Lens Assembly and Electronic Device Including the Same

Abstract

Provided are a lens assembly with improved design freedom and capable of being easily arranged in a narrow space, and an electronic device including the same. 【Solution means】A lens assembly is provided that includes at least two lenses aligned along a first optical axis, an image sensor configured to receive light guided or condensed through the at least two lenses, and at least one optical member disposed between the at least two lenses and the image sensor, the at least one optical member receiving light incident through the at least two lenses and guiding or emitting the light to the image sensor after refracting or reflecting the light at least twice. The ratio of the long side of the imaging surface of the image sensor to the long side of the exit surface of the first optical member closest to the image sensor is within a specified range.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more specifically, to a lens assembly and an electronic device including the same.

Background Art

[0002] An electronic device means a device that executes a specific function based on a mounted program, such as from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, in-vehicle navigation, etc. For example, these electronic devices output stored information as sound or images. In recent years, as the integration level of electronic devices has increased and ultra-high-speed and large-capacity wireless communication has become widespread, various functions have been implemented in a single electronic device such as a mobile communication terminal. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and / or functions such as schedule management and electronic wallets are integrated into a single electronic device.

[0003] With the development of digital camera manufacturing technology, electronic devices equipped with small and lightweight camera modules have been commercialized. Generally, electronic devices that are always carried (e.g., mobile communication terminals) are equipped with camera modules, and users can easily utilize various functions such as not only taking photos and videos but also video calls and augmented reality.

[0004] In recent years, electronic devices including multiple cameras have become popular. The electronic device includes, for example, a camera module equipped with a wide-angle camera and a telephoto camera. The electronic device can capture a wide range of scenes around the electronic device using the wide-angle camera to obtain a wide-angle image, or capture a scene corresponding to a relatively distant position from the electronic device using the telephoto camera to obtain a telephoto image. In this way, miniaturized electronic devices such as smartphones are eroding the digital compact camera market by including multiple camera modules or lens assemblies, and are expected to replace high-performance cameras such as single-lens reflex cameras in the future.

[0005] The above information may be provided as background art to assist in understanding the present invention. No claim or determination is made as to whether any of the above content can be applied as prior art in relation to the present invention.

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide a lens assembly with improved design freedom and easily arrangeable in a narrow space, and an electronic device including the same.

Means for Solving the Problems

[0007] According to an embodiment of the present invention, the lens assembly includes at least two lenses aligned along a first optical axis direction, an image sensor configured to receive light guided or condensed through the at least two lenses, and at least one optical member disposed between the at least two lenses and the image sensor, the at least one optical member receiving light incident through the at least two lenses, refracting or reflecting the light at least twice, and then guiding or emitting the light to the image sensor. In one embodiment, the lens assembly satisfies the following [Conditional Expression 1] and [Conditional Expression 2]. [Conditional Expression 1] 1.2 = <w / img-X = <2.5 [Conditional Expression 2] 15 = <Ang-min = <40 Here, "img-X" is the length of the longer side among the horizontal / vertical lengths of the imaging surface of the image sensor, "w" is the length of the longer side among the horizontal / vertical lengths of the exit surface facing the image sensor among the surfaces of the optical member closest to the image sensor (hereinafter referred to as the "first optical member") among the at least one optical member, and "Ang-min" is the minimum angle among the angles formed by two adjacent surfaces of the first optical member.

[0008] According to an embodiment of the present invention, an electronic device includes a lens assembly, a memory storing instructions related to image acquisition, and a processor configured to execute the instructions to acquire an image by receiving external light using the lens assembly. In one embodiment, the lens assembly includes at least two lenses aligned along a first optical axis direction, an image sensor configured to receive light guided or condensed through the at least two lenses, and at least one optical member disposed between the at least two lenses and the image sensor, the at least one optical member receiving light incident through the at least two lenses, refracting or reflecting the light at least twice, and then guiding or emitting the light to the image sensor. In one embodiment, the lens assembly satisfies the following [Conditional Expression 5] and [Conditional Expression 6]. [Conditional Expression 5] 1.2 = <w / img-X = <2.5 [Conditional Expression 6] 15 = <Ang-min = <40 Here, "img-X" is the length of the longer side of the horizontal / vertical length of the imaging plane of the image sensor, "w" is the length of the longer side of the horizontal / vertical length of the exit surface facing the image sensor among the surfaces of the optical member closest to the image sensor (hereinafter referred to as the "first optical member") among the at least one optical member, and "Ang-min" is the minimum angle among the angles formed by two adjacent surfaces of the first optical member.

[0009] The above and other aspects, features, and / or advantages of the present invention will become more apparent from the following detailed description in conjunction with the drawings.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] As electronic devices become smaller and lighter, it becomes more convenient to carry them. In an environment where displays are enlarged so that even portable electronic devices can enjoy larger screens, by reducing the thickness, the electronic devices can be miniaturized and lightened. In the narrow space of a miniaturized electronic device, it may become difficult to mount a lens assembly having good optical performance. For example, although it becomes easier to ensure good optical performance of a lens assembly as the number and size of lenses increase, in a miniaturized electronic device, the degree of freedom in the design of the arrangement of lenses and image sensors decreases.

[0012] One embodiment of the present invention addresses the above problems and / or drawbacks, provides at least the advantages described below, and provides a lens assembly with improved design freedom and / or an electronic device including the same.

[0013] One embodiment of the present invention can provide a lens assembly that can be easily arranged in a narrow space and / or an electronic device including the same.

[0014] The technical problems to be solved by the present invention are not limited to the above-described technical problems, and other technical problems not mentioned can also be clearly understood by those skilled in the art from the following disclosure.

[0015] The following description with reference to the drawings is provided to assist in a comprehensive understanding of various implementations of the present invention defined by the claims and their equivalents. The specific embodiments disclosed in the following description include various specific details for the purpose of assistance, but may be regarded as one of various exemplary embodiments. Therefore, it will be apparent to those skilled in the art that various changes and modifications to the various implementations described herein can be made without departing from the scope and technical concept of the present invention. Also, for the sake of clarity and conciseness, descriptions of well-known functions and configurations may be omitted.

[0016] The terms and words used in the following description are not limited to their bibliographical meanings and are used to clearly and consistently describe various embodiments of the present invention. Therefore, it will be apparent to those skilled in the art that the following description of the various embodiments of the present invention is provided for the purpose of explanation only and is not intended to limit the present invention.

[0017] Unless the context clearly indicates otherwise, it should be understood that the singular forms "a", "an", and "the" also include plural meanings. Thus, for example, "the surface of a component" may mean including one or more of the surfaces of the component. Throughout the drawings, like reference numerals are assigned to like components, configurations, and / or structures.

[0018] FIG. 1 is a block diagram showing an electronic device 101 within a network environment 100 according to an embodiment of the present invention. Referring to FIG. 1, the electronic device 101 in the network environment 100 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or communicates with at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 communicates with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module 196, or an antenna module 197. In an embodiment, at least one of these components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added. In an embodiment, some of these components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) are integrated into one component (e.g., the display module 160).

[0019] Processor 120 executes software (e.g., program 140), for example, to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected to the processor 120 and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. According to one embodiment, processor 120 includes main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes main processor 121 and auxiliary processor 123, auxiliary processor 123 may use less power than main processor 121 or may be configured to specialize in a specified function. Auxiliary processor 123 may be implemented separately from or as part of main processor 121.

[0020] The auxiliary processor 123 controls at least a part of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) instead of the main processor 121, for example, while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of other functionally related components (e.g., the camera module 180 or the communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., a neural network processing device) can include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model is generated through machine learning. Such learning may be performed, for example, on the electronic device 101 itself on which the artificial intelligence model is executed, or may be performed via a separate server (e.g., the server 108). The learning algorithm includes, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the above examples. The artificial intelligence model can include a plurality of artificial neural network layers. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-networks, or one of combinations of two or more of the above, but is not limited to the above examples.The artificial intelligence model may include a software structure in addition to or alternatively to a hardware structure.

[0021] Memory 130 stores various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101. The data may include, for example, software (e.g., program 140), and input data or output data for related instructions. Memory 130 includes volatile memory 132 or non-volatile memory 134.

[0022] Program 140 is stored in memory 130 as software and includes, for example, operating system 142, middleware 144, or application 146.

[0023] Input module 150 receives instructions or data used by a component (e.g., processor 120) of electronic device 101 from outside the electronic device 101 (e.g., a user). Input module 150 includes, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0024] Acoustic output module 155 outputs an acoustic signal to the outside of electronic device 101. Acoustic output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording playback. The receiver is used for receiving incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

[0025] The display module 160 visually provides information to the outside (e.g., the user) of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a control circuit for controlling a projector and a corresponding device. According to one embodiment, the display module 160 may include a touch sensor set to sense a touch, or a pressure sensor set to measure the intensity of the force generated by the touch.

[0026] The audio module 170 converts sound into an electrical signal or, conversely, converts an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound via the input module 150, or outputs sound via the acoustic output module 155, or an external electronic device (e.g., the electronic device 102) directly or wirelessly connected to the electronic device 101 (e.g., a speaker or headphones).

[0027] The sensor module 176 senses the operating state of the electronic device 101 (e.g., power or temperature), or the external environmental state (e.g., the user state), and generates an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] The interface 177 supports one or more specified protocols used for the electronic device 101 to be directly or wirelessly connected to an external electronic device (e.g., the electronic device 102). According to one embodiment, the interface 177 includes, for example, an HDMI (registered trademark) (high definition multimedia interface), a USB (universal serial bus) interface, an SD (registered trademark) card interface, or an audio interface.

