Radiant air conditioning system

The radiant air conditioning system enhances efficiency by adjusting the flow rate and temperature of heat source water through recirculation, addressing inefficiencies and reducing power consumption and costs in radiant systems.

JP2026046596APending Publication Date: 2026-03-13TAKENAKA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-03
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

Radiant air conditioning systems face inefficiencies due to small temperature differences between inlet and outlet of heat source water, leading to increased power consumption and the need for separate circuits for other heat source utilization units, which increases complexity and cost.

Method used

A radiant air conditioning system with a heat source unit, radiant panels, and a control unit that adjusts the flow rate and temperature of heat source water through a recirculation path to enhance the temperature difference between the inlet and outlet at the heat source unit, allowing efficient supply to other heat source utilization units.

Benefits of technology

This configuration improves heat source efficiency and reduces power consumption while enabling the supply of heat source water to multiple units, such as fan coils and chilled beams, using a rational and low-cost setup.

✦ Generated by Eureka AI based on patent content.

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Abstract

In a radiant air conditioning system that provides air conditioning to a room by circulating heat source water, cooled or heated at a heat source unit, through a heat source water circulation circuit to radiant panels installed in the room, a rational and cost-effective configuration is adopted, while making the temperature difference between the inlet and outlet of the heat source water at the heat source unit greater than the temperature difference between the inlet and outlet of the heat source water at the radiant panel side in the heat source water circulation circuit, thereby improving the heat source efficiency at the heat source unit and enabling the supply of heat source water to other heat source water utilization units besides the radiant panels. [Solution] The heat source water circulation circuit 30 is provided with a heat source water recirculation path 40 that recirculates at least a portion of the return heat source water W2, which is the heat source water that returns from the radiant panel 10 to the heat source unit 20, to the outgoing heat source water W1, which is the heat source water that goes from the heat source unit 20 to the radiant panel 10.
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Description

Technical Field

[0001] The present invention relates to a radiant air conditioning system including a heat source unit that cools or heats heat source water, a radiant panel installed in an air-conditioned room through which the heat source water flows, a heat source water circulation circuit that circulates the heat source water between the heat source unit and the radiant panel, and a control unit that determines a target radiant panel capacity based on the air conditioning load in the air-conditioned room and executes panel heat source water flow rate control to control the flow rate of the heat source water in the radiant panel as the panel heat source water flow rate so that the capacity of the radiant panel is set to the target radiant panel capacity.

Background Art

[0002] There is known a radiant air conditioning system that performs air conditioning of an air-conditioned room by circulating heat source water cooled or heated by a heat source unit through a heat source water circulation circuit to a radiant panel installed in the air-conditioned room (see, for example, Patent Documents 1 to 3). In such a radiant air conditioning system, panel heat source water flow rate control for controlling the flow rate of the heat source water in the radiant panel as the panel heat source water flow rate is executed, so that the capacity of the radiant panel is set to a desired target radiant panel capacity.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the radiant air conditioning system described above, the temperature difference between the inlet and outlet of the heat source water on the radiant panel side is usually small (for example, around 2-3°C) due to the characteristics of the radiant panel, and consequently, the temperature difference between the inlet and outlet of the heat source water on the heat source side is also small. This leads to a decrease in the heat source efficiency at the heat source, and also to an increase in the power required to transport the heat source water as the circulation flow rate of the heat source water from the heat source to the radiant panel side increases. Furthermore, for heat source water utilization components other than radiant panels, such as fan coils and chilled beams, where the temperature difference between the inlet and outlet of the heat source water is larger than that of radiant panels (for example, around 6°C), it is necessary to use a separate heat source water circulation circuit or a separate system, which leads to increased complexity and costs. In view of these circumstances, the main objective of the present invention is to provide a technology for a radiant air conditioning system that air-conditions a room by circulating heat source water, cooled or heated at a heat source unit, through a heat source water circulation circuit to radiant panels installed in the room to be air-conditioned, while employing a rational and low-cost configuration, thereby increasing the temperature difference between the inlet and outlet of the heat source water at the heat source unit side of the heat source water circulation circuit compared to the temperature difference between the inlet and outlet of the heat source water at the radiant panel side, thereby improving the heat source efficiency at the heat source unit and enabling the supply of heat source water to other heat source water utilization units besides the radiant panels. [Means for solving the problem]

