Ultrasonic Therapeutic Apparatus

Abstract

This application discloses an ultrasonic therapy device, which includes an ultrasonic therapy head and a cooling device. The ultrasonic therapy head is provided with a seal chamber, a treatment window, and a heat conduction surface provided surrounding the treatment window. The heat conduction surface contacts the treatment target site. A sound conduction medium is provided in the seal chamber. The cooling device is used to discharge the heat generated at the treatment target site. The technical solution of this application can timely conduct the heat of the treatment target site and avoid the occurrence of burns at the treatment target site.

Description

Technical Field

[0001] This application claims the priority of Chinese patent applications filed on April 20, 2023, with application number 202320974770.0, and on April 16, 2024, with application number 202410457456.4, and the entire content thereof is incorporated herein by reference in its entirety.

[0002] This application relates to the technical field of ultrasonic therapy devices, and particularly to ultrasonic therapy devices.

Background Art

[0003] When an ultrasonic therapy device treats a treatment target site, the temperature of the skin at the treatment target site rises. When the inner layer of the skin at the treatment target site is treated, the temperature reaches about 70°C, and when the surface layer of the skin at the treatment target site is treated, the temperature reaches about 50°C. If this heat is not dissipated in a timely manner, it may cause discomfort at the treatment target site of the patient and may even cause burns to the surface layer of the skin at the treatment target site of the patient.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The main object of this application is to provide an ultrasonic therapy device that aims to reduce the temperature of the treatment target site.

Means for Solving the Problems

[0005] To achieve the above object, the ultrasonic therapy device proposed by this application includes: an ultrasonic therapy head provided with a seal chamber, a treatment window, and a heat conduction surface provided around the treatment window, wherein the heat conduction surface contacts the treatment target site and a sound conduction medium is provided in the seal chamber; a cooling device for discharging the heat generated at the treatment target site.

[0006] In one embodiment, the cooling device includes a semiconductor cooling device, the semiconductor cooling device includes a semiconductor cooling sheet, a heat conduction member, and a heat dissipation member, a cold end of the semiconductor cooling sheet is in close contact with the heat conduction surface, a hot end of the semiconductor cooling sheet is in close contact with the heat conduction member, and a heat exchange end of the heat conduction member away from the semiconductor cooling sheet is connected to the heat dissipation member.

[0007] In one embodiment, the heat dissipation member is arranged as a heat dissipation sheet.

[0008] In one embodiment, the ultrasonic therapeutic apparatus further includes a handle, the handle is connected to a connection end of the ultrasonic therapeutic head away from the heat conduction surface, the heat dissipation member is provided on the handle, the heat exchange end is provided at the connection end, and the heat exchange end abuts against the heat dissipation member.

[0009] In one embodiment, the semiconductor cooling device further includes a heat dissipation fan provided on one side of the heat dissipation member.

[0010] In one embodiment, the cooling device includes a semiconductor cooling device, the semiconductor cooling device includes a semiconductor cooling sheet, a cold end of the semiconductor cooling sheet is in close contact with the heat conduction surface, and a hot end of the semiconductor cooling sheet is in close contact with the seal chamber.

[0011] In one embodiment, the cooling device includes a water cooling device, the water cooling device includes a water cooling chamber, a water supply channel, and a drainage channel, the water cooling chamber is provided inside the housing of the ultrasonic therapeutic head and is arranged close to the heat conduction surface, and the water supply channel and the drainage channel communicate with the water cooling chamber respectively.

[0012] In one embodiment, the water supply channel and the drainage channel are provided inside the housing of the ultrasonic therapeutic head.

[0013] In one embodiment, a hook, a water supply hose portion, and a drain hose portion are protruding from a connection end of the ultrasonic treatment head that is away from the heat conduction surface. The water supply hose portion communicates with the water supply channel, the drain hose portion communicates with the drain channel, and the hook is used for attaching the handle of the ultrasonic treatment device.

[0014] In one embodiment, the water supply channel and the drain channel are arranged separately from each other.

[0015] In one embodiment, the cooling device includes a heat conduction member and a semiconductor cooling sheet. One end of the heat conduction member is arranged in close contact with the semiconductor cooling sheet, the other end of the heat conduction member is in thermal contact with the heat conduction surface, and the semiconductor cooling sheet is thermally connected to the heat conduction surface through the heat conduction member. The operating current of the semiconductor cooling sheet includes a current in a first direction and a current in a second direction, and the current directions of the current in the first direction and the current in the second direction are opposite. When the operating current of the semiconductor cooling sheet is the current in the first direction when the end of the semiconductor cooling sheet that contacts the heat conduction member becomes a hot end. When the operating current of the semiconductor cooling sheet is the current in the second direction when the end of the semiconductor cooling sheet that contacts the heat conduction member becomes a cold end.

[0016] In one embodiment, the ultrasonic treatment device includes a switch that can independently control the on and / or off of the semiconductor cooling sheet.

[0017] In one embodiment, the ultrasonic treatment head includes an outer shell and an inner shell. The inner shell is disposed within the chamber of the outer shell. An ultrasonic chamber is formed within the inner shell, and an ultrasonic transducer unit is disposed within the ultrasonic chamber. The ultrasonic transducer unit emits ultrasonic waves toward the heat conduction surface. The inner shell has a first end face and a second end face that are disposed opposite to each other. An acoustic transmission window is disposed on the first end face, and the acoustic transmission window is disposed in close contact with the heat conduction surface. An insulating chamber is disposed at an interval between the outer wall of the inner shell and the inner wall of the outer shell, and an insulating member is disposed within the insulating chamber.

[0018] In one embodiment, the ultrasonic transducer unit includes a single ultrasonic transducer. The ultrasonic transducer is movably disposed within the ultrasonic chamber and emits ultrasonic waves toward the heat conduction surface.

