Recipe setting device, recipe setting method, and program

Abstract

To provide a system that is effective in reducing the burden of managing recipes in a system in which a plurality of modules are selectively used.SOLUTION: A recipe setting device 130 includes a recipe memory unit 131 that stores a reference recipe that indicates conditions for substrate processing, an offset memory unit 132 that stores an offset table that includes a plurality of offset values corresponding to a plurality of modules, in association with the reference recipe, a selection unit 133 that selects one module from the plurality of modules, an offset value extraction unit 134 that extracts an offset value corresponding to the selected module from the plurality of offset values, and a recipe generation unit 135 that generates a processing recipe to be executed by the one selected module based on the reference recipe and the extracted offset value.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a recipe setting device, a recipe setting method, and a program. [Background technology]

[0002] The coating and developing apparatus described in Patent Document 1 includes multiple processing modules, each of which includes a liquid processing unit and a heat processing unit. For example, the liquid processing unit rotates a wafer to which a processing liquid has been supplied, and forms a film of the processing liquid on the wafer.

[0003] The control device that controls the coating and developing apparatus has a function of adjusting film thickness between modules. The module here corresponds to a unit that performs a specific process on a wafer, such as the liquid processing unit and heat processing unit described above. In the coating and developing apparatus of Patent Document 1, the recipe for processing in each module is adjusted to reduce differences in film thickness distribution that occur as a result of processing in different modules. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-072178 Summary of the Invention [Problem to be solved by the invention]

[0005] As the number of modules increases, so does the need to manage a corresponding number of recipes. The recipes in each module contain many adjustment items. Even if there is only one item to be adjusted, it is necessary to open the recipe item list for every recipe and find the item to be adjusted. Performing these tasks for every recipe is a heavy burden for the user, and can also lead to mistakes such as selecting the wrong item for adjustment.

[0006] The present disclosure provides a system that is effective in reducing the burden of managing recipes in a system in which multiple modules are selectively used. [Means for solving the problem]

[0007] In one exemplary embodiment, a recipe setting device includes: a recipe memory unit that stores a reference recipe that indicates conditions for substrate processing; an offset memory unit that stores an offset table, the offset table including a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing apparatus, in association with the reference recipe; a selection unit that selects one module from the plurality of modules; an offset value extraction unit that extracts an offset value corresponding to the selected module from the plurality of offset values; and a recipe generation unit that generates a processing recipe to be executed by the selected one module based on the reference recipe and the extracted offset value. [Effects of the Invention]

[0008] According to the present disclosure, a recipe setting device, a recipe setting method, and a program are provided that are effective in reducing the burden of managing recipes in a system in which multiple modules are selectively used. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating a schematic configuration of a wafer processing system. [Figure 2] FIG. 2 is a front view illustrating a schematic configuration of the wafer processing system. [Figure 3] FIG. 3 is a diagram illustrating an example of a block diagram of the control device. [Figure 4] FIG. 4 is a diagram showing an example of a module configuration of a processing station. [Figure 5] FIG. 5 is a diagram showing an example of a module as a liquid processing unit. [Figure 6] FIG. 6 is a diagram illustrating an example of a measurement unit. [Figure 7]FIG. 7 is a diagram showing an example of the correspondence between recipes. [Figure 8] Fig. 8(a) is a diagram showing a schematic view of the film thickness distribution of the processed film. Fig. 8(b) is a diagram for explaining the suppression of the difference between the average film thickness and the film thickness distribution. Fig. 8(c) is a diagram for explaining the keeping of the average film thickness constant and bringing the film thickness distribution closer to the target. [Figure 9] FIG. 9 is a diagram illustrating another example of a block diagram of the control device. [Figure 10] FIG. 10 is a diagram illustrating an example of a hardware configuration of the control device. [Figure 11] FIG. 11 is a diagram showing a series of processing flows for a method of suppressing differences in film thickness distribution among a plurality of modules and controlling the average film thickness of each module to a target value. [Figure 12] FIG. 12 is a diagram showing a series of processing flows for changing the offset value by the manual change unit. [Figure 13] FIG. 13 is a diagram illustrating an example of the offset table list. [Figure 14] FIG. 14 is a diagram illustrating an example of an input interface. [Figure 15] FIG. 15 is a diagram illustrating an example of the change history. [Figure 16] FIG. 16 is a diagram illustrating an example of the second input interface. [Figure 17] FIG. 17 is a diagram showing a series of processing flows for generating a processing recipe when the substrate processing control unit performs liquid processing. [Figure 18] FIG. 18 is a diagram illustrating another example of a block diagram of the control device. [Figure 19] FIG. 19 is a diagram illustrating an example of a monitoring interface. [Figure 20] FIG. 20 is a diagram showing another example of a monitoring interface. [Figure 21] FIG. 21 is a diagram showing another example of the offset table list. [Figure 22] FIG. 22 is a diagram showing a series of processing flows of a method for monitoring a plurality of offset values. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a recipe setting device according to this embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description will be omitted.

[0011] [Wafer processing system] First, the configuration of a wafer processing system according to this embodiment will be described. Figures 1 and 2 are a plan view and a front view, respectively, that schematically illustrate the configuration of a wafer processing system 1. In this embodiment, the wafer processing system 1 will be described as an example of a photolithography processing system that performs a resist film forming process and a development process on a wafer (substrate) W.

[0012] As shown in FIG. 1, the wafer processing system 1 includes a cassette station 2 into which a cassette C containing a plurality of wafers W is loaded and unloaded, and a processing station 3 equipped with a plurality of various processing devices that perform predetermined processing on the wafers W. The processing station 3 is an example of a substrate processing device. The wafer processing system 1 has a configuration in which the cassette station 2, the processing station 3, and an interface station 4 that transfers the wafers W between them and an exposure device (not shown) adjacent to the opposite side of the processing station 3 are integrally connected. Note that, as shown in FIG. 1, two processing stations 3 are installed between the cassette station 2 and the interface station 4, but one, or three or more processing stations 3 may be installed.

[0013] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. The cassette station 2 uses the wafer transfer device 22 or 23 to transfer wafers W between the cassette C placed on the mounting table 12 and the processing station 3. To this end, the wafer transfer devices 22 and 23 are each provided with drive mechanisms for directions such as the X direction, Y direction, up and down direction, and around the vertical axis (θ direction) as needed, and may also be provided with drive mechanisms for all directions.

[0014] At least one of wafer transfer devices 22 and 23 is capable of transferring wafers W between cassettes C and processing station 3, and is also capable of transferring wafers W to and from processing station 3. Note that the transfer of wafers W to and from processing station 3 refers to, for example, transferring wafers W to and from third block G3, which includes a transfer device accessible by wafer transfer device 33 in processing station 3, which will be described later. Third block G3 may include multiple transfer devices (not shown) arranged vertically.

[0015] The cassette station 2 may include an inspection device (not shown) that inspects the wafer W at a position accessible to either the wafer transfer device 22 or 23.

[0016] The processing station 3 is an example of a substrate processing apparatus. The processing station 3 includes multiple blocks, e.g., three blocks: a first block G1, a second block G2, and a fourth block G4. As shown in FIG. 2, multiple layers 31 each including a first block G1 and a second block G2 are stacked vertically. For example, the first block G1 is provided on the front side of the processing station 3 (the negative X-direction side in FIG. 1), and the second block G2 is provided on the rear side of the processing station 3 (the positive X-direction side in FIG. 1). The fourth block G4 is provided on the interface station 4 side of the processing station 3 (the positive Y-direction side in FIG. 1) or at a connection point with another adjacent processing station 3. The fourth block G4 may include multiple transfer devices arranged vertically. The aforementioned third block G3 may also be provided within the processing station 3.

[0017] The first block G1 is equipped with a plurality of processing devices, such as a patterning film forming device and a development processing device, both of which are not shown. The patterning film forming device may include, for example, a resist film forming device and an anti-reflection film forming device. For example, a plurality of processing devices are arranged horizontally. The number, arrangement, and type of these processing devices can be selected arbitrarily.

[0018] In these patterning film forming apparatuses and developing treatment apparatuses, for example, a predetermined processing liquid or a predetermined gas is supplied onto the wafer W. In this manner, the patterning film forming apparatus forms a resist film used as a mask when forming a pattern on an underlying film, or forms an anti-reflection film for efficiently performing a light irradiation process, such as an exposure process. Meanwhile, in the developing treatment apparatus, a portion of the exposed resist film is removed to form the uneven shape that serves as the mask.

[0019] For example, in the second block G2, heat treatment devices (not shown) that perform heat treatment such as heating and cooling of the wafer W are arranged in a vertical and horizontal direction. Also, in the second block G2, although neither is shown, a hydrophobization treatment device that performs a hydrophobization treatment to improve the adhesion of the resist liquid to the wafer W, and a peripheral exposure device that exposes the peripheral portion of the wafer W are arranged in a vertical and horizontal direction (Z direction in FIG. 2). The number and arrangement of these heat treatment devices, hydrophobization treatment devices, and peripheral exposure devices can also be selected as desired.

[0020] 1, a wafer transfer area 32 is formed in an area sandwiched between a first block G1 and a second block G2 in a plan view. In the wafer transfer area 32, for example, a wafer transfer device 33 is disposed.

[0021] The wafer transfer device 33 has a transfer arm that is movable in, for example, the X direction, Y direction, θ direction, and up and down direction. The wafer transfer device 33 moves within the wafer transfer area 32 and can transfer the wafer W to predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. When there are multiple processing stations 3 as shown in FIG. 1, the wafer transfer device 33 provided in the processing station 3 located on the interface station 4 side can transfer the wafer W to predetermined devices in the first block G1, second block G2, fourth block G4, and also in the fifth block G5 described below.

[0022] A plurality of wafer transfer devices 33 are arranged, for example, one above the other. One wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of the upper layers 31 among the multiple layers 31 stacked one above the other (see FIG. 2). Another wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of the multiple layers 31 located below the layers 31. A plurality of wafer transfer areas 32 are provided to enable such transfer of wafers W. Note that the number of wafer transfer devices 33 and the number of layers 31 corresponding to one wafer transfer device 33 can be selected arbitrarily, such as by providing a wafer transfer device 33 for each layer 31.

[0023] The wafer transfer area 32, the first block G1, or the second block G2 may also include a shuttle transfer device (not shown). The shuttle transfer device linearly transfers the wafer W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0024] The interface station 4 is provided with a fifth block G5 equipped with a plurality of transfer devices, and wafer transfer devices 41 and 42. The interface station 4 uses the wafer transfer device 41 or 42 to transfer the wafer W between the fifth block G5, where the wafer W is transferred by the wafer transfer device 33, and the exposure device. To this end, the wafer transfer devices 41 and 42 are each provided with drive mechanisms for directions such as the X direction, Y direction, up / down direction, and around the vertical axis (θ direction) as needed, and may also be provided with drive mechanisms for all directions. At least one of the wafer transfer devices 41 and 42 can support the wafer W and transfer the wafer W between the transfer device in the fifth block G5 and the exposure device.

[0025] A cleaning device for cleaning the surface of the wafer W and the aforementioned peripheral exposure device may be provided in the interface station 4 at a position accessible to either of the wafer transfer devices 41 and 42 .

[0026] As described above, the inspection device may be provided in the cassette station 2, but it may also be provided in the processing station 3 and the interface station 4 at a position accessible by any of the transport arms (33, 41, 42 in Figure 1 or Figure 2) provided inside each station.

