Connector with contact support structure

Abstract

Aspects of a connector having a contact support structure are described herein. The exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer mold insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molded interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the wafer mold insert is molded and extends into the molded interlock to secure the terminal row relative to the reference surface. In this manner, the terminal row is secured by the support bar and the wafer mold insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Provisional Patent Application No. 63 / 406,264, filed September 14, 2022, the entire contents of which are incorporated herein by reference. [Background technology]

[0002] A range of input / output (I / O) connectors are designed for power, data, and power and data interconnect systems, including board-to-board, wire-to-wire, and wire-to-board systems. Various designs exist for each system type depending on the requirements of the power and data communication environment in which the connector will be used. As an example, a wire-to-board system includes a free-end connector attached to the wire and a fixed-end connector attached to the board.

[0003] As an example, for high-data-rate applications where physical space is constrained, designing an interconnection system connector can be difficult due to several competing concerns. High-data-rate interconnection systems often rely on differentially coupled signal pairs, in which two conductors are arranged in pairs to transmit a differential signal. The transmitted signal is embodied by the electrical difference measured between the conductor pair. Differential signaling can be useful for avoiding spurious signals and crosstalk and for avoiding inadvertent signal transmission modes between adjacent signal pairs. At the connector interface, ground terminals can be relied upon to create a return path to electrical ground, to provide shielding between differential pairs, and for other purposes.

[0004] Connectors used in high-data-rate applications are typically designed to meet a wide range of mechanical and electrical requirements. High-data-rate connectors are often used in backplane applications, which require extremely high conductor density and data rates, as an example. To achieve the desired mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. The wafer assembly may include an insulating web that supports the terminal conductors within the wafer assembly. The use of wafer assemblies can be useful for manufacturing connectors capable of achieving high data rates using several different assembly processes. Regardless, it remains challenging to design wafers with the conductor density and small footprint required for high-data-rate applications in new systems while maintaining the electrical properties desired for data transmission with integrity. Summary of the Invention

[0005] Aspects of a connector having a contact support structure are described. The exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer mold insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molded interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the wafer mold insert is molded and extends into the molded interlock to secure the terminal row relative to the reference surface. In this manner, the terminal row is secured by the support bar and the wafer mold insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability. In another aspect of the embodiment, the wafer assembly support bar is embodied or formed from metal, and the wafer mold insert is embodied or formed from plastic. The wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first arm and the second arm. The first arm and the second arm define sides of a front port opening of the connector. The extension bar of the wafer assembly support bar includes a molded interlock, and at least one of the first arm and the second arm includes a reference surface.

[0006] In another aspect, the plurality of terminal conductors includes a plurality of ground conductors and a plurality of signal conductors, the wafer assembly support bar includes a plurality of terminal seating surfaces, and each conductor of the plurality of ground conductors is electrically coupled to a respective conductor of the plurality of terminal seating surfaces. The wafer assembly support bar further includes a terminal recess positioned between a pair of the plurality of terminal seating surfaces. A pair of the plurality of signal conductors extends through the terminal recess of the wafer assembly support bar surrounded by the wafer molding insert.

[0007] In another aspect of the embodiment, the connector includes a ground path assembly. The ground path assembly includes a ground channel block, and the ground channel block includes a plurality of channels. A pair of signal conductors of the plurality of terminal conductors extends along one of the plurality of channels. In one example, the ground channel block includes a metal plating on a plastic body. In another aspect, the ground channel block includes a plurality of ground ribs for surface mounting to a terminal foot of the connector. The channel extends between a pair of the plurality of ground ribs on the terminal foot of the connector. In another aspect, the ground channel block includes a ground bar extending between the plurality of ground ribs of the ground channel block and electrically coupled to the plurality of ground ribs of the ground channel block. In one example, the plurality of ground ribs are integrally formed with the ground channel block.

[0008] In another example, the ground channel block includes a metal plating on a plastic body, and the plurality of ground ribs are separate from the ground channel block and formed from metal. In another aspect, the ground path assembly further includes a ground platform frame, the major surface of the ground platform frame extending in a plane extending parallel to the major surfaces of the plurality of ground ribs on the terminal foot of the connector.

[0009] Another exemplary connector includes a wafer assembly including a terminal array and a wafer mold insert, and a wafer assembly support bar. The wafer assembly support bar includes a mold interlock, and the wafer mold insert is molded and extends into the mold interlock of the wafer assembly support bar. In one example, the wafer assembly support bar includes a terminal seating surface, and the ground conductors of the terminal array are electrically coupled to the terminal seating surface of the wafer assembly support bar. In one example, the wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first arm and the second arm, and the first arm and the second arm define sides of a front port opening of the connector. [Brief explanation of the drawings]

[0010] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals indicate corresponding parts throughout the several views.

[0011] [Figure 1] 1 is a perspective view of an exemplary connector according to various embodiments of the present disclosure. FIG. [Figure 2] FIG. 2 is a front perspective view of the connector shown in FIG. 1 without the housing, according to various embodiments of the present disclosure. [Figure 3] FIG. 2 is a rear perspective view of the connector shown in FIG. 1 without the housing, according to various embodiments of the present disclosure. [Figure 4] 2A-2C illustrate support bars of the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 5] 5 is a cross-sectional view of the support bar shown in FIG. 4 taken along line AA. [Figure 6] FIG. 2 is a detailed view of a support bar and terminal row on one side of the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 7] 2 is a detailed view of a terminal row and wafer mold insert of the connector shown in FIG. 1 according to various embodiments of the present disclosure. [Figure 8] 8 is another detailed view of the terminal row shown in FIG. 7, with the wafer mold insert omitted. [Figure 9] 2 is a top perspective view of a terminal array and a wafer mold insert in the connector shown in FIG. 1 according to various embodiments of the present disclosure. FIG. [Figure 10] 2 is a bottom perspective view of a terminal row and wafer mold insert in the connector shown in FIG. 1 according to various embodiments of the present disclosure. FIG. [Figure 11] 2 is a top perspective view of a terminal array and a wafer mold insert in the connector shown in FIG. 1 according to various embodiments of the present disclosure. FIG. [Figure 12]2 is a bottom perspective view of a terminal row and wafer mold insert in the connector shown in FIG. 1 according to various embodiments of the present disclosure. FIG. [Figure 13] 2 is a front perspective view of a ground channel block in the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. FIG. [Figure 14] FIG. 2 is a rear perspective view of a ground channel block in the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 15] FIG. 2 is a front perspective view of a ground frame in the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 16] FIG. 2 is a rear perspective view of a ground frame in the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 17] FIG. 2 is a rear perspective view of a ground frame in the connector shown in FIG. 1 according to various embodiments of the present disclosure. [Figure 18] 2 is a perspective view of a terminal foot of the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 19] 2 is a side view of a ground rib of the connector shown in FIG. 1 in accordance with various embodiments of the present disclosure. [Figure 20] 10A-10C are side views of other ground ribs according to various embodiments of the present disclosure. [Figure 21] 1A-1C illustrate connectors with grounding ribs and grounding platform frames according to various embodiments of the present disclosure. [Figure 22] 1 is a side view of a metal rib insert according to various embodiments of the present disclosure. FIG. [Figure 23] 1 illustrates a top view of a grounding platform frame according to various embodiments of the present disclosure.

[0012] Connectors are typically designed to meet a wide range of mechanical and electrical requirements. High-data-rate connectors, as an example, are often used in backplane applications, which require very high conductor densities and data rates. To achieve the desired mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. The wafer assembly may include an insulating web that supports the terminal conductors within the wafer assembly. The use of wafer assemblies can be useful for manufacturing connectors capable of high data rates using a variety of different assembly processes. Regardless, it remains difficult to design wafers and connectors with the conductor densities and small footprints required for high-data-rate applications in new systems while maintaining the electrical properties desired for data transmission with integrity.

