Imaging apparatus
The imaging device uses a heat dissipation member with perpendicular fixing regions and bent connections to efficiently cool imaging elements without increasing drive load, addressing the challenge of cooling and stabilization in imaging devices.
Patent Information
- Application Number
- JP2024088623
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-12-11
AI Technical Summary
Existing imaging devices face challenges in achieving sufficient cooling performance for imaging elements without increasing the drive load during image stabilization, as existing solutions either require more heat transfer members or wider members, leading to larger mechanisms or decreased responsiveness.
The imaging device incorporates a heat dissipation member with a first and second main fixing region perpendicular to the imaging optical axis, connected by a bent portion parallel to the optical axis, which transfers heat without bulging outward and maintains drive control efficiency.
This configuration ensures effective cooling of the imaging element while preventing an increase in drive load and mechanism size, thus maintaining image stabilization responsiveness.
Smart Images

Figure 2025180926000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to an imaging device having an image stabilization mechanism and a heat dissipation structure. [Background technology]
[0002] In imaging devices such as digital still cameras and video cameras, imaging elements such as CMOS sensors generate heat during operation. Therefore, imaging devices are equipped with a cooling mechanism to prevent the imaging element from exceeding its guaranteed operating temperature. Furthermore, imaging devices equipped with an image stabilization mechanism that corrects image shake by displacing the imaging element in a plane perpendicular to the imaging optical axis to improve image quality are becoming widespread.
[0003] For imaging devices equipped with such image stabilization mechanisms, there is a demand for a cooling mechanism that efficiently cools the image sensor without increasing the drive load during image stabilization drive. In response to this demand, Patent Document 1 discloses a technique for reducing the drive load when driving the movable part of the image stabilization mechanism by orthogonally orthogonalizing the thickness direction of a bendable heat transfer member connecting the movable part and fixed part of the image stabilization mechanism to the imaging optical axis. Patent Document 2 also discloses a technique for reducing the effect of the heat transfer member on the drive load by determining the position through which the movable part passes during image stabilization drive. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] International Publication No. 2020 / 202811 [Patent Document 2] Patent Publication No. 2021-189225 Summary of the Invention [Problem to be solved by the invention]
[0005] In the technology disclosed in Patent Document 1, the thickness direction of the heat transfer member is perpendicular to the imaging optical axis, so in order to increase the amount of heat transfer, it is necessary to increase the number of heat transfer members or widen the width of the heat transfer members. However, as a result, the drive load during image stabilization driving, which displaces the movable part having the imaging element, increases, and there is a risk that the image stabilization mechanism will become larger. Furthermore, in the technology disclosed in Patent Document 2, the via position is fixed, so the responsiveness of the image stabilization will decrease.
[0006] The present invention has been made in view of the above circumstances, and has as its object to provide an imaging device that can obtain sufficient cooling performance for the imaging element without impeding drive control for image stabilization. [Means for solving the problem]
[0007] The imaging device of the present invention is an imaging device having a movable part equipped with an imaging element, a fixed part that supports the movable part so that it can move within a plane perpendicular to the imaging optical axis, and a heat dissipation member that connects the movable part and the fixed part, wherein the heat dissipation member has a first main fixing region fixed to the movable part, a second main fixing region fixed to the fixed part, and a connecting part that connects the first main fixing region and the second main fixing region, the first main fixing region and the second main fixing region each being perpendicular to the imaging optical axis, and the connecting part having at least one first bent portion that is arranged in a gap formed between the movable part and the fixed part in a direction parallel to the imaging optical axis. [Effects of the Invention]
[0008] According to the present invention, sufficient cooling performance for the image sensor can be obtained without impeding drive control for image stabilization. [Brief explanation of the drawings]
[0009] [Figure 1] 1 is a block diagram showing a configuration of an imaging system according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of an imaging device that constitutes the imaging system. [Figure 3] FIG. 2 is an exploded perspective view of an imaging unit disposed inside the imaging device. [Figure 4] 1 is a perspective view showing a configuration of a heat dissipation member and its vicinity according to a first embodiment. FIG. [Figure 5] 2 is a cross-sectional view showing the configuration of the heat dissipation member and its vicinity according to the first embodiment. FIG. [Figure 6] FIG. 2 is a development view of the heat dissipation member according to the first embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing the configuration of a heat dissipation member and its vicinity according to a second embodiment. [Figure 8] FIG. 10 is a development view of a heat dissipation member according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a block diagram showing a schematic configuration of an imaging system 1 according to an embodiment. The imaging system 1 is generally composed of an imaging device 100 and a lens device 10 that is detachable from the imaging device 100. Here, the imaging device 100 is a so-called interchangeable lens digital still camera.