[0029] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., the electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The tactile module 179 converts an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus so that the user can recognize it through the sense of touch or kinesthesia. According to one embodiment, the tactile module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0031] The camera module 180 captures still images and moving images. According to one embodiment, the camera module 180 includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is implemented, for example, as at least a part of a PMIC (power management integrated circuit).

[0033] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module 190 supports the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and the execution of communication via the established communication channel. The communication module 190 is operable independently from the processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module), or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). Among these communication modules, the corresponding communication module communicates with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth (registered trademark), WiFi (registered trademark) (Wireless Fidelity) Direct, or IrDA (infrared data association)), or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a WAN)). Some such types of communication modules may be integrated into one component (e.g., a single chip), or implemented as a plurality of separate components (e.g., a plurality of chips) from each other. The wireless communication module 192 uses the subscriber information (e.g., an international mobile subscriber identifier (IMSI)) stored in the subscriber identification module 196 to identify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199.

[0035] The wireless communication module 192 supports the 5G network after the 4G network and next-generation communication technologies, such as NR connection technology (new radio access technology). The NR connection technology supports high-speed transmission of large-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports, for example, a high-frequency band (e.g., mmWave band) to achieve a high data rate. The wireless communication module 192 supports various technologies for ensuring performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), FD-MIMO (full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 supports various requirements defined in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., for downlink (DL) and uplink (UL), 0.5 ms or less respectively, or a round trip of 1 ms or less) for realizing URLLC.

[0036] The antenna module 197 transmits signals or power to the outside (e.g., an external electronic device) and receives them from the outside. According to one embodiment, the antenna module includes an antenna including a radiator composed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 includes a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by, for example, the communication module 190. Signals or power are transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to one embodiment, other components other than the radiator (e.g., an RFIC (radio frequency integrated circuit)) may be further formed as part of the antenna module 197.

[0037] According to one embodiment, the antenna module 197 forms a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to the first surface (e.g., the bottom surface) of the printed circuit board and supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to the second surface (e.g., the top surface or the side surface) of the printed circuit board and transmitting and receiving signals in the specified high-frequency band.

[0038] At least a part of the above components are connected to each other via an inter-peripheral device communication method (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0039] According to one embodiment, instructions or data are transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic devices (102 or 104) is a device of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations executed by the electronic device 101 are executed by one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device 101 needs to execute some function or service automatically or in response to a request from a user or another device, instead of or in addition to executing the function or service by itself, the electronic device 101 requests one or more external electronic devices to execute at least a part of the function or service. One or more external electronic devices that receive the request execute at least a part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 further processes the above result or provides it as at least a part of the response to the above request without processing. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology is used. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 includes IoT (Internet of things) devices. The server 108 is an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 is applied to intelligent services (for example, smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0040] The electronic devices according to various embodiments disclosed in this specification are devices in various forms. The electronic device is, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a household appliance, or includes such a configuration. The electronic device according to the embodiments of this specification is not limited to the above-described devices.

[0041] Various embodiments of the present invention and the terms used therein are not intended to limit the technical features described in this specification to specific embodiments, but are to be understood to include various modifications, equivalents, or alternatives of those embodiments. Regarding the description of the drawings, similar or related components may be assigned the same reference numerals. The singular form of a noun corresponding to an item includes one or more of the above items unless clearly indicated otherwise in the relevant context. In this specification, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" includes any one of the items listed together in the corresponding phrase of that phrase, or all possible combinations thereof. Terms such as "first", "second", or "the first" or "the second" are used merely to distinguish the component from other corresponding components and do not limit the component in other aspects (e.g., importance or order). When a certain (e.g., first) component is referred to as "functionally" or "communicatively" combined with or without such terms with another (e.g., second) component as "coupled" or "connected", some of the above components may be directly (e.g., wired), wirelessly, or connected via a third component to the other component.

[0042] As used in various embodiments of this specification, the term "module" includes units implemented in hardware, software, or firmware, or combinations thereof, and is used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits. A module is an integrated component, or the smallest unit or a part of a component that executes one or more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0043] Various embodiments of this specification can be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory or an external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of a machine (e.g., an electronic device) calls and executes at least one of the one or more instructions stored in the storage medium. Thereby, the machine operates to execute at least one function according to the at least one called instruction. The one or more instructions include code generated by a compiler or code executable by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), and this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where it is stored temporarily.

[0044] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided included in a computer program product. The computer program product may be traded as a commodity between a seller and a purchaser. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) directly via an application store (e.g., the App Store (trademark)) or between two user devices (e.g., smartphones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0045] According to one embodiment, each of the above components (e.g., a module or a program) includes one or more entities, and some of the multiple entities may be separately arranged in different components. According to one embodiment, one or more of the corresponding components or operations among the above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into one component. In this case, the integrated component executes one or more functions of each of the multiple components in the same or similar manner as those executed by the corresponding component among the multiple components before integration. According to one embodiment, the operations executed by a module, a program, or other components may be executed sequentially, in parallel, repeatedly, or empirically, or one or more of the above operations may be executed in a different order or omitted, or one or more other operations may be added.

[0046] In the following detailed description, when the longitudinal direction, width direction, and / or thickness direction of the electronic device are mentioned, the longitudinal direction is defined as the "Y-axis direction", the width direction is defined as the "X-axis direction", and the thickness direction is defined as the "Z-axis direction". In one embodiment, with respect to the direction in which a component is oriented, "negative / positive (- / +)" is used in combination with the orthogonal coordinate system illustrated in the drawings. For example, the front surface of the electronic device or housing is defined as the "surface facing the +Z direction", and the back surface is defined as the "surface facing the -Z direction". In one embodiment, the side surface of the electronic device or housing includes a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the "X-axis direction" includes both the "-X direction" and the "+X direction". This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of the description, and the description of such directions or components does not limit the embodiments of the present invention.

[0047] FIG. 2 is a perspective view showing the front surface of the electronic device 200 according to an embodiment of the present invention. FIG. 3 is a perspective view showing the back surface of the electronic device 200 shown in FIG. 2 according to an embodiment of the present invention.

[0048] Referring to FIGS. 2 and 3, an electronic device 200 according to one embodiment includes a housing 210 including a first surface (or front surface) 210A, a second surface (or back surface) 210B, and side surfaces 210C surrounding a space between the first surface 210A and the second surface 210B. In one embodiment, the housing refers to a structure forming a part of the first surface 210A, the second surface 210B, and the side surfaces 210C in FIG. 2. According to one embodiment, the first surface 210A is formed by a front plate 202 that is at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second surface 210B is formed by a substantially opaque back plate 211. The back plate 211 is formed, for example, by a coating or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surfaces 210C are formed by a side structure (or "side bezel structure") 218 that is coupled to the front plate 202 and the back plate 211 and includes metal and / or polymer. In one embodiment, the back plate 211 and the side structure 218 are integrally formed and include the same material (e.g., a metal material such as aluminum).

[0049] In the illustrated embodiment, the front plate 202 includes, at both long edges of the front plate 202, two first regions 210D that are seamlessly bent and extend from the first surface 210A toward the back plate 211. In the illustrated embodiment (see FIG. 3), the back plate 211 includes, at both long edges, two second regions 210E that are seamlessly bent and extend from the second surface 210B toward the front plate 202. In one embodiment, the front plate 202 (or the back plate 211) may include only one of the first regions 210D (or the second regions 210E). In one embodiment, a part of the first region 210D or the second region 210E may not be included. In the above embodiment, when viewed from the side of the electronic device 200, the side structure 218 has a first thickness (or width) on the side where the first region 210D or the second region 210E is not included, and has a second thickness thinner than the first thickness on the side where the first region 210D or the second region 210E is included.

[0050] According to one embodiment, the electronic device 200 includes at least one of a display 201, audio modules (203, 207, 214), sensor modules (204, 216, 219), camera modules (205, 212, 213), a key input device 217, a light emitting element 206, and connector holes (208, 209). In one embodiment, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the light emitting element 206), and may further include other components.

[0051] The display 201 is visually exposed, for example, through a substantial portion of the front plate 202. In one embodiment, at least a part of the display 201 is visually exposed through the front plate 202 that forms the first surface 210A and the first region 210D of the side surface 210C. In one embodiment, the edge of the display 201 is formed substantially the same as the shape of the adjacent outline of the front plate 202. In one embodiment, in order to increase the area where the display 201 is visually exposed, the gap between the outline of the display 201 and the outline of the front plate 202 is formed to be substantially equal.

[0052] In one embodiment, a recess or an opening is formed in a part of the screen display area of the display 201, and includes at least one of an audio module 214, a sensor module 204, a camera module 205, and a light emitting element 206 that is aligned with the recess or the opening. In one embodiment, at least one of an audio module 214, a sensor module 204, a camera module 205, a fingerprint sensor 216, and a light emitting element 206 is included on the back surface of the screen display area of the display 201. In one embodiment, the display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor that measures the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen. In one embodiment, at least a part of the sensor module (204, 219) and / or at least a part of the key input device 217 are disposed in the first region 210D and / or the second region 210E.

