Microfluidic chip, preparation method therefor, and microfluidic system

Abstract

A microfluidic chip (1001), a preparation method therefor, and a microfluidic system (1000) are provided. The microfluidic chip (1001) includes a first substrate (100), a second substrate (200), and a gap control layer (300) disposed between the first substrate (100) and the second substrate (200), the gap control layer (300) including an adhesive line (301) and a plurality of gap beads (302) of approximately the same size spaced apart in the adhesive line (301). Providing the plurality of gap beads (302) of approximately the same size spaced apart in the adhesive line (301) allows for very precise control of the gap between the first substrate (100) and the second substrate (200).

Description

Detailed Description of the Invention

[0001] This application refers to Chinese Patent Application No. 202211176002.7, entitled "MICROFLUIDIC CHIP AND PREPARATION METHOD THEREFOR, AND MICROFLUIDIC SYSTEM," filed on September 26, 2022, the entire contents of which are incorporated herein by reference.

[0002] [Technical field] The present disclosure relates to the technical field of microfluidics, and in particular to microfluidic chips, preparation methods therefor, and microfluidic systems.

[0003] [Background technology] Microfluidics is a technology that integrates basic operational units such as sample preparation, reaction, separation, and testing in biological, chemical, and medical analytical processes into microscale chips to automatically complete the entire analytical process. Due to its great potential in fields such as biology, chemistry, and medicine, microfluidics has developed into a new research field that encompasses academic fields such as biology, chemistry, medicine, fluid engineering, electronics, materials, and mechanics.

[0004] The fluid control principle of microfluidic chips is based on electrowetting technology, which uses potential to control the solid-liquid interfacial energy and the asymmetry of the droplet's contact angle to generate a tangential pushing force. The asymmetric deformation at the two edges of the droplet promotes the generation of a pressure difference inside the droplet. Microfluidic chips have also seen rapid development thanks to breakthroughs in materials science, micro-nano fabrication, and microelectronics. However, manufacturing remains a bottleneck hindering the development of microfluidics technology. Improving the manufacturing precision of microfluidic chips to achieve precise droplet control and accurate analysis is a key direction for the development of microfluidic chips. During battery charging and discharging, battery cells expand, compromising the battery's safety performance. Additionally, the battery's charge-discharge cycle continuously consumes electrolyte, affecting its service life.

[0005] [overview] The present disclosure is intended to solve at least one of the existing technical problems in the prior art, and therefore, an object of the present disclosure is to provide a microfluidic chip, a preparation method therefor, and a microfluidic system for improving the manufacturing accuracy of microfluidic chips.

[0006] In a first aspect of the present disclosure, one embodiment provides a microfluidic chip including a first substrate, a second substrate, and a gap control layer, wherein the second substrate faces the first substrate and is spaced apart from the first substrate, and the gap control layer is disposed between the first substrate and the second substrate, and the gap control layer includes an adhesive line and a plurality of gap beads of approximately the same dimensions spaced apart in the adhesive line.

[0007] Providing a plurality of gap beads spaced apart in the adhesive line between the first substrate and the second substrate allows for control of the gap between the first substrate and the second substrate based on the size of the gap beads. The dimensional uniformity of the gap beads can be ensured by improving processing accuracy, and therefore the dimensional uniformity of the gap between the first substrate and the second substrate can be ensured to achieve accurate droplet control and test analysis, thereby improving the yield and test accuracy of the microfluidic chip.

[0008] In some embodiments, the first substrate includes a hydrophobic dielectric functional layer, and an adhesive line is disposed along the outer edge of the hydrophobic dielectric functional layer, and the outer edge of the hydrophobic dielectric functional layer is within the adhesive line.

[0009] The adhesive line is arranged along the outer edge of the hydrophobic dielectric functional layer, and the outer edge of the hydrophobic dielectric functional layer is within the area of ​​the adhesive line. Therefore, the adhesive line can seal the edge of the hydrophobic dielectric functional layer, thereby avoiding the influence on the test results caused by leakage of medium oil or reaction reagents or the intrusion of external impurities, and preventing the hydrophobic dielectric functional layer from falling off due to immersion in liquid, thereby improving the quality stability of the microfluidic chip.

[0010] In some embodiments, the gap bead is disposed outside the outer periphery of the hydrophobic dielectric functional layer.

[0011] Positioning the gap beads at a position offset from the hydrophobic dielectric functional layer can avoid unevenness in gap height caused by some of the gap beads being positioned on the hydrophobic dielectric functional layer, and can also avoid the impact on gap uniformity caused by low surface accuracy of the hydrophobic dielectric functional layer.

[0012] In some embodiments, the first substrate includes a circuit board and a hydrophobic dielectric functional layer, the circuit board includes a substrate and an electrode disposed on the substrate, the hydrophobic dielectric functional layer is disposed on a surface of the electrode that is closer to the second substrate, and the second substrate includes a conductive cover plate and a hydrophobic layer facing each other, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

[0013] Placing the droplet movement space between the hydrophobic dielectric functional layer of the first substrate and the hydrophobic layer of the second substrate can improve testing efficiency by reducing the surface tension of the droplet, allowing the droplet to move precisely under the control of the electrodes.

[0014] In some embodiments, the hydrophobic dielectric functional layer is a single-layer hydrophobic dielectric composite layer, and the hydrophobic dielectric composite layer is bonded to the surface of the electrode that is closer to the second substrate by an adhesive layer.

[0015] The functions of the hydrophobic layer and the dielectric layer are achieved by one film, and therefore the number and thickness of film layers on the surface of the electrode are reduced, thereby shortening the time required for preparing the film layers and avoiding droplet movement and the impact on testing due to the loss of flatness caused by stacking multiple film layers.

[0016] In some embodiments, the hydrophobic dielectric functional layer has a first pattern and the hydrophobic layer has a second pattern that is a mirror image of the first pattern, and the first pattern and the second pattern together define a droplet movement space.

[0017] The droplet movement space area can be defined by providing a first pattern and a second pattern that are mirror images of each other, and the adhesive line area is kept outside the droplet movement space to facilitate guiding subsequent adhesive dispensing and avoid insufficient sealing caused by adhesive leakage.

[0018] In some embodiments, the gap control layer further includes at least one support adhesive block positioned within the outer edge of the hydrophobic dielectric functional layer and abutting the first substrate and the second substrate, wherein the projection of the at least one support adhesive block on the first substrate is offset from the electrode on the first substrate.

