Display device

Abstract

To provide a display device having both a touch sensor function and a fingerprint authentication function.SOLUTION: The display device has a first display area and a second display area. The first display area and the second display area are provided in contact with each other. The first display area includes a plurality of first light-emitting elements and a plurality of first light receiving elements. The second display area includes a plurality of second light-emitting elements and a plurality of second light receiving elements. The first light receiving element has a function of receiving first light emitted by the first light-emitting element. The second light receiving element has a function of receiving second light emitted by the second light-emitting element. The first light-emitting element and the first light receiving element are arranged in the first display area in a matrix. The second light-emitting element and the second light receiving element are arranged in the second display area in the matrix. The second light receiving elements are arranged at higher density than the first light receiving elements.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An aspect of the present invention relates to a display device and an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, and the like. , electronic device, lighting device, input device, input / output device, driving method thereof, or manufacturing method thereof Semiconductor devices function by utilizing the semiconductor properties. This refers to all devices that can do this. [Background technology]

[0003] In recent years, mobile phones such as smartphones, tablet-type information terminals, and notebook PCs (personal computers) have become increasingly Information terminal devices such as personal computers (PCs) are widely used. However, personal information is often included, and various authentication technologies have been developed to prevent unauthorized use. It is being issued.

[0004] For example, Patent Document 1 discloses an electronic device equipped with a fingerprint sensor in a push button switch section. has been disclosed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US Patent Application Publication No. 2014 / 0056493 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of one embodiment of the present invention is to provide a display device having a light detection function. Another object of the present invention is to provide a display device capable of biometric authentication, such as fingerprint authentication. Alternatively, a display device that combines both a touch sensor function and a fingerprint authentication function may be provided. One of the challenges is to

[0007] Another object of one embodiment of the present invention is to provide a highly convenient electronic device. Another object of the present invention is to provide a multifunctional electronic device. One of the objectives is to reduce the display area ratio. Another object of the present invention is to provide a user-friendly fingerprint authentication method for electronic devices. Another issue is to prevent the user from feeling inconvenienced when performing fingerprint authentication. One of the objectives is to provide a high-performance electronic device.

[0008] The description of these problems does not preclude the existence of other problems. It is not necessary for one embodiment to solve all of these problems. The subject matter can be extracted from the description, drawings, claims, etc. [Means for solving the problem]

[0009] One embodiment of the present invention is a display device having a first display area and a second display area. The first display area and the second display area are provided adjacent to each other. The first display area has a plurality of first The second display area has a first light-emitting element and a plurality of first light-receiving elements. The first light receiving element has a light emitting element and a plurality of second light receiving elements. The second light receiving element has a function of receiving the first light emitted by the second light emitting element. The first light emitting element and the first light receiving element have a function of receiving light from the first display area. The second light emitting elements and the second light receiving elements are arranged in a matrix on the second surface. The second light receiving elements are arranged in a matrix in the display area. They are arranged at high density.

[0010] In the above, the first light emitting elements are arranged at a higher density than the second light emitting elements. It is preferable that:

[0011] In the above, the first light receiving element and the second light receiving element are made of the same organic compound. It is preferable that the first light-emitting element and the second light-emitting element have an active layer containing a compound. It is preferable that each of the light-emitting layers contains the same organic compound.

[0012] In the above, the first light receiving element and the second light receiving element are respectively connected to the first pixel electrode. It is preferable that the first electrode has a laminated structure in which the first electrode, the active layer, and the common electrode are laminated. The first light emitting element and the second light emitting element each include a second pixel electrode, a light emitting layer, a common electrode, and In this case, the first pixel electrode and the second pixel electrode are preferably laminated. The base electrodes are provided on the same surface, and the active layer and the light-emitting layer are made of different organic compounds. It is preferred that it contains

[0013] In the above, the common electrode has a function of being given a first potential, and the first pixel potential The first pixel electrode has a function of being given a second potential lower than the first potential, and the second pixel electrode has a function of being given a second potential lower than the first potential. It is preferable that the electrode has a function of applying a third potential higher than the first potential.

[0014] Another embodiment of the present invention is an electronic device including any one of the above display devices and a housing. The housing has a first surface and a second surface. The first surface and the second surface are continuous. The first display area is provided along the first surface and has a different normal direction. The second display area is provided along the second surface.

[0015] In the above, the second surface preferably has a curved surface.

[0016] Another embodiment of the present invention is an electronic device including any one of the above display devices and a housing. The housing has a frame portion that surrounds the first display area and the second display area. The second display area is preferably provided along a part of the inner contour of the frame portion.

[0017] Another embodiment of the present invention is an electronic device including any one of the above display devices and a housing. The housing has a frame that surrounds the first display area and the second display area. The second display area has a rectangular shape or a rectangular shape with rounded corners. It is preferable that the grooves are provided in contact with two adjacent sides of the inner contour.

[0018] In the above, the first display area has a function of capturing a fingerprint, and the second display area It is preferable that the touch panel has a function as a touch sensor. [Effects of the Invention]

[0019] According to one embodiment of the present invention, a display device having a light detection function can be provided. It is possible to provide a display device capable of biometric authentication, such as a touch sensor function. Therefore, it is possible to provide a display device that has both the functions of fingerprint authentication and the like.

[0020] According to one embodiment of the present invention, a highly convenient electronic device can be provided. Or, the number of parts in the electronic device can be reduced. It is possible to provide electronic devices with a high surface area ratio, or fingerprint authentication for user-friendly electronic devices. Or, you can provide a way to prevent users from feeling inconvenienced when performing fingerprint authentication. We can provide high-quality electronic equipment.

[0021] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. can be extracted from descriptions in the specification, drawings, claims, etc. [Brief explanation of the drawings]

[0022] [Figure 1] Fig. 1A is a diagram showing an example of the configuration of an electronic device, and Figs. 1B to 1E are diagrams showing an example of the configuration of a pixel. [Figure 2] 2A to 2D are diagrams showing examples of pixel configurations. [Figure 3] 3A to 3C are diagrams showing examples of pixel configurations. [Figure 4] 4A and 4B are diagrams showing examples of pixel configurations. [Figure 5] 5A and 5B are diagrams showing examples of pixel configurations. [Figure 6] 6A and 6B are diagrams showing configuration examples of electronic devices. [Figure 7] 7A and 7B are diagrams showing configuration examples of electronic devices. [Figure 8] 8A and 8B are diagrams showing configuration examples of electronic devices. [Figure 9]9A, 9B, and 9D are diagrams showing examples of the configuration of a display device, and 9C and 9E are diagrams showing examples of images. [Figure 10] 10A to 10C are diagrams showing configuration examples of a display device. [Figure 11] 11A to 11D are diagrams showing configuration examples of a display device. [Figure 12] 12A to 12D are diagrams showing configuration examples of a display device. [Figure 13] 13A to 13C are diagrams illustrating an example of the configuration of a display device. [Figure 14] 14A and 14B are diagrams illustrating an example of the configuration of a display device. [Figure 15] 15A to 15C are diagrams illustrating an example of the configuration of a display device. [Figure 16] FIG. 16 is a diagram illustrating an example of the configuration of a display device. [Figure 17] FIG. 17 is a diagram illustrating an example of the configuration of a display device. [Figure 18] 18A and 18B are diagrams illustrating an example of the configuration of a display device. [Figure 19] 19A and 19B are diagrams illustrating an example of the configuration of a display device. [Figure 20] FIG. 20 is a diagram illustrating an example of the configuration of a display device. [Figure 21] 21A and 21B are diagrams showing configuration examples of pixel circuits. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments will be described with reference to the drawings. It is understood that the present invention may be embodied in various different forms without departing from its spirit and scope. It will be readily apparent to those skilled in the art that various modifications may be made to the embodiments and details of the present invention. However, the present invention should not be construed as being limited to the description of the following embodiments.

[0024] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0025] In each drawing described in this specification, the size of each component, the thickness of a layer, or the area The figures may be exaggerated for clarity and are not necessarily limited to that scale. I can't.

[0026] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0027] (Embodiment 1) In this embodiment, a display device according to one embodiment of the present invention and an electronic device including the display device will be described. I will explain.

[0028] A display device according to one embodiment of the present invention includes a plurality of display elements and a plurality of light receiving elements (also called light receiving devices). The display element is preferably a light-emitting element (also called a light-emitting device). The light receiving element is preferably a photoelectric conversion element.

[0029] A display device is a device that displays an image on the display surface using display elements arranged in a matrix. Possess the ability.

[0030] The display device can also capture images of objects that touch or approach the display surface. For example, a part of the light emitted by the display element is reflected by the object, and the reflected light is incident on the light receiving element. The light receiving element can also output an electrical signal according to the intensity of the incident light. Therefore, the display device has a plurality of light receiving elements arranged in a matrix, so that the position of the object can be detected. The position information and shape can be acquired as data (also called imaging). The display device can function as an image sensor panel, a touch sensor panel, etc. do.

[0031] The display device has a first display area (also called a first display unit) and a second display area (also called a second display unit). The first display area is adjacent to (in contact with) the second display area. In the display panel, first display elements and first light receiving elements are arranged in a matrix. In the second display area, second display elements and second light receiving elements are arranged in a matrix. The first display element and the second display element can be formed in the same process.

[0032] Here, the second light receiving element provided in the second display area is provided in the first display area. It is preferable that the second light receiving elements are arranged at a higher density than the first light receiving elements. In the second display area, it is possible to capture an image with higher resolution than in the first display area. In the second display area, although the resolution is lower than in the first display area, the time required for capturing images can be shortened and high-speed operation is possible. This allows us to realize our vision.

[0033] For example, since a high-resolution image can be captured in the second display area, The area can be suitably used for imaging for biometric authentication such as fingerprint authentication and palm print authentication. On the other hand, since high-speed operation is possible in the first display area, the first display area is used as a touch sensor panel. It can be suitably used as a sensor panel (including a proximity sensor panel and a near-touch sensor panel). The second display area can also function as a touch sensor panel. can be done.

[0034] A display device having such a first display area and a second display area is applied to an electronic device. At this time, the second display area is allocated to the display unit of the electronic device. The part of the screen that is allocated to the first display area has a fingerprint authentication function, and the other part is allocated to the second display area. This configuration allows the device to function as a touch panel. Since two functions can be realized with one display device, the number of parts can be reduced and multi-functionality can be achieved. This has the effect of making it easier to

[0035] When the display device of one embodiment of the present invention is applied to a display portion of an electronic device, a fingerprint authentication function can be provided. It is preferable that the second area be provided adjacent to a part of the outline of the display unit. The second area is arranged at a position where the user's fingers can naturally touch when holding the electronic device. By doing so, electronic devices can be authenticated as soon as they are held without the user even noticing. Therefore, it is possible to provide a highly convenient electronic device without compromising safety. The position where the user's fingers can naturally touch is around the display. The area along the inner contour of the frame portion is also an area along the side of the electronic device. It is preferable that the display section is configured to extend over the entire surface, and the second area is disposed on the side surface of the display section. stomach.

[0036] In this specification and the like, the contour that forms the outer periphery of a frame-shaped object in a plan view is referred to as an outer contour. The outline forming the inner periphery is called the inner outline. It refers to an object that has at least one opening inside the outline (outer outline) of the object. The inner contour can also be said to refer to a closed curve that follows the edge of the opening of a frame-like object in a plan view. can.

[0037] When using light-emitting elements as display elements, OLED (Organic Light Emitting Diode) Emitting Diode) and QLED(Quantum-dot Light E) It is preferable to use an EL element such as a emitting diode. The luminescent materials include fluorescent materials, phosphorescent materials, Substances that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence) ed delayed fluorescence (TADF) materials), inorganic compounds (amount As for light-emitting elements, micro LEDs (Light Emitting Diodes) are also used. Alternatively, an LED such as a light emitting diode (LED) can be used.

[0038] As the light receiving element, for example, a pn-type or pin-type photodiode can be used. The light receiving element acts as a photoelectric conversion element that detects the light incident on the light receiving element and generates an electric charge. The amount of charge generated by a photoelectric conversion element is determined according to the amount of incident light. As the light receiving element, it is preferable to use an organic photodiode having a layer containing an organic compound. Organic photodiodes are easy to make thin, lightweight, and large in area, and are also easy to form. The high degree of freedom in shape and design allows it to be applied to a variety of display devices.

[0039] The light-emitting element can have, for example, a stacked structure including a light-emitting layer between a pair of electrodes. The light receiving element may have a laminated structure including an active layer between a pair of electrodes. The active layer can be made of a semiconductor material, such as an inorganic semiconductor material such as silicon. can be used.

[0040] It is also preferable to use an organic compound in the active layer of the light-receiving element. It is preferable that the electrode of the light receiving element and one of the electrodes (also called a pixel electrode) are provided on the same surface. Furthermore, the other electrodes of the light emitting element and the light receiving element are formed by an electrode ( It is more preferable that the light emitting element and the light receiving element are connected to each other through a common electrode. It is more preferable that the light emitting element and the light receiving element have a layer. Since part of the manufacturing process can be shared, the manufacturing process can be simplified and manufacturing costs can be reduced. Furthermore, the manufacturing yield can be improved.

[0041] A more specific example will be described below with reference to the drawings.

[0042] [Electronic device configuration example 1] FIG. 1A shows a schematic diagram of an electronic device 10 equipped with a display device according to one embodiment of the present invention.

[0043] The electronic device 10 includes a display unit 11a, a display unit 11b, a housing 12, a speaker 13, and a microphone. The electronic device 10 can be used as a portable information terminal device. The device 10 can be used as, for example, a smartphone.

