Wiring body and display device

Abstract

To provide a wiring board which can enhance flexibility, and a display device.SOLUTION: In a first region E1 of a light transmitting base material 1, a resin layer 7 has a mesh-like through hole 60 penetrating in a thickness direction (Z-axis direction). A conductor layer 5 is arranged in the through hole 60. Thereby, in the first region E1, a mesh-like conductor layer 5 capable of exhibiting electric performance of a wiring body 200 is arranged. On the other hand, the resin layer 7 has a linear groove 70 penetrating through the resin layer 7 in a thickness direction, at a position separated from the mesh-like through hole 60 in a direction (X-axis direction, and Y-axis direction) perpendicular to the thickness direction. The groove 70 penetrates through the resin layer 7 so as to linearly extend, at a position not affecting the performance of the mesh-like conductor layer 5. Therefore, flexibility of the wiring body 200 can be enhanced, and a degree of freedom such as a mounting position of the wiring body 200 can be enhanced.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a wiring body and a display device. [Background technology]

[0002] Conventionally, a wiring body including a substrate, a mesh-shaped conductor pattern provided on the substrate, and a resin layer provided on the substrate has been known (for example, Patent Document 1). Trenches are formed in the resin layer, and conductive lines of the conductor pattern are formed in the trenches. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-78063 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the wiring body as described above may require flexibility depending on the application. If the wiring body does not have sufficient flexibility, the degree of freedom in the mounting position of the wiring body may be reduced.

[0005] Therefore, an object of the present disclosure is to provide a wiring body and a display device that can improve flexibility. [Means for solving the problem]

[0006] A wiring body according to one aspect of the present disclosure comprises a substrate having a first region, a resin layer provided on the substrate including the first region, and a conductor layer, wherein in the first region, the resin layer has a mesh-shaped through hole penetrating in the thickness direction, the conductor layer is disposed within the through hole, and the resin layer has a linear groove penetrating the resin layer in the thickness direction at a position spaced from the mesh-shaped through hole in a direction perpendicular to the thickness direction.

[0007] A display device according to one aspect of the present disclosure includes the wiring body described above. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device that can improve flexibility. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating an embodiment of a conductive film including a wiring body. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 10 is a cross-sectional view showing a conductive film according to a modified example. [Figure 4] 1 is a cross-sectional view showing an embodiment of a display device. [Figure 5] FIG. 2 is a plan view of an antenna including a wiring body. [Figure 6] FIG. [Figure 7] FIG. 10 is a cross-sectional view of a wiring body according to a modified example. [Figure 8] FIG. 10 is a cross-sectional view of a wiring body according to a modified example. [Figure 9] FIG. 10 is a cross-sectional view of a wiring body according to a modified example. [Figure 10] FIG. 10 is a cross-sectional view of a wiring body according to a modified example. [Figure 11] 10A and 10B are diagrams illustrating the pattern of a conductor layer of a wiring body according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0011] FIG. 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . The conductive film 20 includes an antenna 300, and the antenna 300 includes the wiring body 200. The conductive film 20 shown in FIGS. 1 and 2 includes a film-like light-transmitting substrate 1 (substrate), a conductor layer 5 provided on one main surface 1S of the light-transmitting substrate 1, and a resin layer 7 provided on one main surface 1S of the light-transmitting substrate 1. The conductor layer 5 includes a conductor portion 3 that extends in a direction along the main surface 1S of the light-transmitting substrate 1 and includes a portion having a pattern including multiple openings 3a. The resin layer 7 includes an insulating resin portion 7A that fills the openings 3a of the conductor portion 3 and a light-transmitting resin layer 7B that is provided on the outer periphery of the conductor portion 3. In FIG. 2 , the conductor layer 5 is shown in a deformed state, with the width of the conductor portion 3 emphasized. The thickness of each layer is also shown in a deformed state. 1, the conductor layer 5 is formed near one of the short sides of the conductive film 20, but the position where the conductor layer 5 is formed is not particularly limited, and the conductor layer 5 may be formed near the long side.

[0012] The light-transmitting substrate 1 has a degree of light transparency required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate 1 may be 90 to 100%. The haze of the light-transmitting substrate 1 may be 0 to 5%.

[0013] The light-transmitting substrate 1 may be, for example, a transparent resin film, examples of which include films of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI). Alternatively, the light-transmitting substrate 1 may be a glass substrate.