[0013] In the context outlined above, various aspects and embodiments of connectors having contact support structures and other features are described herein. An exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer mold insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molded interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the wafer mold insert is molded and extends into the molded interlock to secure the terminal row relative to the reference surface. In this manner, the terminal row is secured by the support bar and the wafer mold insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability.

[0014] Referring to the drawings, FIG. 1 illustrates a perspective view of an exemplary connector 10 according to various embodiments of the present disclosure. The connector 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, proportions, and other characteristics of the connector 10 may vary compared to those illustrated. For example, the connector 10 may accommodate larger or smaller rows of terminals (e.g., wider or narrower), and other variations are within the scope of the embodiments described herein. For higher data rate interconnections, several connectors similar to the connector 10 may be stacked or arranged side-by-side. Additionally, as shown in the drawings and described herein, one or more of the parts or components of the connector 10 may be omitted in some cases. The connector 10 may also include other parts or components not illustrated.

[0015] Connector 10 includes a front port opening 12 and terminal feet 13. Connector 10 is designed to establish and maintain an electrical connection with contacts on a free-end interface of a cable assembly. For example, a printed circuit board (PCB)-type interface of an Octal Small Form Factor Pluggable (OSFP), Quad Small Form Factor Pluggable (QSFP), or similar cable assembly can be inserted into front port opening 12 of connector 10.

[0016] Connector 10 includes an array of terminal conductors extending from front port opening 12 to terminal feet 13 for communication of data signals on the conductors. Connector 10 is designed to provide shielding and maintain signal integrity of differential signals on the terminal conductors as the terminal conductors extend from front port opening 12 to terminal feet 13. Connector 10 may be designed for use with OSFP, QSFP, or related interconnection systems, although the concepts described herein are not limited to use with any particular type or style of interconnection system. Furthermore, terminal feet 13 of connector 10 may be designed as Surface-Mount Technology (SMT) feet for coupling to the surface of a larger board or assembly, although connector 10 may also be designed with through-hole leads or other lead styles on terminal feet 13 in some cases.

[0017] As shown in FIG. 1 , the connector includes a housing 100, support bars 220 and 320, and terminal rows 210 and 310 positioned within an opening 12. The housing 100 may be formed, in one example, from plastic or other insulating material, although the housing may also be formed, in some cases, from metal or a combination of insulating and conductive materials. The housing includes a front port 110, a bottom mounting surface 120, and mounting posts 122 and 124. The connector 10 is adapted, in one example, to receive a PCB-type end of an OSFP, QSFP, or related type cable system. The PCB-type end of the cable system may mate with the connector opening 12. When inserted, the terminal rows 210 and 310 within the housing 100, including, among other things, terminal conductors 211 and 311, seat and make electrical contact with contacts on the top and bottom surfaces of the PCB-type end.

[0018] The alignment and location of the terminal conductors within the connector 10 are particularly important. The mechanical compliance and robustness of each terminal conductor in the terminal rows 210 and 310 within the housing 100 must match each other across the terminal rows 210 and 310. Designing a connector with terminal rows that do not vary in mechanical robustness, bend or bow in the center (or other locations), or exhibit other mechanical or electrical variations can be challenging, especially when the terminal rows are relatively wide. Furthermore, when the connector 10 is mounted to the surface of a larger board or assembly, heat is often relied upon, and the application of heat can relax internal wafer-molded supports within the connector 10, altering the mechanical or electrical performance of the terminal conductors.

[0019] In the context outlined above, connector 10 includes support bars 220 and 320. Support bars 220 and 320 are formed from a material that is relatively rigid and has a high modulus of elasticity, even when heated. Among other examples described herein, support bars 220 and 320 can be formed from a metal, such as aluminum, copper, or another rigid, thermally stable metal or metal alloy. Wafer assemblies within connector 10 can be molded into the molded interlocks of support bars 220 and 320, and terminal conductors can be mechanically and electrically secured (i.e., soldered or welded) to terminal seats on support bars 220 and 320. Thus, wafer assemblies are mechanically and electrically integrated with support bars 220 and 320, providing additional strength and dimensional precision to the terminal rows within the wafer assemblies. Support bars 220 and 320 thus provide a common electrical path between the ground terminals within the terminal rows.

[0020] Additionally, as shown in FIG. 1 , the ends of support bars 220 and 320 define the sides of connector opening 12. In this configuration, the end surfaces of support bars 220 and 320 provide reference surfaces, allowing the positions of terminal conductors relative to the reference surfaces to be manufactured with greater precision. These positions can be maintained even under mechanical stress and thermal cycling. A PCB-type end of a cable system can fit into opening 12 of connector 10 and find alignment with the terminal rows of conductors within housing 100 based on contact with the reference surfaces of support bars 220 and 320. These and other features of housing 100 are described in further detail below.

[0021] Figure 2 shows a front perspective view of connector 10 shown in Figure 1, with housing 100 omitted from the view, and Figure 3 shows a rear perspective view of connector 10. Within housing 100, connector 10 includes first or upper wafer assembly 200, second or lower wafer assembly 300, support bars 220 and 320, and a ground path assembly. The assembly of connector 10 will first be described with reference to Figures 2 and 3, and then detailed views of the assembly will be described with reference to Figures 4-19.

[0022] Wafer assembly 200 includes, among other possible components, terminal row 210, flexible shields 230 and 231, and wafer mold inserts 240 and 250. Together with support bar 220, wafer assembly 200 supports, spaces, and aligns terminal conductors in terminal row 210. Connector 10 also includes a ground path assembly for wafer assembly 200. The ground path assembly for wafer assembly 200 includes upper ground channel blocks 400A and 400B and lower ground channel blocks 450A and 450B. Blocks 400A, 400B, 450A, and 450B are also shown separately in FIGS. 13 and 14. The ground path assembly also includes ground frames 410A and 410B for upper ground channel blocks 400A and 400A, respectively, and ground frames 460A and 460B for lower ground channel blocks 450A and 450B, respectively. Ground frames 410A, 410B, 460A, and 460B are also shown separately in FIGS.

[0023] Terminal row 210 includes signal conductors, power conductors, and ground conductors. Each of the signal and power conductors in terminal row 210 includes a lead contact at one distal end (i.e., positioned at front port opening 12 of connector 10 as shown in FIG. 1 ), a tail contact at the other distal end (i.e., positioned at terminal foot 13), and a conductor bend between the lead and tail contacts. The signal and power conductors of terminal row 210 are electrically insulated from each other within connector 10. The signal and power conductors begin at the lead contacts at front port opening 12 and extend to tail contacts at terminal feet 13 of connector 10. The tail contacts of the signal and power conductors can be formed as SMT tail contacts, as in the illustrated example, or as through-hole or other types of contacts.

[0024] Each ground conductor in terminal array 210 includes a lead contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the lead contacts in front port opening 12 to contacts on the ground path assembly of wafer assembly 200, as described below. The ground path assembly includes several ground ribs or fins at terminal feet 13 for surface mounting to a substrate. Further views of terminal array 210 are provided in FIGS. 9 and 10.

[0025] Terminal array 210 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat metal sheet. Optionally, the metal sheet may be plated with one or more plating metals. Wafer mold inserts 240 and 250 may be formed from a plastic, such as a liquid crystal polymer (LCP) or other insulating material, and are molded around the terminal conductors in terminal array 210. Wafer mold inserts 240 and 250 are separated from one another along the length of the terminal conductors in terminal array 210, forming a bend in terminal array 210 between wafer mold inserts 240 and 250.

