Curable composition and electronic component

Abstract

To provide a curable composition which hardly generates voids during curing and has sufficient fluidity.SOLUTION: A curable composition comprising a first component represented by the following formula (1) and a second component that is a dimer, an oligomer, or a polymer obtained by polymerizing the first component, wherein when the total content of the first component and the second component is 100% by mass, the content of the first component is 40 to 90% by mass: SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a curable composition and an electronic component. [Background technology]

[0002] In semiconductor processes, various gaps (unevenness) can be formed in a substrate, such as spaces between components (wiring or semiconductor elements) on the substrate, or grooves and holes for wiring patterns in damascene technology. Resin materials are filled into these gaps and cured to smooth the surface. Materials (resin materials) used to fill and smooth the various gaps in a substrate are called gap fill agents.

[0003] For example, Patent Document 1 discloses a composition for forming gap fill that is applicable to a dual damascene process and contains a polymer with a predetermined structure and weight-average molecular weight, a crosslinking agent, and a solvent. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2004 / 074938 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the compositions according to the prior art are used as gap fill agents, voids may occur or the fluidity may be insufficient, resulting in insufficient filling properties.

[0006] Therefore, an object of the present invention is to provide a curable composition that generates few voids during curing and has sufficient fluidity. [Means for solving the problem]

[0007] One aspect of the present invention is a curable composition comprising a first component represented by the following formula (1) and a second component having a structure represented by the following formula (2): When the total content of the first component and the second component is 100 mass%, the content of the first component is 40 mass% or more and less than 90 mass%. [ka] (In formula (1), R1 and R2 are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring A is a six-membered hydrocarbon ring.) [ka] (In formula (2), n is an integer of 1 or more, m is an integer of 0 or more, n+m is an integer of 2 or more, R3 and R4 are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring B is a six-membered hydrocarbon ring.)

[0008] The curable composition preferably has a viscosity at 25° C. of 100.0 Pa·s or less. The curable composition preferably further contains a radical generator. The curable composition preferably contains substantially no organic solvent. It is preferable that the first component has a structure represented by the following formula (1-1), and the second component has a structure represented by the following formula (2-1). [ka] [ka] (In formula (2-1), n ​​is an integer of 1 or more, m is an integer of 0 or more, and n+m is an integer of 2 or more.) The curable composition is preferably for forming a gap fill.

[0009] Another aspect of the present invention is a cured product obtained by curing the curable composition.

[0010] Yet another embodiment of the present invention is an electronic component having the cured product. [Effects of the Invention]

[0011] According to the present invention, there is provided a curable composition which generates few voids during curing and has sufficient fluidity. DETAILED DESCRIPTION OF THE INVENTION

[0012] In this specification, the weight average molecular weight (Mw) is determined by gel permeation chromatography (GPC) using a Shodex K-805L column at a column temperature of 40°C, a flow rate of 1 mL / min, chloroform as the eluent, and polystyrene as the standard.

[0013] In this specification, when the upper and lower limits of a numerical range are separately stated, all combinations of each lower limit and each upper limit are considered to be substantially stated within a consistent range.

[0014] The composition, physical properties / properties, applications, etc. of the curable composition will be described below, but the present invention is not limited to the following in any way.

[0015] <<Composition>> The curable composition includes a first component and a second component. The curable composition preferably includes a radical generator. The curable composition preferably includes a filler. The curable composition may include other components. Each component will be described below.

[0016] <First ingredient> The first component is a compound represented by the following formula (1).

[0017] [ka]

[0018] In formula (1), R1 and R2 are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring A is a six-membered hydrocarbon ring. R1 and R2 may be the same or different.

[0019] As shown in formula (1), the first component has a terminal carbon-carbon double bond and two substituents bonded to ring A via ester bonds.

[0020] In formula (1), the two substituents may each be bonded to the 1,1 position, the 1,2 position, the 1,3 position, or the 1,4 position of ring A, which is a six-membered hydrocarbon ring, preferably to the 1,2 position, the 1,3 position, or the 1,4 position, and more preferably to the 1,2 position.

[0021] In formula (1), R1 and R2 are preferably each independently a hydrocarbon group having 1 to 5 carbon atoms, 1 to 3 carbon atoms, or 1 carbon atom.

[0022] In formula (1), ring A is preferably a benzene ring or a cyclohexane ring, more preferably a benzene ring.