[0014] For example, as shown in FIG. 3 , the light-transmitting substrate 1 may be a laminate having a light-transmitting support film 11, and an intermediate resin layer 12 and an underlayer 13 provided in this order on the support film 11. The support film 11 may be the transparent resin film described above. The underlayer 13 is a layer provided for forming the conductor portion 3 by electroless plating or the like. When the conductor portion 3 is formed by another method, the underlayer 13 does not necessarily have to be provided. The intermediate resin layer 12 does not have to be provided between the support film 11 and the underlayer 13.

[0015] The thickness of the light-transmitting substrate 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.

[0016] The intermediate resin layer 12 can improve the adhesion between the support film 11 and the underlayer 13. If the underlayer 13 is not provided, the intermediate resin layer 12 can be provided between the support film 11 and the light-transmitting resin layer 7B to improve the adhesion between the support film 11 and the light-transmitting resin layer 7B.

[0017] The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is an acrylic resin. An example of the inorganic filler is silica.

[0018] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0019] The underlayer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of the curable resin contained in the curable resin composition include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo polymerization under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0020] The catalyst contained in the underlayer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be one type alone or a combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0021] The catalyst content in the underlayer 13 may be 3 mass% or more, 4 mass% or more, or 5 mass% or more, based on the total amount of the underlayer 13, and may be 50 mass% or less, 40 mass% or less, or 25 mass% or less.

[0022] The thickness of the underlayer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.

[0023] The light-transmitting substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. By providing the protective layer, scratches on the support film 11 are suppressed. The protective layer may be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, or may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0024] The conductor portion 3 constituting the conductor layer 5 includes a portion having a pattern including openings 3a. The pattern including openings 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear portions intersecting each other. The mesh-like pattern may also be a pattern including a plurality of irregularly arranged openings. The conductor portion 3 having a mesh-like pattern can function well as, for example, a radiation conductor and a feed line of the antenna 300. The conductor portion 3 may also have a planar pattern without openings 3a that functions as a terminal and a ground pad portion. Details of the pattern configuration of the conductor portion 3 in the conductor layer 5 will be described later.

[0025] The conductor portion 3 may contain a metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, or may contain copper. The conductor portion 3 may be a metal plating formed by a plating method. The conductor portion 3 may further contain a non-metallic element such as phosphorus, as long as appropriate conductivity is maintained.

[0026] The conductor part 3 may be a laminate composed of multiple layers. The conductor part 3 may also have a blackened layer as a surface layer on the side opposite to the light-transmitting substrate 1. The blackened layer can contribute to improving the visibility of a display device incorporating the conductive film.

[0027] The insulating resin portion 7A is made of a light-transmitting resin and is provided so as to fill the opening 3a of the conductor portion 3, and the insulating resin portion 7A and the conductor portion 3 usually form a flat surface.

[0028] The light-transmitting resin layer 7B is formed of a resin having light transparency. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.

[0029] The difference between the refractive index of the light-transmitting substrate 1 (or the refractive index of the support film constituting the light-transmitting substrate 1) and the refractive index of the light-transmitting resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, or 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflectance spectroscopic film thickness meter. From the viewpoint of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.

[0030] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo a polymerization reaction under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0031] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin portion 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the path length of light passing through the conductive film 20 can be further improved. When the resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B are the same, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed collectively, for example, by forming a pattern from a single curable resin layer using an imprinting method or the like.

[0032] The conductive film 20 can be manufactured by a method including pattern formation using, for example, an imprinting method. One example of a method for manufacturing the conductive film 20 includes preparing a light-transmitting substrate 1 having a support film and, on one main surface of the support film, an intermediate resin layer and a catalyst-containing underlayer. Forming a curable resin layer on the main surface 1S of the light-transmitting substrate 1 facing the underlayer. Forming trenches exposing the underlayer by an imprinting method using a mold with protrusions. Forming conductors 3 filling the trenches by electroless plating, growing metal plating from the underlayer. By curing the curable resin layer with the mold pressed into the curable resin layer, an insulating resin portion 7A having a pattern including openings with the inverse shape of the mold's protrusions and a light-transmitting resin layer 7B are simultaneously formed. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to imprinting; any method, such as photolithography, can be used.