[0026] Flexible shields 230 and 231 are formed (e.g., stamped, sheared, or otherwise formed) from flat metal sheets and may be plated. Flexible shields 230 and 231 are secured to the top surfaces of the ground conductors in terminal row 210 using mechanical interference, within openings through which the ground conductors pass. Flexible shields 230 and 231 span (but do not contact) the signal conductors in terminal row 210 to provide shielding for the signal conductors. Flexible shields 230 and 231 provide additional support for the ground conductors in terminal row 210 and shield the signal conductors in terminal row 210 to maintain electrical ground coupling and preserve data signal integrity. Although not shown in FIG. 2 , terminal row 310 also includes a flexible shield.

[0027] In one example, the upper ground channel blocks 400A and 400B and the lower ground channel blocks 450A and 450B can be formed as insulating blocks or bodies covered with one or more plated metals. For example, the blocks 400A, 400B, 450A, and 450B can be formed from LCP, polyethylene (PE), polytetrafluoroethylene (PTFE), conductive PE or PTFE, fluoropolymer, or other plastic or insulating material. The blocks 400A, 400B, 450A, and 450B can be plated with tin, gold, or one or more other plated metals. In other cases, the ground channel blocks 400A and 400B can be formed from metal or other conductive material, with or without plating. The signal conductors of the terminal array 210 extend into channels formed in the blocks 400A, 400B, 450A, and 450B to help prevent signal crosstalk and interference between them. Lower ground channel blocks 450A and 450B include, among other things, ground ribs, including ground ribs 451A and 452A of block 450A and ground ribs 451B and 451B of block 450B, as shown in FIG.

[0028] Referring to FIG. 3 , ground channel block 450A includes ground bar 456A, and ground channel block 450B includes ground bar 456B. Ground bars 456A and 456B can be formed from a metal, such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy, and can optionally be plated with one or more plating metals. Ground bar 456A extends between and is electrically coupled to the ground ribs of ground channel block 450A to share a ground and maintain a common potential between the ground ribs. Similarly, ground bar 456B extends between and is electrically coupled to the ground ribs of ground channel block 450B to share a ground and maintain a common potential between the ground ribs. Further aspects of the ground path assembly for wafer assembly 300 are described below.

[0029] Wafer mold inserts 240 and 250 are molded or otherwise formed around terminal row 210. Before wafer mold inserts 240 and 250 are formed, one or more of the ground conductors in terminal row 210 may be mechanically and electrically secured (e.g., soldered, welded, glued, etc.) to the terminal seating surfaces of support bar 220. Terminal row 210 and support bar 220 may then be inserted into a mold fixture, and LCP or another insulating material may be injected into the mold. The insulating material forms wafer mold inserts 240 and 250 around terminal row 210, and the insulating material also flows into the mold interlocks of support bar 220. Thus, wafer mold insert 240 is anchored and secured to support bar 220.

[0030] For example, Figures 2 and 3 show how the material of wafer molding insert 240 extends into interlocking apertures 222A of support bar 220 to form interlocking plugs 241. Support bar 220 includes several interlocking apertures, and wafer molding insert 240 extends through each of the interlocking apertures to form several interlocking plugs. In this manner, terminal row 210 is secured to support bar 220 and wafer molding insert 240. Compared to other designs, support bar 220 provides additional strength, a higher modulus of elasticity, and better thermal stability. Support bar 220 also provides additional benefits described herein. Other aspects of the arrangement of terminal row 210, support bar 220, and wafer molding insert 240 are described below.

[0031] Wafer assembly 300 includes, among other possible components, terminal row 310, a flexible shield (not shown in FIGS. 2 and 3), and wafer mold inserts 340 and 350. Together with support bar 320, wafer assembly 300 supports, spaces, and aligns the terminal conductors in terminal row 310. Connector 10 also includes a ground path assembly for wafer assembly 300. The ground path assembly for wafer assembly 300 includes upper ground channel blocks 500A and 500B and lower ground channel blocks 550A and 550B. Blocks 500A, 500B, 550A, and 550B are also shown separately in FIGS. 13 and 14. The ground path assembly also includes ground frames 510A and 510B for upper ground channel blocks 500A and 500B, respectively, and ground frames 560A and 560B for lower ground channel blocks 550A and 550B. Ground frames 510A, 510B, 560A, and 560B are also shown separately in FIGS.

[0032] Terminal row 310 includes signal conductors, power conductors, and ground conductors. Each of the signal and power conductors in terminal row 310 includes a lead contact at one distal end (i.e., positioned at front port opening 12 of connector 10 as shown in FIG. 1 ), a tail contact at the other distal end (i.e., positioned at terminal foot 13), and a conductor bend between the lead and tail contacts. The signal and power conductors of terminal row 310 are electrically insulated from each other within connector 10. The signal and power conductors originate from the lead contact at front port opening 12 and extend to the tail contact at terminal foot 13 of connector 10. As an example, signal conductor 312 extends from a lead contact 312L end at front port opening 12 to a tail contact 312T end at terminal foot 13. The tail contacts of the signal and power conductors can be formed as SMT tail contacts, as in the illustrated example, or as through-hole or other types of contacts.

[0033] Each ground conductor in terminal array 310 includes a lead contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the lead contacts in front port opening 12 to contacts on the ground path assembly of wafer assembly 300, as described below. The ground path assembly includes several ground ribs or fins at terminal feet 13 for surface mounting to a substrate. Further views of terminal array 210 are provided in FIGS. 9 and 10.

[0034] Terminal row 310 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat metal sheet. Optionally, the metal sheet may be plated with one or more plating metals. Wafer mold inserts 340 and 350 may be formed from a plastic, such as LCP or other insulating material, and are molded around the terminal conductors in terminal row 310. Wafer mold inserts 340 and 350 are separated from one another along the length of the terminal conductors in terminal row 310, forming a bend in terminal row 310 between wafer mold inserts 340 and 350.

[0035] The upper and lower ground channel blocks 500A and 500B and 550A and 550B may be formed as plastic blocks coated with one or more plated metals, in one example, although the blocks may also be formed from metal or other conductive materials. For example, the blocks 500A, 500B, 550A, and 550B may be formed from LCP, PE, PTFE, conductive PE or PTFE, fluoropolymer, or other plastic or insulating materials. The signal conductors of the terminal array 310 extend within channels formed in the blocks 500A, 500B, 550A, and 550B to help prevent signal crosstalk and interference between them. The ground channel blocks 550A and 550B include ground ribs. For example, as shown in FIG. 2, the ground channel block 550A includes, among other things, ground ribs 551A and 552A, and the ground channel block 550B includes, among other things, ground ribs 551B and 552B.

[0036] Referring to FIG. 2 , ground channel block 550A includes ground bar 556A, and ground channel block 550B includes ground bar 556B. Ground bars 556A and 556B can be formed from a metal, such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy, and can optionally be plated with one or more plating metals. Ground bar 556A extends between and is electrically coupled to the ground ribs of ground channel block 550A to share a ground and maintain a common potential between the ground ribs. Similarly, ground bar 556B extends between and is electrically coupled to the ground ribs of ground channel block 550B to share a ground and maintain a common potential between the ground ribs. Further aspects of the ground path assembly for wafer assembly 300 are described below.

[0037] Wafer mold inserts 340 and 350 are molded or otherwise formed around terminal row 310. Before wafer mold inserts 340 and 350 are formed, one or more of the ground conductors in terminal row 310 may be electrically and mechanically secured (e.g., soldered, welded, glued, etc.) to the terminal seating surface of support bar 320. When wafer mold insert 340 is molded, the insulating material of wafer mold insert 340 flows into the mold interlocks of support bar 320, anchoring and securing wafer mold insert 340 to support bar 320. This is similar to the way wafer mold insert 240 is anchored to support bar 220. In this manner, terminal row 310 is secured to support bar 320 and wafer mold insert 340. Compared to other designs, support bar 320 provides additional strength, a higher modulus of elasticity, and thermal stability. Support bar 320 also provides additional benefits described herein. Other aspects of the arrangement of terminal rows 310, support bars 320, and wafer mold inserts 340 are described below.