[0019] In one embodiment, the ultrasonic transducer unit includes a plurality of ultrasonic transducers. The plurality of ultrasonic transducers are mounted in an array within the ultrasonic chamber and emit ultrasonic waves toward the heat conduction surface.

[0020] In one embodiment, the ultrasonic treatment head further includes a controller, and a temperature sensor capable of sensing the temperature of the heat conduction surface is attached. The temperature sensor is electrically connected to the controller and feeds back the detected temperature to the controller in real time, and the controller is used to control the cooling device.

[0021] The present application further proposes a control method for an ultrasonic therapeutic apparatus. In at least a part of the operating time period of the ultrasonic therapeutic apparatus, the operating current of the semiconductor cooling sheet is controlled to be a current in a first direction so that the ultrasonic energy and the heat of the semiconductor cooling sheet act at least partially overlapping on the same target tissue.

[0022] In one embodiment, while the ultrasonic therapeutic apparatus is emitting ultrasonic energy, the step of acquiring real-time treatment parameters of the target tissue, the step of determining whether the real-time treatment parameter is smaller than a first treatment parameter, if so, the step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction, if not, the step of determining whether the real-time treatment parameter is larger than a second treatment parameter, if so, the step of controlling the operating current of the semiconductor cooling sheet to be a current in a second direction, if not, the step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction are executed.

[0023] In one embodiment, the ultrasonic therapeutic apparatus has a first operating mode and a second operating mode. When the ultrasonic therapeutic apparatus is in the first operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy toward the target tissue, and the operating current of the semiconductor cooling sheet becomes a current in a first direction. When the ultrasonic therapeutic apparatus is in the second operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy toward the target tissue, and the operating current of the semiconductor cooling sheet becomes a current in a second direction. The operation sequence of the ultrasonic therapeutic apparatus includes only a first operation sequence, or at least includes a first operation sequence and a second operation sequence. In the first operation sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the first operation mode. In the second operation sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the second operation mode.

[0024] In one embodiment, the ultrasonic therapeutic apparatus has a first operation time period before emitting ultrasonic energy and / or a third operation time period after emitting ultrasonic energy. In the first operating time period, control is performed such that the operating current of the semiconductor cooling sheet becomes a current in the first direction or a current in the second direction, and in the third operating time period, control is performed such that the operating current of the semiconductor cooling sheet becomes a current in the first direction or a current in the second direction.

[0025] In one embodiment, in the third operating time period, the ultrasonic therapeutic apparatus further executes the following steps, that is, determine whether the real-time temperature of the target tissue is lower than a first temperature threshold, if so, cut off or reduce the operating current of the semiconductor cooling sheet.

Advantages of the Invention

[0026] The ultrasonic therapeutic apparatus described above includes at least the following beneficial effects, that is, The technical solution of the present application employs an ultrasonic treatment head and a cooling device. The ultrasonic treatment head is provided with a seal chamber, a treatment window, and a heat conduction surface provided to surround the treatment window. The heat conduction surface contacts the treatment target site, a sound conduction medium is provided in the seal chamber, and the cooling device contacts the heat conduction surface to discharge the heat generated at the treatment target site. Specifically, during the treatment of the ultrasonic therapeutic apparatus, the temperature of the treatment target site rises. When the surface layer of the skin of the treatment target site rises to a certain temperature, it causes burns to the surface layer of the skin of the treatment target site. In this solution, a heat conduction surface is arranged on the end face of the head of the ultrasonic therapeutic apparatus, and the cooling device is arranged to contact the heat conduction surface. The heat conduction surface contacts the treatment target site during treatment, the heat conduction surface timely takes away the heat of the treatment target site, and the cooling device also cools the heat of the heat conduction surface, avoiding the situation where the temperature of the skin surface layer of the treatment target site is too high and causes burns to the skin, or the temperature of the heat conduction surface is not timely dissipated and the temperature of the heat conduction surface is too high and causes burns to the treatment target site. As can be seen from the above, this solution can timely conduct the heat of the treatment target site and avoid the occurrence of burns at the treatment target site.

[0027] To more clearly explain the technical solutions in the embodiments of the present application or the prior art, the drawings necessary for describing the embodiments or the prior art will be briefly introduced below. The drawings in the following description are only some embodiments of the present application. It is obvious that those skilled in the art can obtain other drawings based on the structures shown in these drawings without creative labor.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0029] Regarding the realization of the object, functional features and advantages of the present application, it will be further described with reference to the accompanying drawings in conjunction with the embodiments. The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor belong to the protection scope of the present application.

[0030] Note that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to interpret the relative positional relationship, movement status, etc. between components in a specific posture (as shown in the drawings). When this specific posture changes, the corresponding directional indication will also change accordingly.

[0031] In this application, unless there are specific regulations and limitations, terms such as "connection" and "fixation" should be understood in a broad sense. For example, unless there are specific limitations, "fixation" may be a fixed connection, a removable connection, or an integral one, and may be a mechanical connection, an electrical connection, directly connected, or indirectly connected through an intermediate medium, or may be the internal communication between two elements or the interaction relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific situation.

[0032] Also, in the embodiments of this application, if there are descriptions related to "first", "second", etc., these descriptions of "first", "second", etc. are only used for the purpose of description and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Thus, the features limited by "first" and "second" can explicitly or implicitly include at least one such feature. Also, "and / or" appearing throughout the text means including three parallel solution means. Taking "A and / or B" as an example, it includes solution means A, or solution means B, or solution means where both A and B are satisfied simultaneously. Also, the technical solution means between each embodiment may be combined with each other, but it must be based on what those skilled in the art can achieve. When the combination of technical solution means conflicts with each other or cannot be achieved, such a combination of technical solution means does not exist and should be considered outside the protection scope required by this application.

[0033] This application proposes an ultrasonic therapeutic apparatus.