[0011] The imaging device 100 includes a lens mount 103, a shutter 200, a shutter control unit 210, an imaging unit 300, an image processing unit 32, a system control unit 30, a memory 31, a power supply control unit 33, a battery 80, an external communication terminal 121, and a thermometer 50. The imaging device 100 also includes an operation member 60, a power switch 61, a display unit 40, a gyro sensor 20, and a storage medium 90. The imaging unit 300 has an imaging element 311 and an image stabilization mechanism. The lens device 10 includes a lens 11, a lens control unit 12, an aperture (not shown), and a camera mount 13.
[0012] The lens mount 103 is a member (camera-side mount) for attaching and detaching the lens device 10. When the lens device 10 is attached to the lens mount 103, electrical contacts provided on the lens mount 103 and the camera mount 13 (lens-side mount) of the lens device 10 are connected, enabling communication and power supply between the lens control unit 12 and the system control unit 30. The shutter 200 controls the amount of exposure to the image sensor 311 by opening and closing. Light incident on the lens device 10 is guided to the image sensor 311 through the shutter 200, and an image is formed on the imaging surface of the image sensor 311.
[0013] In the imaging unit 300, the imaging element 311 converts the optical image formed on the imaging surface into an analog electrical signal (imaging signal) and sends it to the image processing unit 32. The image processing unit 32 converts the imaging signal sent from the imaging element 311 into a digital signal, then performs a predetermined development process to generate image data, and writes the generated image data to the storage medium 90. The image processing unit 32 also generates an image signal to be displayed on the display unit 40 from the image data read from the storage medium 90. The image shake correction mechanism displaces (sways or moves) the movable unit 330 (see FIG. 3 ) equipped with the imaging element 311 in a plane perpendicular to the imaging optical axis (in a plane parallel to the imaging surface of the imaging element 311) in accordance with the amount of shake detected by the gyro sensor 20. This makes it possible to correct image shake caused by camera shake or the like.
[0014] The system control unit 30 is a microcomputer that performs overall control of the imaging system 1. For example, the system control unit 30 controls the driving of the lens 11 and the aperture via the shutter control unit 210 and the lens control unit 12 to perform AF processing and AE processing based on the results of calculations performed by the image processing unit 32 on image data captured by the image sensor 311. The memory 31 is a storage medium such as an EEPROM that stores constants, variables, programs, etc. for the operation of the system control unit 30, and also stores the state of the image sensor 311 according to the image stabilization mechanism (position information of the movable unit 330). The display unit 40 includes a rear monitor 175 (see FIG. 2) and an EVF 176 (see FIG. 2), and displays live view video, captured images, menus for configuring various settings for the imaging system 1, etc.
[0015] The thermometer 50 measures the temperatures of various heat-generating components, including the image sensor 311. The power switch 61 is an operating member that switches the power of the image capture device 100 on and off. The operating member 60 here refers to various buttons, switches, dials, etc. other than the power switch 61, and is used to select and set functions when capturing images, replaying images, communicating, etc. The gyro sensor 20 detects the amount of image blur in the image capture device 100. The power control unit 33 is composed of a battery detection circuit, a DC / DC converter, a switch circuit that switches between power-conducting blocks, etc., and detects the type and remaining charge of the battery 80 and supplies the required voltage to each unit for the required period based on the detection results and instructions from the system control unit 30.
[0016] The lens device 10 is a so-called interchangeable lens. The lens 11 is composed of multiple lenses such as a focus lens, a zoom lens, and an image stabilization lens. The lens control unit 12 controls the operation of each unit of the lens device 10 in accordance with commands from the system control unit 30. The camera mount 13 is configured to be detachable from the lens mount 103. The diaphragm adjusts the amount of light incident on the image sensor 311.
[0017] FIG. 2 is an exploded perspective view of the imaging device 100. The imaging device 100 has exterior components, including a front base 102, a rear cover 104, a top cover 106, a bottom cover 108, and a side cover 110. Inside the housing formed by these exterior components, an imaging unit 300, a printed circuit board 120, a shutter 200, and a chassis 118 are arranged. As shown in FIG. 2, mutually orthogonal x-, y-, and z-axes are defined. The z-axis is parallel to the imaging optical axis, and when the x- and z-axes are in a horizontal plane, the y-axis is parallel to the vertical direction. In this state, the imaging device 100 is in a normal posture. The x-direction is the width direction of the imaging device 100, the y-direction is the height direction of the imaging device 100, and the z-direction is the front-to-rear direction of the imaging device 100.