[0033] The conductive film described above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic electroluminescence (EL) display device. FIG. 4 is a cross-sectional view showing an embodiment of a display device incorporating a conductive film. The display device 100 shown in FIG. 4 includes an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device is not limited to the configuration shown in FIG. 4 and can be appropriately modified as needed. For example, the polarizing plate 30 may be provided between the image display unit 10 and the conductive film 20. The image display unit 10 may be, for example, a liquid crystal display unit. The polarizing plate 30 and the cover glass 40 may be those commonly used in display devices. The polarizing plate 30 and the cover glass 40 are not necessarily provided. Light for image display emitted from the image display region 10S of the image display unit 10 passes through a path with a highly uniform optical path length that includes the conductive film 20. This enables a good image display with a high degree of uniformity and suppressed moire.

[0034] Next, the conductor layer 5 and its surrounding structure will be described in more detail with reference to FIG. 5. FIG. 5 is a plan view of an antenna 300 including a wiring body 200. FIG. 5 also shows an enlarged view of a portion of the conductor layer 5. In the following description, XY coordinates are defined relative to a plane parallel to the main surface 1S. The Y-axis direction is a direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to a direction perpendicular to the sides of the conductive film 20. The central side of the conductive film 20 is defined as the positive side in the Y-axis direction, and the outer periphery of the conductive film 20 is defined as the negative side in the Y-axis direction. The X-axis direction is a direction perpendicular to the Y-axis direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to the direction in which the sides of the conductive film 20 extend. One side of the conductive film 20 along which the sides extend is defined as the positive side in the X-axis direction, and the other side is defined as the negative side in the X-axis direction. The direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. The side of the light-transmitting substrate 1 on which the resin layer 7 is provided is defined as the positive side in the Z-axis direction.

[0035] As shown in FIG. 5 , the mesh pattern of the conductor layer 5 includes a plurality of first conductive wires 51 and a plurality of second conductive wires 52. The first conductive wires 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged spaced apart from one another in the X-axis direction. The plurality of first conductive wires 51 are arranged spaced apart at an equal pitch. The second conductive wires 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged spaced apart from one another in the Y-axis direction. The plurality of second conductive wires 52 are arranged spaced apart at an equal pitch. The thickness of the conductive wires 51, 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. The pitch of the conductive wires 51, 52 is also not particularly limited, but may be set to, for example, 100 to 300 μm. Note that the first conductive wire 51 does not have to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not have to be parallel to the X-axis direction as long as it extends in the X-axis direction. When the conductive wires 51 and 52 are not to be distinguished from each other, they may be referred to as conductive wire 50.

[0036] The conductor layer 5 has a radiating element portion 5A and a power feeding portion 5B. The radiating element portion 5A is a region that radiates a signal as an antenna. The radiating element portion 5A has a rectangular shape with two sides parallel to the Y-axis direction and two sides parallel to the X-axis direction. The power feeding portion 5B is a region that feeds power to the radiating element portion 5A. The power feeding portion 5B has a strip shape that extends parallel to the Y-axis direction. The power feeding portion 5B is connected to the negative side of the radiating element portion 5A in the Y-axis direction. The power feeding portion 5B is connected to a terminal not shown.

[0037] Next, the configurations of the resin layer 7 and the conductor layer 5 will be described in more detail with reference to FIG. 6 in addition to FIG. 5 . FIG. 6 is a cross-sectional view of the wiring body 200. Note that, although the terms "upper" and "lower" are used in the following description, this does not limit the orientation of the wiring body 200 during use. The positive side in the Z-axis direction may be referred to as "upper" and the negative side as "lower." As described above, as shown in FIG. 6 , the light-transmitting substrate 1 has a first region E1 and a second region E2. The resin layer 7 is provided on the light-transmitting substrate 1 including the first region E1. The resin layer 7 is provided so as to cover the main surface 1S on the positive side in the Z-axis direction of the light-transmitting substrate 1. The resin layer 7 has an upper surface 7a on the positive side in the Z-axis direction and a lower surface 7b on the negative side. The lower surface 7b on the negative side is provided so as to contact the main surface 1S of the light-transmitting substrate 1.