[0038] FIG. 4 illustrates the support bars 220 and 320 separated from one another, with all other components of the connector 10 omitted from the illustration. In FIG. 4, the support bars 220 and 320 are shown as representative examples. The size, shape, and style of the support bars 220 and 320 may vary compared to those shown. For example, the number and location of interlocking features, terminal seats, and other features on the support bars 220 and 320 may differ from those shown. The support bars 220 and 320 may be formed from metals such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys that are relatively rigid and have a high modulus of elasticity, even when heated. The support bars 220 and 320 are preferably formed from a material with a higher rigidity and modulus of elasticity than the wafer mold inserts 240, 250, 340, and 350. The support bars 220 and 320 may be formed by molding, milling, or other suitable manufacturing techniques. In some cases, the support bars 220 and 320 may be plated with one or more metals.

[0039] In the example shown in FIG. 4 , support bars 220 and 320 are formed to have the same shape and size, with support bar 320 rotated 180 degrees along axis “B” compared to support bar 220. Thus, support bars 220 and 320 are duplicates of one another and can be procured as multiples of the same part or component to reduce cost, complexity, and tooling requirements. However, in other cases, support bars 220 and 320 can differ from one another in size, shape, or both size and shape, as well as in other aspects. Support bar 220 includes a first or right-most arm 220A, a second or left-most arm 220B, and an extension bar 220C. Extension bar 220C extends between arms 220A and 220B. Right-most arm 220A and left-most arm 220B include interlocking mechanisms 221A and 221B, respectively, that are complementary in shape. In the illustrated configuration, the interlocking features of support bar 220 correspond to and mate with the interlocking features of support bar 320 so that support bars 220 and 320 are aligned with one another when seated within connector 10. Arm 220A of support bar 220 and arm 220B of support bar 320 define the sides of front port opening 12 of connector 10.

[0040] Support bar 220 includes, among other things, several molded interlocks, such as interlock apertures 222A-222F. Support bar 220 also includes, among other things, several terminal seating surfaces, such as terminal seating surfaces 223A-223C. Support bar 220 also includes terminal recesses between the terminal seating surfaces. Terminal recesses 224A and 224B are shown, among other things, between terminal seating surfaces 223A-223C in FIG. 4. Support bar 320 also includes interlock apertures, terminal seating surfaces, and terminal recesses, as shown in FIG. 4.

[0041] The ground conductors in terminal row 210 can be mechanically and electrically secured (e.g., soldered, welded, adhesively bonded, etc.) to terminal seating surfaces 223A-223C. In this manner, terminal row 210 can be secured to support bar 220 before wafer mold inserts 240 and 250 are formed. Terminal row 210 and support bar 220 can then be inserted into a mold fixture, and LCP or another insulating material can be injected into the mold. As wafer mold inserts 240 and 250 are molded around terminal row 210, the insulating material of wafer mold insert 240 also flows into interlocking apertures 222A-222F of support bar 220, anchoring and securing wafer mold insert 240 to support bar 220. Compared to other designs in which only plastic molding is used to support the rows of terminal conductors, support bar 220 provides additional strength, a higher modulus of elasticity, and thermal stability.

[0042] Similarly, the ground conductors of terminal row 310 may be mechanically and electrically secured to the terminal seats of support bar 320. Terminal row 310 may be secured to support bar 320 in this manner before wafer mold inserts 340 and 350 are formed. Once formed, the insulating material of wafer mold insert 340 flows into interlocking apertures in support bar 320, such as interlocking aperture 322D, captively securing wafer mold insert 240 to support bar 220.

[0043] Support bars 220 and 320 also include several reference surfaces from which the position and surface of the terminal conductors in terminal rows 210 and 310 are precisely set in accordance with aspects of the embodiment. For example, support bar 220 includes reference surface 226, and support bar 320 includes reference surfaces 326 and 327. Reference surfaces 226, 326, and 327 provide a surface interface (or mechanical interface or interference) that allows contacts on the PCB-style connectors to be aligned with the terminal conductors in terminal rows 210 and 310, as will be described below with reference to FIG.

[0044] Figure 5 shows a cross-sectional view AA of the support bar 320 shown in Figure 4 taken through interlocking aperture 322D. Interlocking aperture 322D is cylindrical and tapered in shape, although it can be formed in other shapes, and extends from an inner surface 329A of support bar 320 to an outer surface 329B of support bar 320. Interlocking aperture 322D includes a first, narrower, tapered aperture 328A that extends from the inner surface 329A to a location within support bar 320 and a second, wider, tapered aperture 328B that extends from within support bar 320 to outer surface 329B. Thus, interlocking aperture 322D includes a step or ledge between narrower aperture 328A and wider aperture 328B. Each of the other interlocking apertures in support bars 220 and 320 have a similar shape in one example, although support bars 220 and 320 may include different types and styles of molded interlocks.

[0045] As wafer mold insert 340 is molded around terminal row 310, insulating material of wafer mold insert 340 flows, among other things, into interlocking aperture 322D in support bar 320. Wafer mold insert 340 forms a larger cap or interlocking plug in wider aperture 328B with a mechanical interference between the plug and a step or ledge in interlocking aperture 322D. Thus, wafer mold insert 340 is secured to support bar 320 after wafer mold insert 340 is formed. Wafer mold insert 240 is also secured to support bar 220 in a similar manner based on the flow of material from wafer mold insert 240 extending into apertures 222A-222F of support bar 220.

[0046] FIG. 6 shows a detailed view of support bars 220 and 320 and terminal rows 210 and 310 on one side of connector 10. Housing 100 and flexible shields 230 and 231 are omitted from the view of FIG. 6. Support bars 220 and 320 include reference surfaces from which the positions and surfaces of terminal conductors in terminal rows 210 and 310 can be set or determined with greater precision compared to other designs. For example, support bar 220 includes reference surface 226, and support bar 320 includes reference surfaces 326 and 327. When a PCB-type end of a cable system is inserted into front port opening 12 of connector 10, the top surface of the PCB can be guided by reference surface 226, the bottom surface of the PCB can be guided by reference surface 326, and the side surface of the PCB can be guided by reference surface 327. Thus, reference surfaces 226, 326, and 327 provide a surface interface (or mechanical interference) that allows the PCB and contacts on the PCB to be aligned with the terminal conductors in terminal rows 210 and 310. Support bars 220 and 320 include reference surfaces on both the right and left sides of opening 12 in front port 110 of housing 100. Furthermore, because support bars 220 and 320 are electrically coupled to the ground conductors in terminal rows 210 and 310, support bars 220 and 320 provide a type of ground shield around terminal rows 210 and 310 within front port 110 of housing 100.

[0047] Terminal conductors 211 to 214 of terminal row 210 are referred to in Fig. 6. Terminal conductors 211 and 214 are ground conductors (also referred to as "ground conductors 211 and 214"), and terminal conductors 212 and 213 are a pair of signal conductors for differential signals (also referred to as "signal conductors 212 and 213"). Signal conductors 212 and 213 are arranged between ground conductors 211 and 214 in terminal row 210, and other pairs of signal conductors are also arranged between ground conductors in terminal row 210.

[0048] 6 shows how the top surfaces of ground conductors 211 and 214 contact terminal seats 223A and 223B of support bar 220. Ground conductors 211 and 214 can be soldered, welded, or otherwise adhered to terminal seats 223A and 223B before wafer mold insert 240 is formed. Meanwhile, signal conductors 212 and 213 pass under terminal recesses 224A in support bar 220 without contacting support bar 220. Other signal conductors in terminal row 210 also pass under terminal recesses in support bar 220.