[0053] The audio modules (203, 207, 214) include a microphone hole 203 and speaker holes (207, 214). The microphone hole 203 has a microphone disposed therein for obtaining external sound, and in one embodiment, a plurality of microphones are arranged to sense the direction of sound. The speaker holes (207, 214) include an external speaker hole 207 and a receiver hole 214 for calls. In one embodiment, the speaker holes (207, 214) and the microphone hole 203 are realized in one hole, and a speaker may be included without the speaker holes (207, 214) (for example, a piezo speaker).

[0054] The sensor modules (204, 216, 219) generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state. The sensor modules (204, 216, 219) include, for example, a first sensor module 204 (for example, a proximity sensor) and / or a second sensor module (for example, a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (for example, an HRM sensor) and / or a fourth sensor module 216 (for example, a fingerprint sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed not only on the first surface 210A (for example, the display 201) of the housing 210 but also on the second surface 210B. The electronic device 200 may further include at least one of the sensor modules 176 of FIG. 1, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0055] The camera modules (205, 212, 213) include a first camera device 205 disposed on the first surface 210A of the electronic device 200, and a second camera device 212 and / or a flash 213 disposed on the second surface 210B. The camera devices (205, 212) include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 includes, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor are disposed on one surface of the electronic device 200.

[0056] The key input device 217 is disposed on the side surface 210C of the housing 210. In one embodiment, the electronic device 200 does not include some or all of the key input device 217, and the missing key input device 217 is implemented in another form such as soft keys on the display 201. In one embodiment, the key input device includes a sensor module 216 disposed on the second surface 210B of the housing 210.

[0057] The light emitting element 206 is disposed, for example, on the first surface 210A of the housing 210. The light emitting element 206 provides, for example, the state information of the electronic device 200 in the form of light. In one embodiment, the light emitting element 206 provides, for example, a light source that operates in conjunction with the camera module 205. The light emitting element 206 includes, for example, an LED, an IR LED, and a xenon lamp.

[0058] The connector holes (208, 209) include a first connector hole 208 for accommodating a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) 209 for accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0059] FIG. 4 is an exploded perspective view showing the electronic device 200 shown in FIG. 2 according to an embodiment of the present invention.

[0060] Referring to FIG. 4, the electronic device 300 (e.g., the electronic device 200 in FIG. 2 or FIG. 3) includes a side structure 310 (e.g., the side structure 218 in FIG. 2), a first support member 311 (e.g., a bracket), a front plate 320 (e.g., the front plate 202 in FIG. 2), a display 330 (e.g., the display 201 in FIG. 2), a printed circuit board 340 (e.g., a PCB (printed circuit board), PBA (printed board assembly), FPCB (flexible PCB), or RFPCB (rigid-flexible PCB)), a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a back plate 380 (e.g., the back plate 211 in FIG. 3). In one embodiment, the electronic device 300 may omit at least one of the components (e.g., the first support member 311 or the second support member 360) and may further include other components. At least one of the components of the electronic device 300 is the same as or similar to at least one of the components of the electronic device 200 in FIG. 2 or FIG. 3, and duplicate descriptions are omitted.

[0061] The first support member 311 is disposed inside the electronic device 300 and may be connected to the side structure 310 or may be integrally formed with the side structure 310. The first support member 311 is formed of, for example, a metal material and / or a non-metal (e.g., a polymer) material. The first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface. A processor, a memory, and / or an interface are attached to the printed circuit board 340. The processor includes, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0062] The memory includes, for example, a volatile memory or a non-volatile memory.

[0063] The interface includes, for example, HDMI (registered trademark) (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, and / or audio interface. The interface electrically or physically connects the electronic device 300 to an external electronic device and includes, for example, a USB connector, an SD card / MMC connector, or an audio connector.

[0064] The battery 350 is a device for supplying power to at least one component of the electronic device 300 and includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery 350 is arranged, for example, substantially in the same plane as the printed circuit board 340. The battery 350 may be integrally arranged inside the electronic device 300 or detachably arranged with the electronic device 300.

[0065] The antenna 370 is arranged between the back plate 380 and the battery 350. The antenna 370 includes, for example, an NFC (near field communication) antenna, a wireless charging antenna, and / or an MST (magnetic secure transmission) antenna. The antenna 370, for example, performs short-range communication with an external device or wirelessly transmits and receives power required for charging. In one embodiment, the antenna structure is formed by a part or a combination of the side structure 310 and / or the first support member 311.

[0066] In the following detailed description, with reference to the electronic devices (101, 102, 104, 200, 300) of the prior embodiments, for configurations that can be easily understood by the prior embodiments, the reference numerals in the drawings are given the same or omitted, and the detailed description thereof may also be omitted.

[0067] FIG. 5 is a plan view showing the back of an electronic device 400 (e.g., the electronic devices (101, 102, 104, 200, 300) of FIGS. 1 to 4) according to an embodiment of the present invention. FIG. 6 is a cross-sectional view of a part of the electronic device 400 according to an embodiment of the present invention, taken along line A-A' of FIG. 5. FIG. 7 is a configuration diagram illustrating the optical path of a lens assembly 500 in the electronic device 400 according to an embodiment of the present invention.

[0068] Referring to FIGS. 5 and 6, an electronic device 400 according to an embodiment of the present invention includes a camera window 385 disposed on one surface (e.g., the second surface 210B of FIG. 3). In one embodiment, the camera window 385 is part of a back plate 380. In one embodiment, the camera window 385 is coupled to the back plate 380 via a decorative member 389, and when viewed from the outside, the decorative member 389 is exposed so as to surround the camera window 385. According to one embodiment, the camera window 385 includes a plurality of transparent regions 387, and the electronic device 400 receives external light or emits light to the outside through at least one of the transparent regions 387. For example, the electronic device 400 includes at least one lens assembly 500 (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3) disposed corresponding to at least a part of the transparent regions 387, and at least one light source (e.g., an infrared light source) disposed corresponding to another part of the transparent regions 387. In one embodiment, the lens assembly 500 or the light source receives external light or emits light to the outside of the electronic device 400 through any of the transparent regions 387. In one embodiment, the electronic device 400 or the lens assembly 500 further includes a camera support member 381. The camera support member 381 disposes or fixes at least one of the lens assembly 500 or another lens assembly adjacent thereto (e.g., a wide-angle camera, an ultra-wide-angle camera, or a macro camera) inside the back plate 380 or the camera window 385. In one embodiment, the camera support member 381 is substantially part of the first support member 311 or the second support member 360 of FIG. 4.

[0069] According to one embodiment, the electronic device 400 includes at least one of a lens assembly 500 or a wide-angle camera, an ultra-wide-angle camera, a macro camera, a telephoto camera, or an infrared photodiode as a light-receiving element, and includes a flash (e.g., flash 213 in FIG. 3) or an infrared laser diode as a light source or a light-emitting element. In one embodiment, the electronic device 400 uses an infrared laser diode and an infrared photodiode to emit an infrared laser toward a subject and receive the infrared laser reflected by the subject, thereby detecting the distance or depth to the subject. In one embodiment, the electronic device 400 combines one or more of the cameras to photograph the subject and, if necessary, uses a flash to provide illumination toward the subject.

[0070] According to one embodiment, among cameras, a wide-angle camera, an ultra-wide-angle camera, or a macro camera has a shorter length in the optical axis direction of the lens compared to a telephoto camera (for example, the lens assembly 500). For example, a telephoto camera with a relatively long focal length (for example, the lens assembly 500) has a longer overall lens length of the lenses (423a, 423b, 423c) than other cameras. The "overall lens length" is the distance from the object side surface of the first lens on the object side to the imaging surface of the image sensor 411. Similar to the embodiment described later (for example, the lens assembly 600 in FIG. 8), when other optical members (for example, a mirror or a prism) are arranged between the lens and the image sensor, the "overall lens length" is the distance from the object side surface of the first lens on the object side to the sensor side surface of the first lens on the image sensor side. In one embodiment, even if a wide-angle camera, an ultra-wide-angle camera, or a macro camera arranges the lens along the thickness direction of the electronic device 400 (for example, the thickness measured in the Z-axis direction in FIG. 4 or FIG. 6), the influence on the thickness of the electronic device 400 is substantially small. For example, the wide-angle camera, the ultra-wide-angle camera, or the macro camera is arranged in the electronic device 400 in a state where the direction of light incident on the electronic device 400 from the outside and the optical axis direction of the lens are substantially the same. In one embodiment, compared to a wide-angle camera, an ultra-wide-angle camera, or a macro camera, the lens assembly 500 (for example, a telephoto camera) has a small angle of view but is useful for photographing a subject at a farther distance and may include more lenses (421a, 421b, 423a, 423b, 423c). For example, when the lenses (423a, 423b, 423c) of the lens assembly 500 are arranged in the thickness direction of the electronic device 400 (for example, the Z-axis direction), the thickness of the electronic device 400 increases, or most of the lens assembly 500 protrudes outside the electronic device 400. In one embodiment of the present invention, the lens assembly 500 includes at least one refracting member (413, 415) that reflects or refracts the incident light IL in another direction. When realizing the telephoto function, the lenses (423a, 423b, 423c) are arranged to be movable forward and backward in the incident direction of light and the traveling direction of the reflected or refracted light, thereby suppressing or reducing the increase in the thickness of the electronic device 400.

