Electronic device

Abstract

To provide an electronic device capable of preventing breakdowns and malfunctions from occurring.SOLUTION: The electronic device includes: a metal housing with a flat part; a connector terminal that protrudes from the inside to the outside via the through hole in the flat part of the metal housing, to which an electrical stress is input; and a component made of a static dissipative material that is surrounded by the inner periphery of the flat part of the metal housing and encloses the outer circumference of the connector terminal along the direction in which the connector terminal protrudes.SELECTED DRAWING: Figure 5A

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, electronic devices that reduce noise propagation have been known. This electronic device includes a circuit board on which an electric circuit is formed, a metal housing that houses the circuit board and is grounded and to which the ground of the circuit board is connected, external connection terminals that protrude from the inside of the metal housing to the outside and connect input terminals or output terminals of the circuit board to the outside, and an insulator, at least a portion of which is disposed between the metal housing and the external connection terminals and insulates the metal housing from the external connection terminals. The metal housing has a housing extension portion that extends from a main body of the metal housing toward the inside or outside of the metal housing, facing the external connection terminals. At least a portion of the insulator is disposed between the external connection terminals and the housing extension portion (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-072333 Summary of the Invention [Problem to be solved by the invention]

[0004] In electronic devices, there is a possibility that breakdowns or malfunctions may occur during electrostatic discharge testing, for example, and further improvements are required.

[0005] The present disclosure provides an electronic device that can prevent failures and malfunctions from occurring. [Means for solving the problem]

[0006] One aspect of the present disclosure is an electronic device comprising: a metal casing having a flat portion; a connector terminal that protrudes from the inside to the outside through a through hole in the flat portion of the metal casing and into which electrical stress is input; and a member that surrounds the outer periphery of the connector terminal in the direction in which the connector terminal protrudes, is surrounded by the inner periphery of the flat portion of the metal casing, and is formed from an electrostatic dissipative material.

[0007] One aspect of the present disclosure is a connector comprising a metal housing having a flat plate portion, and a connector terminal that protrudes from the inside to the outside through a through hole in the flat plate portion of the metal housing and to which electrical stress is input, wherein the area of ​​the flat plate portion is 900 cm 2 Below is the It is an electronic device.

[0008] One aspect of the present disclosure is an electronic device comprising: a metal housing having a flat plate portion; and a connector terminal that protrudes from the inside to the outside through a through hole in the flat plate portion of the metal housing and to which electrical stress is input, wherein the length by which the connector terminal protrudes from the flat plate portion to the outside is longer than 1 cm. [Effects of the Invention]

[0009] According to the present disclosure, the occurrence of failures and malfunctions can be suppressed. [Brief explanation of the drawings]

[0010] [Figure 1] A diagram showing an example of the configuration of an ESD test system [Figure 2] Another diagram showing an example of an ESD test system configuration [Figure 3] A diagram showing an example of the relationship between the area of ​​the ground plane and the first peak of the ESD current waveform. [Figure 4] A diagram showing an example of an ESD current waveform for each connector terminal protrusion length [Figure 5A] FIG. 1 is a top view illustrating a first configuration example of an electronic device; [Figure 5B] A-A' cross section of Figure 5A [Figure 6A] FIG. 10 is a top view showing a second configuration example of the electronic device; [Figure 6B]B-B' cross section of Figure 6A [Figure 7A] FIG. 10 is a top view showing a third configuration example of the electronic device; [Figure 7B] C-C' cross section of Figure 7A [Figure 8] ESD current waveform diagram DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters or descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] (Findings that formed the basis of this disclosure) Electronic devices undergo electrostatic discharge testing to check their resistance to static electricity. Electrostatic discharge testing is also known as ESD testing. ESD stands for Electro Static Discharge. ESD testing is also known as ESD gun testing. ESD testing complies with international standards, such as IEC61000-4-2. IEC stands for International Electrotechnical Commission. In ESD testing, electrical stress is applied to a specific terminal of the electronic device being tested, causing a current to flow through the specific terminal. A current waveform is obtained by measuring the current. This current waveform is called the ESD test discharge current waveform or ESD current waveform. The electrical stress could be, for example, electrostatic stress.

