Display device

Abstract

To provide a protection circuit with a suitable structure in order to take advantage of characteristics of a display device including an oxide semiconductor that has excellent operation characteristics and can be manufactured at low temperature.SOLUTION: A nonlinear element 30a forming a protection circuit includes a gate insulating layer 37 that covers a gate electrode 15, a pair of a first wiring layer 38 and a second wiring layer 39 in which an end part overlaps with the gate electrode 15 on the gate insulating layer 37 and a second oxide semiconductor layer 40 and a conductive layer 41 are stacked, and a first oxide semiconductor layer 36 that overlaps with at least the gate electrode 15 and is in contact with a part of a side surface part and an upper surface part of the conductive layer 41 in the gate insulating layer 37, the first wiring layer 38, and the second wiring layer 39 and a side surface part of the second oxide semiconductor layer 40. By forming a junction between the oxide semiconductor layers with different physical properties on the gate insulating layer 37, a stable operation becomes possible as compared to Schottky junction, junction leakage is reduced, and characteristics of the nonlinear element 30a can be improved.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a display device using an oxide semiconductor. [Background technology]

[0002] As typified by liquid crystal display devices, thin film transistors formed on flat plates such as glass substrates are , amorphous silicon, and polycrystalline silicon. Thin film transistors using silicon have low field effect mobility, but are suitable for enlarging the area of ​​glass substrates. On the other hand, thin film transistors using polycrystalline silicon have a field effect mobility of Although it is expensive, it requires a crystallization process such as laser annealing, which is necessary for enlarging the area of ​​glass substrates. It has the characteristic that it does not necessarily adapt.

[0003] In response to this, thin film transistors are being fabricated using oxide semiconductors, and they are being used in electronic devices and optical devices. For example, zinc oxide (ZnO) is used as an oxide semiconductor film. and fabricating thin-film transistors using In-Ga-Zn-O oxide semiconductors to display images. The technology used for the switching elements of the device is disclosed in Patent Documents 1 and 2. . [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-123861 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-96055 Summary of the Invention [Problem to be solved by the invention]

[0005] Thin film transistors that use oxide semiconductors for the channel formation region use amorphous silicon. The operating speed is faster than that of thin-film transistors that use polycrystalline silicon. The manufacturing process is simpler than that of oxide semiconductors. By doing so, it is possible to produce thin-film transistors with high field-effect mobility even at low temperatures below 300°C. It is possible to create a

[0006] To take advantage of the characteristics of display devices using oxide semiconductors, which have excellent operating characteristics and can be manufactured at low temperatures, In addition, a protection circuit or the like having an appropriate configuration is required. It is important to ensure safety.

[0007] An object of one embodiment of the present invention is to provide a structure suitable for a protection circuit.

[0008] One embodiment of the present invention is a semiconductor device for various applications in which an insulating film and a conductive film are stacked in addition to an oxide semiconductor. An object is to prevent defects caused by peeling of a thin film in a display device. [Means for solving the problem]

[0009] One embodiment of the present invention is a semiconductor device in which a protection circuit is formed using a nonlinear element including an oxide semiconductor. This nonlinear element is made up of a combination of oxide semiconductors with different oxygen contents. It has been completed.

[0010] An exemplary embodiment of the present invention is a semiconductor device in which scanning lines and signal lines are provided crossing each other on a substrate having an insulating surface. The pixel section has pixel electrodes arranged in a matrix, and the outer region of the pixel section is made of an oxide semiconductor. The pixel portion is a display device having a nonlinear element formed in a first oxide semiconductor layer. The thin film transistor in the pixel portion has a scanning line forming region. a gate electrode connected to the signal line; a first wiring layer connected to the signal line and in contact with the first oxide semiconductor layer; The pixel electrode is connected to the second wiring layer, and the second wiring layer is in contact with the first oxide semiconductor layer. A nonlinear element is provided between the signal input terminal and the pixel section. a gate insulating layer covering the gate electrode and the gate electrode; a pair of first and second wiring layers in which the pole and the end are overlapped and the second oxide semiconductor layer and the conductive layer are stacked; a wiring layer, a gate insulating layer overlapping at least the gate electrode, the first wiring layer, and the second wiring layer; a first oxide semiconductor layer in contact with a side surface and a part of an upper surface of the conductive layer and a side surface of the second oxide semiconductor layer; The gate electrode of the nonlinear element is connected to a scanning line or a signal line. The first wiring layer or the second wiring layer of the nonlinear element is connected to the first wiring layer or the second wiring layer. The third wiring layer connects the gate electrodes to the line layer so that a voltage is applied to the line layer.

[0011] An exemplary embodiment of the present invention is a semiconductor device in which scanning lines and signal lines are provided crossing each other on a substrate having an insulating surface. The pixel electrode is arranged in a matrix, and the pixel electrode has a protection circuit in the outer area of ​​the pixel electrode. The pixel portion is a thin film in which a channel formation region is formed in the first oxide semiconductor layer. The thin film transistor in the pixel portion has a gate electrode connected to a scanning line. a first wiring layer connected to the signal line and in contact with the first oxide semiconductor layer; The pixel area has a second wiring layer in contact with the oxide semiconductor layer. A protection circuit that connects the wiring and a protection circuit that connects the signal line and the common wiring are provided. The protection circuit includes a gate electrode, a gate insulating layer covering the gate electrode, and a gate insulating layer on the gate insulating layer. a pair of first gate electrodes in which a second oxide semiconductor layer and a conductive layer are stacked and an end portion of the first gate electrode overlaps the second oxide semiconductor layer; a gate insulating layer overlapping at least the gate electrode and the first wiring layer; and a part of the side surface and top surface of the conductive layer in the second wiring layer and the side surface of the second oxide semiconductor layer. The nonlinear element has a first oxide semiconductor layer in contact with the first oxide semiconductor layer. The pole is connected to the first wiring layer or the second wiring layer by the third wiring layer.

[0012] Here, the oxygen concentration of the first oxide semiconductor layer is higher than the oxygen concentration of the second oxide semiconductor layer. That is, the first oxide semiconductor layer is an oxygen-excess type, and the second oxide semiconductor layer is an oxygen-excess type. The second oxide semiconductor layer exhibits n-type conductivity and is an electron-deficient type. The electrical conductivity of the first oxide semiconductor layer is lower than that of the second oxide semiconductor layer. The first and second oxide semiconductor layers are non-single crystal, and preferably, the first oxide semiconductor layer has an amorphous structure. The second oxide semiconductor layer may have an amorphous structure containing crystal grains (nanocrystals). There is a match.

[0013] The ordinal numbers such as 1st and 2nd are used for convenience and do not indicate the order of processes or stacking. Furthermore, the specific names used in this specification are not intended to identify the invention. This does not indicate

[0014] In this specification, a semiconductor layer formed using an oxide semiconductor containing In, Ga, and Zn is The semiconductor film is also referred to as an "IGZO semiconductor film," and the semiconductor layer is also referred to as an "IGZO semiconductor layer." [Effects of the Invention]

[0015] According to one aspect of the present invention, a protection circuit is configured using a nonlinear element using an oxide semiconductor. As a result, it is possible to obtain a display device having a structure suitable for a protection circuit. By using a stacked structure in which the gate insulating layer of the oxide semiconductor is in contact with the oxide semiconductor, peeling of the thin film can be prevented. This can prevent the protection circuit from malfunctioning. [Brief explanation of the drawings]

[0016] [Figure 1] 1A and 1B are diagrams illustrating the positional relationship between signal input terminals, scanning lines, signal lines, a protection circuit including a nonlinear element, and a pixel portion, which constitute a display device. [Figure 2] FIG. 2 is a diagram showing an example of a protection circuit. [Figure 3] FIG. 2 is a diagram showing an example of a protection circuit. [Figure 4] FIG. 2 is a plan view showing an example of a protection circuit. [Figure 5] FIG. 1 is a cross-sectional view showing an example of a protection circuit. [Figure 6] 1A to 1C are cross-sectional views illustrating a manufacturing process of a protection circuit. [Figure 7] 1A to 1C are cross-sectional views illustrating a manufacturing process of a protection circuit. [Figure 8] FIG. 2 is a plan view showing an example of a protection circuit. [Figure 9] FIG. 2 is a plan view showing an example of a protection circuit. [Figure 10] Cross-sectional view of electronic paper. [Figure 11] FIG. 1 is a block diagram illustrating a semiconductor device. [Figure 12] FIG. 2 illustrates a configuration of a signal line driver circuit. [Figure 13] 4 is a timing chart illustrating the operation of the signal line driver circuit. [Figure 14] 4 is a timing chart illustrating the operation of the signal line driver circuit. [Figure 15] FIG. 2 is a diagram illustrating the configuration of a shift register. [Figure 16] FIG. 15 is a diagram for explaining the connection configuration of the flip-flop shown in FIG. 14. [Figure 17] 1A and 1B are a top view and a cross-sectional view illustrating a semiconductor device of an embodiment. [Figure 18] 1 is a cross-sectional view illustrating a semiconductor device according to an embodiment; [Figure 19] 1A and 1B are diagrams illustrating pixel equivalent circuits of a semiconductor device according to an embodiment; [Figure 20] 1A to 1C illustrate a semiconductor device according to an embodiment; [Figure 21] 1A and 1B are a top view and a cross-sectional view illustrating a semiconductor device of an embodiment. [Figure 22] 1A and 1B are diagrams illustrating examples of usage of electronic paper. [Figure 23] FIG. 1 is an external view showing an example of an electronic book. [Figure 24] FIG. 1 is an external view showing an example of a television device and a digital photo frame. [Figure 25] FIG. 1 is an external view showing an example of a gaming machine. [Figure 26] FIG. 1 is an external view showing an example of a mobile phone. DETAILED DESCRIPTION OF THE INVENTION

[0017] The present invention will be described below with reference to the accompanying drawings. The present invention is not limited to the above, and various modifications and variations in form and detail are possible without departing from the spirit and scope of the present invention. It will be readily apparent to those skilled in the art that various modifications may be made to the present invention. The present invention is not limited to the description of the embodiments. In the drawings, the same reference numerals are used to refer to the same parts.

[0018] (Embodiment 1) This embodiment is one aspect of a display device in which a pixel section and a protection circuit including a nonlinear element are formed in the periphery thereof. This will be explained with reference to the drawings.

[0019] Figure 1 shows the signal input terminals, scanning lines, signal lines, and protection circuits including nonlinear elements that make up a display device. 1 is a diagram illustrating the positional relationship between the scanning lines 13 and the pixel portion on a substrate 10 having an insulating surface. The signal lines 14 intersect to form pixel sections 17 .

[0020] The pixel section 17 is configured by arranging a plurality of pixels 18 in a matrix. A pixel transistor 19, a storage capacitor 20, and a pixel electrode 21 connected to the line 13 and the signal line 14 are It is composed of including.

[0021] In the pixel configuration illustrated here, one electrode of the storage capacitor 20 is connected to the pixel transistor 19 The pixel electrode 21 is connected to the capacitor line 22. While driving display elements (liquid crystal elements, light-emitting elements, contrast media (electronic ink), etc.) The other electrodes of these display elements are connected to a common terminal 23.

[0022] The protection circuit is disposed between the pixel section 17 and the scanning line input terminal 11 and the signal line input terminal 12. In this embodiment, a plurality of protection circuits are provided to protect the scanning lines 13, the signal lines 14, and the capacitance bus lines 15. 27 is applied with a surge voltage due to static electricity or the like, and the pixel transistor 19 and the like are not destroyed. Therefore, when a surge voltage is applied to the protection circuit, It is configured to release the charge to the line 29 or the common wiring 28.

[0023] In this embodiment, a protection circuit 24 is provided on the scanning line 13 side, a protection circuit 25 is provided on the signal line 14 side, and a capacitance bus line 2 7 shows an example in which a protection circuit 26 is provided. However, the configuration of the protection circuit is not limited to this. stomach.

[0024] 2 shows an example of a protection circuit. This protection circuit is made up of non-transparent electrodes arranged in parallel across the scanning line 13. It is composed of a linear element 30 and a nonlinear element 31. The element 31 is composed of a two-terminal element such as a diode or a three-terminal element such as a transistor. For example, the nonlinear element can be formed in the same process as the pixel transistor in the pixel section. For example, a nonlinear element can be formed as a diode by connecting the gate terminal and the drain terminal. can have similar properties.

[0025] The first terminal (gate) and the third terminal (drain) of the nonlinear element 30 are connected to the scanning line 13, The second terminal (source) is connected to the common wiring 29. The first terminal of the nonlinear element 31 The gate and drain terminals are connected to a common wiring 29, and the source terminal is connected to a 2 is connected to the scanning line 13. Two transistors with opposite directions connect the scanning line 13 and the common wiring 29. In other words, between the scanning line 13 and the common wiring 29, the rectifying direction is the same as that of the scanning line. The transistor that goes from 13 to the common wiring 29 and the rectification direction is from the common wiring 29 to the scanning line 13 This is a configuration in which the transistors facing each other are connected.

