are used without the upper mask layer 14 and the lower mask layer 15, problems can arise, such as wrinkles in the metal constituting the electrodes or gaps between the electrodes and the dielectric layer 11, if the electrodes are made of thin metal. If gaps are formed between the upper layer electrode 12 and the lower layer electrode 13 and the dielectric layer 11, this can cause abnormal discharge or partial discharge. In this regard, according to this embodiment, the upper mask layer 14 and the lower mask layer 15 can protect the upper electrode 12 and the lower electrode 13, and the plasma generating unit 10 can be easily handled, improving workability and assembly. Furthermore, the provision of the upper mask layer 14 and the lower mask layer 15 allows installation on an object without forming wrinkles or gaps. Furthermore, when multiple pairs of electrodes are provided to form a multi-stage structure, the upper mask layer 14 and the lower mask layer 15 also serve as part of the dielectric that constitutes the barrier discharge, making it less likely that abnormal discharge will occur even if gaps are formed during installation. Depending on the situation, the same effect can be achieved with either the upper or lower mask layer.

[0035] The outer edges of upper-layer electrode 12 and lower-layer electrode 13 may be sealed with an insulator (not shown) to prevent deterioration over time due to exposure to the outside world and to prevent discharge from occurring via the outer edges other than through-hole 16. When a resin or the like is used as the mask layer, this effect is achieved because the resin thinly spreads over not only upper-layer electrode 12 and lower-layer electrode 13 but also the upper and lower surfaces of dielectric layer 11. Similarly, the outer edges of the upper mask layer 14 and the lower mask layer 15 may be sealed with an insulator (not shown) to prevent their outer edges from being exposed to the outside world and reacting with external substances to deteriorate over time, and to prevent discharge from occurring through the outer edges other than the through holes 17.

[0036] When the longitudinal direction of the through holes 16, 17 is parallel to the gas flow direction, the resistance to the gas flow is small and the gas flows smoothly. On the other hand, when the longitudinal direction of the through holes 16, 17 is perpendicular to the gas flow direction, the resistance to the gas flow is large, the gas flow is disturbed, and the gas is agitated.

[0037] The shape, number, and orientation of the through-holes 16 and 17 relative to the gas flow can be selected appropriately depending on the purpose of the plasma processing, the effect of the plasma processing, and other factors. The through-holes may have different shapes on the front and back sides of the plasma generating unit 10. Alternatively, through-holes may be provided on the front side of the plasma generating unit 10, while no through-holes are provided on the back side. In this example, the through-holes are shown as rectangles with rounded corners, but this shape is not required. Round, oval, square, or triangular shapes are also acceptable. However, shapes with sharp corners tend to concentrate the electric field, so rounded corners are more appropriate. A similar effect can also be achieved with a structure with larger holes, such as a mesh-like shape. While five holes are shown in the figure, there is no limit to the number. Multiple holes may be arranged vertically or horizontally. Furthermore, holes with company logos or initials, etc., can be provided to expose the plasma generated through the holes, allowing for use as a display. Dividing the electrode into multiple sections, each with a differently shaped hole, and continuously switching between electrodes can function as a dynamic display.

[0038] <First Modification of Plasma Generation Unit> 4 is a perspective view for explaining a plasma generating unit according to a first modified example. The plasma generating unit 10A according to the first modified example differs from the basic structure described above in that it does not have an upper mask layer 14. As in the plasma generating unit according to the first modified example, the mask layer may be provided only on one side of the plasma generating unit 10A.

[0039] <Second Modification of Plasma Generation Unit> FIG. 5 is a perspective view illustrating a plasma generating unit according to a second modified example. The plasma generating unit 10B according to the second modified example differs from the basic structure described above in that it does not include the upper mask layer 14 and the lower mask layer 15. As in the plasma generating unit 10B according to the second modified example, the upper mask layer 14 and the lower mask layer 15 may be omitted. In other words, by configuring the plasma generating unit 10B with only the dielectric layer 11, the upper-layer electrode 12, and the lower-layer electrode 13, it is possible to further reduce the size and the number of parts. Furthermore, when using this plasma generating unit in a process for manufacturing printed circuit boards, semiconductors, etc., process steps can be omitted, thereby reducing product costs.

[0040] Furthermore, as in the first and second modified examples, by omitting either or both of the upper mask layer 14 and the lower mask layer 15, the overall thickness can be reduced and flexibility can be increased, which is convenient when creating an ultra-compact plasma generation device.