[0027] The wafer processing system 1 described above is provided with a control device 100. The control device 100 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the various processing devices and transport devices described above to realize wafer processing in the wafer processing system 1. The program may be recorded on a computer-readable storage medium and installed into the control device 100 from the storage medium.

[0028] [Wafer Processing System Operation] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0029] First, a cassette C containing a plurality of wafers W is carried into cassette station 2 of wafer processing system 1 and placed on cassette mounting table 21. Next, each wafer W in cassette C is sequentially removed by wafer transfer device 22 or 23 and transferred to a transfer device in third block G3.

[0030] The wafer W transferred to the transfer device in the third block G3 is supported by the wafer transfer device 33 and transferred to the hydrophobization treatment device provided in the second block G2, where hydrophobization treatment is performed. Next, the wafer W is transferred by the wafer transfer device 33 to the resist film forming device, where a resist film is formed on the wafer W. The wafer W is then transferred to the heat treatment device, where it is pre-baked, and then transferred to the transfer device in the fifth block G5. Note that, when there are multiple processing stations 3 as shown in FIGS. 1 and 2, the wafer W is temporarily placed in the transfer device in the fourth block G4 before being transferred to the transfer device in the fifth block G5, and then transferred between the multiple wafer transfer devices 33. Furthermore, the wafer W may be transferred by the wafer transfer device 33 to the peripheral exposure device, where the peripheral portion of the wafer W is exposed to light, as necessary.

[0031] The wafer W transferred to the delivery device in the fifth block G5 is transferred to the exposure device by wafer transfer devices 41 and 42, and is subjected to exposure processing with a predetermined pattern. Note that the wafer W may be cleaned by a cleaning device before the exposure processing.

[0032] The exposed wafer W is transferred to a transfer device in the fifth block G5 by wafer transfer devices 41 and 42. Thereafter, the wafer W is transferred to a heat treatment device by wafer transfer device 33, where it is subjected to post-exposure baking.

[0033] The wafer W that has been subjected to post-exposure baking is transferred by the wafer transfer device 33 to a developing treatment device and developed. After development is completed, the wafer W is transferred by the wafer transfer device 33 to a heat treatment device 40 and subjected to post-baking.

[0034] Thereafter, the wafer W is transferred by the wafer transfer device 33 to the delivery device in the third block G3, and then transferred by the wafer transfer device 22 or 23 in the cassette station 2 to the cassette C on the predetermined cassette mounting table 21. In this way, a series of photolithography steps is completed.

[0035] It should be noted that the wafer processing system of the present disclosure is not limited to the configuration and operation described above. For example, in the above embodiment, the wafer W is transferred between the interface station 4 and the exposure apparatus, but it does not have to be directly connected to the exposure apparatus. In that case, for example, the wafer W is transferred from the cassette station 2 to the processing station 3, where it is subjected to the necessary processing, and then transferred back to the cassette station 2 for removal to the outside. Furthermore, unnecessary processing equipment listed above may not be provided, or processing may not be performed in that equipment.

[0036] The specific configuration of the substrate processing apparatus is not limited to the processing station 3. The substrate processing apparatus may have any configuration as long as it includes a processing apparatus that performs photolithography processing on a wafer W and a control unit 10 that can control the processing apparatus.

[0037] [Recipe setting device overview] The processing station 3 described above has a plurality of modules. For example, the processing station 3 includes, as its plurality of modules, a plurality of liquid processing modules (e.g., the above-mentioned "resist film forming apparatus") that perform liquid processing in the first block G1. The processing station 3 may also include, as its plurality of modules, a plurality of heat processing modules (e.g., the above-mentioned "heat processing apparatus") that perform heat processing in the second block G2. The substrate processing in each module is performed based on a predetermined processing recipe. Here, as the number of modules increases, it becomes necessary to manage a corresponding number of processing recipes. The processing recipe for each module includes many adjustment items. Editing each processing recipe is a heavy burden for the user and may lead to errors such as selecting an item other than the item to be adjusted.

[0038] Therefore, as shown in FIG. 3 , the control device 100 includes a recipe setting device 130. The recipe setting device 130 sets and changes the process recipes to be executed in each module. The recipe setting device 130 stores a reference recipe that represents substrate processing conditions. The recipe setting device 130 also stores an offset table containing multiple offset values ​​corresponding to multiple modules, each associated with the reference recipe. The recipe setting device 130 extracts an offset value corresponding to a selected module from the multiple offset values ​​and generates a process recipe to be executed by the selected module based on the reference recipe and the extracted offset value. The recipe setting device 130 organizes multiple offset values ​​corresponding to multiple modules in an offset table for items in the reference recipe that require adjustment for each module. The extraction of offset values ​​and the generation of a process recipe based on the extracted offset values ​​and the reference recipe are performed for each module. This allows the process recipes for each module to be essentially managed by simply editing the offset table collectively, without having to open each recipe and search for the items.

[0039] The above configuration can be applied to various stages of substrate processing, but as an example, an application to a film formation process (for example, a resist film formation process) using a plurality of liquid processing modules will be shown.

[0040] [Module configuration] Fig. 4 is a diagram showing an example of the arrangement of multiple liquid processing modules in processing station 3. In the example of Fig. 4, processing station 3 has two first blocks G11 and G12 that are partitioned from each other. The first first block G11 includes four modules, module 111 to module 114. The second first block G12 includes four modules, module 121 to module 124. In the following explanation, the multiple modules will be described as being composed of modules 111 to 124.

[0041] Each of the multiple modules 111 to 124 may be connected to one or more supply sources of a processing medium. The processing medium is a medium that is temporarily supplied to the wafer W to promote processing. The processing medium is, for example, a processing liquid, but it may also be a processing gas. In the example of FIG. 4, each of the multiple modules 111 to 124 is connected to one of four supply sources (multiple supply sources). For example, modules 111 and 112 are connected to a common supply source 62A, and the processing liquid is supplied to modules 111 and 112 from the supply source 62A. Modules 113 and 114 are connected to a common supply source 62B, and the processing liquid is supplied to modules 113 and 114 from the supply source 62B. Modules 121 and 122 are connected to a common supply source 62C, and the processing liquid is supplied to modules 121 and 122 from the supply source 62C. Modules 123 and 124 are connected to a common supply source 62D, and the processing liquid is supplied to modules 123 and 124 from the supply source 62D.

[0042] [Liquid treatment module] Next, an example of the configuration of a liquid processing module will be described. Since modules 111 to 124 have a common configuration, the configuration of module 111 will be illustrated as a representative example. FIG. 5 is a diagram showing an example of the configuration of module 111. FIG. 5 shows a state in which a processing film AF is formed on a wafer W. As shown in FIG. 5, module 111 has a nozzle 111a, a nozzle driver 111b, a holder 111c, a shaft 111d, and a rotation driver 111e. Nozzle 111a is connected to pump 63 and supply source 62A via an on-off valve 64. Like supply source 62A, pump 63 and on-off valve 64 may be common to multiple modules. For example, modules 111 and 112 may be connected to a common pump 63 and on-off valve 64.

[0043] The holder 111c (support) supports the wafer W. The holder 111c supports, for example, the center of the wafer W that is placed horizontally with its surface Wa facing up, and holds the wafer W by vacuum suction or the like. The upper surface of the holder 111c (the surface that supports the wafer W) may be circular when viewed from above, and may have a radius that is approximately 1 / 6 to 1 / 2 times the radius of the wafer W. A rotation driver 111e is connected to the lower part of the holder 111c via a shaft 111d.

[0044] The rotation driver 111e is an actuator including a power source such as an electric motor, and rotates the holder 111c around the vertical axis Ax. When the holder 111c is rotated by the rotation driver 111e, the wafer W held (supported) by the holder 111c rotates. The holder 111c may hold the wafer W so that the center of the wafer W substantially coincides with the axis Ax.

[0045] The nozzle 111a discharges a processing liquid onto the surface Wa of the wafer W held by the holder 111c. For example, the nozzle 111a is disposed above the wafer W (vertically above the center of the wafer W) and discharges the processing liquid downward. The processing liquid is, for example, a solution (resist) for forming a resist film. The supply source 62A supplies the processing liquid to the nozzle 111a. Note that a pump 63 for adjusting the supply amount of the processing liquid may be provided between the supply source 62A and the nozzle 111a. The pump 63 pressurizes the processing liquid in the flow path, and the processing liquid can be discharged from the nozzle 111a.

[0046] The on-off valve 64 is provided in the supply path between the nozzle 111a and the supply source 62A. The on-off valve 64 switches the open / close state of the supply path. The nozzle driver 111b moves the nozzle 111a between a discharge position above the wafer W and a retracted position away from the discharge position. The discharge position is, for example, a position vertically above the center of rotation of the wafer W (a position on the axis Ax). The standby position is, for example, set at a position outside the periphery of the wafer W.

[0047] [Measurement Module] The processing station 3 may further include a measurement unit that acquires information related to the thickness of the film formed by each of the modules 111 to 124. The measurement unit may be provided as a plurality of measurement units corresponding to each of the plurality of modules 111 to 124, or as a single measurement unit shared by the plurality of modules 111 to 124. Fig. 6 is a diagram showing an example of the measurement unit.

[0048] 6, the measurement unit 70 functions as a measurement section that performs film thickness measurement. Specifically, the measurement unit 70 includes a housing 71, a measurement holder 72, a linear drive section 73, and a spectroscopic measurement section 74. The portion of the measurement holder 72 on which the wafer W is placed may be rotatable relative to the housing 71. The axis of rotation in this case may be the center of the wafer W held by the measurement holder 72. In this case, the wafer W can be rotated by rotating the upper part of the measurement holder 72. The linear drive section 73 uses, for example, an electric motor as a power source and moves the measurement holder 72 along a horizontal, linear path.

[0049] The spectroscopic measurement unit 74 has the function of receiving light from the wafer W, dispersing the light, and acquiring a spectrum. The spectroscopic measurement unit 74 includes an incident unit 75 that receives the light from the wafer W, a waveguide 76 that guides the light incident on the incident unit 75, a spectrometer 77 that disperses the light guided by the waveguide 76 to acquire a spectrum, and a light source 78. The incident unit 75 is configured to receive light from the center of the wafer W when the wafer W held by the measurement holder 72 moves as driven by the linear drive unit 73. That is, the incident unit 75 is provided at a position corresponding to the path of movement of the center of the measurement holder 72, which moves as driven by the linear drive unit 73. The incident unit 75 is attached so that when the wafer W moves as the measurement holder 72 moves, the incident unit 75 moves relative to the surface of the wafer W along the radial direction of the wafer W. This allows the spectroscopic measurement unit 74 to acquire a spectrum at each position along the radial direction of the wafer W, including the center of the wafer W. The waveguide 76 is configured, for example, by an optical fiber. The spectrometer 77 separates the incident light to obtain a spectrum containing intensity information corresponding to each wavelength. The light source 78 irradiates illumination light downward. As a result, the light reflected by the wafer W passes through the incident portion 75 and the waveguide 76 and enters the spectrometer 77.

[0050] The spectroscopic data acquired by the spectrometer 77 is sent to the control device 100. The control device 100 can estimate the thickness of the film on the surface of the wafer W based on the spectroscopic data, and the estimation result is stored in the control device 100 as an inspection result. As a method for estimating the thickness of the film on the surface of the wafer W from the spectroscopic data, for example, a method of creating in advance a model for estimating the relationship between the thickness of the film on the surface of the wafer W and the spectroscopic data can be given. In this case, the film thickness can be estimated by applying the above model to the spectroscopic data obtained from the wafer W whose film thickness is to be estimated. However, the method for estimating the thickness of the film on the surface of the wafer W is not limited to the above.