[0005] The first characteristic configuration of the present invention is a heat source unit for cooling or heating heat source water, A radiant panel installed in the room to be air-conditioned, through which heat source water flows, A heat source water circulation circuit that circulates heat source water between the heat source unit and the radiant panel, A radiant air conditioning system comprising: a control unit that determines a target radiant panel capacity based on the air conditioning load in the air-conditioned room, and performs panel heat source water flow rate control that controls the flow rate of heat source water in the radiant panel as the panel heat source water flow rate so that the capacity of the radiant panel is set to the target radiant panel capacity, The heat source water circulation circuit is characterized by having a heat source water recirculation path that recirculates at least a portion of the return heat source water, which is the heat source water that returns from the radiant panel side to the heat source unit, into the outgoing heat source water, which is the heat source water that goes from the heat source unit to the radiant panel side.

[0006] In this application, in the heat source water circulation circuit, the temperature of the heat source water at the inlet portion to the radiant panel side is called the panel inlet heat source water temperature, and the temperature of the heat source water at the outlet portion from the radiant panel side is called the panel outlet heat source water temperature. With this configuration, by controlling the flow rate of the heat source water through the panel, the capacity of the radiant panel can be set to the target radiant panel capacity in a manner that changes only the heat source water temperature at the panel outlet while keeping the heat source water temperature at the panel inlet as unchanged as possible. Furthermore, in the heat source water circulation circuit, by recirculating a portion of the return heat source water to the supply heat source water via a heat source water recirculation path, the temperature difference between the heat source water inlet and outlet on the heat source side can be made larger than the temperature difference between the heat source water inlet and outlet on the radiant panel side. This reduces the power required to transport the heat source water and allows for the supply of heat source water at the appropriate temperature to other heat source water utilization parts such as fan coils with HP and chilled beams, in addition to the radiant panel. Therefore, the present invention provides a technology for a radiant air conditioning system that air-conditions a room by circulating heat source water, cooled or heated at a heat source unit, through a heat source water circulation circuit to radiant panels installed in the room to be air-conditioned. This technology employs a rational and low-cost configuration while making the temperature difference between the inlet and outlet of the heat source water at the heat source unit in the heat source water circulation circuit greater than the temperature difference between the inlet and outlet of the heat source water at the radiant panel, thereby improving the heat source efficiency at the heat source unit and enabling the supply of heat source water to other heat source water utilization units besides the radiant panels.

[0007] A second characteristic configuration of the present invention is a means for adjusting the state of recirculation of the return heat source water to the supply heat source water by the heat source water recirculation path, and includes a panel inlet heat source water temperature adjustment means that can adjust the panel inlet heat source water temperature, which is the temperature of the heat source water at the inlet portion to the radiant panel side in the heat source water circulation circuit. The control unit performs panel inlet heat source water temperature control, which controls the operation of the panel inlet heat source water temperature adjustment means so that the panel heat source water flow rate falls within a predetermined adjustable range.

[0008] According to this configuration, in the panel heat source water flow rate control described above, when setting the capacity of the radiant panel to the desired target radiant panel capacity, even if adjusting only the panel heat source water flow rate in the heat source water circulation circuit would cause the panel heat source water flow rate to fall outside a predetermined adjustable range, the panel inlet heat source water temperature can be adjusted by performing the panel inlet heat source water temperature control described above to adjust the state of recirculation of the return heat source water to the supply heat source water, thereby keeping the panel heat source water flow rate within a predetermined adjustable range. [Brief explanation of the drawing]