[0049] As wafer mold insert 240 is formed, material flows into terminal recesses 224B of support bar 220, surrounding signal conductors 212 and 213 along their lengths. Material also flows into interlock apertures 222A, forming interlock plugs 241. Thus, wafer mold insert 240 electrically insulates signal conductors 212 and 213 from support bar 220 while securing signal conductors 212 and 213 to support bar 220. Based on the structural design and assembly technique of connector 10, high accuracy can be achieved between reference surfaces 226, 326, and 327 of support bar 220 and the terminal conductors in terminal row 210. Wafer assemblies 200 and 300 are secured to support bars 220 and 320, respectively, in a similar manner, which provides several advantages, including additional strength and dimensional accuracy for terminal rows 210 and 310 and wafer assemblies 200 and 300.

[0050] FIG. 7 shows a detailed view of terminal row 210 and wafer mold insert 240 of connector 10 shown in FIG. 1. In FIG. 7, housing 100, support bar 220, and upper ground channel block 400A are omitted from the view. FIG. 8 shows another detailed view of terminal row 210 shown in FIG. 7, with wafer mold insert 240 also omitted from the view. FIG. 7 shows how pairs of signal conductors, such as signal conductors 212 and 213, pass through wafer mold insert 240 (i.e., wafer mold insert 240 is formed around signal conductors 212 and 213). However, the top surfaces of ground conductors, such as ground conductors 211 and 214, are not enveloped or surrounded by wafer mold insert 240. Instead, the top surfaces of ground conductors 211 and 214 can be soldered, welded, or otherwise bonded to terminal seating surfaces 223A and 223B of support bar 220 (see FIG. 6). In this manner, the ground conductors 211 and 214 are electrically coupled to the support bar 220 .

[0051] 8 , ground frame 410A includes, among other things, ground contact platforms 411A-413A. Ground contact platforms 411A-413A are bent or otherwise formed to extend upward from a major surface of ground frame 410A. The top surfaces of ground contact platforms 411A-413A contact the bottom surfaces of ground conductors in terminal row 210 when connector 10 is assembled. For example, the top surfaces of ground contact platforms 411A and 412A contact the bottom surfaces of ground conductors 211 and 214. In this manner, ground conductors 211 and 214 are electrically coupled to ground frame 410A, which is assembled or integrated with upper ground channel block 400A, both of which are components of the ground path assembly of wafer assembly 200. The ground frame 410A, the upper ground channel block 400A, as well as the other ground frames and ground channel blocks in the connector, are described in more detail below with reference to Figures 13-16.

[0052] Ground frame 410A also includes interface apertures on the sides of the ground contact platform. For example, ground frame 410A includes interface apertures 416 and 417 on the sides of ground contact platform 411A. When connector 10 is assembled, interface plugs on wafer mold insert 240 can be positioned within the interface apertures of ground frame 410A. Ground frames 410B, 510A, and 510B also include interface apertures, and wafer mold insert 340 of wafer assembly 300 also includes interface plugs. Examples of interface plugs on wafer mold insert 240 are described below with reference to FIG. 10. Examples of interface plugs on wafer mold insert 340 are described below with reference to FIG. 11.

[0053] FIG. 9 shows a top perspective view of terminal row 210 and wafer mold inserts 240 and 250, and FIG. 10 shows a bottom perspective view thereof. Wafer mold insert 240 extends across the width "W" of terminal row 210 as shown in FIG. 9. Similarly, wafer mold insert 250 extends across the width "W" of terminal row 210 as shown in FIG. 10. Terminal row 210 and wafer mold inserts 240 and 250 are parts or components of a first or upper wafer assembly 200 within connector 10.

[0054] Terminal row 210 includes a first or right group 216 of terminal conductors, a center group 217 of terminal conductors, and a second or left group 218 of terminal conductors. Groups 216 and 217 include ground and signal conductors. Among other things, group 216 includes ground conductor 211, signal conductors 212 and 213 forming a differential pair of signal conductors, and ground conductor 214. Collectively, group 216 includes eight signal conductors and five ground conductors, with each pair of signal conductors positioned between two ground conductors. The center group of terminal conductors 217 includes power conductors and, in some cases, ground or signal conductors. Group 218 is similar to group 216 but is positioned on another side of group 217. Terminal row 310, shown in FIG. 11, is similar to terminal row 210. The pitch between lead contacts of the terminal conductors is, in one example, the same in both terminal rows 210 and 310. However, the terminal conductors of terminal row 210 may be offset from the terminal conductors of terminal row 310 such that the lead contacts alternate between the rows. In other cases, the terminal conductors in terminal rows 210 and 310 may have the same pitch and be aligned with respect to one another (i.e., not staggered). In still other cases, the terminal conductors in terminal rows 210 and 310 may have different lead contact pitches compared to one another.

[0055] FIG. 10 illustrates how the signal and power conductors of terminal row 210 extend from lead contacts in opening 12 (see FIG. 1 ) to tail contacts on terminal feet 13 of connector 10. As an example, signal conductor 212 extends from lead contact 212L to tail contact 212T of connector 10. Signal conductor 212, like the other signal and power conductors in terminal row 210, includes bend 212B between wafer mold insert 240 and wafer mold insert 250. The tail contacts of the signal and power conductors in terminal row 210 may be formed as SMT tail contacts, as shown in FIG. 10 , or may be formed as through-hole or other types of contacts. The ground conductors in terminal row 210 do not extend directly to terminal feet 13. Instead, the ground conductors extend from lead contacts in opening 12 to contacts on a ground path assembly of wafer assembly 200. The ground path assembly includes ground ribs for surface mounting to a substrate, as described below.

[0056] FIG. 10 also shows, among other things, wafer interface plugs 243 and 244 of wafer mold insert 240. The interface plugs on wafer mold insert 240 can be positioned within interface apertures of ground frame 410A when connector 10 is assembled. For example, wafer interface plugs 243 and 244 shown in FIG. 10 can be positioned within interface apertures 416 and 417 of ground frame 410A shown in FIG. 8 as part of the assembly of connector 10. The interface plugs of wafer mold insert 240 can be relied upon to secure wafer assembly 200 to the ground path assembly for wafer assembly 200. In a similar manner, as described below, the interface plugs of wafer mold insert 350 can be relied upon to secure wafer assembly 300 to the ground path assembly for wafer assembly 300.

[0057] FIG. 11 shows a top perspective view of terminal row 310 and wafer mold inserts 340 and 350, and FIG. 12 shows a bottom perspective view. Wafer mold insert 340 extends across the width "W" of terminal row 310, as shown in FIG. 11. Similarly, wafer mold insert 350 extends across the width "W" of terminal row 310, as shown in FIG. 10. Terminal row 310 and wafer mold inserts 340 and 350 are parts or components of a second or lower wafer assembly 300 within connector 10.

[0058] Terminal row 310 includes a first or right group 316 of terminal conductors, a center group 317 of terminal conductors, and a second or left group 318 of terminal conductors. Groups 316 and 317 include ground and signal conductors. For example, group 316 includes ground conductor 311, signal conductors 312 and 313 that form a differential pair of signal conductors, and ground conductor 314. Collectively, group 316 includes eight signal conductors and five ground conductors, with each pair of signal conductors positioned between two ground conductors. The center group of terminal conductors 317 includes power conductors and, in some cases, ground or signal conductors. Group 318 is similar to group 316 but is positioned on another side of group 317.

[0059] 11 also shows, among other things, wafer interface plugs 343 and 344 of wafer mold insert 340. The interface plugs on wafer mold insert 340 can be positioned within interface apertures of ground frame 410A when connector 10 is assembled. The interface plugs on wafer mold insert 340 can be relied upon to secure wafer assembly 300 to a ground path assembly for wafer assembly 300.