[0044] The housing 12 has a plate-like shape. A display is provided along a first surface, which is the top surface of the housing 12. A display unit 11a is provided along a second surface of the housing 12, which is one of the side surfaces of the housing 12. Here, the second surface of the housing 12 on which the display unit 11b is provided is the front surface. It is preferable that the first surface of the housing 12 is continuous with the first surface on which the display unit 11a is provided and has a curved surface. The normal direction of the display unit 11a provided on the first surface of the housing 12 and the normal direction of the display unit 11b provided on the second surface of the housing 12 are It can also be said that the normal direction of the display unit 11a and the display unit 11b is different. b are provided consecutively.

[0045] The display unit 11a functions as a touch panel, and has a function of displaying images and a function of accepting touch operations ( The display unit 11a has a function of detecting a main screen (including an attach operation). It can also be called a surface.

[0046] The display unit 11b has a function of displaying an image and a function of capturing an image of a fingerprint or the like. The display unit 11b may have a function as a touch panel, similar to the display unit 11a. The section 11b can also be called a sub-screen.

[0047] In FIG. 1A, the user holds the electronic device 10 and operates the display unit 11a with a finger 30b. This shows an example of a case where

[0048] The display unit 11b is in natural contact with the finger 30a when the user holds the housing 12 with his / her hand. At this time, the electronic device 10 detects the finger 30a touching the display unit 11b. The fingerprint can be captured (photographed) and fingerprint authentication can be performed. The authentication operation can be performed as soon as the user holds the electronic device 10 without knowing the user's identity. By the time the user picks up the electronic device 10 and looks at the screen, authentication has already been completed. The lock is released and ready to use, providing high security and This makes it possible to provide an electronic device that is both highly convenient and user-friendly.

[0049] In the configuration shown in FIG. 1A, the display unit 11b is provided at a position where the fingers 30a of the left hand can touch it. However, the present invention is not limited to this and the electronic device may be provided in a position where the fingers of the right hand can touch it. The different configurations will be explained later.

[0050] [Pixel configuration example] [Configuration example 1] FIG. 1B shows an example of the pixel configuration of the display unit 11a. The display unit 11a has a plurality of pixels. 1C shows the pixel structure of the display unit 11b. The display unit 11b has a plurality of pixels 21b. The pixels 21b are light-receiving elements 2 3 is the pixel.

[0051] In the display section 11a, pixels 21a and pixels 21b are arranged in a matrix. In B, three of the 2×2 pixels are pixels 21a and one is pixel 21b. The display unit 11a has 2×2 pixels as one unit, and the units are arranged in a matrix. The configuration is arranged as follows.

[0052] The number of pixels in one unit is not limited to 2×2. For example, b may be an integer of 2 or more, and each b may independently be an integer of 2 or more, and each b may ... Even if the number of pixels arranged vertically and horizontally in one unit is different, good.

[0053] When the display unit 11a is used as a touch panel, the pixel 21b in the display unit 11a The vertical and horizontal spacing of the array (i.e., the vertical and horizontal width of one unit) is Each of them is 20mm or less, 10mm or less, 8mm or less, or 6mm or less, and the pixel By making the width of the pixel 21a or pixel 21b more than twice as large, a highly sensitive touch panel can be realized. Depending on the configuration of the touch sensor drive circuit, pixel 2 The arrangement interval of 1b may be greater than 20 mm and equal to or less than 25 mm, or equal to or less than 30 mm. By making the arrangement interval of the pixels 21b wider than the arrangement interval of the pixels 21a, the readout time This reduces the time required, making it easier to drive the touch panel at high speed, enabling smooth touch operation. This becomes:

[0054] FIG. 1D shows 2×2 pixels that the display unit 11a has. 1D, display element 22R, display element 22G, and display element 22B. R, display element 22G, and display element 22B are arranged in a line (also called a stripe arrangement). The pixel 21b includes a display element 22R, a display element 22G, a display element 22B, and a receiving 1D, the display element 22R, the display element 22G, and the display element 22 B are arranged in a row, and the light receiving element 23 is disposed below them.

[0055] In the following, the display elements 22R, 22G, and 22B will be collectively referred to as It may be referred to as element 22.

[0056] FIG. 1E shows 2×2 pixels of the display unit 11b. 1b has a pixel 21b having the same configuration as the display unit 11a. .

[0057] The configurations of FIGS. 1B to 1E are such that the display element 22 has the same precision in the display section 11a and the display section 11b. Therefore, the display unit 11a and the display unit 11b are arranged at the same resolution. The display unit 11a can be used as a main display surface. Therefore, the display unit 11a has the same resolution as the display unit 11b or a higher resolution than the display unit 11b. It is preferred that the compound has the following structure:

[0058] On the other hand, when focusing on the light receiving element 23, the display section 11b receives light at a higher density than the display section 11a. Therefore, the display unit 11b has a configuration in which the elements 23 are arranged. High-definition images can be captured.

[0059] For example, the resolution (also referred to as the array density) of the light receiving elements 23 in the display section 11b is It is preferable that the resolution is equal to or higher than that of the display element 22 in the display unit 11b. This makes it possible to capture extremely high-resolution images, making it ideal for fingerprint authentication, etc. Suitable for imaging.

[0060] The resolution of the light receiving element 23 in the display unit 11b is 100 ppi or more, preferably 200 ppi or more, more preferably 300 ppi or more, and even more preferably 400 ppi or more. Therefore, it can be set to 2000 ppi or less, or 1000 ppi or less, etc. Precision of 200ppi or more and 500ppi or less, preferably 300ppi or more and 500ppi or less By arranging the light receiving element 23 at a fine pitch, it can be suitably used for imaging fingerprints. The resolution of the image 23 may be higher than 2000 ppi, but if the resolution is too high, the image processing may be affected. Furthermore, the authentication process takes a long time, which can impair convenience.

[0061] The pixel configuration is not limited to this, and various arrangement methods can be adopted. Next, an example of a pixel configuration different from the above will be described.

[0062] [Configuration example 2] 2A and 2B show examples of pixel configurations of the display section 11a and the display section 11b, respectively. The display unit 11a has a pixel 21a and a pixel 21b. The display unit 11b has a pixel 21b. Has.

[0063] In the pixel 21a, the display elements 22R and the display elements 22G are arranged alternately in the vertical direction. The display element 22B is arranged side by side with the display element 22R and the display element 22G in the horizontal direction. FIG. 2A shows an example in which the area of ​​the display element 22B is larger than the areas of the other display elements. However, the display element 22R or the display element 22G can be replaced as appropriate.

[0064] The pixel 21b includes a display element 22R, a display element 22G, a display element 22B, and a light receiving element 23. The display element 22R and the display element 22B are arranged in the horizontal direction, and below them, the display element The display element 22R, the display element 22G, and the light receiving element 23 are arranged in the horizontal direction. The positions of 2G, the display element 22B, and the light receiving element 23 can be interchanged as appropriate.

[0065] [Configuration Example 3] 2C and 2D show examples of pixel configurations of the display section 11a and the display section 11b, respectively. The display unit 11a includes a pixel 21a1, a pixel 21a2, and a pixel 21b1. 11b includes a pixel 21b1 and a pixel 21b2.

[0066] The pixel 21a1 includes a display element 22G and a display element 22R arranged side by side in the horizontal direction. The pixel 21a2 has a display element 22G and a display element 22B arranged side by side in the horizontal direction. Here, the display element 22R and the display element 22B are each larger than the display element 22G. It has a larger area.

[0067] The pixel 21b1 includes a display element 22G, a display element 22R, and a light receiving element . The display element 22R and the light receiving element 23 are arranged side by side in the vertical direction. The display device 22 includes a display element 22G, a display element 22B, and a light receiving element 23. The light receiving elements 23 are arranged side by side in the vertical direction.

[0068] FIG. 2C shows an example in which the display unit 11a has the pixel 21b1. However, the display unit 11a may have the pixel 21b2. Alternatively, the pixel 21b1 and the pixel 21b2 may be mixed.

[0069] [Configuration Example 4] In the above, the pixel having the light receiving element 23 (pixel 21b, etc.) has three display elements and a receiving element. Although an example having a light-receiving element 23 has been shown, any one of the three display elements and the light-receiving element 2 3 may be replaced.

[0070] 3A to 3C show examples of pixels that can be provided in the display unit 11a. There are.

[0071] The pixel 21a shown in Figure 3A has the same configuration as the pixel 21a illustrated in Figure 1D. The pixel 21b shown in FIG. 1 is a pixel that receives light instead of the display element 22B among the three display elements of the pixel 21a. An element 23 is provided.

[0072] The pixel 21a shown in Figure 3B has the same configuration as the pixel 21a illustrated in Figure 2A. The pixel 21b shown in FIG. 1 is a pixel that receives light instead of the display element 22B among the three display elements of the pixel 21a. An element 23 is provided.

[0073] The pixel 21a1 and the pixel 21a2 shown in FIG. 3C are the same as the pixel 21a shown in FIG. 2C. 3C has the same configuration as pixel 21a1. Of the display elements, a light receiving element 23 is provided in place of the display element 22B.

[0074] By using the configurations shown in FIGS. 3A to 3C, the area of ​​the light receiving element 23 of the pixel 21b is can be increased, thereby improving the light receiving sensitivity.

[0075] In the configuration illustrated here, the pixel 21b having the light receiving element 23 is a display element 22B. Therefore, when an image is displayed, there is a risk that brightness information may be partially lost. At this time, the display element 22B of the pixel surrounding the pixel 21b displays the light that the pixel 21b should display. It is preferable to drive the display so as to complement the brightness. This allows for a natural image to be displayed. It is possible.

[0076] [Configuration Example 5] The display unit 11a functions as the main screen, while the display unit 11b functions as the sub-screen. Therefore, a full-color display is not necessarily required. It can also be used to specialize in capturing fingerprints and other images without displaying them. In this case, the pixels of the display unit 11b can be configured as one or more light receiving elements and light sources. The display device may have the above display element.

[0077] FIG. 4A shows a pixel configuration that can be applied to the display section 11b.

[0078] FIG. 4A shows 4×4 pixels 24. The pixel 24 is made up of one display element 22G. , and one light receiving element 23. By adopting such a configuration, the area of ​​the light receiving element 23 can be It can be made larger and the sensitivity can be increased.

[0079] FIG. 4B shows a pixel configuration example different from that shown in FIG. 4A. In FIG. 4B, 2×2 units 2 5. One unit 25 includes one display element 22G and four light receiving elements 23 The display element 22G is provided at the center of the unit 25, and the light receiving element 23 is provided at the center of the unit 25. One light receiving element 23 is provided at each of the four corners of the gate 25. It can be said that the display element 22G and the display element 22B constitute one pixel 24.

[0080] In the configuration shown in FIG. 4B, the resolution (arrangement density) of the light receiving elements 23 is higher than the array density of the display elements 22G. This configuration makes it possible to capture extremely high-resolution images. This can be done.

[0081] In addition, in FIG. 4B, four light receiving elements 23 are provided adjacent to each other, and the light receiving elements 23 are The display element 22G is provided separately from the display element 22G. It is suitable for use when an organic EL element is used and an organic photodiode is used as the light receiving element 23. For example, when the layers constituting the light receiving element 23 are formed by a vapor deposition method or an ink jet method, It can be formed so as to cover the areas of four adjacent light receiving elements 23. The layer constituting the element 22G and the layer constituting the light receiving element 23 are formed by evaporation using a metal mask. When the display element 22G and the light receiving element 23 are separately manufactured by an ink jet method or the like, The more the number of layers is increased, the higher the manufacturing yield can be.

[0082] 5A and 5B show a configuration that can further increase the manufacturing yield compared to FIG. 4B. There are.

[0083] The configuration shown in FIG. 5A differs from the configuration in FIG. 4B in that the display element 22G and the light receiving element 23 are By adopting such a configuration, the display element 22G and the receiving element 22G are rotated by 45 degrees. The distance to the optical element 23 can be increased.

[0084] The configuration shown in FIG. 5B is obtained by rotating the display element 22G shown in FIG. 4B by 45 degrees and further The four light receiving elements 23 are rotated by 45 degrees without changing their relative positions. In the illustrated configuration, eight light receiving elements 23 are arranged at equal intervals with one display element 22G. With this configuration, the display element 22 is more transparent than the display elements 22 shown in FIGS. 4B and 5A. The distance between G and the light receiving element 23 can be increased.

[0085] [Electronic device configuration example 2] Below, an example of the configuration of an electronic device different from the above will be described.

[0086] [Configuration Example 2-1] FIG. 6A shows an example of the configuration of an electronic device 10a. The electronic device 10a has a pair of display units 11b. 1A and the shape of the housing 12. is doing.

[0087] The housing 12 has two curved side surfaces along the longitudinal direction. are provided along the curved surface of the side surface of the housing 12. The pair of display units 11b are They are provided symmetrically on both sides of the display unit 11a.

[0088] With this configuration, the electronic device 10b can be held in different hands depending on whether it is held in the right hand or the left hand. It can handle both cases.

[0089] [Configuration Example 2-2] 6B shows an example of the configuration of the electronic device 10b. The electronic device 10b has a display on the top surface of the housing 12. The surface is provided.

[0090] 6B, the electronic device 10b includes a camera 15, a light source 16, a physical button 17, and a physical An example with a button 18 is shown.

[0091] The display unit 11a and the display unit 11b are provided inside the frame of the housing 12 that surrounds them. The display unit 11b is provided in contact with a part of the lower side of the inner contour of the frame of the housing 12. Moreover, the display section 11b has a smaller area than the display section 11a.