[0026] The protection circuit shown in FIG. 2 prevents the scanning line 13 from being charged positively or negatively with respect to the common line 29 due to static electricity or the like. For example, if the scanning line 13 is positively charged, a current flows in the direction that cancels the charge. When the positive charge is released, a current flows in the direction of dissipating the positive charge to the common wiring 29. Electrostatic breakdown or threshold voltage shift of pixel transistor 19 connected to the energized scanning line 13 In addition, the distance between the charged scanning line 13 and the adjacent scanning line 13 can be reduced. short circuit between the scanning line 13 and other wiring that crosses the scanning line 13 through an insulating layer. This can prevent dielectric breakdown of the insulating film.

[0027] 2 shows a nonlinear element 30 having a first terminal (gate) connected to the scanning line 13 and a common wiring 2 9, a nonlinear element 31 having a first terminal (gate) connected to the A pair of nonlinear elements is used, and the second terminal (source) and the third terminal (drain) of each element are connected in common. The scanning line 29 and the scanning line 13 are connected in parallel. A linear element may be added to improve the operational stability of the protection circuit. For example, FIG. and the common wiring 29. The protection circuit shown in FIG. 1 is composed of a common wiring, a nonlinear element 31a, and a nonlinear element 31b. Two nonlinear elements (30b, 31b) whose first terminals (gates) are connected to the line 29, and Two nonlinear elements (30a, 31a) with their first terminals (gates) connected to 13 are used for a total of four nonlinear elements. It uses linear elements. That is, two nonlinear elements are used so that the rectification directions are opposite to each other. Two sets of the above are connected between the common wiring 29 and the scanning line 13. Between the scanning line 13 and the common wiring 29, two rectifying lines are provided, the rectifying direction of which is from the scanning line 13 to the common wiring 29. and two transistors whose rectification direction is from the common wiring 29 to the scanning line 13. In this way, the common wiring 29 and the scanning line 13 are connected by four nonlinear elements. By connecting the common wiring 29 to the scanning line 13, not only when a surge voltage is applied to the scanning line 13 but also when the common wiring 29 is statically connected to the scanning line 13, Even if the surface is charged by electricity, the charge flows directly into the scanning line 13. In addition, in FIG. 9, four nonlinear elements 740a, 740b, and 740c are provided. 9 shows an example of the arrangement of the capacitors 40c and 740d on a substrate together with an equivalent circuit diagram. In this figure, 650 indicates a scanning line and 651 indicates a common line.

[0028] As an example of a protection circuit using an odd number of nonlinear elements, the layout of nonlinear elements on a board is shown below. FIG. 8(A) shows an equivalent circuit of FIG. 8(B). In this circuit, for the nonlinear element 730c, The nonlinear element 730b and the nonlinear element 730a are connected as switching elements. By connecting nonlinear elements in series like this, the moment of application to the nonlinear elements that make up the protection circuit In FIG. 8, 650 indicates a scanning line and 651 indicates a common line. .

[0029] FIG. 2 shows an example of a protection circuit provided on the side of the scanning line 13, but a protection circuit of a similar configuration can also be provided on the side of the signal line 14. It can also be applied to the side.

[0030] FIG. 4(A) is a plan view showing an example of a protection circuit, and (B) shows its equivalent circuit diagram. 5 shows a cross-sectional view corresponding to the Q1-Q2 cutting line shown in FIG. An example of the configuration of the protection circuit will be described with reference to FIG.

[0031] The nonlinear elements 30a and 30b have gate electrodes formed in the same layer as the scanning lines 13. The gate electrode 15 and the gate electrode 16 are provided with a gate electrode. An insulating layer 37 is formed on the gate insulating layer 37. A first wiring layer 38 and a second wiring layer 39 are provided on the non-linear element 30a. The linear element 30b has the same main structure.

[0032] The first oxide semiconductor layer 36 covers the area between the first wiring layer 38 and the second wiring layer 39 that face each other. That is, the gate electrode 15 is overlapped with the gate insulating layer 37, the first wiring The wiring layer 38 and the second wiring layer 39 are provided so as to contact part of the side and upper surfaces thereof. The first wiring layer 38 and the second wiring layer 39 are formed by stacking the second oxide semiconductor layer 34 from the gate insulating layer 37 side. The gate insulating layer 37 is made of a silicon oxide. Alternatively, it may be formed of an oxide such as aluminum oxide.

[0033] The first oxide semiconductor layer 36 has a higher oxygen concentration than the second oxide semiconductor layer 40. In other words, the first oxide semiconductor layer 36 is an oxygen-excess type, and the second oxide semiconductor layer The oxygen-deficient type 40 is formed by increasing the oxygen concentration of the first oxide semiconductor layer 36. This has the effect of reducing defects and improving carrier lifetime and mobility. On the other hand, the second oxide semiconductor layer 40 has an oxygen concentration lower than that of the first oxide semiconductor layer 36. By lowering the concentration of the carriers, the carrier concentration can be increased, and the source and drain regions can be formed. It can be used to

[0034] The oxide semiconductor is non-single crystalline, and in a preferred embodiment, the first oxide semiconductor layer 36 is amorphous. The second oxide semiconductor layer 40 has an amorphous structure containing crystal grains (nanocrystals). The first oxide semiconductor layer 36 may be thicker than the second oxide semiconductor layer 40. Therefore, the nonlinear element 30a and the nonlinear element 30b of this embodiment have a low electrical conductivity. In the nonlinear element 30b, the first wiring layer 38 and the second wiring layer 39 are used as components. The second oxide semiconductor layer 40 has the same function as the source region and drain region of a transistor. is expressed.

[0035] The first oxide semiconductor layer 36 and the second oxide semiconductor layer 40 are non-single-crystal oxide semiconductors. Typically, zinc oxide (ZnO) or oxide semiconductor materials containing In, Ga, and Zn are used. It is formed like this.

[0036] The first wiring layer 38 and the second wiring layer 39 overlap the gate electrode 15 at their ends, and the gate insulating layer The second oxide semiconductor layer 40 and the conductive layer 41 are stacked from the side of the second oxide semiconductor layer 37. The second oxide semiconductor layer 40 is provided in contact with the gate insulating layer 37, and the side surface of the second oxide semiconductor layer 40 The first oxide semiconductor layer 36 is provided in contact with the upper surface of the conductive layer 41 and with the side surface of the conductive layer 41. As described above, the oxide semiconductor layers having different physical properties are formed on the gate insulating layer 37. Such a junction structure is provided in the nonlinear element 30a and the nonlinear element 30b. By doing so, when the first wiring layer 38 and the second wiring layer 39 are formed only by metal layers, It is possible to achieve more stable operation than a nonlinear element with a Schottky junction. This reduces junction leakage and improves the characteristics of the nonlinear elements 30a and 30b. It is possible.

[0037] The adhesion between the gate insulating layer 37 and the first oxide semiconductor layer 36 and the second oxide semiconductor layer 40 is That is, the aluminum film in contact with the gate insulating layer 37 is excellent in quality and is unlikely to peel off. Compared to directly forming metal wiring such as silicon, the first wiring layer 38 and the second wiring layer 39 Improved adhesion prevents defects in the protection circuit caused by peeling of the thin film. .

[0038] An interlayer insulating layer 42 is provided on the first oxide semiconductor layer 36. The interlayer insulating layer 42 is made of an oxide It is formed of an oxide such as silicon oxide or aluminum oxide. Silicon nitride, aluminum nitride, silicon oxynitride or aluminum oxynitride on aluminum nitride By laminating aluminum, the function as a protective film can be improved.

[0039] In any case, by forming the interlayer insulating layer 42 in contact with the first oxide semiconductor layer 36 as an oxide, In this case, oxygen is removed from the first oxide semiconductor layer 36, and the layer is prevented from changing into an oxygen-deficient type. You can do this.

[0040] A contact hole 43 is provided in the interlayer insulating layer 42, and the gate electrode 15 is formed in the same layer. The formed scanning line 13 is connected to the third terminal (drain) of the nonlinear element 30a. The connection is made by a third wiring layer 44 made of the same material as the pixel electrodes of the pixel portion. The wiring layer 44 is made of indium tin oxide (ITO), Made of transparent electrode materials such as zinc oxide (ZnO) and tin oxide (SnO2) As a result, the third wiring layer 44 has a higher resistance than wiring made of a metal material. By including wiring with such a resistance component in the protection circuit, excessive current will flow. This can prevent the nonlinear element 30a from being destroyed.

[0041] 4 and 5 show an example of a protection circuit provided on the scanning line 13, a similar protection circuit The line can be applied to a signal line, a capacitance bus line, etc.

[0042] As described above, according to this embodiment, a nonlinear element using an oxide semiconductor is used. By providing a protection circuit, it is possible to obtain a display device having a structure suitable for the protection circuit. Furthermore, it is possible to prevent defects in the protection circuit caused by peeling of the thin film.

[0043] (Embodiment 2) This embodiment mode describes one mode of a manufacturing process of the protection circuit shown in FIG. 4A in Embodiment 1. This will be explained with reference to Figures 6 and 7. Figures 6 and 7 are cut along the Q1-Q2 line in Figure 4(A). The cross-sectional view corresponding to FIG.

[0044] In FIG. 6(A), a commercially available barium borosilicate glass is used for the light-transmitting substrate 100. Glass substrates such as acid glass, aluminoborosilicate glass, and aluminosilicate glass For example, barium oxide (B2O3) can be used in place of boric acid (B2O3). It is preferable to use a glass substrate containing a large amount of oxide semiconductor (aO) and having a distortion point of 730°C or higher. This is because the glass substrate does not warp even when the layer is heat treated at a high temperature of about 700°C. do.

[0045] Next, a conductive layer is formed on the entire surface of the substrate 100, and then a first photolithography process is performed. Then, a resist mask is formed and unnecessary parts are removed by etching to form wiring and electrodes (gate The gate electrode 101, the gate wiring, the capacitance wiring, and the terminal are formed. The gate electrode 101 is also etched so that the end portion thereof is tapered. The scanning lines 108 are formed in the same layer as the port electrodes 101 .

[0046] The gate wiring including the gate electrode 101, the capacitance wiring, and the terminal of the terminal part are made of aluminum (Al It is desirable to form it from a low-resistance conductive material such as aluminum (Al) or copper (Cu), but aluminum alone is not heat-resistant. However, since it has problems such as poor durability and susceptibility to corrosion, it is formed by combining it with a heat-resistant conductive material. Heat-resistant conductive materials include titanium (Ti), tantalum (Ta), and tungsten ( Elements selected from W, molybdenum (Mo), chromium (Cr), and Nd (neodymium), is an alloy containing the above elements as components, an alloy film containing a combination of the above elements, or The cross section at this stage is shown in Figure 6(A).

[0047] Next, a gate insulating layer 102 is formed on the entire surface of the gate electrode 101. The film thickness of 02 is set to 50 to 250 nm using a sputtering method or the like.

[0048] For example, a silicon oxide film is used as the gate insulating layer 102 by sputtering, and 100 n Of course, the gate insulating layer 102 is not limited to such a silicon oxide film. Silicon oxide nitride film, silicon nitride film, aluminum oxide, tantalum oxide It may be formed as a single layer or a laminated structure made of these materials using other insulating films such as a film. good.

[0049] Next, a second oxide semiconductor film is formed on the gate insulating layer 102 by sputtering. , indium oxide (In2O3), gallium oxide (Ga2O3), and zinc oxide (ZnO A target with a composition ratio of 1:1:1 (=In2O3:Ga2O3:ZnO) was used. The pressure in the deposition chamber was 0.4 Pa, the power was 500 W, the deposition temperature was room temperature, and the gas was argon. A gas flow rate of 40 sccm is introduced to perform sputtering film formation. As a result, a second oxide semiconductor film A semiconductor film containing In, Ga, Zn, and oxygen is formed. Although a target of :1 (=In2O3:Ga2O3:ZnO) was intentionally used, However, oxide semiconductor films often contain crystal grains with sizes of 1 nm to 10 nm immediately after deposition. The target component ratio, film formation pressure (0.1 Pa to 2.0 Pa), power ( 250W~3000W: 8 inch φ), temperature (room temperature ~ 100℃), etc. of reactive sputtering By adjusting the film formation conditions appropriately, the presence or absence of crystal grains, the density of the crystal flow, and the diameter size can be adjusted to 1 nm. The thickness of the second oxide semiconductor film can be adjusted in the range of 5 nm to 20 nm. nm. Of course, if the film contains crystal grains, the size of the included crystal grains will exceed the film thickness. In this embodiment, the thickness of the second oxide semiconductor film is 5 nm.

[0050] Next, a conductive film made of a metal material is formed on the second oxide semiconductor film by sputtering or vacuum deposition. The conductive film is made of an element selected from Al, Cr, Ta, Ti, Mo, and W. Alternatively, an alloy containing the above elements or an alloy film of a combination of the above elements may be used. Here, a Ti film is used as the conductive film, and an aluminum (Al) film is placed on top of the Ti film. The conductive film is a three-layer structure in which a Ti film is formed on top of the laminated film. Alternatively, a titanium film may be laminated on an aluminum film. Alternatively, a single layer structure of an aluminum film containing silicon or a single layer structure of a titanium film may be used.

[0051] The gate insulating layer, the second oxide semiconductor film, and the conductive film are introduced into the chamber by sputtering. By appropriately switching the gas and the target to be installed, the gate insulating layer, conductive film, The first oxide semiconductor film and the second oxide semiconductor film can be formed successively without being exposed to the air. By forming the film continuously without contact with the atmosphere, it is possible to prevent the inclusion of impurities. When forming the film, it is preferable to use a multi-chamber manufacturing apparatus.