[0019] The support adhesive block is positioned in the droplet movement space to provide better support between the first and second substrates, allowing the microfluidic chip to receive forces more uniformly and have a more stable structure, thereby extending the service life of the microfluidic chip. The support adhesive block is offset from the electrodes to avoid any influence on droplet movement and ensure the accuracy of droplet movement control.

[0020] In some embodiments, the hydrophobic dielectric functional layer further has a third pattern which is at least one hollowed area for accommodating at least one support adhesive block, and at least one gap bead is provided in any one of the at least one support adhesive block.

[0021] A hollowed-out area is formed in the hydrophobic dielectric functional layer for placing a support adhesive block, and a gap bead is placed on the support adhesive block to provide better support for the microfluidic chip and avoid the impact on the gap height uniformity caused by the formation of a bulge due to a certain degree of deformation in the middle of the first substrate in the droplet movement space.

[0022] In some embodiments, the gap bead disposed in the at least one support adhesive block has approximately the same dimensions as the gap bead disposed in the adhesive line.

[0023] Setting the dimensions of the gap bead in the support adhesive block to be approximately the same as the dimensions of the gap bead in the adhesive line contributes to controlling the gap height at the location where the support adhesive block is placed to approximately match the dimensions of the gap bead, and therefore to match the gap height at other locations on the microfluidic chip, further ensuring uniformity of the gap height while applying a uniform force to the microfluidic chip.

[0024] In some embodiments, the edge of the third pattern is at least partially located within the range of at least one corresponding support adhesive block, and the projection of the gap bead located on any one of the at least one support adhesive block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

[0025] In some embodiments, the gap bead has a diameter of 800±5 microns.

[0026] In some embodiments, the droplet movement space has a height of greater than or equal to 710 microns and less than or equal to 740 microns.

[0027] Selecting the appropriate dimensions and appropriate tolerance of the gap bead according to the requirements on test accuracy and the droplet flow needs of the microfluidic chip can not only meet the functional needs of the microfluidic chip, but also improve the economic efficiency of mass production by considering both the manufacturing cost and manufacturing process.

[0028] In a second aspect of the present disclosure, an embodiment comprises: providing a first substrate; preparing a gap control layer on a surface of one side of a first substrate, the gap control layer including an adhesive line and a plurality of gap beads of approximately the same size spaced apart in the adhesive line; providing a second substrate; placing a second substrate on the gap control layer in alignment with the first substrate to form a cell; curing the gap control layer; The present invention provides a method for preparing a microfluidic chip, comprising:

[0029] Providing multiple gap beads of approximately equal dimensions spaced apart in the adhesive line allows for very precise control of the gap between the first and second substrates, thereby improving the manufacturing accuracy of the microfluidic chip and ensuring controllability of droplet movement and accuracy of test results.

[0030] In some embodiments, preparing a gap control layer on one surface of the first substrate includes dispensing adhesive along the one surface of the first substrate to form an adhesive line, and arranging a plurality of gap beads of approximately the same dimensions at intervals in the adhesive line.

[0031] Compared to a process in which gap beads are first mixed with adhesive and then applied to the surface of a first substrate, this process contributes to ensuring gap uniformity by first dispensing adhesive onto the surface of the first substrate to form an adhesive line and then disposing gap beads of approximately the same dimensions at intervals along the adhesive line. On the one hand, the adhesive line is positioned to allow for a position for gap bead placement so that the gap beads can be distributed stably throughout the entire adhesive line, and the adhesive line has viscosity that ensures that the gap bead does not easily change position after placement. On the other hand, the position of the gap bead can be subjectively set and flexibly adjusted as needed, avoiding the inability to control the placement position of the gap bead during mixing and application, thereby improving the gap uniformity of the droplet movement space throughout the microfluidic chip.

[0032] In some embodiments, the step of providing a first substrate comprises: providing a circuit board; Preparing a hydrophobic dielectric functional layer on a circuit board Including, providing a second substrate; providing a conductive cover plate; Preparing a hydrophobic layer on a conductive cover plate Including, placing a second substrate on the gap control layer in alignment with the first substrate to form a cell; Covering the gap bead of the gap control layer with a second substrate so that the side of the second substrate on which the hydrophobic layer is disposed faces the side of the first substrate on which the hydrophobic dielectric functional layer is disposed, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer. Includes.

[0033] Separately preparing the first and second substrates and then aligning them to form a cell can improve the manufacturing efficiency of microfluidic chips. Covering the gap bead with the second substrate can ensure the dimensional uniformity of the gap. After forming the cell, arranging the droplet movement space between the hydrophobic dielectric functional layer and the hydrophobic layer can ensure smooth droplet movement, thereby improving droplet testing efficiency.

[0034] In some embodiments, the step of ejecting adhesive along one side surface of the first substrate to form an adhesive line includes ejecting adhesive along the outer edge of the hydrophobic dielectric functional layer on the one side surface of the first substrate to form an adhesive line, wherein the outer edge of the hydrophobic dielectric functional layer is within the range of the adhesive line.

[0035] The adhesive lines are arranged along the outer edge of the hydrophobic dielectric functional layer to allow the liquid transfer space to form a sealed chamber, so that the adhesive lines can seal the edges of the hydrophobic dielectric functional layer, thereby preventing the leakage of medium oil or reaction reagents or the intrusion of external impurities from affecting the test results, thereby improving the quality stability of the microfluidic chip. In addition, by covering the outer edge of the hydrophobic dielectric functional layer with the adhesive lines, the edge positions can be sufficiently sealed to prevent the hydrophobic dielectric functional layer from falling off due to the outer edge being exposed to droplets.

[0036] In some embodiments, the gap bead is disposed outside the outer periphery of the hydrophobic dielectric functional layer.

[0037] Placing the gap bead outside the extent of the hydrophobic dielectric functional layer can improve the uniformity of the gap in the microfluidic chip by ensuring that the gap is not affected by the thickness of the hydrophobic dielectric functional layer.

[0038] In some embodiments, preparing a hydrophobic dielectric functional layer on a circuit board includes preparing a film for forming the hydrophobic dielectric functional layer on one surface of the circuit board on which electrodes are provided, and patterning the film to form the hydrophobic dielectric functional layer.

[0039] Preparing a hydrophobic layer on the conductive cover plate includes preparing a hydrophobic layer on one surface of the conductive cover plate, wherein the outer edge of the pattern of the hydrophobic layer is a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer.