[0041] <Third Modification of Plasma Generation Unit> FIG. 6 is a perspective view illustrating a plasma generation unit according to a third modified example. The plasma generation unit 10C according to the third modified example differs from the basic structure described above in that an air layer 18 is provided below the dielectric layer 11C. However, if air is considered a dielectric with a relative dielectric constant of 1 and the combined air and dielectric layer 11C are considered a single dielectric, the plasma generation unit 10C can be considered the same as the basic structure shown in FIG. 2. The composite relative dielectric constant (or dielectric constant) can be calculated from the respective relative dielectric constants (or dielectric constants) and thicknesses. The plasma generation unit 10C according to the third modified example includes a dielectric layer 11C, an upper electrode 12, a lower electrode 13, an upper mask layer 14, a lower mask layer 15, and an air layer 18. The air layer 18 is provided between the dielectric layer 11C and the lower electrode 13. In the third modified example, three surfaces can come into contact with gas: the air layer 18 between the upper electrode 12 and the lower electrode 13, the back surface of the lower electrode 13, and the back surface of the upper electrode 12. The back surface here refers to the surface opposite to the air layer 18. This improves the plasma utilization efficiency compared to when only the air layer 18 is used, and allows for plasma processing of a larger amount of gas.

[0042] <Fourth Modification of Plasma Generation Unit> FIG. 7 is a cross-sectional view illustrating a plasma generation unit according to a fourth modification. The plasma generation unit 10D according to the fourth modification differs from the third modification in that it does not include an upper mask layer 14. In this case, too, a dielectric with a relative permittivity of 1 is considered. Furthermore, if the dielectric layer 11C and the dielectric layer 11C are considered as a single dielectric, the composite dielectric portion in this structure can be considered to be the same as the dielectric shown in FIG. 2 for the basic structure. The composite relative permittivity (or dielectric constant) can be calculated from the thickness and dielectric constant of the dielectric layer 11C and the thickness and dielectric constant of the air layer 18 (or the dielectric constant of air if air is permeable). The plasma generation unit 10D includes the dielectric layer 11C, the upper electrode 12, the lower electrode 13, the lower mask layer 15, and the air layer 18. As in the fourth modification, the upper mask layer may be omitted while providing the air layer 18 between the dielectric layer 11C and the lower electrode 13. This configuration can achieve substantially the same effects as the third modification while reducing the number of components. Furthermore, when the plasma generating unit is produced using the processes for printed circuit boards or semiconductor ICs, the process steps can be omitted, thereby reducing costs.

[0043] <Fifth Modification of Plasma Generation Unit> FIG. 8 is a cross-sectional view illustrating a plasma generating unit according to a fifth modification. The plasma generating unit 10E according to the fifth modification differs from the third modification in that it does not include the upper mask layer 14 and the lower mask layer 15. The plasma generating unit 10E also includes a dielectric layer 11Cb on the lower surface of the lower electrode 13. The plasma generating unit 10E includes dielectric layers 11Ca and 11Cb, an upper electrode 12, and a lower electrode 13. The dielectric layer 11Cb on the lower surface of the lower electrode 13 is used to support the lower electrode 13. As in the fifth modification, the upper and lower mask layers may be omitted while providing an air layer 18 between the dielectric layer 11Ca and the lower electrode 13. This configuration achieves substantially the same effects as the third modification while reducing the number of components. This reduces the thickness of the electrodes. Furthermore, when fabricating this plasma generating unit using a printed circuit board or semiconductor IC process, it eliminates process steps, thereby reducing costs. Furthermore, the reduced material thickness improves flexibility.

[0044] The upper dielectric layer 11Ca and the air layer 18 function as a single dielectric. This dielectric constant can be calculated from the relative permittivity (or dielectric constant) and thickness of the upper dielectric layer 11Ca, and, if air is used as the gas, the relative permittivity (or dielectric constant) of the air and the thickness of the air layer 18. The lower dielectric layer 11Cb plays almost no role in plasma generation. However, this structure allows the same material to be used for the upper electrode 12 and the lower electrode 13. This reduces manufacturing costs.

[0045] <Sixth Modification of Plasma Generation Unit> 9 is a cross-sectional view for explaining a plasma generating unit according to the sixth modified example. The plasma generating unit 10F according to the sixth modified example includes, from top to bottom, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, a dielectric layer 11Cb, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, and a dielectric layer 11Cb. In other words, it is configured by stacking two plasma generating units 10E according to the fifth modified example in the height direction. The ends of the dielectric layers 11Ca and 11Cb are supported by a box-shaped housing 21F.