[0052] Next, a second photolithography process is performed to form a resist mask and etch the unnecessary portions of the conductive film are removed by this method to form the source electrode layer 105a and the drain electrode layer 105b. The etching method used here is wet etching or dry etching. Here, a dry process is used in which a mixture of SiCl4, Cl2, and BCl3 is used as the reactive gas. The conductive film, which is made by sequentially stacking a Ti film, an Al film, and a Ti film, is etched and sawed. A source electrode layer 105a and a drain electrode layer 105b are formed.

[0053] Next, a second oxide semiconductor is formed using the source electrode layer 105a and the drain electrode layer 105b as a mask. The conductive film is etched in a self-aligned manner. Here, ITO07N (manufactured by Kanto Chemical Co., Ltd.) is used. Unnecessary portions are removed by wet etching to form the source region 106a and the drain region The etching method here is not limited to wet etching, and may be dry etching. Dry etching may also be used. A cross-sectional view after removing the resist mask is shown in Figure 6(B). vinegar.

[0054] Next, plasma treatment is performed. Here, oxygen gas and argon gas are introduced into the film formation chamber. Reverse sputtering is performed to generate oxygen radicals or oxygen on the exposed gate insulating layer. In this way, dust adhering to the surface is removed, and the surface of the gate insulating layer is oxidized. The surface of the gate insulating layer is modified to an oxygen-excess region by oxygen radical treatment. This area allows for heat treatment (200℃ to 600℃) to improve reliability in subsequent processes. This is effective in providing an oxygen source for modifying the interface of the first oxide semiconductor layer. The cross section at this stage is shown in FIG. 6(C).

[0055] Next, a first oxide semiconductor film is formed without exposing the plasma-treated substrate to the air. The first oxide semiconductor film is formed without exposing the plasma-treated substrate to the atmosphere. This can prevent problems such as dust and moisture from adhering to the interface between the gate insulating layer and the semiconductor film. Here, an oxide semiconductor target containing In, Ga, and Zn with a diameter of 8 inches (composition ratio and In2O3:Ga2O3:ZnO=1:1:1) was used to form a thin film between the substrate and the target. The distance between the electrodes was 170 mm, the pressure was 0.4 Pa, the DC power was 0.5 kW, and the atmosphere was oxygen. Furthermore, if a pulsed direct current (DC) power supply is used, dust can be reduced and the film thickness distribution can be made uniform. The thickness of the first oxide semiconductor film is set to 5 nm to 200 nm. In this embodiment, the thickness of the first oxide semiconductor film is 100 nm.

[0056] The first oxide semiconductor film is formed under different film formation conditions from the second oxide semiconductor film. The second oxide semiconductor film has a different composition from the first oxide semiconductor film, and the second oxide semiconductor film has a higher oxygen concentration than the first oxide semiconductor film. For example, the second oxide semiconductor film is formed under the following conditions: The ratio of the oxygen gas flow rate to the argon gas flow rate is more important in the film formation conditions of the first oxide semiconductor film. Specifically, the film formation conditions for the second oxide semiconductor film are as follows: Gas (argon, helium, etc.) atmosphere (or oxygen gas 10% or less, argon gas) The first oxide semiconductor film is formed under an oxygen atmosphere (or an oxygen gas flow). The flow rate of the first oxide semiconductor film is set to be equal to or greater than the flow rate of the argon gas. Therefore, the conductivity of the oxide semiconductor film can be made lower than that of the second oxide semiconductor film. By including the fluorine atom in the first oxide semiconductor film, the off-state current can be reduced. Thin film transistors with high on / off ratios can be obtained.

[0057] The first oxide semiconductor film was formed in the same chamber as the previous reverse sputtering. If the film can be formed without exposing it to the atmosphere, it is acceptable to use a chalcogenide film that has been reverse sputtered before. The film may be formed in a chamber different from that of the member.

[0058] Next, it is preferable to carry out a heat treatment at 200°C to 600°C, typically 300°C to 500°C. Here, the material is placed in a furnace and heat treated at 350°C for 1 hour in a nitrogen atmosphere. This heat treatment causes rearrangement of the IGZO semiconductor film at the atomic level. The heat treatment (including photo-annealing) here is important because it releases the strain that inhibits migration. Note that the timing of the heat treatment is not particularly limited as long as it is performed after the formation of the first oxide semiconductor film. Alternatively, the step may be performed after forming the pixel electrodes.

[0059] Next, a third photolithography process is performed to form a resist mask and then etching is performed. The unnecessary portions are removed to form the first oxide semiconductor layer 103. The first oxide semiconductor layer 103 was formed by wet etching using a SiO2 film (manufactured by Kanto Chemical Co., Ltd.). Note that the first oxide semiconductor film and the second oxide semiconductor film are dissolved in the same etchant. Therefore, a part of the second oxide semiconductor film is removed by this etching. The second oxide semiconductor film (IGZO semiconductor) in the area covered with the first oxide semiconductor film and the mask The exposed edge of the second oxide semiconductor film is slightly etched, so The shape of the end portion changes accordingly. The first oxide semiconductor layer 103 is etched by wet etching. The resist mask is removed, and the following process is performed: In the above steps, a nonlinear element 30a is fabricated in which the first oxide semiconductor layer 103 serves as a channel formation region. The cross section at this stage is shown in Figure 7(A).

[0060] Next, a protective insulating film 107 is formed to cover the nonlinear element 30a. Silicon nitride film, silicon oxide film, silicon oxynitride film, and oxide film obtained by a dipping method, etc. For example, an aluminum oxide film, a tantalum oxide film, or the like can be used.

[0061] Next, a fourth photolithography step is performed to form a resist mask, and a protective insulating film 1 07 is etched to form a contact hole 125 reaching the drain electrode layer 105b. Furthermore, the gate insulating layer 102 is etched using the same resist mask to form a gate electrode. It is preferable to form a contact hole 126 that reaches the electrode, since this reduces the number of photomasks. The resist mask is removed, and the cross-sectional view at this stage is shown in FIG.

[0062] Next, the third wiring layer 128 is formed. If a transparent conductive film is used, the third wiring layer 128 and the pixel It is possible to form a film that will become an electrode. The material for the transparent conductive film is indium oxide (In2O3). and indium oxide tin oxide alloy (In2O3-SnO2, abbreviated as ITO) The etching process for such materials is carried out using a hydrochloric acid-based method. However, since ITO etching is particularly prone to leaving residues, Indium oxide-zinc oxide alloy (In2O3-ZnO) was used to improve the workability of the In this way, the transparent conductive film is etched to form the third wiring layer 128.

[0063] Next, a fifth photolithography step is performed to form a resist mask and then to perform etching. Unnecessary portions of the transparent conductive film are then removed to form pixel electrodes in pixel portions (not shown).

[0064] In addition, in this fifth photolithography process, a gate insulator is formed in a capacitor portion (not shown). The insulating layer 102 and the protective insulating film 107 serve as dielectrics, and the capacitance wiring and the pixel electrode form a storage capacitance. Complete.

[0065] In this fifth photolithography step, the terminal portion is covered with a resist mask. The transparent conductive film formed on the terminal part is left. The transparent conductive film is the electrode or are wirings, connection terminal electrodes that function as input terminals of source wirings, etc.

[0066] In this embodiment, the third wiring layer 128 made of a transparent conductive film is connected to the nonlinear element 30. The drain electrode layer 105b of the a-type electrode and the scanning line 108 are connected to each other through contact holes 125 and 126. and connect.

[0067] Next, the resist mask is removed. The cross-sectional view at this stage is shown in Figure 7(C).

[0068] In this way, five photolithography processes were carried out using five photomasks to create multiple layers. In this embodiment, two nonlinear elements 30a and 30b are used. According to this embodiment, a protection circuit (having a nonlinear element) can be completed. Since multiple TFTs can be fabricated in the same way, a bottom-gate n-channel The pixel section having the TFT and the protection circuit can be fabricated simultaneously. That is, by following the process shown in this embodiment, defects in the protection circuit caused by peeling of the thin film can be reduced. To manufacture a substrate for an active matrix display device equipped with a protection diode that does not can be done.

[0069] (Embodiment 3) In this embodiment, a display device to which one embodiment of the present invention is applied includes a protection circuit and a pixel portion. This shows an example of electronic paper having TFTs on the same substrate.

[0070] FIG. 10 shows an active matrix type electronic display device as an example of a display device to which one embodiment of the present invention is applied. The thin film transistor 581 used in the display device is the thin film transistor The thin film transistor 581 can be fabricated in the same manner as the nonlinear element shown in FIG. a gate insulating layer, a source region and a drain region made of an oxygen-deficient IGZO semiconductor film; a source electrode layer and a drain electrode layer in contact with the source region and the drain region; Thin-film transistor with high electrical properties having an oxygen-excess IGZO semiconductor layer in contact with the drain region It's Jista.

[0071] The electronic paper in Figure 10 is an example of a display device that uses the twisting ball display method. The spherical display method is an electrode layer that uses spherical particles painted in black and white as display elements. and a potential difference is applied between the first electrode layer and the second electrode layer. This is a method of displaying by controlling the orientation of spherical particles by generating a magnetic field.

[0072] The thin film transistor 581 is a thin film transistor with a bottom gate structure, and the source electrode layer The drain electrode layer is in contact with the first electrode layer 587 through an opening formed in the insulating layer 585, and is electrically connected. Between the first electrode layer 587 and the second electrode layer 588, a black area 59 is formed. The black area 590a and the white area 590b are surrounded by a liquid. and a spherical particle 589 having a cavity 594 filled with The particle 589 is filled with a filler 595 such as a resin (see FIG. 10). In FIG. 10, 580 is a substrate, 583 is an interlayer insulating layer, 584 is a protective film, and 596 is a substrate. do.

[0073] Also, instead of the twist ball, an electrophoretic element can be used. and a diameter of 10 μm to 20 μm that contains positively charged white particles and negatively charged black particles. Microcapsules of about 0 μm in size are used. When an electric field is applied by the first and second electrode layers, the microcapsules turn white. White particles and black particles move in opposite directions, allowing the display to be white or black. The display element that applies this principle is an electrophoretic display element, which is generally called electronic paper. Electrophoretic display elements have a higher reflectivity than liquid crystal display elements, so auxiliary lights are not required. It also consumes little power and the display can be seen even in dimly lit places. Even if power is not supplied to the display unit, the image that has been displayed can be maintained. Therefore, for example, a semiconductor device with a display function (simply a display) can be connected to a radio wave source that serves as a power supply source. Even if the display device (also called a display device or a semiconductor device equipped with a display device) is placed far away, the display This allows the captured image to be stored.

[0074] According to this embodiment, a protection circuit is configured using a nonlinear element using an oxide semiconductor. This makes it possible to obtain a display device having a structure suitable for a protection circuit. In the connection structure between the oxide semiconductor layer and the wiring layer, the second oxide semiconductor layer has a higher electrical conductivity than the first oxide semiconductor layer. By providing a region that is in contact with the high second oxide semiconductor layer, compared to the case where only metal wiring is used, This allows for stable operation. In addition, defects caused by peeling of the thin film are less likely to occur. As described above, according to this embodiment, electronic paper with high reliability as a display device can be manufactured. It is possible.

[0075] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0076] (Fourth embodiment) In this embodiment, in a display device which is an example of a semiconductor device of one embodiment of the present invention, At least a protection circuit, a part of a driving circuit, and a thin film transistor to be arranged in a pixel portion are arranged on the board. An example of the fabrication will be described below.

[0077] The thin film transistor disposed in the pixel portion is formed in the same manner as the nonlinear element shown in Embodiment Mode 2. In addition, since the thin film transistor formed is an n-channel TFT, Part of the driver circuit can be configured with n-channel TFTs. The semiconductor device is formed on the same substrate as the semiconductor device.

[0078] A block diagram of an active matrix liquid crystal display device, which is an example of a semiconductor device of one embodiment of the present invention, is shown. An example of the circuit diagram is shown in FIG. 11A. The display device shown in FIG. 11A is a display device on a substrate 5300. A pixel portion 5301 having a plurality of pixels each having a display element, and a scanning line driver circuit 5302 for selecting each pixel. 302 and a signal line driver circuit 5303 for controlling the input of a video signal to a selected pixel. Has.

[0079] The pixel portion 5301 is a signal line driver circuit 5303. The signal line driver circuit 5303 is arranged to extend in the column direction. The signal line driver circuit 5303 is connected to the signal line driver circuit 5303 by lines S1 to Sm (not shown). A plurality of scanning lines G1 to Gn (not shown) are arranged extending from 5302 in the row direction. The scanning line driver circuit 5302 is connected to the signal lines S1 to Sm and the scanning lines G1 to Gn. The image sensor has a plurality of pixels (not shown) arranged in a matrix. signal line Sj (one of the signal lines S1 to Sm), scanning line Gi (one of the scanning lines G1 to Gn), (either one) is connected.