[0051] [Control device] The above-described control device 100 controls the plurality of modules 111 to 124 so that a film is formed on the surface of the wafer W by supplying a processing liquid. The control device 100 may also control the measurement unit to acquire information related to the thickness of the film formed by the modules 111 to 124.

[0052] The control device 100 constitutes at least a part of the recipe setting device 130. For example, the control device 100 is configured to store a reference recipe, store an offset table including a plurality of offset values ​​in association with the reference recipe, select one module from the plurality of modules 111 to 124, extract an offset value corresponding to the selected module from the plurality of offset values, and generate a process recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

[0053] Referring again to FIG. 3, FIG. 3 is a block diagram showing the functional configuration of the control device 100. As shown in FIG. 3, the control device 100 has, for example, a substrate processing control unit 110 and a film thickness calculation unit 120 as functional components (hereinafter referred to as "functional modules"). The control device 100 also has, as components of a recipe setting device 130, a recipe storage unit 131, an offset storage unit 132, a selection unit 133, an offset value extraction unit 134, and a recipe generation unit 135. The processing performed by these functional modules corresponds to the processing performed by the recipe setting device 130 and also corresponds to the processing performed by the control device 100.

[0054] The substrate processing control unit 110 controls the multiple modules 111 to 124 so that a film is formed on the surface of the wafer W by supplying a processing liquid. For example, the substrate processing control unit 110 causes the modules 111 to 124 to perform liquid processing on the wafer W in accordance with a processing recipe generated by the recipe setting device 130 so that a predetermined film is formed on the surface of the wafer W by supplying a processing liquid.

[0055] The film thickness calculation unit 120 has a function of estimating the film thickness of the processed film based on the measurement results obtained by the measurement unit. For example, the film thickness calculation unit 120 holds a film thickness model that is generated in advance to represent the relationship between the spectroscopic spectrum and the film thickness. The film thickness calculation unit 120 estimates the film thickness based on the spectroscopic spectrum data acquired by the spectroscopic measurement unit 80 and the film thickness model. The method of calculating the film thickness by the film thickness calculation unit 120 can be changed as appropriate depending on the configuration of the measurement unit.

[0056] The recipe storage unit 131 stores a reference recipe that represents conditions for substrate processing. The reference recipe includes parameter settings for one or more control parameters related to substrate processing. The recipe storage unit 131 stores the reference recipe in association with a module. For example, the recipe storage unit 131 stores a reference recipe RP1 (see FIG. 7) for forming the predetermined films on each of the modules 111 to 124 in association with (linked to) the modules 111 to 124. As an example, the reference recipe RP1 includes a "discharge rotation speed" and a "drying rotation speed." The discharge rotation speed (first set value) is a control parameter that represents the rotation speed (e.g., the number of rotations per minute) of the wafer W when discharging the processing liquid onto the wafer W. The drying rotation speed (second set value) is a control parameter that represents the rotation speed of the wafer ZW when drying the liquid film formed on the wafer W by supplying the processing liquid. The discharge rotation speed and the drying rotation speed affect the average film thickness and film thickness distribution within the surface of the wafer W.

[0057] The offset storage unit 132 stores an offset table in association with a reference recipe. The offset table includes offset values ​​corresponding to each of a plurality of modules. The offset values ​​represent, for example, offset amounts (e.g., differences) relative to parameter setting values ​​of control parameters in the reference recipe RP1.

[0058] For example, as shown in FIG. 7, the offset storage unit 132 stores an offset table OT1 in association with a reference recipe RP1. The offset table OT1 includes a plurality of offset values ​​corresponding to the plurality of modules 111 to 124. For example, the offset table OT1 associates identification information of the plurality of modules 111 to 124 with a plurality of offset values. The offset table OT1 includes an offset value for the discharge rotation speed and an offset value for the drying rotation speed corresponding to each of the plurality of modules 111 to 124. For example, in FIG. 7, the parameter setting value for the drying rotation speed is 1379, and the offset value corresponding to module 111 is +11, and the offset value corresponding to module 121 is +1. "+" indicates addition to the parameter setting value, and "-" indicates subtraction from the parameter setting value. The drying rotation speed for module 111 is 1390, which is obtained by adding 11 to 1379. Similarly, the drying rotation speed for module 121 is 1380.

[0059] 3, the selection unit 133 selects one module from the plurality of modules 111 to 124. The selection unit 133 may select one module in response to an input from a user, for example. Alternatively, the selection unit 133 may select one module in accordance with a predetermined processing schedule.

[0060] The offset value extraction unit 134 extracts from the plurality of offset values ​​an offset value corresponding to the module selected by the selection unit 133. For example, the offset value extraction unit 134 extracts, in the offset table OT1, an offset value associated with the identification information of the module selected by the selection unit 133. For example, when the selection unit 133 selects the module 111, the offset value extraction unit 134 extracts "+11" as the offset value for the drying rotation speed.

[0061] The recipe generation unit 135 generates a process recipe to be executed by the selected module based on the reference recipe RP1 and the extracted offset value. The recipe generation unit 135 sets the parameter setting of the process recipe to a value obtained by adding the extracted offset value to the parameter setting of the control parameter in the reference recipe RP1. For example, the recipe generation unit 135 generates a process recipe including a drying rotation speed of 1390, which is obtained by adding +11, which is an offset value corresponding to the module 111, to 1379, which is a parameter setting of the drying rotation speed in the reference recipe RP1. The generated process recipe is output to the substrate process control unit 110. The substrate process control unit 110 performs liquid processing on the wafer W based on the process recipe.

[0062] The control device 100 may further include an offset editing unit 136. The offset editing unit 136 edits the offset table stored in the offset storage unit 132. For example, the offset editing unit 136 changes the offset value of each module in the offset table.

[0063] The offset editing unit 136 may change two or more offset values ​​in the offset table by the same amount. For example, the offset editing unit 136 may change two or more offset values ​​belonging to the same group by the same amount based on a constraint condition. The constraint condition is, for example, a predetermined condition that groups multiple offset values ​​in the offset table OT1 into one or more groups. Here, because the offset values ​​in the constrained group are changed by the same amount, the constraint condition can also be said to be a condition that constrains the amount of change of the offset values.

[0064] The offset editing unit 136 may select a constraint condition from a plurality of predetermined specified constraint conditions, and may change two or more offset values ​​belonging to the same group by the same amount based on the selected constraint condition. For example, the control device 100 may further include a condition storage unit 138. The condition storage unit 138 stores a plurality of default constraint conditions. The offset editing unit 136 selects a constraint condition from the plurality of default constraint conditions stored in the condition storage unit 138. The number of groups varies for each default constraint condition. An example of the default constraint conditions will be described with reference to FIG. 7. The default constraint conditions include a first condition C1, a second condition C2, a third condition C3, and a fourth condition C4. The first condition C1, the second condition C2, the third condition C3, and the fourth condition C4 have increasing degrees of constraint and decreasing numbers of groups, in this order.

[0065] The first condition C1 is a condition for grouping each of the plurality of modules 111 to 124 into an individual group. That is, when the first condition C1 is selected as the constraint condition, the offset value is changed individually for each module.

[0066] The second condition C2 is a condition for grouping two or more modules among the plurality of modules 111 to 124 that are connected to a common supply source 62 into the same group. In the example of FIG. 4, modules 111 and 112 are connected to a common supply source 62A, and modules 113 and 114 are connected to a common supply source 62B. Modules 121 and 122 are connected to a common supply source 62C, and modules 123 and 124 are connected to a common supply source 62D. In this case, when the second condition C2 is selected as the constraint condition, modules 111 and 112 are grouped into the same group, and modules 113 and 114 are grouped into the same group. Modules 121 and 122 are grouped into the same group, and modules 123 and 124 are grouped into the same group. For example, the plurality of modules 111 to 124 are grouped into the following four groups: Group 2-1: Modules 111 and 112 Group 2-2: Modules 113 and 114 Group 2-3: Modules 121 and 122 Group 2-4: Modules 123, 124

[0067] The third condition C3 is a condition that, of the multiple modules 111-124, two or more modules included in the same block in the processing station 3 are grouped together. In the example of Fig. 4, the modules 111-114 included in the first block G11 are grouped together, and the modules 121-124 included in the first block G12 are grouped together. For example, the multiple modules 111-124 are grouped into the following two groups. Group 3-1: Modules 111-114 Group 3-2: Modules 121-124

[0068] The fourth condition C4 is a condition for grouping all of the multiple modules 111 to 124 into the same group. In the example of Fig. 7, the modules 111 to 124 are all in the same group.

[0069] The offset editing unit 136 may further include an offset changing unit 137. The offset changing unit 137 causes each of the multiple modules 111 to 124 to perform processing according to the processing recipe, and changes the offset table based on multiple processing results by the multiple modules 111 to 124 and constraint conditions. For example, the offset changing unit 137 causes the selection unit 133 to sequentially select the multiple modules 111 to 124. In response to the module selection by the selection unit 133, the offset value extraction unit 134 extracts an offset value, and the recipe generation unit 135 generates a processing recipe, and the processing recipe is output to the substrate processing control unit 110. As a result, processing according to the processing recipe is performed, and the film thickness calculation unit 120 estimates a film thickness, as an example of a processing result.

[0070] The offset change unit 137 acquires a plurality of film thickness estimation results as a plurality of processing results by the plurality of modules 111 to 124, and changes the offset table OT1 based on the plurality of processing results by the plurality of modules 111 to 124 and constraint conditions. The offset change unit 137 may repeat the process of causing each of the plurality of modules 111 to 124 to execute processing and changing the offset table OT1 while changing the constraint conditions so as to reduce the number of groups.

[0071] For example, the offset change unit 137 may change the offset table OT1 to reduce the difference between the multiple processing results under a constraint condition (e.g., the first condition C1) that places each of the multiple modules 111 to 124 in a separate group, and may change the offset table OT1 to bring the average of the multiple processing results closer to the target under a constraint condition (e.g., the fourth condition C4) that places all of the multiple modules 111 to 124 in the same group.

[0072] Here, referring to Figure 8, an example of changing the offset value in three of the multiple modules 111-124 will be shown. Figure 8(a) shows the relationship between the film thickness distributions FD1-FD3 on wafers W after processing in different modules and the target value FD0. Because the film thickness distributions FD1-FD3 have different trends, simply changing the offset value so that the average film thickness on each wafer W approaches the target value FD0 may result in differences in the film thickness distribution trends remaining.

[0073] In such a case, the offset change unit 137 first reduces the difference in film thickness distribution among the multiple modules 111-124, as shown in FIG. 8(b). For example, the offset change unit 137 individually changes the offset values ​​of the multiple modules 111-124 under the first condition C1 so that the film thickness distributions FD1-FD3 have the same film thickness average value and in-plane trend. Here, the in-plane trend may be, for example, the in-plane flatness or surface roughness of the film thickness distributions FD1-FD3. Then, under the fourth condition C4, the offset values ​​of the multiple modules 111-124 are changed by the same amount so that the average film thickness of each wafer W becomes the target value FD0 and the target in-plane trend is achieved. The target in-plane trend may be stored in the condition storage unit 138 in advance, or may be set by the user. As a result, as shown in Figure 8(c), while the film thickness distributions FD1 to FD3 are maintained at the same trend, the average film thickness of each wafer W is brought closer to the target value FD0, and the in-plane trends of the film thickness distributions FD1 to FD3 become the target in-plane trends.