[0023] Examples of the compound represented by formula (1) include diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 1,4-cyclohexanecarboxylate, diallyl 1,3-cyclohexanecarboxylate, and diallyl 1,2-cyclohexanecarboxylate.

[0024] The first component is particularly preferably a compound represented by the following formula (1-1).

[0025] [ka]

[0026] Commercially available products of the compound represented by formula (1) include Daiso DAP (registered trademark) Monomer and Daiso DAP (registered trademark) 100 Monomer (manufactured by Osaka Soda Co., Ltd.).

[0027] <Second ingredient> The second component is a compound represented by the following formula (2) (a compound including a structure represented by the following formula (2)).

[0028] [ka]

[0029] In formula (2), n is an integer of 1 or greater, m is an integer of 0 or greater, n+m is an integer of 2 or greater, R3 and R4 are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring B is a six-membered hydrocarbon ring. R3 and R4 may be the same or different.

[0030] The second component represented by formula (2) is, in other words, a dimer, oligomer, or polymer obtained by polymerizing the first component. As represented by formula (1), the first component has two substituents with terminal carbon-carbon double bonds. When such a first component is polymerized, a first repeating unit (corresponding to the repeating unit with the repeat number n in formula (2)) can be formed, in which only one of the terminal carbon-carbon double bonds of the first component polymerizes between two molecules to form the main backbone of a polymer or the like, while the other carbon-carbon double bond remains as an unreacted functional group to form a side chain of the polymer or the like. The second component can also form a second repeating unit (corresponding to the repeating unit with the repeat number m in formula (2)) in which both terminal carbon-carbon double bonds of the first component polymerize with each other to form the main backbone of a polymer or the like. The second component has a repeating number n of 1 or more, i.e., it has one or more first repeating units containing unreacted carbon-carbon double bonds, and is therefore capable of reacting with other components. The first component contained in the curable composition and the first component that is a monomer of the second component contained in the curable composition may be the same or different. That is, ring A in formula (1) and ring B in formula (2) may be the same or different. It is preferable that ring A in formula (1) and ring B in formula (2) are the same. Furthermore, R1, R2, R3, and R4 in formula (1) and formula (2) may be the same or different.

[0031] The weight average molecular weight of the second component is preferably 500 or more, 1,000 or more, 3,000 or more, or 5,000 or more, and is preferably 200,000 or less, 150,000 or less, or 100,000 or less.

[0032] When formula (2) has a plurality of first repeating units and a plurality of second repeating units, the first repeating units and the second repeating units may be connected randomly, or each repeating unit may form a block.

[0033] The preferred forms of the second component are similar to the preferred forms of the first component, i.e., the preferred forms of the second component are as follows:

[0034] In formula (2), in the first repeating unit and the second repeating unit, the two substituents bonded to ring B may each be bonded to any of the 1,1 positions, 1,2 positions, 1,3 positions, or 1,4 positions of ring B, which is a six-membered hydrocarbon ring, preferably to the 1,2 positions, 1,3 positions, or 1,4 positions, and more preferably to the 1,2 positions.

[0035] In formula (2), R3 and R4 are preferably each independently a hydrocarbon group having 1 to 5 carbon atoms, 1 to 3 carbon atoms, or 1 carbon atom.

[0036] In formula (2), each ring B is preferably a benzene ring or a cyclohexane ring, more preferably a benzene ring.

[0037] The second component is particularly preferably a compound represented by the following formula (2-1) (a compound containing a structure represented by the following formula (2-1)).

[0038] [ka]

[0039] In formula (2-1), n ​​is an integer of 1 or more, m is an integer of 0 or more, and n+m is an integer of 2 or more.

[0040] The second component may be a polymer of the first component described above, or may be a commercially available product, such as Daiso DAP (registered trademark) A, Daiso DAP (registered trademark) S, Daiso DAP (registered trademark) K, or Daiso Isodap (registered trademark) (manufactured by Osaka Soda Co., Ltd.).