[0038] In the first region E1, a mesh-shaped through hole 60 is formed penetrating the resin layer 7 in the Z-axis direction (thickness direction). The mesh-shaped through hole 60 extends from the upper surface 7a on the positive side in the Z-axis direction of the resin layer 7 to the lower surface 7b on the negative side. The conductor layer 5 is disposed within the mesh-shaped through hole 60. As shown in FIG. 5 , the mesh-shaped through hole 60 has first through holes 61 in which first conductive wires 51 are disposed and second through holes 62 in which second conductive wires 52 are disposed. The first through holes 61 are disposed at a pitch and width corresponding to the first conductive wires 51 described above. The second through holes 62 are disposed at a pitch and width corresponding to the second conductive wires 52 described above. In other words, the first through holes 61 are linear through holes extending parallel to the Y-axis direction. The multiple first through holes 61 are disposed so as to be spaced apart from each other in the X-axis direction. The multiple first through holes 61 are disposed so as to be spaced apart at equal intervals. The second through holes 62 are linear through holes extending parallel to the X-axis direction. The multiple second through holes 62 are arranged so as to be spaced apart from one another in the Y-axis direction. The multiple second through holes 62 are arranged so as to be spaced apart at an equal pitch. In the first region E1, the mesh-shaped through holes 60 are arranged so as to correspond to the shapes of the radiating element portion 5A and the power feeding portion 5B of the conductor layer 5 in a plan view.

[0039] The second region E2 is a region located around the first region E1. As shown in FIG. 5, the second region E2 is arranged to surround the radiating element portion 5A and the power supply portion 5B (except for some regions) formed in the first region E1. The second region E2 may be arranged to surround (entirely surround) the radiating element portion 5A and the power supply portion 5B. In the second region E2, the resin layer 7 has linear grooves 70 penetrating the resin layer 7 in the Z-axis direction. The grooves 70 extend from the upper surface 7a on the positive side in the Z-axis direction to the lower surface 7b on the negative side. With this configuration, the resin layer 7 has linear grooves 70 penetrating the resin layer 7 in the Z-axis direction at positions spaced from the mesh-shaped through-holes 60 in directions (X-axis direction and Y-axis direction) perpendicular to the Z-axis direction. The linear grooves 70 extend in a predetermined direction in the XY plane. In this embodiment, as shown in FIG. 5 , a plurality of linear first grooves 71 extending in the Y-axis direction and a plurality of linear second grooves 72 extending in the X-axis direction are provided. As a result, the linear grooves 70 are formed in a mesh pattern. The first grooves 71 are straight grooves extending parallel to the Y-axis direction. The plurality of first grooves 71 are arranged so as to be spaced apart from one another in the X-axis direction. The plurality of first grooves 71 are arranged so as to be spaced apart at an equal pitch. The second grooves 72 are straight grooves extending parallel to the X-axis direction. The plurality of second grooves 72 are arranged so as to be spaced apart from one another in the Y-axis direction. The plurality of second grooves 72 are arranged so as to be spaced apart from one another at an equal pitch.

[0040] As described above, the extension direction of the mesh-shaped through holes 60 and the extension direction of the mesh-shaped grooves 70 are parallel to each other when viewed from above. The extension direction of the first through holes 61 and the extension direction of the first grooves 71 are both in the Y-axis direction and are parallel to each other. The extension direction of the second through holes 62 and the extension direction of the second grooves 72 are both in the Y-axis direction and are parallel to each other.

[0041] 5, the through holes 60 in which the conductive wires 51, 52 are disposed are colored gray. In contrast to this, in this embodiment, the mesh-like grooves 70 are hollow. A hollow groove 70 means that no conductive material or resin material is contained in the groove 70. Therefore, grooves 70 in which the conductive wires 51, 52 are not disposed are not colored. In terms of the distribution form of the wiring body 200, even if the groove 70 is hollow, the groove 70 may be filled with an adhesive such as OCA when the wiring body 200 is joined to another member.

[0042] The grooves 70 are formed by providing depressions in a portion of the resin layer 7 covering the light-transmitting substrate 1. In other words, when the main surface 1S of the light-transmitting substrate 1 is exposed and resin walls are interspersed, the spaces between the walls are different from the grooves 70. A gap larger than the thickness of the wall itself is formed between such walls. In this embodiment, the width WD2 of the mesh-like grooves 70 may be smaller than the pitch PT2 of the grooves 70. The width WD1 of the mesh-like through holes 60 may also be smaller than the pitch PT1 of the through holes 60. The pitch PT2 of the grooves 70 is the distance between the centers of adjacent grooves 70. The pitch PT1 of the through holes 60 is the distance between the centers of adjacent through holes 60.