[0074] The offset change unit 137 may change the constraint condition from the first condition C1 to the fourth condition C4 via the second condition C2 and the third condition C3 in that order. For example, the offset change unit 137 may change the offset table OT1 under the first condition C1 to reduce the difference between multiple processing results, and then change the first condition C1 to the second condition C2. Under the second condition C2, the offset change unit 137 may change the offset table OT1 to reduce the difference between groups 2-1 to 2-4, and then change the second condition C2 to the third condition C3. Under the third condition C3, the offset change unit 137 may change the offset table OT1 to reduce the difference between groups 3-1 to 3-2, and then change the third condition C3 to the fourth condition C4. Under the fourth condition C4, the offset change unit 137 may change the offset table OT1 to bring the average and in-plane tendency of multiple processing results closer to targets.

[0075] 7, the recipe storage unit 131 may further store a supply source recipe RP2 associated with the plurality of supply sources 62A to 62D. The supply source recipe RP2 includes a timing for stopping the supply of the processing liquid (third set value) and a discharge pressure of the processing liquid (fourth set value). The recipe storage unit 131 may store a separate supply source recipe RP2 for each of the plurality of supply sources 62A to 62D. That is, the recipe storage unit 131 may store a plurality of supply source recipes RP2 corresponding to each of the plurality of supply sources 62A to 62D. The timing for stopping the supply of the processing liquid is, for example, the timing for switching the on-off valve 64 from a state in which the processing liquid is being supplied to the wafer W to a closed state. Switching the on-off valve 64 to a closed state stops the supply of the processing liquid from the nozzle. Both the third set value and the fourth set value affect the film thickness distribution within the surface of the wafer W.

[0076] As shown in FIG. 9 , the offset editing unit 136 may further include a manual change unit 139. The manual change unit 139 changes the offset table OT1 based on user input. The manual change unit 139 may be used, for example, when a user wants to manually change a process recipe due to changes in the external environment. The manual change unit 139 may generate an input interface that displays a list of multiple offset values ​​associated with multiple modules. The input interface may be displayed, for example, by a display unit provided in the control device 100. In this case, the user selects a record for a module to be adjusted from the list of offset values ​​displayed on the input interface and changes the offset value on the input interface. The manual change unit 139 may change the offset table OT1 in response to changes to the multiple offset values ​​on the input interface.

[0077] The recipe setting device 130 further includes a history display unit 140 and a rollback unit 141. The history display unit 140 displays, on the input interface, a history of changes made to the offset table OT1 by the manual change unit 139. The change history includes, for example, a list of multiple change records in chronological order. Each of the multiple change records includes the date and time of the change, the module to be changed, the parameter to be changed, the correction value used for the change, the offset value before the correction, and the offset value after the correction.

[0078] The rollback unit 141 returns the offset table OT1 to the previous state selected in the change history. For example, when a user selects a change record from the change history, the rollback unit 141 changes the parameter to be changed in the module that is the target of the change record to the offset value included in the change record.

[0079] The manual modification unit 139 may be configured to associate one offset table with multiple reference recipes. For example, the manual modification unit 139 may further generate a second input interface that displays a recipe list including the reference recipe RP1 in association with the offset table OT1. The second input interface is displayed, for example, by a display unit. As another reference recipe is added to the recipe list in the second input interface, the manual modification unit 139 associates the other reference recipe with the offset table OT1. The offset table OT1 generated for one reference recipe can also be used for other reference recipes. This reduces the workload for generating the offset table OT1.

[0080] In response to the selection of the offset table OT1, the manual change unit 139 may generate a candidate list including one or more reference recipes that can be added to the recipe list. Then, the manual change unit 139 may add one reference recipe selected from the candidate list to the recipe list as another reference recipe. For example, the user selects a new reference recipe that the user wants to add to the recipe list from the candidate list as the other reference recipe on the second input interface.

[0081] An example of a situation in which the offset table OT1 for one reference recipe can be reused for another reference recipe is when the first reference recipe and the other reference recipe target the same module and include the same control parameters. In particular, when the values ​​of the "same control parameters" in the first reference recipe and the other recipes are identical or similar to each other, the offset table OT1 is likely to be reused. Therefore, the manual modification unit 139 may generate a candidate list including one or more reference recipes whose parameter setting values ​​(item values) of control parameters corresponding to multiple offset values ​​are common to the reference recipe RP1. That is, the manual modification unit 139 may add to the candidate list one or more reference recipes that include parameter setting values ​​common to any of the control parameters included in the reference recipe RP1. For example, when the parameter setting value for the drying rotation speed in the reference recipe RP1 is common to (e.g., identical to) the parameter setting value for the drying rotation speed in one or more reference recipes, the manual modification unit 139 includes the one or more reference recipes in the candidate list. In this case, in one or more reference recipes, the parameter setting values ​​of the control parameters other than the drying rotation speed may be different from those of the reference recipe RP1.

[0082] The control device 100 described above is configured with one or more control computers. FIG. 10 is a diagram showing an example of the hardware configuration of the control device 100. For example, the control device 100 has a circuit 150 shown in FIG. 10. The circuit 150 has one or more processors 151, a memory 152, a storage 153, and an input / output port 154. The storage 153 has a computer-readable storage medium such as a hard disk. The storage medium stores programs for causing the control device 100 to execute a substrate processing method and a film thickness estimation method, which will be described later. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk.

[0083] The memory 152 temporarily stores the programs loaded from the storage medium of the storage 153 and the results of calculations by the processor 151. The processor 151 configures the above-mentioned functional modules by executing the programs in cooperation with the memory 152. The input / output port 154 inputs and outputs electrical signals to and from each part of the processing station 3 in accordance with instructions from the processor 151.

[0084] The control device 100 may be configured with multiple control computers. For example, the substrate processing control unit 110 and the film thickness calculation unit 120 may be configured with one or more control computers, and the recipe setting device 130 may be configured with another computer that can communicate with the one or more control computers. Note that the hardware configuration of the control device 100 is not necessarily limited to one in which each functional module is configured by a program. For example, each functional module of the control device 100 may be configured with a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such logic circuits.

[0085] [Recipe setting procedure] Next, as an example of a recipe setting method, a recipe setting procedure performed by the recipe setting device 130 will be illustrated. This recipe setting procedure includes storing a reference recipe, storing an offset table including a plurality of offset values ​​corresponding to a plurality of modules in association with the reference recipe, selecting one module from the plurality of modules, extracting an offset value corresponding to the selected module from the plurality of offset values, and generating a process recipe to be executed by the selected one module based on the reference recipe and the extracted offset value. The recipe setting procedure illustrated below includes an automatic offset table editing procedure, a manual offset table editing procedure, and a process recipe generation procedure. Each procedure will be illustrated in detail below.

[0086] (Automatic offset table editing procedure) This procedure is executed in a state where an offset table is stored in offset storage unit 132. The offset table stored in offset storage unit 132 may be an initial table in which each of a plurality of offset values ​​is an initial value (for example, zero).

[0087] 11, the recipe setting device 130 first executes step S11. In step S11, the offset change unit 137 calculates the offset sensitivity. The offset sensitivity is information indicating the relationship between each offset value and film thickness in one of the multiple modules 111 to 124. By acquiring the offset sensitivity in advance, it becomes possible to estimate with high accuracy how much each offset value should be changed in order to change the film thickness distribution.

[0088] To understand the relationship between each offset value and film thickness distribution, experimental data is required to understand how the film thickness changes when each offset value is changed in one of the multiple modules 111 to 124. Therefore, first, experimental conditions necessary for calculating the sensitivity of each offset value are identified. Specifically, appropriate experimental conditions may be selected using a known experimental design method or the like, and an experimental condition table may be prepared.

[0089] The offset changing unit 137 sequentially changes the offset value based on the prepared experimental condition table. Each time the offset changing unit 137 changes the offset value, it causes the selecting unit 133 to select one of the modules. In response to the module selection by the selecting unit 133, the offset value extracting unit 134 extracts an offset value, and the recipe generating unit 135 generates a process recipe, and the process recipe is output to the substrate processing control unit 110. As a result, processing is performed according to the process recipe, and the film thickness distribution, as an example of the processing result, is estimated by the film thickness calculating unit 120. Based on the experimental design table obtained in this manner and the film thickness distribution measurement results (experimental results), the offset changing unit 137 obtains offset sensitivities that indicate how each offset value contributes to the film thickness distribution of the processed film.

[0090] From the measurement results of the film thickness distribution, a feature quantity indicating the film thickness distribution can be obtained. As an example, an approximation using Zernike polynomials can be performed to obtain a feature quantity indicating the film thickness distribution, and the coefficients related to each component can be used as the feature quantity.

[0091] The offset change unit 137 calculates the relationship between each offset value and a feature value obtained from the measurement result of the film thickness distribution approximated as a Zernike polynomial. For example, the offset change unit 137 determines how much the weighting coefficients included in the Zernike polynomials change when each offset value is changed by a specific amount, and how much the film thickness distribution changes as a result. This result can be the offset sensitivity.

[0092] Next, the recipe setting device 130 executes step S12. In step S12, the offset change unit 137 acquires the film thickness distribution of the wafer W after processing by each of the multiple modules 111 to 124. For example, the offset change unit sets the offset value for each of the multiple modules 111 to 124 to zero, and then causes the selection unit 133 to sequentially select the multiple modules 111 to 124. In response to the module selection by the selection unit 133, the offset value extraction unit 134 extracts the offset value, and the recipe generation unit 135 generates a process recipe, and the process recipe is output to the substrate processing control unit 110. As a result, processing according to the process recipe is executed, and the film thickness calculation unit 120 estimates a film thickness distribution as an example of a processing result. The offset change unit 137 acquires the estimation result by the film thickness calculation unit 120 as the film thickness distribution of the wafer W after processing by each of the multiple modules 111 to 124.

[0093] In step S13, the offset change unit 137 calculates a correction value (offset value correction value) for reducing the difference in film thickness distribution (hereinafter referred to as "film thickness difference") among the multiple modules 111 to 124 based on the film thickness distribution acquired in step S12 and the offset sensitivity calculated in step S11. For example, the offset change unit 137 calculates the correction value individually for each module based on the first condition C1 described above. For example, the offset change unit 137 sets the correction value for correcting the bias in film thickness distribution as a quantification type I problem and calculates the correction value for each module by solving this problem using a known method.

[0094] In step S14, the offset change unit 137 changes the offset value of each module in the offset table OT1 stored in the offset storage unit 132 by the correction value calculated in step S13. For example, the offset change unit 137 adds the correction value to the offset value of each module.

[0095] In step S15, similarly to step S13, the offset change unit 137 acquires the film thickness distribution of the wafer W after processing by each of the plurality of modules 111 to 124.

[0096] In step S16, it is determined whether the film thickness differences between the modules 111 to 124 acquired by the offset change unit 137 are within the target range. If the film thickness differences between the modules 111 to 124 are not within the target range (step S16-NO), the recipe setting device 130 returns the process to step S13. Thereafter, changing the offset value and checking whether the film thickness differences are within the target range are repeated until the film thickness differences between the modules 111 to 124 are within the target range.

[0097] If the film thickness difference is within the target range (step S16-YES), the recipe setting device 130 executes steps S17 and S18. In step S17, the offset change unit 137 changes the constraint conditions. The offset change unit 137 selects one of the second condition C2 to the fourth condition C4 from the preset constraint conditions stored in the condition storage unit 138. For example, the offset change unit 137 changes the first condition C1 to the fourth condition C4.