[0009] [Figure 1] Schematic diagram of the radiant air conditioning system of this embodiment [Figure 2] Diagram showing the processing flow for controlling the water flow rate of the heat source for the panel. [Figure 3] Diagram showing the processing flow for controlling the heat source water temperature at the panel inlet. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described with reference to the drawings. As shown in Figure 1, the radiant air conditioning system 100 of this embodiment is configured to provide air conditioning for a room R by circulating heat source water, cooled or heated by a heat source unit 20, through a heat source water circulation circuit 30 to radiant panels 10 installed in the room R. Specifically, the radiant air conditioning system 100 includes a heat source unit 20 for cooling or heating heat source water, radiant panels 10 installed in the room R through which heat source water flows, a heat source water circulation circuit 30 for circulating heat source water between the heat source unit 20 and the radiant panels 10, and a control device 50 (an example of a control unit) that performs panel heat source water flow rate control and panel inlet heat source water temperature control, which will be described later.

[0011] The heat source water circulation circuit 30 consists of a heat source water supply pipe 31 and a heat source water return pipe 32. The heat source water supply pipe 31 is configured as a pipe that guides the supply heat source water W1, cooled or heated by the heat source unit 20, to the radiant panel 10. The heat source water supply pipe 31 is equipped with a supply heat source water flow rate adjustment valve 35, which can adjust the flow rate of the supply heat source water W1 in the heat source water supply pipe 31 by adjusting the opening degree by the control device 50, and a supply heat source water temperature sensor 21 that measures the supply heat source water temperature To1, which is the temperature of the supply heat source water W1, and outputs the measurement result to the control device 50. The heat source water return pipeline 32 is configured as a pipeline that guides the return heat source water W2, which has passed through the radiant panel 10 and whose temperature has risen or fallen, to the heat source unit 20. The heat source water return pipeline 32 is equipped with a return heat source water flow rate adjustment valve 36, which can adjust the flow rate of the return heat source water W2 in the heat source water return pipeline 32 by adjusting the opening degree by the control device 50, and a return heat source water temperature sensor 22 that measures the return heat source water temperature To2, which is the temperature of the return heat source water W2, and outputs the measurement result to the control device 50. Furthermore, in the heat source water circulation circuit 30, the heat source waters W1 and W2 are transported by a pump (not shown) built into the heat source unit 20. In the heat source water circulation circuit 30, the flow rate of the supply heat source water W1 and the flow rate of the return heat source water W2 correspond to the heat source water circulation flow rate Vo, which is the flow rate of heat source water circulated from the heat source unit 20 to the radiant panel 10 in the heat source water circulation circuit 30.

[0012] The heat source water cooled or heated by the heat source unit 20 is circulated and supplied to other heat source water utilization units 70, such as fan coils and chilled beams, in addition to the radiant panel 10, as described later. That is, a portion of the heat source water cooled or heated by the heat source unit 20, excluding the supply heat source water W1 supplied to the heat radiating panel 10, is supplied to the heat source water utilization unit 70. The heat source water, which has increased or decreased in temperature after passing through the heat source water utilization unit 70, merges with the return heat source water W2 that has passed through the heat radiating panel 10 and is returned to the heat source unit 20.

[0013] Multiple radiant panels 10 are installed in the air-conditioned room R, and these multiple radiant panels 10 are connected in parallel to the heat source water supply line 31 and heat source water return line 32 of the heat source water circulation circuit 30. That is, the supply heat source water W1, which is cooled or heated by the heat source unit 20 and flows through the heat source water supply line 31, passes through the connection point with the heat source water recirculation line 40 (described later) and is then distributed and supplied to each radiant panel 10 as panel inlet heat source water W3. In addition, the panel outlet heat source water W4, which has passed through each radiant panel 10, merges and passes through the connection point with the heat source water recirculation line 40 (described later) and is then returned to the heat source unit 20 via the heat source water return line 32 as return heat source water W2. Furthermore, in the air-conditioned room R, the radiant panels 10 are installed at any location, such as on the ceiling, floor, or walls.