[0013] FIG. 8 is a diagram showing an example of an ESD current waveform. In FIG. 8, the horizontal axis represents time and the vertical axis represents current. In the ESD current waveform, there are a first peak P1 and a second peak P2 in chronological order. The electronic device under test may be damaged or malfunction due to the current indicated by the first peak P1 itself or the energy at the second peak P2. The energy at the second peak P2 is correlated with the area of the second peak P2. The electronic device under test is also referred to as a DUT. DUT is an abbreviation for Device Under Test. The first peak P1 is larger than the second peak P2. If the current of the first peak P1 is large, there is a possibility of damaging or malfunctioning the electronic device under test.

[0014] Therefore, if the current of the first peak P1 can be reduced, the possibility of damage or malfunction of the electronic device under test can be reduced. In order to reduce the current of the first peak P1, it is considered effective to reduce the parasitic capacitance between the ESD gun that inputs an electrical stress to the electronic device under test and the electronic device under test.

[0015] The reason will be explained below. When an electrical stress is input from an ESD gun to an external connection terminal of an electronic device, it is considered that the current value of the first peak P1 increases due to the parasitic capacitance between the metal housing of the electronic device and the ESD gun. Therefore, it is required to reduce the parasitic capacitance between the electronic device and the ESD gun.

[0016] Hereinafter, embodiments of the electronic device according to the present disclosure will be described while referring to the drawings.

[0017] (First Embodiment) <Configuration of ESD Test System> Fig. 1 is a diagram showing an example of the configuration of an ESD test system 5. Fig. 2 is another diagram showing an example of the configuration of the ESD test system 5. The ESD test system 5 includes, for example, a target 110, a ground plate 150, an ESD gun 200, a tester main body 300, a Faraday cage 400, and an oscilloscope 500. Note that the oscilloscope 500 is not shown in Fig. 1, and the tester main body 300 is not shown in Fig. 2.

[0018] 1 and 2 has the same configuration as a general ESD test system for performing ESD testing in accordance with the IEC 61000-4-2 standard. The test environment and test method for the ESD test are defined, for example, in the above standard. Furthermore, as will be described later, the ESD test system 5 can perform an ESD test while appropriately changing the size of the ground plate 150 and the height, i.e., the protrusion length, of the target 110 from the ground plate 150.

[0019] The target 110 is conductive, and receives an electrical stress for testing from the ESD gun 200. The target 110 has a portion simulating a connector terminal of an electronic device and a ground portion connected to the ground plate 150. In the ESD test system 5, targets 110 with various protruding lengths from the ground plate 150 are attached for the ESD test. The targets 110 are attached to the front and back surfaces of the ground plate 150, for example, at the center of the plane of the ground plate 150.

[0020] The ground plate 150 is, for example, a flat, conductive member. The ground plate 150 is modeled after the metal housing of an electronic device. In the ESD test system 5, ground plates 150 of various sizes are attached for ESD testing, and the characteristics of each size of the ground plate 150 are measured.

[0021] The ESD gun 200 is a discharge gun for discharging static electricity. During an ESD test, the tip of the ESD gun 200 is brought into contact with the target 110 from the front side, which is closer to the ESD gun 200 than the ground plate 150. Then, the ESD gun 200 inputs an electrical stress from the tip of the ESD gun 200 to the target 110, for example, by pressing a switch. The level of the input electrical stress is changeable. Furthermore, for example, a return cable of the ESD gun 200 is connected to the ground terminal of the ground plate 150.

[0022] The tester main body 300 charges the discharge capacitor of the ESD gun 200 with, for example, a predetermined voltage. The predetermined voltage may be, for example, 2 kV, 4 kV, 8 kV, or 15 kV, or may be another voltage. The ESD gun 200 generates a pulse by discharging the stored charge. The ESD gun 200 inputs the generated pulse as electrical stress to the target 110. Note that as the electrical stress input from the ESD gun 200 increases, the current indicated by the ESD current waveform obtained by the ESD test also increases, and the first peak P1 and second peak P2 tend to become larger.