[0092] By adopting such a configuration, the area of ​​the display section 11a that functions as the main display surface can be increased. This allows for improved visibility, visibility at a glance, and convenience. When the resolution of the display element of the display unit 11b is reduced by arranging the display unit 11b on the lower side of the screen, Even in this case, a natural display can be produced.

[0093] [Configuration Example 2-3] 7A and 7B show an example of the configuration of a tablet-type electronic device 10c.

[0094] The housing 12 of the electronic device 10c has a frame that surrounds the display unit 11a and the display unit 11b. The frame has an inner contour of a quadrilateral shape with rounded corners. Four display sections 11b are provided along the inner contour of the frame. In other words, each display section 11b is provided at a corner of the inner contour of the frame. It is installed adjacent to the two sides.

[0095] FIG. 7A shows the electronic device 10c in such a manner that the long side of the housing 12 is approximately horizontal (also called horizontal orientation). 7B shows an example of a case where the electronic device 10c is used with the short side of the housing 12. This is an example of a case where the camera is used in a roughly horizontal position (also called a portrait orientation). The fingers 30a of the hand (here, the left hand) holding the electronic device 10c touch the four display units 11b. By touching any of the frame parts of the housing 12, the fingerprint can be captured. By arranging the display units 11b at the four corners of the screen, even when the electronic device 10c is rotated, Furthermore, fingerprints can be captured reliably regardless of whether the electronic device 10c is held in the left or right hand. It can be done.

[0096] 8A shows an example of the configuration of an electronic device 10d. As shown in FIG. Two display units 11b may be arranged within the frame. The display unit 11b is disposed at each of two corners located at both ends of one of the short sides of the inner contour. This allows the electronic device 10d to be used both horizontally and vertically. In either case, the fingerprint can be captured on the display unit 11b. .

[0097] Although FIG. 8A shows an example in which the electronic device 10d is held in the left hand, it can also be held in the right hand. When the electronic device 10d is to be held, it is only necessary to rotate the electronic device 10d by 180 degrees.

[0098] 8B shows an example of the configuration of the electronic device 10e. The electronic device 10e has a frame of the housing 12. One display unit 11b is provided in a partial area along the short side of the inner contour of the unit. With this configuration, the electronic device 10e can be placed sideways in the same manner as the electronic device 10d. Whether the terminal is used in portrait or landscape orientation, the fingerprint can be captured on the display unit 11b. The image can be executed.

[0099] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0100] (Embodiment 2) In this embodiment, a structural example of a display device according to one embodiment of the present invention will be described with reference to drawings. The display device exemplified below is the first display unit of the electronic device exemplified in Embodiment 1. This can be applied to the second display unit.

[0101] The display device exemplified below includes a light emitting element and a light receiving element. a function to detect the position of the object using the light reflected from the object; The display device exemplified below has a function of capturing an image of a fingerprint or the like using light. It can also be said that the sensor has both a function as a panel and a function as a fingerprint sensor.

[0102] A display device according to one embodiment of the present invention includes a light-emitting element (light-emitting device) that emits a first light, The light receiving element (light receiving device) receives the light of the light receiving element. It is preferable that the first light be visible light or infrared light. When infrared light is used as the first light, a light emitting element that emits visible light is also used. The light emitting element may have a structure in which the light emitting element

[0103] The display device also includes a pair of substrates (also referred to as a first substrate and a second substrate). The display element and the light receiving element are disposed between a first substrate and a second substrate. The first substrate is located on the side opposite the display surface side, and the second substrate is located on the side opposite the display surface side.

[0104] Visible light emitted from the light emitting element is emitted to the outside through the first substrate. By having a plurality of light emitting elements arranged in a matrix, an image can be displayed. Cut.

[0105] The first light emitted from the light emitting element reaches the surface of the first substrate. When an object touches the surface of the first substrate, the first light is scattered at the interface between the first substrate and the object, and the A part of the scattered light is incident on the light receiving element. When the light receiving element receives the first light, it outputs a signal in response to the intensity of the first light. The display device can convert the image data into an electrical signal and output it. By having multiple light receiving elements, the position information, shape, etc. of an object that touches the first substrate can be detected. That is, the display device can be an image sensor panel, a touch sensor panel, etc. It can function as.

[0106] Even if the object does not touch the surface of the first substrate, the first light that passes through the first substrate The light is reflected or scattered on the surface of the object, and the reflected or scattered light is transmitted through the first substrate. Therefore, the display device is a non-contact type touch sensor panel (near touch It can also be used as a panel.

[0107] When visible light is used as the first light, the first light used for displaying an image is transmitted to the touch sensor. In this case, the light emitting element functions as a display element and a light source. The first light also functions as a light source, which simplifies the configuration of the display device. When infrared light is used, it is not visible to the user, so the visibility of the displayed image is reduced. Image pickup or sensing can be performed by the light receiving element without any trouble.

[0108] When infrared light is used as the first light, it is preferable that the first light contains infrared light, preferably near-infrared light. In particular, a near-infrared light having one or more peaks in the wavelength range of 700 nm to 2500 nm is preferable. Infrared light can be preferably used, particularly in the wavelength range of 750 nm to 1000 nm. By using light having one or more peaks in the This is preferable because it spreads.

[0109] When a fingertip touches the surface of the display device, the shape of the fingerprint can be captured. There are concave and convex parts, and when a finger touches the first substrate, the convex parts of the fingerprint that touch the surface of the first substrate The first light is easily scattered. Therefore, the scattered light incident on the light receiving element overlapping the convex portion of the fingerprint The intensity of the scattered light incident on the light receiving element overlapping the recess is large, and the intensity of the scattered light incident on the light receiving element overlapping the recess is small. A device having a display device according to one embodiment of the present invention can capture an image of a fingerprint. The captured fingerprint image can be used to perform fingerprint authentication, a type of biometric authentication.

[0110] The display device can also capture images of blood vessels, particularly veins, in fingers and hands. Light with a wavelength of 760 nm or thereabouts is not absorbed by reduced hemoglobin in the veins, so it can be The position of veins is detected by capturing reflected light from the palm or finger with a light-receiving element and creating an image. The device having the display device according to one aspect of the present invention can display an image of the captured veins. This can be used to perform vein authentication, a type of biometric authentication.

[0111] Furthermore, a device including the display device of one embodiment of the present invention can perform touch sensing and fingerprint authentication. This allows for low-cost authentication without increasing the number of parts. It is possible to perform high-security biometric authentication at low cost.

[0112] The light receiving element is preferably an element capable of receiving both visible light and infrared light. The light-emitting element has both a light-emitting element that emits infrared light and a light-emitting element that emits visible light. It is preferable that the reflected light reflected by the user's finger is visible light. By receiving the infrared light with a light receiving element, the shape of the fingerprint can be captured. This allows for both fingerprint and vein authentication. This makes it possible to perform the process on a single display device. These may be performed at different times or simultaneously. By capturing the fingerprint and vein information simultaneously, the fingerprint and vein information are both included. This makes it possible to obtain image data that is accurate enough to achieve more accurate biometric authentication.

[0113] Furthermore, the display device of one embodiment of the present invention has a function of detecting the health condition of a user. For example, the reflectance and the reflectance for visible light and infrared light may be changed in response to changes in the oxygen saturation level in the blood. By utilizing the change in oxygen saturation and transmittance, the time modulation of the oxygen saturation can be obtained. It is also possible to measure the glucose concentration in the dermis and the neutral fat in the blood. The concentration and the like can also be measured using infrared light or visible light. The device has a function to acquire information that is an indicator of the user's health condition. It can be used as a healthcare device.

[0114] The first substrate may be a sealing substrate for sealing the light emitting element, a protective film, or the like. In addition, a resin layer may be provided between the first substrate and the second substrate to bond them together. may have

[0115] Here, the light emitting element is an OLED (Organic Light Emitting Diode) and QLED(Quantum-dot Light Emitting D) It is preferable to use an EL element such as an EL element (e.g., a luminescent element). , fluorescent materials, phosphorescent materials, inorganic compounds (quantum dots), materials, etc.), materials that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence activated delayed fluorescence (TADF) material) In addition, as a light emitting element, micro LED (Light Emitting Diode) LEDs such as LEDs (LEDs) can also be used.

[0116] As the light receiving element, for example, a pn-type or pin-type photodiode can be used. The light receiving element acts as a photoelectric conversion element that detects the light incident on the light receiving element and generates an electric charge. The amount of charge generated by a photoelectric conversion element is determined according to the amount of incident light. As the light receiving element, it is preferable to use an organic photodiode having a layer containing an organic compound. Organic photodiodes are easy to make thin, lightweight, and large in area, and are also easy to form. The high degree of freedom in shape and design allows it to be applied to a variety of display devices.

[0117] The light-emitting element can have, for example, a stacked structure including a light-emitting layer between a pair of electrodes. The light receiving element may have a laminated structure including an active layer between a pair of electrodes. The active layer can be made of a semiconductor material, such as an inorganic semiconductor material such as silicon. can be used.

[0118] It is also preferable to use an organic compound in the active layer of the light-receiving element. It is preferable that the electrode of the light receiving element and one of the electrodes (also called a pixel electrode) are provided on the same surface. Furthermore, the other electrodes of the light emitting element and the light receiving element are formed by an electrode ( It is more preferable that the light emitting element and the light receiving element are connected to each other through a common electrode. It is more preferable that the light emitting element and the light receiving element have a layer. The process can be simplified, the manufacturing cost can be reduced, and the manufacturing yield can be improved. Cut.

[0119] A more specific example will be described below with reference to the drawings.

[0120] [Display device configuration example 1] [Configuration Example 1-1] 9A is a schematic diagram of a display device 50. The display device 50 includes a substrate 51, a substrate 52, a light receiving The device includes an element 53, a light-emitting element 57R, a light-emitting element 57G, a light-emitting element 57B, a functional layer 55, and the like.

[0121] The light emitting element 57R, the light emitting element 57G, the light emitting element 57B, and the light receiving element 53 are connected to the substrate 51. It is provided between the substrates 52.

[0122] The light emitting element 57R, the light emitting element 57G, and the light emitting element 57B are red (R), green (G), and ) or blue (B) light.

[0123] The display device 50 has a plurality of pixels arranged in a matrix. The pixel has the above sub-pixels. Each sub-pixel has one light-emitting element. For example, the pixel has A configuration having three sub-pixels (three colors of R, G, and B, or yellow (Y), cyan (C), and magenta (M), or a structure with four sub-pixels (R, G, B, white (W) ) or R, G, B, Y). The light receiving element 53 may be provided in all pixels or in some pixels. Furthermore, one pixel may have a plurality of light receiving elements 53.

[0124] 9A shows a state in which a finger 60 touches the surface of the substrate 52. The light emitting element 57G emits light. A portion of the light that enters the substrate 52 is reflected or scattered at the contact point between the substrate 52 and the finger 60. Alternatively, a part of the scattered light is incident on the light receiving element 53, and when the finger 60 touches the substrate 52, That is, the display device 50 functions as a touch panel. It is possible.

[0125] The functional layer 55 includes circuits for driving the light emitting elements 57R, 57G, and 57B, and The functional layer 55 includes a switch, a transistor, Capacitances, wiring, etc. are provided. When the light receiving element 53 is driven by a passive matrix method, a switch or a transistor A configuration without a resistor may also be used.

[0126] The display device 50 may have a function of detecting a fingerprint of a finger 60. 52 is a schematic enlarged view of the contact portion when a finger 60 is in contact with the touch panel 52. 9B shows light emitting elements 57 and light receiving elements 53 arranged alternately.

[0127] A fingerprint is formed on the finger 60 by recesses and protrusions. The protrusions of the pattern come into contact with the substrate 52, and scattered light (indicated by the dashed arrow) is generated at the contact surface. Jiru.

[0128] As shown in FIG. 9B, the intensity distribution of the scattered light scattered at the contact surface between the finger 60 and the substrate 52 is approximately The strength is highest in the direction perpendicular to the contact surface, and the greater the angle in the diagonal direction, the lower the strength. Therefore, the light receiving element 5 located directly below the contact surface (overlapping with the contact surface) The intensity of the light received by the detector 3 is the highest. The light is totally reflected by the other surface of the substrate 52 (the surface opposite to the contact surface) and is transmitted to the light receiving element 53 side. Therefore, a clear fingerprint shape can be captured.

[0129] The arrangement interval of the light receiving elements 53 is the distance between two convex portions of a fingerprint, preferably the distance between adjacent concave portions and convex portions. By making the interval smaller than the distance between the portions, a clear image of the fingerprint can be obtained. Since the distance between the recesses and protrusions of a human fingerprint is approximately 200 μm, for example, the arrangement of the light receiving element 53 The row spacing is 400 μm or less, preferably 200 μm or less, and more preferably 150 μm or less. , more preferably 100 μm or less, and even more preferably 50 μm or less, Preferably, the thickness is 10 μm or more, and more preferably 20 μm or more.

[0130] An example of a fingerprint image captured by the display device 50 is shown in FIG. 9C. In the figure, the outline of the finger 60 is shown by a broken line, and the outline of the contact part 61 is shown by a dashed line. In this case, a fingerprint 62 with high contrast can be photographed depending on the difference in the amount of light incident on the light receiving element 53. It can be imagined.

[0131] The display device 50 can also function as a touch panel or a pen tablet. FIG. 9D shows a state in which the tip of the stylus 65 is in contact with the substrate 52 and is slid in the direction of the dashed arrow. This shows how the device is being used.

[0132] As shown in FIG. 9D, scattered light scattered at the contact surface between the tip of the stylus 65 and the substrate 52 is incident on the light receiving element 53 located in the area overlapping the contact surface, and the stylus 65 The position of the tip of the probe can be detected with high accuracy.