[0014] Each radiant panel 10 is provided with a panel heat source water flow rate adjustment valve 15, for example on the heat source water inlet side (heat source water supply pipe 31 side), which can be adjusted by the control device 50 to control the panel heat source water flow rate Vp, which is the flow rate of heat source water through the radiant panel 10. Furthermore, each radiant panel 10 is provided with a panel inlet heat source water temperature sensor 11 that measures the panel inlet heat source water temperature Tp1, which is the temperature of the panel inlet heat source water W3, and outputs the measurement result to the control device 50, and a panel outlet heat source water temperature sensor 12 that measures the panel outlet heat source water temperature Tp2, which is the temperature of the panel outlet heat source water W4, and outputs the measurement result to the control device 50.

[0015] The heat source water circulation circuit 30 is provided with a heat source water recirculation path 40 provided across the heat source water supply pipe 31 and the heat source water return pipe 32. The heat source water recirculation path 40 is provided with a recirculation pump 41 that sends heat source water from the heat source water return pipe 32 side toward the heat source water supply pipe 31 side. That is, the heat source water recirculation path 40 is configured as a pipe that recirculates at least a part of the return heat source water W2 that returns from the radiation panel 10 side to the heat source unit 20 through the heat source water return pipe 32 to the forward heat source water W1 that goes from the heat source unit 20 to the radiation panel 10 side through the heat source water supply pipe 31 by operating the recirculation pump 41. The heat source water recirculation path 40 is provided with a recirculation heat source water flow rate adjustment valve 45 that can be adjusted in opening degree by the control device 50 to adjust the recirculation heat source water flow rate Vr, which is the flow rate of heat source water in the heat source water recirculation path 40.

[0016] 〔Panel heat source water flow rate control〕 The panel heat source water flow rate control executed by the control device 50 is control for setting the capacity of the radiation panel 10 to the target radiation panel capacity determined based on the air conditioning load in the air conditioning target room R. Details thereof will be described with reference to the processing flow chart in FIG. 2 in addition to FIG. 1.

[0017] First, based on the air conditioning load in the air conditioning target room R, the target capacity of the radiation panel 10 is determined as the target radiation panel capacity (step #11). Next, the panel outlet heat source water temperature Tp2 when assuming that the capacity of the radiation panel 10 is set to the target radiation panel capacity at the current panel inlet heat source water temperature Tp1 is calculated as the target panel outlet heat source water temperature Tp2a (step #12). Next, the panel heat source water flow rate Vp when the panel outlet heat source water temperature Tp2 becomes the target panel outlet heat source water temperature Tp2a is calculated as the target panel heat source water flow rate Vpa (step #13). Next, it is determined whether or not the target panel heat source water flow rate Vpa is within the adjustable range preset based on the specifications of the panel heat source water flow rate adjustment valve 15, etc. (step #14).

[0018] In step #14 above, if the target panel heat source water flow rate Vpa is within the adjustable range (Yes in step #14), the panel heat source water flow rate Vp is controlled by adjusting the opening of the panel heat source water flow rate control valve 15 so that the panel outlet heat source water temperature Tp2 measured by the panel outlet heat source water temperature sensor 12 becomes the target panel outlet heat source water temperature Tp2a (step #15). In other words, by controlling the flow rate Vp of the panel heat source water in step #15, the capacity of the radiant panel 10 can be set to the target radiant panel capacity in a manner that changes only the panel outlet heat source water temperature Tp2 while keeping the panel inlet heat source water temperature Tp1 as unchanged as possible. Furthermore, in the heat source water circulation circuit 30, by recirculating a portion of the return heat source water W2 to the supply heat source water W1 via the heat source water recirculation path 40, the temperature difference between the inlet and outlet of the heat source water on the heat source unit 20 side (|To2-To1|) can be made larger than the temperature difference between the inlet and outlet of the heat source water on the radiant panel 10 side (|Tp2-Tp1|). As a result, the power required to transport the heat source water in the heat source water circulation circuit 30 is reduced, and heat source water at the appropriate temperature is supplied to other heat source water utilization units 70.

