Organic light-emitting display device

Abstract

The organic light-emitting display device may include a first three-dimensional structure on a substrate, a second three-dimensional structure spaced apart from the first three-dimensional structure with a separation region therebetween along a first direction on the substrate, a first sub-pixel on one side surface of the first three-dimensional structure, a second sub-pixel on one side surface of the second three-dimensional structure, a third sub-pixel on the separation region, a first anode separation structure below the first three-dimensional structure between the first organic light-emitting element and the third organic light-emitting element, and a second anode separation structure below the second three-dimensional structure between the second organic light-emitting element and the third organic light-emitting element. The first sub-pixel may include the first organic light-emitting element, the second sub-pixel may include the second organic light-emitting element, and the third sub-pixel may include the third organic light-emitting element.

Description

Technical Field

[0001] Examples relate to an organic light emitting display device.

Background Art

[0002] In recent years, society has entered a full-fledged information age, and interest in information displays for processing and displaying a large amount of information has been increasing. Along with this, the demand to use portable information media has been increasing, and the display field has been rapidly developing. In response to this, various lightweight and thin flat panel display devices have been attracting attention.

[0003] Among such flat panel display devices, organic light emitting display devices (OLED: Organic Light Emitting Display Device, hereinafter referred to as OLED) have been attracting attention. OLEDs are actively being developed for use as display devices for head mounted displays (HMD) worn close to the human eye. HMDs are worn in the form of helmets or glasses, and virtual reality (VR) or augmented reality (AR) is realized.

[0004] High-resolution small OLEDs are provided for HMDs. In a high-resolution small OLED, organic light emitting elements are arranged on a driving circuit formed using a wafer-based semiconductor process. On the other hand, glasses-type HMDs require a brighter and clearer screen at a very small screen size. For this purpose, it is necessary to maximize the amount of light from the organic light emitting element and its light extraction efficiency. In addition, it is necessary to suppress light leakage between pixels and improve image quality. A technology for improving light extraction efficiency applicable to ultra-high resolution is expected to be widely applied to large screen display industries such as mobile devices and IT devices.

[0005] On the other hand, conventionally, in order to form an organic light emitting layer constituting an organic light emitting element by vapor deposition for each sub-pixel, a fine metal mask (FMM) is used as a vapor deposition pattern mask.

[0006] However, in the manufacture of high-definition (e.g., 500 PPI or higher) display devices or large-area (e.g., 8th generation or higher) display devices, it is quite difficult to form an organic light-emitting layer for each sub-pixel using an FMM. Also, when using an FMM, there is a limit to further increasing the high definition. In addition, when using an FMM, there are problems such as a decrease in yield and an increase in manufacturing cost. Further, when using an FMM, it is difficult to optimize the evaporation, and there is a problem that the product life is reduced.

[0007] On the other hand, with the recent increase in the resolution of displays, the pixel resolution (ppi) has also increased, and the interval between pixels (or sub-pixels) has gradually become narrower. Also, the efficiency of the light-emitting material for organic light-emitting elements has increased, enabling high brightness to be achieved at low current and voltage, and having the advantage of low power consumption. However, as the efficiency of the light-emitting material for organic light-emitting elements increases and light emission becomes possible even with a small amount of current, light emission may also occur due to a small amount of current leaking from one pixel (or sub-pixel) to an adjacent pixel (or sub-pixel). As a result, a phenomenon occurs where adjacent pixels (or sub-pixels) that should not emit light also emit light. Such a leakage of current is referred to as lateral current leakage.

[0008] When leakage light emission due to lateral current leakage occurs, problems such as color mixing and color coordinate variation occur. Also, when leakage light emission occurs in a low-brightness region, it may increase the black brightness.

[0009] There are methods such as reducing the efficiency of the light-emitting material or reducing the resolution of the display element to suppress leakage light emission. However, in a situation where the demand for low-power high-resolution products has recently increased, it is not preferable to solve the problem of leakage light emission due to lateral current leakage as described above by methods such as reducing the efficiency of the light-emitting material or reducing the resolution of the display element. Therefore, there is a need for a technology that can suppress leakage light emission due to lateral current leakage without reducing the resolution in a display device using a high-efficiency light-emitting material. Summary of the Invention

Problems to be Solved by the Invention

[0010] The embodiments are intended to solve the above-described problems and other problems.

[0011] Another object of the embodiments is to provide a high-definition and high-resolution organic light-emitting display device.

[0012] Still another object of the embodiments is to provide an organic light-emitting display device that does not use an FMM.

[0013] Still another object of the embodiments is to provide an organic light-emitting display device capable of preventing lateral current leakage between pixels (or sub-pixels).

[0014] The technical problems of the embodiments are not limited to those described in this item, and include those that can be understood from the description of the invention.

Means for Solving the Problems

[0015] According to one aspect of the embodiments to achieve the above or another object, an organic light-emitting display device includes a first three-dimensional structure on a substrate, a second three-dimensional structure spaced apart from the first three-dimensional structure on the substrate with a separation region along a first direction, a first sub-pixel on one side surface of the first three-dimensional structure, a second sub-pixel on one side surface of the second three-dimensional structure, a third sub-pixel on the separation region, a first anode separation structure under the first three-dimensional structure between the first organic light-emitting element and the third organic light-emitting element, and a second anode separation structure under the second three-dimensional structure between the second organic light-emitting element and the third organic light-emitting element. The first sub-pixel includes a first organic light-emitting element, the second sub-pixel includes a second organic light-emitting element, and the third sub-pixel may include a third organic light-emitting element.

[0016] The organic light-emitting display device may further include a protective layer including a plurality of insulating films on the substrate, a first auxiliary electrode between the protective layer and the first three-dimensional structure, a second auxiliary electrode between the protective layer and the second three-dimensional structure, and a third auxiliary electrode between the protective layer and the third organic light-emitting element.

[0017] The first anode separation structure includes a first undercut structure in which at least one end of the protective film among the plurality of insulating films is formed inside from the side surface of the first three-dimensional structure. The second anode separation structure may include a second undercut structure in which at least one end of the protective film among the plurality of insulating films is formed inside from the side surface of the second three-dimensional structure.

[0018] The first anode separation structure may further include a first isolation structure that isolates between the first sub-pixel and the third sub-pixel by the first undercut structure. The second anode separation structure may further include a second isolation structure that isolates between the second sub-pixel and the third sub-pixel by the second undercut structure.

[0019] The first isolation structure includes a first-1 isolation structure that isolates the first anode electrode of the first organic light-emitting element and the third anode electrode of the third organic light-emitting element between the first sub-pixel and the third sub-pixel. The second isolation structure may include a second-1 isolation structure that isolates the second anode electrode of the second organic light-emitting element and the third anode electrode of the third organic light-emitting element between the second sub-pixel and the third sub-pixel.

[0020] The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element each include a plurality of stacks between an anode electrode and a cathode electrode, and a plurality of charge generation layers between the plurality of stacks. The plurality of stacks of the third organic light-emitting element each include a blue light-emitting layer, and the blue light-emitting layer and the charge generation layer may be commonly formed in the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element, respectively.

[0021] The first isolation structure includes a first-2 isolation structure that isolates the blue light-emitting layer between the first sub-pixel and the third sub-pixel, and the second isolation structure can include a second-2 isolation structure that isolates the blue light-emitting layer between the second sub-pixel and the third sub-pixel.

[0022] The first isolation structure includes a first-3 isolation structure that isolates the charge generation layer between the first sub-pixel and the third sub-pixel, and the second isolation structure can include a second-3 isolation structure that isolates the charge generation layer between the second sub-pixel and the third sub-pixel.

[0023] The first auxiliary electrode and the second auxiliary electrode each include a plurality of metal films. At least one metal film of the plurality of metal films of the first auxiliary electrode includes a first protruding region that protrudes outward from the side surface of the first three-dimensional structure and contacts the first anode electrode. At least one metal film of the plurality of metal films of the second auxiliary electrode can include a second protruding region that protrudes outward from the side surface of the second three-dimensional structure and contacts the second anode electrode.

[0024] The organic light-emitting display device further includes a first insulating layer on the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element, a second insulating layer on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure, and a third insulating layer on the second insulating layer. The third insulating layer can contact the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure.

Advantages of the Invention

[0025] Regarding the effects of the organic light-emitting display device according to the embodiment, it is as follows.

[0026] According to at least one of the embodiments, sub-pixels are arranged on the three-dimensional structure. Thereby, the light-emitting area of each sub-pixel is maintained or expanded while the occupied area is reduced, and a high-definition and high-resolution display is realized.

[0027] According to at least one of the embodiments, the inclination angle of the side surface of the three-dimensional structure is increased or a vertical surface is provided so that the blue common structure does not form on the side surface of the three-dimensional structure or is formed with a very thin thickness. Thereby, the blue organic light-emitting layer does not affect the light emission of each sub-pixel, and defects due to color purity degradation and color unevenness are prevented.

[0028] According to at least one of the embodiments, the anode electrodes of the respective sub-pixels are naturally insulated (or separated) by the anode separation structure. Thereby, a patterning process for separating the anode electrodes for each sub-pixel becomes unnecessary, defects due to the patterning process are prevented, the process becomes simple, and costs are reduced.

[0029] According to at least one of the embodiments, the charge generation layer is insulated (or separated) for each sub-pixel by the anode separation structure. Thereby, lateral current leakage between the respective sub-pixels is prevented.

[0030] The additional scope of applicability of the embodiments will become apparent from the following detailed description. It should be understood that various changes and modifications within the spirit and scope of the embodiments should be clearly understandable to those skilled in the art, so specific embodiments such as the detailed description and preferred embodiments are merely illustrative.

Brief Description of the Drawings

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[0032] The sizes, shapes, numerical values, etc. of the components illustrated in the drawings do not match the actual ones. Also, even if the same component is illustrated with different sizes, shapes, numerical values, etc. between the drawings, this is merely an example on the drawing, and the same component can have the same size, shape, numerical values, etc. between the drawings.

Embodiments for Carrying Out the Invention

[0033] Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the attached drawings. However, the same or similar components regardless of the reference numerals will be given the same reference numbers, and overlapping descriptions thereof will be omitted. The suffixes "module" and "section" for the components used in the following description are given or mixed for the convenience of preparing the specification and do not have distinct meanings or roles by themselves. Also, the attached drawings are for facilitating the understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings. Also, when an element such as a layer, region, or substrate is referred to as being "on" another component, this includes cases where it is directly on the other element or there may be other intermediate elements therebetween.

[0034] FIG. 1 is a plan view schematically illustrating an organic light-emitting display device according to an embodiment.

[0035] The organic light-emitting display device 100 according to the embodiment may be a top-emission type or a bottom-emission type. The top-emission type organic light-emitting display device can emit light in the upward direction to display an image. The bottom-emission type organic light-emitting display device can emit light in the downward direction to display an image.

[0036] Referring to FIG. 1, the organic light-emitting display device 100 according to the embodiment may include a plurality of pixels P arranged on a substrate 101.

[0037] The substrate 101 can be divided into a display area and a non-display area. The plurality of pixels P are arranged on the display area. Driving devices such as a gate driver, a data driver, etc. may be arranged in the non-display area, but are not limited thereto. The plurality of pixels P are arranged in a matrix. The plurality of pixels P are arranged along the first direction X. The plurality of pixels P are arranged along the second direction Y.

[0038] Each pixel P can include a plurality of sub-pixels SPg, SPr, and SPb. The plurality of sub-pixels SPg, SPr, and SPb can include at least three sub-pixels of different colors from each other.

[0039] As a first example, the plurality of sub-pixels SPg, SPr, and SPb are separated in units of pixels P or line units along the second direction Y. For example, the green sub-pixel SPg is separated in units of pixels P or line units along the second direction Y, the red sub-pixel SPr is separated in units of pixels P or line units along the second direction Y, and the blue sub-pixel SPr is separated in units of pixels P or line units along the second direction Y.

[0040] As a second example, the plurality of sub-pixels SPg, SPr, and SPb may be arranged in a stripe pattern along the second direction Y. In the structure of the stripe pattern, the plurality of sub-pixels SPg, SPr, and SPb may be continuously arranged without being separated from each other along the second direction Y. For example, the green sub-pixel SPg is continuously arranged along the second direction Y, the red sub-pixel SPr is continuously arranged along the second direction Y, and the blue sub-pixel SPr is continuously arranged along the second direction Y.

[0041] On one hand, in the first example and the second example, the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb are alternately arranged in column line units along the first direction X. That is, in the embodiment, the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb having different colors from each other are arranged in a side-by-side structure along the first direction X. In the side-by-side structure, it is very important to realize high definition and high resolution without reducing the emission area of each of the plurality of sub-pixels SPg, SPr, and SPb.

[0042] The green sub-pixel SPg can be referred to as the first sub-pixel, the red sub-pixel SPr can be referred to as the second sub-pixel, and the blue sub-pixel SPb can be referred to as the third sub-pixel.

[0043] FIGS. 2 to 4 illustrate an organic light emitting display device on various three-dimensional structures 130-1 and 130-2. That is, FIG. 2 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a first illustration, FIG. 3 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a second illustration, and FIG. 4 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a third illustration. FIGS. 2 to 4 are cross-sectional views taken along the line A-A' in FIG. 1.

[0044] For convenience of explanation, two three-dimensional structures 130-1 and 130-2 are illustrated, but a plurality of three-dimensional structures may be arranged on the substrate 100.

[0045] As illustrated in FIGS. 1 to 4, the organic light emitting display device 100 according to the embodiment may include three-dimensional structures 130-1 and 130-2. The three-dimensional structures 130-1 and 130-2 have at least two side surfaces 130-1a, 130-1b, 130-2a, and 130-2b, and at least two sub-pixels SPg and SPr are arranged on the at least two side surfaces 130-1a, 130-1b, 130-2a, and 130-2b. With such a structure, it is possible to realize high definition and high resolution without reducing the emission area of each sub-pixel SPg and SPr.