[0071] Referring to FIGS. 6 and 7, a folded camera (e.g., lens assembly 500) includes a first refractive member 413, a second refractive member 415, an image sensor 411, and / or at least one lens system (e.g., a second lens group 423 including a second lens (423a, 423b, 423c) or a dummy member 423d). A "folded camera" is useful for expanding the adjustment range of the focal length. For example, in a folded camera, by arranging reflective members such as prisms or mirrors, the design or arrangement of the direction in which the lens is arranged can be made free regardless of the direction in which external light enters. As the degree of freedom in the design with respect to the arrangement direction of the lens in the folded camera improves, a miniaturized telephoto camera can be realized and can be mounted on an electronic device in combination with a wide-angle camera. In one embodiment, at least one optical member guides or focuses the light RL1 reflected or refracted by the first refractive member 413 to the second refractive member 415 and blocks the light RL1 reflected or refracted by the first refractive member 413 from directly entering the image sensor 411.

[0072] According to one embodiment, the first refractive member 413 includes a reflective member including, for example, a prism, a mirror, or a mirror that reflects light. For example, the first refractive member 413 is formed from a prism including at least one mirror. For example, the first refractive member 413 is formed from a prism having at least one surface including a mirror. In one embodiment, the first refractive member 413 reflects or refracts the incident light IL from the first direction D1 to a second direction D2 that intersects the first direction D1. The first direction D1 means, for example, the direction in which light IL enters the electronic device 400 or the lens assembly 500 from the outside through any of the transparent regions 387 in FIG. 5 when photographing a subject. In one embodiment, the first direction D1 means the photographing direction, the subject direction, the pointing direction of the lens assembly 500, or a direction parallel thereto. In one embodiment, the first direction D1 is parallel to the thickness direction or the Z-axis direction of the electronic device 400.

[0073] According to one embodiment, the second refracting member 415 includes, for example, a prism, a mirror, or a reflecting member including a mirror that reflects light. For example, the second refracting member 415 is formed from a prism including at least one mirror. For example, the second refracting member 415 is formed from a prism in which at least one surface includes a mirror. In one embodiment, the second refracting member 415 reflects or refracts the light RL1 incident along the second direction D2 by the first refracting member 413, and reflects or refracts it in a third direction D3 intersecting the second direction D2. In one embodiment, the third direction D3 is substantially perpendicular to the second direction D2. For example, the third direction D3 means a direction parallel to the Z-axis direction. However, one embodiment of the present invention is not limited to this, and depending on the arrangement and specifications of the lens assembly 500 or the second refracting member 415 within the electronic device 400, the third direction D3 may be a direction inclined with respect to the second direction D2 or the X-Y plane. In one embodiment, the third direction D3 is substantially parallel to the first direction D1.

[0074] According to one embodiment, the image sensor 411 is configured to detect the light RL2 incident along the third direction D3, which is reflected or refracted by the second refracting member 415. For example, the light IL incident from the outside is detected by the image sensor 411 via the first refracting member 413 and the second refracting member 415, and the electronic device 400 or the lens assembly 500 acquires a subject image based on the signal or information detected via the image sensor 411. In one embodiment, the image sensor 411 is arranged substantially parallel to the X-Y plane. For example, when the lens assembly 500 has a shake correction function of a structure that shifts the image sensor 411, the image sensor 411 moves horizontally in a plane perpendicular to the first direction D1 or the third direction D3.

[0075] According to an embodiment, when performing the shake correction operation, the image sensor 411 shifts in the longitudinal direction (e.g., Y-axis direction) or the width direction (e.g., X-axis direction) of the electronic device 400. For example, the image sensor 411 is arranged in a plane perpendicular to the first direction D1 or the third direction D3, so that in an electronic device with a small thickness (e.g., a thickness within about 10 mm), it is easy to enlarge the size of the image sensor 411 and it is also easy to secure space for the shake correction operation. In one embodiment, when the lens assembly 500 is used as a telephoto camera, by equipping it with a shake correction function, the quality of the captured image can be further improved. In one embodiment, when the image sensor 411 is enlarged, the performance of the lens assembly 500 can be further enhanced.

[0076] According to an embodiment, the lens assembly 500 further includes a lens system (e.g., a first lens group 421 including at least one first lens (421a, 421b)) that guides or focuses the incident light IL from the first direction D1 to the first refracting member 413. In one embodiment, the first lens group 421 or the first lens (e.g., the first lens 421a) disposed on the object side within the lens assembly 500 has a positive refractive power. For example, by configuring the first lens 421a to focus or align the light IL incident from the outside to the first refracting member 413, the optical system from the first lens 421a to the image sensor 411 can be miniaturized. According to the embodiment, the first lens group 421 further includes an additional first lens 421b for focusing or aligning the light incident from the outside.

[0077] According to an embodiment, the second lens group 423 includes a dummy member 423d and a light-shielding member 425. The dummy member 423d is disposed, for example, inside the lens assembly 500 or the electronic device 400, has a cylindrical shape extending along the second direction D2, and transmits the light RL1 traveling along the second direction D2. In one embodiment, the dummy member 423d is one of the lenses having a positive or negative refractive power. In one embodiment, the dummy member 423d can be any one of the second lenses (423a, 423b, 423c) or a component integrally formed with the second refractive member 415.

[0078] According to an embodiment, the light-shielding member 425 is formed or disposed on at least a part of the outer peripheral surface of the dummy member 423d, and absorbs, scatters, or reflects light. The light-shielding member 425 is formed, for example, by performing a corrosion treatment, a black lacquer treatment, and / or printing or vapor-depositing a reflective layer on at least a part of the outer peripheral surface of the dummy member 423d. In one embodiment, a part of the light reflected or refracted by the first refractive member 413 is absorbed, scattered, or reflected by the light-shielding member 425. In one embodiment, the light-shielding member 425 substantially blocks the light reflected or refracted by the first refractive member 413 from directly entering the image sensor 411 without passing through the second lens group 423 and / or the second refractive member 415. For example, in the lens assembly 500, the light that has sequentially passed through the first direction D1, the second direction D2, and / or the third direction D3 (for example, the light along the paths indicated by "IL", "RL1", and "RL2" in FIG. 7) can enter the image sensor 411, and substantially blocks the light traveling through other paths from entering the image sensor 411.

[0079] According to an embodiment, at least one of the second lenses (423a, 423b, 423c) moves back and forth along an axis substantially the same as the second direction D2 between the first refractive member 413 and the second refractive member 415. For example, the electronic device 400 (e.g., the processor 120 in FIG. 1) or the lens assembly 500 adjusts the focal length or focus by moving at least one second lens (423a, 423b, 423c) back and forth with reference to an axis substantially the same as the second direction D2. A miniaturized electronic device such as a smartphone has a thickness of about 10 mm or so. In this case, the range in which the lens can move back and forth in the thickness direction is limited.

[0080] According to an embodiment, the second direction D2 is substantially parallel to the longitudinal direction (e.g., the Y-axis direction in FIG. 4), the width direction (e.g., the X-axis direction in FIG. 4), and / or the X-Y plane. Compared with a general wide-angle camera that moves back and forth in the Z-axis direction for focus adjustment, the range in which at least one second lens (423a, 423b, 423c) can move back and forth is large. For example, when at least one second lens (423a, 423b, 423c) moves back and forth along an axis substantially the same as the second direction D2, the telephoto performance in the lens assembly 500 is improved, and by securing a space for the back-and-forth movement for focal length adjustment or focus adjustment, the degree of freedom in design can be improved.

[0081] According to one embodiment, the electronic device 400 and / or the lens assembly 500 further includes an infrared cut-off filter 419. In one embodiment, the infrared cut-off filter 419 blocks light in the infrared or near-infrared wavelength band from entering the image sensor 411 and is disposed at an arbitrary position within the optical path between the first lens 421a and the image sensor 411. In one embodiment, the infrared cut-off filter 419 is disposed at a position close to the image sensor 411 (e.g., between the image sensor 411 and the second refractive member 415), thereby suppressing or preventing the infrared cut-off filter 419 from being visually exposed to the outside. In one embodiment, the first refractive member 413, the second refractive member 415, and / or at least one optical member (e.g., the second lens group 423) includes an infrared cut-off coating layer, in which case the infrared cut-off filter 419 may be omitted. In one embodiment, the infrared cut-off coating layer is provided on at least one of the image sensor side surface and the object side surface of the dummy member 423d or on the second refractive member 415. Thereby, the image sensor 411 can detect light that has substantially passed through the infrared cut-off filter 419 (or the infrared cut-off coating layer).

[0082] The refractive members (413, 415) of the present invention are selectively designed according to the structure of the lens assembly 500. For example, in one embodiment, the refractive member (e.g., the second refractive member 415 in FIG. 6) is triangular prism-shaped. In one embodiment, the refractive member (e.g., the second refractive member 415 in FIG. 7) is trapezoidal prism-shaped. The shape of the refractive members (413, 415) is not limited to the structure shown in this embodiment. For example, when the refractive members (413, 415) reflect, refract, or transmit light, the refractive members (413, 415) may have other structures other than triangular prisms or trapezoidal prisms. In one embodiment, the refractive members (413, 415) are arranged in various types. For example, the refractive member (e.g., the second refractive member 415 in FIG. 6) is configured with a prism. For example, the refractive member (e.g., the second refractive member 415 in FIG. 7) is configured with a mirror. For example, the refractive members (413, 415) include a substantially transparent material. For example, the refractive members (413, 415) are made of glass.