[0018] The front base 102 is molded from magnesium die-cast or resin. A lens mount 103 to which the lens device 10 is attached is fixed to the front base 102, and a grip portion is also provided for a user to hold the imaging device 100. The rear cover 104 is equipped with a plurality of operation members 60 and a vari-angle rear monitor 175. The rear cover 104 also has an EVF 176, and is equipped with a finder unit 112 that allows the user to look into the subject.
[0019] The top cover 106 has a plurality of operating members 60. The bottom cover 108 has a battery chamber that houses a battery 80 and a tripod mount for fixing the imaging device 100 to a tripod. The side cover 110 has a terminal cover 111 that protects an external communication terminal 121 mounted on the printed circuit board 120.
[0020] The printed circuit board 120 is mounted with various electronic components, such as an external communication terminal 121, electronic elements that function as the system control unit 30 and image processing unit 32, and a connector for attaching the storage medium 90. The printed circuit board 120 is fixed to the front base 102 and a metal chassis 118 with screws. The imaging unit 300 and the printed circuit board 120 are electrically connected by a flexible substrate 380, and an imaging signal output from the imaging element 311 is transmitted to the printed circuit board 120 via the flexible substrate 380.
[0021] Of all the internal components of the imaging device 100, the imaging element 311 consumes particularly large amounts of power and is prone to temperature increases during operation. To prevent degradation in the quality of captured images, it is necessary to maintain the imaging element 311 at a temperature below the guaranteed operating temperature. The imaging unit 300 is fixed to the front base 102 with screws, and heat generated by the imaging element 311 is transferred to the front base 102. Inside the imaging unit 300, the heat generated by the imaging element 311 is transferred using the heat dissipation member 400 according to the first embodiment.
[0022] Next, the configuration of the imaging unit 300 will be described, including the heat transfer path by the heat dissipation member 400 inside the imaging unit 300. Figure 3 is an exploded perspective view of the imaging unit 300, and the imaging unit 300 is viewed from different directions in Figure 3(a) and Figure 3(b).
[0023] The imaging unit 300 has a movable part 330 and a fixed part 340. The fixed part 340 is made up of a front plate 341 and a rear plate 342, which are sheet metal members, and the rear plate 342 is fixed to the front base 102 with screws, thereby fixing the imaging unit 300 inside the imaging device 100.
[0024] Movable section 330 is disposed between front plate 341 and rear plate 342 of fixed section 340. Movable section 330 has an imaging board on which imaging element 311 is mounted, and imaging element holder 331 that holds the imaging board. A flexible board 333 is connected to the imaging element board, and heat dissipation member 400 is disposed so as to connect imaging element holder 331 and rear plate 342.
[0025] The imaging element holder 331 is provided with ball holding portions 331a at three locations around its periphery, and balls 335 are sandwiched in the ball holding portions 331a between the imaging element holder 331 and the rear plate 342. As the balls 335 roll freely, the movable portion 330 is supported between the front plate 341 and the rear plate 342 so as to be displaceable (in other words, swingable or movable) within a plane perpendicular to the imaging optical axis (z-axis).
[0026] Magnets 343 are arranged in three locations on the rear plate 342. Each magnet 343 is stably fixed to the rear plate 342 by a fixing plate 344. Meanwhile, a coil 332 is fixed to the imaging element holder 331 so as to face the magnet 343 in the imaging optical axis direction (z direction). Power is supplied to the coil 332 by a flexible substrate 333 connected to the imaging element substrate.
[0027] The magnet 343 and the coil 332 constitute a drive mechanism that enables displacement of the movable part 330 relative to the fixed part 340. That is, by supplying power to the coil 332 through the flexible substrate 333, the movable part 330 is displaced by utilizing the repulsive and attractive forces that are generated between the magnetic field generated around the coil 332 and the magnetic field of the magnet 343. At this time, by controlling the magnitude of the current flowing through each coil 332, it is possible to control the direction and amount of displacement of the movable part 330 in a plane perpendicular to the imaging optical axis.