[0046] Inside the housing 21F, basic units in which an upper-layer electrode 12 is laminated only on one side (top surface) of a dielectric layer 11Ca and basic units in which a lower-layer electrode 13 is laminated only on one side (top surface) of a dielectric layer 11Cb are alternately arranged with an air layer (gas inlet layer) 18 between them. As a result, electrodes of opposite polarity are alternately laminated, but if a space in which plasma is not generated is desired, the electrodes do not need to be alternately arranged. By designing a space in which plasma is not generated in this way, it is possible to place a sensor, wiring, or other circuits between them. An air layer 18 is formed between each of the electrode layers adjacent in the vertical direction.

[0047] According to this modification, the plasma generating section 10F can be easily formed simply by stacking basic units each consisting of a dielectric layer and an electrode layer (upper electrode 12 or lower electrode 13) at intervals. Furthermore, since plasma can be generated in multiple air layers 18, plasma can be generated efficiently in a small space. Furthermore, since no separate components such as spacers are required to space the basic units, multi-stage construction is easily possible, reducing manufacturing costs and shortening development time. In this way, the number of stacked electrodes can be freely changed, which has the advantage of allowing the amount of contact between plasma and gas to be controlled and devices with different capacities to be easily constructed.

[0048] The functions achieved by treating gas with plasma include sterilization, virus inactivation, deodorization, surface modification, and decomposition of chemical substances.The mechanism by which these functions are achieved is thought to be that plasma treatment generates active species in the gas, such as singlet oxygen, hydrogen peroxide, OH radicals, peroxide radicals, and ozone, which kill target microorganisms and decompose and modify chemical substances through oxidation reactions.Microorganisms include various bacteria, viruses, and mold.

[0049] The plasma-treated gas is sterilized and deodorized by killing microorganisms present in the gas and decomposing chemical substances due to the activated species generated by the plasma. Furthermore, active species remain in the plasma-treated gas, so by spraying the plasma-treated gas generated by the plasma treatment apparatus of this embodiment onto an object, microorganisms present in the object are killed and chemical substances are decomposed, thereby sterilizing and deodorizing the object.

[0050] First Embodiment Next, a container plasma processing apparatus according to a first embodiment of the present invention will be described. As shown in FIGS. 10 to 12, the container plasma processing apparatus 100 according to this embodiment is installed in a container 200. The container 200 includes a housing 201. The container 200 is a transport container for storing food such as vegetables, fruits, fish, and meat, or other cargo. Examples of the container 200 include those loaded onto trucks, freight trains, airplanes, and ships.

[0051] The housing 201 is a box-shaped body that forms a closed space, and allows air to circulate between the housing 201 and the container-use plasma processing apparatus 100. The size of the housing 201 is not particularly limited, and it may be of any size as long as the container-use plasma processing apparatus 100 can be installed therein.

[0052] As shown in Figures 10 to 12, the container plasma processing apparatus 100 includes a plasma generating unit 10, a gas flow unit 20, a power supply unit 30, a sensor 40, a wireless interface 50, and a control unit 60. The plasma generating unit 10 of this embodiment has the same basic structure as the plasma generating unit described above, but various modified examples of the plasma generating unit may also be used. One or more plasma generating units 10 may be installed.

[0053] The gas flow unit 20 is a part that flows gas into the plasma generating unit 10 to treat the gas with plasma, and supplies the gas treated with plasma into the housing 201. As shown in FIG. 13 , the gas flow unit 20 includes a housing 21, an inlet tube (inlet section) 22, an outlet tube (outlet section) 23, a blower 24, and an inlet tube (inlet section) 25. The housing 21 is a box-shaped body that covers the plasma generating unit 10. In this embodiment, the gas flow unit 20 flows the gas in the container 200 into the plasma generating unit 10, and supplies the gas treated with plasma into the container 200. This circulates the gas in the container 200. Note that gas outside the container 200 may be taken into the plasma generating unit 10 and supplied into the container 200.

[0054] The housing 21 is detachably attached to the side of the container 200. The inlet tube 25 is a flexible cylindrical body that connects the container 200 and the blower 24. The tip of the inlet tube 25 is located inside the container 200. The inlet tube 22 is a flexible cylindrical body that connects the blower 24 and the housing 21. The outlet tube 23 is a flexible cylindrical body that connects the housing 21 and the container 200. The tip of the outlet tube 23 is located inside the container 200. The inlet tube 25 may have any other form as long as it functions as an inlet that can supply gas to the blower 24. The inlet tube 22 may have any other form as long as it functions as an inlet that can supply gas to the plasma generating unit 10. The outlet tube 23 may have any other form as long as it functions as an outlet that discharges the gas that has been treated with plasma in the plasma generating unit 10.