[0060] FIG. 12 illustrates how the signal and power conductors of terminal row 310 extend from lead contacts in opening 12 (see FIG. 1 ) to tail contacts on terminal feet 13 of connector 10. As an example, signal conductor 312 extends from lead contact 312L to tail contact 312T of connector 10. Signal conductor 312, like the other signal and power conductors in terminal row 310, includes bend 312B between wafer mold insert 340 and wafer mold insert 350. The tail contacts of the signal and power conductors in terminal row 310 can be formed as SMT tail contacts, as shown in FIG. 12 , or as through-hole or other types of contacts. Ground conductors in terminal row 310 do not extend directly to mounting interface 330. Instead, the ground conductors extend from lead contacts in opening 12 (see FIG. 1 ) to contacts on the ground path assembly of wafer assembly 300.

[0061] Figure 13 shows a front perspective view of ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B in connector 10 shown in Figure 1, and Figure 14 shows a rear perspective view of the blocks. Ground channel blocks 400A, 400B, 450A, and 450B form parts or components of the ground path assembly of wafer assembly 200, and ground channel blocks 500A, 500B, 550A, and 550B form parts or components of the ground path assembly of wafer assembly 300. Ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B are separate (i.e., not integrally formed) blocks in the example shown, although in some cases one or more of the blocks may be combined or integrally formed together. For example, blocks 400A and 450A may be formed as a single block in some cases or may be combined with other blocks. As mentioned above, ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may be formed from LCP, PE, PTFE, conductive PE or PTFE, fluoropolymer, or other plastic or insulating material.

[0062] 13 and 14, ground channel block 400A includes channels 401C-404C, and ground channel block 400B includes channels 401D-404D. When connector 10 is assembled, pairs of signal conductors of terminal row 210 extend into channels 401C-404C and 401D-404D of ground channel blocks 400A and 400B, as also shown in FIG. 3. Channels 401C-404C and 401D-404D help electrically isolate pairs of signal conductors in terminal row 210 from each other to reduce crosstalk and interference therebetween.

[0063] Similarly, ground channel blocks 500A and 500B include, among other channels, channels 501C, 502C, 501D, and 502D. Pairs of signal conductors in terminal row 310 extend, among other channels, in channels 501C and 502C in ground channel block 500A and in channels 501D and 502D in ground channel block 500B. Pairs of signal conductors in terminal row 310 also extend, among other channels, in channels 551C and 552C in ground channel block 550A and in channels 551D and 552D in ground channel block 550B. The channels in blocks 500A, 500B, 550A, and 550B help electrically isolate pairs of signal conductors in terminal row 310 from each other to reduce crosstalk and interference therebetween. The signal conductors in terminal row 310 begin at lead contacts in opening 12 (see FIG. 1), pass through channels in ground channel blocks 500A and 500B, through channels in ground channel blocks 550A and 550B, and extend to tail contacts on terminal feet 13 of connector 10.

[0064] 14, ground channel block 450A includes, among other channels, channels 451C-452C, and ground channel block 450B includes, among other channels, channels 451D-452D. Pairs of signal conductors in terminal row 210 extend within channels 451C and 452C in ground channel block 450A and channels 451D and 452D in ground channel block 450B, among other channels. The channels in blocks 450A and 450B serve to electrically isolate pairs of signal conductors in terminal row 210 from one another to reduce crosstalk and interference therebetween. Signal conductors in terminal row 210 originate from lead contacts in opening 12 (see FIG. 1), pass through channels in ground channel blocks 400A and 400B (see FIG. 3), and then through channels in ground channel blocks 450A and 450B to tail contacts on terminal feet 13 of connector 10. The channels in ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may also include shifts, bends, or other features to conform to the shifts or bends in the signal conductors extending therethrough. By way of example, Figures 13 and 14 show shifts 610 and 612, although other variations in channel direction are within the scope of the embodiments.

[0065] A subset of ground channel blocks shown in FIGS. 13 and 14 also include ground ribs on terminal feet 13 of connector 10. In the examples shown in FIGS. 13 and 14, the ground ribs are integrally formed with ground channel blocks 450A, 450B, 550A, and 550B. Ground channel blocks including separate ground ribs formed from metal may be employed in other embodiments, such as those shown in FIGS. 21-23. As shown in FIG. 13, among other things, ground channel block 550A includes ground ribs 551A and 552A, and ground channel block 550B includes ground ribs 551B and 552B. Channel 551C extends between ground ribs 551A and 552A of ground channel block 550A, and another channel of ground channel block 550A extends between pairs of ground ribs of ground channel block 550A. Channel 551D extends between ground ribs 551B and 552B, and other channels in ground channel block 550B also extend between pairs of ground ribs in ground channel block 550B.

[0066] As shown in FIG. 14 , among other things, ground channel block 450A includes ground ribs 451A and 452A, and ground channel block 450B includes ground ribs 451B and 452B. The ground ribs may be plated with tin, gold, or another metal plating suitable for surface mounting, and the ground ribs, along with the SMT tails of the signal and power terminal conductors, may be surface mounted to traces on a PCB. The ground ribs also provide shielding between the SMT tails at the mounting surface of terminal feet 13 of connector 10. The ground ribs in ground channel blocks 450A, 450B, 550A, and 550B are also described below with reference to FIGS. 18 and 19 .

[0067] 13 , ground channel block 550A also includes a ground bar 556A, and ground channel block 550B includes a ground bar 556B. Ground bar 556A extends between and is electrically coupled to the ground ribs of ground channel block 550A to share a ground and maintain a common potential between the ground ribs. Similarly, ground bar 556B extends between and is electrically coupled to the ground ribs of ground channel block 550B to share a ground and maintain a common potential between the ground ribs.

[0068] 14, ground channel block 450A also includes a ground bar 456A, and ground channel block 450B includes a ground bar 456B. Ground bar 456A extends between and is electrically coupled to the ground ribs of ground channel block 450A to share a ground and maintain a common potential between the ground ribs. Similarly, ground bar 456B extends between and is electrically coupled to the ground ribs of ground channel block 450B to share a ground and maintain a common potential between the ground ribs.

[0069] Ground bars 456A, 456B, 556A, and 556B can be formed from a metal such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy, and can optionally be plated with one or more plating metals. Ground channel blocks 450A and 450B, in one example, can be molded around ground bars 456A and 456B, or the ground bars 456A and 456B can be inserted into slots in the ends of ground ribs and secured with an interference fit, welding, adhesive, or other means. Similarly, ground channel blocks 550A and 550B, in one example, can be molded around ground bars 556A and 556B, or the ground bars 556A and 556B can be inserted into slots in the ends of ground ribs and secured with an interference fit, welding, adhesive, or other means.

[0070] Ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may also include several corresponding or mating interlocking features, such as interlocking feature 600 shown in Figure 13 and interlocking feature 601 shown in Figure 14, among others. Interlocking feature 600 may be used to position, align, and secure pairs of ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B to one another.

[0071] Figure 15 shows a front perspective view of ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B in connector 10 shown in Figure 1, and Figure 16 shows a rear perspective view of the ground frames. Ground frames 410A, 410B, 460A, and 460B form parts or components of the ground path assembly of wafer assembly 200, and ground frames 510A, 510B, 560A, and 560B form parts or components of the ground path assembly of wafer assembly 300. Ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B are separate (i.e., not integrally formed) in the illustrated example, although in some cases one or more of the ground frames may be combined and integrated. For example, ground frames 410A and 460A may optionally be formed as a single ground frame or may be combined with other ground frames.

[0072] Ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be stamped, sheared, or otherwise formed from flat metal sheets. In some cases, the metal sheets can be plated with one or more plating metals. Ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be positioned and secured to (e.g., adjacent to, between, against, etc.) wafer mold inserts 240, 250, 340, and 350 and ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B when connector 10 is assembled. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B includes two major sides that are the two largest surfaces of the ground frame. By way of example, the major sides of the ground frames 410A and 410B are identified using cross-hatched lines in FIGS. 15 and 16.