[0034] Referring to FIGS. 1 to 4, in one embodiment of the present application, the ultrasonic therapeutic apparatus includes an ultrasonic treatment head 100 and a cooling device. The ultrasonic treatment head 100 is provided with a seal chamber, a treatment window 110, and a heat conduction surface 120 provided to surround the treatment window 110. The heat conduction surface 120 contacts the treatment target site, a sound conduction medium is provided in the seal chamber, and the cooling device is arranged in contact with or close to the heat conduction surface 120 to discharge the heat generated at the treatment target site.

[0035] Specifically, during the treatment of the ultrasonic therapeutic apparatus, when the temperature of the treatment target site rises and the surface layer of the skin of the treatment target site rises to a certain temperature, there is a risk of causing burns to the surface layer of the skin of the treatment target site. In this solution, the heat conduction surface 120 is arranged on the end face of the head of the ultrasonic therapeutic apparatus, and the cooling device is arranged to contact the heat conduction surface 120. The heat conduction surface 120 contacts the treatment target site during treatment, the heat conduction surface 120 takes away the heat of the treatment target site, and the cooling device also cools the heat of the heat conduction surface 120, so as to avoid the situation that the temperature of the surface layer of the skin of the treatment target site is too high and causes burns to the skin, or the heat of the heat conduction surface is not dissipated in a timely manner and the temperature of the heat conduction surface is too high and causes burns to the treatment target site. As can be seen from the above, this solution can conduct the heat of the treatment target site in a timely manner and avoid the occurrence of burns at the treatment target site.

[0036] Referring to FIGS. 4 and 5, optionally, in one embodiment, the cooling device includes a semiconductor cooling device 200, the semiconductor cooling device 200 includes a semiconductor cooling sheet 210, a heat conduction member 220 and a heat dissipation member, the cold end of the semiconductor cooling sheet 210 is in close contact with the heat conduction surface 120, the hot end of the semiconductor cooling sheet 210 is in close contact with the heat conduction member 220, and the heat exchange end 221 of the heat conduction member 220 away from the semiconductor cooling sheet 210 is connected to the heat dissipation member. When in use, the temperature of the treatment target site is sequentially conducted along the heat conduction surface 120, the semiconductor cooling sheet 210, the heat conduction member 220 and the heat dissipation member, thereby dissipating heat from the ultrasonic therapeutic apparatus. Since the cooling surface of the semiconductor cooling sheet 210 is directly connected to the heat conduction surface 120, the low temperature generated on the cooling surface of the semiconductor cooling sheet 210 is balanced by the heat conducted from the treatment target site by the heat conduction surface 120, so it can be understood that a very good cooling effect is produced.

[0037] Optionally, the heat dissipation member includes a heat dissipation sheet, which has high-efficiency heat dissipation performance and relatively strong corrosion resistance, and the cost performance is relatively high, so the service life of the heat dissipation member can be increased. Specifically, the heat dissipation sheet may be a metal heat dissipation sheet or a ceramic heat dissipation sheet, and here, the heat dissipation member is not specifically limited.

[0038] Furthermore, the ultrasonic therapeutic apparatus further includes a handle, the handle is connected to the connection end of the ultrasonic therapeutic head 100 away from the heat conduction surface 120, the heat dissipation member is provided on the handle, the heat exchange end 221 is provided on the connection end, and the heat exchange end 221 abuts against the heat dissipation member. It can be understood that attaching the heat dissipation member to the handle can make the installation space of the entire cooling device larger and easier to install. Of course, the present application is not limited thereto, and in other embodiments, the heat dissipation member may be provided at the end of the ultrasonic therapeutic head 100 away from the heat conduction surface 120.

[0039] Optionally, the semiconductor cooling device 200 further includes a heat dissipation fan. The heat dissipation fan is provided on one side of the heat dissipation member. The heat conduction member 220 can transfer the thermal energy generated in the semiconductor cooling sheet 210 to the heat dissipation member located at the handle, and then use the heat dissipation fan to blow out the heat of the heat dissipation member from the ultrasonic therapeutic apparatus, thereby improving the heat dissipation efficiency.

[0040] Optionally, in the second embodiment, the cooling device includes a semiconductor cooling device. The semiconductor cooling device includes a semiconductor cooling sheet. The cold end of the semiconductor cooling sheet is in close contact with the heat conduction surface, and the hot end of the semiconductor cooling sheet is in close contact with the seal chamber. It can be understood that such a structure of the semiconductor cooling device can conduct the heat of the semiconductor cooling sheet by using a conventional sound conduction medium, thereby omitting the arrangement of the heat conduction member and saving the production cost.

[0041] Referring to FIGS. 1 to 3, in an alternative embodiment, the cooling device includes a water cooling device 300. The water cooling device 300 includes a water cooling chamber 310, a water supply channel 320, and a drainage channel 330. The water cooling chamber 310 is provided inside the housing of the ultrasonic treatment head 100 and is disposed in proximity to the heat conduction surface 120. The water supply channel 320 and the drainage channel 330 communicate with the water cooling chamber 310 respectively. During use, when circulating water enters the water cooling chamber 310 through the water supply channel 320, the heat conducted from the treatment target site by the heat conduction surface 120 is carried by the flow of the circulating water to the drainage channel 330 on the other side and discharged. Thereby, rapid and effective heat dissipation and cooling of the treatment target site are realized. Such a method of directly cooling the heat of the heat conduction surface 120 by such a circulating water cooling method has a good effect.

[0042] Optionally, the water supply channel 320 and the drainage channel 330 are provided inside the housing of the ultrasonic treatment head 100. It can be understood that providing the water supply channel 320 and the drainage channel 330 inside the housing of the ultrasonic treatment head 100 can avoid interference with the user's hand during the treatment of the ultrasonic therapy device. Of course, the present application is not limited thereto. In other embodiments, the water supply channel 320 and the drainage channel 330 may be provided outside the housing of the ultrasonic treatment head 100.