[0098] In step S18, the offset change unit 137 determines whether the average film thickness value acquired is within a target range and whether the in-plane trend of each of the modules 111 to 124 has reached the target in-plane trend. Here, the offset change unit 137, for example, calculates the average film thickness of the multiple modules 111 to 124. "Within the target range" may be, for example, a range obtained by adding a predetermined value in both the positive and negative directions to the target value FD0. Whether the target in-plane trend has been reached may be whether 3σ of the difference between the target value of the in-plane trend and the in-plane trend value of each module has reached a reference value. Alternatively, whether the target in-plane trend has been reached may be whether the range from the minimum value to the maximum value of the difference between the target value of the in-plane trend and the in-plane trend value of each module has reached a reference range. Alternatively, whether the target in-plane trend has been reached may be whether 3σ of the in-plane trend value of each module has reached a reference value, or whether the range from the minimum value to the maximum value of the in-plane trend value of each module has reached a reference range.

[0099] If the average film thickness and in-plane tendency are not within the target range (step S18-NO), the recipe setting device 130 executes steps S19, S20, and S21. In step S19, the offset change unit 137 calculates one correction value for each of the modules 111-124 based on the fourth condition C4. For example, the offset change unit 137 calculates a correction value (offset value correction value) for bringing the average film thickness within the target range based on the average film thickness and offset sensitivity. In step S20, the offset change unit 137 adds the same correction value to each of the offset values ​​stored in the offset storage unit 132 to update the offset table OT1. In step S21, similar to step S13, the offset change unit 137 acquires the film thickness value of the wafer W after processing by each of the modules 111-124 (e.g., the average film thickness within the wafer W). Thereafter, the recipe setting device 130 returns the process to step S18. Thereafter, steps S18 to S21 are repeated until the average film thickness falls within the target range. If the average film thickness falls within the target range (step S18-YES), the series of processing steps ends. Note that the recipe setting device 130 does not have to execute step S18. In this case, the recipe setting device 130 may execute steps S19, S20, and S21 regardless of whether the average film thickness and in-plane tendency fall within the target range.

[0100] (Manual editing procedure for offset table) This procedure is a procedure for further editing the offset table edited by the automatic editing procedure based on manual input by the user. For example, this procedure is executed when, due to a change in the external environment or the like, the film thickness difference or the average film thickness no longer falls within the target range even with the edited offset table. According to this procedure, it is also possible to edit the initial table based on manual input by the user without going through the automatic editing procedure.

[0101] 12, the recipe setting device 130 first executes steps S21 and S22. In step S21, the manual change unit 139 waits for a manual edit request to be input by the user. In step S22, the manual change unit 139 displays a list of offset tables on the display unit. FIG. 13 is a diagram showing an example of the offset table list. In the offset table list 81, a plurality of offset tables and reference recipes corresponding to each of the plurality of offset tables are displayed in a list.

[0102] Returning to FIG. 12 , the recipe setting device 130 next executes step S23. In step S23, the manual change unit 139 determines whether any offset table has been selected from the offset table list 81. If an offset table has been selected (step S23—YES), the manual change unit 139 generates an input interface in step S24. FIG. 14 is a diagram illustrating an example of the input interface 82. The example of FIG. 14 illustrates the input interface 82 when the offset table OT1 has been selected in step S23. In the example of FIG. 14 , the input interface 82 includes an offset value list 83. The offset value list 83 includes control parameters, offset correction values, offset values ​​before correction, and offset values ​​after correction, each associated with a plurality of modules 111 to 124. The input interface 82 may include an input unit 84 for constraint conditions. The input unit 84 may include a pull-down menu that allows selection of a plurality of default constraint conditions. The input interface 82 may further include a history call button 85 for displaying a change history.

[0103] Returning to FIG. 12, the recipe setting device 130 then executes step S25. In step S25, it is determined whether or not the constraint conditions have been changed in, for example, the input unit 84. If the constraint conditions have been changed (step S25-YES), the recipe setting device 130 executes step S27. In step S27, the offset change unit 137 changes the constraint conditions for the amount of change in the offset value in accordance with the change in the input unit 84. If the constraint conditions have not been changed (step S25-NO), in step S26, the offset change unit 137 maintains the original constraint conditions.

[0104] After steps S26 and S27, the recipe setting device 130 executes step S28. In step S28, the manual change unit 139 determines whether a new correction value has been input. In response to the input correction value and the constraint conditions, the manual change unit 139 adds the correction value to the current offset value, and stores the resulting offset value in the offset storage unit 132 as the corrected offset value.

[0105] If there is no input for changing the offset value (step S28—NO), the recipe setting device 130 executes step S30. In step S30, the manual change unit 139 determines whether or not the user has performed a history call operation. For example, the manual change unit 139 determines whether or not the user has pressed the history call button 85 in the input interface 82. If the history call has not been received (step S30—NO), the recipe setting device 130 returns the process to step S25. If it is determined in step S30 that a history call operation has been performed, the recipe setting device 130 executes steps S31, S32, and S33. In step S31, the history display unit 140 displays a change history 86 in the input interface 82. FIG. 15 is a diagram showing an example of the change history 86. The change history 86 is displayed, for example, below the offset value list 83 in the input interface 82. In the example of FIG. 15, the change history 86 includes multiple change records 860 in chronological order. Each of the multiple change records 860 includes a change date and time, a module to be changed, a parameter to be changed, a correction value used for the change, an offset value before the correction, and an offset value after the correction.

[0106] 12, in step S32, the rollback unit 141 waits until one of the multiple change records 860 is selected in the change history 86. In step S33, the rollback unit 141 changes the parameter to be changed of the module that is the target of the selected change record to the offset value included in the change record.

[0107] After step S29 or step S33, the recipe setting device 130 executes step S38. In step S38, the manual modification unit 139 updates the modification history 86 based on the modification of the offset value executed in step S29 or step S33. For example, the manual modification unit 139 adds a modification record including the modification content executed in step S29 or step S33 to the modification history 86.

[0108] If an offset table is not selected in step S23 (step S23-NO), the recipe setting device 130 executes step S34. In step S34, the manual change unit 139 determines whether or not a reference recipe is selected in the offset table. If it is determined that a reference recipe is not selected in the offset table (step S33-NO), the recipe setting device 130 returns the process to step S23.

[0109] If it is determined in step S34 that a reference recipe has been selected (step S34-YES), the recipe setting device 130 executes steps S35, S36, and S37. In step S35, the manual change unit 139 generates a second input interface. FIG. 16 is a diagram showing an example of the second input interface 87. In the example of FIG. 16, the second input interface 87 includes a candidate list 88 and a recipe list 89. The recipe list 89 is a list of reference recipes that have already been associated with the offset table OT1. In FIG. 16, the recipe list 89 includes the reference recipe RP1. The candidate list 88 is a list of one or more reference recipes that can be added to the recipe list 89.

[0110] In step S36, the manual change unit 139 waits for a reference recipe to be selected from the candidate list 88. In step S37, the manual change unit 139 associates the reference recipe selected from the candidate list 88 with the offset table as another reference recipe. After executing step S36 or step S37, the recipe setting device 130 may complete the manual editing procedure, or may continue the manual editing procedure until an operation to close the offset table or the like is performed.

[0111] (Processing recipe generation procedure) This procedure is a procedure for generating a processing recipe based on the generated offset table and a reference recipe. As shown in Fig. 17, the recipe setting device 130 executes steps S41, S42, S43, S44, and S45.

[0112] In step S41, the selection unit 133 acquires a process execution command from a process operation instruction unit (not shown) arranged in the control device 100. The execution command includes identification information of the process to be executed. In step S42, the selection unit 133 selects one of the multiple modules 111 to 124 that can execute the instructed process. In step S43, the offset value extraction unit 134 selects an offset table associated with the reference recipe for the instructed process.

[0113] In step S44, offset value extraction unit 134 extracts from offset table OT1 an offset value corresponding to the module selected by selection unit 133. In step S45, recipe generation unit 135 generates a process recipe to be executed by the selected module based on reference recipe RP1 and the extracted offset value. Substrate processing control unit 110 performs liquid processing on wafer W based on the process recipe generated in step S45.

[0114] (Monitoring changes in offset values ​​over time) The offset storage unit 132 may store a plurality of offset values ​​at each of a plurality of time points. For example, every time the offset change unit 137 adds a correction value to each of the plurality of offset values ​​to update the offset table OT1, the offset change unit 137 stores the plurality of corrected offset values ​​in the offset storage unit 132. The offset change unit 137 may update the offset table OT1 when the control device 100 is periodically maintained. In this case, each of the plurality of time points is a time point when the control device 100 is periodically maintained. For example, maintenance of the control device 100 may be performed daily, monthly, or once every few months.

[0115] When the offset storage unit 132 stores a plurality of offset values ​​at each of a plurality of time points, the recipe setting device 130 may further include a monitoring unit 142, as shown in Fig. 18. The monitoring unit 142 may generate a monitoring interface that displays the transition of the plurality of offset values ​​over time, based on the plurality of offset values ​​at each of the plurality of time points. In this case, the monitoring unit 142 may display the transition of the plurality of offset values ​​over time, and the display may be in any form.

[0116] As an example, as shown in FIG. 19 , the monitoring unit 142 generates a monitoring interface 90 that displays a graph showing the transitions of multiple offset values ​​over time. In the example of FIG. 19 , the monitoring unit 142 displays, in the monitoring interface 90, a graph 91 showing the transitions of multiple offset values ​​over time relative to the discharge rotation speed (first set value) and a graph 92 showing the transitions of multiple offset values ​​over time relative to the drying rotation speed (second set value). The discharge rotation speed is, for example, the rotation speed of the wafer W during discharge of the processing liquid from the nozzle 61, and is a value that contributes to the in-plane distribution of the film thickness of the processing liquid. The drying rotation speed is, for example, the rotation speed of the wafer W after the discharge of the processing liquid from the nozzle 61 has stopped, and is a value that contributes to the average film thickness of the processing liquid measured at multiple locations on the wafer W. The horizontal axes of the graphs 91 and 92 represent multiple time points, and in the example of FIG. 19 , specific dates are displayed. The horizontal axis of the graph 91 may be the same as the horizontal axis of the graph 92. The vertical axis of graph 91 represents the rotation speed during discharge, and the vertical axis of graph 92 represents the rotation speed during drying. In the example of Fig. 19, graph 91 and graph 92 are displayed vertically side by side on the monitoring interface 90, but graph 91 and graph 92 may also be displayed horizontally side by side.

[0117] Furthermore, the monitoring unit 142 may generate a monitoring interface 90 that displays a graph 91 including subgraphs 911, 912, and 913, each of which individually indicates a plurality of offset values, at a plurality of time points. The subgraphs 911, 912, and 913 correspond to the plurality of time points, respectively. The horizontal axis of each of the subgraphs 911, 912, and 913 represents any one of the plurality of modules 111 to 124. In the example of FIG. 19, a plurality of modules 111 to 122 are displayed. The vertical axis of each of the subgraphs 911, 912, and 913 represents the offset value relative to the rotation speed during discharge.