[0041] As described above, the curable composition according to the present disclosure combines a first component having a specific structure and a relatively low molecular weight with a second component having a structure derived from the first component and a relatively high molecular weight. Furthermore, in the curable composition according to the present disclosure, the content of the first component is 40% by mass or more but less than 90% by mass (preferably 50 to 85% by mass, 60 to 80% by mass, or 65 to 75% by mass) when the total content of the first component and the second component is taken as 100% by mass. A first component content of 40% by mass or more ensures excellent fluidity of the curable composition, while a first component content of less than 90% by mass can suppress the occurrence of voids in the cured product. The present inventors have found that a first component having a relatively low molecular weight has excellent fluidity due to its low viscosity, but is prone to vaporization, which makes the curable composition more susceptible to voids during curing. As a result of extensive research, the inventors have found that by using a first component and a second component in combination and further setting the content of the first component within a predetermined range, excellent fluidity can be achieved and the occurrence of voids can be suppressed. Although the details of why such effects are obtained are unknown, it is presumed that this is because a good balance is achieved between the effect of relatively lowering the viscosity compared to when only the second component is used and the effect of suppressing the generation of bubbles due to vaporization of the first component by using the second component.

[0042] In the curable composition, the total content of the first component and the second component is preferably 50.0 mass% or more, 60.0 mass% or more, 70.0 mass% or more, 80.0 mass% or more, 90.0 mass% or more, or 95.0 mass% or more, based on the total solid content of the curable composition (in the case where a filler described below is contained, based on the total solid content excluding the filler).

[0043] The curable composition according to the present disclosure can have sufficient fluidity by using a combination of the first and second components, allowing the aforementioned gap to be filled without substantially containing an organic solvent. Furthermore, the curable composition according to the present disclosure is preferably substantially free of an organic solvent, since this can prevent volumetric shrinkage and bubble formation due to evaporation of the organic solvent. By making the curable composition according to the present disclosure substantially free of an organic solvent, volumetric shrinkage due to drying and other factors is less likely to occur, and effects such as suppressing peeling from the substrate and reducing the occurrence of voids are expected. Note that "the curable composition is substantially free of an organic solvent" means, for example, that the content of the organic solvent in the curable composition relative to the total amount of the curable composition is less than 1.0 mass%, less than 0.5 mass%, or less than 0.1 mass%, and the curable composition may contain an impurity amount of organic solvent.

[0044] In the present disclosure, an organic solvent refers to an organic compound that is liquid at room temperature and does not react with itself or with the first component, second component, or other components contained in the curable composition when the curable composition is cured. Examples of the organic solvent include well-known and commonly used organic solvents such as amide solvents, ester solvents, and alcohol solvents.

[0045] <Filler> The filler may be either an organic filler or an inorganic filler.

[0046] Examples of the organic filler include imide-based fillers having an imide structure such as polyimide, polyamideimide, and polyetherimide, and organic fillers made of engineering plastics such as polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyetherketone, and polyoxybenzoate.

[0047] Examples of inorganic fillers include clay minerals such as talc, mica, sericite, and montmorillonite, metal oxides such as silica, alumina, and titanium oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, fillers having a ferovskite crystal structure such as barium titanate and strontium titanate, boron nitride, aluminum borate, barium sulfate, and calcium carbonate. The filler is preferably silica.

[0048] The shape of the filler is not particularly limited, and examples thereof include spherical, needle-like, plate-like, scaly, hollow, irregular, hexagonal, cubic, and flaky shapes.

[0049] The average particle size of the filler is preferably 0.1 μm or more, 0.2 μm or more, or 0.3 μm or more, and is preferably 100 μm or less, 50 μm or less, or 10 μm or less. The average particle size of the filler is the particle size at 50% cumulative volume obtained using a laser diffraction / scattering particle size distribution measurement method.

[0050] The filler may be one that has been subjected to a surface treatment using a silane coupling agent or the like.

[0051] The content of the filler in the curable composition is preferably 10.0 mass% or more, 20.0 mass% or more, 25.0 mass% or more, or 30.0 mass% or more, based on the total solid content of the curable composition, and is preferably 80.0 mass% or less, 70.0 mass% or less, 65.0 mass% or less, 60.0 mass% or less, or 55.0 mass% or less. By setting the content of the filler in the curable composition within these ranges, the linear expansion coefficient and elastic modulus of the obtained cured product can be improved.

[0052] The curable composition of the present disclosure contains a moderate amount of a second component having a relatively high viscosity, and therefore, when a filler is contained, it is possible to suppress sedimentation of the filler while maintaining excellent fluidity, and the curable composition is likely to have excellent storage stability.