[0023] The Faraday cage 400 is a container made of, for example, a conductor. Electromagnetic noise and external electromagnetic waves are blocked inside the Faraday cage 400. As shown in Fig. 1, an oscilloscope 500 may be placed inside the Faraday cage 400. The Faraday cage 400 is not shown in Fig. 2.

[0024] The oscilloscope 500 is electrically connected to the target 110, which is attached to the back side of the ground plate 150, opposite the ESD gun 200 with respect to the ground plate 150. The oscilloscope 500 measures the current flowing through the target 110. In other words, the oscilloscope 500 measures the ESD current waveform. In this case, the oscilloscope 500 may directly measure the current flowing through the target 110, or may measure the voltage applied to the input impedance of the target 110 and calculate the current by dividing this voltage by the resistance value. The ESD current waveform may change depending on the conditions of the target 110 and the ground plate 150.

[0025] <Consideration of the relationship between the ground plane area and the first peak> 3 is a diagram showing an example of the relationship between the area of ​​the ground plate 150 and the current value at the first peak P1 of the ESD current waveform. In FIG. 3, an area of ​​xm square, that is, xm×xm, is written as "xm□". For example, when the ground plate 150 is xm square, the area is x 2 m 2 3, the GND plate area, which is the area of ​​the ground plate 150 indicated on the horizontal axis, is displayed logarithmically.

[0026] In this embodiment, as shown in Fig. 3, the current value of the first peak P1 was measured using oscilloscope 500 when the area of ​​the ground plate 150 was 2 m square, 60 cm square, 30 cm square, 20 cm square, 15 cm square, 10 cm square, and 0 cm square, i.e., when no ground plate 150 was provided. Referring to Fig. 3, it can be seen that the current value of the first peak P1 decreases as the area of ​​the ground plate 150 decreases. In particular, when the area of ​​the ground plate 150 is 30 cm square or less, the current value of the first peak P1 decreases significantly, and it can be inferred that the parasitic capacitance between the target 110 / ground plate 150 and the ESD gun 200 decreases.

[0027] <Consideration of target protrusion length> 4 is a diagram showing an example of an ESD current waveform for each protrusion length of the target 110. The ESD current waveform is shown by the time from when the ESD gun 200 discharges and the current value of the discharge current.

[0028] In this embodiment, as shown in FIG. 4, ESD current waveforms were measured using an oscilloscope 500 when the protrusion length of the target 110 was 2.0 cm, 1.5 cm, 1.2 cm, 1.0 cm, 0.5 cm, and 0 cm. Referring to FIG. 4, it can be seen that the longer the protrusion length of the target 110 from the ground plate 150, the smaller the current value of the first peak P1 present around 1 ns. This is because the longer the protrusion length of the target 110 from the ground plate 150, the longer the distance between the ESD gun 200, which contacts the target 110 and applies electrical stress, and the ground plate 150, resulting in a smaller parasitic capacitance. When the protrusion length of the target 110 from the ground plate 150 is greater than 1.0 cm, the current value of the first peak P1 becomes smaller, and it can be inferred that the parasitic capacitance between the target 110 and the ESD gun 200 is smaller. In particular, when the protruding length of the target 110 from the ground plate 150 is 1.2 cm or more, the current value of the first peak P1 is significantly reduced, and it can be estimated that the parasitic capacitance between the target 110 and the ESD gun 200 is significantly reduced.

[0029] Based on these considerations, the inventors have noticed that if the electronic device 10 is configured as follows, it is possible to reduce the parasitic capacitance between the electronic device 10 simulated by the target 110 and the ground plate 150 and the ESD gun 200 during an ESD test of the electronic device 10. With the electronic device 10 having such a configuration, it is expected that failures and malfunctions of the electronic device 10 can be suppressed.