[0043] Furthermore, a hook 130, a water supply hose portion 340, and a drainage hose portion 350 are protrudingly provided at the connection end of the ultrasonic treatment head 100 away from the heat conduction surface 120. The water supply hose portion 340 communicates with the water supply channel 320, the drainage hose portion 350 communicates with the drainage channel 350, and the hook 130 is used to fasten the handle of the ultrasonic therapy device. It can be understood that the fastening and mounting process is very simple, usually only need to press once, without the need for rotational movement or the positioning operation of the product before mounting, which is quick and concise and can improve the mounting speed of the ultrasonic therapy device. Of course, the present application is not limited thereto. In other embodiments, the water supply hose portion 340 and the drainage hose portion 350 may not be protrudingly provided on the end surface of the connection end of the ultrasonic treatment head 100 away from the heat conduction surface 120.

[0044] Furthermore, a hook 130, a water supply hose portion 340, and a drainage hose portion 350 are simultaneously protrudingly provided at the connection end of the ultrasonic treatment head 100 away from the heat conduction surface 120, and anti-mistakes can be realized when the ultrasonic treatment head 100 and the handle are mounted.

[0045] Furthermore, the water cooling device 300 further includes a water tank and a water pump. The water tank and the water pump are arranged on the handle, and the water pump, the water tank, the water supply channel 320, the drainage channel 330, and the water cooling chamber 310 form a water cooling channel.

[0046] Furthermore, the water supply channel 320 and the drainage channel 330 are arranged apart from each other, so that the circulating water can flow along the path of the chamber body of the water cooling chamber 310, avoiding the water cooling chamber 310 having dead corners where the circulating water cannot reach, thereby improving the heat dissipation efficiency of the heat conduction surface 120. Of course, the present application is not limited thereto. In other embodiments, the water supply channel 320 and the drainage channel 330 may be arranged close to each other, but it is necessary to arrange a partition plate inside the water cooling chamber 310 and between the water supply channel 320 and the drainage channel 330.

[0047] In the embodiment shown in FIG. 6, the cooling device includes a semiconductor cooling sheet 210 and a heat conduction member 220. One end of the heat conduction member 220 is arranged in close contact with the semiconductor cooling sheet 210, and the other end of the heat conduction member 220 is arranged in contact with the heat conduction surface 120, and the semiconductor cooling sheet 210 is thermally connected to the heat conduction surface 120 through the heat conduction member 220. The operating current of the semiconductor cooling sheet 210 includes a current in the first direction and a current in the second direction. The current in the first direction and the current in the second direction have opposite current directions. When the operating current of the semiconductor cooling sheet 210 is the current in the first direction, the end of the semiconductor cooling sheet 210 in contact with the heat conduction member 220 becomes the hot end. When the operating current of the semiconductor cooling sheet 210 is the current in the second direction, the end of the semiconductor cooling sheet 210 in contact with the heat conduction member 220 becomes the cold end.

[0048] According to the characteristics of the semiconductor cooling sheet 210, after passing a direct current through the semiconductor cooling sheet 210, one end absorbs heat, while the other end dissipates heat, forming a hot end and a cold end. The present ultrasonic therapy device can control the cooling and heating states of the cooling device by controlling the direction of the current input to the semiconductor cooling sheet 210 to switch the cold end and the hot end of the semiconductor cooling sheet 210.

[0049] Specifically, at the start-up stage of the ultrasonic therapeutic apparatus, the operating current input to the semiconductor cooling sheet 210 is controlled to be a current in the first direction. At this time, the end in contact with the heat conduction member 220 of the semiconductor cooling sheet 210 becomes the hot end, and the end away from the heat conduction member 220 becomes the cold end. The semiconductor cooling sheet 210 is in a heating state, and the heat conduction member 220 transfers the high temperature of the hot end of the semiconductor cooling sheet 210 to the heat conduction surface 120, and then heats the surface of the skin to warm the skin. As a result, the treatment cycle quickly passes through the initial temperature rise stage, shortening the preheating time. At this start-up stage, the heating function of the semiconductor cooling sheet 210 and the ultrasonic emission of the ultrasonic therapeutic apparatus can be turned on simultaneously to improve the treatment efficiency. In another embodiment of the present application, only the heating function of the semiconductor cooling sheet is turned on at the start-up stage, and at the same time, the treatment parameters (such as temperature, impedance) of the target tissue are detected. When a certain threshold value is reached, the ultrasonic emission of the ultrasonic therapeutic apparatus may be turned on, thereby avoiding obvious pain caused by excessive energy input in the initial stage.

[0050] The control of the semiconductor cooling sheet 210 may be integrated into the control system of the ultrasonic therapeutic apparatus or simply controlled by a switch. In one embodiment, the ultrasonic therapeutic apparatus includes a switch that can independently control the on and / or off of the semiconductor cooling sheet 210. In another optional embodiment, the ultrasonic therapeutic apparatus includes a switch and a power supply that can independently control the on and / or off of the semiconductor cooling sheet 210. As a result, without turning on the ultrasonic energy and without the need for additional equipment, the heating or cooling function of the ultrasonic therapeutic apparatus, such as post-treatment warm compresses or cold compresses, can be used independently. Here, the switch may be a physical switch (such as a button on the therapeutic apparatus) or a switch of the control interface, such as a control button on the user interaction interface of the therapeutic apparatus host.