[0043] The mesh-shaped through holes 60 and the mesh-shaped grooves 70 may have the same width and pitch. However, the mesh-shaped through holes 60 and the mesh-shaped grooves 70 may have different widths and pitches. For example, the pitch PT2 of the mesh-shaped grooves 70 may be smaller than the pitch PT1 of the mesh-shaped through holes 60. The width WD1 of the through holes 60 may be set to, for example, 1 to 3 μm, similar to the conductive wires 51 and 52 described above. The pitch PT1 of the through holes 60 may be set to, for example, 100 to 300 μm, similar to the conductive wires 51 and 52 described above. The width WD2 of the grooves 70 is not particularly limited, but may be set to, for example, 1 to 3 μm. In particular, the width of the grooves 70 may be set to 2 μm or more. The pitch PT2 of the grooves 70 is not particularly limited, but may be set to, for example, 100 to 300 μm. Because the through holes 60 and the grooves 70 penetrate the resin layer 7, the depth of the through holes 60 and the grooves 70 is equal to the thickness of the resin layer 7 and may be set to, for example, 1.5 to 5.0 μm. The grooves 70 do not have to be mesh-shaped, as long as they have a linear configuration. For example, it is sufficient to have only one of the first grooves 71 and the second grooves 72. Furthermore, depending on the position of the second region E2, there may be a mixture of areas where only the first grooves 71 exist and areas where only the second grooves 72 exist.

[0044] An example of a method for forming the through holes 60, conductor layer 5, and grooves 70 described above will be described. First, a curable resin is applied to the main surface 1S of the light-transmitting substrate 1, and the curable resin is hardened by heat, light, or the like while being pressed with a mold. This imprints the through holes 60 and grooves 70. Next, electroless Cu plating is performed on the imprinted resin layer 7. Next, electrolytic Cu plating is performed. At this time, power is supplied to the first region E1 having the through holes 60, and power is not supplied to the second region E2 having the grooves 70. This forms the conductive lines 50 in the through holes 60. Thereafter, the conductor remaining in the grooves 70 is removed by etching.

[0045] Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

[0046] The wiring body 200 of this embodiment comprises a light-transmitting substrate 1 (substrate) having a first region E1, a resin layer 7 provided on the light-transmitting substrate 1 including the first region E1, and a conductor layer 5, and in the first region E1, the resin layer 7 has mesh-shaped through holes 60 penetrating in the thickness direction (Z-axis direction), the conductor layer 5 is disposed within the through holes 60, and the resin layer 7 has linear grooves 70 penetrating the resin layer 7 in the thickness direction at positions spaced from the mesh-shaped through holes 60 in directions perpendicular to the thickness direction (X-axis direction and Y-axis direction).

[0047] According to this wiring body 200, in the first region E1 of the light-transmitting substrate 1, the resin layer 7 has mesh-shaped through holes 60 penetrating in the thickness direction (Z-axis direction). The conductor layer 5 is disposed in the through holes 60. As a result, the mesh-shaped conductor layer 5, which allows the electrical performance of the wiring body 200 to be exhibited, is disposed in the first region E1. In contrast, the resin layer 7 has linear grooves 70 penetrating the resin layer 7 in the thickness direction at positions spaced apart from the mesh-shaped through holes 60 in directions (X-axis direction and Y-axis direction) perpendicular to the thickness direction. These grooves 70 penetrate the resin layer 7 in a linear state at positions that do not affect the performance of the mesh-shaped conductor layer 5. This increases the flexibility of the wiring body 200, thereby increasing the degree of freedom in the mounting position of the wiring body 200. For example, when the wiring body 200 is applied to smart glasses or the like, the wiring body 200 can flexibly adapt to the shape of the lenses of the smart glasses or the like. Additionally, the wiring body 200 can be used for applications such as smartphone displays and automobile glass, thereby demonstrating its flexibility.

[0048] The light-transmitting substrate 1 is provided with a resin layer 7 and has a second region E2 located around the first region E1, and the linear grooves 70 may be arranged in the second region E2. In this case, the grooves 70 in the second region E2 can increase the flexibility of the wiring body 200 around the first region E1. Furthermore, even in the case where the mesh openings are large, as in the conductor layer 5 shown in FIG. 11(c) described below, the flexibility can be increased by effectively utilizing the region around the conductor layer 5.

[0049] The linear grooves 70 may be formed in a mesh shape. In this case, the mesh-shaped grooves 70 can increase flexibility in both the X-axis direction and the Y-axis direction.

[0050] The width of the mesh-like grooves 70 may be smaller than the pitch of the grooves 70. In this case, by setting the width of the grooves 70 to be small, the invisibility of the grooves 70 can be increased and the flatness of the surface of the wiring body 200 can be ensured.