[0055] The blower 24 supplies air to the plasma generating unit 10 and supplies plasma-treated gas to the housing 201 of the container 200. Any known device can be appropriately selected and used. As a driving device for moving the gas, a centrifugal blower (such as a sirocco fan, radial fan, or turbo fan), an axial flow blower (such as a propeller fan), a mixed flow blower (such as a line fan), a cross flow blower, a blower, a compressor, or an air pump can be appropriately used. The blower 24 operates or stops, or controls the airflow or gas discharge pressure, based on a control signal from the control unit 60. Alternatively, instead of the blower 24, the inlet tube 22 may be connected to the outlet of a pressurized air hose or the like to deliver the gas. In this case, the blower 24 is not necessary.

[0056] The power supply unit 30 applies an AC voltage between the upper electrode 12 and the lower electrode 13, which face each other with the dielectric layer 11 sandwiched therebetween. The power supply unit 30 is connected to, for example, a power connector 31. There are no particular limitations on the power supply unit 30 as long as it can apply an AC voltage of a predetermined voltage at a predetermined frequency to each electrode of the plasma generation unit 10, and any known power supply device can be used. The frequency of the AC voltage is preferably 50 Hz to 30 MHz, and more preferably 50 Hz to 100 kHz. The AC voltage is preferably 0.1 to 50 kV, and more preferably 0.2 to 10 kV.

[0057] 10 to 12, the container plasma processing apparatus 100 according to this embodiment includes a solar cell 32, a charge controller 33, and a battery 34. The solar cell 32 is a power device that converts solar light energy into electrical energy, and any known power device can be appropriately selected and used. The solar cell 32 is a plate-shaped member and is arranged to cover the upper surface of the housing 201. The charge controller 33 is connected to, for example, the power connector 31 and the solar cell 32, and controls charging of the battery 34. The charge controller 33 is installed in the housing 21, but may also be installed in the housing 201. The battery 34 is connected to, for example, the control unit power supply 61 and the power connector 31, and supplies power to them.

[0058] The solar cell 32, the charge controller 33, and the battery 34 may be included in the container plasma processing apparatus 100, or may be separate components from the container plasma processing apparatus 100. Furthermore, the solar cell 32, the charge controller 33, and the battery 34 may be provided as needed, and the container plasma processing apparatus 100 may be of any system as long as it can supply power to the power supply unit 30 and the control unit power supply 61.

[0059] The sensor 40 is a sensor that detects the generation state of gas treated by plasma inside the container 200, and is a sensor module that includes sensors for temperature, humidity, light, infrared rays, ozone, PM2.5, CO2, etc. The measurement results are sent to the control unit 60. The sensor 40 is installed inside the container 200. Through these sensors, the amount of plasma generation, etc. is determined according to pre-programmed requirements, and the plasma output and air volume are controlled. One example of the sensor 40 is a sensor that estimates the amount of activated species by referencing the values ​​of an ozone sensor to acquire information such as temperature, humidity, the power and voltage supplied to the plasma generating unit 10, and the plasma emission intensity. The ozone sensor measures the amount of ozone in the container 200. For example, when plasma-treating air, the oxygen concentration in the air remains nearly constant, and ozone is generated as a by-product of the plasma-treating oxygen. The amount of activated species resulting from the plasma-treating process can be estimated by using the ozone sensor and information such as humidity, temperature, and plasma intensity. The measurement results (detection results) are transmitted to the control unit 60. The plasma intensity can be estimated by the power supplied to the plasma generating unit 10, or, if the shape of the plasma generating unit 10 is constant, by the voltage. Alternatively, the plasma intensity can be measured directly using a photosensor. If the oxygen concentration varies significantly, an oxygen sensor can be added.

[0060] The wireless interface 50 is a component that wirelessly provides information to a mobile terminal device, a terminal device, etc. The control unit 60 transmits information related to plasma generation to the wireless interface 50. The information related to plasma generation includes, for example, the number of plasma occurrences, the amount of plasma generated (plasma density), the plasma strength, the voltage, current, or amount of power, the operating time, the temperature of the power supply unit, the controller, the plasma generation unit, humidity, information related to the fan and pump, the water temperature, error information, etc. The information transmitted to the mobile terminal device, etc. may also include, for example, the amount of water. The wireless interface 50 may use, for example, Bluetooth (registered trademark), Wi-Fi, NFC (Near Field Communication), an induction coil, an optical sensor, etc. The mobile terminal device may use, for example, a smartphone, a mobile phone, etc. The terminal device may use, for example, a personal computer or a tablet.