[0083] FIG. 8 is a diagram showing a lens assembly 600 according to an embodiment of the present invention. FIG. 9 is a diagram showing a first optical member R1 of the lens assembly 600 of FIG. 8 according to an embodiment of the present invention. FIG. 10 is a diagram illustrating an imaging surface img of the image sensor S and an exit surface F2 of the first optical member R1 in the lens assembly 600 of FIG. 8 according to an embodiment of the present invention.

[0084] Referring to FIGS. 8 - 10, the lens assembly 600 (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 - 3 and / or the lens assembly 500 of FIG. 6) includes at least two lenses (L1, L2, L3, L4, L5), an image sensor S, and at least one optical member R1 (hereinafter referred to as the "first optical member R1") disposed between the image sensor S and at least two lenses (hereinafter referred to as lenses (L1, L2, L3, L4, L5)). According to one embodiment, the lens assembly 600 further includes a second optical member R2 (e.g., the first refracting member 413 of FIG. 6 or FIG. 7) aligned with the first optical member R1 (e.g., the second refracting member 415 of FIG. 6 or FIG. 7) with the lenses (L1, L2, L3, L4, L5) therebetween. The first optical member R1 receives light focused or guided by the lenses (L1, L2, L3, L4, L5) and reflects, refracts, or guides the light in the direction of the image sensor S. The second optical member R2 receives light incident from the outside and guides the light in the direction in which the lenses (L1, L2, L3, L4, L5) are aligned (e.g., in the direction of the first optical axis O1) by reflecting or refracting the light. For example, when the second optical member R2 is not included, external light enters the lens assembly 600 from the ID1 direction, and when the second optical member R2 is included, external light enters the lens assembly 600 from the ID2 direction different from the ID1 direction.

[0085] According to one embodiment, the lens assembly 600 further includes an infrared blocking layer (or infrared blocking coating layer) IFL. For example, the infrared blocking layer IFL is disposed on either the incident surface F1 or the exit surface F2 of the first optical member R1. In one embodiment, the infrared blocking layer IFL is provided on either the surface of the first optical member R1 or the surface of any of the lenses (L1, L2, L3, L4, L5). According to one embodiment, the lens assembly 600 further includes an infrared blocking filter independent of the first optical member R1 and / or the lenses (L1, L2, L3, L4, L5), and in this case, the infrared blocking layer IFL can be omitted.

[0086] According to one embodiment, at least two (e.g., five) lenses (L1, L2, L3, L4, L5) are sequentially arranged along the direction of the first optical axis O1. In one embodiment, the first optical axis O1 is arranged substantially parallel to the front surface (e.g., the first surface 210A in FIG. 2) or the back surface (e.g., the second surface 210B in FIG. 3) of the electronic device (e.g., the electronic devices (101, 200, 300, 400) in FIGS. 1 to 6). For example, even if the thickness of the electronic device 400 is reduced, there is a high degree of freedom in the design of the number and arrangement of the lenses (L1, L2, L3, L4, L5). According to one embodiment, the electronic device 400 (e.g., the processor 120 in FIG. 1) and / or the lens assembly 600 move at least one of the lenses (L1, L2, L3, L4, L5) along the direction of the first optical axis O1. For example, by moving at least one of the lenses (L1, L2, L3, L4, L5) along the direction of the first optical axis O1, a focal length adjustment or a focusing operation is performed. In one embodiment, the electronic device 400 (e.g., the processor 120 in FIG. 1) and / or the lens assembly 600 perform an anti-shake operation by moving at least one of the lenses (L1, L2, L3, L4, L5) along a direction substantially perpendicular to the first optical axis O1. "Moving along a direction substantially perpendicular to the first optical axis O1" is understood to mean that, for example, the lenses (L1, L2, L3, L4, L5) move along at least two directions in a plane substantially perpendicular to the first optical axis O1. "At least two directions" means, for example, directions perpendicular to each other.

[0087] According to an embodiment, the image sensor S is configured to receive light that is guided or focused through the lens (L1, L2, L3, L4, L5) and / or the first optical member R1, so that the lens assembly 600 and / or the electronic device 400 including the same can acquire a subject image. In one embodiment, the imaging surface img of the image sensor S is arranged in a direction intersecting the first optical axis O1. For example, the imaging surface img of the image sensor S is arranged to form an acute angle or an obtuse angle with the first optical axis O1. In one embodiment, "the imaging surface img is arranged in a direction intersecting the first optical axis O1" is understood to mean that the imaging surface img is arranged to be inclined with respect to the X-axis, Y-axis, and / or Z-axis in FIGS. 2 to 6. In one embodiment, since the image sensor S can be arranged in various directions with respect to the alignment direction of the lens (L1, L2, L3, L4, L5), the degree of freedom in design can be increased in the manufacture of the lens assembly 600 and / or the electronic device 400 including the same.

[0088] According to an embodiment, the optical members R1, R2 convert the traveling direction of light by reflecting or refracting the incident light. For example, by arranging at least one optical member (for example, the first optical member R1) between the lens (L1, L2, L3, L4, L5) and the image sensor S, the degree of freedom in the design of the arrangement of the lens (L1, L2, L3, L4, L5) and the image sensor S can be increased. In one embodiment, when a plurality of optical members are arranged between the lens (L1, L2, L3, L4, L5) and the image sensor S, the first optical member R1 refers to the optical member arranged closest to the image sensor S.

[0089] According to one embodiment, the first optical member R1 is disposed between the lenses (L1, L2, L3, L4, L5) and the image sensor S, and light is incident through the lenses (L1, L2, L3, L4, L5) in the direction of the first optical axis O1. In one embodiment, the first optical member R1 reflects or refracts the light incident from the direction of the first optical axis O1 through the lenses (L1, L2, L3, L4, L5) at least twice, and emits it along the direction of the second optical axis O2 that intersects the first optical axis O1. The second optical axis O2 is substantially understood as the optical axis of the image sensor S or the imaging surface img. In the illustrated embodiment, for the sake of convenience of explanation, the second optical axis O2 is illustrated, but the embodiments of the present invention are not limited thereto, and can be defined differently according to the embodiments or the structure of the lens assembly 600 actually manufactured.

[0090] According to one embodiment, the first optical member R1 includes a prism. In one embodiment, the first optical member R1 includes a first surface (for example, the incident surface F1) that is aligned opposite to at least two lenses (for example, the lenses (L1, L2, L3, L4, L5)) on the first optical axis O1. The incident surface F1 is substantially perpendicular to the first optical axis O1, for example. However, the embodiments of the present invention are not limited thereto. For example, an additional optical member may be disposed, or the incident surface F1 may be disposed inclined with respect to the first optical axis O1 according to the specifications of the first optical member R1.

[0091] According to one embodiment, the first optical member R1 includes a second surface (e.g., the exit surface F2) facing the image sensor S. The exit surface F2 is connected to the entrance surface F1 in a state inclined at a first angle Ang-p1 with respect to the entrance surface F1, for example. In one embodiment, the exit surface F2 provides a total reflection environment for incident light (e.g., light incident on the entrance surface F1 along the direction of the first optical axis O1). For example, the exit surface F2 is arranged to be inclined at a specified angle with respect to the first optical axis O1, thereby reflecting (or refracting) the incident light. When providing the total reflection environment, the inclination angle of the exit surface F2 with respect to the first optical axis O1 will be described with reference to the "mathematical formula" described later. Therefore, the exit surface F2 functions at least partially as a reflector inside the first optical member R1.

[0092] According to one embodiment, the first optical member R1 includes a reflecting surface F3 connecting the exit surface F2 and the entrance surface F1. The reflecting surface F3 is connected to the exit surface F2 in a state forming a second angle Ang-p2, for example, and is connected to the entrance surface F1 in a state forming a third angle Ang-p3. In one embodiment, when the reflecting surface F3 is arranged substantially parallel to the first optical axis O1, the inclination angle of the exit surface F2 with respect to the first optical axis O1 is defined as the second angle Ang-p2.

[0093] According to one embodiment, the light reflected by the exit surface F2 inside the first optical member R1 is reflected (or refracted) again by the reflection surface F3 and then exits to the outside through the exit surface F2. For example, when the incident angle with respect to the exit surface F2 is smaller than the specified angle, inside the first optical member R1, the exit surface F2 provides a total reflection environment, and when the incident angle is larger than the specified angle, the exit surface F2 transmits the light. Therefore, the light incident on the first optical member R1 is reflected (or refracted) at least twice inside the first optical member R1 and guided to the image sensor S through the exit surface F2. In one embodiment, when the lens assembly 600 has a structure including an infrared cut-off layer IFL, the infrared cut-off layer IFL is disposed on at least a part of the surface of the first optical member R1 (for example, the incident surface F1 or the exit surface F2). The position and size where the infrared cut-off layer IFL is disposed are variously selected in consideration of the optical path passing through the first optical member R1. In one embodiment, the infrared cut-off layer IFL is disposed on at least one of the incident surface F1 and the exit surface F2.

[0094] According to one embodiment, the electronic device 400 (for example, the processor 120 in FIG. 1) and / or the lens assembly 600 performs a shake correction or subject tracking function by rotating or tilting at least one of the optical members R1, R2 (for example, the first optical member R1) with respect to the first optical axis O1. The "tilt operation" is understood to be, for example, an operation in which the first optical member R1 rotates about an arbitrary axis intersecting the first optical axis O1. The central axis of the tilt operation can be variously set according to the structure of the actually manufactured lens assembly 600 or the electronic device 400.