[0133] FIG. 9E shows an example of a trajectory 66 of the stylus 65 detected by the display device 50. The display device 50 is capable of detecting the position of a detection object such as a stylus 65 with high positional accuracy. It is also possible to perform high-resolution drawing in drawing applications, etc. Unlike capacitive touch sensors or electromagnetic induction touch pens, Since it is possible to detect the position of even high-profile objects, the material of the tip of the stylus 65 is not an issue. In addition, various writing implements (e.g., brushes, glass pens, quills, etc.) can also be used.

[0134] [Configuration Example 1-2] Hereinafter, a light emitting element that emits visible light, a light emitting element that emits infrared light, and a light receiving element will be described. An example of a configuration that can be implemented will be described below.

[0135] The display device 50a shown in FIG. 10A includes a light guide plate 50 in addition to the display device 50 shown in FIG. 9 and a light-emitting element 54.

[0136] The light guide plate 59 is provided on the substrate 52. The light guide plate 59 is a light guide plate for guiding visible light and infrared light. It is preferable to use a material that has high transparency to light with a wavelength of 600 nm. and transmittance for light with a wavelength of 800 nm is 80% or more, preferably 85% or more, More preferably, the content is 90% or more, and even more preferably, 95% or more and 100% or less. Fees can be used.

[0137] The light guide plate 59 is made of a material having a high refractive index relative to the light emitted by the light emitting element 54. For example, the refractive index for light with a wavelength of 800 nm is preferably 1.2 or more and 2.5 or less. Preferably, a material having a molecular weight of 1.3 or more and 2.0 or less, more preferably 1.4 or more and 1.8 or less is used. It is possible.

[0138] The light guide plate 59 and the substrate 52 are provided in contact with each other, or are bonded together with a resin layer or the like. In this case, the substrate 52 or the resin layer in contact with the light guide plate 59 is preferably The portion in contact with the light guide plate 59 has a wavelength range of 800 nm to 1000 nm, which is larger than that of the light guide plate 59. It is preferable that the refractive index of the material is low.

[0139] The light emitting element 54 is provided near the side surface of the light guide plate 59. The light emitting element 54 can emit infrared light IR from the side. As the light emitting element 54, a light emitting element capable of emitting infrared light can be used. EL elements such as OLED and QLED, or LEDs can be used. A plurality of such light guide plates may be provided along the side surfaces of the light guide plate 59.

[0140] In the following, an example in which both a user's fingerprint and blood vessels are captured using the display device 50a will be described. The display device 50a has two modes: a mode for capturing an image of a fingerprint using visible light and a mode for capturing an image of a fingerprint using infrared light. There are two modes: one that uses light to capture blood vessel images, and the other that uses both visible and infrared light to capture fingerprints and blood vessels. A mode in which both are captured as a single image can be implemented.

[0141] FIG. 10A shows how a fingerprint is captured using visible light. The light emitting element 54 is not made to emit light, and the light emitting element 57G is made to emit light. The light G is irradiated onto the surface of the finger 60, and a part of it is reflected or scattered. A part of the light (r) is incident on the light receiving element 53. The light receiving element 53 is arranged in a matrix. Therefore, by mapping the intensity of the scattered light G(r) detected by each light receiving element 53, , an image of the fingerprint of finger 60 can be acquired.

[0142] FIG. 10B shows how blood vessels are imaged using infrared light. The light emitting element 57R, the light emitting element 57G, and the light emitting element 57B are not made to emit light, and the light emitting element 54 is made to emit light. A part of the infrared light IR that diffuses inside the light guide plate 59 is incident on the contact between the light guide plate 59 and the finger 60. The infrared light IR penetrates from the area of ​​the finger 60 to the inside of the finger 60. The light is reflected or scattered by the blood vessels 67 present therein, and the scattered light IR(r) enters the light receiving element 53 . By mapping the intensity of the scattered light IR(r) detected by the light receiving element 53 in the same manner as above, An image of the blood vessels 67 can be acquired.

[0143] FIG. 10C shows the simultaneous imaging using visible light and infrared light. The scattered light G(r) and the scattered light IR(r) are incident on the light receiving element 53. The two scattered light intensities acquired by the optical element 53 are not distinguished from each other, and are mapped in the same manner as above. By doing so, an image that reflects the shape of the fingerprint and the shape of the blood vessels 67 can be acquired.

[0144] Here, the blood vessels 67 include veins and arteries. By doing so, the image can be used for vein authentication.

[0145] In addition, the arteries (arterioles) inside the finger 60 emit infrared light according to fluctuations in blood oxygen saturation. The reflectance to visible light changes. This change is acquired over time, i.e., blood By obtaining the time modulation of the oxygen saturation, pulse wave information can be obtained. This allows the user's heart rate to be measured. Although an example of acquiring pulse wave information has been shown, it is also possible to measure using visible light.

[0146] Furthermore, information that can be obtained by imaging the inside of the finger 60 and the blood vessels 67 includes information such as the oxygen concentration in the blood, In addition to saturation, there are also blood triglyceride levels and blood or dermal glucose levels. From the glucose concentration, blood sugar levels can be estimated. Such information can be used to It is an indicator of health status, so measuring it at least once a day will help you keep track of your daily health. The electronic device having the display device according to one embodiment of the present invention can be used for fingerprint recognition. When performing authentication or vein authentication, biometric information can be acquired at the same time, This allows you to manage your health unconsciously without any hassle.

[0147] In the above, the light emitting element 57G that emits green light is used as the light source of visible light. However, the present invention is not limited to this, and the light emitting element 57R or the light emitting element 57B may be used. Two or more of these elements may be used. In particular, blue light, which has low visibility, is used as a light source. This can reduce the visibility of images when performing touch sensing or fingerprint capture. can be suppressed.

[0148] Furthermore, as the light emitting element 54, not only one type of light emitting element is used, but also different types of light emitting elements are used. A plurality of light emitting elements that emit infrared light of wavelengths may be used, or a light emitting element that emits infrared light of continuous wavelengths may be used. The light source used for fingerprint authentication, vein authentication, or biometric information acquisition may be a Depending on the application, a light source that emits light of an appropriate wavelength can be selected and used.

[0149] [Configuration Example 1-3] By using a flexible material for the substrate of the display device of one embodiment of the present invention, the display device can be bent. By adopting such a configuration, it is possible to provide a display device that can A part of the device can be provided along a curved surface.

[0150] 11A shows an example of the configuration of a display device 50b. In order to achieve this, the display device 50b includes a substrate 51, a substrate 52, a light receiving element 53, and a light emitting element 54. It shows 7.

[0151] The display device 50b has a curved portion 40. In the curved portion 40, the display device 50b , the end portion thereof has a shape curved by 180 degrees.

[0152] 11A shows an example in which the substrate 51 is supported by a support 56a. The body 56a may be a part of the housing of an electronic device incorporating the display device 50b. By supporting the substrate 51 with the support 56a, the mechanical strength can be increased. In particular, when a flexible substrate is used as the substrate 51, the substrate 51 can be supported by the support 56a. It is preferable to support 1.

[0153] The substrate 51 and the substrate 52 can be made of a flexible material. It is preferable to use a material containing organic resin for the substrate 51 and the substrate 52. For the substrate 52, an inorganic insulating substrate such as a glass substrate thin enough to have flexibility is used. It is preferable that:

[0154] The portion of the display device 50b other than the curved portion 40 is a first display portion that functions as a main display surface. The curved portion 40 can be called a second display portion that functions as a secondary display surface. This can be done.

[0155] Here, the light receiving element 53 provided in the curved portion 40 (i.e., the second display portion) is the same as the first display portion. It is preferable that the second display portion is provided at a higher density than the first display portion. It is preferable that the area is smaller than the area of ​​the part.

[0156] In the curved portion 40, the light emitting element 57 can display an image along the curved surface. In addition, a light receiving element 53 provided on the bending portion 40 detects an object to be detected that is in contact with the bending portion 40. It can receive light reflected from

[0157] 11A shows an example in which the display device 50b is bent 180 degrees at the bending portion 40. However, the present invention is not limited to this. For example, the angle may be 30 degrees or more and 180 degrees or less, and preferably 60 degrees or more and 180 degrees or less. The curved angle is preferably 80 degrees or less, more preferably 90 degrees or more and 180 degrees or less. can.

[0158] The display device 50c shown in FIG. 11B is supported by a support 56b located on the display surface side. This is the main difference from the display device 50b.

[0159] The support 56b functions as a protective member that protects the display surface of the display device 50c. 56b is located on the display surface side of the display device 50c, and therefore, it emits visible light or visible light and infrared light. In addition, the support 56b is preferably transparent to light. The support 56b may have a polarizing plate (including a linear polarizing plate, a circular polarizing plate, etc.). The transparent substrate 1 may have a function as a scattering plate, a diffusing plate, an anti-reflection member, or the like.

[0160] The display device 50c has an adhesive layer 71 instead of the substrate 52. The adhesive layer 71 The adhesive layer 71 is made of a material that is irradiated with visible light or visible light and An organic resin that is translucent to infrared light and the like can be suitably used.

[0161] A display device 50d shown in FIG. 11C has a pair of curved portions 40a and 40b. The display device 50d has a pair of display screens positioned in the second display section, sandwiching a portion positioned in the first display section. It has a curved portion.

[0162] With this configuration, both ends of the display device 50d are folded back to the opposite side of the main display surface. Therefore, the frame of the electronic device to which the display device 50d is applied can be substantially eliminated. This makes it possible to realize an electronic device that is excellent in design and convenience.

[0163] The display device 50d is provided with a support 56a on the side opposite to the display surface side. As in the display device 50e shown in FIG. 1D, a support 56b may be provided on the display surface side. The display device 50e is attached to the support 56b by an adhesive layer 71.

[0164] The display device 50f shown in FIG. 12A has a curved portion 40c that functions as a second display portion. The display device 50f has a first display portion and a second display portion. The display device has a portion located in the curved portion 40c that functions as a display portion. The flat portion of the display device 50f is sandwiched between the pair of curved portions. , a portion located at the first display portion of the display device 50f and a flat portion located at the curved portion 40c. A curved portion is provided between them.

[0165] The display device 50f shown in FIG. 12A includes a first display unit that functions as a main display surface and a first display unit that functions as a display unit. It can also be said that the first display has a second display that is inclined relative to the first display. It can also be said that the normal directions of the first display unit and the second display unit are different from each other. By configuring the bending portion 40c to have a flat portion, when a finger touches the bending portion 40c, This allows for a larger contact area during authentication, resulting in more accurate authentication.

[0166] Here, the surface of the display device 50f located on the first display unit and the surface of the display device 50f located on the curved portion 40c are The angle (angle θ1) formed with the surface of the flat portion is preferably greater than 0 degrees and equal to or less than 90 degrees. Specifically, the angle is 15 degrees or more and 90 degrees or less, preferably 20 degrees or more and less than 90 degrees, and more preferably Alternatively, the angle θ1 can be set to 25 degrees or more and 90 degrees or less. It can be 45 degrees, 60 degrees, or 75 degrees, etc.

[0167] In addition, the surface of the flat portion located at the curved portion 40c of the display device 50f and the flat portion near the end The angle (angle θ2) formed with the surface is the angle obtained by subtracting the above angle θ1 from 180 degrees. It is preferable that:

[0168] Here, it is preferable that the second display section has a smaller area than the first display section.

[0169] FIG. 12A shows an example in which a support 56a is provided on the side opposite to the display surface side of a display device 50f. However, as in the case of a display device 50g shown in FIG. 12B, a support 56b is provided on the display surface side. The display device 50g is attached to the support 56b by an adhesive layer 71. do.

[0170] Also, as in the display device 50h shown in FIG. 12C and the display device 50k shown in FIG. 12D, A configuration having a pair of curved portions 40c and 40d may also be used. Then, both ends of the display device 50h or the display device 50k are folded back to the opposite side of the main display surface. Therefore, the display device 50h or the display device 50k can be used in an electronic device. This allows for the realization of electronic devices with excellent design and convenience. It can be realized.

[0171] The above is the description of the first configuration example of the display device.

[0172] [Display device configuration example 2] [Configuration Example 2-1] FIG. 13A shows a schematic cross-sectional view of the display device 100A.

[0173] The display device 100A includes a light receiving element 110 and a light emitting element 190. The light receiving element 110 , a pixel electrode 111, a common layer 112, an active layer 113, a common layer 114, and a common electrode 115. The light emitting element 190 includes a pixel electrode 191, a common layer 112, a light emitting layer 193, and a common layer 11. 4 and a common electrode 115.

[0174] Pixel electrode 111, pixel electrode 191, common layer 112, active layer 113, light-emitting layer 193, common The layer 114 and the common electrode 115 may each have a single layer structure or a laminated structure. That's fine.

[0175] The pixel electrode 111 and the pixel electrode 191 are located on the insulating layer 214. The pixel electrode 191 can be formed using the same material and in the same process.

[0176] The common layer 112 is located on the pixel electrode 111 and the pixel electrode 191. The common layer 112 is , a layer used in common by the light receiving element 110 and the light emitting element 190.

[0177] The active layer 113 overlaps with the pixel electrode 111 via the common layer 112. The light-emitting layer 193 is The active layer 113 overlaps with the pixel electrode 191 via the common layer 112. The active layer 113 contains a first organic compound. The light-emitting layer 193 contains a second organic compound different from the first organic compound.

[0178] Common layer 114 is located on common layer 112 , active layer 113 , and light-emitting layer 193 . The common layer 114 is a layer that is used in common by the light receiving element 110 and the light emitting element 190 .