[0061] The control unit 60 is a unit that controls each part of the container plasma processing apparatus 100 by sending control signals to them. The control unit 60 is installed in the housing 21. The control unit 60 includes at least a calculation unit (central processing unit) and a memory unit. The control unit 60 is connected to the power connector 31 via a control unit power supply 61. The control unit power supply 61 is a unit that generates and supplies the power required for the operation of the control unit 60. The control unit 60 sends a control signal to the power supply unit 30 via a high-voltage control unit (not shown) provided within the control unit 60 to apply an AC voltage to each electrode layer (upper electrode 12 and lower electrode 13). In addition, the control unit 60 sends a control signal to the blower 24 in accordance with the application of the AC voltage to circulate air through the plasma generation unit 10.

[0062] The control unit 60 may also include a timer unit (not shown) that measures the date and time. The timing at which the control unit 60 applies the AC voltage can be set as appropriate. For example, the control unit 60 may be provided with a timer unit that measures time, and plasma may be generated at a desired time period, or may be operated by a predetermined operation, or may be operated continuously. The timer unit may also generate plasma by correlating the time with information from the sensor 40.

[0063] Next, the effects of this embodiment will be described. The control unit 60 sends a control signal to the power supply unit 30 to apply an AC voltage, and also operates the air blower 24 or controls the airflow rate. As a result, gas flows through the inlet tube 25, the inlet tube 22, the housing 21, and the outlet tube 23, and the gas is treated with plasma in the plasma generating unit 10, and the gas treated with plasma is supplied into the container 200. This allows the inside of the container 200 to be efficiently sterilized, reducing various types of bacteria, viruses, mold, etc.

[0064] When transporting cargo using containers, in order to reduce or prevent the growth of various bacteria, viruses, mold, etc. attached to the cargo, cargo has traditionally been soaked in chemicals or fumigated as necessary before loading the container. Alternatively, the cargo has been moved to a warehouse or other location after transport and fumigated or washed. For example, chemicals such as thiabendazole are used to treat citrus fruits and other fruits. While thiabendazole is recognized as a food additive, it is also a substance suspected of posing risks such as genetic damage, mutagenicity, chromosomal abnormalities, and carcinogenicity. Furthermore, while foods containing these chemicals recognized as food additives are required to be labeled, even those grown using pesticide-free or reduced-pesticide farming methods may lose their pesticide-free or reduced-pesticide labeling after chemical treatment.

[0065] Food and other cargo treated with plasma-treated gas or plasma liquid also has the effect of reducing or suppressing the growth of various bacteria, viruses, mold, etc., so depending on the conditions, it is possible to reduce or suppress the growth of various bacteria, viruses, mold, etc. without the need for antibacterial or antifungal agents. Furthermore, unlike chemicals, electricity can continuously generate substances that can reduce bacteria and viruses, so the effect of reducing or suppressing the growth of various bacteria, viruses, mold, etc. can be maintained continuously during container transport. Therefore, compared to methods that perform antibacterial or antifungal treatments intensively only before and after transport, effective ingredients for antibacterial or antifungal treatments can be continuously supplied to the container, and the effect can be maintained even under conditions where various bacteria, viruses, mold, etc. re-adhere during transport. In this way, filling a container with plasma-treated gas can reduce various bacteria, viruses, mold, etc. that cause infectious diseases, and further reduce food waste due to mold. In addition, reducing mold or suppressing its growth can reduce the production of mycotoxins, which are believed to be the cause of Alzheimer's disease, and indirectly reduce the number of Alzheimer's patients.

[0066] Furthermore, by using the sensor 40, it is possible to detect the temperature, humidity, ozone concentration, and the like inside the container 200. Furthermore, when generating a gas treated with plasma as in this embodiment, ozone is generated as a by-product because oxygen is processed with plasma. By using an ozone sensor as the sensor 40, it is possible to estimate the amount of plasma-treated active species from the ozone concentration, which is a by-product when generating a gas treated with plasma, as well as humidity, plasma power, temperature, and the like. Furthermore, it is possible to control the capacity of the plasma processing, and start or stop operation based on these measurement results. Furthermore, if the measurement results of the sensor 40 show that the calculated active ingredient continues to decrease, the calculated active ingredient remains decreased, or abnormal fluctuations in the calculated active ingredient are detected, it can detect that there is some kind of malfunction and send an error signal, or it can send error information to the user's mobile terminal device, etc. via the wireless interface 50.

[0067] Furthermore, since the system is equipped with a wireless interface 50, information regarding plasma generation can be transmitted to, for example, the user's mobile terminal device. This allows the user to understand the status of plasma generation. Furthermore, the control unit 60 can calculate the electricity charge from the amount of electricity, and this information can also be provided to the user.