[0053] <Radical generator> The radical generator is a compound that generates active species (also called free radicals) by heat or ultraviolet light, thereby promoting the polymerization reaction. The radical generator can be appropriately selected depending on the application, and may be either a photoradical generator or a thermal radical generator. The radical generator is preferably a thermal radical generator.

[0054] Examples of the thermal radical generator include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis(1,1-dimethylethylperoxy)cyclohexane, 1,1-bis(dimethylethylperoxy)-2-methylcyclohexane, 1,1-bis(dimethylethylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(3,3-dimethylbutylperoxy)cyclohexane, and 1,1-bis(3,3-dimethylbutylperoxy)cyclohexane. peroxyketals such as )-3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; dialkyl peroxides such as α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, t-butylcumyl peroxide, and di-t-butyl peroxide; diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; bis(4-t-butylcyclohexyl)peroxydicarbonate, di-2 -Peroxycarbonates such as ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and di-3-methoxybutyl peroxycarbonate; t-butyl peroxypivalate, t-hexyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t peroxyesters such as t-butylperoxyisobutyrate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-butylperoxybenzoate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, and t-butylperoxyacetate;Examples of the azo compounds include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile). These can be used alone or in combination.

[0055] Examples of photoradical generators include benzoin ether-based photoradical generators, acetophenone-based photoradical generators, α-ketol-based photoradical generators, aromatic sulfonyl chloride-based photoradical generators, photoactive oxime-based photoradical generators, benzoin-based photoradical generators, benzyl-based photoradical generators, benzophenone-based photoradical generators, ketal-based photoradical generators, thioxanthone-based photoradical generators, acylphosphine oxide-based photoradical generators, etc. These can be used alone or in combination.

[0056] The content of the radical generator is preferably 0.1 parts by mass or more, 0.5 parts by mass or more, or 1.0 part by mass or more, and is preferably 10.0 parts by mass or less, 8.0 parts by mass or less, or 5.0 parts by mass or less, relative to 100 parts by mass of the total mass of the first component and the second component in the curable composition.

[0057] <Other ingredients> Examples of other components include additives such as crosslinking curing agents, resin components, sensitizers, adhesion aids, surfactants, leveling agents, plasticizers, adhesion agents, colorants, fibers, silane coupling agents, flame retardants, cellulose nanofibers, dispersants, thermosetting catalysts, thickeners, antifoaming agents, antioxidants, rust inhibitors, and adhesion promoters.

[0058] Other components may be appropriately selected depending on the application, etc. As described above, it is preferable that the curable composition according to the present disclosure does not substantially contain an organic solvent.

[0059] <<Physical properties / properties>> The viscosity of the curable composition at 25°C is preferably 100.0 Pa·s or less, 50.0 Pa·s or less, 20.0 Pa·s or less, 15.0 Pa·s or less, 10.0 Pa·s or less, 5.0 Pa·s or less, or 1.0 Pa·s or less. The lower limit is not particularly limited, but is, for example, 0.1 Pa·s, 0.3 Pa·s, or 0.5 Pa·s. The viscosity of the curable composition is measured in accordance with JIS-Z8803:2011 using a cone-plate rotational viscometer (TVE-33H, manufactured by Toki Sangyo Co., Ltd.) with a 1°34' x R24 cone as the cone rotor, at a plate rotation speed of 5 rpm, for 30 seconds at 25°C.

[0060] <<Application>> The curable composition according to the present disclosure is suitable for use as a gap fill composition (gap fill agent). Gap fill agents are materials that fill various gaps (irregularities) on a substrate, such as spaces between components (wiring or semiconductor elements) on the substrate or grooves and holes for wiring patterns in damascene technology, to smooth the gaps. The curable composition according to the present disclosure has an appropriately low viscosity, so it can adequately fill even minute gaps. Furthermore, cured products made using the curable composition according to the present disclosure have reduced void generation, making them less likely to produce defective products.

[0061] The curable composition according to the present disclosure is not limited to gap fill agents and can be used in various applications, such as underfill agents and hole filling agents for printed wiring boards, because the curable composition suppresses the generation of voids and has sufficient fluidity.