[0080] Furthermore, a thin film transistor that can be formed in the same manner as the nonlinear element shown in the second embodiment is The signal line driver circuit is configured with n-channel TFTs. This will be explained using:

[0081] The signal line driver circuit shown in FIG. 12 includes a driver IC 5601 and a group of switches 5602_1 to 5602_56. 02_M, a first wiring 5611, a second wiring 5612, a third wiring 5613 and a wiring 56 Each of the switch groups 5602_1 to 5602_M includes: A first thin film transistor 5603a, a second thin film transistor 5603b, and a third thin film transistor It has a transistor 5603c.

[0082] The driver IC 5601 is connected to a first wiring 5611, a second wiring 5612, and a third wiring 5613. and are connected to the wirings 5621_1 to 5621_M. 5602_M are connected to the first wiring 5611, the second wiring 5612, and the third wiring 561 3 and wiring 5621_1 to 5621_5 corresponding to the switch groups 5602_1 to 5602_M, respectively. Each of the wirings 5621_1 to 5621_M is connected to the first A thin film transistor 5603a, a second thin film transistor 5603b, and a third thin film transistor For example, the wiring 5621 in the Jth column is connected to three signal lines via a resistor 5603c. _J (one of the wirings 5621_1 to 5621_M) is connected to the switch group 5602 The first thin film transistor 5603a, the second thin film transistor 5603b, and and the third thin film transistor 5603c, the signal line Sj-1, the signal line Sj, the signal line S connected to j+1.

[0083] The first wiring 5611, the second wiring 5612, and the third wiring 5613 are each connected to a signal line. The number is entered.

[0084] It is desirable that the driver IC 5601 be formed on a single crystal substrate. The switch groups 5602_1 to 5602_M are formed on the same substrate as the pixel section. Therefore, the driver IC 5601 and the switch group 5602_1 to 5602_ It is recommended to connect to M via an FPC or similar.

[0085] Next, the operation of the signal line driver circuit shown in FIG. 12 will be described with reference to the timing chart of FIG. The timing chart in FIG. 13 is explained with reference to the timing chart when the i-th scanning line Gi is selected. Furthermore, the timing chart shows the selection period of the i-th scanning line Gi. is divided into a first sub-selection period T1, a second sub-selection period T2, and a third sub-selection period T3. Furthermore, when a scanning line of another row is selected, the signal line driver circuit of FIG. In this case, the same operation as in FIG. 13 is performed.

[0086] In the timing chart of FIG. 13, the wiring 5621_J in the Jth column is connected to the first thin-film transistor. a second thin film transistor 5603a, a second thin film transistor 5603b, and a third thin film transistor 560 When connected to signal line Sj-1, signal line Sj, and signal line Sj+1 via 3c It shows.

[0087] The timing chart of FIG. 13 shows the timing when the i-th scanning line Gi is selected, The on / off timing 5703a of the first thin film transistor 5603a, The on / off timing 5703b of the third thin film transistor 56 The on / off timing of 03c is input to 5703c and the J-th row wiring 5621_J. Illustrated is signal 5721_J.

[0088] The wirings 5621_1 to 5621_M are connected to the first sub-selection period T1 and the second sub-selection period T2. In the first sub-selection period T2 and the third sub-selection period T3, different video signals are input. For example, the video signal input to the wiring 5621_J in the first sub-selection period T1 is The signal is input to the signal line Sj-1 and input to the wiring 5621_J in the second sub-selection period T2. The video signal to be output is input to the signal line Sj, and the signal is output to the wiring 5621 during the third sub-selection period T3. The video signal input to the first sub-selection period is input to the signal line Sj+1. During the period T1, the second sub-selection period T2, and the third sub-selection period T3, the wiring 5621_ The video signals input to J are Data_j-1, Data_j, and Data_j+ Let's say it's 1.

[0089] As shown in FIG. 13, in the first sub-selection period T1, the first thin film transistor 5603 a is turned on, and the second thin film transistor 5603b and the third thin film transistor 5603c At this time, Data_j-1 input to the wiring 5621_J is turned off. The signal is input to the signal line Sj-1 via the transistor 5603a. Second sub-selection period T2 In this case, the second thin film transistor 5603b is turned on, and the first thin film transistor 5603a The third thin film transistor 5603c is turned off. The output Data_j is input to the signal line Sj via the second thin film transistor 5603b. In the third sub-selection period T3, the third thin film transistor 5603c is turned on, and the first The first thin film transistor 5603a and the second thin film transistor 5603b are turned off. At this time, Data_j+1 input to the wiring 5621_J is input to the third thin film transistor 56 It is input to the signal line Sj+1 via 03c.

[0090] From the above, the signal line driver circuit in FIG. 12 can achieve the following by dividing one gate selection period into three. During one gate selection period, a video signal is input from one wiring 5621 to three signal lines. Therefore, the signal line driver circuit of FIG. The number of connections between the substrate on which the display is mounted and the substrate on which the pixel section is formed is reduced to about one-third of the number of signal lines. By reducing the number of connections to about one-third, the signal line driver circuit of FIG. This can improve productivity and yield.

[0091] As shown in Figure 12, one gate selection period is divided into multiple sub-selection periods, and multiple sub-selection periods are During each selection period, a video signal is input from one line to each of multiple signal lines. As long as this can be achieved, there are no limitations on the arrangement, number, driving method, etc. of the thin film transistors.

[0092] For example, three or more signal lines are connected to one wiring in each of three or more sub-selection periods. When a video signal is input to each, a thin film transistor and a thin film transistor are controlled. However, it is necessary to divide one gate selection period into four or more sub-selection periods. Therefore, one gate selection period is divided into two or Preferably, it is divided into three sub-selection periods.

[0093] As another example, as shown in the timing chart of FIG. 14, one selection period is precharged. The first sub-selection period Tp, the second sub-selection period T2, the third sub-selection period T 3. Furthermore, in the timing chart of FIG. 14, the scanning line Gi of the i-th row is selected. the timing at which the first thin film transistor 5603a is turned on and off; 03a, the on / off timing 5803b of the second thin film transistor 5603b, The on / off timing 5803c of the thin film transistor 5603c and the J-th column wiring 5 14, the signal 5821_J input to the pre-channel 621_J is shown. During the load period Tp, the first thin film transistor 5603a and the second thin film transistor 56 The third thin film transistor 5603b and the third thin film transistor 5603c are turned on. The precharge voltage Vp input to the first thin film transistor 5603a and the second thin film transistor 5603b is and the third thin film transistor 5603b and the third thin film transistor 5603c are connected to the signal line S j-1, signal line Sj, and signal line Sj+1. The first thin film transistor 5603a is turned on, and the second thin film transistor 5603b and the third thin film transistor 5603c are turned on. At this time, the thin film transistor 5603c is turned off. ata_j-1 is input to the signal line Sj-1 via the first thin film transistor 5603a. In the second sub-selection period T2, the second thin film transistor 5603b is turned on, and the first The first thin film transistor 5603a and the third thin film transistor 5603c are turned off. At this time, Data_j input to the wiring 5621_J is input to the second thin film transistor 5603 b is input to the signal line Sj. In the third sub-selection period T3, The first thin film transistor 5603a and the second thin film transistor 5603c are turned on. At this time, Data_j+1 input to the wiring 5621_J is , and is input to the signal line Sj+1 via the third thin film transistor 5603c.

[0094] From the above, the signal line driver circuit of FIG. 12 to which the timing chart of FIG. 14 is applied By providing a precharge period before the block selection period, the signal line can be precharged. Therefore, the video signal can be written to the pixel at high speed. 13 are denoted by the same reference numerals, and the same parts or parts having similar functions are shown. A detailed description of the relevant parts will be omitted.

[0095] The configuration of the scanning line driving circuit will be described. The scanning line driving circuit includes a shift register, a buffer, and a In some cases, a level shifter may be included. In the circuit, a clock signal (CLK) and a start pulse signal (SP) are input to the shift register. ) is input, the selection signal is generated. The generated selection signal is The signal is buffered and amplified in the scanning line and then supplied to the corresponding scanning line. The gate electrodes of the transistors are connected. Since they must all be turned on at the same time, the buffer must be able to pass a large current. It is used.

[0096] One form of a shift register used as part of a scanning line driving circuit is shown in FIGS. 15 and 16. I will explain.

[0097] The circuit configuration of the shift register is shown in Figure 15. The shift register shown in Figure 15 has multiple free The flip-flops are composed of flip-flops (flip-flops 5701_1 to 5701_n). The first clock signal, the second clock signal, the start pulse signal, and the reset signal are input. It works like this.

[0098] The connection relationship of the shift register in Fig. 15 will be explained. The shift register in Fig. 15 has i-stage Flip-flop 5701_i (flip-flop 5701_1~5701_n) In either case, the first wiring 5501 shown in FIG. 16 is connected to the seventh wiring 5717_i-1. 16 is connected to the seventh wiring 5717_i+1. 16 is connected to the seventh wiring 5717_i, and The sixth wiring 5506 is connected to the fifth wiring 5715 .

[0099] In addition, the fourth wiring 5504 shown in FIG. 16 is the second wiring in the odd-numbered flip-flops. 5712, and in the even-numbered flip-flops, it is connected to the third wiring 5713. The fifth wiring 5505 shown in FIG.

[0100] However, the first wiring 5501 shown in FIG. 16 of the first-stage flip-flop 5701_1 is 16 of the n-th flip-flop 5701_n. The second wiring 5502 is connected to the sixth wiring 5716 .

[0101] The first wiring 5711, the second wiring 5712, the third wiring 5713, and the sixth wiring 57 16 can be called the first signal line, the second signal line, the third signal line, and the fourth signal line, respectively. Furthermore, the fourth wiring 5714 and the fifth wiring 5715 are respectively connected to the first power supply line and the This may also be called the power line 2.

[0102] Next, the details of the flip-flop shown in FIG. 15 are shown in FIG. 16. The flip-flop includes a first thin film transistor 5571, a second thin film transistor 5572, A third thin film transistor 5573, a fourth thin film transistor 5574, a fifth thin film transistor a sixth thin film transistor 5575, a sixth thin film transistor 5576, a seventh thin film transistor 5577, and and an eighth thin film transistor 5578. A second thin film transistor 5572, a third thin film transistor 5573, a fourth thin film transistor a fifth thin film transistor 5574, a fifth thin film transistor 5575, a sixth thin film transistor 5576, The seventh thin film transistor 5577 and the eighth thin film transistor 5578 are n-channel A transistor in which the gate-source voltage (Vgs) exceeds the threshold voltage (Vth) When this occurs, the device is in a conductive state.

[0103] Next, the connection configuration of the flip-flop shown in FIG. 16 will be described below.

[0104] A first electrode (either a source electrode or a drain electrode) of the first thin film transistor 5571 is connected to a fourth wiring 5504, and a second electrode (source) of the first thin film transistor 5571 is connected to a The other of the source electrode and the drain electrode is connected to a third wiring 5503 .

[0105] A first electrode of the second thin film transistor 5572 is connected to the sixth wiring 5506, and A second electrode of the thin film transistor 5572 is connected to a third wiring 5503 .

[0106] A first electrode of the third thin film transistor 5573 is connected to a fifth wiring 5505. The second electrode of the thin film transistor 5573 is the gate electrode of the second thin film transistor 5572. , and the gate electrode of the third thin film transistor 5573 is connected to the fifth wiring 5505. will be done.

[0107] A first electrode of the fourth thin film transistor 5574 is connected to a sixth wiring 5506, and The second electrode of the thin film transistor 5574 is the gate electrode of the second thin film transistor 5572. , and the gate electrode of the fourth thin film transistor 5574 is connected to the first thin film transistor 5 It is connected to the gate electrode of 571.

[0108] A first electrode of the fifth thin film transistor 5575 is connected to a fifth wiring 5505. The second electrode of the thin film transistor 5575 is the gate electrode of the first thin film transistor 5571. , and the gate electrode of the fifth thin film transistor 5575 is connected to the first wiring 5501. will be done.

[0109] A first electrode of the sixth thin film transistor 5576 is connected to the sixth wiring 5506. The second electrode of the thin film transistor 5576 is the gate electrode of the first thin film transistor 5571. , and the gate electrode of the sixth thin film transistor 5576 is connected to the second thin film transistor 5 It is connected to the gate electrode of 572.

[0110] A first electrode of the seventh thin film transistor 5577 is connected to the sixth wiring 5506. The second electrode of the thin film transistor 5577 is the gate electrode of the first thin film transistor 5571. , and the gate electrode of the seventh thin film transistor 5577 is connected to the second wiring 5502. A first electrode of the eighth thin film transistor 5578 is connected to the sixth wiring 5506. The second electrode of the eighth thin film transistor 5578 is connected to the gate of the second thin film transistor 5572. The gate electrode of the eighth thin film transistor 5578 is connected to the first wiring 550. Connected to 1.

[0111] The gate electrode of the first thin film transistor 5571 and the gate electrode of the fourth thin film transistor 5574 the gate electrode of the fifth thin film transistor 5575, the second electrode of the sixth thin film transistor The connection point of the second electrode of the seventh thin film transistor 5576 and the second electrode of the seventh thin film transistor 5577 is Further, the gate electrode of the second thin film transistor 5572, the gate electrode of the third thin film transistor 5573, and the gate electrode of the third thin film transistor 5574 are connected to the gate electrode of the second thin film transistor 5575. a second electrode of the fourth thin film transistor 5573; a second electrode of the fourth thin film transistor 5574; The gate electrode of the sixth thin film transistor 5576 and the gate electrode of the eighth thin film transistor 5578 The connection point of the two electrodes is designated as node 5544.