[0046] In the drawings, the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b have straight surfaces, but may alternatively have curved surfaces or uneven surfaces. The side surfaces 130-1a, 130-1b, 130-2a, and 130-2b can be referred to as wall surfaces. The side surfaces 130-1a, 130-1b, 130-2a, and 130-2b and the wall surfaces may be used interchangeably.

[0047] The three-dimensional structures 130-1 and 130-2 can have a dot structure. The three-dimensional structures 130-1 and 130-2 are arranged in a matrix along the first direction X and the second direction Y. The three-dimensional structures 130-1 and 130-2 are separated along the first direction X in units of pixels P or column lines. As shown in FIGS. 2 and 4, the three-dimensional structures 130-1 and 130-2 are separated along the second direction Y in units of pixels P or row lines. As shown in FIG. 3, the three-dimensional structures 130-1 and 130-2 are separated along the second direction Y into two or more units of pixels P or row lines.

[0048] Although not shown, the three-dimensional structures 130-1 and 130-2 are continuously arranged in a stripe form along the second direction Y. That is, the three-dimensional structures 130-1 and 130-2 are not separated along the second direction Y and are integrally arranged in a long shape.

[0049] The side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 can have inclined surfaces (FIGS. 2 and 3) or vertical surfaces (FIG. 4). Although not shown, the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 are separated along the second direction Y into two or more units of pixels P or row lines and can also have vertical surfaces.

[0050] A plurality of sub-pixels SPg, SPr, and SPb are sequentially or alternately (interleaving) driven for at least one or more row lines by a scan signal. For example, they are alternately driven in the order of the first row line, the third row line, the second row line, and the fourth row line. Such an alternating drive reduces the leakage current in the second direction Y.

[0051] By separating the three-dimensional structures 130-1 and 130-2 along the second direction Y in units of one pixel P or two or more pixel Ps, the patterning process of the anode electrode is facilitated, and the leakage current between the pixel P or the sub-pixels SPg, SPr, and SPb in the second direction Y is reduced.

[0052] The height and width of the three-dimensional structures 130-1 and 130-2 are determined according to the resolution of the organic light-emitting display device 100, and the manufacturing method of the three-dimensional structures 130-1 and 130-2 is also determined.

[0053] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are provided on the substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be separated with the separation region 105 therebetween. The second three-dimensional structure 130-2 can be separated from the first three-dimensional structure 130-1 with the separation region 105 along the first direction X.

[0054] In such a case, one pixel P is defined by using the first side surface 130-1a of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation region 105. The first side surface 130-1a of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2 can be positioned to face each other with the separation region 105 therebetween. The first side surface 130-1a of the first three-dimensional structure 130-1 can be in contact with one side of the separation region 105, and the first side surface 130-2a of the second three-dimensional structure 130-2 can be in contact with the other side of the separation region 105.

[0055] For example, a green sub-pixel SPg is defined on a first side surface 130-1a of a first three-dimensional structure 130-1, a red sub-pixel SPr is defined on a first side surface 130-2a of a second three-dimensional structure 30-2, and a blue sub-pixel SPb is defined on a separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. One pixel P is constituted by the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. Therefore, by providing a plurality of three-dimensional structures on a substrate 101, a plurality of pixels are defined.

[0056] A green organic light-emitting element 140g is disposed in the green sub-pixel SPg, a red organic light-emitting element 140r is disposed in the red sub-pixel 140r, and a blue organic light-emitting element 140b is disposed in the blue sub-pixel SPb. The green organic light-emitting element 140g can be referred to as a first organic light-emitting element, the red organic light-emitting element 140r can be referred to as a second organic light-emitting element, and the blue organic light-emitting element 140b can be referred to as a third organic light-emitting element.

[0057] Furthermore, another red organic light-emitting element 140’r is disposed in the red sub-pixel SPr on a second side surface 130-1b of the first three-dimensional structure 130-1, and another green organic light-emitting element 140’g is disposed in the green sub-pixel SPg on a second side surface 130-2b of the second three-dimensional structure 130-2.

[0058] Therefore, the red sub-pixel SPr, the green sub-pixel SPg, the blue sub-pixel SPb, the red sub-pixel SPr, and the green sub-pixel SPg are arranged in this order along a first direction X. Another red organic light-emitting element 140’r, a green organic light-emitting element 140g, a blue organic light-emitting element 140b, a red organic light-emitting element 140r, and another green organic light-emitting element 140’g are arranged in this order along the first direction X.

[0059] The average wall angles θa1 and θa2 can be obtained from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2. For example, the average wall angles θa1 and θa2 may be the angles at which the upper and lower ends of the anode electrode are extended to contact the surface of the separation region 105 of the substrate 101 on the upper surfaces 130T of the three-dimensional structures 130-1 and 130-2. When the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 have round surfaces, the average wall angles θa1 and θa2 can be obtained using the linear extrapolation method.

[0060] In one example, depending on the magnitudes of the average wall angles θa1 and θa2, the three-dimensional structures 130-1 and 130-2 can have a rhombic prism (Figs. 2 and 3) or a square prism (Fig. 4) when viewed from the side. That is, the inner diameter and area of the three-dimensional structures 130-1 and 130-2 decrease towards the upper part. In the three-dimensional structures 130-1 and 130-2 having a rhombic prism (Figs. 2 and 3) or a square prism (Fig. 4), the average wall angles θa1 and θa2 may be 60 degrees or more and less than 90 degrees.

[0061] As another example, the average wall angles θa1 and θa2 may be perpendicular to the substrate 101. That is, the average wall angles θa1 and θa2 may be 90 degrees with respect to the substrate 101.

[0062] As yet another example, the three-dimensional structures 130-1 and 130-2 can have an inverse taper shape in which the inner diameter and area increase towards the upper part. In such a case, the average wall angles θa1 and θa2 can have 90 degrees or more with respect to the substrate 101.

[0063] On the one hand, the closer the average wall angle θa is to being perpendicular, i.e., 90 degrees, the more advantageous it is for high resolution. The average wall angle θa may be the angle with respect to the ground or the substrate 101. In a blue common structure, the blue organic light-emitting layer 142B may be commonly arranged for the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The closer the average wall angle θa is to being perpendicular, i.e., 90 degrees, the thickness of the blue organic light-emitting layer 142B commonly arranged for the green sub-pixel SPg and the red sub-pixel SPr is minimized, so defects due to color purity degradation and color unevenness are minimized.

[0064] On the other hand, as shown in FIG. 3, the three-dimensional structures 130-1 and 130-2 are separated into two or more pixel P units or row line units along the second direction Y. In such a case, two or more green organic light-emitting elements 140g are provided on the first side surface 130-1a of the first three-dimensional structure 130-1 along the second direction Y. Two or more red organic light-emitting elements 140r are provided on the first side surface 130-2a of the second three-dimensional structure 130-2 along the second direction Y. Two or more blue organic light-emitting elements 140b are provided on the separation region 105 along the second direction Y.

[0065] Hereinafter, various organic light-emitting display devices will be described with reference to FIGS. 5 to 8. FIGS. 5 to 8 are cross-sectional views taken along the B-B' line of FIG. 1, respectively.

[0066] FIG. 5 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0067] The organic light-emitting display device 100A illustrated in FIG. 5, as the organic light-emitting display device illustrated in FIG. 2 or FIG. 3, the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101.

[0068] Referring to FIG. 5, the organic light-emitting display device 100A according to the first embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, and the like.

[0069] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are disposed on the substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can have a square prism or a rhombic prism (FIGS. 2 to 4). The side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101. In such a case, the average wall surface angle θa may be 60 degrees or more and less than 90 degrees.

[0070] On the other hand, the three-dimensional structures 130-1 and 130-2 can have flat or round upper surfaces 130T. For example, when a photolithography process is involved, a flat one is advantageous for thickness control, and when it is a printing process, it does not necessarily have to be flat. Although not shown, the three-dimensional structures 130-1 and 130-2 can also have vertices instead of the upper surfaces 130T.

[0071] On the other hand, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be separated into one pixel P unit or two or more pixel P units along the second direction Y or can have a stripe form.

[0072] The green sub-pixel SPg is disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, the red sub-pixel SPr is disposed on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue sub-pixel SPb is disposed on the separation region 105. The separation region 105 may be a region on the substrate 101 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0073] The first side surface 130-1a of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2 can be in contact with both sides of the separation region 105.

[0074] The area of the isolation region 105 changes according to the isolation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, the area of the blue sub-pixels SPb arranged on the isolation region 105 is determined by the area of the isolation region 105. As the isolation distance increases, the area of the isolation region 105 increases, and the area of the blue sub-pixels SPb can increase. When the area of the blue sub-pixels SPb increases, the luminance increases but is contrary to the increase in resolution. Therefore, the isolation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 is determined in consideration of the resolution.

[0075] The green organic light-emitting element 140g is arranged in the green sub-pixels SPg, the red organic light-emitting element 140r is arranged in the red sub-pixels SPr, and the blue organic light-emitting element 140b is arranged in the blue sub-pixels SPb.

[0076] The green organic light-emitting element 140g can include a first anode electrode 141g, a green organic light-emitting layer 142G, and a cathode electrode 143. The red organic light-emitting element 140r can include a second anode electrode 141r, a red organic light-emitting layer 142R, and a cathode electrode 143. The blue organic light-emitting element 140b can include a third anode electrode 141b, a blue organic light-emitting layer 142B, and a cathode electrode 143. The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b can include more layers than this.

[0077] The green organic light-emitting layer 142G can be referred to as the first organic light-emitting layer, the red organic light-emitting layer 142R can be referred to as the second organic light-emitting layer, and the blue organic light-emitting layer 142B can be referred to as the third organic light-emitting layer.

[0078] The first anode electrode 141g of the green organic light-emitting element 140g and the green organic light-emitting layer 142G are arranged in the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. The second anode electrode 141r of the red organic light-emitting element 140r and the red organic light-emitting layer 142R are arranged in the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2. The third anode electrode 141b of the blue organic light-emitting element 140b and the blue organic light-emitting layer 142B are arranged in the blue sub-pixel SPb on the isolation region 105.

[0079] The cathode electrode 143 may be commonly arranged for the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The cathode electrode 143 is commonly arranged for the entire region of the substrate 101, for example, all pixels P and all sub-pixels SPg, SPr, SPb.

[0080] In the embodiment, the blue organic light-emitting layer 142B is arranged not only in the blue sub-pixel SPb but also in the green sub-pixel SPg and the red sub-pixel SPr. That is, the blue organic light-emitting layer 142B is commonly arranged for the entire region of the substrate 101, for example, all pixels P and all sub-pixels SPg, SPr, SPb. Such a structure can be referred to as a blue common structure. In such a blue common structure, the blue organic light-emitting layer 142B is arranged on the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2, and the isolation region 105. The blue organic light-emitting layer 142B is arranged between the first anode electrode 141g and the green organic light-emitting layer 142G in the green sub-pixel SPg. The blue organic light-emitting layer 142B is arranged between the second anode electrode 141r and the red organic light-emitting layer 142R in the red sub-pixel SPr.

[0081] According to an embodiment, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb, respectively, without using an FMM. That is, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are formed by using a self-aligned deposition (SAD) method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The SAD method will be described later.

[0082] On the other hand, the organic light-emitting display device 100A according to the first embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, and the like.

[0083] The plurality of driving circuits 103 are disposed on the substrate 101, the protective layer 110 is disposed on the plurality of driving circuits 103, and the plurality of auxiliary electrodes 120g, 120r, 120b are disposed on the protective layer 110. The auxiliary electrode can be referred to as a pixel electrode.

[0084] The substrate 101 can be made of a silicon wafer, glass, plastic, ceramic, or the like. The substrate 101 can be made of a transparent material or an opaque material. The driving circuit 103 can include a plurality of transistors and at least one or more capacitors. One of the plurality of transistors may be a driving transistor.

[0085] The protective layer 110 may be a single layer made of an inorganic film or an organic film. The protective layer 110 may be a multilayer of inorganic films or a combination of a multilayer of inorganic films and an organic film. The protective layer 110 may be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

[0086] For example, the protective layer 110 is composed of a multilayer structure of an organic film and an inorganic film. In such a case, the organic film can include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc. The inorganic film can include a silicon oxide film (SiOx), a silicon nitride film (SiNx), etc.

[0087] The plurality of auxiliary electrodes 120g, 120r, 120b are provided corresponding to the plurality of sub-pixels SPg, SPr, SPb. For example, the first auxiliary electrode 120g is connected to the green sub-pixel SPg, the second auxiliary electrode 120r is connected to the red sub-pixel SPr, and the third auxiliary electrode 120b is connected to the blue sub-pixel SPb. For example, the first auxiliary electrode 120g is connected to the green organic light-emitting element 140g, the second auxiliary electrode 120r is connected to the red organic light-emitting element 140r, and the third auxiliary electrode 120b is connected to the blue organic light-emitting element 140b.

[0088] On the other hand, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b can be connected to the corresponding drive circuits 103 of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b through the through-holes 114 of the protective layer 110, respectively. The plurality of auxiliary electrodes 120g, 120r, 120b are used as pads or terminals for applying power or signals to the plurality of sub-pixels SPg, SPr, SPb or for inspection.