[0095] According to an embodiment, a second optical member R2 (for example, the first refracting member 413 in FIG. 6) is disposed in front of the lenses (L1, L2, L3, L4, L5). For example, the direction in which light enters the electronic device 400 and / or the lens assembly 600 is different from the first optical axis O1. Therefore, when the above-described configuration regarding the lens assembly 600 in FIG. 8 and / or the configuration described below is satisfied, other configurations of the embodiments disclosed herein (for example, the first lens group 421, the first refracting member 413, the dummy member 423d, and / or the light-shielding member 425 in FIG. 6) can be arbitrarily combined to implement additional embodiments.

[0096] According to an embodiment, the above-described and / or hereinafter-described lens assembly (for example, the lens assemblies (600, 700, 800) in FIGS. 8, 11, and / or 13) satisfies the condition of the following [Equation 1].

[0097]

Number

[0098] Here, “img-X” is the length of the long side (hereinafter referred to as “long side”) of the horizontal / vertical length of the imaging surface img of the image sensor S, and “w” is the length of the long side of the horizontal / vertical length of the exit surface F2 facing the image sensor S among the surfaces of the optical member closest to the image sensor S among at least one optical member (for example, the first optical member R1). In one embodiment, the long side of the exit surface F2 indicated by “w” in FIG. 9 is understood as the long side of the region through which the light incident on the image sensor S in the exit surface F2 of FIG. 9 passes. For example, among the exit surface F2, the region indicated by “F2E” in FIG. 10 is the region through which the light incident on the image sensor S passes. In one embodiment, the area or size of the region indicated by “F2E” is smaller than one surface of the first optical member R1 (for example, the exit surface F2 in FIG. 9).

[0099] According to one embodiment, the long side "img-X" of the imaging plane img is arranged substantially parallel to the longitudinal direction (e.g., the Y-axis direction in FIG. 4) or the width direction (e.g., the X-axis direction in FIG. 4 or FIG. 6) of the electronic device. In one embodiment, the long side "w" of the exit surface F2 is arranged corresponding to the long side "img-X" of the imaging plane img. For example, the long side "w" of the exit surface F2 is arranged substantially parallel to the longitudinal direction (e.g., the Y-axis direction in FIG. 4) or the width direction (e.g., the X-axis direction in FIG. 4 or FIG. 6) of the electronic device. In one embodiment, the shorter side (hereinafter referred to as "shorter side") of the imaging plane img in the horizontal / vertical length or the shorter side of the horizontal / vertical length of the exit surface F2 is arranged substantially parallel to the thickness direction (e.g., the Z-axis direction in FIG. 4 or FIG. 6) of the electronic device. For example, when a lens assembly is arranged inside the miniaturized electronic device, an increase in the thickness of the electronic device due to the size of the image sensor S or the first optical member R1 is suppressed. According to one embodiment, the long sides of the imaging plane img and the exit surface F2 are substantially parallel to the XY plane of the electronic device, and the short sides of the imaging plane img and the exit surface F2 are arranged inclined with respect to the XY plane of the electronic device. For example, even when the short sides of the imaging plane img and the exit surface F2 are longer than the thickness of the electronic device, it is easy to arrange the image sensor S or the first optical member R1 inside the electronic device. This is possible by improving the design freedom of the path through which light is refracted and / or reflected using the first optical member R1.

[0100] According to one embodiment, the length and width of the electronic device are considerably larger compared to the long sides of the imaging plane img and the exit surface F2. For example, the long sides of the imaging plane img and the exit surface F2 are fabricated to be about several millimeters, and by setting the length and width of the electronic device to be about 50 mm or more, the size of the image sensor S or the first optical member R1 can be easily enlarged. In one embodiment, when the long sides of the imaging plane img and the exit surface F2 are parallel to the XY plane of the electronic device and the short sides of the imaging plane img and the exit surface F2 are arranged inclined with respect to the XY plane of the electronic device, the constraints due to the thickness of the electronic device are relaxed, so the length of the short sides of the imaging plane img and the exit surface F2 can be easily enlarged.

[0101] According to one embodiment, when the value according to [Equation 1] is less than about 1.2, stray light may increase from the acquired image. "Stray light" is understood as light that travels through a path other than the designed path and is incident. For example, as the stray light increases, the quality of the acquired image deteriorates. This stray light is generated by unintended reflection or refraction inside the lens assembly 600. In one embodiment, when the value according to [Equation 1] is greater than about 2.5, the overall length of the lens becomes small, and it becomes difficult to realize a lens assembly 600 having good optical performance. For example, by satisfying the conditions of [Equation 1], the lens assembly 600 can have an appropriate overall lens length and good optical performance while suppressing stray light.

[0102] In one embodiment, the lens assembly 600 further includes an anti-reflection coating layer disposed on at least one of the incident surface F1 or the exit surface F2 of the first optical member R1. For example, reflection or refraction that occurs when light passes through the incident surface F1 or the exit surface F2 can be suppressed. In one embodiment, reflection or refraction at the incident surface F1 (or the exit surface F2) causes stray light. For example, by disposing an anti-reflection coating layer on at least one of the incident surface F1 or the exit surface F2, stray light can be suppressed. In one embodiment, when an infrared cut-off layer IFL is disposed on either the incident surface F1 or the exit surface F2, an anti-reflection coating layer is disposed on the other of the incident surface F1 or the exit surface F2.

[0103] According to one embodiment, the lens assembly (for example, the lens assemblies (600, 700, 800) in FIGS. 8, 11, and / or 13) described above and / or hereinafter satisfies the following conditions of [Equation 2].

[0104]

Number

[0105] Here, "Ang-min" is the minimum angle among the angles formed by two adjacent surfaces of the first optical member R1. In the first optical member R1 illustrated in FIG. 9, it is the second angle Ang-p2. According to one embodiment, when the value according to [Equation 2] is smaller than an angle of about 15 degrees, the size of the first optical member R1 increases, making it difficult to implement a miniaturized electronic device (for example, the electronic devices (101, 102, 104, 200, 300, 400) in FIGS. 1 to 6) or the lens assembly 600. In one embodiment, when the value according to [Equation 2] is larger than an angle of about 50 degrees, it becomes difficult to create a total reflection environment for reflecting or refracting the incident light at least twice inside the first optical member R1.

[0106] According to one embodiment, the incident surface F1 and the reflection surface F3 are arranged to form a substantially right angle. In that case, the reflection surface F3 is substantially parallel to the first optical axis O1. In one embodiment, when the incident surface F1 and the reflection surface F3 are arranged to form a substantially right angle, the exit surface F2 is arranged to satisfy the condition presented by [Equation 2] with respect to the reflection surface F3. In one embodiment, when the incident surface F1 and the reflection surface F3 are arranged to form a substantially right angle, the second angle Ang-p2 between the exit surface F2 and the reflection surface F3 is about 25 to 35 degrees. In one embodiment, the first angle Ang-p2 between the incident surface F1 and the exit surface F2 satisfies the condition presented by [Equation 2].

[0107] According to one embodiment, the above-described and / or hereinafter-described lens assemblies (for example, the lens assemblies (600, 700, 800) in FIGS. 8, 11, and / or 13) satisfy the following condition of [Equation 3] regarding the Abbe number, Vd-1, of the first optical member R1.

[0108]

Equation

[0109] According to one embodiment, the first optical member R1 is disposed between the lenses (L1, L2, L3, L4, L5) and the image sensor S (e.g., imaging plane img), and affects curvature or chromatic aberration. In one embodiment, when the Abbe number, Vd - 1, of the first optical member R1 is greater than about 95, it is useful for correcting the aberrations of the lens assembly, but its strength becomes low, and during the assembly process, or during the manufacturing, transportation, and / or storage processes before assembly, the optical member (e.g., the first optical member R1) may be easily deformed or damaged. In one embodiment, when the Abbe number, Vd - 1, of the first optical member R1 is less than about 25, the risk of deformation and damage is reduced, but it becomes difficult to control the aberrations. For example, when the conditions of [Equation 3] regarding the Abbe number, Vd - 1, are satisfied, the first optical member R1 can facilitate the control of the aberrations of the lens assembly 600 without being easily damaged by the external environment.

[0110] According to one embodiment, the lens assembly (e.g., the lens assemblies (600, 700, 800) of FIGS. 8, 11, and / or 13) described above and / or hereinafter satisfies the following condition of [Equation 4] regarding the field of view (FOV).

[0111]

Number

[0112] According to one embodiment, when the angle of view becomes larger than about 35 degrees, the focal length of the lens assembly 600 becomes shorter, and it becomes difficult to arrange the first optical member R1 between the lenses (L1, L2, L3, L4, L5) and the image sensor S (for example, the imaging surface img). In one embodiment, when the angle of view becomes less than about 5 degrees, the focal length of the lens assembly 600 becomes longer and the lens assembly 600 becomes larger. For example, when the angle of view becomes less than about 5 degrees, it becomes difficult to mount the lens assembly 600 on a miniaturized electronic device (for example, the electronic devices (101, 102, 104, 200, 300, 400) in FIGS. 1 to 6). In one embodiment, when the lens assembly 600 satisfies the condition of [Equation 4] regarding the angle of view, good telephoto performance can be provided.