[0118] Using the monitoring interface 90 generated by the monitoring unit 142, the user may monitor changes over time in the multiple offset values ​​from graph 91. Furthermore, the user may monitor changes over time in the variations in the multiple offset values ​​among the multiple modules 111 to 122 from subgraph 911, subgraph 912, and subgraph 913. For example, the user may first see from graph 91 that the multiple offset values ​​are increasing from December 6, 2024 to January 6, 2025. Then, the user may see from subgraph 912 and subgraph 913 that the variations in the multiple offset values ​​are increasing, and in particular, that the offset values ​​of module 113 and module 114 are increasing compared to the other modules.

[0119] The monitoring unit 142 may display the graph 91 on the monitoring interface 90 so that the graph 91 can be distinguished from the subgraphs 911, 912, and 913. For example, the monitoring unit 42 may display each subgraph so that there is a gap between the subgraphs 911 and 912, and between the subgraphs 912 and 913. As shown in Fig. 19 , the monitoring unit 42 may display each of the subgraphs 911, 912, and 913 as a line graph, and space the graphs apart.

[0120] The monitoring unit 142 may set at least one of a threshold indicating a maximum value (upper limit value) and a threshold indicating a minimum value (lower limit value) in the monitoring interface 90. The monitoring unit 142 may alert the user to an abnormality when the offset value exceeds the threshold indicating the maximum value or falls below the threshold indicating the minimum value. For example, in the example of FIG. 19, the monitoring unit 142 sets a threshold Th1 indicating a maximum value in the graph 91. In this case, because the offset value of the module 113 and the offset value of the module 114 in the subgraph 913 exceed the threshold Th1, the monitoring unit 142 alerts the user.

[0121] Similarly, the monitoring unit 142 may generate a monitoring interface 90 that displays a graph 92 including subgraphs 921, 922, and 923, each of which individually indicates a plurality of offset values, at a plurality of time points. Subgraphs 921, 922, and 923 are the same as subgraphs 911, 912, and 913, respectively, except that the vertical axis of each subgraph represents the rotation speed during drying. In the example of FIG. 19 , the monitoring unit 142 sets a threshold value Th2 in the graph 92. In this case, for example, the offset value of module 113 and the offset value of module 114 in subgraph 922 exceed the threshold value Th2, and the monitoring unit 142 issues an alert to the user. As an example of an alert, the monitoring unit 142 may highlight the alert on the monitoring interface 90. Alternatively, the monitoring unit 142 may display the alert on an interface separate from the monitoring interface 90. The monitoring unit 142 may issue an alarm sound in addition to or instead of displaying the alert.

[0122] The monitoring unit 142 may generate a monitoring interface that shows the time-varying changes in statistical values ​​of multiple offset values. The statistical values ​​may include at least one of the average, median, and scatter values ​​of the multiple offset values. The scatter value may be a standard deviation or 3σ, which indicates three times the standard deviation, or a scatter range. The scatter range may be, for example, the difference between the smallest and largest offset values ​​among the multiple offset values. The monitoring unit 142 may display multiple statistical values ​​at multiple time points on the monitoring interface. As an example, as shown in FIG. 20 , the monitoring unit 142 generates a monitoring interface 93 that shows the time-varying changes in the average and scatter values ​​of the multiple offset values. The scatter value here refers to the range of multiple offset values ​​at multiple time points. In the example of FIG. 20 , the monitoring unit 142 displays, on the monitoring interface 93, a graph 94 that shows the average and range of multiple offset values ​​versus the rotation speed during dispensing, and a graph 95 that shows the average and range of multiple offset values ​​versus the rotation speed during drying. In the example of FIG. 20, the graph 94 and the graph 95 are displayed side by side on the monitor interface 93, but the graph 94 and the graph 95 may also be displayed side by side on the top and bottom.

[0123] Furthermore, the monitoring unit 142 may generate a monitoring interface 93 that displays a graph 94 including a subgraph 941 that indicates an average value of multiple offset values ​​and a subgraph 942 that indicates a range of multiple offset values. Similarly, the monitoring unit 142 may generate a monitoring interface 93 that displays a graph 95 that includes a subgraph 951 that indicates an average value of multiple offset values ​​and a subgraph 952 that indicates a range of multiple offset values. The subgraphs 941 and 951 represent average values ​​of multiple modules at multiple time points. The subgraphs 942 and 952 represent ranges of multiple modules at multiple time points. The horizontal axis of each subgraph represents multiple time points, and in the example of FIG. 20, specific dates are displayed. The display format of the monitoring interface 93 is not limited to the example of FIG. 20. For example, although the subgraphs 941 and 951 are displayed as line graphs, they may also be displayed as bar graphs.

[0124] The monitoring unit 142 may set at least one of a threshold indicating a maximum value (upper limit) and a threshold indicating a minimum value (lower limit) in the monitoring interface 93. The monitoring unit 142 may alert the user to an abnormality when a statistical value of multiple offset values ​​exceeds a threshold indicating a maximum value or falls below a threshold indicating a minimum value. For example, in the example of FIG. 20 , the monitoring unit 142 sets a threshold Th3 indicating a maximum value in the subgraph 942. In this case, the range in the subgraph 942 as of January 6, 2025 exceeds the threshold Th3, so the monitoring unit 142 alerts the user. In addition, the monitoring unit 142 sets a threshold Th4 indicating a maximum value in the subgraph 951. In this case, the range in the subgraph 951 as of December 6, 2024 exceeds the threshold Th4, so the monitoring unit 142 alerts the user.

[0125] The user may check the time-varying changes in the statistical values ​​of the plurality of offset values ​​on the monitoring interface 93, and then check the time-varying changes in the plurality of offset values ​​on the monitoring interface 90 as detailed data. For example, the offset change unit 137 may display an offset table list 810 including the monitoring interface 93 on the display unit, as shown in FIG. 21 . The offset table list 810 displays a list of the plurality of offset tables, the reference recipes corresponding to each of the plurality of offset tables, and the monitoring interfaces 93 corresponding to each of the plurality of offset tables. Note that the number of sub-graphs displayed on the monitoring interface 93 may be two or more, and the number of statistical values ​​displayed on each sub-graph may be two or more.

[0126] The user may first check the time-varying changes in the statistical values ​​of multiple offset values ​​displayed on the monitoring interface 93 from the offset table list 810. Then, the user may press the detailed data call button 811 to call up the monitoring interface 90 shown in FIG.

[0127] Next, an example of a method for monitoring multiple offset values ​​will be illustrated. This procedure may be performed in the order of steps S51 to S57, as shown in FIG. 22. This procedure may be performed by storing multiple offset values ​​at multiple time points in the offset storage unit 132. First, the monitoring unit 142 generates a monitoring interface that shows changes in statistical values ​​of multiple offset values ​​over time (step S51). As an example, as shown in FIG. 21, the offset change unit 137 may display an offset table list 810 including the monitoring interface 93 on the display unit. Next, the monitoring unit 142 determines whether the statistical values ​​of the multiple offset values ​​are within a threshold range (step S52). For example, in the example of FIG. 20, the monitoring unit 142 sets a threshold Th3 in the subgraph 942. In this case, it is determined whether the range of the multiple offset values ​​at each of multiple time points in the subgraph 942 is within the threshold Th3. If the statistical values ​​are not within the threshold range (step S52: NO), the monitoring unit 142 may alert the user of an abnormality (step S53). Upon receiving the alert, the user may check the detailed data.

[0128] If the statistical value is within the threshold range (step S52: YES) or after alerting the user, the monitoring unit 142 determines whether the user has called up detailed data (step S54). If the detailed data has not been called up (step S54: NO), the monitoring unit 142 again determines whether the statistical value of the multiple offset values ​​is within the threshold range (step S52). On the other hand, if the detailed data has been called up (step S54: YES), the monitoring unit 142 generates a monitoring interface 90 that displays a graph showing the transition of the multiple offset values ​​over time (step S55). As an example, as shown in FIG. 19 , the monitoring unit 142 may cause the display unit to display a graph 91 including sub-graphs 911, 912, and 913 that individually show multiple offset values ​​at multiple time points. At the same time, the monitoring unit 142 may cause the display unit to display a graph 92 including sub-graphs 921, 922, and 923 that individually show multiple offset values ​​at multiple time points on the same monitoring interface 90 as the graph 91.

[0129] Next, the monitoring unit 142 determines whether the multiple offset values ​​are within a threshold range (step S56). For example, in the example of FIG. 19, the monitoring unit 142 sets a threshold Th1 for the graph 91. In this case, the monitoring unit 142 determines whether the multiple offset values ​​in each of the subgraphs 911, 912, and 913 are within the threshold Th1 range. If the multiple offset values ​​are not within the threshold range (step S56: NO), the monitoring unit 142 may alert the user to the abnormality (step S57). In response to the alert, the user may identify the time when the abnormality occurred and the module, and analyze the cause of the abnormality or repair the module. If the multiple offset values ​​are within the threshold range (step S56: YES) or after the user is alerted, the series of monitoring methods ends.

[0130] [Effects of the embodiment] According to the recipe setting device, recipe setting method, and recipe setting program described above, for items in the reference recipe RP1 that require adjustment for each module, multiple offset values ​​corresponding to each of the multiple modules 111-124 are compiled in an offset table OT1. The offset table OT1 is stored in association with the reference recipe RP1, and extraction of offset values ​​and generation of a processing recipe based on the extracted offset values ​​and the reference recipe RP1 are performed for each module. This allows the processing recipe for each module to be managed essentially by the simple task of collectively editing the offset table OT1, without having to open each recipe and search for the item. This reduces the burden of recipe management in a system in which multiple modules 111-124 are selectively used.

[0131] Recipe setting device 130 further includes offset editing unit 136 that changes two or more offset values ​​in offset table OT1 by the same amount. In this case, if two or more offset values ​​can be made common, the two or more offset values ​​can be changed collectively, further reducing the management burden.

[0132] The offset editing unit 136 changes two or more offset values ​​belonging to the same group by the same amount based on a predetermined constraint condition that groups the offset values ​​in the offset table OT1 into one or more groups. In this case, the offset values ​​in the same group can be changed collectively based on the constraint condition, further reducing the burden of recipe management.

[0133] The recipe setting device 130 further includes a condition storage unit 138 that stores a plurality of different predefined constraint conditions. The offset editing unit 136 selects a constraint condition from a plurality of predefined constraint conditions and changes two or more offset values ​​belonging to the same group by the same change amount based on the selected constraint condition. In this case, by changing the constraint condition, it is possible to achieve both the degree of freedom that comes from being able to change multiple offset values ​​individually and the convenience that comes from being able to change two or more offset values ​​collectively. Furthermore, by making it possible to change constraint conditions by selecting from a plurality of predefined constraint conditions, the burden of changing constraint conditions can be reduced.

[0134] The plurality of predetermined constraint conditions include a first condition C1 that groups each of the plurality of modules 111-124 individually; a second condition C2 that groups two or more modules connected to a common processing medium supply source 62A-62D among the plurality of modules 111-124 together; a third condition C3 that groups two or more modules included in the same block among the plurality of modules 111-124 together; and a fourth condition C4 that groups all of the plurality of modules 111-124 together. In this case, the first condition C1 allows for adaptation to situations where the plurality of offset values ​​should be adjusted individually (e.g., situations where there is a large variation in processing results between modules). The second condition C2 allows for adaptation to situations where the plurality of offset values ​​should be adjusted separately for two or more modules connected to a common supply source (e.g., situations where the control parameters are changed in response to a change in the type of processing medium). The third condition C3 allows for adaptation to situations where the plurality of offset values ​​should be adjusted collectively (e.g., situations where there is a variation in processing results between modules on a block-by-block basis). The fourth condition C4 allows adaptation to situations where all offset values ​​should be adjusted collectively (for example, situations where the processing results of each module need to be adjusted to a common value after the variations in the processing results of each module have been almost eliminated). In this way, multiple predetermined constraint conditions allow adaptation to various situations.