[0040] In some embodiments, preparing the hydrophobic dielectric functional layer on the circuit board further includes forming a hydrophobic dielectric functional layer having a first pattern and a third pattern that is offset from the first pattern and the electrode, wherein the third pattern is at least one hollowed-out region.

[0041] Preparing the hydrophobic layer on the conductive cover plate includes forming a hydrophobic layer having a second pattern that is a mirror image of the first pattern and that defines a droplet movement space together with the first pattern.

[0042] The step of preparing the gap control layer further includes discharging adhesive into at least one hollowed area of ​​the third pattern to form at least one support adhesive block, and disposing at least one gap bead in any one of the at least one support adhesive block.

[0043] A hollowed-out area is formed in the hydrophobic dielectric functional layer for placing a support adhesive block, and a gap bead is placed on the support adhesive block to provide better support for the microfluidic chip and avoid the impact on the gap height uniformity caused by the formation of a bulge due to intermediate deformation of the first substrate in the droplet movement space.

[0044] In some embodiments, the gap bead disposed in the at least one support adhesive block has approximately the same dimensions as the gap bead disposed in the adhesive line.

[0045] Setting the dimensions of the gap bead in the support adhesive block to be approximately the same as the dimensions of the gap bead in the adhesive line contributes to controlling the gap height at the location where the support adhesive block is placed to match the dimensions of the gap bead, and therefore to match the gap height at other locations on the microfluidic chip, further ensuring uniformity of the gap height while applying a uniform force to the microfluidic chip.

[0046] In some embodiments, the edges of the third pattern are at least partially positioned within the range of at least one corresponding supporting adhesive block, and the projection of the gap bead on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

[0047] Positioning the gap beads at an offset position relative to the hydrophobic dielectric functional layer can avoid non-uniformity in gap height due to various gap beads being offset in position, and can also avoid the impact on gap uniformity due to low surface accuracy of the hydrophobic dielectric functional layer.

[0048] In some embodiments, before curing the gap control layer, the method further includes applying a preset pressure to the outer surface of the first substrate and the outer surface of the second substrate.

[0049] A preset pressure is applied to the outer surfaces of the first substrate and the second substrate after the first substrate and the second substrate are aligned and before the gap control layer is cured, and the gap bead is pressed toward the first substrate and the second substrate to ensure uniformity of the gap between the first substrate and the second substrate throughout the microfluidic chip.

[0050] In a third aspect of the present disclosure, an embodiment provides a microfluidic system including a control module and a microfluidic chip according to any one of the above embodiments or a microfluidic chip prepared by the method according to any one of the above embodiments, wherein the control module is electrically connected to the microfluidic chip to control an electrical signal supplied to the microfluidic chip.

[0051] The above description is only a summary of the technical solution of the present application. In order to make the technical means of the present application more clearly understood and implemented in accordance with the contents of this specification, and to make the above and other objects, features and advantages of the present application more clearly and understandable, the embodiments of the present application are described in detail below.

[0052] In the figures, the same reference numerals refer to the same or similar components or elements throughout the several views, unless otherwise specified. The figures are not necessarily drawn to scale. It should be understood that the figures illustrate only some embodiments disclosed in accordance with the present application and should not be construed as limiting the scope of the present application. [Brief explanation of the drawings]

[0053] [Figure 1] 1 is a schematic structural diagram of a microfluidic chip according to some embodiments of the present disclosure. [Figure 2] 1 is a schematic structural diagram of a microfluidic chip according to some embodiments of the present disclosure. [Figure 3] FIG. 2 is a schematic structural diagram of a microfluidic chip according to some embodiments of the present disclosure from another perspective. [Figure 4] FIG. 1 is a schematic structural diagram of a first substrate of a microfluidic chip according to some embodiments of the present disclosure. [Figure 5] FIG. 2 is a schematic structural diagram of a second substrate of a microfluidic chip according to some embodiments of the present disclosure. [Figure 6] 1 is a schematic flow chart of a method for preparing a microfluidic chip according to some embodiments of the present disclosure. [Figure 7] 1 is a schematic structural diagram of a microfluidic system according to some embodiments of the present disclosure.

[0054] [List of references] 1000 Microfluidic Systems 1001 Microfluidic Chip 1002 Control Module 100 first substrate 101 Circuit Board 1011 board 1012 Electrode 102 Hydrophobic dielectric functional layer 1021 First Pattern 1022 Third Pattern 103 Adhesive layer 200 Second substrate 201 Conductive cover plate 202 Hydrophobic layer 2021 Second Pattern 300 Gap Control Layer 301 Adhesive Line 302 Gap bead 303 Droplet movement space 304 Support Adhesive Block

[0055] Detailed Description of the Embodiments The embodiments of the technical solution of the present disclosure are described in detail below with reference to the accompanying drawings. The following embodiments are merely intended to more clearly illustrate the technical solution of the present disclosure, and therefore merely serve as examples, and are not intended to limit the protection scope of the present disclosure.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the disclosure. The terms "comprises" and "having" and any variations thereof in the specification and claims of this disclosure, and in the brief description of the accompanying drawings described above, are intended to cover a non-exclusive inclusion.

[0057] In describing the embodiments of the present disclosure, the technical terms "first," "second," etc. are merely used to distinguish various objects and should not be interpreted as indicating or implying relative importance, or implying the number, particular order, or primary-secondary relationship of the technical features shown. In describing the embodiments of the present disclosure, the word "plurality" means two or more unless expressly and specifically defined otherwise.

[0058] The phrase "embodiment" as used herein means that a particular feature, structure, or characteristic described with reference to an embodiment may be included in at least one embodiment of the present disclosure. The appearances of this phrase in various places throughout the specification do not necessarily refer to the same embodiment or to separate or alternative embodiments that do not include other embodiments. It should be understood by those skilled in the art that the embodiments described herein can be combined with other embodiments, either explicitly or implicitly.

[0059] In describing embodiments of the present disclosure, the term "and / or" is intended to describe only a relationship between related objects and indicates that a three-way relationship may exist, for example, A and / or B may include A being present alone, both A and B being present, and B being present alone. Additionally, the symbol " / " in this specification generally indicates that related objects are in an "or" relationship.

[0060] In describing embodiments of the present disclosure, the term "plurality" means two or more (including two); similarly, the term "multiple groups" means two or more groups (including two groups); and the term "multiple pieces" means two or more pieces (including two pieces).

