Method and apparatus for processing a substrate in a cleaning module

Abstract

FIELD OF THE INVENTION [0002] Embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to cleaning systems, cleaning system hardware, and associated methods that may be used to transfer substrates and clean surfaces of substrates. According to one embodiment, a blade handling assembly for handling substrates in a cleaning system includes a gripping assembly including a pair of gripping blades operable to hold a substrate at its ends by a gripping actuator. The assembly includes a first blade actuator for moving the gripping assembly and the substrate between a horizontal orientation and a vertical orientation using a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and the substrate 180 degrees using a second axis, thereby orienting the substrate in the opposite direction. Movement using the first axis results in rotation of the first and second blade actuators, while movement using the second axis results in rotation of only the second blade actuator.

Description

[Technical Field]

[0001] FIELD OF THE INVENTION The embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to substrate processing systems that may be used to clean the surface of a substrate. [Background technology]

[0002] Substrate processing systems can perform chemical mechanical polishing (CMP), which is commonly used to planarize or polish material layers deposited on substrates during the manufacture of high-density integrated circuits. In a typical CMP process, a substrate is held in a carrier head, which presses the backside of the substrate against a rotating polishing pad in the presence of a polishing fluid. The combination of the polishing fluid and the chemical and mechanical activity caused by the relative motion of the substrate and polishing pad removes material across the surface of the material layer of the substrate in contact with the polishing pad. Typically, after one or more CMP processes are completed, the polished substrate is further processed using one or more post-CMP substrate processing steps in a CMP processing system. For example, the polished substrate can be further processed using one or more cleaning processes in a cleaning unit. Various cleaning processes can be performed in a cleaning unit having multiple cleaning stations, i.e., cleaning chambers. Once post-CMP processing is complete, the substrate can be removed from the CMP processing system and sent to a subsequent device manufacturing system (such as a lithography, etch, or deposition system).

[0003] In cleaning units with multiple cleaning chambers, the space available for transferring substrates between the various chambers is limited. This space limitation problem is exacerbated when substrates must be manipulated between vertical and horizontal positions to insert and remove them from various types of chambers. For example, some first cleaning chambers require the substrate to be inserted in a horizontal orientation, while some second cleaning chambers (such as those typically encountered after cleaning in the first cleaning chamber) require a vertical orientation. Subsequent transfer of the substrate from the vertically oriented cleaning chamber to another horizontally oriented cleaning chamber requires the substrate to be oriented back to a horizontal position. Furthermore, each chamber requiring a horizontal substrate orientation requires the substrate to be oriented "device side up," i.e., with the side containing the semiconductor devices facing upward. A major challenge when cleaning enclosures is minimizing the substrate's exposure to air between cleaning stations to prevent oxidation and particulate matter. For this reason, the chambers are placed as close together as possible, leaving little room for a robotic-like device to pick up a substrate, turn it around, and insert it into another chamber.

[0004] Typically, a substrate enters a CMP tool's cleaning unit from a polishing apparatus, where it is inserted into and acted upon by a first cleaning chamber. The substrate then moves to one or more secondary cleaning chambers and then to a final cleaning chamber. As the substrate becomes increasingly "clean" as it moves through the process, the final transfer from the secondary cleaning chamber to the final cleaning chamber is the most critical, as it creates the greatest opportunity for oxidation and contamination over time and handling.

[0005] What is needed is an apparatus that can manipulate a substrate between two degrees of rotation during a given step of the cleaning process, thereby reducing the footprint of the cleaning enclosure and, consequently, the time required to move the substrate between chambers late in the process. In one example, particles can accumulate on the substrate while it is being transferred from the second cleaning chamber to the drying chamber. Thus, the post-CMP cleaning process may not provide optimal particle-free performance.

[0006] Therefore, what is further needed is an improved final drying process in the final cleaning chamber. Therefore, what is needed in the art is an apparatus and method for solving the above problems. Summary of the Invention

[0007] FIELD OF THE INVENTION The embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to cleaning systems and associated methods that may be used to clean surfaces of substrates in semiconductor device manufacturing processes.

[0008] In one embodiment, a substrate cleaning unit includes a pre-cleaning module configured to perform a pre-cleaning process on a horizontally oriented substrate. The unit includes a first cleaning chamber configured to perform a first cleaning process on a vertically oriented substrate. The unit includes a second cleaning chamber configured to perform a second cleaning process on a vertically oriented substrate. The unit includes an integrated cleaning and drying module configured to perform a cleaning and drying process on a horizontally oriented substrate. The unit includes a substrate handler configured to transfer a substrate from the pre-cleaning chamber to the first cleaning chamber, from the first cleaning chamber to the second cleaning chamber, and from the second cleaning chamber to the integrated cleaning and drying module. The first cleaning chamber and the second cleaning chamber are located below the pre-cleaning module.

[0009] In another embodiment, a substrate cleaning system includes a first substrate cleaning unit, a second substrate cleaning unit, and a first substrate handler configured to transfer a substrate from a polishing system to one of the first and second substrate cleaning units. Each of the units includes a pre-cleaning module configured to receive a substrate from the first substrate handler and perform a pre-cleaning process on a horizontally oriented substrate. Each of the units includes a first cleaning chamber configured to perform a first cleaning process on a vertically oriented substrate. Each of the units includes a second cleaning chamber configured to perform a second cleaning process on a vertically oriented substrate. Each of the units includes an integrated cleaning and drying module configured to perform a cleaning and drying process on a horizontally oriented substrate. Each of the units includes a second substrate handler configured to transfer a substrate from the pre-cleaning module to the first cleaning chamber, from the first cleaning chamber to the second cleaning chamber, and from the second cleaning chamber to the integrated cleaning and drying module. The first and second cleaning chambers are located below the pre-cleaning module.

[0010] In yet another embodiment, a method for cleaning a substrate includes transferring the substrate to a pre-cleaning module in a substrate cleaning system using a first substrate handler. The method includes performing a pre-cleaning process on the horizontally oriented substrate in the pre-cleaning module. The method includes transferring the substrate from the pre-cleaning module to a first cleaning chamber in the substrate cleaning system using a second substrate handler. The method includes performing a first cleaning process on the vertically oriented substrate in the first cleaning chamber. The method includes transferring the vertically oriented substrate from the first cleaning chamber to a second cleaning chamber in the substrate cleaning system using the second substrate handler. The method includes performing a second cleaning process on the vertically oriented substrate in the second cleaning chamber. The method includes transferring the substrate from the second cleaning chamber to an integrated cleaning and drying module in the substrate cleaning system using the second substrate handler. The method includes performing cleaning and drying processes on the horizontally oriented substrate using the integrated cleaning and drying module. The first and second cleaning chambers are located below the pre-cleaning module.

[0011] In another embodiment, a method for processing a substrate in a substrate processing system includes translating a substrate held by a first blade assembly from a processing region of a first cleaning chamber, the first blade assembly being connected to a first vertical motion actuator and a first horizontal motion actuator, and the substrate held by the first blade assembly being oriented in a horizontal orientation with the device side up. The method includes using the first blade actuator of the first blade assembly to rotate the substrate and the first blade assembly 90 degrees from the horizontal orientation to a vertical orientation. The method includes using the second blade actuator of the first blade assembly to rotate the substrate and the first blade assembly 180 degrees to orient the device side of the substrate in the opposite direction while the substrate is positioned or being positioned in the vertical orientation. The method includes using the first horizontal motion actuator to translate the vertically oriented substrate and the first blade assembly along a horizontal axis to a position above a second cleaning chamber. The method includes using the first vertical motion actuator to insert the substrate into a processing region of the second cleaning chamber. The method includes translating the blade assembly along a horizontal axis to a third cleaning chamber using a first horizontal motion actuator. The method includes transferring a substrate from the second cleaning chamber to the third cleaning chamber using a second vertical motion actuator and a second blade assembly connected to the second horizontal motion actuator. The method includes removing a substrate from a processing region of the third cleaning chamber using the first blade assembly and the first vertical motion actuator. The method includes using the first blade actuator of the blade assembly to rotate the substrate and first blade assembly 90 degrees from a vertical orientation to a horizontal orientation, where the substrate oriented in the horizontal orientation is oriented device side up. The method includes inserting the substrate and first blade assembly into a processing region of a fourth cleaning chamber using the first horizontal motion actuator.

[0012] In another embodiment, a blade handling assembly for handling a substrate includes a gripping assembly including a pair of gripping blades operable to hold a substrate at its ends by a gripping actuator. The assembly includes a first blade actuator for moving the gripping assembly and substrate between horizontal and vertical orientations using a first axis. The assembly includes a second blade actuator for moving the gripping assembly and substrate 180 degrees using a second axis, thereby orienting the substrate in the opposite direction. Movement using the first axis results in rotation of the gripping actuator and the second blade actuator, while movement using the second axis results in rotation of only the gripping actuator.

[0013] In another embodiment, a blade handling assembly for handling a substrate includes a gripping assembly including a pair of gripping blades operable by a gripping actuator to hold a substrate at its ends. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation. The assembly includes a second blade actuator for moving the gripping assembly and substrate 180 degrees, thereby orienting the substrate in the opposite direction. The assembly includes a first cleaning chamber disposed on a first side of the assembly. The assembly includes a second cleaning chamber disposed on a second side of the assembly. The horizontal distance between the chambers is 115% to 150% of the length of the gripping assembly and substrate when oriented in a horizontal position.

[0014] Embodiments of the present disclosure may also include a substrate handling apparatus comprising: a first blade assembly; a first vertical actuator assembly including a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; and a horizontal actuator assembly including a horizontal rail and a first rail actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal rail and configured to be positioned along the horizontal rail by the first rail actuator. The first blade assembly includes a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during a first transfer process, a first blade actuator for rotating the gripping assembly about a first axis, and a second blade actuator configured to rotate the gripping assembly about a second axis, the second axis being substantially parallel to the front surface of the substrate, wherein rotation by the first blade actuator about the first axis results in rotation of the second blade actuator and the gripping assembly, and rotation by the second blade actuator about the second axis results in rotation of the gripping assembly.

[0015] Embodiments of the present disclosure may also include a substrate handling apparatus including: a gripping assembly including a pair of gripping blades operable to hold a substrate at its ends by a gripping actuator; a first blade actuator for rotating the gripping assembly and the substrate about a first axis, the first axis being substantially parallel to a front surface of the substrate held at its end; a second blade actuator for rotating the gripping assembly and the first blade actuator about a second axis; a first cleaning module having a first side; and a second cleaning module having a first side, wherein the gripping assembly is disposed between the first side of the first cleaning module and the first side of the second cleaning module. When the first axis is oriented perpendicular to the first side of the first cleaning module and the first side of the second cleaning module, the distance between the first side of the first cleaning module and the first side of the second cleaning module is 102% to 150% of the total length of the gripping assembly and the held substrate.

[0016] Embodiments of the present disclosure may also include a substrate handling apparatus comprising: a first blade assembly; a first vertical actuator assembly including a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a second blade assembly; a second vertical actuator assembly including a second vertical rail and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; and a horizontal actuator assembly. The first blade assembly includes a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during a first transfer process; a first blade actuator for rotating the gripping assembly about a first axis, where rotating the gripping assembly about the first axis is configured to rotate the substrate between a horizontal orientation and a vertical orientation during the first transfer process; and a second blade actuator configured to rotate the gripping assembly about a second axis, where the second axis is substantially parallel to a front surface of the substrate, where rotating the gripping assembly about the second axis is configured to orient the front surface of the substrate in an opposite direction during the first transfer process, where rotation by the first blade actuator about the first axis results in rotation of the second blade actuator and the gripping assembly, and rotation by the second blade actuator about the second axis results in rotation of the gripping assembly. The second blade assembly includes a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during the second transfer process.The horizontal actuator assembly includes a horizontal rail, a first horizontal rail actuator, and a second horizontal rail actuator, the first vertical actuator assembly being coupled to a first portion of the horizontal rail and configured to be positioned along the horizontal rail by the first horizontal rail actuator, and the second vertical actuator assembly being coupled to a second portion of the horizontal rail and configured to be positioned along the horizontal rail by the second horizontal rail actuator.

[0017]

[0010] Embodiments of the present disclosure may also include a substrate cleaning system, the substrate cleaning system comprising: a first substrate cleaning unit; and a first substrate handler disposed between the first substrate cleaning unit and configured to transfer a substrate from the polishing system to the first substrate cleaning unit. The first substrate cleaning unit includes a first cleaning chamber configured to receive a substrate from the first substrate handler and perform a first cleaning process on a horizontally oriented substrate, a second cleaning chamber configured to perform a second cleaning process on a vertically oriented substrate, a third cleaning chamber configured to perform a third cleaning process on a vertically oriented substrate, and a fourth cleaning chamber configured to perform a fourth cleaning process on a horizontally oriented substrate; and the second substrate handler configured to transfer the substrate from the first cleaning chamber to the second cleaning chamber, from the second cleaning chamber to the third cleaning chamber, and from the third cleaning chamber to the fourth cleaning chamber.

[0018] Embodiments of the present disclosure may also include a substrate cleaning system, the substrate cleaning system including a first substrate cleaning unit, a second substrate cleaning unit, and a first substrate handler disposed between the first substrate cleaning unit and the second substrate cleaning unit, the first substrate handler configured to transfer a substrate from the polishing system to one of the first substrate cleaning unit and the second substrate cleaning unit. The first substrate cleaning unit and the second substrate cleaning unit each include a first cleaning module configured to receive a substrate from the first substrate handler and perform a first cleaning process on the horizontally oriented substrate, a second cleaning module configured to perform a second cleaning process on the vertically oriented substrate, a third cleaning module configured to perform a third cleaning process on the vertically oriented substrate, a fourth cleaning module configured to perform a fourth cleaning process on the horizontally oriented substrate, and a second substrate handler configured to transfer the substrate from the first cleaning module to the second cleaning module, from the second cleaning module to the third cleaning module, and from the third cleaning module to the fourth cleaning module. Each of the first substrate cleaning unit and the second substrate cleaning unit can further include a fifth cleaning module configured to perform a fifth cleaning process on the vertically oriented substrate, where the fifth cleaning process is performed sequentially between performing the third cleaning process in the third cleaning module and performing the fourth cleaning process in the fourth cleaning module.

[0019] Embodiments of the present disclosure may also include a method of cleaning a substrate using the following activities: transferring a substrate to a first cleaning module in a substrate cleaning system using a first substrate handler, performing a first cleaning process on the substrate in a first orientation in the first cleaning module, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system using a second substrate handler, where transferring the substrate includes changing the orientation of the substrate from the first orientation to a second orientation, performing a second cleaning process on the substrate in the second orientation in the second cleaning module, and performing a second cleaning process on the substrate in the substrate cleaning system using the second substrate handler. The method includes transferring the substrate from the cleaning chamber to a third cleaning module, performing a third cleaning process on the substrate in the second orientation in the third cleaning module, transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system using a second substrate handler, wherein the transferring includes changing the orientation of the substrate from the second orientation to the first orientation, and then performing the fourth cleaning process on the substrate in the first orientation using the fourth cleaning module, wherein the second cleaning module or the third cleaning module is positioned vertically lower than the first cleaning module.

[0020] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following activities: transferring a substrate to a first cleaning module in a substrate cleaning system using a first substrate handler, performing a first cleaning process on the substrate in a first orientation in the first cleaning module, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system using a second substrate handler, wherein the transferring includes rotating the substrate about a first axis, thereby changing the orientation of the substrate from the first orientation to a second orientation, transferring and translating the substrate in the first direction, performing a second cleaning process on the substrate in the second orientation in the second cleaning module, and transferring a second cleaning module in the substrate cleaning system using the second substrate handler. transferring the substrate in the second orientation from the chamber to a third cleaning module, the transferring including translating the substrate in a second direction, the second direction being opposite to the first direction; performing a third cleaning process on the substrate in the second orientation in the third cleaning module; transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system using a second substrate handler, the transferring including rotating the substrate about a first axis, thereby changing an orientation of the substrate from the second orientation to a third orientation; and then performing a fourth cleaning process on the substrate in the first orientation using the fourth cleaning module.

[0021] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following activities: The following activities include using a first substrate handler to transfer a substrate to a first cleaning module in the substrate cleaning system and performing a first cleaning process on the horizontally oriented substrate in the first cleaning module; using a second substrate handler to transfer a substrate from the first cleaning module to a second cleaning module in the substrate cleaning system and performing a second cleaning process on the vertically oriented substrate in the second cleaning module; using the second substrate handler to transfer the vertically oriented substrate from the second cleaning module to a third cleaning module in the substrate cleaning system and performing a third cleaning process on the vertically oriented substrate in the third cleaning module; using the second substrate handler to transfer a substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system and performing a fourth cleaning process on the horizontally oriented substrate using the fourth cleaning module, wherein the second cleaning module or the third cleaning module is positioned vertically below the first cleaning module.

[0022] Embodiments of the present disclosure may also include a method of cleaning a substrate using the following activities: transferring a substrate to a first cleaning module in a substrate cleaning system using a first substrate handler, performing a first cleaning process on the substrate in a first orientation in the first cleaning module, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system using a second substrate handler, wherein the transferring includes rotating the substrate about a first axis, thereby changing the orientation of the substrate from the first orientation to a second orientation, transferring and translating the substrate in the first direction, performing a second cleaning process on the substrate in the second orientation in the second cleaning module, and performing a second cleaning process on the substrate in the second orientation in the substrate cleaning system using the second substrate handler. transferring the substrate in the second orientation from the second cleaning chamber to a third cleaning module, the transferring including translating the substrate in a second direction, the second direction being opposite to the first direction; performing a third cleaning process on the substrate in the second orientation in the third cleaning module; transferring the substrate from the third cleaning chamber to a fourth module in the substrate cleaning system using a second substrate handler, the transferring including rotating the substrate about a first axis, thereby changing the orientation of the substrate from the second orientation to a third orientation; and performing a fourth cleaning process on the substrate in the first orientation using the fourth cleaning module.