[0089] As described above, the auxiliary electrodes 120g, 120b, and 120r can electrically connect the driving circuit 103 and the anode electrodes 141g, 141r, and 141b of the organic light-emitting elements 140g, 140r, and 140b. For example, the auxiliary electrodes 120g, 120b, and 120r are formed of a single layer such as Ti or Mo in order to improve the characteristics of the contact resistance. For example, on the single layer such as Ti or Mo of the auxiliary electrodes 120g, 120b, and 120r, an oxide film such as ITO or IZO is formed for processability and reliability. For example, the auxiliary electrodes 120g, 120b, and 120r may have a double structure of ITO / (Ti or Mo). For example, the auxiliary electrodes 120g, 120b, and 120r may have a triple structure of (Ti or Mo) / ITO / (Ti or Mo).

[0090] On the other hand, in the blue subpixel SPb, the third auxiliary electrode 120b can replace the third anode electrode 141b. In such a case, the third anode electrode 141b may be omitted in the blue subpixel SPb. That is, it is required that the third auxiliary electrode 120b has a low connection resistance with the drain electrode of the driving transistor of the driving circuit 103, excellent reflection performance, or conforms to the Work Function value (>4.8 eV) of the third anode electrode 141b. In such a case, only the first anode electrode 141g of the green organic light-emitting element 140g and the second anode electrode 141r of the red organic light-emitting element 140r are formed. For example, after the first anode electrode 141g of the green organic light-emitting element 140g, the second anode electrode 141r of the red organic light-emitting element 140r, and the third anode electrode 141b of the blue organic light-emitting element 140b are formed, the third anode electrode 141b may be removed.

[0091] The first three-dimensional structure 130-1 is disposed on the first auxiliary electrode 120g, and the second three-dimensional structure 130-2 is disposed on the second auxiliary electrode 120r. A part of the terminal of the first auxiliary electrode 120g is electrically connected to the first anode electrode 141g disposed on the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. A part of the terminal of the second auxiliary electrode 120r is electrically connected to the second anode electrode 141r disposed on the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0092] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be made of an inorganic film or an organic resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can also be made of a double structure of an organic resin on an inorganic film. The organic resin may be a black resin, but is not limited thereto. When a black resin is used as the organic resin, the black resin absorbs external or internal light, so that image quality can be improved such as contrast characteristics and color unevenness due to light leakage.

[0093] Such a material selection can select a material that is easy for the process depending on the height of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2 due to the resolution and the size of the width of the lower surface of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2.

[0094] On the other hand, the organic light-emitting display device 100A according to the first embodiment can include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, and the like. The first insulating layer 150 is made of an inorganic material, the second insulating layer 160 is made of an organic material, and the third insulating layer 170 can be made of an inorganic material, but is not limited thereto.

[0095] The first insulating layer 150 is disposed on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. That is, the first insulating layer 150 is disposed on the side surfaces 130-1a, 130-1b and the upper surface 130T of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b and the upper surface 130T of the second three-dimensional structure 130-2, and the separation region 105. Since the first insulating layer 150 has a relatively thin thickness, it is formed to bend according to the respective shapes of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0096] The second insulating layer 160 is disposed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 is disposed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 respectively. That is, the second insulating layer 160 can cover the first insulating layer 150 disposed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 respectively. Since a thick thickness is required for the second insulating layer 160, it is formed of an organic material that is easy to form a thick thickness in terms of process. The second insulating layer 160 may be a planarization layer that flattens the upper surface 130T so that the formation of the third insulating layer 170 is easy.

[0097] The third insulating layer 170 is disposed on the second insulating layer 160.

[0098] The first insulating layer 150, the second insulating layer 160, and the third insulating layer 170 can play a role in preventing the penetration of oxygen, moisture, etc. and alleviating impact. Since the first insulating layer 150 and the third insulating layer 170 are made of an inorganic material, the penetration of oxygen or moisture is perfectly blocked.

[0099] At least one or more layers may be added on the third insulating layer 170. For example, a planarization layer, an antireflection layer, a PSA layer, a cover film, etc. may be disposed on the third insulating layer 170.

[0100] The substrate 101 described above may be a silicon substrate on which a plurality of driving circuits 103 are formed using semiconductor processes. Alternatively, a glass substrate or a plastic substrate may be used. In addition to this, an organic light-emitting display device manufactured using various materials, structures, methods, processes, etc. can be obtained.

[0101] According to the embodiment, the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb are respectively disposed on the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2, and the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Thereby, the light-emitting areas of the green subpixel SPg and the red subpixel SPr are maintained or expanded while the occupied area is reduced, and a high-definition and high-resolution display is realized.

[0102] FIG. 6 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0103] The second embodiment is the same as the first embodiment (FIG. 5) except that the third insulating layer 170 is in contact with the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 respectively. In the second embodiment, the same reference numerals are given to the components having the same structure, shape, and / or function as those in the first embodiment, and detailed descriptions thereof are omitted.

[0104] In the organic light-emitting display device illustrated in FIG. 6, as the organic light-emitting display devices illustrated in FIGS. 2 and 3, the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101.

[0105] Referring to FIG. 6, the organic light-emitting display device 100B according to the second embodiment can include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100B according to the second embodiment can include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100B according to the second embodiment can include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0106] The green organic light-emitting element 140g is disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is disposed in the green sub-pixel SPg, the red organic light-emitting element 140r is disposed in the red sub-pixel SPr, and the blue organic light-emitting element 140b is disposed in the blue sub-pixel SPb. One pixel P is constituted by the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb.

[0107] The side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101. For example, the average wall surface angle θa may be 60 degrees or more and less than 90 degrees.

[0108] The third insulating layer 170 can contact the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 can contact the upper surface 130T of the second three-dimensional structure 130-2.

[0109] The second embodiment can also be said to be a modified example of the first embodiment (FIG. 5). That is, according to the first embodiment (FIG. 5), a green organic light-emitting layer 142G, a red organic light-emitting layer 142R, a blue organic light-emitting layer 142B, a cathode electrode 143, a first insulating layer 150, and a second insulating layer 160 are formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Thereafter, the second insulating layer 160, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are removed, and the upper surface 130T of the first three-dimensional structure 130-1 and the upper surfaces 130T of the second three-dimensional structure 130-2 can be exposed. Thereafter, a third insulating layer 170 is formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Thereby, as in the second embodiment, the third insulating layer 170 can be in contact with the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2.

[0110] Although not shown, a charge generation layer CGL common to the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb is formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In such a case, the charge generation layer CGL on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 is removed, and the charge generation layer CGL of the green subpixel SPg and the charge generation layer CGL of the red subpixel SPr are disconnected, thereby preventing the lateral current leakage between the subpixels.

[0111] FIG. 7 is a cross-sectional view illustrating an organic light-emitting display device according to the third embodiment.

[0112] The third embodiment is the same as the first embodiment (FIG. 5) or the second embodiment (FIG. 6), except that the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101. In the third embodiment, the same reference numerals are given to the components having the same structure, shape, and / or function as those in the first embodiment (FIG. 5) or the second embodiment (FIG. 6), and the detailed description thereof is omitted.

[0113] As the organic light-emitting display device illustrated in FIG. 7, the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be perpendicular to the substrate 101, as in the organic light-emitting display device illustrated in FIG. 4.

[0114] Referring to FIG. 7, the organic light-emitting display device 100C according to the third embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100C according to the third embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100C according to the third embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0115] The green organic light-emitting element 140g is disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is disposed in the green subpixel SPg, the red organic light-emitting element 140r is disposed in the red subpixel SPr, and the blue organic light-emitting element 140b is disposed in the blue subpixel SPb. One pixel P is constituted by the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb.

[0116] The side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be perpendicular to the substrate 101. For example, the average wall surface angle θa may be 90 degrees. The green organic light-emitting element 140g is disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. Since the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, when viewed from the front, the occupied areas of the green organic light-emitting element 140g and the red organic light-emitting element 140r are minimized, and a display with ultra-high resolution is realized.

[0117] Since the average wall surface angle θa is 90 degrees, the blue organic light-emitting layer 142B in the blue common structure is not formed or is formed with a very thin thickness on the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 or on the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2. Thereby, the blue organic light-emitting layer 142B that should not affect the light emission of each of the green sub-pixel SPg and the red sub-pixel SPr is not formed or is formed with a minimum thickness, preventing defects due to color purity degradation and color unevenness.

[0118] FIG. 8 is a cross-sectional view illustrating an organic light-emitting display device according to the fourth embodiment.

[0119] The fourth embodiment is the same as the first embodiment (FIG. 5) or the second embodiment (FIG. 6) except that the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101. Also, the fourth embodiment is the same as the third embodiment (FIG. 7) except that the third insulating layer 170 is in contact with the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In the fourth embodiment, the same reference numerals are given to the components having the same structure, shape, and / or function as those in the first to third embodiments (FIGS. 5 to 7), and detailed descriptions thereof are omitted.

[0120] The organic light-emitting display device illustrated in FIG. 8 may be the organic light-emitting display device illustrated in FIG. 4, and the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 may be perpendicular to the substrate 101.

[0121] Referring to FIG. 8, the organic light-emitting display device 100D according to the fourth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100D according to the fourth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100D according to the fourth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0122] The green organic light-emitting element 140g is disposed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is disposed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is disposed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is disposed in the green sub-pixel SPg, the red organic light-emitting element 140r is disposed in the red sub-pixel SPr, and the blue organic light-emitting element 140b is disposed in the blue sub-pixel SPb. One pixel P is constituted by the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb.

[0123] The third insulating layer 170 may be in contact with the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 may be in contact with the upper surface 130T of the second three-dimensional structure 130-2.

[0124] The fourth embodiment can also be said to be a modified example of the third embodiment (FIG. 7). According to the third embodiment (FIG. 7), a green organic light-emitting layer 142G, a red organic light-emitting layer 142R, a blue organic light-emitting layer 142B, a cathode electrode 143, a first insulating layer 150, and a second insulating layer 160 are formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Thereafter, the second insulating layer 160, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are removed, and the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2 can be exposed. Thereafter, a third insulating layer 170 is formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Thereby, like the second embodiment, the third insulating layer 170 can be in contact with the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2.

[0125] Although not shown, a charge generation layer CGL common to the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb is formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In such a case, the charge generation layer CGL on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 is removed, and the charge generation layer CGL of the green subpixel SPg and the charge generation layer CGL of the red subpixel SPr are disconnected, thereby preventing the lateral current leakage between the subpixels.

[0126] On the other hand, the organic light-emitting display device according to the first to fourth embodiments (FIGS. 5 to 8) can include a first anode separation structure 180-1 and a second anode separation structure 180-2. That is, one pixel P is provided with two anode separation structures 180-1 and 18-2.

[0127] The first anode separation structure 180-1 is provided along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 can be located between the green sub-pixel SPg and the blue sub-pixel SPb. The first anode separation structure 180-1 can be located below the first three-dimensional structure 130-1 between the green sub-pixel SPg and the red sub-pixel SPr. The second anode separation structure 180-2 is provided along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 can be located between the red sub-pixel SPr and the blue sub-pixel SPb. The second anode separation structure 180-2 can be located below the second three-dimensional structure 130-2 between the red sub-pixel SPr and the blue sub-pixel SPb.

[0128] For example, during the evaporation process for forming the anode electrode, the first anode electrode 141g of the green organic light-emitting element 140g and the third anode electrode 141b of the blue organic light-emitting element 140b are insulated by the first anode separation structure 180-1. For example, during the evaporation process, the second anode electrode 141r of the red organic light-emitting element 140r and the third anode electrode 141b of the blue organic light-emitting element 140b are insulated by the second anode separation structure 180-2. Therefore, a separate patterning process is not required to separate the first anode electrode 141g and the third anode electrode 141b or to separate the second anode electrode 141r and the third anode electrode 141b, defects caused by the patterning process are prevented, the process is simplified, and costs are reduced.

[0129] For example, a green sub-pixel SPg, a blue sub-pixel SPb, and a red sub-pixel SPr are arranged in this order along the first direction X, and a charge generation layer CGL is formed in common for the green sub-pixel SPg, the blue sub-pixel SPb, and the red sub-pixel SPr. In such a case, a lateral current leakage (LCL) may occur between the green organic light-emitting element 140g on the green sub-pixel SPg, the red organic light-emitting element 140r on the red sub-pixel SPr, and the blue organic light-emitting element 140b on the blue sub-pixel SPb via the charge generation layer CGL. However, according to the embodiment, the charge generation layer CGL formed in common for the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb is interrupted by each of the first anode separation structure 180-1 and the second anode separation structure 180-2. That is, the charge generation layer CGL located between the green sub-pixel SPg and the blue sub-pixel SPb is interrupted by the first anode separation structure 180-1. The charge generation layer CGL located between the red sub-pixel SPr and the blue sub-pixel SPb is interrupted by the second anode separation structure 180-2. Therefore, the lateral current leakage flowing between the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b due to the charge generation layer CGL formed in common for the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b is prevented.

[0130] The first anode separation structure 180-1 and the second anode separation structure 180-2 will be described in detail with reference to FIGS. 15 to 18 later.

[0131] On the other hand, in the embodiment, the anode electrodes 141g, 141r, 141b can be made of a transparent conductive film or a reflective film. The transparent conductive film can be formed with a thickness of 50 nm or less using a transparent conductive material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light by a sputtering method. A metal film may be formed on the transparent conductive film using electroplating.

[0132] According to the embodiment, the thickness of the transparent conductive film of the anode electrodes 141g, 141r, and 141b is formed to be within 50 nm, or the anode electrodes 141g, 141r, and 141b are connected to the auxiliary electrodes 120g, 120b, and 120r and the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2, so that a structure without a step is formed source-wise. Alternatively, the anode separation structures 180-1 and 180-2 are provided. Thereby, even if a bank such as a PDL (Pixel Define Layer) is not formed, a short circuit defect between the anode electrodes 141g, 141r, and 141b and the cathode electrode 143 and a leakage current between pixels P (or sub-pixels) are prevented.