[0113] The following [Table 1] exemplifies the values of [Equations 1 to 4] in the lens assemblies (600, 700, 800) according to the embodiments of FIGS. 8, 11, and / or 13 described above or below. According to one embodiment, by satisfying the conditions of [Equations 1 to 4], the lens assemblies (600, 700, 800) can have good optical performance while being miniaturized. In one embodiment, by satisfying the conditions of [Equations 1 to 4], the lens assemblies (600, 700, 800) are miniaturized, and the degree of freedom in design in the arrangement of the lenses and / or the image sensor can be increased.

[0114]

Table 1

[0115] In the following embodiments, for configurations that can be easily understood from the preceding embodiments, the same reference numerals are given in the drawings or omitted, and the detailed description thereof is also omitted.

[0116] FIG. 11 is a diagram showing a lens assembly 700 according to an embodiment of the present invention. FIG. 12 is a diagram showing the imaging surface img of the image sensor S and the exit surface F2 of the first optical member R1 in the lens assembly 700 of FIG. 11 according to an embodiment of the present invention.

[0117] Referring to FIGS. 11 and 12, the lens assembly 700 (e.g., the lens assembly 500 of FIG. 6) includes at least two (e.g., four) lenses (L1, L2, L3, L4), an image sensor S, and / or a first optical member R1, and the first optical member R1 is disposed between the lenses (L1, L2, L3, L4) and the image sensor S. In one embodiment, the lens assembly 700 satisfies the above specifications or the conditions presented by [Equations 1 to 4]. In one embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) is substantially parallel to the first optical axis O1.

[0118] According to one embodiment, the first optical member R1 includes an incident surface F1, an exit surface F2, and / or a reflective surface (F31, F32, F33, F34). For example, the light incident from the incident surface F1 is reflected or refracted four times inside the first optical member R1. In one embodiment, some of the reflective surfaces (F31, F32, F33, F34) are disposed substantially in the same plane as the incident surface F1 or the exit surface F2. For example, among the reflective surfaces (F31, F32, F33, F34), the first reflective surface F31 and the fourth reflective surface F34 are disposed inclined with respect to the incident surface F1 and / or the exit surface F2, the second reflective surface F32 is disposed in the same plane as the incident surface F1, and the third reflective surface F33 is disposed in the same plane as the exit surface F2. For example, although the incident surface F1, the exit surface F2, and / or the reflective surface (F31, F32, F33, F34) are distinguished, these refer to the regions or points in the first optical member R1 where light is transmitted, reflected, and / or refracted, and at least one of the reflective surfaces (F31, F32, F33, F34) is disposed so as to form the same plane as the incident surface F1 or the exit surface F2.

[0119] According to an embodiment, the light focused by the lenses (L1, L2, L3, L4) is incident (IL) on the incident surface F1 along the direction of the first optical axis O1, and inside the first optical member R1, it is sequentially reflected or refracted by the first reflecting surface F31, the second reflecting surface F32, the third reflecting surface F33, and / or the fourth reflecting surface F34. In one embodiment, the light reflected or refracted by the fourth reflecting surface F34 is emitted (EL) through the emission surface F2 and guided to the image sensor S. In one embodiment, the angle, Ang-min, that satisfies the condition of [Equation 2] is the angle between the incident surface F1 and the first reflecting surface F31, and / or the angle between the emission surface F2 and the fourth reflecting surface F34.

[0120] FIG. 13 is a diagram showing a lens assembly 800 according to an embodiment of the present invention. FIG. 14 is a diagram showing the imaging surface img of the image sensor S and the emission surface F2 of the first optical member R1 in the lens assembly 800 of FIG. 13 according to an embodiment of the present invention.

[0121] Referring to FIGS. 13 and 14, the lens assembly 800 (e.g., the lens assembly 500 of FIG. 6) includes at least two (e.g., four) lenses (L1, L2, L3, L4), an image sensor S, and / or a first optical member R1, and the first optical member R1 is disposed between the lenses (L1, L2, L3, L4) and the image sensor S. In one embodiment, the lens assembly 800 satisfies the above specifications or the conditions presented by [Equations 1 to 4]. In one embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) is substantially parallel to the first optical axis O1.

[0122] According to one embodiment, the first optical member R1 includes an incident surface F1, an exit surface F2, and / or reflecting surfaces F31, F32. For example, the light incident from the incident surface F1 is reflected or refracted at least twice inside the first optical member R1. In one embodiment, the incident surface F1 and the exit surface F2 are arranged substantially in the same plane on the first optical member R1 and are understood as different regions. In one embodiment, the reflecting surfaces (F31, F32) are arranged inclined with respect to the incident surface F1 and / or the exit surface F2 and are inclined substantially in opposite directions.

[0123] According to one embodiment, the light focused by the lenses (L1, L2, L3, L4) is incident (IL) on the incident surface F1 along the direction of the first optical axis O1 and is sequentially reflected or refracted by the first reflecting surface F31 and / or the second reflecting surface F32 inside the first optical member R1. In one embodiment, the light reflected or refracted by the second reflecting surface F32 is emitted (EL) through the exit surface F2 and is guided to the image sensor S. In one embodiment, the angle, Ang-min that satisfies the condition of [Equation 2] is the angle between the incident surface F1 and the first reflecting surface F31 and / or the angle between the exit surface F2 and the second reflecting surface F32.

[0124] A lens assembly according to an embodiment of the present invention (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3, or the lens assemblies (500, 600, 700, 800) of FIGS. 6, 8, 11, and / or 13) includes at least one optical member (e.g., the first optical member R1 of FIGS. 8, 11, and / or 13) disposed between a lens and an image sensor (e.g., the image sensor S of FIGS. 8, 11, and / or 13), thereby enabling free design of the optical path of light reaching the image sensor S. For example, the arrangement direction of the imaging surface (e.g., the imaging surface img of FIG. 8) of the image sensor S with respect to the arrangement of the lenses (e.g., the lenses (L1, L2, L3, L4, L5) of FIG. 8) can be designed in various ways. Thereby, a lens assembly having high optical performance can be easily mounted on a miniaturized and lightweight electronic device (e.g., the electronic devices (101, 102, 104, 200, 300, 400) of FIGS. 1 to 6) such as a smartphone. In one embodiment, by disposing an additional optical member (e.g., the first refracting member 413 of FIG. 6) in front of the lens array, the lenses can be arranged in the longitudinal direction (e.g., the Y-axis direction of FIG. 5) or the width direction (e.g., the X-axis direction of FIG. 5) of the electronic device. For example, in the number and arrangement of the lenses, the design freedom in the miniaturized electronic device can be increased. In one embodiment, when the lenses are arranged in the longitudinal direction or the width direction of the electronic device, a space for the forward and backward movement of the lenses in the optical axis direction (e.g., the first optical axis O1 of FIG. 8) can be easily ensured. For example, by ensuring an environment in which a focus distance adjustment operation or a focus adjustment operation can be realized, the optical performance (e.g., telephoto performance) of the lens assembly can be easily improved. In one embodiment, by controlling the size of the light-emitting surface of the first optical member with respect to the imaging surface img (e.g., the region through which the light incident on the image sensor passes), the generation of stray light in the lens assembly is suppressed, and good optical performance can be realized.

[0125] The effects obtained by the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those of ordinary skill in the technical field to which the present invention pertains from the following description.

[0126] As described above, according to one embodiment of the present invention, a lens assembly (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3, or the lens assemblies (500, 600, 700, 800) of FIGS. 6, 8, 11, and / or 13) includes at least two lenses (e.g., the lenses (L1, L2, L3, L4, L5) of FIG. 8) aligned along the direction of a first optical axis (e.g., the first optical axis O1 of FIG. 8), an image sensor (e.g., the image sensor S of FIG. 8) configured to receive light guided or focused through the at least two lenses, and at least one optical member (e.g., the first optical member R1 of FIG. 8) disposed between the at least two lenses and the image sensor, the at least one optical member receiving the light incident through the at least two lenses, refracting or reflecting the light at least twice, and then guiding or emitting the light to the image sensor. In one embodiment, the lens assembly as described above satisfies the following [Conditional Expression 1] and [Conditional Expression 2].

[0127] [Conditional Expression 1] 1.2 <= w / img-X <= 2.5

[0128] [Conditional Expression 2] 15 <= Ang-min <= 40

[0129] Here, "img-X" is the length of the longer side of the horizontal / vertical length of the imaging surface of the image sensor (see, for example, FIG. 10), "w" is the length of the longer side (see, for example, FIG. 10) of the horizontal / vertical length of the exit surface (e.g., the exit surface F2 of FIG. 9 or the region indicated by "F2E" in FIG. 10) of the surface of the at least one optical member closest to the image sensor (hereinafter referred to as the "first optical member") that faces the image sensor, and "Ang-min" is the minimum angle (e.g., the second angle indicated by "Ang-p2" in FIG. 9) of the angles formed by two adjacent surfaces of the first optical member.

[0130] According to one embodiment, the first optical member satisfies the following [Conditional Expression 3] for the dispersion value Vd-1.

[0131] [Conditional Expression 3] 25 ≤ Vd-1 ≤ 95

[0132] According to one embodiment, the first optical member includes an anti-reflection coating layer formed on at least one of the incident surface (for example, the incident surface F1 in FIG. 9) facing the at least two lenses and the exit surface (for example, the exit surface F2 in FIG. 9, the region indicated by "F2E" in FIG. 10).

[0133] According to one embodiment, the first optical member includes an infrared blocking coating layer formed on at least one of the incident surface facing the at least two lenses and the exit surface.

[0134] According to one embodiment, a lens assembly as described above satisfies the following [Conditional Expression 4] regarding the angle of view and FOV.