[0023] So that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above will be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the present disclosure may admit of other equally effective embodiments, and therefore, that the accompanying drawings illustrate only typical embodiments of the present disclosure and should not be considered as limiting the scope of the present disclosure. [Brief explanation of the drawings]

[0024] [Figure 1A] 1 is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system according to one or more embodiments. [Figure 1B] 1 is a schematic side view of a CMP processing system according to one or more embodiments. [Figure 2A] 1 is a perspective view of an example of a first cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 2B] FIG. 2B is a cross-sectional view of the first cleaning module of FIG. 2A according to one or more embodiments. [Figure 2C] FIG. 2 is a perspective view of an example of a second cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 2D] FIG. 2D is a cross-sectional view of the second cleaning module of FIG. 2C according to one or more embodiments. [Figure 2E] FIG. 1 is a cross-sectional view of a third cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 2F] FIG. 10 is a cross-sectional view of a fourth cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 2G] FIG. 10 is a cross-sectional view of a fifth cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 2H] FIG. 10 is a cross-sectional view of a sixth cleaning module utilized in a CMP processing system according to one or more embodiments. [Figure 3] 1 is a perspective view of a portion of an exemplary cleaning system in a CMP processing system, specifically an enclosure containing several substrate cleaning chambers, according to one or more embodiments. [Figure 4] 4 is another perspective view of a portion of a cleaning system similar to FIG. 3 with the housing omitted, according to one or more embodiments. [Figure 5] 1B is a schematic front view of an exemplary cleaning system as viewed from inside the factory interface of FIG. 1A in accordance with one or more embodiments. [Figure 6]FIG. 1 is a perspective view of a portion of an enclosure containing several substrate cleaning chambers. [Figure 7] FIG. 2 is a perspective view of a horizontal actuator and a vertical actuator for moving a substrate between chambers. [Figure 8] FIG. 1 illustrates a top view of a first blade assembly according to one or more embodiments. [Figure 9A] FIG. 1 illustrates a top view of a gripper assembly according to one or more embodiments. [Figure 9B] 1 is another embodiment of a gripper assembly according to one or more embodiments. [Figure 10] FIG. 10 is a side view of a second blade assembly according to one or more embodiments. [Figure 11] 1 is another embodiment of a gripper assembly according to one or more embodiments. [Figure 12A] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12B] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12C] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12D] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12E] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12F]1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12G] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12H] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12I] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 12J] 1 illustrates the progression of a substrate while being moved by a first blade assembly and a second blade assembly through a cleaning process involving multiple chambers, according to one or more embodiments. [Figure 13A] FIG. 1 is a perspective view of a portion of an enclosure containing several substrate cleaning chambers according to one or more embodiments. [Figure 13B] FIG. 1 is a perspective view of a portion of an enclosure containing several substrate cleaning chambers according to one or more embodiments. [Figure 13C] 1 is a schematic top view of an alternative chemical mechanical polishing (CMP) processing system configuration according to one or more embodiments. [Figure 14A] 1B illustrates a substrate processing sequence that can be performed in the CMP processing system shown in FIG. 1A, according to one or more embodiments. [Figure 14B] 1B illustrates a substrate processing sequence that can be performed in the CMP processing system shown in FIG. 1A, according to one or more embodiments. [Figure 14C] 1B illustrates a substrate processing sequence that can be performed in the CMP processing system shown in FIG. 1A, according to one or more embodiments. [Figure 14D]1B illustrates a substrate processing sequence that can be performed in the CMP processing system shown in FIG. 1A, according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0025] For ease of understanding, where possible, the same reference numerals have been used to designate identical elements common to the figures, and it is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further description.

[0026] The embodiments described herein relate generally to apparatus used in the manufacture of electronic devices, and more particularly to cleaning systems that may be used to clean the surface of a substrate and then chemically mechanically polish the substrate in a semiconductor device manufacturing process.

[0027] 1A is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system 100 described herein, according to one or more embodiments. FIG. 1B is a schematic side view of the CMP processing system 100, according to one or more embodiments. While the disclosure provided herein primarily describes various embodiments usable in combination with a CMP apparatus, such as polishing station 105, this configuration is not intended to be limiting with respect to the scope of the disclosure provided herein.

[0028] In the figure, certain portions of the housing and certain other internal and external components have been omitted to more clearly illustrate aspects of the CMP processing system 100. Here, the CMP processing system 100 is connected to a factory interface 102. The factory interface 102 may include one or more loading stations 102A. The loading stations 102A may be, for example, Front Opening Unified Pods (FOUPs) or cassettes. Each loading station 102A may contain one or more substrates 200 for CMP processing within the CMP processing system 100.

[0029] The CMP processing system 100 may include a polishing station 105, a first substrate handler 103 in a factory interface 102, and a cleaning system 106 including a second substrate handler 104. The first substrate handler 103 is arranged to transfer substrates 200 to and from one or more loading stations 102A. For example, the first substrate handler 103 may transfer the substrate 200 from the loading station 102A to the cleaning system 106, e.g., to a cleaner pass-through 102B, where the substrate 200 may be picked up by the second substrate handler 104. As another example, the first substrate handler 103 may transfer the substrate 200 from the cleaning system 106, e.g., from a cleaning module 110 or the cleaner pass-through 102B, to the loading station 102A.

[0030] Typically, the substrate 200 initially placed in the loading station 102A has had a previous manufacturing process, such as wafering, lithography, etching, and / or deposition, performed on its processing surface 201. The first substrate handler 103 transfers the substrate to and from the loading station 102A with the processing surface 201 facing upward.

[0031] The second substrate handler 104 may be, for example, a cleaner wet robot. The second substrate handler 104 is configured to transfer the substrate 200 to and from the polishing station 105 with the processing surface 201 facing up or down. For example, the second substrate handler 104 receives the substrate 200 from the cleaner pass-through 102B or the first substrate handler 103 and then transfers the substrate 200 to the transfer station 105A in the polishing system 105. As another example, the second substrate handler 104 removes the substrate 200 from the transfer station 105A in the polishing station 105 and then transfers the substrate 200 to a first cleaning chamber including a first cleaning module 107 in the cleaning system 106. In some embodiments, the first cleaning module 107 may be replaced with a horizontal input station 117 (FIG. 2G) or a vertical input station 119 (FIG. 2H). In some embodiments, the second substrate handler 104 may include a substrate flipping capability (e.g., a rotating blade wrist assembly) that allows the orientation of the substrate to be flipped from a polished side facing up to a polished side facing down, or vice versa. This ability to flip the substrate during a cleaning processing sequence may be useful to allow the cleaning process performed in the cleaning system 106 to be performed on the front side of the substrate, the back side of the substrate, or sequentially on both sides of the substrate.

[0032] The polishing station 105 is a substrate polishing system that may include multiple polishing stations (not shown). The polishing station 105 includes one or more polishing assemblies used to polish the substrate 200 received from the second substrate handler using one or more CMP processes. Typically, each of the one or more polishing assemblies includes a polishing platen (not shown) and a polishing head (not shown) configured to urge the substrate 200 against a polishing pad (not shown) mounted on the polishing platen. After the CMP process in the polishing station 105, the substrate 200 may contain residual abrasive particles and / or liquids, such as acidic or basic chemicals. Therefore, a cleaning system 106 is disposed between the polishing station 105 and the factory interface 102 to clean the substrate 200 before returning it to the loading station 102A.

[0033] As shown in FIG. 1A, the cleaning system 106 may be composed of two cleaning units 106A and 106B arranged parallel to each other on either side of the second substrate handler 104. The cleaning units 106A and 106B include multiple cleaning chambers. The cleaning chambers arranged in the cleaning system 106 may include one or more first cleaning modules, one or more second cleaning modules, one or more third cleaning modules, one or more fourth cleaning modules, one or more fifth cleaning modules, one or more sixth cleaning modules, and / or one or more seventh cleaning modules, as described below. FIG. 3 is a top isometric view of the cleaning unit 106A, in which the partition between the robot tunnel 104T (FIG. 1A) and the cleaning unit 106B (as well as other internal and external components) has been omitted for clarity. FIG. 4 is another top isometric view of the cleaning unit 106A, in which the housing (as well as other internal and external components) has been omitted for clarity. The cleaning system 106 configuration shown in FIGS. 3, 4, and 12A-12J includes, for ease of discussion, three different types of cleaning modules located at various cleaning chamber locations. As discussed further below, FIG. 13A illustrates a configuration that may include six different types of cleaning modules usable in the cleaning process sequences described herein. FIG. 13B illustrates a configuration that may include seven different types of cleaning modules usable in the cleaning process sequences described herein. As can be seen from FIG. 1A and as previously described, cleaning unit 106B is essentially identical to cleaning unit 106A. Accordingly, any description and depiction of cleaning unit 106A in the figures herein should also be understood, by inference, to be a description and depiction of cleaning unit 106B. However, while the disclosure provided herein primarily illustrates and discloses configurations in which cleaning unit 106A and cleaning unit 106B are identical, this configuration is not intended to be limiting with respect to the scope of the disclosure provided herein, as cleaning units may include different types and / or different numbers of cleaning modules without departing from the scope of the disclosure provided herein.

[0034] The cleaning units 106A, 106B may be separated by a robotic tunnel 104T in which the second substrate handler 104 is located. In some embodiments, each cleaning unit 106A, 106B includes a first cleaning module 107, a third substrate handler 108, a second cleaning module 109, a third cleaning module 110, and optionally a fourth cleaning module 115. In some embodiments, the first cleaning module is sometimes referred to herein as a horizontal pre-cleaning module 107, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. However, as mentioned above, the first cleaning module 107 could be replaced by a vertical input station 119 ( FIG. 2H ) or a horizontal input station 117 ( FIG. 2G ), respectively, generally configured to support the substrate in a desired physical orientation while ensuring that the surface of the substrate remains wet before a subsequent cleaning process is performed. In some embodiments, the second cleaning module 109 is sometimes referred to herein as a vertical cleaning module 109, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. In some embodiments, the third cleaning module 110 is sometimes referred to herein as an integrated clean and dry (ICD) module 110, although this is not intended to be limiting with respect to the scope of the disclosure provided herein. In some embodiments, the vertical cleaning module 109 may be provided as a first vertical cleaning module 109A and a second vertical cleaning module 109B. In some embodiments, the integrated cleaning and drying module 110 may be provided as a first integrated cleaning and drying module 110A and a second integrated cleaning and drying module 110B. In some embodiments, as shown in FIG. 1A , the third substrate handler 108 in each cleaning unit 106A, 106B is positioned such that it is located at the outer edge of the cleaning units 106A, 106B of the CMP processing system 100.In this configuration, the substrate handler 108 is located outside the cleaning chambers, such as the first cleaning module, second cleaning module, and third cleaning module shown, opposite the inside of the first cleaning module, second cleaning module, and third cleaning module facing the robot tunnel 104T and second substrate handler 104 of the CMP processing system 100.

[0035] The horizontal pre-cleaning module 107 is configured to process substrates 200 positioned in a substantially horizontal orientation, i.e., in the XY plane, with the processing surface 201 facing upward. In some embodiments, each cleaning unit 106A, 106B includes two vertical cleaning modules 109A, 109B configured to process substrates 200 positioned in a substantially vertical orientation, i.e., in the ZY plane, with the processing surface 201 facing towards the factory interface 102.

[0036] As described above, in some embodiments of the cleaning system 106, the horizontal pre-cleaning module 107 receives the polished substrate 200 from the second substrate handler 104 through a first door 107A formed in a first side panel of the horizontal pre-cleaning module 107. The first door 107A can be, for example, a slit valve configured to isolate an interior region of the horizontal pre-cleaning module 107 from an exterior region of the horizontal pre-cleaning module 107. The substrate 200 is received in a horizontal orientation by the horizontal pre-cleaning module 107 for placement on a horizontally disposed substrate support surface within the horizontal pre-cleaning module 107. The horizontal pre-cleaning module 107 then uses a third substrate handler 108 (sometimes referred to herein as a third substrate handling device 108) to perform a pre-cleaning process, such as a buffing process, on the substrate 200 before transferring the substrate 200 therefrom. In some embodiments, the buffing process involves sweeping a buffing pad across the surface of a substrate placed on a horizontally positioned substrate support surface to remove slurry, scratches, and other defects found on the surface of the substrate. The buffing pad may comprise a material such as polyurethane, acrylate, or other polymeric material.

[0037] 2A is a top isometric view of a horizontal pre-cleaning module 107 that may be disposed within a cleaning chamber in a CMP processing system 100 described herein. In FIG. 2A, an inspection access panel has been omitted to more clearly show the internal components of the horizontal pre-cleaning module 107. Generally, the horizontal pre-cleaning module 107 includes a chamber 210 formed by multiple side panels, a basin 214, and a lid 216, which collectively define a processing region 212.

[0038] A first side panel 226 is formed on a first side 208 of the horizontal pre-cleaning module 107 facing the second substrate handler 104 and includes a first door 107A (e.g., a slit valve not shown in FIGS. 2A and 2B ) configured to selectively cover an opening used to load a substrate 200 onto the rotatable vacuum table 230 using the second substrate handler 104. A second side panel 222 is formed on a second end 204 of the horizontal pre-cleaning module 107 facing away from the polishing station 105. The second side panel 222 includes a second door 107B (e.g., a slit valve not shown in FIGS. 2A and 2B ) configured to selectively cover an opening 209 used to remove a substrate 200 from the rotatable vacuum table 230 using the third substrate handler 108. The horizontal pre-cleaning modules 107 may be configured and installed in both cleaning units 106A, 106B, as shown in FIG. 1A, and therefore may be positioned on opposite sides of the CMP processing system 100.

[0039] The horizontal pre-cleaning module 107 further includes a rotatable vacuum table 230 for vacuum-chucking the substrate 200, the rotatable vacuum table 230 being disposed within the processing region 212 of the horizontal pre-cleaning module 107, an annular substrate lift mechanism 270 disposed radially outward from the rotatable vacuum table 230, a pad conditioning station 280 disposed adjacent to the rotatable vacuum table 230, and a pad carrier positioning arm 282 movable between a first position above the rotatable vacuum table 230 and a second position above the pad conditioning station 280. The rotatable vacuum table 230, the annular substrate lift mechanism 270, the pad conditioning station 280, and the pad carrier positioning arm 282 are each separately mounted to a basin 214.

[0040] FIG. 2B is a side cross-sectional view of a pad carrier positioning arm 282 that may be used in the horizontal pre-clean module 107 of FIG. 2A. As shown in FIG. 2B, the pad carrier positioning arm 282 is positioned adjacent the rotatable vacuum table 230. A distal end 302 of the pad carrier positioning arm 282 includes a vertically movable pad carrier assembly 304 for supporting a buffing pad 306 at its lower end. The pad carrier assembly 304 is moved vertically relative to the rotatable vacuum table 230 using an actuator assembly 317. The distal end 302 of the pad carrier positioning arm 282 can also be positioned over the pad conditioning station 280 (FIG. 2A) using a rotary actuator 313 configured to rotate the pad carrier positioning arm 282 about axis c1.

[0041] The pad carrier assembly 304 includes a head motor 308 for rotating the buffing pad 306 about an axis c2 aligned substantially in the direction of gravity. The pad carrier assembly 304 includes a coupling base 307 connected to the head motor 308 via a shaft 311. In some embodiments, the coupling base 307 is sized to support one or more buffing pads 306. In one example, as shown in FIGS. 2A-2B, a single buffing pad 306 is utilized, which is approximately 40 mm to 150 mm in diameter and is larger than conventional buffing pads used in similar cleaning modules.

[0042] In some embodiments, the buffing pad 306 is formed of a polyvinyl alcohol (PVA) material. PVA material is hydrophilic and can absorb and retain water. When wet, PVA material is resilient, flexible, and soft, and has mechanical strength and abrasion resistance. Compared to conventional materials used as buffing pads, such as poromeric materials or filled or unfilled polymeric materials, PVA material provides high shear force for chemical and mechanical cleaning of previously CMP-polished surfaces of substrates. The buffing pad 306 formed of PVA material has a diameter smaller than the diameter of the substrates processed in the horizontal pre-cleaning module 107. A larger buffing pad improves performance during the chemical-mechanical cleaning process and reduces buffing time. The coupling base 307 is designed to support a large, thick, water-absorbent buffing pad 306 while including a retention feature configured to prevent sagging of the buffing pad 306 using a mechanical clamping mechanism.

[0043] During processing in the horizontal pre-clean module 107, a substrate is loaded onto the rotatable vacuum table 230 by using the second substrate handler 104 to transfer the substrate 200 through an opening formed in the first side panel 226 and placing the substrate 200 on a plurality of lift pins in a lift pin assembly 303. The lift pin assembly 303 includes a plurality of lift pins that can be raised and lowered to place and remove the substrate 200 from the surface of the rotatable vacuum table 230 using a lift pin actuator (not shown). A vacuum is then generated between the substrate 200 and the opening formed in the surface of the rotatable vacuum table 230 using a pump 319. A rotating buffing pad 306 is then brought into contact with the surface of the substrate using a head motor 308 and an actuator assembly 317. In some embodiments, the rotatable vacuum table 230 and substrate 200 are also rotated during processing using a rotational actuator 327. The rotating buffing pad 306 can then be translated across the surface of the substrate 200 in an oscillatory, arcuate motion using a rotational actuator 313. In some embodiments, the rotational actuator 313 can rotate the buffing pad 306 in an oscillatory, rotational motion that covers less than a full 360-degree rotation. While the rotating buffing pad 306 translates across the surface of the substrate 200, a first processing liquid, such as deionized water and / or one or more first cleaning liquids (e.g., TMAH, PlanarClean®), can be applied to the surface of the substrate 200 from a fluid source 315. The cleaning process is effective to remove residual scratches and abrasive particles from the substrate surface. After a desired processing time, processing is stopped, and the substrate is removed from the horizontal pre-cleaning module 107 by performing the steps listed above in reverse order. However, as will be explained below, the substrate is beneficially removed from the horizontal pre-clean module 107 through the opening 209 by use of a portion of the third substrate handler 108 .