[0133] FIG. 9a is a cross-sectional view illustrating a stacked structure of an organic light-emitting device according to the first embodiment. FIG. 9b is a cross-sectional view illustrating a stacked structure of an organic light-emitting device according to the second embodiment.

[0134] The green organic light-emitting device 140g, the red organic light-emitting device 140r, and the blue organic light-emitting device 140b may be configured in a single stack (FIG. 9a), or may be configured in a tandem structure including two stacks ST1 and ST2 (FIG. 9b). Although not shown, it may be configured with three or more stacks.

[0135] As shown in FIG. 9a, the green organic light-emitting device 140g, the red organic light-emitting device 140r, and the blue organic light-emitting device 140b may each be configured in a single stack including one green organic light-emitting layer G-EML, one red organic light-emitting layer R-EML, and one blue organic light-emitting layer B-EML.

[0136] The green organic light-emitting device 140g may include a green organic light-emitting layer G-EML between the first anode electrode 141g and the cathode electrode. The red organic light-emitting device 140r may include a red organic light-emitting layer R-EML between the second anode electrode 141r and the cathode electrode. The blue organic light-emitting device 140b may include a blue organic light-emitting layer B-EML between the third anode electrode 141b and the cathode electrode.

[0137] The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b can each include a hole injection layer HIL, a hole transport layer HTL, an organic light-emitting layer EML, an electron transport layer ETL, an electron injection layer, etc. Further, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b can each include at least one or more electron blocking layers EBL. A capping layer CPL is formed on the cathode electrode for each of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The hole injection layer HIL, the hole transport layer HTL, the electron transport layer ETL, the electron injection layer, the cathode electrode, and the capping layer CPL are also commonly included in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b.

[0138] The cathode electrode may be formed of a transparent conductive film, a semi-transmissive film, a reflective film, etc. The semi-transmissive film can be formed by making an alloy of magnesium (Mg) and silver (Ag) (Mg:Ag) 20 nm or less. The semi-transmissive film may be composed of a double layer. That is, the semi-transmissive film can include a first layer containing an Mg:Ag alloy and a second layer containing a transparent conductive substance (TCO) such as ITO or IZO on top of the first layer. When the cathode electrode consists only of a transmissive film, the transmissive film may be formed only of a transparent conductive film containing a transparent conductive substance (TCO).

[0139] When a voltage is applied to the first anode electrode 141g and the cathode electrode of the green organic light-emitting element 140g, holes and electrons move to the green organic light-emitting layer G-EML through the hole transport layer HTL and the electron transport layer ETL, and holes and electrons can combine with each other in the green organic light-emitting layer G-EML to emit light. Similarly, the red organic light-emitting element 140r and the blue organic light-emitting element 140b can also emit light by the combination of holes and electrons.

[0140] In the blue common structure, the blue organic light-emitting layer B-EML is commonly included not only in the blue organic light-emitting element 140b but also in the green organic light-emitting element 140g and the red organic light-emitting element 140r.

[0141] As shown in FIG. 9b, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each be composed of two stacks ST1 and ST2 including two organic light-emitting layers. The green organic light-emitting element 140g may be composed of two stacks ST1 and ST2 including two green organic light-emitting layers G-EML1 and G-EML2 between the first anode electrode 141g and the cathode electrode. The red organic light-emitting element 140r may be composed of two stacks ST1 and ST2 including two red organic light-emitting layers R-EML1 and R-EML2 between the second anode electrode 141r and the cathode electrode. The blue organic light-emitting element 140b may be composed of two stacks ST1 and ST2 including two blue organic light-emitting layers B-EML1 and B-EML2 between the third anode electrode 141b and the cathode electrode.

[0142] The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each include a hole injection layer HIL, two hole transport layers HTL1 and HTL2, two electron transport layers ETL1 and ETL2, two electron blocking layers EBL1 and EBL2, and the like. A capping layer CPL is formed on the cathode electrode for each of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The hole injection layer HIL, the hole transport layers HTL1 and HTL2, the electron transport layers ETL1 and ETL2, the electron blocking layers EBL1 and EBL2, and the capping layer CPL are also commonly included in the green organic light-emitting element 140g and the red organic light-emitting element 140r.

[0143] In particular, a charge generation layer is formed between the first stack ST1 and the second stack ST2 by the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. For example, the charge generation layer can include a first charge generation layer formed adjacent to the first stack ST1, that is, an n-type charge generation layer n-CGL, and a second charge generation layer formed between the first charge generation layer and the second stack ST2, that is, a p-type charge generation layer p-CGL. The n-type charge generation layer n-CGL can serve to inject electrons into the first stack ST1, and the p-type charge generation layer p-CGL can serve to inject holes into the second stack ST2. The n-type charge generation layer n-CGL can be composed of an organic layer doped with an alkali metal such as Li, Yb, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generation layer p-CGL may be formed by doping a dopant into the hole transport layer HTL2.

[0144] As described above, since the charge generation layer is made of a low-resistance material and is commonly formed for the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, a lateral current leak may occur between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. As will be described later, by disconnecting the charge generation layer located between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb, the lateral current leak between each sub-pixel is prevented.

[0145] On the other hand, in the blue common structure, two blue organic light-emitting layers B-EML1 and B-EML2 are also commonly included in the green organic light-emitting element 140g and the red organic light-emitting element 140r. The first blue organic light-emitting layer B-EML1 can be located under the first stack ST1, and the second blue organic light-emitting layer B-EML2 can be located between the first stack ST1 and the second stack ST2.

[0146] FIG. 10a illustrates a deposition system according to an embodiment. FIG. 10b illustrates a state in which a blue organic light-emitting layer, a red organic light-emitting layer, and a green organic light-emitting layer are deposited on a substrate.

[0147] Although the upper part of the three-dimensional structure is shown as the vertex in FIG. 10b, it can also have an upper surface as shown in FIGS. 5 to 8. Although seven chambers CH1 to CH7 are provided in the drawing, more chambers may be provided.

[0148] As shown in FIGS. 5 to 8, FIGS. 9a, 10a, and 10b, the deposition system according to the embodiment can operate in an in-line manner. That is, the substrate 101 passes through the first chamber CH1 to the seventh chamber CH7 along one direction, and the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b are formed on the substrate 101. That is, when the substrate 101 is transferred, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b are deposited on the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb on the substrate 101.

[0149] The first chamber CH1 can deposit a hole injection layer HIL and / or a hole transport layer HTL on the substrate 101. The hole injection layer HIL and the hole transport layer HTL may be deposited in separate chambers, respectively. The second chamber CH2 can deposit a blue organic light-emitting layer B-EML on the substrate 101. The third chamber CH3 can deposit a red organic light-emitting layer R-EML on the substrate 101. The fourth chamber CH4 can deposit a green organic light-emitting layer G-EML on the substrate 101. The fifth chamber CH5 can deposit an electron transport layer ETL on the substrate 101. The sixth chamber CH6 can deposit an electron injection layer EIL and / or a cathode electrode on the substrate 101. The electron injection layer EIL and the cathode electrode may be deposited in separate chambers, respectively. The seventh chamber CH7 can deposit a capping layer CPL on the substrate 101.

[0150] As shown in Fig. 9b, when the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b are each composed of two stacks ST1 and ST2, a separate chamber is provided between the fourth chamber CH4 and the fifth chamber CH5, and the second chamber CH2 to the fourth chamber CH4 are additionally arranged. In such a case, the substrate 101 passes through the second chamber CH2 to the fourth chamber CH4, and the first stack ST1 including the first blue organic light-emitting layer B-EML1, the first red organic light-emitting layer R-RML1, and the first green organic light-emitting layer G-EML1 is formed on the substrate 101. Thereafter, the charge generation layer CGL and the second stack ST2 are formed on the first stack by passing the substrate 101 through the separate chamber where the substrate 101 is additionally arranged and the second chamber CH2 to the fourth chamber CH4. The second stack ST2 can include the second blue organic light-emitting layer B-EML1, the second red organic light-emitting layer R-RML2, and the second green organic light-emitting layer G-EML2, respectively. Therefore, each of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b can have a tandem structure including the first stack ST1 and the second stack ST2. The first blue organic light-emitting layer B-EML1 and the second blue organic light-emitting layer B-EML1 are commonly deposited on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, respectively.

[0151] As shown in FIGS. 10a and 10b, the substrate 101 is transferred from left to right above the first evaporation source 251, the second evaporation source 252, and the third evaporation source 253. The first evaporation source 251 is provided in the second chamber CH2, the second evaporation source 252 is provided in the third chamber CH3, and the third evaporation source 253 is provided in the fourth chamber CH4. The first evaporation source 251 can discharge a blue organic light-emitting material, the second evaporation source 252 can discharge a red organic light-emitting material, and the third evaporation source 253 can discharge a green organic light-emitting material. The first evaporation source 251 can discharge the blue organic light-emitting material vertically toward the substrate 101. The second evaporation source 252 can discharge the red organic light-emitting material toward the substrate 101 in the first diagonal direction. The third evaporation source 253 can discharge the green organic light-emitting material toward the substrate 101 in the second diagonal direction. The first diagonal direction and the second diagonal direction can be symmetric with respect to the normal direction.

[0152] On the other hand, a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 are provided on the substrate 101. As described above, the separation region 105 is defined on the substrate 101 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0153] After the substrate 101 is repeatedly moved so that the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 face the first evaporation source 251, the second evaporation source 252, and the third evaporation source 253, the corresponding substrate 101 is transferred to each of the first chamber CH1, the second chamber CH2, and the third chamber CH3.

[0154] When the substrate 101 passes through the first chamber CH1, the blue organic light-emitting material vertically discharged from the first evaporation source 251 is deposited on the entire area of the substrate 101. That is, it is deposited on the side surfaces 130-1a, 130-1b of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b of the second three-dimensional structure 130-2, and the separation region 105. The blue organic light-emitting layer B-EML is formed by the blue organic light-emitting material deposited on the separation region 105.

[0155] When the substrate 101 passes through the second chamber CH2, the red organic light-emitting material ejected from the second evaporation source 252 in the first diagonal direction is deposited on the exposed area on the substrate 101. That is, the red organic light-emitting material is deposited only on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. The red organic light-emitting layer R-EML is formed by the red organic light-emitting material deposited on each of the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. Since the red organic light-emitting material traveling in the first diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the red organic light-emitting material is not deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and the separation region 105.

[0156] When the substrate 101 passes through the third chamber CH3, the green organic light-emitting material ejected from the third evaporation source 253 in the second diagonal direction is deposited on the exposed area on the substrate 101. That is, the green organic light-emitting material is deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. The green organic light-emitting layer G-EML is formed by the green organic light-emitting material deposited on each of the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. Since the green organic light-emitting material traveling in the second diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the green organic light-emitting material is not deposited on the first side surface 130-2a of the second three-dimensional structure 130-2 and the separation region 105.

[0157] Therefore, by passing the substrate 101 through the second chamber CH2 and the third chamber CH3, the blue organic light-emitting material is deposited on the entire area of the substrate 101 including the separation region 105, the red organic light-emitting material is deposited only on the first side surface 130-2a of the second three-dimensional structure 130-2, and the green organic light-emitting material is deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1.

[0158] According to the embodiment, the blue-emitting organic light-emitting layer EML, the red organic light-emitting layer R-EML, and the green organic light-emitting layer G-EML can be formed by an inline deposition system without using a separate deposition pattern mask such as an FMM. Therefore, since a separate deposition pattern mask such as an FMM is not used, a high-definition (e.g., 500 PPI or higher) display or a large-area (e.g., 8th generation or higher) display can be realized. Since a separate deposition pattern mask such as an FMM is not used, the manufacturing cost is significantly reduced. Since a separate deposition pattern mask such as an FMM is not used, the yield is improved and the product life is extended by optimizing the deposition.

[0159] On the other hand, as shown in FIGS. 5 to 8 and 10b, the magnitude of the average wall surface angle θa between the substrate 101 and the three-dimensional structures 130-1 and 130-2 is determined by the selection of the materials of the three-dimensional structures 130-1 and 130-2, the equipment for forming the three-dimensional structures 130-1 and 130-2, and the process conditions. In order to ensure uniform image quality and no color unevenness within the screen, the shape of the three-dimensional structures 130-1 and 130-2 and the manufacturing methods and process conditions for uniformly forming the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 need to be optimized.

[0160] The angles of the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 with respect to the substrate 101 of the anode electrodes 141g, 141r, and 141b affect the formation of the organic light-emitting elements 142G, 142R, and 142B and thus affect the final image quality. Therefore, the selection of this angle is an important key success factor (KSF) at the process and product design stages.

[0161] On the other hand, as shown in FIG. 10b, the deposition angle θe of the green organic light-emitting material ejected from the third evaporation source 253 can be expressed by Equation 1. The structure of the third evaporation source 253 changes according to the design of the deposition angle θe.

[0162] (Equation 1) [Number]

[0163] The evaporation angle θe may be an angle for evaporating the green organic light-emitting material only on a specific region of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 by utilizing the Shadow Effect caused by the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 on the substrate 101.

[0164] TS represents the distance between the substrate 101 and the third evaporation source 253, and Offset can represent the shortest distance at which the green organic light-emitting material ejected from the third evaporation source 253 is deposited on the substrate 101.

[0165] Formula 1 can be similarly applied to the evaporation angle of the red organic light-emitting material ejected from the second evaporation source 252.

[0166] On the other hand, as shown in FIG. 10c, the evaporation angle θe for accommodating the green organic light-emitting material ejected from the third evaporation source 253 in a specific region of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 on the substrate 101 can be represented by Formula 2. The structure of the pixel P on the substrate 101 changes according to the design of the evaporation angle θe.