[0061] In describing the embodiments of the present disclosure, it should be understood that the orientations or positional relationships indicated by technical terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. are based on the orientations or positional relationships shown in the drawings, are intended merely for ease of and simplification of the description of the embodiments of the present disclosure, and do not indicate or imply that the devices or elements referred to must have a particular orientation or be configured and operated in a particular orientation, and therefore cannot be construed as limiting the embodiments of the present disclosure.

[0062] In describing the embodiments of the present disclosure, unless otherwise expressly specified and defined, the technical terms "attach," "connect," "connection," "fix," etc. should be interpreted broadly, and may refer to, for example, a fixed connection, a detachable connection, or an integral part, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or an internal communication between two elements or an interaction between two elements. Those skilled in the art may interpret the specific meanings of the above terms in the embodiments of the present disclosure according to the specific circumstances.

[0063] The chip substrate and chip cover of a microfluidic chip together form a liquid migration space, and the height of the liquid migration space, i.e., the gap between the lower surface of the hydrophobic layer of the chip cover and the upper surface of the hydrophobic layer of the chip substrate, is crucial for liquid control. The gap needs to maintain good uniformity throughout the chip; otherwise, non-uniformity in the gap may cause the liquid area to change, making it impossible to align the liquid with the electrodes, and therefore resulting in an inability to control the liquid.

[0064] The embodiments of the present disclosure will be further described with reference to the drawings, but the present disclosure is not limited to the following embodiments.

[0065] 1 , in a first aspect of the present disclosure, some embodiments provide a microfluidic chip 1001 including a first substrate 100 and a second substrate 200 facing each other and spaced apart, and a gap control layer 300 disposed between the first substrate 100 and the second substrate 200. The gap control layer 300 includes an adhesive line 301 and a plurality of gap beads 302 disposed on the adhesive line 301. The plurality of gap beads 302 have substantially the same dimensions and are spaced apart.

[0066] It can be understood that the gap beads are, for example, hard spheres and may be made of metals such as steel, gold, or titanium. Having approximately the same dimensions includes cases where the gap beads have the same nominal dimensions but have allowable errors caused by manufacturing or processing accuracy. Multiple gap beads having the same dimensions are further considered to be within the range of approximately the same dimensions defined in this embodiment, and this range should be included in the scope of protection of this embodiment.

[0067] Providing a plurality of gap beads spaced apart in the adhesive line between the first substrate and the second substrate allows for control of the gap between the first substrate and the second substrate based on the size of the gap beads. Since the dimensional uniformity of the gap beads can be ensured by improving processing accuracy, the dimensional uniformity of the gap between the first substrate and the second substrate can be ensured to achieve accurate droplet control and test analysis, thereby improving the yield and test accuracy of the microfluidic chip.

[0068] In some embodiments, the first substrate 100 includes a hydrophobic dielectric functional layer 102, and an adhesive line 301 is arranged along the outer edge of the hydrophobic dielectric functional layer 102, and the outer edge of the hydrophobic dielectric functional layer 102 is within the adhesive line 301.

[0069] In some embodiments, the gap bead 302 is positioned outside the outer edge of the hydrophobic dielectric functional layer 102. This positioning prevents the gap between the first and second substrates from having a non-uniform height due to a non-uniform thickness of the hydrophobic dielectric functional layer 102.

[0070] In some embodiments, the first substrate 100 further includes a circuit board 101. For example, as shown in FIGS. 1 and 2 , the first substrate 100 includes a circuit board 101 and a hydrophobic dielectric functional layer 102, which are arranged in order from bottom to top. A portion of the bottom of an adhesive line 301 is disposed on the hydrophobic dielectric functional layer, and another portion of the bottom of the adhesive line 301 is disposed on the circuit board 101, so that the outer edge of the hydrophobic dielectric functional layer 102 is within the range of the adhesive line 301. The adhesive line 301 is used to reduce the risk of the hydrophobic dielectric functional layer falling off due to immersion in liquid while bonding the circuit board 101 to the second substrate 200.

[0071] 1 and 2, the second substrate 200 includes a conductive cover plate 201 and a hydrophobic layer 202, which are arranged sequentially from top to bottom. A portion of the top of the adhesive line 301 contacts the conductive cover plate 201, and another portion of the top of the adhesive line 301 contacts the hydrophobic layer 202. Thus, the adhesive line 301 bonds the conductive cover plate 201 to the circuit board 101, and a droplet movement space 303 is formed in the area surrounded by the adhesive line 301 between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202. In addition, the adhesive line 301 prevents the outer edges of the hydrophobic layer and the hydrophobic dielectric functional layer from being immersed in liquid.

[0072] As shown in Figures 1 and 2, the gap bead 302 is positioned outside the outer edges of the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202, and this positioning avoids uneven height of the gap between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202 caused by uneven thickness of the gap between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202.

[0073] The circuit board 101 typically includes a substrate 1011 and electrodes 1012 disposed on the substrate 1011. The substrate is used to support other functional film layers of the microfluidic chip and is usually made of a non-conductive material such as plastic, glass, or a PCB substrate. The electrodes can be arranged according to the flow path design and test function of the microfluidic chip. They can be made of conductive materials, such as metal materials such as copper, gold, silver, or titanium, or transparent conductive materials such as indium tin oxide (ITO). The electrodes can be prepared by industrial printed circuit board processes. The conductive cover plate can be made of indium tin oxide (ITO)-plated glass or PET. The hydrophobic dielectric functional layer is used to insulate the electrodes from the liquid to prevent current conduction to the liquid, and is also used together with a hydrophobic layer to provide a smooth surface for liquid movement and reduce movement resistance. The hydrophobic dielectric functional layer can be a single-layer functional film layer or a multi-layer functional film layer formed by stacking dielectric and hydrophobic layers. The hydrophobic layer can be made from fluoride coatings that have hydrophobic properties, such as Teflon and Cytop.

[0074] By arranging the droplet movement space between the hydrophobic dielectric functional layer 102 of the first substrate 100 and the hydrophobic layer 202 of the second substrate 200, the surface tension of the droplet can be reduced, allowing the droplet to move precisely under the control of the electrodes, thereby improving testing efficiency.

[0075] In some embodiments, as shown in FIG. 2, the hydrophobic dielectric functional layer 102 is a single-layer hydrophobic dielectric composite layer that is bonded to the surface of the electrode 1012 on the substrate 1011 that is closer to the second substrate 200 by an adhesive layer 103.

[0076] The hydrophobic dielectric composite layer is typically a polytetrafluoroethylene (PTFE) film, a fluorinated ethylene propylene (FEP) film, or the like.