[0044] In some alternative embodiments of the cleaning system 106, a horizontal input module 117 (FIG. 2G) is disposed in place of the horizontal pre-cleaning module 107, thereby enabling the horizontal input module 117 to receive polished substrates 200 from the second substrate handler 104. The housing of the horizontal input module 117 is configured similarly to the horizontal pre-cleaning module 107 and thus includes a first door 107A formed in a first side panel of the housing and a second door 107B formed in a second side panel. The horizontal input module 117 generally includes a substrate support assembly 288, which may include a plurality of support pins 289, and one or more rinse nozzles 286A, 286B positioned to deliver a flow of rinse fluid (e.g., deionized water) received from a fluid source 287 to exposed surfaces (e.g., upper and lower surfaces) of the substrate during processing. The horizontal input module 117 is configured to keep the substrate wet and remove any residual slurry or other residue remaining on the surface of the substrate after it has been polished in the polishing station 105 .

[0045] In another alternative embodiment of the cleaning system 106, a vertical input module 119 (FIG. 2H) is disposed in place of the horizontal pre-cleaning module 107, thereby enabling the vertical input module 119 to receive polished substrates 200 from the second substrate handler 104. The housing of the vertical input module 119 includes a first door 107A formed in a first side panel of the housing and a second door 107B formed in a second side panel. The vertical input module 119 generally includes a substrate support assembly 297, which may include a plurality of support features 294, and one or more rinse nozzles 286A, 286B positioned to deliver a flow of rinse fluid (e.g., deionized water) received from a fluid source 287 to the exposed surfaces (e.g., front and back surfaces) of the substrate during processing. The vertical input module 119 is configured to keep the substrate wet and remove any residual slurry or other residue remaining on the surface of the substrate after polishing in the polishing station 105. The vertical input module 119 also includes an actuator configured to rotate the substrate 200 mounted on the substrate support assembly 297 about a vertical axis (i.e., the Z-axis) to rotationally orient the substrate 200 so that the blade assembly 300 ( FIG. 7 ) of the central robot 104 and the third substrate handler 108 can access the substrate 200 from each side of the vertical input module 119 at different times. As shown in FIG. 2H , in some embodiments, during a transfer process, a robot blade 298 is inserted through a door (e.g., the second door 107B) and positioned behind a substrate mounted on a portion of the substrate support assembly 297. The robot blade 298 includes a clamp assembly 298A and a holding element 298B configured to grip a vertically oriented substrate during the substrate transfer process. The process of gripping the substrate may include the use of an actuator (not shown) within the clamp assembly 298A configured to apply a force to the edge of the substrate so that the edge of the substrate can be supported and held between the components of the clamp assembly 298A and the holding element 298B.

[0046] 6-12K below, the third substrate handler 108 includes two separate blade assemblies 300, 400 for separately handling the substrate 200 during various cleaning stages within the cleaning system 106. It should therefore be understood that references to the handling of the substrate 200 by the third substrate handler 108 may refer to the movement of one or more blade assemblies 300, 400 of the substrate handler 108 handling the substrate 200, as described further below.

[0047] 1A and 1B, the third substrate handler 108 transfers the substrate 200 from the horizontal pre-cleaning module 107 through a second door 107B that covers an opening 209 formed in a second side panel 222 of the horizontal pre-cleaning module 107. The second side panel 222 may be orthogonal to the first side panel 226, for example. The substrate 200 remains in a horizontal orientation, i.e., oriented in the XY plane, while being removed from the horizontal pre-cleaning module 107. After the substrate 200 is transferred from the horizontal pre-cleaning module 107, the third substrate handler 108 manipulates the substrate 200 to a vertical orientation, i.e., oriented in the YZ plane with the processing surface 201 facing toward the factory interface 102, for further processing in the vertical cleaning modules 109A, 109B of the cleaning system 106. For example, after the substrate 200 is transferred from the horizontal pre-clean module 107, the third substrate handler 108 may rotate the substrate 200 90 degrees about the Y axis to a vertical position, and then rotate the substrate 180 degrees about the Z axis so that the processing surface 201 faces the factory interface 102. The Y axis rotation and the Z axis rotation may be completed sequentially or over an overlapping period.

[0048] After manipulating the substrate 200 so that the processing surface 201 faces the factory interface 102, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109A through a door 109C (FIG. 1B). The transfer process may include movement of the third substrate handler 108 in at least one direction, such as the X direction. The door 109C may be, for example, a slit valve. Each cleaning unit 106A, 106B may include two vertical cleaning modules 109A, 109B. The two vertical cleaning modules 109A, 109B may be arranged linearly, i.e., in the X direction, within each cleaning unit 106A, 106B. The two vertical cleaning modules 109A, 109B may also be arranged substantially below the horizontal pre-cleaning module 107, i.e., in the Z direction, within each cleaning unit 106A, 106B. Such an arrangement of the vertical cleaning modules 109A, 109B below the horizontal pre-cleaning module 107 results in a reduced footprint for the overall cleaning system 106, and may further reduce travel times between the modules to improve throughput, and more importantly, may help reduce the drying capacity of wet substrates and reduce the time the substrates are exposed to air between cleaning steps.

[0049] In some embodiments, the vertical cleaning modules 109A, 109B can be either or a combination of contact and non-contact cleaning systems for removing polishing by-products from the surface of the substrate, and can be, for example, spray boxes and / or scrubber brush boxes.

[0050] FIG. 2C is an isometric view of an exemplary vertical cleaning module 109, representing vertical cleaning modules 109A and 109B, which may be utilized in a cleaning unit as described above. The lid portion of the vertical cleaning module 109, including the door 109C, has been removed from FIGS. 2C and 2D for ease of illustration. The vertical cleaning module 109 shown in FIG. 2C may be a scrubber brush box type vertical cleaning machine. The exemplary vertical cleaning module 109 includes a tank 505 supported by a first support 525 and a second support 530. The vertical cleaning module 109 includes an actuator 535 connected to cylindrical rollers 515 and 520 (shown in FIG. 2D), respectively, located within the tank 505. Each actuator 535 may include a drive motor, such as a direct drive servo motor, adapted to rotate the respective cylindrical roller 515, 520 about axis A′ and A″. Each actuator 535 is connected to a controller adapted to control the rotational speed of the cylindrical rollers 515, 520.

[0051] The linkage 510 and actuator 545 are configured to enable movement of cylindrical rollers 515, 520 located within the tank 505 relative to a major surface of a substrate 200 (shown in FIG. 2D ). The actuator 545 is connected to a controller to control movement of the linkage 510 relative to a substrate disposed between the cylindrical rollers 515, 520. In operation, the first support 525 and the second support 530 can be moved simultaneously relative to the base 540. Such movement can bring the first cylindrical roller 515 and the second cylindrical roller 520 closer together relative to the substrate 200, as shown in FIG. 2C , or move the first cylindrical roller 515 and the second cylindrical roller 520 apart to allow insertion and / or removal of the substrate 200 from the vertical cleaning module 109.

[0052] 2D is a top view of the vertical cleaning module 109 of FIG. 2C showing the cylindrical rollers 515, 520 in a processing position in which the cylindrical rollers 515, 520 are closed or pressed against a major surface of the substrate 200. The vertical cleaning module 109 also includes one or more drive motors 544 and rotators 547. Each of the drive motors 544 and rotators 547 includes a roller 549 disposed at the end of an output shaft of each drive motor 544 and rotator 547 and configured to support and / or engage the substrate 200 to facilitate rotation of the substrate 200 about an axis parallel to a horizontal plane (i.e., the XY plane).

[0053] Each of the cylindrical rollers 515, 520 may include a tubular cover 528 disposed thereon. The tubular cover 528 may be a removable sleeve made of a pad material utilized to polish the substrate 200, or may be a brush body adapted to clean the substrate 200. During processing within the vertical cleaning module 109, the tubular covers 528 of the cylindrical rollers 515, 520 are brought into contact with the substrate while being rotated by an actuator 535, and the substrate 200 is rotated through the use of a drive motor 544 and a support roller 549 coupled to the output shaft of a rotation device 547. While the substrate 200 and cylindrical rollers 515, 520 are rotated by the various actuators and motors, a second processing fluid, such as deionized water and / or one or more second cleaning liquids (e.g., an acid-containing aqueous solution or a base-containing aqueous solution), is applied to the surface of the substrate 200 from a second fluid source. In some embodiments, the second processing fluid supplied to the surface of the substrate has a different composition than the first processing fluid supplied to the surface of the substrate in the horizontal pre-cleaning module 107. During the cleaning process in each vertical cleaning module 109A, 109B, the substrate 200 can be positioned such that the processing surface 201 faces the factory interface 102. In other embodiments, the vertical cleaning modules 109A, 109B are oriented in the cleaning units 106A, 106B such that the processing surface 201 faces substantially perpendicular to the factory interface 102 (e.g., parallel to the XZ plane) during the cleaning process. In other embodiments, the vertical cleaning modules 109A, 109B are oriented in the cleaning units 106A, 106B such that the processing surface 201 faces an angle between parallel to the XZ plane and parallel to the YZ plane during the cleaning process.

[0054] According to one embodiment, a dedicated conditioning device 560 can be provided for each of the cylindrical rollers 515, 520. The conditioning device 560 is mounted near a sidewall of the tank 505 by one or more support members 570. The conditioning device 560 is positioned away from the center of the tank 505 so as not to interfere with the substrate transfer process and / or the substrate polishing or cleaning process. However, the conditioning device 560 is positioned to contact each of the cylindrical rollers 515, 520 when the first support 525 and the second support 530 are moved downward and outward away from each other. In one embodiment, movement of the first support 525 and the second support 530 brings the cylindrical rollers 515, 520 into contact with their respective conditioning devices 560. In this position, during the relative movement between the cylindrical rollers 515 , 520 and the conditioning device 560 , the treatment surface of the tubular cover 528 on each cylindrical roller 515 , 520 can be adjusted.

[0055] According to one embodiment, the cleaning units 106A and 106B may each be configured to sequentially process each substrate 200 through two vertical cleaning modules 109A and 109B as a two-step cleaning process. That is, after the substrate 200 is subjected to a cleaning process in the vertical cleaning module 109A closest to the polishing station 105, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109B closest to the factory interface 102 for further cleaning. During the cleaning process sequence, the substrate is processed in the first vertical cleaning module 109A for a first period of time, then transferred to the second vertical cleaning module 109B, and then processed for a second period of time that is typically substantially similar to the first period of time. The processes performed in the first vertical cleaning module 109A and the second vertical cleaning module 109B may include using similar fluid chemistries and mechanical processing parameters (e.g., cylindrical roller rotation speed and applied force). In some embodiments, the first vertical cleaning module 109A is adapted to perform a coarse cleaning step to remove most of the residual contaminants (e.g., particles, abrasive particles, chemical residues, etc.) remaining on the surface of the substrate after a first cleaning process has been performed in the first cleaning module, and the second vertical cleaning module 109B is configured to perform a cleaning process adapted to remove any residual contaminants remaining from the process performed in the first vertical cleaning module 109A.

[0056] The third substrate handler 108 then transfers the substrate 200 to one of the integrated cleaning and drying modules 110A, 110B via a first door 110C (FIGS. 1A and 2E) formed in a first side panel of the one of the integrated cleaning and drying modules 110A, 110B. The door 110C may be, for example, a slit valve. As shown in FIGS. 1A-1B, each cleaning unit 106A, 106B may include two integrated cleaning and drying modules 110A, 110B arranged vertically, i.e., in the Z direction. Each of the integrated cleaning and drying modules 110A, 110B performs cleaning and drying processes on the substrate 200. In one example, the integrated cleaning and drying modules 110A, 110B may rinse and dry the substrate 200. For example, the integrated cleaning and drying modules 110A, 110B can apply a chemical while rinsing the substrate 200 with deionized water to clean it and / or adjust the surface tension of the liquid to reduce adhesion of the liquid to the substrate 200 during the rinsing and drying process. In another example, at least one of the integrated cleaning and drying modules 110A, 110B is configured to only rinse and dry the substrate 200. For example, the integrated cleaning and drying modules 110A, 110B can also apply a surface tension adjusting fluid (e.g., IPA vapor) to dry the substrate using a Marangoni-type process while rinsing the substrate 200 with deionized water.

[0057] The horizontal arrangement of the integrated cleaning and drying modules 110A, 110B can result in an increased throughput of substrates 200 for cleaning and drying processing while maintaining a reduced footprint for the overall cleaning system 106. Such an arrangement of the integrated cleaning and drying modules 110A, 110B within the CMP system 100 helps to improve throughput by reducing transfer times between the vertical cleaning module 109B and the integrated cleaning and drying modules 110A, 110B, and importantly, reduces the drying capacity of wet substrates, reducing the air exposure time of the substrates between cleaning steps.

[0058] In some configurations, each cleaning unit 106A, 106B may include only a single integrated cleaning and drying module 110. For example, one integrated cleaning and drying module 110 may require maintenance. In such an example, the integrated cleaning and drying module 110 requiring maintenance can be lowered and / or removed from the cleaning unit 106A or 106B, and the remaining integrated cleaning and drying module 110 can remain in the cleaning unit 106A or 106B so that the CMP process on the substrate 200 in the polishing station 105 and subsequent cleaning of the substrate 200 in the cleaning unit 106A or 106B (as the case may be) can continue.

[0059] As can be seen in FIG. 5 , for example, if only one integrated washing and drying module 110A is used in the washing unit 106B, a door blank 110E can be placed on the wall of the washing unit 106B facing the factory interface 102. The door blank 110E can maintain isolation between the interior of the washing unit 106B and the factory interface 102 even when only one integrated washing and drying module 110A is used and the other integrated washing and drying module 110B is not installed in the washing unit 106B. It will be appreciated that the washing unit 106A can be configured in the same manner. That is, the washing system 106 can operate with two, three, or four integrated washing and drying modules 110. However, for most applications, it is envisioned that the washing system 106 will operate with two or four integrated washing and drying modules 110. That is, both washing units 106A, 106B can operate with the same number of integrated washing and drying modules 110 (one or two). In some embodiments, each of the washing units 106A, 106B includes two integrated washing and drying modules 110 stacked vertically.

[0060] 2E is a schematic cross-sectional view of an exemplary integrated cleaning and drying module 110, representing the integrated cleaning and drying modules 110A, 110B, which may be utilized within the cleaning units 106A, 106B, as described above. The integrated cleaning and drying module 110 may receive the substrate 200 to be cleaned after the substrate 200 has been cleaned in one or more of the horizontal pre-cleaning module 107, the vertical cleaning modules 109A, 109B, and the final cleaning module 115, and before the substrate 200 is received by the first substrate handler 103 in the factory interface 102. The integrated cleaning and drying module 110 may be utilized to remove contamination from the substrate 200 that, if not removed, could result in the corresponding substrate 200 not meeting cleanliness requirements for subsequent processing steps and being discarded. In one example, the integrated cleaning and drying module 110 is configured to perform a cleaning and drying process that prevents water droplet marks from forming on the surface of the substrate 200. Generally, the process performed in each integrated cleaning and drying module 110 is the final cleaning process performed in a cleaning sequence performed on a substrate in the CMP system 100. The process performed in each integrated cleaning and drying module 110 can include one or more cleaning steps in which a cleaning or rinsing fluid (e.g., deionized water) is supplied to the top and / or bottom surfaces of the substrate, followed by a drying process performed on the substrate. The drying process can include separate, sequential supply of flows of deionized water and IPA vapor containing an inert gas mixture using a rotatable arm, which is scanned across the process-side surface (i.e., the top surface in FIG. 2E ) and / or back surface of the substrate 200.

[0061] The integrated cleaning and drying module 110 includes a substrate gripper 603, a first sweep arm 639, a second sweep arm 630, a first nozzle mechanism 640, a second nozzle mechanism 641, a plenum 680, an exhaust outlet 660, a water drain 684, and a gas source 670. The integrated cleaning and drying module 110 may further include a sensing device 694, which may include, for example, a camera for detecting the status of the cleaning process or a retro-reflective position sensing device for detecting the position of the substrate within the interior space 695.

[0062] The substrate gripping apparatus 603 is configured to support, hold, and / or maintain the substrate 200 in a horizontal orientation. For example, the substrate gripping apparatus 603 is configured to support the substrate 200 in a horizontal orientation perpendicular to the vertically oriented rotation axis 616. The substrate gripping apparatus 603 includes a catch cup 610 and a gripper assembly 620. The catch cup 610 may include a first catch cup 611 and a second catch cup 612. The first catch cup 611 may be coupled to the second catch cup 612. For example, the first catch cup 611 may be coupled to the second catch cup 612 via one or more bolts. One or more of the first catch cup 611 and the second catch cup 612 may include one or more threaded portions configured to receive a threaded bolt.

[0063] The catch cup 610 may include drain holes 662 arranged in an array along the edge of the catch cup 610 to allow moisture to flow into the drain outlet 684 while the substrate 200, gripper assembly 620, and catch cup 610 are rotated by the drive motor 622. Additionally, a labyrinth 664 may be formed between the catch cup 610 and the housing of the integrated cleaning and drying module 110. The labyrinth 664 may be configured to at least partially restrict moisture from flowing back through the labyrinth 664 into the interior space 695.