[0112] The first wiring 5501, the second wiring 5502, the third wiring 5503 and the fourth wiring 5504 are 504 are referred to as the first signal line, the second signal line, the third signal line, and the fourth signal line, respectively. Furthermore, the fifth wiring 5505 may be connected to a first power supply line, and the sixth wiring 5506 may be connected to a second power supply line. It can also be called a line.

[0113] In addition, the signal line driver circuit and the scanning line driver circuit may be formed in the same manner as the nonlinear element shown in the second embodiment. It is also possible to fabricate the device using only n-channel TFTs that can be formed by the above method. The n-channel TFT, which can be formed in the same manner as the nonlinear element shown in form 2, is a transistor. The high mobility of the star makes it possible to increase the driving frequency of the driving circuit. The n-channel TFT, which can be formed in the same manner as the nonlinear element shown in the second embodiment, is an in- The source region or drain region is an oxygen-deficient oxide semiconductor layer containing sodium, gallium, and zinc. The parasitic capacitance is reduced by the MOSFET area, resulting in high frequency characteristics (called f characteristics). For example, an n-channel TFT can be formed in the same manner as the nonlinear element shown in the second embodiment. The scanning line driving circuit can be operated at high speed, so the frame frequency can be increased. Alternatively, it is also possible to implement the insertion of a black screen.

[0114] Furthermore, the channel width of the transistor of the scanning line driving circuit can be increased, and multiple scanning lines can be formed. By arranging the drive circuit, it is possible to achieve an even higher frame frequency. When multiple scanning line driving circuits are arranged, the scanning line driving circuits for driving the even-numbered scanning lines are The circuit for driving the odd-numbered scanning lines is placed on one side, and the scanning line driving circuit for driving the odd-numbered scanning lines is placed on the other side. By placing the frame frequency at a higher level, it is possible to increase the frame frequency.

[0115] Furthermore, an active matrix light-emitting display device, which is an example of a semiconductor device to which one embodiment of the present invention is applied, When manufacturing a display device, a plurality of thin film transistors are arranged in at least one pixel. It is preferable that a plurality of scanning line driving circuits are arranged. An example of a block diagram is shown in FIG.

[0116] The light-emitting display device shown in FIG. 11B has a plurality of pixels each having a display element over a substrate 5400. A pixel portion 5401 for selecting each pixel, a first scanning line driver circuit 5402 for selecting each pixel, and a second scanning line driver circuit 5403 for selecting each pixel. A driver circuit 5404 and a signal line driver circuit 5405 for controlling the input of a video signal to a selected pixel 403 and

[0117] When a video signal input to a pixel of the light-emitting display device shown in FIG. 11(B) is in a digital format, When a pixel is turned on, it emits light or does not emit light by switching the transistor on or off. Therefore, gray scale display can be performed using area gray scale or time gray scale. The stacked gray scale method divides one pixel into multiple sub-pixels, and each sub-pixel is independently driven based on a video signal. The time gray scale method is a driving method that displays gray scales by moving the pixel. This is a driving method that displays gradation by controlling the period during which the light is turned on.

[0118] Light-emitting elements have a higher response speed than liquid crystal elements, making them more suitable for time gray scale modulation than liquid crystal elements. Specifically, when displaying using the time gray scale method, one frame period is divided into multiple subframes. Then, in accordance with the video signal, the light emitting element of the pixel is By dividing the period into multiple subframes, The total length of the period during which pixels actually emit light during one frame is controlled by the video signal. It is possible to control the brightness and display gradation.

[0119] In the light-emitting display device shown in FIG. 11B, one pixel has a switching TFT and a When two TFTs are arranged, the first TFT is the gate wiring of the switching TFT. The signal input to the scanning line is generated by the first scanning line driver circuit 5402, and the current control TFT A signal input to the second scanning line, which is the gate wiring of the second scanning line, is generated by a second scanning line driver circuit 5404. The example shows a signal input to the first scanning line and a signal input to the second scanning line. The signals to be output may be generated by a single scanning line driving circuit. The operation of the switching element is controlled by the number of transistors that the switching element has. In this case, a plurality of first scanning lines may be provided for each pixel. Alternatively, all of the signals input to the plurality of first scanning lines may be generated by one scanning line driver circuit. Alternatively, the signals may be generated by a plurality of scanning line driving circuits.

[0120] In addition, in the light-emitting display device, the driver circuit may be configured with an n-channel TFT. A part of the driver circuit can be formed on the same substrate as the thin film transistor of the pixel portion. In addition, the signal line driver circuit and the scanning line driver circuit may be similarly configured together with the nonlinear element shown in the second embodiment. It is also possible to fabricate only n-channel TFTs that can be formed by the method described above.

[0121] The above-mentioned driving circuit is not limited to liquid crystal display devices and light-emitting display devices, but may also be used in It may also be used in electronic paper, which uses electrically connected elements to drive electronic ink. Electronic paper is also called an electrophoretic display (electrophoretic display) and has the same properties as paper. It is easy to read, consumes less power than other display devices, and can be made thinner and lighter. It has advantages.

[0122] Electrophoretic displays can be of various forms, but the first particle has a positive charge. A microcapsule containing a negatively charged particle and a second particle is immersed in a solvent or solute. By applying an electric field to the microcapsules, The particles in the capsule are moved in opposite directions to each other, and only the color of the particles that have gathered on one side is displayed. The first particles or the second particles contain a dye, and in the absence of an electric field, The first particle and the second particle have different colors (colorless). (including

[0123] Thus, electrophoretic displays allow materials with high dielectric constants to migrate to areas of high electric field. This is a display that utilizes the so-called dielectrophoretic effect. The polarizing plate and counter substrate required for display devices are not required, and the thickness and weight are reduced by half.

[0124] The microcapsules dispersed in a solvent are called electronic ink. The electronic ink can be printed on surfaces such as glass, plastic, fabric, and paper. Color display is also possible by using color filters or particles containing pigments.

[0125] Furthermore, the microphone is appropriately placed on the active matrix substrate so as to be sandwiched between two electrodes. By arranging multiple microcapsules, an active matrix display device is completed. By applying an electric field to the cell, display can be performed. For example, in the nonlinear element shown in the second embodiment, Active matrix obtained by thin film transistors that can be formed in a similar manner with the A substrate can be used.

[0126] The first particles and the second particles in the microcapsules may be made of a conductive material, an insulating material, Semiconductor materials, magnetic materials, liquid crystal materials, ferroelectric materials, electroluminescent materials, A material selected from magnetochromic materials, magnetophoretic materials, or a composite material thereof Just use it.

[0127] According to this embodiment, a protection circuit is configured using a nonlinear element using an oxide semiconductor. This makes it possible to obtain a display device having a structure suitable for a protection circuit. In the connection structure between the oxide semiconductor layer and the wiring layer, the second oxide semiconductor layer has a higher electrical conductivity than the first oxide semiconductor layer. By providing a region that is in contact with the high second oxide semiconductor layer, compared to the case where only metal wiring is used, This allows for stable operation. In addition, defects caused by peeling of the thin film are less likely to occur. As described above, according to this embodiment mode, a highly reliable display device can be manufactured.

[0128] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0129] (Embodiment 5) A thin film transistor is fabricated together with the nonlinear element according to one embodiment of the present invention, and the thin film transistor is printed. A semiconductor device (also called a display device) having a display function is manufactured by using the semiconductor device in the element part and further in the driver circuit. In addition, the nonlinear element according to one embodiment of the present invention and the thin film transistor can be used in a driving circuit. It is used in part or the whole of the substrate, and is integrated with the pixel section to form a system-on-panel. It is possible.

[0130] The display device includes a display element. The display element includes a liquid crystal element (also called a liquid crystal display element), a light-emitting element, A light-emitting element (also called a light-emitting display element) can be used. This category includes elements whose brightness is controlled by the light emitted from the light source, specifically inorganic EL (Electroluminescent) Also, electronic inks and other electronic devices are also included. A display medium whose contrast changes due to mechanical action can also be applied.

[0131] The display device also includes a panel in which a display element is sealed, and a controller for the panel. Furthermore, one aspect of the present invention is a module in which an IC or the like including the above-mentioned is mounted. In the process of manufacturing a display device, the element substrate corresponds to one form before the display element is completed. The element substrate includes a means for supplying a current to each of the plurality of pixels. Specifically, the substrate may be in a state where only pixel electrodes of the display element are formed, or After forming the conductive film that will become the electrode, but before etching to form the pixel electrode It's fine, and all forms apply.

[0132] In this specification, the term "display device" refers to an image display device, a display device, or an optical device. It also refers to connectors, such as FPC (Flexible Printed Circuit) integrated circuit) or TAB (Tape Automated Bon ding) tape or TCP (Tape Carrier Package) Modules with printed wiring boards attached to the end of TAB tape or TCP or the display element is mounted on an IC (integrated circuit) by the COG (Chip On Glass) method. The display device also includes all modules in which the display device (circuit) is directly mounted.

[0133] In this embodiment, the appearance of a liquid crystal display panel, which is one mode of a display device according to one embodiment of the present invention, is The cross section will be explained using FIG. 17. FIG. 17 shows a nonlinear element and a similar method. Thin film transistors 4010 and 4011 and liquid crystal elements 4013 with high electrical properties can be fabricated. The substrate is sealed by a sealant 4005 between a first substrate 4001 and a second substrate 4006. 17(A1) and 17(A2) are cross-sectional views of the panel. This corresponds to a plan view.

[0134] A pixel portion 4002 and a scanning line driver circuit 4004 are provided on a first substrate 4001. In this way, a sealing material 4005 is provided. A second substrate 4006 is provided on the path 4004. The line driver circuit 4004 is formed by a sealing material 4 between the first substrate 4001 and the second substrate 4006. The first substrate 4001 is sealed together with the liquid crystal layer 4008 by a sealing material 4005. In an area different from the area surrounded by the cooling material 4005, a single A signal line driver circuit 4003 formed of a crystalline semiconductor film or a polycrystalline semiconductor film is mounted. .

[0135] The method of connecting the separately formed drive circuit is not particularly limited, and may be a COG method, Wire bonding or TAB method can be used. is an example of mounting a signal line driver circuit 4003 by the COG method, and FIG. 17(A2) is This is an example in which a signal line driver circuit 4003 is mounted by the TAB method.

[0136] A pixel portion 4002 and a scanning line driver circuit 4004 are provided on a first substrate 4001. 17B, ​​the thin film transistor included in the pixel portion 4002 is A transistor 4010 and a thin film transistor 4011 included in the scanning line driver circuit 4004 Insulating layers 4020 and 4022 are formed on the thin film transistors 4010 and 4011. 1 is provided.

[0137] The thin film transistors 4010 and 4011 have a plasma-treated gate insulating layer and an oxygen-deficient A source region and a drain region made of an IGZO semiconductor film, and a source region and a drain region a source electrode layer and a drain electrode layer in contact with the source region and the drain region; A thin film transistor having an excess IGZO semiconductor layer and high electrical characteristics, In this embodiment, the thin film transistor can be fabricated in the same manner as the nonlinear element shown in FIG. The transistors 4010 and 4011 are n-channel thin film transistors.

[0138] The pixel electrode layer 4030 of the liquid crystal element 4013 is connected to the thin film transistor 4010. The counter electrode layer 4031 of the liquid crystal element 4013 is electrically connected to the second substrate 40. 06. The pixel electrode layer 4030, the counter electrode layer 4031, and the liquid crystal layer 4008 are The overlapping portion corresponds to the liquid crystal element 4013. The electrode layer 4031 is provided with insulating layers 4032 and 4033 which function as alignment films. A liquid crystal layer 4008 is sandwiched between insulating layers 4032 and 4033 .

[0139] The first substrate 4001 and the second substrate 4006 may be made of glass or metal (typically, stainless steel). Stainless steel, ceramics, and plastics can be used. , FRP (Fiberglass-Reinforced Plastics) board, PV F (polyvinyl fluoride) film, polyester film or acrylic resin film Aluminum foil can also be used with PVF film or polyester film. A sheet sandwiched between films can also be used.

[0140] 4035 is a columnar spacer obtained by selectively etching the insulating film. To control the distance (cell gap) between the pixel electrode layer 4030 and the counter electrode layer 4031 A spherical spacer may also be used.

[0141] Alternatively, a liquid crystal that exhibits a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases. When the temperature of cholesteric liquid crystal is increased, the phase immediately transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range, so the temperature range needs to be improved. In order to achieve this, the liquid crystal layer 4008 is formed using a liquid crystal composition containing 5% by weight or more of a chiral agent. The liquid crystal composition containing the liquid crystal exhibiting the blue phase and the chiral agent has a response speed of 10 μs It is short (approximately 100 μs), has optical isotropy so alignment treatment is not required, and has little viewing angle dependency. Sai.

[0142] Note that this embodiment mode is an example of a transmissive liquid crystal display device, but one embodiment of the present invention is a reflective liquid crystal display device. The present invention can be applied to both a liquid crystal display device and a semi-transmissive liquid crystal display device.

