Protective films and laminates
JP2026042373A5Pending Publication Date: 2026-06-08DAI NIPPON PRINTING CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DAI NIPPON PRINTING CO LTD
- Filing Date
- 2024-08-27
- Publication Date
- 2026-06-08
AI Technical Summary
Technical Problem
Conventional resin films lack sufficient solvent resistance, scratch resistance, and bending suitability, and the use of fluororesin coatings can impact the environment and human health.
Method used
A protective film with a surface protective layer made from a cured product of ionizing radiation curable or thermosetting resin, with a thickness of 3.0 μm to 15 μm and nanoindentation hardness of 100 MPa to 350 MPa, which does not contain organic fluorine compounds.
Benefits of technology
The film achieves excellent solvent resistance, scratch resistance, and good bending suitability while minimizing environmental and health impacts.
✦ Generated by Eureka AI based on patent content.
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Abstract
Provided is a protective film that has excellent solvent resistance and scratch resistance and also has good bending suitability. [Solution] A protective film having a resin substrate and a surface protective layer arranged on one side of the resin substrate, wherein the surface protective layer contains a cured product of at least one of an ionizing radiation curable resin and a thermosetting resin, the thickness of the surface protective layer is 3.0 μm or more and 15 μm or less, and the nanoindentation hardness of the surface protective layer is 100 MPa or more and 350 MPa or less.
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