[0064] The catch cup 610 includes a wall 613 having an inner annular surface 614. The inner annular surface 614 defines a processing space 697 within the substrate gripper 603. The inner annular surface 614 has an angled portion that is symmetrical about a central axis, e.g., an axis of rotation 616 of the substrate gripper 603. For example, the substrate 200 can be cleaned within the processing space 697.

[0065] Gripper assembly 620 holds substrate 200 while deionized water and / or a third cleaning liquid is applied to substrate 200 for cleaning. Gripper assembly 620 may also include gripping pins 617 coupled to plate 619. In one or more embodiments, each gripping pin 617 may be coupled to element 680 configured to contact a housing of first catch cup 611 when plate 619 is positioned relative to catch cup 610 using actuator 629. Contact between element 680 and a surface of first catch cup 611 imparts translational motion to gripping pin 617. For example, in response to element 680 contacting inner annular surface 614 of first catch cup 611, element 680 contacts and rotates against inner annular surface 614 of first catch cup 611 when plate 619 and gripper assembly 620 are moved in the +Z direction by actuator 629. In response, rotational and / or translational motion is imparted to gripper pin 617 coupled to element 680. In one embodiment, element 680 continues to rotate until movement of gripper assembly 620 in the +Z direction is stopped. In one embodiment, element 680 and gripper pin 617 are disposed in the open position after movement of plate 619 in the +Z direction is stopped.

[0066] A spring element, such as a leaf spring or other suitable spring design (not shown), can further return element 680 to the starting position while moving gripping pin 617 to the gripping position in response to element 680 no longer contacting inner annular surface 614 of first catch cup 611, such as when substrate 200 is placed in the processing position as shown in Figure 2B. When element 680 is no longer contacting the housing of first catch cup 611, a biasing force from the spring element can load element 680 such that element 680 returns to the starting position and gripping pin 617 returns to the gripping position.

[0067] One or more fluids may be applied to the processing surface 201 of the substrate 200 by a first nozzle mechanism 640 and a second nozzle mechanism 641. For example, the first fluid supply 643 may supply deionized water, an inert gas, and / or IPA vapor to the second nozzle mechanism 641, which is positioned to supply fluid to the processing surface (i.e., the top surface in FIG. 2E ) of the substrate 200. The first nozzle mechanism 640 may also apply deionized (DI) water and / or cleaning chemicals to the processing side of the substrate 200.

[0068] The first nozzle mechanism 640 can be or can include components configured to perform a non-contact cleaning process, such as a cleaning process utilizing a megasonic nozzle or a jet nozzle. In one example, the first nozzle mechanism 640 includes one or more elements, such as a megasonic actuator configured to alternately apply megasonic energy in the form of waves into a cleaning fluid according to a sinusoidal or other pattern to generate a megasonic-actuated fluid. The cleaning fluid can be supplied from a first fluid source 643 adapted to supply deionized water and / or a cleaning solvent (i.e., an acidic or basic solvent). For example, the first nozzle mechanism 640 can be configured to alternately apply megasonic energy in a sinusoidal pattern at a rate of approximately 430 kHz to 5 MHz, e.g., 950 kHz, to generate megasonic-actuated deionized water that is supplied to the surface of the substrate 200. The first nozzle mechanism 640 can be configured to transmit megasonic energy at multiple frequencies, e.g., at least two different frequencies.

[0069] While the gripper assembly 620 and catch cup 610 are rotated, a fluid may be applied to the backside of the substrate 200 through an opening 625 formed in a shaft 624 connected to a fluid source 623. The shaft 624 may include one or more tubes (not shown) configured to supply deionized water, cleaning fluids, and / or gases to the backside of the substrate 200.

[0070] A drive motor 622 may be connected to the gripper assembly 620 via a shaft 624. The drive motor 622 rotates the gripper assembly 620 and the catch cup 610 about the axis of rotation 616. Furthermore, the drive motor may be a hydraulic motor, a pneumatic motor, an electromechanical motor, or a magnetic motor. The gripper assembly 620, the substrate 200, and the catch cup 610 are configured to rotate together (e.g., simultaneously), which ensures that the relative velocities between the substrate 200 and the catch cup 610 are substantially the same and reduces the likelihood that droplets flying off the surface of the rotating substrate will bounce off the inner surface of the catch cup 610 and fall onto the surface of the substrate due to the application of fluid to the front or backside of the substrate.

[0071] The lid 602 covers an opening formed in a wall (e.g., an enclosure wall) 683 and can provide access to an interior space 695 of the integrated cleaning and drying module 110 for inserting and removing a substrate 200 into and from the integrated cleaning and drying module 110. When the lid 602 is in a closed position, the interior space 695 of the integrated cleaning and drying module 110 can be referred to as an isolated environment. For example, when the lid 602 is closed, the interior space 695 of the integrated cleaning and drying module 110 is isolated from the external environment, such that fumes (e.g., IPA vapor) and liquids generated and / or used during cleaning of the substrate 200 do not escape from the integrated cleaning and drying module 110 during the cleaning process. Any fumes and cleaning fluids used and / or generated during the cleaning process are removed from the integrated cleaning and drying module 110 in a controlled manner via the exhaust outlets 660 and / or the drain outlets 684. Air may be supplied to the plenum 680 by the gas source 670 and exhausted from the integrated cleaning and drying module 110 through the exhaust port 660. Additionally, the plenum 680 and the exhaust port 660 may be configured to control the airflow within the integrated cleaning and drying module 110 to prevent particles from redepositing on the surface of the substrate 200. The airflow supplied to the integrated cleaning and drying module 110 may be supplied at a desired pressure and flow rate to ensure the removal of vapors (e.g., IPA vapor) and / or airborne particles formed within the processing region of the integrated cleaning and drying module 110 during processing. In some embodiments where nitrogen gas is supplied within the integrated cleaning and drying module 110, it may be desirable to eliminate the use of HEPA filters from the system to reduce system and maintenance costs and system complexity. In some embodiments, the gas source 670 is configured to supply filtered air or other gas such that a desired pressure (e.g., greater than atmospheric pressure) is maintained within the processing region of the integrated cleaning and drying module 110A.

[0072] The drain port 684 may be utilized to remove excess water from the integrated washing and drying module 110. In one embodiment, the drain port 684 removes excess cleaning fluid from the integrated washing and drying module 110 during the cleaning process.

[0073] An interior space 695 of the integrated cleaning and drying module 110 can be defined as existing between the catch cup 610 and a wall (e.g., a housing wall) 683. A substrate (e.g., a substrate 200) can be inserted into the interior space 695 when being loaded into the integrated cleaning and drying module 110 and removed from the interior space 695 when being removed from the integrated cleaning and drying module 110.

[0074] The sensing device 694 can detect the substrate 200 within the integrated cleaning and drying module 110. For example, the sensing device 694 can detect the substrate 200 within the interior space 695. Furthermore, the sensing device 694 can detect the substrate 200 while it is being held by the gripper assembly 620. The sensing device 694 can detect when the substrate 200 is properly or improperly loaded into the gripper assembly 620. Furthermore, the sensing device 694 can detect when the substrate 200 has fallen out of or exited the gripper assembly 620. The sensing device 694 can also determine when the substrate 200 is inserted into and removed from the integrated cleaning and drying module 110.

[0075] The first sweep arm 639 is connected to a sweep arm shaft 637 and a sweep arm drive motor 638. The sweep arm shaft 637 and the sweep arm drive motor 638 form a first sweep arm drive assembly 633. The sweep arm drive motor 638 can be connected to the sweep arm shaft 637 and can be configured to move a first nozzle mechanism 640 at a distal end of the first sweep arm 639 in an arcuate path parallel to the surface of the substrate 200. The first sweep arm 639 can include one or more tubes for supplying fluid to the first nozzle mechanism 640. The first sweep arm drive assembly 633 is configured to move the first nozzle mechanism 640 over the surface of the substrate 200 during the cleaning process such that the cleaning fluid dispensed by the first nozzle mechanism 640 is evenly distributed over the surface of the substrate 200. The first sweep arm drive assembly 633 may also be configured to move the first sweep arm 639 vertically to set the distance between the lid of the integrated cleaning and drying module 110 and the surface of the substrate 200 .

[0076] The second sweep arm 630 is connected to a sweep arm shaft 632 and a sweep arm drive motor 634. The sweep arm shaft 632 and the sweep arm drive motor 634 form a second sweep arm drive assembly 636. The sweep arm drive motor 634 can be connected to the second sweep arm shaft 636 and can be configured to move a second nozzle mechanism 641 at the distal end of the second sweep arm 630 in an arcuate path parallel to the surface of the substrate 200. The second sweep arm 630 can include one or more tubes for supplying fluid to the second nozzle mechanism 641. The second sweep arm drive assembly 636 is configured to move the second nozzle mechanism 641 over the surface of the substrate 200 during the cleaning process such that the cleaning fluid dispensed by the second nozzle mechanism 641 is evenly distributed over the surface of the substrate 200. The second sweep arm drive assembly 636 may also be configured to move the second sweep arm 630 vertically to set the distance between the lid of the integrated cleaning and drying module 110 and the surface of the substrate 200 .

[0077] In some embodiments, while deionized water is supplied to the surface of the substrate 200 by the first nozzle mechanism 640, the second nozzle mechanism 641 is adapted to supply IPA vapor to the surface of the substrate 200 to create a “Marangoni” effect that dries the surface of the substrate 200. The IPA vapor is supplied from an IPA vapor supply assembly, which may include an IPA vapor source 644 and a carrier gas source 645. The IPA vapor source 644 may include an IPA liquid vaporizer (not shown) configured to receive and convert liquid IPA into a vapor, which is then mixed with a carrier gas (e.g., N) supplied from the carrier gas source 645 and then supplied to the surface of the substrate during the Marangoni drying process. During the horizontally oriented Marangoni drying process, the sweep arm 639 moves the first nozzle mechanism 640 in an arcuate path from the central region to the edge region of the substrate, creating a moving boundary of deionized water that moves outward from the center to the edge of the substrate. In this case, a first nozzle mechanism 640 supplying deionized water to the substrate surface leads a second nozzle mechanism 641 supplying an IPA vapor carrier gas mixture to the substrate surface while the sweep arm 630 moves the second nozzle mechanism 641 in an arcuate path from a central region to an edge region.

[0078] The positions of the sweep arms 630, 639 and their respective nozzle mechanisms 640, 641 can be adjusted to ensure that the nozzle mechanisms 640, 641 each pass through the center of the rotating substrate 200 during processing. Additionally, the positions of the sweep arms 630, 639 and / or the nozzle mechanisms 640, 641 can be adjusted so that the nozzle mechanisms 640, 641 each pass through a portion of the substrate 200 other than the center. To change the position of the nozzle mechanisms 640, 641 relative to the surface of the substrate 200, for example, the nozzle mechanism 640 or 641 can be moved relative to the sweep arm 630 or 639 and / or the sweep arm 630 or 639 can be moved relative to the sweep arm shaft 632. Additionally, the axial distance between the nozzle mechanisms 640, 641 and the surface of the substrate 200 can be changed to assist in the cleaning process.

[0079] According to some embodiments, as shown in FIG. 5, a shared gas supply module 113 may be provided in the robotic tunnel 104T (FIG. 1). For example, the shared gas supply module 113 may be provided above the cleaning device pass-through 102B. The shared gas supply module 113 may be serviced and / or resupplied via an access panel (not shown) in the robotic tunnel 104T. The shared gas supply module 113 is configured to supply gas (e.g., IPA vapor) to one of the integrated cleaning and drying modules 110 in the cleaning unit 106A and one of the integrated cleaning and drying modules 110 in the cleaning unit 106B. In one example, the shared gas supply module 113 is configured to supply gas (e.g., IPA vapor) to the lower integrated cleaning and drying module 110A in the cleaning unit 106A and the lower integrated cleaning and drying module 110A in the cleaning unit 106B.

[0080] The cleaning system 106 may also include fluid and piping sections 111. For example, as shown in FIGS. 1B and 5, the fluid and piping sections 111 may be located at the bottom of the cleaning units 106A, 106B below the robot tunnel 104T. The fluid and piping sections 111 for each cleaning unit 106A, 106B may include liquid supply modules 111A, 111B, 111C (and conduits, valves, etc., not shown) to supply processing liquid needed by each individual module 107, 109, 110 within each cleaning unit 106A, 106B. For example, the horizontal pre-cleaning liquid supply module 111A may supply processing liquid to the horizontal pre-cleaning module 107. Similarly, two different vertical brush box liquid supply modules 111B can each supply processing liquid to a respective one of the vertical cleaning modules 109A, 109B, and two different integrated cleaning and drying liquid supply modules 111C can each supply processing liquid to a respective one of the integrated cleaning and drying modules 110.

[0081] In some embodiments, each liquid supply module 111A-111C may be a liquid supply module dedicated to supplying processing liquid to a specific one of the modules 107, 109, 110. Thus, if one of the cleaning units 106A, 106B is configured with only one integrated cleaning and drying module 110 (as described above), one integrated cleaning and drying liquid supply module 111C may be provided in the corresponding fluid piping section 111 to supply processing liquid to that one integrated cleaning and drying module 110.

[0082] The fluid and plumbing section 111 for each cleaning unit 106A, 106B may also include modules for supplying gases to or exhausting gases from the integrated cleaning and drying modules 110, for example. According to one embodiment, the fluid and plumbing system 111 of each cleaning unit 106A, 106B includes an integrated cleaning and drying direct gas supply module 111D for supplying process gases to one of the integrated cleaning and drying modules 110. For example, the integrated cleaning and drying direct gas supply module 111D of each cleaning unit 106A, 106B supplies process gases to the respective upper integrated cleaning and drying module 110B. In some embodiments, the integrated cleaning and drying direct gas supply module may be omitted from the corresponding fluid plumbing section 111, since a shared gas supply module 113 supplies the necessary process gases to one integrated cleaning and drying module 110.

[0083] According to one embodiment, the fluid and plumbing section 111 of each cleaning unit 106A, 106B includes two integrated cleaning and drying inert gas supply modules 111F for supplying an inert gas, such as N2, to each of the integrated cleaning and drying modules 110. For example, the integrated cleaning and drying inert gas supply modules 111F may be N2 pellets. Each integrated cleaning and drying inert gas supply module 111F may be a dedicated gas supply module for supplying inert gas to one specific integrated cleaning and drying module 110. Thus, if one of the cleaning units 106A, 106B is configured with only one integrated cleaning and drying module 110 (as described above), one integrated cleaning and drying inert gas supply module 111F may be provided in the corresponding fluid plumbing section 111 for supplying inert gas to that one integrated cleaning and drying module 110.

[0084] The environment of the CMP system 100 is tightly controlled, for example, with respect to temperature, humidity, airflow, lighting, etc. In accordance with these tightly controlled environmental conditions, the cleaning system 106 may also include an air supply and exhaust 112. For example, as shown in FIGS. 1B and 5, the air supply and exhaust may be located above the cleaning units 106A, 106B and above the robotic tunnel 104T. The air supply and exhaust 112 for each cleaning unit 106A, 106B may include an air filtration system 112A. The air filtration system 112A of each cleaning unit 106A, 106B supplies air through the respective cleaning unit 106A, 106B according to, for example, requirements dictated by a particular application. For example, each air filtration system 112A may include a filter, such as a high-efficiency particulate air (HEPA) filter, configured to supply filtered air to certain areas of the CMP system 100. Each air filtration system 112A may be configured to control the temperature of the air delivered to its respective washing unit 106A, 106B. Each air filtration system 112A may also be configured to control the humidity of the air delivered to its respective washing unit 106A, 106B. Each air filtration system 112A may supply air to its respective washing unit 106A, 106B, for example, through a duct. Each washing unit 106A, 106B may include an opening (not shown) in its base to allow air delivered by the air filtration system 112A to flow through the base of the washing unit 106A, 106B and exit the washing unit 106A, 106B. Such a configuration can ensure that a positive flow of environmentally controlled air is maintained from top to bottom through the cleaning units 106A, 106B, which can minimize airborne particles that can contaminate the substrates 200 and processing surfaces 201, for example, during handling of the substrates 200 within the cleaning units 106A, 106B. In some embodiments, the gas source 670 forms part of the air filtration system 112A.In one embodiment, the air filtration system 112A is configured to provide a separate, controlled airflow to each of the integrated cleaning and drying modules 110 located within each cleaning unit 106A, 106B. The separate, controlled airflows can be provided using separate fan units within the air filtration system 112A, which are connected to each plenum 680 within each integrated cleaning and drying module 110 by fluid ducts (not shown). In some embodiments of the air filtration system 112A, HEPA filters are located at the outlets of the fan filter units located above the various cleaning modules (e.g., the first cleaning module 107, the second cleaning module 109, the third cleaning module 110, etc.) within each cleaning unit 106A, 106B, allowing the fans to direct laminar airflow through the open areas of the cleaning units 106A, 106B during processing. Alternatively, in some embodiments, HEPA filters are located within one or more cleaning modules (e.g., the third cleaning module 110) within each cleaning unit 106A, 106B, thereby enabling a fan unit within an air filtration system 112A connected to the cleaning modules via a fluid duct to direct laminar airflow through the interior areas of the cleaning modules during processing.

[0085] The air supply and exhaust section 112 of each cleaning unit 106A, 106B may also include an exhaust section 112B, which includes various exhaust conduits for venting exhaust from the horizontal pre-scrubbing module 107, the vertical cleaning modules 109A, 109B, the integrated cleaning and drying modules 110A, 110B, the integrated cleaning and drying direct gas supply module 111D, and the shared gas supply module 113.