[0179] The common electrode 115 is connected to the pixel electrode via the common layer 112, the active layer 113, and the common layer 114. The common electrode 115 has a portion overlapping with the common layer 112 and the light-emitting layer 193. , and has a portion overlapping with the pixel electrode 191 via the common layer 114. The common electrode 115 , a layer used in common by the light receiving element 110 and the light emitting element 190.

[0180] In the display device of this embodiment, an organic compound is used for the active layer 113 of the light receiving element 110. The light receiving element 110 has layers other than the active layer 113 in common with the light emitting element 190 (EL element). Therefore, in the manufacturing process of the light emitting device 190, the active layer 113 is formed. By simply adding a process, the light receiving element 110 can be formed in parallel with the formation of the light emitting element 190. Furthermore, the light emitting element 190 and the light receiving element 110 can be formed on the same substrate. Therefore, the light receiving element 110 can be built into the display device without significantly increasing the number of manufacturing steps. It is possible.

[0181] In the display device 100A, the active layer 113 of the light receiving element 110 and the light emitting layer 190 93 and 190 are made separately, but the light receiving element 110 and the light emitting element 190 have the same configuration. However, the configuration of the light receiving element 110 and the light emitting element 190 is not limited to this. The active layer 113 and the light-emitting element 190 are fabricated separately from each other in addition to the active layer 113 and the light-emitting layer 193. The display device 100 may have a light receiving element. It is preferable that the light emitting element 110 and the light emitting element 190 have one or more layers that are used in common (common layers). This allows the light receiving element 110 to be built into the display device without significantly increasing the number of manufacturing steps. It is possible.

[0182] The display device 100A includes a pair of substrates (substrate 151 and substrate 152) and a light receiving element 110 disposed between the substrates. , a light-emitting element 190, a transistor 131, a transistor 132, and the like.

[0183] In the light receiving element 110, the pixel electrodes 111 and the common electrode 115 are located between the pixel electrodes 111 and the common electrode 115. The common layer 112, the active layer 113, and the common layer 114 are organic layers (layers containing organic compounds). It is preferable that the pixel electrode 111 has a function of reflecting visible light. The end of the electrode 111 is covered by a partition wall 216. The common electrode 115 is transparent to visible light. It has the function of

[0184] The light receiving element 110 has a function of detecting light. Specifically, the light receiving element 110 is A photoelectric conversion element that receives light 122 incident from the outside via 152 and converts it into an electrical signal. is.

[0185] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at positions overlapping the optical element 110 and the light-emitting element 190. By providing this, the range in which the light receiving element 110 detects light can be controlled.

[0186] The light-shielding layer BM can be made of a material that blocks light emitted from the light-emitting element. It is preferable that M absorbs visible light. The light-shielding layer BM is made of, for example, a metal material or Black matrix is ​​created using resin materials containing pigments (carbon black, etc.) or dyes. The light-shielding layer BM can be formed with a red color filter, a green color filter, and a The transparent electrode may have a laminated structure of a transparent electrode and a blue color filter.

[0187] Here, a part of the light emitted from the light emitting element 190 is reflected within the display device 100A and is incident on the light receiving element 1 The light blocking layer BM can suppress the influence of such stray light. For example, if the light-shielding layer BM is not provided, the light 1 emitted from the light-emitting element 190 The reflected light 123a may be reflected by the substrate 152, and the reflected light 123b may be incident on the light receiving element 110. By providing the light-shielding layer BM, the reflected light 123b is prevented from entering the light-receiving element 110. This reduces noise and increases the sensitivity of the sensor using the light receiving element 110. This can be done.

[0188] In the light-emitting element 190, the pixel electrode 191 and the common electrode 115 are located between the pixel electrode 191 and the common electrode 115. The common layer 112, the light-emitting layer 193, and the common layer 114 can also be called an EL layer. The pixel electrode 191 preferably has a function of reflecting visible light. The pixel electrode 111 and the pixel electrode 191 are covered by the partition wall 216. They are electrically insulated from each other. The common electrode 115 has a function of transmitting visible light.

[0189] The light emitting element 190 has a function of emitting visible light. By applying a voltage between the element electrode 191 and the common electrode 115, light 121 is emitted to the substrate 152 side. It is an electroluminescent element that emits light.

[0190] The light-emitting layer 193 is preferably formed so as not to overlap the light-receiving region of the light-receiving element 110. This can prevent the light emitting layer 193 from absorbing the light 122, and This allows for a larger amount of light to be irradiated onto the target object.

[0191] The pixel electrode 111 is connected to the transistor 131 via an opening provided in the insulating layer 214. The edge of the pixel electrode 111 is electrically connected to the source or drain of the pixel electrode 111. is covered by

[0192] The pixel electrode 191 is connected to the transistor 132 via an opening provided in the insulating layer 214. The edge of the pixel electrode 191 is electrically connected to the source or drain of the pixel electrode 191. The transistor 132 has the function of controlling the driving of the light emitting element 190. Has.

[0193] The transistors 131 and 132 are formed on the same layer (substrate 151 in FIG. 13A). It is attached above.

[0194] At least a part of the circuit electrically connected to the light receiving element 110 is electrically connected to the light emitting element 190. It is preferable that the circuit is formed from the same material and in the same process as the circuit to which it is electrically connected. This allows the thickness of the display device to be thinner than when the two circuits are formed separately. In addition, the manufacturing process can be simplified.

[0195] Here, the common electrode 115 provided in common to the light emitting element 190 and the light receiving element 110 has a first It is preferable that the first potential is electrically connected to a wiring to which the first potential is applied. A fixed potential such as a common potential, a ground potential, or a reference potential can be used. The first potential applied to the common electrode 115 is not limited to a fixed potential, but may be two or more different potentials. You can also give selectively.

[0196] When the light receiving element 110 receives light and converts it into an electrical signal, the pixel electrode 111 has a common It is preferable to apply a second potential that is lower than the first potential applied to the conducting electrode 115. The potential of 2 is determined depending on the configuration, optical characteristics, and electrical characteristics of the light receiving element 110. In other words, the light receiving element 110 can be given a potential that is optimal for the above. Assuming that the cathode is a photodiode, a reverse bias voltage is applied to the cathode. A first potential is applied to the common electrode 115 which functions as anode, and a second potential is applied to the pixel electrode 115 which functions as an anode. The second potential applied to the electrode 191 can be selected. If not, the pixel electrode 111 is set to a potential that is the same as or approximately the same as the first potential, or A potential higher than the first potential may be applied.

[0197] On the other hand, when the light emitting element 190 is made to emit light, the pixel electrode 191 is connected to the common electrode 115. Preferably, a third potential higher than the first potential is applied to the light emitting element. The required luminance and brightness are determined depending on the structure of the element 190, the threshold voltage, and the current-brightness characteristics. That is, the light emitting element 190 can be made to function as a light emitting diode. When viewed as a diode, it functions as a cathode so that a forward bias voltage is applied. A first potential is applied to the common electrode 115 which functions as an anode, and a second potential is applied to the pixel electrode 191 which functions as an anode. In addition, when the light emitting element 190 is not made to emit light, In this case, the pixel electrode 191 is supplied with a potential that is the same as or approximately the same as the first potential, or a potential that is higher than the first potential. A lower potential may be applied.

[0198] In this example, the light receiving element 110 and the light emitting element 190 are formed such that the common electrode 115 is a cathode. The above description is of an example in which each pixel electrode functions as an anode and each pixel electrode functions as an anode. Instead, the common electrode 115 functions as an anode and each pixel electrode functions as a cathode. In this case, when the light receiving element 110 is driven, the second potential may be set to When the light emitting element 190 is driven, a potential higher than the first potential is applied to the second potential. All you have to do is apply a potential lower than potential 1.

[0199] The light receiving element 110 and the light emitting element 190 are each covered with a protective layer 195. 13A, a protective layer 195 is provided on and in contact with the common electrode 115. By providing the protective layer 195, impurities such as water can be prevented from entering the light receiving element 110 and the light emitting element 190. This can suppress the incorporation of the light receiving element 110 and the light emitting element 190, thereby improving the reliability of the light receiving element 110 and the light emitting element 190. In addition, the protective layer 195 and the substrate 152 are bonded together by the adhesive layer 142 .

[0200] As shown in FIG. 14A, a protective layer is provided on the light receiving element 110 and the light emitting element 190. In FIG. 14A, the adhesive layer 142 connects the common electrode 115 and the substrate 152. and are pasted together.

[0201] 14B, the light-shielding layer BM may not be provided. Since the light receiving area of ​​the light receiving element 110 can be increased, the sensitivity of the sensor can be further improved. .

[0202] [Configuration Example 2-2] FIG. 13B shows a cross-sectional view of the display device 100B. Description of the same configuration as the display device described above may be omitted.

[0203] The display device 100B shown in FIG. 13B has a lens 149 in addition to the configuration of the display device 100A. Has.

[0204] The lens 149 is provided at a position overlapping the light receiving element 110. In the display device 100B, a lens 149 is provided in contact with a substrate 152. The lens 149 is a convex lens having a convex surface on the substrate 151 side. The convex lens may be disposed in an area overlapping with the light receiving element 110.

[0205] When both the light-shielding layer BM and the lens 149 are formed on the same surface of the substrate 152, the formation Although FIG. 13B shows an example in which the lens 149 is formed first, it is also possible to form the light-shielding layer BM first. In FIG. 13B, the edge of the lens 149 is covered with a light-shielding layer BM. do.

[0206] The display device 100B has a configuration in which light 122 is incident on the light receiving element 110 via a lens 149. When the lens 149 is provided, the light receiving element 11 is more reflective than when the lens 149 is not provided. This increases the amount of light 122 incident on the light receiving element 110. can be increased.

[0207] The method for forming the lenses used in the display device of this embodiment is to form the lenses on the substrate or the light receiving element. A lens such as a microlens may be formed directly on the substrate, or a separately manufactured microlens may be formed on the substrate. A lens array such as a lens array may be attached to the substrate.

[0208] [Configuration Example 2-3] 13C is a schematic cross-sectional view of the display device 100C. , the substrate 152, and the partition wall 216 are not included, and the substrate 153, the substrate 154, the adhesive layer 155, the insulating The display device 100 differs from the display device 100A in that it has a layer 212 and a partition wall 217.

[0209] The substrate 153 and the insulating layer 212 are bonded together by an adhesive layer 155. and protective layer 195 are bonded together by adhesive layer 142.

[0210] The display device 100C includes an insulating layer 212, a transistor 131, and a transistor 132 formed on a fabrication substrate. The transistor 132, the light receiving element 110, the light emitting element 190, etc. are transposed onto the substrate 153. The substrate 153 and the substrate 154 are each flexible. This makes it possible to improve the flexibility of the display device 100C. It is preferable that the substrates 153 and 154 are made of resin.

[0211] The substrates 153 and 154 are made of polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate Polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, amide, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamide Imide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, poly Propylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose One or both of the substrate 153 and the substrate 154 may be made of a material such as silicon nanofiber. Alternatively, glass having a thickness sufficient to provide flexibility may be used.

[0212] A film having high optical isotropy may be used for the substrate of the display device of this embodiment mode. Triacetyl cellulose (TAC, cellulose acetate) is an example of a film with high optical isotropy. (also called triacetate) film, cycloolefin polymer (COP) film, cyclo Examples include olefin copolymer (COC) film and acrylic film.

[0213] The partition 217 preferably absorbs light emitted from the light emitting element. For example, a black matrix can be formed using a resin material containing a pigment or a dye. In addition, by using a brown resist material, the partition wall 217 can be formed of a colored insulating layer. It is possible.

[0214] The light 123c emitted from the light emitting element 190 is reflected by the substrate 152 and the partition wall 217. The light 123d may be incident on the light receiving element 110. The light 123c may be transmitted through the partition wall 217. The reflected light is reflected by a transistor or wiring, and enters the light receiving element 110. The light 123c is absorbed by the partition wall 217, and the reflected light 123d is received. This can reduce noise and prevent light from being incident on the light receiving element 110. The sensitivity of the sensor using this method can be increased.

[0215] The partition wall 217 preferably absorbs at least the wavelength of light detected by the light receiving element 110. For example, when the light receiving element 110 detects red light emitted by the light emitting element 190, It is preferable that the partition wall 217 absorbs at least red light. The color filter 123b absorbs red light 123c and reflects red light 123d. can be prevented from being incident on the light receiving element 110.

[0216] [Configuration Example 2-4] In the above example, the light emitting element and the light receiving element have two common layers. However, this is not limiting. Below, we will explain an example in which the common layer has a different configuration.

[0217] 15A is a schematic cross-sectional view of a display device 100D. The display device 100D includes a common layer 11 4, but has buffer layer 184 and buffer layer 194. The buffer layer 184 and the buffer layer 194 may each have a single layer structure. , may have a laminated structure.

[0218] In the display device 100D, the light receiving element 110 includes a pixel electrode 111, a common layer 112, an active layer 113, and a The display device 100D also includes a layer 113, a buffer layer 184, and a common electrode 115. 1, the light emitting element 190 includes a pixel electrode 191, a common layer 112, a light emitting layer 193, a buffer layer 194 and a common electrode 115.

[0219] In the display device 100D, a buffer layer 184 between the common electrode 115 and the active layer 113, An example will be shown in which the buffer layer 194 between the common electrode 115 and the light-emitting layer 193 is separately formed. The layer 184 and the buffer layer 194 may be, for example, an electron injection layer or an electron transport layer. Or both can be formed.

[0220] 15B is a schematic cross-sectional view of the display device 100E. 2, but has buffer layer 182 and buffer layer 192, which is different from display device 100A. The buffer layer 182 and the buffer layer 192 may each have a single layer structure. , may have a laminated structure.