[0019] On the other hand, if the target panel heat source water flow rate Vpa is not within the adjustable range (No. in step #14), the panel inlet heat source water temperature control (step #20) is performed, as will be described in detail later, to change the panel inlet heat source water temperature Tp1 so that the target panel heat source water flow rate Vpa falls within the adjustable range. Then, once the adjustment of the opening degree of the panel heat source water flow rate control valve 15 (step #15) and the control of the panel inlet heat source water temperature (step #20) are completed, the process returns to step #11 and the panel heat source water flow rate control processes described above are repeated.

[0020] [Panel inlet heat source water temperature control] The panel inlet heat source water temperature control performed by the control device 50 is a control that changes the panel inlet heat source water temperature Tp1 so that the panel heat source water flow rate Vp falls outside the adjustable range when performing the panel heat source water flow rate control (see Figure 2) described above, (No. in step #14 of Figure 2). Details of this will be explained with reference to the processing flow diagram in Figure 3 in addition to Figure 1.

[0021] First, regarding the specific reason why the target panel heat source water flow rate Vpa was determined to be outside the adjustable range in the above-mentioned panel heat source water flow rate control (No in step #14 of Figure 2), it is determined whether or not this is because the target panel heat source water flow rate Vpa exceeded the upper limit Vpmax of its adjustable range (step #21). That is, if the determination in step #21 is Yes, the reason why the target panel heat source water flow rate Vpa is outside the adjustable range is that the target panel heat source water flow rate Vpa exceeded the upper limit Vpmax of its adjustable range. If the determination in step #21 is No, the reason why the target panel heat source water flow rate Vpa is outside the adjustable range is that the target panel heat source water flow rate Vpa fell below the lower limit Vpmin of its adjustable range.

[0022] As will be explained in more detail later, if the target panel heat source water flow rate Vpa exceeds the upper limit of the adjustable range Vpmax (Yes in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the panel inlet heat source water W3, is changed to the side that increases the capacity of the radiant panel 10 (step #22) in order to decrease the target panel heat source water flow rate Vpa. On the other hand, if the target panel heat source water flow rate Vpa falls below the lower limit of the adjustable range Vpmin (No in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the panel inlet heat source water W3, is changed to the side that decreases the capacity of the radiant panel 10 (step #23) in order to increase the target panel heat source water flow rate Vpa. This allows the target panel heat source water flow rate Vpa to be kept within the adjustable range. Specifically, the processing differs between cooling operation, where chilled water cooled in the heat source unit 20 is circulated as heat source water, and heating operation, where hot water heated in the heat source unit 20 is circulated as heat source water. Therefore, these cases are explained separately below.

[0023] (During air conditioning operation) During cooling operation, when chilled water cooled in the heat source unit 20 is circulated as heat source water, if the target panel heat source water flow rate Vpa exceeds the upper limit of the adjustable range Vpmax (Yes in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the chilled water supplied to the radiant panel 10 as panel inlet heat source water W3, is lowered by a predetermined change amount ΔT (during cooling operation in step #22). As a result of this decrease in the panel inlet heat source water temperature Tp1, the target panel heat source water flow rate Vpa calculated in step #13 of the panel heat source water flow rate control described above decreases, and as a result, the target panel heat source water flow rate Vpa, which was exceeding the upper limit Vpmax, can be brought within the adjustable range. On the other hand, if the target panel heat source water flow rate Vpa falls below the lower limit Vpmin of the adjustable range (No. in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the chilled water supplied to the radiant panel 10 as the panel inlet heat source water W3, is increased by a predetermined change amount ΔT (in step #23 [during cooling operation]). As a result of this temperature increase in the panel inlet heat source water temperature Tp1, the target panel heat source water flow rate Vpa, calculated in step #13 of the panel heat source water flow rate control described above, increases, and as a result, the target panel heat source water flow rate Vpa, which was below the lower limit Vpmin, can be brought within the adjustable range.