[0143] In the liquid crystal display device of this embodiment, a polarizing plate is provided on the outer side (viewing side) of the substrate, and a polarizing plate is provided on the inner side. An example is shown in which a colored layer and an electrode layer used for a display element are provided in this order, but the polarizing plate is provided on the inner side of the substrate. The laminated structure of the polarizing plate and the colored layer is not limited to that of the present embodiment. The coloring layer may be appropriately selected depending on the material and manufacturing process conditions of the coloring layer. A light-shielding film that functions as a light-shielding film may be provided.

[0144] In this embodiment, in order to reduce the unevenness of the surface of the thin film transistor, In order to improve the reliability of the transistor, the nonlinear element shown in the second embodiment and the same The thin film transistor can be formed by the above method. The insulating layer 4020 and the insulating layer 4021 are used to cover the insulating film. It is designed to prevent the intrusion of polluting impurities such as floating organic matter, metals, and water vapor. The protective film is preferably a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like, which is formed by sputtering. Bare film, silicon nitride oxide film, aluminum oxide film, aluminum nitride film, aluminum oxynitride film The insulating film may be formed of a single layer or a stack of aluminum nitride oxide films. Although the protective film is formed by sputtering in this example, it may be formed by various methods without any particular limitation. stomach.

[0145] Here, an insulating layer 4020 having a stacked structure is formed as a protective film. As the first layer of the silicon dioxide film, a silicon dioxide film is formed by sputtering. By using the above, it is possible to prevent hillocks in the aluminum film used as the source electrode layer and the drain electrode layer. It is effective in stopping.

[0146] In addition, a silicon nitride film is formed as a second layer of the insulating layer 4020 by sputtering. When a silicon nitride film is used as the film, mobile ions such as sodium penetrate into the semiconductor region, It is possible to suppress changes in the electrical characteristics of the TFT.

[0147] After forming the protective film, the oxide semiconductor layer was annealed (at 300°C to 400°C). That's fine.

[0148] An insulating layer 4021 is formed as a planarization insulating film. Heat-resistant organic compounds such as amide, acrylic, benzocyclobutene, polyamide, and epoxy. In addition to the above organic materials, low-k materials can also be used. , siloxane resin, PSG (phosphorus glass), BPSG (borophosphorus glass), etc. Siloxane resins can have fluorine, alkyl groups, or alkyl groups in addition to hydrogen as a substituent. The insulating material formed from these materials may have at least one of the following groups: The insulating layer 4021 may be formed by laminating a plurality of insulating films.

[0149] Siloxane-based resin is a Si-OS compound formed using siloxane-based materials as starting materials. Siloxane resins contain hydrogen as a substituent, as well as fluorine and alkyl groups. The alkyl group may have at least one of a methyl group, a methyl group, an alkyl ...

[0150] The method for forming the insulating layer 4021 is not particularly limited, and may be a sputtering method, an SOG method, or the like, depending on the material. , spin coating, dip coating, spray coating, droplet ejection method (inkjet method, screen printing, offset printing, etc.), doctor knife, roll coater, curtain coater, knife When the insulating layer 4021 is formed using a material liquid, In the step of annealing, the oxide semiconductor layer may be annealed (at 300°C to 400°C). The baking process of the insulating layer 4021 and the annealing process of the oxide semiconductor layer are combined to efficiently bake the semiconductor. It is possible to create a body device.

[0151] The pixel electrode layer 4030 and the counter electrode layer 4031 are made of indium oxide containing tungsten oxide. , indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, Indium tin oxide containing titanium oxide, indium tin oxide (hereinafter referred to as ITO), Translucent materials such as indium zinc oxide and indium tin oxide doped with silicon oxide A conductive material can be used.

[0152] The pixel electrode layer 4030 and the counter electrode layer 4031 are made of a conductive polymer (conductive polymer The conductive composition can be used to form the conductive film. The pixel electrode has a sheet resistance of 10,000 Ω / □ or less and a light transmittance of 550 nm. It is preferable that the resistance of the conductive polymer contained in the conductive composition is 70% or more. It is preferable that the electrical conductivity is 0.1 Ω·cm or less.

[0153] As the conductive polymer, a so-called π-electron conjugated conductive polymer can be used. For example, polyaniline or its derivatives, polypyrrole or its derivatives, polythiophene or or a derivative thereof, or a copolymer of two or more of these.

[0154] A signal line driver circuit 4003 and a scanning line driver circuit 4004 are separately formed. Various signals and potentials applied to 2 are supplied from FPC4018.

[0155] In this embodiment, the connection terminal electrode 4015 is connected to the pixel electrode layer 40 of the liquid crystal element 4013. The terminal electrode 4016 is formed from the same conductive film as the thin film transistors 4010 and 40 The source electrode layer and the drain electrode layer 11 are formed of the same conductive film.

[0156] The connection terminal electrode 4015 is connected to the terminal of the FPC 4018 via the anisotropic conductive film 4019. are electrically connected.

[0157] In FIG. 17, a signal line driver circuit 4003 is formed separately and mounted on a first substrate 4001. However, this embodiment is not limited to this configuration. Alternatively, a part of the signal line driver circuit or a part of the scanning line driver circuit may be formed separately and mounted. Alternatively, the circuit board may be formed separately and mounted.

[0158] FIG. 18 shows a semiconductor device using a TFT substrate 2600 manufactured according to one embodiment of the present invention. 1 shows an example of a liquid crystal display module.

[0159] FIG. 18 shows an example of a liquid crystal display module, in which a TFT substrate 2600 and an opposing substrate 2601 are connected. The substrate is fixed by a bonding material 2602, and a pixel portion 2603 including a TFT and the like and a liquid crystal layer are disposed between the substrate and the bonding material 2602. A display element 2604 and a colored layer 2605 are provided to form a display area. is required for color display, and in the case of the RGB method, it corresponds to each color of red, green, and blue. A colored layer is provided corresponding to each pixel. On the outside, a polarizing plate 2606, a polarizing plate 2607, and a diffusion plate 2613 are arranged. It is composed of a cathode ray tube 2610 and a reflector 2611, and a circuit board 2612 is a flexible wiring board. The wiring board 2609 is connected to the wiring circuit section 2608 of the TFT substrate 2600, and the controller It also incorporates external circuits such as a polarizing plate and a power supply circuit. The layers may be laminated with a retardation film interposed therebetween.

[0160] The LCD module is available in TN (Twisted Nematic) mode, IPS (In-Plane Switching) mode, n-Plane-Switching mode, FFS (Fringe Field Switching) Switching mode, MVA (Multi-domain Vertical A alignment) mode, PVA(Patterned Vertical Alignment) mode nment), ASM(Axially Symmetric aligned Mic) ro-cell) mode, OCB(Optical Compensated Bire) fringence mode, FLC (Ferroelectric Liquid Crystal Crystal mode, AFLC (AntiFerroelectric Liquid Crystal) can be used.

[0161] According to this embodiment, a protection circuit is configured using a nonlinear element using an oxide semiconductor. This makes it possible to obtain a display device having a structure suitable for a protection circuit. In the connection structure between the oxide semiconductor layer and the wiring layer, the second oxide semiconductor layer has a higher electrical conductivity than the first oxide semiconductor layer. By providing a region that is in contact with the high second oxide semiconductor layer, compared to the case where only metal wiring is used, This allows for stable operation. In addition, defects caused by peeling of the thin film are less likely to occur. As described above, according to this embodiment, a highly reliable liquid crystal display panel can be manufactured. Cut.

[0162] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0163] (Sixth embodiment) In this embodiment, an example of a light-emitting display device will be described as a display device according to one embodiment of the present invention. Here, a light-emitting element that uses electroluminescence is used as the display element. The light-emitting element that utilizes electroluminescence uses an organic compound as the light-emitting material. Generally, the former is an organic EL element, and the latter is an inorganic compound. These are called EL elements.

[0164] In an organic EL element, electrons and holes are released from a pair of electrodes by applying a voltage to the light-emitting element. are injected into the layers containing the light-emitting organic compounds, causing a current to flow. The recombination of the electrons and holes creates an excited state in the light-emitting organic compound. The excited state is then converted to the ground state, at which point light is emitted. Such a light-emitting element is called a current-excited light-emitting element.

[0165] Inorganic EL elements are divided into dispersion-type inorganic EL elements and thin-film-type inorganic EL elements depending on the element structure. Dispersion-type inorganic EL elements have a light-emitting layer in which particles of a light-emitting material are dispersed in a binder. The emission mechanism is a donor-acceptor interaction that utilizes the donor and acceptor levels. Thin-film inorganic EL devices sandwich the light-emitting layer between dielectric layers. Furthermore, this structure is sandwiched between electrodes, and the light emission mechanism utilizes the inner-shell electron transition of metal ions. In this example, the light-emitting element is an organic EL element. do.

[0166] FIG. 19 shows an example of a semiconductor device to which digital time gray scale driving is applied. FIG. 1 shows an example of a possible pixel configuration.

[0167] The configuration and operation of a pixel to which digital time gray scale driving can be applied will be described. The first oxide semiconductor layer can be formed by the same method as in the nonlinear element shown in the second embodiment. An example in which two n-channel transistors are used in the filter formation region in one pixel is shown.

[0168] The pixel 6400 includes a switching transistor 6401, a driving transistor 6402, It has a light emitting element 6404 and a capacitor element 6403. 01 has a gate connected to a scanning line 6406 and a first electrode (one of the source and drain electrodes) The first electrode (the other of the source electrode and the drain electrode) is connected to a signal line 6405, and the second electrode (the other of the source electrode and the drain electrode) is connected to a drive The driving transistor 6402 is connected to the gate of the driving transistor 6402. The gate is connected to a power supply line 6407 via a capacitor element 6403, and the first electrode is connected to a power supply line 640 7, and the second electrode is connected to the first electrode (pixel electrode) of the light emitting element 6404. The second electrode of the light emitting element 6404 corresponds to the common electrode 6408 .

[0169] A low power supply potential is set to the second electrode (common electrode 6408) of the light emitting element 6404. The low power supply potential is a low power supply potential with respect to the high power supply potential set to the power supply line 6407. Potential < High power supply potential. For example, GND, 0V, etc. are set as low power supply potential. The potential difference between the high power supply potential and the low power supply potential is applied to the light emitting element 6404. Then, in order to make the light emitting element 6404 emit light by passing a current through the light emitting element 6404, a high power supply potential and the low power supply potential is set to be equal to or greater than the forward threshold voltage of the light emitting element 6404. Each potential is set.

[0170] The capacitor element 6403 is omitted by substituting the gate capacitance of the driving transistor 6402. The gate capacitance of the driving transistor 6402 is determined by the channel region A capacitance may be formed between the gate electrode and the transistor.

[0171] In the case of a voltage input voltage driving method, the gate of the driving transistor 6402 is connected to The driving transistor 6402 is either fully on or off. A video signal is input, that is, the driving transistor 6402 is operated in a linear region. The driving transistor 6402 is operated in a linear region, so that the voltage of the driving transistor 6402 is higher than the voltage of the power supply line 6407. A high voltage is applied to the gate of the driving transistor 6402. The signal line 6405 is connected to A voltage equal to or greater than (power supply line voltage+Vth of the driving transistor 6402) is applied.

[0172] Furthermore, when analog grayscale driving is performed instead of digital time grayscale driving, the input of the signal is different. By doing so, the same pixel configuration as in FIG. 19 can be used.

[0173] When analog gradation driving is performed, a light emitting element 6404 is connected to the gate of a driving transistor 6402. A voltage equal to or greater than the forward voltage of the light emitting element 64 and the Vth of the driving transistor 6402 is applied. The forward voltage in 04 refers to the voltage required to achieve the desired brightness, and It should be noted that the driving transistor 6402 is designed to operate in the saturation region. By inputting an optical signal, a current can be passed through the light emitting element 6404. In order to operate the transistor 6402 in the saturation region, the potential of the power supply line 6407 is The potential of the light emitting element is made higher than the gate potential of the capacitor 6402. A current corresponding to a video signal is passed through 6404, enabling analog gradation driving.

[0174] Note that the pixel configuration shown in Fig. 19 is not limited to this. For example, A switch, a resistor, a capacitor, a transistor, a logic circuit, or the like may be added.

[0175] Next, the configuration of the light emitting element will be described with reference to FIG. 20. Here, the driving TFT is The cross-sectional structure of a pixel will be explained using the example of the type shown in Figures 20(A), (B), and (C). The driving TFTs 7001, 7011, and 7021 used in the semiconductor device are the same as those in the second embodiment. A thin film transistor can be formed in a similar manner to the nonlinear element shown in FIG. The gate insulating layer is made of an oxygen-deficient IGZO semiconductor film, and the source and drain regions are made of an oxygen-deficient IGZO semiconductor film. a source electrode layer and a drain electrode layer in contact with the source region and the drain region; A thin film transistor with high electrical properties having an oxygen-excess IGZO semiconductor layer in contact with the drain and gate regions It is a transistor.

[0176] The light emitting element only needs to have at least one of the anode and cathode transparent in order to extract light. Then, a thin film transistor and a light emitting element are formed on the substrate, and light is taken from the surface opposite to the substrate. The surface of the substrate and the substrate are different. There is a light-emitting element having a dual emission structure in which light is extracted from the opposite surface. The composition can be applied to any light emitting device with any emission structure.