[0221] In the display device 100E, the light receiving element 110 includes a pixel electrode 111, a buffer layer 182, The display device 100E includes an active layer 113, a common layer 114, and a common electrode 115. In the light emitting element 190, a pixel electrode 191, a buffer layer 192, a light emitting layer 193, a common layer 114 and a common electrode 115.

[0222] In the display device 100E, a buffer layer 182 between the pixel electrode 111 and the active layer 113, An example will be shown in which a buffer layer 192 between a pixel electrode 191 and a light-emitting layer 193 is separately formed. The layer 182 and the buffer layer 192 may be, for example, a hole injection layer or a hole transport layer. Or both can be formed.

[0223] 15C is a schematic cross-sectional view of the display device 100F. 2 and the common layer 114, and the buffer layer 182, the buffer layer 184, the buffer layer 192 1 and a buffer layer 194.

[0224] In the display device 100F, the light receiving element 110 includes a pixel electrode 111, a buffer layer 182, The display device 100 includes an active layer 113, a buffer layer 184, and a common electrode 115. In FIG. 1F, the light emitting element 190 includes a pixel electrode 191, a buffer layer 192, a light emitting layer 193, a buffer layer 194, a buffer layer 195, a buffer layer 196, a buffer layer 197, a buffer layer 198, a buffer layer 199, a buffer layer 191a, a buffer layer 199b, a buffer layer 199c, a buffer layer 199d, The pixel includes a buffer layer 194 and a common electrode 115 .

[0225] In the manufacture of the light receiving element 110 and the light emitting element 190, the active layer 113 and the light emitting layer 193 are formed. Not only can you separate it, but you can also create other layers.

[0226] In the display device 100F, the light receiving element 110 and the light emitting element 190 form a pair of electrodes (pixel electrodes 111 or between the pixel electrode 191 and the common electrode 115. The light receiving element 110 and the light emitting element 190 of the display device 100F are provided with pixel electrodes on the insulating layer 214. The electrode 111 and the pixel electrode 191 are formed using the same material and in the same process. The buffer layer 182, the active layer 113, and the buffer layer 184 are buffered on the pixel electrode 191. After the light emitting layer 192, the light emitting layer 193, and the buffer layer 194 are formed, the buffer layer The common electrode 115 is formed so as to cover the layer 184 and the buffer layer 194. do.

[0227] The stacked structure of the buffer layer 182, the active layer 113, and the buffer layer 184 and the buffer The order of forming the laminated structure of the light emitting layer 192, the light emitting layer 193, and the buffer layer 194 is not particularly limited. For example, after the buffer layer 182, the active layer 113, and the buffer layer 184 are formed, The buffer layer 192, the light-emitting layer 193, and the buffer layer 194 may be formed. Before the deposition of the photoresist layer 182, the active layer 113, and the buffer layer 184, the buffer layer 192 , a light-emitting layer 193, and a buffer layer 194 may be formed. The buffer layer 192, the active layer 113, the light-emitting layer 193, etc. may be deposited alternately in this order.

[0228] [Display device configuration example 3] A more specific example of the configuration of the display device will be described below.

[0229] [Configuration Example 3-1] FIG. 16 shows a perspective view of the display device 200A.

[0230] The display device 200A has a configuration in which a substrate 151 and a substrate 152 are bonded together. , the substrate 152 is shown in dashed lines.

[0231] The display device 200A includes a display unit 162, a circuit 164, wiring 165, etc. In FIG. 1 shows an example in which an IC (integrated circuit) 173 and an FPC 172 are mounted on a display device 200A. Therefore, the configuration shown in FIG. 16 includes a display device 200A, an IC, and an FPC. It can also be called a display module.

[0232] The circuit 164 can be a scanning line driver circuit.

[0233] The wiring 165 has a function of supplying signals and power to the display portion 162 and the circuit 164 . The signal and power are input from the outside via FPC172 or from IC173. The signal is input to wiring 165.

[0234] In Figure 16, the COG (Chip On Glass) method or the COF (Chip On In this example, an IC 173 is mounted on a substrate 151 using a method such as an IC Film. C173 can be applied to an IC having, for example, a scanning line driving circuit and a signal line driving circuit. The display device 200A and the display module may be configured without an IC. The IC may be mounted on the FPC using a COF method or the like.

[0235] FIG. 17 shows a part of the area including the FPC 172 of the display device 200A shown in FIG. a part of the area including the display unit 162, and a part of the area including the edge 1 shows an example of a cross section when each of the above is cut.

[0236] The display device 200A shown in FIG. 17 includes a transistor 20 between a substrate 151 and a substrate 152. 1, a transistor 205, a transistor 206, a light emitting element 190, a light receiving element 110, etc. do.

[0237] The substrate 152 and the insulating layer 214 are bonded together via an adhesive layer 142. A solid sealing structure or a hollow sealing structure can be applied to seal the light receiving element 110. In the example shown in FIG. 7, the space 143 surrounded by the substrate 152, the adhesive layer 142, and the insulating layer 214 is an inert It is filled with gas (nitrogen, argon, etc.) and has a hollow sealing structure. The substrate 152 and the adhesive layer 142 may be provided overlapping the light emitting element 190. The space 143 surrounded by the insulating layer 214 is filled with a resin different from that of the adhesive layer 142. That's fine.

[0238] The light emitting element 190 is made up of a pixel electrode 191, a common layer 112, and a light emitting layer 193 from the insulating layer 214 side. , a common layer 114, and a common electrode 115 are laminated in this order. 1 is connected to the conductive layer 22 of the transistor 206 through an opening provided in the insulating layer 214. The transistor 206 has a function of controlling the driving of the light emitting element 190. The edge of the pixel electrode 191 is covered with a partition wall 216. The common electrode 115 comprises a material that reflects visible light, and the common electrode 115 comprises a material that transmits visible light.

[0239] The light receiving element 110 is made up of a pixel electrode 111, a common layer 112, an active layer 113, and a common layer 114. The pixel electrode 11 has a laminated structure in which the pixel electrode 11, the common layer 114, and the common electrode 115 are laminated in this order. 1 is connected to the conductive layer 22 of the transistor 205 through an opening provided in the insulating layer 214. The end of the pixel electrode 111 is covered with a partition wall 216. The pixel electrode 111 contains a material that reflects visible light, and the common electrode 115 contains a material that transmits visible light. Contains materials that

[0240] The light emitted by the light emitting element 190 is emitted to the substrate 152 side. The light is incident on the substrate 152 through the space 143. The substrate 152 has a It is preferable to use a material that is highly transparent.

[0241] The pixel electrode 111 and the pixel electrode 191 can be manufactured using the same material and the same process. The common layer 112, the common layer 114, and the common electrode 115 are connected to the light receiving element 110 and the light emitting element 110. The light receiving element 110 and the light emitting element 190 are both formed of an active layer 113 and a light emitting layer. The structure of the layer 193 is different, but the other components can be the same. The light receiving element 110 can be built into the display device 100A without significantly increasing the amount of work required. .

[0242] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at positions overlapping the optical element 110 and the light-emitting element 190. By providing the shielding member, it is possible to control the range in which the light receiving element 110 detects light. By providing the optical layer BM, light from the light emitting element 190 is allowed to directly enter the light receiving element 110. Therefore, a sensor with low noise and high sensitivity can be realized.

[0243] The transistor 201, the transistor 205, and the transistor 206 are all substrate These transistors are formed on the same substrate 151 using the same material and process. It can be made.

[0244] On the substrate 151, an insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are formed. The insulating layer 211 is provided in this order. A part of the insulating layer 211 serves as a gate insulating layer for each transistor. The insulating layer 213 has a portion that functions as a gate insulating layer for each transistor. An insulating layer 215 is provided over the transistor. The gate insulating layer is formed to cover the gate electrode and has a function as a planarization layer. The number of insulating layers covering the transistor is not limited, and each may be a single layer or two or more layers. .

[0245] At least one insulating layer covering the transistor is designed to prevent impurities such as water and hydrogen from diffusing. It is preferable to use a material that can function as a barrier layer. This structure effectively prevents impurities from diffusing into the transistor from the outside. This can effectively suppress the noise and improve the reliability of the display device.

[0246] The insulating layer 211, the insulating layer 213, and the insulating layer 215 are each made of an inorganic insulating film. As the inorganic insulating film, for example, a silicon nitride film or a silicon oxynitride film is preferable. film, silicon oxide film, silicon nitride oxide film, aluminum oxide film, aluminum nitride film, etc. Inorganic insulating films such as hafnium oxide film, yttrium oxide film, Zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film Alternatively, a titanium film, a cerium oxide film, a neodymium oxide film, or the like may be used. Two or more layers may be stacked.

[0247] Here, organic insulating films often have lower barrier properties than inorganic insulating films. The organic insulating film preferably has an opening near the end of the display device 200A. It is possible to suppress the diffusion of impurities from the end portion of the display device 200A through the organic insulating film. Alternatively, the edge of the organic insulating film may be positioned inside the edge of the display device 200A. Even if an organic insulating film is formed on the edge of the display device 200A so that the organic insulating film is not exposed at the edge of the display device 200A, good.

[0248] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used include acrylic resin, polyimide resin, epoxy resin, polyamide resin, amide resin, polyimide amide resin, siloxane resin, benzocyclobutene resin, phenone Examples of the resin include olefin resins and precursors of these resins.

[0249] In the region 228 shown in FIG. 17, an opening is formed in the insulating layer 214. Even when an organic insulating film is used for the insulating layer 214, the display unit Therefore, the reliability of the display device 200A can be improved. It can be increased.

[0250] The transistors 201, 205, and 206 have gates a conductive layer 221 that functions as a gate insulating layer, an insulating layer 211 that functions as a gate insulating layer, a source and a drain the conductive layers 222a and 222b, which function as a gate insulating layer; the semiconductor layer 231; The insulating layer 213 functions as a gate, and the conductive layer 223 functions as a gate. The same hatching pattern is applied to multiple layers obtained by processing the same conductive film. The insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231. The insulating layer 213 is It is located between the conductive layer 223 and the semiconductor layer 231 .

[0251] The structure of a transistor included in the display device of this embodiment is not particularly limited. Using staggered transistors, reverse staggered transistors, etc. In addition, either a top-gate or bottom-gate transistor structure can be used. Alternatively, gates may be provided above and below the semiconductor layer where the channel is formed. That's fine.

[0252] The transistor 201, the transistor 205, and the transistor 206 have channels The structure in which the semiconductor layer is sandwiched between two gates is applied. and drive the transistors by supplying the same signal to them. A potential for controlling the threshold voltage is applied to one of the two gates, and a potential for driving the other is applied to the other. The threshold voltage of the transistor may be controlled by applying a potential of the above formula.

[0253] The crystallinity of the semiconductor material used in the transistor is not particularly limited. Single crystal semiconductors or semiconductors with crystallinity other than single crystal (microcrystalline semiconductors, polycrystalline semiconductors) A single-crystal semiconductor or a semiconductor having a crystalline region in part may be used. It is preferable to use a crystalline semiconductor because it can suppress deterioration of transistor characteristics.

[0254] The semiconductor layer of the transistor preferably contains a metal oxide (also called an oxide semiconductor). Alternatively, the semiconductor layer of the transistor may include silicon. For example, amorphous silicon, crystalline silicon (low-temperature polysilicon, single-crystal silicon, etc.) etc.)

[0255] The semiconductor layer may be, for example, a layer of indium and M (where M is gallium, aluminum, silicon, Boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium Rumanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, one or more selected from tantalum, tungsten, and magnesium), zinc, In particular, M is aluminum, gallium, yttrium, and Preferably, the metal oxide is one or more selected from tin.

[0256] In particular, the semiconductor layer is made of indium (In), gallium (Ga), and zinc (Zn). It is preferable to use an oxide containing IGZO (also referred to as IGZO).

[0257] When the semiconductor layer is an In-M-Zn oxide, the In the sputtering target, the atomic ratio of In is preferably equal to or greater than the atomic ratio of M. The atomic ratio of the metal elements in such a sputtering target is In:M:Zn. =1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:3, In: M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1 , In:M:Zn=5:1:3, In:M:Zn=5:1:6, In:M:Zn=5:1 :7, In:M:Zn=5:1:8, In:M:Zn=6:1:6, In:M:Zn=5 :2:5 etc.

[0258] When a target containing polycrystalline oxide is used as a sputtering target, This is preferable because it is easy to form a semiconductor layer having crystallinity. The atomic ratio is the plus or minus of the atomic ratio of the metal elements contained in the sputtering target. For example, the composition of the sputtering target used for the semiconductor layer is When the atomic ratio is In:Ga:Zn=4:2:4.1, the composition of the semiconductor layer to be formed is: The atomic ratio may be close to In:Ga:Zn=4:2:3.

[0259] When the atomic ratio is described as In:Ga:Zn=4:2:3 or in the vicinity, it means In When Ga is 4, this includes the case where Ga is 1 or more and 3 or less, and Zn is 2 or more and 4 or less. In addition, when describing that the atomic ratio is In:Ga:Zn=5:1:6 or in the vicinity, When n is 5, Ga is greater than 0.1 and less than or equal to 2, and Zn is greater than or equal to 5 and less than or equal to 7. It also includes cases where the atomic ratio is In:Ga:Zn=1:1:1 or in the vicinity. When mounting, when In is 1, Ga is greater than 0.1 and not more than 2, and Zn is 0. Includes cases where the value is greater than 1 and less than or equal to 2.