[0028] The image stabilization mechanism is normally controlled so that the movable part 330 is maintained at the imaging center position, and during imaging, is controlled so that the movable part 330 is displaced in a direction that cancels out image shake of the imaging device 100 caused by the photographer. In addition, a metal plate 334 is arranged on the front side of the coil 332 of the movable part 330, and the metal plate 334 and a magnet 343 are attracted by magnetic force, thereby positioning the imaging element holder 331 with a ball 335 sandwiched between them in the imaging optical axis direction relative to the back plate 342. In this way, the imaging element 311 is positioned at a predetermined flange back position inside the imaging device 100.
[0029] The heat dissipation member 400 has a layered structure made up of a PET film (sheet) or the like and a graphite sheet or the like. Heat generated by the imaging element 311 is transferred from the imaging element substrate and imaging element holder 331 to the rear plate 342 via the heat dissipation member 400, and is then transferred from the rear plate 342 to the front base 102 that holds the rear plate 342. In this way, the heat generated by the imaging element 311 is released to the outside, thereby suppressing a rise in temperature of the imaging element 311.
[0030] Next, the heat dissipation member 400 will be described in detail. Fig. 4 is a perspective view showing the heat dissipation member 400 and the configuration in the vicinity thereof in the imaging unit 300. Fig. 5 is a cross-sectional view of the heat dissipation member 400. Fig. 6 is a development view of the heat dissipation member 400.
[0031] The heat dissipation member 400 is composed of a first movable part attachment region 402 which is a main fixing region for the movable part 330, a first fixed part attachment region 403 which is a main fixing region for the fixed part 340, and a connection portion 406 which connects the first movable part attachment region 402 and the first fixed part attachment region 403. In the first movable part attachment region 402, the heat dissipation member 400 is attached and fixed to a flat portion of the imaging element holder 331 on the front base 102 side which is approximately perpendicular to the imaging optical axis with double-sided tape 420. In the first fixed part attachment region 403, the heat dissipation member 400 is attached and fixed to a flat portion of the rear cover 104 side of the back plate 342 which is approximately perpendicular to the imaging optical axis with double-sided tape 430.
[0032] The connecting portion 406 has a first bent portion 409, two second bent portions 407, two third bent portions 408, a second movable portion attachment region 404 which is a secondary fixing region for the movable portion 330, a second fixed portion attachment region 405 which is a secondary fixing region for the fixed portion 340, and a connecting arm portion 410. The two second bent portions 407 are provided between the first movable portion attachment region 402 and the second movable portion attachment region 404, and between the first fixed portion attachment region 403 and the second fixed portion attachment region 405. The two third bent portions 408 are provided between the second movable portion attachment region 404 and the second fixed portion attachment region 405 and the connecting arm portion 410.
[0033] The bent portion refers to a portion having a fold, which is a type of curved portion having a certain radius of curvature. The bent portion is defined as having a crease at the fold so that the bent state is maintained in a natural state.
[0034] The heat dissipation member 400 extends from the first movable part attachment region 402 and the first fixed part attachment region 403 at both ends toward the outside of the imaging unit 300, then extends toward the back (inside) of the imaging unit 300 via the second bent portion 407 and the third bent portion 408, and is connected at the first bent portion 409. At this time, the second movable part attachment region 404 is attached and fixed to a surface of the imaging element holder 331 different from the attachment surface of the first movable part attachment region 402 (a side surface of the imaging element holder 331 substantially parallel to the imaging optical axis) using double-sided tape 440 or the like. Moreover, the second fixed part attachment region 405 is attached and fixed to a surface of the rear side plate 342 different from the attachment surface of the first fixed part attachment region 403 (a side surface of the rear side plate 342 substantially parallel to the imaging optical axis) using double-sided tape 450 or the like.
[0035] In this way, the heat dissipation member 400 is configured so that the connecting arm portion 410 and the first bent portion 409 (hereinafter referred to as "storage portion 411") sandwiched by the third bent portion 408 are stored in a gap formed between the imaging element holder 331 and the rear side plate 342 in the imaging optical axis direction. Also, because the second movable part attachment region 404 and the second fixed part attachment region 405 are attached to the imaging element holder 331 and the rear side plate 342, respectively, the heat dissipation member 400 does not unnecessarily bulge outward from the imaging unit 300, and an increase in the size of the imaging unit 300 is suppressed.
[0036] The second movable part attachment region 404 and the second fixed part attachment region 405 are provided to obtain the effect of preventing unnecessary bulging of the heat dissipation member 400 toward the outside of the imaging unit 300. Therefore, the area of each of the second movable part attachment region 404 and the second fixed part attachment region 405 may be smaller than the area of the first movable part attachment region 402 and the first fixed part attachment region 403, respectively.