[0077] The functions of the hydrophobic layer and the dielectric layer are achieved by one film layer, thereby reducing the number and thickness of film layers on the surface of the electrode, thereby shortening the preparation time of the film layers to avoid droplet movement and the impact on testing due to the loss of flatness caused by stacking multiple film layers.

[0078] In some embodiments, as shown in Figures 3 to 5, the hydrophobic dielectric functional layer 102 has a first pattern 1021 and the hydrophobic layer 202 has a second pattern 2021 that is a mirror image of the first pattern 1021, and the first pattern 1021 and the second pattern 2021 precisely align with each other after the first substrate 100 and the second substrate 200 are aligned, and thus together define a region of the droplet movement space.

[0079] It can be understood that the first pattern 1021 and the second pattern 2021 are patterns formed by the remaining film layers, and that no film layers are retained outside the outer boundaries of the first pattern 1021 and the second pattern 2021. The first pattern 1021 can be prepared by laser engraving or drilling, and the second pattern 2021 can be prepared by mask-spraying.

[0080] The area of ​​the droplet movement space can be defined by providing a first pattern 1021 and a second pattern 2021 that are mirror images of each other, and the area of ​​the adhesive line is kept outside the droplet movement space to facilitate guiding subsequent adhesive dispensing and prevent inadequate sealing caused by adhesive leakage.

[0081] In some embodiments, as shown in FIG. 3, the adhesive line 301 is arranged along the outer edge of the first pattern 1021 of the hydrophobic dielectric functional layer 102, and the outer edge of the hydrophobic dielectric functional layer 102 is within the adhesive line 301.

[0082] The adhesive line 301 is arranged along the outer edge of the hydrophobic dielectric functional layer 102 to enable the liquid transfer space to form a sealed chamber, and the outer edge of the hydrophobic dielectric functional layer 102 is within the area of ​​the adhesive line 301, so that the adhesive line 301 can seal the edge of the hydrophobic dielectric functional layer 102, thereby avoiding the influence on the test results caused by leakage of medium oil or reaction reagents or the intrusion of external impurities, and also preventing the hydrophobic dielectric functional layer from falling off due to immersion in liquid, thereby improving the quality stability of the microfluidic chip.

[0083] In some embodiments, as shown in Figures 3 and 4, the gap control layer 300 further includes at least one support adhesive block 304 positioned within the outer edge of the hydrophobic dielectric functional layer 102 and abutting the first substrate 100 and the second substrate 200, and the projection of the at least one support adhesive block 304 on the first substrate 100 is offset from the first pattern 1021 and the electrode 1012.

[0084] As shown in FIG. 3, the support adhesive block 304 is typically located at the center or elsewhere on the microfluidic chip 1001, and there may be one or more support adhesive blocks.

[0085] The support adhesive block 304 may be, for example, an adhesive block with specific support and bonding capabilities, or may be an adhesive block formed by disposing a support (e.g., a gap bead) in the adhesive. The support adhesive block is disposed in the droplet movement space to provide better support between the first substrate 100 and the second substrate 200, thereby allowing the microfluidic chip 1001 to receive forces more uniformly and have a more stable structure, thereby extending the service life of the microfluidic chip. The support adhesive block 304 is offset from the first pattern 1021 and the electrodes 1012 to avoid affecting droplet movement and ensure the accuracy of droplet movement control.

[0086] In some embodiments, the hydrophobic dielectric functional layer 102 further has a third pattern 1022. The third pattern 1022 is at least one hollowed area for accommodating the support adhesive blocks 304, and at least one gap bead 302 is disposed in any one of the support adhesive blocks 304.

[0087] A hollowed-out area is formed in the hydrophobic dielectric functional layer 102 for placing the support adhesive block 304, and the gap bead 302 is placed on the support adhesive block 304 to provide better support for the microfluidic chip 1001, especially for the middle region of the droplet movement space, and to avoid the impact on the uniformity of the gap height caused by the formation of a bulge due to a certain degree of deformation in the middle of the first substrate 100 in the droplet movement space.

[0088] In some embodiments, the gap bead 302 disposed in the support adhesive block 304 has approximately the same dimensions as the gap bead 302 disposed in the adhesive line 301 .

[0089] It can be appreciated that the hydrophobic layer has a nanoscale thickness and is not a rigid coating, so that the thickness of the hydrophobic layer may have a negligible effect on the gap height between the first substrate 100 and the second substrate 200. Setting the dimensions of the gap bead 302 in the support adhesive block 304 to be approximately the same as the dimensions of the gap bead 302 in the adhesive line 304 contributes to controlling the gap height at the position where the support adhesive block 304 is disposed to match the dimensions of the gap bead 302 and therefore match the gap height at other positions on the microfluidic chip 1001, thereby further improving the gap height uniformity while applying a uniform force to the microfluidic chip 1001 to prevent the gap height uniformity from being affected by intermediate deformation of the substrate in the droplet movement space. Positioning the support adhesive block 304 offset from the electrode 1012 can also prevent the gap bead 302 from contacting the electrode 1012.

[0090] Furthermore, the edges of the hollowed area may be partially or completely within the area of ​​the support adhesive block 304, thereby improving sealing performance throughout the microfluidic chip 1001 by partially or completely sealing the edges of the hollowed area to prevent liquid leakage.

[0091] In some embodiments, as shown in FIG. 3, the projections of all gap beads 302 (including the gap beads arranged in the adhesive lines 301 and the supporting adhesive blocks 304) on the first substrate 100 are offset from the projections of the hydrophobic dielectric functional layer 102 on the first substrate 100, i.e., the gap beads 302 are arranged outside the hydrophobic dielectric functional layer 102.

[0092] To ensure the uniformity of the gap height, the dimensional accuracy of the gap bead 302 must be relatively high. The sum of the thickness of the hydrophobic dielectric functional layer 102 and the thickness of the adhesive layer 103 is a value that cannot be easily ignored. If some of the gap beads 302 contact the hydrophobic dielectric functional layer 102 and some do not, the corresponding gap height cannot be maintained constant. In particular, because the electrode 1012 is usually arranged on the surface of the substrate 1011 in a patterned form, it is often difficult to maintain a high level of surface flatness of the hydrophobic dielectric functional layer 102 arranged on the surface of the electrode 1012. Therefore, it is also difficult to adequately control the gap error when the gap bead 302 is arranged on the surface of the hydrophobic dielectric functional layer 102. The substrate 1011 is relatively simple and can be manufactured accurately, which can fully meet the accuracy requirements and also fully achieve the uniformity of the gap height when the gap bead 302 is arranged.