[0167] (Formula 2)

Number

[0168] W1 represents the width of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2, W2 represents the width of the separation region 105, and H can represent the height of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2.

[0169] From Formula 2, the larger the height H of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2, the larger the maximum evaporation angle θe can be. From Formula 2, the smaller the width W1 of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 and the width W2 of the separation region 105, the larger the maximum evaporation angle θe can be.

[0170] Formula 2 can be similarly applied to the deposition angle of the red organic light-emitting material ejected from the second evaporation source 252.

[0171] On the other hand, as shown in FIG. 10b, the blue organic light-emitting material ejected from the first evaporation source 251 is deposited over the entire area of the substrate 101, and the blue organic light-emitting layer B-EML is formed.

[0172] The thickness of the blue organic light-emitting layer B-EML may vary among the blue sub-pixel SPb, the green sub-pixel SPg, and the red sub-pixel Spr. That is, the thickness of the blue organic light-emitting layer B-EML may vary among the blue sub-pixel SPb, the green sub-pixel SPg, and the red sub-pixel Spr according to the average wall angle θa.

[0173] Theoretically, when the average wall angle θa is 90 degrees, that is, when the green sub-pixel SPg or the red sub-pixel Spr is perpendicular to the substrate 101, there is a possibility that the blue organic light-emitting layer B-EML is not formed on the green sub-pixel SPg or the red sub-pixel Spr. Also, when the blue organic light-emitting material ejected from the first evaporation source 251 travels straight at the same angle, there is a possibility that the blue organic light-emitting layer B-EML is not formed on the green sub-pixel SPg or the red sub-pixel Spr that is perpendicular to the substrate 101.

[0174] However, since the blue organic light-emitting material ejected from the first evaporation source 251 travels straight at different angles, even if the green sub-pixel SPg or the red sub-pixel Spr is perpendicular to the substrate 101, the blue organic light-emitting layer B-EML is formed on the green sub-pixel SPg or the red sub-pixel Spr. The thickness of the blue organic light-emitting layer B-EML can be expressed by Formula 3.

[0175] (Formula 3) T WS =T BS cos(θa - θb)

[0176] T WScan represent the thickness of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr. T BS can represent the thickness of the blue organic light-emitting layer B-EML formed on the blue sub-pixel SPb. θa represents the average wall value, and θb can represent the correction angle considering the structure of the first evaporation source 251, particularly the evaporation characteristics.

[0177] The smaller the correction angle θb, the smaller the thickness T of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr WS can be. For example, when the correction angle θb is 0, the thickness T of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg or the red sub-pixel SPr WS can be 0. That is, this can mean that no blue organic light-emitting layer B-EML is formed on the green sub-pixel SPg or the red sub-pixel SPr.

[0178] For example, when the green sub-pixel SPg and / or the red sub-pixel SPr are perpendicular to the substrate 101 and the correction angle θb is about 10 degrees, the thickness of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg and / or the red sub-pixel SPr may be 17.4% of the thickness of the blue organic light-emitting layer B-EML formed on the blue sub-pixel SPb. In such a case, when the thickness of the blue organic light-emitting layer B-EML formed on the blue sub-pixel SPb is 20 nm, the thickness of the blue organic light-emitting layer B-EML formed on the green sub-pixel SPg and / or the red sub-pixel SPr can be 3.5 nm and can be ignored. That is, even if a 3.5-nm blue organic light-emitting layer B-EML is formed on the green sub-pixel SPg and / or the red sub-pixel SPr, it does not affect the luminance of the green light emitted from the green sub-pixel SPg or the red light emitted from the red sub-pixel SPr.

[0179] According to the embodiment, since the blue organic light-emitting layer EML is deposited over the entire area of the substrate 101, it is not necessary to use a deposition pattern mask such as an FMM to deposit it only on a specific area.

[0180] Also, as described above, without using a deposition pattern mask such as an FMM by utilizing the SAD method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, only the green organic light-emitting layer G-EML is formed in the green subpixel SPg, and only the red organic light-emitting layer R-EML is formed in the red subpixel SPr.

[0181] FIG. 11 is a flowchart showing a method of manufacturing an organic light-emitting display device according to the first embodiment. FIGS. 12a to 12n are cross-sectional views showing a method of manufacturing an organic light-emitting display device according to the first embodiment. Using FIGS. 11 to 12n, a method of manufacturing a video display device (FIGS. 7 and 8) including the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 with average wall surface angles θa1 and θa2 of 90 degrees will be described. However, the manufacturing method illustrated in FIGS. 11 and 12n can be similarly applied to a video display device (FIGS. 5 and 6) including the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 with average wall surface angles θa1 and θa2 of less than 90 degrees.

[0182] As illustrated in FIG. 12a, a plurality of driving circuits 103 are formed on the substrate 101 (step A1).

[0183] The plurality of driving circuits 103 are arranged at intervals from each other. The driving circuits 103 may be formed for each subpixel, but are not limited thereto. The driving circuit 103 can include a plurality of transistors formed using a semiconductor process and at least one or more capacitors. The transistors can be made of a silicon-based semiconductor material or an oxide-based semiconductor material.

[0184] As illustrated in FIG. 12b, after a protective layer 110 is formed on the plurality of driving circuits 103, through holes 114 are formed in the protective layer 110 (step A2).

[0185] The protective layer 110 can be composed of a single film or a multiple film made of an inorganic material. The protective layer 110 can include a polymer resin layer. The through hole 114 is formed through the protective layer 110 so that the drain electrode of the driving transistor of the driving circuit 103 is exposed.

[0186] For example, when a polymer resin layer is formed on a plurality of driving circuits 103, a first through hole is formed in the polymer resin layer. Thereafter, after an inorganic film is formed on the polymer resin layer, a second through hole having a diameter larger than that of the first through hole is formed in the inorganic film. The second through hole can communicate with the first through hole. The through hole 114 is constituted by the first through hole and the second through hole. In such a case, the protective layer 110 can be composed of a polymer resin layer and an inorganic film.

[0187] As shown in FIG. 12c, a plurality of auxiliary electrodes 120g, 120r, 120b are formed on the protective layer 110 (A3 step).

[0188] The plurality of auxiliary electrodes 120g, 120r, 120b are formed by film formation using a sputtering process and are patterned. The plurality of auxiliary electrodes 120g, 120r, 120b are formed for each subpixel. The width of the third auxiliary electrode 120b may be larger than the width of the first auxiliary electrode 120g and the width of the second auxiliary electrode 120r, but is not limited thereto. The plurality of auxiliary electrodes 120g, 120r, 120b are arranged separately from each other. The plurality of auxiliary electrodes 120g, 120r, 120b can overlap perpendicularly to the plurality of driving circuits 103, respectively. The plurality of auxiliary electrodes 120g, 120r, 120b are electrically connected to the drain electrodes of the respective driving transistors of the plurality of driving circuits 103 through the through holes 114 of the protective layer 110, respectively.

[0189] As shown in FIG. 12d, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are formed on the first auxiliary electrode 120g and the second auxiliary electrode 120r (A4 step).

[0190] For example, the first three-dimensional structure 130-1 is formed on the first auxiliary electrode 120g, and the second three-dimensional structure 130-2 is formed on the second auxiliary electrode 120r. No three-dimensional structure is formed on the third auxiliary electrode 120b. The area above the third auxiliary electrode 120b can be defined as the separation region 105.

[0191] For example, the green sub-pixel SPg is defined on the first side surface 130-1a of the first three-dimensional structure 130-1, the red sub-pixel SPr is defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue sub-pixel SPb is defined in the separation region 105. As will be described later, a green organic light-emitting element (140g in FIG. 12k) is arranged in the green sub-pixel SPg, a red organic light-emitting element 140r is arranged in the red sub-pixel SPr, and a blue organic light-emitting element 140b is arranged in the blue sub-pixel SPb.

[0192] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be made of an acrylic or polyimide resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be formed of an inorganic material for high-resolution products. When the resolution of the product is 300 ppi or less, an organic material is applied onto the substrate using a printing technique, accurately aligned and transferred onto the substrate, and patterned through ultraviolet or thermal curing steps. Thereby, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are formed.

[0193] As shown in FIG. 12e, a plurality of auxiliary electrodes 120g, 120r, 120b are patterned using the three-dimensional structures 130-1, 130-2 as masks (step A5).

[0194] The auxiliary electrodes 120g, 120b, 120r are patterned using wet etching, dry etching, or a mixture thereof depending on the type and structure of the auxiliary electrodes 120g, 120b, 120r or according to the design values of the anode separation structures (180-1, 180-2 in FIG. 12f). Also, an ashing process may be added after patterning.

[0195] When the auxiliary electrodes 120g, 120b, and 120r are composed of a plurality of metal films and the plurality of metal films are patterned, the ends of the plurality of metal films can be positioned differently depending on the materials and etching characteristics of the plurality of metal films. That is, the ends of some of the plurality of metal films can protrude in the outer direction from the ends of other metal films. This will be described in detail with reference to FIGS. 17a and 17b.

[0196] As shown in FIG. 12f, a plurality of anode separation structures 180-1 and 180-2 are formed (A6 step).

[0197] For example, the first anode separation structure 180-1 is formed along the periphery of the first three-dimensional structure 130-1, and the second anode separation structure 180-2 is formed along the periphery of the second three-dimensional structure 130-2.

[0198] The anode separation structure can mean any of a plurality of isolation structures configured such that the anode electrode and the charge generation layer CGL are self-aligned and electrically isolated by using an undercut structure formed in the protective layer 110, but is not limited thereto.

[0199] Therefore, without a separate patterning process, the anode electrode is formed by being isolated for each of the sub-pixels SPg, SPr, and SPb, so that the manufacturing process is simple and the manufacturing cost is reduced. In addition, the patterning defect of the anode electrode in high definition and high resolution is fundamentally blocked. Further, since the charge generation layer CGL formed in common for the plurality of sub-pixels SPg, SPr, and SPb is isolated for each of the sub-pixels SPg, SPr, and SPb, the lateral current leakage between the sub-pixels is prevented.

[0200] The method of forming the anode separation structure will be described in detail later with reference to FIGS. 16 to 17g.

[0201] As shown in FIG. 12g, anode electrodes 141g, 141r, and 141b are formed on a substrate 101 provided with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2. In such a case, the anode electrodes 141g, 141r, and 141b are separated for each sub-pixel SPg, SPr, and SPb by a plurality of anode separation structures 180-1 and 180-2 (step A7). That is, the anode electrodes 141g, 141r, and 141b are formed only on the corresponding sub-pixels SPg, SPr, and SPb and are not formed between the sub-pixels SPg, SPr, and SPb.

[0202] The anode electrodes 141g, 141r, and 141b can include, but are not limited to, a transparent conductive film. The anode electrodes 141g, 141r, and 141b can include a single metal film such as Ni, Au, etc., or a multi-metal film such as Ni / Au. The third auxiliary electrode 120b on the blue sub-pixel SPb can be formed of a multi-layer film so as to ensure reflectivity, such as ITO / Ag alloy / Ti, for example.

[0203] On the other hand, a photoresist pattern may be formed on each upper surface 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 before the film formation process so that the anode electrodes 141g, 141r, and 141b are not formed on each upper surface 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, but this is not limiting.

[0204] As shown in FIGS. 12h, 12i, and 12j, a blue organic light-emitting layer 142B, a red organic light-emitting layer 142R, and a green organic light-emitting layer 142G are sequentially deposited on the substrate 101 (step A8).

[0205] Specifically, as shown in FIG. 12h, the blue organic light-emitting layer 142B is deposited over the entire area of the substrate 101 using the first evaporation source (251 in FIG. 10b) of the second chamber (CH2 in FIG. 10a). That is, the blue organic light-emitting layer 142B is formed in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The blue organic light-emitting layer 142B is formed on the anode electrodes 141g, 141r, 141b in the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. Also, before the blue organic light-emitting layer 142B is formed, the hole injection layer HIL and the hole transport layer HTL are formed on the anode electrodes 141g, 141r, 141b using the respective evaporation sources of the first chamber CH1.

[0206] Even when the hole injection layer HIL, the hole transport layer HTL, and the blue organic light-emitting layer 142B are deposited over the entire area of the substrate 101, the hole injection layer HIL, the hole transport layer HTL, and the blue organic light-emitting layer 142B are interrupted and separated between the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb by the first anode separation structure 180-1 and the second anode separation structure 180-2.

[0207] In order to prevent defects such as color purity and color unevenness, thickness control of the blue organic light-emitting layer 142B on the green sub-pixel SPg and the red sub-pixel SPr is very important. The green sub-pixel SPg can emit green light, the red sub-pixel SPr can emit red light, and the blue sub-pixel SPb can emit blue light. In such a case, the blue organic light-emitting layer 142B on the green sub-pixel SPg and the red sub-pixel SPr preferably is removed because it interferes with the emission of green light and red light.

[0208] However, as shown in Equation 3, even if the side surfaces 130-1a and 130-1b of the first three-dimensional structure 130-1 and the side surfaces 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, since the blue organic light-emitting material ejected from the first evaporation source 251 travels straight at different angles, the blue organic light-emitting layer 142B is likely to be formed on the green sub-pixel SPg and the red sub-pixel SPr. In the embodiment, the correction angle θb considering the structure of the first evaporation source 251, particularly the evaporation characteristics, is minimized to reduce the thickness of the blue organic light-emitting layer 142B formed on the green sub-pixel SPg and the red sub-pixel SPr. Even if the blue organic light-emitting layer 142B is formed on the green sub-pixel SPg and the red sub-pixel SPr, it is managed so that the thickness of the blue organic light-emitting layer 142B does not affect the luminance of the color light emitted from the green sub-pixel SPg and the red sub-pixel SPr.