[0051] During the treatment stage of the ultrasonic therapeutic apparatus, when the temperature of the heat conduction surface 120 is higher than a preset temperature range, the operating current input to the semiconductor cooling sheet 210 is controlled to be a current in the second direction. At this time, the end in contact with the heat conduction member 220 of the semiconductor cooling sheet 210 becomes the cold end, and the end away from the heat conduction member 220 becomes the hot end. The semiconductor cooling sheet 210 is in a cooling state, and the heat conduction member 220 transfers the low temperature of the cold end of the semiconductor cooling sheet 210 to the heat conduction surface 120, thereby timely reducing the temperature of the heat conduction surface 120. When the temperature of the treatment area is lower than a preset temperature range, the operating current input to the semiconductor cooling sheet 210 is controlled to be a current in the first direction, and the semiconductor cooling sheet 210 is converted to a heating state, thereby controlling the temperature for treating the skin within a preset temperature range.

[0052] As described above, in this embodiment, by controlling the direction of the current input to the semiconductor cooling sheet 210, the cooling state and the heating state of the semiconductor cooling sheet 210 can be changed, thereby controlling the temperature of the heat conduction surface 120 within a preset temperature range, avoiding the phenomenon that the treatment temperature is too high or too low, ensuring the treatment effect while shortening the treatment time and enhancing the treatment comfort.

[0053] At this time, the cooling device may further include a heat dissipation member. The heat dissipation member is disposed on the side away from the heat conduction member 220 of the semiconductor cooling sheet 210, contacts the semiconductor cooling sheet 210 to transfer heat, and is used to dissipate heat from the semiconductor cooling sheet 210. For example, the heat dissipation member may be a heat dissipation fin, and the heat dissipation fin may be made of a metal material or a ceramic material. Alternatively, the heat dissipation member may be a heat dissipation tube, and a refrigerant may flow in the heat dissipation tube. The refrigerant circulates and flows in the heat dissipation tube, and the heat dissipation effect can be enhanced. Alternatively, the heat dissipation member may be a heat dissipation fan.

[0054] Note that the heat conduction surface 120 has a sound transmission area located in the central region and an outer ring area surrounding the sound transmission area. In one embodiment, the heat conduction member 220 may be closely attached and annularly arranged within the outer ring area. On the one hand, it ensures that the heat conduction member 220 and the heat conduction surface 120 have a sufficient contact area, and on the other hand, it meets the needs of sound wave transmission of the ultrasonic transducer. In another embodiment, the heat conduction members may be discretely distributed. For example, they may be a plurality of discrete heat conduction points, a plurality of discrete heat conduction arc structures, etc. In another embodiment, the heat conduction member 220 may include a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet is annularly arranged and closely attached to the inner wall of the outer shell 150. The second heat conduction sheet is annularly arranged and disposed at the end facing the heat conduction surface 120 of the first heat conduction sheet and is closely attached to the outer ring area. This embodiment can increase the heat conduction surface of the heat conduction member 220 and improve the heat conduction efficiency.

[0055] In an embodiment of this ultrasonic therapeutic apparatus, referring to FIG. 6, the ultrasonic treatment head 10 includes an outer shell 150 and an inner shell 140. The inner shell 140 is disposed within the chamber of the outer shell 150. An ultrasonic chamber 160 is formed within the inner shell 140. An ultrasonic transducer unit is disposed within the ultrasonic chamber 160. The ultrasonic transducer unit is immersed in the sound conduction medium and emits ultrasonic waves toward the heat conduction surface 120. The sound conduction medium may be bubble-free water or glycerin. Here, there is no specific limitation on the sound conduction medium. The ultrasonic waves emitted by the ultrasonic transducer unit act on the treatment skin through the treatment window.

[0056] The outer wall of the inner shell 140 and the inner wall of the outer shell 150 are arranged at an interval to form a heat insulation chamber 13, and a heat insulation member (not shown) is arranged in the heat insulation chamber 13. To illustrate with an example, the heat insulation member is a heat insulation film, and the heat insulation film is arranged to surround and cover the outer peripheral surface of the inner shell 140. The heat insulation film may be made of a heat insulation material such as glass wool or a vacuum heat insulation plate.

[0057] Since both the semiconductor cooling sheet 210 and the heat conduction member 220 radiate heat to the heat insulation chamber 13, the sound conduction medium in the ultrasonic chamber 160 will also be affected by the heat of this part. It is not difficult to understand that the arrangement of the heat insulation member can reduce the heat exchange between the sound conduction medium and the heat insulation chamber 13.

[0058] The ultrasonic transducer unit may include a single ultrasonic transducer 400. The ultrasonic transducer 400 is movably arranged in the ultrasonic chamber 160 and emits ultrasonic waves toward the heat conduction surface 120. For example, a sliding rail is arranged in the ultrasonic chamber 160, and the ultrasonic transducer 400 is slidably connected to the inner shell 140 via the sliding rail, thereby realizing the movement of the position. Each ultrasonic transducer 400 has a preset stroke trajectory and can reciprocate between its respective stroke start point and stroke end point, thereby radiating to a larger heat conduction surface and reducing the number of sliding times of the ultrasonic treatment head 10.

[0059] Alternatively, the ultrasonic transducer unit may include a plurality of ultrasonic transducers 400. The plurality of ultrasonic transducers 400 are mounted in an array in the ultrasonic chamber 160 and emit ultrasonic waves toward the heat conduction surface 120. By arranging the ultrasonic transducers 400 in an array, the treatment area and / or treatment energy can be increased. plusIt can also be made to. The array-type ultrasonic transducer may also be a phased array that realizes an electronic scanning focus by controlling the phase of the electrical signal of the transducer unit constituting the ultrasonic transducer.

[0060] Furthermore, the ultrasonic treatment head further includes a controller, and a temperature sensor capable of sensing the temperature of the heat conduction surface is attached. The temperature sensor is electrically connected to the controller to feedback the detected temperature to the controller in real time, and the controller is used to control the cooling device. The controller is used to control the rate of the semiconductor cooling sheet 210 or the flow of the circulating water. The arrangement of the temperature sensor and the controller makes it easier to control the adjustment of the cooling device for the heat conduction efficiency of the heat conduction surface 120, thereby preventing the heat conduction surface 120 from getting too cold or too hot and improving the comfort of use.