[0068] Furthermore, the gas flow unit 20 causes the gas in the container 200 to flow to the plasma generating unit 10, and also supplies the gas treated by plasma into the container 200, thereby circulating the gas in the container 200. This allows the gas treated by plasma to be efficiently generated, and the gas treated by plasma to be efficiently supplied into the container 200.

[0069] Furthermore, since the container 200 is provided with the solar cell 32, the charge controller 33, and the battery 34, the power generated by the solar cell 32 can be supplied to the power supply unit 30. Furthermore, the battery 34 can be charged with power from the solar cell 32 and the power connector 31. As a result, even if the power supply is temporarily interrupted when, for example, the container 200 is relocated, the container 200 will not lose its functionality.

[0070] Second Embodiment Next, a container plasma processing apparatus according to a second embodiment of the present invention will be described. In this embodiment, a humidified refrigerated container is used as the container 200A. As shown in FIGS. 14 and 15, the container plasma processing apparatus 100A according to this embodiment is installed in the container 200A. The container 200A includes a housing 201, a humidifier 202, and a cooling device 203. In this embodiment, differences from the first embodiment will be mainly described.

[0071] The humidifier 202 is a device that supplies water vapor to the inside of the container 200A and humidifies the gas inside the container 200A. The humidifier 202 includes a water tank 212 that stores water and a heating unit 222 that heats the water in the water tank. In the humidifier 202, the water in the water tank 212 is heated by the heating unit 222 to become water vapor. The heating unit 222 is capable of communicating with the inside of the container 200A, and the water vapor generated by the heating unit 222 is supplied to the inside of the container 200A through an outlet unit 223. This humidifies the gas inside the container 200A. As the humidifier 202, any known device can be appropriately selected and used.

[0072] The humidifier 202 may include, for example, a power supply unit and a power connector, and may receive power from a power facility of a transport vehicle carrying the container 200A. Alternatively, power may be supplied from, for example, a battery 34. The humidifier 202 may be driven as needed. For example, water vapor may be supplied to the interior of the container 200A under preset conditions. For example, a humidity sensor that detects humidity may be disposed inside the container 200A, and water vapor may be supplied to the interior of the container 200A based on the measurement results (detection results) of the humidity sensor.

[0073] The cooling device 203 is a device that supplies cold air to the inside of the container 200A and cools the gas inside the container 200A. The cooling device 203 is capable of communicating with the inside of the container 200A, and the cold air generated by the cooling device 203 is supplied to the inside of the container 200A. This cools the gas inside the container 200A. As the cooling device 203, a known device can be appropriately selected and used.

[0074] The cooling device 203 may include, for example, a power supply unit and a power connector, and may be supplied with power from a power facility of a transport vehicle carrying the container 200A. Alternatively, for example, power may be supplied from a battery 34. The cooling device 203 may be driven as needed. For example, cool air may be supplied to the inside of the container 200A under preset conditions. For example, a temperature sensor that detects the temperature may be disposed inside the container 200A, and cool air may be supplied to the inside of the container 200A based on the measurement results (detection results) of the temperature sensor.

[0075] 16, the container plasma processing apparatus 100A is different from the first embodiment in that a plurality of spaces are provided in the housing 21A, and gases of different pressures can be extracted. In this embodiment, the differences from the first embodiment will be mainly described.

[0076] The gas flow section 20A includes an inlet tube 26, inlet tubes 25A, 25B, and 25C, a housing 21A, inlet tubes 22A, 22B, and 22C, outlet tubes 23A, 23B, and 23C, and blowers 24A, 24B, and 24C connected to the inlet tubes 25A, 25B, and 25C and the inlet tubes 22A, 22B, and 22C. Each of the blowers 24A, 24B, and 24C can send gas at a different wind speed (wind pressure). The ends of the inlet tubes 25A, 25B, and 25C are connected on the opposite side from the blowers 24A, 24B, and 24C to form a single inlet tube 26. The end of the inlet tube 26 is located inside the container 200A. However, each of the inlet tubes 25A, 25B, and 25C may be located inside the container 200A.