[0086] According to an embodiment, the exhaust section 112B may include multiple separate exhaust conduits for exhausting air from each of the horizontal pre-cleaning modules 107 and vertical cleaning modules 109A, 109B of each cleaning unit 106A, 106B. The exhaust section 112B may also include two separate exhaust conduits for venting exhaust air from the main chamber area of ​​each cleaning unit 106A, 106B (i.e., return air from the air filtration system 112A). The exhaust section 112B may further include one separate shared exhaust conduit for venting exhaust air from the integrated cleaning and drying modules 110A, 110B and the shared gas supply module 113. In some embodiments, the exhaust section 112B may further include separate shared exhaust conduits for venting the shared gas supply module 113 adapted to supply fluid to at least one of the integrated cleaning and drying modules 110A, 110B in the cleaning units 106A, 106B and each of the auxiliary gas supply modules 513 adapted to supply fluid to at least one of the integrated cleaning and drying modules 110A, 110B in the cleaning units 106A, 106B. The exhaust section 112B may further include one separate exhaust conduit for venting exhaust from the fluid and piping section 111. The exhaust section 112B may further include one separate shared exhaust conduit for venting exhaust from the horizontal pre-cleaning liquid supply module 111A, the vertical brush box liquid supply module 111B, and the integrated cleaning and drying liquid supply module 111C. In some embodiments, the shared gas supply module 113 is used to supply gases, such as inert gases (e.g., nitrogen (N), argon (Ar)) and / or process gases (e.g., IPA) to the cleaning and drying module 110A (e.g., the fourth cleaning chamber) in each cleaning unit 106A, 106B. Additionally, in some embodiments of the system, direct supply gas boxes are used to supply gases to the individual modules, for example, each of the cleaning and drying modules 110B (e.g., the fifth cleaning chamber) in each cleaning unit 106A, 106B receives gases from a separate gas supply box.

[0087] The integrated cleaning and drying modules 110A, 110B in each cleaning unit 106A, 106B may require separate conduits for separately venting solvent exhaust, acid exhaust, and cabinet exhaust. That is, according to one embodiment, the exhaust section 112B may further include one separate exhaust conduit for venting solvent exhaust from the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A, one separate exhaust conduit for venting acid exhaust from the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A, and one separate exhaust conduit for venting exhaust from the cabinets of the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A. Similarly, the exhaust section 112B may further include one separate exhaust conduit for venting solvent exhaust from the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B, one separate exhaust conduit for venting acidic exhaust from the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B, and one separate exhaust conduit for venting exhaust from the cabinets of the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B. In some embodiments, one or more of the exhaust conduits of the exhaust section 112B are configured to vent the processing volumes of the integrated cleaning and drying modules 110A, 110B to one of two or more exhaust paths at different times during processing sequences performed in each integrated cleaning and drying module 110A, 110B. In one example, at a first time, a valve incorporated in exhaust section 112B is configured to allow flammable or toxic gases or vapors to flow through a first type of exhaust path (e.g., scrubbed exhaust), and at a second time, the valve is configured to allow other types of gases or vapors to flow through a second type of exhaust path (e.g., non-scrubbed exhaust).

[0088] As mentioned above, the integrated cleaning and drying modules 110A, 110B in each cleaning unit 106A, 106B may require separate conduits for separately venting the solvent exhaust and the acid exhaust. Accordingly, each integrated cleaning and drying module 110A, 110B may include a three-way valve operable to selectively and separately vent the solvent exhaust or the acid exhaust.

[0089] To prevent backflow of air into the cabinet of the integrated washing and drying module 110A, 110B, each integrated washing and drying module 110A, 110B may include a P-trap (not shown) that leads to an appropriate conduit for venting exhaust air from the corresponding cabinet. Each P-trap may include a drain port.

[0090] The various conduits of the exhaust section 112B may be located on the upper side of the cleaning system 106 as required by the location of the respective module being vented and the manufacturing facility. According to one embodiment, various conduits for venting exhaust from the horizontal pre-cleaning module 107, the vertical cleaning modules 109A and 109B, and the main chamber regions of the cleaning units 106A and 106B may be located on the side of the exhaust section 112B closest to the polishing station 105. Additionally, various conduits for venting exhaust from the integrated cleaning and drying modules 110A and 110B, the integrated cleaning and drying direct gas supply module 111D, the shared gas supply module 113, and the fluid and piping section 111 may be located on the side of the exhaust section 112B closest to the factory interface 102.

[0091] FIG. 2F is a cross-sectional side view of a fourth cleaning module 115 that can be used in a CMP processing system, according to one or more embodiments. The fourth cleaning module 115, also referred to herein as a final cleaning module, includes an improved cleaning system and method for removing particles from processed substrates. In various embodiments, the substrate cleaning process performed in the fourth cleaning module 115 is performed after a buffing and / or brush scrubbing, polishing, or cleaning process (e.g., a first cleaning module and a second cleaning module type process), and particle redeposition can occur after either the buffing process and / or the brush cleaning process. Therefore, the yield of processed wafers can be adversely affected. The following description of the fourth cleaning module 115 describes a non-contact cleaning method configured to remove residual particles on the substrate before it is dried.

[0092] The fourth cleaning module 115 includes a substrate gripper 703, a first sweep arm 739, a first nozzle mechanism 740, a second nozzle mechanism 741, a plenum 780, an exhaust port 760, a water outlet 784, and a gas source 770. The fourth cleaning module 115 may further include a detection device 794.

[0093] The substrate gripping apparatus 703 is configured to support, hold, and / or maintain the substrate 200 in a vertical orientation. For example, the substrate gripping apparatus 703 is configured to support the substrate 200 in a vertical orientation that is perpendicular to the horizontally oriented rotation axis 716. The substrate gripping apparatus 703 includes a catch cup 710 and a gripper assembly 720. The catch cup 710 can include a first catch cup 711 and a second catch cup 712. The first catch cup 711 can be coupled to the second catch cup 712.

[0094] The catch cup 710 can include drain holes 762 arranged in an array along the edge of the catch cup 710 to allow moisture to flow into the drain port 784 while the substrate 200, gripper assembly 720, and catch cup 710 are rotated by the drive motor 722. Additionally, a labyrinth 764 can be formed between the catch cup 710 and the housing of the fourth cleaning module 115. The labyrinth 764 can be configured to at least partially restrict moisture from flowing back through the labyrinth 764 into the interior space 795.

[0095] The catch cup 710 includes a wall 713 having an inner annular surface 714. The inner annular surface 714 defines a processing space 797 within the substrate gripper 703. The inner annular surface 714 has an angled portion that is symmetrical about a central axis, e.g., an axis of rotation 716 of the substrate gripper 703. For example, the substrate 200 can be cleaned within the processing space 797.

[0096] The gripper assembly 720 holds the substrate 200 while deionized water and / or a third cleaning fluid is applied to the substrate 200 for cleaning. The gripper assembly 720 may also include gripping pins 717 coupled to a plate 719. In one or more embodiments, each gripping pin 717 may be coupled to an element 780 configured to contact a housing of the first catch cup 711 when the plate 719 is positioned relative to the catch cup 710 using the actuator 729. Contact between the element 780 and a surface of the first catch cup 711 imparts translational motion to the gripping pins 717. For example, in response to the element 780 contacting the inner annular surface 714 of the first catch cup 711, when the plate 719 and the gripper assembly 720 are moved in the +Y direction by the actuator 729, the element 780 contacts the inner annular surface 714 of the first catch cup 711 and rotates. In response, rotational and / or translational motion is imparted to gripper pin 717 coupled to element 780. In one embodiment, element 780 continues to rotate until movement of gripper assembly 720 in the +Y direction is stopped. In one embodiment, element 780 and gripper pin 717 are disposed in the open position after movement of plate 719 in the +Y direction is stopped.

[0097] A spring element, such as a leaf spring or other suitable spring design (not shown), can further return element 780 to the starting position while moving gripping pin 717 to the gripping position in response to element 780 no longer contacting inner annular surface 714 of first catch cup 711, such as when substrate 200 is placed in the processing position as shown in FIG. 2F. When element 780 is no longer contacting the housing of first catch cup 711, a biasing force from the spring element can load element 780 such that element 780 returns to the starting position and gripping pin 717 returns to the gripping position.

[0098] One or more fluids may be applied to the process side 201 of the substrate 200 by a first nozzle mechanism 740 and a second nozzle mechanism 741. For example, the first fluid supply 743 may supply deionized water to the second nozzle mechanism 741, which is positioned to supply fluid to the process side of the substrate 200. The first nozzle mechanism 740 may also apply deionized (DI) water and / or cleaning chemicals to the process side of the substrate 200.

[0099] The first nozzle mechanism 740 can be, and can include, a component configured to perform a non-contact cleaning process, such as a cleaning process utilizing a megasonic nozzle or a jet nozzle. In one example, the first nozzle mechanism 740 includes one or more elements, such as a megasonic actuator configured to alternately apply megasonic energy in the form of waves into a cleaning fluid according to a sinusoidal or other pattern to generate a megasonic-actuated fluid. The cleaning fluid can be supplied from a first fluid source 743 adapted to supply deionized water and / or a cleaning fluid (i.e., an acid or base solution). For example, the first nozzle mechanism 740 can be configured to alternately apply megasonic energy in a sinusoidal pattern at a rate of approximately 430 kHz to 5 MHz, e.g., 950 kHz, to generate megasonic-actuated deionized water that is supplied to the surface of the substrate 200. The first nozzle mechanism 740 can be configured to transmit megasonic energy at multiple frequencies, e.g., at least two different frequencies.

[0100] While the gripper assembly 720 and catch cup 710 are rotated, a fluid may be applied to the backside of the substrate 200 through an opening 725 formed in a shaft 724 connected to a fluid source 723. The shaft 724 may include one or more tubes (not shown) configured to supply deionized water, cleaning fluids, and / or gases to the backside of the substrate 200.

[0101] A drive motor 722 may be connected to the gripper assembly 720 via a shaft 724. The drive motor 722 rotates the gripper assembly 720 and the catch cup 710 about the axis of rotation 716. Furthermore, the drive motor may be a hydraulic motor, a pneumatic motor, an electromechanical motor, or a magnetic motor. The gripper assembly 720, the substrate 200, and the catch cup 710 are configured to rotate together (e.g., simultaneously), which ensures that the relative velocities between the substrate 200 and the catch cup 710 are substantially the same and reduces the likelihood that droplets flying off the surface of the rotating substrate will bounce off the inner surface of the catch cup 710 and fall onto the surface of the substrate due to the application of fluid to the front or backside of the substrate.

[0102] The lid 702 covers an opening formed in a wall (e.g., an enclosure wall) 783 and can provide access to an interior space 795 of the fourth cleaning module 115 for inserting and removing vertically oriented substrates 200 into and from the fourth cleaning module 115. When the lid 702 is in a closed position, the interior space 795 of the fourth cleaning module 115 can be referred to as an isolated environment. For example, when the lid 702 is closed, the interior space 795 of the fourth cleaning module 115 is isolated from the external environment, thereby preventing fumes (e.g., acidic or basic vapors) and liquids generated and / or used during cleaning of the substrates 200 from escaping from the fourth cleaning module 115 during the cleaning process. Any fumes and cleaning liquids used and / or generated during the cleaning process are removed in a controlled manner from the fourth cleaning module 115 via exhaust ports 760 and / or drain ports 784 located at either end of the module. Air may be supplied to the plenum 780 by a gas source 770 and exhausted from the fourth cleaning module 115 by an exhaust port 760. Furthermore, the plenum 780 and the upper exhaust port 760 may be configured to control the flow of air within the fourth cleaning module 115 to prevent particles from redepositing on the surface of the substrate 200. The air flow supplied to the fourth cleaning module 115 may be provided at a desired pressure and flow rate to ensure the removal of vapors and / or airborne particles, etc., formed within the processing region of the fourth cleaning module 115 during processing. In some embodiments, the gas source 770 is configured to supply filtered air or other gas such that a desired pressure (e.g., greater than atmospheric pressure) is maintained within the processing region of the fourth cleaning module 115A.

[0103] An interior space 795 of the fourth cleaning module 115 can be defined as existing between the catch cup 710 and the wall 783. The substrate 200 can be inserted into the interior space 795 when being loaded into the fourth cleaning module 115 and removed from the interior space 795 when being removed from the fourth cleaning module 115.

[0104] The sensing device 794 can detect the substrate 200 within the fourth cleaning module 115. For example, the sensing device 794 can detect the substrate 200 within the interior space 795. Additionally, the sensing device 794 can detect the substrate 200 while it is being held by the gripper assembly 720. The sensing device 794 can detect when the substrate 200 is properly or improperly loaded into the gripper assembly 720. Additionally, the sensing device 794 can detect when the substrate 200 has fallen out of or exited the gripper assembly 720. The sensing device 794 can also determine when the substrate 200 is inserted into and removed from the fourth cleaning module 115.

[0105] The sweep arm 730 is connected to a sweep arm shaft 732 and a sweep arm drive motor 734. The sweep arm shaft 732 and the sweep arm drive motor 734 form a first sweep arm drive assembly 736. A sweep arm drive motor 738 can be connected to the sweep arm shaft 732 and can be configured to move a first nozzle mechanism 740 at the distal end of the first sweep arm 730 in an arcuate path parallel to the surface of the substrate 200. The first sweep arm 730 can include one or more tubes for supplying fluid to the first nozzle mechanism 740. The first sweep arm drive assembly 736 is configured to move the first nozzle mechanism 740 over the surface of the substrate 200 during the cleaning process so that the cleaning fluid dispensed by the nozzle mechanism 740 is evenly distributed over the surface of the substrate 200. The first sweep arm drive assembly 736 can also be configured to move the first sweep arm 730 vertically to set the distance between the lid of the fourth cleaning module 115 and the surface of the substrate 200.

[0106] The substrate cleaning process involves simultaneously rotating the catch cup 710, the gripper assembly 720, and the substrate 200 while cleaning fluid is applied to a first side (front side) and a second side (back side) of the substrate 200. Simultaneous rotation of the catch cup 710, the gripper assembly 720, and the substrate 200 while cleaning fluid is applied helps minimize and / or eliminate particle redeposition on either surface of the substrate 200. For example, the drive motor 722 can be configured to rotate the catch cup 710, the gripper assembly 720, and the substrate 200. The substrate 200 can be rotated at a speed in the range of about 500 RPM to about 1000 RPM to remove fluid from the surface of the substrate 200. Furthermore, the speed at which the substrate 200 is rotated can be varied during the cleaning process. Furthermore, once the wafer gripper 710 is positioned in the cleaning position, a cleaning cycle can be initiated. A first cleaning fluid may be applied to the backside of the substrate 200 via the fluid source 723, shaft 724, and opening 725. Additionally, a second fluid may be applied to the front side of the substrate 200 via a nozzle mechanism 740. A sweep arm drive motor 734 moves the sweep arm 730 such that the nozzle mechanism 740 moves in an arcuate path over the front side of the substrate 200. The nozzle mechanism 740 may be configured to apply a cleaning fluid to the front side of the substrate 200 during the cleaning process. The fluid may include a cleaning chemical and / or a rinse agent. In one embodiment, the cleaning fluid may be applied to the front and back sides of the substrate 200 substantially simultaneously or during one or more overlapping and non-overlapping time periods. While in the cleaning position, splashing of the cleaning fluid back onto the substrate 200 is at least reduced, and in various embodiments, eliminated. During at least one of the cleaning, loading, and unloading processes, the airflow within the fourth cleaning module 115 mitigates recirculation and prevents particles from redepositing on the surface of the substrate 200 .

[0107] Cleaning system configuration The various cleaning chambers in the cleaning system 106, which may include one or more cleaning modules 107, 109, 110, 115, 117, and 119, are modular such that the modules 107, 109, 110, 115, 117, and 119 can be changed as needed, for example, for inspection and / or routine maintenance, or for a particular application.

[0108] 1A-1B and 5, in an embodiment in which each cleaning unit 106A, 106B is configured with two integrated cleaning and drying modules 110A, 110B, the third substrate handler 108 can transfer the substrate 200 from the vertical cleaning module 109B to an available one of the integrated cleaning and drying modules 110A, 110B. That is, while one substrate 200 is being subjected to a cleaning and drying process in one of the integrated cleaning and drying modules 110A, 110B, the third substrate handler 108 can transfer the substrate 200 to the other integrated cleaning and drying module 110A, 110B (collectively, the integrated cleaning and drying module 110) that is not currently performing the cleaning and drying process on the substrate 200. While transferring the substrate 200 from the vertical cleaning module 109B to the available integrated cleaning and drying module 110, the third substrate handler 108 can rotate the substrate 200 by 90 degrees about the Y axis so that the processing surface 201 of the substrate 200 faces upward, i.e., in the Z direction, when placed in the integrated cleaning and drying module 110.

[0109] The first substrate handler 103 can transfer the substrate 200 from the integrated cleaning and drying module 110 through a second door 110D formed in a second side panel of the integrated cleaning and drying module 110. The first side panel of the integrated cleaning and drying module 110 and the second side panel of the integrated cleaning and drying module 110 can be parallel to each other and on opposite sides of the integrated cleaning and drying module. The door 110D can be, for example, a slit valve. The first substrate handler 103 can transfer the substrate 200 from the integrated cleaning and drying module 110 to one of the loading stations 102A.

[0110] In one example cleaning processing sequence, the substrate 200 is moved between the horizontal pre-cleaning module 107 and the vertical cleaning module 109A, between the individual cleaning modules 109A, 109B, and between the vertical cleaning module 109B and the integrated cleaning and drying modules 110A, 110B using the third substrate handler 108. The arrangement of the various modules 107, 109, 110, 115, 117, and 119, and the substantial range in the Z direction of the substrate handler 108, may result in improved cleaning, for example, due to the reduced time and distance over which the substrate 200 is processed by the third substrate handler 108.