[0051] In a plan view, the extending direction of the mesh-shaped through holes 60 and the extending direction of the mesh-shaped grooves 70 may be parallel to each other. In this case, the mesh pattern of the conductor layer 5 of the through holes 60 and the mesh pattern of the grooves 70 look the same, which can improve the invisibility of the mesh pattern.

[0052] The mesh-like through holes and the mesh-like grooves may have the same width and pitch, in which case the mesh pattern of the conductor layer 5 of the through holes 60 and the mesh pattern of the grooves 70 look the same, thereby improving the invisibility of the mesh pattern.

[0053] The pitch of the mesh-like grooves 70 may be smaller than the pitch of the mesh-like through-holes 60. In this case, flexibility can be improved by increasing the density of the grooves 70, which do not have the conductor layer 5 and have little effect on visibility.

[0054] The width of mesh-like groove 70 may be 2 μm or more. In this case, when wiring body 200 is mounted on a device, it becomes easier to fill with adhesive (optically clear adhesive (OCA)), and adhesive strength can be improved.

[0055] The mesh grooves 70 may be hollow, which can improve the invisibility of the grooves 70.

[0056] A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.

[0057] According to the display device 100 described above, the same functions and effects as those of the wiring body 200 described above can be obtained.

[0058] The present disclosure is not limited to the above-described embodiments.

[0059] For example, the configuration shown in Fig. 7 may be employed. Wiring body 200 shown in Fig. 7 has resin 80 arranged in mesh-shaped grooves 70. This resin 80 may have a higher hardness than resin layer 7. The resin 80 may have a lower refractive index than resin layer 7. In this case, it is possible to improve the transmittance at the locations where grooves 70 are formed.

[0060] The configuration shown in FIG. 8 may also be employed. The wiring body 200 shown in FIG. 8 has resin 80 arranged in mesh-shaped grooves 70. The resin 80 also has a resin layer 81 covering the surface of the mesh-shaped conductor layer 5 and the surface of the resin layer 7. In this case, the resin layer 81 can improve the flatness of the surface of the wiring body 200. It can also protect the conductor layer 5 and the resin layer 7. The resin 80 used in FIG. 8 may be the same as the resin 80 used in FIG. 7. For example, if the resin 80 used in FIG. 8 has a higher hardness than the resin layer 7, it can prevent the wiring body 200 from being scratched. Note that the resin layer 7 has grooves 70, ensuring flexibility. In contrast, even if the grooves 70 are filled with high-hardness resin 80 and the surfaces of the mesh-shaped conductor layer 5 and the resin layer 7 are covered, it is possible to prevent scratches while preventing a significant loss of flexibility due to the provision of the grooves 70. Furthermore, the thickness of the mesh-shaped conductor layer 5 and the resin layer 81 disposed on the surface of the resin layer 7 may be thinner than the thickness of the resin layer 7. This makes it possible to obtain the above-mentioned effects of the resin layer 81 while preventing the wiring body 200 from becoming larger and preventing its flexibility from being impaired.

[0061] The configuration shown in FIG. 9 may also be employed. In the wiring body 200 shown in FIG. 9, the light-transmitting substrate 1 is provided with a resin layer 7 and may have a fourth region E4 adjacent to the second region E2. The resin layer 7 extends in the fourth region E4 without any grooves. In this case, a fourth region E4 with high strength and no grooves 70 may be provided adjacent to the second region E2. By partially providing the fourth region E4 with high strength in this way, deflection during mounting of the wiring body 200 is suppressed, enabling stable mounting. Furthermore, because the fourth region E4 with high strength is partially provided, significant loss of flexibility of the wiring body 200 as a whole is suppressed. Furthermore, the pitch of the mesh-like grooves 70 may increase from the second region E2 to the fourth region E4. For example, if the pitch changes abruptly between the second region E2 and the fourth region E4, the grooves in the second region E2 may be more visible at the boundary. In contrast to this, by gradually increasing the pitch, it is possible to suppress abrupt changes at the boundary portions and prevent the grooves 70 from becoming easily visible.