[0077] The housing 21A includes a dielectric layer 11Aa and a dielectric layer 11Ab, which divide the housing 21A into three spaces: a first space 71, a second space 72, and a third space 73. An upper electrode 12 is provided on the upper surface of the dielectric layer 11Aa, and a lower electrode 13 is provided on the lower surface of the dielectric layer 11Ab. The upper electrode 12 and the lower electrode 13 are electrically connected to a power supply unit 30. The upper electrode 12, the lower electrode 13, the dielectric layer 11Aa, the dielectric layer 11Ab, and the second space 72 (air layer) constitute a "plasma generation unit." By applying an AC voltage to the upper electrode 12 and the lower electrode 13, gas flowing through the first space 71, the second space 72, and the third space 73 can be treated with plasma. The upper electrode 12 and the lower electrode 13 may have holes or a structure with larger holes (e.g., a mesh-like structure) as needed. Furthermore, a mask layer may be provided on the upper layer electrode 12 and the lower layer electrode 13 to protect the electrodes.

[0078] In the first space 71, gas flows in through inlet tube (inlet portion) 22A, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23A. In the second space 72, gas flows in through inlet tube (inlet portion) 22B, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23B. In the third space 73, gas flows in through inlet tube (inlet portion) 22C, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23C.

[0079] Since the plasma-treated gas extracted from each space has a different pressure (air pressure), the supply destination of the plasma-treated gas can be selected depending on the air pressure. For example, since a high pressure is required to send air to water in humidifier 202, the gas treated with plasma at the highest pressure is supplied to water tank 212 of humidifier 202. Alternatively, the gas treated with plasma at the next highest pressure may be supplied into housing 201 of container 200A, and the gas treated with plasma at the lowest pressure may be supplied to or near outlet 223 from which water vapor generated in humidifier 202 flows out.

[0080] Next, the effects of this embodiment will be described. In this embodiment, differences from the first embodiment will be mainly described. The generation of plasma-treated gas by the container plasma processing apparatus 100A is as described in the first embodiment, but the generation of plasma-treated gas may be adjusted appropriately in accordance with the timing of supplying the plasma-treated gas to the humidifier 202.

[0081] According to this embodiment, the gas flow unit 20A can extract gas treated with plasma at a plurality of different pressures (atmospheric pressures) from one plasma generation unit. This allows efficient supply of plasma-treated gas even when the supply destinations have different atmospheric pressure loads, such as the housing 201 of the container 200A, the water tank 212 of the humidifier 202, and the water vapor outlet 223 of the humidifier 202. Furthermore, supplying plasma-treated gas to the water tank 212 of the humidifier 202 can suppress mold growth in the water tank 212. Furthermore, supplying plasma-treated gas to the water tank 212 generates plasma water. This allows water vapor derived from the plasma water to be sprayed into the container 200A. Furthermore, supplying plasma-treated gas to the water vapor outlet 223 of the humidifier 202, where mold is likely to grow, or its vicinity, can effectively suppress mold growth due to the humidifier 202. Although three spaces are provided in this embodiment, two, four, or more spaces may be provided.

[0082] The gas load varies depending on the conditions of the supply destination. For example, sending gas into water requires a higher pressure than sending gas into the atmosphere. In such a case, if plasma generating units are provided for different atmospheric pressures, a high-voltage power supply or the like is required for each, which increases costs and requires more installation space. According to this embodiment, the pressure can be changed for each space, so a single plasma generating unit can distribute gas evenly to multiple different pressure loads.

[0083] Furthermore, according to this embodiment, each space is provided with an inlet tube (inlet section) and an outlet tube (outlet section), and the three spaces are independent of each other. Therefore, even if there is a malfunction in one space, the device can maintain its function as long as the path through the other spaces is still valid. If the device were to operate with only one plasma space, a problem in that space would cause the entire device to lose function. In contrast, this embodiment can improve the reliability of the device.

[0084] Furthermore, for example, in order to more effectively suppress the growth of mold in the humidifier 202, it is also possible to circulate the water in the water tank 212 inside the plasma processing apparatus. However, in this embodiment, the container plasma processing apparatus 100A and the water tank 212 are connected by the outflow tube 23B, and the water in the water tank 212 can be sterilized, so there is no need for complex processing on the humidifier 202 side, which is advantageous in terms of cost.

[0085] In addition, as in this embodiment, the plasma generating unit may be configured such that a pair of electrode layers are provided on the upper and lower surfaces of a dielectric layer as in the basic structure described above, or such that an air layer (space) is provided between the pair of electrode layers via a dielectric layer as in this embodiment. Even in the latter case, plasma can be generated. Furthermore, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space need only be different from that of the other spaces in at least one location, and does not have to be different everywhere. Alternatively, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space may all be the same.