[0135] [Conditional Expression 4] 5 ≤ FOV ≤ 35

[0136] According to one embodiment, such a lens assembly is configured to perform a focus adjustment function by moving at least one of the at least two lenses along the first optical axis direction.

[0137] According to one embodiment, such a lens assembly is configured to perform a shake correction function by moving at least one of the at least two lenses along a direction perpendicular to the first optical axis.

[0138] According to one embodiment, such a lens assembly is configured to perform a shake correction function or a subject tracking function by moving or rotating the at least one optical member.

[0139] According to one embodiment, such a lens assembly further includes a second optical member (for example, the second optical member R2 in FIG. 8) aligned with the at least one optical member with the at least two lenses interposed therebetween in the first optical axis direction. In one embodiment, the second optical member receives light incident from a direction different from the first optical axis (for example, the ID2 direction in FIG. 8), refracts or reflects the light in the first optical axis direction, and guides the light to the at least two lenses.

[0140] According to one embodiment, the first optical member further includes an incident surface facing the at least two lenses. In one embodiment, between the incident surface and the exit surface, the first optical member is configured to reflect or refract the light incident on the incident surface at least twice.

[0141] According to one embodiment, the first optical member further includes a reflecting surface (for example, the reflecting surface F3 in FIG. 9) disposed inclined with respect to the exit surface. In one embodiment, inside the first optical member, the exit surface and the reflecting surface reflect or refract the light incident on the incident surface. In one embodiment, the light reflected or refracted at least twice inside the first optical member is guided or emitted to the image sensor through the exit surface.

[0142] According to one embodiment, in such a lens assembly as described above, at least one of the angle formed by the incident surface and the reflecting surface or the angle formed by the reflecting surface and the exit surface satisfies [conditional expression 2].

[0143] According to one embodiment, the first optical member includes a prism.

[0144] According to an embodiment of the present invention, an electronic device (e.g., the electronic devices (101, 102, 104, 200, 300, 400) in FIGS. 1 to 6) includes a lens assembly (e.g., the camera modules (180, 205, 212, 213) in FIGS. 1 to 3, or the lens assemblies (500, 600, 700, 800) in FIGS. 6, 8, 11, and / or 13), a memory (e.g., the memory 130 in FIG. 1) that stores instructions related to image acquisition, and a processor (e.g., the processor 120 in FIG. 1) configured to execute the instructions for acquiring an image by receiving external light using the lens assembly. In one embodiment, the lens assembly includes at least two lenses (e.g., the lenses (L1, L2, L3, L4, L5) in FIG. 8) aligned along the direction of a first optical axis (e.g., the first optical axis O1 in FIG. 8), an image sensor (e.g., the image sensor S in FIG. 8) configured to receive light guided or condensed through the at least two lenses, and at least one optical member (e.g., the first optical member R1 in FIG. 8) disposed between the at least two lenses and the image sensor, the at least one optical member receiving light incident through the at least two lenses, refracting or reflecting the light at least twice, and then guiding or emitting the light to the image sensor. In one embodiment, the lens assembly satisfies the following [Conditional Expression 5] and [Conditional Expression 6].

[0145] [Conditional Expression 5] 1.2 <= w / img-X <= 2.5

[0146] [Conditional Expression 6] 15 <= Ang-min <= 40

[0147] Here, "img-X" is the length of the longer side of the horizontal / vertical length of the imaging plane of the image sensor (see, for example, FIG. 10), "w" is the surface of the optical member closest to the image sensor among the at least one optical member (hereinafter referred to as the "first optical member"), and the longer side of the horizontal / vertical length of the exit surface facing the image sensor (for example, the exit surface F2 in FIG. 9 or the region indicated by "F2E" in FIG. 10) (see, for example, FIG. 10), and "Ang-min" is the minimum angle among the angles formed by two adjacent surfaces of the first optical member (for example, the second angle indicated by "Ang-p2" in FIG. 9).

[0148] According to one embodiment, the processor is configured to execute a focus adjustment function by moving at least one of the at least two lenses along the first optical axis direction.

[0149] According to one embodiment, the processor is configured to execute a shake correction function by moving at least one of the at least two lenses along a direction perpendicular to the first optical axis.

[0150] According to one embodiment, the processor is configured to execute a shake correction function or a subject tracking function by moving or rotating the at least one optical member.

[0151] According to one embodiment, the first optical member satisfies the following [Conditional Expression 7] for the dispersion value Vd-1.

[0152] [Conditional Expression 7] 25 ≤ Vd-1 ≤ 95

[0153] According to one embodiment, the lens assembly satisfies the following [Conditional Expression 8] regarding the angle of view and FOV.

[0154] [Conditional Expression 8] 5 ≤ FOV ≤ 35

[0155] According to one embodiment, the first optical member includes an incident surface (e.g., incident surface F1 in FIG. 9) facing the at least two lenses and an infrared blocking coating layer formed on at least one of the exit surfaces.

[0156] Although the present invention has been illustratively described with respect to one embodiment, it should be understood that one embodiment is for illustration purposes only and does not limit this specification. It will be apparent to those skilled in the art that various changes can be made to its form and detailed configuration without departing from the overall perspective of the present invention, including the scope of the claims and their equivalents.

Explanation of Reference Numerals

[0157] 101, 102, 104, 200, 300, 400 Electronic device 120 Processor 130 Storage device 150 Radio Access Network (RAN) 151 Distributed Unit (DU) 154 Core network 160 User Equipment (UE) 161 Remote Unit (RU) 190 Communication module 201, 330 Display 202, 320 Front plate 210 Housing 211, 380 Rear plate 218, 310 Side structure 385 Camera window 387 Transparent region 411 Image sensor 413 First refractive member 415 Second refractive member 419 Infrared blocking filter 421 First lens group 423 Second lens group 425 Light shielding member 500, 600, 700, 800 lens assemblies

Claims

1. In the lens assembly (500, 600, 700, 800), At least two lenses (L1, L2, L3, L4, L5) aligned along a first optical axis (O1); an image sensor (S) configured to receive light guided or collected through the at least two lenses; and at least one optical element (R1) disposed between the at least two lenses and the image sensor, the at least one optical element being configured to receive light incident through the at least two lenses and guide or emit the light to the image sensor by refracting or reflecting the light at least twice; A lens assembly characterized by satisfying the following [Conditional Expression 1] and [Conditional Expression 2]. [Conditional Expression 1] 1.2=<w / img-X=<2.5 [Conditional Expression 2] 15=<Ang-min=<40 Here, "img-X" is the length of the long side of the horizontal / vertical length of the imaging surface (img) of the image sensor, "w" is the length of the long side of the horizontal / vertical length of the exit surface (F2, F2E) facing the image sensor of the surface of the first optical element that is closest to the image sensor among the at least one optical element, and "Ang-min" is the minimum angle formed by two adjacent surfaces of the first optical element.

2. 2. The lens assembly according to claim 1, wherein the first optical member satisfies the following [Conditional Expression 3] regarding a dispersion value Vd-1. [Conditional Expression 3] 25=<Vd-1=<95

3. 2. The lens assembly of claim 1, wherein the first optical member includes an anti-reflection coating layer formed on at least one of an incident surface (F1) facing the at least two lenses and an exit surface.

4. 2. The lens assembly of claim 1, wherein the first optical member includes an infrared blocking coating layer (IFL) formed on at least one of an incident surface facing the at least two lenses and an exit surface.

5. 2. The lens assembly according to claim 1, wherein the following conditional expression 4 is satisfied regarding the angle of view, FOV (Field of View). [Conditional Expression 4] 5=<FOV=<35

6. 2. The lens assembly of claim 1, configured to perform a focus adjustment function by moving at least one of the at least two lenses along the first optical axis.

7. 2. The lens assembly of claim 1, wherein the lens assembly is configured to perform an image stabilization function by moving at least one of the at least two lenses along a direction perpendicular to the first optical axis.

8. 10. The lens assembly of claim 1, configured to perform at least one of an image stabilization function and an object tracking function by moving or rotating the at least one optical element.

9. a second optical element (R2) aligned with the at least one optical element along the first optical axis and sandwiching the at least two lenses; 2. The lens assembly of claim 1, wherein the second optical element receives light incident from a direction (ID2) different from the first optical axis, refracts or reflects the light in the direction of the first optical axis, and guides the light to the at least two lenses.

10. the first optical member further includes an incident surface facing the at least two lenses; 2. The lens assembly of claim 1, wherein the first optical element is configured to reflect or refract light incident on the entrance surface at least twice between the entrance surface and the exit surface.

11. The first optical member further includes a reflecting surface (F3) disposed at an angle with respect to the exit surface, Within the first optical member, the exit surface and the reflecting surface reflect or refract the light incident on the incident surface, The lens assembly according to claim 10 , wherein the light reflected or refracted at least twice inside the first optical member is guided or emitted to the image sensor through the emission surface.

12. 12. The lens assembly according to claim 11, wherein at least one of an angle between the incident surface and the reflecting surface or an angle between the reflecting surface and the exit surface satisfies [Conditional Expression 2].

13. The lens assembly of claim 1 , wherein the first optical element comprises a prism.

14. In an electronic device (101, 102, 104, 200, 300, 400), A lens assembly (500, 600, 700, 800) according to claim 1; a memory for storing instructions relating to image acquisition; a processor (120) configured to execute the instructions to capture an image by receiving external light using the lens assembly.

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