[0062] The method for obtaining a cured product from the curable composition is not particularly limited and can be appropriately changed depending on the composition of the curable composition. For example, when the curable composition according to the present disclosure is a gap fill agent, the curable composition is filled into a gap provided on a substrate and then cured (thermally cured or photocured) to form a cured product. The conditions for carrying out each step (e.g., filling method, curing conditions, etc.) may be appropriately changed depending on the composition and application of the curable composition. The curing temperature is preferably 200°C or less, 180°C or less, or 150°C or less.

[0063] The curable composition according to the present disclosure can form a cured product in which the generation of voids is suppressed, and therefore can be preferably used as a material for forming electronic components such as semiconductor devices. [Example]

[0064] The curable composition will be specifically described below with reference to examples, but the present invention is not limited to the following.

[0065] <<<Raw materials>>> As the first component, Daiso DAP (registered trademark) monomer [manufactured by Osaka Soda Co., Ltd., diallyl phthalate (DAP) monomer shown in formula (1-1)] was used.

[0066] As the second component, product name: Daiso DAP (registered trademark) K [manufactured by Osaka Soda Co., Ltd., weight average molecular weight = 20,000 to 30,000, diallyl phthalate (DAP) polymer shown in formula (2-1)] was used.

[0067] As a radical generator (thermal radical generator), Perhexa (registered trademark) HC (a product of NOF Corporation, 1,1-bis(3,3-dimethylbutylperoxy)cyclohexane) was used.

[0068] As the filler, product name: SV-C10 (manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, vinylsilane treated product) was used.

[0069] <<<Example 1>>> The first and second components were mixed to the contents (parts by mass) shown in Table 1, and the mixture was stirred overnight with a stirrer (40°C) to obtain a resin component mixture. Next, a filler was added to this mixture to the contents (parts by mass) shown in Table 1, and pre-mixing was performed using a Mixer (Thinky Corporation) at 2000 rpm for 5 minutes. Next, two sets of mixing were performed using a triple-roll mill to obtain a filler-dispersed mixture. Next, a radical generator was added to the filler-dispersed mixture to the contents (parts by mass) shown in Table 1, and the mixture was kneaded using a Mixer (Thinky Corporation) at 2000 rpm for 5 minutes to obtain a curable composition according to Example 1.

[0070] <<<Examples 2 to 8, Comparative Examples 1 and 2>>> Curable compositions according to the examples and comparative examples were obtained in the same manner as in Example 1, except that the content of each component was adjusted to the content shown in Table 1. In Example 4, which did not contain a filler, no filler was added, and pre-mixing and mixing using a three-roll mill were not performed.

[0071] <<<Evaluation of storage stability of curable compositions>>> The curable compositions of Comparative Example 1 and Example 2 were prepared and then allowed to stand at room temperature for 30 days, after which the presence or absence of filler settling was visually confirmed. While filler settling occurred in the curable composition of Comparative Example 1, no filler settling was observed in the curable composition of Example 2.

[0072] <<<Cured film manufacturing>>> Cured films were produced using the curable compositions of each Example and Comparative Example. The curable composition was dropped onto PTFE tape attached to a glass plate serving as a substrate, and the PTFE tape was attached so as to surround the curable composition. A glass substrate, to which a PTFE tape different from the substrate had been attached, was placed on the glass substrate serving as a substrate, with the PTFE tape on the glass substrate facing the curable composition, to obtain a glass plate laminate. In this case, the PTFE tape attached so as to surround the curable composition served as a spacer, ensuring a constant height of the curable composition. The height of the curable composition (the thickness of the PTFE tape serving as a partition wall) was adjusted so that the thickness of the resulting cured film would be 130 μm. The glass plate laminate was placed in a box furnace and heated at 150°C for 1 hour to obtain a cured product. The glass plate and PTFE tape were removed from the resulting cured product to obtain a cured film.

[0073] <<<Evaluation>>> The viscosity of the curable compositions according to each Example and Comparative Example was measured using the method described above. The film-forming properties of the cured films according to each Example and Comparative Example were evaluated using the following evaluation method. Furthermore, the curable compositions and cured films according to some Examples were evaluated using the following evaluation methods: thermomechanical analysis, tensile test, TGA, DSC, and adhesion test. The evaluation results are shown in Table 1. For Comparative Examples 1 and 2, which received a film-forming property evaluation of B, the number of voids was so large that a uniform cured film suitable for evaluation could not be obtained, and therefore, thermomechanical analysis, tensile test, TGA, DSC, and adhesion test could not be performed.