[0086] By installing the container plasma processing apparatus 100A according to this embodiment in the container 200A, it is possible to obtain substantially the same effects as those of the first embodiment. Furthermore, by humidifying the inside of the container 200A and lowering the temperature, it is possible to transport fresh vegetables and fruits, such as high-moisture vegetables, apples, and potatoes, while maintaining their freshness better than with conventional methods. Furthermore, by using the container plasma processing apparatus 100A, it is possible to suppress mold growth in the container 200A due to humidification. Furthermore, it is possible to suppress mold growth in the humidifier 202, thereby suppressing mold discharge into the container 200A and reducing the frequency of humidifier maintenance.

[0087] Although the embodiments of the present invention have been described above, appropriate design changes are possible within the scope of the present invention. For example, the control unit 60 may be provided with an input unit (such as a touch panel) and a display unit (monitor). For example, plasma may be generated based on instructions input from the input unit. Furthermore, information related to plasma generation, the amount of electricity, etc. may be displayed on the display unit. In the second embodiment, blowers with different air speeds (air pressures) are provided for the first space 71, the second space 72, and the third space 73, respectively, so that the pressure (air pressure) in each space is different. However, for example, a single blower may be used, and valves may be provided in the flow paths through which the air passes, and the pressure in each space may be adjusted by the valve. This reduces the number of blowers installed, thereby lowering equipment costs. Alternatively, a single blower may be used, and the pressure (air pressure) in each space may be different by changing the inner diameter of each flow path through which the air flows.

[0088] Furthermore, for example, the container plasma processing apparatus may be provided with a device for detecting and displaying the remaining battery charge, or a sensor for detecting the particle concentration in the container, separate from the ozone sensor. If other devices are present in the container, their control terminals can be connected to the control unit of the container plasma processing apparatus to enable them to operate in coordination with each other. While the humidifier uses water in the above example, it may also be a device that sprays other liquids, such as hypochlorous acid water, or a mixture of other liquids and water. The humidifier is not limited to a type equipped with a water tank, but may be, for example, a type that uses a cold plate (cooled plate) to collect the water needed for humidification from water vapor in the air. The humidifier is not limited to a type that heats water, but may be one that sprays mist water using ultrasound, or one that humidifies by evaporating water impregnated into a cloth or the like. The container plasma processing apparatus, humidifier, and cooling device may each be located inside the container. This improves the loading efficiency of the container. 10 may be configured to be connected to, for example, the housing 21 (upstream side of the housing 21) or the inflow tube 22. This also allows the gas to circulate within the container 200. Furthermore, the inflow tubes 25A, 25B, and 25C in FIG. 14 may be configured to be connected to, for example, the housing 21 (upstream side of the housing 21) or the inflow tubes 22A, 22B, and 22C. This also allows the gas to circulate within the container 200A. [Explanation of symbols]

[0089] 10 Plasma generation unit 11 Dielectric layer 12 Upper layer electrode (electrode layer) 13 Lower electrode (electrode layer) 14 Upper mask layer (mask layer) 15 Lower mask layer (mask layer) 20 Gas flow section 21. Cabinet 22 Inlet tube (inlet section) 23 Outlet tube (outlet section) 25 Inlet tube (inlet section) 30 Power supply section 40 sensors 50 Wireless Interface 60 Control Unit 100 Plasma treatment device for container 200 containers

Claims

1. a plasma generating unit that generates plasma and includes at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer; a power supply unit that applies an AC voltage to the pair of electrode layers; a gas flow unit that flows a gas through the plasma generating unit to treat the gas with plasma, and supplies the gas that has been treated with plasma into the container.

2. a sensor for detecting plasma within the container; 2. The plasma processing apparatus for a container according to claim 1, further comprising: a control unit that receives a detection result from the sensor and transmits a signal to the power supply unit to apply an AC voltage based on the detection result.

3. 2. The plasma processing apparatus for a container according to claim 1, further comprising a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer unit that measures time.

4. a wireless interface for providing information to a terminal device; a control unit that transmits a signal to apply an AC voltage to the power supply unit, The plasma processing apparatus for a container according to claim 1 , wherein the control unit transmits information about plasma generation to an external device via the wireless interface.

5. a housing that covers the plasma generating unit and is divided into a plurality of spaces by the dielectric layer; 2. The plasma processing apparatus for a container according to claim 1, wherein the housing is provided with an inlet portion through which gas flows into each of the spaces and an outlet portion through which gas flows out, and is configured so that gases of different pressures flow into each of the spaces.

6. 2. The plasma processing apparatus for a container according to claim 1, wherein the gas flow unit flows the gas in the container to the plasma generating unit and supplies the gas treated by the plasma into the container.

7. 6. The plasma processing apparatus for a container according to claim 5, wherein the container has a humidifier, and the gas flowing in at least one of the spaces is supplied to the humidifier.

Images