Resin composition

JP2025162944AInactive Publication Date: 2025-10-28NANYA PLASTICS CORP
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Patent Information

Application Number
JP2024097899
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-16
Filing Date
2024-06-18
Publication Date
2025-10-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

PURPOSE: To provide a resin composition which can improve workability at a high filler rate, and simultaneously has excellent performance.SOLUTION: A resin composition contains a resin, a filler, a siloxane compound, and an organic elastomer. The resin contains an epoxy resin, a maleimide resin, a curing agent, or a combination thereof. The weight ratio in the resin composition of the filler is 75 wt.% or more.SELECTED DRAWING: None
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Citation Information

Patent Citations

  • Resin composition for sealing semiconductor

    JP1992296317A

  • Epoxy resin composition for sealing semiconductor and semiconductor device

    JP2003138104A

  • Epoxy resin precursor composition, prepreg, laminated plate, resin sheet, printed wiring board and semiconductor device

    JP2012102227A

  • Thermosetting resin composition and prepreg, laminate sheet, and multilayer printed wiring board using the same

    JP2014024926A

  • Thermosetting resin composition, and prepreg, laminate and multilayer printed wiring board using the same

    JP2016033195A