[0260] The transistors included in the circuit 164 and the transistors included in the display portion 162 have the same structure. The circuit 164 may have a plurality of transistors, or may have a different structure. The structures may all be the same, or there may be two or more types. The structures of the plurality of transistors may all be the same, or there may be two or more types.

[0261] A connecting portion 204 is provided in the area of ​​the substrate 151 where the substrate 152 does not overlap. In the connection portion 204, the wiring 165 is electrically connected to the FPC 172 via the conductive layer 166 and the connection layer 242. The upper surface of the connection portion 204 is made of the same conductive film as the pixel electrode 191. The conductive layer 166 thus obtained is exposed. Electrical connection can be made via the connection layer 242 .

[0262] Various optical members can be arranged on the outside of the substrate 152. Examples include a plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light-collecting film. The outside of the substrate 152 is coated with an anti-static film to prevent dust from adhering, a water-repellent film that makes the surface resistant to scratches, a hard coating that prevents scratches from occurring during use, and an impact absorbing layer. It may be placed.

[0263] The substrates 151 and 152 are made of glass, quartz, ceramic, sapphire, Resin or the like can be used. The substrate 151 and the substrate 152 are made of a flexible material. This can increase the flexibility of the display device.

[0264] The adhesive layer can be a photo-curable adhesive such as an ultraviolet curable adhesive, a reaction-curable adhesive, or a heat-curable adhesive. Various curing adhesives such as adhesives and anaerobic adhesives can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E VA (ethylene vinyl acetate) resin, etc. In particular, the moisture permeability of epoxy resin, etc. A material with low viscosity is preferable. Two-component resin may also be used. It may be used.

[0265] The connection layer 242 is made of an anisotropic conductive film (ACF). Conductive Film), Anisotropic Conductive Paste (ACP) Conductive Paste) can be used.

[0266] The light emitting element 190 may be a top emission type, a bottom emission type, a dual emission type, or a The electrode on the light extraction side uses a conductive film that transmits visible light. It is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted.

[0267] The light-emitting element 190 has at least a light-emitting layer 193. As the other layers, a material with high hole injection properties, a material with high hole transport properties, a hole blocking material, an electrode A material with high electron transport properties, a material with high electron injection properties, or a bipolar material (electron transport properties and For example, the common layer 112 may further include a layer containing a material having a high hole transporting property. It is preferable that the layer has one or both of a hole injection layer and a hole transport layer. For example, The layer 114 preferably has one or both of an electron transport layer and an electron injection layer.

[0268] The common layer 112, the light-emitting layer 193, and the common layer 114 contain low-molecular compounds and high-molecular compounds. The common layer 112 and the light-emitting layer may be made of any of these materials, and may contain inorganic compounds. The layers constituting the common layer 114 and the layer 193 are formed by deposition (including vacuum deposition), transfer, respectively. The layer can be formed by a method such as a copying method, a printing method, an ink jet method, or a coating method.

[0269] The light-emitting layer 193 may contain an inorganic compound such as quantum dots as a light-emitting material.

[0270] The active layer 113 of the light receiving element 110 includes a semiconductor, such as silicon. and organic semiconductors containing organic compounds. An example in which an organic semiconductor is used as the semiconductor in the conductive layer will be shown below. The light-emitting layer 193 of the light-emitting element 190 and the active layer 113 of the light-receiving element 110 are formed by the same method (for example, For example, it can be formed by a vacuum deposition method, which is preferable because it allows the use of common manufacturing equipment.

[0271] The active layer 113 has an n-type semiconductor material, such as fullerene (e.g., C 60 , C 70 The active layer 11 may be made of an organic semiconductor material having an electron-accepting property, such as a SiO 2 -based organic semiconductor material or a derivative thereof. The p-type semiconductor material of 3 is copper(II) phthalocyanine (Copper(II) ) phthalocyanine;CuPc) and tetraphenyldibenzoperiflante Tetraphenyldibenzoperiflanthene (DBP), Electron donor of lead phthalocyanine (ZnPc) Examples of suitable organic semiconductor materials include:

[0272] For example, the active layer 113 is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor. It's nice.

[0273] In addition to the gate, source and drain of the transistor, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten Examples of such materials include metals such as zinc and alloys containing such metals as the main component. The film containing the compound may be used as a single layer or as a laminate structure.

[0274] Examples of the light-transmitting conductive material include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as gallium zinc oxide, zinc oxide, zinc oxide containing gallium, or graphite Alternatively, gold, silver, platinum, magnesium, nickel, tungsten, Metallic materials such as iron, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium Alternatively, a nitride of the metal material (e.g., a nitride of the metal material) can be used. For example, titanium nitride) may be used. When using a material such as a fluoride, it is preferable to make it thin enough to have light-transmitting properties. A laminated film of a material can be used as the conductive layer. For example, a silver-magnesium alloy and an insulator can be used. It is preferable to use a laminated film of tin oxide or the like, since the conductivity can be increased. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive layers of the display element. The conductive layer may also be used as a pixel electrode or a common electrode.

[0275] Examples of insulating materials that can be used for each insulating layer include acrylic resin and epoxy resin. Resins such as fats, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, acid Examples of suitable insulating materials include inorganic insulating materials such as aluminum oxide.

[0276] [Configuration Example 3-2] 18A shows a cross-sectional view of the display device 200B. The display device 200B includes a lens 149 and The difference from the display device 200A is mainly in that the display device 200A has a protective layer 195.

[0277] By providing a protective layer 195 that covers the light receiving element 110 and the light emitting element 190, The diffusion of impurities such as water into the light receiving element 110 and the light emitting element 190 is suppressed. The reliability of the optical element 190 can be improved.

[0278] In a region 228 near the edge of the display device 200B, an insulating layer 214 is formed through an opening in the insulating layer 214. It is preferable that the insulating layer 215 and the protective layer 195 are in contact with each other. It is preferable that the inorganic insulating film of the protective layer 195 and the inorganic insulating film of the protective layer 195 are in contact with each other. This prevents impurities from diffusing from the outside into the display section 162 via the organic insulating film. This makes it possible to improve the reliability of the display device 200B.

[0279] FIG. 18B shows an example in which the protective layer 195 has a three-layer structure. 5 is an inorganic insulating layer 195a on the common electrode 115 and an organic insulating layer 195b on the inorganic insulating layer 195a. 95b and an inorganic insulating layer 195c on the organic insulating layer 195b.

[0280] The end of the inorganic insulating layer 195a and the end of the inorganic insulating layer 195c are aligned with the end of the organic insulating layer 195b. The inorganic insulating layer 195a extends outward from the insulating layer 214 and is in contact with the insulating layer 214. The insulating layer 215 (inorganic insulating layer) is in contact with the insulating layer 215 through the opening in the insulating layer 215 (organic insulating layer). The edge layer 215 and the protective layer 195 can surround the light receiving element 110 and the light emitting element 190. Therefore, the reliability of the light receiving element 110 and the light emitting element 190 can be improved.

[0281] In this way, the protective layer 195 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends further outward than the end of the organic insulating film. .

[0282] A lens 149 is provided on the surface of the substrate 152 facing the substrate 151. The lens 149 is The light receiving area of ​​the light receiving element 110 overlaps with the lens 149, and the light receiving area of ​​the light receiving element 110 overlaps with the lens 149. In addition, it is preferable that the light-receiving element 110 does not overlap with the light-emitting layer 193. This can increase the sensitivity and accuracy of the sensor.

[0283] The lens 149 has a refractive index of 1.3 or more and 2.5 or less for the wavelength of light received by the light receiving element 110. The lens 149 is preferably made of at least one of an inorganic material and an organic material. For example, the lens 149 can be formed using a material containing resin. In addition, by using a material containing at least one of oxide and sulfide for the lens 149, This can be done.

[0284] Specifically, resins containing chlorine, bromine, or iodine, resins containing heavy metal atoms, resins containing aromatic rings, Resin containing sulfur, resin containing sulfur, etc. can be used for the lens 149. A material containing nanoparticles of a material with a higher refractive index than the resin can be used for the lens 149. Titanium oxide or zirconium oxide can be used for the nanoparticles.

[0285] Also, cerium oxide, hafnium oxide, lanthanum oxide, magnesium oxide, niobium oxide , tantalum oxide, titanium oxide, yttrium oxide, zinc oxide, indium and tin containing oxide The lens 149 may be made of an oxide containing indium, gallium, and zinc, or an oxide containing indium, gallium, and zinc. Alternatively, zinc sulfide or the like can be used for the lens 149.

[0286] In the display device 200B, the protective layer 195 and the substrate 152 are bonded together by the adhesive layer 142. The adhesive layer 142 is overlaid on the light receiving element 110 and the light emitting element 190. The display device 200B is provided with a solid sealing structure.

[0287] [Configuration Example 3-3] FIG. 19A shows a cross-sectional view of the display device 200C. The display device 200C has a transistor The difference between the display device 200A and the display device 200B is mainly in the structure and the absence of the light-shielding layer BM and the lens 149. They are different.

[0288] The display device 200C includes a transistor 208, a transistor 209, and a and a transistor 210.

[0289] The transistors 208, 209, and 210 have gates a conductive layer 221 that functions as a gate insulating layer, an insulating layer 211 that functions as a gate insulating layer, a channel forming region 2 31i and a semiconductor layer having a pair of low resistance regions 231n, one of the pair of low resistance regions 231n the conductive layer 222a connected to one of the pair of low resistance regions 231n, and the conductive layer 222b connected to the other of the pair of low resistance regions 231n. b, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and The insulating layer 211 is formed between the conductive layer 221 and the channel. The insulating layer 225 is located between the conductive layer 223 and the channel forming region 231i. It is located between the area 231i.

[0290] The conductive layer 222a and the conductive layer 222b are provided on the insulating layer 225 and the insulating layer 215, respectively. The conductive layer 222a and the conductive layer 222b are connected to the low resistance region 231n through the opening. One of 2b functions as a source and the other functions as a drain.

[0291] The pixel electrode 191 of the light emitting element 190 is connected to one side of the transistor 208 via the conductive layer 222b. It is electrically connected to one of the pair of low resistance regions 231n.

[0292] The pixel electrode 111 of the light receiving element 110 is connected to one side of the transistor 209 via the conductive layer 222b. It is electrically connected to the other of the pair of low resistance regions 231n.

[0293] 19A shows an example in which an insulating layer 225 covers the top and side surfaces of the semiconductor layer. In FIG. 19B, the insulating layer 225 overlaps with the channel forming region 231i of the semiconductor layer 231. For example, the conductive layer 223 is used as a mask. By processing the insulating layer 225 using the above, the structure shown in FIG. 19B can be fabricated. In the example shown in FIG. 1, an insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the opening of the insulating layer 215 The conductive layer 222a and the conductive layer 222b are connected to the low resistance region 231n through the holes. Furthermore, an insulating layer 218 may be provided to cover the transistor.

[0294] [Configuration Example 3-4] FIG. 20 shows a cross-sectional view of a display device 200D. The display device 200D has a different substrate configuration. The main difference from the display device 200C is that:

[0295] The display device 200D does not have the substrate 151 and the substrate 152, but has the substrates 153, 154, It has an adhesive layer 155 and an insulating layer 212 .

[0296] The substrate 153 and the insulating layer 212 are bonded together by an adhesive layer 155. and protective layer 195 are bonded together by adhesive layer 142.

[0297] The display device 200D includes an insulating layer 212, a transistor 208, and a transistor 209 formed on a fabrication substrate. The transistor 209, the light receiving element 110, the light emitting element 190, etc. are transposed onto the substrate 153. The substrate 153 and the substrate 154 are each flexible. This is preferable, as it allows the display device 200D to have increased flexibility.

[0298] The insulating layer 212 can be used for the insulating layer 211, the insulating layer 213, and the insulating layer 215. Alternatively, the insulating layer 212 may be a combination of an organic insulating film and an inorganic insulating film. In this case, the film on the transistor 209 side is an inorganic insulating film. It is preferable that

[0299] The above is a description of an example of the configuration of the display device.

[0300] [About metal oxides] Metal oxides applicable to the semiconductor layer will be described below.

[0301] In this specification, metal oxides containing nitrogen are also referred to as metal oxides (metal oxides). Metal oxides containing nitrogen are sometimes collectively called metal oxynitrides (metal oxynitrides). For example, zinc oxynitride (ZnON) Nitrogen-containing metal oxides such as the above may be used for the semiconductor layer.

[0302] In this specification, CAAC (c-axis aligned crystal) l), and when written as CAC (Cloud-Aligned Composite) CAAC represents an example of a crystal structure, and CAC represents an example of a function or material configuration. .

[0303] For example, the semiconductor layer uses CAC (Cloud-Aligned Composite) OS (Oxide Semiconductor) can be used.

[0304] CAC-OS or CAC-metal oxide is a material that has a conductive function in some parts. The material has insulating properties in some parts and semiconductor properties in the whole material. Note that CAC-OS or CAC-metal oxide is used as the semiconductor of a transistor. When used in a dielectric layer, the conductive function is to allow electrons (or holes) to flow as carriers. The insulating function is to prevent the flow of electrons, which act as carriers. By making the functions of the two complementary, the switching function (On / Off) This function (which turns off the power supply) is given to CAC-OS or CAC-metal oxide. In CAC-OS or CAC-metal oxide, By separating the functions, the functionality of both can be maximized.

[0305] In addition, CAC-OS or CAC-metal oxide is a conductive region and an insulating region. The conductive region has the above-mentioned conductive function, and the insulating region has the above-mentioned insulating function. In addition, the conductive region and the insulating region in the material are formed by nanoparticle layers. The conductive and insulating regions may be separated by a bell. In addition, the conductive area may be observed as a cloud-like connected area with a blurred periphery. This may be the case.