[0030] The electronic device 10 may be, for example, an electronic device mounted on a vehicle, such as an ECU or a power conversion device. ECU is an abbreviation for Electronic Control Unit. The electronic device 10 may also be an electronic device other than an electronic device mounted on a vehicle.

[0031] <First configuration example of electronic device> Fig. 5A is a top view showing a first configuration example of electronic device 10. Fig. 5B is a cross-sectional view showing the first configuration example of electronic device 10, taken along the line AA' in Fig. 5A.

[0032] In the first configuration example, the electronic device 10 includes a connector terminal 11, a predetermined member 12, and a metal housing 15.

[0033] The connector terminal 11 is a terminal to which an electric stress is input by the ESD gun 200 during an ESD test. The electric stress is the same as the electric stress input to the target 110 described above. The connector terminal 11 is conductive.

[0034] The predetermined member 12 is a member having electrical properties other than an insulator, for example, a member made of an electrostatic dissipative material. 4 Ω or more 10 11 The predetermined member 12 is made of a material with a resistance of less than Ω. By being made of a static electricity dissipative material, the predetermined member 12 has the property of being able to dissipate static electricity applied by the ESD gun 200, that is, has dissipative properties. This makes it possible to prevent the predetermined member 12 from being broken down by repeated application of static electricity by the ESD gun 200.

[0035] The metal housing 15 is electrically conductive and is made of a metal such as aluminum.

[0036] The metal casing 15 has, for example, a box-like shape. The metal casing 15 has a flat plate portion 15S. The flat plate portion 15S has, for example, a through-hole 15H in the center, but the through-hole 15H may be located at a position other than the center. The connector terminals 11 and a predetermined component 12 are arranged in the through-hole 15H, starting from the inside, i.e., the center of the hole. A substrate is provided inside the metal casing 15, and various electronic components are mounted on the substrate. The connector terminals 11, the predetermined component 12, and the metal casing 15 may be arranged coaxially. While FIGS. 5A and 5B illustrate an example in which the flat plate portion 15S of the metal casing 15 is rectangular when viewed from above, other shapes, such as a circle, may be used. The flat plate portion 15S does not have to be a completely flat plate. For example, the flat plate portion 15S may have a curvature greater than zero in part or in its entirety.

[0037] The connector terminals 11 extend in a direction R2 perpendicular to a direction R1 along the flat portion 15S of the metal housing 15, and protrude from the inside to the outside of the metal housing 15. Although the connector terminals 11 are shown in Fig. 5A and Fig. 5B as being rectangular when viewed from above, they may have other shapes, such as a circular shape.

[0038] Furthermore, connector terminal 11 may be electrically connected to electronic components on the board inside metal housing 15. Connector terminal 11 may also be an external connection terminal that electrically connects between the electronic components on the board and an external device outside electronic device 10. Connector terminal 11 may also be a dedicated terminal that is provided separately from the external connection terminal and to which a predetermined electrical stress is input by ESD gun 200 during ESD testing. Even if connector terminal 11 is the above-mentioned dedicated terminal, it may be electrically connected to electronic components on the board.

[0039] The predetermined member 12 has a through hole 12H. The connector terminal 11 passes through the through hole 12H. The predetermined member 12 surrounds the outer periphery of the connector terminal 11 along the direction R2, is surrounded by the inner periphery of the flat portion 15S that defines the through hole 15H, and is arranged coaxially with the connector terminal 11. In the direction R2, the thickness of the predetermined member 12 is smaller than the length of the connector terminal 11 and larger than the thickness of the flat portion 15S. Also, although FIGS. 5A and 5B illustrate the predetermined member 12 as being rectangular when viewed from above, it may have other shapes, such as a circle.

[0040] In the first configuration example, the predetermined member 12 is made of a static electricity dissipative material. In this case, the electronic device 10 can reduce the parasitic capacitance between the electronic device 10 and the ESD gun 200 compared to when the predetermined member 12 is made of an insulating material. Therefore, the electronic device 10 can suppress the occurrence of failures or malfunctions during, for example, an ESD test.