[0111] As previously mentioned and described herein, the third substrate handler 108 includes two separate blade assemblies for separately handling the substrate 200 during various stages of cleaning within the cleaning system 106 .

[0112] Figure 6 is another version of Figure 3, including identification and description of other components of the substrate handler 106A. Specifically, the handler includes a first blade assembly 300 and a second blade assembly 400, each having a gripping actuator 310, 410 for enabling the pair of blades 370 of each assembly to open and close around the edge of the substrate 200. As best seen in Figure 7, each blade assembly includes a vertical actuator 320, 420 disposed within a vertical actuator assembly 330, 430, and a horizontal actuator assembly 435 for moving the blade assembly 300, 400 to various horizontal and vertical positions within the substrate handler housing. As shown in Figures 7-8 and 10, each blade assembly 300, 400 is coupled to a translatable portion of a vertical rail 321, 421 (e.g., a linear guide, linear ball slide, etc.) aligned vertically (i.e., in the Z direction). Each rail 321, 421 is disposed within a respective vertical actuator assembly 330, 430, and each of the rails 321, 421 is movable along a horizontal rail 436 (e.g., linear guides, linear ball slides, etc.) within the horizontal actuator assembly 435 by use of horizontal actuators 437A, 437B adapted to position the respective blade assembly 300, 400 horizontally (i.e., in the X direction). In some embodiments, the horizontal actuators 437A, 437B and the vertical actuators 320, 420 may each include a linear actuator or a motor-driven ball screw actuator assembly configured to drive and position the respective component by use of commands from the system controller 160.

[0113] As shown in FIG. 8 , the first blade assembly 300 also includes a first blade actuator motor 350 for enabling movement of the blade assembly and substrate between a horizontal position (as shown) and a vertical position, and a second blade actuator motor 355 for rotating the first blade assembly and substrate 180 degrees to orient a vertically positioned substrate 200 in the opposite direction. As shown, the actuator motors 350, 355 enable the blade assembly to rotate about two axes A1 and A2. As shown herein, in operation, the first blade actuator 350 first operates to move the substrate from a horizontal position to a vertical position using axis A1. Then, the second actuator motor 355 rotates the substrate 180 degrees using axis A2. As shown in FIG. 8 , axis A2 is aligned substantially parallel to the front side (e.g., device side) of the substrate 200, and axis A1 is aligned substantially perpendicular to axis A2. In the illustrated embodiment, the first movement causes the second actuator motor 355 to rotate along with the substrate and blade assembly 300, while the second movement, i.e., the 180 degree movement, causes only the substrate and blade assembly 300 to rotate.

[0114] In some embodiments, the entire blade assembly 300 can be optionally set a predetermined distance “W” from its own vertical actuator 320 using a sliding mechanism 376 between the first blade actuator and the vertical actuator. The sliding mechanism ensures that the gripping blade 370 is properly aligned with the access door of each cleaning chamber. In practice, substrates are manipulated and repositioned between cleaning chambers utilizing the blade assemblies 300, 400. Also visible in FIG. 8 is the gripping blade 370 for holding and / or gripping the substrate 200. In embodiments herein, the gripping blade is part of the gripping assembly 360 and is opened and closed by the gripping actuator 310. The substrate 200 is shown sandwiched between the blades 370. The substrate 200 is depicted “device side up,” meaning that the side shown (i.e., the front side) is the side on which semiconductor devices are formed. In the present disclosure, the device side is illustrated by a schematic representation of a semiconductor die formed on the front side of the substrate, also referred to herein as the front side or device side of the substrate. Unlike the first blade assembly 300, the second assembly 400 operates only to transfer substrates from the first vertical cleaning module 109A to the second vertical cleaning module 109B, and therefore utilizes only its own vertical actuator 420 and horizontal actuator 430, along with a gripping actuator (not shown), to grip and release the substrate 200.

[0115] FIG. 9A is a top isometric view of a particular embodiment of a gripping assembly 360. The cover has been removed for clarity. Two gripping blades 370 are shown, arranged to move toward and away from each other upon actuation of a gripping actuator 310. In this embodiment, each blade 370 is attached to a block 382, ​​which is attached to a rail 384. The blocks 382, ​​attached to the rail 384, are moved in opposite directions while the gripping actuator 310, using a bracket 385, causes motion within the block 382 to move the gripping assembly 360 between an open position and a closed position. FIG. 9B is a side view of a vertically oriented gripping assembly 360, visually illustrating the position of the gripping blades 370 relative to the substrate 200 being gripped. Each blade 370 is provided with a "target" 386 (FIG. 9B). The targets move with the blades 370 as the gripping actuator 310 moves the blades together and apart. Optical sensors 388 (FIG. 9B) are mounted on the housing, each positioned to provide a signal when aligned with its corresponding target 386. The basics of optical sensors are well known in the art. In FIG. 9B, the upper sensor is aligned with its target, while the lower sensor is misaligned. This configuration represents a successful gripping of the substrate by the gripping assembly 360. An "open" condition is indicated when the blades 370 are separated to a point where the inner diameter of the blade exceeds the outer diameter of the substrate 200, the lower sensor 388 is aligned with the target 386, and the upper target is not aligned with the sensor. A "missed" condition is indicated when the blades 370 are closed beyond the outer diameter of the substrate 200 and neither sensor is aligned with its target.

[0116] FIG. 10 is a side view of the second blade assembly 400. The second blade assembly 400 generally includes a gripper assembly 360 attached to a vertical rail 421 of a vertical actuator 420 using a slide mechanism 476. In operation, the second blade assembly 400 is coupled to a translatable portion of the vertical rail 412 and is adapted to move vertically through the use of a vertical actuator (not shown), such as a linear motor or motor-driven ball screw, disposed within the vertical actuator 420. The second blade assembly 400 is also adapted to move horizontally through the use of a horizontal actuator 437B found within the horizontal actuator assembly 435 ( FIG. 7 ). In some embodiments, the entire blade assembly 400 can be set to a predetermined distance “W” from its vertical actuator 420 using the slide mechanism 476. The slide mechanism 476 properly aligns the gripper blade 370 with the access door of each second cleaning module 109A, 109B. In practice, the substrate is handled and repositioned between the second cleaning modules using both the blade assemblies 300 and 400. Also visible in FIG. 10 is a gripping blade 370 for holding and / or retaining the substrate 200. In one example, the blade assembly 400 includes a gripping blade 370 configured to hold and maintain the substrate 200 in a vertical orientation, as shown in FIG. 10, e.g., the front surface of the substrate 200 is parallel to the YZ plane. In the embodiment herein, the gripping blade is part of the gripping assembly 360 and is opened and closed by the gripping actuator 310, as similarly described with respect to FIG. 8. The substrate 200 is shown held between the blades 370 by their ends, with the device side facing away from the polishing station 105. Unlike the first blade assembly 300, the second assembly 400 operates only to transfer substrates from the first vertical cleaning module 109A to the second vertical cleaning module 109B, and therefore, in some embodiments, utilizes only its own vertical actuator 420 in conjunction with the gripping assembly 360 to position, grip, and release the substrate 200.In some embodiments, the second blade assembly 400 has an overall height "H," which is defined as the distance from the farthest point on the edge of the substrate 200 to the farthest point on the opposite side of the second blade assembly 400. In some embodiments, the overall height H is configured to be equal to or less than the overall length "L" of the first blade assembly 300 (FIG. 8), as described further below.

[0117] To reduce system complexity and for cost considerations, it is generally desirable to form the second blade assembly 400 without the additional capability of rotating the gripping blade 370 about one or more axes of rotation, although in some cases it may be desirable to provide this additional capability. Accordingly, in some embodiments of the third substrate handler 108, the second blade assembly 400 further includes one or more actuators configured to rotate the gripping blade 370 about one or more axes, such as axes similar to axis A1 and / or axis A2 described herein with respect to the first blade assembly 300. In one example, it is desirable for the second blade assembly 400 to change the device-side orientation of the substrate while transferring the substrate between cleaning chambers, in which case the second blade assembly 400 includes a second actuator motor 355 adapted to rotate the substrate about axis A2. In other examples, the second blade assembly 400 is configured similarly to the first blade assembly 300 and, therefore, is configured to perform similar movements as the first blade assembly 300 described herein.

[0118] FIG. 11 illustrates an alternative embodiment of a first blade assembly 300, including a first housing 390 and a second housing 392, which enclose and protect wiring elements 394 associated with each actuator 310, 312, 314 from contaminants during substrate processing. In this configuration, the first housing 390 is coupled to the slide mechanism 376. In some embodiments, each wiring element 394 may include electrical cables and / or pneumatic tubing used by one or more components within the first blade assembly 330. The cable wiring elements 394 enter the first housing through several openings 396. From there, each wiring element is routed to its assigned actuator 310, 312, 314 using a protected path that includes the centerline A11, A21 of the bore 310C, 312C, respectively, to provide rotational movement of the gripper assembly 360 and the substrate 200. 11 , axis A21 is aligned substantially parallel to the front side (e.g., device side) of substrate 200, and axis A11 is aligned substantially perpendicular to axis A21. Actuator motors 312 and 314 each have an output shaft coupled to concentric / coaxial gears 312A and 314A, respectively, which interact with offset gears 312B and 314B to cause rotation of the components coupled to offset gears 312B and 314B. As shown in FIG. 11 , actuator 314 is configured to rotate gear 314A (drive gear), which causes gear 314B (offset gear) to rotate about axis A11 and rotates second housing 392, actuator 312, and blade assembly 393 about axis A11. Actuator 312 is configured to rotate gear 312A (drive gear), which causes gear 312B (offset gear) to rotate about axis A21, which in turn causes blade assembly 393 to rotate about axis A21. In some embodiments, blade assembly 393 can include the same components as blade assembly 360 described herein.Offset gears 312B and 314B include openings, such as concentric / coaxial bores 312C and 314C, respectively, that lie on the gears' axes of rotation represented by centerlines A21 and A11, which allow rotational movement of second housing 392 and gripping assembly 360 while providing pathways for electrical wiring (e.g., sensor wires, and AC or DC power cables) and / or pneumatic tubing elements to be guided through gear 314B.

[0119] Example of a cleaning process sequence FIGS. 12A-12K illustrate an example sequence of movement of blade assemblies 300, 400 and multiple substrates 200 through multiple cleaning chambers, including various types of cleaning modules, used during a cleaning processing sequence. The transfer sequence utilizes the various apparatus and methods disclosed herein to perform operations that are most time- and space-efficient during the processing sequence performed within the CMP processing system 100. The cleaning processes performed within each cleaning module during the cleaning processing sequence are described above. It should be understood that the cleaning processing sequence described herein is an ongoing process, such that during steady-state processing, substrates are typically positioned within all cleaning modules at any one time. For this reason, substrates within modules are shown with dotted lines in FIGS. 12A-12K. In FIG. 12A, for example, substrate 200 is shown within all modules except for the first vertical cleaning module 109A, which is waiting to receive a substrate currently positioned within the horizontal pre-cleaning module 107, as shown. To better explain the operation of the blade assembly, the substrate in the vertical cleaning module 109B will be referred to as the first substrate 200A, and the substrate in the horizontal pre-cleaning module 107 will be referred to as the second substrate 200B. The second substrate 200B in the horizontal pre-cleaning module 107 was placed there using the first door 107A at the front of the module by a central robot (e.g., the second substrate handler 104), not shown in FIGS. 12A-12K, after a polishing process had been performed on the substrate. The first blade assembly 300 is seen with its gripping blade 370 open to retrieve the substrate 200B through the side door 107B of the first cleaning module. As shown, the blade assembly 300 is vertically aligned with the door 107B and requires only horizontal movement, provided by the horizontal actuator 435A in the horizontal actuator assembly 435, to reach the substrate.

[0120] 12B-12F, for example, the horizontal space between module 107 and module 110B is minimized, reducing the footprint of the cleaning system and reducing the need for large horizontal movements of first vertical actuator assembly 330 and, therefore, first blade assembly 300. In this manner, the operations illustrated in FIGS. 12B-12F are performed to reduce the footprint of the system. Furthermore, FIGS. 12A-12F show spacings adapted to clearly illustrate the robot's operation. However, the actual distance between module 107 and module 110B is approximately the same as or approximately equal to the overall length L (FIG. 8) of blade assembly 300 that holds the substrate, as described more clearly herein.

[0121] In FIG. 12B, substrate 200B is being removed from module 107 using horizontal actuator 435A, with the direction of gripper assembly movement indicated by arrow 202. Substrate 200B is oriented device-side up. In FIG. 12C, first blade assembly 300 has been rotated 45 degrees clockwise about the Y-axis from a horizontal position due to actuation of first blade actuator 350. In FIG. 12D, first blade assembly 300 has orientated substrate 200B in a vertical position due to continued actuation of first blade actuator 350, and the first blade assembly has been lowered within the enclosure to a height directly above vertical cleaning modules 109A, 109B due to actuation of vertical actuator 320. Note that in FIG. 12D, substrate 200B is device-side facing toward the right side of the enclosure.

[0122] Figure 12E shows the first blade assembly 300 with the substrate 200B rotated 90 degrees and oriented so that it faces the side of the housing due to the operation of the second blade actuator 355. In Figure 12F, the substrate 200B is ready to be lowered into the first vertical cleaning module 109A. Due to the operation of the horizontal actuator 435A, not only has the blade assembly 300 moved horizontally, but the first blade assembly 300 has also used the second blade actuator 355 to rotate the substrate 180 degrees from the configuration of Figure 12D, so that the device side of the substrate 200B faces the left side of the housing, thereby minimizing the movement required to place the substrate in one of the integrated cleaning and drying modules 110A, 110B later in the processing sequence.

[0123] 12G shows the first blade assembly 300 being repositioned above the second vertical cleaning module 109B after depositing a substrate 200 in the first vertical cleaning module 109A, where the first substrate 200A has already undergone a cleaning process. The movement and position of the blade assembly 300 is the result of movement by the horizontal actuator 435A and the vertical actuator 320. In addition to the movement of the first blade assembly 300, the second blade assembly 400 is simultaneously utilizing its horizontal actuator 435B and vertical actuator 420 to position itself above the first vertical cleaning module 109A in preparation for retrieving the second substrate 200B previously deposited there by the first blade assembly 300. In FIG. 12H, each blade assembly 300, 400 has retrieved the corresponding substrate 200A, 200B from the vertical cleaning module 109A, 109B using its respective vertical actuator. At this point, the first substrate 200A is ready to be transferred to one of the integrated cleaning and drying modules 110A, 110B on the left side of the enclosure. The substrate that was in the integrated cleaning and drying module 110A has been processed and removed from the integrated cleaning and drying module using the first substrate handler 103, in a movement indicated by arrow 205. It will be appreciated that some steps in a cleaning process take longer than others. For this reason, two integrated cleaning and drying modules are provided within the cleaning unit 106A to compensate for the additional time required to complete the cleaning and drying steps performed in the integrated cleaning and drying modules.

[0124] In some configurations, two integrated cleaning and drying modules are provided in the cleaning unit 106A, allowing a substrate to undergo a cleaning process in one of the integrated cleaning and drying modules, for example, integrated cleaning and drying module 110A, and then undergo a separate rinsing and drying process in a second integrated cleaning and drying module 110, such as integrated cleaning and drying module 110B. In one example, during a processing sequence, after a substrate is processed in integrated cleaning and drying module 110A, the substrate is transferred by the first blade assembly 300 to the integrated cleaning and drying module 110B for further processing, and then the first substrate handler 103 removes the substrate from the integrated cleaning and drying module 110B.

[0125] FIG. 12I shows both substrates 200A, 200B being moved horizontally toward the left side of the housing. In the case of substrate 200B, the second blade assembly 400 has been moved by its horizontal actuator 435B to a position directly above the second vertical cleaning module 109B for insertion therein. In the case of substrate 200A, the first blade assembly 300 has been moved by its horizontal actuator 435A toward the integrated cleaning and drying modules 110A, 110B. Additionally, the first blade actuator 350 has rotated the gripper assembly 360, and with it, substrate 200A, toward a horizontal position. Note that in FIG. 12I, both substrates are positioned with their device sides facing the left side of the housing. In Figure 12J, the first substrate 200A is assumed to be in a fully horizontal, device-side-up position, and is being inserted into the integrated cleaning and drying module 110A using the horizontal actuator 435A, in a movement indicated by arrow 204. Simultaneously, the second substrate 200B has been inserted into the second vertical cleaning module 109B by vertical movement of the second blade assembly 400 using the vertical actuator 420. Also in Figure 12J, the first blade assembly 300 is shown in dotted lines positioning the subsequent substrate into the second integrated cleaning and drying module 110B (this occurs every other cycle), so that each substrate remains in the integrated cleaning and drying module for twice as long as it would in any other type of module.