[0306] In addition, in the CAC-OS or CAC-metal oxide, a conductive region and The insulating regions are each 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. They may be dispersed in the material at sizes of less than 1 m.

[0307] In addition, CAC-OS or CAC-metal oxide has different band gaps For example, CAC-OS or CAC-metal ox The ide consists of a wide-gap component due to the insulating region and a conductive component due to the conductive region. In this configuration, when carriers flow, In addition, carriers mainly flow in the narrow gap component. The component with a narrow gap acts complementary to the component with a wide gap. Carriers also flow into the wide-gap component in conjunction with the component that has a wide gap. CAC-OS or CAC-metal oxide is used as the channel formation region of the transistor. When used in a transistor, it has a high current driving force in the on-state, i.e., a large on-current. , and high field-effect mobility can be obtained.

[0308] That is, CAC-OS or CAC-metal oxide is a matrix composite. matrix composite, or metal matrix composite It can also be called a matrix composite.

[0309] Oxide semiconductors (metal oxides) are classified into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. As a non-single-crystal oxide semiconductor, for example, CAAC-OS (c- axis aligned crystalline oxide semiconductor ctor), polycrystalline oxide semiconductor, nc-OS (nanocrystalline ox ide semiconductor), pseudo-amorphous oxide semiconductor (a-like OS : amorphous-like oxide semiconductor), and non crystalline oxide semiconductors.

[0310] CAAC-OS has a c-axis orientation and multiple nanocrystals are connected in the ab-plane direction. The crystal structure is distorted by the connection of multiple nanocrystals. In the region, the lattice arrangement is changed between a region with a uniform lattice arrangement and another region with a uniform lattice arrangement. This refers to the point where the direction of the

[0311] Nanocrystals are basically hexagonal, but are not limited to regular hexagonal shapes. They may also have non-regular hexagonal shapes. In addition, the distortion may have lattice arrangements such as pentagons and heptagons. In CAAC-OS, clear grain boundaries are observed even near the strain. It is difficult to confirm the lattice distortion. This is because the CAAC-OS has a crystalline structure in the ab-plane direction. The oxygen atoms are not densely packed, and the bond distance between atoms is shortened by the substitution of metal elements. This is because distortion can be tolerated by changing the frequency.

[0312] In addition, the CAAC-OS has a layer containing indium and oxygen (hereinafter referred to as an In layer) and an element A layered crystal structure consisting of layers containing M, zinc, and oxygen (hereinafter referred to as the (M,Zn) layer). (also called layer structure). Indium and element M are mutually substitutable. When the element M in the (M,Zn) layer is replaced with indium, the (In,M,Zn) layer Also, when indium in the In layer is substituted with element M, (In,M) It can also be expressed as a layer.

[0313] CAAC-OS is a highly crystalline metal oxide. Since it is difficult to identify grain boundaries, the decrease in electron mobility caused by grain boundaries is unlikely to occur. In addition, the crystallinity of metal oxides can be reduced by the incorporation of impurities or the generation of defects. Therefore, CAAC-OS should be free from impurities and defects (oxygen vacancies (V O :oxygen v It can also be called a metal oxide with low acancy. Metal oxides with CAAC-OS have stable physical properties. The metal oxides used are heat resistant and highly reliable.

[0314] nc-OS is a material that can be used in microscopic areas (e.g., areas between 1 nm and 10 nm, especially areas between 1 nm and 10 nm). The atomic arrangement is periodic in the region of 3 nm or less. There is no regularity in the crystal orientation between the crystals. Therefore, no orientation is observed throughout the film. Therefore, depending on the analytical method, nc-OS may be classified as a-like OS or amorphous oxide semiconductor. It may be indistinguishable from the body.

[0315] Indium gallium oxide, a type of metal oxide containing indium, gallium, and zinc, is used. The IGZO nanocrystals mentioned above are stable. In particular, IGZO tends to have difficulty growing crystals in the atmosphere. , small crystals (e.g., crystals of several mm or several cm) are more likely to be formed than large crystals (here, crystals of several mm or several cm). For example, the nanocrystals mentioned above may be structurally more stable.

[0316] The a-like OS is a metal oxide semiconductor with a structure between the nc-OS and the amorphous oxide semiconductor. The a-like OS has pores or low density regions. The ke-OS has lower crystallinity than the nc-OS and CAAC-OS.

[0317] Oxide semiconductors (metal oxides) have a variety of structures, each with different properties. The oxide semiconductor of one embodiment of the present invention may be an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-li The ke-OS, nc-OS, and CAAC-OS may have two or more of them.

[0318] The metal oxide film that functions as a semiconductor layer is heated with either an inert gas or oxygen gas, or The metal oxide film can be formed by using both of the oxygen flow rate and the oxygen flow rate. There is no particular limitation on the ratio (oxygen partial pressure). However, in order to obtain a transistor with high field effect mobility, In this case, the oxygen flow rate (oxygen partial pressure) during the formation of the metal oxide film is 0% or more. Preferably, it is 30% or less, more preferably 5% to 30% or less, and even more preferably 7% to 15% or less. Preferred.

[0319] The metal oxide preferably has an energy gap of 2 eV or more, and more preferably 2.5 eV or more. It is more preferable that the electron energy is 3 eV or more, and even more preferable that the electron energy is 3 eV or more. The off-state current of a transistor is reduced by using a metal oxide with a wide energy gap. It is possible.

[0320] The substrate temperature during the deposition of the metal oxide film is preferably 350°C or less, and is preferably between room temperature and 200°C. The temperature is more preferably from room temperature to 130° C., and even more preferably from room temperature to 130° C. The temperature is preferably room temperature, as this can increase productivity.

[0321] The metal oxide film can be formed by sputtering. The LD method, PECVD method, thermal CVD method, ALD method, vacuum deposition method, etc. may also be used.

[0322] This concludes the explanation of metal oxides.

[0323] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0324] (Embodiment 3) In this embodiment, a display device that can be applied to electronic devices of one embodiment of the present invention will be described with reference to FIG. A, explanation will be given using Figure 21B.

[0325] A display device according to one embodiment of the present invention includes a first pixel circuit having a light-receiving element and a light-emitting element. and a second pixel circuit. The first pixel circuit and the second pixel circuit each include a matrix. The plates are arranged in a square pattern.

[0326] FIG. 21A shows an example of a first pixel circuit having a light receiving element, and FIG. 21B shows an example of a first pixel circuit having a light emitting element. 1 shows an example of a second pixel circuit having a

[0327] The pixel circuit PIX1 shown in FIG. 21A includes a light receiving element PD, a transistor M1, a transistor The transistor M2, the transistor M3, the transistor M4, and the capacitance element C1 are included. An example is shown in which a photodiode is used as the optical element PD.

[0328] The cathode of the light receiving element PD is electrically connected to the wiring V1, and the anode is connected to the transistor M1. The gate of the transistor M1 is electrically connected to either the source or the drain of the TX, and the other of the source and drain is one electrode of the capacitance element C1. The source or drain of the transistor M2 is electrically connected to the gate of the transistor M3. The transistor M2 has a gate electrically connected to the wiring RES and a source or drain The other of the source and drain is electrically connected to the wiring V2. One of the sources or drains is electrically connected to the wiring V3, and the other of the source or drain is connected to the transistor M4 The gate of the transistor M4 is electrically connected to either the source or drain of the The other of the source and drain is electrically connected to the wiring OUT1. .

[0329] A constant potential is supplied to the wiring V1, wiring V2, and wiring V3. When driving with a reverse bias, a potential lower than the potential of the wiring V1 is supplied to the wiring V2. The transistor M2 is controlled by a signal supplied to the wiring RES. A function that resets the potential of the node connected to the gate of M3 to the potential supplied to wiring V2 The transistor M1 is controlled by a signal supplied to the wiring TX, and the light receiving element P The timing at which the potential of the above node changes depending on the current flowing through D, or the timing at which the photodetector PD The transistor has the function of controlling the timing at which the charge generated in the transistor is transferred to the node. The transistor M3 functions as an amplifying transistor that outputs an output according to the potential of the node. The transistor M4 is controlled by a signal supplied to the line SE, and is set in accordance with the potential of the node. It functions as a selection transistor to read the output with an external circuit connected to the OUT1 wiring. do.

[0330] The pixel circuit PIX2 shown in FIG. 21B includes a light-emitting element EL, a transistor M5, a transistor Here, the light-emitting element EL includes: This shows an example using a light-emitting diode. In particular, an organic EL element is used as the light-emitting element EL. It is preferable that

[0331] The transistor M5 has a gate electrically connected to the wiring VG and a source or drain One of the source and drain terminals is electrically connected to the wiring VS, and the other of the source and drain terminals is connected to one of the capacitors C2. The source of the transistor M6 is electrically connected to the electrode of the transistor M1 and the gate of the transistor M6. One of the drain and the anode of the light-emitting element EL is electrically connected to the wiring V4, and the other is electrically connected to the anode and the drain of the light-emitting element EL. and electrically connected to either the source or the drain of the transistor M7. 7, the gate is electrically connected to the wiring MS, and the other of the source and drain is connected to the wiring OUT2 The cathode of the light-emitting element EL is electrically connected to a wiring V5.

[0332] A constant potential is supplied to the wiring V4 and the wiring V5. The transistor M can be set to a high potential and the cathode side can be set to a lower potential than the anode side. 5 is controlled by a signal supplied to the wiring VG, and controls the selection state of the pixel circuit PIX2. The transistor M6 also functions as a select transistor for It functions as a driving transistor that controls the current flowing through the light-emitting element EL according to the potential applied When the transistor M5 is in a conducting state, the potential supplied to the wiring VS is The potential is supplied to the gate, and the luminance of the light emitting element EL can be controlled according to the potential. The transistor M7 is controlled by a signal supplied to the wiring MS, and the transistor M6 and the light emitting The potential between the element EL and the element EL is output to the outside via a wiring OUT2.

[0333] In the display device of this embodiment, an image is displayed by making the light emitting element emit light in a pulsed manner. By shortening the driving time of the light emitting element, the power consumption of the display device can be reduced, and In particular, organic EL elements have excellent frequency characteristics, The frequency can be, for example, 1 kHz or more and 100 MHz or less.

[0334] Here, the pixel circuit PIX1 has a transistor M1, a transistor M2, a transistor transistor M3, transistor M4, and transistor M5 of pixel circuit PIX2, The transistors M6 and M7 each have a semiconductor layer in which a channel is formed. It is preferable to use a transistor using a metal oxide (oxide semiconductor) for the gate insulating film.

[0335] Using metal oxides with a wider band gap and lower carrier density than silicon The transistor can achieve an extremely small off-state current. The off-state current allows the charge accumulated in the capacitor connected in series with the transistor to be released over a long period of time. Therefore, it is possible to hold the capacitance by connecting the capacitance element C1 or the capacitance element C2 in series. The transistors M1, M2, and M5 connected to It is preferable to use a transistor in which a semiconductor is applied. Similarly, by using a transistor including an oxide semiconductor, the manufacturing cost of the transistor can be reduced. It is possible.

[0336] In addition, the transistors M1 to M7 have a semiconductor in which a channel is formed. It is also possible to use transistors that use silicon. By using highly crystalline silicon such as silicon dioxide, high field-effect mobility can be achieved. This is preferable because it allows for faster operation.

[0337] In addition, an oxide semiconductor is used for at least one of the transistors M1 to M7. In addition, a silicon-based transistor is used. Good too.

[0338] In addition, in FIGS. 21A and 21B, the transistors are n-channel transistors. However, a p-channel transistor can also be used.

[0339] The transistors included in the pixel circuit PIX1 and the transistors included in the pixel circuit PIX2 are It is preferable that they are formed side by side on the same substrate. The transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are mixed in one area and periodically It is preferable to have a configuration in which the electrodes are arranged.

[0340] In addition, a transistor and a capacitor element are provided at a position overlapping with the light receiving element PD or the light emitting element EL. It is preferable to provide one or more layers having one or both of these. This reduces the effective area occupied by the path, and allows for a high-definition light receiving section or display section.

[0341] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0342] 10, 10a to 10e: electronic device, 11a, 11b: display unit, 12: housing, 13: speaker Ka, 14: microphone, 21a, 21a1, 21a2, 21b, 21b1, 21b2: pixels, 22, 22B, 22G, 22R: display element, 23: light receiving element, 24: pixel, 25: unit 30a, 30b: Fingers, 40, 40a to 40d: Curved parts, 50, 50a to 50h, 50 k: display device, 51, 52: substrate, 53: light receiving element, 54: light emitting element, 55: functional layer, 5 6a, 56b: Supports, 57, 57B, 57G, 57R: Light-emitting elements, 59: Light guide plate, 60 : finger, 61: contact part, 62: fingerprint, 63: imaging range, 65: stylus, 66: trajectory, 6 7: Blood vessels, 71: Adhesive layer

Claims

[Claim 1] A display device having a first display area and a second display area, the first display area and the second display area are provided adjacent to each other, the first display region includes a plurality of first light-emitting elements and a plurality of first light-receiving elements; the second display region includes a plurality of second light-emitting elements and a plurality of second light-receiving elements; the first light receiving element has a function of receiving first light emitted by the first light emitting element, the second light receiving element has a function of receiving second light emitted by the second light emitting element, the first light-emitting elements and the first light-receiving elements are arranged in a matrix in the first display area, the second light-emitting elements and the second light-receiving elements are arranged in a matrix in the second display area, the second light receiving elements are arranged at a higher density than the first light receiving elements; Display device.

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