[0135] The offset editing unit 136 has an offset changing unit 137 that causes each of the multiple modules 111 to 124 to perform processing according to a processing recipe and changes the offset table OT1 based on the multiple processing results of the multiple modules 111 to 124 and constraint conditions. In this case, by utilizing the constraint conditions and the offset table OT1, it is possible to easily automate the adjustment of the offset table OT1.

[0136] The offset change unit 137 repeatedly causes each of the multiple modules 111-124 to execute processing and changes the offset table OT1 while changing the constraint conditions to reduce the number of groups. In this case, by changing the constraint conditions to reduce the number of groups, it is possible to gradually reduce the individual variations in each module and adjust the average processing results of the multiple modules 111-124.

[0137] The offset change unit 137 changes the offset table OT1 to reduce the difference between the multiple processing results under the constraint (first condition C1) that groups each of the multiple modules 111-124 into a separate group, and changes the offset table OT1 to bring the average of the multiple processing results closer to a target under the constraint that groups all of the multiple modules 111-124 into the same group. By more clearly separating the stage of reducing the individual variations among the multiple modules 111-124 from the stage of adjusting the average processing result of the multiple modules 111-124, the offset table OT1 can be adjusted more efficiently.

[0138] The offset editing unit 136 has a manual change unit 139 that changes the offset table OT1 based on user input. In this case, by making the offset table OT1 the target for editing by the user, the burden of recipe management on the user can be reduced.

[0139] The manual change unit 139 generates an input interface 82 that displays a list of multiple offset values ​​in association with each of the multiple modules 111 to 124, and changes the offset table OT1 in response to changes to the multiple offset values ​​in the input interface 82. The list display makes it easy to edit the offset value for each module.

[0140] The recipe setting device 130 further includes a history display unit 140 that displays a change history 86 of the offset table OT1 made by the manual change unit 139 on the input interface 82. Making the change history 86 available for confirmation reduces redundant consideration and further reduces the burden of recipe management on the user.

[0141] The recipe setting device 130 further includes a rollback unit 141 that returns the offset table OT1 to a previous state selected in the change history 86. In this case, the offset table OT1 can be easily returned to the previous state.

[0142] The manual change unit 139 further generates a second input interface 87 that displays a recipe list 89 including the reference recipe RP1 in association with the offset table OT1, and associates the other reference recipe with the offset table OT1 in the second input interface 87 as other reference recipes are added to the recipe list 89. The offset table OT1 associated with the reference recipe RP1 can be easily adapted to other reference recipes. This can reduce the burden of separately adjusting offset tables corresponding to other reference recipes.

[0143] In response to the selection of offset table OT1, the manual change unit 139 generates a candidate list 88 including one or more reference recipes that can be added to the recipe list 89, and adds one reference recipe selected from the candidate list 88 as another reference recipe to the recipe list 89. Other reference recipes can be easily added to the recipe list 89.

[0144] The manual change unit 139 generates a candidate list 88 that includes one or more reference recipes that share the same values ​​as the reference recipe RP1 for items corresponding to multiple offset values. Since the candidate list 88 includes one or more reference recipes that are likely to be applicable to the offset table, other reference recipes can be added to the recipe list more easily.

[0145] Each of the plurality of modules 111 to 124 includes a rotary holder 50 that holds and rotates a wafer W, and a nozzle 61 that discharges a processing liquid onto the wafer W held by the rotary holder 50. In this case, the burden of recipe management can be reduced in liquid processing that requires delicate recipe adjustment.

[0146] The reference recipe RP1 includes a first set value representing the rotation speed of the wafer W while the processing liquid is being discharged from the nozzle 61, and a second set value representing the rotation speed of the wafer W after the discharge of the processing liquid from the nozzle 61 has stopped, and the offset table OT1 includes an offset value for the first set value and an offset value for the second set value corresponding to each of the multiple modules 111 to 124. In this case, by combining the offset values ​​for the first set value and the offset values ​​for the second set value, which allow for easy adjustment of the film thickness individually, in the offset table OT1, it is possible to facilitate adjustment of the processing recipe based on the film thickness.

[0147] Each of the multiple modules 111-124 is connected to one of one or more supply sources 62 of the processing liquid, and the recipe storage unit 131 further stores a supply source recipe RP2 including a third set value indicating the timing for stopping the supply of the processing liquid from one of the one or more supply sources 62 and a fourth set value indicating the discharge pressure of the processing liquid from one of the one or more supply sources 62. In this case, the supply timing and discharge pressure of the processing liquid are parameters that contribute to the film thickness, and adjusting these parameters allows for more precise adjustment of the film thickness. Furthermore, by storing the supply source recipe RP2 separately from the reference recipe RP1 and the offset table OT1, recipe management can be performed with a higher degree of freedom, for example, by adjusting the recipe for each supply source separately from adjustments for each module.

[0148] Recipe setting device 130 includes a plurality of supply sources 62A to 62D as one or more supply sources 62, and recipe storage unit 131 stores a supply source recipe RP2 corresponding to each of the plurality of supply sources 62A to 62D. In this case, for supply source 62, the recipe and offset value are not separated, and instead a supply source recipe RP2 is stored for each supply source 62, thereby matching the operating conditions when checking the operation of each supply source 62 alone and when processing a wafer W, thereby improving the reliability of the check of the operation of each supply source 62 alone.

[0149] The offset storage unit 132 stores a plurality of offset values ​​at a plurality of time points. The recipe setting device 130 further includes a monitoring unit 142 that generates a monitoring interface 90 that displays changes in the plurality of offset values ​​over time, based on the plurality of offset values ​​at a plurality of time points. In this case, even if adjustment of the offset values ​​does not result in any change in the processing results, an abnormality or the like in the substrate processing apparatus can be detected early based on the change in the offset values ​​over time.

[0150] The monitoring unit 142 generates a monitoring interface 90 that displays graphs 91 and 92 that show the transitions of the multiple offset values ​​over time. In this case, the visibility of the changes over time of the multiple offset values ​​can be improved.

[0151] The monitoring unit 142 generates a monitoring interface 90 that displays a graph 91 including sub-graphs 911-913 that individually indicate a plurality of offset values ​​at a plurality of time points, and a graph 92 including sub-graphs 921-923 that individually indicate a plurality of offset values ​​at a plurality of time points. In this case, it is possible to improve the visibility of both the changes over time in the plurality of offset values ​​and the changes over time in the variations in the plurality of offset values.

[0152] The monitoring unit 142 generates a monitoring interface 93 that indicates the transition over time of the statistical values ​​of a plurality of offset values. In this case, it is possible to easily grasp the overall trend of change in the plurality of offset values.

[0153] The statistical values ​​include the average or median of the offset values ​​and the variance of the offset values. The monitoring unit 142 generates a monitoring interface 93 that shows the changes over time of the average or median and the variance of the offset values. In this case, it is easy to understand both the changes over time of the offset values ​​and the changes over time of the variance of the offset values.

[0154] Each of the multiple modules 111-124 includes a spin holder 50 that holds and rotates a wafer W and a nozzle 61 that dispenses a processing liquid onto the wafer W held by the spin holder 50. The reference recipe RP1 includes a first set value that represents the rotation speed of the wafer W while the processing liquid is being dispensed from the nozzle 61, and a second set value that represents the rotation speed of the wafer W after the dispensing of the processing liquid from the nozzle 61 has stopped. The offset table OT1 includes an offset value relative to the first set value and an offset value relative to the second set value, corresponding to each of the multiple modules 111-124. The monitoring unit 142 displays, via the monitoring interface 90, both the transitions over time of the multiple offset values ​​relative to the first set value and the transitions over time of the multiple offset values ​​relative to the second set value. In this case, the film thickness can be adjusted by changing the offset value relative to the first set value and the offset value relative to the second set value, respectively. Since the monitoring unit 142 displays both the offset value for the first set value and the offset value for the second set value, the history of the film thickness adjustment results can be grasped at a glance.

[0155] The gist of this disclosure is as follows [1] to

[28] . [1] A recipe setting device comprising: a recipe memory unit that stores a reference recipe representing conditions for substrate processing; an offset memory unit that stores an offset table, the offset table including a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing apparatus, in association with the reference recipe; a selection unit that selects one module from the plurality of modules; an offset value extraction unit that extracts an offset value corresponding to the selected module from the plurality of offset values; and a recipe generation unit that generates a processing recipe to be executed by the selected one module based on the reference recipe and the extracted offset value. [2] The recipe setting device according to [1], further comprising an offset editing unit that changes two or more offset values ​​in the offset table by the same change amount. [3] The recipe setting device described in [2], wherein the offset editing unit changes the two or more offset values ​​belonging to the same group by the same change amount based on a predetermined constraint condition that groups the multiple offset values ​​in the offset table into one or more groups. [4] The recipe setting device according to [3], further comprising a condition storage unit that stores a plurality of mutually different predefined constraint conditions, wherein the offset editing unit selects the constraint condition from the plurality of predefined constraint conditions, and changes the two or more offset values ​​belonging to the same group by the same change amount based on the selected constraint condition. [5] The recipe setting device described in [4], wherein the plurality of predetermined constraint conditions include a first condition for grouping each of the plurality of modules into an individual group, a second condition for grouping two or more modules among the plurality of modules that are connected to a common supply source of processing medium into the same group, a third condition for grouping two or more modules among the plurality of modules that are included in the same block in a substrate processing apparatus into the same group, and a fourth condition for grouping all of the plurality of modules into the same group. [6] The recipe setting device described in any one of [3] to [5], wherein the offset editing unit causes each of the plurality of modules to execute processing according to the processing recipe, and has an offset changing unit that changes the offset table based on a plurality of processing results by the plurality of modules and the constraint conditions. [7] The recipe setting device described in [6], wherein the offset change unit repeats causing each of the plurality of modules to execute processing and changing the offset table while changing the constraint conditions to reduce the number of groups. [8] The recipe setting device described in [6] or [7], wherein the offset change unit changes the offset table to reduce the difference between the plurality of processing results under the constraint condition that each of the plurality of modules is in a separate group, and changes the offset table to bring the average of the plurality of processing results closer to a target under the constraint condition that all of the plurality of modules are in the same group. [9] The recipe setting device according to any one of [2] to [8], wherein the offset editing unit has a manual change unit that changes the offset table based on a user's input.

[10] The recipe setting device described in [9], wherein the manual change unit generates an input interface that displays a list of the plurality of offset values ​​in association with each of the plurality of modules, and changes the offset table in response to changes to the plurality of offset values ​​in the input interface.

[11] The recipe setting device according to

[10] , further comprising a history display unit that displays a history of changes to the offset table made by the manual change unit on the input interface.

[12] The recipe setting device according to

[11] , further comprising a rollback unit that returns the offset table to a previous state selected in the change history.

[13] The recipe setting device described in any one of [9] to

[12] , wherein the manual change unit further generates a second input interface that displays a recipe list including the reference recipe in association with the offset table, and in the second input interface, associates the other reference recipe with the offset table as another reference recipe is added to the recipe list.

[14] The recipe setting device described in

[13] , wherein the manual change unit generates a candidate list including one or more reference recipes that can be added to the recipe list in response to the selection of the offset table, and adds one reference recipe selected from the candidate list to the recipe list as the other reference recipe.