[0177] A light emitting element with a top emission structure will be described with reference to FIG.

[0178] In FIG. 20(A), a driving TFT 7001 is an n-type TFT, and light emitted from a light emitting element 7002 is A cross-sectional view of a pixel when the light passes through to the anode 7005 side (the side opposite to the substrate) is shown in FIG. In this example, the cathode 7003 of the light emitting element 7002 is electrically connected to the driving TFT 7001. A light-emitting layer 7004 and an anode 7005 are stacked in this order on the cathode 7003. 3) Various materials can be used as long as they have a small work function and are conductive films that reflect light. For example, Ca, Al, CaF, MgAg, AlLi, etc. are preferable. 7004 may be composed of a single layer or multiple layers may be stacked. When the cathode 7003 is configured with a plurality of layers, an electron injection layer, an electron The transport layer, light-emitting layer, hole transport layer, and hole injection layer are laminated in this order. The anode 7005 is formed using a light-transmitting conductive material. , such as indium oxide containing tungsten oxide, indium oxide containing tungsten oxide Zinc oxide, indium oxide with titanium oxide, indium tin oxide with titanium oxide Indium tin oxide (hereinafter referred to as ITO), indium zinc oxide, silicon oxide A light-transmitting conductive film such as an indium tin oxide film containing doped indium tin may also be used.

[0179] The region where the light-emitting layer 7004 is sandwiched between the cathode 7003 and the anode 7005 is the light-emitting element 7002. In the case of the pixel shown in FIG. 20(A), the light emitted from the light emitting element 7002 is The light is emitted toward the anode 7005 as shown by the mark.

[0180] Next, a light emitting element with a bottom emission structure will be described with reference to FIG. 011 is n-type, and light emitted from the light emitting element 7012 is emitted to the cathode 7013 side (substrate side). FIG. 20B shows a cross-sectional view of a pixel when the driving TFT 7011 is electrically connected to the driving TFT 7012. A cathode 7013 of the light-emitting element 7012 is formed on the connected conductive film 7017 having light-transmitting properties. A light-emitting layer 7014 and an anode 7015 are stacked in this order on the cathode 7013. If the anode 7015 is light-transmitting, a light-reflecting or light-shielding layer is formed on the anode. A shielding film 7016 for blocking the light may be formed on the cathode 7013. Similarly, various conductive materials with small work functions can be used. The film thickness is set to a level that allows light to pass through (preferably, about 5 nm to 30 nm). An aluminum film having a thickness of 0 nm can be used as the cathode 7013. The light-emitting layer 7014 may be composed of a single layer or a plurality of layers, as in FIG. The anode 7015 does not need to transmit light. However, similarly to FIG. 20(A), it can be formed using a light-transmitting conductive material. The shielding film 7016 can be made of, for example, a metal that reflects light. The material is not limited to a film, and for example, a resin to which a black pigment is added may also be used.

[0181] The region where the light-emitting layer 7014 is sandwiched between the cathode 7013 and the anode 7015 is the light-emitting element 7012. In the case of the pixel shown in FIG. 20B, light emitted from the light-emitting element 7012 corresponds to The light is emitted toward the cathode 7013 as shown by the arrow.

[0182] Next, a light emitting element with a dual emission structure will be described with reference to FIG. Then, on the conductive film 7027 having light-transmitting properties and electrically connected to the driving TFT 7021, A cathode 7023 of the light-emitting element 7022 is formed as a film. A light-emitting layer 7024 is formed on the cathode 7023. The cathode 7023 is laminated in the same manner as in FIG. Various conductive materials with small electrical conductivity can be used. For example, Al having a thickness of 20 nm is used as the cathode 7023. The light-emitting layer 7024 can be formed of a single layer, as in FIG. The anode 70 may be formed by laminating a plurality of layers. 25 is formed using a light-transmitting conductive material, similar to FIG. 20(A). It is possible.

[0183] The overlapping portion of the cathode 7023, the light-emitting layer 7024, and the anode 7025 is the light-emitting element 70. In the case of the pixel shown in FIG. 20C, the light emitted from the light emitting element 7022 is emitted to both the anode 7025 side and the cathode 7023 side as shown by the arrows.

[0184] Although organic EL elements have been described as light-emitting elements here, inorganic EL elements can also be used as light-emitting elements. It is also possible to provide an L element.

[0185] In this embodiment, a thin film transistor (driving TFT) that controls driving of a light emitting element is Although an example in which the light emitting element is electrically connected has been shown, it is possible to prevent a current from flowing between the driving TFT and the light emitting element. A control TFT may be connected.

[0186] Note that the semiconductor device shown in this embodiment mode is not limited to the configuration shown in FIG. Various modifications based on the technical concept of the present invention are possible.

[0187] Next, a light-emitting display panel (also referred to as a light-emitting panel) which corresponds to one mode of a semiconductor device of one embodiment of the present invention will be described. The appearance and cross section of the device (referred to as "device") will be explained with reference to FIG. 21. FIG. 21(A) shows one example of the device of the present invention. A thin film transistor with high electrical properties can be fabricated on the first substrate in the same manner as the nonlinear element of the embodiment. A panel in which a transistor and a light-emitting element are sealed between a first substrate and a second substrate with a sealant. 21(B) is a top view of the panel, and FIG. 21(B) corresponds to a cross-sectional view taken along line HI in FIG. 21(A). .

[0188] A pixel portion 4502, a signal line driver circuit 4503a, and a signal line driver circuit 4504 are provided on a first substrate 4501. 3b and the scanning line driver circuits 4504a and 4504b. In addition, a pixel portion 4502, signal line driver circuits 4503a and 4503b, and A second substrate 4506 is provided on the scanning line driver circuits 4504a and 4504b. The pixel portion 4502, the signal line driver circuits 4503a and 4503b, and the scanning line driver circuit 45 4504a and 4504b are a first substrate 4501, a sealing material 4505, and a second substrate 4506. The seal is sealed together with the filler 4507 by the sealant. Highly airtight protective film with little outgassing (lamination film, UV curable resin film) It is preferable to package (enclose) the product in a protective film (such as a film) or a cover material.

[0189] In addition, a pixel portion 4502, a signal line driver circuit 4503a, 4503b and the scanning line driver circuits 4504a and 4504b have a plurality of thin film transistors. In FIG. 21B, a thin film transistor 4510 included in a pixel portion 4502 and A thin film transistor 4509 included in a signal line driver circuit 4503a is illustrated.

[0190] The thin film transistors 4509 and 4510 have a plasma-treated gate insulating layer and an oxygen-deficient The source and drain regions are made of an IGZO semiconductor film, and the source and drain regions are made of an IGZO semiconductor film. a source electrode layer and a drain electrode layer in contact with the source region and the drain region; A thin film transistor having high electrical characteristics and an IGZO semiconductor layer with excess silicon, It can be fabricated in the same manner as the nonlinear element shown in Embodiment 2. Transistors 4509 and 4510 are n-channel thin film transistors.

[0191] Further, 4511 corresponds to a light-emitting element, and a first electrode which is a pixel electrode of the light-emitting element 4511 The layer 4517 is electrically connected to the source electrode layer or the drain electrode layer of the thin film transistor 4510. The light-emitting element 4511 is configured by a first electrode layer 4517, an electroluminescent layer The second electrode layer 4512 and the second electrode layer 4513 are stacked in a stacked structure. The direction of the light emitting element 4511 is adjusted according to the direction of the light extracted from the light emitting element 4511. The configuration can be changed as appropriate.

[0192] The partition wall 4520 is formed using an organic resin film, an inorganic insulating film, or organic polysiloxane. In particular, a photosensitive material is used to form an opening on the first electrode layer 4517, and the sidewall of the opening It is preferable to form the inclined surface so that the inclined surface has a continuous curvature.

[0193] The electroluminescent layer 4512 may be composed of a single layer or a plurality of layers stacked. It doesn't matter whether it's done or not.

[0194] The second electrode layer is formed to prevent oxygen, hydrogen, moisture, carbon dioxide, and the like from entering the light-emitting element 4511. A protective film may be formed on the partition wall 4513 and the partition wall 4520. The protective film may be a silicon nitride film, A silicon nitride oxide film, a DLC film, or the like can be formed.

[0195] In addition, signal line driver circuits 4503a and 4503b, scanning line driver circuits 4504a and 4504b Various signals and potentials applied to the pixel portion 4502 are transmitted through the FPC 4518a, 4518b, and It is supplied by b.

[0196] In this embodiment, the connection terminal electrode 4515 is connected to the first electrode layer 4 The terminal electrode 4516 is formed from the same conductive film as the thin film transistors 4509 and 517. The source electrode layer and the drain electrode layer 510 are formed from the same conductive film.

[0197] The connection terminal electrode 4515 is connected to the terminal of the FPC 4518a via the anisotropic conductive film 4519. are electrically connected to each other.

[0198] The second substrate 4506 located in the direction of light extraction from the light emitting element 4511 must be light-transmitting. In this case, glass plates, plastic plates, polyester films or A light-transmitting material such as an acrylic film is used.

[0199] In addition to inert gases such as nitrogen and argon, filler 4507 can also be used as UV-curable resin. It can be made of oil or thermosetting resin, and PVC (polyvinyl chloride), acrylic, Polyimide, epoxy resin, silicone resin, PVB (polyvinyl butyral) or EV In this embodiment, nitrogen is used as the filler. Use the element.

[0200] If necessary, a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate) may be provided on the light-emitting surface of the light-emitting element. Optical films such as retardation plates (λ / 4 plates, λ / 2 plates) and color filters may be provided as appropriate. In addition, an anti-reflection film may be provided on the polarizing plate or the circular polarizing plate. Anti-glare treatment can be applied to diffuse reflected light and reduce glare.

[0201] The signal line driver circuits 4503a and 4503b and the scanning line driver circuits 4504a and 4504b are A driving circuit formed of a single crystal semiconductor film or a polycrystalline semiconductor film on a separately prepared substrate is Alternatively, only the signal line driver circuit, or a part of the signal line driver circuit, or the scanning line driver circuit may be mounted. Only the path or only a part of the path may be separately formed and mounted. In this embodiment, the structure shown in FIG. Not limited.

[0202] According to this embodiment, a protection circuit is configured using a nonlinear element using an oxide semiconductor. This makes it possible to obtain a display device having a structure suitable for a protection circuit. In the connection structure between the oxide semiconductor layer and the wiring layer, the second oxide semiconductor layer has a higher electrical conductivity than the first oxide semiconductor layer. By providing a region that is in contact with the high second oxide semiconductor layer, compared to the case where only metal wiring is used, This allows for stable operation. In addition, defects caused by peeling of the thin film are less likely to occur. As described above, according to this embodiment, a highly reliable light-emitting display device (display panel) can be manufactured. It is possible.

[0203] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0204] (Embodiment 7) The display device of one embodiment of the present invention can be used as electronic paper. It can be used in any electronic device that displays information. For example, electronic paper can be used for electronic books, posters, and on trains and other vehicles. It can be used for in-car advertising, display on various cards such as credit cards, etc. An example of a slave device is shown in FIG. 22 and FIG.

[0205] FIG. 22(A) shows a poster 2631 made of electronic paper. In the case of printed matter, the advertisements are exchanged manually. By using electronic paper, the display of advertisements can be changed in a short time. The poster is designed to be able to send and receive information wirelessly. It may also be possible to use the following.

[0206] FIG. 22(B) shows an advertisement 2632 inside a vehicle such as a train. In the case of paper printouts, the advertisements are exchanged manually. By using electronic paper, it is possible to change the display of advertisements in a short time without requiring much manpower. In addition, stable images can be displayed without any distortion. It may be configured to be able to send and receive information.

[0207] 23 shows an example of an electronic book 2700. For example, the electronic book 2700 includes: It consists of two housings, housing 2701 and housing 2703. The body 2703 is integrated with a shaft 2711, and the opening and closing movement is performed around the shaft 2711. This configuration allows the device to operate like a paper book. This becomes:

[0208] A display unit 2705 is incorporated in the housing 2701, and a display unit 2707 is incorporated in the housing 2703. The display unit 2705 and the display unit 2707 are configured to display a continuous screen. Alternatively, a different screen may be displayed. For example, a sentence is displayed on the right display unit (display unit 2705 in FIG. 23) and An image can be displayed on the display unit 2707 in FIG.

[0209] 23 shows an example in which the housing 2701 is provided with an operation unit. 701 includes a power supply 2721, operation keys 2723, a speaker 2725, etc. The operation keys 2723 can be used to turn pages. It may also be configured to include a touch panel, a pointing device, etc. On the side, there are external connection terminals (earphone terminal, USB terminal, or AC adapter and USB A configuration including a terminal that can be connected to various cables, a recording medium insertion section, etc. Furthermore, the electronic book 2700 may be configured to have the function of an electronic dictionary. That's fine.

[0210] The electronic book 2700 may also be configured to be able to send and receive information wirelessly. The desired book data can be purchased and downloaded from the e-book server. is also possible.

[0211] As in this embodiment, the nonlinear element using an oxide semiconductor is used to improve the function and stabilize the operation. By incorporating a display device having a protective circuit into an electronic device, the The display is highly reliable and equipped with a protection circuit made of nonlinear elements that are less susceptible to defects. It is possible to manufacture electronic devices equipped with such a structure.