[0041] <Second configuration example of electronic device> Fig. 6A is a top view showing a second configuration example of electronic device 10. Fig. 6B is a cross-sectional view showing the second configuration example of electronic device 10, taken along the line B-B' in Fig. 6A. Note that in the second configuration example, descriptions of the same configuration as that shown in the first configuration example of Figs. 5A and 5B may be omitted or simplified.

[0042] In the second configuration example, the electronic device 10 includes a connector terminal 11 and a metal housing 15. The electronic device 10 of the second configuration example differs from the first configuration example in that it does not include a predetermined member 12 and the area of ​​the flat portion 15S of the metal housing 15 is limited.

[0043] As shown in Figures 6A and 6B, the connector terminals 11 have the same configuration as in the first configuration example, but because the predetermined member 12 is absent, they are surrounded by the flat plate portion 15S of the metal housing 15. In other words, the connector terminals protrude from the inside to the outside through the through holes 15H in the flat plate portion 15S of the metal housing 15, and electrical stress for ESD testing is input. The area of ​​the flat plate portion 15S is equal to or less than the area corresponding to a square with sides of 30 cm, that is, 900 cm. 2The area of ​​the flat plate portion 15S may be a square with one side of 30 cm or less.

[0044] In the second configuration example, the electronic device 10 has a flat plate portion 15S with an area of ​​900 cm 2 3, the first peak P1 can be significantly reduced. Therefore, the parasitic capacitance between the electronic device 10 and the ESD gun 200 during an ESD test can be reduced. Therefore, the electronic device 10 can be prevented from failing or malfunctioning during an ESD test, for example. Furthermore, by not including the specified component 12, the electronic device 10 can be made smaller.

[0045] <Third configuration example of electronic device> Fig. 7A is a top view showing a third configuration example of electronic device 10. Fig. 7B is a cross-sectional view showing the third configuration example of electronic device 10, taken along the line CC' of Fig. 7A. Note that in the third configuration example, descriptions of the same configuration as those shown in the first configuration example of Figs. 5A and 5B or the second configuration example of Figs. 6A and 6B may be omitted or simplified.

[0046] In the third configuration example, electronic device 10 includes connector terminals 11 and a metal housing 15. Electronic device 10 of the third configuration example differs from the first configuration example in that it does not include specified member 12 and the length of protrusion of connector terminals 11 from metal housing 15 is limited. Electronic device 10 of the third configuration example also differs from the second configuration example in that it does not include specified member 12, the area of ​​flat portion 15S of metal housing 15 is arbitrary, and the length of protrusion of connector terminals 11 from metal housing 15 is limited. Specifically, the protrusion length of connector terminals 11 is longer than 1.0 cm, preferably 1.2 cm or more, and more preferably 1.5 cm or more.

[0047] In the third configuration example, the protrusion length of the connector terminals 11 from the metal housing 15 of the electronic device 10 is greater than 1.0 cm, so the distance between the metal housing 15 and the ESD gun 200 is increased. Therefore, as shown in FIG. 4 , the electronic device 10 can reduce the parasitic capacitance between the electronic device 10 and the ESD gun 200, thereby reducing the current value of the first peak P1. In particular, when the protrusion length of the connector terminals 11 of the electronic device 10 is set to 1.2 cm or more, the current value of the first peak P1 can be further reduced. Therefore, the electronic device 10 can suppress the occurrence of failures or malfunctions during ESD testing. Furthermore, by not including the specified component 12, the electronic device 10 can be made smaller.