[0093] In some embodiments, the gap bead 302 has a diameter of 800±5 microns.

[0094] In some embodiments, the droplet movement space has a height of greater than or equal to 710 microns and less than or equal to 740 microns.

[0095] Selecting the appropriate dimensions and appropriate tolerance of the gap bead according to the requirements for test accuracy and the droplet flow needs of the microfluidic chip 1001 can not only meet the functional needs of the microfluidic chip, but also improve the economic efficiency of mass production by considering both the manufacturing cost and manufacturing process.

[0096] In some embodiments, the gap beads 302 may be uniformly distributed, i.e., adjacent gap beads 302 are spaced approximately equal distances apart. Uniformly distributed gap beads 302 are more conducive to maintaining gap uniformity at various locations and avoiding gap non-uniformity affecting droplet control.

[0097] In a second aspect of the present disclosure, an embodiment provides a method for preparing a microfluidic chip. As shown in FIG. 6, the method includes: S601: preparing a first substrate 100; S602: preparing a gap control layer 300 on the surface of the first substrate 100, the gap control layer 300 including an adhesive line 301 and a plurality of gap beads 302 of approximately the same size spaced apart in the adhesive line 301; S603: preparing a second substrate 200; S604: Placing a second substrate 200 on the gap control layer 300 in alignment with the first substrate 100 to form a cell; S605: curing the gap control layer 300; Includes:

[0098] Typically, the step of curing the gap control layer 300 can be performed by curing the applied adhesive by photocuring, heat curing, or other practical curing methods.

[0099] Providing multiple gap beads of approximately the same or similar dimensions spaced apart in the adhesive line allows for very precise control of the gap between the first and second substrates, thereby improving the manufacturing accuracy of the microfluidic chip and ensuring controllability of droplet movement and accuracy of test results.

[0100] In some embodiments, as shown in FIGS. 1-3, S601 includes: providing a circuit board 101; preparing a hydrophobic dielectric functional layer 102 on a circuit board 101; Including, The step of preparing the second substrate 200 includes: providing a conductive cover plate 201; preparing a hydrophobic layer 202 on a conductive cover plate 201; Includes.

[0101] In some embodiments, S604 includes: Covering the gap bead 302 of the gap control layer 300 with the second substrate 200 so that the side of the second substrate on which the hydrophobic layer 202 is disposed faces the side of the first substrate 100 on which the hydrophobic dielectric functional layer 102 is disposed, and a droplet movement space 303 is formed in the area surrounded by the adhesive line 301 between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202. Includes.

[0102] 1, the circuit board 101 typically includes a substrate 1011 and an electrode 1012 disposed on the substrate 1011. The substrate 1011 is configured to support other functional film layers of the microfluidic chip 1001.

[0103] Preparing the first substrate 100 and the second substrate 200 separately and then aligning the first substrate 100 and the second substrate 200 to form a cell can improve the manufacturing efficiency of the microfluidic chip 1001, covering the gap bead 302 with the second substrate 200 can ensure the dimensional uniformity of the gap, and after forming the cell, arranging the droplet movement space between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202 allows the droplet to move smoothly, thereby improving the droplet testing efficiency.

[0104] In some embodiments, the step of dispensing adhesive along the surface of one side of the first substrate 100 to form adhesive lines 301 includes: Discharging adhesive along the outer edge of the hydrophobic dielectric functional layer 102 on one surface of the first substrate 100 to form an adhesive line 301, where the outer edge of the hydrophobic dielectric functional layer 102 is within the range of the adhesive line 301. Includes:

[0105] The adhesive lines 301 are arranged along the outer edge of the hydrophobic dielectric functional layer 102 to allow the liquid transfer space to form a sealed chamber, and the outer edge of the hydrophobic dielectric functional layer 102 is within the area of ​​the adhesive lines 301. Therefore, the adhesive lines 301 can seal the edges of the hydrophobic dielectric functional layer 102, thereby preventing the leakage of medium oil or reaction reagents or the intrusion of external impurities from affecting the test results, thereby improving the quality stability of the microfluidic chip 1001. In addition, the ability to seal can also prevent the hydrophobic dielectric functional layer 102 from falling off due to immersion in liquid.

[0106] In some embodiments, the step of preparing the hydrophobic dielectric functional layer 102 on the circuit board 101 includes: preparing a hydrophobic dielectric functional layer 102 on one surface of the circuit board 101 on which the electrode 1012 is provided; patterning the hydrophobic dielectric functional layer 102; Includes:

[0107] For example, first, one surface of the circuit board 101 on which the electrode 1012 is provided is uniformly coated with an adhesive layer, then the other surface of the circuit board 101 on which the electrode is provided is covered with a film for preparing the hydrophobic dielectric functional layer 102 by a coating process, and the film is engraved into desired shapes such as a first pattern and a third pattern by laser engraving or the like to form a patterned hydrophobic dielectric functional layer 102.

[0108] Optionally, the patterned hydrophobic dielectric functional layer 102 is prepared by other processes, for example, a film for preparing the hydrophobic dielectric functional layer 102 is provided, the film is punched and cut into the described shape by a punching and cutting process or the like to obtain the patterned hydrophobic dielectric functional layer 102, and then the hydrophobic dielectric functional layer 102 is bonded to one surface of the circuit board 101 on which the electrodes 1012 are provided.

[0109] In some embodiments, the step of preparing the hydrophobic layer 202 on the conductive cover plate 201 comprises: preparing a hydrophobic layer 202 on one surface of the conductive cover plate 201, the outer edge of the hydrophobic layer being a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer 102, and the hydrophobic layer and the pattern of the hydrophobic dielectric functional layer 102 together defining a region of the droplet movement space; Includes:

[0110] The area of ​​the droplet movement space can be defined by providing a first pattern 1021 and a second pattern 2021 that are mirror images of each other, and the area of ​​the adhesive line is kept outside the droplet movement space to facilitate guiding subsequent adhesive dispensing and prevent inadequate sealing caused by adhesive leakage.

[0111] For example, the hydrophobic layer 202 is prepared by a mask-spraying process, i.e., the hydrophobic layer 202 is formed by spraying, with a portion of the conductive cover plate 201 masked, such that the outer edge of the cured hydrophobic layer 202 is a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer 102.