[15] The recipe setting device described in

[14] , wherein the manual change unit generates the candidate list including one or more reference recipes whose values ​​of items corresponding to the plurality of offset values ​​are common to the reference recipe.

[16] The recipe setting device described in any one of [1] to

[15] , wherein each of the plurality of modules includes a rotating holder that holds and rotates the substrate, and a processing liquid nozzle that ejects a processing liquid onto the substrate held by the rotating holder.

[17] The recipe setting device described in

[16] , wherein the reference recipe includes a first set value representing a rotation speed of the substrate while the processing liquid is being ejected from the processing liquid nozzle, and a second set value representing a rotation speed of the substrate after ejection of the processing liquid from the processing liquid nozzle has stopped, and the offset table includes an offset value relative to the first set value and an offset value relative to the second set value corresponding to each of the plurality of modules.

[18] The recipe setting device described in

[17] , wherein each of the plurality of modules is connected to one or more supply sources of the processing liquid, and the recipe memory unit further stores a supply source recipe including a third set value representing the timing for stopping the supply of the processing liquid from one of the one or more supply sources, and a fourth set value representing the discharge pressure of the processing liquid from one of the one or more supply sources.

[19] The recipe setting device according to

[18] , wherein the one or more supply sources include a plurality of supply sources, and the recipe storage unit stores the supply source recipes corresponding to the plurality of supply sources, respectively.

[20] The recipe setting device described in any one of [1] to

[18] , wherein the offset storage unit stores the plurality of offset values ​​at each of a plurality of time points, and the recipe setting device further includes a monitoring unit that generates a monitoring interface that displays changes over time of the plurality of offset values ​​based on the plurality of offset values ​​at each of the plurality of time points.

[21] The recipe setting device according to

[20] , wherein the monitoring unit generates the monitoring interface that displays a graph showing the changes over time of the plurality of offset values.

[22] The recipe setting device described in

[21] , wherein the monitoring unit displays the monitoring interface that displays the graph including sub-graphs that individually show the multiple offset values ​​at each of the multiple time points.

[23] The recipe setting device according to any one of

[20] to

[22] , wherein the monitoring unit generates the monitoring interface that indicates a transition over time of statistical values ​​of the plurality of offset values.

[24] The recipe setting device described in

[23] , wherein the statistical values ​​include an average value of the plurality of offset values ​​and a scatter value of the plurality of offset values, and the monitoring unit generates the monitoring interface that represents the time-dependent changes of the average value and the scatter value.

[25] A recipe setting device described in any one of

[20] to

[24] , wherein each of the plurality of modules includes a spin holder that holds and rotates the substrate, and a processing liquid nozzle that ejects a processing liquid onto the substrate held by the spin holder, the reference recipe includes a first set value that represents a rotation speed of the substrate while the processing liquid is being ejected from the processing liquid nozzle, and a second set value that represents a rotation speed of the substrate after ejection of the processing liquid from the processing liquid nozzle has stopped, the offset table includes an offset value relative to the first set value and an offset value relative to the second set value corresponding to each of the plurality of modules, and the monitoring unit displays, in the monitoring interface, both the changes over time of the plurality of offset values ​​relative to the first set value and the changes over time of the plurality of offset values ​​relative to the second set value.

[26] A recipe setting method comprising: storing a reference recipe representing conditions for substrate processing; storing an offset table including a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing apparatus in association with the reference recipe; selecting one module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; and generating a processing recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

[27] A program causing a computer to execute a recipe setting method, the program comprising: storing a reference recipe representing substrate processing conditions; storing an offset table containing a plurality of offset values ​​corresponding to a plurality of modules of a substrate processing apparatus in association with the reference recipe; selecting one module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; and generating a processing recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

[28]

[27] A computer-readable storage medium storing the program described in

[27] . [Explanation of symbols]

[0156] 50... rotation holding unit, 61... nozzle, 62, 62A, 62B, 62C, 62D... supply source, 82... input interface, 86... change history, 87... second input interface, 88... candidate list, 89... recipe list, 90, 93... monitoring interface, 91, 92... graph, 111, 112, 113, 114, 121, 122, 123, 124... module, 130... recipe setting device, 131... recipe memory unit, 132... offset memory unit, 133... selection unit, 135... recipe Generation unit, 136...offset editing unit, 137...offset change unit, 138...condition memory unit, 139...manual change unit, 140...history display unit, 141...rollback unit, 142...monitoring unit, 911 to 914, 921 to 924...subgraphs, C1...first condition, C2...second condition, C3...third condition, C4...fourth condition, G1, G11, G12...first block, OT1...offset table, RP1, RP9, RP10...reference recipe, RP2...supply source recipe, W...wafer (substrate).

Claims

1. a recipe storage unit that stores a reference recipe representing conditions for substrate processing; an offset storage unit that stores an offset table including a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing apparatus in association with the reference recipe; a selection unit for selecting one module from the plurality of modules; an offset value extracting unit that extracts an offset value corresponding to the selected module from the plurality of offset values; a recipe generating unit that generates a process recipe to be executed by the one selected module based on the reference recipe and the extracted offset value.

2. The recipe setting device according to claim 1 , further comprising an offset editing unit that changes two or more offset values ​​in the offset table by the same change amount.

3. The offset editing unit 3. The recipe setting device according to claim 2, wherein the two or more offset values ​​belonging to the same group are changed by the same change amount based on a predetermined constraint condition that groups the plurality of offset values ​​in the offset table into one or more groups.

4. further comprising a condition storage unit that stores a plurality of mutually different predetermined constraint conditions; 4. The recipe setting device according to claim 3, wherein the offset editing unit selects the constraint condition from the plurality of predetermined constraint conditions, and changes the two or more offset values ​​belonging to the same group by the same change amount based on the selected constraint condition.

5. The plurality of predetermined constraints are: a first condition that groups each of the plurality of modules into a separate group; a second condition for grouping two or more modules connected to a common supply source of processing medium among the plurality of modules into the same group; a third condition that two or more modules included in the same block of the substrate processing apparatus are grouped into the same group among the plurality of modules; The recipe setting device according to claim 4 , further comprising a fourth condition that all of the plurality of modules are grouped into the same group.

6. the offset editing unit causes each of the plurality of modules to execute a process according to the process recipe, and includes an offset changing unit that changes the offset table based on a plurality of process results by the plurality of modules and the constraint condition. The recipe setting device according to any one of claims 3 to 5.

7. The recipe setting device according to claim 6 , wherein the offset change unit repeats causing each of the plurality of modules to execute a process and changing the offset table while changing the constraint condition so as to reduce the number of groups.

8. The offset changing unit modifying the offset table to reduce differences between the processing results under the constraint that each of the plurality of modules is a separate group; 7. The recipe setting device according to claim 6, wherein the offset table is changed so that an average of the plurality of processing results approaches a target under the constraint that all of the plurality of modules are grouped into the same group.

9. 6. The recipe setting device according to claim 2, wherein the offset editing unit includes a manual change unit that changes the offset table based on a user's input.

10. The manual change unit generating an input interface that displays a list of the plurality of offset values ​​in association with each of the plurality of modules; The recipe setting device according to claim 9 , wherein the offset table is changed in response to a change in the plurality of offset values ​​in the input interface.

11. The recipe setting device according to claim 10 , further comprising a history display unit that displays a history of changes to the offset table made by the manual change unit on the input interface.

12. The recipe setting device according to claim 11 , further comprising a rollback unit that returns the offset table to a previous state selected in the change history.

13. The manual change unit further generating a second input interface that displays a recipe list including the reference recipe in association with the offset table; The recipe setting device according to claim 9 , wherein in response to another reference recipe being added to the recipe list in the second input interface, the other reference recipe is associated with the offset table.

14. The manual change unit generating a candidate list including one or more reference recipes that can be added to the recipe list in response to the offset table being selected; The recipe setting device according to claim 13 , wherein one reference recipe selected from the candidate list is added to the recipe list as the other reference recipe.

15. The recipe setting device according to claim 14 , wherein the manual change unit generates the candidate list including the one or more reference recipes that share values ​​of items corresponding to the plurality of offset values ​​with the reference recipe.

16. Each of the plurality of modules a rotation holder that holds and rotates the substrate; 6. The recipe setting device according to claim 1, further comprising: a processing liquid nozzle that ejects a processing liquid onto the substrate held by the rotation holder.

17. The reference recipe is a first set value representing a rotation speed of the substrate during ejection of the processing liquid from the processing liquid nozzle; a second set value representing a rotation speed of the substrate after the discharge of the processing liquid from the processing liquid nozzle has stopped; 17. The recipe setting device according to claim 16, wherein the offset table includes an offset value for the first set value and an offset value for the second set value, for each of the plurality of modules.

18. each of the plurality of modules is connected to one or more sources of processing liquid; The recipe storage unit a third set value representing a timing for stopping supply of the processing liquid from any of the one or more supply sources; and a fourth set value representing a discharge pressure of the processing liquid from any of the one or more sources.

19. The one or more supply sources include a plurality of supply sources; The recipe setting device according to claim 18 , wherein the recipe storage unit stores the supply source recipes corresponding to the plurality of supply sources, respectively.

20. the offset storage unit stores the plurality of offset values ​​at a plurality of time points, 6. The recipe setting device according to claim 1, further comprising a monitoring unit that generates a monitoring interface that displays transitions of the plurality of offset values ​​over time, based on the plurality of offset values ​​at each of the plurality of time points.

21. The recipe setting device according to claim 20 , wherein the monitoring unit generates the monitoring interface to display a graph showing changes over time of the plurality of offset values.

22. The recipe setting device according to claim 21 , wherein the monitoring unit displays the monitoring interface displaying the graph including sub-graphs individually showing the offset values ​​at the plurality of time points.

23. The recipe setting device according to claim 20 , wherein the monitoring unit generates the monitoring interface that represents a transition over time of a statistical value of the plurality of offset values.

24. the statistical value includes an average value of the plurality of offset values ​​and a variance value of the plurality of offset values; The recipe setting device according to claim 23 , wherein the monitoring unit generates the monitoring interface that represents changes over time of the average value and the dispersion value.

25. Each of the plurality of modules a rotation holder that holds and rotates the substrate; a processing liquid nozzle that ejects a processing liquid onto the substrate held by the spin holder, The reference recipe is a first set value representing a rotation speed of the substrate during ejection of the processing liquid from the processing liquid nozzle; a second set value representing a rotation speed of the substrate after the discharge of the processing liquid from the processing liquid nozzle has stopped; the offset table includes an offset value for the first setting value and an offset value for the second setting value corresponding to each of the plurality of modules, 21. The recipe setting device of claim 20, wherein the monitoring unit displays, in the monitoring interface, both a transition over time of the plurality of offset values ​​with respect to the first set value and a transition over time of the plurality of offset values ​​with respect to the second set value.

26. storing a reference recipe representing conditions for substrate processing; storing an offset table including a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing apparatus in association with the reference recipe; selecting a module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; generating a process recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

27. storing a reference recipe representing conditions for substrate processing; storing an offset table including a plurality of offset values ​​corresponding to a plurality of modules of the substrate processing apparatus in association with the reference recipe; selecting a module from the plurality of modules; extracting an offset value corresponding to the selected module from the plurality of offset values; generating a process recipe to be executed by the selected one module based on the reference recipe and the extracted offset value.

28. A computer-readable storage medium storing the program according to claim 27.

Images