[0061] For the temperature sensor, a first temperature threshold and a second temperature threshold are set, and the second temperature threshold is greater than the first temperature threshold. When the temperature sensor detects that the real-time temperature of the heat conduction surface 120 is between the first threshold and the second threshold, the ultrasonic treatment device is in a normal operating state. When the temperature sensor detects that the real-time temperature of the heat conduction surface 120 is greater than the second temperature threshold, the controller controls the operating current input to the semiconductor cooling sheet 210 to be a current in the second direction, and controls the semiconductor cooling sheet 210 to cool, thereby timely reducing the temperature of the heat conduction surface 120. When the temperature sensor detects that the real-time temperature of the heat conduction surface 120 is less than the first temperature threshold, the controller controls the operating current input to the semiconductor cooling sheet 210 to be a current in the first direction, and controls the semiconductor cooling sheet 210 to heat, thereby raising the temperature of the heat conduction surface 120.

[0062] This application further proposes a control method for an ultrasonic therapeutic apparatus. The control method of this ultrasonic therapeutic apparatus includes a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction so that, in at least a part of the operating time zone of the ultrasonic therapeutic apparatus, the ultrasonic energy and the heat of the semiconductor cooling sheet at least partially overlap and act on the same target tissue.

[0063] Illustrated with examples, the ultrasonic therapeutic apparatus has an initial first operating time zone (start-up stage), a second operating time zone (treatment stage) for emitting ultrasonic energy, and a third operating time zone (temperature reduction stage) after emitting ultrasonic energy. In the first operating time zone of the ultrasonic therapeutic apparatus, the operating current of the semiconductor cooling sheet is controlled to be a current in a first direction, and the semiconductor cooling sheet 210 is heated, thereby enabling the treatment cycle to quickly pass through the initial temperature rising stage and improving the treatment efficiency. In the third operating time zone of the ultrasonic therapeutic apparatus, although the treatment process of the ultrasonic therapeutic apparatus has ended, relatively high residual heat remains in the target tissue. At this time, the operating current of the semiconductor cooling sheet is controlled to be a current in a second direction, and the semiconductor cooling sheet 210 is cooled to reduce the temperature of the target tissue and improve the comfort of the treatment.

[0064] The above-mentioned first operating time zone and third operating time zone are not essential for the steps of this application. The entire treatment process may include only one of the first operating time zone and the third operating time zone, or may include all of them, or may not include all of them, except for including the second operating time zone.

[0065] In another embodiment, in the first operating time zone, the operating current of the semiconductor cooling sheet is controlled to be a current in a second direction. This solution can cool the skin before receiving ultrasonic energy, paralyze the pain nerves, and reduce pain.

[0066] In the third operating time zone, the operating current of the semiconductor cooling sheet may be controlled to be a current in a first direction. This solution can continue to heat the skin even after receiving ultrasonic energy, uniformly diffuse heat, and enhance the treatment effect.

[0067] In one embodiment, in the first operating time period (start-up stage) and the second operating time period (treatment stage) of the ultrasonic therapeutic apparatus, the heating function of the semiconductor cooling sheet 210 and the ultrasonic emission of the ultrasonic therapeutic apparatus are simultaneously turned on to improve the treatment efficiency.

[0068] In another embodiment, only the heating function of the semiconductor cooling sheet is turned on in the start-up stage, and the treatment parameters (e.g., temperature, impedance) of the target tissue are detected. When a certain threshold value is reached, the ultrasonic emission of the ultrasonic therapeutic apparatus is turned on, thereby avoiding obvious pain caused by excessive energy input in the initial stage.

[0069] In one example of this control method, while the ultrasonic therapeutic apparatus is emitting ultrasonic energy, a step of obtaining real-time treatment parameters of the target tissue, a step of determining whether the real-time treatment parameter is smaller than a first treatment parameter, if so, a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction, if not, a step of determining whether the real-time treatment parameter is greater than a second treatment parameter, if so (i.e., the real-time treatment parameter is greater than the second treatment parameter), a step of controlling the operating current of the semiconductor cooling sheet to be a current in a second direction, if not (i.e., the real-time treatment parameter is less than or equal to the second treatment parameter), a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction are executed.

[0070] The current in the first direction and the current in the second direction have opposite current directions, and the real-time treatment parameters of the target tissue include, but are not limited to, temperature parameters such as the surface temperature, central temperature, color, and impedance of the target tissue, and image parameters. At the startup stage of the ultrasonic therapeutic apparatus, the real-time treatment parameters of the target tissue are smaller than the first treatment parameters, the operating current of the semiconductor cooling sheet becomes the current in the first direction, the semiconductor cooling sheet is in a heated state, and when the real-time treatment parameters of the target tissue reach the first treatment parameters, the ultrasonic therapeutic apparatus enters the second operating time period (operating stage). At this time, in order to avoid the real-time treatment parameters of the target tissue becoming slightly higher or slightly lower during the treatment process, it is necessary to monitor whether the real-time treatment parameters of the target tissue are greater than the second treatment parameters. If so, it indicates that the temperature of the ultrasonic energy is too high. At this time, the operating current of the semiconductor cooling sheet is controlled to be the current in the second direction, and the semiconductor cooling sheet will perform cooling. Otherwise, it indicates that the temperature of the ultrasonic energy is too low. At this time, the operating current of the semiconductor cooling sheet is controlled to be the current in the first direction, and the semiconductor cooling sheet will perform heating.