[0048] Thus, through the ESD test using the ESD test system 5, it can be seen that the current in the ESD current waveform depends on the ground plate 150, which simulates the metal housing 15 of the electronic device 10, and on the protruding length of the target 110, which simulates the connector terminal 11 of the electronic device 10. Therefore, it can be estimated that the current in the ESD current waveform depends on the parasitic capacitance between the target 110, which simulates the electronic device 10, and the ground plate 150 and the ESD gun 200. In contrast, the electronic device 10 is configured to reduce parasitic capacitance by, for example, providing a specific member 12, limiting the area of ​​the flat portion 15S of the metal housing 15, or limiting the protruding length of the connector terminal 11. Such an electronic device 10 can reduce large currents, such as the first peak P1, in the ESD current waveform, thereby reducing problems such as breakdowns and malfunctions. For example, the electronic device 10 can prevent excessive current from flowing through the connector terminal 11 to electronic devices on a circuit board inside the metal housing 15. Therefore, the electronic device 10 can prevent breakdowns and malfunctions of the electronic device 10.

[0049] In this embodiment, it has been described that failures and malfunctions of the electronic device 10 can be suppressed using an ESD test as an example. Failures and malfunctions of the electronic device 10 can also be suppressed in other situations. The electronic device 10 can reduce the parasitic capacitance between the electronic device 10 and an object that generates electrical stress other than the ESD gun 200, for example. This allows the electronic device 10 to suppress failures and malfunctions. An object that generates electrical stress other than the ESD gun 200 is, for example, a human hand.

[0050] [Note] The above description of the embodiments discloses the following techniques.

[0051] (Technology 1) a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; a member that surrounds an outer periphery of the connector terminal along a direction in which the connector terminal protrudes, is surrounded by an inner periphery of the flat plate portion of the metal housing, and is made of an electrostatic dissipative material; An electronic device comprising:

[0052] The electronic device is, for example, electronic device 10. The flat plate portion is, for example, flat plate portion 15S. The metal housing is, for example, metal housing 15. The through hole is, for example, through hole 15H. The connector terminal is, for example, connector terminal 11.

[0053] With this configuration, the electronic device does not surround the outer periphery of the connector terminal with a metal housing, but rather with a member made of electrostatic dissipative material. Compared to when the electrostatic dissipative material is an insulating material or when the member made of electrostatic dissipative material is also part of the metal housing, the parasitic capacitance between the electronic device and the ESD gun is reduced. Therefore, the electronic device can reduce large currents, such as the first peak in the ESD current waveform, and prevent damage or malfunction of the electronic device.

[0054] (Technology 2) a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; Equipped with The area of ​​the flat plate is 900 cm 2 Below is the electronic equipment.

[0055] With this configuration, the electronic device has a flat surface area of ​​900cm 2 or less, the parasitic capacitance between the electronic device and the ESD gun can be reduced, thereby reducing large currents such as the first peak in the ESD current waveform in the electronic device and preventing damage or malfunction of the electronic device.

[0056] (Technology 3) The flat plate portion is smaller than a square with one side measuring 30 cm. The electronic device according to Art. 2.

[0057] This configuration allows the electronic device to easily create a flat metal housing portion and reduces the parasitic capacitance between the electronic device and the ESD gun.

[0058] (Technology 4) a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; Equipped with The length by which the connector terminals protrude outward from the flat plate portion is longer than 1 cm. electronic equipment.

[0059] This configuration places the connector terminals more than 1 cm away from the metal housing, increasing the distance between the ESD gun and the metal housing during electrostatic discharge testing, for example. This reduces the parasitic capacitance between the electronic device and the ESD gun. This allows the electronic device to reduce large currents, such as the first peak in the ESD current waveform, preventing damage to or malfunction of the electronic device.

[0060] (Technology 5) The protruding length is 1.2 cm or more. The electronic device described in technology 4.

[0061] This configuration places the connector terminals at least 1.2 cm away from the metal housing, further increasing the distance between the metal housing and the ESD gun during electrostatic discharge testing, for example. Furthermore, as shown in Figure 4, when the connector terminals have a protrusion length of 1.2 cm or more, it becomes easier to identify the first peak corresponding to the protrusion length compared to when the protrusion length is around 1.0 cm, and it can be seen that the first peak can be further reduced. Therefore, the occurrence of breakdown or malfunction of electronic devices can be further reduced.

[0062] (Technology 6) The protruding length is 1.5 cm or more. The electronic device described in technique 5.