[0112] In some embodiments, the step of preparing the gap control layer 300 on the surface of the first substrate 100 comprises: Discharging adhesive along the edge of the first pattern 1021 of the first substrate 100 to form an adhesive line 301; disposing a plurality of gap beads 302 at intervals in the adhesive line 301; Includes.

[0113] Compared to a process of first mixing the gap bead 302 with the adhesive and then applying the mixture to the surface of the first substrate 100, first discharging the adhesive onto the surface of the first substrate 100 to form an adhesive line 301 and then arranging gap beads 302 of approximately the same dimensions at intervals in the adhesive line 301 contributes to ensuring gap uniformity. On the one hand, the position of the adhesive strip can provide a position for the gap bead placement to enable the gap bead to be distributed approximately stably within the entire adhesive line, and the viscosity of the adhesive strip can ensure that the gap bead 302 does not change position after placement. On the other hand, the position of the gap bead 302 can be subjectively positioned and flexibly adjusted as needed, avoiding the inability to control the placement position of the gap bead 302 during mixing and application, thereby improving gap uniformity in the droplet movement space throughout the microfluidic chip 1001.

[0114] In some embodiments, as shown in Figures 2 and 3, the edge of the first pattern 1021 in the hydrophobic dielectric functional layer 102 is within the adhesive line 301, and the projection of the gap bead 302 on the first substrate 100 is located outside the range of the hydrophobic dielectric functional layer 102.

[0115] By covering the edges of the first pattern 1021 in the hydrophobic dielectric functional layer 102 with the adhesive line 301, the edge position can be sufficiently sealed to avoid the hydrophobic dielectric functional layer 102 from falling off due to the edges being exposed to droplets during patterning, and to prevent the droplets from leaking and coming into contact with the electrodes 1012 after leaking. Placing the gap bead 302 outside the range of the hydrophobic dielectric functional layer 102 can improve the gap uniformity of the microfluidic chip 1001 by ensuring that the gap is not affected by the thickness of the film layer.

[0116] In some embodiments, preparing the hydrophobic dielectric functional layer 102 on the circuit board 101 further includes patterning the hydrophobic dielectric functional layer 102 to form a first pattern 1021 and a third pattern 1022 that is offset from the first pattern 1021 and the electrode 1012, the third pattern 1022 being at least one hollowed-out region. The hydrophobic layer 202 has a second pattern 2021. The second pattern 2021 is a mirror image of the first pattern 1021 and defines a droplet movement space together with the first pattern 1021.

[0117] In some embodiments, the step of preparing the gap control layer 300 includes: Dispensing adhesive into at least one hollowed area to form at least one support adhesive block 304; disposing at least one gap bead 302 on any one of at least one support adhesive block 304; Further includes:

[0118] In some embodiments, the gap bead 302 disposed in the support adhesive block 304 has approximately the same dimensions as the gap bead 302 disposed in the adhesive line 301 .

[0119] The hollowed area is formed in the hydrophobic dielectric functional layer 102 for disposing the support adhesive block 304, and the gap bead 302 is disposed in the support adhesive block 304 to provide better support for the microfluidic chip 1001, particularly for the central region of the droplet movement space, and to avoid an impact on the gap height uniformity caused by the formation of a bulge due to a certain degree of deformation in the middle of the first substrate 100 in the droplet movement space. Setting the dimensions of the gap bead 302 in the support adhesive block 304 to be approximately the same as those of the gap bead in the adhesive line 301 contributes to controlling the gap height at the position where the support adhesive block 304 is disposed to approximately match the dimensions of the gap bead 302, and therefore to approximately match the gap height at other positions on the microfluidic chip 1001, thereby further ensuring the uniformity of the gap height while applying a uniform force to the microfluidic chip. The placement of the support adhesive block 304 offset from the electrode 1012 can also prevent the gap bead 302 from contacting the electrode 1012 .

[0120] In some embodiments, the edges of the third pattern 1022 are at least partially positioned within the range of at least one corresponding support adhesive block 304, and the projection of the gap bead 302 on the first substrate 100 is located outside the range of the hydrophobic dielectric functional layer 102.

[0121] Based on the sealing performance of the support adhesive block 304, covering at least a portion of the edge of the third pattern 1022 can achieve sealing of the patterned edge of the hydrophobic dielectric functional layer 102, and arranging the gap bead 302 at a position offset from the hydrophobic dielectric functional layer 102 can avoid unevenness in gap height caused by the offset positions of various gap beads 302, and can also avoid the impact on gap uniformity caused by the low surface accuracy of the hydrophobic dielectric functional layer 102.

[0122] In some embodiments, before curing the gap control layer 300, the method further includes applying a preset pressure to the outer surface of the first substrate 100 and the outer surface of the second substrate 200.

[0123] The preset pressure is applied to the outer surfaces of the first substrate 100 and the second substrate 200 after the first substrate 100 and the second substrate 200 are aligned and before the gap control layer 300 is cured. In this way, when a small number of gap beads 302 change position and come into contact with the hydrophobic dielectric functional layer 102, these gap beads 302 are pushed away from the hydrophobic dielectric functional layer 102 under the action of the preset pressure, so as to improve the gap uniformity between the first substrate 100 and the second substrate 200 throughout the microfluidic chip 1001.

[0124] In a third aspect of the present disclosure, an embodiment further provides a microfluidic system 1000. As shown in Figures 1 and 7, the microfluidic system 1000 includes a microfluidic chip 1001 and a control module 1002. The microfluidic chip 1001 is a microfluidic chip as described in any one of the above embodiments, or a microfluidic chip fabricated by a preparation method for a microfluidic chip. The control module 1002 is electrically connected to the microfluidic chip 1001 to control an electrical signal supplied to the microfluidic chip 1001.

[0125] It should be understood that controlling the electrical signals supplied to the microfluidic chip 1001 can refer to controlling the electrical signals supplied to the first substrate 100 in the microfluidic chip 1001, controlling the electrical signals supplied to the second substrate 200, or controlling both the electrical signals supplied to the first substrate 100 and the second substrate 200.

[0126] The electrical signals supplied to the first substrate 100 and the second substrate 200 of the microfluidic chip 1001 are controlled by the control module 1002 to perform multiple functions such as driving, separating and testing droplets in the microfluidic chip 1001, and then the potential difference between the first substrate 100 and the second substrate 200 is controlled, thereby improving controllability and expanding the application range of the microfluidic system 1000.