[0062] The configuration shown in FIG. 10 may also be employed. In the wiring body 200 shown in FIG. 10, the light-transmitting substrate 1 may have a fifth region E5 where the resin layer 7 is not provided. The resin layer 7 may be thinner from the second region E2 toward the fifth region E5. In this case, the fifth region E5 does not have the resin layer 7, thereby further enhancing flexibility. Therefore, when the wiring body 200 is folded for mounting, the highly flexible fifth region E5 can be folded for mounting. In the example shown in FIG. 10, if the thickness of the resin layer 7 changes abruptly between the second region E2 and the fifth region E5, the boundary between the second region E2, where the resin layer 7 is provided on the light-transmitting substrate 1, and the fifth region E5 of the light-transmitting substrate 1, where the resin layer 7 is not provided, may become more visible. In response to this, gradually reducing the thickness of the resin layer 7 suppresses abrupt changes near the boundary, thereby preventing the boundary between the second region E2 and the fifth region E5 from becoming more visible.

[0063] The configuration shown in FIG. 11(c) may also be employed. In the wiring body 200 shown in FIG. 11(c), the light-transmitting substrate 1 is provided with a resin layer 7 and has a third region E3 located within an opening in the mesh-shaped conductor layer 5. The linear grooves 70 are arranged in the third region E3. The opening in the conductor layer 5 is a rectangular portion surrounded by a pair of adjacent first conductive wires 51, 51 and a pair of adjacent second conductive wires 52, 52. A pair of linear grooves 70 intersects with another pair of linear grooves 70 perpendicular to the pair of linear grooves 70 within the opening, forming a dummy mesh. In the dummy mesh, each linear groove 70 extends from each corner of the rectangular portion so as to extend beyond both sides. Although the dummy mesh in FIG. 11(c) has only one rectangular portion, it may have two or more rectangular portions. In this case, since the dummy mesh is disposed within the opening of the conductor layer 5, the pitch of the linear grooves 70 constituting the multiple rectangular portions of the dummy mesh is smaller than the pitch of the through holes 60 in which the mesh-shaped conductor layer 5 is disposed. Note that within the opening of the conductor layer 5, each linear groove 70 is disposed so as not to contact the conductor layer 5. For example, as shown in FIG. 11(a), a mesh pattern with a larger pitch as shown in FIG. 11(b) is adopted to increase the transmittance compared to the mesh pattern of the conductor layer 5 in the first region E1. In this case, although the larger pitch increases the transmittance, as shown in the upper diagram of FIG. 11(b), the mesh pattern may become more visible than in the upper diagram of FIG. 11(a). In contrast, by employing the structure shown in FIG. 11(c), grooves 70 that form the dummy mesh are disposed within the opening of the conductor layer 5 of the mesh pattern. In this case, as shown in the upper diagram of FIG. 11(c), the mesh pattern can be made less visible than in FIG. 11(b). 11(c), the transmittance can be increased and the resistance can be adjusted to the same level as that of FIG. 11(b). In the structure shown in FIG. 11(c), the third region E3 is not provided separately from the first region E1, but is included in the first region E1. Specifically, the portion of the first region E1 within the openings of the mesh-shaped conductor layer 5 becomes the third region E3.

[0064] [Form 1] a substrate having a first region; a resin layer provided on the base material including the first region; a conductor layer; In the first region, the resin layer has mesh-shaped through-holes penetrating in a thickness direction, the conductor layer is disposed in the through hole, The resin layer has linear grooves that penetrate the resin layer in the thickness direction at positions spaced apart from the mesh-shaped through holes in a direction perpendicular to the thickness direction. [Form 2] the base material is provided with the resin layer and has a second region located around the first region, The wiring component according to embodiment 1, wherein the linear groove is disposed in the second region. [Form 3] the base material is provided with the resin layer and has a third region located within an opening of the mesh-shaped conductor layer; 3. The wiring component according to embodiment 1 or 2, wherein the linear groove is disposed in the third region. [Form 4] 4. The wiring body according to any one of embodiments 1 to 3, wherein the linear grooves are formed in a mesh pattern. [Form 5] The wiring component according to embodiment 4, wherein the width of the mesh-shaped grooves is smaller than the pitch of the grooves. [Form 6] The wiring body according to embodiment 4 or 5, wherein the extending direction of the mesh-shaped through holes and the extending direction of the mesh-shaped grooves are parallel to each other in plan view. [Form 7] 7. The wiring body according to any one of embodiments 4 to 6, wherein the mesh-like through holes and the mesh-like grooves have the same width and pitch. [Form 8] 8. The wiring body according to any one of embodiments 4 to 7, wherein the pitch of the mesh-like grooves is smaller than the pitch of the mesh-like through-holes. [Form 9] 9. The wiring component according to any one of embodiments 4 to 8, wherein the mesh-shaped grooves have a width of 2 μm or more. [Form 10] 10. The wiring body according to any one of embodiments 4 to 9, wherein the mesh-shaped grooves are hollow. [Form 11] 11. The wiring body according to any one of aspects 4 to 10, further comprising a resin disposed in the mesh-shaped grooves, the resin having a higher hardness than the resin layer. [Form 12] 12. The wiring body according to any one of embodiments 4 to 11, further comprising a resin disposed in the mesh-shaped grooves, the resin having a refractive index lower than that of the resin layer. [Form 13] 13. The wiring body according to any one of embodiments 4 to 12, further comprising a resin disposed in the mesh-shaped grooves, the resin covering a surface of the mesh-shaped conductor layer and a surface of the resin layer. [Form 14] 14. The wiring body according to any one of the embodiments 13, wherein the mesh-shaped conductor layer and the resin disposed on the surface of the resin layer have a thickness smaller than that of the resin layer. [Form 15] the base material is provided with the resin layer and has a fourth region adjacent to the second region, 3. The wiring body according to claim 2, wherein the resin layer extends without having the groove in the fourth region. [Form 16] 16. The wiring component according to embodiment 15, wherein the pitch of the mesh-like grooves increases from the second region toward the fourth region. [Form 17] the substrate has a fifth region in which the resin layer is not provided, 17. The wiring body according to claim 2 or 16, wherein the resin layer has a thickness that decreases from the second region toward the fifth region. [Form 18] A display device comprising the wiring body according to any one of the first to seventeenth aspects. [Explanation of symbols]