[0063] This configuration places the connector terminals at least 1.5 cm away from the metal housing, further increasing the distance between the metal housing and the ESD gun during electrostatic discharge testing, for example. Furthermore, as shown in Figure 4, when the connector terminals protrude 1.5 cm or longer, it becomes easier to identify the first peak corresponding to the protrusion length, and it can be understood that the first peak can be further reduced. Therefore, the occurrence of damage or malfunction of electronic devices can be further reduced.

[0064] (Technology 7) The connector terminals are electrically connected to electronic components on a substrate provided inside the metal housing. 7. An electronic device according to any one of claims 1 to 6.

[0065] With this configuration, during an ESD test, for example, the electronic device can prevent a large current such as the first peak from flowing into the metal casing via the connector, which can cause breakdowns or malfunctions in electronic components within the electronic device.

[0066] (Technology 8) The electrical stress is an electrostatic stress for performing an electrostatic discharge test. 8. An electronic device according to any one of claims 1 to 7.

[0067] With this configuration, even if an ESD test is performed by inputting electrostatic stress to the connector terminals, the electronic device can be prevented from being destroyed or malfunctioning.

[0068] (Technology 9) the connector terminal is an external connection terminal that electrically connects an electronic component on a substrate provided inside the metal housing to an external device outside the electronic device; 9. An electronic device according to any one of the preceding claims.

[0069] With this configuration, the electronic device can perform an ESD test using a configuration that the electronic device already has, without providing a new terminal for performing the ESD test, for example.

[0070] (Technology 10) the connector terminal is a terminal separate from an external connection terminal that electrically connects an electronic component on a board provided inside the metal housing to an external device outside the electronic device, and is a dedicated terminal to which electrical stress is input; 9. An electronic device according to any one of the preceding claims.

[0071] With this configuration, an electronic device can, for example, have a terminal for performing ESD testing separate from the external connection terminal, thereby enabling ESD testing to be performed using electrical stress that cannot be input or is not recommended to be input to the external connection terminal.

[0072] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0073] The present disclosure is useful for electronic devices and the like that can suppress the occurrence of breakdowns and malfunctions. [Explanation of symbols]

[0074] 5 ESD Test System 10 Electronic equipment 11 Connector terminal 12. Prescribed materials 12H through hole 15 Metal housing 15S flat plate part 15H through hole 110 Target 150 Ground Board 200 ESD Gun 300 Tester body 400 Faraday Cage 500 oscilloscope

Claims

1. a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; a member that surrounds an outer periphery of the connector terminal along a direction in which the connector terminal protrudes, is surrounded by an inner periphery of the flat plate portion of the metal housing, and is made of a static electricity dissipative material; An electronic device comprising:

2. a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; Equipped with The area of ​​the flat plate is 900 cm ２ Below is the electronic equipment.

3. The flat plate portion is smaller than a square with one side measuring 30 cm. The electronic device according to claim 2 .

4. a metal housing having a flat plate portion; a connector terminal that protrudes from the inside to the outside through the through hole in the flat plate portion of the metal housing and to which electrical stress is input; Equipped with The length by which the connector terminals protrude outward from the flat plate portion is longer than 1 cm. electronic equipment.

5. The protruding length is 1.2 cm or more.

5. The electronic device according to claim 4.

6. The protruding length is 1.5 cm or more. The electronic device according to claim 5 .

7. The connector terminal is electrically connected to an electronic component on a substrate provided inside the metal housing. The electronic device according to claim 1 .

8. The electrical stress is an electrostatic stress for performing an electrostatic discharge test. The electronic device according to claim 1 .

9. the connector terminal is an external connection terminal that electrically connects an electronic component on a substrate provided inside the metal housing to an external device outside the electronic device; 8. The electronic device according to claim 7.

10. the connector terminal is a terminal separate from an external connection terminal that electrically connects an electronic component on a board provided inside the metal housing to an external device outside the electronic device, and is a dedicated terminal to which electrical stress is input; 8. The electronic device according to claim 7.

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