[0037] 4 and 6, the heat dissipation member 400 has a substantially rectangular flat plate shape when unfolded. In order to suppress an increase in the driving load caused by the heat dissipation member 400 during image shake correction operation, the heat dissipation member 400 is formed with slits 401 whose longitudinal direction is the direction connecting the first movable part attachment region 402 and the first fixed part attachment region 403. The portion other than the slits 401 is a heat transfer portion filled with a graphite sheet or the like.
[0038] The width of the slit 401 (the length in the x direction in FIG. 4 and the length in the left-right direction in FIG. 6) is set to a value that prevents contact between the heat transfer portions on the long sides of the slit 401 when the imaging unit 300 is at its maximum displacement, so that a load due to contact between the heat transfer portions on the long sides of the slit 401 is not generated. Furthermore, the overall length of the storage section 411 in the length direction of the slit 401 is set to a value that is longer than the maximum displacement of the movable section 330 in the y direction. This prevents the storage section 411 from protruding outward from the imaging unit 300 (between the image sensor holder 331 and the rear plate 342) even when the movable section 330 is at its maximum displacement in the y direction. For example, if the storage section 411 protrudes outward from the imaging unit 300 and comes into contact with other components, the contact may increase the drive load, and heat transfer from the heat dissipation member 400 to other components may cause malfunctions in those components. By configuring the storage section 411 so that it does not protrude outward from the imaging unit 300, these problems can be avoided.
[0039] In this embodiment, there is one slit 401, but there may be more than one. When more than one slit 401 is provided, by making the slit widths the same for each slit, the drive load during image shake correction can be kept constant regardless of the position of the movable part 330, which makes it easier to control the drive of the image shake correction mechanism.
[0040] Next, the bent portions of the heat dissipation member 400 will be described in detail. The heat dissipation member 400 has a valley fold at the second bent portion 407 and a mountain fold at the third bent portion 408, and can maintain its bent shape even in a free state. Therefore, the heat dissipation member 400 can maintain its shape even when the image stabilization drive is performed or when an external force such as an impact is applied.
[0041] 4, the heat dissipation member 400 is arranged such that the first movable part attachment region 402 and the first fixed part attachment region 403 face each other in the imaging optical axis direction (z direction). As shown in FIG. 6, the two second bent portions 407 are provided at a distance L1 from the first bent portion 409, and the two third bent portions 408 are provided at a distance L2 from the first bent portion 409. Here, the distances L1 and L2 are set so that the first bent portion 409 is located approximately in the middle of the gap formed between the imaging element holder 331 and the rear plate 342 in the imaging optical axis direction, and in close proximity to a region connecting both ends of the heat dissipation member 400. The ends of the heat dissipation member 400 refer to the ends of the first movable part attachment region 402 and the first fixed part attachment region 403 on the opposite side from the connection portion 406 (the -y side in FIG. 4).
[0042] By configuring the heat dissipation member 400 in the above-described structure that is substantially symmetrical about the first bent portion 409 in the imaging optical axis direction, it is possible to realize a configuration in which the storage portion 411 is less likely to come into contact with the imaging element holder 331 and the rear plate 342 even during image shake correction driving. Furthermore, because the storage portion 411 is stable in a state in which it extends toward the inside of the imaging unit 300 by the second bent portion 407 and the third bent portion 408, it is possible to realize a configuration in which the heat dissipation member 400 does not jump out to the outside of the imaging unit 300 even if an impact is applied to the imaging unit 300.
[0043] The bending positions of the heat dissipation member 400 are not limited to the positions described above. For example, the two third bent portions 408 may be omitted, and the second movable portion attachment area 404 and the second fixed portion attachment area 405 may not be provided. That is, the imaging element holder 331 and the rear plate 342 are each formed in a substantially flat plate shape. The first movable portion attachment area is provided on a surface (first surface) of the imaging element holder 331 opposite to the surface facing the rear plate 342. Meanwhile, the first fixed portion attachment area is provided on a surface (second surface) of the rear plate 342 opposite to the surface facing the imaging element holder 331. The imaging element holder 331 and the fixed portion 340 are arranged with a predetermined space between them so that the first surface and the second surface are substantially parallel to each other. Therefore, the connecting portion extends from the first movable portion attachment region across a side surface (first side surface) of the imaging element holder 331 that is substantially parallel to the imaging optical axis, through the space formed between the imaging element holder 331 and the rear plate 342, in a direction perpendicular to the first side surface. The connecting portion is then bent at least once within the space and extends toward a second side surface of the rear plate 342 that is parallel to the imaging optical axis. Here, the second side surface is substantially parallel to and close to the first side surface on a projection plane from the imaging optical axis direction. The connecting portion is then connected to the second main fixed region across the second side surface. Note that this configuration, plus two third bent portions 408, a second movable portion attachment region 404, and a second fixed portion attachment region 405, can be said to be the heat dissipation member 400 according to the first embodiment.