[0126] It is important to understand that due to the first blade assembly's ability to manipulate the substrate in two different axes early in the process, i.e., between the horizontal pre-cleaning module 107 and the first vertical cleaning module 109A, the all-important transfer between the second vertical cleaning module 109B and the integrated cleaning and drying module 110 can be accomplished quickly, with fewer operations and less free space, with the device side of the substrate already oriented correctly for insertion into the integrated cleaning and drying module 110A. This significantly reduces the substrate's exposure to damaging water spots due to premature air drying and unwanted corrosion of the substrate's surface material (e.g., metal). A more realistic distance between the two cleaning modules is shown in FIGS. 1A-1B and 8, where it can be seen that the distance "D" between the first and second cleaning modules, such as the horizontal pre-cleaning module 107 and the integrated cleaning and drying module 110B, is only slightly greater than the overall length "L" of the first blade assembly 300. In one embodiment, the distance between the first and second cleaning modules is 102% to 125%, such as about 102% to 110%, or even about 104% to 106%, of the total length L of the first blade assembly 300, including the substrate 200 disposed between the blades 370. As shown in FIG. 8 , the total length L is defined as the distance from the farthest point on the edge of the substrate 200 to the farthest point on the opposite side of the first blade assembly 300, which is disposed between adjacently disposed cleaning modules, such as the horizontal pre-cleaning module 107 and the integrated cleaning and drying module 110B. In one example, the total length L is about 500 mm to 550 mm for the first blade assembly 300 configured to transport 300 mm substrates.In some embodiments where rotational movement about axis A1 (FIG. 8) occurs within a narrow space or region within the cleaning unit 106A, 106B, the first blade assembly 300 can be configured to have a sweep envelope length that is a small percentage of the overall length L, such as 0% to 5% or 0.5% to 3% of the overall length L. The sweep envelope length is roughly defined by the outer extents of a swept volume of the rotating portion of the blade assembly 300 projected onto a plane (i.e., the XY plane in FIG. 8) that is parallel to the major surface of the substrate 200 and includes the axis of rotation (i.e., axis A1). Minimizing the sweep envelope length helps ensure that portions of the first blade assembly 300 do not collide with components within the cleaning units 106A, 106B while the first blade assembly 300 is rotated (e.g., rotated 90 degrees) during the transfer process, due to the first blade assembly 300 having a thickness in a direction perpendicular to the plane along which the sweep envelope length is measured (e.g., the Z direction in FIG. 8 ). In configurations where the sweep envelope length is greater than 0%, the distance between the first and second cleaning modules can be configured to be a percentage of the sweep envelope length plus an additional percentage to reduce the likelihood of collision with components within the cleaning units 106A, 106B due to robotic or calibration errors. As an example, if it is advantageous to rotate the substrate in position between cleaning modules, the sweep envelope length is 3% greater than the total length L, and the minimum spacing desired to avoid collisions related to robot or calibration errors is 102%, then the spacing between modules can be set to 105% of the total length L.However, to minimize the footprint of the cleaning units 106A, 106B, it may be desirable to prevent the blade assembly from rotating within certain areas of the cleaning units 106A, 106B, such as between the first and second cleaning modules, which may result in the spacing between modules being set to a value less than the sweep envelope length.

[0127] 12K shows the position of the assembly at the end of one cycle. Each of the two integrated cleaning and drying modules 110A, 110B is simultaneously working on a substrate 200, while another substrate is being worked on by the second vertical cleaning module 109B. Meanwhile, the first blade assembly 300 is ready to remove the other substrate 200 from the horizontal pre-cleaning module 107 so that it can be deposited in the first vertical cleaning module 109A.

[0128] 13A illustrates a portion of cleaning units 106A, 106B including four different types of cleaning chambers, each configured to include a first cleaning module 107, two second cleaning modules 109, two third cleaning modules 110, and a fourth cleaning module 115. In some embodiments, the fourth cleaning module 115 includes components configured to process substrates in a vertical orientation, as shown in FIG. 13A. During a cleaning processing sequence performed in the cleaning system 106 that includes the use of the fourth cleaning module 115, the process performed in the fourth cleaning module 115 (e.g., a non-contact cleaning process) is performed after the buffing and / or brush cleaning process is performed in the second cleaning module 109 and before the rinsing and drying process is performed in the third cleaning module 110. As shown in FIG. 13A, the fourth cleaning module 115 can also be physically located between the second cleaning module 109 and the third cleaning module 110, and the first cleaning module 107 can be located above the fourth cleaning module 115.

[0129] 13B illustrates a portion of cleaning units 106A, 106B including five different types of cleaning chambers, each configured to include a first cleaning module 107, two second cleaning modules 109, two third cleaning modules 110, a fourth cleaning module 115, and a fifth cleaning module 121. In some embodiments, the fifth cleaning module 121 includes components configured to process substrates in a vertical orientation, as shown in FIG. 13B. During a cleaning processing sequence performed in the cleaning system 106 that includes the use of the fifth cleaning module 121, the process performed in the fifth cleaning module 121 (e.g., a vertical vapor drying process) may be performed after the buffing and / or brush cleaning process in the second cleaning module 109, after the cleaning process in the fourth cleaning module 115, and / or before the drying process in the third cleaning module 110. As shown in FIG. 13B, the fifth cleaning module 121 can be physically located between the fourth cleaning module 115 and the third cleaning module 110, and the first cleaning module 107 can be located above the fourth cleaning module 115.

[0130] The fifth cleaning module 121 may include a first horizontally oriented spray bar (not shown) positioned above and to the side of a vertically oriented substrate disposed on a support within the fifth cleaning chamber 121. The first horizontally oriented spray bar is adapted to spray a rinse liquid, such as deionized water (with or without a cleaning agent such as a surfactant), onto a major surface of the vertically oriented substrate while the substrate is being lifted from the enclosure by a robotic element (not shown) coupled to the fifth cleaning module. In one configuration, the rinse liquid is dispensed such that a meniscus forms on the surface of the substrate while the substrate is being lifted from the enclosure by the robotic element. In another configuration, the fifth cleaning module 121 includes a deionized water bath in which the substrate is immersed such that a meniscus forms on the surface of the substrate while the substrate is being lifted from the enclosure by the robotic element. A second horizontally oriented spray bar (not shown), which may be positioned vertically above the first horizontally oriented spray bar, is adapted to direct drying vapor (e.g., isopropyl alcohol (IPA) vapor) onto a major surface of the substrate and onto the meniscus of the rinsing liquid to utilize the Marangoni effect to dry the substrate while it is being lifted out of the chamber by the robotic element. The blade assembly 300 or the first substrate handler 103 can then retrieve the dried substrate from the robotic element and then transfer the substrate to a desired location within the FOUP.

[0131] FIG. 13C is a schematic top view of an alternative version of the CMP processing system 100 shown in FIG. 1A, according to one or more embodiments. In FIG. 13C, cleaning units 106A and 106B are shown with different configurations, each including a different number of cleaning chambers of a different type. In one embodiment, cleaning unit 106A includes a cleaning unit configuration similar to that shown and described with respect to FIGS. 4 and 12A-12K, which is broadly configured to include a first cleaning module 107, two second cleaning modules 109, and two third cleaning modules 110. However, in other embodiments, cleaning unit 106A can include a cleaning unit configuration similar to that shown and described with respect to FIG. 13A, which is configured to include one or more first cleaning modules 107, two or more second cleaning modules 109, two or more third cleaning modules 110, and one or more fourth cleaning modules 115.

[0132] 13C, in one embodiment, cleaning unit 106B is configured differently from cleaning unit 106A, including one or more first cleaning modules 107, two or more second cleaning modules 109, and one or more fifth cleaning modules 121, while cleaning unit 106A is configured as shown in FIG. 4, 12A-12K, or 13A. However, in other embodiments, cleaning unit 106B can include a cleaning unit configuration similar to that shown in FIG. 13B, including one or more first cleaning modules 107, two or more second cleaning modules 109, one or more third cleaning modules 110, one or more fourth cleaning modules 115, and one or more fifth cleaning modules 121. In yet another embodiment, the cleaning unit 106B may include a cleaning unit configuration including one or more first cleaning modules 107, two or more second cleaning modules 109, one or more fourth cleaning modules 115, and one or more fifth cleaning modules 121. In yet another embodiment, the cleaning unit 106B may include a cleaning unit configuration including one or more first cleaning modules 107, two or more second cleaning modules 109, and one or more fifth cleaning modules 121.

[0133] As described in the foregoing specification and corresponding figures, embodiments provide a space-saving apparatus and method for moving substrates through a cleaning chamber enclosure, in which each substrate is moved through two rotational levels with reduced space and reduced air time, particularly during critical later steps of the cleaning process.

[0134] In embodiments herein, operation of the CMP processing system 100, including the third substrate handler 108, is directed by a system controller 160 (FIG. 1B). According to one embodiment, the system controller 160 may be located within the air supply and exhaust section 112. The system controller 160 includes a programmable central processing unit (CPU) 161 operable with memory 162 (e.g., non-volatile memory) and support circuits 163. The support circuits 163 are conventionally connected to the CPU 161 and include cache, clock circuits, input / output subsystems, power supplies, etc., and combinations thereof, connected to and facilitating control of the various components of the CMP processing system 100. The CPU 161 may be any form of general-purpose computer processor used in industrial settings, such as a programmable logic controller (PLC), to control the various components and sub-processors of a processing chamber. Memory 162 is connected to CPU 161 and is typically one or more readily available memories such as random access memory (RAM), read-only memory (ROM), a floppy disk drive, a hard disk, or any other form of local or remote digital storage.

[0135] Typically, memory 162 takes the form of a non-transitory computer-readable storage medium (e.g., non-volatile memory) containing instructions that, when executed by CPU 161, facilitate the operation of CMP processing system 100. The instructions in memory 162 take the form of a program product, such as a program that implements the methods of the present disclosure. The program code may conform to any one of several different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program in the program product defines the functions of the embodiments (including the methods described herein).

[0136] Exemplary non-transitory computer-readable storage media include, but are not limited to, (i) non-writable storage media on which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory (e.g., a solid state drive (SSD))), and (ii) writable storage media on which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, constitute embodiments of the present disclosure. In other embodiments, the methods described herein, or portions thereof, are implemented in an application specific integrated circuit (ASIC). In some other embodiments, the substrate processing and / or handling methods described herein are performed by a combination of software routines, ASICs, and / or other types of hardware implementations. One or more system controllers 160 may be used with one or any combination of the various modular polishing systems described herein and / or with individual polishing chambers thereof.

[0137] The system controller 160 controls the activities and operating parameters of automated components found within the CMP processing system 100. Generally, most of the movement of substrates through the processing system is performed using commands sent by the system controller 160 using the various automated devices disclosed herein. In some embodiments, the system controller 160 is a general-purpose computer used to control one or more components found within the CMP processing system 100. The system controller 160 is generally designed to facilitate the control and automation of one or more processing sequences disclosed herein using a CPU 161, memory 162, and support circuits (or I / O). Software instructions and data may be coded and stored in memory (e.g., a non-transitory computer-readable medium) to instruct the CPU 161. A program (or computer instructions) readable by a processing unit within the system controller determines which tasks are executable within the processing system. For example, the non-transitory computer-readable medium may include a program configured, when executed by the processing unit, to perform one or more of the methods described herein. Preferably, the program includes code for performing tasks related to monitoring, performing, and controlling the movement, support, and / or positioning of the substrate, as well as the various process recipe tasks and various cleaning module process recipe steps being performed.

[0138] Processing sequence example 14A-14D illustrate four example substrate processing sequences that can be performed within CMP processing system 100 using system controller 160 and other support components found within CMP processing system 100. While Figures 14A-14D illustrate different substrate processing sequences that can be performed within the CMP processing system shown in Figure 1A, this example CMP processing system configuration is not intended to be limiting with respect to the scope of the disclosure provided herein.

[0139] 14A illustrates two substrate processing sequences 1400A, 1400B that can be performed in parallel within each cleaning unit 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, the substrate processing sequences 1400A and 1400B include the same processing sequence steps performed in parallel on both sides of the cleaning system 106. Thus, in one example, the processing sequence 1400A shown in FIG. 14A begins with the first substrate handler 103 removing the substrate 200 from the loading station 102A and positioning it on the cleaner pass-through 102B, as shown by path 1401. The second substrate handler 104 then transfers the substrate 200 from the cleaner pass-through 102B to the transfer station 105A of the polishing station 105, as shown by path 1402. After the substrate is processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is once again placed in the transfer station 105A. The processes performed in the polishing station 105 may include one or more CMP polishing processes configured to remove and planarize at least a portion of material on the surface of the substrate. The second substrate handler 104 then transfers the substrate 200 from the transfer station 105A to the first cleaning module 107, as shown by path 1403. However, if the first cleaning module 107 is replaced with the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 would transfer the substrate 200 from the transfer station 105A to either the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117 or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1404.The substrate cleaning process sequence performed along path 1404 can include, for example, one or more of process path steps 14041, 14042, 14043, and 14044, which require the use of blade assemblies 300 and 400 to transfer substrates between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. In one example, as described above with respect to Figures 12A-12J, the substrate cleaning process sequence performed along path 1404 includes a process sequence including three process path steps 14041, 14042, and 14044, which include performing cleaning processes in the first cleaning module 107, two second cleaning modules, and the third cleaning module 110. In this example, the first processing path step 14041 involves transferring the substrate from the first cleaning module 107 to the first second cleaning module 109 by the first blade assembly 300, the second processing path step 14042 involves transferring the substrate from the first second cleaning module 109 to the second second cleaning module 109 by the second blade assembly 400, and the fourth processing path step 14044 involves transferring the substrate from the second second cleaning module 109 to the third cleaning module 110 by the first blade assembly 300. In this example, the third processing path step 14043 is not included in the substrate processing sequence because the substrate processing sequence does not include the use of the fourth cleaning module 115, which would normally perform a cleaning process between the cleaning process performed in the second cleaning module 109 and the cleaning process performed in the third cleaning module 110. After the process is performed in path 1404, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and places it in the loading station 102A, as shown by path 1405. As mentioned above, while the processing sequence 1400A is being performed sequentially on multiple substrates, the processing sequence 1400B may also be simultaneously performed sequentially on different substrates.

[0140] 14B illustrates a substrate processing sequence 1410 that can be performed in either cleaning unit 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, the substrate processing sequence 1410 is performed in parallel on both sides of the cleaning system 106. In one example, the processing sequence 1410 illustrated in FIG. 14B begins with the first substrate handler 103 removing a substrate 200 from the loading station 102A and placing it in the third cleaning module 110, as shown by path 1411, so that the cleaning process can be performed on the next substrate. After the cleaning process has been performed on the substrate, the first substrate handler 103 removes the substrate from the third cleaning module 110 and places it on the cleaner pass-through 102B, as shown by path 1412. The second substrate handler 104 then transfers the substrate 200 from the cleaner pass-through 102B to the transfer station 105A of the polishing station 105, as shown by path 1413. After the substrate is processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is once again placed in the transfer station 105A. The second substrate handler 104 then transfers the substrate 200 from the transfer station 105A to the first cleaning module 107, as shown by path 1414. However, if the first cleaning module 107 is replaced with the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 would transfer the substrate 200 from the transfer station 105A to either the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117 or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1415.As previously mentioned, the substrate cleaning process sequence performed along path 1415 can include, for example, one or more of process path steps 14151, 14152, 14153, and 14154, which require the use of blade assemblies 300 and 400 to transfer substrates between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. After one or more processes are performed in path 1415, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and places the substrate in loading station 102A, as shown by path 1416. As described above, while the process sequence 1410 is being performed sequentially on multiple substrates in cleaning unit 106A, the process sequence 1410 can also be simultaneously performed sequentially on different multiple substrates in cleaning unit 106B.

[0141] Figure 14C illustrates a substrate processing sequence 1420 that can be performed in either of the cleaning units 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, although not shown in Figure 14C, the substrate processing sequence 1420 is performed in parallel on both sides of the cleaning system 106. However, in some cases, as shown in Figure 14C, the processing sequence can utilize both cleaning units 106A, 106B to perform different portions of the substrate processing sequence 1420. Thus, in one example, the processing sequence 1420 illustrated in Figure 14C begins with the first substrate handler 103 removing a substrate 200 from the loading station 102A and positioning the substrate on the cleaner pass-through 102B, as indicated by path 1421. The second substrate handler 104 then transfers the substrate from the cleaner pass-through 102B to the first cleaning module 107 in the cleaning unit 106A, as shown by path 1422. However, if the first cleaning module 107 is replaced with the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 transfers the substrate 200 from the cleaner pass-through 102B to either the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1423. As previously mentioned, the substrate cleaning processing sequence performed along path 1423 may include, for example, one or more of processing path steps 14231, 14232, 14233 and 14234, which processing steps require the use of blade assemblies 300 and 400 to transfer substrates between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115.After one or more processes are performed along path 1423, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and places it in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, as shown by path 1424. The second substrate handler 104 then transfers the substrate 200 from the first cleaning module 107, the horizontal input module 117, or the vertical input module 119 to the transfer station 105A of the polishing station 105, as shown by path 1425. After the substrate is processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is once again placed in the transfer station 105A. The second substrate handler 104 then transfers the substrate from the transfer station 105A to the first cleaning module 107 in the cleaning unit 106B, as shown by path 1426. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1427. As also mentioned above, the substrate cleaning processing sequence performed along path 1427 can include, for example, one or more of processing path steps 14271, 14272, 14273, and 14274, which require the use of blade assemblies 300 and 400 to transfer the substrate between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. After the process is performed in path 1427, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and places the substrate in the loading station 102A, as shown by path 1428. As described above, while the processing sequence 1410 is being performed sequentially on multiple substrates in the cleaning unit 106A, the processing sequence 1410 may also be simultaneously being performed sequentially on different multiple substrates in the cleaning unit 106B.