[0209] For this purpose, the average wall surface angle θa is optimized within the range of 60 degrees to 90 degrees so that the thickness of the blue organic light-emitting layer 142B on the green sub-pixel SPg and the red sub-pixel SPr is controlled to be 5% to 60% of the thickness of the blue organic light-emitting layer 142B formed on the blue sub-pixel SPb.

[0210] As shown in FIG. 12i, a red organic light-emitting layer 142R is deposited on the substrate 101. The red organic light-emitting layer 142R is deposited on the first side surface 130-2a of the second three-dimensional structure 130-2 using the second evaporation source (252 in FIG. 10b) of the third chamber (CH3 in FIG. 10a). The red organic light-emitting layer 142R is deposited on the blue organic light-emitting layer 142B on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. At this time, due to the shadow effect in which the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 act as a shielding film, the red organic light-emitting material is not formed on the first side surface 130-1a of the first three-dimensional structure 130-1, the second side surface 130-2b of the second three-dimensional structure 130-2, and the separation region 105.

[0211] Therefore, without using a deposition pattern mask such as an FMM, the red organic light-emitting layer 142R is selectively deposited on a specific region, that is, the second side surface 130-1b of the first three-dimensional structure 130-1 or the first side surface 130-2a of the second three-dimensional structure 130-2 by using the SAD method.

[0212] As shown in FIG. 12j, the green organic light-emitting layer 142G is deposited on the substrate 101. The green organic light-emitting layer 142G is deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 by using the third evaporation source (253 in FIG. 10b) of the fourth chamber (CH4 in FIG. 10a). The green organic light-emitting layer 142G is deposited on the blue organic light-emitting layer 142B on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. At this time, due to the shadow effect in which the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 serve as a shielding film, the green organic light-emitting material is not formed on the second side surface 130-1b of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation region 105.

[0213] Therefore, without using a deposition pattern mask such as an FMM, the green organic light-emitting layer 142G is selectively deposited on a specific region, that is, the first side surface 130-1a of the first three-dimensional structure 130-1 or the second side surface 130-2b of the second three-dimensional structure 130-2 by using the SAD method.

[0214] Thereafter, the electron transport layer ETL and the electron injection layer EIL are formed by using the evaporation sources of the fifth chamber CH5 and the sixth chamber CH6.

[0215] As shown in FIG. 12k, the cathode electrode 143 is formed on the organic light-emitting layer 142 (step A9). A transparent conductive film such as ITO and IZO is sputtered by using a sputtering process to form the cathode electrode 143. A metal film such as magnesium (Mg) and silver (Ag) is deposited by using a vacuum evaporation method to form the cathode electrode 143.

[0216] The cathode electrode 143 is commonly connected to a plurality of sub-pixels SPg, SPr, and SPb. The cathode electrode 143 must not be interrupted by the anode separation structures 180-1 and 180-2. In the case of the vacuum evaporation method, since the step coverage for the cathode electrode 143 is not good, it is necessary to optimize the evaporation angle of the evaporation source so that the cathode electrode 143 is not interrupted by the anode separation structures 180-1 and 180-2. Also, the undercut structures included in the anode separation structures 180-1 and 180-2 are made not to exceed a predetermined height, thereby preventing the interruption of the cathode electrode 143.

[0217] On the other hand, by the evaporation process illustrated in FIGS. 12g to 12k, a green organic light-emitting element 140g, a red organic light-emitting element 140r, and a blue organic light-emitting element 140b are formed in each of the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb. The green organic light-emitting element 140g may include a green organic light-emitting layer 142G, the red organic light-emitting element 140r may include a red organic light-emitting layer 142R, and the blue organic light-emitting element 140b may include a blue organic light-emitting layer 142B. The first anode electrode 141g, the second anode electrode 141r, and the third anode electrode 141b are independently included in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, respectively, and the cathode electrode 143 is commonly included in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b.

[0218] As illustrated in FIG. 12l, a first insulating layer 150 is formed on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b (step A10).

[0219] The first insulating layer 150 is formed on the respective cathode electrodes 143 of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The first insulating layer 150 can prevent oxygen or moisture from penetrating into the blue organic light-emitting layer 142B, the green organic light-emitting layer 142G, and the blue organic light-emitting layer 142B.

[0220] The first insulating layer 150 can be made of an inorganic film. For example, in the case of an inorganic film, a silicon oxide film or a silicon nitride film formed by a PECVD method can be formed. The first insulating layer 150 can include a film formed by an ALD (Atomic Layer Deposition) method (for example, a SiNx film, a SiOx film, or an Al2O3 film). The first insulating layer 150 can include a double film of a film formed by an ALD method and a film formed by a PECVD method. The first insulating layer 150 can include a double film of a film formed by a PECVD method on a film formed by an ALD method.

[0221] As shown in FIG. 12m, the second insulating layer 160 is formed on the first insulating layer 150 (A11 step).

[0222] The second insulating layer 160 is formed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 can be made of an organic material that can easily form a thick thickness, but is not limited thereto. The second insulating layer 160 may be formed by an inkjet method, but is not limited thereto.

[0223] As shown in FIG. 12n, the third insulating layer 170 is formed on the second insulating layer 160 (A12 step).

[0224] The third insulating layer 170 can be made of an inorganic film. The third insulating layer 170 may be formed of the same material as the first insulating layer 150, but is not limited thereto.

[0225] The organic light-emitting display device (third embodiment) shown in FIG. 7 is manufactured by the manufacturing method according to FIGS. 12a to 12n.

[0226] FIG. 13 is a flowchart showing a manufacturing method of an organic light-emitting display device according to a second embodiment. FIGS. 14a to 14d are cross-sectional views showing a manufacturing method of an organic light-emitting display device according to a second embodiment.

[0227] A method for manufacturing a video display device (Figs. 7 and 8) including a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 with average wall surface angles θa1 and θa2 of 90 degrees will be described with reference to Figs. 13 to 14d. However, the manufacturing method illustrated in Figs. 13 to 14d can be similarly applied to a video display device (Figs. 5 and 6) including a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 with average wall surface angles θa1 and θa2 of less than 90 degrees.

[0228] Since steps A1 to A10 in Fig. 13 are the same as steps A1 to A10 illustrated in Figs. 11 to 12l, detailed description thereof will be omitted.

[0229] As illustrated in Fig. 14a, a first insulating layer 150 is formed on a green organic light-emitting element 140g, a red organic light-emitting element 140r, and a blue organic light-emitting element 140b (step A10).

[0230] As illustrated in Fig. 14b, a second insulating layer 160 is formed on the first insulating layer 150 (step A11).

[0231] The second insulating layer 160 is formed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0232] Unlike Fig. 12m, the upper surface of the second insulating layer 160 illustrated in Fig. 14b can be positioned lower than at least the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The upper surface of the second insulating layer 160 can be positioned higher than the upper end of the first anode electrode 141g on the first side surface 130-1a of the first three-dimensional structure 130-1. The upper surface of the second insulating layer 160 can be positioned higher than the upper end of the second anode electrode 141r on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0233] For this reason, in the case of an inkjet process, the dot amount, the shrinkage amount after vacuum drying, etc. are considered. Also, a material considering the surface energy between the first insulating layer 150 and the second insulating layer 160 is selected.

[0234] As shown in FIG. 14c, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are removed (step A111).

[0235] In the dry etching process, it is important to select the ashing amount and the gas suitable for each material, and damage to the first to blue organic light-emitting elements 140b should not occur in the dry etching process.

[0236] When removing the first insulating layer 150, the cathode electrode 143, etc., the second insulating layer 160 is used as a stopper. That is, each of the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B is removed up to the upper surface of the second insulating layer.

[0237] By removing the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B that are higher than the upper surface of the second insulating layer, the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be exposed. Thereby, the lateral current leakage between the green sub-pixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1 and the red sub-pixel SPr on the second side surface 130-1b is prevented. The lateral current leakage between the red sub-pixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2 and the green sub-pixel SPg on the second side surface 130-2b is prevented. In particular, in the two-stack tandem structure, by removing the charge generation layer on the upper surface 130T of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the lateral current leakage between the green sub-pixel SPg and the red sub-pixel SPr through the charge generation layer is prevented.

[0238] At least one of the remaining first insulating layer 150, cathode electrode 143, green organic light-emitting layer 142G, red organic light-emitting layer 142R, and blue organic light-emitting layer 142B after the removal can be positioned lower than the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. With such a structure, the organic light-emitting layers 142G, 142R, and 142B on the adjacent sub-pixels SPg and SPr are completely isolated, and lateral current leakage is more reliably prevented.

[0239] As shown in FIG. 14d, a third insulating layer 170 is formed on the substrate 101 (step A12).

[0240] The third insulating layer is formed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The third insulating layer 170 is formed on the respective upper surfaces 130T of the exposed first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0241] Not only is the organic light-emitting layer EML between the adjacent sub-pixels SPg and SPr completely isolated by the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, but also the third insulating layer 170 is in contact with the respective upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, so lateral current leakage is more completely prevented.

[0242] The organic light-emitting display device (fourth embodiment) shown in FIG. 8 is manufactured by the manufacturing method according to FIGS. 14a to 14d.

[0243] On the other hand, as shown in FIG. 14c, lateral current leakage can be prevented without removing all the layers on the respective upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, such as the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B.

[0244] Specifically, as shown in FIG. 12m, the second insulating layer 160 is formed on the first insulating layer 150. Thereafter, the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are locally removed on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively, so that the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be exposed. Thereby, each of the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B can have a structure separated from each other on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Thereby, a path through which a leakage current flows between the green sub-pixel SPg and the red sub-pixel SPr is removed on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, and lateral current leakage is prevented.

[0245] According to the embodiment, since the leakage current paths between all the sub-pixels SPg, SPr, and SPb are blocked by the anode separation structures 180-1 and 180-2 and the separation structures on the three-dimensional structures 130-1 and 130-2, lateral current leakage is perfectly prevented.

[0246] Thereafter, the third insulating layer 170 is formed on the second insulating layer 160. In such a case, the third insulating layer 170 can be in contact with the etched cross-sections of the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B, respectively, and can be in contact with the upper surface of the first three-dimensional structure 130-1 and the upper surface of the second three-dimensional structure 130-2. The green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B can each have a structure separated by the third insulating layer 170.

[0247] FIG. 15 is a cross-sectional view showing the X region of FIG. 7 in detail. Referring to FIG. 15, the first anode separation structure 180-1 and the second anode separation structure 180-2 will be described in detail.

[0248] As shown in FIG. 15, a green sub-pixel SPg is defined on a first side surface 130-1a of a first three-dimensional structure 130-1, a red sub-pixel SPr is defined on a first side surface 130-2a of a second three-dimensional structure 130-2, and a blue sub-pixel SPb is defined on a separation region 105. The green sub-pixel SPg includes a green organic light-emitting element 140g, the red sub-pixel SPr includes a red organic light-emitting element 140r, and the blue sub-pixel SPb can include a blue organic light-emitting element 140b. One pixel P is constituted by the green sub-pixel SPg, the red sub-pixel SPr, and the blue sub-pixel SPb.

[0249] A first anode separation structure 180-1 is disposed along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 is disposed below the first three-dimensional structure 130-1 between the green sub-pixel SPg and the blue sub-pixel SPb. The first anode separation structure 180-1 is disposed below the first three-dimensional structure 130-1 between the green organic light-emitting element 140g and the blue organic light-emitting element 140b.

[0250] The first anode separation structure 180-1 can include a first undercut structure 1810 and a first isolation structure 1820.

[0251] In the first undercut structure 1810, the end of at least one insulating film 112 among a plurality of insulating films 111 to 113 constituting the protective layer 110 is formed to be located inside from the first side surface 130-1a of the first three-dimensional structure 130-1.

[0252] The first isolation structure 1820 can isolate between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810. The first isolation structure 1820 can include a first-1 isolation structure 1821, a first-2 isolation structure 1822, a first-3 isolation structure 1823, and the like.

[0253] The first isolation structure 1821 can isolate the first anode electrode 141g of the green organic light-emitting element 140g from the third anode electrode 141b of the blue organic light-emitting element 140b between the green subpixel SPg and the blue subpixel SPb. At least one or more metal films are formed on the substrate 101 during the formation process of the anode electrode. In such a case, at least one or more metal films are isolated between the green subpixel SPg and the blue subpixel SPb by the first undercut structure 1810 due to the first undercut structure 1810. Thereby, the first anode electrode 141g is formed on the green subpixel SPg, and the third anode electrode 141b is formed on the blue subpixel SPb.

[0254] On the other hand, as shown in FIGS. 9a and 9b, a common layer is formed in common for the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. For example, in FIG. 9a, the common layer can include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a blue organic light-emitting layer 142B, a charge generation layer CGL, an electron transport layer ETL, a cathode electrode 143, and the like. For example, in FIG. 9b, the common layer can include a hole injection layer HIL, hole transport layers HTL1, HTL2, electron blocking layers EBL1, EBL2, a blue organic light-emitting layer 142B, a charge generation layer CGL, electron transport layers ETL1, ETL2, a cathode electrode 143, and the like.

[0255] Since the blue organic light-emitting layer 142B and the charge generation layer CGL cause a lateral current leak, they must be isolated between the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb. On the contrary, since the cathode electrode 143 is electrically connected in common to the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, it must not be isolated between the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb.

[0256] According to the embodiment, the blue organic light-emitting layer 142B, the charge generation layer CGL, etc. are isolated between the green subpixel SPg and the blue subpixel SPb by the first undercut structure 1810.

[0257] The first to second isolation structure 1822 can isolate the blue organic light-emitting layer 142B between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810 and / or the separation interval between the first anode electrode 141g and the third anode electrode 141b. The first to third isolation structure 1823 can isolate the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810, the separation interval between the first anode electrode 141g and the third anode electrode 141b, and / or the isolated blue organic light-emitting layer 142B.