[0044] In this case, the effect of preventing the heat dissipation member from bulging outward from the imaging unit 300 decreases, but it is possible to prevent the storage section 411 from protruding outward from the imaging unit 300. Furthermore, if the configuration is such that the bending section is provided with only the minimum first bending section 409, it is possible to simplify the manufacturing process of the heat dissipation member.
[0045] Next, a heat dissipation member 500 according to a second embodiment will be described. Fig. 7(a) is a cross-sectional view showing the heat dissipation member 500 according to the second embodiment and the configuration in the vicinity thereof in the same manner as Fig. 5. Fig. 7(b) is a cross-sectional view showing an example of a state in which the heat dissipation member 500 bulges outward from the imaging unit 300. Fig. 8 is a development view of the heat dissipation member 500.
[0046] The heat dissipation member 500 is composed of a first movable part attachment region 502, a first fixed part attachment region 503, and a connecting portion 506. The connecting portion 506 is composed of two curved connecting arm portions 504, bent portions 505 provided at each end of the two connecting arm portions 504, and a tubular portion 507 connecting the two bent portions 505. The material constituting the heat dissipation member 500 is the same as the material constituting the heat dissipation member 400, and therefore a description thereof will be omitted. In addition, slits 501 similar to the slits 401 provided in the heat dissipation member 400 are also formed in the heat dissipation member 500.
[0047] The first movable part attachment region 502 is attached and fixed to the front base 102 side of the imaging element holder 331, and the first fixed part attachment region 503 is attached and fixed to the rear cover 104 side of the rear side plate 342 with double-sided tapes 520, 530, etc. One of the two connecting arms 504 extends from the first movable part attachment region 502 across the side surface of the imaging element holder 331 to the rear (inside) of the imaging unit 300 and is connected to one bent part 505. Similarly, the other of the two connecting arms 504 extends from the first fixed part attachment region 503 across the side surface of the rear side plate 342 to the rear (inside) of the imaging unit 300 and is connected to the other bent part 505. In this case, the two bent parts 505 are arranged to face each other at a predetermined interval in the imaging optical axis direction, which is the connection direction of the heat dissipation member 500, between the imaging element holder 331 and the rear side plate 342. The two bent portions 505 are connected by a cylindrical portion 507 in the gap formed between the imaging element holder 331 and the rear plate 342. This configuration prevents the connecting portion 506 from bulging outward from the imaging unit 300.
[0048] It is desirable that connecting arm portion 504 and tubular portion 507 are bent at a predetermined curvature, similar to bending portion 505. Furthermore, the shape of tubular portion 507 when viewed from the x direction in FIG. 7 is not limited to a circle (annular), and may be a polygon such as an octagon.
[0049] Here, the two bent portions 505 are provided at positions spaced a length L3 apart from the inner ends of the first movable portion attaching region 502 and the first fixed portion attaching region 503. As a result, the cylindrical portion 507 is disposed at approximately the middle of the gap formed between the imaging element holder 331 and the rear plate 342 in the connection direction (imaging optical axis direction) of the heat dissipation member 500. As a result, even if an external force such as an impact acts to displace the heat dissipation member 500 outward from the imaging unit 300, the bent portions 505 are close to each other, preventing the bent portions 505 and the cylindrical portion 507 from jumping outward from the imaging unit 300.
[0050] While the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Furthermore, each of the above-described embodiments merely represents one embodiment of the present invention, and each embodiment can be combined as appropriate.