[0024] (During heating operation) During heating operation, when hot water heated in the heat source unit 20 is circulated as heat source water, if the target panel heat source water flow rate Vpa exceeds the upper limit of the adjustable range Vpmax (Yes in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the hot water supplied to the radiant panel 10 as panel inlet heat source water W3, is increased by a predetermined change amount ΔT (during heating operation in step #22). As a result of this temperature increase in the panel inlet heat source water temperature Tp1, the target panel heat source water flow rate Vpa calculated in step #13 of the panel heat source water flow rate control described above decreases, and as a result, the target panel heat source water flow rate Vpa, which was above the upper limit Vpmax, can be brought within the adjustable range. On the other hand, if the target panel heat source water flow rate Vpa falls below the lower limit Vpmin of the adjustable range (No. in step #21), the panel inlet heat source water temperature Tp1, which is the temperature of the hot water supplied to the radiant panel 10 as the panel inlet heat source water W3, is lowered by a predetermined change amount ΔT (in step #23 [during heating operation]). As a result of this decrease in the panel inlet heat source water temperature Tp1, the target panel heat source water flow rate Vpa, calculated in step #13 of the panel heat source water flow rate control described above, increases, and as a result, the target panel heat source water flow rate Vpa, which was below the lower limit Vpmin, can be brought within the adjustable range.

[0025] Next, we will provide a detailed explanation of the panel inlet heat source water temperature adjustment means X for changing the panel inlet heat source water temperature Tp1 in the panel inlet heat source water temperature control described above. The panel inlet heat source water temperature adjustment means X is configured to adjust the panel inlet heat source water temperature Tp1, which is the temperature of the heat source water at the inlet portion of the heat source water circulation circuit 30 to the radiant panel 10. Specifically, the supply heat source water flow rate adjustment valve 35 and the return heat source water flow rate adjustment valve 36, which can adjust the heat source water circulation flow rate Vo from the heat source section 20 to the radiant panel 10 in the heat source water circulation circuit 30, and the recirculation heat source water flow rate adjustment valve 45, which can adjust the recirculation heat source water flow rate Vr in the heat source water recirculation path 40, function as the panel inlet heat source water temperature adjustment means X. The panel inlet heat source water temperature adjustment means X is configured to adjust the panel inlet heat source water temperature Tp1 (panel inlet heat source water temperature sensor 11) by adjusting the opening degree of these adjustment valves 35, 36, and 45, thereby adjusting the state of recirculation of the return heat source water W2 to the supply heat source water W1 by the heat source water recirculation path 40.

[0026] In other words, the panel inlet heat source water temperature adjustment means X can adjust the panel inlet heat source water temperature Tp1 by increasing or decreasing the recirculation ratio Rr (= recirculation heat source water flow rate Vr / total panel heat source water flow rate Vp), which is the ratio of the recirculated heat source water flow rate Vr to the total of the panel heat source water flow rates Vp of the multiple radiant panels 10 (= heat source water circulation flow rate Vo + recirculated heat source water flow rate Vr), as the recirculation state. For example, during cooling operation where chilled water is circulated as the heat source water, reducing the recirculation ratio Rr reduces the ratio of the heat source water W4 at the panel inlet, which has increased in temperature after passing through the recirculated radiant panel 10, to the relatively low-temperature chilled heat source water W1 at the panel inlet W3. This reduces the heat source water temperature Tp1 at the panel inlet. Conversely, increasing the recirculation ratio Rr increases the ratio of the heat source water W4 at the panel inlet, which has increased in temperature after passing through the recirculated radiant panel 10, to the relatively low-temperature chilled heat source water W1 at the panel inlet W3. This increases the heat source water temperature Tp1 at the panel inlet. On the other hand, during heating operation in which hot water is circulated as the heat source water, increasing the recirculation ratio Rr increases the ratio of the panel outlet heat source water W4, which has passed through the recirculated radiant panel 10 and whose temperature has decreased, to the relatively high-temperature supply heat source water W1 at the panel inlet heat source water W3. This allows the panel inlet heat source water temperature Tp1 to be lowered. Conversely, decreasing the recirculation ratio Rr decreases the ratio of the panel outlet heat source water W4, which has passed through the recirculated radiant panel 10 and whose temperature has decreased, to the relatively low-temperature supply heat source water W1 at the panel inlet heat source water W3. This allows the panel inlet heat source water temperature Tp1 to be raised.