[0074] <<Film forming properties>> The appearance of the cured film was visually observed and evaluated based on the following evaluation criteria. A: No voids or only a small number of voids are generated. B: A large number of voids are generated.

[0075] < <tma>> The cured film was cut into test pieces (3 mm x 10 mm) to obtain the measurement size. The CTE of each test piece was measured using a TA Instruments TMAQ40. The measurement conditions were a test load of 5 g, a temperature rise / fall rate of 10 K / min, and a tensile mode in a nitrogen atmosphere (100 mL / min), with the temperature cycle increasing / decreasing from 30°C to 300°C, then -55°C, and finally to 300°C. The linear thermal expansion coefficient (CTE α1) was determined from the measurement results for the second heat from 30°C to 100°C, and the linear thermal expansion coefficient (CTE α2) was determined from the measurement results from 150°C to 250°C.

[0076] <<Tensile test>> The cured film was cut into a length of 8 cm and a width of 0.5 cm, and the breaking elongation (tensile breaking elongation) was measured under the following conditions. The elastic modulus was determined from the slope of the strain in the stress-strain curve obtained from 5 MPa to 10 MPa. [Measurement conditions] Testing machine: Tensile testing machine EZ-SX (Shimadzu Corporation) Chuck distance: 50mm Test speed: 1mm / min Elongation calculation: (Tensile movement amount / Distance between chucks) x 100

[0077] < <tga>> Using a thermogravimetric analyzer (Waters, model name: TGA5500), the 5% weight loss temperature (T d5 The amount of sample used per measurement was 1 to 2 mg. Measurements were carried out in a nitrogen atmosphere by increasing the temperature from 50°C to 600°C at a rate of 10°C per minute.

[0078] < <dsc>> For each of the cured products obtained, a differential scanning calorimetry (DSC) device (Q-100 TA Instruments) and analysis software (Universal analysis, manufactured by TA Instruments) were used to measure the extrapolated onset temperature of the baseline shift as the glass transition temperature (Tg) at a temperature increase / decrease rate of 10°C / min over a measurement range of 20°C to 200°C in a nitrogen atmosphere.

[0079] <<Adhesion test>> Each curable composition was applied to a silicon substrate using a spin coater to a thickness of approximately 10 μm after curing, and cured on a hot plate at 150°C for 1 hour to obtain a silicon substrate with a cured film formed on its surface. A total of 25 squares measuring 1 mm x 1 mm were formed on the resulting cured film using a cutter knife, with five rows and five columns, and the squares were then peeled off with tape. The number of squares remaining on the silicon substrate without peeling was evaluated. The condition of the remaining squares was also evaluated according to the classification of JIS K5600 5-6.

[0080] [Table 1] [Industrial Applicability]

[0081] The curable composition of the present invention generates few voids during curing and has sufficient fluidity, making it suitable for a variety of uses such as gap fill agents.< / dsc> < / tga> < / tma>

Claims

1. The composition includes a first component represented by the following formula (1) and a second component having a structure represented by the following formula (2): A curable composition, wherein the content of the first component is 40% by mass or more and less than 90% by mass, when the total content of the first component and the second component is 100% by mass. 【Chemistry 1】 (In formula (1), R １ , R ２ are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring A is a six-membered hydrocarbon ring. 【Chemistry 2】 (In formula (2), n is an integer of 1 or more, m is an integer of 0 or more, n+m is an integer of 2 or more, and R ３ , R ４ are each independently a hydrocarbon group having 1 to 10 carbon atoms, and ring B is a six-membered hydrocarbon ring.

2. The curable composition according to claim 1, which has a viscosity at 25°C of 100.0 Pa·s or less.

3. The curable composition of claim 1 , further comprising a radical generator.

4. The curable composition of claim 1 , which is substantially free of organic solvents.

5. The curable composition according to claim 1, wherein the first component has a structure represented by the following formula (1-1), and the second component has a structure represented by the following formula (2-1): 【Transformation 3】 【Chemistry 4】 (In formula (2-1), n ​​is an integer of 1 or more, m is an integer of 0 or more, and n+m is an integer of 2 or more.)

6. The curable composition according to any one of claims 1 to 5, which is used for forming a gap fill.

7. A cured product obtained by curing the curable composition according to any one of claims 1 to 5.

8. An electronic part comprising the cured product according to claim 7.

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