[0071] In an embodiment of this control method, the ultrasonic therapeutic apparatus has a first operating mode and a second operating mode. When the ultrasonic therapeutic apparatus is in the first operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy towards the target tissue, and the operating current of the semiconductor cooling sheet becomes the current in the first direction. When the ultrasonic therapeutic apparatus is in the second operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy towards the target tissue, and the operating current of the semiconductor cooling sheet becomes the current in the second direction. The operating sequence of the ultrasonic therapeutic apparatus includes only the first operating sequence, or at least includes the first operating sequence and the second operating sequence. In the first operating sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the first operating mode. In the second operating sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the second operating mode.

[0072] That is, in one embodiment, the ultrasonic therapeutic apparatus is only in the first operating mode, performs ultrasonic therapy on top of heating the semiconductor cooling sheet, thereby achieving the highest efficiency of heat accumulation and completing the treatment. In another embodiment, the ultrasonic therapeutic apparatus is first in the first operating mode, and then in the second operating mode. First, ultrasonic therapy is performed on top of heating to reach the optimal treatment temperature range as quickly as possible, and then temperature reduction control is performed to reduce pain, achieving both efficiency and comfort.

[0073] In this embodiment, the program of the ultrasonic therapeutic apparatus is set with the first operating mode and the second operating mode. In the first operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy outward and passes a current in the first direction through the semiconductor cooling sheet. That is, the heating function of the semiconductor cooling sheet 210 and the ultrasonic emission function of the ultrasonic therapeutic apparatus are turned on simultaneously. In the second operating mode, the ultrasonic therapeutic apparatus emits ultrasonic energy outward and at the same time passes a current in the second direction through the semiconductor cooling sheet. That is, the cooling function of the semiconductor cooling sheet 210 and the ultrasonic emission function of the ultrasonic therapeutic apparatus are turned on simultaneously. At this time, the first operating mode and the second operating mode of the ultrasonic therapeutic apparatus can be manually switched, or the ultrasonic therapeutic apparatus is preset to have the first operating sequence [0, T1] and the second operating sequence [T1, T2]. When the clock parameter T obtained by the ultrasonic therapeutic apparatus is < T1, the controller automatically controls the ultrasonic therapeutic apparatus to enter the first operating mode. When the clock parameter T obtained by the ultrasonic therapeutic apparatus is > T1, the controller automatically controls the ultrasonic therapeutic apparatus to enter the second operating mode. Of course, the automatic mode and the manual mode are simultaneously set for the ultrasonic therapeutic apparatus to make the usage method of the ultrasonic therapeutic apparatus more flexible. For example, the ultrasonic therapeutic apparatus can be controlled to complete the entire treatment process in a single first operating mode or second operating mode.

[0074] In the third operating time period, the ultrasonic treatment device further performs the following steps, that is, it determines whether the real-time temperature of the target tissue is lower than the first temperature threshold. If so, it cuts off or reduces the operating current of the semiconductor cooling sheet, and the treatment is completed.

[0075] The above is only an optional embodiment of the present application, and it does not limit the scope of the patent of the present application. Any equivalent structural transformation carried out by using the content of the specification and drawings of the present application under the concept of the invention of the present application, or direct / indirect application in other related technical fields, are all included within the scope of patent protection of the present application.

Explanation of Reference Numerals

[0076] 100 Ultrasonic treatment head 110 Treatment window 120 Heat conduction surface 130 Hook 140 Inner shell 150 Outer shell 160 Ultrasonic chamber 200 Semiconductor cooling device 210 Semiconductor cooling sheet 220 Heat conduction member 221 Heat exchange end 300 Water cooling device 310 Water cooling chamber 320 Water supply channel 330 Drainage channel 340 Water supply hose part 350 Drainage hose part 400 Ultrasonic transducer

Claims

1. An ultrasonic treatment head provided with a seal chamber, a treatment window, and a heat conduction surface provided to surround the treatment window, wherein the heat conduction surface contacts a treatment target site, and a sound conduction medium is provided in the seal chamber; an ultrasonic treatment head, and a cooling device for discharging heat generated at the treatment target site. An ultrasonic treatment apparatus characterized by the above.

2. The cooling device includes a semiconductor cooling device, the semiconductor cooling device includes a semiconductor cooling sheet, a heat conduction member, and a heat dissipation member, a cold end of the semiconductor cooling sheet is in close contact with the heat conduction surface, a hot end of the semiconductor cooling sheet is in close contact with the heat conduction member, and a heat exchange end of the heat conduction member away from the semiconductor cooling sheet is connected to the heat dissipation member. The ultrasonic treatment apparatus according to claim 1, characterized by the above.

3. The heat dissipation member is arranged as a heat dissipation sheet. The ultrasonic treatment apparatus according to claim 2, characterized by the above.

4. Further including a handle, wherein the handle is connected to a connection end away from the heat conduction surface of the ultrasonic treatment head, the heat dissipation member is provided on the handle, the heat exchange end is provided at the connection end, and the heat exchange end abuts against the heat dissipation member. The ultrasonic treatment apparatus according to claim 2, characterized by the above.

5. The semiconductor cooling device further includes a heat dissipation fan provided on one side of the heat dissipation member. The ultrasonic treatment apparatus according to claim 4, characterized by the above.

6. The cooling device includes a semiconductor cooling device, the semiconductor cooling device includes a semiconductor cooling sheet, a cold end of the semiconductor cooling sheet is in close contact with the heat conduction surface, and a hot end of the semiconductor cooling sheet is in close contact with the seal chamber. The ultrasonic treatment apparatus according to claim 1, characterized by the above.

7. The cooling device includes a water cooling device, the water cooling device includes a water cooling chamber, a water supply channel, and a drainage channel, the water cooling chamber is provided inside a housing of the ultrasonic treatment head and is arranged close to the heat conduction surface, and the water supply channel and the drainage channel communicate with the water cooling chamber respectively. The ultrasonic treatment apparatus according to claim 1, characterized by the above.

8. The water supply channel and the drainage channel are provided inside a housing of the ultrasonic treatment head. The ultrasonic treatment apparatus according to claim 7, characterized by the above.