[0027] Furthermore, when changing the panel inlet heat source water temperature Tp1, the openings of the supply heat source water flow rate control valve 35, the return heat source water flow rate control valve 36, and the recirculation heat source water flow rate control valve 45 can be adjusted simultaneously. However, it is desirable to prioritize the adjustment of the opening of the recirculation heat source water flow rate control valve 45 over the adjustment of the openings of the supply heat source water flow rate control valve 35 and the return heat source water flow rate control valve 36. That is, when changing the panel inlet heat source water temperature Tp1, first the recirculation heat source water flow rate Vr is adjusted by adjusting the opening of the recirculation heat source water flow rate control valve 45 to increase or decrease the recirculation ratio Rr. Then, only if it is determined that the recirculation heat source water flow rate Vr falls outside the predetermined adjustable range, the heat source water circulation flow rate Vo is adjusted by adjusting the openings of the supply heat source water flow rate control valve 35 and the return heat source water flow rate control valve 36 to increase or decrease the recirculation ratio Rr. Specifically, if the panel heat source water flow rate Vp is likely to exceed the adjustable range, increasing the heat source water circulation flow rate Vo and decreasing the recirculation ratio Rr prevents an excessive increase that would cause the panel heat source water flow rate Vp to exceed the adjustable range. On the other hand, if the panel heat source water flow rate Vp is likely to fall below the adjustable range, decreasing the heat source water circulation flow rate Vo and increasing the recirculation ratio Rr prevents an excessive decrease that would cause the panel heat source water flow rate Vp to fall below the adjustable range. [Explanation of symbols]

[0028] 10 Radiation Panels 20 Heat source part 30 Heat source water circulation circuit 35. Supply heat source water flow rate control valve (panel inlet heat source water temperature control means) 36. Return heat source water flow rate control valve (panel inlet heat source water temperature control means) 40 Heat source water recirculation path 45. Recirculating heat source water flow rate control valve (panel inlet heat source water temperature control means) 50 Control device (control unit) 100 Radiant Air Conditioning System Rooms subject to air conditioning (R) Rr Recirculation rate (recirculation status) Tp1 Panel Inlet Heat Source Water Temperature Vp panel heat source water flow rate W1 Past heat source water W2 Return heat source water W3 Panel Inlet Heat Source Water X Panel Inlet Heat Source Water Temperature Adjustment Means

Claims

1. A heat source unit for cooling or heating the heat source water, A radiant panel installed in the room to be air-conditioned, through which heat source water flows, A heat source water circulation circuit that circulates heat source water between the heat source unit and the radiant panel, A radiant air conditioning system comprising: a control unit that determines a target radiant panel capacity based on the air conditioning load in the air-conditioned room, and performs panel heat source water flow rate control that controls the flow rate of heat source water in the radiant panel as the panel heat source water flow rate so that the capacity of the radiant panel is set to the target radiant panel capacity, A radiant air conditioning system comprising a heat source water recirculation path in the heat source water circulation circuit, wherein at least a portion of the return heat source water, which is heat source water returning from the radiant panel side to the heat source unit, is recirculated to the outgoing heat source water, which is heat source water going from the heat source unit to the radiant panel side.

2. The system includes a panel inlet heat source water temperature adjustment means that can adjust the state of recirculation of the return heat source water to the supply heat source water by the heat source water recirculation path, which is the temperature of the heat source water at the inlet portion of the heat source water circulation circuit to the radiant panel side, and is configured to adjust the panel inlet heat source water temperature, which is the temperature of the heat source water at the inlet portion to the radiant panel side of the heat source water circulation circuit. The radiant air conditioning system according to claim 1, wherein the control unit performs panel inlet heat source water temperature control, which controls the operation of the panel inlet heat source water temperature adjustment means so that the panel heat source water flow rate falls within a predetermined adjustable range in the panel heat source water flow rate control.

Citation Information

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