[0142] Figure 14D illustrates a substrate processing sequence 1430 that can be performed in either of the cleaning units 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, although not shown in Figure 14D, the substrate processing sequence 1430 is performed in parallel on both sides of the cleaning system 106. However, in some cases, as shown in Figure 14D, the processing sequence can utilize both cleaning units 106A, 106B to perform different portions of the substrate processing sequence 1430. In one example, the processing sequence 1430 illustrated in Figure 14D begins with the first substrate handler 103 removing a substrate from the loading station 102A and placing the substrate into the third cleaning module 110, as indicated by path 1431. The third substrate handler 108 then transfers the substrate to the first cleaning module 107 in the cleaning unit 106A via a cleaning module in the cleaning modules 106A and 106B, as shown by path 1432. However, if the first cleaning module 107 is replaced with the horizontal input module 117 or the vertical input module 119, the third substrate handler 108 transfers the substrate from the third cleaning module 110 via the cleaning module to either the horizontal input module 117 or the vertical input module 119. The second substrate handler 104 then transfers the substrate from the first cleaning module 107, the horizontal input module 117, or the vertical input module 119 to the transfer station 105A of the polishing station 105, as shown by path 1433. After the substrate has been processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is once again placed in the transfer station 105A. The second substrate handler 104 then transfers the substrate from the transfer station 105A to the first cleaning module 107 in the cleaning unit 106B, as shown by path 1434. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1435.As also mentioned above, the substrate cleaning process sequence performed along path 1435 can include, for example, one or more of process path steps 14351, 14352, 14353, and 14354, which require the use of blade assemblies 300 and 400 to transfer the substrate between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. After a process is performed in path 1435, the first substrate handler 103 then removes the substrate from the third cleaning module 110 and places the substrate in loading station 102A, as shown by path 1436.

[0143] In some embodiments of any of the processing sequences disclosed herein, the substrate processing sequence may include performing a cleaning process (e.g., a vertical vapor drying process) in the fifth cleaning module 121 after performing a cleaning process in the one or more second cleaning modules 109, or after one or more fourth cleaning modules 115 if a fourth cleaning module 115 is present, and before performing a cleaning process in the third cleaning module 110. In some other embodiments, the substrate processing sequence may include performing a cleaning process (e.g., a vertical vapor drying process) in the fifth cleaning module 121 as the final step of the processing sequence, and therefore after performing a cleaning process in the one or more second cleaning modules 109, or after one or more fourth cleaning modules 115 if a fourth cleaning module 115 is present.

[0144] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is defined by the claims that follow.

Claims

1. 1. A substrate cleaning system comprising: a first substrate cleaning unit; a first substrate handler disposed between the first substrate cleaning units and configured to transfer a substrate from the polishing system to the first substrate cleaning unit; The first substrate cleaning unit includes: a first cleaning chamber configured to receive the substrate from the first substrate handler and perform a first cleaning process on the substrate in a horizontal orientation; a second cleaning chamber configured to perform a second cleaning process on the substrate in a vertical orientation; a third cleaning chamber configured to perform a third cleaning process on the vertically oriented substrate; a fourth cleaning chamber configured to perform a fourth cleaning process on the horizontally oriented substrate; a second substrate handler configured to transfer the substrate from the first cleaning chamber to the second cleaning chamber, from the second cleaning chamber to the third cleaning chamber, and from the third cleaning chamber to the fourth cleaning chamber; A substrate cleaning system comprising:

2. further comprising a second substrate cleaning unit; The first substrate cleaning unit and the second substrate cleaning unit each include: a fifth cleaning chamber configured to perform a fifth cleaning process on the horizontally oriented substrate, the fourth cleaning chamber and the fifth cleaning chamber each including an integrated cleaning and drying module. The substrate cleaning system of claim 1 , further comprising:

3. a first supply gas box configured to supply a process gas to the fourth cleaning chamber; a second supply gas box configured to supply a process gas to the fifth cleaning chamber; The substrate cleaning system of claim 2 , further comprising:

4. 3. The substrate cleaning system of claim 2, wherein, for each of the first substrate cleaning unit and the second substrate cleaning unit, the respective second substrate handler is configured to transfer the substrate from the respective third cleaning chamber to a selected one of the respective fourth cleaning chamber and the respective fifth cleaning chamber.

5. 3. The substrate cleaning system of claim 2, wherein for each of the first substrate cleaning unit and the second substrate cleaning unit, the integrated cleaning and drying module of each of the fourth cleaning chambers is positioned vertically lower than the integrated cleaning and drying module of each of the fifth cleaning chambers.

6. The substrate cleaning system of claim 2 , wherein the second cleaning chamber or the third cleaning chamber is positioned vertically below the first cleaning chamber.

7. The second substrate handler includes: further comprising a substrate handling device; the substrate handling device, a first blade assembly; The first blade assembly includes: a gripping assembly including a pair of gripping blades configured to hold a substrate at its ends through the use of a gripping actuator; a first blade actuator for rotating the gripping assembly and the held substrate about a first axis, the first axis being substantially parallel to a front surface of the held substrate at a distal end of the first blade actuator; and a second blade actuator for rotating the gripper assembly and the first blade actuator about a second axis; The substrate cleaning system of claim 1 , comprising:

8. 8. The substrate cleaning system of claim 7, wherein when the first axis is oriented perpendicular to the first side of the first cleaning chamber and the first side of the fourth cleaning chamber, the distance between the first side of the first cleaning chamber and the first side of the fourth cleaning chamber is 102% to 150% of the overall length of the gripping assembly and the held substrate.

9. The second substrate handler includes: a first vertical actuator assembly including a first vertical rail and a first vertical actuator, the first blade assembly coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a horizontal actuator assembly including a horizontal rail and a first rail actuator, the first vertical actuator assembly coupled to a first portion of the horizontal rail and configured to be positioned along the horizontal rail by the first rail actuator; further comprising 8. The substrate cleaning system of claim 7, wherein the horizontal actuator assembly and the first and second vertical actuators of the second substrate handler are located at an outer periphery of the substrate cleaning system.

10. The second substrate handler includes: further comprising a second blade assembly; The second blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, the gripping blades configured to hold a substrate at its ends using the gripping actuator; a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; Including, 10. The substrate cleaning system of claim 9, wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and configured to be positioned along the horizontal rail by a second rail actuator.

11. 1. A substrate cleaning system comprising: a first cleaning chamber configured to perform a first cleaning process on a horizontally oriented substrate; a second cleaning chamber configured to perform a second cleaning process on the substrate in a vertical orientation; a third cleaning chamber configured to perform a third cleaning process on the vertically oriented substrate; a fourth cleaning chamber configured to perform a fourth cleaning process on the horizontally oriented substrate; a substrate handler configured to transfer the substrate from the first cleaning chamber to the second cleaning chamber, from the second cleaning chamber to the third cleaning chamber, and from the third cleaning chamber to the fourth cleaning chamber; The substrate cleaning system, wherein the second cleaning chamber or the third cleaning chamber is positioned vertically below the first cleaning chamber.

12. a fifth cleaning chamber configured to perform the fourth cleaning process on the horizontally oriented substrate, the fourth cleaning chamber and the fifth cleaning chamber each including an integrated cleaning and drying module. The substrate cleaning system of claim 11 further comprising:

13. 13. The substrate cleaning system of claim 12, wherein the substrate handler is configured to transfer the substrate from the third cleaning chamber to a selected one of the fourth cleaning chamber or the fifth cleaning chamber.

14. 13. The substrate cleaning system of claim 12, wherein the fourth cleaning chamber is positioned vertically above the fifth cleaning chamber.

15. The substrate handler includes: further comprising a substrate handling device; the substrate handling device, a first blade assembly; The first blade assembly includes: a gripping assembly including a pair of gripping blades configured to hold a substrate at its ends through the use of a gripping actuator; a first blade actuator for rotating the gripping assembly and the held substrate about a first axis, the first axis being substantially parallel to a front surface of the held substrate at a distal end of the first blade actuator; and a second blade actuator for rotating the gripper assembly and the first blade actuator about a second axis; The substrate cleaning system of claim 11 , comprising:

16. 12. The substrate cleaning system of claim 11, wherein when the first axis is oriented perpendicular to the first side of the first cleaning chamber and the first side of the fourth cleaning chamber, the distance between the first side of the first cleaning chamber and the first side of the fourth cleaning chamber is 102% to 150% of the overall length of the gripping assembly and the held substrate.

17. The substrate handler includes: a first vertical actuator assembly including a first vertical rail and a first vertical actuator, the first blade assembly coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a horizontal actuator assembly including a horizontal rail and a first rail actuator, the first vertical actuator assembly coupled to a first portion of the horizontal rail and configured to be positioned along the horizontal rail by the first rail actuator; further comprising The substrate cleaning system of claim 11 , wherein the horizontal actuator assembly and the first vertical actuator are disposed on an outer periphery of the substrate cleaning system.

18. The substrate handler includes: further comprising a second blade assembly; The second blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, the gripping blades configured to hold a substrate at its ends using the gripping actuator; a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly being coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; 20. The substrate cleaning system of claim 17, wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and configured to be positioned along the horizontal rail by a second rail actuator.

19. a fifth cleaning chamber configured to perform the fourth cleaning process on the horizontally oriented substrate, the fourth cleaning chamber and the fifth cleaning chamber each including an integrated cleaning and drying module; a first supply gas box configured to supply a process gas to the fourth cleaning chamber; a second supply gas box configured to supply a process gas to the fifth cleaning chamber; 20. The substrate cleaning system of claim 17, wherein the fourth cleaning chamber is positioned vertically above the fifth cleaning chamber.

20. The substrate handler includes: further comprising a second blade assembly; The second blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, the gripping blades configured to hold a substrate at its ends using the gripping actuator; a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly being coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; 20. The substrate cleaning system of claim 19, wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and configured to be positioned along the horizontal rail by a second rail actuator.

21. 1. A substrate handling apparatus, comprising: a first blade assembly; The first blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, the gripping actuator configured to hold the substrate between the pair of gripping blades during a first transfer process; a first blade actuator for rotating the gripper assembly about a first axis; and a second blade actuator configured to rotate the gripping assembly about a second axis, the second axis being substantially parallel to the front surface of the substrate; Including, rotation by the first blade actuator about the first axis results in rotation of the second blade actuator and the gripper assembly, and rotation by the second blade actuator about the second axis results in rotation of the gripper assembly; The substrate handling apparatus further comprises: a first vertical actuator assembly including a first vertical rail and a first vertical actuator, the first blade assembly coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a horizontal actuator assembly including a horizontal rail and a first rail actuator, the first vertical actuator assembly coupled to a first portion of the horizontal rail and configured to be positioned along the horizontal rail by the first rail actuator; A substrate handling apparatus comprising:

22. a second blade assembly, a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during a second transfer process; a second blade assembly including: a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; Including, 22. The substrate handling apparatus of claim 21, wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by a second rail actuator.

23. 23. The substrate handling apparatus of claim 22, wherein the gripper assembly of the second blade assembly is configured to hold the substrate in a vertical orientation between the pair of gripper blades.

24. 23. The substrate handling apparatus of claim 22, wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal rail by use of the first rail actuator and the second rail actuator, respectively.

25. 23. The substrate handling apparatus of claim 22, wherein the first blade assembly further comprises optical means for determining the position of the pair of gripper blades relative to the substrate.

26. and a processor and a non-transitory computer-readable medium having instructions for performing a method, the method comprising: translating a substrate held by the first blade assembly out of a processing region of a first cleaning module, the substrate held by the first blade assembly being oriented in a horizontal orientation with a device side of the substrate facing up; rotating the substrate and the first blade assembly from the horizontal orientation to a vertical orientation using the first blade actuator of the first blade assembly; using the second blade actuator of the first blade assembly to rotate the substrate and the first blade assembly while the substrate is in the vertical orientation so that the device side of the substrate faces in an opposite direction; translating the vertically oriented substrate and the first blade assembly along the horizontal rail using a first rail actuator to a position above a second cleaning module; inserting the substrate into a processing region of the second cleaning module using the first vertical actuator; translating the first blade assembly along the horizontal rail to a third cleaning module using the first rail actuator; transferring the substrate from the second cleaning module to the third cleaning module using the second blade assembly and the second rail actuator; removing the substrate from a processing region of the third cleaning module using the first blade assembly and the first vertical actuator; rotating the substrate and the first blade assembly from the vertical orientation to the horizontal orientation using the first blade actuator of the first blade assembly, wherein the horizontally oriented substrate is oriented with the device side up; inserting the substrate and the first blade assembly into a processing region of a fourth cleaning module using the first rail actuator; 23. The substrate handling apparatus of claim 22, comprising:

27. the first blade actuator of the first blade assembly includes a first actuator motor connected to a first drive gear and a first offset gear, the first actuator motor configured to rotate the first drive gear, thereby rotating the first offset gear about the first axis and causing the rotation of the second blade actuator and the first gripper assembly; 22. The substrate handling apparatus of claim 21, wherein the second blade actuator of the second blade assembly includes a second actuator motor connected to a second drive gear and a second offset gear, the second actuator motor configured to rotate the second drive gear, thereby rotating the second offset gear about the second axis and causing rotation of the first gripper assembly.

28. a plurality of electrical cables and / or pneumatic tubes associated with at least one of the second blade actuator and the gripping actuator and passing through openings formed in the second offset gear; 28. The substrate handling apparatus of claim 27, further comprising:

29. 22. The substrate handling apparatus of claim 21, wherein the horizontal actuator assembly and the first and second vertical actuators of the substrate handling apparatus are disposed at an outer edge of a cleaning system disposed within a chemical mechanical polishing system.

30. 1. A substrate handling apparatus, comprising: a gripping assembly including a pair of gripping blades, the blades operable by a gripping actuator to hold a substrate at its ends; a first blade actuator for rotating the gripper assembly and the substrate about a first axis, the first axis being substantially parallel to a front surface of the substrate held at an end thereof; a second blade actuator that rotates the gripper assembly and the first blade actuator about a second axis; a first cleaning module having a first side; a second cleaning module having a first side; Including, the gripper assembly is disposed between the first side of the first cleaning module and the first side of the second cleaning module; When the first axis is oriented perpendicular to the first side of the first cleaning module and the first side of the second cleaning module, the distance between the first side of the first cleaning module and the first side of the second cleaning module is 102% to 150% of the total length of the gripping assembly and the held substrate. Substrate handling equipment.

31. Horizontal rails and a first blade assembly including the gripper assembly; a first vertical actuator assembly including a first vertical rail and a first vertical actuator, the first blade assembly coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a second blade assembly, a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during a second transfer process; a second blade assembly including: a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; Furthermore, the first vertical actuator assembly is coupled to a first portion of the horizontal rail and is configured to be positioned along the horizontal rail by a first rail actuator; 31. The substrate handling apparatus of claim 30, wherein the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by a second rail actuator.

32. 32. The substrate handling apparatus of claim 31 , wherein the gripper assembly of the second blade assembly is configured to hold the substrate in a vertical orientation between the pair of gripper blades.

33. 33. The substrate handling apparatus of claim 32, wherein the first blade assembly further comprises optical means for determining the position of the pair of gripper blades relative to the substrate.

34. 32. The substrate handling apparatus of claim 31 , wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal rail by use of the first rail actuator and the second rail actuator, respectively.

35. the first blade assembly further includes a first actuator motor connected to a first drive gear and a first offset gear, the first actuator motor configured to rotate the first drive gear, thereby rotating the first offset gear about the first axis and causing the rotation of the second blade actuator and the gripper assembly; 31. The substrate handling apparatus of claim 30, wherein the second blade actuator includes a second actuator motor connected to a second drive gear and a second offset gear, the second actuator motor configured to rotate the second drive gear, thereby causing the second offset gear to rotate about the second axis and causing the rotation of the gripper assembly.

36. a plurality of electrical cables and / or pneumatic tubes associated with at least one of the second blade actuator and the gripping actuator and passing through openings formed in the second offset gear; 36. The substrate handling apparatus of claim 35, further comprising:

37. 1. A substrate handling apparatus, comprising: a first blade assembly; The first blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, the gripping actuator configured to hold the substrate between the pair of gripping blades during a first transfer process; a first blade actuator for rotating the gripping assembly about a first axis, wherein rotating the gripping assembly about the first axis is configured to rotate the substrate between a horizontal orientation and a vertical orientation during the first transfer process; and a second blade actuator configured to rotate the gripping assembly about a second axis, the second axis being substantially parallel to a front surface of the substrate, and wherein rotating the gripping assembly about the second axis is configured to orient the front surface of the substrate in an opposite direction during the first transfer process; Including, rotation by the first blade actuator about the first axis results in rotation of the second blade actuator and the gripper assembly, and rotation by the second blade actuator about the second axis results in rotation of the gripper assembly; The substrate handling apparatus further comprises: a first vertical actuator assembly including a first vertical rail and a first vertical actuator, the first blade assembly coupled to a portion of the first vertical rail and configured to be positioned along the first vertical rail by the first vertical actuator; a second blade assembly, a gripping assembly including a pair of gripping blades and a gripping actuator configured to hold the substrate between the pair of gripping blades during a second transfer process; a second blade assembly including: a second vertical actuator assembly including a second vertical rail and a second vertical actuator, the second blade assembly coupled to a portion of the second vertical rail and configured to be positioned along the second vertical rail by the second vertical actuator; 1. A horizontal actuator assembly comprising: Horizontal rail, a first horizontal rail actuator; and Second Horizontal Rail Actuator a horizontal actuator assembly including: Equipped with the first vertical actuator assembly is coupled to a first portion of the horizontal rail and is configured to be positioned along the horizontal rail by the first horizontal rail actuator; the second vertical actuator assembly is coupled to a second portion of the horizontal rail and is configured to be positioned along the horizontal rail by the second horizontal rail actuator. Substrate handling equipment.

38. 37. The substrate handling apparatus of claim 36, wherein the first blade assembly further comprises optical means for determining the position of the pair of gripper blades relative to the substrate.

39. 37. The substrate handling apparatus of claim 36, wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal rail using the first horizontal rail actuator and the second horizontal rail actuator, respectively.

40. 37. The substrate handling apparatus of claim 36, wherein the horizontal actuator assembly and the first and second vertical actuators of the substrate handling apparatus are disposed at the outer edge of a cleaning system disposed within a chemical mechanical polishing system.

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