[0258] Therefore, by isolating the blue organic light-emitting layer 142B and the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810 or the like, the lateral current leakage between the sub-pixels is prevented.

[0259] The anode separation structure 180-2 is arranged along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 is arranged below the second three-dimensional structure 130-2 between the red sub-pixel SPr and the blue sub-pixel SPb. The second anode separation structure 180-2 is arranged below the second three-dimensional structure 130-2 between the red organic light-emitting element 140r and the blue organic light-emitting element 140b.

[0260] The anode separation structure 180-2 can include a second undercut structure 1830 and a second isolation structure 1840.

[0261] In the second undercut structure 1830, the end of at least one insulating film 112 among the plurality of insulating films 111 to 113 constituting the protective layer 110 is formed to be located inside from the first side surface 130-2a of the second three-dimensional structure 130-2.

[0262] The second isolation structure 1840 can isolate between the red sub-pixel SPr and the blue sub-pixel SPb by the second undercut structure 1830. The second isolation structure 1840 can include a second-1 isolation structure 1841, a second-2 isolation structure 1842, a second-3 isolation structure 1843, and the like.

[0263] The second-1 isolation structure 1841 can isolate the second anode electrode 141r of the red organic light-emitting element 140r and the third anode electrode 141b of the blue organic light-emitting element 140b between the red sub-pixel SPr and the blue sub-pixel SPb. At least one or more metal films are formed on the substrate 101 during the formation process of the anode electrode. In such a case, at least one or more metal films are isolated between the red sub-pixel SPr and the blue sub-pixel SPb by the second undercut structure 1830. Thereby, the second anode electrode 141r is formed on the green sub-pixel SPg, and the third anode electrode 141b is formed on the blue sub-pixel SPb.

[0264] According to the embodiment, the common layers such as the blue organic light-emitting layer 142B and the charge generation layer CGL are isolated between the red sub-pixel SPr and the blue sub-pixel SPb by the second undercut structure 1830.

[0265] The second-2 isolation structure 1842 can isolate the blue organic light-emitting layer 142B between the red sub-pixel SPr and the blue sub-pixel SPb by the second undercut structure 1830 and / or the separation distance between the second anode electrode 141r and the third anode electrode 141b. The second-3 isolation structure 1843 can isolate the charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb by the second undercut structure 1830, the separation distance between the second anode electrode 141r and the third anode electrode 141b, and / or the isolated blue organic light-emitting layer 142B.

[0266] Therefore, the second undercut structure 1830 or the like cuts off the blue organic light-emitting layer 142B and the charge generation layer CGL between the red sub-pixel SPr and the blue sub-pixel SPb, thereby preventing the lateral current leakage between the sub-pixels.

[0267] On the other hand, the first anode separation structure 180-1 may include only the first undercut structure 1810, and the second anode separation structure 180-2 may include only the second undercut structure 1830. That is, the first isolation structure 1820 may not be included in the first anode separation structure 180-1, and the second isolation structure 1840 may not be included in the second anode separation structure 180-2.

[0268] Although not shown, a third auxiliary electrode 120b is disposed under the third anode electrode 141b. The third anode electrode 141b may be removed, and the third auxiliary electrode 120b may be in contact with the hole injection layer HIL in FIGS. 9a and 9b. In such a case, the third auxiliary electrode 120b can serve as the third anode electrode 141b.

[0269] On the other hand, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b may each include a plurality of metal films 121a, 121b, 122a, 122b, 123a, 123b.

[0270] For example, the first metal films 121a, 121b may be made of, for example, Ti, Mo, or the like, which is a metal material having excellent electrical contact characteristics with the driving circuit 103 and being easily dry-etched. For example, the second metal films 122a, 122b may be made of, for example, Ag, an Ag alloy, Al, or the like, which is a metal material having excellent reflection characteristics and being easily wet-etched. For example, the third metal films 123a, 123b may be made of ITO, IZO, or the like, which is a transparent material having low contact resistance with the anode electrodes 141g, 141r, 141b and excellent process reliability. For example, the third metal films 123a, 123b may also be made of Mo, a MoTi alloy, Ti, or the like.

[0271] The first auxiliary electrode 120g is disposed under the first three-dimensional structure 130-1, and the second auxiliary electrode 120r is disposed under the second three-dimensional structure 130-2.

[0272] Among the plurality of metal films 121a, 122a, 123a of the first auxiliary electrode 120g, at least one metal film 121a can protrude in the outer direction from the first side surface 130-1a of the first three-dimensional structure 130-1 and include a first protruding region 1211 in contact with the first anode electrode 141g. The first protruding region 1211 can be such that the end of one metal film 121a of the first auxiliary electrode 120g protrudes in the outer direction more than the ends of the other metal films 122a, 123a.

[0273] Among the plurality of metal films 121b, 122b, 123b of the second auxiliary electrode 120r, at least one metal film 121b can protrude in the outer direction from the first side surface 130-2a of the second three-dimensional structure 130-2 and include a second protruding region 1212 in contact with the second anode electrode 141r. The second protruding region 1212 can be such that the end of one metal film 121b of the first auxiliary electrode 120g protrudes in the outer direction more than the ends of the other metal films 12b, 123b.

[0274] FIG. 16 is a flowchart showing a method of manufacturing an organic light-emitting display device according to a third embodiment. FIGS. 17A to 17G are cross-sectional views showing a method of manufacturing an organic light-emitting display device according to the third embodiment. FIGS. 17A to 17G illustrate a red sub-pixel SPr and a blue sub-pixel SPb in FIG. 15, but the green sub-pixel SPg can be similarly applied.

[0275] Steps A1 to A4 in FIG. 16 are the same as steps A1 to A4 illustrated in FIG. 11, and thus detailed description thereof is omitted.

[0276] As illustrated in FIG. 17A, the auxiliary electrode 120r is patterned using the three-dimensional structure 130-2 (step A5).

[0277] Specifically, a protective layer 110 and an auxiliary electrode 120r are formed on a substrate 101, and a three-dimensional structure 130-2 is formed on the auxiliary electrode 120r. The protective layer 110 can include a plurality of insulating films 111 to 113. The auxiliary electrode can include a plurality of metal films 121b, 122b, and 123b.

[0278] Thereafter, the auxiliary electrode 120r is patterned using the three-dimensional structure 130-2 as a mask. In such a case, the ends of the plurality of metal films 121b, 122b, and 123b can be positioned so as to be different from each other. The third metal film 123b, the second metal film 122b, and the first metal film 121b are etched into various cross-sectional shapes depending on the etching characteristics of the materials.

[0279] For example, the third metal film and the second metal film are etched, while the first metal film is not etched. As a result, the third metal film and the second metal film may be over-etched under the three-dimensional structure 130-2.

[0280] In FIG. 16, step A6 is a step of forming an anode separation structure, which will be described in detail with reference to FIGS. 17b to 17g.

[0281] As shown in FIG. 17b, the width and height of the three-dimensional structure 130-2 are reduced by an ashing process or dry etching (step A61). As a result, the over-etched third metal film and second metal film can be exposed. The first metal film can include a protruding region 1212 that protrudes outward from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2. The protruding region 1212 can protrude within approximately 2 μm from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2.

[0282] The etched side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the third metal film and the second metal film of the auxiliary electrode 120r can be positioned on the same vertical line within an error range of about several hundred nm.

[0283] As shown in FIG. 17c, a plurality of insulating films 111 to 113 of the protective layer 110 are patterned (step A62). For example, dry etching is performed using the first metal film of the auxiliary electrode 120r as a mask, and the third insulating film 113 and the second insulating film 112 of the protective layer 110 are patterned.

[0284] The dry etching characteristics of the first insulating film 111, the second insulating film 112, and the third insulating film 113 are different. For example, although the dry etching characteristics of the second insulating film 112 and the third insulating film 113 are very excellent, the first insulating film 111 may not be patterned by dry etching. For example, an HF-based etching solution can be used, but it is not limited thereto.

[0285] For example, the first insulating film 111 and the third insulating film 113 may be silicon nitride films, and the second insulating film 112 may be a silicon oxide film, but it is not limited thereto. At the film formation stage of the first insulating film 111, the second insulating film 112, and the third insulating film 113, the ratio of silicon to nitrogen, the ratio of silicon to oxygen, the film density, etc. are optimized, and at the dry etching stage, the type and composition ratio of the dry etching gas, etc. are optimized.

[0286] As shown in FIG. 17d, dry etching is continuously performed, and the second insulating film 112 is patterned (step A63). By additional dry etching, the first insulating film 111 and the third insulating film 113 are not patterned, and the second insulating film 112 is patterned. As a result, an undercut structure 1830 in which the end of the second insulating film 112 is located inside from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2 is formed.

[0287] On the other hand, the third insulating film 113 may be omitted, and a double structure of the second insulating film 112 and the first insulating film 111 may be formed. In such a case, the first insulating film 111 may include a resin film, and the second insulating film 112 may include an inorganic film such as a silicon nitride film or a silicon oxide film. Thereby, the undercut structure 1830 is easily formed by using a large etching selectivity between the resin film and the inorganic film. When the first insulating film 111 is a resin film, the etching selectivity can be increased to facilitate structure formation by utilizing a resin film that is difficult to be etched by a wet etching solution.

[0288] As shown in FIG. 17e, anode electrodes 141r and 141b are formed on the substrate 101 (step A7). The green anode electrode (142g in FIG. 15) is also formed on the substrate 101.

[0289] At least one or more metal films are formed on the substrate 101. In such a case, the second - 1 isolation structure 1841 is formed by the undercut structure 1830. At least one or more metal films are isolated between the red sub - pixel SPr and the blue sub - pixel SPb by the second - 1 isolation structure 1841 and separated into the second anode electrode 141r and the third anode electrode 141b. The second anode electrode 141r is formed on the red sub - pixel SPr on the side surface 130 - 2a of the three - dimensional structure 130 - 2, and the third anode electrode 141b is formed on the blue sub - pixel SPb on the isolation region 105.

[0290] Since the thickness of at least one or more metal films is very small, 50 nm or less, the height 182 of the undercut structure 1830 is not reduced by the anode electrodes 141r and 141b, and it is prevented that the anode electrodes 141r and 141b are separated and connected.

[0291] According to the embodiment, the anode electrodes 141r and 141b separated from each other are formed without a separate additional process by an FMM or the like, so that the manufacturing process is simplified and the manufacturing cost is reduced.

[0292] On the one hand, the second anode electrode 141r is electrically connected to the protruding region 1212 of the first metal film 121b of the auxiliary electrode 120r. That is, the second anode electrode 141r can contact the upper and side surfaces of the protruding region 1212 and the side surfaces of the second metal film 122b and the third metal film 123b, respectively. Therefore, the contact area between the second anode electrode 141r and the auxiliary electrode 120r is maximized, the voltage and current supply characteristics are improved, and the electrical / optical characteristics are enhanced.

[0293] The anode electrode 141b is removed, and an auxiliary electrode (not shown) located under the third anode electrode 141b can also serve as the third anode electrode 141b.

[0294] As shown in FIG. 17f, the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B are deposited on the anode electrodes 141r and 141b (step A8). Although not shown, the green organic light-emitting layer 142G is also deposited on the green anode electrode (141g in FIG. 15).

[0295] The organic light-emitting layer 142R shown in FIG. 17f may be the organic light-emitting layers R-EML1 and R-EML2 having a two-stack structure shown in FIG. 9b.

[0296] As shown in FIG. 9b, the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B can each have a tandem structure including a first stack ST1, a charge generation layer CGL, and a second stack ST2.

[0297] For example, the first stack ST1 of the blue organic light-emitting layer 142B is deposited on the red sub-pixel SPr and the blue sub-pixel SPb, and the first stack ST1 of the red organic light-emitting layer 142R is deposited on the red sub-pixel SPr. Thereafter, the charge generation layer CGL is deposited on the red sub-pixel SPr and the blue sub-pixel SPb. Thereafter, the second stack ST2 of the blue organic light-emitting layer 142B is deposited on the red sub-pixel SPr and the blue sub-pixel SPb, and the second stack ST2 of the red organic light-emitting layer 142R is deposited on the red sub-pixel SPr.

[0298] In such a case, a second isolation structure 1842 in which the first stack ST1 of the blue organic light-emitting layer 142B is isolated between the red sub-pixel SPr and the blue sub-pixel SPb by an undercut structure 1830 or the like is formed. A second isolation structure 1843 in which the charge generation layer CGL is isolated between the red sub-pixel SPr and the blue sub-pixel SPb by an undercut structure 1830 or the like is formed. The second isolation structure 1840 is constituted by the second isolation structure 1841, the second isolation structure 1842, and the second isolation structure 1843.

[0299] The isolation of the second anode electrode 141r and the third anode electrode 141b, the isolation of the first stack ST1 of the blue organic light-emitting layer 142B, and the isolation of the charge generation layer CGL are performed at the same position. That is, these isolations are performed at a position adjacent to the undercut structure 1830 or diagonally at the undercut structure 1830.

[0300] On the other hand, the organic vapor deposition film constituting the red organic light-emitting layer 142R or the blue organic light-emitting layer 142B has poor step coverage characteristics. However, the embodiment can make reverse use of the point that the step coverage characteristics of the organic vapor deposition film are poor. That is, in the embodiment, since the step coverage characteristics of the organic vapor deposition film are poor, even when the organic vapor deposition film is deposited, the material of the corresponding organic vapor deposition film does not penetrate into the undercut structure 1830. Therefore, since the first stack ST1 of the blue organic light-emitting layer 142B and the charge generation layer CGL are isolated at the entrance of the undercut structure 1830, the lateral current leakage is minimized by the influence of the adjacent sub-pixels SPr and SPb, so that the image quality becomes clear and the luminance is improved.