[0127] Finally, it should be noted that the above embodiments are only used to explain, not limit, the technical solutions of the present disclosure. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be equivalently replaced, and such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure, and should be within the scope of the claims and specification of the present disclosure. In particular, the technical features described in the embodiments can be arbitrarily combined as long as there is no structural contradiction. The present disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions within the scope of the claims.

Claims

1. a first substrate; a second substrate facing the first substrate and spaced apart from the first substrate; a gap control layer disposed between the first substrate and the second substrate; Including, The microfluidic chip, wherein the gap control layer includes an adhesive line and a plurality of gap beads of approximately equal dimensions spaced apart in the adhesive line.

2. 2. The microfluidic chip of claim 1, wherein the first substrate includes a hydrophobic dielectric functional layer, the adhesive line is disposed along an outer edge of the hydrophobic dielectric functional layer, and the outer edge of the hydrophobic dielectric functional layer is within the adhesive line.

3. The microfluidic chip of claim 2 , wherein the gap bead is disposed outside the outer edge of the hydrophobic dielectric functional layer.

4. The first substrate further includes a circuit board including a substrate and an electrode disposed on the substrate, and the hydrophobic dielectric functional layer is disposed on a surface of the electrode that is closer to the second substrate; 4. The microfluidic chip of claim 2, wherein the second substrate includes a conductive cover plate and a hydrophobic layer facing each other, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

5. 5. The microfluidic chip of claim 4, wherein the hydrophobic dielectric functional layer is a single-layer hydrophobic dielectric composite layer bonded to the surface of the electrode that is closest to the second substrate by an adhesive layer.

6. 5. The microfluidic chip of claim 4, wherein the hydrophobic dielectric functional layer has a first pattern, the hydrophobic layer has a second pattern that is a mirror image of the first pattern, and the first pattern and the second pattern together define the droplet movement space.

7. 4. The microfluidic chip of claim 2, wherein the gap control layer further comprises at least one support adhesive block disposed within the outer edge of the hydrophobic dielectric functional layer and abutting the first substrate and the second substrate, and wherein a projection of the at least one support adhesive block on the first substrate is offset from the electrodes on the first substrate.

8. 8. The microfluidic chip of claim 7, wherein the hydrophobic dielectric functional layer further has a third pattern that is at least one hollowed-out area for accommodating the at least one support adhesive block, and at least one gap bead is provided in any one of the at least one support adhesive block.

9. The microfluidic chip of claim 8 , wherein the gap bead disposed in the at least one support adhesive block has approximately the same dimensions as the gap bead disposed in the adhesive line.

10. 10. The microfluidic chip of claim 9, wherein an edge of the third pattern is at least partially located within the range of at least one corresponding support adhesive block, and a positive projection of the gap bead located on any one of the at least one support adhesive block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

11. The microfluidic chip of claim 4 , wherein the gap bead has a diameter of 800±5 microns.

12. The microfluidic chip of claim 11 , wherein the droplet movement space has a height of 710 microns or more and 740 microns or less.

13. providing a first substrate; preparing a gap control layer on a surface of one side of the first substrate, the gap control layer including an adhesive line and a plurality of gap beads of approximately the same size spaced apart in the adhesive line; providing a second substrate; placing the second substrate on the gap control layer in alignment with the first substrate to form a cell; curing the gap control layer; A method for preparing a microfluidic chip, comprising:

14. The step of preparing a gap control layer on one surface of the first substrate comprises: dispensing adhesive along a surface of one side of the first substrate to form an adhesive line; placing a plurality of gap beads of substantially equal size at spaced intervals in the adhesive line; 14. The method of claim 13, comprising:

15. The step of providing a first substrate comprises: providing a circuit board; providing a hydrophobic dielectric functional layer on the circuit board; Including, providing a second substrate; providing a conductive cover plate; providing a hydrophobic layer on said conductive cover plate; Including, the step of placing the second substrate on the gap control layer in alignment with the first substrate to form a cell comprises: Covering the gap bead of the gap control layer with the second substrate so that the side of the second substrate on which the hydrophobic layer is disposed faces the side of the first substrate on which the hydrophobic dielectric functional layer is disposed, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

15. The method of claim 14, comprising:

16. The step of dispensing adhesive along a surface of one side of the first substrate to form an adhesive line comprises: Discharging adhesive along the outer edge of the hydrophobic dielectric functional layer on the surface of one side of the first substrate to form an adhesive line, the outer edge of the hydrophobic dielectric functional layer being within the range of the adhesive line.

16. The method of claim 14 or 15, comprising:

17. The method of claim 16 , wherein the gap bead is disposed outside the outer periphery of the hydrophobic dielectric functional layer.

18. preparing a hydrophobic dielectric functional layer on the circuit board; preparing a film for forming a hydrophobic dielectric functional layer on one surface of the circuit board on which electrodes are provided; patterning the film to form the hydrophobic dielectric functional layer; Including, providing a hydrophobic layer on the conductive cover plate; preparing a hydrophobic layer on one surface of the conductive cover plate, the outer edge of the pattern of the hydrophobic layer being a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer; 16. The method of claim 15, comprising:

19. preparing a hydrophobic dielectric functional layer on the circuit board; forming the hydrophobic dielectric functional layer having a first pattern and a third pattern offset from the first pattern and the electrode, the third pattern being at least one hollowed region; further comprising providing a hydrophobic layer on the conductive cover plate; forming the hydrophobic layer with a second pattern that is a mirror image of the first pattern and that defines the droplet movement space together with the first pattern; Including, preparing a gap control layer; dispensing adhesive into the at least one hollowed area to form at least one supporting adhesive block; disposing at least one gap bead in any one of the at least one support adhesive block; 20. The method of claim 18, further comprising:

20. 20. The method of claim 19, wherein the gap bead disposed in the at least one support adhesive block has approximately the same dimensions as the gap bead disposed in the adhesive line.

21. 20. The method of claim 19, wherein an edge of the third pattern is at least partially located within the range of at least one corresponding support adhesive block, and a projection of the gap bead located on the at least one support adhesive block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

22. Prior to curing the gap control layer, the method further comprises: applying a predetermined pressure to an outer surface of the first substrate and an outer surface of the second substrate; The method of any one of claims 13 to 15, further comprising:

23. A microfluidic system comprising a control module and a microfluidic chip according to any one of claims 1 to 12 or a microfluidic chip prepared by the method according to any one of claims 13 to 22, A microfluidic system, wherein the control module is electrically connected to the microfluidic chip for controlling electrical signals supplied to the microfluidic chip.

Images