9. At a connection end of the ultrasonic treatment head that is away from the heat conduction surface, a hook, a water supply hose portion, and a drainage hose portion are protrudingly provided. The water supply hose portion communicates with the water supply channel, the drainage hose portion communicates with the drainage channel, and the hook is used for attaching the handle of the ultrasonic treatment device. The ultrasonic treatment device according to claim 8, characterized in that.

10. The water supply channel and the drainage channel are arranged separately from each other. The ultrasonic treatment device according to claim 8, characterized in that.

11. The cooling device includes a heat conduction member and a semiconductor cooling sheet. One end of the heat conduction member is arranged in close contact with the semiconductor cooling sheet, the other end of the heat conduction member is in thermal contact with the heat conduction surface, and the semiconductor cooling sheet is thermally connected to the heat conduction surface through the heat conduction member. The operating current of the semiconductor cooling sheet includes a current in a first direction and a current in a second direction. The current directions of the current in the first direction and the current in the second direction are opposite. When the operating current of the semiconductor cooling sheet is the current in the first direction, the end of the semiconductor cooling sheet in contact with the heat conduction member becomes a hot end. When the operating current of the semiconductor cooling sheet is the current in the second direction, the end of the semiconductor cooling sheet in contact with the heat conduction member becomes a cold end. The ultrasonic treatment device according to claim 1, characterized in that.

12. The ultrasonic treatment device includes a switch capable of independently controlling the on and / or off of the semiconductor cooling sheet. The ultrasonic treatment device according to claim 11, characterized in that.

13. The ultrasonic treatment head includes an outer shell and an inner shell. The inner shell is arranged in the chamber of the outer shell. An ultrasonic chamber is formed in the inner shell, and an ultrasonic transducer unit is arranged in the ultrasonic chamber. The ultrasonic transducer unit emits ultrasonic waves toward the heat conduction surface. The inner shell has a first end face and a second end face arranged opposite to each other. An acoustic transmission window is arranged on the first end face, and the acoustic transmission window is arranged in close contact with the heat conduction surface. The outer wall of the inner shell and the inner wall of the outer shell are arranged at intervals to form a heat insulation chamber, and a heat insulation member is arranged in the heat insulation chamber. The ultrasonic treatment device according to claim 1, characterized in that.

14. The ultrasonic transducer unit includes a single ultrasonic transducer, the ultrasonic transducer is disposed movably within the ultrasonic chamber, and emits ultrasonic waves toward the heat conduction surface. The ultrasonic therapeutic apparatus according to claim 13, characterized in that.

15. The ultrasonic transducer unit includes a plurality of ultrasonic transducers, the plurality of ultrasonic transducers are mounted in an array within the ultrasonic chamber, and emit ultrasonic waves toward the heat conduction surface. The ultrasonic therapeutic apparatus according to claim 13, characterized in that.

16. The ultrasonic treatment head further includes a controller, and a temperature sensor capable of sensing the temperature of the heat conduction surface is attached, the temperature sensor is electrically connected to the controller and feeds back the detected temperature to the controller in real time, and the controller is used to control the cooling device. The ultrasonic therapeutic apparatus according to any one of claims 1 to 15, characterized in that.

17. In at least a part of the operating time zone of the ultrasonic therapeutic apparatus, a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction is included so that the ultrasonic energy and the heat of the semiconductor cooling sheet at least partially overlap and act on the same target tissue. A control method of an ultrasonic therapeutic apparatus, characterized in that.

18. While the ultrasonic therapeutic apparatus is emitting ultrasonic energy, A step of acquiring real-time treatment parameters of the target tissue; A step of determining whether the real-time treatment parameters are smaller than a first treatment parameter; If so, a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction; If not, a step of determining whether the real-time treatment parameters are greater than a second treatment parameter; If so, a step of controlling the operating current of the semiconductor cooling sheet to be a current in a second direction; If not, a step of controlling the operating current of the semiconductor cooling sheet to be a current in a first direction is executed. The control method of the ultrasonic therapeutic apparatus according to claim 17, characterized in that.

19. The ultrasonic therapeutic apparatus has a first operation mode and a second operation mode. When the ultrasonic therapeutic apparatus is in the first operation mode, the ultrasonic therapeutic apparatus emits ultrasonic energy toward a target tissue, and the operating current of the semiconductor cooling sheet becomes a current in a first direction. When the ultrasonic therapeutic apparatus is in the second operation mode, the ultrasonic therapeutic apparatus emits ultrasonic energy toward the target tissue, and the operating current of the semiconductor cooling sheet becomes a current in a second direction. The operation sequence of the ultrasonic therapeutic apparatus includes only a first operation sequence, or at least includes a first operation sequence and a second operation sequence. In the first operation sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the first operation mode. In the second operation sequence of the ultrasonic therapeutic apparatus, the ultrasonic therapeutic apparatus is controlled to enter the second operation mode. The control method of the ultrasonic therapeutic apparatus according to claim 17, characterized in that.

20. The ultrasonic therapeutic apparatus has a first operation time period before emitting ultrasonic energy and / or a third operation time period after emitting ultrasonic energy. In the first operation time period, the operating current of the semiconductor cooling sheet is controlled to be a current in a first direction or a current in a second direction. In the third operation time period, the operating current of the semiconductor cooling sheet is controlled to be a current in a first direction or a current in a second direction. The control method of the ultrasonic therapeutic apparatus according to claim 17, characterized in that.

21. The ultrasonic therapeutic apparatus is in the third operation time period. Judge whether the real-time temperature of the target tissue is lower than a first temperature threshold. If so, further execute the step of interrupting or reducing the operating current of the semiconductor cooling sheet. The control method of the ultrasonic therapeutic apparatus according to claim 20, characterized in that.

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