[0073] The ground frame 410A includes, among other things, ground contact platforms 411A-413A. The ground contact platforms 411A-413A are bent or otherwise formed to extend upward from a major surface of the ground frame 410A. The top surfaces of the ground contact platforms 411A-413A contact the bottom surfaces of the ground conductors in the terminal row 210 when the connector 10 is assembled. For example, the top surfaces of the ground contact platforms 411A and 412A contact the bottom surfaces of the ground conductors 211 and 214, as also shown in FIG. 8 . In this manner, the ground conductors 211 and 214 are electrically coupled to the ground frame 410A, which is assembled or integrated with the upper ground channel block 400A as part of a ground path assembly for the wafer assembly 200.

[0074] Similarly, ground frame 410B includes, among other things, ground contact platforms 411B-413B. Ground contact platforms 411B-413B are bent or otherwise formed to extend upward from the main surface of ground frame 410B. The top surfaces of ground contact platforms 411B-413B contact the bottom surfaces of the ground conductors in terminal row 210 when connector 10 is assembled. In this manner, the ground conductors in terminal row 210 are coupled to ground frame 410B, and ground frame 410B is assembled or integrated with upper ground channel block 400B as a ground pathway assembly for wafer assembly 200. Ground frames 510A and 510B also include, among other things, ground contact platforms 511A, 512A, 511B, and 512B that contact the ground terminals in terminal row 310, as shown in FIG. 17 .

[0075] As shown in FIG. 16 , ground frame 410A includes several bent tabs, including bent tab 414A, that mechanically and electrically couple with mating tabs of ground frame 460A when connector 10 is assembled using an interference fit. As an example, bent tab 414A is mechanically and electrically coupled with mating tab 461A of ground frame 460A, as shown in FIG. 16 . Ground frame 510A is also mechanically and electrically coupled with ground frame 560A, and ground frame 510B is also mechanically and electrically coupled with ground frame 560B. As shown in FIG. 17 , ground frame 560B includes several eyelets, such as eyelet 561A, and ground frame 510B includes several ground pins, such as ground pin 514B. Ground pin 514B is inserted into eyelet 561A, mechanically and electrically coupling ground frames 510B and 560B. Ground frames 510A and 510B are coupled to each other in a similar manner. 15-17 illustrate exemplary ground frames and techniques for coupling the ground frames together, other sizes, shapes, and styles of frames can be relied upon. The ground frames can also be electrically coupled together in other ways using mechanical interfaces and mating configurations.

[0076] Ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be secured to wafer mold inserts 240, 250, 340, and 350 and ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B in a variety of ways. Referring to FIG. 16 , for example, ground frame 460B includes a mounting aperture 620 at one end, and ground frame 560B includes a mounting aperture 622 at one end. Mounting posts or plugs on wafer mold inserts 250 and 350 can be molded or inserted through apertures 620 and 622 to help secure ground frames 460B and 560B in place with wafer mold inserts 250 and 350. Each of the ground frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B may include one or more mounting apertures and rely on other mechanisms to position the ground frame within the connector 10. In some cases, the mounting apertures may be omitted.

[0077] FIG. 18 shows a perspective view of terminal foot 13 of connector 10 shown in FIG. 1. As shown, ground channel blocks 450A, 450B, 550A, and 550B include ground ribs. For example, ground channel blocks 450A and 450B include, among other things, ground ribs 451A and 452A of block 450A and ground ribs 451B and 451B of block 450B. Ground channel block 550A includes, among other things, ground ribs 551A and 552A, and ground channel block 550B includes, among other things, ground ribs 551B and 552B. The ground ribs of ground channel blocks 450A, 450B, 550A, and 550B can be plated with tin, gold, or another metal plating suitable for surface mounting using tin, cadmium, zinc, indium, or other types of solder.

[0078] Because the ground ribs have a relatively large surface area, they help to electrically isolate the tail contacts or ends of the terminal conductors in terminal rows 210 and 310 to the PCB or other assembly to which connector 10 is attached to terminal feet 13. For example, tail contacts 318T and 319T are positioned between ground ribs 551B and 552B, and ground ribs 551B and 552B help to maintain electrical isolation between the signals on tail contacts 318T and 319T. Similarly, tail contacts 218T and 219T are positioned between ground ribs 451B and 452B, and ground ribs 451B and 452B help to maintain electrical isolation between the signals on tail contacts 218T and 219T.

[0079] The side contours of the ground ribs may, in some cases, be formed to follow or match the side contours of the tail contacts in terminal rows 210 and 310. For example, as shown in FIG. 19 , the side contours of ground ribs 451B and 551B follow the side contours of tail contacts 219T and 319T along bottom edge length 630 of ground rib 451B and bottom edge length 631 of ground rib 451B, respectively. Thus, when terminal feet 13 of connector 10 are placed on top of a PCB or other assembly for surface mounting, both edge lengths 630 and 631 of ground ribs 451B and tail contacts 219T and 319T of terminal rows 210 and 310 contact the PCB.

[0080] The ground ribs of connector 10 may include other features that aid in surface mounting. For example, FIG. 20 shows side views of ground ribs 451F and 551F, presenting alternative examples of ground ribs. Ground rib 451F includes curved recesses 641 and 642, and ground rib 551F includes curved recesses 643 and 644. The curved recesses 641 and 642 of ground rib 451F are located at opposite ends of a bottom edge length 650 of ground rib 451F, and the curved recesses 643 and 644 of ground rib 551F are located at opposite ends of a bottom edge length 651 of ground rib 551F. Recesses 641-644 provide areas for, for example, solder or other electrical bonds to flow around and secure the edge lengths 650 and 651 of ground ribs 451F and 551F.

[0081] FIG. 21 shows a partial view of another connector 20. Connector 20 is similar to connector 10 but includes metal ground ribs and a ground platform. In connector 20, each ground channel block includes a ground rib and a platform frame. In FIG. 21, ground channel block 450E is similar to ground channel block 450B in connector 10, as described above. However, ground channel block 450E includes ground ribs 451F-455F formed as metal rib inserts. Ground ribs 451F-455F can be formed (e.g., stamped, sheared, or otherwise formed) from a metal such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy, and can optionally be plated with one or more plated metals. A side view of ground rib 455F is shown in FIG. 22.

[0082] Ground ribs 451F-455F are not integrally formed with ground channel block 450E, as ground ribs 451B and 451B are integrally formed with ground channel block 450B. Instead, ground ribs 451F-455F fit around wafer mold insert 250E and ground channel block 450E. Wafer mold insert 250E includes several seating channels, such as seating channel 251E, among others. Ground rib 455F includes rib teeth 670 (see FIG. 22), which seat on the lower ledge of seating channel 251E to form an interference fit between ground rib 455F and wafer mold insert 250E. Ground channel block 450E also includes channels or slots, and rib tabs 680 (see FIG. 22) on ground rib 455F slide into the channels or slots of ground channel block 450E to help secure it in place. The other ground ribs 451F-454F are secured to the wafer mold insert 250E and ground channel block 450E in a similar manner.

[0083] The example shown in FIG. 21 also includes a grounding platform frame 640. At least one major surface of the grounding platform frame 640 extends in a plane parallel to the major surfaces of the grounding ribs 451F-455F. For reference, the major surfaces of the grounding platform frame 640 are identified using cross-hatched lines in FIG. 21, and the major surface of the grounding rib 455F is identified using cross-hatched lines in FIG. 22. The grounding platform frame 640 includes several openings 690-693 (see FIG. 23) and a shared bar 649 (see FIG. 23) that extends across the grounding ribs 451F-455F and over the tail ends of the signal conductors, as shown in FIG. 21. The grounding platform frame 640 can be formed from a metal, such as aluminum, copper, zinc, stainless steel, or other metal or metal alloy, and can optionally be plated with one or more plating metals.