[0301] As shown in FIG. 17g, the cathode electrode 143 is formed (step A9).

[0302] FIG. 18 illustrates the height and depth of the undercut structure in the anode separation structure according to the embodiment.

[0303] As shown in FIG. 18, the cathode electrode 143 common to all sub-pixels (SPg, SPr, SPb in FIG. 15) is not interrupted (or separated), the second anode electrode 141r and the third anode electrode 141b are interrupted (or separated) between the red sub-pixel SPr and the red sub-pixel SPr, the first blue organic light-emitting layer B-EML1 is interrupted (or separated), and the charge generation layer CGL is interrupted (or separated). To do so, it is necessary to satisfy Equation 4.

[0304] (Equation 4) The thickness 184 of the third anode electrode 141b + the thickness 185 of the first stack ST1 + the thickness 186 of the charge generation layer CGL < the height 182 of the undercut structure 1830 < the thickness 184 of the third anode electrode 141b + the total thickness 187 of the blue organic light-emitting layer 142B

[0305] The height 182 of the undercut structure 1830 may be greater than the value obtained by adding at least the thickness 184 of the third anode electrode 141b (or the second anode electrode 141r), the thickness 185 of the first stack ST1, and the thickness 186 of the charge generation layer CGL. The height 182 of the undercut structure 1830 may be smaller than the value obtained by adding the thickness 184 of the third anode electrode 141b (or the second anode electrode 141r) and the total thickness 187 of the blue organic light-emitting layer 142B. The total thickness 187 of the blue organic light-emitting layer 142B may be the total thickness of all the organic light-emitting layers included in the blue organic light-emitting layer 142B shown in FIG. 9b.

[0306] On the other hand, the depth 183 of the undercut structure 1830 may be twice or more the height 182 of the undercut structure 1830 in consideration of process variations.

[0307] For example, as shown in FIG. 9b, in a structure having a two-stack tandem structure, the height 182 and the depth 183 of the undercut structure 1830 can be calculated as follows.

[0308] - Thickness 184 of the third anode electrode 141b: 50 nm

[0309] - Thickness of the first stack ST1: 185:150 nm

[0310] - Thickness of the charge generation layer CGL: 186:20 nm

[0311] - Total thickness of the blue organic light-emitting layer 142B: 187:450 nm

[0312] The height 182 of the undercut structure 1830 is calculated in the range of 220 nm to 500 nm, and the depth 183 of the undercut structure 1830 is calculated in the range of 440 nm to 1,000 nm.

[0313] On the other hand, in the structure having a two-stack tandem structure, the height 182 and the depth 183 of the undercut structure 1830 calculated by Equation 4 are changed according to the integration degree. Equation 4 can be similarly applied to the structure having a single stack (Figure 9a).

[0314] Figure 19 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0315] The embodiment is the same as the third embodiment (Figure 7) except for the light-scattering particles 190. In the fifth embodiment, the same reference numerals are given to the components having the same structure, shape, and / or function as those in the third embodiment (Figure 7), and detailed descriptions thereof are omitted. The fifth embodiment can be similarly applied to the first embodiment, the second embodiment, and the fourth embodiment.

[0316] Referring to Figure 19, the organic light-emitting display device 100E according to the fifth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100E according to the fifth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100E according to the fifth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0317] The second insulating layer 160 contains light-scattering particles 190. Although only the second insulating layer 160 on the separation region 105 on the far left side in the drawing contains the light-scattering particles 190, the second insulating layer 160 on other separation regions 105 may also contain the light-scattering particles 190.

[0318] The green light emitted from the green organic light-emitting element 140g, the red light emitted from the red organic light-emitting element 140r, and the blue light emitted from the blue organic light-emitting element 140b can travel through the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0319] For example, the first anode electrode 141g, the second anode electrode 141r, and the third anode electrode 141b can include a reflective film. For example, the cathode electrode 143 can include a semi-transmissive film. The green light, red light, and blue light are reflected by the reflective film and the semi-transmissive film and emitted forward. Here, P1 to P4 can represent the light paths. Some light, for example, red light, is totally reflected upward within the red organic light-emitting element 140r and emitted forward (P2).

[0320] On the other hand, some light, red light, is scattered by the light-scattering particles 190 and emitted forward (P3). Since more light is extracted to the outside by the light-scattering particles 190, the luminance can be increased.

[0321] FIG. 20 is a cross-sectional view illustrating an organic light-emitting display device according to the sixth embodiment.

[0322] The embodiment is the same as the fifth embodiment (FIG. 19) except for the lens structure 193. In the sixth embodiment, the same reference numerals are given to the components having the same structure, shape, and / or function as those in the fifth embodiment (FIG. 19), and detailed descriptions thereof are omitted. The sixth embodiment can be similarly applied to the first to fourth embodiments.

[0323] Referring to FIG. 20, the organic light-emitting display device 100F according to the sixth embodiment may include a substrate 101, a plurality of driving circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting display device 100F according to the sixth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting display device 100F according to the sixth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0324] A lens structure 193 is disposed on the third insulating layer 170. For example, the lens structure 193 is disposed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0325] The structure of the lens 193 is shown as convex, but it may also be concave. After light passes through the insulating film 170 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 and enters the lens 193, it then enters another layer provided above the lens 193 and is emitted. Through such a process, light is not totally reflected on the upper and lower surfaces of the lens 193, and is maximally emitted forward, and the lens 193 is optimized to match the refractive index of each layer through which the light passes.

[0326] Although not shown, the second insulating layer 160 can be patterned into a lens structure so that total reflection does not occur at the interface with the third insulating film 170, thereby maximizing the light extraction efficiency.

[0327] The green light emitted from the green organic light-emitting element 140g, the red light emitted from the red organic light-emitting element 140r, and the blue light emitted from the blue organic light-emitting element 140b are emitted forward through the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In such a case, the green light, red light, and blue light in the second insulating layer 160 are focused by the lens structure 193. Each lens structure 193 may be wider than the width of the second insulating layer 160.

[0328] When the second insulating layer 160 contains light-scattering particles 190, the green light, red light, and blue light scattered by the light-scattering particles 190 are focused by the lens structure 193, so that the luminance can be increased. The light-scattering particles 190 may be omitted.

[0329] Although one lens structure 193 is illustrated in the drawing, the lens structure 193 may be disposed on each upper surface of the second insulating layer 160 between the plurality of first three-dimensional structures 130-1 and the plurality of second three-dimensional structures 130-2.

[0330] FIG. 21a is a cross-sectional view schematically designing a panel of an AR product. FIG. 21b is a design data sheet for the panel design of FIG. 21a. FIG. 22 is a plan view schematically designing a panel of an AR product.

[0331] As described above, the pixel P (or sub-pixel) is designed to be smaller as the average wall angle θa is larger, which is advantageous for high resolution. FIGS. 21 and 22 are designed as the highest possible integration screen physically.

[0332] Referring to FIGS. 21 and 22, the diagonal size of the screen of the target product is 0.6", the screen ratio is 16:9, and the resolution is QHD (Quad HD).

[0333] In such a case, the integration degree of the pixels P of the panel is 4,900 ppi, and the size of the pixels P is 5.2 μm.

[0334] With such a design, the theoretical light-emitting area ratio and the target deposition angle θe are calculated. The light-emitting area ratio is a value obtained by dividing the total area of each color that emits light in the sub-pixel by the area of the pixel P. The target deposition angle θe is an angle that uses the shadow effect of the first three-dimensional structure 130-1 to deposit the desired organic light-emitting material only on a specific region of the second three-dimensional structure 130-2 and not on other regions, such as the separation region 105 and the like.

[0335] As shown in FIG. 22, the height of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be designed to be 4 μm. The width of the lower surface of each of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 in the first direction X can be designed to be 2.2 μm, and the width in the second direction Y can be designed to be 4.0 μm. The distance between the rows of the three-dimensional structures 130-1 and 130-2 can be designed to be 1.2 μm. When the vertical margin of each of the red anode electrode and the green anode electrode is 0.6 μm on the upper side and 1.0 μm on the lower side, and the interval between the rows is 1.0 μm, the total light-emitting area (anode area) is 22.4 μm 2 becomes. In such a case, the light-emitting area ratio, which is the value obtained by dividing the total light-emitting area by the pixel P area (27 μm 2 ), is calculated to be 83%.

[0336] The target deposition angle θe is 51 degrees, and the deposition angle margin may be ±6 degrees.

[0337] Normally, when compared with the fact that the light-emitting area ratio of a 500 ppi mobile phone product is 20 - 25%, in the structure of the embodiment, although the integration degree of pixel P is 10 times or more as 5,000 ppi, it is possible to manufacture a product with a light-emitting area ratio of 3 times or more. Furthermore, it can be seen that the SAD structure of the embodiment is an epoch-making technology that can improve the luminance and lifespan of the product by implementing a side-by-side structure in a product area having an integration degree of pixel P where the use of an FMM is impossible.

[0338] The above detailed description should not be construed restrictively in all aspects and should be considered exemplary. The scope of the embodiments should be determined by a reasonable analysis of the appended claims, and all changes within the equivalent scope of the embodiments are included in the scope of the embodiments.

Claims

1. A first three-dimensional structure on a substrate; a second three-dimensional structure spaced apart from the first three-dimensional structure by a spaced apart region on the substrate along a first direction; a first sub-pixel on one side of the first three-dimensional structure; a second sub-pixel on one side of the second three-dimensional structure; a third sub-pixel on the spaced apart region; a first anode separation structure below the first three-dimensional structure between the first organic light emitting device and the third organic light emitting device; a second anode separation structure below the second three-dimensional structure between the second organic light emitting device and the third organic light emitting device, The first sub-pixel includes a first organic light emitting element, The second subpixel includes a second organic light emitting element, The third sub-pixel includes a third organic light emitting element.

2. a protective layer including a plurality of insulating films on the substrate; a first auxiliary electrode between the protective layer and the first three-dimensional structure; a second auxiliary electrode between the protective layer and the second three-dimensional structure; The organic light emitting display device of claim 1 , further comprising a third auxiliary electrode between the protective layer and the third organic light emitting element.

3. The first anode isolation structure is the first anode isolation structure includes a first undercut structure formed by positioning an end of at least one protective film among the plurality of insulating films inward from a side surface of the first three-dimensional structure, The second anode isolation structure is The organic light emitting display device of claim 2 , further comprising a second undercut structure formed by locating an end of at least one of the protective layers among the plurality of insulating layers inward from a side surface of the second three-dimensional structure.

4. The first anode isolation structure is a first isolation structure is provided to isolate the first sub-pixel from the third sub-pixel by the first undercut structure, The organic light emitting display device of claim 3 , wherein the second anode isolation structure further comprises a second isolation structure isolating the second sub-pixel and the third sub-pixel by the second undercut structure.

5. The first isolation structure is a first-first isolation structure is provided between the first sub-pixel and the third sub-pixel to isolate a first anode electrode of the first organic light emitting device and a third anode electrode of the third organic light emitting device, 5. The organic light emitting display device of claim 4, wherein the second isolation structure comprises a 2-1 isolation structure that isolates the second anode electrode of the second organic light emitting element and the third anode electrode of the third organic light emitting element between the second subpixel and the third subpixel.

6. The first organic light emitting element, the second organic light emitting element, and the third organic light emitting element each include a plurality of stacks between an anode electrode and a cathode electrode; a plurality of charge generating layers between the plurality of stacks; each of the plurality of stacks of the third organic light emitting element includes a blue light emitting layer; The organic light emitting display device of claim 4 , wherein the blue light emitting layer and the charge generating layer are formed in common to the first organic light emitting element, the second organic light emitting element, and the third organic light emitting element, respectively.

7. the first isolation structure includes a first-second isolation structure that isolates the blue light emitting layer between the first subpixel and the third subpixel, The organic light emitting display device of claim 6 , wherein the second isolation structure comprises a second-2 isolation structure that isolates the blue light emitting layer between the second subpixel and the third subpixel.

8. the first isolation structure includes a first-third isolation structure that isolates the charge generation layer between the first subpixel and the third subpixel; The organic light emitting display device of claim 7 , wherein the second isolation structure comprises a second-third isolation structure that isolates the charge generation layer between the second sub-pixel and the third sub-pixel.

9. each of the first auxiliary electrode and the second auxiliary electrode includes a plurality of metal films; At least one of the plurality of metal films of the first auxiliary electrode includes a first protruding region protruding outward from a side surface of the first three-dimensional structure and contacting the first anode electrode, 2 . The organic light emitting display device of claim 1 , wherein at least one of the plurality of metal films of the second auxiliary electrode includes a second protruding region protruding outward from a side surface of the second three-dimensional structure and contacting the second anode electrode.

10. a first insulating layer on the first organic light emitting element, the second organic light emitting element, and the third organic light emitting element; a second insulating layer on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure; a third insulating layer on the second insulating layer, The organic light emitting display device of claim 1 , wherein the third insulating layer contacts an upper surface of the first three-dimensional structure and an upper surface of the second three-dimensional structure.

11. The third insulating layer is 11. The organic light emitting display device of claim 10, wherein the insulating layer is in contact with etched cross sections of the second insulating layer, the first organic light emitting layer of the first organic light emitting device, the second organic light emitting layer of the second organic light emitting device, and the third organic light emitting layer of the third organic light emitting device, and is in contact with an upper surface of the first three-dimensional structure and an upper surface of the second three-dimensional structure.

12. 12. The organic light emitting display device of claim 11, wherein the first organic light emitting layer of the first organic light emitting element, the second organic light emitting layer of the second organic light emitting element, and the third organic light emitting layer of the third organic light emitting element are separated from each other by the third insulating layer.

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