[0051] The disclosure of this embodiment includes the following configuration. (Configuration 1) An imaging device having a movable part equipped with an imaging element, a fixed part that supports the movable part so that it can move within a plane perpendicular to the imaging optical axis, and a heat dissipation member that connects the movable part and the fixed part, wherein the heat dissipation member has a first main fixing region fixed to the movable part, a second main fixing region fixed to the fixed part, and a connecting part that connects the first main fixing region and the second main fixing region, the first main fixing region and the second main fixing region are each perpendicular to the imaging optical axis, and the connecting part has at least one first bent portion that is arranged in a gap formed between the movable part and the fixed part in a direction parallel to the imaging optical axis. (Configuration 2) The imaging device described in Configuration 1, characterized in that the heat dissipation member has an approximately rectangular flat plate shape when unfolded, and the connection portion has a slit whose longitudinal direction is the direction connecting the movable portion and the fixed portion. (Configuration 3) The imaging device described in configuration 1 or 2, characterized in that the first bending portion is located close to a region connecting an end portion of the first main fixing region opposite the connection portion and an end portion of the second main fixing region opposite the connection portion in a direction parallel to the imaging optical axis, and is located at approximately the middle position of the gap. (Configuration 4) The imaging device according to configuration 3, wherein the heat dissipation member has a structure that is substantially symmetrical with respect to the first bent portion. (Configuration 5) The imaging device described in configuration 1 or 2, characterized in that the connection portion has the first bend portions at two locations and a tubular portion with the two first bend portions as its ends, the two first bend portions facing each other at a predetermined distance in a direction parallel to the imaging optical axis, and the tubular portion is positioned at approximately the middle position of the gap in the direction parallel to the imaging optical axis. (Configuration 6) The imaging device according to any one of configurations 1 to 5, wherein the first bending portion has a crease, and the crease is maintained in a natural state bent at the crease. (Configuration 7) An imaging device described in any one of configurations 1 to 6, characterized in that the connection portion has a first sub-fixing region fixed to a surface of the movable portion different from the surface to which the first main fixing region is fixed, and a second sub-fixing region fixed to a surface of the fixed portion different from the surface to which the second main fixing region is fixed. (Configuration 8) The imaging device described in Configuration 7, characterized in that in the heat dissipation member, the first main fixing region is fixed to a surface in the movable part that is approximately perpendicular to the imaging optical axis, the first sub-fixing region is fixed to a surface in the movable part that is approximately parallel to the imaging optical axis, the second main fixing region is fixed to a surface in the fixed part that is approximately perpendicular to the imaging optical axis, and the second sub-fixing region is fixed to a surface in the fixed part that is approximately parallel to the imaging optical axis. (Configuration 9) An imaging device described in configuration 7 or 8, characterized in that the area of the first sub-fixing region is smaller than the area of the first main fixing region, and the area of the second sub-fixing region is smaller than the area of the second main fixing region. (Configuration 10) An imaging device described in any one of configurations 7 to 9, characterized in that a second bending portion is provided in the connection portion between the first main fixing region and the first sub-fixing region, and between the second main fixing region and the second sub-fixing region. (Configuration 11) An imaging device described in Configuration 10, characterized in that a third bending portion is provided in the connection portion so as to sandwich the first sub-fixing region or the second sub-fixing region between the third bending portion and the second bending portion in the direction connecting the first main fixing region and the second main fixing region. (Configuration 12) An imaging device having a movable part equipped with an imaging element, a fixed part supporting the movable part so that it can move within a plane perpendicular to an imaging optical axis, and a heat dissipation member connecting the movable part and the fixed part, wherein the heat dissipation member has a first main fixing region fixed to a first surface perpendicular to the imaging optical axis of the movable part, a second main fixing region fixed to a second surface perpendicular to the imaging optical axis of the fixed part, and a connecting part connecting the first main fixing region and the second main fixing region, the movable part and the fixed part are arranged with a predetermined space between them so that the first surface and the second surface are approximately parallel, and the first surface is the first surface is a surface opposite to a surface facing the fixed part, the second surface is a surface of the fixed part opposite to a surface facing the movable part, the connecting part extends from the first main fixing region across a first side surface of the movable part that is parallel to the imaging optical axis, extends within the space in a direction perpendicular to the first side surface, and then bends at least once to extend towards a second side surface of the fixed part that is parallel to the imaging optical axis, and further extends across the second side surface to be connected to the second main fixing region, and the first side surface and the second side surface are approximately parallel to and close to each other on a projection plane from the imaging optical axis direction. [Explanation of symbols]
[0052] 100 Imaging device 311 Image sensor 330 Moving parts 340 Fixed part 400,500 Heat dissipation material 401,501 Slit 402,502 First movable part attachment area 403,503 First fixing part attachment area 404 Second movable part attachment area 405 Second fixing part attachment area 406,506 Connection 407 2nd bending part 408 3rd bending part 409 1st bending part 505 Bend 507 Cylindrical part
Claims
1. a movable part including an imaging element; a fixed portion that supports the movable portion so that the movable portion is movable within a plane perpendicular to the imaging optical axis; a heat dissipation member connecting the movable portion and the fixed portion, The heat dissipation member is a first main fixing region fixed to the movable portion; a second primary fixing region fixed to the fixing portion; a connection portion connecting the first main fixing region and the second main fixing region, the first primary fixation area and the second primary fixation area are each perpendicular to an imaging optical axis; An imaging device characterized in that the connecting portion has at least one first bent portion arranged in a gap formed between the movable portion and the fixed portion in a direction parallel to the imaging optical axis.