[0084] FIG. 22 shows a side view of the ground rib 455F, and FIG. 23 shows a top view of the ground platform frame 640. The ground rib 455F includes a bottom edge length 660 for surface mounting. The bottom edge length 660 of the ground rib 455F can have other side profile shapes or styles, including angled lengths, compared to those shown. The bottom edge length 660 includes a curved recess 661, for example, to provide an area for solder to flow. The bottom edge length 660 of the ground rib 455F can also optionally have additional recesses, similar to the example shown in FIG. 20.

[0085] The grounding rib 455F also includes a rib tab 680. The rib tab 680 can be inserted into a channel or slot in the grounding channel block 450E (see FIG. 21), with the abutting edge of the rib tab 680 contacting the back surface within the channel or slot. The rib tab 680 also extends into channel 646 in the grounding platform frame 640, as shown in FIG. 23. The rib tabs of other grounding ribs can extend into other channels within the grounding platform frame 640. For example, the rib tab of the grounding rib 454F can extend into channel 647 of the grounding platform frame 640, etc.

[0086] The ground rib 455F also includes rib teeth 670 that seat within the lower ledge of the seating channel 251E of the wafer mold insert 250E (see FIG. 21 ), forming an interference fit between the ground rib 455F and the wafer mold insert 250E. In addition, the ground rib 455F includes a shared channel 672. Referring to FIGS. 22 and 23 , an interlocking region 695 of the ground platform frame 640 is inserted into the shared channel 672 of the ground rib 455F when the connector is assembled. A similar interlocking region of the ground platform frame 640 can be inserted into the shared channels of the ground ribs 451F-454F. The shared teeth 671 of the ground rib 455F seat against the leading edge 648 of the interlocking region 695 to electrically and mechanically secure the ground rib 455F to the ground platform frame 640. As shown in FIG. 21, when the connector 20 is assembled, the signal conductors can extend downward through openings 690-693 in the grounding platform frame 640, with the shared bar 649 extending across the grounding ribs 451F-455F and over the tail ends of the signal conductors.

[0087] Terms such as "top," "bottom," "side," "front," "back," "right," and "left" are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to distinguish particular features relative to one another as the orientation of structures described herein may vary. Terms such as "comprising," "including," and "having" are synonymous and are used open-endedly and do not exclude additional elements, features, acts, operations, etc. Additionally, the term "or" is used in an inclusive rather than exclusive sense; thus, for example, when used to connect elements in a list, the term "or" may refer to one, some, or all of the elements in the list.

[0088] Combination language such as "at least one of X, Y, and Z" or "at least one of X, Y, or Z," unless otherwise indicated, is generally used to identify one, any two, or all three (or more if a larger group is identified), such as X and X only, Y and Y only, and Z and Z only, combinations of X and Y, combinations of X and Z, and combinations of Y and Z, and all of X, Y, and Z. Such combination language is not generally intended to require identifying or including at least one X, at least one Y, and at least one Z, unless specified. The terms "about" and "substantially," unless otherwise defined herein as associated with a specific range, percentage, or related measure of deviation, take into account at least some manufacturing tolerances between the theoretical design and the manufactured product or assembly, such as the geometric dimensioning and tolerance criteria set forth in American Society of Mechanical Engineers (ASME®) Y14.5 and related International Organization for Standardization (ISO®) standards. As one skilled in the art will understand, even in connection with the use of theoretical terms such as geometric "perpendicular," "orthogonal," "vertex," "collinear," "coplanar," and other terms, "about," "substantially," or related terms, such manufacturing tolerances are still assumed even if not explicitly referenced.

[0089] The above-described embodiments of the present disclosure are merely exemplary implementations intended to provide a clear understanding of the principles of the present disclosure. Many changes and modifications can be made to the above-described embodiments without substantially departing from the spirit and principles of the present disclosure. Furthermore, components and features described with respect to one embodiment can be included in another embodiment. All such modifications and variations are intended to be included herein within the scope of the present disclosure.

Claims

1. A connector, Housing and a wafer assembly including a terminal array and a wafer molding insert, the terminal array including a plurality of terminal conductors; a wafer assembly support bar, the wafer assembly support bar comprising a terminal seating surface, a reference surface, and a molded interlock; one of the plurality of terminal conductors is electrically coupled to a terminal seat surface of the wafer assembly support bar; The wafer mold insert extends into a mold interlock of the wafer assembly support bar to secure the terminal array relative to the reference surface.

2. the wafer assembly support bar comprises metal; The connector of claim 1 , wherein the wafer mold insert comprises plastic.

3. the wafer assembly support bar comprises a first arm, a second arm, and an extension bar extending between the first arm and the second arm; The connector of claim 1 , wherein the first and second arms define sides of a port opening in the connector.

4. an extension bar of the wafer assembly support bar including the molded interlock; The connector of claim 3 , wherein at least one of the first arm and the second arm comprises the reference surface.

5. the plurality of terminal conductors includes a plurality of ground conductors and a plurality of signal conductors; the wafer assembly support bar includes a plurality of terminal seats; The connector of claim 1 , wherein each of the plurality of ground conductors is electrically coupled to a respective one of the plurality of terminal seats.

6. The connector of claim 5 , wherein the wafer assembly support bar further comprises a terminal recess positioned between a pair of the plurality of terminal seating surfaces.

7. 7. The connector of claim 6, wherein a pair of signal conductors of said plurality of signal conductors are surrounded by said wafer mold insert and extend through terminal recesses in said wafer assembly support bar.

8. a ground path assembly; The ground path assembly includes a ground channel block; the ground channel block includes a plurality of channels; The connector of claim 1 , wherein a pair of signal conductors of the plurality of terminal conductors extend along one of the plurality of channels.

9. The connector of claim 8 , wherein the ground channel block comprises a metal plating on a plastic body.

10. the ground channel block includes a plurality of ground ribs for surface mounting to terminal feet of the connector; The connector of claim 8 , wherein the channel extends between a pair of the plurality of ground ribs at a terminal foot of the connector.

11. The connector of claim 10 , wherein the ground channel block comprises a ground bar extending between and electrically coupled to a plurality of ground ribs of the ground channel block.

12. The connector of claim 10 , wherein the plurality of ground ribs are integrally formed with the ground channel block.

13. the ground channel block includes a metal plating on a plastic body; The connector of claim 10 , wherein the plurality of ground ribs are separate from the ground channel block and are formed from metal.

14. the ground path assembly further includes a ground platform frame; 14. The connector of claim 13, wherein a major surface of the grounding platform frame extends in a plane extending parallel to major surfaces of the plurality of grounding ribs at the terminal foot of the connector.

15. A connector, a wafer assembly including a terminal array and a wafer molding insert; a wafer assembly support bar with a molded interlock, wherein the wafer mold insert extends into the molded interlock of the wafer assembly support bar.

16. the wafer assembly support bar further comprises a terminal seat; 16. The connector of claim 15, wherein the ground conductors of the terminal rows are electrically coupled to the terminal seats of the wafer assembly support bar.

17. the wafer assembly support bar comprises metal; the wafer mold insert comprises plastic; the wafer assembly support bar comprises a first arm, a second arm, and an extension bar extending between the first arm and the second arm; The connector of claim 15, wherein the first and second arms define sides of a front port opening of the connector.

18. a ground path assembly; The ground path assembly includes a ground channel block; the ground channel block includes a channel; 16. The connector of claim 15, wherein a pair of signal conductors of the terminal row extend along the channel.

19. the ground channel block includes a plurality of ground ribs for surface mounting to terminal feet of the connector; 20. The connector of claim 18, wherein the channel extends between a pair of ground ribs on a terminal foot of the connector.

20. 20. The connector of claim 19, wherein the ground channel block comprises a ground bar extending between and electrically coupled to a plurality of ground ribs of the ground channel block.

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