[0065] 1...light-transmitting substrate (substrate), 7...resin layer, 5...conductor layer, 60...through hole, 70...groove, 80...resin, 100...display device, 200...wiring body.

Claims

1. a substrate having a first region; a resin layer provided on the base material including the first region; a conductor layer; In the first region, the resin layer has mesh-shaped through-holes penetrating in a thickness direction, the conductor layer is disposed in the through hole, The resin layer has linear grooves that penetrate the resin layer in the thickness direction at positions spaced apart from the mesh-shaped through holes in a direction perpendicular to the thickness direction.

2. the base material is provided with the resin layer and has a second region located around the first region, The wiring body according to claim 1 , wherein the linear groove is disposed in the second region.

3. the base material is provided with the resin layer and has a third region located within an opening of the mesh-shaped conductor layer; The wiring body according to claim 1 , wherein the linear groove is disposed in the third region.

4. The wiring body according to claim 1 , wherein the linear grooves are formed in a mesh pattern.

5. The wiring body according to claim 4 , wherein a width of the mesh-shaped grooves is smaller than a pitch of the grooves.

6. The wiring body according to claim 4 , wherein the extending direction of the mesh-shaped through holes and the extending direction of the mesh-shaped grooves are parallel to each other in a plan view.

7. The wiring body according to claim 4 , wherein the mesh-shaped through holes and the mesh-shaped grooves have the same width and pitch.

8. The wiring body according to claim 4 , wherein the pitch of the mesh-like grooves is smaller than the pitch of the mesh-like through holes.

9. The wiring body according to claim 4 , wherein the mesh-shaped grooves have a width of 2 μm or more.

10. The wiring body according to claim 4 , wherein the mesh-shaped grooves are cavities.

11. The wiring body according to claim 4 , further comprising a resin disposed in the mesh-shaped grooves, the resin having a higher hardness than the resin layer.

12. The wiring body according to claim 4 , further comprising a resin disposed in the mesh-shaped grooves, the resin having a refractive index lower than that of the resin layer.

13. The wiring body according to claim 4 , further comprising a resin disposed in the mesh-shaped grooves, the resin covering a surface of the mesh-shaped conductor layer and a surface of the resin layer.

14. The wiring body according to claim 13 , wherein the mesh-shaped conductor layer and the resin disposed on the surface of the resin layer have a thickness smaller than that of the resin layer.

15. the base material is provided with the resin layer and has a fourth region adjacent to the second region, The wiring body according to claim 2 , wherein the resin layer extends without the groove in the fourth region.

16. The wiring body according to claim 15 , wherein the pitch of the mesh-like grooves increases from the second region toward the fourth region.

17. the substrate has a fifth region in which the resin layer is not provided, The wiring body according to claim 2 , wherein the resin layer has a thickness that decreases from the second region toward the fifth region.

18. A display device comprising the wiring body according to any one of claims 1 to 17.

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