[0212] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0213] (Embodiment 8) A semiconductor device according to one embodiment of the present invention can be applied to various electronic devices (including gaming machines). The electronic device can be, for example, a television device (television or television (also called digital receivers), computer monitors, digital cameras, digital video cameras digital photo frames, mobile phones (also called mobile phones or mobile phone devices), Examples include large game machines such as small game machines, mobile information terminals, sound reproduction devices, and pachinko machines. can be.

[0214] FIG. 24(A) shows an example of a television device 9600. The display unit 9603 is incorporated in the housing 9601. In this case, the housing 9601 is supported by a stand 9605. This shows a configuration in which the above is supported.

[0215] The television device 9600 can be operated using an operation switch on the housing 9601 or a separate remote control. This can be done by the remote control operation device 9610. The channel and volume can be controlled by the 9609, and the information displayed on the display 9603 is In addition, the remote control operation device 9610 can operate the video. A display portion 9607 for displaying information output from 9610 may be provided.

[0216] The television device 9600 is configured to include a receiver, a modem, and the like. It can receive more general TV broadcasts and can also receive them via wired or wireless modems. By connecting to a communication network, it can be one-way (sender to receiver) or two-way. It is also possible to communicate information (between a sender and a receiver, or between receivers).

[0217] FIG. 24B shows an example of a digital photo frame 9700. The photo frame 9700 has a display unit 9703 built into a housing 9701. The unit 9703 is capable of displaying various images, for example, images taken with a digital camera. By displaying the image data, it can function like a normal photo frame.

[0218] The Digital Photo Frame 9700 has an operation panel, external connection terminals (USB terminal, US A terminal that can be connected to various cables such as B cable, etc., and a recording medium insertion section. These components may be incorporated on the same surface as the display unit, but they may be incorporated on the side or back. It is preferable to have a recording medium for a digital photo frame as it improves the design. A memory that stores image data taken with a digital camera is inserted into the body insertion section. The image data can be captured and the captured image data can be displayed on the display portion 9703 .

[0219] The digital photo frame 9700 may also be configured to be capable of transmitting and receiving information wirelessly. It is also possible to configure the device so that desired image data can be wirelessly acquired and displayed.

[0220] FIG. 25(A) shows a portable gaming machine, which is composed of two cabinets, a cabinet 9881 and a cabinet 9891. The housing 9881 is connected to a connector 9893 so as to be openable and closable. A display unit 9883 is incorporated in the housing 9891. The portable gaming machine shown in 25(A) also includes a speaker unit 9884, a recording medium insertion unit 988 6, LED lamp 9890, input means (operation key 9885, connection terminal 9887, sensor 9 888 (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, Chemical substances, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration (including functions for measuring movement, smell, or infrared rays), microphone 9889) Of course, the configuration of the portable gaming machine is not limited to the above, and It is sufficient if the semiconductor device according to one aspect is included, and other auxiliary equipment is appropriately provided. The portable gaming machine shown in FIG. 25(A) can be configured as It has the function of reading out programs or data and displaying them on the display, as well as wireless communication with other portable gaming machines. The portable gaming machine shown in Figure 25(A) has the function of communicating with the user and sharing information. The functions are not limited to these, and various other functions may be provided.

[0221] FIG. 25(B) shows an example of a slot machine 9900, which is a large gaming machine. The machine 9900 has a display unit 9903 built into a housing 9901. Machine 9900 also has other operating means such as a start lever and stop switch, coin It is equipped with an insertion slot, a speaker, etc. Of course, the configuration of the slot machine 9900 is The present invention is not limited to the above, and may be implemented in any configuration as long as it includes at least a semiconductor device according to one embodiment of the present invention. In addition, other auxiliary equipment may be provided as appropriate.

[0222] FIG. 26 shows an example of a mobile phone 1000. The mobile phone 1000 has a housing 100 1, in addition to the display unit 1002, operation buttons 1003, an external connection port 1004, It is equipped with a speaker 1005, a microphone 1006, etc.

[0223] The mobile phone 1000 shown in FIG. 26 allows users to input information by touching the display unit 1002 with a finger or the like. In addition, operations such as making a call or sending an email can be performed by the display unit 100. This can be done by touching 2 with a finger or something.

[0224] The screen of the display unit 1002 has three main modes. The first is a display mode that mainly displays images. The first mode is a display mode, and the second mode is an input mode that mainly inputs information such as characters. This is a display + input mode that combines two modes: display mode and input mode.

[0225] For example, when making a call or creating an email, the display unit 1002 is used to input characters. This is the main character input mode, and you can input characters displayed on the screen. It is preferable to display a keyboard or number buttons on most of the screen of the display unit 1002. I wish.

[0226] In addition, the mobile phone 1000 may include a sensor for detecting tilt, such as a gyro or an acceleration sensor. By providing a detection device having the above configuration, the orientation of the mobile phone 1000 (portrait or landscape) can be determined and the display The screen display of the display unit 1002 can be automatically switched.

[0227] The screen mode can be switched by touching the display unit 1002 or by operating the housing 1001. This is done by operating the button 1003. Also, depending on the type of image displayed on the display unit 1002, For example, if the image signal to be displayed on the display unit is a video signal, If it is data, the display mode is switched to, and if it is text data, the input mode is switched to.

[0228] In the input mode, the optical sensor of the display unit 1002 detects a signal and displays it. If there is no input by touch operation of the part 1002 for a certain period of time, the screen mode is changed to the input mode. Alternatively, the display mode may be switched from the normal mode to the display mode.

[0229] The display unit 1002 can also function as an image sensor. By touching the palm or fingers to the sensor 02, the palm print, fingerprint, etc. can be captured and identity authentication can be performed. In addition, the display unit may be equipped with a backlight that emits near-infrared light or a sensor that emits near-infrared light. By using a scanning light source, it is also possible to capture images of finger veins, palm veins, etc.

[0230] As in this embodiment, the nonlinear element using an oxide semiconductor is used to improve the function and stabilize the operation. By incorporating a display device having a protective circuit into an electronic device, the The display is highly reliable and equipped with a protection circuit made of nonlinear elements that are less susceptible to defects. It is possible to manufacture electronic devices equipped with such a structure.

[0231] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is. [Explanation of symbols]

[0232] 10 Substrate 11 Scanning line input terminal 12 Signal line input terminal 13 scan lines 14 Signal line 15 gate electrode 16 gate electrode 17 Pixel section 18 pixels 19 pixel transistor 20 Holding capacity section 21 pixel electrode 22 Capacitance line 23 Common terminal 24 Protection circuit 25 Protection circuit 26 Protection circuit 27 capacity bus lines 28 Common wiring 29 Common wiring 30 Nonlinear elements 30a Nonlinear element 30b Nonlinear element 31 Nonlinear elements 31a Nonlinear element 31b Nonlinear element 36 Oxide semiconductor layer 37 Gate insulating layer 38 wiring layer 39 Wiring layer 40 Oxide semiconductor layer 41 Conductive layer 42 Interlayer insulating layer 43 Contact Hole 44 Wiring layer 100 boards 101 gate electrode 102 Gate insulating layer 103 Oxide semiconductor layer 105a Source electrode layer 105b drain electrode layer 106a Source Region 106b Drain region 107 Protective insulating film 108 scan lines 125 Contact Hole 126 Contact Hole 128 wiring layer 580 board 581 Thin-film transistor 583 Interlayer Insulation Layer 584 Protective film 585 Insulation Layer 587 Electrode layer 588 Electrode layer 589 Spherical particles 590a black area 590b White area 594 Cavity 595 Filling material 596 PCB 650 scan lines 651 Common Wiring 730a Nonlinear element 730b Nonlinear element 730c Nonlinear Element 740a Nonlinear element 740b Nonlinear element 740c Nonlinear Element 740d Nonlinear Element 1000 mobile phones 1001 Case 1002 Display section 1003 Operation button 1004 External connection port 1005 Speaker 1006 Mike 2600 TFT substrate 2601 Opposing substrate 2602 Sealing material 2603 Pixel section 2604 Display element 2605 Colored layer 2606 Polarizing plate 2607 Polarizing plate 2608 Wiring circuit section 2609 Flexible wiring board 2610 cold cathode tube 2611 Reflector 2612 Circuit Board 2613 Diffuser 2631 Poster 2632 In-car advertising 2700 e-books 2701 Housing 2703 Housing 2705 ​​Display section 2707 Display section 2711 Shaft 2721 Power supply 2723 Operation Key 2725 Speaker 4001 board 4002 Pixel section 4003 Signal line driver circuit 4004 Scanning line driver circuit 4005 Sealing material 4006 board 4008 Liquid crystal layer 4010 Thin Film Transistor 4011 Thin-film transistor 4013 Liquid crystal element 4015 Connection terminal electrode 4016 Terminal electrode 4018 FPC 4019 Anisotropic conductive film 4020 Insulation layer 4021 Insulation layer 4030 Pixel electrode layer 4031 Counter electrode layer 4032 Insulation layer 4033 Insulation layer 4035 Spacer 4501 Circuit Board 4502 Pixel section 4503a Signal line driver circuit 4503b Signal line driver circuit 4504a Scanning line driver circuit 4504b Scanning line driver circuit 4505 Sealing material 4506 board 4507 Filling material 4509 Thin-film transistor 4510 Thin-film transistor 4511 Light-emitting element 4512 Electroluminescent layer 4513 Electrode layer 4515 Connection terminal electrode 4516 Terminal electrode 4517 Electrode layer 4518a FPC 4518b FPC 4519 Anisotropic conductive film 4520 Bulkhead 5300 board 5301 Pixel unit 5302 Scanning line driver circuit 5303 Signal line driver circuit 5400 board 5401 Pixel unit 5402 Scanning line driver circuit 5403 Signal line driver circuit 5404 Scanning line driver circuit 5501 Wiring 5502 Wiring 5503 Wiring 5504 Wiring 5505 Wiring 5506 Wiring 5543 nodes 5544 nodes 5571 Thin-film transistor 5572 Thin-film transistor 5573 Thin-film transistor 5574 Thin-film transistor 5575 Thin-film transistor 5576 Thin-film transistor 5577 Thin-film transistor 5578 Thin-film transistor 5601 Driver IC 5602 switches 5603a Thin Film Transistor 5603b Thin Film Transistor 5603c Thin Film Transistor 5611 Wiring 5612 Wiring 5613 Wiring 5621 Wiring 5701 Flip-Flop 5703a Timing 5703b Timing 5703c Timing 5711 Wiring 5712 Wiring 5713 Wiring 5714 Wiring 5715 Wiring 5716 Wiring 5717 Wiring 5721 Signal 5803a Timing 5803b Timing 5803c Timing 5821 Signal 6400 pixels 6401 Switching transistor 6402 Drive transistor 6403 Capacitor element 6404 Light-emitting element 6405 signal line 6406 scan lines 6407 Power line 6408 Common electrode 7001 Driving TFT 7002 Light-emitting element 7003 Cathode 7004 Light-emitting layer 7005 Anode 7011 Driving TFT 7012 Light-emitting element 7013 Cathode 7014 Light-emitting layer 7015 Anode 7016 Shielding membrane 7017 Conductive film 7021 Driving TFT 7022 Light-emitting element 7023 Cathode 7024 Light-emitting layer 7025 Anode 7027 Conductive film 9600 Television Equipment 9601 Housing 9603 Display section 9605 Stand 9607 Display section 9609 Operation Key 9610 Remote Control Machine 9700 Digital Photo Frame 9701 Housing 9703 Display section 9881 Case 9882 Display section 9883 Display section 9884 Speaker section 9885 Operation Key 9886 Recording medium insertion section 9887 Connection terminal 9888 Sensor 9889 Microphone 9890 LED Lamp 9891 Case 9893 Connection section 9900 slot machine 9901 Housing 9903 Display section

Claims

[Claim 1] A display device having a pixel portion in which scanning lines and signal lines are provided to intersect with each other on a substrate having an insulating surface and pixel electrodes are arranged in a matrix, the pixel portion includes a thin film transistor having a channel formation region formed in a first oxide semiconductor layer, the thin film transistor has a gate electrode connected to the scanning line, a first wiring layer connected to the signal line and in contact with the first oxide semiconductor layer, and a second wiring layer connected to the pixel electrode and in contact with the first oxide semiconductor layer; a nonlinear element is provided between a signal input terminal disposed on the periphery of the substrate and the pixel unit; the nonlinear element includes a gate electrode and a gate insulating layer covering the gate electrode; a pair of first and second wiring layers, each having an end portion overlapping the gate electrode on the gate insulating layer and including a second oxide semiconductor layer and a conductive layer stacked thereon; and a first oxide semiconductor layer overlapping at least the gate electrode and in contact with side surfaces and top surfaces of the gate insulating layer and the conductive layers in the first wiring layer and second wiring layer and a side surface portion of the second oxide semiconductor layer; a gate electrode of the nonlinear element is connected to the scanning line or the signal line; A display device characterized in that the first wiring layer or the second wiring layer of the nonlinear element is connected to the gate electrode by a third wiring layer so that the potential of the gate electrode is applied to the first wiring layer or the second wiring layer.

Images