2. The heat dissipation member has a substantially rectangular flat plate shape when deployed, 2. The imaging device according to claim 1, wherein the connecting portion has a slit whose longitudinal direction is a direction connecting the movable portion and the fixed portion.
3. The imaging device described in claim 1 or 2, characterized in that the first bending portion is located close to a region connecting an end portion of the first main fixing region opposite the connection portion and an end portion of the second main fixing region opposite the connection portion in a direction parallel to the imaging optical axis, and is located at approximately the middle position of the gap.
4. 4. The imaging device according to claim 3, wherein the heat dissipation member has a structure that is substantially symmetrical with respect to the first bent portion.
5. the connecting portion has the first bent portions at two locations and a tubular portion having the two first bent portions as end portions, 3. The imaging device according to claim 1, wherein the two first bends face each other at a predetermined interval in a direction parallel to the imaging optical axis, and the cylindrical portion is positioned at approximately the middle of the gap in the direction parallel to the imaging optical axis.
6. 2. The imaging device according to claim 1, wherein the first bent portion has a crease, and the bent state at the crease is maintained in a natural state.
7. The imaging device according to claim 1, characterized in that the connection portion has a first sub-fixing region fixed to a surface of the movable portion different from the surface to which the first main fixing region is fixed, and a second sub-fixing region fixed to a surface of the fixed portion different from the surface to which the second main fixing region is fixed.
8. The imaging device described in claim 7, characterized in that in the heat dissipation member, the first main fixing region is fixed to a surface in the movable part that is approximately perpendicular to the imaging optical axis, the first sub-fixing region is fixed to a surface in the movable part that is approximately parallel to the imaging optical axis, the second main fixing region is fixed to a surface in the fixed part that is approximately perpendicular to the imaging optical axis, and the second sub-fixing region is fixed to a surface in the fixed part that is approximately parallel to the imaging optical axis.
9. 9. The imaging device according to claim 7, wherein the area of the first sub-fixing region is smaller than the area of the first main fixing region, and the area of the second sub-fixing region is smaller than the area of the second main fixing region.
10. 9. The imaging device according to claim 7, wherein a second bending portion is provided in the connection portion between the first main fixing region and the first sub-fixing region and between the second main fixing region and the second sub-fixing region.
11. The imaging device according to claim 10, characterized in that a third bending portion is provided in the connection portion so as to sandwich the first sub-fixing region or the second sub-fixing region between the third bending portion and the second bending portion in the direction connecting the first main fixing region and the second main fixing region.
12. a movable part including an imaging element; a fixed portion that supports the movable portion so that the movable portion is movable within a plane perpendicular to the imaging optical axis; a heat dissipation member connecting the movable portion and the fixed portion, The heat dissipation member is a first main fixing region fixed to a first surface of the movable portion that is perpendicular to the imaging optical axis; a second main fixing region fixed to a second surface of the fixing portion that is perpendicular to the imaging optical axis; a connection portion connecting the first main fixing region and the second main fixing region, the movable portion and the fixed portion are arranged with a predetermined space therebetween so that the first surface and the second surface are substantially parallel to each other; the first surface is a surface of the movable portion opposite to a surface facing the fixed portion, the second surface is a surface of the fixed portion opposite to a surface facing the movable portion, the connecting portion extends from the first main fixing region across a first side surface of the movable portion that is parallel to the imaging optical axis, within the space in a direction perpendicular to the first side surface, bends at least once, extends towards a second side surface of the fixed portion that is parallel to the imaging optical axis, and further extends across the second side surface to be connected to the second main fixing region; An imaging device, characterized in that the first side surface and the second side surface are approximately parallel to and close to each other on a projection plane from the imaging optical axis direction.
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